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Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Stelight Instrument has submitted a patent application for Chip Test Equipment and Test Method. Sun Chengyang developed the invention.
The patent application number is CN202511229965 20250829. The patent publication number is CN121027144 (A). International Patent Classification codes are B07C5/02, B07C5/34..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- State Intellectual Property Office of China has released Stelight Instrument patent application for Chip Transmission Mechanism, Control Method Thereof and Chip Testing Equipment. This invention was developed by Sun Chengyang.
The patent application number is CN202511227646 20250829. The patent publication..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- State Intellectual Property Office of China has released Beijing Institute of Computer Technology & Application patent application for Device for Rapidly and Effectively Destroying Information Storage Chip Through Thermit Reaction. This invention was developed by Wu Fei, Ma Chengzhen, Ren Kaiqi, Wang Weibin, ..
Semiconductor
| Sun 05 Apr 2026
Beijing, April 6 -- State Intellectual Property Office of China has released Beijing NAURA Microelectronics Equipment patent application for Magnetic Field Adjusting Device and Semiconductor Processing Equipment. This invention was developed by Li Haodong, Jiang Bingxuan and Deng Bin.
The patent application number is CN20241066..
Semiconductor
| Sun 05 Apr 2026
Beijing, April 6 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Computing System in Digital Memory and Computing Compiler in Digital Memory. This invention was developed by Clifton Brian, Sun Xiaoyu and Akarvadar Murat Kerem.
The patent application number is..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- State Intellectual Property Office of China has released Delta Electronics patent application for Photon Integrated Circuit and Detection Method Thereof. This invention was developed by Zhang Dengxiang, Lin Enhong, Zhang He, Li Dongdong and Kee Jack Sheng.
The patent application number is CN202410662680 2024..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- State Intellectual Property Office of China has released Beijing NAURA Microelectronics Equipment patent application for Temperature Monitoring Method and Semiconductor Process Equipment. This invention was developed by Wang Feng, Liu Jiantao, Liu Hongli and Mu Xiaohang.
The patent application number is CN20..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- State Intellectual Property Office of China has released 58th Research Institute of China Electronics Technology Corporation patent application for Test Platform and Test Method for Testing Bonding Strength of Double-sided Chip Module. This invention was developed by Wei Jiayu, Wang Shinan, Wan Yongkang, Meng..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- State Intellectual Property Office of China has released Xi'an University patent application for Portable Double-path Optical Field Detection Device and Method Based on Paper Chip. This invention was developed by Guo Xiaoli, Zhai Yunhui, Tong Mingfei, Long Xiaoqian, Quan Xinyue, Liu Jun, Xie Jingyan, Bai Yuet..
Semiconductor
| Sun 05 Apr 2026
Rome, April 6 -- Italian Patent and Trademark Office has published STMicroelectronics patent application for a Compensation Circuit for Delta-sigma Modulators, Corresponding Device and Method. The invention was developed by Modaffari Roberto, Pesenti Paolo and Nicollini Germano.
The patent application number is IT20200001918 20..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- State Intellectual Property Office of China has received NVIDIA patent application for Surface Curvature Estimation for Autonomous or Semi-autonomous Systems and Applications. Jiang Chun-liang, Malayappan Raghavan R, Zhao Yan, Stojanovic Ivana and Akbazadeh Amir developed the invention.
The patent applicatio..
Semiconductor
| Sun 05 Apr 2026
Rome, April 6 -- Italian Patent and Trademark Office has received STMicroelectronics patent application for Thermoelectric Generator. Ferrari Paolo, Villa Flavio Francesco, Zanotti Luca, Nomellini Andrea and Seghizzi Luca developed the invention.
The patent application number is IT20200001879 20200131. The patent publication nu..
Semiconductor
| Sun 05 Apr 2026
Beijing, April 6 -- State Intellectual Property Office of China has received AECC Nanjing Aviation Power patent application for Bidirectional Installation Plug Seat and Magnetic Chip Installation Structure Convenient to Maintain. Jin Hongjiang, Zhang Jinxin, Zhou Jia, Cai Baiming and Gao Na developed the invention.
