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Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Xinchaoliu Zhuhai Tech Co Ltd has applied Chinese patent for Universal Calibration Circuit for High-speed Serdes Chip and Working Method Thereof. Zheng Lin, Zhao Xuehui and Wang Tao developed it.
The patent application number is CN202610342031 20260319. The patent publication number is CN122092880 (A). Int..
Semiconductor
| Fri 14 Aug 2026
Beijing, Aug. 14 -- Cangzhou Zhongtie Equipment Manufacturing Materials has been granted a patent for Track Trolley with Buffer Mechanism. This invention was developed by Sun Tao, Xie Shuliu, Liu Huigang, Mu Zhibao, Ma Hui, Duan Geng, Liu Longteng, Liu Chenglong, Ren Shuyin, Zhang Guoliang and Li Zhizhen.
The patent applicati..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 13 -- Dongguan Paibo Tech Co Ltd and Shenzhen Paibo Tech Co Ltd have applied Chinese patent for Prefabricated Solder Assembly, Heat Sink Device and Semiconductor Component. Tang Shen, An Yi and Qin Taimeng developed it.
The patent application number is CN202610135580 20251121. The patent publication number is CN..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 13 -- Dongguan Paibo Tech Co Ltd and Shenzhen Paibo Tech Co Ltd have applied Chinese patent for Prefabricated Solder Assembly, Heat Sink Device and Semiconductor Component. Tang Shen, An Yi and Qin Taimeng developed it.
The patent application number is CN202610135576 20251121. The patent publication number is CN..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has received Spreadtrum Semiconductor (Nanjing) patent application for Channel Blind Detection Method and Device, Computer Equipment, Chip and Chip Module. Chen Yanbo developed the invention.
The patent application number is CN202610205108 20260211. The patent publ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has released Nanjing University patent application for Quantum Remote Cloning Method and System Based on Integrated Photon Chip. This invention was developed by Ma Xiaosong, Wen Zicong and Wang Kai.
The patent application number is CN20261088384 20260122. The paten..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has released Shanghai Meiren Semiconductor Co Ltd patent application for Carrier Communication Circuit, Chip and System. This invention was developed by Xia Zhao.
The patent application number is CN202411633368 20241114. The patent publication number is CN1220929..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Spreadtrum Semiconductor (Nanjing) has submitted a patent application for Data Compression Method and Device, Computer Equipment, Chip and Chip Module. This invention was developed by Wang Chang, Wang Yizhu, Luo Jiaxing, Yan Lei, Wang Min and Wang Xiaopeng.
The patent application number is CN202610255002 202..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Spreadtrum Semiconductor (Nanjing) has submitted a patent application for Data Compression Method, Device and Equipment, Chip and Chip Module. This invention was developed by Ren Nana, Qian Heyue, Yuan Hongli, Dai Yunpeng, Teng Yin and Lu Huan.
The patent application number is CN202610164497 20260204. The pa..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Taiwan Semiconductor Manufacturing and Global Unichip patent application for Digital-to-analog Converter. The invention was developed by Cai Huiwen and Wang Dinghao.
The patent application number is CN202411697226 20241126. The patent publication nu..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Shenzhen Sibrood Microelectronic Co Ltd has applied Chinese patent for Phase Discriminator Circuit, Phase Discriminator Chip and Clock Data Recovery Circuit. Chen Tao, Liu Fanhong and Zhang Chunhua developed it.
The patent application number is CN202610551289 20260424. The patent publication number is CN12..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Hefei University of Technology has applied Chinese patent for High-frequency Driving System of Power Semiconductor Device. Zhang Haotian, Deng Erping and Wu Lixin developed it.
The patent application number is CN202511992518 20251226. The patent publication number is CN122092840 (A). International Patent Cla..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- SK Hynix has filed a patent application for Duty Cycle Monitoring Circuit and Semiconductor Device Using Same. This invention was developed by Park Hyun Kyu, Xu Yanghao and Zhang Dongxu.
The patent application number is CN202510514135 20250423. The patent publication number is CN122092834 (A). International ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Xiamen Yixinyuan Semiconductor Tech Co Ltd has filed a patent application for Quick Response Rssi Circuit, High-speed Burst Mode Transimpedance Amplifier Chip and Optical Receiving Module. This invention was developed by Tu Hanghui, Luo Wenyu, Li Jinghu and Chen Fujie.
