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Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Soochow University has applied Chinese patent for Transient Photovoltage Test System and Method with Spatial Resolution. Sun Baoquan, Xiang Zhizhang, Wang Yusheng and Song Tao developed it.
The patent application number is CN202510642002 20250519. The patent publication number is CN120334594 (A). Internati..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Jiangxi Smalite Optoelectronics has submitted a patent application for Deep Red Light Source Preparation Method and High-fitting-degree Full-spectrum Light-emitting Device. Zhang Luhua, Xie Dongsheng, Wang Bin, Zuo Mingpeng and Li Yiyuan developed the invention.
The patent application number is CN202510813..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Heilongjiang University patent application for Single Event Upset Resistant Self-recovery In-memory Computing Unit Design Method Based on SRAM (static Random Access Memory). Li Hongchen, Zhao Xiaofeng and Cao Bei developed the invention.
The patent a..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Wuhan University patent application for Integrated In-situ Real-time Monitoring MPCVD System and Use Method Thereof. Shen Wei, Wu Gai, Yang Dekun, Song Yunfei and Wang Qijun developed the invention.
The patent application number is CN202510571610 202..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received ACRE Coking & Refractory Engineering Consulting Corporation, MCC patent application for Multi-section Type Semi-coke Deep Cooling and Coke Discharging System and Multi-section Type Semi-coke Deep Cooling and Coke Discharging Method. Bai Bin, Xiao Jiansh..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Zhisensor Tech Inc patent application for Z-axis MEMS Closed-loop Accelerometer Assembly and Accelerometer. This invention was developed by Fan Hongbin, Wang Yan, Zhang Gengcheng, Zhou Rui, Zhang Hengji and Luo Peng.
The patent application number is ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Univ Hengyang Normal patent application for Passive Electrostatic Collection Method Radon Measurement System Based on CMOS Image Sensor. This invention was developed by Tan Yanliang, Xie Ruomei, Fan Zhongkai and Yuan Hongzhi.
The patent application n..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Shanghai Iluvatar Chip Semiconductor Co Ltd patent application for Chip, Electronic Equipment and Method for Processing Interruption Between Chip Particles. This invention was developed by Hu Fuping.
The patent application number is CN202510303538 20..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Anhui Anyi Intelligent Equipment Co Ltd patent application for Ceramic Engraving and Milling Machine with Chip Cleaning Function. This invention was developed by Xia Gang, Zhong Zhiming and Zong Chaomei.
The patent application number is CN20251054729..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Shanghai Hanshu Image Tech Co Ltd patent application for High-speed Wafer Separator. This invention was developed by Zhang Weihai and Qian Lei.
The patent application number is CN202510508013 20250422. The patent publication number is CN120325558 (A)..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Tibet Autonomous Region Acad Of Forest Sciences patent application for Seedling Raising Substrate for Juniperus Chinensis and Preparation Method of Seedling Raising Substrate. This invention was developed by Li Bingzhang, Gesang Quzhen, Min Xiaohang, Wa..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Xiaomi Technology, Wuhan, Xiaomi Intelligent Home Appliance Wuhan Co Ltd and Beijing Xiaomi Mobile Software patent application for Control Method and Device of Air Conditioning Equipment, Electronic Equipment, Chip and Medium. This invention was develop..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Ningxia Beici New Material Tech Co Ltd patent application for Preparation Method of Low-oxygen Ultrahigh-thermal-conductivity Aluminum Nitride Substrate. The invention was developed by Xu Xuelei, Shi Liang, Wang Mingqing, Huang Jinxia, Yang Ying, Ma Ji..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Grinm Semiconductor Materials and Grinm Semiconductor Silicon Mat Co Ltd patent application for Method for Controlling Stability of Wide Surface in Isometric Stage of Crystal Orientation Monocrystalline Silicon. This invention was developed by Zhang Hua..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Hefei Zhice Electronic Co Ltd patent application for Device for Measuring Thermal Resistance of Semiconductor Device. The invention was developed by Yang Liangliang and Li Fangkui.
