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09:25:01 Mon 18 May 2026

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(2)

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(1)

(1)

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BOE Tech Group Co Ltd [cn

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BOE Tech Group Co Ltd [cn

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BOE Tech Group Co Ltd [cn

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BOE Tech Group Co Ltd [cn

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(1)

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Changchun Institute of Optics, Fine Mechanics & Physics of the Chinese Academy of Sciences Submits Chinese Patent Application for Chip for Cell Sorting by Laser-induced Forward Tra..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Changchun Institute of Optics, Fine Mechanics & Physics of the Chinese Academy of Sciences has submitted a patent application for Chip for Cell Sorting by Laser-induced Forward Transfer. This invention was developed by Wang Huan and Liu Zhenyu. The patent application number is CN202511575116 20251031. The p..

Hubei Sanfbot Co Ltd Submits Chinese Patent Application for Non-contact Charging Wafer Box Carrying Robot, Charging Pile and Charging Control System

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Hubei Sanfbot Co Ltd has submitted a patent application for Non-contact Charging Wafer Box Carrying Robot, Charging Pile and Charging Control System. This invention was developed by Zhang Xiangcheng, Yin Zhangxiao, Xu Hang, Hua Hongwei, Huang Kaizhao, Tang Bin and Hong Jiahua. The patent application number ..

State Intellectual Property Office of China Releases Chengdu Yisiwei Computing Tech Co Ltd and Beijing ESWIN Computing Technology Patent Application for Overlay Display Device and ..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Chengdu Yisiwei Computing Tech Co Ltd and Beijing ESWIN Computing Technology patent application for Overlay Display Device and Method, Chip and Electronic Equipment. This invention was developed by Cheng Xuguang, Xuan Weijie, Hu Zhengyan, Zhao Shuang, Wa..

Zhejiang Mingyu Can Ind Co Ltd Applies for Patent on Metal Wafer Cutting Device for Can Production

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Zhejiang Mingyu Can Ind Co Ltd has applied Chinese patent for Metal Wafer Cutting Device for Can Production. Tang Linlin developed it. The patent application number is CN202511809914 20251203. The patent publication number is CN121339273 (A). International Patent Classification codes are B21D28/04, B21D28/1..

State Intellectual Property Office of China Receives Foshan Hebang New Material Tech Co Ltd Patent Application for Wear-resistant Polyurethane Polishing Layer for Sic Wafer as Well..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Foshan Hebang New Material Tech Co Ltd patent application for Wear-resistant Polyurethane Polishing Layer for Sic Wafer as Well as Preparation Method and Application of Wear-resistant Polyurethane Polishing Layer. Li Jianbo, Jiao Jianqing, Wu Guofeng, Ni..

Shandong Dayi Chemical Co Ltd Submits Patent Application for MQ Silicon Resin for Medical Organic Silicon Pressure-sensitive Adhesive and Preparation Method of MQ Silicon Resin

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Shandong Dayi Chemical Co Ltd has submitted a patent application for MQ Silicon Resin for Medical Organic Silicon Pressure-sensitive Adhesive and Preparation Method of MQ Silicon Resin. Huang Yunpeng, Jiang Xiang, Wang Wanqing, Sun Xiaoqiang, Song Xuelian, Dou Chang, He Yiting and Li Xuehong developed the inve..

Beijing Baogang Steel Tech Co Ltd Submits Chinese Patent Application for Method for Improving Same-plate Difference of Non-oriented Silicon Steel Through Multi-process Coordinated ..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Beijing Baogang Steel Tech Co Ltd has submitted a patent application for Method for Improving Same-plate Difference of Non-oriented Silicon Steel Through Multi-process Coordinated Regulation and Control. This invention was developed by Lu Xiaoyu, Lu Bin, Liu Pengcheng, Yuan Xiaoming, Hao Juanjuan, Wu Yuxuan, F..

Zhangjiagang Ultrasonic Electric Co Ltd Submits Chinese Patent Application for All-in-one Machine for Removing, Inserting and Cleaning Silicon Wafers

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Zhangjiagang Ultrasonic Electric Co Ltd has submitted a patent application for All-in-one Machine for Removing, Inserting and Cleaning Silicon Wafers. This invention was developed by He Zhiming, Liu Rongxuan, Wang Jiawei and Ding Xiao. The patent application number is CN202511905328 20251217. The patent pub..

State Intellectual Property Office of China Publishes Hongyuan Energy Technology, Baotou and Hongyuan Green Energy Co Ltd Patent Application for Polycrystalline Silicon Reduction F..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Hongyuan Energy Technology, Baotou and Hongyuan Green Energy Co Ltd patent application for Polycrystalline Silicon Reduction Furnace Tail Gas Hole Cleaning Equipment and Cleaning Method Thereof. The invention was developed by Yang Hao, Li Mingjie, Guo H..

State Intellectual Property Office of China Releases Shandong Yuehaijin Semiconductor Technology and Chengdu Yuehaijin Semiconductor Mat Co Ltd Patent Application for Cleaning Proc..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Shandong Yuehaijin Semiconductor Technology and Chengdu Yuehaijin Semiconductor Mat Co Ltd patent application for Cleaning Process for Removing Smudginess on Edge of Chip Blocking Plug. This invention was developed by Jia Wenhuan, Wang Ximing, Cai Lizhi,..

State Intellectual Property Office of China Receives Chengdu Kaiweitesi Semiconductor Tech Co Ltd Patent Application for Automatic Cleaning and Detecting Integrated Equipment for S..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Chengdu Kaiweitesi Semiconductor Tech Co Ltd patent application for Automatic Cleaning and Detecting Integrated Equipment for Surface of Semiconductor Device. Xue Hongyu, Jin Puyun, Lu Yuguo, Lin Haokun, Li Zelong, Chen Kaiqing, Liu Weiwei and Jiang Wei ..