The patent application number is CN20..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Xincun Technology (Wuhan) patent application for Forming Method of Semiconductor Device and Semiconductor Device. The invention was developed by Liu Jun, Ya Dian Bao Luo, Song Xiaojie, Xiao Shengquan, Liu Guoqiang and Wu Wenhao.
The patent application..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Hefei Ruike Micro Electronic Co Ltd has submitted a patent application for Single Integrated Circuit. This invention was developed by Chen Zezhi, Chen Chaoyang, Zhang Wenxiong and Lyu Zhichao.
The patent application number is CN202610212622 20230919. The patent publication number is CN122094115 (A). Intern..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Beijing Integrated Circuit Equipment Innovation Center Co Ltd has applied Chinese patent for Gate-all-around Dynamic Memory, Process Method Thereof and Semiconductor Process Equipment. Liu Mingxuan, Ping Yanlei and Shi Xiaoping developed it.
The patent application number is CN20261042626 20260113. The pate..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- SK Hynix has filed a patent application for Semiconductor Device. This invention was developed by Kim Dong-soo and Park Jung-woo.
The patent application number is CN202510632910 20250516. The patent publication number is CN122094104 (A). International Patent Classification codes are H10B12/00, H10D30/60, H10..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published ChangXin Technology Group patent application for Preparation Method of Semiconductor Structure and Semiconductor Structure. The invention was developed by Ren Peng.
The patent application number is CN202411679081 20241121. The patent publication numbe..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Yangtze Memory Holdings Co Ltd patent application for Semiconductor Structure and Preparation Method Thereof, and Semiconductor Device. The invention was developed by Huo Zongliang, Jin Lei, Liu Gang and Xu Feng.
The patent application number is CN2..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Jiangsu Fukesi Tech Co Ltd patent application for Semiconductor Chip Pasting Device for Automobile Data Recorder Processing. The invention was developed by Song Haoting, Chen Guangjin and Deng Lixiang.
The patent application number is CN202610347087..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Cohpros Int Co Ltd has filed a patent application for Substrate Processing Method and Device and Processed Substrate. This invention was developed by Lin Shih-sheng and You Zhiwei.
The patent application number is CN202411689836 20241125. The patent publication number is CN122094025 (A). International Pate..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Wuxi Zhongxing Micro System Technology has submitted a patent application for PCB Circuit Board, Layout Method and Chip. This invention was developed by Pan Minghua and Sun Xiangnan.
The patent application number is CN202610214811 20260213. The patent publication number is CN122094022 (A). International Pate..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has released ASML Netherlands patent application for Laser System for Source Material Conditioning in EUV Light Sources. This invention was developed by Fomenkov Igor Vladimirovich, Tao Yezheng and Rafac Robert J.
The patent application number is CN202610213710 2..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Shanghai Xianfeng Tech Co Ltd has submitted a patent application for Static Electricity Removing Device for Substrate. Chen Junhong, Chuang Chih-jen, Lin Zhengyi, Chen Zhihui, Gao Yongqiang, Tang Xinlu and Zhang Junhao developed the invention.
The patent application number is CN202610329509 20260318. The p..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has received Suzhou Wuai Yida Internet Of Things Co Ltd patent application for Low-power Volte Voice Call Management Method and System for Sip Chip. Zhang Shunping, Ouyang Guang and Nie Shilong developed the invention.
The patent application number is CN202610223..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has received Zhejiang Xiandao Ruitai Medical Tech Co Ltd patent application for Asic Chip with Energy Response Self-calibration Module. Wang Bin, Ren Jiahui and Bai Shiqiang developed the invention.
The patent application number is CN202610103065 20260126. The pa..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Chengdu Weiguang Jidian Tech Co Ltd has filed a patent application for Counter Circuit and Image Sensor. This invention was developed by Chen Fei, Xia Tian, Wang Yong, Jiang Sheng and Cai Hua.
The patent application number is CN202610240195 20260228. The patent publication number is CN122093680 (A). Intern..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has received Hefei Haitu Microelectronics Co Ltd patent application for Comparator Circuit and Image Sensor. Wang Wenjing and Liu Zheng developed the invention.
