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Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Raintree Scient Instruments Shanghai has submitted a patent application for Elliptic Polarization Measurement Method and System of Semiconductor Device, and Optimization Method of Optical Model. Xie Yukun, Wang Wei and Zhuang Yuan developed the invention.
The patent application number is CN202510438888 20250..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- STMicroelectronics International has submitted a patent application for Metasurface Element for Imaging/structured Light/de-scanning. This invention was developed by Fessol Michael.
The patent application number is CN20251092015 20250121. The patent publication number is CN120370288 (A). International Patent..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- The 55th Research Institute of China Electronics Technology Group has submitted a patent application for Optical Waveguide Modulator Chip Coupling Packaging Structure and Packaging Process Method Thereof. This invention was developed by Bang Gun, Tan Wei, Cui Hongbo and Xu Weijie.
The patent application numb..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Semiconductor Manufacturing International (Shanghai) has submitted a patent application for Photomask Combination, Developing Parameter Determination Method and Semiconductor Structure. This invention was developed by Lin Haixiao, Yu Xiao, Wang Lanfang, Yi Xudong and Liu Xuan.
The patent application number i..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Shanghai Xuanjie Technology has submitted a patent application for Screen Display Track Evaluation Method and Device, Electronic Equipment, Chip and Storage Medium. This invention was developed by Li Jianlin, Hou Fangjie, Zhang Xinyi and Ning Zuobin.
The patent application number is CN202410200273 20240222. ..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Chip Control Method and Device, Electronic Equipment, Chip and Storage Medium. This invention was developed by Wu Geming.
The patent application number is CN202411783432 20241205. The patent publication number is CN120371114 (A). International..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Beijing University of Posts and Telecommunications has submitted a patent application for Method and System for Optimizing Low Power Consumption of Embedded System on Chip Based on Task Awareness. Zheng Xiaolong, Liu Liang, Ma Huadong, Guan Yi and Chu Haolin developed the invention.
The patent application nu..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Shanghai Xuanjie Technology has submitted a patent application for Data Processing Method and Device, Electronic Equipment, Storage Medium and Chip. This invention was developed by Wang Haiming.
The patent application number is CN202410219119 20240227. The patent publication number is CN120371396 (A). Intern..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Shanghai Ideal Automotive Technology has submitted a patent application for Task Stack Protection Method and Device, Electronic Equipment, Chip and Medium. This invention was developed by Sun Junyan.
The patent application number is CN202410109266 20240125. The patent publication number is CN120371390 (A). I..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Data Processing Method and Device, Electronic Equipment, Chip and Storage Medium. Wang Shujun developed the invention.
The patent application number is CN202411545630 20241031. The patent publication number is CN120371200 (A). International Pa..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Frequency Determination Method and Device, Electronic Equipment, Medium and Chip. Hou Fangjie, Liu Kuangyu, Ning Zuobin, Li Jianlin and Zhang Guobin developed the invention.
The patent application number is CN202510429560 20250407. The patent ..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Data Transmission Method and Device, Electronic Equipment, Chip and Medium. This invention was developed by Xu Jin.
The patent application number is CN202510241494 20250228. The patent publication number is CN120371750 (A). International Paten..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- China Electronic Product Reliability & Environmental Testing Research Institute 5th Electronic Research has submitted a patent application for Integrated Circuit Chip Thermal Neutron Soft Error Source Positioning Method. This invention was developed by Zhang Hong, Ma Teng, Lei Zhifeng, Zhang Zhangang, Peng Ch..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Beijing Smartchip Microelectronics Technology has submitted a patent application for Modeling Method and Device of Semiconductor Device, Electronic Equipment and Storage Medium. This invention was developed by Cho Young Man, Yu Wen, Liu Fang, Wu Bo, Li Junjian, Wu Zumou and Zhang Junjiang.
The patent applica..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Data Processing Method and Device, Storage Medium, Electronic Equipment and Chip. This invention was developed by Zhang Boyu, Zhang Xiaolin and Yoon Hyun-moo.