The patent application number is CN202510811486 20250618. The patent..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Junci Electronic Mat Hebei Co Ltd patent application for High-strength Aluminum Nitride Ceramic Substrate and Preparation Method Thereof. The invention was developed by Liu Qingfeng, Liu Jiale, Liu Fupeng, Liu Weihua, Zhang Fengyun, Liu Weimin and Du P..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Liaoning Tuobang Hongji Semiconductor Mat Co Ltd patent application for Process Method for Manufacturing Quartz Filter Assembly for Semiconductor. The invention was developed by Zhang Jian, Zhao Shujun, Xing Hongchao, Li Jingshuang, Wu Jingli, Wang Zha..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Jiangsu Tuoyang Material Tech Co Ltd patent application for Ultra-high-purity Stainless Steel Material for Semiconductor Industry and Processing Technology of Ultra-high-purity Stainless Steel Material. The invention was developed by Yang Shibiao and C..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Northwest Electronic Equipment Tech Research Institute Second Research Institute Of China Electronic patent application for Vehicle Gauge Grade Silicon Carbide Device Power Cycle Test Method. The invention was developed by Liu Wenqing, Zhang Huo, Deng ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Huayouyi Tech Co Ltd patent application for Multi-ray Machine Detection Module of Semiconductor Equipment. The invention was developed by Zhu Junlong and Zheng Jinghong.
The patent application number is CN20241062854 20240116. The patent publication..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Luoyang Changlong Ind Co Ltd patent application for Aluminum Substrate Rapid Drying Device for Production. The invention was developed by Ma Long, Li Danfei and Zang Shiqi.
The patent application number is CN202510674498 20250523. The patent publica..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Boliu Intelligent Tech Nanjing Co Ltd patent application for Low-power-consumption Dual-firmware Chip System and Starting Control Method Thereof, Electronic Equipment and Storage Medium. The invention was developed by Huan Wei, Chen Pengfang, Wang Qiqi..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Zhuhai Tanyun Jingxin Intelligent Tech Co Ltd patent application for Polypeptide Chip Preparation Method and Monitoring Method for Exposure Alignment of Polypeptide Chip. The invention was developed by Wang Jun, Chen Cui, Su Haoxian, Luo Rilang and Li ..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Tianshui Tianguang Semiconductor Co Ltd patent application for Method for Improving Quality of Polycrystalline Silicon Film Layer. The invention was developed by Lu Yu, Zhuang Liqiang, Liu Yunjie, Wang Shigui, Liao Qiang, Cheng Ruiqing, Zhao Haihong, R..
Semiconductor
| Tue 27 Jan 2026
London, Jan. 28 -- UK Patent Office has published Lumet Tech Ltd patent application for Transfer of a Pattern to a Substrate. The invention was developed by Benzion Landa, Yosef Shachak, Jitschak Sanders and Boris Zborovsky.
The patent application number is GB20230011276 20230721. The patent publication number is GB2632019 (A..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Tbstest Tech Co Ltd patent application for Signal Transmission Method Based on Chip Test. Zhang Loulou, Li Hongfei, Zhang Yue, Yang Aimin and Hua Lei developed the invention.
The patent application number is CN202510552918 20250429. The patent public..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Silicon Motion Tech Corp patent application for Flash Memory Controller, Solid-state Storage Device and Method for Monitoring Temperature Information of Solid-state Storage Device. Lee Jun-sung developed the invention.
The patent application number i..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Hefei Chipsea Electronic Tech Co Ltd patent application for Voltage Output Circuit, Chip and Electronic Equipment. Zhu Shoujia, Cai Yan and Liu Shuaifeng developed the invention.
The patent application number is CN202510501596 20250421. The patent pu..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Zhengyang Ronghe Microelectronic Tech Zhuhai Co Ltd patent application for Cathode and Anode Control Method for Horizontal Double-sided Electroplating. Peng Yong and Yang Zhengchao developed the invention.
The patent application number is CN202510494..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Anhui Jixin Microelectronics Tech Co Ltd patent application for Clamp for Chip Electroplating. Zhang Meng, Zhang Jun and Gu Mengtian developed the invention.
The patent application number is CN202510590195 20250508. The patent publication number is C..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Wuxi Huaci New Mat Co Ltd patent application for Modified Silicon Carbide Special Ceramic Material and Preparation Method Thereof. Zhu Wei developed the invention.
