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Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Aihua Wuxi Semiconductor Tech Co Ltd has secured a patent on Furnace Door Lifting Sealing Structure of Vacuum Equipment. Zhang Mian developed the invention. The patent application number is CN202422955136U 20241202. The patent publication number is CN223596503 (U). International Patent Classification code ..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Larix Shenzhen Tech Co Ltd has submitted a patent application for NAND Flash Memory Life Dynamic Prediction Method for Extreme Temperature Change Environment. This invention was developed by Han Rui and Zhu Jianbao. The patent application number is CN202610264949 20260305. The patent publication number is ..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has awarded a patent to Qingdao Zhuoyingshe Technology for Double-layer Light-emitting Surface Light Source. Fang Bing and Wang Tao developed the invention. The patent application number is CN202422772109U 20241113. The patent publication number is CN223595782 (U..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Xiamen Anjieli Meiwei Tech Co Ltd and Shanghai Meadville Science & Tech Co Ltd have secured a patent on Developing and Spraying Structure of Packaging Substrate. Chen Junmin and Huang Rixin developed the invention. The patent application number is CN20242389478U 20241213. The patent publication number is C..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Duntai Electronics Shenzhen Co Ltd and Guangdong University of Technology have submitted a patent application for Differential Transmission Circuit, Chip and Electronic Equipment. This invention was developed by Xie Huanlin, Xu Sha, Chen Xuexuan, Wen Jie, Zhong Xiaohong, Chen Kejing, Wen Haolang, Xie Xubin, G..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Beijing Yuanliu Hongyuan Electronic Technology and Beijing Yuanlu Hongyuan Electronic Tech Co Ltd have been awarded a patent for Breakdown Test Multifunctional Tool for Single-layer Chip Ceramic Dielectric Capacitor. This invention was developed by Li Zishuo, Wu Qi and Yang Shanshan. The patent application..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Beizhen Electronic Tech Co Ltd has been awarded a patent for Socket for Chip Continuous Slt. This invention was developed by Fan Caifeng. The patent application number is CN202422796823U 20241118. The patent publication number is CN223597717 (U). International Patent Classification codes are G01R1/04 and G..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Hefei Institutes of Physical Science, Chinese Academy of Sciences and Hangzhou International Science and Technology Innovation Center of Zhejiang University have filed a patent application for Ultrathin Flexible Radiovolt Isotope Battery Based on Silicon Carbide and Preparation Method of Ultrathin Flexible Ra..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Sichuan Gaojing Solar Energy Technology and Gaojing Solar Energy have obtained a patent for monocrystalline silicon sample wafer manufacturing equipment. This invention was developed by Zhu Wenxuan, Huangfu Ya'nan and Fu Mingquan. The patent application number is CN202520291826U 20250221. The patent public..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Hunan Gaochuang Xiangyu Equipment Tech Co Ltd and Hunan Gaochuang Xiangyu Tech Co Ltd have filed a patent application for Laser Additive Manufacturing Substrate Based on Machine Learning and Manufacturing Method Thereof. This invention was developed by Huang Qingjun, Liu Chengcheng, Guo Pojiang, Quan Shuhao, ..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Shenzhen Songsheng Innovation Tech Co Ltd has been awarded a patent for Crosstalk Suppression Driving Circuit of Silicon Carbide MOSFET Bridge Circuit and Power Supply Equipment. This invention was developed by Tang Jianguo, Qin Hui, Lai Chuiting and Long Bin. The patent application number is CN20242329689..