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Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Yangtze Memory Tech Holding Co Ltd has submitted a patent application for Methods of Operating Memory Device, Memory Devices and Systems. This invention was developed by Li Xinran, Xu Feng, Li Da, Jin Lei and Huo Zongliang.
The patent application number is US202519306650 20250821. The patent publication ..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Yangtze Memory Tech Holding Co Ltd has submitted a patent application for Semiconductor Devices, Methods of Operating Thereof, and Systems. This invention was developed by Li Xinran, Zhao Xiangnan, Xu Feng, Chen Wenping, Min Yuanyuan, Li Da, Jin Lei and Huo Zongliang.
The patent application number is US2..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Macronix has filed a patent application for Memory Device and Memory System. This invention was developed by Tseng Po-hao and Bo Tian-cih.
The patent application number is US202519089087 20250325. The patent publication number is US20260148771 (A1). International Patent Classification codes are G11C16/04..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Huayuan Semiconductor Shenzhen Limited Co and Huayuan Semiconductor Tianjin Limited Co have submitted a patent application for Bidirectional Address Allocation Method and System. This invention was developed by Wang Honglai, Wang Yujun, Fang Yuting and Zou Yufeng.
The patent application number is US20261..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- U.S. Patent and Trademark Office has received Stats Chippac Man Pte Ltd patent application for Semiconductor Package Assembly with a Water Cooling System. Lee Jiseon developed the invention.
The patent application number is US202519396372 20251121. The patent publication number is US20260150681 (A1). Coo..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- U.S. Patent and Trademark Office has released Roku patent application for Utilizing a Single Buffer for a Dynamic Number of Players, Each Using a Dynamically Sized Buffer. This invention was developed by Atzitz Offer, Michiels Wim, Weng Huatao and Vaidya Govind.
The patent application number is US2026194..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Wallace Kerry has submitted a patent application for Thermal Buffer Device for Rapid, Non-dilutive Cooling of Beverages.
The patent application number is US202519398559 20251124. The patent publication number is US20260146804 (A1). International Patent Classification code is F28F1/42. Cooperative Patent Cl..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Disco has applied United States patent for Laser Processing Method and Manufacturing Method for Chips. Ikeda Yuki developed it.
The patent application number is US202519371219 20251028. The patent publication number is US20260145277 (A1). International Patent Classification codes are B23K26/082, B23K26/3..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Xiamen Ubest Electronic Tech Co Ltd has filed a patent application for Cold and Hot Compress Device. This invention was developed by Zhu Zonghu.
The patent application number is US202519015615 20250109. The patent publication number is US20260144670 (A1). International Patent Classification code is A61F7..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Kyulux has submitted a patent application for Compound, Light-emitting Material, and Organic Light-emitting Element. This invention was developed by Barigapalli Udaya, Higa Takuya, Suzuki Yoshitake, Watahiki Yuta, Kailing Yubaraj and Shimoi Yuko.
The patent application number is CN20248046883 20240814. The ..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Harvard College and Yeda Research and Development At The Weizmann Institute Of Science have submitted a patent application for Superconducting Diode Devices. This invention was developed by Yacoby Amir, Chen Shaowen, Park Seunghyun, Vool Uri, Maksimovic Nikola, Stern Adiel and Halperin Bertrand I.
The pa..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Tandem PV has submitted a patent application for Last-step Interconnection for Perovskite Modules. This invention was developed by Bailie Colin David and Eberspacher Chris.
The patent application number is US202519401268 20251125. The patent publication number is US20260150482 (A1). International Patent ..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- U.S. Patent and Trademark Office has published Tandem PV patent application for Last-step Interconnection for Perovskite Modules. The invention was developed by Bailie Colin David and Eberspacher Chris.
The patent application number is US202519401281 20251125. The patent publication number is US202601504..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Ennostar Corp has sought patent for Light Emitting Device and Manufacturing Method Thereof. This invention was developed by Wang Hsin Ying, Yeh Tzung Shiun, Lin Yu Ling and Hu Bo Jiun.
The patent application number is US202619454072 20260120. The patent publication number is US20260150453 (A1). Internati..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Nichia has submitted a patent application for Light-emitting Device. This invention was developed by Daikoku Shinichi and Sagawa Takehiro.