The patent application number is CN202410502378 20240424. The patent publication num..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Shanghai Xuanjie Technology has submitted a patent application for Signal Processing Method and Device, Communication Equipment, Chip and Readable Storage Medium. Xiao Libo, Li Yan and Han Jiajia developed the invention.
The patent application number is CN202410331191 20240321. The patent publication number ..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Signal Processing Method and Device, Electronic Equipment, Chip and Storage Medium. Chen Hengyi developed the invention.
The patent application number is CN202411808512 20241209. The patent publication number is CN120378259 (A). International ..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Shanghai Xuanjie Technology has submitted a patent application for Channel Estimation Method and Device, Electronic Equipment, Storage Medium and Chip. This invention was developed by Zhang Huan and Chen Miao.
The patent application number is CN202410224366 20240228. The patent publication number is CN120378..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Message Verification Method and Device, Electronic Equipment, Chip and Storage Medium. This invention was developed by Liang Xiaogang.
The patent application number is CN202410687859 20240530. The patent publication number is CN120378496 (A). ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Transmission Control Method and Device, Equipment, Chip and Medium. This invention was developed by Nagafuku.
The patent application number is CN20251061084 20250114. The patent publication number is CN120378474 (A). International Patent Class..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Image Processing Method and Device, Electronic Equipment, Chip and Storage Medium. Yu Hongyuan and Guan Xianyu developed the invention.
The patent application number is CN202411230595 20240903. The patent publication number is CN120374371 (A)...
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Image Processing Method and Device, Storage Medium, Electronic Equipment and Chip. Liu Yuqing, Huang Zejun, Cho Eun-jin, Yoon Hyun-moo and Shao Zhen developed the invention.
The patent application number is CN202410659215 20240524. The patent ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Vivo Mobile Communication has submitted a patent application for Image Generation Method and Device, Electronic Equipment, Storage Medium and Chip. This invention was developed by Chen Minghong and Huang Shizhen.
The patent application number is CN202510590668 20250508. The patent publication number is CN120..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Frame Insertion Processing Method and Device, Electronic Equipment, Chip and Medium. This invention was developed by Huang Zejun, Shao Zhen and Liu Yuqing.
The patent application number is CN202510505479 20250421. The patent publication number..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Image Processing Method and Device, Electronic Equipment, Chip and Medium. This invention was developed by Yu Haodong, Zhang Heng, Yoon Hyun-moo and Lun Chaolin.
The patent application number is CN202410545343 20240430. The patent publication ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Image Denoising Model Generation Method and Device, Equipment, Storage Medium and Chip. This invention was developed by Lin Jiamin.
The patent application number is CN202411466717 20241018. The patent publication number is CN120374432 (A). Int..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Communication Method and Device, Storage Medium, Electronic Equipment and Chip. This invention was developed by Lei Xiandiao.
The patent application number is CN202411195921 20240828. The patent publication number is CN120378882 (A). Internati..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Communication Method and Device, Storage Medium, Electronic Equipment and Chip. This invention was developed by Ma Quan.
The patent application number is CN202410749460 20240611. The patent publication number is CN120379033 (A). International ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Communication Method and Device, Electronic Equipment and Chip. This invention was developed by Lei Xiandiao.
The patent application number is CN202411488308 20241023. The patent publication number is CN120379024 (A). International Patent Clas..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Image Processing Method and Device, Electronic Equipment, Storage Medium and Chip. Liu Yuqing and Yoon Hyun-moo developed the invention.
The patent application number is CN202410627835 20240520. The patent publication number is CN120374754 (A)..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Communication Control Method and Device, Equipment, Chip and Medium. This invention was developed by Zeng Nian.
The patent application number is CN202411960958 20241227. The patent publication number is CN120378999 (A). International Patent Cl..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Communication Method, Device, Equipment, System, Chip and Storage Medium. Chen Suhui developed the invention.
The patent application number is CN20241181708 20240807. The patent publication number is CN120379071 (A). International Patent Class..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Signal Receiving Method and Device, Communication Equipment, Terminal, Chip and Storage Medium. Ma Quan developed the invention.