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Zhejiang Jin Yi Special Motor Co Ltd has been awarded a patent for Stator Silicon Steel Sheet for Special Motor. This invention was developed by Du Yan and Zhang Guosheng. The patent application number is CN202520294012U 20250221. The patent publication number is CN223625644 (U). International Patent Class..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Central South University and Zhuzhou Diyuan Powder Metallurgy Furnace Co Ltd have submitted a patent application for High-purity Silicon Nitride Powder Screening Device for Silicon Nitride Ceramic Production. This invention was developed by Wang Zhiyong, Zou Simin, Li Songbai, Zhou Xin, Lu Guopu and Shen Wenq..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Central South University and Zhuzhou Diyuan Powder Metallurgy Furnace Co Ltd have submitted a patent application for Efficient Ball Milling Device for Silicon Nitride Ceramic Production and Processing. Zou Simin, Wang Zhiyong, Li Songbai, Zhou Xin, Lu Guopu and Shen Wenquan developed the invention. The pat..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Nanjing University of Technology and Njut Membrane Applied Technology Research Inst Co Ltd have sought patent for Preparation Method of Tubular Janus Silicon Carbide Ceramic Membrane. This invention was developed by Gu Qilin, Yang Qiqi, Zhong Zhaoxiang, Zhou Jian and Xing Weihong. The patent application nu..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Chengdu BOE Optoelectronics Technology, BOE Technology Group and Beijing BOE Technology Development have applied Chinese patent for Display Substrate and Display Device. Liu Jia, Wang Rong, Deng Kaijie and Huang Yao developed it. The patent application number is CN20248002086 20240930. The patent publicati..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Chengdu BOE Optoelectronics Technology, BOE Technology Group and Beijing BOE Technology Development have filed a patent application for Display Substrate and Display Device. This invention was developed by Fan Cong, Liu Lang, Liu Zhen, Ding Wenbiao and Huang Yao. The patent application number is CN20248002..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Yunnan Chuangshijie Optoelectronics Tech Co Ltd, BOE Technology Group and Beijing BOE Technology Development have applied Chinese patent for Gate Drive Circuit and Working Method Thereof, Display Substrate and Display Device. Shan Qingshan, Bai Xiao, Zhang Dacheng, Hwang In-ho, Zhu Zhijian, Huang Yue and Yang..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Huizhou Jufei Optical Mat Co Ltd, China University of Geosciences, Wuhan and Guangzhou Nansha Dida Binhai Research Institute have submitted a patent application for Self-splicing Large-size Single Crystal Diamond Substrate and Manufacturing Method Thereof. Liu Qiang, Sun Qinglei, Hu Linghui, Sun Changheng and..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Hebei Tongguang Tech Development Co Ltd and Hebei Tongguang Semiconductor have submitted a patent application for Efficient Terminal Cleaning Method for Silicon Carbide Substrate. This invention was developed by Tang Huan, Li Qingxuan, Zheng Xiangguang, Cui Jingguang and Liu Qing. The patent application nu..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Hebei Tongguang Tech Development Co Ltd and Hebei Tongguang Semiconductor have submitted a patent application for Terminal Cleaning Method for Silicon Carbide Substrate. This invention was developed by Tang Huan, Li Qingxuan, Gao Yanjing, Zheng Xiangguang and Cui Jingguang. The patent application number is..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Hebei Tongguang Tech Development Co Ltd and Hebei Tongguang Semiconductor have filed a patent application for Pre-cleaning Method for Silicon Carbide Polished Wafer. This invention was developed by Tang Huan, Zheng Xiangguang, Cui Jingguang and Yan Lan. The patent application number is CN202610262396 20260..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Chongqing New Energy Storage Material and Equipment Research Institute and Chongqing University have sought patent for Method for Large-scale Batch Preparation of Bulk Semiconductor Material by Using Natural Ore. This invention was developed by Lu Xu, Zhou Xiaoyuan, Zhang Kaiqi and Ji Xiao. The patent appl..

