Semiconductor
| Thu 24 Sep 2026
Alexandria, Sept. 23 -- Applied Materials has secured a patent on Metal Cap for Contact Resistance Reduction. Lee Joung Joo, Hou Wenting, Gelatos Avgerinos V, Lei Jianxin, Wu Liqi, Hung Raymond Hoiman, Mebarki Bencherki, Kuratomi Takashi, Ha Tae Hong and Tang Xianmin developed the invention.
The patent application number is U..