The patent application number is CN20251248783 20251231. The patent publication number is CN122093679 ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Shanghai Yuanshixin Intelligent Tech Co Ltd has submitted a patent application for Automatic Exposure Sampling Control Method of Image Sensor, Image Sensor and Storage Medium. This invention was developed by Hou Licong and Xie Yong.
The patent application number is CN202610546057 20260423. The patent publi..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Spreadtrum Semiconductor (Nanjing) has submitted a patent application for Image Phase Difference Determination Method and Device, Equipment, Chip and Chip Module. This invention was developed by Bai Chunmeng, Chen Huxin, Guo Wenbin, Wang Tao and Huang Chuncheng.
The patent application number is CN20261016451..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Spreadtrum Communications Tianjin Co Ltd patent application for Image Shooting Method, Image Shooting Device, Computer Equipment, Chip and Chip Module. The invention was developed by Yang Hongxing, Yang Jiewei and Ma Ke.
The patent application numbe..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- NVIDIA has sought patent for Application Programming Interface for Allocating Memory to Store Compressed Video. This invention was developed by Maksimo Andrew D A.
The patent application number is CN202511754716 20251126. The patent publication number is CN122093574 (A). International Patent Classification c..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has received Beijing Xiaomi Songguo Elect Co Ltd and Beijing Xiaomi Mobile Software patent application for Task Processing System, Method and Equipment, Storage Medium and Chip. Zhou Chunliang developed the invention.
The patent application number is CN2024117563..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- iSOFT Infrastructure Software has submitted a patent application for Communication Gateway for Realizing Inter-core Cooperation, Data Communication Method and Vehicle-mounted Control Chip. Zhang Lipeng, Gao Huiming and Ni Zhiqiang developed the invention.
The patent application number is CN202610185911 20260..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Fujian Jinshi Energy Co Ltd patent application for Preparation Method of Heterojunction Cell Copper Grid Line Without Electroplating Contact. The invention was developed by He Guangdong, Chen Guixiang and Hu Xingmei.
The patent application number is..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Qidian Photonics Intelligent Tech Private Co Ltd has sought patent for Waveguide Type Photoelectric Detector with Low Polarization Sensitivity, Optical Receiving Chip and Optimized Manufacturing Method. This invention was developed by Qu Jingyu, Xie Chongjin and Li Miaofeng.
The patent application number i..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Inner Mongolia University patent application for Thin Film Solar Cell with Synergistic Passivation and Field Effect Regulation and Control Functions and Preparation Method of Thin Film Solar Cell. The invention was developed by Zhu Chengjun, Cui Yaqing..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Beijing Chaoxian Memory Research Inst has applied Chinese patent for Semiconductor Structure, Semiconductor Structure Preparation Method and Electronic Equipment. Mao Shujuan, Wang Guilei, Zhao Chao and Sun Xianglie developed it.
The patent application number is CN202411697083 20241125. The patent publicat..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has released TDK Microcare GmbH patent application for Integrated Circuit Arrangement with Reduced Injection of Charge Carriers in Semiconductor Substrate. This invention was developed by Shinde Sachin.
The patent application number is CN202511749132 20251126. Th..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- DB HiTek has sought patent for Power Semiconductor Device. This invention was developed by Kim Jaehoon, Liu Chentai and Shin Hong-sik.
The patent application number is CN20251013256 20250106. The patent publication number is CN122094170 (A). International Patent Classification codes are H10D84/40, H10D84/80 ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Suzhou Lingcun Tech Co Ltd has submitted a patent application for Three-dimensional Semiconductor Capacitor Structure and Preparation Method Thereof. This invention was developed by Wu Di, Wu Xuezhao and Chen Jinzhong.
The patent application number is CN20251233832 20251230. The patent publication number i..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- ChangXin Technology Group has submitted a patent application for Semiconductor Structure, Semiconductor Structure Preparation Method and Electronic Equipment. This invention was developed by Liu Mingyuan, Sun Zheng, Yuan Lin and Zhang Ming.
