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Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has received Suzhou Xingxiangyi Prec Manufacturing Co Ltd patent application for Efficient Preparation Method of Femtosecond Laser Induced Flexible Carbon-based Field Effect Transistor Array. You Rui, Liang Misheng, Min Xiaochao, Liao Decheng and Wu Fan developed th..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Jiangsu Shouxin Semiconductor Tech Co Ltd has sought patent for Thin Film Deposition Cavity with Uniform Temperature Distribution. This invention was developed by Zhang Jun, Zhou Wei, Zhu Shunli and Li Jigang.
The patent application number is CN202510936619 20250708. The patent publication number is CN1205..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Suzhou Lianyun Tech Co Ltd has applied Chinese patent for Message Generation Module, Network Chip and Network Equipment. Zhang Qin, Xu Peng and Chen Bin developed it.
The patent application number is CN202410183640 20240219. The patent publication number is CN120512382 (A). International Patent Classificat..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Hunan Hongyi Biotechnology Co Ltd has submitted a patent application for Dry Biochemical Micro-fluidic Detection Chip, Dry Chemical Test Paper and Combination of Dry Biochemical Micro-fluidic Detection Chip and Dry Chemical Test Paper. Tan Dan, Yu Xianming, Wang Yan, Wen Yao and Peng Yong developed the invent..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Shenzhen Sandi Yixin Electronic Co Ltd has submitted a patent application for Binding Mapping Method and Device, Storage Control Chip and Storage Medium. This invention was developed by Zhong Zhenchang, Chen Xiangbing, Hu Laisheng, Zhang Ruhong and Zhang Hui.
The patent application number is CN202510693984..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Guangdong Saiboan Intelligent Tech Co Ltd has submitted a patent application for Multi-layer Intermediate Representation Compiler Implementation Method Based on RISC-V Open Source Chip Hardware Perception. This invention was developed by Bie Xiaofeng, Nakahara Ryu, Cai Chunyan and Yu Yuanjie.
The patent ap..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has released Jiangsu Yuntu Semiconductor Co Ltd patent application for Method and Device for Realizing Cordic Algorithm with Input Adaptive Precision. This invention was developed by Li Junjie and Wu Haige.
The patent application number is CN202510951382 20250710..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Hangzhou Hongxin Micro Semiconductor Co Ltd has applied Chinese patent for Positioning Detection Tool for Wafer Box. Shen Ji, Wu Huiming, Fang Xiaocheng, Liu Jiang, Lin Kai, Song Jianwei, Chen Yangyang and Xiang Liqing developed it.
The patent application number is CN202510809952 20250617. The patent publi..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has published Chongqing Pingwei Entpr Co Ltd and Chongqing University patent application for Low Dropout Linear Regulator Integrated on Three-loop Chip. The invention was developed by Xu Xiangtao, Shu Hang, Chen Wensuo, Zhang Chengfang and Wang Hang.
The patent a..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has released Shanghai Panxin Semiconductor Tech Co Ltd patent application for Fully-integrated Low-dropout Linear Regulator, Chip and System. This invention was developed by Zhou Yonghua.
The patent application number is CN202510991774 20250718. The patent public..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Song Yuning has applied Chinese patent for Temperature Regulation and Control Method, Device and Equipment for Wafer Heating Disc.
The patent application number is CN202510612415 20250513. The patent publication number is CN120523260 (A). International Patent Classification code is G05D23/30. Cooperative ..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has received Shanghai Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Accurate Box Opening Method Based on Infrared Induction. Ji Yuanjun and Ge Yingjun developed the invention.
The patent application number is CN202510746588 20250605. The pate..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has released Tianjin Puzhixin Network Measurement and Control Tech Co Ltd patent application for ATE and Probe Station Isolation System and Method in Semiconductor CP Test Environment. This invention was developed by Qu Liangfu, Xue Liang and Zhang Dawei.
The pat..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has received GigaDevice Semiconductor patent application for Chip Test Mode Entering Method and Device, Equipment, Medium and Program Product. Chen Xiaolong and Liu Ming developed the invention.
The patent application number is CN202410196113 20240221. The patent..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Shanghai University has filed a patent application for SiC Composite Cladding Tube Microstructure Analysis Sample and Sample Preparation Method and Application Thereof. This invention was developed by Wu Zhaorong, Lin Xiaodong, Xia Kun, Li Yifeng, Liang Xue and Li Qiang.
