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Semiconductor
| Fri 30 Jan 2026
Alexandria, Jan. 30 -- Anhui Sanan Optoelectronics Co Ltd has been granted a patent for Light-emitting Device and Manufacturing Method for Making the Same. This invention was developed by Wang Yu, Shi Xiulei, Zhao Doudou, Li Yao, Lee Cheng-hung and Ling Chan-chan.
The patent application number is US202318178297 20230303. The ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has released Xiaokeli Suzhou Semiconductor Tech Co Ltd patent application for Flexible Plasma-assisted Atomic Layer Deposition Device and Method. This invention was developed by Xiao Shaoqing.
The patent application number is CN202510740899 20250605. The patent p..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has released Hefei Weiguan Jiyuan Digital Tech Co Ltd patent application for Large Air Water Trapping System Based on MOFs (metal-organic Frameworks). This invention was developed by Li Shibo, Lai Guanxue and Geng Wei.
The patent application number is CN202510856..
Semiconductor
| Thu 29 Jan 2026
Alexandria, Jan. 30 -- United States Patent for Secure Enclave System-in-package has been issued to Octavo Systems LLC. This invention was developed by Linder Peter Robert, Murtuza Masood, Welsh Erik James and Lee William Arthur Fitzhugh.
The patent application number is US202418655486 20240506. The patent publication number ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Taizhou Huatuo Electronic Tech Co Ltd has submitted a patent application for Semiconductor Chip Packaging Box. Wang Tianhua, Wang Long and Zhang Biao developed the invention.
The patent application number is CN202510864956 20250626. The patent publication number is CN120364249 (A). International Patent Cla..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has released Danzhai Zhuyoulin Bamboo and Rattan Culture Co Ltd patent application for Assembling Process and Production Method of Bamboo Chip Tray. This invention was developed by Lin Haifeng.
The patent application number is CN202510561310 20250430. The patent ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has released Beijing Aerospace Hezhong Tech Development Co Ltd patent application for Flexible Solar Wing Substrate Structure and Preparation Method Thereof. This invention was developed by Zhang Haopeng, Qiu Quanshui, Li Haopeng, Yin Yongxia, Guo Zhisong, Ji Huijun..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has published Zhuhai Print Rite Microelectronics Co Ltd patent application for Consumable Chip and Working Method Thereof, Consumable Container and Printing Equipment. The invention was developed by Wen Guanguo, Luo Shoujie, Liao Jiansheng, Pan Huifeng, Yang Haihuo ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Yanyang New Energy Suzhou Co Ltd has submitted a patent application for Full-opening Solar Cell Printing Plate. Hu Bingfeng and Wu Lianxiang developed the invention.
The patent application number is CN202510672668 20250523. The patent publication number is CN120363597 (A). International Patent Classificati..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has published Luoyang CSI Photovoltaic Tech Co Ltd and Canadian Solar Manufacturing (Luoyang) patent application for Silicon Wafer Processing Method and Silicon Wafer. The invention was developed by Guo Qinghong, Ni Jintao and Yuan Weijin.
The patent application ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Suzhou Yuanben Tech Consulting Co Ltd has applied Chinese patent for Water-based Laser Cutting Wafer Protection Liquid and Preparation Method Thereof. Zhang Hao, Bai Changqing and Sun Liangwei developed it.
The patent application number is CN202510517583 20250424. The patent publication number is CN1203658..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Lonten Semiconductor Co Ltd has submitted a patent application for Organic Silicon Modified Epoxy Resin and Preparation Method Thereof. This invention was developed by Liu Yanfen and Chen Qiaoliang.
The patent application number is CN202510793470 20250613. The patent publication number is CN120365698 (A). ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has received Shenzhen Lianyunshan Electronic Material Tech Co Ltd patent application for Mold Cleaning Adhesive for Semiconductor Packaging Mold and Preparation Method of Mold Cleaning Adhesive. Qiu Boxiang, Deng Xiaolin, Qiu Zhaowu and Chen Zhongping developed the ..