The patent application number is US202519393569 20251119. The patent publication number is US20260150452 (A1). International Patent Classification codes are H10H20/83..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- U.S. Patent and Trademark Office has published Korea Photonics Technology Institute patent application for Light-emitting Device Having Excellent Light Efficiency and Manufacturing Method Thereof. The invention was developed by Ryu Yung Ryel, Baek Jong Hyeob, Kim Sang Mook, Jeong Tae Hun and Kim Young Woo.
..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Japan Display Inc and Idemitsu Kosan have submitted a patent application for Semiconductor Device. Watakabe Hajime, Tsubuku Masashi, Sasaki Toshinari, Tamaru Takaya, Mochizuki Marina and Watabe Masahiro developed the invention.
The patent application number is US202519387691 20251113. The patent publicat..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Patentix Inc has applied United States patent for Semiconductor Device, Electronic Device, and System. Matsuda Shinpei, Shimizu Yuri, Takahashi Isao and Kaneko Kentaro developed it.
The patent application number is US202519395392 20251120. The patent publication number is US20260150361 (A1). Internationa..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Episil Tech Inc has applied United States patent for Semiconductor Device and Method of Making the Same. Liu Yuan-liang, Lee Yi-chen, Chang Yuan-chou and Chen Yen-chang developed it.
The patent application number is US202519173321 20250408. The patent publication number is US20260150329 (A1). Internation..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- U.S. Patent and Trademark Office has received Yefimov Stanislav Vadimovich patent application for Diode Made of Ice.
The patent application number is US202418957968 20241125. The patent publication number is US20260150312 (A1). Cooperative Patent Classification codes are H10D8/30 (US) and H10D99/00 (US)..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Yangtze Memory Technologies has sought patent for Memory Device and Method of Forming the Same. This invention was developed by Xie Wei, Fan Dongyu, Wang Di, Zhou Wenxi, Xia Zhiliang and Huo Zongliang.
The patent application number is US202619453795 20260120. The patent publication number is US2026015028..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Micatu Inc has submitted a patent application for Modular High-voltage Switching System and Method. This invention was developed by Oshetski Michael.
The patent application number is US202519402712 20251126. The patent publication number is US20260149242 (A1). International Patent Classification codes ar..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- U.S. Patent and Trademark Office has published Mediatek patent application for Instruction Cache, Circular Buffer and Method for Controlling Access of Instruction Cache. The invention was developed by Li Jiaze, Leong Chenyap, Bai Yu, Luo Chengping, Mao Jian, Chen Bozhan, Song Litong, Tsao You-ming and Yu La..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Yangtze Memory Technologies has filed a patent application for Managing Warm-up Operations in Memory Devices. This invention was developed by Jia Lei, Xie Shu and Miao Lin.
The patent application number is CN20248001548 20240605. The patent publication number is CN121488295 (A). International Patent Classif..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Xincun Technology (Wuhan) has sought patent for Phase Change Memory Unit and Memory. This invention was developed by He Zumao, Liu Jun and Tian Baoyi.
The patent application number is CN202311684003 20231207. The patent publication number is CN121487498 (A). International Patent Classification codes are H10..
Semiconductor
| Tue 02 Jun 2026
Munich, June 3 -- Patentix Inc has submitted a patent application for Semiconductor Device, Electronic Device, and System. This invention was developed by Matsuda Shinpei, Shimizu Yuri, Takahashi Isao and Kaneko Kentaro.
The patent application number is EP20250217350 20251120. The patent publication number is EP4750303 (A1). ..
Semiconductor
| Tue 02 Jun 2026
Alexandria, June 3 -- Sound Semiconductor Inc has submitted a patent application for Cascading of Bucket Brigade Delay Devices. This invention was developed by Johnson Neil Edward.
The patent application number is US202418958615 20241125. The patent publication number is US20260149431 (A1). International Patent Classification..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Xincun Technology (Wuhan) has submitted a patent application for Phase Change Memory and Forming Method Thereof. This invention was developed by Liu Guoqiang, Liu Jun and Zhang Heng.
The patent application number is CN202311703931 20231211. The patent publication number is CN121487261 (A). International Pat..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- The Sixth Element Changzhou Ltd has submitted a patent application for Graphene Coated Silicon Carbon Material and Preparation Method Thereof. This invention was developed by Xiong Feng, Liu Qing, Sun Yitong, Zhang Chen, Tan Huabing and Qu Yan.