Semiconductor

  |  Sun 30 Aug 2026

Seoul, Aug. 31 -- Nitto Denko Corp and Nitto Seiki KK have submitted a patent application for Tape Processing Apparatus for Semiconductor Work and Tape Exchange Method for Semiconductor Work. Okuno Chouhei developed the invention. The patent application number is KR20240091673 20240711. The patent publication number is KR2025..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Nanjing University and Hefei Nat Laboratory have submitted a patent application for Junction Barrier Type Wide Energy Detection Range Semiconductor Electron Detector and Imaging Method. Xu Renjie, Lu Hai, Ren Fangfang, Zhou Feng, Xu Weizong, Zhou Dong and Zhang Rong developed the invention. The patent appl..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Semiconductor Manufacturing International (Shanghai) andSemiconductor Mfg North Integrated Circuit Mfg Beijing Co Ltd have submitted a patent application for Formation Method of Semiconductor Structure. This invention was developed by He Cunzhe, Gao Dongliang and Liu Xuan. The patent application number is ..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- BOE Technology Group and South China University of Technology have submitted a patent application for Semiconductor Material, Thin Film Transistor, Preparation Method of Thin Film Transistor and Array Substrate. This invention was developed by Wang Fei, Liu Fengjuan, Yuan Guangcai, Lan Linfeng, Peng Junbiao, ..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Huahong Semiconductor Mfg Wuxi Co Ltd and Huahong Semiconductor, Wuxi have applied Chinese patent for Manufacturing Method of Fast Recovery Power Semiconductor Device. Zhi Liming, Li Qing, Rui Chenkang and Ma Dong developed it. The patent application number is CN202610162311 20260204. The patent publicatio..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- West Lake Instrument Hangzhou Tech Co Ltd has applied Chinese patent for Processing Method for Approximately Zero-taper Special-shaped Laser Cutting of Silicon Carbide Lens and Laser Cutting System. Yu Xiaoying, Liu Dongli and Liu Fengjiang developed it. The patent application number is CN202610663820 2026..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has published Inst of Mechanical Manufacturing Technology China Academy of Engineering Physics patent application for Method for Removing Fused Quartz Substrate Multilayer Oxide Film Through Laser Back Incidence Thermal Stress. The invention was developed by Hai Kuo..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Jiangsu Tanglong Electronic Tech Co Ltd has submitted a patent application for Spot Welding Equipment for Integrated Circuit Chip Processing. Li Jiaxi, Wan Xing and Zhao Yunfei developed the invention. The patent application number is CN202610677387 20260518. The patent publication number is CN122184500 (A..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Wuhan Shengshi Qichuang Tech Co Ltd has submitted a patent application for Sensor Chip Pin Header and Circuit Board Welding Tool, Process and Processing Equipment. This invention was developed by Liu Huan, Qian Zhenqiang, Ke Binbin, Liu Gang, Ke Changtang and Cao Jingyu. The patent application number is CN..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Shateka Tech Jiangsu Co Ltd has filed a patent application for High-damping Anti-vibration Type Wafer Grinding Machine Tool Body Casting Mold. This invention was developed by Zhang Jie and Gong Yougao. The patent application number is CN202610487788 20260414. The patent publication number is CN122184281 (A..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Xuzhou Botong Aluminum Ind Co Ltd has sought patent for Feeding Mechanism of Aluminum Wafer Punching Machine. This invention was developed by Zhang Li, Ren Jun and Tao Lei. The patent application number is CN202610460826 20260409. The patent publication number is CN122184227 (A). International Patent Class..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Zhongke Weifen Tech Development Beijing Co Ltd has sought patent for Modified Silicon Dioxide Chromatographic Microspheres and Preparation Method Thereof. This invention was developed by Guo Baosheng. The patent application number is CN202610652902 20260513. The patent publication number is CN122183564 (A)..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Wuxi Fujia Semiconductor Tech Co Ltd patent application for Collecting Device for Chip Manufacturing Process. This invention was developed by Jiang Liuyun, Gan Yu, He Weixin, Jiang Lang, Yu Qianru and Yu Zhengmin. The patent application number is CN2..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has published Adya Semiconductor Zink Tech Co Ltd patent application for Through-substrate Via Structure and Process. The invention was developed by Uzoh Cyprian Emeka and Katkar Rajesh. The patent application number is CN20248071606 20240920. The patent publicat..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Imax Osram International BV patent application for Growth Substrate and Method for Processing Optoelectronic Device. Sundgren Petrus developed the invention. The patent application number is CN202380103818 20231107. The patent publication number is C..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Hoya Optical Lab Inc patent application for Fluorine-free Hydrophobic Coating. This invention was developed by Knutsson Thomas R. The patent application number is CN20248071987 20240925. The patent publication number is CN122180900 (A). International..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Robert Bosch Co Limited has filed a patent application for Method for Transferring Chips of Wafer and Corresponding Device. This invention was developed by Pinter Stefan. The patent application number is CN20248071492 20241015. The patent publication number is CN122180647 (A). International Patent Classifi..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Wuxi Xinzhuo Huguang Semiconductor Co Ltd has submitted a patent application for Preparation Method of Semiconductor Device. This invention was developed by Shen Yuli, Tang Danni, Cheng Hanyue and Yuan Lefan. The patent application number is CN202610169327 20260205. The patent publication number is CN12218..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Chongqing Xinlian Microelectronic Co Ltd has sought patent for Method for Improving Reliability of Metal Interconnection Layer and Preparation Method of Semiconductor Structure. This invention was developed by Zhang Nianheng, Li Bao and Cai Xianzhu. The patent application number is CN202610123059 20260129...

