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Semiconductor
| Wed 26 Aug 2026
Beijing, Aug. 27 -- Suzhou Liangsai Tech Co Ltd has submitted a patent application for Laser to Packaging Structure and Packaging Method Thereof. Luo Shirui, Im Chang-yeol, Yang Xiaojie and Ye Xiaojun developed the invention.
The patent application number is CN202610473070 20260410. The patent publication number is CN12215904..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Luohe Technician College has been granted a patent for Semiconductor Packaging Test Platform Suitable for Various Specifications. This invention was developed by Hong Yang, Xu Jiangxin and Zhao Hongjie.
The patent application number is CN202422136565U 20240902. The patent publication number is CN223581986 ..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Yantai Penglai Yike Juda Electronic Tech Co Ltd has been granted a patent for Laser Packaging Base. This invention was developed by Gao Guangwei and Gao Chen'en.
The patent application number is CN202422829961U 20241120. The patent publication number is CN223583479 (U). International Patent Classification ..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Huaxin Micro Semiconductor Tangshan Co Ltd has filed a patent application for Semiconductor Equipment Packaging Production Line Scheduling Method, Device and Equipment. This invention was developed by Li Lei.
The patent application number is CN202610167546 20260205. The patent publication number is CN12215..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Jiangsu Goodwork Microelectronics Tech Co Ltd has been granted a patent for Machining Jig for Micro Diode Packaging. Su Dinan developed the invention.
The patent application number is CN202423104979U 20241217. The patent publication number is CN223584642 (U). International Patent Classification codes are H..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Zhejiang Aiko Solar Tech Co Ltd, Zhuhai Fushan Aiko Solar Tech Co Ltd, Tianjin Aiko Solar Tech Co Ltd, Shandong Aiko Solar Tech Co Ltd and Guangdong Aiko Solar Tech Co Ltd have submitted a patent application for Back Contact Cell and System. Chen Gang, Wang Yongqian and Qiu Xianqi developed the invention.
T..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Guangdong Huaxi Semiconductor Equipment Co Ltd has been granted a patent for Turnover Test Assembly. This invention was developed by Pan Weijie, Liang Jinglun, Zhang Wentao, Jiang Quansheng, Peng Wenfeng and Cho Ho-yong.
The patent application number is CN202422968137U 20241202. The patent publication numb..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Suzhou Manyu Intelligent Tech Co Ltd has been granted a patent for Matrix Type LED Screen. This invention was developed by Qiao Yu and Sun Jiangming.
The patent application number is CN202422987843U 20241204. The patent publication number is CN223582635 (U). International Patent Classification codes are F1..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Tianjin Juhua Electronics Co Ltd has been granted a patent for Surface-mounted Piezoresistor. Zhao Jianyong developed the invention.
The patent application number is CN202422884690U 20241126. The patent publication number is CN223582770 (U). International Patent Classification codes are H01C1/032, H01C1/08..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Taicang Dingyi Semiconductor Tech Co Ltd has been granted a patent for Lead Frame Transition Device. This invention was developed by Luo Wenjun.
The patent application number is CN202422933622U 20241129. The patent publication number is CN223582951 (U). International Patent Classification codes are H01L21/..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Silicon Storage Technology has sought patent for RRAM Memory Cell Structure. This invention was developed by Tkachev Yuri, Zhou Feng, Tran Hieu Van, Liu Xian and Song Yi.
The patent application number is WO2025US31973 20250602. The patent publication number is WO2026173612 (A1). International Patent Classif..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has published Mitsubishi Electric patent application for Semiconductor Device, Package, and Production Method for Semiconductor Device. The invention was developed by Iwai Yuji.
The patent application number is WO2025JP05220 20250217. The patent publication number is W..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Resonac has submitted a patent application for Method for Inspecting Semiconductor Device, and Coating Material. Saiki Shiori and Nakata Mitsuki developed the invention.