Semiconductor
| Thu 29 Jan 2026
Alexandria, Jan. 30 -- U.S. Patent and Trademark Office has awarded a patent to Beijing BOE Optoelectronics Tech Co Ltd and BOE Technology Group for Microfluidic Substrate and Manufacturing Method Therefor, and Microfluidic Chip. Xu Shanshan and Chen Zhao developed the invention.
The patent application number is US20191704031..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Zhongmao Green Energy Tech Xian Co Ltd has applied Chinese patent for Hole Transport Layer Material for Inverted Perovskite Solar Cell, Inverted Perovskite Solar Cell and Application. Wen Qian and Yu Qiao developed it.
The patent application number is CN202510463543 20250414. The patent publication number ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Huizhou Pusaida New Mat Co Ltd has submitted a patent application for Phosphorus-containing Coupling Agent, Modified Hollow Glass Beads, Organic Silicon Pouring Sealant as Well as Preparation Method and Application of Organic Silicon Pouring Sealant. This invention was developed by Han Hongwei, Yang Dongfang ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Jiangsu Bree Optronics Co Ltd has submitted a patent application for Direct Aluminum-coated Ceramic Substrate and Preparation Method Thereof. This invention was developed by He Jinhua, Wang Jing, Liang Chao and Gu Gaoyuan.
The patent application number is CN202510501581 20250421. The patent publication num..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Huachuang Jiangsu Prec Ceramic Co Ltd has submitted a patent application for Corrosion-resistant High-performance Ceramic Substrate and Preparation Method Thereof. This invention was developed by Cheng Liang.
The patent application number is CN202510489958 20250418. The patent publication number is CN12036..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Suzhou Yi Bei High Temperature Tech Co Ltd has sought patent for High-wear-resistance Zirconium Oxide Coating Silicon Carbide Material and Preparation Method Thereof. This invention was developed by Zhang Sheng, Zhang Ziwen, Zhu Mingdong, Zhang Hongliang and Kong Yabin.
The patent application number is CN2..
Semiconductor
| Thu 29 Jan 2026
Alexandria, Jan. 30 -- ICTK Co Ltd has secured a patent on Security Device and Substrate. Lee Kyung Tek, Lee Jae Seong and Jeon Du Hyun developed the invention.
The patent application number is US202418637504 20240417. The patent publication number is US12536343 (B2). International Patent Classification codes are G06F21/71, G..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has received Lvmo Fluid Tech Chengdu Co Ltd patent application for Pretreatment Method of Water Glass and Preparation Method of Nano Silicon Dioxide. Chen Quanyi developed the invention.
The patent application number is CN202311629348 20231130. The patent publica..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Kunshan Sigo Microelectronics Co Ltd has applied Chinese patent for Preparation Method of Silicon Oxide Nanoparticles with Controllable Morphology. Bian Pengcheng, Wang Boyu, Pan Yang and Liu Xuhui developed it.
The patent application number is CN202510442690 20250409. The patent publication number is CN12..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Sichuan Qixing Nengda Tech Co Ltd has applied Chinese patent for Method for Recovering Monatomic Silicon from Silicon Smelting Slag. Zhao Ke, Wang Kuanqu, Chen Gang, Xu Changyu and Lin Yisheng developed it.
The patent application number is CN202510415326 20250403. The patent publication number is CN1203647..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Shenzhen Mems Frontier Electronics Co Ltd has sought patent for MEMS Wet Etching Processing Method and MEMS Sensor. This invention was developed by Hong Yu and Wu Bin.
The patent application number is CN202510849072 20250624. The patent publication number is CN120364646 (A). International Patent Classifica..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Shandong Tongjiang Intelligent Tech Co Ltd has sought patent for Glass Substrate Conveying and Caching System. This invention was developed by Cao Shoudong and Cao Qingguo.