The patent application number is CN202410749513 20240611. The patent publication number is CN120379056 (A). Intern..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Shanghai Xuanjie Technology has submitted a patent application for Dual-card Bandwidth Interference Elimination Method and Device, Chip and Electronic Equipment. Chen Suhui developed the invention.
The patent application number is CN202410139205 20240131. The patent publication number is CN120379045 (A). Int..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Image Processing Method and Device, Electronic Equipment, Chip and Storage Medium. This invention was developed by Chu Fuchen, Han Byung-nam, Huang Yuan and Yoon Hyun-moo.
The patent application number is CN202411337244 20240924. The patent pu..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Semiconductor Device with Via-shaped Cut Gate Structure and Method of Manufacturing Same. Lin Zijing and Gu Shuyuan developed the invention.
The patent application number is CN20251054612 20250114. The patent publication number is CN12..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Yuexin Semiconductor Technology has submitted a patent application for Semiconductor Metal Field Plate Manufacturing Method and Semiconductor Metal Field Plate. This invention was developed by Peng Xiong, Lyu You and Tian Ye.
The patent application number is CN202510728690 20250603. The patent publication nu..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- BOE Huacan Optoelectronics Suzhou has submitted a patent application for High Electron Mobility Transistor Chip and Preparation Method Thereof. Zhou Jizong, Ma Huan, Ge Yonghui and Cai Liwu developed the invention.
The patent application number is CN202510305331 20250314. The patent publication number is CN1..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- 58th Research Institute of China Electronics Technology Corporation has submitted a patent application for Vdmos Power Chip Preparation Method. Xu Haiming, Hong Genshen, Xie Rubin, Liao Yuanbao and Tang Xinyu developed the invention.
The patent application number is CN202510718901 20250530. The patent public..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- SK Hynix has submitted a patent application for Semiconductor Device and Forming Method Thereof. This invention was developed by Kim Hyunwoo, Han Su Jung, Oh Dong Yean and Lim Woon-ha.
The patent application number is CN202410845360 20240627. The patent publication number is CN120379247 (A). International Pa..
Semiconductor
| Sat 31 Jan 2026
Beijing, Jan. 31 -- Shanghai Xuanjie Technology has submitted a patent application for Payment Method, Device and System, Electronic Equipment, Storage Medium and Chip. This invention was developed by Jia Jianwei.
The patent application number is CN202410109185 20240125. The patent publication number is CN120374111 (A). Interna..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Changchun Institute of Optics, Fine Mechanics & Physics of the Chinese Academy of Sciences has submitted a patent application for Wide Band Gap Nitride Quantum Well, Preparation Method and Wide Band Gap Semiconductor Device. This invention was developed by Shi Zhiming, Yang Yuxin, Sun Xiaojuan, Li Dabing, Jia..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Jade Bird Display, Shanghai has submitted a patent application for Miniature Light Emitting Diode Chip. This invention was developed by Gu Zhichen and Chen Weixin.
The patent application number is CN202510459681 20250414. The patent publication number is CN120379419 (A). International Patent Classification c..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Jade Bird Display, Shanghai has submitted a patent application for Miniature Light Emitting Diode Chip. This invention was developed by Gu Zhichen and Chen Weixin.
The patent application number is CN202510459680 20250414. The patent publication number is CN120379418 (A). International Patent Classification c..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Samsung Electronics has submitted a patent application for Memory Device and Test Method for Memory Device. An Byoung-jin, Kang Dong-seok, Kim Sin-ho and Kim Jong-wan developed the invention.
The patent application number is CN20251050475 20250113. The patent publication number is CN120375897 (A). Internatio..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Milliken & Company has submitted a patent application for Printed Fabric Substrate and Method of Manufacture. Mcmeccan Robert M, Mckay James Charles, Harris Thomas B, West Kevin D, Kitchen Dale S, Rosen Jonathan and Palli Sudhakar Reddy developed the invention.
The patent application number is CN20248005721 ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Milliken & Company has submitted a patent application for Printed Fabric Substrate and Method of Manufacture. This invention was developed by Mcmeccan Robert M, Mckay James Charles, Harris Thomas B, West Kevin D, Kitchen Dale S, Rosen Jonathan and Palli Sudhakar Reddy.