The patent application number is CN202610559824 20260424. The patent..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Sun Yat-sen University has applied Chinese patent for Method for Improving Hole Concentration in P-type Compound Semiconductor. Liu Yang, Yu Yue and Wu Qianshu developed it.
The patent application number is CN202610234481 20260227. The patent publication number is CN122094149 (A). International Patent Classi..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Huawei Technologies patent application for Transistor and Preparation Method Thereof, Chip and Electronic Equipment. The invention was developed by Liu Xiaowei, Liu Shuai, Zhao Chunsong, Li Cheng, Xu Junhao and Liu Bingzhi.
The patent application numb..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has received Hangzhou Puxiguangjing Semiconductor Technology Co Ltd patent application for Humanoid Robot Arm High-load Turn-off Power MOS Structure with Enhanced P-gan Cap Layer. Ding Jinchao, Jiang Fengyi, Ren Na, Yang Qi, Li Jiashuai, Xu Yili and Li Xin developed..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Sanken Electric has sought patent for Nitride Semiconductor Device. This invention was developed by Niwa Ailing, Iwagami Shinichi and Sato Ken.
The patent application number is CN202511653179 20251112. The patent publication number is CN122094133 (A). International Patent Classification codes are H10D30/47 a..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Jinan Jingheng Electronics Co Ltd has filed a patent application for Low-power-consumption High-reliability Schottky Chip with Self-adjusting Injection Efficiency. This invention was developed by Shen Zhongtang, Shi Chaoqun and Wang Hongguang.
The patent application number is CN202610232971 20260227. The p..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Taiwan Semiconductor Co Ltd patent application for Inverted Diode Structure and Manufacturing Method Thereof. The invention was developed by Wu Hourun.
The patent application number is CN202510136435 20250207. The patent publication number is CN1220..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has released Gexin USA Integrated Circuit Technology patent application for Resistor for Group III-V Semiconductor Device. This invention was developed by Raghunathan Umesh S, Rassl Robert J and Raman Arun.
The patent application number is CN202511478954 20251016..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has released Jingpeng Energy Shenzhen Co Ltd patent application for Molecular Co-doped Hole Transport Layer, Preparation Method Thereof and Trans-perovskite Solar Cell. This invention was developed by Lyu Jinqing, Zhang Yekai, Dong Zhiwen and Liu Weifeng.
The pat..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Yicai Xinguang Tech Ningbo Co Ltd patent application for Red and Green Dual-color Miniature Light Emitting Diode Light Emitting Structure and Preparation Method Thereof. The invention was developed by Li Fei and Feng Haoxian.
The patent application ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Chongqing Kangjia Optoelectronic Technology has filed a patent application for Manufacturing Method of Growth Substrate, Growth Substrate and Mass Transfer Method. This invention was developed by Xiao Junlong, Wang Bin, Fan Chunlin, Wang Qing and Wang Yike.
The patent application number is CN202411710587 202..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- BOE Huacan Optoelectronics (Zhejiang) has applied Chinese patent for Preparation Method of Light-emitting Diode Chip and Light-emitting Diode Chip. Wang Huining, Hao Yalei and Zhang Xudong developed it.
The patent application number is CN202610282887 20260310. The patent publication number is CN122094267 (A)..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Jade Bird Display, Shanghai has applied Chinese patent for Micro Light-emitting Pixel Unit and Forming Method Thereof, Micro Light-emitting Diode Chip and Micro Display Panel. Jin Guangrong and Li Jingyue developed it.
The patent application number is CN202411621464 20241113. The patent publication number is..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has received BOE Huacan Optoelectronics (Zhejiang) patent application for Light Emitting Diode Chip and Preparation Method Thereof. Wei Ting, Zhou Yu, Wu Wangjian, Li Shuai, Lou Gaoming and Wang Shun developed the invention.
The patent application number is CN20261..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- BOE Huacan Optoelectronics (Zhejiang) has submitted a patent application for Light Emitting Diode Chip and Preparation Method Thereof. Qian Jiayu, Shi Yuehang, Wang Huining, Shao Guanning, Hao Yalei, Zhang Xudong, Han Yifan and Song Feixiang developed the invention.