The patent application number is CN..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- The Spot Laboratory has submitted a patent application for Method for Verifying Cleaning Effect of Printed and Synthesized DNA Chip Enhanced by Photonic Crystal Fluorescence. Niu Saisai and Wang Yichen developed the invention.
The patent application number is CN20251128878 20250725. The patent publication ..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has published Anhui Microchip Changjiang Semiconductor Mat Co Ltd patent application for Nanoscale Thickness Uniformity Optimization Method for Silicon Carbide Wafer Double-sided Grinding Process. The invention was developed by Yin Xueyuan and Yao Zhiyong.
The pa..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Suzhou Maotesi Tech Co Ltd has applied Chinese patent for Double-sided Detection Device for Chip. Yao Xinwei and Jing Ziyong developed it.
The patent application number is CN202510677862 20250526. The patent publication number is CN120522089 (A). International Patent Classification codes are G01N21/01 and ..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has received Zhejiang Jibao Intelligent Equipment Co Ltd patent application for Reference Correction Device and Correction Method for Chip Removal Guide Rail of Machine Tool. Xia Ping developed the invention.
The patent application number is CN20251130321 2025072..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Hanglingwei Taizhou Tech Co Ltd has sought patent for Boring Equipment with Chip Collecting Treatment and Machining Surface Scratching Prevention Functions. This invention was developed by Li Lingyun, He Ping and Li Changzhe.
The patent application number is CN20251120888 20250724. The patent publication n..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Jiangsu Heyi Guangxian Tech Co Ltd has submitted a patent application for Low-temperature Hot-pressing Laminating Equipment for OLED (organic Light Emitting Diode) Screen. This invention was developed by Li Dean and Li Zheng.
The patent application number is CN202510706692 20250529. The patent publication ..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has received Zhenhe Huilian Zhejiang Environmental Tech Co Ltd patent application for Silicon Carbide Ceramic Membrane for High-temperature Fluid and Preparation Method of Silicon Carbide Ceramic Membrane. Han Yantao and Chen Lihui developed the invention.
The pa..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Hao Yaning has submitted a patent application for Nasal Plastic Postoperative Intelligent Pressure Regulating and Ice Compressing Integrated Device Based on Semiconductor Temperature Control. This invention was developed by Hao Yaning.
The patent application number is CN202510702363 20250528. The patent pu..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Semiconductor Device. This invention was developed by Iijima Tadashi and Kitamura Yuya.
The patent application number is CN20248007040 20240109. The patent publication number is CN120513709 (A). International Patent Classificat..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Dongguan Haocai Ink Tech Co Ltd has submitted a patent application for Nanometer Silicon Oxide Enhanced High-brightness Waterborne Polyurethane Gloss Oil and Preparation Method Thereof. Yao Li, Wu Zhi, Shang Xu, Wang Shixuan and Deng Haibo developed the invention.
The patent application number is CN2024112..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Suzhou Gate Sea Microelectronics Tech Co Ltd has sought patent for Power Line Carrier Communication Chip Test System and Test Method. This invention was developed by Wu Feng, Wang Lihui and Zhu Zhongyi.
The patent application number is CN202510858237 20250625. The patent publication number is CN120512154 (..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has published Suzhou Gate Sea Microelectronics Tech Co Ltd patent application for Multi-level D-type Power Amplifier, PA Chip and Broadband Carrier Communication System. The invention was developed by Mao Kai, Zhu Zhongyi and Lin Xiongxin.
The patent application ..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has released Sichuan Dongcai New Mat Co Ltd, Dongcai Electronic Mat Meishan Co Ltd and Chengdu Dongkaixin Semiconductor Mat Co Ltd patent application for Synthesis Method of M-acetoxystyrene. This invention was developed by Mu Binyuan, Zhao Hongyang, Hu Cuixia, He Y..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Boce Ruichuang Semiconductor Tech Suzhou Co Ltd has sought patent for Amplifier for Power Semiconductor Test Source Meter and Processing Method Thereof. This invention was developed by Ren Zhijun, Chen Yanrui, Li Chong, Ji Wenming and Wei Chunlei.
The patent application number is CN20251111864 20250722. Th..
Semiconductor
| Fri 13 Feb 2026
Geneva, Feb. 13 -- Rapidus has submitted a patent application for Semiconductor Device. Nonaka Toshihisa developed the invention.