Fujian Huaqing Electronic Material Technology Submits Patent Application for Preparation Method of Super-tough Aluminum Oxide Substrate

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Fujian Huaqing Electronic Material Technology has submitted a patent application for Preparation Method of Super-tough Aluminum Oxide Substrate. Zhou Qing developed the invention. The patent application number is CN202511903423 20251217. The patent publication number is CN121339090 (A). International Patent C..

State Intellectual Property Office of China Publishes Caihong Display Devices Patent Application for Spray Cleaning Device and Method for Glass Substrate

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Caihong Display Devices patent application for Spray Cleaning Device and Method for Glass Substrate. The invention was developed by Jiao Zongping, Hou Hongrong and Zhang Zhijun. The patent application number is CN202511582851 20251031. The patent publi..

Zhejiang Atongmu Tech Co Ltd Submits Patent Application for Heating Device for Chemical Vapor Deposition Equipment and Chemical Vapor Deposition Equipment

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Zhejiang Atongmu Tech Co Ltd has submitted a patent application for Heating Device for Chemical Vapor Deposition Equipment and Chemical Vapor Deposition Equipment. Erik Einarsson, Chen Pianpian and Yuan Yuewei developed the invention. The patent application number is CN202511899858 20251216. The patent publ..

Aixtron Submits Patent Application for Method and Apparatus for Thermally Treating Substrate

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Aixtron has submitted a patent application for Method and Apparatus for Thermally Treating Substrate. Laufer Peter S developed the invention. The patent application number is CN202511448296 20200210. The patent publication number is CN121344570 (A). International Patent Classification codes are C23C16/46 an..

Shanghai Optical Communication Co Ltd Applies for Patent on Pipeline and Sub-normal-pressure Chemical Vapor Deposition Equipment

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Shanghai Optical Communication Co Ltd has applied Chinese patent for Pipeline and Sub-normal-pressure Chemical Vapor Deposition Equipment. Zong Jing developed it. The patent application number is CN202410948835 20240715. The patent publication number is CN121344561 (A). International Patent Classification c..

State Intellectual Property Office of China Receives Shandong Jingcheng New Material Tech Co Ltd Patent Application for Method for Rapidly Coating Silicon Carbide CVD (chemical Vap..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Shandong Jingcheng New Material Tech Co Ltd patent application for Method for Rapidly Coating Silicon Carbide CVD (chemical Vapor Deposition) on High-purity Silicon Carbide Substrate. Li Wenjie, Zhang Wei, Sun Haibin, Ren Yi, Liu Zi'ang, Zhang Xu and Xin..

ASM International Holding Applies for Patent on Method of Filling Gap on Surface of Substrate

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- ASM International Holding has applied Chinese patent for Method of Filling Gap on Surface of Substrate. Sugiura Keiji, Kurumisawa Hirohiro, Saha Tuhin, Kikuchi Yoshiyuki, Remnev Alexander and Mishra Abhinav developed it. The patent application number is CN202510926642 20250707. The patent publication number i..

Shenzhen Qualisell Ind Co Ltd Submits Patent Application for High-thermal-conductivity Material for Chip Plate Type Liquid Cooling Heat Dissipation and Preparation Method of High-t..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Shenzhen Qualisell Ind Co Ltd has submitted a patent application for High-thermal-conductivity Material for Chip Plate Type Liquid Cooling Heat Dissipation and Preparation Method of High-thermal-conductivity Material. Feng Chong, Li Jiangbin and He Erping developed the invention. The patent application numb..

Shanghai Yinjiang Tech Co Ltd Submits Chinese Patent Application for Modified Nickel Powder and Preparation Method Thereof, Conductive Silver-nickel Slurry and Topcon Solar Cell

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Shanghai Yinjiang Tech Co Ltd has submitted a patent application for Modified Nickel Powder and Preparation Method Thereof, Conductive Silver-nickel Slurry and Topcon Solar Cell. This invention was developed by Sun Yang, Chen Nana, Song Wenna, Chen Xiaolong, Liu Jie and Ran Hongxia. The patent application n..

Zhejiang Uivoled Photoelectric Tech Co Ltd Submits Chinese Patent Application for Compound for Covering Layer, OLED (organic Light Emitting Diode) with Compound and Organic Light E..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Zhejiang Uivoled Photoelectric Tech Co Ltd has submitted a patent application for Compound for Covering Layer, OLED (organic Light Emitting Diode) with Compound and Organic Light Emitting Device. This invention was developed by Zhang Lei, Wu Kongwu, Zhang Huaxing, Rao Minyu, Wang Xi and Zhao Xiaoyu. The pat..

Tuojing Technology, Shanghai Seeks Patent for Flow Resistance Adjusting Mechanism, Gas Distribution Device and Method and Processing Equipment of Semiconductor Device

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Tuojing Technology, Shanghai has sought patent for Flow Resistance Adjusting Mechanism, Gas Distribution Device and Method and Processing Equipment of Semiconductor Device. This invention was developed by Lee Wookbong. The patent application number is CN202511589777 20251031. The patent publication number is ..

State Intellectual Property Office of China Receives Haipurui Changzhou Clean System Tech Co Ltd Patent Application for Static Electricity Elimination Connector, Semiconductor Infu..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Haipurui Changzhou Clean System Tech Co Ltd patent application for Static Electricity Elimination Connector, Semiconductor Infusion Equipment and Working Method of Static Electricity Elimination Connector. Zhang Jie and Feng Weiwu developed the invention..

State Intellectual Property Office of China Receives Jiangsu Chengxing Phosph Chemicals Co Ltd Patent Application for Method for Preparing Thickening Type Silicon Dioxide with Narr..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Jiangsu Chengxing Phosph Chemicals Co Ltd patent application for Method for Preparing Thickening Type Silicon Dioxide with Narrow Particle Size Distribution by Phosphoric Acid Method. Xue Wenting, Yu Zhenyang, Liu Yuanqiu and Liu Jingzhong developed the ..

