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Semiconductor
| Wed 24 Jun 2026
Geneva, June 24 -- Shennan Circuits has submitted a patent application for Chip-embedded Package. This invention was developed by Wang Zedong, Zhu Kai and Wu Jun.
The patent application number is WO2025CN92414 20250430. The patent publication number is WO2026123556 (A1). International Patent Classification code is H05K1/18. C..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- World Intellectual Property Organization has received Sony Europe Ltd and Sony Semiconductor Solutions Corporation patent application for Optical Engine, Device and Method. Vaskin Aleksandr, Miteva Tzenka, Setzpfandt Frank, Sotoodeh Soheil, Pertsch Thomas, Clifton John Christopher and Fedotova Anna N developed..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Jiangsu Banruo Electronic Ind Co Ltd has sought patent for Led Filament Packaging Process. This invention was developed by Chen Wei, Yang Xiaoliang, Ma Jiazheng, Tang Ning and Feng Anmin.
The patent application number is CN202511498172 20251020. The patent publication number is CN121665778 (A). Internation..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- World Intellectual Property Organization has published Micronorm Woronka GmbH patent application for Stamp System for a Stamping Press and Stamp for Same. The invention was developed by Sönmez Aziz.
The patent application number is WO2025DE101027 20251106. The patent publication number is WO2026124713 (A1)..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Shenzhen Haisheng Rui Tech Co Ltd has submitted a patent application for Integrated Packaging Module with Power Semiconductor Embedded into Copper-clad High-thermal-conductivity Insulating Material. Tu Yurong developed the invention.
The patent application number is WO2026CN73741 20260120. The patent public..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- World Intellectual Property Organization has released Parcan Lab Co Ltd patent application for Combined Transparent Substrate Having Thermal Insulation Layer, and Combined Transparent Substrate System. This invention was developed by Huang Yizhi and Zhou Xiangqian.
The patent application number is WO2025CN1..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has released Guixin Tech Shenzhen Co Ltd patent application for Device-to-device (d2d) Communication Payload Transmission Method and Device, Chip and User Equipment. This invention was developed by Du Jianguo and Zhao Yueying.
The patent application number is CN2..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- World Intellectual Property Organization has published Beijing Ic East Semiconductor Tech Co Ltd patent application for Transfer Assembly and Photolithography Machine. The invention was developed by Han Hongfu, Wang Yinxun, Yang Shangyong and Wang Ye.
The patent application number is WO2025CN130520 20251028..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- World Intellectual Property Organization has received Shanghai Gona Semiconductor Tech Co Ltd patent application for Track Assembly. Zhou Dao, Ye Ying and Zhang Qing developed the invention.
The patent application number is WO2025CN130150 20251027. The patent publication number is WO2026123978 (A1). Interna..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Shanghai Ouyi Biomedical Tech Co Ltd has sought patent for Single-cell Sequencing Microfluidic Chip Suitable for High-impurity-content Samples and Large-volume Cell Samples, and Use Thereof. This invention was developed by Shi Jinchao, Wang Jiaqi, Fan Liming, Zhu Yanmin, Tang Gaohong, Huang Lijun, Yin Hao, Xia..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- World Intellectual Property Organization has published Hangzhou Fullsemi Semiconductor Co Ltd patent application for Shielded Gate Trench Device and Manufacturing Method Therefor. The invention was developed by Lan Zongjin, Li Xiuzhu, Chen Guoshuai and Liu Yu.
The patent application number is WO2025CN100629..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- World Intellectual Property Organization has published Zhejiang Aiko Solar Tech Co Ltd patent application for Back-contact Solar Cell Module and Photovoltaic System. The invention was developed by Yang Xinqiang, Peng Qingqing, Xu Zhigang and Wang Yongqian.
The patent application number is WO2025CN99376 2025..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has released Changsha Zhaotong Microelectronics Co Ltd patent application for Frequency Synthesis Circuit and Chip. This invention was developed by Zhou Liguo.