The patent application number is WO2025JP08657 20250310. The patent publication number is WO2026028505 (A1).
Semiconductor
| Fri 13 Feb 2026
Geneva, Feb. 13 -- Resonac has sought patent for Semiconductor Package and Method for Manufacturing Same. This invention was developed by Ueno Keiko, Kang Dongchul and Fukuzumi Shizu.
The patent application number is WO2024JP27388 20240731. The patent publication number is WO2026028344 (A1).
An abstract released by the Wo..
Semiconductor
| Fri 13 Feb 2026
Geneva, Feb. 13 -- World Intellectual Property Organization has received Mitsubishi Electric patent application for Semiconductor Device. Okimoto Shigeru developed the invention.
The patent application number is WO2024JP27373 20240731. The patent publication number is WO2026028338 (A1).
World Intellectual Property Organiz..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Shenzhen Shanhai Semiconductor Tech Co Ltd has sought patent for Energy Consumption Balancing Method of Battery Management System, Battery Management Chip and Battery Management System. This invention was developed by Du Yunhai, Li Ming and Tang Ruichao.
The patent application number is CN202510990553 2025..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Hu Dyi Chung has filed a patent application for Test Substrate Structure.
The patent application number is CN202510169418 20250217. The patent publication number is CN120511261 (A). International Patent Classification codes are G01R1/02, H01L21/66 and H01L23/544. Cooperative Patent Classification codes a..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Huatian Tech Jiangsu Co Ltd has submitted a patent application for Multi-chip Stacked Packaging Structure and Manufacturing Method Thereof. This invention was developed by Zhao Yanjiao, Ma Shuying and Jiang Zitian.
The patent application number is CN202510642216 20250519. The patent publication number is C..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Semiconductor Mfg International Beijing Corp and Semiconductor Manufacturing International (Shanghai) have filed a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Sui Kai.
The patent application number is CN202410182122 20240218. The patent publica..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Xinai Tech Nanjing Co Ltd has filed a patent application for Package Substrate and Manufacturing Method Thereof. This invention was developed by Zhang Chuihong, Chen Minyao and Chen Yingru.
The patent application number is CN202510649268 20250519. The patent publication number is CN120511256 (A). Internati..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has released Alpha & Omega Semiconductor LP patent application for Semiconductor Package with Partially Plated Lead. This invention was developed by Yan Xun Xue, Bode Madhur, Wang Long-ching, Li Wenjun and Zeng Xiaoguang.
The patent application number is CN202510..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Jixin Tuofang Tech Shanghai Co Ltd has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Wu Shu and Wang Xiushan.
The patent application number is CN202510668245 20250522. The patent publication number is CN120511248 (A). Internatio..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has received Fuji Electric patent application for Semiconductor Device. Miyakoshi Masataka and Nomaguchi Ryo developed the invention.
The patent application number is CN202510112671 20250124. The patent publication number is CN120511239 (A). International Patent ..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Xiamen Sihe Microelectronics Co Ltd has applied Chinese patent for Multi-chip Embedded Packaging Structure and Method. Chen Wu, Huang Mian, Ding Kunpeng, Lu Peiliang, Ma Yi and Sun Guohua developed it.
The patent application number is CN202510656356 20250521. The patent publication number is CN120511237 (A..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Tengyun Chuangxin Semiconductor Mat Shanghai Co Ltd has submitted a patent application for Preparation Method of Fd-soi Substrate Structure Through Hydrogen and Carbon Ion Implantation Process. Chen Minteng and Yang Xiujing developed the invention.
The patent application number is CN202510561532 20250430. ..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Tianjin Zhongke Jinghe Electronic Tech Co Ltd has sought patent for Wafer Bonding Alignment Device and Method and Wafer Bonding Machine. This invention was developed by Ning Zhaoxu, Gao Zhiwei, Mu Fengwen, Guo Chao, Tan Xianghu and Liu Fuchao.
The patent application number is CN202510725688 20250603. The p..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Anhui Zhonghe Semiconductor Tech Co Ltd has submitted a patent application for Semiconductor Lead Frame Overturning and Conveying Device. This invention was developed by Chen Xiaofei, Ding Hui and Zhang Chenyang.