The patent application number is CN202510762453 20250609. The patent publication number is CN120364433 (A). International Patent Class..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has released Yiweitang Testing Tech Shanghai Co Ltd patent application for Transportation Device and Method for Skin Organ Chip Model. This invention was developed by Li Mingyuan, Yang Yunyun and Jiang Li.
The patent application number is CN202510820645 20250619...
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Wuhan Baizhen Semiconductor Tech Co Ltd has filed a patent application for Full-automatic Wafer Chemical Plating Machine, Control Method and Use Method. This invention was developed by Xiao Zhenfang and Wang Qingsong.
The patent application number is CN202410323717 20240320. The patent publication number i..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Tianhong Tech Co Ltd has sought patent for Batch Substrate Atomic Layer Deposition Device. This invention was developed by Zhang Ronghua and Yi Jinliang.
The patent application number is CN202410102669 20240125. The patent publication number is CN120366740 (A). International Patent Classification codes are..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Yancheng Genion Electronic Mat Factory has submitted a patent application for Composite Modified Material for Lithium Niobate Wafer. This invention was developed by Xu Guozhong, Zhou Jiwei, Xu Guofeng and Xu Zhentao.
The patent application number is CN202510563578 20250429. The patent publication number is..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Inner Mongolia Zhongqi Core Mat Co Ltd has sought patent for Diamond Semiconductor Material Production Equipment Based on MPCVD Technology. This invention was developed by Zhao Jianbo, Tian Jingfeng and Chai Xihong.
The patent application number is CN202510586678 20250508. The patent publication number is ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Taizhou Tianli Ironcore Mfg Co Ltd has submitted a patent application for Transformer Silicon Steel Sheet Punching Stress Eliminating Method and Stress Eliminating Heater. This invention was developed by Yan Guidi and Shen Zhengxin.
The patent application number is CN202510276755 20250310. The patent publi..
Semiconductor
| Thu 29 Jan 2026
Alexandria, Jan. 30 -- U.S. Patent and Trademark Office has awarded a patent to Quintessent Inc for Systems and Methods for Distributing Optical Signals Using a Photonic Integrated Circuit. Koch Brian, Liu Alan and Sparacin Daniel Knight developed the invention.
The patent application number is US202217708856 20220330. The pa..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Univ Luoyang Normal has sought patent for Flexible Semiconductor Device and Application Thereof. This invention was developed by Sun Peng, Zhang Shijie, Zhang Yongxin, Guo Chenrui, Li Deguang, Zhang Jiyong, Shen Jiaquan, Xu Guoliang and Meng Qingchao.
The patent application number is CN202510557213 2025042..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Suzhou Wenhao Microfluidic Tech Co Ltd has applied Chinese patent for Biological Chip for Detecting Bacteria in Food. Nie Fuqiang developed it.
The patent application number is CN202510285707 20250311. The patent publication number is CN120366034 (A). International Patent Classification codes are C12M1/00,..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Hunan Province And New Mat Co Ltd has sought patent for Electron Beam Irradiation Cross-linked Organic Silicon Pressure-sensitive Adhesive and Preparation Method Thereof. This invention was developed by Liao Pingxiang, Lin Jiazhi, Lai Xuejun and Lin Xiaodan.
The patent application number is CN202510720306 ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Guangdong Apubang New Material Tech Co Ltd has submitted a patent application for Moisture-curing Organic Silicon Modified Acrylate Adhesive with High Refractive Index and Preparation Method of Moisture-curing Organic Silicon Modified Acrylate Adhesive. Qiu Haoyun, Long Liqun and Li Heng developed the inventi..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Shenzhen Zhongji New Mat Co Ltd has submitted a patent application for Fine Polishing Liquid for Diamond Substrate, Preparation Method of Fine Polishing Liquid and Polishing Method of Diamond Substrate. Chen Bin, Liu Xuguan, Zhao Qingzhen, Zhou Botao and Chen Dongli developed the invention.