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Jiangsu Jingkai Semiconductor Tech Co Ltd has submitted a patent application for Micro-force Control System and Method for Picking and Placing Thin Film Chip. This invention was developed by Pan Hanye. The patent application number is CN202610652792 20260513. The patent publication number is CN122180360 (A..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Beijing Xinyuewei Semiconductor Tech Co Ltd, Wuhu Xin Yue Micro Semiconductor Co Ltd and Hefei Xin Yue Micro Semiconductor Co Ltd patent application for Supporting Structure, Wafer Box and Preparation Method of Wafer Box. This invention was developed by..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Wuhu Xin Yue Micro Semiconductor Co Ltd has applied Chinese patent for Suspension Type Wafer Carrier for Semiconductor Wafer Production. Li Yue, Zhang Liang and Guo Xiaonan developed it. The patent application number is CN202610645629 20260512. The patent publication number is CN122180346 (A). Internationa..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Shanghai Xinshang Micro Fitting Tech Co Ltd patent application for Air Bath Device and Semiconductor Production Equipment. Wang Gang, Luo Bing, Yang Yuqi, Cheng Hang, Wang Sainan, Zhang Shun, Zhang Hongbo and Cheng Binbin developed the invention. The..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Anhui Juhe Microelectronics Co Ltd has applied Chinese patent for Cutting Method, Cutting Device and Chip. Chen Jingfeng and Wu Jihua developed it. The patent application number is CN202610619632 20260507. The patent publication number is CN122180325 (A). International Patent Classification codes are H10P5..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Suzhou Weiqing Semiconductor Co Ltd has sought patent for Method for Forming Semiconductor Groove. This invention was developed by Shi Wenhua, Hu Bowen, Li Shuai, Zhang Guangjing, Zhang Junchao and Pu Dong. The patent application number is CN202610135838 20260130. The patent publication number is CN1221803..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Zhangjiang Nat Laboratory has submitted a patent application for Patterning Method and Patterning System for Semiconductor Process. Li Zhonghua and Ji Shengxiang developed the invention. The patent application number is CN202411767097 20241203. The patent publication number is CN122180320 (A). Internationa..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Zhongke Huizhu Guangzhou Semiconductor Co Ltd has applied Chinese patent for Silicon Carbide Epitaxial Wafer and Preparation Method and Application Thereof. Yang Junwei, Lin Haobo, Song Huaping and Guo Songbo developed it. The patent application number is CN202610117779 20260128. The patent publication num..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Chengdu Pro Microwave Electronic Tech Co Ltd patent application for Preparation Method of Epitaxial Structure, Epitaxial Structure and Semiconductor Device. This invention was developed by Yin Yuzhe, He Li and Zhao Guangyu. The patent application num..

Semiconductor

  |  Sun 30 Aug 2026

Seoul, Aug. 31 -- Korean Intellectual Property Office has received ApS Inc patent application for Manufacturing Method of Wafer Frame Continuous Processing Mask and Wafer Frame Continuous Mask Manufactured Thereby. Kwon Oeun, Moon Jong Woon and Kim Hwi Su developed the invention. The patent application number is KR20240105966..

Semiconductor

  |  Sun 30 Aug 2026

Seoul, Aug. 31 -- ApS Inc has filed a patent application for Manufacturing Method of Wafer Frame Continuous Processing Mask and Wafer Frame Continuous Mask Manufactured Thereby. This invention was developed by Kwon Oeun, Moon Jong Woon and Kim Hwi Su. The patent application number is KR20240105956 20240808. The patent publica..