The patent a..
Semiconductor
| Sun 05 Apr 2026
Rome, April 6 -- Italian Patent and Trademark Office has received Lamberti patent application for Method of Coating a Substrate by Electron Beam Curing. Mansi Silvia, Vetri Domenico, Gallo Thomas, Diamante Daria, De Luca Mariuccia, Fumagalli Stefano, Floridi Giovanni and Li Bassi Giuseppe developed the invention.
The patent app..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- State Intellectual Property Office of China has received SK Hynix patent application for Semiconductor Device and Semiconductor System. Jin Xiaoqin and Park Min-su developed the invention.
The patent application number is CN202411525683 20241030. The patent publication number is CN121029647 (A). Internationa..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- State Intellectual Property Office of China has received Guangxi Juxin Technology patent application for Parallel Testing and Data Processing Optimizing Device of Laser Chip Testing Machine. Fu Jianbo, Zong Hua, Jiang Shengxiang, Liu Lei, Hu Xiaodong and Luo Zhengbiao developed the invention.
The patent appl..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- State Intellectual Property Office of China has received National Institute of Measurement and Testing Technology patent application for Test Optimization Method and Device for High-precision Chip and Storage Medium. Li Xingxing, Kong Linghui, Ran Liping, Xu Chuandi, Cheng Yuxi, Tang Xiaolin, Xue Liang and Ch..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Huawei Technologies has sought patent for First Chip, Second Chip, Chip System, Display Device and Display Method. This invention was developed by Sun Yifang, Xu Lu and Yang Zhiyong.
The patent application number is CN202411549398 20241031. The patent publication number is CN121029683 (A). International Pate..
Semiconductor
| Sun 05 Apr 2026
Beijing, April 6 -- Guangdong OPPO Mobile Telecommunications has sought patent for Task Execution Method and Device, Processing Unit and Processing Chip. This invention was developed by Nie Lingzi and Lu Yichao.
The patent application number is CN202410668081 20240527. The patent publication number is CN121029329 (A). Internati..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Dalian Medical University has sought patent for Nerve-organoid Co-culture Chip and Use Method Thereof. This invention was developed by Liu Qiang, An Fan, Pan Zhujun and He Bin.
The patent application number is CN202511300148 20250912. The patent publication number is CN121022588 (A). International Patent Cla..
Semiconductor
| Sun 05 Apr 2026
Beijing, April 6 -- Beijing NAURA Microelectronics Equipment has applied Chinese patent for Semiconductor Process Chamber and Semiconductor Process Equipment. Pang Kunfeng, Yu Zhenduo, Ren Xipeng, Deng Bin and Bian Guodong developed it.
The patent application number is CN202410667465 20240527. The patent publication number is C..
Semiconductor
| Sun 05 Apr 2026
Beijing, April 6 -- Yantai Yesdo Electronic Materials has applied Chinese patent for Bonding Aluminum Wire for Integrated Circuit Packaging and Preparation Method Thereof. Lin Liang developed it.
The patent application number is CN202511543425 20251028. The patent publication number is CN121023316 (A). International Patent Clas..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Haiguang Information Technology has applied Chinese patent for Packaging Chip Failure Detection Method and Device, Electronic Equipment and Storage Medium. Lu Yuxuan, Yao Shun, Lin Jian and Zhan Lichang developed it.
The patent application number is CN202511328841 20250917. The patent publication number is C..
Semiconductor
| Sun 05 Apr 2026
Beijing, April 6 -- Beijing NAURA Microelectronics Equipment has filed a patent application for Sealing Connection Device and Semiconductor Process Equipment. This invention was developed by Yin Lingfeng.
The patent application number is CN202410663596 20240527. The patent publication number is CN121023473 (A). International Pa..
