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Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Guangdong University of Technology has filed a patent application for Control Method and System of Chip Mass Transfer Device. This invention was developed by Long Jiecai, Chen Yun, Li Yongyi, Gao Jian, Gong Jianxiang, Gu Chao, Wu Yelun, Yang Zhijun, Lin Guohuai, Sun Jianfeng, Yao Jingsong, Wang Han, Chen Xun ..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Chongqing Kangjia Optoelectronic Technology has sought patent for Light-emitting Chip Arrangement Method, Display Panel and Display Device. This invention was developed by Mao Yitian, Hu Xuanang, Li Shun, Wang Fuxiong, Xiao Junlong and Mai Xuanwei. The patent application number is CN20251014236 20250102. The..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Chongqing Kangjia Optoelectronic Technology has submitted a patent application for Epitaxial Structure and Manufacturing Method Thereof, Light-emitting Chip and Display Panel. Gu Pengjun developed the invention. The patent application number is CN20251014242 20250102. The patent publication number is CN12234..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has published Shenzhen Zhengdongming Opto Electronics Co Ltd and Huizhou Hengshen Tech Co Ltd patent application for Light Emitting Diode Chip Die Bonding Device and Die Bonding Method Thereof. The invention was developed by Li Peng and Li Juan. The patent applic..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Guangxi Xinyi Photoelectric Tech Co Ltd has submitted a patent application for LED Chip High-heat-dissipation Packaging Method Based on Thermal Diffusion Path Reconstruction. This invention was developed by Wu Xianquan and Shi Yongde. The patent application number is CN202610460083 20260409. The patent pub..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Jiangsu Chaowei Photoelectric Co Ltd has applied Chinese patent for Multi-station Collaborative LED Wafer High-speed Die Bonding Device. Ge Chufan, Chen Xiaodong and Shi Gang developed it. The patent application number is CN202610436375 20260403. The patent publication number is CN122340969 (A). Internatio..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has published Shandong Runma Solar Energy Tech Co Ltd and Ronma Solar Technology Jinhua patent application for Solar Cell, Solar Cell Module, and Sealing Material. The invention was developed by Wu Peng, Yu Wangwang, He Liang, Cheng Xiaojuan, Zhou Yingying and Sun M..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has published Zhuhai Jingci Electronic Tech Co Ltd patent application for Embedded Composite Substrate Structure and Preparation Method Thereof. The invention was developed by Yan Haoqiang and Xun Zongxian. The patent application number is CN202610490320 20260414..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Shenzhen Deyizhi Photoelectric Co Ltd has submitted a patent application for OLED Module Heat Dissipation Structure and OLED Display Screen. Lin Yong, Lin Jiujun, Wang Dejie and Wu Yunzhang developed the invention. The patent application number is CN202610514369 20260417. The patent publication number is C..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Shenzhen Xinkailai Industry Machine has submitted a patent application for Laser-maintained Plasma Light Source, Adjustment Control Method Thereof and Semiconductor Device. Cheng Liang, Cheng Zhiwen, Li Rihua and Ding Zhanghao developed the invention. The patent application number is CN202610210063 20260212...