Semiconductor

  |  Sun 30 Aug 2026

Seoul, Aug. 31 -- Korean Intellectual Property Office has received Nitto Denko Corp and Nitto Seiki KK patent application for Tape Processing Apparatus for Semiconductor Work and Tape Exchange Method for Semiconductor Work. Okuno Chouhei developed the invention. The patent application number is KR20240090200 20240709. The pat..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Nuoshi Tech Zhejiang Co Ltd has filed a patent application for Micro Led Micro Display Chip. This invention was developed by Yan Gaige, Wang Xiaonan and Zhu Youliang. The patent application number is CN202610633902 20260509. The patent publication number is CN122180234 (A). International Patent Classificat..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Jiangsu Third Generation Semiconductor Research Inst Co Ltd has sought patent for Light Emitting Diode Epitaxial Wafer and Preparation Method and Application Thereof. This invention was developed by Yan Qi'ang and Wang Guobin. The patent application number is CN202411802059 20241209. The patent publication..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Jiangsu Third Generation Semiconductor Research Inst Co Ltd has submitted a patent application for Epitaxial Wafer, and Preparation Method and Application of Epitaxial Wafer. This invention was developed by Yan Qi'ang and Wang Guobin. The patent application number is CN202411802062 20241209. The patent pub..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Jiangxi Yaochi Tech Co Ltd has filed a patent application for Forward-installed Led Chip and Preparation Method Thereof. This invention was developed by Jin Conglong, Hu Jiahui, Xu Zhou and Cao Guangliang. The patent application number is CN202610272389 20260306. The patent publication number is CN12218021..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Zhongmao Green Energy Tech Xi'an Co Ltd has applied Chinese patent for Cadmium Telluride Thin-film Solar Cell Based on P-type Copper-containing Oxide Back Contact Layer and Preparation Method of Cadmium Telluride Thin-film Solar Cell. Ma Qianqian and Ding Ye developed it. The patent application number is C..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Ruishi Shenzhen Display Tech Co Ltd patent application for Rare Earth Ion Co-doped Two-dimensional Semiconductor Material with Optimized Proportion and Preparation Method and Application Thereof. Zhao Tianlong, Zhao Yingxue, Yue Yi and Zhao Hongquan dev..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Nat Ct Advanced Packaging Co Ltd NCAP China patent application for Photoelectric Co-packaging Semiconductor Device Structure and Preparation Method Thereof. Dai Fengwei, Gao Li and Liu Fengman developed the invention. The patent application number is..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Geke Semiconductor Shanghai Co Ltd has sought patent for Backside Illuminated Image Sensor Forming Method and Image Sensor. This invention was developed by Wang Chunlin, Zeng Tian and Zou Wen. The patent application number is CN202411809086 20241209. The patent publication number is CN122180165 (A). Intern..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Geke Semiconductor Shanghai Co Ltd patent application for Forming Method of Semiconductor Device, Semiconductor Device and Image Sensor. This invention was developed by Zeng Tian and Zou Wen. The patent application number is CN202411808609 20241209. ..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Geke Semiconductor Shanghai Co Ltd patent application for Non-stack Image Sensor and Preparation Method Thereof. Zeng Tian, Xu Jian and Zou Wen developed the invention. The patent application number is CN20261066683 20260116. The patent publication n..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Shanghai Xinwei Semiconductor Co Ltd has sought patent for Semiconductor Device and Preparation Method of Semiconductor Device. This invention was developed by Yin Jie, Tang Sishi, Lei Jiacheng and Zhang Wei. The patent application number is CN202610317083 20260316. The patent publication number is CN12218..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Beijing Zhongke Xinweite Tech Development Co Ltd has applied Chinese patent for Preparation Method and Structure of Metal-oxide Semiconductor Field Effect Transistor. Zhang Yanfei, Li Qing, Wen Xiaoxia, Wang Dandan, Liu Mengxin, Li Ya and Zhang Danyang developed it. The patent application number is CN20261..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Institute Electronic Eng China Academy Eng Physics has submitted a patent application for Silicon Carbide Bipolar Semiconductor Device with Heterojunction and Preparation Method Thereof. This invention was developed by Li Zhiqiang, Li Juntao, Li Lingfeng, Liao Zhengxiang, Zhang Lin, Li Lianghui and Xu Xinglia..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Zhanxun Semiconductor Chengdu Co Ltd has submitted a patent application for Wireless Local Area Network Authorized Flow Identification and Service Quality Guarantee Method and Device, Wireless Access Point, Terminal Chip, Terminal Chip Module and Terminal Equipment. This invention was developed by Jiang Dawei..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received University of Macau and Shenzhen Futian District Aoda Hetao Integrated Circuit Research Institute patent application for First Chip, Second Chip and Single-channel Bidirectional Isolation System. Mai Peiran, Jiang Yang, Liang Zhi'ao, Jia Siman and Ma Xu..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Hangzhou Dixin Tech Co Ltd patent application for Control Method of Serial Peripheral Interface Applied to Beam Forming Chip, Beam Forming Chip and Radio Frequency Front End. This invention was developed by Li Yan, Song Zhihao, Zhang Luan and Wu Ruili. ..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has published Hangzhou Dixin Tech Co Ltd patent application for Circuit of Serial Peripheral Interface, Beam Forming Chip and Radio Frequency Front End. The invention was developed by Li Yan, Song Zhihao, Zhang Luan and Wu Ruili. The patent application number is ..