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Semiconductor
| Mon 03 Aug 2026
Geneva, Aug. 4 -- Carl Zeiss SMT has submitted a patent application for Semiconductor Technology Apparatus and Method. This invention was developed by Feldmann Heiko, Toepfer Susanne, Steinert Steffen, Schmeissner Roman, Matejka Ulrich, Georg Niklas, Schmidt Carsten and Van Driel Martin.
The patent application number is WO202..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- Forehope Semiconductor Ningbo has been granted a patent for Chip Cutting Jig and Chip Cutting Equipment. This invention was developed by He Zhenghong, Han Xin, Zhang Cheng and Tian Xu.
The patent application number is CN202422894249U 20241126. The patent publication number is CN223506342 (U). International Pa..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Hans CNC Science and Technology for Substrate Processing Device and Laser Processing Equipment. Guan Tianshe, Zhai Xuetao, Li Qiang, Wu Chaosen and Yang Chaohui developed the invention.
The patent application number is CN202422106634..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Shenzhen Meixi Micro Semiconductor has secured a patent on Waterproof Substrate and Transparent Waterproof Display Device. Xia Wei and He Ximing developed the invention.
The patent application number is CN202422933421U 20241129. The patent publication number is CN223503345 (U). International Patent Classifica..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Taiwan Semiconductor Manufacturing has secured a patent on Semiconductor Device. Liu Jianxuan developed the invention.
The patent application number is CN202422373982U 20240927. The patent publication number is CN223503290 (U). International Patent Classification codes are H10D84/03 and H10D84/83. Cooperative..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has awarded a patent to Qingdao Zichai Boyang Diesel Engine for Auxiliary Chip Removal Device for Machining Inclined Oil Hole of Crankshaft. Li Qiang, Han Yingji, Song Dianliang, Tan Shaobin, Zhang Peng and He Minghui developed the invention.
The patent application ..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Haohong Electric Technology (Hubei) has secured a patent on Wood Chip Combustion Furnace. Wang Min developed the invention.
The patent application number is CN202422959369U 20241129. The patent publication number is CN223504072 (U). International Patent Classification codes are A47J37/06 and A47J37/07. Cooper..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Haohong Electric Technology (Hubei) has been granted a patent for Wood Chip Combustion Furnace. This invention was developed by Wang Min.
The patent application number is CN202422952224U 20241129. The patent publication number is CN223504071 (U). International Patent Classification codes are A47J37/06 and A47..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has awarded a patent to Beijing Jingyi Jingwei Technology for Exhaust Device for Substrate Cleaning and Substrate Cleaning System. Zhang Bo, Zhang Weiqiang, Yin Ying and Li Ting developed the invention.
The patent application number is CN202421867480U 20240802. The ..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- ROHM has submitted a patent application for Semiconductor Device. This invention was developed by Senga Kei.
The patent application number is WO2026JP01779 20260121. The patent publication number is WO2026160364 (A1). International Patent Classification codes are H10D12/00, H10D30/66, H10D62/10, H10D8/60 and..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has released Nuvoton Technology Corporation Japan patent application for Semiconductor Device. This invention was developed by Jokyu Katsuyoshi, Okada Naoaki and Kanda Yusuke.
The patent application number is WO2026JP01805 20260121. The patent publication number is WO..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Taiwan Semiconductor Manufacturing has been awarded a patent for Integrated Device. This invention was developed by Wang Jiaowei, Yang Dunnian, Liu Rencheng, Lin Xingzhi, Gao Minfeng, Liu Kequn and Lin Mengxian.
The patent application number is CN202422809181U 20241118. The patent publication number is CN2235..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- Spreadtrum Communications (Shanghai) has applied Chinese patent for User Plane Resource Reconstruction Method and Device and Chip. Zhang Nanfei developed it.
The patent application number is CN202610159180 20260204. The patent publication number is CN122028225 (A). International Patent Classification codes ar..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Idemitsu Kosan has applied WIPO patent for Transistor and Semiconductor Device. Sunagawa Misa, Tsuruma Yuki and Tomai Shigekazu developed it.
The patent application number is WO2025JP02331 20250124. The patent publication number is WO2026159870 (A1). International Patent Classification code is H10D30/67.
The..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Miraial has applied WIPO patent for Load Port, Storage Container, and Side Substrate Support Part. Maeda Ryosuke developed it.