The patent appl..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has received Suzhou Institute Of Tech patent application for Modified Organic Silicon Marine Antifouling Paint Based on Boric Acid Ester Dynamic Crosslinking and Coating. Ba Miao, Xu Ying, Cai Yudan, Chen Lulu, Feng Dongyu and Yu Suxi developed the invention.
The..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Jiangsu Wu Xin Pump Ind Co Ltd has submitted a patent application for Double-volute Split-half Wafer Type Pump Body and Centrifugal Pump Using Same. This invention was developed by Liu Ming, Gao Fen, Wang Sheng and Zhao Jie.
The patent application number is CN202510874347 20250627. The patent publication n..
Semiconductor
| Fri 30 Jan 2026
Alexandria, Jan. 30 -- United States Patent for Semiconductor Component and Semiconductor Device has been issued to Ganstronic Inc. This invention was developed by Chen Cheng-chuan.
The patent application number is US202318225846 20230725. The patent publication number is US12538795 (B2). International Patent Classification c..
Semiconductor
| Fri 30 Jan 2026
Alexandria, Jan. 30 -- Hua Hsu Advanced Tech Co Ltd has been granted a patent for Method for Wafer Treatment. This invention was developed by Jenq Muh-gueng, Lin Yung-hsiang and Le Thi-yen Thu.
The patent application number is US202318210077 20230614. The patent publication number is US12538764 (B2). International Patent Clas..
Semiconductor
| Fri 30 Jan 2026
Alexandria, Jan. 30 -- U.S. Patent and Trademark Office has awarded a patent to Shenyang Kingsemi Co Ltd and Sheyang Kingsemi Co Ltd for Semiconductor Substrate Heating Device, Semiconductor Device and Temperature Control Method. Sun Yuanbin, Chen Xinglong, Jiang Yunhe and Han Yu developed the invention.
The patent applicatio..
Semiconductor
| Fri 30 Jan 2026
Alexandria, Jan. 30 -- United States Patent for Modified Thioxanthone Photoinitiators has been issued to Lintfield Ltd and Tokyo Electron. This invention was developed by Wall Christopher, Dinh Cong-que and Nagahara Seiji.
The patent application number is US202117791834 20210115. The patent publication number is US12535735 (B..
Semiconductor
| Fri 30 Jan 2026
Alexandria, Jan. 30 -- U.S. Patent and Trademark Office has awarded a patent to Toshiba and Toshiba Electronic Devices & Storage for Semiconductor Device Having Semiconductor Regions of Alternating Conductivity Types, One of Which has a Peak in Impurity Concentration Located Between Gate Electrodes of the Semiconductor Device. ..
Semiconductor
| Fri 30 Jan 2026
Alexandria, Jan. 30 -- U.S. Patent and Trademark Office has awarded a patent to Samsung Electronics Co Ltd and SEMES for Semiconductor Element and Multiplexer Including a Plurality of Semiconductor Elements. Nam Seunggeol, Bae Hagyoul and Heo Jinseong developed the invention.
The patent application number is US202217983856 20..
Semiconductor
| Fri 30 Jan 2026
Alexandria, Jan. 30 -- United States Patent for Three-dimensional Memory Device Having Controlled Lateral Isolation Trench Depth and Methods of Forming the Same has been issued to Western Digital Tech Inc and SanDisk Technology. This invention was developed by Tsutsumi Masanori, Akasaki Keita, Kubo Tomohiro, Yada Shinsuke and Iw..
Semiconductor
| Thu 29 Jan 2026
Alexandria, Jan. 30 -- Scienta Omicron AB has secured a patent on Illumination Control Device for a Charged Particle Analyser. Olofsson Mikael developed the invention.
The patent application number is US202218546706 20220203. The patent publication number is US12535439 (B2). International Patent Classification code is G01N23/..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Zhejiang Guiyi New Energy Tech Co Ltd has submitted a patent application for Low-reflectivity Uniform Inverted Pyramid Suede Monocrystalline Silicon Texturing Additive and Application Thereof. This invention was developed by Zhou Hao, Cao Xiaan, Peng Li and Wu Baojian.