The patent application number is WO2025JP05192 20250217. The patent publication number is WO2026172524 (A1). International Patent Classifica..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Idemitsu Kosan has submitted a patent application for Oxide Semiconductor Film and Method for Producing Same, Transistor, Semiconductor Device, Electronic Circuit, Electrical Apparatus, Electronic Apparatus, Vehicle, and Prime Mover. This invention was developed by Tsuruma Yuki, Sunagawa Misa, Tomai Shigekazu,..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Idemitsu Kosan has applied WIPO patent for Oxide Semiconductor Film and Method for Manufacturing Same, Transistor, Semiconductor Device, Electronic Circuit, Electrical Apparatus, Electronic Apparatus, Vehicle, and Power Engine. Tsuruma Yuki, Sunagawa Misa, Tomai Shigekazu, Tamamoto Hiroki, Takahashi Takanori, ..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Idemitsu Kosan has sought patent for Crystal Oxide Semiconductor Film and Method for Producing Same, Transistor, Semiconductor Device, Electronic Circuit, Electrical Apparatus, Electronic Apparatus, Vehicle, and Power Engine. This invention was developed by Tsuruma Yuki, Sunagawa Misa, Tomai Shigekazu, Tamamot..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Idemitsu Kosan has submitted a patent application for Crystal Oxide Semiconductor Film and Method for Producing Same, Transistor, Semiconductor Device, Electronic Circuit, Electrical Apparatus, Electronic Apparatus, Vehicle, and Prime Mover. Tsuruma Yuki, Sunagawa Misa, Tomai Shigekazu, Tamamoto Hiroki, Takaha..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Idemitsu Kosan has submitted a patent application for Crystalline Oxide Semiconductor Film, Production Method for Same, Transistor, Semiconductor Device, Electronic Circuit, Electrical Apparatus, Electronic Apparatus, Vehicle, and Power Engine. Tsuruma Yuki, Sunagawa Misa, Tomai Shigekazu, Tamamoto Hiroki, Tak..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Resonac has submitted a patent application for Slurry, Polishing Method, Component Production Method, and Semiconductor Component Production Method. This invention was developed by Kurata Yuto.
The patent application number is WO2025JP04926 20250214. The patent publication number is WO2026172479 (A1). Interna..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Semiconductor Energy Laboratory has submitted a patent application for Semiconductor Device. This invention was developed by Tezuka Sachiaki, Wakuda Masahiro and Sawai Hiromi.
The patent application number is WO2026IB51196 20260209. The patent publication number is WO2026172212 (A1). International Patent Clas..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has released Semiconductor Energy Laboratory patent application for Electronic Apparatus and Method for Operating Same. This invention was developed by Hatsumi Ryo, Ikeda Hisao, Nakamura Daiki and Nishimura Tomotaka.
The patent application number is WO2026IB51133 20260..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Fraunhofer-Gesellschaft has submitted a patent application for Buffering of Wavelet Transform Coefficients. This invention was developed by Richter Thomas and Fössel Siegfried.
The patent application number is WO2026EP54114 20260216. The patent publication number is WO2026171985 (A1). International Patent ..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- ROCKWOOL has submitted a patent application for Growth Substrate Unit for Crops. This invention was developed by Schols Floris Olivier, Haenen Joost, Helderman Mario Silvester, Hochstenbach Jip and Puksic Federico.
The patent application number is WO2026EP54011 20260213. The patent publication number is WO202..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has released ams OSRAM patent application for Semiconductor Device Package and Method for Forming a Semiconductor Device Package. This invention was developed by Chan Yuan-ju.
The patent application number is WO2026EP53908 20260213. The patent publication number is W..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Nexperia has submitted a patent application for a Power Semiconductor and a Method of Manufacturing Thereof. This invention was developed by Poelma Regnerus Hermannus, Sun Quan and Liu Xu.
The patent application number is WO2026EP53773 20260212. The patent publication number is WO2026171831 (A1). Internationa..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Henkel has submitted a patent application for Material Buffer and System for Conveying and Metering a Viscous Material. This invention was developed by Baldauf Guenter, Schneider Pascal and Metzler Mario.
The patent application number is WO2026EP53664 20260211. The patent publication number is WO2026171776 ..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Credoxys GmbH has applied WIPO patent for Organic Light-emitting Diode and Method to Produce Such an Organic Light-emitting Diode. Samigullina Dinara and Stolz Julia developed it.
The patent application number is WO2025EP86377 20251210. The patent publication number is WO2026171390 (A1). International Paten..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Huizhou Jufei Optoelectronics has applied WIPO patent for Light-emitting Apparatus. Ma Wenbo, Sun Pingru and Xing Meizheng developed it.