State Intellectual Property Office of China Releases Xiexinxin Shanghai Photovoltaic Tech Co Ltd Patent Application for Preparation Method of Silicon Carbide

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Xiexinxin Shanghai Photovoltaic Tech Co Ltd patent application for Preparation Method of Silicon Carbide. This invention was developed by Qian Zhiling and Fan Jinjin. The patent application number is CN202511797780 20251202. The patent publication num..

State Intellectual Property Office of China Publishes Hwatsing and Hwatsing Beijing Tech Co Ltd Patent Application for Wafer Cutting-up Equipment, Wafer Processing Method and Contr..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Hwatsing and Hwatsing Beijing Tech Co Ltd patent application for Wafer Cutting-up Equipment, Wafer Processing Method and Control Device. The invention was developed by Liu Yuanhang, Bao Weicheng, Zhu Lin, Zhao Dewen and Lu Xinchun. The patent applica..

Hangzhou Dunyuan Juxin Semiconductor Tech Co Ltd Submits Chinese Patent Application for Silicon Boat Groove Rod Processing Device and Silicon Boat

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Hangzhou Dunyuan Juxin Semiconductor Tech Co Ltd has submitted a patent application for Silicon Boat Groove Rod Processing Device and Silicon Boat. This invention was developed by Zhou Bo, Ding Fangfang, Lin Shuang, Zhu Jianmin and Gong Yiwen. The patent application number is CN202511319457 20250916. The pa..

State Intellectual Property Office of China Releases Zhengzhou Institute of Emerging Industrial Technology and Longzihu New Energy Laboratory Patent Application for Method and Syst..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Zhengzhou Institute of Emerging Industrial Technology and Longzihu New Energy Laboratory patent application for Method and System for Synthesizing 5-methyl-3, 5-dicyclopropyl Pyrazoline Through Reaction-separation Coupling of Micro-fluidic Chip and Super..

Zhuhai Juxin Semiconductor Mat Co Ltd Applies for Patent on Ultrasonic Cleaning Process and Equipment for Semiconductor Polishing Solution Production Equipment

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Zhuhai Juxin Semiconductor Mat Co Ltd has applied Chinese patent for Ultrasonic Cleaning Process and Equipment for Semiconductor Polishing Solution Production Equipment. Zhang Jiaqi, Zhang Peng, Liu Jiaxin, Liu Chuan, Li Wenlong and Zhang Shaojun developed it. The patent application number is CN202511633907..

Tuojing Chuangyi Shenyang Semiconductor Equipment Submits Chinese Patent Application for C-shaped Sealing Ring, Valve and Production Die of C-shaped Sealing Ring

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Tuojing Chuangyi Shenyang Semiconductor Equipment has submitted a patent application for C-shaped Sealing Ring, Valve and Production Die of C-shaped Sealing Ring. This invention was developed by Kim Su-woo. The patent application number is CN202511906343 20251216. The patent publication number is CN12134599..

Nantong Polytechnic College Files Chinese Patent Application for Cooling Pin Wheel Housing Device of RV Speed Reducer

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Nantong Polytechnic College has filed a patent application for Cooling Pin Wheel Housing Device of RV Speed Reducer. This invention was developed by Xing Zhipeng, Guo Biyu, Ji Shen'ao, Shao Tianci, Qiu Bingyan and Zhang Yiwen. The patent application number is CN202511753697 20251126. The patent publication ..

Chongqing Zhuangsifei Intelligent Equipment Co Ltd Seeks Patent for Preparation Method of High-purity Silicon Carbide Raw Material, Wafer and System

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Chongqing Zhuangsifei Intelligent Equipment Co Ltd has sought patent for Preparation Method of High-purity Silicon Carbide Raw Material, Wafer and System. This invention was developed by Yuan Jiahu. The patent application number is CN202511578084 20251031. The patent publication number is CN121342013 (A). I..

State Intellectual Property Office of China Releases Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd Patent Application for Method for Reducing Occurrence Rate of Slip Line of ..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Method for Reducing Occurrence Rate of Slip Line of Heavily-doped Single Crystal Silicon Rod and Single Crystal Silicon Rod. This invention was developed by Ma Yinshuang, Zhang Yo..

Element Six Ltd Seeks Patent for Single Crystal Synthetic Diamond Material by Chemical Vapor Deposition

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Element Six Ltd has sought patent for Single Crystal Synthetic Diamond Material by Chemical Vapor Deposition. This invention was developed by Markham Matthew Lee, Edmonds Andrew Mark, Dhillon Harpreet Kaur and Hardman David William. The patent application number is CN202511470671 20171130. The patent public..

State Intellectual Property Office of China Publishes Jiangsu Hi Print Tech Co Ltd Patent Application for Equipment Self-adaptive Control Method for Growth of Silicon Carbide Epita..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Jiangsu Hi Print Tech Co Ltd patent application for Equipment Self-adaptive Control Method for Growth of Silicon Carbide Epitaxial Film. The invention was developed by Wen Cheng, Zhou Jinxin and Shi Huancheng. The patent application number is CN20251..

State Intellectual Property Office of China Receives Wuxi Yimeng Electronic Tech Co Ltd Patent Application for Process Method for Solving Ink Permeation Corrosion of MEMS (micro El..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Wuxi Yimeng Electronic Tech Co Ltd patent application for Process Method for Solving Ink Permeation Corrosion of MEMS (micro Electro Mechanical System) Flow Channel. Yu Ziran and Zhang Lei developed the invention. The patent application number is CN20..

Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd Applies for Patent on Method for Reducing Osf of Large-size Czochralski Silicon

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd has applied Chinese patent for Method for Reducing Osf of Large-size Czochralski Silicon. Wang Baiqing, Yang Kai, Zhang Youhai, Rui Yang, Ma Cheng, Zhang Xingmao and Ma Yingjian developed it. The patent application number is CN202511515002 20251022. The pa..

