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Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Cixin Tech Group Co Ltd has applied Chinese patent for SRAM (static Random Access Memory) Module Splicing Method and Device in Chip. Wang Fu, Feng Jun and Gu Jialu developed it.
The patent application number is CN202610244464 20260302. The patent publication number is CN121764871 (A). International Patent C..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Li Haiquan has submitted a patent application for Storage and Calculation Integrated Topological Quantum Relaxation Physical Phase Calculation Chip (PPU) of Nonlinear Fully-coupled Continuous Field Evolution Based on Psi-energy Potential Dynamics. This invention was developed by Li Haiquan.
The patent appli..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Chengdu Yunbao Chuangxin Intelligent Tech Co Ltd patent application for Network Processor and Chip. The invention was developed by Dong Deji and Zhang Xueli.
The patent application number is CN202511913464 20251218. The patent publication number is C..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Horizon Zhengcheng Shanghai Tech Co Ltd has submitted a patent application for System on Chip Supporting Inter-core Communication, Inter-core Communication Method, Electronic Equipment and Storage Medium. This invention was developed by Jia Haisheng.
The patent application number is CN202511884365 20251212...
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Beijing Tsing Micro Intelligent Tech Co Ltd has submitted a patent application for Chip Model and Chip Model Expansion Method. This invention was developed by Zhang Anqi.
The patent application number is CN202511719794 20251121. The patent publication number is CN121764862 (A). International Patent Classifi..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Beijing Suanneng Tech Co Ltd patent application for Data Transmission Method Between Chips, Chip and Electronic Equipment. Wang Yiwei, Xue Yunan, Shen Guangchong and Wang Jun developed the invention.
The patent application number is CN202610258457 202..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Beijing Xindatong Tech Co Ltd has filed a patent application for Memory Chip Interface Signal Integrity Enhancement Method Supporting Multiple Rates. This invention was developed by Zhang Xiaocheng.
The patent application number is CN202511730163 20251124. The patent publication number is CN121764831 (A). I..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Beijing Suanneng Tech Co Ltd has filed a patent application for Storage Management Unit, Address Translation Method, Chip Product and Computer Equipment. This invention was developed by Qiu Hao, Wang Jun and Liu Hui.
The patent application number is CN202610248724 20260302. The patent publication number is ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Shanghai Fullhan Microelectronics Co Ltd patent application for Image Processing Chip Semi-offline Debugging System and Method Based on Data Reinjection. Ju Caixia, Dong Pengyu, Xue Jiayuan, Wang Xiufeng and Wang Zeyu developed the invention.
The pate..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Beijing Kaiyuan Chip Research Inst has submitted a patent application for Data Acquisition Circuit of System on Chip, Semiconductor Chip and Electronic Equipment. Bao Yungang, Zeng Zhongjie, Zhao Huatao and Tang Dan developed the invention.
The patent application number is CN202610254842 20260303. The paten..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Ziguang Shanxin Tech Chengdu Co Ltd has submitted a patent application for Write Error Data Reconstruction Method and Device Based on RAID Error Correction and SSD Equipment. Higashi Takeshi, Ba Shufa and Zhang Xinyu developed the invention.
The patent application number is CN202511568148 20251030. The pate..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Infineon Technologies Americas Corp has submitted a patent application for Single PHY for Ethernet Multi-rate and Camera Asymmetric Link. Zherebtsov Aleksei, Jonsson Ragnar and Razavi Majomard Seid Alireza developed the invention.
The patent application number is WO2025US60131 20251217. The patent publicatio..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Starfire Systems Inc has applied WIPO patent for Process and Catalysts for Producing Polycarbosilanes for the Production of Silicon Carbide Fibers and Composites. Shen Howard developed it.
The patent application number is WO2025US58952 20251210. The patent publication number is WO2026136085 (A1). Internation..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received Nordamps AB patent application for Semiconductor Structure Forming a Plurality of Transistors. Tired Tobias, Olson Simon, Saxena Aditya and Vera Edith developed the invention.