The patent application number is CN202511836935 20251208. The patent publication number is CN121664187 ..
Semiconductor
| Wed 24 Jun 2026
Geneva, June 24 -- Sky Chip Interconnection Tech Co Ltd has submitted a patent application for Packaging Method for Packaging Structure and Packaging Structure. This invention was developed by Zhang Qiangbo, Li Shizhen and Jiang Jing.
The patent application number is WO2025CN92945 20250506. The patent publication number is WO..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Vortex Containment Tech has sought patent for Sterilisation Device and System. This invention was developed by Cogdell Anthony, Newman-smith John and Mckelvey Robert.
The patent application number is WO2025GB52675 20251209. The patent publication number is WO2026125873 (A1). International Patent Classificat..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has published Toshiba and Toshiba Electronic Devices & Storage patent application for Semiconductor Device. The invention was developed by Kitazawa Hideaki, Watanabe Daiki and Kiie Ryota.
The patent application number is CN202411815680 20241211. The patent public..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Xiamen Sky Semiconductor Tech Co Ltd has submitted a patent application for Fan-out Packaging Structure and Packaging Method of Integrated Passive Device. Wu Heng and Yu Daquan developed the invention.
The patent application number is CN202511474802 20251015. The patent publication number is CN121666118 (A..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has released Semiconductor Mfg Beijing Co Ltd, Semiconductor Mfg Int Shanghai Co Ltd and Semiconductor Mfg Int Beijing Corp patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Ma Ying and Wang Jinzhe.
The pat..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has received Toshiba and Toshiba Electronic Devices & Storage patent application for Semiconductor Device. Kawashiro Fumiyoshi developed the invention.
The patent application number is CN202510107633 20250123. The patent publication number is CN121666107 (A). Int..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Huatian Technology Xi'an Co Ltd has filed a patent application for Design Structure and Packaging Method of Pin-free High-heat-dissipation Product. This invention was developed by Li Wanxia, Xiong Tao, Lyu Hailan, Wang Yanrong and Guo Xiaowei.
The patent application number is CN20261016364 20260107. The pa..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Toshiba and Toshiba Electronic Devices & Storage have sought patent for Semiconductor Device. This invention was developed by Miyake Eitaro.
The patent application number is CN202510107634 20250123. The patent publication number is CN121666089 (A). International Patent Classification codes are H10W42/60 an..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has released Semiconductor Manufacturing International (Shanghai) and Semiconductor Mfg International Beijing Corp patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Yu Donglin.
The patent application number..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- University of Electronic Science and Technology of China Zhongshan Institute has applied Chinese patent for Chip Shielding Packaging Structure and Packaging Method Thereof. Yuan Haijun, Su Ye, Bei Weici, He Guangsheng, Pan Xinjian, Kong Qian, Huang Jie and Zhao Mingsen developed it.
The patent application ..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has published Dongguan Qihai Ind Co Ltd patent application for Semiconductor Cooling and Efficiency-improving Device. The invention was developed by Song Gang, Wu Jinbo and Zhang Linhui.
The patent application number is CN202511898473 20251216. The patent publica..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Wuxi Xinzhuo Huguang Semiconductor Co Ltd has applied Chinese patent for Fuse Structure and Manufacturing Method Thereof. Lin Xin developed it.
The patent application number is CN202411238894 20240904. The patent publication number is CN121666069 (A). International Patent Classification code is H10W20/49. ..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Semiconductor Mfg International Shanghai Co Ltd and Semiconductor Mfg International Tianjin Co Ltd have sought patent for Semiconductor Structure and Forming Method Thereof. This invention was developed by Lin Jie and Xu Luan.
The patent application number is CN202411203623 20240829. The patent publication..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has published Hangzhou Xinju Semiconductor Co Ltd patent application for Reusable Temporary Support Plate and Reuse Method Thereof. The invention was developed by Li Qing, Zhang Yu, Huang Chaokui and Zhao Ke.