Semiconductor
| Sun 05 Apr 2026
Beijing, April 6 -- Itest Semiconductor Technology (Yiwu) has filed a patent application for Method and System for Cleaning Pins on Demand in Chip Test. This invention was developed by Jiang Weiwei and Zhou You.
The patent application number is CN202511153538 20250818. The patent publication number is CN121028697 (A). Internati..
Semiconductor
| Sun 05 Apr 2026
Beijing, April 6 -- SK Hynix has filed a patent application for Memory Device Including Volatile Memory and Operating Method Thereof. This invention was developed by Kim Donggun, Yun Nam-hyun, Na Hyeong-ju and Lee Dong-sop.
The patent application number is CN202510511759 20250423. The patent publication number is CN121029072 (A..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Shanghai Institute of Satellite Equipment has filed a patent application for System and Method for Testing Thermal Expansion Coefficient of Flexible Substrate Assembly Under Constant Tension Condition. This invention was developed by Chen Li, Cao Hongtao, Hu Bingsheng, Du Sheng, Meng Fanping, Cheng Tao and Li..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Zhongshan Hospital, Fudan University has filed a patent application for Information Management Method for Organization Chip Manufacturing Process. This invention was developed by Hou Yingyong, Deng Minying, Jiang Dongxian, Lu Shaohua, Xu Chen, Chen Lingli, Song Qi, Yuan Wei, Luo Rongkui, Liu Hongwu, Pan Weiyu..
Semiconductor
| Sun 05 Apr 2026
Beijing, April 6 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Remote Control Method and Device of Semiconductor Production Machine, Production System and Equipment. Huang Dingjie developed the invention.
The patent application number is CN202511569479 20251030. The patent publication number is CN12..
Semiconductor
| Sun 05 Apr 2026
Rome, April 6 -- STMicroelectronics has submitted a patent application for Bit-line Voltage Generation Circuit for a Non-volatile Memory Device and Corresponding Method. This invention was developed by Perroni Maurizio Francesco, Disegni Fabio Enrico Carlo, La Placa Michele and Torti Cesare.
The patent application number is IT2..
Semiconductor
| Sun 05 Apr 2026
Beijing, April 6 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Bearing Device, Process Chamber and Semiconductor Process Equipment. This invention was developed by Xiang Hongbo, Zhang Nan, Pan Yongqing and Shi Quanyu.
The patent application number is CN202511433250 20250930. The patent publi..
Semiconductor
| Sun 05 Apr 2026
Beijing, April 6 -- Applied Materials has submitted a patent application for Ultrathin Conformal Coating for Electrostatic Dissipation in Semiconductor Process Tools. This invention was developed by Natu Jayatri, Bajaj Jitika, Goradia Prerna, Thakkar Darshan, Fenwick David, He Xiaoming, Sepaele Sonny, Sun Jennifer, Thanu Rajkuma..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- IRICO Hefei LCD Glass has submitted a patent application for Glass Substrate Grinding, Pre-wetting and Cleaning System. This invention was developed by Fu Lili and Zhu Shaowen.
The patent application number is CN202511211134 20250828. The patent publication number is CN121017148 (A). International Patent Cla..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Xiamen University has submitted a patent application for 4-atp Functionalized Ag Nanocube Detection Chip and Application Thereof in Sers (surface Enhanced Raman Scattering) Detection of Gaseous Benzaldehyde. This invention was developed by Li Jianfeng, Kou Yichuan, Zhang Yuejiao and Xu Qingchi.
The patent ap..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Shanghai Shiyu Precision Equipment has submitted a patent application for Substrate Turnover Mechanism and Method and Double-sided Laser Marking Machine. Zhao Kai, Liang Meng, Lin Haitao, Wan Zhongyu, Lyu Zhongxun and Chen Qunfei developed the invention.