The patent application number is WO2025JP02095 20250123. The patent publication number is WO2026159834 (A1). International Patent Classification code is B65D85/30.
The abstract of th..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Semiconductor Energy Laboratory has applied WIPO patent for Display Device and Method for Producing Display Device. Nakazawa Yasutaka, Okazaki Kenichi, Sato Rai, Idojiri Satoru, Eguchi Shingo, Kawakami Sachiko, Yamazaki Shunpei and Ohsawa Nobuharu developed it.
The patent application number is WO2026IB50332 20..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Semiconductor Energy Laboratory has applied WIPO patent for Display Device and Display Device Production Method. Nakazawa Yasutaka, Okazaki Kenichi, Sato Rai, Idojiri Satoru, Eguchi Shingo, Kawakami Sachiko, Yamazaki Shunpei and Ohsawa Nobuharu developed it.
The patent application number is WO2026IB50328 20260..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Honor Device has applied WIPO patent for Model-based Positioning Method, Apparatus, Medium, Product and Chip. Zhang Wenlu developed it.
The patent application number is WO2025CN138030 20251127. The patent publication number is WO2026157523 (A1). International Patent Classification code is H04W64/00.
The abst..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Tokyo Electron has applied WIPO patent for Substrate Processing System and Transport Method. Akama Toshiki, Kato Shusei and Kobayashi Ryoya developed it.
The patent application number is WO2026JP00379 20260108. The patent publication number is WO2026160168 (A1). International Patent Classification codes are H1..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Samsung Electronics has applied Chinese patent for Calibration Method, Integrated Circuit and Memory Device Including Same. Ahn Chul-min, Moon Dae-sik, Lee Jae-woo and Kim Ki-han developed it.
The patent application number is CN202511225891 20250829. The patent publication number is CN122024802 (A). Internati..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Shenzhen Xinkailai Industry Machine has applied Chinese patent for Packaging Cavity, Packaging Structure, Light Source Module and Semiconductor Equipment. Cheng Liang, Li Zhan, Du Ying and Zhang Yinuo developed it.
The patent application number is CN202610218189 20260214. The patent publication number is CN12..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Huawei Technologies has submitted a patent application for Memory Fault Location Method and Related Apparatus. This invention was developed by Shen Zhenkai.
The patent application number is WO2025CN145112 20251224. The patent publication number is WO2026157742 (A1). International Patent Classification code i..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Semiconductor Forming Method. This invention was developed by Huang Xianzhong, Lin Binyan, Jang Yong-ho, Li Yihong and Chen Binghong.
The patent application number is CN20261055440 20260116. The ..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has released Jihai Microelectronics patent application for Electric Wiring Component, Consumable Chip and Ink Box. This invention was developed by Su Jing, Liu Weichen, Yang Yali, Liu Yuanbo, Gong Ming, Chen Hao and Lei Minfeng.
The patent application number is CN20..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has released BOE Huacan Optoelectronics (Zhejiang) patent application for Light Emitting Diode Chip and Preparation Method Thereof. This invention was developed by Song Yuhua, Lou Yongjian, Wei Yang, Song Mingjun and Tong Zhidi.
The patent application number is CN20..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has released Guangdong OPPO Mobile Telecommunications patent application for Frame Transmission Method and Apparatus, Device, Medium, and Chip. This invention was developed by Lu Liuming, Gao Ning and Luo Chaoming.
The patent application number is WO2025CN73759 20250121..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has released Guangdong OPPO Mobile Telecommunications patent application for Information Transmission Method and Apparatus, and Device, Chip and Storage Medium. This invention was developed by Ding Yi.
The patent application number is WO2025CN73876 20250122. The patent ..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has released Resonac patent application for Polishing Liquid, Polishing Method, Component Manufacturing Method, and Semiconductor Component Manufacturing Method. This invention was developed by Nishimura Keiichiro and Sato Kazuya.
The patent application number is WO2025..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has released Tokyo Electron patent application for Maintenance Device, Processing System, and Control Method for Maintenance Device. This invention was developed by Kaneko Tomohiro, Kataoka Masamichi and Kawabe Atsushi.
The patent application number is WO2025JP45560 202..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has released Honor Device patent application for Communication Method, Communication Apparatus, Chip System and Readable Storage Medium. This invention was developed by Guo Delin and Zheng Guozeng.