The patent application number is WO2025SE51161 20251218. The patent publication..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Hana Mat Inc has submitted a patent application for Graphite and Silicon Composite and Lithium Secondary Battery Including Same. This invention was developed by Oh Dong Hoon, Jang Hye Young, Park Sang Eun and Shin Jong Sik.
The patent application number is WO2025KR21694 20251215. The patent publication numbe..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Jeong Inkwon has submitted a patent application for Substrate Polishing Apparatus Featuring Substrate Transfer Shuttle.
The patent application number is WO2025KR20919 20251207. The patent publication number is WO2026134908 (A1). International Patent Classification codes are B24B27/00, B24B27/033, B24B37/30,..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Xinwei Bite Nano Tech Suzhou Co Ltd patent application for Machine Learning Force Field Molecular Dynamics Efficient Parallel Acceleration Method, System and Device Based on Taftogen S60 Chip Architecture and Storage Medium. The invention was developed ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Suanmiao Tech Beijing Co Ltd patent application for Integrated Circuit Layout Design Method and Integrated Circuit. This invention was developed by Liu Haiyun and Zhang Yusheng.
The patent application number is CN202511984291 20251225. The patent publ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Tianjin Haixin Microelectronics Tech Co Ltd has submitted a patent application for Image Sensor Chip Dark Current Non-uniformity Correction Method and System. This invention was developed by Shan Ke and Xu Hongfei.
The patent application number is CN202511977592 20251225. The patent publication number is CN..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Beijing Hongtu Semiconductor Co Ltd has submitted a patent application for Mode Switching Circuit and Image Sensor. This invention was developed by Liu Yi and Xie Rui.
The patent application number is CN202511929819 20251219. The patent publication number is CN121771549 (A). International Patent Classificat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published BYD Co Limited and BYD Semiconductor patent application for Image Flicker Detection Method and Acquisition Parameter Adjustment Method of Image Sensor. The invention was developed by Liu Yang, Bai Mei, Lyu Yupeng, Hu Yajie and Kuang Jianghua.
The pat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Elane Beijing Data Tech Co Ltd has sought patent for False Alarm Suppression Method and Device, Electronic Equipment, Readable Storage Medium and Chip. This invention was developed by Geng Jun.
The patent application number is CN202511961101 20251224. The patent publication number is CN121765396 (A). Intern..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Beijing Yiqi Tech Co Ltd has submitted a patent application for 12-channel XLR Audio Playing System Based on SOC Chip Platform and Audio and Video Separation Output Method. This invention was developed by Guan Tian, Wang Gang, Wu Yahui and Li Jinze.
The patent application number is CN202511616941 20251106. ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Wuxi Zhixian Weilai Tech Co Ltd patent application for Correlation Analysis Method for Multi-source Defect Data of Semiconductor Wafer. Guan Jian and Li Yunhao developed the invention.
The patent application number is CN202511766463 20251127. The pate..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released No. 723 Research Inst Of Csic patent application for Universal Extensible Digital Beam Forming Chip Design Architecture and Method. This invention was developed by Xu Siyuan, Ma Ganjun, Hu Jinxian, Li Chunlai, Xue Cheng and Li Rengang.
The patent appl..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Infineon Technologies Americas Corp patent application for High Voltage Delta-sigma Modulator Analog-to-digital Converter. This invention was developed by Fini Luca, Hancioglu Erkan, Kijima Masako, Goniodetsky Dmitry, Singh Rajinder, Yasukochi Kazuhiko a..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Qingdao Xinxin Microelectronics Tech Co Ltd has applied Chinese patent for Digital-to-analog Converter and Display Chip. Yan Dongdong, Teo Yeow Leng and Wang Ping developed it.
The patent application number is CN202411658388 20241119. The patent publication number is CN121770525 (A). International Patent Cl..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Huatian Technology Xi'an Co Ltd patent application for Method and System for Automatically Binding Operation Map Coordinate Information of Automatic Chip Mounter and 2D System. The invention was developed by Huang Guoliang and Luo Zongru.
The patent ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Huangshi Yongxinglong Electronics Co Ltd patent application for Printed Circuit Board Electroplating Method and Method for Preventing Printed Circuit Board from Bending. Wu Yongqiang developed the invention.