The patent application number is CN202511390456 202509..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Powerchina Huadong Engineering Corporation has submitted a patent application for Sewage Treatment Regulation and Control Method and System Based on Artificial Water Body Substrate and Related Equipment. This invention was developed by Wei Jun, Wu Boran, Jiang Jingang, Li Yiping, Wu Weiyong, Chen Si and Yao Y..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- IRICO Hefei LCD Glass has submitted a patent application for Device and Method for Automatically Controlling Thickness of Tft-lcd (thin Film Transistor Liquid Crystal Display) Substrate Glass. This invention was developed by Zhou Hui, Ge Xinqing and Ning Xiaoyong.
The patent application number is CN202511351..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Beijing ESWIN Computing Technology has submitted a patent application for Cache Replacement Control Device, Chip System and Cache Replacement Control Method. This invention was developed by Fan Rundi.
The patent application number is CN202511135510 20250813. The patent publication number is CN121029637 (A). ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Shenzhen Pango Microsystems has submitted a patent application for Cascaded Clock Synchronization Circuit, Clock Synchronization Circuit, Chip and Electronic Equipment. This invention was developed by Wei Shengchang, Zhang Yong and Wen Changqing.
The patent application number is CN202510967303 20250711. The ..
Semiconductor
| Sun 05 Apr 2026
Beijing, April 6 -- Inspur Computer Technology has submitted a patent application for Micro-ring Resonator, Photoelectric Calculation Neural Network Chip and Photoelectric Calculation Method. This invention was developed by Zhang Feng, Zhu Kejian, Qi Dawei, Li Ang and Fang Yu.
The patent application number is CN202511562869 202..
Semiconductor
| Mon 06 Apr 2026
Vilnius, April 6 -- STMicroelectronics has submitted a patent application for Bit-line Voltage Generation Circuit for a Non-volatile Memory Device and Corresponding Method. This invention was developed by Perroni Maurizio Francesco, Disegni Fabio Enrico Carlo, La Placa Michele and Torti Cesare.
The patent application number is ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Beijing Hirain Technologies has submitted a patent application for System and Method for Testing Conduction Immunity of Integrated Circuit. This invention was developed by Zhang Xuan.
The patent application number is CN202511248094 20250902. The patent publication number is CN121027671 (A). International Pat..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Suzhou Zhongxin Changhong Semiconductor Technology has submitted a patent application for Detection Equipment for Chip Processing. Kim Ki-yong developed the invention.
The patent application number is CN202511231505 20250831. The patent publication number is CN121027790 (A). International Patent Classificati..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Nanjing University has submitted a patent application for Micro-fluidic Chip for Specific Single Cell Screening and Use Method of Micro-fluidic Chip. This invention was developed by Ju Huangxian, Wu Jie and Xiao Wencheng.
The patent application number is CN202511261145 20250904. The patent publication number..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Ningbo CRRC Times Transducer Technology has submitted a patent application for Current Sensing Chip Bandwidth Test System and Method. Hou Xiaowei, Zheng Huaxiong, Guan Ke, Hong Changhui, Li Juping, Zhang Po and Shi Yanan developed the invention.
The patent application number is CN202511143063 20250815. The p..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 6 -- Huawei Technologies has submitted a patent application for Ranging Method and Device, Radar Equipment, Readable Storage Medium and Chip. Zhao Yifan, Wu Yanming, Liang Junli, Shui Mengyang, Wu Yifan and Wang Jiaxing developed the invention.
The patent application number is CN202410681414 20240528. The patent ..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- Taiwan Semiconductor Mfg Company Ltd and TSMC China Company have submitted a patent application for Semiconductor Device with Reverse Current Protection. This invention was developed by Zhang David, Gui Linchun and Zhu Jiping.
The patent application number is US202418916389 20241015. The patent publicat..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- Cypress Semiconductor Corp and Politecnico Di Milano have submitted a patent application for Radio Transmitter. This invention was developed by Karman Saleh, Moleri Riccardo, Castoro Giacomo and Dartizio Simone Mattia.