The patent application number is CN202511707034 20251120. The p..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has released The Sixth Element Changzhou Ltd patent application for Graphene Coated Silicon Carbon Material and Preparation Method Thereof. This invention was developed by Liu Qing, Xiong Feng, Tan Huabing, Sun Yitong, Zhang Chen and Qu Yan.
The patent application..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Hebei Kuntian New Energy Co Ltd has filed a patent application for Preparation Method of Composite Porous Carbon Beneficial to Silicon Deposition. This invention was developed by Song Zhitao, Chen Zuochuan, Song Fan, Guo Panpan, Chen Fei, Dong Zekun, Zhang Sijia, Wang Limin and Jia Zhonghao.
The patent appl..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Linyi University has submitted a patent application for Method for Preparing Sb2 (s, Se) 3 Film Through NH4SCN-assisted Hydrothermal Method and Solar Cell. This invention was developed by Wang Zhi, Abu Dhappal Abdul Abdul, Tao Jiahua, Nie Er and Chu Junhao.
The patent application number is CN202511687556 20..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has published Zhangjiagang Yangzijiang Cold Rolled Sheet Co Ltd, Jiangsu Shagang Group and Jiangsu Shagang Institute Research Iron & Steel patent application for Lifting Device for Backflow Filter Screen of Silicon Steel Annealed Wire Cleaning Section. The invention ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has received Beijing Institute of Technology, Zhuhai and Beijing Institute of Technology patent application for Micro-fluidic Chip for Detecting Various Solutes in Solution Based on Terahertz Metasurface Sensing. Hu Weidong, Shu Jingyi, Yang Chen, Lu Guiping, Huang ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has released Big Health Res Institute of Hefei Integrated Sciences Center patent application for Digital Micro-fluidic Chip for Preparing NGS Methylation Library. This invention was developed by Cheng Zexin, Sun Xueguang and Yuan Xianliu.
The patent application nu..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Jingchu University of Technology has submitted a patent application for Cross Response Type Screen Printing Paper-based Micro-fluidic Chip as Well as Preparation Method and Application Thereof. This invention was developed by Li Jinli, Huang Shaoyun, Li Yueyan and Shu Zhong.
The patent application number is C..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Liaoning Shanshui Yinong Tech Co Ltd has submitted a patent application for Mixing Preparation Device and Method for Plant Growth Regulator Containing Silicon Element. Wang Huizhong, Wang Jingyi, Wang Junyi, Zhao Xupeng, Zhao Jin, Chi Jian, Wang Ronggang, Li Peng and Cai Shuang developed the invention.
The ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has released Inner Mongolia Qingcheng Semiconductor Tech Co Ltd patent application for Crucible Assembly for Synthesizing Silicon Carbide Powder and Synthesis Method Thereof. This invention was developed by Na Seung-ik, Shi Lin and Yang Qianqian.
The patent applic..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Chongqing Lidao New Material Tech Co Ltd has applied Chinese patent for Preparation Method and Device of High-stability Gold-tin Alloy Electroplating Dispersing Agent. Hu Guohui, Mo Xinlu, Li Li, Bao Haisheng, Wu Wendi and Zhou Hui developed it.
The patent application number is CN202511721117 20251121. The ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- China Nuclear Tongliao Uranium Ind Co Ltd has sought patent for Method for Reducing Silicon Dioxide in In-situ Leaching Uranium Mining Closed Cycle System Diuranate. This invention was developed by Liu Tianyin, Chen Jianqi, Ruan Zhilong, Mao Xinlei, Shu-ni Chuting, Tang Xuetao, Wang Yingnan, Xiang Lin and Bao ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Shandong University of Science and Technology has submitted a patent application for Preparation Method of Cesium-copper-iodine Semiconductor for Photoelectric Device. This invention was developed by Zhang Weiwei, Fu Yu and Ding Jianxu.
The patent application number is CN202511502226 20251021. The patent publ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has received Shandong Link Chemical Co Ltd patent application for Method for Preparing Silicon Dioxide for Food Additive by Using Rice Hull Ash. Cai Xinhua, Gao Xinsheng, Gong Shiwei, Yang Xuemin and Cheng Changbin developed the invention.