State Intellectual Property Office of China Releases Taicang Haifeng Electroplating Patent Application for Automatic Electroplating Production Line and Production Process

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Taicang Haifeng Electroplating patent application for Automatic Electroplating Production Line and Production Process. This invention was developed by Wang Haifeng and Guo Xiaoyang. The patent application number is CN202511444282 20251010. The patent pu..

Dalian Yongguang Tech Co Ltd Seeks Patent for Multi-layer Anti-corrosion Electroplating Device for Automobile Fastener

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Dalian Yongguang Tech Co Ltd has sought patent for Multi-layer Anti-corrosion Electroplating Device for Automobile Fastener. This invention was developed by Liu Zhiyuan, Wang Yanqiu and Li Wusheng. The patent application number is CN202511914530 20251218. The patent publication number is CN121344730 (A). In..

Guangzhou Ribobio Co Ltd Submits Chinese Patent Application for Preparation Method of Sequencing Chip

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Guangzhou Ribobio Co Ltd has submitted a patent application for Preparation Method of Sequencing Chip. This invention was developed by Zhang Biliang, Adams J Overley and Zhou Heping. The patent application number is CN202410952652 20240716. The patent publication number is CN121340764 (A). International Pat..

Jiangxi Hongruixing Tech Co Ltd Submits Patent Application for Halogen-free Flame-retardant Copper-clad Plate Substrate Material and Preparation Method Thereof

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Jiangxi Hongruixing Tech Co Ltd has submitted a patent application for Halogen-free Flame-retardant Copper-clad Plate Substrate Material and Preparation Method Thereof. Zeng Jieshu, Kuang Xiaojun, Ye Zhi, Peng Huimin, Li Zhu and Wu Xingmao developed the invention. The patent application number is CN20251161..

State Intellectual Property Office of China Publishes Jiangsu Cas Microelectronics Integration Tech Co Ltd and China University of Mining Patent Application for Gradient Deposition..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Jiangsu Cas Microelectronics Integration Tech Co Ltd and China University of Mining patent application for Gradient Deposition Electroplating Method for Packaging Copper Bump. The invention was developed by Chen Zheng, Gong Yufeng, Tong Yuan, Bao Changz..

Shenzhen Xinfuhua Surface Tech Co Ltd Files Chinese Patent Application for Cyanide-free Brass Tin Electroplating Process

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Shenzhen Xinfuhua Surface Tech Co Ltd has filed a patent application for Cyanide-free Brass Tin Electroplating Process. This invention was developed by Qiu Yonghua. The patent application number is CN202511925448 20251219. The patent publication number is CN121344706 (A). International Patent Classification..

State Intellectual Property Office of China Releases Maxone Semiconductor Suzhou Co Ltd Patent Application for Composite Leveling Agent for MEMS Deep Hole Nickel Alloy Electroplati..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Maxone Semiconductor Suzhou Co Ltd patent application for Composite Leveling Agent for MEMS Deep Hole Nickel Alloy Electroplating Forming and Application. This invention was developed by Yu Haichao, Yin Tijian and Wang Xinggang. The patent application..

Maxone Semiconductor Suzhou Co Ltd Submits Chinese Patent Application for Composite Additive for Semiconductor Gold Plating Solution and Application Thereof

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Maxone Semiconductor Suzhou Co Ltd has submitted a patent application for Composite Additive for Semiconductor Gold Plating Solution and Application Thereof. This invention was developed by Dai Siyun, Zhou Jingyi and Yu Haichao. The patent application number is CN202511661646 20251113. The patent publicatio..

Anji Microelectronics, Shanghai Submits Chinese Patent Application for Metal Electroplating Composition and Use Method

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Anji Microelectronics, Shanghai has submitted a patent application for Metal Electroplating Composition and Use Method. This invention was developed by Sun Peng, Peng Libbert Hongxiu and Shen Menghan. The patent application number is CN202311838876 20231228. The patent publication number is CN121344697 (A). I..

Zhuoxinwei Xiamen Semiconductor Co Ltd Submits Chinese Patent Application for High-efficiency Low-cost Chip Photoresist Removing Device and Photoresist Removing Process

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Zhuoxinwei Xiamen Semiconductor Co Ltd has submitted a patent application for High-efficiency Low-cost Chip Photoresist Removing Device and Photoresist Removing Process. This invention was developed by Zhang Weina. The patent application number is CN202511666800 20251114. The patent publication number is CN..

Beijing Jinyu Tiancheng Tech Co Ltd Files Chinese Patent Application for Non-oriented Silicon Steel Surface Polishing Device for Ferrous Metal Smelting Rolled Product

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Beijing Jinyu Tiancheng Tech Co Ltd has filed a patent application for Non-oriented Silicon Steel Surface Polishing Device for Ferrous Metal Smelting Rolled Product. This invention was developed by Yan Di and Yu Liyuan. The patent application number is CN202511811830 20251204. The patent publication number ..

Jiangsu Sanxin Prec Machinery Co Ltd Submits Chinese Patent Application for Primary and Secondary Shaft Machining Method Compatible with Wafer Coarse and Fine Grinding and Multi-sp..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Jiangsu Sanxin Prec Machinery Co Ltd has submitted a patent application for Primary and Secondary Shaft Machining Method Compatible with Wafer Coarse and Fine Grinding and Multi-specification and Multi-dimension Wafer Process. This invention was developed by Wang Qiang, Zou Yuyao, Wang Tong and Gao Shuai. T..

Jiangsu Jinggong Semiconductor Equipment Co Ltd Submits Chinese Patent Application for Edge Shape Chamfering and Polishing Equipment for Three-station Semiconductor Wafer Material

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Jiangsu Jinggong Semiconductor Equipment Co Ltd has submitted a patent application for Edge Shape Chamfering and Polishing Equipment for Three-station Semiconductor Wafer Material. This invention was developed by Huang Yi, Chen Zhangshui and He Weiwei. The patent application number is CN202511821848 2025120..