The patent application number is US202418902007 20240930. The patent publication numb..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- Cypres Semiconductor Corp and Cypress Semiconductor Corporation have submitted a patent application for Reconfiguration Data Handling. This invention was developed by Kan Senwen.
The patent application number is US202418900022 20240927. The patent publication number is US20260094662 (A1). International ..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- Pan Yang and Inspiring Atoms Pte Ltd have submitted a patent application for Ai-based System and Method for Optimizing Lot Dispatching in Semiconductor Fabrication Using Reinforcement Learning and Fab-wide Digital Twin. This invention was developed by Pan Yang.
The patent application number is US2024189..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- BOE Technology Group and BOE Crystal Core Technology Co Ltd have submitted a patent application for Light-emitting Substrate and Display Device. Xu Xiaofei, Niu Enmin, Wu Zhongbao, Lu Kun, Niu Jingran and Shang Xingce developed the invention.
The patent application number is CN20248000569 20240325. The pat..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Suzhou Maxwell Technologies and Suzhou Maizheng Tech Co Ltd have submitted a patent application for Preparation Method of Heterojunction Solar Cell, Heterojunction Solar Cell and Device. Zhou Jian, Qu Qingyuan, Dang Xiaoqiang, Liu Huan, Lin Jie and Ma Wenhao developed the invention.
The patent application ..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- Greene Tweed Tech Inc and University of Rhode Island Board of Trustees have sought patent for Smart Seals for Monitoring and Analysis of Seal Properties Useful in Semiconductor Valves. This invention was developed by Quartapella Carmen J, Periyasamy Mookkan, Sassano Elizabeth, Gregory Otto J, Fischer Godi,..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- Advanced Micro Devices has applied United States patent for Processes for Manufacturing Wafer-on-wafer Devices, and Systems Incorporating Such Devices. Mandalapu Chandra Sekhar, Kulkarni Deepak Vasant, Vadlamani Sai, Alam Arsalan and Spurney Robert Grant developed it.
The patent application number is US..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- Yangtze Memory Tech Holding Co Ltd has submitted a patent application for Semiconductor Package Structure, Fabrication Method and Memory System. Liu Xiaoxin and Huo Zongliang developed the invention.
The patent application number is US202519055695 20250218. The patent publication number is US20260096481..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- U.S. Patent and Trademark Office has released Advanced Micro Devices patent application for Chip Package with Multi-tier Stacks. This invention was developed by Kulkarni Deepak Vasant and Naffziger Samuel.
The patent application number is US202418902608 20240930. The patent publication number is US20260..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- U.S. Patent and Trademark Office has released Nepes patent application for Semiconductor Package. This invention was developed by Park Jueok, Lee Sunghyuk, Yu Hanju, Lee Jungwon and Kang Insoo.
The patent application number is US202519347613 20251001. The patent publication number is US20260096458 (A1)...
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- Metaone Corp has submitted a patent application for Stacked Chip with Liquid Cooling Plate. Chiang Kuo-ching and Chiang Yueh-feng developed the invention.
The patent application number is US202519412935 20251209. The patent publication number is US20260096431 (A1). International Patent Classification co..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- Intel has sought patent for Complementary Field-effect Transistor Static Random-access Memory. This invention was developed by Augustine Charles, Ghosh Amlan and Merchant Feroze.
The patent application number is US202418900291 20240927. The patent publication number is US20260096411 (A1). International ..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- Samsun Elgectronics Co Ltd has applied United States patent for Semiconductor Device. Jin Woojin, Noh Yunseok, Park Sangun, You Taeyang, Yoo Haemin and Lee Joohwan developed it.
The patent application number is US202519097188 20250401. The patent publication number is US20260096399 (A1). International P..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- Skytech Inc has sought patent for Wafer Holder for Providing Even Temperature Distribution. This invention was developed by Wang Chun-fu, Cheng Chi-hung, Cheng Yao-syuan, Liu Chi-hsiang, Liu Kuo-ju and Yi Ching-liang.