The patent application number is CN20251191..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Sichuan Provincial Architectural Design and Research Inst Co Ltd has submitted a patent application for Method and System for Testing Influence Relation of Color on Characteristics of Photovoltaic Curtain Wall Monocrystalline Silicon Battery. This invention was developed by Fu Yunchao, Yuan Yang, He Qingsong, ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Heilongjiang Huixin Semiconductor Co Ltd has submitted a patent application for Glass Fabric/resin Composite Dielectric Substrate and Preparation Method and Application Thereof. This invention was developed by Li Bin, Wang Yue, Feng Kexin, Xie Yingxi, Niu Bing, Guo Jiajie and Feng Yuxiang.
The patent applic..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Ase Semiconductor Shanghai Co Ltd patent application for Integrated Circuit Board and Integrated Circuit Board Manufacturing Method. Weng Jimeng, Yin Zhihua, Lin Jiade and Chang Chao developed the invention.
The patent application number is CN20261019..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received State Power Invest Group Qinghai Photovoltaic Industry Innovation Center Co Ltd, SPIC Huanghe Hydropower Development, Qinghai Huanghe Hydropower Dev and Photovoltaic Industry Tech Branch Of Qinghai Huanghe Hydropower Development Co Ltd patent application..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Ningbo Sailamike New Material Tech Co Ltd has filed a patent application for Pulse Electroplating Ceramic Power Supply. This invention was developed by Shi Jianbo and Krasnikov Yury.
The patent application number is CN20251250492 20251231. The patent publication number is CN121770379 (A). International Pate..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Ningbo Sailamike New Material Tech Co Ltd patent application for Double-pulse Electroplating Ceramic Power Supply. This invention was developed by Shi Jianbo and Krasnikov Yury.
The patent application number is CN20251250681 20251231. The patent publi..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Heilongjiang Huixin Semiconductor Co Ltd patent application for Anti-dead-zone Circuit, PCB and Chip. This invention was developed by Li Bin, Feng Kexin, Xie Yingxi, Niu Bing, Guo Jiajie, Feng Yuxiang and Ma Bobin.
The patent application number is CN2..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Great Wall Power Tech Co Ltd has submitted a patent application for Power Converter and Semiconductor Chip Starting Circuit. This invention was developed by Liao Pengcheng, Yang Biao and Ou Guobin.
The patent application number is CN20251244110 20251231. The patent publication number is CN121770336 (A). Int..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Jiangsu Third Generation Semiconductor Research Inst Co Ltd has submitted a patent application for Epitaxial Wafer, Preparation Method of Epitaxial Wafer and Micro-led. This invention was developed by Yan Qi'ang and Wang Guobin.
The patent application number is CN202411324473 20240923. The patent publicatio..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Jiangsu Third Generation Semiconductor Research Inst Co Ltd has sought patent for Red Light Micro-led Epitaxial Wafer and Preparation Method and Application Thereof. This invention was developed by Yan Qi'ang and Wang Guobin.
The patent application number is CN202411324470 20240923. The patent publication n..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Jiangxi MTC Semiconductor and Jiangxi Yaochi Tech Co Ltd patent application for Composite Patterned Substrate and Preparation Method Thereof. This invention was developed by Wen Guosheng, Jin Conglong, Liang Yi, Xu Zhou, Chen Tian and Li Hui.
The pate..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Jiangxi MTC Semiconductor and Jiangxi Zhaochi Integration Tech Co Ltd patent application for Preparation Method of Composite Patterned Substrate, Composite Patterned Substrate and Led Chip. The invention was developed by Wen Guosheng, Jin Conglong, Lian..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Jiangxi MTC Semiconductor and Jiangxi Zhaochi Integration Tech Co Ltd patent application for High-reliability Vertical Led Chip and Preparation Method Thereof. The invention was developed by Jin Conglong, Ru Hao, Hu Jiahui, Ao Yingquan and Wang Li.
T..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Tianma New Display Technology Research Inst Xiamen Co Ltd has submitted a patent application for Bonding Layer and Manufacturing Method of Light-emitting Substrate. This invention was developed by Huo Sitao.