State Intellectual Property Office of China Publishes East China Institute of Technology Patent Application for Heavy Isotope Substituted Organic Semiconductor Material and Organic..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published East China Institute of Technology patent application for Heavy Isotope Substituted Organic Semiconductor Material and Organic Electroluminescent Device Comprising Same. The invention was developed by Xu Qianqian, Ma Wei, Mi Zhiming, Liao Lintao, Li Zuo..

Changchun Normal University Submits Chinese Patent Application for Ternary Organic Solar Cell Based on High Dielectric Constant Non-fullerene Receptor and Preparation Method Thereo..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Changchun Normal University has submitted a patent application for Ternary Organic Solar Cell Based on High Dielectric Constant Non-fullerene Receptor and Preparation Method Thereof. This invention was developed by Zhang Youdi, Ye Nan, Wang Hao, Wang Tonghui, Liu Feng, Xu Shuai, Zhang Peng and Zhu Junfei. The..

Anhui Xuteng Microelectronic Equipment Co Ltd Files Chinese Patent Application for Nitrogen Auxiliary Heating Structure Applied to Packaging and Annealing of Semiconductor Glass Su..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Anhui Xuteng Microelectronic Equipment Co Ltd has filed a patent application for Nitrogen Auxiliary Heating Structure Applied to Packaging and Annealing of Semiconductor Glass Substrate. This invention was developed by Liu Handong, Yuan Liangzhao, Liu Xia and Li Wenlong. The patent application number is CN2..

State Intellectual Property Office of China Receives Inner Mongolia Hengxin Quartz Co Ltd and Jiangsu Hengxin Quartz Tech Co Ltd Patent Application for Device and Method for Prepar..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Inner Mongolia Hengxin Quartz Co Ltd and Jiangsu Hengxin Quartz Tech Co Ltd patent application for Device and Method for Preparing Porous Opaque High-purity Quartz by CVD (chemical Vapor Deposition) Method. Wang Yucai, Xiao Hua, Wang Jun, Zhong Yuan, Wan..

Jiujiang Precision Measuring Technology Research Institute Files Chinese Patent Application for Small Linear Limiting Buffer Mechanism

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Jiujiang Precision Measuring Technology Research Institute has filed a patent application for Small Linear Limiting Buffer Mechanism. This invention was developed by Du Bo, Pan Nengwei, Li Pengfei and Lin Lin. The patent application number is CN202511738228 20251125. The patent publication number is CN12134..

Anhui Jingwei Tech Co Ltd Files Chinese Patent Application for Ceramic Packaging Diaphragm Solder Ring Setting Process

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Anhui Jingwei Tech Co Ltd has filed a patent application for Ceramic Packaging Diaphragm Solder Ring Setting Process. This invention was developed by Li Mengmeng, Tong Zongxian and Gong Zhongliang. The patent application number is CN202511469223 20251015. The patent publication number is CN121341934 (A). In..

State Intellectual Property Office of China Publishes Shanghai Huahong Grace Semiconductor Manufacturing Corporation Patent Application for Nife Etching Method

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Shanghai Huahong Grace Semiconductor Manufacturing Corporation patent application for Nife Etching Method. The invention was developed by Cheng Wangyang, Dai Youjiang, Wang Rui, Li Lingjun and Xu Heng. The patent application number is CN202511335125 ..

BeiJing REJE Automation Submits Patent Application for Integrated Grabbing Mechanism for Multi-specification Crystal Ingots

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- BeiJing REJE Automation has submitted a patent application for Integrated Grabbing Mechanism for Multi-specification Crystal Ingots. An Guodong, Liu Dongmei, Wang Qiang and Wang Yong developed the invention. The patent application number is CN202511823120 20251205. The patent publication number is CN1213416..

Dongguan Yima Semiconductor Co Ltd Submits Patent Application for Automatic Feeding Detection Equipment for Integrated Circuit Packaging

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Dongguan Yima Semiconductor Co Ltd has submitted a patent application for Automatic Feeding Detection Equipment for Integrated Circuit Packaging. Yin Zean, Chen Dianwen and Liu Cao developed the invention. The patent application number is CN202511633333 20251110. The patent publication number is CN121341675..

Weishi Advanced Intelligent Tech Suzhou Co Ltd Submits Patent Application for Method and Device for Automatically Controlling Semiconductor Crystal Ingot to Enter Water Tank

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Weishi Advanced Intelligent Tech Suzhou Co Ltd has submitted a patent application for Method and Device for Automatically Controlling Semiconductor Crystal Ingot to Enter Water Tank. Liu Ming, Lin Yiwei and Li Lili developed the invention. The patent application number is CN202511909953 20251217. The patent..

Wuhan Ruiyuchuang Tech Co Ltd Files Chinese Patent Application for Novel Continuous Annealing Furnace for Producing Non-oriented Silicon Steel of New Energy Automobile

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Wuhan Ruiyuchuang Tech Co Ltd has filed a patent application for Novel Continuous Annealing Furnace for Producing Non-oriented Silicon Steel of New Energy Automobile. This invention was developed by Zhou Mo, Ji Yong, Zhang Jin, Song Jianzhi, Yang Shu, Zhang Guomin and Li Zhiqiang. The patent application num..

Baotou Weifeng New Mat Co Ltd Seeks Patent for Method for Optimizing Silicon Steel Inhibitor Structure Through Dew Point Regulation and Control

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Baotou Weifeng New Mat Co Ltd has sought patent for Method for Optimizing Silicon Steel Inhibitor Structure Through Dew Point Regulation and Control. This invention was developed by Hao Zhiyuan, Li Dan, Zhang Yu, Li Jin and Bai Jie. The patent application number is CN202511910481 20251217. The patent public..