The patent application number is WO2026CN78106 20260210. The patent publication number is WO2026171128 (A1). International Patent Classification code is H10H20/855. Cooper..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Hangzhou Microquanta Semiconductor Corporation Ltd has submitted a patent application for Dihydroacridine Bridged Self-assembled Molecular Material and Preparation Method Therefor, and Preparation Method for Perovskite Module. This invention was developed by Zhang Shengxiong, Cao Guang, Yan Buyi and Yao Jizhon..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Westlake Smoky Mountains Tech Hangzhou Co Ltd has submitted a patent application for Semiconductor Structure and Preparation Process Therefor, and Light-emitting Array and Preparation Process Therefor. This invention was developed by Yang Jun.
The patent application number is WO2025CN77147 20250213. The pat..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Samsung Electronics has submitted a patent application for Memory Device with Parity Block Allocation. Choi Jin-yong, Kim Ki-heung, Shin Hoon, Yoo Jae-il and Seol Ho-seok developed the invention.
The patent application number is CN202511798478 20251202. The patent publication number is CN122157748 (A). Int..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Henan University of Science and Technology has sought patent for Automatic Design and Parameter Optimization System for SRAM (Static Random Access Memory) Circuit in In-memory Computing Architecture. This invention was developed by Meng Qingduan, Liu Tianyu, Zhang Jincan, Liu Bo, Wang Jun and Jia Longtao.
..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Shanghai Laiao Electronic Tech Co Ltd has received a patent for Integrated Circuit Protection Shell. This invention was developed by Xing Zhenqing.
The patent application number is CN202423142989U 20241219. The patent publication number is CN223584508 (U). International Patent Classification codes are H05K..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Huizhou Jingbaide Tech Co Ltd has been awarded a patent for Led Front Maintenance Bottom Shell and LED Front Maintenance Kit. This invention was developed by Wang Shitong, Wang Shaowu, Li Rencong, Wang Fuchang and Chen Lin.
The patent application number is CN202422951122U 20241129. The patent publication n..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Chinese Patent for Surface Acoustic Wave Resonator has been issued to Henan Kezhicheng Third Generation Semiconductor Carbon Based Chip Co Ltd. This invention was developed by Huang Xin, Liang Yu, Yang Jinfei, Liu Jiaqi and Wang Youzhi.
The patent application number is CN202422972054U 20241203. The patent ..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Xince Shenzhen Semiconductor Co Ltd has obtained a patent for chip particle test production line. This invention was developed by Guo Jibo.
The patent application number is CN202422877980U 20241125. The patent publication number is CN223582945 (U). International Patent Classification codes are H01L21/66, H..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Chinese Patent for Hard Disk Data Memory Monitoring Device has been issued to Beijing Wangyuanfeng Tech Co Ltd. This invention was developed by Feng Wei.
The patent application number is CN202422751495U 20241112. The patent publication number is CN223582687 (U). International Patent Classification codes ar..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Huajie Intelligent Tech Suzhou Co Ltd has obtained a patent for chip test probe. This invention was developed by Cao Huijie.
The patent application number is CN202520452027U 20250314. The patent publication number is CN223582021 (U). International Patent Classification codes are G01R1/067 and G01R31/28.
..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Chinese Patent for Inspection Device for LED Screen Production has been issued to Beijing Zhaochi Photoelectric Tech Co Ltd. This invention was developed by Jing Xianwei and Wang Dan.
The patent application number is CN20252017357U 20250106. The patent publication number is CN223581336 (U). International P..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Univ Catolica San Pablo has filed a patent application for Method for 3D Printing Silicon Carbide Parts Using Carbon Preforms and 3D Printing Device. This invention was developed by Bringas RodrÃguez Verónica Cecilia, Palomino Ñaupa Cris Katherin, Grande Ccalla Juan Carlos and Huaman Mamani Fredy Alberto.
..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has published NGK Corp patent application for Semiconductor Device Substrate and Method for Producing Semiconductor Device Substrate. The invention was developed by Kaku Takeshi, Masuda Izumi and Ebigase Takashi.
The patent application number is WO2026JP04179 2026020..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Indian Instituite Technology Bombay has sought patent for Dual Solar Cell Albedo Meter and Method of Manufacturing Dual Solar Cell Albedo Meter. This invention was developed by Kotantarayer Arvind and Sunil Stephen P.
The patent application number is CN20251244469 20251231. The patent publication number is..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Hefei Zhongying Electronics Co Ltd has submitted a patent application for Single-cycle Control Digital Power Factor Correction Module Based on Chip Platform. This invention was developed by Chen Haowen and Wan Xiang.