The patent application number is CN2024..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- ASML Netherlands has submitted a patent application for Method for Generating Acceleration Setpoint Profile for Movable Object, Setpoint Generator and Lithographic Apparatus. This invention was developed by Butler Hans and Kamidi Ramidin Izair.
The patent application number is CN20238088817 20231127. The pat..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Tokyo Electron has submitted a patent application for Substrate Processing Method and Substrate Processing Apparatus. This invention was developed by Nakane Yuta and Kumakura Sho.
The patent application number is CN20238086732 20231220. The patent publication number is CN120380428 (A). International Patent C..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Lam Research has submitted a patent application for Processing of Electrostatic Chuck Susceptor. This invention was developed by Wahidi Mahmoud, Belostotskiy Sergey Georgievich, Hollingsworth Joel, Leeser Karl Frederick and Kucuk Ahmet.
The patent application number is CN20238086455 20231213. The patent publ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Applied Materials has submitted a patent application for Phase Resolved Optical Metrology for Substrates. This invention was developed by Saleh Nader, Jiang Zhiming, Zhang Xiaodong and Srivatsa Arun R.
The patent application number is CN20238086555 20231212. The patent publication number is CN120380585 (A). ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Huawei Technologies has submitted a patent application for Substrate, Chip, Chip Packaging Structure and Electronic Equipment. This invention was developed by Yang Fangxu, Song Jiajia and Shi Lin.
The patent application number is CN20238084956 20230428. The patent publication number is CN120380597 (A). Inter..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- ASML Netherlands has submitted a patent application for High Throughput Load Lock Chamber. This invention was developed by Yu Dongchi, Lin Yichen, Fu Shaowei, Lin Jim and Zhang Huanyu.
The patent application number is CN20238086885 20231206. The patent publication number is CN120380587 (A). International Pat..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Unimicron Technology has submitted a patent application for Substrate Structure and Manufacturing Method Thereof. This invention was developed by Wang Jinsheng, Tan Ruimin, Zhan Zhikai, Cheng Shiliang and Ma Guanghua.
The patent application number is CN202410891726 20240704. The patent publication number is ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Texas Instruments has submitted a patent application for Determination of Values Indicative of Plurality of Passive Components Connected to Device Pins. This invention was developed by Jing Weibing, Chen Lei and Liu Bing.
The patent application number is CN20248005606 20240102. The patent publication number ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Huawei Technologies has submitted a patent application for Electronic Assembly, Electronic Equipment and Chip Structure. Wang Shaolei, Zhang Wei, Yuan Lingcheng and Wang Liangmeng developed the invention.
The patent application number is CN20241099181 20240123. The patent publication number is CN120376529 (A..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Shanghai Xuanjie Technology has submitted a patent application for Chip Packaging Structure and Chip Packaging Method. This invention was developed by Zhang Xiaodong, Jing Xiangmeng, Xu Bin and Wang Qizuo.
The patent application number is CN202410386234 20240329. The patent publication number is CN120376522 ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Semiconductor Energy Laboratory has submitted a patent application for Light Emitting Device. Watabe Takeyoshi, Kido Hiromitsu, Seo Hiromi, Ohsawa Nobuharu and Sasaki Toshiki developed the invention.
The patent application number is CN20238086096 20231220. The patent publication number is CN120380869 (A). In..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- SanDisk Technologies has submitted a patent application for Three-dimensional Memory Device Including Extended Support Opening and Dual. This invention was developed by Chu Joao Matthew, Matsuno Koichi, Rashidi Seyed El Emad, Yu Jixin and Alsmeier Johann.
The patent application number is CN20238075499 202311..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Micron Technology has submitted a patent application for Hybrid Gate Dielectric Access Device for Vertical Three-dimensional Memory. This invention was developed by Karda Kamal M, Liu Haitao, Sills Scott E and Lee Si Woo.
The patent application number is CN20238086383 20231207. The patent publication number ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Shanghai Institute of Technology has submitted a patent application for High-density Semiconductor Laser Heat Dissipation Device. Luo Denghui, Zhai Meng, Huang Haoxiang and Pan Zhenhai developed the invention.