The patent application number is CN202511869449 202512..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has received Xi'an ESWIN Silicon Wafer Technology and Xi'an ESWIN Material Technology patent application for Calibration System and Calibration Method. Yang Shule developed the invention.
The patent application number is CN202511515728 20251022. The patent public..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has published Xinhui Lianxin Jiangsu Tech Co Ltd patent application for Wafer Bonding Alignment Visual System and Automatic Focusing Method. The invention was developed by Ren Chaoqun, Zhang Qiyuan, Wang Yifei, Yan Xin and Zhang Yuankang.
The patent application n..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has received Suzhou Xinshinuo Semiconductor Equipment Co Ltd patent application for Transfer Equipment Operation Control Method and Device and Transfer Equipment. Chen Tianyuan, Wang Hongyu, Wang Haiyang and Wang Changsheng developed the invention.
The patent app..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has released Semiconductor Manufacturing International (Shanghai), Semiconductor Mfg International Beijing Corp and Semiconductor Mfg North Integrated Circuit Mfg Beijing Co Ltd patent application for Wafer Process Monitoring Method, System and Related Equipment. Th..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has released Gmc Semiconductor Technology Wuxi Co Ltd patent application for Wafer Cleaning Device and Method. This invention was developed by Gan Yongliang, Wu Junyi, Yin Qi and Zhang Pengfei.
The patent application number is CN202511979680 20251225. The patent ..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Beijing Institute Technology has applied Chinese patent for Design Method for Rapidly Preparing Large-area Microwire with Polarized Electro-synapse Characteristic Based on Soaking Method. Shen Guozhen, Yang Yaxi, Chen Di and Li Ying developed it.
The patent application number is CN202511785154 20251201. Th..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Institute Of Metal Research Chinese Academy Of Sciences has sought patent for Phototransistor with Adjustable Light Response Sensitivity and Application Thereof. This invention was developed by Cheng Huiming, Han Ruyue, Liu Chi, Sun Dongming and Feng Shun.
The patent application number is CN202510802500 20..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Zhangjiang Nat Laboratory and Shanghai IC R&D Centre have applied Chinese patent for MOS Device and Manufacturing Method Thereof. Kong Shuai, Kang Xiaoxu and Hu Shaojian developed it.
The patent application number is CN202411205151 20240830. The patent publication number is CN121665675 (A). International P..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Guangdong Zhineng Semiconductor Co Ltd has submitted a patent application for Bidirectional Semiconductor Device and Preparation Method Thereof. Wu Junfeng, Tan Xiao, Yan Hongyang, Li Zilan and Liu Qingbo developed the invention.
The patent application number is CN202511621759 20251106. The patent publicat..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Toshiba and Toshiba Electronic Devices & Storage have applied Chinese patent for Semiconductor Device. Suwa Takeshi, Miura Kosuke and Ryohei Nega developed it.
The patent application number is CN202411912734 20241224. The patent publication number is CN121665644 (A). International Patent Classification cod..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Taiwan Sun Yat Sen University has applied Chinese patent for Semiconductor Device. Lin Jicong developed it.
The patent application number is CN202411829102 20241210. The patent publication number is CN121665640 (A). International Patent Classification codes are H10D30/87 and H10D64/60. Cooperative Patent C..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- IBM Deutschland GmbH and International Business Machines have sought patent for Compensation Scheme for Analog In-memory Matrix Multiplication. This invention was developed by Sebastian Abu, Narayanan Pritish, Le Gallo-bourdeau Manuel and Singh Abhairaj.
The patent application number is WO2025EP84581 202511..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has published Wuxi Botong Microelectronics Tech Co Ltd patent application for Semiconductor Device and Preparation Method Thereof. The invention was developed by Wang Gang, Huang Jun and Feng Kaiyong.
