Telecom
| Tue 07 Jul 2026
Alexandria, July 7 -- Intel has applied United States patent for Backside Contacts Formed by Direct Backside Etching. Madhavan Atul, Mehta Nikhil J, Desai Umang, Kandas Angelo W, Kobrinsky Mauro J, Vaidya Sachin S, Kybert Nicholas J, Koeper Mark, Rajasekhara Shreyas, Mannebach Ehren, Hopkins Stephen D, Moumen Nadjoua, De Re Eleo..