The patent application number is CN20..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- Xi'an Chenghui Metal Material Prot Co Ltd has applied Chinese patent for Metal Piece Inner Diameter Electroplating Device. Xia Quanmin, Dang Taoli, Zhang Junchao, Liu Zhuanping and Zhang Jing developed it.
The patent application number is CN202510863566 20250626. The patent publication number is CN12036687..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has released Harbin Yinguang Electroplating Co Ltd patent application for Hanging Rack for Improving Electroplating Uniformity. This invention was developed by Wang Heyi, Zhou Bingwu, Chen Hongfei, Wu Bo, Li Haixia and Jia Hongsheng.
The patent application number..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has published Dosemi Semiconductor Shanghai Co Ltd patent application for Integrated Inductance Type Switch Chip Structure and Switch Module. The invention was developed by Li Jianzheng and Yu Jiaze.
The patent application number is CN202510433448 20250408. The p..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has published Sidike Guangzhou Electronics Co Ltd patent application for Bipolar Magnetic Induction Integrated Circuit and Switch. The invention was developed by Liang Xingwei and Sa Yuangong.
The patent application number is CN202510678414 20250526. The patent p..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Innopro Tech Co Ltd has sought patent for Non-polar Electronic MOS (metal Oxide Semiconductor) Tube Array Control Method and Device. This invention was developed by Xu Youhua.
The patent application number is CN202510476682 20250416. The patent publication number is CN120357885 (A). International Patent Cl..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Xiamen Yinke Qirui Semiconductor Tech Co Ltd has sought patent for Solar Cell Taking Alloy as Flexible Substrate and Preparation Method Thereof. This invention was developed by Zhang Yinqiao and Wang Jianhong.
The patent application number is CN202510447044 20250410. The patent publication number is CN1203..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has received Changchun Changguang Chenpu Tech Co Ltd patent application for Video-level Multispectral Imaging Chip. Yang Fei, Zhang Zhuo, Lin Hongyang, Qin Yuan, Song Zhengwei, Liu Huanhuan and Sui Zhen developed the invention.
The patent application number is CN..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Maanshan Lingzhong New Energy Tech Co Ltd has submitted a patent application for Ultra-light Crystalline Silicon Solar Photovoltaic Cell. This invention was developed by Jiang Junjie, Zhang Fengming, Wu Shiliang and Wang Wei.
The patent application number is CN202510487043 20250418. The patent publication ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has released Northwest Electronic Equipment Tech Research Institute Second Research Institute Of China Electronic patent application for Back Metal Reworking Process of Silicon Carbide Power Device. This invention was developed by Wu Shuxuan, Deng Zhuanlong, Li Xiao..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has received Beijing Integrated Circuit Equipment Innovation Center Co Ltd patent application for Semiconductor Structure Processing Method and Semiconductor Process Equipment. Sun Chunyu, Xu Wenqing, Zhao Leichao and Shi Xiaoping developed the invention.
The pat..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Nanjing Hanjing Energy Storage Tech Co Ltd has applied Chinese patent for All-solid-state Battery Based on High-performance Silicon Negative Electrode and Conversion Type Positive Electrode and Dynamic Compensation Method for Volume Expansion of All-solid-state Battery. Zhang Tengfei and Yu Xuebin developed i..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Xingyao Semiconductor Wuhan Co Ltd has applied Chinese patent for Method and Structure for Preventing Corrosion of Metal Bonding Layer in Wafer Bonding Structure. Wang Siwei and Fang Shiwei developed it.
The patent application number is CN20241051631 20240112. The patent publication number is CN120356882 (..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Huancheng Intelligent Equipment Chengdu Co Ltd has applied Chinese patent for Alignment Mechanism for Vacuum Chamber and Wafer Alignment System. Liu Rui, Liu Lin, Lin Zhenzhang and Xie Jiajian developed it.