The patent application number is CN202511602743 20251104. The ..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has received Toshiba and Toshiba Electronic Devices & Storage patent application for Semiconductor Device. Tomita Kota developed the invention.
The patent application number is CN202411797768 20241209. The patent publication number is CN121665632 (A). Internation..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has published Toshiba and Toshiba Electronic Devices & Storage patent application for Semiconductor Device. The invention was developed by Kachi Tsuyoshi.
The patent application number is CN202411776967 20241205. The patent publication number is CN121665631 (A). ..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has published Shenzhen Founder Microelectronics Co Ltd patent application for Trench Gate MOSFET and Preparation Method Thereof, and Chip. The invention was developed by Wen Yan, Cai Zongrui, Ma Hongming and Fan Yujia.
The patent application number is CN202511697..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Shenzhen Founder Microelectronics Co Ltd has sought patent for Trench Gate MOSFET and Preparation Method Thereof, and Chip. This invention was developed by Cai Zongrui.
The patent application number is CN202511697037 20251119. The patent publication number is CN121665624 (A). International Patent Classific..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Yinuofei Suzhou Tech Co Ltd has applied Chinese patent for Metal Oxide Semiconductor Transistor. Guo Panlin developed it.
The patent application number is CN20261028088 20260109. The patent publication number is CN121665620 (A). International Patent Classification code is H10D30/60. Cooperative Patent Clas..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Wuxi China Resources Microelectronics Co Ltd has sought patent for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Liu Liping, Wu Zhikang, Fang Hao, Zhou Yaqi, Zhou Nansong, Sun Yongsheng, Tang Wei and Wang Qihan.
The patent application number is CN202411263604 202409..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has released Hangzhou Siftsem Co Ltd patent application for Positioning Voltage-limiting Bidirectional Thyristor. This invention was developed by Liu Lei, Xie Yeyuan, Liu Dong, Yuan Yuan, Li Yuling and Wang Yu.
The patent application number is CN202511846965 2025..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Wenlai Semiconductor Electronic Tech Shenzhen Co Ltd has filed a patent application for Wafer Back N + Layout Structure of Reverse Conducting Insulated Gate Bipolar Transistor Rc-igbt. This invention was developed by Zhang Wenchen.
The patent application number is CN202511814600 20251204. The patent public..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Jinan Jingheng Electronics Co Ltd has filed a patent application for Lead-free GPP Diode Chip of Flexible Composite Passivation Layer. This invention was developed by Wang Yan, Zhang Bin, Zhang Zeyang and Tian Cuicui.
The patent application number is CN202511886167 20251215. The patent publication number i..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has published Beijing Electric Control Integrated Circuit Mfg Co Ltd patent application for Semiconductor Structure, Preparation Method and Wafer. The invention was developed by Hou Jinhong.
The patent application number is CN202511821574 20251204. The patent pub..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Chengdu Xinziguang Semiconductor Tech Co Ltd has sought patent for Method for Preparing Polycrystalline Silicon Resistor and Prepared Polycrystalline Silicon Resistor. This invention was developed by Xing Qinggang.
The patent application number is CN202411261849 20240909. The patent publication number is C..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has received Snu R&db Foundation and Samsung Electronics patent application for Semiconductor Device and Data Storage System Including the Same. Jin Tong, Choi Woo-young, Lee Kiseok and Kim Chang-ha developed the invention.
The patent application number is CN2025..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Shenzhen Zhangge Instr Co Ltd has sought patent for Memory and Preparation Method Thereof. This invention was developed by Guo Shuai.