The patent application number is CN202510990548 20250718. The patent publication number is CN1..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Suzhou Xintai Semiconductor Tech Co Ltd has submitted a patent application for Wafer Groove Type Cleaning Machine with Automatic Liquid Supplementing Function. This invention was developed by Qi Yi, Lai Jianhao and Wu Mingfang.
The patent application number is CN202510741090 20250605. The patent publicatio..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Wuxi Donglong Semiconductor Tech Co Ltd has filed a patent application for Chip Etching Processing Equipment with Convenient Feeding Function. This invention was developed by Li Chuannan.
The patent application number is CN202510651508 20250520. The patent publication number is CN120511214 (A). Internation..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Suzhou Xintai Semiconductor Tech Co Ltd has submitted a patent application for Scaling Powder Cleaning Machine. This invention was developed by Wu Mingfang, Lai Jianhao, Zhang Liang, Xie Hanyu and Yang Liu.
The patent application number is CN202510499250 20250421. The patent publication number is CN1205112..
Semiconductor
| Fri 13 Feb 2026
Geneva, Feb. 13 -- Incize has filed a patent application for Integrated Circuit Device Having an Etch-stop Layer and its Processing. This invention was developed by Scheen Gilles, Derluyn Joff and Tuyaerts Romain.
The patent application number is WO2025EP72146 20250731. The patent publication number is WO2026027720 (A1). Coop..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Xiamen Sihe Microelectronics Co Ltd has sought patent for Embedded Board-level Packaging Method and Chip Mounting Equipment. This invention was developed by Chen Wu, Huang Mian, Ding Kunpeng, Lu Peiliang, Ma Yi, Sun Guohua and Ou Tangwei.
The patent application number is CN202510658554 20250521. The patent..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has released Huatian Tech Kunshan Elect Co Ltd patent application for Fan-out Packaging Method for Improving Reliability of Vehicle-mounted Chip and Product Thereof. This invention was developed by Huang Yu, Zhou Qiong and Ma Shuying.
The patent application numbe..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has released Riyuexin Advanced Tech Research Kunshan Co Ltd patent application for Novel Integrated Circuit De-bonding Process. This invention was developed by Gu Jiayi.
The patent application number is CN202510646199 20250520. The patent publication number is CN..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Hefei Silergy Semiconductor Tech Co Ltd has submitted a patent application for Power Module Packaging Method, Power Module and Electronic Equipment. Dai Ke, Yan Jiajia, Huang Qiukai, Li Chao and Deng Xiaobin developed the invention.
The patent application number is CN202510600611 20250509. The patent publi..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Hu Dyi Chung has submitted a patent application for Manufacturing Method of Package Substrate and Optical Device. This invention was developed by Hu Dyi-chung.
The patent application number is CN202510172804 20250217. The patent publication number is CN120511192 (A). International Patent Classification cod..
Semiconductor
| Fri 13 Feb 2026
Geneva, Feb. 13 -- World Intellectual Property Organization has received Univ Catalunya Politecnica and Univ Degli Studi Di Pavia patent application for Method for Transforming Dielectric Materials into Electro-responsive Materials and Uses Thereof. Gul Merve, Fontana-escartÃn Adrián, Arnau Roca Marc, Sans Milà Jordi, Lanzala..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Zhejiang Xinke Medical Tech Co Ltd has filed a patent application for Substrate Solution Suitable for Full-automatic Immunoassay System and Preparation Method Thereof. This invention was developed by Hu Limin and Xu Juan.
The patent application number is CN202510646195 20250520. The patent publication numb..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has published Yangtze River Delta Optoelectronics Academy Of Peking Univ patent application for In-situ Nondestructive Detection Device and Method for Antimonide Semiconductor Defects. The invention was developed by Gong Jingrui, Zhang Zelin, Chen Fei, Shi Kebin and..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Wuxi Institute Of Advanced Tech Chinese Academy Of Sciences has submitted a patent application for TH-1 Chip Debugging Method Based on Openocd and Customized Openocd. This invention was developed by Wang Zechun and Li Yaqing.
The patent application number is CN202510522856 20250424. The patent publication ..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Hefei Kangxinwei Storage Tech Co Ltd has submitted a patent application for Method and Device for Analyzing Reasons of Abnormal Power Failure of Flash Memory Device and Power Failure Testing Device. This invention was developed by Chen Wentao, Xu Jianqiang and Su Zhongyi.