The patent application number is CN202610331686 20260318. The patent publication number is..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Shandong Shanke Lanxin Solar Energy Tech Co Ltd has applied Chinese patent for Method and System for Controlling Power Generation of Multiple Pvt Solar Cell Panels. Zhang Mingyin, Zhao Tingting and Ren Shiyi developed it.
The patent application number is CN202610301578 20260312. The patent publication numb..
Semiconductor
| Wed 26 Aug 2026
Beijing, Aug. 27 -- Changzhou Winpark Electronics Co Ltd has applied Chinese patent for Surge Protection Circuit and Protection Method Based on Bidirectional Silicon Controlled Rectifier. Zhou Congwen, Bao Hongbin and Fu Daozhi developed it.
The patent application number is CN202610324395 20260317. The patent publication numb..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has released Chengdu BOE Optoelect Tech Co, Beijing BOE Technology Dev Co Ltd and BOE Technology Group patent application for Touch Display Substrate and Manufacturing Method Therefor, Touch Method, and Device. This invention was developed by Du Zhongbo and Yang Xi.
..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Sabers Co Ltd has sought patent for Temporary Bonding and Debonding Method, Preparation Method for Composite Substrate, and Manufacturing Method for Wafer. This invention was developed by Mu Fengwen, Feng Ce, Tan Xianghu and Liu Fuchao.
The patent application number is WO2026CN74386 20260123. The patent pub..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Picmore Tech Suzhou Ltd and Picmore Tech Pte Ltd have submitted a patent application for Micro-ring-assisted Mzi Wavelength Division Multiplexer and Chip. This invention was developed by Li Chenguang, Li Xianyao and Guo Defen.
The patent application number is WO2026CN73713 20260120. The patent publication n..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has published Univ Tsinghua and Beijing Superstring Academy of Memory Technology patent application for DRAM Cell Structure, Three-dimensional DRAM Array Structure, Operation Method Therefor, and Semiconductor Apparatus Comprising Same. The invention was developed by Pa..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has received Picmore Tech Suzhou Ltd and Picmore Tech Pte Ltd patent application for Photonic Integrated Circuit Chip. Li Xianyao, Ji Mengxi and Ding Chuanyang developed the invention.
The patent application number is WO2025CN144237 20251222. The patent publication n..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Shanghai Weishi Semiconductor Co Ltd has sought patent for Preparation Method for High-voltage Resistant Chip, and High-voltage Resistant Chip. This invention was developed by Chen Han, Gu Weidong, Ding Bo, Wang Chao, Hang Haiyan, Zhang Wei, Hou Jinsong and Zhi Peng.
The patent application number is WO2025C..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has released Shenzhen Phenosolar Tech Co Ltd patent application for Perovskite Thin Film Manufacturing Method and Apparatus, and Perovskite Solar Cell Module. This invention was developed by Fang Dafu and Wang Jiantao.
The patent application number is WO2025CN87279 2..
Semiconductor
| Wed 26 Aug 2026
Alexandria, Aug. 27 -- US Biofilm LLC has sought patent for Method for Creating a Beneficial Biofilm on a Hydrophilic Substrate for Use as a Soil Conditioner. This invention was developed by Cude Johnny William.
The patent application number is US202619646333 20260413. The patent publication number is US20260240170 (A1). Inte..
Semiconductor
| Wed 26 Aug 2026
Alexandria, Aug. 27 -- Biocompatibility Innovation SRL has applied United States patent for Method for Imparting Antimicrobial Properties to a Synthetic Substrate. Naso Filippo, Gandaglia Alessandro, Russo Laura, Stefanelli Ugo, Sturaro Giulio and Nicotra Francesco developed it.
The patent application number is US202319164721..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Dongguan Senguang Photoelectric Tech Co Ltd has submitted a patent application for Keyboard Backlight Module Manufacturing Method Based on Pre-packaged Light-emitting Chip. This invention was developed by Li Senlin.
The patent application number is CN202610375586 20260325. The patent publication number is ..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Hangzhou Zhongtan New Mat Co Ltd has applied Chinese patent for High-specific-volume Chip Tantalum Capacitor and Preparation Method Thereof. Zhang Dongjing developed it.
The patent application number is CN202610443074 20260407. The patent publication number is CN122158345 (A). International Patent Classifi..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has released Hefei Kangxinwei Storage Tech Co Ltd patent application for Fixed-point Power Failure Test Method for Storage Chip and Storage Medium. This invention was developed by Li Gang and Wang Wenxuan.