The patent application number is CN202511816698 20251202. The patent publication number is CN121665581 (A). International Patent Classification code is H10B61/00. Cooperativ..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has released Guangxi Huaxin Zhenbang Semiconductor Co Ltd patent application for Parallel Gradient Calculation Chip Based on Synaptic Transistor and Packaging Method. This invention was developed by Fan Yaqiong, Zhang Yanshuo, Meng Zhonglyu, Wu Rui, Zhao Chun and La..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has published Southwest China Research Institute Of Electronic Equipment patent application for Chip Mounter Utilization Rate Calculation and Operation Process Monitoring Method and System. The invention was developed by Xiang Weiwei, Guo Peipei, Wen Junling, Xu Wen..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Suzhou Jieyanxin Electronic Tech Co Ltd has applied Chinese patent for Automatic Micro-fluidic Chip Laminating Equipment and Method Based on Visual Positioning. Wang Jianguo, Shi Jianhong and Shen Yaqi developed it.
The patent application number is CN202511887532 20251215. The patent publication number is ..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- World Intellectual Property Organization has received IBM United Kingdom Ltd and International Business Machines patent application for Backside Gate Contact for Shifted Stacked Fets. Xie Ruilong, Mazza James, Ando Takashi, Sarkar Debarghya, Anderson Brent, Zhang Chen, Lanzillo Nicholas and Reboh Shay develope..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Shanghai Atom Qizhi Semiconductor Equipment Co Ltd has submitted a patent application for Data Transmission Method and Semiconductor Processing Equipment. Luo Qiyong and Pan Yang developed the invention.
The patent application number is CN202610170292 20260206. The patent publication number is CN121664891 ..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- World Intellectual Property Organization has received Shanghai Heli Tech Co Ltd patent application for Dual-chip Card Structure Based on Electrical Shielding Layer. Li Zengbin developed the invention.
The patent application number is WO2025CN137973 20251127. The patent publication number is WO2026124220 (A1..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Shanghai Integrated Circuit Equipment & Mat Industry Innovation Center Co Ltd has sought patent for Interconnect Structure and Design Method Therefor. This invention was developed by Zhang Sheng, Liu Huixiong, Yang Jianning, Chen Wujia and Xia Siyu.
The patent application number is WO2025CN136692 20251121. ..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has released Wuhan Erjin Semiconductor Co Ltd patent application for Ram-based Longest Prefix Matching Method and Communication Chip. This invention was developed by Wang Liangjun and Yang Zongyue.
The patent application number is CN202511889928 20251215. The pat..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- World Intellectual Property Organization has released Visionox Tech Inc, Hefei Visionox Electronics Co Ltd and Hefei Visionox Technology patent application for Array Substrate and Display Panel. This invention was developed by Zhou Zhiwei, Zhang Lu, Yang Yang, Xue Aihua and Zhang Jinfang.
The patent applica..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- State Intellectual Property Office of China has published Chengdu Bona Shensuo Tech Development Co Ltd patent application for Continuous GPS Signal Simulation System Based on ZYNQ Chip. The invention was developed by Yang Changqing, Tang Qiang, Meng Gengle, Wang Weichen, Ren Zhouchang and Cui Yan.
The pate..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Won St Co Ltd and Hbmt Co Ltd have submitted a patent application for Guide Block for Linear Guidance and Method for Producing Same. Son Gi Dong, Kwon Hyeok Do, Nam Dong Hyup, Lee Taek Won and Han Sang Won developed the invention.
The patent application number is WO2024KR96888 20241213. The patent publicati..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Beijing Vcore Tech Co Ltd has submitted a patent application for Processor Structure Based on Odd-even Scheduling and Allocation, and Chip and Electronic Device. This invention was developed by Song Delin and Zhang Lei.
The patent application number is WO2025CN141608 20251210. The patent publication number ..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Lingmai Acoustics Shenzhen Tech Co Ltd has filed a patent application for Bone Conduction MEMS Microphone Intelligent Detection Sensor and Frequency Response Detection Method. This invention was developed by Zhao Yanhai, Zou Wei and Li Dongfang.
The patent application number is CN202511663856 20251113. The..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- World Intellectual Property Organization has published Principle Space Tech Co Ltd patent application for Smart Light-emitting Magic Cube. The invention was developed by Su Shoushun and Lu Yu.