The patent application number is CN202510384356 20250328. The patent publication numbe..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Beijing Jingyeyuan New Mat Co Ltd has sought patent for Preparation Method of Metal Toughened Silicon Carbide-silicon Nitride Stemming Material. This invention was developed by Zuo Liangzhu, Zhao Ming and Tian Shixiu.
The patent application number is CN202510625884 20250515. The patent publication number i..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Shenzhen Kaiweida Electronic Co Ltd patent application for Wastewater Treatment Equipment and Method for Chip Production Line. Wu Jianwei developed the invention.
The patent application number is CN202510672053 20250523. The patent publication number..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Tongling Hengxin Guitan New Material Tech Co Ltd has applied Chinese patent for Preparation Method of Modified Nano Silicon Powder for Silicon-carbon Negative Electrode. Zhang Jin, Fang Dawei, Zhang Hongyan and Xu Zhenghe developed it.
The patent application number is CN202510456481 20250411. The patent pu..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Hangzhou Beihang Univ International Innovation Institute Beihang Univ International Innovation Insti has sought patent for LB Assembly Method of TE Nanowires on Different Substrate Surfaces. This invention was developed by Niu Tianchao, Zheng Qiao, Hua Chenqiang and Zhou Miao.
The patent application number..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Taian Senxin Ind and Trade Co Ltd has sought patent for High-sealing Rotary Wood Chip Blanking Device and Using Method. This invention was developed by Zhang Peixing.
The patent application number is CN202310533732 20230512. The patent publication number is CN120328200 (A). International Patent Classificat..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has applied Chinese patent for Broken Line Detection and Roller Surface State Monitoring System Based on Sic Crystal Bar Cutting Process. Yao Zhiyong, Jiang Chengchen and Chen Haibing developed it.
The patent application number is CN202510657756 20250521...
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Hangzhou Zhongwei Photoelectricity Co Ltd, Zhejiang Jingsheng Mechanical & Electrical and Zhejiang Jinray Electronic Mat Co Ltd patent application for Automatic Feeding and Discharging Equipment for Wafer Polishing and Grinding. Xie Longhui, Zhang Zunha..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Jieke Dima Intelligent Equipment Nantong Co Ltd has applied Chinese patent for Centralized Chip Removal Machine for Machine Tool. Li Zhiliang, Nguyen Thi Miaotsui, Li Zhizhen and Cheng Shi developed it.
The patent application number is CN202510749581 20250606. The patent publication number is CN120326425 (..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Hebei Zhitong Hydrogen Clean Tech Co Ltd patent application for Combined Machining Method and System for High-precision Multi-channel Main Shaft of Semiconductor CMP Equipment. Han Xiaoguang, Zeng Fanyong, Mei Lizheng, Jin Pan and Wang Limin developed t..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Shenzhen Yuanke Photoelectric Co Ltd has applied Chinese patent for Automobile Lamp Led Chip Packaging Equipment and Technology. Meng Jun, Huang Zucai, Li Jing, Lin Daiying and Zhong Shilin developed it.
The patent application number is CN202510505746 20250422. The patent publication number is CN120325470 ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Kunshan Maiye Electronic Tech Co Ltd has sought patent for Semiconductor Chip Test Seat and Test Method Thereof. This invention was developed by Zou Anxing.
The patent application number is CN202510586714 20250508. The patent publication number is CN120334716 (A). International Patent Classification code i..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Jiangsu Dongfang Jiutian New Energy Mat Co Ltd patent application for Nickel-plated Steel Strip Electroplating Equipment for Lithium Battery. Liu Junyou and Li Jianzhong developed the invention.
The patent application number is CN202510707100 2025052..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Suzhou Baochen Intelligent Equipment Co Ltd has sought patent for Machine Tool Chip Removal and Cleaning Device for Numerical Control Machine Tool. This invention was developed by Sui Haitao, Sui Haipeng and Zhong Weiye.
The patent application number is CN202510642839 20250519. The patent publication numbe..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Cymer Inc has applied Chinese patent for Catheter System, Radiation Source, Lithographic Apparatus and Methods Thereof. Steiger Thomas Detlef developed it.
The patent application number is CN20238083698 20231106. The patent publication number is CN120322923 (A). International Patent Classification codes ar..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- RNR Labs Inc has applied Chinese patent for Laser Heat Treatment Method of Substrate Structural Body and Preparation Method of Electronic Device Using Laser Heat Treatment Method. Ryu Jeong-do and Kang Sung-ho developed it.