The patent application number is C..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Shandong Peak Tech New Mat Co Ltd has submitted a patent application for Nano Silicon Dioxide Sol and Preparation Method Thereof. This invention was developed by Li Xiaoyu, Li Chunsheng, Pang Xiangbo, Li Shuaishuai, Yang Shaohan, Hu Jing and Zong Zhihao.
The patent application number is CN202510864051 2025..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Xinjiang Hesheng Silicon Industry New Mat Co Ltd has submitted a patent application for Surface Modifier for High-purity Silicon Powder and Preparation Method of Surface Modifier. Cheng Yufeng, Luo Yedong, Qu Longxue, Cao Liang and Liu Shaolong developed the invention.
The patent application number is CN20..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Suss Microtec Solutions GmbH & Co KG has sought patent for Positioning Device with Stamping Pressure Nozzle and Method of Aligning Substrate. This invention was developed by Hansen Sven.
The patent application number is CN202510195503 20250221. The patent publication number is CN120518034 (A). Internationa..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- East China Institute Optoelectronic Integrated Device has sought patent for Preparation Method of Monolithic MEMS Pressure Chip. This invention was developed by Song Jidi, Wang Peng, Liao Qichao and Chen Pu.
The patent application number is CN202510958898 20250711. The patent publication number is CN120518..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has published Hangzhou Dunyuan Juxin Semiconductor Tech Co Ltd patent application for Machining Jig for Annular Array Holes of Silicon Circular Tube. The invention was developed by Wang Shize, Ge Zirong, Lu Jinbao, Yu Kaixin and Mitsushi.
The patent application n..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Jiangsu Meike Solar Tech Co Ltd has submitted a patent application for Monocrystalline Silicon Rod Slicing and Pressing Detection Device and Detection Method. Chen Jian developed the invention.
The patent application number is CN202510893025 20250630. The patent publication number is CN120516858 (A). Inter..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Shenzhen Yunhai Zhidong Tech Co Ltd has submitted a patent application for Robot Liquid Cooling Circulation System Based on Semiconductor Refrigeration. Wu Wufeng and Qi Fayun developed the invention.
The patent application number is CN202510629750 20250515. The patent publication number is CN120516753 (A)..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Suzhou Anyi Robot Tech Co Ltd has submitted a patent application for Discharging Device for Processing High-crystal Silicon Quartz Material. This invention was developed by Ding Yina and Tian Chuanye.
The patent application number is CN202510726361 20250603. The patent publication number is CN120515683 (A)..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Huaxing Communication Tech Co Ltd has filed a patent application for Waveguide Packaging System of Millimeter Wave Radio Frequency Chip. This invention was developed by Liu Pingtang, Chen Qing, Wang Yongjian, Zhang Feifeng and Tao Pingjun.
The patent application number is CN202510699582 20250528. The paten..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- SSuzhou R&D Center Of No. 214 Res Institute Of China North Industries Group Corporation has submitted a patent application for Multi-channel Electroencephalogram Signal Acquisition Chip. Li Mengyao, Tong Ziping, Xu Fubin, Sun Jiangdong, Hang Jinwen and Qin Guanming developed the invention.
The patent appli..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Zhejiang Tuogan Tech Co Ltd has submitted a patent application for Mercury Cadmium Telluride Material Liquid Phase Epitaxy Method Based on Patterned Sapphire Substrate. This invention was developed by Zhang Chuanjie, Sun Weiguo and Hu Wanzhen.
The patent application number is CN20251131516 20250725. The pa..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Shanghai Hanhong Prec Mach Co has applied Chinese patent for Method for Repairing Imbalance of Carbon-silicon Ratio of Silicon Carbide Based on Charging Mode. Luo Yu, Zhao Zhihong, Wang Yu and Li Jin developed it.
The patent application number is CN202510488164 20250418. The patent publication number is CN..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Xindong Micro Shanghai Semiconductor Tech Co Ltd has sought patent for Electroplating Device and Wafer Cleaning Method Using Same. This invention was developed by Wang Steven He, Yin Qiongling, Wang Yitian, Lin Pengpeng, Wei Yongyan, Xu Yanan and Wang Tao.