The patent application number is CN202511745310 20251125. The patent publication number is CN1217724..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shanghai Weijing Electronic Tech Co Ltd has filed a patent application for Silicon Optical Chip and Manufacturing Method Thereof. This invention was developed by Katsura.
The patent application number is CN20251235322 20251230. The patent publication number is CN121772412 (A). International Patent Classific..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Shanghai Weijing Electronic Tech Co Ltd patent application for Silicon Optical Chip and Manufacturing Method Thereof. This invention was developed by Katsura.
The patent application number is CN20251235176 20251230. The patent publication number is CN..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shanghai Weijing Electronic Tech Co Ltd has submitted a patent application for Silicon Optical Chip and Manufacturing Method Thereof. This invention was developed by Katsura.
The patent application number is CN20251235078 20251230. The patent publication number is CN121772410 (A). International Patent Class..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Shanghai Weijing Electronic Tech Co Ltd patent application for Silicon Optical Chip and Manufacturing Method Thereof. This invention was developed by Katsura.
The patent application number is CN20251235038 20251230. The patent publication number is CN..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Yangzhou Carbon Zhonghe Technology Innovation Research Center Of Yangzhou Univ and Yangzhou University patent application for Thin Film Gallium Arsenide Cell Stripping and Transferring System and Method Based on Van Der Waals Force. The invention was de..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Yangtze River Delta Optoelectronics Academy Of Peking Univ has submitted a patent application for Recyclable Patterned Master Mask for Preparing Flexible Substrate and Conductive Electrode, Preparation Method Thereof, Planarized Flexible Substrate and Conductive Electrode Structure. Zhu Rui, Sha Rui, Li Xingyi..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shanghai Belling Co Ltd has submitted a patent application for Silicon Carbide MOSFET and Semiconductor Device. This invention was developed by Zhong Shengrong, Cao Rongrong, Wu Yifan, Cao Hongfei and Xue Lujie.
The patent application number is CN202511964855 20251224. The patent publication number is CN121..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Guangzhou Zhiming Microelectronics Tech Co Ltd has applied Chinese patent for Power Semiconductor Device Integrated with Temperature Sensor and Preparation Method. Tu Yuanyuan, Zhang Jinping and Wang Yonggang developed it.
The patent application number is CN202511914193 20251218. The patent publication numb..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Ningbo Inst Of Fudan University has submitted a patent application for High-k Gate Dielectric Composite Material, Beta-ga2o3 MOS Power Device and Preparation Method of Beta-ga2o3 MOS Power Device. This invention was developed by Lyu Mengmeng, Ma Hongping, Zhang Junran and Liu Gang.
The patent application nu..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Wuxi Xinzhuo Huguang Semiconductor Co Ltd has sought patent for Preparation Method of Semiconductor Device and Semiconductor Device. This invention was developed by Yang Changlin, Zhou Qiang and Han Xinyu.
The patent application number is CN20251259408 20251231. The patent publication number is CN121772308 ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received 3peak Incorporated patent application for Semiconductor Device, Preparation Method and Integrated Circuit. Cui Yongjiu, Liu Kun, Zhao Yonghao, Ma Xiaobo and Tong Xu developed the invention.
The patent application number is CN20251232170 20251230. The ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Dongbu Hitek Co Ltd patent application for Silicon-on-insulator Semiconductor Device and Manufacturing Method Thereof. The invention was developed by Wi Hyun-sol and Jung Jin-hyo.
The patent application number is CN202411809052 20241210. The patent p..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Beijing Zhongke Xinweite Tech Development Co Ltd has submitted a patent application for Metal-oxide Semiconductor Field Effect Transistor and Preparation Method Thereof. Zhang Yanfei, Wen Xiaoxia, Zhao Ge, Gong Xueqin and Liu Mengxin developed the invention.
The patent application number is CN202610248921 2..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Peking University Chongqing Carbon Based Integrated Circuit Research Inst has sought patent for Carbon-based Semiconductor Device and Preparation Method Thereof. This invention was developed by Wang Chengbo, Zhang Weizhen and Tao Dezhi.