Tropical Crops Genetic Resources Institute, CATAS Applies for Patent on Beautiful Millettia Root Liquid Phase Chip as Well as Preparation Method and Application Thereof

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Tropical Crops Genetic Resources Institute, CATAS has applied Chinese patent for Beautiful Millettia Root Liquid Phase Chip as Well as Preparation Method and Application Thereof. Li Zhiying, Xu Li, Meng Chunyang, Wang Jiabin, Fu Yunliu, Wang Minrui, Yang Qingquan, Chen Langxin, Wang Xiaobing, Huang Bilan and Z..

Huizhou Glorysky Electronics Tech Co Ltd Seeks Patent for V-cutting Aluminum Scrap Cleaning Method Based on Aluminum Substrate and Aluminum Scrap Cleaning Plate

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Huizhou Glorysky Electronics Tech Co Ltd has sought patent for V-cutting Aluminum Scrap Cleaning Method Based on Aluminum Substrate and Aluminum Scrap Cleaning Plate. This invention was developed by Wu Guanfu, Chen Jinxing, Xu Xiaobin, Zhou Meifan and Zhou Jiansheng. The patent application number is CN20251..

State Intellectual Property Office of China Releases Huangshan Aike Equipment Tech Co Ltd Patent Application for Cutter Speed Increasing Device and Machine Tool Spindle Center Jet ..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Huangshan Aike Equipment Tech Co Ltd patent application for Cutter Speed Increasing Device and Machine Tool Spindle Center Jet Flow Chip Cleaning Machine. This invention was developed by Wang Xiaoguang, Hu Ming, Cheng Feng, Liu Jie, Zhang Liangbin, Wu Xi..

State Intellectual Property Office of China Publishes South West University Patent Application for Buffalo Whole Genome 20k Liquid-phase SNP Chip as Well as Design Method and Appli..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published South West University patent application for Buffalo Whole Genome 20k Liquid-phase SNP Chip as Well as Design Method and Application Thereof. The invention was developed by Zhang Gongwei, Zhang Wenxiu, Zuo Fuyuan, Chen Xining, Fu Shubin and Zhou Zeyang...

Suzhou Jiujun Intelligent Equipment Co Ltd Submits Chinese Patent Application for Double-clip Type Photovoltaic Silicon Rod Stable Grabbing Unit Mechanism

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Suzhou Jiujun Intelligent Equipment Co Ltd has submitted a patent application for Double-clip Type Photovoltaic Silicon Rod Stable Grabbing Unit Mechanism. This invention was developed by Fu Rurong, Le Jiajing, Wu Rencai, Lin Mei and Zhu Yongsong. The patent application number is CN202511766980 20251128. Th..

Zheda Dixun Bio Gene Eng Co Ltd Submits Patent Application for Detection Kit and Method for Detecting Allergic Inflammatory Factors Based on Centrifugal Micro-fluidic Chip

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Zheda Dixun Bio Gene Eng Co Ltd has submitted a patent application for Detection Kit and Method for Detecting Allergic Inflammatory Factors Based on Centrifugal Micro-fluidic Chip. Wu Shandong, Zhu Mingzhi, Wu Zhoujie, Sun Yi, Liu Yi, Jiang Xuehan, Wang Jiping, Qian Lei, Wang Siyuan and Xu Zhangyan developed t..

Jiangsu Guangqian Electronic Co Ltd Seeks Patent for Laser Welding Device for Thermoelectric Separation Aluminum Substrate

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Jiangsu Guangqian Electronic Co Ltd has sought patent for Laser Welding Device for Thermoelectric Separation Aluminum Substrate. This invention was developed by Xie Xiansheng. The patent application number is CN202511573828 20251031. The patent publication number is CN121339669 (A). International Patent Cla..

Zhejiang Juhua Tech Center Co Ltd Files Chinese Patent Application for Application of Tetrafluoroethylene Oligomer as Heat Transfer Medium in Semiconductor Manufacturing Process an..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Zhejiang Juhua Tech Center Co Ltd has filed a patent application for Application of Tetrafluoroethylene Oligomer as Heat Transfer Medium in Semiconductor Manufacturing Process and Energy Storage. This invention was developed by Lei Zhigang, Xiao Yanru, Li Hao, Xu Xiaobo, Yang Bo, Wang Shuhua, Ye Pengfei and Li..

Huaian Ruoan Electronic Tech Co Ltd Submits Patent Application for Communication Router Chip Pin Welding Equipment

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Huaian Ruoan Electronic Tech Co Ltd has submitted a patent application for Communication Router Chip Pin Welding Equipment. Wu Dihong developed the invention. The patent application number is CN202511731006 20251124. The patent publication number is CN121339592 (A). International Patent Classification codes..

State Intellectual Property Office of China Releases Zhejiang Shanglin Tech Co Ltd Patent Application for Low-stress Low-repair-temperature Glue for Fixing Chip and Preparation and..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Zhejiang Shanglin Tech Co Ltd patent application for Low-stress Low-repair-temperature Glue for Fixing Chip and Preparation and Use Method of Low-stress Low-repair-temperature Glue. This invention was developed by Zhou Huihui. The patent application n..

Dongguan Hansi New Material Tech Co Ltd Files Chinese Patent Application for Small-spacing Chip Filling Adhesive for Temperature Control Crystal Oscillator and Preparation Method o..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Dongguan Hansi New Material Tech Co Ltd has filed a patent application for Small-spacing Chip Filling Adhesive for Temperature Control Crystal Oscillator and Preparation Method of Small-spacing Chip Filling Adhesive. This invention was developed by Jiang Zhangyong and Li Wei. The patent application number i..

Jiangsu Zhongke Ruida Health Technology Applies for Patent on Adjustable Ozone Generator Air Filtering Device

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Jiangsu Zhongke Ruida Health Technology has applied Chinese patent for Adjustable Ozone Generator Air Filtering Device. Dai Yuhao, Li Nan and Chen Zhi developed it. The patent application number is CN202511578149 20251031. The patent publication number is CN121338447 (A). International Patent Classification..