The patent application number is WO2025CN139812 20251203. The patent publication number is WO2026124328 (A1). Inter..
Semiconductor
| Wed 24 Jun 2026
Geneva, June 24 -- Beijing BOE Tech Development Co Ltd and BOE Technology Group have submitted a patent application for Light-emitting Substrate and Display Substrate, and Fabrication Method Therefor. This invention was developed by Huang Hua, Li Shulei, Huo Shaohua, Kang Zhao, Zhou Ying, Ma Yuanyuan and Jia Miaomiao.
The pat..
Semiconductor
| Wed 24 Jun 2026
Geneva, June 24 -- Beijing BOE Tech Development Co Ltd, Yunnan Invensight Optoelectronics Tech Co Ltd and BOE Technology Group have submitted a patent application for Display Substrate and Manufacturing Method Thereof. This invention was developed by Zhang Dacheng, Li Yunlong, Liu Wei, Yang Zongshun, Wang Weijie, Yang Shengji an..
Semiconductor
| Wed 24 Jun 2026
Geneva, June 24 -- Beijing BOE Tech Development Co Ltd, Yunnan Invensight Optoelectronics Tech Co Ltd and BOE Technology Group have applied WIPO patent for Display Substrate and Manufacturing Method Therefor. Zhang Dacheng, Li Yunlong, Yang Zongshun, Wang Weijie, Yang Shengji, Lv Peng and Zhang Banghan developed it.
The paten..
Semiconductor
| Wed 24 Jun 2026
Geneva, June 24 -- Li Kun and Applied Materials have applied WIPO patent for Image Sensor Including Air Grid and Method of Forming. Min Shudi, Leow Yen Lin, Chen Xing, Li Kun, Li Shimin, Wang Chen Yu, Hemkar Manish, Zheng Zhenmian, Zhang Qintao, Yuan Zheng and Kang Jian developed it.
The patent application number is WO2024CN1..
Semiconductor
| Wed 24 Jun 2026
Beijing, June 24 -- Guangdong Desai Xipu Technology, Blueway Electronics, Beijing University of Posts and Telecommunications and Beijing Phosense Electronic Tech Co Ltd have sought patent for Antenna Array Based on Ridge Substrate Integrated Waveguide Cavity. This invention was developed by Kuang Rui, Jiang Xuanqin, Wang Yong, L..
Semiconductor
| Wed 24 Jun 2026
Beijing, June 24 -- Polytechnic Ruiwei Photoelectric Tech Beijing Co Ltd and Polytechnic Ruiwei Beijing Tech Co Ltd have filed a patent application for Photon Integrated Chip Layout Design Method and System Based on Artificial Intelligence. This invention was developed by Feng Zhenhua and Ding Chen.
The patent application num..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Tzeng George Tzong Chyi, Ledl Ludwig Franz, Jost Georg and Applied Materials have submitted a patent application for Method for Testing a Packaging Substrate, and Apparatus for Testing a Packaging Substrate. This invention was developed by Ledl Ludwig Franz, Tzeng George Tzong-chyi and Jost Georg.
The paten..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Xi'an Eswin Silicon Wafer Technology and Xi'an ESWIN Material Technology have submitted a patent application for Silicon Wafer Processing Device and Method. This invention was developed by Ma Chengchen, Feng Zhi, Zhao Dong, Hao Yinzuo, Jia Xiaodong and Guo Hongyan.