The patent application number is CN20238083715 20231023. The patent publication num..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Univ Wuxi Taihu has sought patent for Non-contact Working Parameter Measurement Method for IGBT (insulated Gate Bipolar Translator) Chip. This invention was developed by Yin Rong, Yang Xinbiao, Jiang Ningning and Gao Wenzhe.
The patent application number is CN202510514671 20250423. The patent publication n..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Suzhou Geju Electronic Tech Co Ltd has applied Chinese patent for Probe Pin Test Equipment of Integrated Circuit Test Socket. Zhao Chengbing developed it.
The patent application number is CN202510479735 20250417. The patent publication number is CN120334712 (A). International Patent Classification codes ar..
Semiconductor
| Tue 27 Jan 2026
London, Jan. 28 -- UK Patent Office has received BOE Technology Group Co Ltd and Chengdu BOE Optoelectronics Technology patent application for Display Substrate and Display Device. Biao Liu, Tinghua Shang, Yixuan Long, Jiaxing Chen and Zuoji Niu developed the invention.
The patent application number is GB20240014229 20220507...
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Zhuhai Tanyun Jingxin Intelligent Tech Co Ltd has applied Chinese patent for Polypeptide Chip Sample Automatic Detection Processing Equipment and Detection Method. Wang Jun, Zhang Liying, Wang Quan, Liao Xitai and Li Yingrui developed it.
The patent application number is CN20241039821 20240110. The patent ..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Guangzhou China Star Optoelectronics Tech Co Ltd has sought patent for Array Substrate and Display Panel. This invention was developed by Xu Hongyuan, Liu Jing, Ge Ru, Li Lizhen and Lin Jiandan.
The patent application number is CN202510638253 20250516. The patent publication number is CN120335205 (A). Inte..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Hanglingwei Taizhou Tech Co Ltd has applied Chinese patent for Cooling Equipment with Uniform Cooling Function for Semiconductor Production. Xu Wenjun, Qian Jin, He Ping and Li Changzhe developed it.
The patent application number is CN202510635305 20250516. The patent publication number is CN120333059 (A)...
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Ningxia JJY Crystal Tech Co Ltd has sought patent for Lithium Tantalate Wafer and Preparation Device and Method Thereof. This invention was developed by Zhang Xuefeng, Xu Qingyan, Liang Shuaijie, Wang Mengfan, Yang Yong, Wang Beibei, Wang Yingxue, Si Jiashun, Zhao Wu and Ji Yaoxing.
The patent application ..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Wuhan Lingjiu Microelectronics Co Ltd has applied Chinese patent for Testing Method and Testing Device for Ip Interface Circuit in GPU Chip. Li Ruipeng, Cheng Cheng, Wang Jiajia, Cheng Zhenhong and Ruan Hang developed it.
The patent application number is CN202510403243 20250401. The patent publication numb..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Shenzhen Anteland Tech Co Ltd has applied Chinese patent for Silicon Wafer Double-sided Exposure Equipment. Chen Naiqi and Xiang Zhenjia developed it.
The patent application number is CN202510734197 20250604. The patent publication number is CN120335255 (A). International Patent Classification code is G03F..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Wenzhou Taiyu New Material Tech Co Ltd has sought patent for Compound Dispersing Agent, Mixed Electroplating Solution and Application. This invention was developed by Xu Zhengli, Shen Qi, Zeng Lang, Li Tongyang and Zhao Wei.
The patent application number is CN20241063874 20240116. The patent publication nu..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Wuyi Jiaheda New Material Tech Co Ltd has applied Chinese patent for High-heat-insulation Nanometer Silicon Heat Preservation Coating and Preparation Method Thereof. Deng Bin and Liu Yizhong developed it.
The patent application number is CN202510515736 20250423. The patent publication number is CN120329804..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Dongguan Xichen Qiming New Material Tech Co Ltd has applied Chinese patent for Organic Silicon Polystyrene Foam for Ultrasonic Sensor and Preparation Method of Organic Silicon Polystyrene Foam. Wang Chonghao, Shang Xiangbing, Li Hao, Li Shuang, Li Dan and Li Wenhuan developed it.
