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Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 25 -- Shanghai Zhoudayang Semiconductor Materials has been awarded a patent for Easily-detached Sealing Ring. This invention was developed by Jiang Jiafu.
The patent application number is CN202422271057U 20240918. The patent publication number is CN223242064 (U). International Patent Classification codes are F16..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Wuhan China Star Optoelectronics Semiconductor Display Technology has applied Chinese patent for Display Device and Driving Method Thereof. Gong Houfu and Jin Zengjian developed it.
The patent application number is CN202411898029 20241220. The patent publication number is CN119861837 (A). International Pat..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has released Dingdao Zhixin (Shanghai) Semiconductor patent application for Data Processing Method and Device. This invention was developed by Chen Yong.
The patent application number is CN202311362392 20231019. The patent publication number is CN119861896 (A). I..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Dingdao Zhixin (Shanghai) Semiconductor has submitted a patent application for Weight Compression Method and Device and Data Processing Method and Device. This invention was developed by Chen Yong and Liao Renyi.
The patent application number is CN202311362394 20231019. The patent publication number is CN1..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Dingdao Zhixin (Shanghai) Semiconductor has submitted a patent application for Weight Processing Method and Device and Data Processing Method and Device. This invention was developed by Chen Yong, Liao Renyi and Fu Chih-ming.
The patent application number is CN202311362398 20231019. The patent publication ..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has published Dingdao Zhixin (Shanghai) Semiconductor patent application for Weight Compression Method and Device and Data Processing Method and Device. The invention was developed by Liao Renyi and Chen Yong.
The patent application number is CN202311363736 20231..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has released ChangXin Technology Group patent application for Refresh Protection Circuit and Memory. This invention was developed by Yang Fan, Xu Rui, Wang Xudong and Gu Yinchuan.
The patent application number is CN202311362842 20231019. The patent publication nu..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Puya Semiconductor, Shanghai has applied Chinese patent for Screening Method and Device of Abnormal Flash Chip, Medium and Equipment. Qin Ting developed it.
The patent application number is CN202411941229 20241226. The patent publication number is CN119864073 (A). International Patent Classification code i..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- China Institute of Atomic Energy has submitted a patent application for Isotope Light Source and Preparation Method Thereof. This invention was developed by Li Sijie, Li Xue, Ma Junping, Ping Jiehong, Li Xin, Han Yunze and Zhang Caiyi.
The patent application number is CN202411804183 20241209. The patent pu..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- SiEn QingDao Integrated Circuits has applied Chinese patent for Ion Implantation Method and Ion Implantation Apparatus. Liu Ke, Ma Jiankun, Qu Jiajia and Duan Jinjie developed it.
The patent application number is CN20251019018 20250106. The patent publication number is CN119864281 (A). International Patent..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Wuhan Guangju Microelectronic has submitted a patent application for Packaging Device and Manufacturing Method Thereof. Yi Chao, Wang Aobo, Xu Feng and Chen Jing developed the invention.
The patent application number is CN202411799366 20241209. The patent publication number is CN119864286 (A). Internationa..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Suzhou Saisen Electronic Technology has applied Chinese patent for Ion Implanter and Use Method Thereof. Luan Guangqing and Zhao Hui developed it.
The patent application number is CN20241200309 20241231. The patent publication number is CN119864308 (A). International Patent Classification codes are H01J37/..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Murata Manufacturing has submitted a patent application for Semiconductor Device. This invention was developed by Masuno Shinya.
The patent application number is CN202411380675 20240930. The patent publication number is CN119864325 (A). International Patent Classification codes are H01L23/00 and H01L23/14...
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Hangzhou Fuxin Semiconductor has submitted a patent application for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Mei Shuang and Fan Yiliang.
The patent application number is CN202411931960 20241225. The patent publication number is CN119864338 (A). International P..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Samsung Electronics has sought patent for Semiconductor Package. This invention was developed by Ryu Han-sung and Park Jong-beom.
The patent application number is CN202410535009 20240430. The patent publication number is CN119864339 (A). International Patent Classification codes are H01L23/522, H01L23/528 ..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Nanya Technology has submitted a patent application for Semiconductor Device Structure Having Liner with Tapered Sidewall. He Jiaming developed the invention.