The patent application number is CN202610263857 20260305...
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Hefei High Tech Zone Rhythm Space Design Studio India Workshop has submitted a patent application for Phonetic Sequence Generation Method and Device for String-free Musical Instrument, and Chip. Chen Ping developed the invention.
The patent application number is CN202610485767 20260414. The patent publicat..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Chengdu BOE Optoelectronics Technology and BOE Technology Group have submitted a patent application for Display Substrate and Display Device. Liu Tingliang, Shu Xiaoqing, Zhang Yi, Ma Hongwei and Yang Huijuan developed the invention.
The patent application number is CN202610275077 20220223. The patent publ..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Wuxi Yingwei Innovation Tech Development Co Ltd and Shenzhen Yingwei Innovation Microelectronics Co Ltd have filed a patent application for Image Processing Method and System, Chip and Storage Medium. This invention was developed by Fu Hao, Liu Yichen, Luo Jialong, Pan Guanghua and Zhang Jiehua.
The patent..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has released Shenzhen Biaowang Ind Equipment Co Ltd patent application for Semiconductor Chip Defect Detection Method, Device, Equipment and Storage Medium. This invention was developed by Li Bo, Pan Yongpeng, Huang Zinan and Huang Aike.
The patent application nu..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has published Wuxi Silicon Semiconductor Tech Co Ltd patent application for Method for Detecting and Measuring Edge Breakage in Wafer Cutting Process. The invention was developed by Liu Lei and He Chunyan.
The patent application number is CN202610114322 20260128...
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Zhoushan Donghai Microchip Ocean Digital Science Research Instituite has applied Chinese patent for Document Time Sequence Account Book Consistency Risk Prediction and Block Chain Verification System and Method. Sun Weihao and Huang Yadong developed it.
The patent application number is CN202610335726 20260..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has received China Mobile Suzhou Software Tech Co Ltd and China Mobile Communications patent application for Architecture Search Method for Quantum Neural Network, Electronic Equipment, Chip and Storage Medium. Qian Ling, Zhao Jingjing, Cai Dunbo and Zhang Runqing d..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Jiangxi Datang International New Energy Co Ltd and Datang Regeneration Energy Test Research Instituite Co Ltd have applied Chinese patent for Brain-like Chip Hardware Acceleration Method and System. Liu Yangguang, Yang Wenbiao, Sun Xinning, Tang Miao, Wu Wu, Ren Chaoyu, Lin Hengfeng, Peng Yuxuan, Gao Xiang, W..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Jiangsu Yourun Microelectronics Co Ltd has submitted a patent application for Ai-based Multi-dimensional Wafer Defect Detection Method. Chen Delin, Shi Huaping, Lu Xinchen and Chen Tingting developed the invention.
The patent application number is CN202610264746 20260305. The patent publication number is C..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has awarded a patent to Shanghai Pudate Equipment Tech Co Ltd, Shanghai Pudate Semiconductor Equipment and Pudate Semiconductor Equipment (Xuzhou) for Silicon Wafer Texturing Machine. Song Hao developed the invention.
The patent application number is CN2025202918..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Jiangsu Xianghuan Tech Co Ltd has been granted a patent for Single-side Chemical Treatment Device for Solar Cell Silicon Wafer. This invention was developed by Ji Jingjia, Qin Yusen, He Ruiyong, Lu Yibo and Zhou Guohua.
The patent application number is CN202423105242U 20241216. The patent publication numbe..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has awarded a patent to Yidefa Guan Electronic Tech Co Ltd for Chip Mounting Debugging Platform of Chip Mounter for Circuit Board Processing. Zu Mingcheng and Li Qi developed the invention.
The patent application number is CN202422729051U 20241109. The patent pub..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Shenzhen Xinwei Electronic Tech Co Ltd has been granted a patent for Substrate Shielding Cover of Vehicle-mounted Liquid Crystal Screen Module. This invention was developed by Fang Yong, Yan Kai, Huang Ruiqing and Xue Dengping.
The patent application number is CN20242365680U 20241212. The patent publicatio..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Shenzhen Zhihui Chuangxin Electronics Co Ltd has been awarded a patent for Clamping Type Voltameter Chip. This invention was developed by Zhao Bangnan.