State Intellectual Property Office of China Receives Nanjing Ziyijie Tech Research and Development Co Ltd and Zhejiang Wudebaoer New Mat Co Ltd Patent Application for Organic Silic..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Nanjing Ziyijie Tech Research and Development Co Ltd and Zhejiang Wudebaoer New Mat Co Ltd patent application for Organic Silicon Defoaming Composition and Preparation Method Thereof. Fan Yuanbin and Xu Zhuang developed the invention. The patent appli..

Jiangsu Minchuang Communication Tech Co Ltd Seeks Patent for Heat Dissipation Storage Device for Chip

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Jiangsu Minchuang Communication Tech Co Ltd has sought patent for Heat Dissipation Storage Device for Chip. This invention was developed by Hu Chunrong. The patent application number is CN202511785028 20251201. The patent publication number is CN121341534 (A). International Patent Classification codes are B..

Guangzhou Inst Biomed & Health Submits Chinese Patent Application for Dual-channel Organ-like Dynamic Co-culture Micro-fluidic Chip and Application Thereof

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Guangzhou Inst Biomed & Health has submitted a patent application for Dual-channel Organ-like Dynamic Co-culture Micro-fluidic Chip and Application Thereof. This invention was developed by Zhang Xiao, Guo Yaqiong and Xiong Yucui. The patent application number is CN202511792318 20251201. The patent publicati..

Shanghai Qianzhan Innovation Res Institute Co Ltd Files Chinese Patent Application for Microfluidic Culture Chip for Vascularized Organoids and Culture Method of Three-dimensional ..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Shanghai Qianzhan Innovation Res Institute Co Ltd has filed a patent application for Microfluidic Culture Chip for Vascularized Organoids and Culture Method of Three-dimensional Vascularized Organoids. This invention was developed by Hui Jianan, Gao Xinzhuo, Zhao Jianlong, Mao Hongju and Chen Wen. The paten..

State Intellectual Property Office of China Releases Guangzhou Ribobio Co Ltd Patent Application for Sample Introduction and Reaction System and Method for Chip Sequencing

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Guangzhou Ribobio Co Ltd patent application for Sample Introduction and Reaction System and Method for Chip Sequencing. This invention was developed by Zhang Biliang, Adams J Overley and Zhong Huaqiang. The patent application number is CN202410952600 ..

Shengjisheng Ningbo Semiconductor Technology Submits Chinese Patent Application for Cold Pump Baffle Position Adjusting Device, Vacuum Chamber and Vacuum Adjusting Method

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Shengjisheng Ningbo Semiconductor Technology has submitted a patent application for Cold Pump Baffle Position Adjusting Device, Vacuum Chamber and Vacuum Adjusting Method. This invention was developed by Li Xiaoya, Kim Soo-heon and Park Hae Yoon. The patent application number is CN202511487541 20251017. The..

Shanghai Huali Integrated Circuit Manufacturing Submits Chinese Patent Application for Semiconductor Deposition Process Equipment Base Center Positioning Jig

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Shanghai Huali Integrated Circuit Manufacturing has submitted a patent application for Semiconductor Deposition Process Equipment Base Center Positioning Jig. This invention was developed by Wang Shuo, Ding Jingran and Gu Luoyang. The patent application number is CN202511483999 20251016. The patent publicat..

State Intellectual Property Office of China Publishes Ningbo Dezhou Prec Electronic Co Ltd Patent Application for Multi-chip Clip Packaging Structure

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Ningbo Dezhou Prec Electronic Co Ltd patent application for Multi-chip Clip Packaging Structure. The invention was developed by Zhou Zhenhui, Xin Haibo, Deng Xinping, Jiang Huanhui and Zhai Chongxin. The patent application number is CN202511861395 20..

State Intellectual Property Office of China Releases Changsha Anmuquan Intelligent Tech Co Ltd Patent Application for Multi-chip Packaging Structure with Heat Dissipation System

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Changsha Anmuquan Intelligent Tech Co Ltd patent application for Multi-chip Packaging Structure with Heat Dissipation System. This invention was developed by Dai Qiaobo, Zheng Boyu, Liu Zhen, Wei Ping and Xu Lanying. The patent application number is C..

State Intellectual Property Office of China Receives Guangdong Changhua Tech Co Ltd Patent Application for Chip Packaging Method and Related Device

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Guangdong Changhua Tech Co Ltd patent application for Chip Packaging Method and Related Device. Liu Jianyun and Wang Zhi developed the invention. The patent application number is CN202511475014 20251015. The patent publication number is CN121335503 (A..

Nat Ct Advanced Packaging Co Ltd Ncap China Submits Patent Application for Chip Packaging Structure and Preparation Method

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Nat Ct Advanced Packaging Co Ltd Ncap China has submitted a patent application for Chip Packaging Structure and Preparation Method. Zhou Cheng developed the invention. The patent application number is CN202511645019 20251111. The patent publication number is CN121335108 (A). International Patent Classificat..

Qingdao Zhancheng Tech Co Ltd Files Chinese Patent Application for Band-pass Filter Structure Packaging Method Based on RDL Technology

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Qingdao Zhancheng Tech Co Ltd has filed a patent application for Band-pass Filter Structure Packaging Method Based on RDL Technology. This invention was developed by Sun Yanhui, Zhou Jing, Wang Hong, Liu Tao, Zhu Dengji and Wei Xin. The patent application number is CN202511261399 20250904. The patent public..

State Intellectual Property Office of China Publishes Yuanqixin Shandong Semiconductor Tech Co Ltd Patent Application for Heat Dissipation Packaging Shell Based on Micro-channel St..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Yuanqixin Shandong Semiconductor Tech Co Ltd patent application for Heat Dissipation Packaging Shell Based on Micro-channel Structure, Packaging Structure and Manufacturing Method Thereof. The invention was developed by Sang Jian, Cao Gang and Wei Chaof..