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has published Beijing Maoruixin Tech Co Ltd patent application for Turn-off Circuit of High-side Driver, Chip and Electronic Equipment. The invention was developed by Fan Bo, Jiao Yutao, Li Jiawei and Sheng Lin. The patent application number is CN202610147489 202..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Zitai Microelectronics Shanghai Co Ltd has submitted a patent application for Low-power-consumption Bluetooth SOC Adaptive Clock Gating Structure and Chip. Xue Daoshan developed the invention. The patent application number is CN202610637348 20260511. The patent publication number is CN122178879 (A). Intern..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has published Beijing Maoruixin Tech Co Ltd patent application for Relaxation Oscillator Circuit, Control Method, Integrated Chip and Electronic Equipment. The invention was developed by Yang Xiufang, Fan Bo, Jiao Yutao and Sheng Lin. The patent application numbe..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Guangxi Tiexiang Tech Co Ltd has submitted a patent application for Resistor Adjusting Method and System Based on MEMS Technology. This invention was developed by Zhang Mingxin, Li Jun, Yao Yuqiang, Fu Longfei, Zhu Haipeng, He Pei and Lou Hanwei. The patent application number is CN202610654548 20260513. Th..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Shenzhen Microsource Semiconductor Co Ltd has applied Chinese patent for Low-dropout Linear Voltage Stabilizing Circuit, Chip and Electronic Equipment. Nie Dan and Yuan Tao developed it. The patent application number is CN202610652681 20260513. The patent publication number is CN122178724 (A). Internationa..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Shanghai Huahong IC Co Ltd has applied Chinese patent for Bootstrap Charge Pump Structure. Luo Yi, Fan Xing and Zhao Wenguang developed it. The patent application number is CN202610270221 20260306. The patent publication number is CN122178710 (A). International Patent Classification code is H02M3/07. T..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Changzhou Guiyuan New Energy Mat Co Ltd has filed a patent application for Low-expansion Silicon-carbon Negative Electrode Material Based on Composite Porous Carbon Substrate and Preparation Method of Low-expansion Silicon-carbon Negative Electrode Material. This invention was developed by Ren Chunlei, Huang ..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Kunshan Semi Kentonghui Semiconductor Tech Co Ltd has submitted a patent application for Electric Arc Detection Processing Method and Device for Radio Frequency Plasma Processing System. This invention was developed by Duan Yaoduo and Dang Junfeng. The patent application number is CN202610309281 20260313. ..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Jiangmen Branch of Zhonglian Taiping Zhuhai Political and Law Consulting Service Co Ltd has submitted a patent application for Online Health Management Method and System Based on Intelligent Chip. This invention was developed by Xu Yina, Xu Lian, Xu Teli and Xu Yi. The patent application number is CN202610..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Wenzhou Yingjie Machinery Equipment Co Ltd has been granted a patent for Special Water-cooling Red Copper Conductive Seat Assembly for Electroplating Equipment. Hu Guoli developed the invention. The patent application number is CN202421609384U 20240709. The patent publication number is CN223598556 (U). Int..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has awarded a patent to Success Electronics Huizhou Co Ltd for High-reliability Ceramic Chip Capacitor. Yang Hao and Li Hai developed the invention. The patent application number is CN20242356723U 20241211. The patent publication number is CN223598548 (U). Intern..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Anhui Chengde Gonggao Steel Proc Co Ltd has been granted a patent for High-efficiency Heat Dissipation Silicon Steel Sheet Laminated Structure. Han Bing, Feng Gangyin, Li Guofang and Dong Hui developed the invention. The patent application number is CN202520269271U 20250220. The patent publication number i..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Chinese Patent for Circuit for Testing Power Supply Reliability of Chip has been issued to Megahunt Tech Co Ltd. This invention was developed by Qi Mengchao, Li Li, Zhang Fang and Wang Biao. The patent application number is CN202422972485U 20241203. The patent publication number is CN223597863 (U). Interna..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Jiefeng Test Tech Kunshan Co Ltd has been granted a patent for Testing Device for Semiconductor Device. Qiu Weiguang, Chen Xinjun, Xie Jingqi and Bai Ming developed the invention. The patent application number is CN202422868658U 20241125. The patent publication number is CN223597818 (U). International Pate..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has awarded a patent to Beizhen Electronic Tech Co Ltd for Self-positioning Chip Inspection Test Socket. Fan Caifeng developed the invention. The patent application number is CN202422796820U 20241118. The patent publication number is CN223597716 (U). Internationa..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Qingdao Xinfu New Material Tech Co Ltd has secured a patent on Finished Product Detection Machine for Semiconductor Rubber Ring Production. Zhang Shixin, Zhang Jinguo, Ma Jinfu, Yan Xu and Sun Mingchao developed the invention. The patent application number is CN20242359485U 20241212. The patent publication..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Xi'an Lumcore Optoelectronics Tech Co Ltd has been granted a patent for Microstructure Semiconductor Laser Bar Detection Probe. This invention was developed by Zhang Duoshi, Xu Bin, Qiu Bocang, Zhao Yongchao, Ren Zhanqiang, Li Yujia and Guo Xianwu. The patent application number is CN202422875953U 20241125...