The patent application num..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Suzhou Xudong Construction Eng Co Ltd has applied Chinese patent for Preparation Process of Nano Silicon Dioxide Composite Modified Asphalt. Chen Gang and Xia Zhengbai developed it.
The patent application number is CN202510645730 20250520. The patent publication number is CN120329575 (A). International Pat..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Suzhou Hongdian Semiconductor Tech Co Ltd has filed a patent application for Laser Cutting Device for Manufacturing Semiconductor Processing Equipment Shell. This invention was developed by Li Xiwen, Wang Kang and Pang Fei.
The patent application number is CN202510688256 20250527. The patent publication nu..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Jiangsu H Fast Electronics Co Ltd has filed a patent application for Continuous Laser Precision Cutting Equipment for Ceramic Substrate. This invention was developed by Zhu Liming, Liu Jianguo and Liu Tongfa.
The patent application number is CN202510655266 20250521. The patent publication number is CN12032..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Yueyang Changling Equipment Res Institute Co Ltd has filed a patent application for Silica Powder Filter Stick Regeneration Compound and Technology for Polycrystalline Silicon Production Enterprise. This invention was developed by Yang Cixiong, Lu Hao, Chen An, Li Jiong and Yang Hao.
The patent application..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Coligen China Corp has filed a patent application for Ultrasonic Radar Semiconductor Chip Pin Design Method. This invention was developed by Huang Chengbiao, Lan Xingliang, Lin Zhenkui, Huang Zhiping, Liu Shaoxian, Fu Jie, Liao Wanqiang, Chen Jiaxin, Lin Zhiqi, Peng Bin, He Deren and Jiang Zhiqiang.
The pa..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Li Xiulu has filed a patent application for Storage and Calculation Integrated Chip and Storage Device. This invention was developed by Li Xiulu and Zhu Xiaocong.
The patent application number is CN202510482959 20250417. The patent publication number is CN120336256 (A). International Patent Classification ..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Wang Xiaoyin has filed a patent application for Hardware Chip Temperature Monitoring and Automatic Protection System Based on Artificial Intelligence.
The patent application number is CN202510215146 20250226. The patent publication number is CN120336111 (A). International Patent Classification codes are G0..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Suzhou Junhua Semiconductor Tech Co Ltd has filed a patent application for Full-automatic Wafer Horizontal Electroplating Equipment. This invention was developed by Bao Jie, Li Jiarui and Pang Guoqiang.
The patent application number is CN202510622124 20250515. The patent publication number is CN120330850 (..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Jiangsu Guanlan New Material Tech Co Ltd has submitted a patent application for Rare Earth Doped Silicon Carbide Particle Trap and Preparation Method and Application Thereof. Liu Dengdeng, Sun Min, Peng Hong, Zang Zhicheng, Ma Minglong, Qingshan Yao, Dong Huakai, Jiang Zihao and Chu Xiutang developed the inve..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Li Wenyan has submitted a patent application for Inorganic Silicon Composite Heat Preservation and Sound Insulation Material and Preparation Method Thereof. This invention was developed by Wu Dahua, Li Wenyan, Li Wentao and Li Wenbo.
The patent application number is CN202510547781 20250428. The patent publ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Tiannuo Photoelectric Mat Co Ltd has submitted a patent application for Preparation Method of Easily Dispersed Coated Silicon Nitride Powder. Zhu Yanyan, Li Huayang, Zhang Zheng, Hu Xiaojing, Zheng Jie, Chen Shibing and Li Deshan developed the invention.
The patent application number is CN202510340728 2025..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Zhejiang Jingyue Semiconductor Co Ltd has submitted a patent application for Method and Device for Synthesizing Low-nitrogen-content High-purity Silicon Carbide Powder. This invention was developed by Gao Bing and Li Lujie.
The patent application number is CN202510828181 20250620. The patent publication nu..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Jiangxi Hengyi New Electronic Mat Co Ltd has submitted a patent application for Glass Fiber Substrate Forming Machine. This invention was developed by Zhang Jixiao, Zhai Guitao and Yi Maoqing.
The patent application number is CN202510781947 20250612. The patent publication number is CN120326538 (A). Intern..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Geke Microelectronics Zhejiang Co Ltd has submitted a patent application for Test Method and Test Fixture for Image Sensor Chip Package. This invention was developed by Lu Qun, Huang Zhiping and Zhang Wei.