The patent application number is CN20241089408 20240122. The patent publication number is CN119864341 (A). International Patent Classification codes..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Nanya Technology has submitted a patent application for Semiconductor Device Structure Having Liner with Tapered Sidewall. He Jiaming developed the invention.
The patent application number is CN202410614861 20240122. The patent publication number is CN119864342 (A). International Patent Classification code..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Shennan Circuits has filed a patent application for Chip Package. This invention was developed by Zhu Kai, Wang Zedong and Wu Jun.
The patent application number is CN202411807650 20241209. The patent publication number is CN119864344 (A). International Patent Classification codes are H01L23/31, H01L23/538 ..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Nuvoton Technology has applied Chinese patent for Control Device, Trust Chain and Control Method. Chen Qing'an and Shen Zilan developed it.
The patent application number is CN202411380735 20240930. The patent publication number is CN119862576 (A). International Patent Classification codes are G06F21/12 and..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has released Nichia patent application for Light Emitting Device. This invention was developed by Sogo Takayuki, Maruyama Hiroshi, Kitaoka Daisuke and Monji Yusuke.
The patent application number is CN202411458696 20241018. The patent publication number is CN11986..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Apple has filed a patent application for Semiconductor Package with Local Interconnects and Chiplet Integration. This invention was developed by Dabral Shashank, Zhai Jun, Hu Kunzhong, Jajam Saleh and Cao Zhitao.
The patent application number is CN20238064910 20230901. The patent publication number is CN11..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Shenzhen Xinsheng Semiconductor has submitted a patent application for Filtering Device for Improving Bonding Force and Manufacturing Method Thereof. Wang Youliang, Feng Duan and Zou Jie developed the invention.
The patent application number is CN202510353439 20250325. The patent publication number is CN11..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Hupan Guangxin Semiconductor Jiangsu has sought patent for Novel Attaching and Pre-fixing Structure. This invention was developed by Wang Taifang, Yue Mingming, Hu Chunquan, Tung Weng Hai and Kong Dekun.
The patent application number is CN20251074128 20250116. The patent publication number is CN119866157 (..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Shenzhen Xinkailai Industry Machine has been granted a patent for Semiconductor Etching Equipment. This invention was developed by Guan Xiaoyan, Wang Qiaoci and Zhao Jun.
The patent application number is CN202422475669U 20241012. The patent publication number is CN223260558 (U). International Patent Classi..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- SiEn QingDao Integrated Circuits has received a patent for Edge Washing Device. This invention was developed by Zhang Qi and Wei Xiaoping.
The patent application number is CN202422613787U 20241028. The patent publication number is CN223260561 (U). International Patent Classification codes are B08B3/02, B08..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Chinese Patent for Jig has been issued to Advanced Semiconductor Engineering. This invention was developed by Chen Taiying, Kan Woo Sun, Xu Jingyao and Chen Renjun.
The patent application number is CN202422235739U 20240912. The patent publication number is CN223260577 (U). International Patent Classificati..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Weenergy Semiconductor Shanghai has received a patent for Clamp and Production Equipment. This invention was developed by Jin Chenxi.
The patent application number is CN202422610185U 20241028. The patent publication number is CN223260582 (U). International Patent Classification codes are H01L21/67 and H01L..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Vanchip (Tianjin) Electronic Technology has secured a patent on Packaging Structure. Yu Caixiang and Jiang Pinfang developed the invention.
The patent application number is CN202422314392U 20240923. The patent publication number is CN223260588 (U). International Patent Classification codes are H01L21/50, H..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Advanced Semiconductor Engineering has been awarded a patent for Package Structure. This invention was developed by Chen Junwei, Cai Yubin and Ye Yuyuan.
The patent application number is CN20242213201U 20240820. The patent publication number is CN223260591 (U). International Patent Classification codes are..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Advanced Semiconductor Engineering has secured a patent on Package Structure. Guo Guanlin, Zhou Yijun and Chen Minghong developed the invention.
The patent application number is CN202422155648U 20240903. The patent publication number is CN223260600 (U). International Patent Classification codes are H01L23/..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Chinese Patent for Package Structure has been issued to Advanced Semiconductor Engineering. This invention was developed by Huang Zengyu.