The patent application number is CN202511654820 20251111. The patent pu..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shanghai Xinwei Semiconductor Co Ltd has submitted a patent application for Preparation Method of Semiconductor Structure and Semiconductor Structure. Liu Weikai, Wang Hao, Chen Guoji and Yang Yu developed the invention.
The patent application number is CN20251229563 20251230. The patent publication number ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Xian Tangjing Quantum Tech Co Ltd has applied Chinese patent for Gaas-based Hbt Epitaxial Wafer Multi-parameter Cooperative Control Growth Processing System. Xia Tianwen, Danielsson Fan Xing, Liu Bang, Shi Kangqiao, Wang Yuan and Gong Ping developed it.
The patent application number is CN202511648432 202511..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- United Microelectronics Center Co Ltd has sought patent for Three-dimensional Spiral Inductor, Preparation Method Thereof and Semiconductor Device. This invention was developed by Yuan Kai, Tian Sijie and Luo Wei.
The patent application number is CN20251251963 20251231. The patent publication number is CN12..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Yangtze Memory Holdings Co Ltd patent application for Semiconductor Structure and Preparation Method Thereof, Chip Packaging Structure and Storage System. This invention was developed by Liu Lei, Zhou Wenxi, Fan Dongyu, Liu Meiying, Huo Zongliang, Gao Ti..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Zhangjiagang Zhiheng Electronics Co Ltd patent application for Automatic Welding Control Method, Device and System for Integrated Circuit Board. This invention was developed by Huang Guan, Jiang Jianfei and Zhuang Mingkun.
The patent application numbe..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Kunshan Huixing Prec Machinery Co Ltd has submitted a patent application for Pushing and Positioning Device for Precise Machining of Semiconductor Parts. This invention was developed by Li Huidong.
The patent application number is CN202511720406 20251121. The patent publication number is CN121772665 (A). In..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Guangdong Kezhuo Semiconductor Equipment Co Ltd patent application for Wafer Carrier Capable of Being Conveniently Matched with Wafer Cutting Machine. The invention was developed by Wei Yuhong and Zhu Yuqing.
The patent application number is CN202610..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Shanghai Chuangxian Semiconductor Co Ltd patent application for Power Semiconductor Chip Welding Mixed Material Bearing Device. The invention was developed by Zhang Chang, You Haitao, Sun Wenda, Liu Xingquan, Zhang Yihan and Wang Yijia.
The patent ap..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Jiangsu Shengchuang Semiconductor Tech Co Ltd has filed a patent application for Thermal Ultrasonic Lead Bonding Machine Assembly for Automatic Feeding of Semiconductor Packaging. This invention was developed by Sun Haipeng, Gu Chuanglong and Gu Binjie.
The patent application number is CN202610244909 202603..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Zhenjiang Meiernai Tech Co Ltd has sought patent for Soaking Cleaning Tank of Wafer Cleaning Rod. This invention was developed by Ni Ting and Zhang Honggang.
The patent application number is CN20251232584 20251230. The patent publication number is CN121772656 (A). International Patent Classification codes a..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Shenzhen Xintong Electronic Tech Co Ltd patent application for Packaging Method of High-power MOS (metal Oxide Semiconductor) Tube. Wu Junfeng and Ai Shuyi developed the invention.
The patent application number is CN202511941660 20251222. The patent p..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Guilin Xinfeiguang Electronic Tech Co Ltd patent application for Chip on Chip (coc) Patch Modification Mechanism of Die Bonder. Chen Jiangzong, Zhang Haiyong, Wei Wenlong and Liu Jianying developed the invention.
The patent application number is CN202..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published United Semi Integrated Circuit Mfg Xiamen Co Ltd patent application for Wafer Cleaning Method and Wafer Cleaning System. The invention was developed by Xu Rongxin, Lan Wanfu and Tan Wenyi.
The patent application number is CN202411364290 20240927. The..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Chongqing Xinlian Microelectronic Co Ltd has sought patent for Ashing Method and Preparation Method of Semiconductor Device. This invention was developed by Gai Yu, Wang Tao, Li Gang, Yin Xueguo and He Deyan.