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Momenta Suzhou Technology has filed a patent application for Light Source Driving Circuit, Chip and Domain Controller. This invention was developed by Zhao Xuefeng, Yang Fan and Liu Junrong. The patent application number is CN20251021312 20250103. The patent publication number is CN122340686 (A). Internation..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Chongqing Kangjia Optoelectronic Technology has submitted a patent application for Light-emitting Chip Double-color Packaging Method, Display Panel and Display Equipment. This invention was developed by Liu Zhixian, Xiao Junlong and Ye Tingting. The patent application number is CN20251014244 20250102. The pa..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has published Zhejiang Aiko Solar Energy Technology, Zhuhai Fushan Aixu Solar Energy Technology and Tianjin Aiko Solar Energy Technology patent application for Silicon Wafer Surface Treatment Method, Photovoltaic Cell and Preparation Method. The invention was develo..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has received Northwestern Polytechnical University, Shenzhen Aoxiang Ruiying Tech Co Ltd and Research & Development Inst Of Northwestern Polytechnical University In Shenzhen patent application for Near-space Sublimation Method Process for Improving Uniformity of Lar..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Hengdian Group DMEGC Magnetics has submitted a patent application for Preparation Method of Selective Emitter, Solar Cell and Preparation Method of Solar Cell. Huang Hanhan, Zhang Yifan, Song Jintao and He Xinshao developed the invention. The patent application number is CN202610225066 20260225. The patent p..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Chengdu Shansiwei Tech Co Ltd has applied Chinese patent for Apparatus and Method for Detector Chip Coupling. Ma Shuaihui, Luo Jie and Guo Lianxi developed it. The patent application number is CN202411975699 20241231. The patent publication number is CN122340930 (A). International Patent Classification cod..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Suzhou Vocational and Technical Univ Suzhou Open Univ has submitted a patent application for Vertical Close-packed Silicon Nanowire CFET Structure and Preparation Method Thereof. This invention was developed by Sun Ying, Wang Shihui and Ibiki Kazuhiro. The patent application number is CN202610315032 202603..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Chen Junyuan, Wang Chaoxun, Wang Zhihao, Jiang Guocheng, Su Huanjie and Yang Fukai. The patent application num..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has published Taiwan Semiconductor Manufacturing patent application for Semiconductor Device and Manufacturing Method Thereof. The invention was developed by Wang Zhilin, Hsiao Tsung-chieh and Peng Chengyi. The patent application number is CN202610280626 20260309. ..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Hangzhou Puxiguangjing Semiconductor Technology Co Ltd has submitted a patent application for Gallium Nitride and MOS Power Module for Robot Digital Control Unit. This invention was developed by Jiang Fengyi, Ren Na, Yang Qi, Li Jiashuai, Xu Yili and Li Xin. The patent application number is CN202610780402 ..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Hangzhou Fuxin Semiconductor has sought patent for Preparation Method of Semiconductor Structure and Semiconductor Device. This invention was developed by Wu Chao. The patent application number is CN202610798656 20260603. The patent publication number is CN122340889 (A). International Patent Classification c..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Xinlian Integrated Circuit Manufacturing has submitted a patent application for Preparation Method of Semiconductor Device and Semiconductor Device. Tian Shufang, Huang Yan and Zhao Xiaoyan developed the invention. The patent application number is CN202610400260 20260330. The patent publication number is CN1..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Taiwan Semiconductor Manufacturing has applied Chinese patent for Semiconductor Device and Method of Forming Semiconductor Device. Li Yilun, Cai Xinhan, Cai Youtai and Li Zhiwei developed it. The patent application number is CN202610310183 20260313. The patent publication number is CN122340885 (A). Internati..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Semiconductor Device and Forming Method Thereof. This invention was developed by Li Zonglin, Ye Zhikai and Ye Zhuhui. The patent application number is CN202610310176 20260313. The patent publication number is CN122340884 (A). Internati..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Taiwan Semiconductor Manufacturing has applied Chinese patent for Method of Forming Semiconductor Structure. Chen Sihua, Liao Siya, Wen Weiyuan and Yang Kaijie developed it. The patent application number is CN202610294488 20260311. The patent publication number is CN122340881 (A). International Patent Classi..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Jiangsu Donghai Semiconductor has submitted a patent application for Stepped P-well High-voltage-resistant Shield Gate Type MOS (metal Oxide Semiconductor) Tube. This invention was developed by Xia Huazhong, Xia Huaqiu, Hu Gai and Jiao Wei. The patent application number is CN202610431194 20260402. The patent..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- United Microelectronics Corporation has sought patent for Semiconductor Element and Manufacturing Method Thereof. This invention was developed by Jin Tae Woo, Yang Minti, Lin Junxian and Hong Qingwen. The patent application number is CN20251076017 20250117. The patent publication number is CN122340864 (A)...

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Beijing Chaoxian Memory Research Institute has submitted a patent application for Transistor, Semiconductor Device and Manufacturing Method Thereof, and Electronic Equipment. This invention was developed by Liu Xiaomeng, Wang Xiangsheng, Wang Guilei, Song Yanpeng, Wang Hailing and Zhao Chao. The patent app..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Southern University of Science and Technology has sought patent for Two-dimensional Semiconductor Transistor and Preparation Method and Application Thereof. This invention was developed by Salach, Ren Zecheng, Liang Jinxuan, Lei Ruoyu, Chen Peng and Liu Xianlong. The patent application number is CN2026102600..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has published Runxin Microelectronics Dalian Co Ltd patent application for Depletion Type Gallium Nitride Chip and Cascade Packaging Device. The invention was developed by Ren Yongshuo, Sun Guozhen, Xu Lingrui, Liang Huinan and Wang Ronghua. The patent applicatio..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Guangzhou Zengxin Technology has submitted a patent application for Hv MOS Tube and Preparation Method Thereof. This invention was developed by Tao Bo, Wang Zijian, Gu Liangzhi, Li Yutang and Liu Jiaqi. The patent application number is CN202610451239 20260407. The patent publication number is CN122340846 (A)..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Semiconductor Device and Forming Method Thereof. This invention was developed by Zhong Zhengting, Wang Zhihao, Jiang Guocheng, Chen Guanlin and Zhu Xining. The patent application number is CN202..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Southern University of Science and Technology has submitted a patent application for High-performance P-type Two-dimensional Semiconductor Transistor and Preparation Method and Application Thereof. Zhou Xiaojun, Chen Peng and Wei Yinghao developed the invention. The patent application number is CN20261025829..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Runxin Microelectronics Dalian Co Ltd has filed a patent application for Depletion Type Gallium Nitride Chip and Preparation Method Thereof. This invention was developed by Ren Yongshuo, Sun Guozhen, Xu Lingrui, Liang Huinan and Wang Ronghua. The patent application number is CN202610239740 20251225. The pa..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has published Institute of Microelectronics, CAS and Guangdong Greater Bay Area Inst Of Integrated Circuit And System patent application for Preparation Method of MOS (Metal Oxide Semiconductor) Device. The invention was developed by Chen Xu, Luo Jun, Liu Chang and ..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Guangdong Opcso Tech Co Ltd has submitted a patent application for Constant-current Driving Chip for Fishing Float, Fishing Float and Control Method. This invention was developed by Liu Mingjian, Wang Dazhi and Zhu Gengsheng. The patent application number is CN202610496187 20260415. The patent publication ..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Silergy Semiconductor Technology (Hangzhou) has filed a patent application for Information Feedback Method, Driving System and Backlight System. This invention was developed by Zeng Zhenwen, Cao Yu, Gao Shang and Yang Yuanyu. The patent application number is CN202610519359 20260417. The patent publication nu..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Rongyao Terminal has sought patent for Business Processing Method and Device, Storage Medium, Chip System and Program Product. This invention was developed by Wang Hao. The patent application number is CN20251006202 20250102. The patent publication number is CN122340642 (A). International Patent Classificati..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Chengdu Weiguang Jidian Tech Co Ltd has submitted a patent application for Pixel Circuit, Control Method Thereof and Image Sensor. This invention was developed by Zhou Yang and Wen Jianxin. The patent application number is CN202610507427 20260416. The patent publication number is CN122340372 (A). Internati..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has published NVIDIA patent application for Multi-frame Interpolation for Real-time Video Processing Using Deep Neural Networks. The invention was developed by Luo Zhekun, Sulecki Andrew, Kondruszewicz Wojciech, Pottorf Robert and Lunden John R. The patent applicat..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Taiwan Semiconductor Manufacturing has applied Chinese patent for Semiconductor Structure and Forming Method Thereof. Li Yilun, Tong Xuanyu, Cai Xinhan and Li Zhiwei developed it. The patent application number is CN202610310172 20260313. The patent publication number is CN122340883 (A). International Patent ..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Chen Kunyi, Wu Weicheng, Zhuang Xueli, Wang Yiqing, Huang Guoqin, Xie Zhiren and Deng Lifeng. The patent appli..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has received Chengdu Jiangjing Semiconductor Co Ltd and Tianfu Jiangxi Laboratory patent application for Multi-chip Silicon Carbide Power Module and Packaging Method Thereof. Wang Zhigang, Zhong Chiyu and Huang Xiaobing developed the invention. The patent applica..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Powerchip Semiconductor Manufacturing Corporation has filed a patent application for Memory Structure and Manufacturing Method Thereof. This invention was developed by Zhang Lipeng and Zhang Sanrong. The patent application number is CN20251066080 20250116. The patent publication number is CN122340806 (A). ..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Shenzhen Yunji Intelligent Tech Co Ltd has applied Chinese patent for Multifunctional Integrated Chip for Smart Phone and Application Thereof. Zhang Lihua, Yan Gaolei and Zhuang Shicai developed it. The patent application number is CN202610697596 20260520. The patent publication number is CN122340211 (A). ..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has published SK Hynix patent application for Manufacturing Method of Memory Device. The invention was developed by Choi Won-keun, Park Mi-seong, Jang Jung-sik, Kwak No Kyu, Liang Naying, Choi Seok-min and Park In-su. The patent application number is CN202510866783..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Xinlian Integrated Circuit Manufacturing has sought patent for Preparation Method of Semiconductor Device and Semiconductor Device. This invention was developed by Gu Xueqiang, Sun Jinshan, Wang Qiang and Song Miaomiao. The patent application number is CN202610420503 20260401. The patent publication number i..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has released ChangXin Technology Group patent application for Semiconductor Structure and Manufacturing Method of Semiconductor Structure. This invention was developed by Shi Lu'an, Chen Yinchu, Zhu Shun, Chen Longyang and Fang Ke. The patent application number is ..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Taiwan Semiconductor Manufacturing has sought patent for Semiconductor Device and Forming Method Thereof. This invention was developed by Zhang Ruiwen, Ding Yifeng, Chang Fong-min, Chen Ruilin and Wang Pingwei. The patent application number is CN202610310179 20260313. The patent publication number is CN12234..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has published Hailin Yizao Integrated Circuit Langfang Co Ltd patent application for High-precision Multi-axis Linkage Chip Mounter Based on Double-track Parallelism and Visual Correction. The invention was developed by Ren Xuezhi. The patent application number i..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Zhouzhi Taiyuan Digital Tech Co Ltd has applied Chinese patent for Compression Seat for Quickly Replacing Suction Nozzle of Memory Chip Particle Placement Machine. Liang Jiantao developed it. The patent application number is CN202610446741 20260407. The patent publication number is CN122340795 (A). Interna..

Semiconductor

  |  Sat 17 Oct 2026

Beijing, Oct. 16 -- Tianjin Teel Tech Co Ltd has filed a patent application for Two-phase Immersion Liquid Cooling Fin Column Grooving Chip Heat Dissipation Control System Based on Heat Management. This invention was developed by Xue Xiaodong, Xie Yaxuan, Qin Guoqiang, Li Xueqiang, Sun Haiwang, Zhou Meng and Liu Shengchun. Th..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Kokusai Electric Semiconductor Service Inc has submitted a patent application for Measurement Method, Semiconductor Device Manufacturing Method, Program, and Resistivity Measuring Device. This invention was developed by Ueda Kohei, Miyakawa Ryuichi and Shochi Futa. The patent application number is WO2026JP1..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- Mayfran Int BV has submitted a patent application for Machine Chip and Coolant Flow Cleaning System for Endless Belt Conveyor. This invention was developed by Manzukic Mark Andrew, Petrovic Nebojsa, Yuksel Melissa M, Gervais Michael C and Velten Wilhelmus J C. The patent application number is CN20261023555..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has received Wuhan Xinxin Semiconductor patent application for Bonding Crystal Grain, Semiconductor Device and Forming Method Thereof. Hu Sheng, Song Shengjin, Zhan Qiong and Zhan Di developed the invention. The patent application number is CN202610771272 20260601...

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- Beijing Xinli Tech Innovation Center Co Ltd has submitted a patent application for High-precision Bonding Semiconductor Device Manufacturing Method and Production System. Liu Kuo, Han Jianzhong and Xu Peng developed the invention. The patent application number is CN202610504101 20260416. The patent publica..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- Wuyuan Semiconductor Tech Qingdao Co Ltd has applied Chinese patent for Driving Chip Based on Hybrid Bonding and Heterogeneous Integration and Preparation Method Thereof. Fu Xinyue, Yang Ruifeng and Wang Xin developed it. The patent application number is CN202610422043 20260401. The patent publication numb..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Panasonic Intellectual Property Management has sought patent for Light-transmissive Substrate. This invention was developed by Yamamoto Yusuke, Araki Kota, Jeon Sohui and Shibata Kenji. The patent application number is WO2025JP39459 20251111. The patent publication number is WO2026210869 (A1). International..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Mitsubishi Electric has submitted a patent application for Microstrip Line and Semiconductor Device. This invention was developed by Komatsuzaki Yuji, Sasaki Yoshinobu and Taguchi Marie. The patent application number is WO2025JP13418 20250401. The patent publication number is WO2026210709 (A1). International ..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Idemitsu Kosan has submitted a patent application for Transistor and Semiconductor Device. This invention was developed by Sunagawa Misa, Tsuruma Yuki and Tomai Shigekazu. The patent application number is WO2025JP13203 20250331. The patent publication number is WO2026210641 (A1). International Patent Classifi..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device. This invention was developed by Nakahara Kenta. The patent application number is WO2025JP13122 20250331. The patent publication number is WO2026210597 (A1). An abstract released by the World Intellectual Property Organizati..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- World Intellectual Property Organization has received Hitachi High Technologies patent application for an Etching Processing Method and a Semiconductor Manufacturing System. Nguyen Thi-thuy-nga, Ishikawa Kenji, Hori Masaru and Shinoda Kazunori developed the invention. The patent application number is WO2025JP..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- ITC Ltd has submitted a patent application for an Aerosol Generating Device Facilitating Uniform Distribution of an Aerosol Generating Substrate. Sunkara Koteswara Rao, Shivanna Naveen Koppa and Gudihal Vijaya Vittal developed the invention. The patent application number is WO2026IB53174 20260331. The paten..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Kyocera has submitted a patent application for Optical Waveguide Substrate. This invention was developed by Toujo Ayane. The patent application number is WO2026JP12237 20260325. The patent publication number is WO2026205275 (A1). International Patent Classification codes are G02B6/12, G02B6/122 and G02B6/42. ..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- World Intellectual Property Organization has released Daikin India patent application for Member, and Semiconductor Manufacturing–related Device. This invention was developed by Nakano Marina, Tokuda Masato, Okuno Shingo and Tsujimoto Nobuyuki. The patent application number is WO2026JP12215 20260325. The pa..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- World Intellectual Property Organization has released Daikin India patent application for Joined Body for Semiconductor Manufacturing-related Device, Method for Manufacturing Joined Body for Semiconductor Manufacturing-related Device, and Semiconductor Manufacturing-related Device. This invention was developed..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Daikin India has submitted a patent application for Member, and Semiconductor Manufacturing–related Device. Nakano Marina, Tokuda Masato, Okuno Shingo and Tsujimoto Nobuyuki developed the invention. The patent application number is WO2026JP12210 20260325. The patent publication number is WO2026205262 (A1). ..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Daikin India has filed a patent application for Member, and Semiconductor Manufacturing-related Device. This invention was developed by Nakano Marina, Tokuda Masato, Okuno Shingo and Tsujimoto Nobuyuki. The patent application number is WO2026JP12207 20260325. The patent publication number is WO2026205261 (A1)..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Daikin India has submitted a patent application for Member, and Semiconductor Manufacturing-related Device. This invention was developed by Nakano Marina, Tokuda Masato, Okuno Shingo and Tsujimoto Nobuyuki. The patent application number is WO2026JP12206 20260325. The patent publication number is WO2026205260 ..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Daikin India has filed a patent application for Transfer System Member, and Semiconductor Manufacturing-related Device. This invention was developed by Nakano Marina, Kishikawa Yosuke, Okuno Shingo and Tsujimoto Nobuyuki. The patent application number is WO2026JP12204 20260325. The patent publication number i..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- World Intellectual Property Organization has published Daikin India patent application for Member, and Semiconductor Manufacturing-related Device. The invention was developed by Nakano Marina, Okuno Shingo and Tsujimoto Nobuyuki. The patent application number is WO2026JP12201 20260325. The patent publication ..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Furukawa Electric has submitted a patent application for Optical Semiconductor Module, Optical Semiconductor Unit, and Raman Amplifier. Yoshida Junji, Thudsalingkarnsakul Nitidet, Anantathanasarn Sanguan, Odaka Kazumi, Rammarat Ekkachai, Mamart Wikatsama, Somfai Nattapon and Tatamida Yasuto developed the inven..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- World Intellectual Property Organization has released Panasonic Intellectual Property Management patent application for Resin Composition for Sealing and Semiconductor Device. This invention was developed by Sanada Shohei. The patent application number is WO2026JP12132 20260325. The patent publication number ..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- World Intellectual Property Organization has released Panasonic Intellectual Property Management patent application for Resin Composition for Sealing and Semiconductor Device. This invention was developed by Sanada Shohei. The patent application number is WO2026JP12129 20260325. The patent publication number ..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- World Intellectual Property Organization has released Nitto Denko patent application for Substrate with Built-in Inductor and Method for Manufacturing Substrate with Built-in Inductor. This invention was developed by Furukawa Yoshihiro, Yamanishi Daiki and Nakayama Hidenori. The patent application number is W..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Sato KK has filed a patent application for Conductive-film-equipped Resin Substrate Manufacturing Method, Electronic Device Manufacturing Method, Electromagnetic Wave Shield Sheet Manufacturing Method, and Planar Heating Element Manufacturing Method. This invention was developed by Yashiro Shumpei, Shibata Tak..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- World Intellectual Property Organization has received Sato KK patent application for Resin Substrate with Conductive Film, Electronic Device, Electromagnetic Wave Shield Sheet, and Planar Heating Element. Yashiro Shumpei, Shibata Takeshi, Shinada Hidetoshi and Ogawa Takayuki developed the invention. The pat..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Sato KK has filed a patent application for Conductive-film-equipped Substrate, Electronic Device, Electromagnetic Wave Shielding Sheet, Planar Heating Element, and Method for Manufacturing Conductive-film-equipped Substrate. This invention was developed by Yashiro Shumpei, Shibata Takeshi, Shinada Hidetoshi an..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Sato KK has submitted a patent application for Conductive Film-equipped Substrate, Electronic Device, Electromagnetic Wave Shielding Sheet, Planar Heating Element, and Method for Manufacturing Conductive Film-equipped Substrate. Yashiro Shumpei, Shibata Takeshi, Shinada Hidetoshi and Ogawa Takayuki developed t..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Sato KK has submitted a patent application for Paper Substrate with Conductive Film, Electronic Device, Electromagnetic Wave Shielding Sheet, and Planar Heating Element. This invention was developed by Yashiro Shumpei, Shibata Takeshi, Shinada Hidetoshi and Ogawa Takayuki. The patent application number is W..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- World Intellectual Property Organization has published NAMICS Corporation patent application for Epoxy Resin Composition, Cured Product, Semiconductor Device, and Method for Producing Semiconductor Device. The invention was developed by Ogawa Hideaki and Iwaya Ruka. The patent application number is WO2026JP11..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- NGK Corp has submitted a patent application for Composite Substrate, Device, and Method for Manufacturing Composite Substrate. Kaneko Shinya, Fujita Naoki, Niwa Masato and Yajima Ryuga developed the invention. The patent application number is WO2026JP11874 20260324. The patent publication number is WO202620..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- NGK Corp has sought patent for Composite Substrate, Device, and Method for Manufacturing Composite Substrate. This invention was developed by Yajima Ryuga and Hazumi Masahiro. The patent application number is WO2026JP11869 20260324. The patent publication number is WO2026205112 (A1). International Patent Cl..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- Nippon Electric Glass has submitted a patent application for Glass for Coating Semiconductor Element, and Sintered Body for Coating Semiconductor Element. This invention was developed by Hirose Masayuki. The patent application number is WO2026JP11716 20260324. The patent publication number is WO2026205040 (A1..

Semiconductor

  |  Sat 17 Oct 2026

Geneva, Oct. 16 -- World Intellectual Property Organization has published Fujifilm patent application for Photosensitive Resin Composition, Cured Product, Transfer Film, Laminate, Method for Producing Cured Product, Method for Producing Semiconductor Device, and Semiconductor Device. The invention was developed by Matsuda Tomoki..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- NVIDIA has filed a patent application for Dynamic Power Optimization for High Speed Interconnects Using Machine Learning. This invention was developed by Despotovich Mark, Li Xutong, Felix Mark Alan, Carvajal Antonio, Plummer Christopher, A Choudhury, Naik Amol D, Gopalakrishnan Arun and Paikala Christian. T..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- Moxin Artificial Intelligence Tech Shenzhen Co Ltd has submitted a patent application for Data Transmission Method, System and Program Product for AI Computing Chip. This invention was developed by Li Xin. The patent application number is CN202610821417 20260608. The patent publication number is CN12234644..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- SK Hynix has sought patent for Storage Device and Operating Method for Reconstructing Mapping Table Using Host Memory Buffer. This invention was developed by Lee Jung-ho, Son Min-su, Choi Ji-hoon and Shin Soong-sun. The patent application number is CN202511599927 20251104. The patent publication number is CN..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has released Shenzhen Bayi Ind Co Ltd patent application for Automobile Intelligent Chip Dynamic Computing Power Scheduling Method Oriented to Automatic Driving Domain. This invention was developed by Xiao Houyang, Zhang Hao and Xiao Houyu. The patent application..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- Rongyao Terminal has submitted a patent application for Memory Management Method, Electronic Equipment, Storage Medium and Program Product. This invention was developed by Li Jing. The patent application number is CN20251039418 20250107. The patent publication number is CN122346371 (A). International Paten..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- Rongyao Terminal has applied Chinese patent for Wallpaper Display Method, Electronic Equipment, Storage Medium and Chip System. Zhang Taolin and Feng Ting developed it. The patent application number is CN20251028430 20250107. The patent publication number is CN122346344 (A). International Patent Classificati..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has received Dingdao Zhixin (Shanghai) Semiconductor patent application for Memory Configuration Component and Memory Configuration Method. Jia Xiongxiong developed the invention. The patent application number is CN202610771230 20260531. The patent publication nu..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has received Hangzhou Weiying Sensing Electronic Co Ltd patent application for Wafer Bonding Assembly and Wafer Bonding Equipment. Wan Ding, Zhang Tao, Chi Hai, Zhang Zhixin, Xu Zhenyu and Yang Tao developed the invention. The patent application number is CN20241..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has received Taiwan Semiconductor Manufacturing patent application for Semiconductor Package and Method of Forming Same. Zheng Rongwei, You Jiyang, Shi Yingqing, Zheng Lihui, Hou Shangyong and Shi Chaowen developed the invention. The patent application number is CN..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has received Ziguang Tongxin Microelectronics patent application for Chip Packaging Structure, Chip Packaging Method and Chip Packaging Product. Wang Ling, Huang Dongdong and Hu Bo developed the invention. The patent application number is CN202411953030 20241227. T..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has released Shenzhen Ruisi Chuangqi Tech Co Ltd patent application for Integrated Circuit Chip Packaging Processing Device and Processing Method. This invention was developed by Li Hao. The patent application number is CN202610460437 20260409. The patent publica..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has received Sanshan Chongxin Suzhou Microelectronics Tech Co Ltd patent application for Semiconductor Packaging Equipment Based on Micro-domain Control Technology and Control Method Thereof. Huang Jiawei and Zhu Jun'an developed the invention. The patent applica..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- Hangzhou Jinzhi Zhaoxin Tech Innovation Development Co Ltd has submitted a patent application for Coating Protection Method, Device and Equipment for Chip and Storage Medium. Shi Feng developed the invention. The patent application number is CN202610451432 20260407. The patent publication number is CN12234..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- Shenzhen Founder Microelectronics Co Ltd has filed a patent application for Manufacturing Method of Homogeneous Interlayer Step Solder Resist Structure Based on Groove and Semiconductor Device. This invention was developed by Zheng Qiankun, Li Rudong, Li Jin and Lai Wangkun. The patent application number i..

Semiconductor

  |  Fri 16 Oct 2026

Beijing, Oct. 16 -- State Intellectual Property Office of China has released Zhuhai Xinmaite Tech Co Ltd patent application for Welding Method of QFN (Quad Flat No-lead) Chip. This invention was developed by Qin Jianliu and Yu Jinze. The patent application number is CN202610414026 20260331. The patent publication number is CN..
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