The patent application number is CN202422223485U 20240911. The patent publication number is CN223260601 (U). International Patent Classification codes are H01L23/498, H0..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Chinese Patent for Package Structure has been issued to Advanced Semiconductor Engineering. This invention was developed by Huang Zengyu.
The patent application number is CN202422460151U 20241011. The patent publication number is CN223261056 (U). International Patent Classification codes are H01S5/0239 and..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- IBM has submitted a patent application for Function-based Memory Level Activation. This invention was developed by Buescher James R, Le Gallo-bourdeau Manuel, Sebastian Abu, Rahimi Ali and Boybat Kara Ibrahim.
The patent application number is CN20238065715 20230808. The patent publication number is CN11986..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has published Nordic Semiconductor patent application for Fine Tuning Techniques for Oscillators. The invention was developed by Farian Lucas.
The patent application number is CN20238065048 20230911. The patent publication number is CN119866599 (A). International..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Qualcomm has submitted a patent application for Vertical Channel Field Effect Transistor (VCFET) with Reduced Contact Resistance and/or Parasitic Capacitance and Related Fabrication Methods. Bao Jianan, Li Xia and Nallapati Giridhar developed the invention.
The patent application number is CN20238065183 20..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Origin Quantum Computing Technology, Hefei and Benyuan Keyi Chengdu Tech Co Ltd have submitted a patent application for Quality Judgment Method and Device for Simulation Semiconductor Quantum Dot Device. This invention was developed by Li Shuxiao.
The patent application number is CN202311368069 20231020. T..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Hefei Xinsheng Optoelectronic Technology Co Ltd and BOE Technology Group haves secured a patent on Display Substrate and Display Device. Yuan Can developed the invention.
The patent application number is CN202422725618U 20241107. The patent publication number is CN223261885 (U). International Patent Classi..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Shihezi University, Xinjiang Western Hesheng Silicon Industrial and Xinjiang Hesheng Silicon Industry New Mat Co Ltd have applied Chinese patent for Organic Silicon Monomer Efficient Catalytic Reaction Equipment and Process. Yang Shengchao, Hao Han, Li Congcong, Shi Chenkai, Cao Song, Li Xiong, Jang In-wook, ..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- SK Hynix and Toshiba Memory have submitted a patent application for Selector, Semiconductor Device, and Method of Manufacturing Selector and Semiconductor Device. This invention was developed by Kim Jeong-myeong, Dong Qiede, Choi Geo-rak, Cho Hyung Joon and Ahn Hyung-woo.
The patent application number is C..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Henan Academy of Sciences Institute of Mat and Henan Academy Sciences have applied Chinese patent for Method for Modifying Buried Interface of Perovskite Solar Cell. Liu Heng, Pan Wengao, Zhang Zhaoqi, Zhang Hongfei, Sun Suyang, Yue Pengfei and Zhang Guoshang developed it.
The patent application number is ..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Semiconductor Device and Preparation Method Thereof, Light-emitting Substrate and Display Device. Zhang Can, Chen Xiaochuan, Wang Can and Zhou Ying developed the invention.
The patent application number is C..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Shenzhen Yuntong Microelectronics Tech Co Ltd and Chongqing Yuntong Technology have submitted a patent application for High-reliability Sic MOSFET (metal Oxide Semiconductor Field Effect Transistor) Device and Manufacturing Method. This invention was developed by Cai Zhengkun, Zhang Wei, Tian Tian and Liao Gu..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Beijing BOE Sensing Tech Co Ltd, BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Substrate Integrated with Passive Device. This invention was developed by Yang Shuo, Li Yue, Feng Chunnan, Cao Xue and Feng Yulin.
The patent application number is CN20231135..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- China Jiliang University and Yu Zijie have received a patent for Micro-fluidic Chip Fluorescence Detector. This invention was developed by Yu Zijie, Yu Jiahao, Zhang Junqi, Li Yixin, Zhao Zihan, Wang Shuai and Li Yunfeng.
The patent application number is CN202422406198U 20241007. The patent publication num..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Shenzhen Tribet Tech Co Ltd and Mianyang Polytechnic have submitted a patent application for Silicon Carbide MOS Transformer Drive Circuit and Welding Machine. This invention was developed by Xie Bingxing and Li Chuan.