The patent application number is CN202510935524 20..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has published Dongguan Yichuang Surface Treat Technology Co Ltd patent application for Protective Agent Used After Electroplating of Water-soluble Metal, Preparation Method and Application of Protective Agent. The invention was developed by Li Hui, Zheng Yueqiang, L..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Suzhou Junhua Semiconductor Tech Co Ltd has submitted a patent application for Semiconductor Wafer Chemical Plating Process Tank Shaking Mechanism. This invention was developed by Bao Jie, Li Jiarui, Pang Guoqiang and Liu En.
The patent application number is CN202510782377 20250612. The patent publication ..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Shandong Xingbang Mould Tech Co Ltd has filed a patent application for Method for Chemical Vapor Deposition of Chromium Nitride Ceramic Coating on Surface of Working Tape of Extrusion Die. This invention was developed by Liu Hongxue.
The patent application number is CN202510494518 20250418. The patent publ..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Huachen Xinguang Wuxi Semiconductor Co Ltd has submitted a patent application for Film Coating System and Film Coating Method for Cavity Surface Film of Semiconductor Laser. This invention was developed by Li Ning, Leng Xiang and Wei Ming.
The patent application number is CN202510672066 20250523. The paten..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Bgrimm Advanced Materials Science & Technology Co Ltd has filed a patent application for Preparation Method for Preparing Tantalum Carbide Coating on Composite Substrate and Spraying Protection Device. This invention was developed by Wan Weiwei, Lu Xiaoliang, Xia Chunyang, Yang Wenchao, Liu Kaidi, Liu Yu, Li ..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has released Jiangsu Faner Tech Co Ltd patent application for Stripping Device for Insulating Outer Semiconductor Layer of High-voltage Cable. This invention was developed by Mao Jinrong and Sun Ruyun.
The patent application number is CN202510656236 20250521. The..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has released Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Method for Detecting Silicon Single Crystal Cop Free Region Distribution. This invention was developed by Wang Ruonan, Qi Haibin, Xu Jiamei, Chen Guozhe, Liu Kun, Huang Sen and Y..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Ningbo Jufeng Sensing Tech Co Ltd has submitted a patent application for MEMS Galvanometer of T-shaped Double-layer Beam Structure and Manufacturing Method of MEMS Galvanometer. This invention was developed by Ran Longqi, Zhou Wu, He Jiangbo and Ma Zhongrui.
The patent application number is CN20251108287 2..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Sichuan Ziguan Photonics Tech Co Ltd has submitted a patent application for Adjustable Light Delay Integrated Chip and Adjustable Light Delay Line Device. This invention was developed by Liang Lianchang and Zhang Mengruo.
The patent application number is CN20251118379 20250723. The patent publication numbe..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Zhangjiagang Jueqi Tech Co Ltd has submitted a patent application for Intelligent Control System and Method for Printer Consumable Chip and Storage Medium. This invention was developed by Gao Yun, Xu Chuyun and Lin Zusen.
The patent application number is CN202510839785 20250623. The patent publication numb..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Jiangsu Guangwei Semiconductor Co Ltd has filed a patent application for MEMS Optical Fiber Sensor, MEMS Chip with Double-sided Composite Layer Structure and Preparation Method of MEMS Chip. This invention was developed by Wang Yichuan, Liu Ke, Wang Yabin and Hong Zhiyuan.
The patent application number is ..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Qingdao Shengyu Prec Mould Co Ltd has submitted a patent application for Stamping Die of Non-oriented Silicon Steel Sheet for New Energy Automobile Driving Motor. This invention was developed by Yang Lun.
The patent application number is CN20251102795 20250721. The patent publication number is CN120515904 ..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has released Jiangxi Juhuang Magnetoelectric Tech Co Ltd patent application for Pre-warning System and Method for Uncoiling Diameter of Silicon Steel Production Line. This invention was developed by Yang Youhan, Jin Mingpeng and Wu Tiecheng.
The patent applicatio..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- Zhejiang Purui Pipe Ind Co Ltd has submitted a patent application for Preparation System of Ultrahigh-cleanliness Stainless Steel Seamless Tube for Integrated Circuit. This invention was developed by Mei Binglin and Qian Hongxia.
The patent application number is CN202510751191 20250606. The patent publicat..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has published Hongyuan Energy Technology, Baotou and Hongyuan Green Energy Co Ltd patent application for Furnace Door Smoke Collecting Cover of Industrial Silicon Submerged Arc Furnace. The invention was developed by Yang Hao, Hao Xiongfeng and Wang Baoping.