The patent application number is CN202511791944 20251201. The patent publication number is CN121772..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Chongqing Xinlian Microelectronic Co Ltd patent application for Method for Ashing Etched Wafer and Semiconductor Dry Etching Equipment. Zhang Nianheng, Fan Guanghao and Cai Xianzhu developed the invention.
The patent application number is CN2025117864..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Nankang Nanjing Electronic Tech Co Ltd patent application for Preparation Method of Formamide-ethylene Glycol System Al2o3 Film for Semiconductor Product. Zhong Shiwen and Rui Yawen developed the invention.
The patent application number is CN202512362..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Wuxi Zhongwei Microchips Co Ltd has applied Chinese patent for Method for Improving Metal Step Coverage of Device. Zhu Saining, Zhang Hui, Zhang Keke, Sun Jianjie, Liu Zhaofang, Qin Runlian and Chan Siu-hong developed it.
The patent application number is CN202511754908 20251126. The patent publication numbe..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Shanghai Xinaoxinyi Tech Co Ltd patent application for Bonded Wafer and Preparation Method Thereof. The invention was developed by Zhou Yuhao, Wang Ziwen, Zhu Wei, Li Wei and Wei Xing.
The patent application number is CN20251221305 20251229. The pate..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shanghai Xinaoxinyi Tech Co Ltd has submitted a patent application for Bonded Wafer and Processing Method Thereof. This invention was developed by Deng Qingwen, Dai Rongwang, Wang Ziwen, Ding Jingjun, Li Wei and Wei Xing.
The patent application number is CN20251221274 20251229. The patent publication number..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shanghai Xinaoxinyi Tech Co Ltd has filed a patent application for Bonded Wafer and Forming Method Thereof. This invention was developed by Wang Ziwen, Ding Jingjun, Li Wei and Wei Xing.
The patent application number is CN20251204651 20251226. The patent publication number is CN121772613 (A). International ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Solar Cell Module, Preparation Method Thereof and Solar Cell. Dong Shengzhi developed the invention.
The patent application number is CN202511984544 20251225. The patent publication number is CN121772582 (A). International Patent C..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Chengdu Jingxin Mingneng Photovoltaic Tech Co Ltd has submitted a patent application for Preparation Method of Perovskite Layer, Solar Cell and Photovoltaic Module. This invention was developed by Tang Xiao, Li Haohui and Yang Tian.
The patent application number is CN202511857842 20251210. The patent public..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Chengdu BOE Optoelectronics Technology and BOE Technology Group patent application for Display Substrate and Display Device. Liu Tingliang, Zhang Yuxin, Zhang Yuanqi and Xu Peng developed the invention.
The patent application number is CN202411376292 ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Chengdu BOE Optoelectronics Technology and BOE Technology Group patent application for Display Substrate and Display Device. This invention was developed by Wang Kui.
The patent application number is CN20261050031 20260114. The patent publication numb..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Yunnan University and Huacai Luminous Energy Tech Yunnan Co Ltd patent application for Interface Modification Layer of Perovskite Solar Cell and Perovskite Solar Cell. The invention was developed by Lyu Yinhua, Guo Kaiyang, Yang Hang, Zhang Wenhua, Geng..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Suzhou Guoxian Innovation Tech Co Ltd patent application for Solar Cell Module, Preparation Method Thereof and Solar Cell. Li Lianyue developed the invention.
The patent application number is CN202511984457 20251225. The patent publication number is C..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Suzhou Guoxian Innovation Tech Co Ltd patent application for Solar Cell, Packaging Method of Solar Cell and Electric Equipment. The invention was developed by Li Lianyue.
The patent application number is CN202511984783 20251225. The patent publicatio..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Xixian Tech Co Ltd patent application for Active Heat Dissipation and Positioning Integrated Device of Ultraviolet Led Array for Semiconductor Packaging. Sun Lubin, Xu Qiang, Tao Dongdong, Li Rongrong, Xie Yu, Tian Ziyan, Shen Long and Tian Ruoxian devel..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Jiangxi MTC Semiconductor and Jiangxi Yaochi Tech Co Ltd patent application for Flip Light Emitting Diode Chip and Preparation Method Thereof. This invention was developed by Li Wentao, Jin Conglong, Hu Jiahui, Xu Zhou and Zhang Cunlei.