The patent application number is CN20251036895 20250109. The patent publication number i..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- BOE Crystal Core Technology Co Ltd, BOE Technology Group and Beijing BOE Technology Development have filed a patent application for Display Substrate and Preparation Method Thereof. This invention was developed by Jia Mingming, Wang Jing, Liu Mengqing, Wang Huaimin, Wang Lili, Zhao Jingping, Feng Shanshan, Li..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Hefei BOE Optoelectronics Tech and BOE Technology Group have filed a patent application for Display Substrate, Display Device and Preparation Method of Display Substrate. This invention was developed by Gong Kui and Duan Xianxue.
The patent application number is CN20251090927 20250120. The patent publicati..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Beijing Tankeblue Semiconductor and Jiangsu Tianke Heda Semiconductor have applied Chinese patent for Method for Distinguishing TSD and TMD Defects in Silicon Carbide. Zhang Hongwei, Yao Jing, Lou Yanfang, Liu Chunjun, Peng Tonghua and Yang Jian developed it.
The patent application number is CN20251040516 ..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Guangzhou Haoyi New Materials Technology and Longnan Haoyu New Material Tech Co Ltd have submitted a patent application for Sintered Polymer for N-type Topcon Electronic Paste as Well as Preparation Method and Application of Sintered Polymer. This invention was developed by Zhang Qingqing, Sun Peiyang and Wu ..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Shenzhen Faroad Intelligent Equipment has secured a patent on Chip Mounting Equipment Cover Plate Control Device. Li Fei, Deng Zefeng, Chen Jinliang and Hu Quan developed the invention.
The patent application number is CN202422254913U 20240913. The patent publication number is CN223261849 (U). Internationa..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Chinese Patent for Light Emitting Diode and Light Emitting Panel has been issued to BOE Huacan Optoelectronics (Zhejiang). This invention was developed by Liu Xiaoliang, Ren Ruzhen, Wang Wei, Lin Zhenhua, Cui Weihao, Wei Bolin, Tian Yanhong and Yin Lingfeng.
The patent application number is CN202422450621U..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has received Chonghui Semiconductor Jiangmen patent application for Stamping Part Cleaning System Self-adaptive to Various Sizes, Shapes and Materials. Li Shihao, Luo Xiaoping and Zheng Jianguo developed the invention.
The patent application number is CN202510865..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has received Guangxi University of Science and Technology patent application for Flexible Thin-wall Bearing Fault Diagnosis Method Based on FFT and SABO-KELM. Guo Mingjun, Chen Xinyun, Zhang Minghao, Guo Linxiong, Wu Haijiang, Hayashi Akio and Liu Mingcong developed..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- ChangXin Technology Group has submitted a patent application for Semiconductor Structure, Preparation Method Thereof and Storage Array Structure. This invention was developed by Tang Yi.
The patent application number is CN202311373206 20231020. The patent publication number is CN119866010 (A). Internationa..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Nuvoton Technology has submitted a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Wen Wenying.
The patent application number is CN202410888842 20240704. The patent publication number is CN119866025 (A). International Patent Classification codes ar..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Nuvoton Technology has filed a patent application for Semiconductor Device and Forming Method Thereof. This invention was developed by Chen Baian.
The patent application number is CN202410888896 20240704. The patent publication number is CN119866026 (A). International Patent Classification codes are H10D30..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Nexperia has submitted a patent application for Semiconductor Switching Device for Implementing Edge Terminal Structure. Nida Seranish and Xiang Junli developed the invention.
The patent application number is CN202411451588 20241017. The patent publication number is CN119866040 (A). International Patent Cl..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Beijing Chaoxian Memory Research Institute has submitted a patent application for Semiconductor Structure, Memory and Manufacturing Method Thereof. This invention was developed by Li Yongjie, Zhao Chao, Wang Guilei and Li Yuke.
The patent application number is CN202311351431 20231018. The patent publicatio..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- The 54th Research Institute of China Electronics Technology Group has filed a patent application for High-speed High-gain Three-step Back Incidence Avalanche Photodetector and Preparation Method Thereof. This invention was developed by Liu Boyuan, Yang Xiaohong, Wang Rui, Ma Xiang, Qi Hefei, Yang Jin, He Yuha..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 25 -- Zhiwei Semiconductor Shanghai Co Ltd has been awarded a patent for Shaft Sleeve Sealing Structure of Mechanical Arm. This invention was developed by Huang Long, Tang Baoguo and Chen Xinlai.