The patent application number is WO2025CN140295 20251205. The patent pub..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has released Beijing Hailan Technology patent application for High-toughness Rubber Composition, Preparation Method and Application of High-toughness Rubber Composition to Semiconductor Sealing Ring. This invention was developed by Qin Lilu and Zhao Gang.
The patent..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has released Anhui University patent application for Organ Chip for Simulating Airway-alveolar Continuous Barrier Function and Application of Organ Chip in Copd Model Construction and Drug Evaluation. This invention was developed by Li Qiuling, Tao Chengxu, Chen Xiao..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has released Shanghai Tianma Microelectronics patent application for Driving Method of Electronic Paper Display Screen, Driving Chip and Electronic Paper Display. This invention was developed by Lyu Bojia, Fu Jujian, Ding Yuan, Cheng Wei, Guo Wanlong and Hua Jinhui.
..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has released Beijing ESWIN Computing Technology patent application for Voltage Buffer, Voltage Buffering Method, Display Driving Chip and Electronic Equipment. This invention was developed by Kim Min-sung, Peng Rui and Li Dongming.
The patent application number is C..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has released Technical Institute of Physics & Chemistry, Chinese Academy of Sciences patent application for Spectral Beam-combining Semiconductor Laser Capable of Suppressing Crosstalk. This invention was developed by Wang Xiaojun, Zhang Xiaoming, Li Jingzu and Guo Y..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- Huawei Device has sought patent for Bluetooth Communication Method, Electronic Equipment, Readable Storage Medium and Chip. This invention was developed by Deng Qing, Xiong Yong, Wang Liang and Lin Jianxin.
The patent application number is CN202411613553 20241112. The patent publication number is CN122028016 ..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Idemitsu Kosan has sought patent for Transistor and Semiconductor Device. This invention was developed by Sunagawa Misa, Tsuruma Yuki and Tomai Shigekazu.
The patent application number is WO2025JP02328 20250124. The patent publication number is WO2026159867 (A1). International Patent Classification code is H10..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Guangdong OPPO Mobile Telecommunications has sought patent for Data Transmission Methods and Apparatuses, Devices, Chip and Storage Medium. This invention was developed by Lin Xue and Yu Xinlei.
The patent application number is WO2025CN75474 20250127. The patent publication number is WO2026156878 (A1). Interna..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Guangdong OPPO Mobile Telecommunications has sought patent for Signal Transmission Method and Apparatus, Device, Medium, and Chip. This invention was developed by Ding Yi and Zhang Shichang.
The patent application number is WO2025CN75294 20250126. The patent publication number is WO2026156833 (A1). Internation..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has published Olympic Guangdong PCB patent application for Manufacturing Process of PCB (printed Circuit Board) Embedded with High-power Chip Module. The invention was developed by Pan Jiawei, Guo Gonghua and Chen Aohui.
The patent application number is CN2026102248..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Tokyo Electron has sought patent for Bonding Apparatus and Bonding Method. This invention was developed by Sugiyama Toru.
The patent application number is WO2026JP00783 20260114. The patent publication number is WO2026160212 (A1). International Patent Classification codes are H10P72/50, H10W72/00, H10W72/30, H..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Tokyo Electron has sought patent for Substrate Processing Device and Substrate Processing Method. This invention was developed by Higashi Ryunosuke.
The patent application number is WO2026JP00319 20260108. The patent publication number is WO2026160162 (A1). International Patent Classification codes are H10P70/..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Honor Device has sought patent for Decoding Method, Electronic Device, Chip System, and Storage Medium. This invention was developed by Zhong Haijing.
The patent application number is WO2025CN142840 20251216. The patent publication number is WO2026157664 (A1). International Patent Classification code is H04L1/..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has published Semiconductor Energy Laboratory patent application for Continuous Film Forming Apparatus. The invention was developed by Eguchi Shingo and Yamazaki Shunpei.
The patent application number is WO2026IB50329 20260115. The patent publication number is WO2026159..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has published Eindhoven University of Technology patent application for Electrowetting-on-dielectric Apparatus with 3D Embedded Electrode, Microfluidic Chip and Methods of Manufacturing. The invention was developed by Ozden Mert, Savchak Oksana and Gumuscu-sefunc Burcu.
..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has published ACM Research, Shanghai patent application for Electroplating Apparatus and Electroplating Device. The invention was developed by Yang Hongchao, Liu Gen, Wang Jian, Wang Ruofei, Wang Zunyu, Zhu Zhijun, Dai Lankui, Jia Zhaowei and Wang Qiqiang.