The patent application number is CN20241069293 20240117. The patent publication number is CN120334704..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has submitted a patent application for Silicon Carbide Wire Cutting Equipment. Zhang Lei, Zhou Zhengfei and Jiang Chengchen developed the invention.
The patent application number is CN202510691278 20250527. The patent publication number is CN120326810 (A)..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Hangzhou Zhongxin Wafer Semiconductor Co Ltd has submitted a patent application for Polishing Pad Structure for Silicon Wafer Grinding and Control Method Thereof. Xu Jiangwei developed the invention.
The patent application number is CN202510290369 20250312. The patent publication number is CN120326521 (A)...
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Aidit Qinhuangdao Digital Dental System Co Ltd has submitted a patent application for Cutting Chip Removal Device and Cutting Machine. This invention was developed by Liu Chen, Hou Dawei and Li Yongjun.
The patent application number is CN202510699411 20250528. The patent publication number is CN120326423 (..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Shanghai DGT Environmental Protection Tech Co Ltd has submitted a patent application for Wood Chip Type Termite Monitoring Equipment with Termite Capturing Mechanism. This invention was developed by Chen Zhifeng.
The patent application number is CN202510621587 20250515. The patent publication number is CN1..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- DRS Network & Imaging Systems Inc has submitted a patent application for Method and System for Manufacturing Infrared Transparent Window Wafer with Integrated Anti-reflection Grating Structure. This invention was developed by Schmert Thomas.
The patent application number is CN20238082755 20231205. The pate..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- RNR Labs Inc has submitted a patent application for Laser Heat Treatment Method of Substrate Structural Body Based on Scanning Mode and Electronic Device Preparation Method Applying Laser Heat Treatment Method. This invention was developed by Ryu Jeong-do, Kang Sung-ho, Cho Joo-hyun and Ryu Sung-hoon.
The ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- SK Hynix Memory Solutions Inc has submitted a patent application for Systems, Methods, and Media for Prioritizing Read Access to Storage Device. This invention was developed by De Vries Jan and Vemula Naveen.
The patent application number is CN20238083809 20231025. The patent publication number is CN120322..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Zhengqi Co Ltd has submitted a patent application for Miniature Composite I/o Computer Chip Module Based on OSM-l Standard. This invention was developed by Zhang Yuzheng and Zhang Yuqi.
The patent application number is CN20241062997 20240116. The patent publication number is CN120337842 (A). International ..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Jiangsu Xingzhou Microelectronics Co Ltd has submitted a patent application for Chip Control Method and Device and Chip. Qu Junwu developed the invention.
The patent application number is CN202510445602 20250410. The patent publication number is CN120337311 (A). International Patent Classification codes ar..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Jiangxi Special Carbon Nano Tech Co Ltd has submitted a patent application for Sealing Mechanism for Feeding of CVD (chemical Vapor Deposition) Furnace. This invention was developed by Gu Hongqi and Shuai Bo.
The patent application number is CN202510630892 20250516. The patent publication number is CN12033..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Ningxia Hexing Carbon Based Mat Co Ltd has submitted a patent application for Production Equipment and Method of Silicon Nitride and Silicon Carbide Combined Product. Gu Wenhua, Gu Xu, Chee Sze Keat, Huang Tao, Wan Libin, Ye Qian and Xu Jiazhen developed the invention.
The patent application number is CN20..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Guangbenwei Tech Shanghai Co Ltd has submitted a patent application for System on Chip Based on Photoelectric Mixing and Photoelectric Fusion Chip. Cheng Tangsheng, Jiang Jun, Wang Yongliang, Liang Xianguo and Chen Qi developed the invention.
The patent application number is CN202510428521 20250407. The pa..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Shenzhen Jiahejingwei Electronic Tech Co Ltd has submitted a patent application for Test Method and System of Semiconductor Memory Test Production Line. This invention was developed by Chen Renjia, Zhang Lili, Guo Jinning and Xie Taotao.
The patent application number is CN202510508843 20250422. The patent ..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd has submitted a patent application for Integrated Multi-stage Water Ring Vacuum Pump Set Suitable for Semiconductor Crystal Pulling. This invention was developed by Ma Xuwu, Ma Yuhuai, Yang Kai, Wang Liguang and Cao Qigang.