The patent application number is CN202511..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Shanghai Lingang Kingstone Semiconductor Co Ltd, Beijing Kaishitong Semiconductor Co Ltd and Kingstone Semiconductor Joint Stock Co Ltd have submitted a patent application for Wafer Heating Device, Wafer Heating Method and Semiconductor Process Equipment. Yang Guangliang, Wang Zhanzhu, Wei Jifu, Cui Ruijun, S..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Jiangsu Tianke Heda Semiconductor and Beijing Tankeblue Semiconductor have submitted a patent application for Cleaning Method of Large-size Silicon Carbide Seed Crystals. Zhang Shiying, Zhang He, Peng Tonghua, Yang Jian, Li Peipei, Wang Guiling, Zhao Boshen, Zhao Yan and Wang Bo developed the invention.
Th..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Guangdong Aiko Solar Energy Technology Co Ltd, Zhejiang Aiko Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Zhuhai Fushan Aixu Solar Energy Technology and Tianjin Aiko Solar Energy Technology have applied Chinese patent for Silicon Wafer Cleaning Method and Silicon Wafer. Ling Jun, Wang Yong..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Yunnan Xinyao Semiconductor Materials Co and Yunnan Zhongke Xinyuan Crystalline Mat Co Ltd have sought patent for Grinding Method for Reducing Scratch of Indium Phosphide Wafer. This invention was developed by Wang Shunjin, Ma Lu'e, Liu Hanbao, Pu Shikun, Luo Zhongxu, Wang Huaiwei and Wei Hua.
The patent a..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Commissariat A Lenergie Atomique Et Aux Energies Alternatives and Centre Nat Detudes Spatiales have sought patent for Photovoltaic Solar Cell. This invention was developed by Mekki Julien, Danel Adrien, Aicardi Corinne, Cariou Romain, Veirman Jordi, Guillot Océane and Dubois Sébastien.
The patent applicat..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Hunan Architectural Design Institute Group and Central South University have submitted a patent application for Application of Organosilane in Inverted Organic Solar Cell, Inverted Organic Solar Cell and Preparation Method of Inverted Organic Solar Cell. This invention was developed by Zou Yingping, Li Shufan..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Hefei BOE Ruisheng Technology and BOE Technology Group have submitted a patent application for Light-emitting Substrate and Display Device. Hu Haifeng, Zeng Ting, Zhong Hao, Liu Huan, Yang Caigui and Wang Haixin developed the invention.
The patent application number is CN202411207444 20240829. The patent p..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Guangdong Aiko Solar Energy Technology Co Ltd, Zhejiang Aiko Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Zhuhai Fushan Aixu Solar Energy Technology and Tianjin Aiko Solar Energy Technology have submitted a patent application for Solar Cell Grid Line Preparation Process and Solar Cell. Thi..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Huizhou China Star Optoelectronics Display and TCL China Star Optoelectronics Technology have submitted a patent application for Array Substrate and Display Panel. This invention was developed by Mo Chaode, Zhou Libin, Li Zhifu, Yuan Jianfeng and Zhao Rui.
The patent application number is CN202511727815 20..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Guangdong Institute of Intelligent Science and Technology have sought patent for Three-dimensional Chip Stacking Power Supply System and Method Based on Power Supply Wafer. This invention was developed by Chu Haoming, Zheng Lirong, Ma Ning, Ding Chen, Jia Hao and Huan Yuxiang.
The patent application number..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Jiangsu Cas Igbt Tech Co Ltd and Wuxi Xichan Microchip Semiconductor Co Ltd have sought patent for Power Semiconductor Device with Terminal Area Integrated with Temperature Sensor. This invention was developed by Xu Shenggen, Kong Fanbiao, Yang Xiaoluan and Li Zhefeng.
The patent application number is CN20..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Semiconductor Mfg International Shanghai Co Ltd and Semiconductor Mfg International Beijing Corp have filed a patent application for Semiconductor Structure and Forming Method of Semiconductor Structure. This invention was developed by Gao Changcheng and Wang Jialun.
The patent application number is CN2024..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Shenzhen Hope Microelectronics Co Ltd and Wuxi Zetai Microelectronics Co Ltd have submitted a patent application for Low-power-consumption Narrowband Internet of Things Communication Chip Method and System. This invention was developed by Wu Yikang and Deng Jianyuan.