The patent application number is CN202510837430 20250623. The patent publication number is CN1203568..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has published Information Communication Branch State Grid Jibei Electric Power Company, State Grid Jibei Electric Power Co Ltd and State Grid Corporation of China patent application for Auxiliary Device for Packaging Semiconductor Chip. The invention was developed b..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Saisi Exploration Hubei New Material Tech Co Ltd has applied Chinese patent for High-strength Long-service-life Quartz Combined Silicon Carbide Boat Support and Method Thereof. Yu Chao, Chen Yufeng, Tan Chuanqi, Zhu Hongxi, Chen Yinqiao and Nie Wei developed it.
The patent application number is CN202510377..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Gaoneng Ruitai Shandong Electronic Tech Co Ltd has submitted a patent application for Cap Device for Chip Packaging. This invention was developed by Li Enze, Shi Xian, Wang Haiying and Yang Yanhui.
The patent application number is CN202510854623 20250625. The patent publication number is CN120356853 (A). I..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Hebei Zhaozi Tech Co Ltd has submitted a patent application for Intelligent Processing Monitoring System of Integrated Circuit Chip. Jia Huiqin developed the invention.
The patent application number is CN202510581145 20250507. The patent publication number is CN120356850 (A). International Patent Classific..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has published Zhejiang Lishui Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Doped Gas Regulation and Control Equipment and Method for Wafer Production. The invention was developed by Xu Xinhua.
The patent application number is CN202510550366 ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Wentian Jingce Instrument Tech Suzhou Co Ltd has applied Chinese patent for Baking Device Used in Wafer Bonding Equipment. Yang Peiyu, Zhao Tianbiao, Jiang Jie and Li Hongjun developed it.
The patent application number is CN202510489382 20250418. The patent publication number is CN120356847 (A). Internatio..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has published Shenzhen Chenda Semiconductor Co Ltd patent application for Preparation Method of Sic MOS Tube with High Thermal Conductivity and Wide Working Temperature Range. The invention was developed by Ma Yijun and Ma Yimian.
The patent application number is..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has published Chaojing Tech Heilongjiang Co Ltd patent application for Large-size Diamond-based Gallium Nitride Wafer and Preparation Method Thereof. The invention was developed by Liu Yiming and Sun Lili.
The patent application number is CN202510430301 20250408...
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has published Kunshan Pinpu Electronic Tech Co Ltd patent application for Foamed Silicon Dioxide Insulating High-fidelity Communication Coaxial Cable and Preparation Method Thereof. The invention was developed by Jin Zhijie, Zhang Yashan, Lyu Ying, Liu Shuquan and X..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has published Xi'an Chuanglian Photoelectric New Mat Co Ltd patent application for High-conductivity Thermocuring Hjt Solar Cell Silver Paste. The invention was developed by He Wei, Zhang Bo, Yang Kun, Li Hongjie and Liu Jiake.
The patent application number is CN..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Shenzhen Jove Tech Ltd has applied Chinese patent for Microwave Communication Radio Frequency Front-end Transceiver Chip and Dynamic Bandwidth Allocation Method and System. Feng Xianhua developed it.
The patent application number is CN202510716459 20250530. The patent publication number is CN120357917 (A)...
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Xinhe Semiconductor Hefei Co Ltd has applied Chinese patent for Power Electronic Power Supply Based on Integrated Power Semiconductor Module. Zhao Fengjian, Shan Weiping, Zhao Qing, Shi Xiaoping, Zhao Haiming, Xu Miaoling and Zhang Chen developed it.
The patent application number is CN202510516084 20250423..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has received Zhongmao Green Energy Tech Xi'an Co Ltd patent application for Additive Modified Perovskite Light Absorption Layer Material, Preparation Method and Perovskite Solar Cell. Guan Ping and Ma Kunhui developed the invention.
The patent application number ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has released Najingtech Co Ltd patent application for Preparation Method and Application of Semiconductor Nanocrystalline Pattern Layer. This invention was developed by Xiao Pengwei, Gao Yuan and Zhao Jingxin.