The patent application number i..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Shenzhen Weiyangquan Tech Co Ltd has submitted a patent application for Intelligent Temperature Management Method and System for Integrated Circuit. Xu Yufu developed the invention.
The patent application number is CN202510454321 20250411. The patent publication number is CN120335578 (A). International Pat..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Heilongjiang Huixin Semiconductor Co Ltd has submitted a patent application for High-precision Reference Circuit, PCB and Chip. Feng Yuxiang and Ma Bobin developed the invention.
The patent application number is CN202510536499 20250427. The patent publication number is CN120335548 (A). International Patent..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Wuhan Baizhen Semiconductor Tech Co Ltd has submitted a patent application for Liquid Level Control Mechanism of Wafer Cleaning Machine. This invention was developed by Wang Qingsong and Xiao Zhenfang.
The patent application number is CN202510489306 20250418. The patent publication number is CN120335505 (A..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Suzhou Lieqi Intelligent Equipment Co Ltd has submitted a patent application for Fa Coupling Device of PLC Optical Chip and Coupling Method Thereof. This invention was developed by Li Wenming, Song Yuhua and Chen Qingdong.
The patent application number is CN202510788950 20250613. The patent publication num..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Beijing Zhongruizhicheng Tech Co Ltd has submitted a patent application for Ultrasonic Reflected Wave Signal Processing Operation Method, Chip and Storage Medium. This invention was developed by Wang Chuan and Zhou Jinhua.
The patent application number is CN202510795887 20250616. The patent publication num..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Zhejiang Wangrong Semiconductor Co Ltd has submitted a patent application for Alignment Mask and Manufacturing Method of Semiconductor Device. This invention was developed by Qin Xiaofeng, Jin Tao, Wen Guibao, Feng Zhiqiang and Ren Jie.
The patent application number is CN202510332262 20250320. The patent p..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Hangzhou Beihang Univ International Innovation Institute Beihang Univ International Innovation Insti has submitted a patent application for Method for Rapidly Synthesizing High-quality Blue Phosphorene Based on Molecular Beam Epitaxy and Blue Phosphorene. This invention was developed by Niu Tianchao, Zhu Yinu..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Zhejiang Houji Tech Co Ltd has submitted a patent application for Feeding Mechanism of Electroplating Machine. This invention was developed by Shan Xiji, Huang Fuguo and Shi Yiting.
The patent application number is CN202510508509 20250422. The patent publication number is CN120330854 (A). International Pat..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Shanghai Sanjing Plate Making Co Ltd has submitted a patent application for Plate Roller Electroplating Device and Plate Roller Machining Method. This invention was developed by Lu Lingxi.
The patent application number is CN202510548411 20250428. The patent publication number is CN120330848 (A). Internatio..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Jiangsu Toubo Photoelectric Tech Co Ltd has submitted a patent application for Selective Electroplating Method for Ceramic Copper-clad Substrate. This invention was developed by Zhang Weixing and Shi Chuanming.
The patent application number is CN202510605147 20250512. The patent publication number is CN120..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Suzhou Yuanben Tech Consulting Co Ltd has submitted a patent application for Microemulsion Type Modified Silicon Leather Waterproof Agent and Preparation Method Thereof. Tang Fei, Zhang Hao and Bai Changqing developed the invention.
The patent application number is CN202510597538 20250509. The patent publi..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Chongqing University Cancer Hospital has submitted a patent application for Micro-fluidic Chip for Quantitatively Detecting Drug Sensitivity of Bacteria and Detection Method of Micro-fluidic Chip. Lyu Zilan, Li Shunbo, Guo Bianqin, Zhang Jianhao and Liu Qian developed the invention.
The patent application ..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Shenzhen Nikto Tape New Mat Co Ltd has submitted a patent application for Film for Semiconductor Bonding, Preparation Method Thereof and Semiconductor Device. This invention was developed by Wu Weijun, Wu Haofeng and Zhang Xiao.
The patent application number is CN202510540744 20250427. The patent publicati..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Qingdao Jiaen Semiconductor Tech Co Ltd patent application for All-silicon Carbide Double-sided Heat Dissipation Module Packaging Method Based on Gradient Thermal Resistance Optimization. Yang Yuzhen, Wang Pilong, He Jun and Wang Xinqiang developed the ..
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