The patent application number is CN2026102..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Fuzhou Huazhao Photoelectric Co Ltd has applied Chinese patent for Epitaxial Structure of Dual-wavelength Led Chip and Preparation Method Thereof. Ma Kunwang, Zheng Hang, Chen Bingyang, Zou Shengbin and He Weiqun developed it.
The patent application number is CN202610215874 20260214. The patent publication..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Fucai Optoelectronics Co Ltd has applied Chinese patent for Semiconductor Element and Semiconductor Assembly Including Same. Zheng Shihao, Ye Zhenlong, Zeng Yanjun, Yan Shinan, Song Jun Cheol, Lin Jiahong, Jin Mingda, Jiang Zhengxing, Li Yiqing, Huang Guofeng and Li Shichang developed it.
The patent applic..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Tcl Zhonghuan New Energy Tech Co Ltd has submitted a patent application for Back Contact Solar Cell and Preparation Method Thereof. This invention was developed by Guan Tongzhou, Song Nan and Tang Yiwu.
The patent application number is CN202610549983 20260423. The patent publication number is CN122094247 (..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- TCL Zhonghuan New Energy Tech Co Ltd has submitted a patent application for Back Contact Solar Cell, Preparation Method of Mark Point of Back Contact Solar Cell and Positioning Method of Mark Point of Back Contact Solar Cell. This invention was developed by Guan Tongzhou, Song Nan and Tang Yiwu.
The patent..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- TCL Zhonghuan New Energy Tech Co Ltd has submitted a patent application for Solar Cell, Manufacturing Method of Solar Cell and Photovoltaic Module. This invention was developed by Guan Tongzhou, Song Nan and Tang Yiwu.
The patent application number is CN202610552669 20260423. The patent publication number ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Henan Institute of Engineering has sought patent for High-absorptivity Semiconductor Device Structure Design Method. This invention was developed by Xiong Xicheng, Huang Quanzhen and Li Min.
The patent application number is CN202511262352 20250828. The patent publication number is CN122094227 (A). Internatio..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Shenzhen Xinsaibo Tech Co Ltd has sought patent for Full-automatic Preparation Method and Device of Multi-layer Composite Substrate Photovoltaic Module. This invention was developed by Chen Yuanjun.
The patent application number is CN202610185556 20260209. The patent publication number is CN122094219 (A). ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has received Zhejiang University patent application for Anti-reflection Film for Back Surface of Solar Cell and Preparation Method and Application of Anti-reflection Film. Jin Siyu, Yang Deren, Feng Hailong and Wang Lei developed the invention.
The patent applicati..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Weijia Electromechanical Tech Tianjin Co Ltd has submitted a patent application for Wafer Cleaning Machine for Semiconductor Device Manufacturing. This invention was developed by Xu Bin, Kang Jiajia, Cheng Huanhuan and Yu Hailei.
The patent application number is CN202610197116 20260211. The patent publicat..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Anhui Sixiang Semiconductor Material Tech Co Ltd patent application for Edge Over-polishing Prevention Chemical Mechanical Polishing Equipment for Silicon Wafer Processing. The invention was developed by Zhou Bo, Qin Guoliang, Tao Min and Zhong Weiyi.
..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Suzhou Nanowin Science And Tech Co Ltd has submitted a patent application for Surface Repairing Method, Semiconductor Substrate and Semiconductor Device. Wang Jianfeng, Li Jinjuan and He Lun developed the invention.
The patent application number is CN202610147578 20260203. The patent publication number is ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Anhui Jinglong Semiconductor Tech Co Ltd has submitted a patent application for Epitaxial Method for Improving Crystal Point Defect on Back Surface of Epitaxial Wafer. Zhou Jianxiong and Li Shidong developed the invention.
The patent application number is CN202610193870 20260210. The patent publication num..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Kunyuan Jingke Semiconductor Deyang Co Ltd and Coreway Optech patent application for Method for Preventing Metal Residue Caused by Recess of Photoresist-free Pattern Side Wall of Semiconductor Cooler. The invention was developed by Qiu Tian, Xu Jian an..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has released Inst Advanced Technology Univ Science & Technology China patent application for Antimony-based Solar Cell and Preparation Method Thereof. This invention was developed by Chen Ruizhe and Hu Yue.