The patent ap..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has published Honor Device patent application for Communication Method, Communication Apparatus, Chip System, Storage Medium, and Program Product. The invention was developed by Chen Zhe.
The patent application number is WO2025CN140463 20251205. The patent publication n..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has published Tokyo Electron patent application for Plasma Processing Apparatus, Power Supply System, and Source Frequency Control Method. The invention was developed by Koshimizu Chishio.
The patent application number is WO2026JP00693 20260113. The patent publication n..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Changchun Faway High Technology Automotive Trim has sought patent for Anti-oxidation Corrosion-resistant Automobile Air-inlet Grille and Electroplating Process Thereof. This invention was developed by Zheng Zigang, Qi Guolu, Yi Dengyu, Sun Guohang, Wang Xingqiang and Jiang Bao.
The patent application number i..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has published Huawei Technologies patent application for Communication Method, Apparatus, Storage Medium, Chip and Program Product. The invention was developed by Zhu Quan, Wang Lei, Zeng Kan, Xie Yichao and Xi Jiaojiao.
The patent application number is WO2025CN145979 2..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Semiconductor Components Industries has sought patent for Dual Polysilicon Non-volatile Memory Bit Cell. This invention was developed by Greenwood Bruce Blair, Liu Gang, Menon Shashi and Cosmin Andrew P.
The patent application number is CN202510329844 20250320. The patent publication number is CN122024792 (A)..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has published Huawei Technologies patent application for Pixel Circuit, Display Panel, Display Driving Chip and Display Driving Method Thereof. The invention was developed by Zhong Jiexing and Lei Haohan.
The patent application number is CN20251099146 20250121. The ..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Huawei Technologies has sought patent for Bare Chip, Chip Packaging Structure and Electronic Equipment. This invention was developed by Liu Zhe, Bao Qinglei, Bai Xingxing and Li Ding.
The patent application number is CN202411574974 20241106. The patent publication number is CN122026717 (A). International Pate..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- FAW Jiefang Automotive has sought patent for Multi-source Side Information Fusion Deterministic Leakage Detection Method for Automobile Cipher Chip. This invention was developed by Gao Dezhi, Sun Ningning, Zhan Yue, Gu Qian, Wang Cong and Feng Qi.
The patent application number is CN20261015614 20260107. The p..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has published Zhejiang Dixin Gravity Technology patent application for Power Tube Driving Circuit, Power Management Chip and Electronic Equipment. The invention was developed by Qiu Zheng, Xu Min, Huang Zixuan and Liang Yimin.
The patent application number is CN2026..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- OmniVision Technologies has submitted a patent application for Fast Low Leakage SRAM Cell. Qin Qing, Yi Jingjun, Ng Sunny Yat-san and Dai Tiejun developed the invention.
The patent application number is CN202511310404 20250915. The patent publication number is CN122024787 (A). International Patent Classific..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Fuji Electric has applied Chinese patent for Semiconductor Device. Minagawa Kei developed it.
The patent application number is CN202511255322 20250904. The patent publication number is CN122026697 (A). International Patent Classification codes are H02M1/00, H02M1/08, H02M1/088 and H02M1/32. Cooperative Pate..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has published Haiguang Information Technology patent application for Protocol Controller, Test Method, Computing Device and Chip. The invention was developed by Xu Shuai and Peng Jiaxi.
The patent application number is CN202610148409 20260202. The patent publication..
Semiconductor
| Sun 02 Aug 2026
Alexandria, Aug. 3 -- Rohm Co Ltd and Ancora Semiconductors Inc have sought patent for Semiconductor Device and Switching Circuit. This invention was developed by Chao Wei-hsiang, Fujimaki Takumi, Liu Ying-chen and Nate Satoru.
The patent application number is US202619456797 20260122. The patent publication number is US202602..
Semiconductor
| Sun 02 Aug 2026
Beijing, Aug. 3 -- Jinko Energy Haining and Shangrao Jingke Energy Three Dimensional Intelligent Mfg Co Ltd have submitted a patent application for Screen Printing Plate, Preparation Method Thereof and Solar Cell. This invention was developed by Zhang Yusen, Guo Ruijie, Liu Zhi and Miao Liyan.
The patent application number is..
Semiconductor
| Sun 02 Aug 2026
Alexandria, Aug. 3 -- Dynex Semiconductor Ltd and Zhuzhou CRRC Times Semiconductor have sought patent for High Power Density Flip Chip Semiconductor Packaging. This invention was developed by Wang Yangang.