Jiangsu Pangu Semiconductor Tech Co Ltd Seeks Patent for Multi-chip High-density Three-dimensional Interconnected Board-level Packaging Structure and Packaging Method

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Jiangsu Pangu Semiconductor Tech Co Ltd has sought patent for Multi-chip High-density Three-dimensional Interconnected Board-level Packaging Structure and Packaging Method. This invention was developed by Ma Shuying, Liu Su, Liu Yi, Yan Li and Dong Xueshu. The patent application number is CN202511473873 202..

Jiangsu Pangu Semiconductor Tech Co Ltd Submits Patent Application for Three-dimensional Stacked Packaging Method and Structure

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Jiangsu Pangu Semiconductor Tech Co Ltd has submitted a patent application for Three-dimensional Stacked Packaging Method and Structure. Jiang Xinglong and Ma Shuying developed the invention. The patent application number is CN202511549982 20251028. The patent publication number is CN121335609 (A). Internat..

Jiangsu Pangu Semiconductor Tech Co Ltd Submits Chinese Patent Application for Fan-out Packaging Method

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Jiangsu Pangu Semiconductor Tech Co Ltd has submitted a patent application for Fan-out Packaging Method. This invention was developed by Ma Shuying, Yan Li and Zhang Heng. The patent application number is CN202511583412 20251031. The patent publication number is CN121335610 (A). International Patent Classif..

Hangzhou Zhonggui Electronic Technology Co Ltd Submits Singaporean Patent Application for Wafer Loading Support, Wafer Loading System, and Wafer Mounting Method for CMP Process

Semiconductor

| Mon 18 May 2026

Singapore, May 18 -- Hangzhou Zhonggui Electronic Technology Co Ltd has submitted a patent application for Wafer Loading Support, Wafer Loading System, and Wafer Mounting Method for CMP Process. This invention was developed by Xu Hui and Shen Linghan. The patent application number is SG20211111470X 20190904. The patent public..

Heilongjiang Huixin Semiconductor Co Ltd Seeks Patent for Detection Protection Circuit, PCB and Chip

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Heilongjiang Huixin Semiconductor Co Ltd has sought patent for Detection Protection Circuit, PCB and Chip. This invention was developed by Feng Yuxiang, Zhong Zunheng and Feng Kexin. The patent application number is CN202511290701 20250910. The patent publication number is CN121332414 (A). International Pat..

Shanghai Yuechenxin Semiconductor Tech Co Ltd Submits Chinese Patent Application for Short Circuit Protection Circuit and Battery Protection Chip

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Shanghai Yuechenxin Semiconductor Tech Co Ltd has submitted a patent application for Short Circuit Protection Circuit and Battery Protection Chip. This invention was developed by Zheng Tiantian, Gong Kunlin and Cui Guoqing. The patent application number is CN202511737679 20251125. The patent publication num..

State Intellectual Property Office of China Publishes Heilongjiang Huixin Semiconductor Co Ltd Patent Application for Undervoltage Protection Circuit, PCB and Chip

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Heilongjiang Huixin Semiconductor Co Ltd patent application for Undervoltage Protection Circuit, PCB and Chip. The invention was developed by Feng Yuxiang, Zhong Zunheng and Feng Kexin. The patent application number is CN202511295920 20250911. The pa..

Guilin Leiguang Tech Co Ltd Submits Patent Application for Quality Control Method of Laser Chip Surface Passivation Layer

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Guilin Leiguang Tech Co Ltd has submitted a patent application for Quality Control Method of Laser Chip Surface Passivation Layer. Peng Hui, Liao Qiulin, Wen Fan, Wang Weijian and Qin Chengfeng developed the invention. The patent application number is CN202511466964 20251014. The patent publication number i..

Infineon Technologies Dresden GmbH Seeks Patent for Semiconductor Die with Field Oxide Thickness Transition Region and Method of Producing the Same

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Infineon Technologies Dresden GmbH has sought patent for Semiconductor Die with Field Oxide Thickness Transition Region and Method of Producing the Same. This invention was developed by Christopher Foss, Schroeder Thomas and Weiss Robert. The patent application number is CN202510588348 20250508. The patent ..

Hypersics Semiconductor Co Ltd Submits Patent Application for Epitaxial-free Silicon Carbide Integrated Substrate and Preparation Method Thereof

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Hypersics Semiconductor Co Ltd has submitted a patent application for Epitaxial-free Silicon Carbide Integrated Substrate and Preparation Method Thereof. Liu Xinyu, Shi Yuchen, Pang Xu and Yuan Zhenzhou developed the invention. The patent application number is CN202511464727 20251014. The patent publication..

Magnachip Semiconductor Inc Seeks Patent for Super Junction Semiconductor Device and Manufacturing Method Thereof

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Magnachip Semiconductor Inc has sought patent for Super Junction Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Lin Zhirong, Park Chan-ho, Moon Su-young and Kim Ki-hwan. The patent application number is CN202510937128 20250708. The patent publication number is CN12133..

State Intellectual Property Office of China Releases Wuhan University and Hubei University Patent Application for Transverse MOSFET Device Based on Beta-ga2o3 Substrate, Preparatio..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Wuhan University and Hubei University patent application for Transverse MOSFET Device Based on Beta-ga2o3 Substrate, Preparation Method Thereof and Semiconductor Equipment. This invention was developed by Ren Feng, Wei Linfu, Wu Hao, Qiao Biyan, Zeng Zhi..

Guangdong Greater Bay Area Institute Of Integrated Circuit and System Submits Chinese Patent Application for Manufacturing Method of Semiconductor Device

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Guangdong Greater Bay Area Institute Of Integrated Circuit and System has submitted a patent application for Manufacturing Method of Semiconductor Device. This invention was developed by Xu Yong, Song Weijia, Zhang Ji, Li Binhong, Wang Yun and Ye Tianchun. The patent application number is CN202410917976 202..

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