The patent application number is CN202610550048 20260424..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Xinzhan Semiconductor Equipment Wuxi Co Ltd has filed a patent application for Silicon Wafer Scrubbing Device. This invention was developed by Gao Wenfeng and Jiang Hao.
The patent application number is CN202610331533 20260318. The patent publication number is CN122094432 (A). International Patent Classifi..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Shenyang Xinli Microelectronic Equipment Co Ltd has sought patent for Wafer Cleaning Device and Wafer Cleaning Method in Wafer De-bonding Process. This invention was developed by Dong Qiushi, Wang Jinlong, Wang Yi, Guan Hesheng, Sun Pu and Wang Mingbo.
The patent application number is CN202610463313 202604..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Suzhou Hualongkun Tech Co Ltd has applied Chinese patent for Chip Transfer Mechanism and Chip Transfer Method. Tan Xuewen, Zhang Maolin and Duan Yuena developed it.
The patent application number is CN202610183801 20260209. The patent publication number is CN122094450 (A). International Patent Classificatio..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Shenzhen Xinkailai Industry Machine patent application for Uncovering Mechanism and Semiconductor Device. The invention was developed by Zhang Pei and Yao Liming.
The patent application number is CN202610123738 20260128. The patent publication number ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has released Shenzhen Mulinsheng Microelectronic Co Ltd patent application for Hot Pressing Sintering Device for Packaging High-power Semiconductor Device. This invention was developed by Zhan Maosheng.
The patent application number is CN202610244420 20260302. Th..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Flow Monitoring Method and Semiconductor Process Equipment. Zhu Chaoyue developed the invention.
The patent application number is CN202610209133 20260212. The patent publication number is CN122094443 (A). International Patent Cla..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has received UVAT Technology patent application for Combined Electrode Plasma Processing System and Method for Performing Plasma Processing by Using Combined Electrode. Lee Won-gil, Lin Daiwei, Lu Zhiming, Liu Pinjun, Liu Zhongjiong and Huang Jialiang developed the ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Research Micro Jiangsu Semiconductor Tech Co Ltd has submitted a patent application for Tray Adjusting Device for Semiconductor Equipment, Mounting Method and Semiconductor Equipment. Wang Fei, Zhao Qia and Qin Zhijian developed the invention.
The patent application number is CN202610564375 20260427. The p..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Shenzhen Xinkailai Industry Machine has submitted a patent application for Lifting Assembly and Semiconductor Process Equipment. This invention was developed by Zhang Yang, Cheng Jie, Yang Jinquan and Zhang Lu.
The patent application number is CN202411698199 20241122. The patent publication number is CN12209..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Ningbo Chengfan Tech Co Ltd has submitted a patent application for Pin Adjusting Device for Integrated Circuit Manufacturing. Cai Yilin and Fu Yunfeng developed the invention.
The patent application number is CN202610224008 20260225. The patent publication number is CN122094542 (A). International Patent Cl..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has received Anxinmei Technology, Hubei patent application for Automatic Wire Welding Device for High-precision Semiconductor Chip. Lu Jinfa developed the invention.
The patent application number is CN202610122350 20260129. The patent publication number is CN122094..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has released Changdian Microelectronics Jiangyin Co Ltd patent application for Packaging Substrate, Chip Packaging Body, Chip Packaging Structure and Preparation Method Thereof. This invention was developed by Zhu Xigang, Wei Ye, Bao Man and Zhang Wenjuan.
The pa..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Chengdu Spaceon Electronics Co Ltd has applied Chinese patent for Three-dimensional Stacked Packaging Substrate Device and Manufacturing Method. Du Runchang, Wang Taolong and Liu Leiji developed it.
The patent application number is CN202610172914 20260206. The patent publication number is CN122094533 (A). ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Samsung Electro-Mechanics has submitted a patent application for Electronic Component Embedded Substrate. This invention was developed by Min Tae-hong, Han Sang-won and Park Jong-eun.