The patent application number is CN202422746699U 20241111. The patent publication number is CN223242077 (U). Internat..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- Gallant Prec Machining Co Ltd has received a patent for Wafer Box. This invention was developed by Wu Tingyi, Zhang Ruizong, Liu Baozheng, Xu Xunquan and Peng Shaosheng.
The patent application number is CN202422430711U 20241009. The patent publication number is CN223260564 (U). International Patent Classif..
Semiconductor
| Wed 26 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has awarded a patent to Jiangsu Yujing Semiconductor Tech Co Ltd for Semiconductor Integrated Transistor Packaging Structure. Wang Maorong developed the invention.
The patent application number is CN202422153813U 20240903. The patent publication number is CN22326..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Hangzhou Weiying Sensing Electronic Co Ltd has submitted a patent application for Bearing Structure and Integrated Circuit Packaging Method. This invention was developed by Chi Hai, Li Shuang, Xu Zhenyu, Song Yawei, Zhang Xiaotian and Song Xueqian.
The patent application number is CN202510330927 20250320. ..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has released Hwatsing Beijing Tech Co Ltd patent application for Wafer Positioning Mechanism, Positioning Method and Wafer Processing Device. This invention was developed by Wang Peng, Wang Yanhua, Xu Juncheng and Liu Fengdi.
The patent application number is CN20..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Northwest Electronic Equipment Tech Research Institute Second Research Institute of China Electronic has submitted a patent application for Pre-bonding Mechanism of Visual Alignment Device in Wafer Bonding Equipment. This invention was developed by Wang Chengjun, Wang Tao, Bao Xiang, Xue Zhiping, Yang Xiaodon..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Payton Technology Shenzhen Co Ltd has filed a patent application for Ultrathin Stacked Chip Low-stress Stripping Process Adopting Auxiliary Air Cavity. This invention was developed by Lee Myung-tae, Zeng Fanqiang, Zhang Li and He Hongwen.
The patent application number is CN20251041184 20250110. The patent ..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Northwest Electronic Equipment Tech Research Institute Second Research Institute of China Electronic has applied Chinese patent for Visual Mechanism of Visual Alignment Device in Wafer Bonding Equipment. Wang Chengjun, He Junmin, Yang Xiaodong, Bao Xiang, Li Wenhao, Wang Yuliang, Wang Tao and Zhang Hongmei de..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Gaize Precision Tech Suzhou Co Ltd has sought patent for Compound Semiconductor Wafer Rapid Warehouse-in and Warehouse-out Detection Device. This invention was developed by Zhou Yichu, Ren Jie, Lu Lijun, Zhou Tingcheng, Qiao Saisai and Chen Qi.
The patent application number is CN202411986425 20241231. The ..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Jiangsu Xianjin Quancheng Tech Co Ltd has submitted a patent application for Rapid Wafer Heat Treatment Equipment. This invention was developed by Zhu Wanglong, Lyu Hao, Shen Zhengjie and Guo Yu.
The patent application number is CN20251064208 20250115. The patent publication number is CN119864299 (A). Inte..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has received Zhejiang Hexin Integrated Circuit Co Ltd patent application for Forming Process of Lsi Chip Packaging Structure. Zhang Li, Guo Hongyan, Zhang Yufeng and Gong Jiaming developed the invention.
The patent application number is CN20251013854 20250106. Th..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Guangxi Yunxin Semiconductor Tech Co Ltd has applied Chinese patent for Packaging Method and Packaging Structure of GaN Hemt Chip. Xu Powen, Liang Faquan and Qiu Deheng developed it.
The patent application number is CN20251056185 20250114. The patent publication number is CN119864284 (A). International Pat..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Hypersics Semiconductor Co Ltd has submitted a patent application for Cleaning Method of Silicon Carbide Wafer. Li Wenwen, Song Hyun-jin, Zhang Honggen, Yuan Zhenzhou and Liu Xinyu developed the invention.