The patent application number is CN202422736643U 20241111. The patent publication number is CN223584498 (U). International Patent Classification codes are ..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Shenji Semiconductor Tech Xuzhou Co Ltd has obtained a patent for heating control device for semiconductor device. This invention was developed by Wang Yiming.
The patent application number is CN202423117787U 20241217. The patent publication number is CN223584349 (U). International Patent Classification co..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Lingmai Acoustics Shenzhen Tech Co Ltd has been granted a patent for PCB (Printed Circuit Board) Side Sound Inlet Silicon Microphone. This invention was developed by Zou Wei, Zhao Yanhai, Li Dongfang, Chen Ruili and Luo Jianqiu.
The patent application number is CN202422977633U 20241204. The patent publicat..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Guangdong Renda Tech Co Ltd has received a patent for Link Encryption Device Based on S0C Chip. This invention was developed by Wu Guoping.
The patent application number is CN202423263519U 20241227. The patent publication number is CN223584211 (U). International Patent Classification codes are B08B17/04, G..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Yunnan Detong Tech Co Ltd has been awarded a patent for Four-channel Single-laser Micro-ring 56g Chip. This invention was developed by Xiao Xiao, Shan Li and Li Xueshuai.
The patent application number is CN202423217407U 20241225. The patent publication number is CN223584189 (U). International Patent Classi..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Yunnan Detong Tech Co Ltd has been awarded a patent for Four-channel Single-laser MZI56G Chip. This invention was developed by Xiao Xiao, Shan Li and Li Xueshuai.
The patent application number is CN202423216286U 20241225. The patent publication number is CN223584188 (U). International Patent Classification..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has awarded a patent to Suzhou Tongxinyuan Semiconductor Tech Co Ltd for Semiconductor Chip Lead Frame Leadframe Depression Bar Assembly. Liu Ke developed the invention.
The patent application number is CN202423136233U 20241218. The patent publication number is C..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Chinese Patent for Transferring Equipment of Photovoltaic Silicon Wafer Coating Jig has been issued to Zhuhai Hongjun New Energy Co Ltd. This invention was developed by Zhang Wei, Hou Hongtao, Li Changhong and Jiang Qingtang.
The patent application number is CN202520283412U 20250221. The patent publication..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has awarded a patent to Kunshan Maipuen Prec Components Co Ltd for Stop Mechanism of Semiconductor Device. Sheng Zekui developed the invention.
The patent application number is CN202422932049U 20241129. The patent publication number is CN223582967 (U). Internatio..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Chinese Patent for Semiconductor Chip Manufacturing Vacuum Device has been issued to Wuhu Lide Zhixing Semiconductor Co Ltd. This invention was developed by Zhao Ding, Ge Shijian and Qin Chuan.
The patent application number is CN202422755117U 20241112. The patent publication number is CN223582950 (U). Inte..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Yunzhonggu Intelligent Tech Suzhou Co Ltd has received a patent for Semiconductor Silicon Optical Wafer Multichannel Photoelectric Performance Test Equipment. This invention was developed by Zhang Baohua, Xiong Lianjun and Huang Xiaohua.
The patent application number is CN20242322922U 20241209. The patent ..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Wuxi Xinyuanwei Tech Co Ltd has been granted a patent for Integrated Circuit Chip Burning Device Based on Image Alignment Detection. Qing Xiaozheng developed the invention.
The patent application number is CN202423191781U 20241224. The patent publication number is CN223582470 (U). International Patent Clas..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Wuxi Xinyuanwei Tech Co Ltd has secured a patent on Integrated Circuit Chip Batch Burning Jig with Positioning and Pressing Mechanism. Sun Yanyan developed the invention.
The patent application number is CN202423191773U 20241224. The patent publication number is CN223582469 (U). International Patent Classi..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has awarded a patent to Henan Shijia Photons Tech Co Ltd for Planar Optical Waveguide Chip Suitable for High-power Coupling. Zheng Zhiyuan, Zhao Shurui, Zheng Wei, Wang Jinghui, Hong Qian and Chang Xiasen developed the invention.
The patent application number is ..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Chinese Patent for High-purity Silicon Carbide Ceramic Part Detection Device has been issued to Hangzhou Herui Semiconductor Tech Co Ltd. This invention was developed by Hu Xiaowen, Wang Xin and Lu Chunmao.