The patent application number is CN2026..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Shenzhen Smoore Tech Limited and Smoore International Holdings have submitted a patent application for Substrate Segment and Aerosol-generating Product. This invention was developed by Zhou Hongming, Jian Xiaopeng and Guo Fei.
The patent application number is WO2025CN141558 20251210. The patent publication ..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Shenzhen Smoore Tech Limited and Smoore International Holdings have submitted a patent application for Aerosol Substrate Sheet, Aerosol Substrate Segment and Preparation Method Therefor, and Aerosol Product. This invention was developed by Zhou Hongming, Jian Xiaopeng and Yuan Kai.
The patent application nu..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group have applied WIPO patent for Display Substrate and Display Device. Xiao Xingliang, Guo Yonglin and Yan Zhuoran developed it.
The patent application number is WO2025CN140505 20251205. The patent publication number is WO2026124380 (A1). Internat..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group have submitted a patent application for Display Substrate and Display Device. This invention was developed by Ma Tianyang, Li Zhenyu, Zhao Guowei, Guo Yonglin, Yan Zhuoran and Zhu Feifei.
The patent application number is WO2025CN134767 2025111..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- ACM Res Lingang Inc and ACM Research, Shanghai have applied WIPO patent for Substrate Processing Apparatus. Li Yu, Wang Wenjun and Zhang Xiaoyan developed it.
The patent application number is WO2025CN131592 20251031. The patent publication number is WO2026124025 (A1).
The abstract of the patent publishe..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Shenzhen Smoore Tech Limited and Smoore International Holdings have submitted a patent application for Aerosol Substrate Sheet, Aerosol Substrate Section and Preparation Method Therefor, and Aerosol Product. This invention was developed by Zhou Hongming, Jian Xiaopeng, Yuan Kai and Tu Tianming.
The patent a..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- NGK Corp has submitted a patent application for Composite Substrate and Method for Producing Same. Kondo Wataru, Nagaya Shogo, Katagiri Yoshiki and Yamamoto Takeshi developed the invention.
The patent application number is WO2025JP23913 20250702. The patent publication number is WO2026126545 (A1).
World..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- NGK Corp has submitted a patent application for Composite Substrate and Method for Manufacturing Same. This invention was developed by Kondo Wataru, Yamadera Takahiro, Ogiso Yusuke, Katagiri Yoshiki and Yamamoto Takeshi.
The patent application number is WO2025JP23912 20250702. The patent publication number ..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Guizhou Corporation of China Nat Tobacco Corporation has submitted a patent application for Tobacco Leaf Floating Seedling Substrate Active Hole Pressing Device and Control Method Thereof. This invention was developed by Jin Xiang, Tang Jiati, Mei Yuting, Guo Liang, Jiang Kai, Chen Tianen, Liao Qiang, Hong Sh..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- World Intellectual Property Organization has published Resonac patent application for Sic Composite Substrate, Sic Epitaxial Wafer, and Sic Device. The invention was developed by Shonai Tomohiro.
The patent application number is WO2024JP43457 20241209. The patent publication number is WO2026126299 (A1). Int..
Semiconductor
| Tue 23 Jun 2026
Geneva, June 24 -- Resonac has applied WIPO patent for Composite Substrate, Epitaxial Wafer, Method for Producing Composite Substrate, Method for Producing Epitaxial Wafer, and Method for Producing Device. Shonai Tomohiro developed it.
The patent application number is WO2024JP43451 20241209. The patent publication number is W..
Semiconductor
| Tue 23 Jun 2026
Beijing, June 24 -- Giesecke & Devrient GmbH has submitted a patent application for Method for Configuring a Chip Module with a Configuration File, Chip Module and Device Having Such a Chip Module. Huber Uwe developed the invention.
The patent application number is CN20248050968 20241112. The patent publication number is CN12..
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