The patent application number is CN20251076746 20250117. The patent publication number is CN119864280..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Huayi Microelectronics Co Ltd has submitted a patent application for Treatment Method for Falling of Metal Product on Back Surface of Wafer. This invention was developed by Li Yanping, Zhang Yaowen and Wang Zhanjie.
The patent application number is CN20251011118 20250103. The patent publication number is C..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Hunan Zhongke Storage Tech Co Ltd has submitted a patent application for Secondary Packaging Method of Chip. This invention was developed by Xiao Fangbin.
The patent application number is CN202411861266 20241217. The patent publication number is CN119864278 (A). International Patent Classification codes ar..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Shijiazhuang Boruidi Biotechnology Co Ltd has filed a patent application for Method for Detecting Rppk in Backcross Analysis, Liquid Chip and Kit. This invention was developed by Lan Haofa, He Yilin, Dong Jiahui, Kang Jingtong, Ye Weijian, Xu Yanfen and Zhang Jia'nan.
The patent application number is CN202..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Hanxu Tech Beijing Co Ltd has applied Chinese patent for Data Transfer Circuit, Sram (static Random Access Memory) Storage Circuit, Near Storage Convolution Operation Unit and Chip System. Luo Jiamu developed it.
The patent application number is CN202411930551 20241226. The patent publication number is CN1..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has released Guangdong Ruihua Photoelectric Tech Co Ltd patent application for Reflection Type Display Method for Liquid Crystal on Silicon. This invention was developed by Cai Hua and Cai Hanye.
The patent application number is CN20251099042 20250122. The patent..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has published Mailaide Microelectronic Tech Wuxi Co Ltd patent application for Micro LED Micro Display Chip with Multiple Interfaces and Over-temperature Control. The invention was developed by Huang Long and Wei Chenyu.
The patent application number is CN2024118..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Beijing Ruiwei Xunke Electronic Tech Co Ltd has applied Chinese patent for Iteration-based Sdr Chip Iq Calibration Method and Circuit. Yu Huazhang and Guo Yin developed it.
The patent application number is CN202510102892 20250122. The patent publication number is CN119865258 (A). International Patent Class..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Hubei Jixinyuan Ecological Tech Co Ltd has filed a patent application for Wet-formed Rice Seedling Raising Substrate Sheet as Well as Preparation Method and Application Thereof. This invention was developed by Chen Guo, Yuan Pengfei, Tian Bo, Tan Mingzhao and Chen Yutong.
The patent application number is C..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Beijing Megahunt Tech Co Ltd has sought patent for Analog Switch Circuit with Overvoltage Protection and Chip. This invention was developed by Wang Dongwang, Yang Lei and Li Li.
The patent application number is CN202411766633 20241204. The patent publication number is CN119865153 (A). International Patent ..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has received Zhuhai Jieli Technology Co Ltd patent application for Adaptive Filter Circuit, Radio Frequency Circuit, Chip and Equipment. Yan Jiashu, Chen Weishun, Deng Yulin and Du Yingzhi developed the invention.
The patent application number is CN202411882733 2..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Zhuhai Smart Ware Tech Co Ltd has submitted a patent application for Control Method and Control Device of Wireless Charging Equipment, Wireless Charging Equipment and Chip. This invention was developed by Cheng Chun-fai, Huang Suibiao and Yang Huaguang.
The patent application number is CN202510356041 20250..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Tanaka Electronics Ind has submitted a patent application for Copper Bonding Wire, Method for Manufacturing Copper Bonding Wire, and Semiconductor Device. This invention was developed by Mitoma Syuichi, Nakajima Shinichiro and Yanai Hirofumi.
The patent application number is CN20238065618 20230913. The pat..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Giesecke & Devrient GmbH has submitted a patent application for Stabilization of Contactless Energy Supply of Chips of Chip Card and Corresponding Chip Card. This invention was developed by Baldischweiler Maximilian and Wurstle Paul.
The patent application number is CN20238068260 20230913. The patent publi..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has released Fujian ZK Litecore Ltd patent application for Miniaturized Low-power-consumption and High-gain Semiconductor Optical Amplifier and Method Thereof. This invention was developed by Tu Xiaoyan, Su Hui and Song Zhihua.