The patent application number is CN20242343470U 20241210. The patent publication number is CN2235816..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Suzhou Guangjun Heyue Information Tech Co Ltd has received a patent for Testing Device for Chip Packaging. This invention was developed by Yang Huajie and Zhang Hui.
The patent application number is CN20242335654U 20241210. The patent publication number is CN223581618 (U). International Patent Classificati..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has received La Luce Cristallina Inc patent application for Single-domain A-oriented Epitaxial Barium Titanate on Silicon or Silicon-on Insulator Substrates. Posadas Agham developed the invention.
The patent application number is WO2026US12713 20260127. The patent pu..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Tokyo Electron Ltd and Tokyo Electron US Holdings have sought patent for Bonding Method Using a Variable Thickness Layer. This invention was developed by Murphy Michael, Son Ilseok and Netzband Christopher Michael.
The patent application number is WO2025US49561 20251006. The patent publication number is WO2..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Derkwoo Semitech Co Ltd and Derkwoo Electronics Co Ltd have filed a patent application for Apparatus and Method for Manufacturing Semiconductor Using Surface Charge of Semiconductor Substrate. This invention was developed by Kim Ki-bum, Lee Jin Seong and Chang Hun.
The patent application number is WO2026KR0..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has published Quantum Imaging Co Ltd patent application for Apparatus for Inspecting Through-holes of Glass Substrate by Using Complex Optical System. The invention was developed by Jo Sung Ho.
The patent application number is WO2025KR19235 20251120. The patent publi..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has received Hana Micron Inc patent application for Optical Semiconductor Package and Manufacturing Method Therefor. Park Geun Woo, Lim Jae Sung, Kim Kwangil, Jang Yong Gyu and Bae Seojun developed the invention.
The patent application number is WO2026KR01751 2026012..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has published Tanigurogumi Corp patent application for Manufacturing Device and Manufacturing Method for Fine Solder Pattern Formation Substrate. The invention was developed by Watanabe Genzo and Taniguro Katsumori.
The patent application number is WO2026JP04939 2026..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Nanjing Yitai Microelectronics Tech Co Ltd has submitted a patent application for Method for Realizing Efficient General Reed-solomon Decoder on Chip. This invention was developed by Zhang Beirong, Yue Leiting, Shi Xin, Yu Chunxia and Chi Weilong.
The patent application number is CN202610297542 20260312. T..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Chengdu Weiguang Jidian Tech Co Ltd has applied Chinese patent for Column-level Latch Module, Analog-to-digital Converter and Image Sensor. Chen Fei, Xia Tian, Wang Yong, Chu Xingmeng and Cai Hua developed it.
The patent application number is CN202610240126 20260228. The patent publication number is CN1221..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has released Hunan Greatwall Galaxy Tech Co Ltd patent application for Double-edge Sampling Circuit, Sampling Method, Integrated Circuit Chip and Electronic Equipment. This invention was developed by Deng Jie, Yang Zeyu, Li Boya, Gong Guohui and Zou Zhichao.
The ..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Shanghai Chipanalog Microelectronics Co Ltd has applied Chinese patent for Spread Spectrum Circuit, Power Supply System, Chip and Electronic Equipment. Shi Guangda, Sun Wei and Chen Dongpo developed it.
The patent application number is CN202610229926 20260226. The patent publication number is CN122159866 (..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Chen Xiaoliang has filed a patent application for Man-machine Interaction Double-control Intelligent Switch Control Device, Control Method and Chip.
The patent application number is CN202610217267 20260215. The patent publication number is CN122159849 (A). International Patent Classification codes are H03..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has released Shenzhen Huaqiang Electronic Network Group Co Ltd patent application for ESD Collaborative Integration Method for Gaas Radio Frequency Integrated Circuit. This invention was developed by Pan Shufeng, Xu Li and Huang Chongfa.
The patent application nu..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Sungrow Power Supply Jiangsu Co Ltd has submitted a patent application for Control Method, Soft Switching Control Loop, Module, System, Equipment and Chip. Xu Ye, Kong Fanbo, Li Haitao, Cheng Lin and Liu Zhibo developed the invention.
The patent application number is CN202411776990 20241204. The patent pub..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Zhiqu Power Dongguan Co Ltd has submitted a patent application for Full-direct-drive Stacking and Aligning Mechanism for Mounting Silicon Steel Sheets on Iron Core. This invention was developed by Liu Peng, Wang Chengtang and Chen Tianming.
The patent application number is CN202610269692 20260306. The pate..
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