The patent application number is CN202510714874 20250530. The patent publication number is CN120377..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- SG Micro has submitted a patent application for Control Circuit and Power Supply Chip of Constant On-time Voltage Converter. This invention was developed by Yang Qi, Li Dan and Hu Xiaodong.
The patent application number is CN202510481949 20250416. The patent publication number is CN120377666 (A). Internation..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- SG Micro has submitted a patent application for Control Circuit and Power Supply Chip of Constant On-time Voltage Converter. Yang Qi, Li Dan and Hu Xiaodong developed the invention.
The patent application number is CN202510481469 20250416. The patent publication number is CN120377665 (A). International Paten..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- South China University of Technology has submitted a patent application for Bidirectional Amplifier Structure, Front-end System, Chip Array Element and Phased Array System. Yi Xiang, Tu Junyuan, Cao Yunfei, Che Wenquan and Xue Quan developed the invention.
The patent application number is CN202510269038 2025..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- South China University of Technology has submitted a patent application for Three-inductor Stray Capacitance Counteracting Network, Broadband Power Amplifier, Chip and Equipment. This invention was developed by Qin Pei, Feng Xin, Li Yongchun and Xue Quan.
The patent application number is CN202510354314 20250..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Texas Instruments has submitted a patent application for Trimming Resistor Using Modulated Signal. This invention was developed by Merkin Todd, Aasheim Priya, Scoones Kevin, Liao Jianquan, Chen Zhenzhen and Krishna Kiran.
The patent application number is CN20251040510 20250110. The patent publication number ..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- South China University of Technology has submitted a patent application for Dead-zone-free High-gain Time Amplifier, Calibration Circuit, Chip and Electronic Equipment. Yi Xiang, Li Yongqi, Zhong Kaiming, Che Wenquan and Xue Quan developed the invention.
The patent application number is CN202510254537 202503..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Beijing Xuanjie Technology has submitted a patent application for Information Sending Method and Device, Communication Equipment, Terminal, Chip and Storage Medium. This invention was developed by Chen Jiaxuan.
The patent application number is CN202410643050 20240522. The patent publication number is CN12037..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Shanghai Xuanjie Technology has submitted a patent application for Scene Information Determination Method and Device, Electronic Equipment, Storage Medium and Chip. This invention was developed by Li Yan and Hu Chenggong.
The patent application number is CN202410302511 20240315. The patent publication number..
Semiconductor
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Shenzhen StateMicro Electronics has submitted a patent application for Adjustable Schmidt Input Circuit, Memory Chip and Memory. This invention was developed by Liu Zhongyang, Zhang Lianhao, He Kai, Mo Yushu and Zhang Chaojian.
The patent application number is CN202510241850 20250226. The patent publication ..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- European Patent Office has published STMicroelectronics International patent application for Folding Angle Detection in a Device. The invention was developed by Ding Peter, Fan Bin and Wen Peng Cheng.
The patent application number is EP20250189757 20250715. The patent publication number is EP4685609 (A1). Int..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- Huizhou Vision New Technology has filed a patent application for Power Management Circuit and Power Management Chip. This invention was developed by Tang Wang and Zhang Yue.
The patent application number is EP20240773763 20240109. The patent publication number is EP4686067 (A1). International Patent Classific..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- European Patent Office has received Samsung Electronics patent application for Three-dimensional Integrated Circuit. Hong Yongjin, Kim Kiok and Kim Wook developed the invention.
The patent application number is EP20250183412 20250617. The patent publication number is EP4685845 (A1). Cooperative Patent Classif..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- STMicroelectronics International has submitted a patent application for Metallization Structure for Electronic Devices and Method of Manufacturing the Same. This invention was developed by Sciarrillo Samuele, Brambilla Riccardo, Vassena Aurora and Bacciaglia Paola.
The patent application number is EP202501888..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- European Patent Office has published Kokusai Electric patent application for Etching Method, Semiconductor Device Production Method, Program, and Processing Device. The invention was developed by Ogawa Arito and Hayasaka Shogo.