The patent application number is US202418980831 20241213. The patent publication numbe..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- U.S. Patent and Trademark Office has published Disco patent application for Chip Production Method. The invention was developed by Hashimoto Kazuki.
The patent application number is US202519341556 20250926. The patent publication number is US20260096369 (A1). Cooperative Patent Classification codes are ..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- Canon has applied United States patent for Light Emitting Device, Manufacturing Method Thereof, and Device Including Light Emitting Device. Okabayashi Daisuke and Makaino Akinori developed it.
The patent application number is US202519333675 20250919. The patent publication number is US20260096334 (A1). ..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- U.S. Patent and Trademark Office has published Samsung Display patent application for Light Emitting Element Transfer System and Method Thereof. The invention was developed by Han Jeong Won, Kim Gil Jun and Lee Jin Pyung.
The patent application number is US202519202203 20250508. The patent publication n..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- Samsung Electronics Co Ltd and Research & Business Foundation Sungkyunkwan University have submitted a patent application for Semiconductor Device Including Antiferromagnetic Layer and Data Storage Systems Including the Same. This invention was developed by Kim Sungwon, Kim Hyoungsub, Kim Hyungjoon and Lee..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 --Toshiba and Toshiba Electronic Devices & Storage have applied United States patent for Semiconductor Device and Method for Manufacturing Same. Isobe Yasuhiro, Saito Yasunobu and Yoshioka Akira developed it.
The patent application number is US202519411094 20251205. The patent publication number is US20260..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- U.S. Patent and Trademark Office has published Kawasaki Jukogyo KK and Kawasaki Robotics Usa Inc patent application for Substrate Transfer Apparatus and Substrate Transfer Method. The invention was developed by Tan Haruhiko, Kurata Iori and Nakahara Hajime.
The patent application number is US20241890153..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- 10X Genomics has sought patent for Microfluidic On-chip Filters. This invention was developed by Bernate Jorge, Bharadwaj Rajiv, Masquelier Donald A and Wheeler Tobias Daniel.
The patent application number is US202519319160 20250904. The patent publication number is US20260091389 (A1). International Pat..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Husong Intelligent Equipment Taicang Co Ltd has submitted a patent application for Preparation Method of Nano Silicon Slurry and Preparation Method of Silicon Carbon Material. This invention was developed by Li Yuanlin, Li Zhaokuan, Wu Hsu-hsiang, Gong Benli and Rao Caiji.
The patent application number is ..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Shenzhen Shangji New Energy Tech Co Ltd has submitted a patent application for Porous Silicon-carbon Negative Electrode Composite Material with Low Silicon Filling Rate as Well as Preparation Method and Application of Porous Silicon-carbon Negative Electrode Composite Material. Hu Chunlin developed the invent..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- State Intellectual Property Office of China has published Fuji Electric patent application for Semiconductor Device. The invention was developed by Nomaguchi Ryo and Harada Takahito.
The patent application number is CN202510371143 20250327. The patent publication number is CN121011592 (A). International Pa..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- State Intellectual Property Office of China has released SEDI patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Inoue Shingo.
The patent application number is CN202510469229 20250415. The patent publication number is CN121011590 (A). Internati..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Chingis Tech Corporation has submitted a patent application for Lead Frame and Packaging Structure. This invention was developed by Yu Zhengfu.
The patent application number is CN202410645748 20240523. The patent publication number is CN121011589 (A). International Patent Classification codes are H01L23/36..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- State Intellectual Property Office of China has released Taijidian China Co Ltd and Taiwan Semiconductor Manufacturing patent application for Monitoring System and Method of Operating Same. This invention was developed by Ma Lin, Zhu Honghua and Chen Lei.
The patent application number is CN202410629345 202..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- State Intellectual Property Office of China has published Nanjing Kuanneng Semiconductor Co Ltd patent application for High-efficiency Wafer Bonding Equipment. The invention was developed by Xie Huiqing.