The patent application number is CN..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has released Beijing Tricolor Tech Co Ltd patent application for Chip High-speed Test Connection Assembly and Chip Test Device. This invention was developed by He Shida, Zhang Zhe, Yang Tao, Wang Zhitao and Kong Lingshu.
The patent application number is CN2024119..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Zhejiang HCB Co Ltd has sought patent for Integrated Miniaturized Connector of Integrated Circuit Board. This invention was developed by Zhao Chenggang, Wang Jinjian, Wang Zijian, Zhang Qinguo, Ye Binwu and Ji Jing.
The patent application number is CN20251075911 20250117. The patent publication number is C..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Zhuhai Weidu Xinchuang Tech Co Ltd has filed a patent application for Antenna Substrate of Millimeter Wave Radar Chip and Design Method. This invention was developed by Mu Ying, Zhou Chunyuan, Fu Guosheng, Luo Jun, Liu Wendong, Gao Wei and Zhang Hui.
The patent application number is CN202411970037 20241230..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Etown Mem Tek Ltd Xi'an has submitted a patent application for Connecting Plate of Flash Memory Chip, Preparation Method of Connecting Plate and Flash Memory Chip. Fu Leilei, Li Yuanyuan, Wang Pingchang and Xie Xiaoqiang developed the invention.
The patent application number is CN202510213563 20250225. The..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has released Huatian Tech Baoji Co Ltd patent application for Lead Frame Structure of Special-shaped High Radiating Fin and Corresponding Chip Packaging Method. This invention was developed by Chen Guolan, Lin Xingjiang, Hu Pan and Liu Yanling.
The patent applica..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has released Wuyuan Semiconductor Tech Qingdao Co Ltd patent application for Semiconductor Manufacturing Method and Semiconductor Structure. This invention was developed by Lin Benfu, Guo Shunhua and Yang Tongtong.
The patent application number is CN202510336105 ..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Zhongmao Green Energy Tech Xi'an Co Ltd has submitted a patent application for Preparation Method of Halogen-doped Window Layer and Cadmium Telluride Solar Cell. Ma Qianqian, Shi Qinchang and Zhang Yanning developed the invention.
The patent application number is CN20251026487 20250108. The patent publicat..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Xinyi New Energy Tech Quzhou Co Ltd has submitted a patent application for Repair Method of Back Contact Solar Cell. This invention was developed by Ni Zhirong.
The patent application number is CN202411980927 20241231. The patent publication number is CN119866092 (A). International Patent Classification co..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Shenzhen Waytronic Electronics Co Ltd has secured a patent on Electric Leakage Voice Alarm Device, Chip and Electronic Equipment. Li Guojun, Li Yiping, Zhang Jianling and Chen Shangxing developed the invention.
The patent application number is CN202421687722U 20240716. The patent publication number is CN22..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- State Intellectual Property Office of China has published Mianyang Huike Optoelectronics Technology Co Ltd and HKC patent application for Array Substrate and Display Panel. The invention was developed by Wu Chuan, Cao Zhonglin, Yi Wenyu, Feng Yajuan, Wei Dongmei, Chen Jie and Ye Lidan.
The patent applicati..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Wuxi Guangke Communication Equipment Co Ltd has been granted a patent for Strip-shaped Chip Test System. This invention was developed by Cao Deying and Gu Chunyi.
The patent application number is CN202422385972U 20240929. The patent publication number is CN223259837 (U). International Patent Classification..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Angell Tech Co Ltd has submitted a patent application for Chain Type Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Liang Jiajin, Wu Zhenwei and Shan Jianan.
The patent application number is CN202311355751 20231019. The patent publication number is CN119866032 (A). I..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Yangzhou Longsheng Electronic Tech Co Ltd has submitted a patent application for Etching Machine for Processing Integrated Circuit Board and Processing Method. Peng Chang developed the invention.
The patent application number is CN202510339069 20250321. The patent publication number is CN119865977 (A). Int..
Semiconductor
| Tue 25 Nov 2025
Beijing, Nov. 26 -- Anjiexin Tech Co Ltd has been granted a patent for Bar Strip Test Fixture Suitable for Wafer. This invention was developed by He Qichang and Yao Huaye.
The patent application number is CN202421786050U 20240725. The patent publication number is CN223259758 (U). International Patent Classification codes are ..
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