The ..
Semiconductor
| Thu 12 Feb 2026
Beijing, Feb. 13 -- IBM has submitted a patent application for Resistive Random Access Memory on Buried Bit Lines. This invention was developed by Senapati Balaji, Lanzillo Nicholas A, Lawrence A Clevenger, Zhu Wenxi, Xie Ruilong and Muneto Seiji.
The patent application number is CN20238087294 20231127. The patent publication..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has received Xincun Technology (Wuhan) patent application for Forming Method of Phase Change Memory and Phase Change Memory. Zhang Ding and Jin Tong developed the invention.
The patent application number is CN202510630477 20250516. The patent publication number i..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Toshiba; Toshiba System Tech Corporation has applied Chinese patent for Method for Manufacturing Photoelectric Conversion Element and Method for Manufacturing Tandem Solar Cell. Shiokawa Miyuki, Gotanda Takeshi, Hirano Tatsuki, Yamashita Katsuya and Tobari Tomohiro developed it.
The patent application numb..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Guangzhou Keyicheng New Mat Co Ltd has submitted a patent application for PCR Detection Chip Packaging Structure and Preparation Method Thereof. This invention was developed by Zhang Jianwei, Li Aijuan, Shi Ming and Lan Zhifeng.
The patent application number is CN202510658706 20250521. The patent publicati..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Guangdong University of Technology has submitted a patent application for Light Emitting Diode with In-situ Integrated State Sensing Function and Preparation Method Thereof. This invention was developed by Chu Chunshuang, Zhang Zihui, Tian Kangkai, Huang Fuping and He Conglin.
The patent application number..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Nanjing University has applied Chinese patent for Gan-based Bidirectional Dual-band Avalanche Photodetector Based on Back-to-back P-i-n Structure. Cai Qing, Zhang Zheni, You Haifan, Chen Dunjun and Zhang Rong developed it.
The patent application number is CN202510640891 20250519. The patent publication num..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has received Yangtze Memory Technologies patent application for Semiconductor Structure and Preparation Method Thereof, and Memory System. Zhang Quan, Shi Yanwei, Xu Wenshan, Chen Liang, Li Jing and Chen Cheng developed the invention.
The patent application numbe..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Yuanshan New Material Tech Co Ltd has filed a patent application for E-mode Hemt Chip with High Threshold Voltage and Manufacturing Method Thereof. This invention was developed by Wang Long and Gao Tian.
The patent application number is CN202510507160 20250422. The patent publication number is CN120512918 ..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Wuxi Kuangtong Semiconductor Co Ltd has submitted a patent application for Terminal Structure of Semiconductor Device and Semiconductor Device. This invention was developed by Zhao Yong and Liao Wei.
The patent application number is CN202510867850 20250626. The patent publication number is CN120512913 (A)...
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Nantong Maitelong New Material Tech Co Ltd has submitted a patent application for Degreasing Agent Used Before PCB Pattern Electroplating and Preparation and Use Methods Thereof. This invention was developed by Lu Jianhui, Yuan Junhua and Gu Liming.
The patent application number is CN202510639435 20250519...
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has released Chengdu Gaozhen Technology patent application for Semiconductor Device and Preparation Method Thereof. This invention was developed by Xu Min and Jang Hyun-woo.
The patent application number is CN202510598477 20250509. The patent publication number i..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- State Intellectual Property Office of China has published Hangzhou Angxin Laser Tech Co Ltd patent application for Wafer-level Flip-chip Bonding Packaging Mechanism and Method. The invention was developed by Gu Xiaodong, Xuan Zhenhua and Yuan Man.
The patent application number is CN202510553075 20250429. T..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- ASR Tech Co Ltd has submitted a patent application for Information Transmission Method, Device and System, Storage Medium, Program Product and Chip. This invention was developed by Zhu Huiying and Sun Songsong.
The patent application number is CN202510486873 20250418. The patent publication number is CN120..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 13 -- Jiangsu Fanhua Applied Materials Tech Co Ltd has filed a patent application for Preparation Method of Curved-surface Coated Glass, Coated Glass and Automobile. This invention was developed by Liu Jiang, Ji Shunqing, Liu Haibin, Gao Fengbo and He Hao.
The patent application number is CN202510425027 20250407..
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