Semiconductor
| Sun 12 Jul 2026
Alexandria, July 13 -- Intel has applied United States patent for Heterogenous Glass Core Vias for Integrated Semiconductor Packages. Hasib Amm, Nie Bai, George Samuel, Pattadar Dhruba, Bradley Jason, Bryks Whitney, Li Yonggang, Rahman Mohammad Mamunur, Pietambaram Srinivas, Bejugam Vinith, Tseng Mao-feng, Song Hanyu and Erturk ..