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Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- United Nova Tech Yuezhou Shaoxing Corp has sought patent for Semiconductor Device and Manufacturing Method Therefor. This invention was developed by Zhao Liangliang, Li Yong and Sun Wei. The patent application number is EP20250757711 20250218. The patent publication number is EP4672903 (A1). International P..

Semiconductor

  |  Mon 12 Jan 2026

Munich, Jan. 12 -- NPL Management Ltd has sought patent for Photon Emission by Hot Carrier Injection Across a Lateral P-N or N-P Junction. This invention was developed by Kataoka Masaya and See Patrick. The patent application number is EP20240721184 20240327. The patent publication number is EP4673789 (A1). International Pate..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received Tan Kah Kee Innovation Laboratory and Zhang Aiqiang patent application for Texturing Agent Composition of Silicon Wafer for Monocrystalline Silicon Heterojunction Solar Cell, Texturing Liquid and Solar Cell. Zhang Aiqiang, Fan Ruojing, Li Weiliang and X..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Shenji Semiconductor Tech Xuzhou Co Ltd has submitted a patent application for Epitaxial Growth Method of Semiconductor Compound. Huang Xiaohui, Liu Chao and Chen Kaihui developed the invention. The patent application number is CN202510667666 20250523. The patent publication number is CN120193334 (A). Inte..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has released Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Device, Method and Product for Reducing Epitaxial Layer Fault of 12-inch Red Phosphorus Silicon Single Crystal and Single Crystal Furnace. This invention was developed by Shang R..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Guangdong Jinming Machinery Equipment Tech Co Ltd has submitted a patent application for Cathode Bearing Hanger for Electroplating. Zhao Zhili, Chen Fei and Yang Kaiyi developed the invention. The patent application number is CN202510500500 20250421. The patent publication number is CN120193319 (A). Intern..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Dongguan Jiazhe Metal Products Co Ltd has sought patent for Bearing Basket for Electroplating. This invention was developed by Sun Chunchun and Shi Qiuming. The patent application number is CN202510393758 20250331. The patent publication number is CN120193318 (A). International Patent Classification code i..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published LYSTEEL and Hunan Liangang Electromagnetic Mat Co Ltd patent application for Bottom-layer-free Oriented Silicon Steel and Production Method and Application Thereof. The invention was developed by Xu Guang, Liang Liang, Zhu Yechao, Tian Fei, Liu Xuhui, ..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has published Intel patent application for Integrated Circuit Structure with Zero Diffusion Break and Wrap-around Contact. The invention was developed by Hung Ting-hsiang, Yeung Chun Wing, Chao Robin, Chu Tao, Hu Lin, Jang Minwoo, Lin Chia-ching, Lin Chung-hsun, Luo Yanbin, Murthy Anand,..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Nanchang Kaixun Photoelectric Co Ltd has submitted a patent application for Led Epitaxial Wafer with Improved Antistatic Capability and Preparation Method Thereof. This invention was developed by Wang Sujie, Lin Xiaoshan and Yang Qi. The patent application number is CN202510661010 20250522. The patent publ..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Intel has filed a patent application for Integrated Circuit Structures Having Stress-inducing Gate Cut Plugs. This invention was developed by Chu Tao, Xu Guowei, Chao Robin, Zhang Feng, Hung Ting-hsiang, Lin Chia-ching, Zhang Yang, Zhang Kan, Yeung Chun Wing, Jang Minwoo, Luo Yanbin, Lin Chung-hsun, Murthy Ana..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Jinko Solar Holding Co Ltd has applied Chinese patent for Preparation Method of Solar Cell and Solar Cell. Zeng Xianhuan, Wang Yilan, Zhang Ning and Qiu Yankai developed it. The patent application number is CN202510648333 20250519. The patent publication number is CN120187147 (A). International Patent Clas..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received Xining Solar Power Branch, Qinghai Upstream of Yellow River Hydropower Devlopment, Xi'an Solar Power Branch of Qinghai Huanghe Hydropower Devlopment, Qinghai Huanghe Hydropower Dev and SPIC Huanghe Hydropower Development patent application for High-boro..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published Changzhou Inno Machining and Yingnuo Photovoltaic Equipment (Jiangsu) patent application for Heterojunction Solar Cell Laser Sintering Method and Optical System. The invention was developed by Zhu Jiukai, Zeng Jianglong and Luo Kun. The patent appli..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has published Lee Shao Lun patent application for Preparation Method for Active Metal Welded Ceramic Substrate. The patent application number is EP20240758700 20240125. The patent publication number is EP4672872 (A1). International Patent Classification code is H05K3/38. Cooperative ..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Optunity Inc has submitted a patent application for Switching of Power Semiconductor Devices by Programmable Current Pulses. This invention was developed by Wu Ta-chung. The patent application number is EP20240214742 20241122. The patent publication number is EP4672605 (A1). International Patent Classificat..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has released Topologic Inc patent application for Memory Element. This invention was developed by Ohmori Hiroyuki and Higo Tomoya. The patent application number is EP20240764038 20240301. The patent publication number is EP4676184 (A1). International Patent Classification codes are H1..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Samsung Electronics has filed a patent application for Semiconductor Devices. This invention was developed by Kim Jaeho, Kim Bitna, Jang Sunghwan, Yang Guifu and Jung Soonwook. The patent application number is EP20250183577 20250618. The patent publication number is EP4676179 (A1). International Patent Clas..

Semiconductor

  |  Mon 12 Jan 2026

Munich, Jan. 12 -- Usw Commercial Services Ltd has submitted a patent application for Compartmented Reaction Vessel, System and Method for Converting a Substrate to a Product. This invention was developed by Esteves Sandra, Patterson Timothy and Savvas Savvas. The patent application number is EP20240712165 20240229. The paten..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published Hangzhou Tinker Biotechnology Co Ltd patent application for Online Liquid Transfer Interface Structure for Centrifugal Micro-fluidic Chip. The invention was developed by Yang Zhiyuan, Huang Mengshi, Li Yan, Ye Jiaming, E Qing, Hua Qiang and Qian Zhihao..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Xinsheng Silicon Material Tech Suzhou Co Ltd has filed a patent application for Cone-shaped Polycrystalline Silicon Reactor Capable of Rapidly Moving Particles and Method. This invention was developed by Chen Liqun, Ma Fang and Li Hongqiang. The patent application number is CN202510448451 20250410. The pat..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Shanghai Shinchem Chemicals Co Ltd has applied Chinese patent for Yellowing-resistant Hydrophilic Organic Silicon Softener and Preparation Method Thereof. Yang Po and Cao Huabin developed it. The patent application number is CN202311769338 20231221. The patent publication number is CN120193418 (A). Interna..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Guangdong Huayao Time High Tech Equipment Co Ltd has submitted a patent application for Double-station Gauze Chip Sewing Folding Machine. This invention was developed by Li Dongpo, Zheng Daojie and Zheng Zhiguang. The patent application number is CN202510435086 20250408. The patent publication number is CN..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Zibo Shengye New Material Tech Co Ltd has filed a patent application for Automatic Spinning Forming Device for Silicon Carbide Ceramic Blank. This invention was developed by Miao Wei. The patent application number is CN202510689189 20250527. The patent publication number is CN120190889 (A). International P..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Hongzhu New Mat Ganzhou Co Ltd has applied Chinese patent for Bamboo Chip Splitting and Bamboo Juice Taking All-in-one Machine. Li Chunlin, Wen Ruidong and Liu Shuhang developed it. The patent application number is CN202510508002 20250422. The patent publication number is CN120190879 (A). International Pat..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Enaisi Zaozhuang Robot Tech Co Ltd has sought patent for Robot for Carrying Display Substrate. This invention was developed by Liu Yuzhong, Wu Chenglong and Kim Min-jun. The patent application number is CN202410343507 20240325. The patent publication number is CN120190808 (A). International Patent Classifi..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Beijing Yiganxin Tech Co Ltd has submitted a patent application for Grinding and Polishing Sample Wafer Carrier and Grinding and Polishing Equipment. This invention was developed by Guo Junjie and Du Wenzhuo. The patent application number is CN202510514015 20250423. The patent publication number is CN12019..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Henan Dubang Photoelectric Co Ltd has applied Chinese patent for Aluminum-based Silicon Carbide Optical Mirror Surface Processing Equipment and Method. Bi Wenjiang, Cao Zhichang, Sun Bo, Liao Mengde and Wei Chunyu developed it. The patent application number is CN202510217416 20250226. The patent publicatio..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received BOE Technology Group and Chengdu BOE Optoelectronics Technology patent application for Display Substrate and Display Device. Shi Ling, Shi Shiming, Huang Jianbang and Zhang Hao developed the invention. The patent application number is CN202510343155 ..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published BOE Technology Group and Hefei Xinsheng Optoelectronic Technology Co Ltd patent application for Display Substrate and Display Device. The invention was developed by Fang Jingang, Ding Luke, Su Tongshang, Cheng Jun, Zhou Bin, Zhao Ce, Wang Haitao, Wang ..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has released BOE Technology Group Co Ltd and Chengdu BOE Optoelectronics Technology patent application for Display Substrate and Preparation Method Therefor, and Display Device. This invention was developed by Zhang Jingli, Song Erlong, Zhang Kai and Chu Xiaodong. The patent applicati..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Changsha Zhongyao New Energy Co Ltd has applied Chinese patent for Large-area Perovskite Thin Film Lossless Passivation Method, Perovskite Thin Film and Solar Cell. Ren Fumeng and Zhang Wenjun developed it. The patent application number is CN202510330592 20250320. The patent publication number is CN1201871..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has released Quzhou Microquanta Renewable Energy Techn Co Ltd patent application for Internal Series-connected Perovskite Solar Cell Module and Preparation Method Therefor. This invention was developed by Yao Jizhong, Yan Buyi, Zhu Jiquan, Dai Wanlei and Yang Yawen. The patent applica..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published Zhejiang Aiko Solar Energy Technology, Guangdong Aiko Tech Co Ltd, Tianjin Aiko Solar Energy Technology, Zhuhai Fushan Aixu Solar Energy Technology and Chuzhou Aiko Solar Energy Tech Co Ltd patent application for Perovskite Solar Cell and Preparation M..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Sinomine Resource Tianjin New Mat Co Ltd has filed a patent application for Perovskite Solar Cell Doped with Pyridinium Compound and Preparation Method Thereof. This invention was developed by Wang Zhiwei, Zhang Weilun, Mao Fulong, Yan Lujie and Wang Pingwei. The patent application number is CN202510670415..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published Mianyang Huike Optoelectronics Technology Co Ltd and HKC patent application for Driving Substrate and Preparation Method of Driving Substrate. The invention was developed by Zhang Jianying and Ye Lidan. The patent application number is CN20251039295..

Semiconductor

  |  Mon 12 Jan 2026

Munich, Jan. 12 -- Mersen France Gennevilliers SAS has submitted a patent application for Doped Polycrystalline Sic Wafer with Improved Flatness and Electrical Conductivity, and Method for Producing Such a Wafer. This invention was developed by Potier Alexandre, Ferrato Marc and Bommier Christophe. The patent application numb..

Semiconductor

  |  Mon 12 Jan 2026

Munich, Jan. 12 -- Axelera AI BV has submitted a patent application for Vector Processing for In-memory Computing. This invention was developed by Eleftheriou Evangelos, Platzer Michael, Zaruba Florian and Wüthrich Domenic. The patent application number is EP20230710293 20230307. The patent publication number is EP4670090 (A..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published Sanan Japan Tech Co Ltd patent application for Silicon Carbide Semiconductor Device. The invention was developed by Shun Subei and Shioi Shinichi. The patent application number is CN202411834241 20241213. The patent publication number is CN120187057..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published Lx Semiconductor Tech Co Ltd patent application for Power Semiconductor Device and Power Converter Including Same. The invention was developed by Li Zhongguang and Kim Jin-gon. The patent application number is CN202411828268 20241212. The patent pub..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has released Hunan Jiechu Micro Semiconductor Tech Co Ltd patent application for Silicon-on-insulator Lateral Insulated Gate Bipolar Transistor Device and Preparation Method Thereof. This invention was developed by Qiu Tao, Deng Xiulin and Zhang Fanwen. The paten..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Inroad Silicon Canada Inc has submitted a patent application for Three-dimensional Stacked Chip and Manufacturing Method Thereof. Ao Hai and Gao Zhuan developed the invention. The patent application number is CN202510255895 20250305. The patent publication number is CN120187043 (A). International Patent Cl..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has released Inroad Silicon Canada Inc patent application for Three-dimensional Stacked Chip and Manufacturing Method Thereof. This invention was developed by Ao Hai and Gao Zhuan. The patent application number is CN202510255822 20250305. The patent publication n..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Inroad Silicon Canada Inc has sought patent for Three-dimensional Stacked Chip and Manufacturing Method Thereof. This invention was developed by Ao Hai and Gao Zhuan. The patent application number is CN202510255806 20250305. The patent publication number is CN120187041 (A). International Patent Classificat..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has released Inroad Silicon Canada Inc patent application for Three-dimensional Stacked Chip and Manufacturing Method Thereof. This invention was developed by Ao Hai and Gao Zhuan. The patent application number is CN202510255754 20250305. The patent publication n..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received Guangzhou Shengchuang Electronic Co Ltd patent application for PCB Positioning Mechanism of Chip Mounter and Positioning Method Thereof. Lin Bo, Yang Yonglian and Lin Yujie developed the invention. The patent application number is CN202510330966 2025..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Wuxi Xinshenghong Automation Co Ltd has filed a patent application for Mobile Platform Device for Chip Mounter. This invention was developed by Duan Dezhong, Jiang Hongying, Duan Mohong, Duan Xiying, Duan Huoying and Jiang Longchao. The patent application number is CN202510256152 20250305. The patent publi..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Guangdong Homeen Organic Silicon Mat Co Ltd has applied Chinese patent for Equal-proportion Semitransparent Bi-component Dealcoholization Type Organic Silicon Sealant for Electric Kettle and Preparation Method and Application of Equal-proportion Semitransparent Bi-component Dealcoholization Type Organic Silic..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Jinqiao Texas New Mat Co Ltd has submitted a patent application for Skin-touch Coating for Glass Substrate and Preparation Method of Skin-touch Coating. Chen Xixi, Zhu Xinlong and Song Youyue developed the invention. The patent application number is CN202510466891 20250415. The patent publication number is..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Shanghai Kunwei Tech Co Ltd has submitted a patent application for Substrate for Atomizing Core, Atomizing Core and Atomizing Device. This invention was developed by Tang Liheng and Jiang Zhijun. The patent application number is CN202311792502 20231222. The patent publication number is CN120188924 (A). Int..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- MediaTek has filed a patent application for Signal Attenuator Circuit Using Complementary Source Follower Circuit and Programmable Gain-tuning Array Circuit. This invention was developed by Park Henry Arnold, Atharav and Ali Tamer Mohammed. The patent application number is EP20250187510 20250704. The patent..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Hedera 22 SA has filed a patent application for Computer-implemented Method and System for Ranking And/or Identifying Substrate-enzyme Combinations and Predicting Substrate Range Using Machine Learning. This invention was developed by La Rocca Raphaël, Naômé Aymeric, Goffin Philippe and Rezende Lucas C D. ..

Semiconductor

  |  Mon 12 Jan 2026

Munich, Jan. 12 -- Touch Sensity has submitted a patent application for Device for Tomography Measurement Using a Ratiometric Electrical Process for a Solid Substrate. Freitas Philippe and Passet Charles developed the invention. The patent application number is EP20240709818 20240220. The patent publication number is EP466919..

Semiconductor

  |  Mon 12 Jan 2026

Munich, Jan. 12 -- European Patent Office has published Leica Microsystems NC Inc and Leica Microsystems patent application for Compact MEMS Two-dimensional MEMS Scanning Mirror Assembly Design and Related Aspects. The invention was developed by Hart Robert H. The patent application number is EP20240706449 20240223. The paten..

Semiconductor

  |  Mon 12 Jan 2026

Munich, Jan. 12 -- European Patent Office has received Kappa Agtech LLC patent application for Devices and Methods for Growing Crops with Non-fibrous, Non-porous and Non-consumable Substrate. Milton Schuyler developed the invention. The patent application number is EP20240761122 20240224. The patent publication number is EP46..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Tongxin Qisheng New Energy Tech Co Ltd has filed a patent application for Automatic Laying Machine for Solar Cell Packaging Material. This invention was developed by Ma Xue, Yang Zhong, Yang Wensheng, Yu Weiwei, Zhou Xueping and He Chungui. The patent application number is CN202510153870 20250212. The pate..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Jingjin Tech Co Ltd has submitted a patent application for Array Substrate. Lin Shengjia developed the invention. The patent application number is CN202311728086 20231215. The patent publication number is CN120187101 (A). International Patent Classification codes are G02F1/1362, H01L25/16, H10D86/60, H10H2..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received University of Electronic Science and Technology of China and CSMC Technologies patent application for Laterally Diffused Metal Oxide Semiconductor Device and Preparation Method Thereof. Liu Teng, Zhang Wentong, Zhong Shixiong, He Nailong, Zhang Sen, Zou..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Shenzhen Zhenmao Jia Semiconductor Co Ltd has submitted a patent application for Groove Type Silicon Carbide MOSFET Device and Construction Method. This invention was developed by Ren Yujiao, Ren Weiqiang and Yu Liang. The patent application number is CN202510493977 20250419. The patent publication number ..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received LX Semiconductor Tech Co Ltd patent application for Power Semiconductor Device and Power Converter Including the Same. Lee Ho Jung developed the invention. The patent application number is CN202411869266 20241218. The patent publication number is CN1..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published Sanan Japan Tech Co Ltd patent application for Silicon Carbide Semiconductor Device. The invention was developed by Shun Subei and Shioi Shinichi. The patent application number is CN202411814565 20241211. The patent publication number is CN120187070..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- The 43th Research Institute Of China Electronics Tech Group Corporation has sought patent for Metallization Method for Side Wall of Cavity of Low-temperature Co-fired Ceramic Substrate. This invention was developed by Lan Yaohai and Lyu Yang. The patent application number is CN202510318249 20250318. The pa..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Lin Danke has submitted a patent application for Skin Fluorescence Detection Integrated Circuit Chip and Preparation Method Thereof. This invention was developed by Lin Danke and Zhou Haijun. The patent application number is CN202510366996 20250326. The patent publication number is CN120186885 (A). Interna..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published Zhongshan Zhishuo Intelligent Tech Co Ltd patent application for Circuit for Realizing Intelligent Led Dimming and Color Modulation Based on Single DC-DC Dimming Chip. The invention was developed by Guo Jiawen, Li Guoxin, Qiu Zhiwei and Wu Guihua. T..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Research Institute China Mobile Communications and China Mobile Communications have applied Chinese patent for Power Control Method and Device, Communication Equipment, Chip and Storage Medium. Liu Kangyi developed it. The patent application number is CN202311754926 20231219. The patent publication number ..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- China Star Network Application Co Ltd has submitted a patent application for Emergency Service Method, Device, Equipment, Chip and Storage Medium. Li Jian, Zhou Xin and Wu Hao developed the invention. The patent application number is CN202410338350 20240322. The patent publication number is CN120186592 (A)..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Anhui Dongchao Technology has sought patent for Organic Light-emitting Material, Preparation Method of Organic Light-emitting Material and Light-emitting Device. This invention was developed by Zhang Liangliang, Wang Haiqian and Han Dong-sung. The patent application number is CN202311781393 20231221. The p..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published Inner Mongolia Haite Huacai Tech Co Ltd patent application for Preparation Method of CVD (chemical Vapor Deposition) Silicon Carbide Coating. The invention was developed by Wang Zhijiang and Liu Jingxiang. The patent application number is CN20251042..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has released BOE Technology Group, Chengdu BOE Optoelectronics Technology and Beijing BOE Technology Development patent application for Array Substrate and Display Device. This invention was developed by Du Mengmeng, Huang Yao, Liu Tingliang, Liu Lang, Zhang Yuxin, ..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Hoya and Hoya Photoelectric Tech Weihai Co Ltd have submitted a patent application for Optical Glass and Optical Element. This invention was developed by Kayano Kohei. The patent application number is CN202411878444 20241219. The patent publication number is CN120192091 (A). International Patent Classifica..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has released Wuhu Dongxu Photoelectric Sci & Tech Co Ltd, Zhejiang Xingke Photoelectric Tech Co Ltd and Tunghsu Technology Group patent application for Method and System for Controlling Thickness of Glass Substrate. This invention was developed by Li Qing, Zhu Xiang..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Weichun Biotechnology Guangzhou Co Ltd has sought patent for Core-shell Type Porous Silicon Dioxide Microsphere, Preparation Method Thereof and Application of Core-shell Type Porous Silicon Dioxide Microsphere in Structural Color. This invention was developed by Huang Xiao, Han Yuyang, Hao Yaorui and Luo Hong..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published Dalai Nur Coal Industry and Harbin Institute of Technology patent application for Method for Preparing Ti-doped Silicon Carbide from Lignite. The invention was developed by Wang Zhijiang, Huang Yuhui, Cui Yi, Le Shiru, Jing Qinghe and Shi Lei. The p..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Hanwha Chemical Corp has submitted a patent application for Electrical Connector and Inverter for Solar Cell Module Including the Same. Kim Jung-tae, Yun Ju-hwan and Kim Jung-geun developed the invention. The patent application number is CN20248004735 20240126. The patent publication number is CN120188353 ..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Toshiba and Toshiba Materials have submitted a patent application for Silicon Nitride Substrate and Silicon Nitride Circuit Substrate Using Same. This invention was developed by Matsumoto Itsuki. The patent application number is CN20248004763 20240119. The patent publication number is CN120188275 (A). Inte..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Viatron Tech Inc has submitted a patent application for Pre-cleaning Device for Semiconductor Substrate and Pre-cleaning Method Using Same. This invention was developed by Kim Hyung-jun, Noh Jae-sung, Park Wang-jun, Kwon O Sung and Han Myung-hoon. The patent application number is CN20238078999 20231130. Th..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has released Suzhou Maxwell Tech Co Ltd and Suzhou Maizheng Tech Co Ltd patent application for Radio Frequency Feed Structure and PECVD Device Having Same. This invention was developed by Qu Qingyuan, Wang Fengming, Gao Lei, Zhang Heng and Han Shaowen. The patent application number is..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Mycrobez AG has sought patent for Integrated Biodegradable Foam and Mycelium-fixated Substrate Composites and Method for Obtaining the Same. This invention was developed by Staub Jonas Anton, Pilscheur Hans Mosas, Schiller Moritz Valentin, Mennet Cedric Rafael and Grimm Felix. The patent application number ..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received Mstar Tech Inc patent application for Dual-band Imaging Method and System Integrating Image Sensor and Liquid Crystal Shutter, and Medium. Zhou Rougang, Zhang Huaxiong, Sheng Jinhua and Zhou Caijian developed the invention. The patent application num..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Shandong Inspur Science Research Institute has submitted a patent application for Network-on-chip Application Method and Device for Data Synchronization. This invention was developed by Meng Fankun, Qin Gang, Chen Jianxin and Hou Kun. The patent application number is CN202510645781 20250520. The patent pub..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Xi'an Xinhai Microelectronic Tech Co Ltd has submitted a patent application for Ethernet Interface Circuit, Signal Delay Method, Chip and Electronic Equipment. This invention was developed by Cheng Xumin and Deng Xiaobo. The patent application number is CN202510305275 20250314. The patent publication numbe..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received Zhuhai Huge IC Co Ltd patent application for Baseband Self-test Method of WiFi Chip, WiFi Chip and Wireless Communication Equipment. Ling Dekun and Peng Hong developed the invention. The patent application number is CN202510301606 20250314. The paten..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- China Star Network Application Co Ltd has submitted a patent application for Communication Method, Device, Equipment, System, Chip and Storage Medium. This invention was developed by Xiao Hong, Zhou Xin and Li Jian. The patent application number is CN202410624537 20240517. The patent publication number is ..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has released Ruishi Chuangxin Shenzhen Semiconductor Co Ltd patent application for Low-noise Amplification Chip and Radio Frequency Front-end Module. This invention was developed by Li Haizhu, Song Nan, Li Meiyu and Ni Jianxing. The patent application number is C..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Shenzhen Guangnengda Semiconductor Tech Co Ltd has submitted a patent application for Resonance Driving Circuit of Semiconductor Radio Frequency Power Supply Power Amplifier and Application. This invention was developed by Chen Zhihui, Deng Dingyang and Zhang Zhenwei. The patent application number is CN202..