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has awarded a patent to Xi'an Junjie Xinchuang Electronic Tech Co Ltd for Manual Rotation Impact Test Tool for MEMS Inertial Product. Ma Jiangang, Yang Dong, Xue Dongmei, Liu Cong, Liu Gang, Wang Kun and Yan Fukang developed the invention. The patent application ..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Chinese Patent for Thermocouple Assembly of Liquid Crystal Substrate Platinum Channel and Glass Production Device has been issued to Zhejiang Xingke Photoelectric Tech Co Ltd and Beijing Bojia Tech Co Ltd. This invention was developed by Feng Zikang, Zhao Yonghua, Dong Qingmin and Fan Hongbin. The patent a..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Chinese Patent for Raw Material Proportioning and Weighing Equipment for Silicon Production has been issued to Qinghai Huaxin Silicon Ind Co Ltd. This invention was developed by Li Caiying, Yan Gaoding, An Zongquan and Zhao Shengyu. The patent application number is CN202423281735U 20241230. The patent publ..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Lianyungang Qixiang Electronic Co Ltd has received a patent for Drying Device for Piezoelectric Quartz Crystal Frequency Chip Production. This invention was developed by Xu Dasi, Ma Jinbang, Wang Wanmei and Wang Wanyun. The patent application number is CN202423273762U 20241230. The patent publication numbe..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Dalian Shengguang Tech Development Co Ltd has secured a patent on Novel Sealing Device for Aluminized Silicon Production Process. Chen Liangliang and Liu Jia developed the invention. The patent application number is CN202520250421U 20250218. The patent publication number is CN223594966 (U). International P..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Wiiss Beijing Tech Co Ltd patent application for Six-axis PCB Drilling Machine Automatic Chip Cleaning Assembly and Method Thereof. Sun Xingguo and Wang Fan developed the invention. The patent application number is CN202610646276 20260512. The patent..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Wanhua Chemical Group Electronic Mat Co Ltd has applied Chinese patent for Polishing Pad with Grooves for Reducing Flowing Resistance of Polishing Solution and Wafer Polishing Device. Chai Wanli, Jin Yunquan and Xie Yu developed it. The patent application number is CN202610457993 20260409. The patent publi..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Suzhou Canaan Holding Group Co Ltd patent application for Anti-cracking Polishing Equipment for Semiconductor Wafer. This invention was developed by Hong Shanshan and Gao Li. The patent application number is CN202610497452 20260415. The patent public..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has sought patent for Method for Directly Grinding Silicon Surface of Silicon Carbide Crystal Ingot by Filling Carbon Surface. This invention was developed by Zuo Xuan, Yao Zhiyong, Zhong Chao, Jiang Chengchen and Cao Dekun. The patent application number ..

Semiconductor

  |  Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Shanghai Inst of Microsystem and Information Technology Chinese Academy Of Sciences patent application for Polishing Method of Polycrystalline Silicon Carbide. This invention was developed by Song Zhitang, Xu Manlin, Li Yaowen and Liu Weili. The pate..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- Suzhou Dingtian Prec Machinery Co Ltd has submitted a patent application for Electronic Display Float Glass Substrate Cleaning Machine. Zhu Wendeng, Li Junpeng and Zhong Guochang developed the invention. The patent application number is CN202610622533 20260508. The patent publication number is CN122184027 ..

Semiconductor

  |  Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Jiangsu Shineng New Energy Tech Co Ltd patent application for Crushed Material Discharging Type Silicon Material Cleaning Device. Yuan Hui, Cheung Hocheung and Wang Huameng developed the invention. The patent application number is CN202610615637 2026..
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