The patent application n..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has received Zhongqi Xinneng Battery Tech Co Ltd patent application for Porous Silicon Carbon Negative Electrode Material, Preparation Method Thereof, Negative Electrode Plate and Battery. Li Yan, Liu Lizhen, Sun Xinyi, Lu Chunyang, Wang Jianmin, Wen Jingjing and Zha..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Beijing Institute of Technology has submitted a patent application for Inner Chip Removal Deep Hole Spraying and Sucking Drill. Liang Zhiqiang, Zhang Rui, Zhao Yang and Ma Yue developed the invention.
The patent application number is CN202511617905 20251106. The patent publication number is CN121491390 (A). I..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Jiangsu Guozhongxin Semiconductor Tech Co Ltd has filed a patent application for IC Pin Arrangement Device for Semiconductor Packaging. This invention was developed by Fu Guoyang, Hu Wei and Chen Hong.
The patent application number is CN202511937401 20251222. The patent publication number is CN121491239 (A)..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Jiangsu Mingfan New Mat Co Ltd has sought patent for Crease-resistant Stamping Process for Ultrathin Battery Aluminum Wafer. This invention was developed by Zhang Zheng, Zhang Zhaojing, Cong Shuai, Zhang Mingxuan, Yang Panpan and Liu Yongqin.
The patent application number is CN202511885303 20251215. The pat..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Chengdu Titan Testing Technology has sought patent for Chip Testing Seat Cleaning Device and Chip Testing Equipment. This invention was developed by Xu Yonggang, Peng Rui, Tong Wei, Sun Chengsi, He Han and Wang Can.
The patent application number is CN202311702561 20231211. The patent publication number is CN1..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Beijing Tsingke Biotechnology has applied Chinese patent for Method for Cleaning Porous Chip. Du Jun, Zhou Jianguo, Chen Yuanyuan, Zhu Qiang, Li Yafeng and Li Junjie developed it.
The patent application number is CN202511718560 20230515. The patent publication number is CN121491082 (A). International Patent C..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Xiamen Pecton Semiconductor Technology has submitted a patent application for Lens Dedusting and Transferring Equipment. This invention was developed by Feng Qingxiong, Luo Canbo, Liu Lifeng, Shi Nengjie, Chen Yuhang, Lin Xiaodong, Liu Jia, Lin Huatao and Wang Zhifeng.
The patent application number is CN202..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Jinhua Troq Electronic Co Ltd has applied Chinese patent for Picking and Sorting Method for Quartz Wafers in Wafer Arrangement Station. Chen Kang, Yi Liping, Xu Xinghua, Xu Yunfeng, Lu Yanhua and Tang Duo developed it.
The patent application number is CN202511438503 20251010. The patent publication number i..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has received Jiangsu Fulehua Semiconductor Technology patent application for Automatic Ceramic Chip Feeding and Discharging Equipment. Wang Yunfei, Cao Haiyang, Cai Jun and Ma Jingwei developed the invention.
The patent application number is CN20261004150 20260105. ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Shenzhen Chenyue Storage Electronic Technology has applied Chinese patent for Packaging Substrate Collecting Device and Method. Chen Shi, Zhang Fengfeng and Cheng Hao developed it.
The patent application number is CN20261020008 20260108. The patent publication number is CN121493566 (A). International Patent C..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has received Dongguan Xiongchuang Automation Machinery Co Ltd patent application for Automatic Silicon Steel Sheet Burying and Taking Machine. Liu Hongliang, Pan Ji, Deng Kun and Huang Caishuang developed the invention.
The patent application number is CN202512438..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Shanxi Huarui Wild Medicinal Mat Co Ltd has filed a patent application for Special Sandwich Jam for Single Fruit Wafer Biscuit with High Pulp Content and Preparation Method of Special Sandwich Jam. This invention was developed by Zhang Zerui and Zhang Zeyu.
The patent application number is CN202511950049 20..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- China Triumph International Engineering has applied Chinese patent for Stripping Device of Glass Substrate. Liu Xiaoliang, Liu Ziyu and Ding Honghan developed it.
The patent application number is CN202511742272 20251125. The patent publication number is CN121492477 (A). International Patent Classification cod..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- ASML Netherlands has filed a patent application for Illumination Configuration Module for Metrology Device. This invention was developed by Arab Muhammad Umar.