The patent application number is CN202410618194 20240517. The patent publication number is CN121011525 ..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Guangzhou Shengzhong Electronic Co Ltd has applied Chinese patent for Device for Detecting Thickness of Semiconductor Wafer. Xu Xinghua and Cai Yanli developed it.
The patent application number is CN202511190827 20250825. The patent publication number is CN121011523 (A). International Patent Classification..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Huatian Tech Jiangsu Co Ltd has submitted a patent application for Silicon Bridge Packaging Method for Preferentially Integrating Functional Chip. Fu Dongzhi, Ma Shuying and Liu Weidong developed the invention.
The patent application number is CN202511231390 20250831. The patent publication number is CN121..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Chengdu Yicheng Integrated Circuit Co Ltd has sought patent for Packaging Method for Improving Reliability of Board-level Packaging Bridging Chip. This invention was developed by Zhang Yongchao, Zhang Kang, Liu Qing and Qiu Yuling.
The patent application number is CN202511208912 20250827. The patent public..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- State Intellectual Property Office of China has received Zhuhai Yuexin Semiconductor Co Ltd patent application for Embedded Packaging Structure and Manufacturing Method Thereof. Chen Xianming, Lin Wenjian, Huang Benxia, Feng Lei, Hong Yejie and Li Qiaoling developed the invention.
The patent application nu..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Chengdu Yicheng Integrated Circuit Co Ltd has sought patent for Preparation Method of Glass Core Plate, Glass Core Plate and Chip Packaging Structure. This invention was developed by Liu Xinghua, Zhang Kang and Zou Ke.
The patent application number is CN202511115317 20250811. The patent publication number ..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Hubei Xingchen Technology has submitted a patent application for Semiconductor Device and Forming Method Thereof. This invention was developed by Cao Bin.
The patent application number is CN202511160285 20250819. The patent publication number is CN121011504 (A). International Patent Classification code is ..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- State Intellectual Property Office of China has published Xinmai Semiconductor Tech Hangzhou Co Ltd patent application for Metal Element Diffusion Method and Manufacturing Method of Semiconductor Device. The invention was developed by Sun Yu and Tong Liang.
The patent application number is CN202511127676 2..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Hefei Yaozheng Quantum Tech Co Ltd has applied Chinese patent for Multifunctional Ion Trap Chip Rapid Replacement Device and Method and Quantum Computer. Liu Yarui, Tao Sijing, Cao Wenlin and He Ran developed it.
The patent application number is CN202511116421 20250811. The patent publication number is CN1..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Hefei Yaozheng Quantum Tech Co Ltd has submitted a patent application for Ion Trap Chip Rapid Replacement System and Method and Quantum Computer. Liu Yarui, Tao Sijing, Cao Wenlin and He Ran developed the invention.
The patent application number is CN202511116331 20250811. The patent publication number is ..
Semiconductor
| Fri 03 Apr 2026
Alexandria, April 4 -- U.S. Patent and Trademark Office has released International Business Machines patent application for Stacked FET with Flexible Inter-epi Dielectric Thickness. This invention was developed by Sarkar Debarghya, Xie Ruilong, Reboh Shay, Wang Junli and Strane Jay William.
The patent application number is US..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Huatian Tech Jiangsu Co Ltd has sought patent for 3D Packaging Structure and Packaging Method Thereof. This invention was developed by Zhao Kai, Li Danting and Ma Shuying.
The patent application number is CN202511193106 20250825. The patent publication number is CN121011575 (A). International Patent Classi..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Semiconductor Mfg Int Shanghai Co Ltd has sought patent for Thin Film Chip Packaging Structure and Packaging Method, and Wafer Packaging Structure and Packaging Method. This invention was developed by Wang Weigang, Zhang Haiyang, Yang Jian and Chai Shanshan.
