Semiconductor
| Sat 07 Nov 2026
Munich, Nov. 6 -- ASML Netherlands has submitted a patent application for Apparatus and Method for Multi-stage Die Bonding. This invention was developed by Dolk Victor Sebastiaan, Assendelft Joep, Venugopalan Syam Parayil, De Jager Pieter Willem Herman, Bustraan Krijn Frederik, Alleleijn Joep Hanni Hub Maria, Sahin Buket, Broers..