The patent application number is CN20248046012 20240612. The patent publication number is CN121488193 (A). International Patent Classification code is..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Carl Zeiss SMT has sought patent for Method for Reducing Aberration of Optical Element, Optical Element and Semiconductor System. This invention was developed by Hammes Robert, Walderchen Frank, Langenhorst Martin and Weiss Walter.
The patent application number is CN20248043556 20240619. The patent publicatio..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- ASML Netherlands has applied Chinese patent for Measurement Method and Data Processing Method for Measurement. Scholz Stephen C, Van Rijswijk Leendert F, Nienhuys Han-kwang, Coenen Teis Johan, Porter Christopher L, Nayak Dinesh R and Reinhardt Juergen developed it.
The patent application number is CN202480467..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Infineon Technologies has filed a patent application for Scanning Electron Microscope-based Sample Analysis. This invention was developed by Bobergen Geert Bastiaan, Moser Matthew A and Nelhiebel Michael.
The patent application number is CN20248046439 20240611. The patent publication number is CN121488158 (A)..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- KLA-Tencor has submitted a patent application for Flexible Measurement Model for Model-based Measurement of Semiconductor Structures. This invention was developed by Chouaib Houssam, Zhan Tianrong, Iloreta Jonathan, Gu Teng and Shchegrov Andrei V.
The patent application number is CN20248043172 20240723. The p..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has published Panasonic Holdings Co Ltd patent application for Group Iii Nitride Semiconductor Epitaxial Wafer and Device. The invention was developed by Sumi Tomoaki, Mori Yusuke, Yoshimura Masashi, Imanishi Masayuki and Usami Shigeyoshi.
The patent application n..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Korea Univ Of Science and Technology Cooperation Foundation has sought patent for Monocrystal Diamond Substrate Capable of Eliminating Bicrystal Defects and Preparation Method of Monocrystal Diamond Substrate. This invention was developed by Nam Ok Hyun, Kang Hyun Woo, Choi Eui-ho, Yoo Geun-ho, Lee Jong-beom, ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Wuhan Xinxin Semiconductor has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Tan Yuan, Zhang Xingping, Xu Zhen and Yang Xiao.
The patent application number is CN202511687210 20251117. The patent publication number is CN121487638 (A)..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has published Beijing Xinli Tech Innovation Center Co Ltd patent application for Chip-to-wafer Hybrid Bonding Method and Semiconductor Device. The invention was developed by Xu Peng, Liu Kuo, Wang Yang, Hu Jinjin and Li Wei.
The patent application number is CN2025..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Beijing Xinli Tech Innovation Center Co Ltd has submitted a patent application for High-density Multi-layer Chip Wafer Stacking Method and Semiconductor Device. Xu Peng, Liu Kuo, Wang Yang, Hu Jinjin and Li Wei developed the invention.
The patent application number is CN202511562018 20251029. The patent pub..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Beijing Xinli Tech Innovation Center Co Ltd has submitted a patent application for Novel Carrier Wafer Manufacturing Method Based on Chip Wafer Bonding Recombination. This invention was developed by Xu Peng, Liu Kuo, Wang Yang, Hu Jinjin and Li Wei.
The patent application number is CN202511562016 20251029. ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Huawei Technologies has applied Chinese patent for Semiconductor Device and Preparation Method Thereof, Chip and Electronic Equipment. Huang Linhua, Wang Yuru, Yu Yi, Li Jiaqi, Peng Yingchun and Bai Zhiqiang developed it.
The patent application number is CN20241148422 20240731. The patent publication number i..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Micron Technology has applied Chinese patent for Package-to-package Interconnects for Solder Joint Fault Redundancy and High Bandwidth Applications. Naeini Mohammad, Eddapalambir Shalini, Nune Niranjan V and Naravelli Roberto developed it.
The patent application number is CN20251177692 20250801. The patent pu..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- SK Hynix has sought patent for Semiconductor Device. This invention was developed by Song Choung-ki.
The patent application number is CN20251014649 20250106. The patent publication number is CN121487618 (A). International Patent Classification codes are H10B80/00, H10W20/20, H10W72/20 and H10W72/29. Cooperati..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Suzhou Hannuxin Tech Co Ltd has applied Chinese patent for High-reliability Welding Process of Semiconductor IGBT Module. