Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Applied Materials has submitted a patent application for Reducing Etch Resistance in Advanced Substrate Patterning. This invention was developed by Chen Chung-chia, Choung Ji-young, Haas Dieter, Lin Yuxin, Lee Jeong-min, Wu Wenhao and Kim Si-kyung.
The patent application number is CN20248026256 20240423. Th..