The patent application number is US202219141654 20221222. The patent publication number is US20260223745 (A1). Internatio..
Semiconductor
| Sun 02 Aug 2026
Alexandria, Aug. 3 -- Shenzhen Sts Microelectronics Co Ltd and STMicroelectronics International NV have submitted a patent application for Connecting Pins in a Substrate. Liang Yi Ming, Feng Qing Ming, Ding Feng, Leung Ho Ting, Yoo Inpil and Paul Indrajit developed the invention.
The patent application number is US20251904183..
Semiconductor
| Sun 02 Aug 2026
Alexandria, Aug. 3 -- Shenzhen Sts Microelectronics Co Ltd and STMicroelectronics International NV have submitted a patent application for Packaging Structure for a Surface-mounting, Power Module Comprising a Plurality of Semiconductor Electronic Devices. This invention was developed by Cataudo Sebastiano, Wei Zai Bao, Zhao Qing..
Semiconductor
| Sun 02 Aug 2026
Alexandria, Aug. 3 -- Tsmc Arizona Corp and Taiwan Semiconductor Manufacturing have submitted a patent application for Backside Gate Contacts and Methods of Forming the Same. Wang Chih-lin, Hsiao Tsung-chieh, Chen Tso-hsuan and Peng Cheng-yi developed the invention.
The patent application number is US202519226661 20250603. Th..
Semiconductor
| Sun 02 Aug 2026
Alexandria, Aug. 3 -- Japan Display Inc and Idemitsu Kosan have applied United States patent for Oxide Semiconductor Film, Thin Film Transistor, and Electronic Device. Tsuruma Yuki, Watakabe Hajime, Mochizuki Marina, Tsubuku Masashi, Tamaru Takaya, Sasaki Toshinari, Watabe Masahiro, Kawashima Emi, Onodera Ryo and Sasaki Daichi d..
Semiconductor
| Sun 02 Aug 2026
Alexandria, Aug. 3 -- Innolume GmbH and Silorix GmbH have submitted a patent application for Photonic Integrated Circuit and Methods for Manufacturing and Operating the Same. This invention was developed by Kovsh Alexey, Mertens Adrian, Bougrov Vladislav, Eschenbaum Carsten, Gubenko Alexey, Borodkin Aleksei and Koos Christian.
..
Semiconductor
| Sun 02 Aug 2026
Alexandria, Aug. 3 -- Centre National De La Recherche Scient, Institute Polytechnique De Bordeaux, Univ De Bordeaux and STMicroelectronics International NV have submitted a patent application for Bidirectional Antenna. Robin Nicolas and Ghiotto Anthony developed the invention.
The patent application number is US202619443352 2..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 3 -- Zhongyan Jilantai Chlor Alkali Chemical Co Ltd and Lanzhou University have sought patent for Hydrophilic Substrate and Tin Composite Photothermal Conversion Material and Preparation Method and Application Thereof. This invention was developed by Wang Guangbin, Liang Yongmin, Niu Fang, Zhao Yongqing, Guo Guoqin..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 3 -- Cfhi Group Dalian Engineering & Technology and China First Heavy Industries have submitted a patent application for Guiding Device Based on Hot-rolled High-grade Silicon Steel and Hot Rolling Production Line. Liao Xinyang, Liu Zhongxin, Ma Bo, Xiao Zhenxing, Dong Zhikui, Zhao Yue, Fu Huanyu, Xin Shaohe, Lu Chu..
Semiconductor
| Sun 02 Aug 2026
Alexandria, Aug. 3 -- The Univ of Queensland and Tokyo Electron have submitted a patent application for Phosphorus-based Film Compositions and Patterning Methods. This invention was developed by Blakey Idriss, Cutler Charlotte, Whittaker Andrew, Peng Hui, Conklin David, Markus Josua and Hossain Md Daloar.
The patent applicati..
Semiconductor
| Mon 03 Aug 2026
Alexandria, Aug. 3 -- Mattson Tech Inc and Beijing E Town Semiconductor Technology have filed a patent application for Conductive Member for Cleaning Focus Ring of a Plasma Processing Apparatus. This invention was developed by Guan Changle and Long Maolin.
The patent application number is US202619629640 20260326. The patent p..