The patent application number is EP20240774981 20240322. The patent publication nu..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- European Patent Office has published ASML Netherlands patent application for Charged Particle-optical Element, Charged Particle-optical Device and Methods of Manufacturing Electrodes. The invention was developed by Veenstra Roy Ramon, Mudretsov Dmitry, Stegemann Almut Johanna, Krecinic Faruk and Kuiper Vincent..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- Huawei Technologies has sought patent for Communication Method and Apparatus, and Storage Medium and Chip System. This invention was developed by Yu Yingjie.
The patent application number is EP20240784026 20240312. The patent publication number is EP4686272 (A1). International Patent Classification code is H0..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- European Patent Office has released Huawei Technologies patent application for Communication Method and Apparatus, and Storage Medium and Chip System. This invention was developed by Jiao Minghan, Li Ruijie and Guan Lei.
The patent application number is EP20240784128 20240327. The patent publication number is..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- United Microelectronics Corporation has submitted a patent application for Layout Pattern of Semiconductor Structure and Forming Method Thereof. This invention was developed by Hsu Chia-chang and Wang Hui-lin.
The patent application number is EP20240203375 20240927. The patent publication number is EP4686338 ..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- Huawei Technologies has submitted a patent application for Three-dimensional Memory Array and Preparation Method Therefor, Memory, and Electronic Device. Jing Weiliang, Huang Kailiang, Sun Ying, Wang Zhengbo and Liao Heng developed the invention.
The patent application number is EP20230930154 20231229. The pa..
Semiconductor
| Fri 30 Jan 2026
Munich, Jan. 31 -- Stora Enso has applied European patent for a Method for Manufacturing a Dispersion Coated Fiber-based Substrate. Backfolk Kaj, Nyflött Åsa, Cunha Gisela and Hiltunen Mari developed it.
The patent application number is EP20240774324 20240305. The patent publication number is EP4684062 (A1). International Pat..
Semiconductor
| Fri 30 Jan 2026
Munich, Jan. 31 -- Stora Enso has filed a patent application for Pha Dispersion Coating Composition and Coated Fiber-based Substrate. This invention was developed by Backfolk Kaj, Nyflött Åsa, Cunha Gisela and Kishani Saina.
The patent application number is EP20240774325 20240305. The patent publication number is EP4683976 (A..
Semiconductor
| Fri 30 Jan 2026
Munich, Jan. 31 -- European Patent Office has received Merck Patent patent application for Thickening Composition, Method for Manufacturing Thickened Resist Pattern, and Method for Manufacturing Processed Substrate. Yanagita Hiroshi and Yamamoto Kazuma developed the invention.
The patent application number is EP20240713414 2024..
Semiconductor
| Fri 30 Jan 2026
Munich, Jan. 31 -- Semiconductor Components Industries has applied European patent for Power Module Package with Molded Via and Dual Side Press-fit Pin. Chi Heejo, Im Seungwon and Jeon Oseob developed it.
The patent application number is EP20240735408 20240524. The patent publication number is EP4684424 (A1). Cooperative Patent..
Semiconductor
| Fri 30 Jan 2026
Munich, Jan. 31 -- European Patent Office has released Semiconductor Components Industries patent application for Package Comprising a Direct Bonded Metal Substrate and a Cooling Jacket, Method of Forming the Package and a Direct Bonded Metal Substrate. This invention was developed by Kang Ingoo, Jeon Oseob and Im Seungwon.
The..
Semiconductor
| Fri 30 Jan 2026
Munich, Jan. 31 -- SK Hynix Nand Product Solutions has submitted a patent application for Methods and Systems for Controlling Underfill Bleed-out in Semiconductor Packaging. Khalaf Bilal developed the invention.
The patent application number is EP20240775410 20240314. The patent publication number is EP4684420 (A1). Internation..
Semiconductor
| Fri 30 Jan 2026
Munich, Jan. 31 -- European Patent Office has received EV Group E Thallner patent application for Method for Surface Treatment of a Substrate and Method for Bonding Such a Substrate to a Further Substrate, and a Device for Carrying Out Such Methods. Kerepesi Peter developed the invention.
The patent application number is EP2023..