The patent application number is CN202510785058 20250..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Beijing Boya Clean Energy Tech Co Ltd has submitted a patent application for Perovskite Solar Cell Based on Peptidomimetic Passivation and Preparation Method Thereof. Weng Peimin, Chen Peng, Xue Tao, Wang Qiyue and Wang Yanxi developed the invention.
The patent application number is CN202510426511 20250407..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Dazheng Xiamen Micro Nano Tech Co Ltd has applied Chinese patent for Hole Transport Layer, Preparation Method and Perovskite Solar Cell. Zhang Aihua, Chang Kai, Xu Weizhe, Zhang Kang, Zheng Wei, Gan Yuanbing and Zhuang Ziquan developed it.
The patent application number is CN202510332199 20250320. The paten..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has received Shenzhen Zhongke Guangxin Semiconductor Tech Co Ltd patent application for Vcsel Chip Preparation Method and Vcsel Chip. Zheng Junxiong and Dong Bo developed the invention.
The patent application number is CN202510532815 20250425. The patent publicat..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Nanjing Jingyao Xinhui Semiconductor Tech Co Ltd has submitted a patent application for Epitaxial Chip Structure for High-speed Optical Communication. This invention was developed by Li Xiaohan, Chen Guanting, Huai Chen, Li Yannian and Cheng Lin.
The patent application number is CN202510534314 20250427. Th..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Huachen Xinguang Wuxi Semiconductor Co Ltd has sought patent for Laser Chip Stripping System. This invention was developed by Li Ning, Leng Xiang and Wei Ming.
The patent application number is CN202510735467 20250604. The patent publication number is CN120357260 (A). International Patent Classification cod..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has published Shenzhen Technology University and Shenzhen Special Zone Construction Eng Energy Construction Group Co Ltd patent application for Perovskite Solar Cell Containing Halogen Ammonium Salt and Preparation Method Thereof. The invention was developed by Hu Y..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Tianma New Display Tech Research Institute Xiamen Co Ltd has submitted a patent application for Transfer Substrate and Microchip Transfer Method. Huang An developed the invention.
The patent application number is CN202510486535 20250417. The patent publication number is CN120358860 (A). International Paten..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- BOE Huacan Huahui Smart Mfg Guangdong Co Ltd has filed a patent application for Packaging Substrate and Light Emitting Diode Packaging Structure. This invention was developed by Li Hui, Hu Xuntao, Zhang Ji, Zhang Fang and Xu Qingxiang.
The patent application number is CN202510384469 20250328. The patent pu..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Longji Green Energy Photovoltaic Tech Xixian New Area Co Ltd has submitted a patent application for Silicon Substrate, Photovoltaic Module, Solar Cell and Manufacturing Method Thereof. This invention was developed by Zhang Wenku, Zhao Zanliang, Huang Chao, Wang Wulin and Yao Qi.
The patent application numb..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Shenzhen Kangyuan Semiconductor Co Ltd has applied Chinese patent for Secondary Side Synchronous Rectification Chip and Switching Power Supply. Zhong Shiwen developed it.
The patent application number is CN202510857468 20250625. The patent publication number is CN120357752 (A). International Patent Classif..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has received Tianjin JHT Semiconductor Equipment Co Ltd patent application for Double-track Discharging Mechanism of High-throughput IC Chip Tube Sorting Machine. Liu Shuailing, Li Yanzhang, Chen Qian and Li Xingbao developed the invention.
The patent application..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has published Guangxi Quanlin Intelligent Equipment Mfg Co Ltd patent application for Multistage Winnowing System for Wood Chip Impurity Removal. The invention was developed by Zhu Jing, Liang Huakun, Zhu Shanqi and Wu Yansong.
The patent application number is CN..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has received Lianhua Zhizao Wuhan Biotechnology Co Ltd patent application for Single-particle Packaging Micro-fluidic Chip Based on Hydraulic-sound Wave Focusing and Preparation Method of Single-particle Packaging Micro-fluidic Chip. Sun Xuegang, Ouyang Li, He Chunh..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Zhuhai Smart Ware Tech Co Ltd has submitted a patent application for Crystal Oscillator Starting Method and Device, Crystal Oscillation Circuit, Oscillator and Chip. Li Heng, Cheng Chun-fai and Huang Suibiao developed the invention.
The patent application number is CN202510431864 20250408. The patent publi..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has received Tokyo Electron and NICHIAS patent application for Heat Insulation Structure for Pipe, Pipe Heating System, Heat Insulation Sheet, and Construction Method for Heat Insulation Structure. Komori Eiichi, Okabe Tsuneyuki, Sasaki Akira, Fukuda Keiichi, Seki D..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Huang Chunyan has submitted a patent application for Waste Material Recovery Process Based on Silicon Carbide Composite Material Production. This invention was developed by Huang Chunyan, Ou Zhiling and Zhu Zijun.
The patent application number is CN202510553541 20250429. The patent publication number is CN..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has released Tianshui Tianguang Semiconductor Co Ltd patent application for Tube Shell Clamp and Welding Method. This invention was developed by Wang Minhua, Wang Jiangrui, Feng Yuling, Fan Xin, Ling Longlong and Li Wenjun.
The patent application number is CN2025..
Semiconductor
| Fri 30 Jan 2026
Alexandria, Jan. 30 -- Xiamen Sanan Optoelectronics Tech Co Ltd and Quanzhou Sanan Semiconductor Technology have been awarded a patent for Light-emitting Diode Device and Method for Making the Same. This invention was developed by Cai Linrong, Yang Lixun, Tseng Hsin-yi and Zhu Liqin.
The patent application number is US2022178..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has received Zhejiang Qiushi Semiconductor Equipment and Zhejiang Jingsheng Mechanical & Electrical patent application for Micropore Machining Device and Method. Wang Jinrong, Zhu Liang, Cao Jianwei, Deng Jiangshan and Fan Yeping developed the invention.
The pate..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has published Shandong University patent application for Boolean Operation Method Based on Flash Memory Addressable Memory. The invention was developed by Zhan Xuepeng, Guo Xinyi, Feng Yang, Sang Pengpeng, Chen Jiezhi and Wu Jixuan.
The patent application number ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- State Intellectual Property Office of China has received Chipbond Technology patent application for Chip Structure and Manufacturing Method Thereof. Shi Zhenghong, Xie Yongwei and Zheng Baisheng developed the invention.
The patent application number is CN202410158168 20240204. The patent publication number..
Semiconductor
| Thu 29 Jan 2026
Alexandria, Jan. 30 -- Rambus has been awarded a patent for Inter-server Memory Pooling. This invention was developed by Haywood Christopher and Erickson Evan Lawrence.
The patent application number is US202318094474 20230109. The patent publication number is US12536043 (B2). International Patent Classification codes are G06F..
Semiconductor
| Thu 29 Jan 2026
Alexandria, Jan. 30 -- Intel has been granted a patent for Tracker for Individual Branch Misprediction Cost. This invention was developed by Yasin Ahmad and Hasson Nofar.
The patent application number is US202217705946 20220328. The patent publication number is US12536087 (B2). International Patent Classification codes are G0..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 30 -- Hans Semiconductor Equipment Technology has sought patent for Laser Processing Method, Device and Equipment and Storage Medium. This invention was developed by Wang Hongen, Tong Canzhao, Liu Jiaxin, Wu Lijie and Yin Jiangang.
The patent application number is CN202510453594 20250411. The patent publication ..
Semiconductor
| Thu 29 Jan 2026
Alexandria, Jan. 30 -- Advanced Micro Devices has received a patent for Decomposing Matrices for Processing at a Processor-in-memory. This invention was developed by Boyer Michael W, Gondimalla Ashish and Beckmann Bradford M.
The patent application number is US202117490037 20210930. The patent publication number is US12536246..
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