Semiconductor
| Mon 03 Aug 2026
Alexandria, Aug. 3 -- ACM Res Lingang Inc and ACM Research, Shanghai have filed a patent application for Substrate Processing Apparatus. This invention was developed by Wang He, Wang Hui, Jia Shena, Xu Rong, Zhang Xiaoyan, Wang Jun and Deng Xuefei.
The patent application number is US202319142127 20231201. The patent publicati..
Semiconductor
| Mon 03 Aug 2026
Alexandria, Aug. 3 -- Tmeic Corp and Kyushu Institute of Technology have submitted a patent application for State Estimation System and State Estimation Method for Power Conversion Semiconductor Apparatus. This invention was developed by Watanabe Kazuha, Omura Ichiro, Tsukakoshi Masahiko, Guan Li, Yamaguchi Haruyuki, Mukunoki Ma..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- Huawei Technologies has filed a patent application for Optical Chip and Optical Communication System. This invention was developed by Wang Shaowu, Zhang Bin, Liao Zihao and Liu Jiang.
The patent application number is CN202411613616 20241112. The patent publication number is CN122027917 (A). International Pate..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Semiconductor Energy Laboratory has filed a patent application for Method for Forming Film of Metal Oxide. This invention was developed by Isaka Fumito, Takahashi Hironobu, Tezuka Sachiaki, Sawai Hiromi, Ohno Toshikazu and Hata Yuki.
The patent application number is WO2026IB50438 20260119. The patent publicati..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Guangdong OPPO Mobile Telecommunications has filed a patent application for Signal Sending Method and Apparatus, Information Receiving Method and Apparatus, and Devices, Chip and Medium. This invention was developed by Shen Jia and Zhang Shichang.
The patent application number is WO2025CN74422 20250123. The pa..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- Taiwan Semiconductor Manufacturing has filed a patent application for Integrated Circuit and Forming Method Thereof. This invention was developed by Feng Jiaxin, Zhou Junyi, Wang Zhihao, Jiang Guocheng and Chen Jianhao.
The patent application number is CN20251245151 20251231. The patent publication number is ..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- SK Hynix has filed a patent application for Semiconductor Device and Method of Manufacturing Semiconductor Device. This invention was developed by Kim Jae-ho.
The patent application number is CN202510589185 20250508. The patent publication number is CN122028419 (A). International Patent Classification codes a..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- Huawei Technologies has filed a patent application for Communication Link Management Method, Electronic Equipment, Readable Storage Medium and Chip. This invention was developed by Liu Jing, Wang Zhifeng and Jia Yinyuan.
The patent application number is CN202510144615 20250207. The patent publication number i..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- Rongyao Terminal has filed a patent application for Communication Method, Storage Medium, Chip System and Communication System. This invention was developed by Cao Yongzhao and Shan Baokun.
The patent application number is CN202411600584 20241108. The patent publication number is CN122028147 (A). Internationa..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Tokyo Electron has filed a patent application for Substrate Processing Apparatus. This invention was developed by Goto Kenji.
The patent application number is WO2026JP00633 20260113. The patent publication number is WO2026160194 (A1). International Patent Classification codes are C23F1/00, C23F1/26, C23F1/38, ..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Tokyo Electron has filed a patent application for Substrate Processing System. This invention was developed by Sato Naoki, Yoshida Rintaro, Takase Mami and Motegi Suguru.
The patent application number is WO2026JP00587 20260109. The patent publication number is WO2026160188 (A1). International Patent Classifica..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Beijing University of Technology has filed a patent application for Novel Open-loop External Cavity Spectrum Beam Combining Device of Semiconductor Laser. This invention was developed by Cao Yinhua, Liu Youqiang, Wang Xiaotian, Qin Wenbin and Jiang Menghua.
The patent application number is CN202610208240 2026..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Beijing NAURA Microelectronics Equipment has filed a patent application for Gas Transmission Structure, Lower Electrode Device and Semiconductor Process Equipment. This invention was developed by Yang Jipeng, Lyu Yongli, Wang Haili and Mao Xingfei.
The patent application number is CN202411554963 20241101. The..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Wuhan Polycore Microelectronics has filed a patent application for Control Circuit and Chip of Power Amplifier. This invention was developed by Li Shiliang, Zhang Hanwen, Wang Qiyangshuo and Ba Ao.