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Beijing Xingyuan Tech Co Ltd has submitted a patent application for Dual-mode Delay Chip RCL Oscillator Frequency Calibration Device. Guo Rongling and Liu Guoxiang developed the invention. The patent application number is CN202510252887 20250305. The patent publication number is CN120185552 (A). Internatio..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Huaian Jinmu Electronic Tech Co Ltd has filed a patent application for High-efficiency Solar Cell Panel. This invention was developed by Jin Hongtao, Zhang Jiayi and Zhou Yuanyuan. The patent application number is CN202510312535 20250317. The patent publication number is CN120185523 (A). International Pate..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Beijing Chuancheng Information Tech Co Ltd has sought patent for Voltage Doubling Rectifying Circuit and Isolation Relay Chip. This invention was developed by Wang Kun and Yun Tinghua. The patent application number is CN202510253430 20250305. The patent publication number is CN120185409 (A). International ..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published Huayuan Zhixin Semiconductor Shenzhen Co Ltd patent application for Self-powered Chip System. The invention was developed by Xiao Haibin and Guo Chunming. The patent application number is CN202510660229 20250522. The patent publication number is CN1..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Toshiba and Toshiba Materials have submitted a patent application for Method for Inspecting Amount of Deposited Powder and Method for Manufacturing Ceramic Substrate Using Same. This invention was developed by Suemori Kazuma. The patent application number is CN20238078099 20231218. The patent publication n..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- IBM has filed a patent application for Intelligent Reusable Package Improvements for Cognitive Shipping. This invention was developed by Rendahl Randy A, Fox James R, Kean Michael G and Rakshit Sarbajit K. The patent application number is CN20238078602 20231107. The patent publication number is CN120187645..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Jiangsu Toubo Photoelectric Tech Co Ltd has submitted a patent application for Intelligent Deviation-rectifying Copper-clad Ceramic Substrate Positioning Jig. This invention was developed by Shi Chuanming and Zhang Weixing. The patent application number is CN202510476250 20250416. The patent publication nu..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Gaoyou Jinghui New Mat Co Ltd has sought patent for Anti-ultraviolet Solar Cell Backboard Film and Preparation Method Thereof. This invention was developed by Li Yanxing and Tan Xiaofan. The patent application number is CN202510350426 20250324. The patent publication number is CN120191101 (A). Internationa..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Berne Univ Of Applied Sciences has sought patent for Modular Sensing and Actuating Layered Substrate for Electronic Catheters. This invention was developed by Gupta Nishant, Kuert Gerhard and Niederhauser Thomas. The patent application number is EP20240706443 20240222. The patent publication number is EP467..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Monta Vista Energy Tech Corporation Anhui has submitted a patent application for Silver-containing Silicon Carbon Composite Material and Preparation Method and Application Thereof. This invention was developed by Zhou Lisha, He Jun, Zhou Fei, Zhang Yuegang, Huang Xuefei and Luo Chi. The patent application ..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Yiweisheng Semiconductor Tech Shanghai Co Ltd has submitted a patent application for Combined Machining Method for Silicon Carbide Electrode Micropores. This invention was developed by Ding Shuangwei, Zhang Yaowen and Yu Zhengfei. The patent application number is CN202510397669 20250401. The patent publica..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received Zhejiang Fanyuan Xincai Tech Co Ltd patent application for Manufacturing Device and Method of Chip Component. Lyu Hang, Xu Xiaolin and Shen Yang developed the invention. The patent application number is CN202510676819 20250526. The patent publication..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Synworld Instr Shanghai Co Ltd has filed a patent application for Multifunctional Wafer Measuring and Sorting Device. This invention was developed by Li Furong and Li Kunlin. The patent application number is CN202510677651 20250526. The patent publication number is CN120190136 (A). International Patent Cla..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Shenzhen Jineng Environmental Protection Tech Co Ltd has filed a patent application for Biomass Wood Chip Fuel Screening Equipment Special for Biomass Gasification Boiler. This invention was developed by Chen Baojiu, Zeng Yi and Gan Junxian. The patent application number is CN202510630007 20250516. The pat..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has released Hebei Guangxing Semiconductor Technology and Beijing Shengda Zhongan Technology patent application for Automatic Deviation Rectifying Method, Device and Equipment for Glass Substrate Conveying and Storage Medium. This invention was developed by Tang Xud..
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