Semiconductor
| Wed 05 Feb 2025
Alexandria, Feb. 5 -- Taiwan Semiconductor Mfg Company has filed a patent application for package structure and method for forming the same. This invention was developed by Shen Ke-Han, Chen Chih-Yuan, Wu Jiung, Kuo Hung-Yi, Lee Chung-Ju, Chou Tung-He, Cui Ji, Yee Kuo-Chung, Yu Chen-Hua, Hsieh Cheng-Chieh, Lien Yu-Jen, Kuo Yian-..