The patent application number is CN202511576625 20251031. The patent publication number is CN122094530 (A). International Pat..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Beijing Huafeng Jixin Electronics Co Ltd has submitted a patent application for Bare Chip Leveling Structure and Preparation Method Thereof, Pre-packaging Module and Preparation Method Thereof, and Chip Packaging Structure and Preparation Method Thereof. This invention was developed by Mao Yucheng, Yang Ying ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Shenzhen Yusite Electronics Co Ltd has submitted a patent application for Process for Manufacturing Redistribution Structure in Integrated Circuit Package. Shi Ming developed the invention.
The patent application number is CN202610251265 20260303. The patent publication number is CN122094523 (A). Internati..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Suzhou Guoxian Innovation Tech Co Ltd has sought patent for Preparation Method of Support Plate Structure, Support Plate Structure and Semiconductor Packaging Structure. This invention was developed by Zhou Yanxu.
The patent application number is CN202610548130 20260423. The patent publication number is CN..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Preparation Method of Packaging Carrier Plate, Packaging Carrier Plate and Semiconductor Packaging Structure. This invention was developed by Zhou Yanxu.
The patent application number is CN202610547260 20260423. The patent publica..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has published Suzhou Guoxian Innovation Tech Co Ltd patent application for Package Carrier, Preparation Method Thereof and Chip Packaging Structure. The invention was developed by Zhou Yanxu.
The patent application number is CN202610546122 20260423. The patent pu..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Suzhou Guoxian Innovation Tech Co Ltd has applied Chinese patent for Manufacturing Method of Glass Substrate, Glass Substrate and Packaging Structure. Zhou Yanxu developed it.
The patent application number is CN202610545956 20260423. The patent publication number is CN122094518 (A). International Patent Cl..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Luoyang Junjiang Building Material Tech Co Ltd has sought patent for Method for Regulating and Controlling Eutectic Reaction Mechanism of Dbc Metal Ceramic Substrate. This invention was developed by Zhou Dawen, Ren Yizhun, Zhao Yanxiang and Luo Wei.
The patent application number is CN202610528520 20260421...
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Jiangsu Fulehua Power Semiconductor Research Inst Co Ltd has sought patent for Copper Deposition Process of DPC Deep-hole Ceramic Substrate. This invention was developed by Guan Pengfei, Wang Bin and Zhou Pengcheng.
The patent application number is CN202610180759 20260209. The patent publication number is ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has released Shennan Circuits Co Limited patent application for Manufacturing Method of Package Substrate and Package Substrate. This invention was developed by Yu Chunhao, Wang Hao and Liu Xiaofeng.
The patent application number is CN20261013966 20260106. The pa..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Beijing Huafeng Jixin Electronics Co Ltd has submitted a patent application for Pre-packaging Module, Preparation Method of Pre-packaging Module, Chip Packaging Structure and Preparation Method of Chip Packaging Structure. This invention was developed by Mao Yucheng, Yang Ying and Hua Fei.
The patent appli..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has released Beijing Huafeng Jixin Electronics Co Ltd patent application for Pre-packaging Module Based on Pre-lamination of Heat Dissipation Cover, Preparation Method of Pre-packaging Module, Chip Packaging Structure and Preparation Method of Chip Packaging Structu..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has released Changfei Advanced Semiconductor Wuhan Co Ltd patent application for Gate Interconnection Structure and Preparation Method Thereof, and Semiconductor Device and Preparation Method Thereof. This invention was developed by Chen Xiaojiang, Yan Shuai, Yang B..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- State Intellectual Property Office of China has received Hubei Jiufengshan Laboratory patent application for Backward Power Supply Photoelectric Interconnection Chip System and Manufacturing Method Thereof. He Junlei, Zhang Jieqiong, Shen Xiao'an and Li Sichao developed the invention.
The patent application ..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- Hangzhou Fuxin Semiconductor has submitted a patent application for Semiconductor Structure and Forming Method of Semiconductor Structure. This invention was developed by Shi Yule, Tian Binwei and Cao Wenkang.
The patent application number is CN202610534905 20260421. The patent publication number is CN122094..
Semiconductor
| Thu 13 Aug 2026
Beijing, Aug. 14 -- SK Hynix has submitted a patent application for Silicon-on-insulator Substrate and Method of Forming Same. Kim Il-do, Kim Seung-bum and Lee Min-young developed the invention.
The patent application number is CN202510303458 20250314. The patent publication number is CN122094475 (A). International Patent Class..
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