The patent application number is CN202410644335 ..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- State Intellectual Property Office of China has released Pingtouge Shanghai Semiconductor Technology Co Ltd patent application for Packaging Reinforcer, Packaging Structure and Method of Semiconductor Device, and Communication Equipment. This invention was developed by Ai Changsheng and Hu Chuanjun.
The pa..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Beijing Integrated Circuit Equipment Innovation Center Co Ltd has filed a patent application for Hole Filling Method and Semiconductor Device. This invention was developed by Wang Haiyan.
The patent application number is CN20251164509 20250730. The patent publication number is CN121011565 (A). Internationa..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- DB HiTek has applied Chinese patent for Semiconductor Device Isolation Structure and Manufacturing Method Thereof. Lee Joo-hyun and Kim Jun-hyung developed it.
The patent application number is CN202410819485 20240624. The patent publication number is CN121011559 (A). International Patent Classification cod..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Beijing Tongyuanda Automation Equipment Co Ltd has submitted a patent application for Packaging Device for Chip Manufacturing and Processing. This invention was developed by Li Jiefeng, Sun Dong and Sun Jianghai.
The patent application number is CN202511216167 20250828. The patent publication number is CN1..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- State Intellectual Property Office of China has received Hangzhou Dunyuan Juxin Semiconductor Tech Co Ltd patent application for Welding Type Silicon Boat and Silicon Boat Manufacturing Method. Feng Jingkai, Mitsushi, Zhu Jianmin and Liu Zhibiao developed the invention.
The patent application number is CN2..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Shanghai Gnd Etech Co Ltd has sought patent for Detection Device of Semiconductor Processing Equipment. This invention was developed by Zhu Wenlong and Xia Zihuan.
The patent application number is CN202511223632 20250829. The patent publication number is CN121011547 (A). International Patent Classification..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- State Intellectual Property Office of China has published Shanghai Xinyuan Micro Entpr Development Co Ltd patent application for Substrate Liquid Supply Device and Substrate Processing Equipment. The invention was developed by Chen Jiawei, Peng Bo, Li Zhifeng, Zhang Yu and Zhang Yuhui.
The patent applicati..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- State Intellectual Property Office of China has released Shanghai Xinyuan Micro Entpr Development Co Ltd patent application for Liquid Supply System for Wafer Processing Liquid. This invention was developed by Chen Jiawei, Peng Bo, Li Zhifeng, Zhang Yu and Zhang Yuhui.
The patent application number is CN20..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- State Intellectual Property Office of China has released Chinasol Tech Shenzhen Co Ltd patent application for Power Semiconductor Chip Welding Device. This invention was developed by Wang Guishen, Wang Zhichao and Liu Zhiwei.
The patent application number is CN202511118727 20250811. The patent publication ..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Gaoshute Tech Co Ltd has submitted a patent application for Loading Lock Chamber of Wafer Transfer Device and Wafer Transfer Device Comprising Same. Shin Jaehyuk and Bae Jun-ho developed the invention.
The patent application number is CN202510638708 20250519. The patent publication number is CN121011531 (A..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- Hubei Xingchen Technology has sought patent for Semiconductor Structure and Forming Method Thereof. This invention was developed by Yang Daohong, Hu Chencheng, Xiong Zhuo, Zhu Lixiao and Tao Ye.
The patent application number is CN202511176202 20250821. The patent publication number is CN121011511 (A). Inte..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- State Intellectual Property Office of China has released Hubei Xingchen Technology patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Hu Chencheng, Yang Daohong, Zhu Lixiao, Tao Ye and Xiong Zhuo.
The patent application number is CN202511176173 202508..
Semiconductor
| Sat 04 Apr 2026
Beijing, April 4 -- State Intellectual Property Office of China has received Chengdu Yicheng Integrated Circuit Co Ltd patent application for Manufacturing Method of Chip Packaging Structure and Chip Packaging Structure. Zhang Yongchao, Zhang Kang, Liu Qing and Qiu Yuling developed the invention.
The patent application number..
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