Semiconductor
| Fri 30 Jan 2026
Munich, Jan. 31 -- European Patent Office has published Yangtze Memory Technologies patent application for Managing Warmup Operations in a Memory Device. The invention was developed by Jia Lei, Xie Shu and Miao Lin.
The patent application number is EP20240737302 20240605. The patent publication number is EP4684394 (A1). Interna..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- Texas Instruments has submitted a patent application for Controlled Transient Responses in Four-switch Buck Boost Power Stages. This invention was developed by Martinez Gustavo, Zhang Han, Sheehan Robert and Bhardwaj Manish.
The patent application number is EP20230928987 20231229. The patent publication numbe..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- Micron Technology has submitted a patent application for Microelectronic Devices Including Contact Structures, and Related Electronic Systems and Methods. Xuan Zhou, Yu Sijia and Ong Biow Hiem developed the invention.
The patent application number is EP20240775685 20240320. The patent publication number is EP..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- Daikin India has applied European patent for Rubber Member, and Semiconductor Manufacturing-related Device. Okuno Shingo and Tanaka Yuhei developed it.
The patent application number is EP20250775087 20250327. The patent publication number is EP4685184 (A1). International Patent Classification codes are C08K3/..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- Kokusai Electric has applied European patent for Processing Method, Method of Manufacturing Semiconductor Device, Processing Apparatus, and Program. Nakatani Kimihiko, Miyata Shoma and Hamada Keitaro developed it.
The patent application number is EP20250182750 20250613. The patent publication number is EP4685..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- Proterial has submitted a patent application for Fe-co Based Alloy Coated Substrate and Laminated Core Member. This invention was developed by Kato Daiki.
The patent application number is EP20240774468 20240202. The patent publication number is EP4685263 (A1). International Patent Classification codes are C21..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- ASML Netherlands has submitted a patent application for Method and Apparatus for Homogenizing a Beam of Radiation. Van Voorst Peter Danny developed the invention.
The patent application number is EP20240190917 20240725. The patent publication number is EP4685529 (A1). International Patent Classification codes..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- Infineon Technologies has filed a patent application for Apparatus and Method, Apparatus and Method for Determining a Reference Value Indicating a Parallax and Time-of-flight System. This invention was developed by Leitner Raimund.
The patent application number is EP20240190996 20240725. The patent publicatio..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- Hangzhou Chipjet Technology has filed a patent application for Chip Short-circuit Check Method and Apparatus, Chip Testing Method, and Chip and Consumable Box. This invention was developed by Zhang Shouyu, Liu Tianxiang, Hong Ke and Lu Junjie.
The patent application number is EP20240777822 20240320. The paten..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- Hoya Lens Thailand has submitted a patent application for Method for Determining Progressive Refractive Power Lens. Matsuoka Shohei, Kaga Tadashi, Ito Ayumu and Sonoda Yutaro developed the invention.
The patent application number is EP20240774599 20240227. The patent publication number is EP4685549 (A1). Inte..
Semiconductor
| Sat 31 Jan 2026
Munich, Jan. 31 -- European Patent Office has released Hoya Lens Thailand patent application for Method for Determining Progressive Refractive Power Lens. This invention was developed by Matsuoka Shohei, Kaga Tadashi, Ito Ayumu and Sonoda Yutaro.
The patent application number is EP20240774598 20240227. The patent publication nu..
Semiconductor
| Fri 30 Jan 2026
Alexandria, Jan. 30 -- Anhui Sanan Optoelectronics Co Ltd has been granted a patent for Light-emitting Device and Manufacturing Method for Making the Same. This invention was developed by Wang Yu, Shi Xiulei, Zhao Doudou, Li Yao, Lee Cheng-hung and Ling Chan-chan.
The patent application number is US202318178297 20230303. The ..
Semiconductor
| Thu 29 Jan 2026
Alexandria, Jan. 30 -- Hardware Resources Inc has been granted a patent for Systems and Methods for Providing Led Connectors. Bartek Jay developed the invention.
The patent application number is US202217569201 20220105. The patent publication number is US12537322 (B2). International Patent Classification codes are F21V23/06, ..
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