The patent app..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Chip Carrier Plate and Manufacturing Method Thereof, and Chip Packaging Structure. Zhou Yanxu developed the invention.
The patent application number is CN202511924182 20251218. The patent publication number is CN121772796 (A). Inte..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Pingtouge Shanghai Semiconductor Technology Co Ltd has submitted a patent application for Interposer, Chip Package Structure and Electronic Device. This invention was developed by Ma Chao and Fu Huili.
The patent application number is CN202511679712 20251114. The patent publication number is CN121772792 (A)..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Nat Ct Advanced Packaging Co Ltd Ncap China has filed a patent application for High-density Rewiring Layer, Preparation Method Thereof and Semiconductor Packaging Structure. This invention was developed by Xu Cheng, Dai Fengwei, Liu Fengman and Yin Xiang.
The patent application number is CN20251237078 20251..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Nanjing University and Hefei Nat Laboratory patent application for Ceramic Substrate Structure and Integrated Packaging Structure Thereof. Lu Hai, Guo Yue, Ren Fangfang, Zhou Feng, Xu Weizong and Zhou Dong developed the invention.
The patent applicati..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Semikron Danfoss Electronics As patent application for Power Semiconductor Module with Two-part Conduction Device and Equipment with Power Semiconductor Module. Frenznik Eric, Klemm Georg and Holtyes Martin developed the invention.
The patent applicat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shanghai Chuangxian Semiconductor Co Ltd has submitted a patent application for Method for Removing Oxidation Film of Power Semiconductor Wafer. This invention was developed by Zhang Chang, You Haitao, Sun Wenda, Liu Xingquan, Zhang Yihan and Wang Yijia.
The patent application number is CN20251253137 202512..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Suzhou Guoxian Innovation Tech Co Ltd has filed a patent application for Package Carrier and Preparation Method Thereof, and Chip Packaging Structure. This invention was developed by Zhao Yanfei and Zhou Yanxu.
The patent application number is CN202511924022 20251218. The patent publication number is CN1217..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Jiangxi Deercheng Semiconductor Co Ltd has submitted a patent application for Pre-packaged Chip Heat Dissipation Module. Yao Ruihong, Gyojo Takeru and Yao Ruiqi developed the invention.
The patent application number is CN202511680147 20251117. The patent publication number is CN121772745 (A). International ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Beijing Xinji Tech Co Ltd has sought patent for Diamond Glass Composite Substrate and Preparation Method Thereof. This invention was developed by Wang Qi, Yang Xiaoyu and Wang Zhongqiang.
The patent application number is CN202511991162 20251226. The patent publication number is CN121772744 (A). Internationa..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Kunshan Jianghong Precision Tech Co Ltd patent application for Processing Technology of Integrally-formed Chip Micro-channel Heat Dissipation Device. This invention was developed by Li Jinqun, Zou Xinmu, Wei Juan and Chen Mingzhi.
The patent applicati..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Kunshan Jianghong Precision Tech Co Ltd patent application for Processing Technology of Laminated Chip Micro-channel Heat Dissipation Device. The invention was developed by Li Jinqun, Zou Xinmu, Wei Juan and Chen Mingzhi.
The patent application numbe..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Nat Ct Advanced Packaging Co Ltd Ncap China has filed a patent application for Composite Metal Grid Structure, Chip Packaging Structure and Preparation Method Thereof. This invention was developed by Dai Fengwei, Sun Peng, Zhang Wenqiang and Liu Fengman.
The patent application number is CN202511982561 20251..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Chongqing Xinlian Microelectronic Co Ltd has sought patent for Forming Method of Interlayer Dielectric Layer and Semiconductor Structure. This invention was developed by Zhao Chunxue and Shi Qingyun.
The patent application number is CN202511771216 20251128. The patent publication number is CN121772717 (A). ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Shanghai Weijing Electronic Tech Co Ltd patent application for Chip Planarization Method and Integrated Circuit Chip. Katsura developed the invention.
The patent application number is CN20251235772 20251230. The patent publication number is CN12177271..
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