The patent application number is CN202511991749 20251226. The patent publication number is CN122026834 (A). Inte..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has received Spreadtrum Communications (Shanghai) patent application for Audio Channel Determination Method, Audio Channel Determination Device, Chip and Chip Module. Li Hongkang and Du Jiang developed the invention.
The patent application number is CN202610206759 2..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- Konfoong Material International has received a patent for Magnetic Grinding Jig for Heat Dissipation Substrate and Mounting Structure. This invention was developed by Yao Lijun, Mu Erlong, Mao Jie, Wang Yanbin and Zhou Youping.
The patent application number is CN202422143312U 20240902. The patent publication ..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has received Guangdong OPPO Mobile Telecommunications patent application for Information Transmission Method and Apparatus, and Device, Chip and Storage Medium. Ding Yi developed the invention.
The patent application number is WO2025CN73945 20250122. The patent publicat..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has received Idemitsu Kosan patent application for Transistor and Semiconductor Device. Sunagawa Misa, Tsuruma Yuki and Tomai Shigekazu developed the invention.
The patent application number is WO2025JP02330 20250124. The patent publication number is WO2026159869 (A1). ..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has received Caihong Display Devices patent application for Thickness Control Cooling Air Device for Forming Substrate Glass by Overflow Process, and Method for Using Same. Luo Ting, Ren Yongjing, Hu Weidong and Zhang Zhijun developed the invention.
The patent applicati..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- World Intellectual Property Organization has received Tokyo Electron patent application for Plasma Processing Device, Power Supply System, and Control Method. Koshimizu Chishio developed the invention.
The patent application number is WO2026JP00665 20260113. The patent publication number is WO2026160202 (A1). ..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has received Wuhan Tianma Micro Electronics patent application for Hdr Brightness Improving Method of Display Panel, Driving Chip and Display Device. Ye Shuai, Eom Eun-cheol, Lu Lizhu, Cao Zhongtao and Zhang Linzheng developed the invention.
The patent application n..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has received Shenzhen Xinghan Laser Technology patent application for Inp Optical Communication Laser Chip Reliability Prediction and Aging Screening Method. Luo Junbo, Ding Liang, Lyu Tianjian, Zhou Shaofeng and Fang Zixun developed the invention.
The patent applic..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- State Intellectual Property Office of China has received Rongyao Terminal patent application for Display Processing Method and Device, Chip System, Storage Medium and Program Product. Zhuang Ruigang developed the invention.
The patent application number is CN202411598617 20241108. The patent publication numbe..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Taiwan Semiconductor Manufacturing has received a patent for Semiconductor Device. This invention was developed by Qiu Rizhao, Caina, Liu Yuanming and Liu Chee-wee.
The patent application number is CN202422943386U 20241129. The patent publication number is CN223503288 (U). International Patent Classification ..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 4 -- Shinlone Intellectual Manufacture Precision Applied Materials (Suzhou) has received a patent for Quick-change Type Waste Cutter for Blanking Die. This invention was developed by Shi Xingyang, Zhang Liyin, Chen Yichen, Zhang Yingying, Du Yunlong and Chen Wuxiang.
The patent application number is CN20242361809U..
Semiconductor
| Mon 03 Aug 2026
Beijing, Aug. 4 -- Huahong Semiconductor, Wuxi has submitted a patent application for ESD Device with MOS Structure. This invention was developed by Fan Weisheng.
The patent application number is CN202610140025 20260130. The patent publication number is CN122028507 (A). International Patent Classification code is H10D89/60.
A..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Heidelberg University has submitted a patent application for Single Photonic Integrated Circuit. This invention was developed by Römer Julius, Lohmann Philipp, Ma Xinyu, Pernice Wolfram, Jung Erik and Bankwitz Julian Rasmus.
The patent application number is WO2026EP51590 20260122. The patent publication numbe..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Stora Enso has submitted a patent application for Formable Fiber Substrate with Barrier Layer. Räsänen Jari, Karhu Teemu, Lammi Titta, Heiskanen Isto and Miikki Nina developed the invention.
The patent application number is WO2026IB50220 20260112. The patent publication number is WO2026159525 (A1). Internati..
Semiconductor
| Tue 04 Aug 2026
Geneva, Aug. 4 -- Guangdong OPPO Mobile Telecommunications has submitted a patent application for Wireless Communication Methods and Apparatuses, Device, Chip and Storage Medium. This invention was developed by Wu Zuomin.
The patent application number is WO2025CN75291 20250126. The patent publication number is WO2026156831 (A1)..
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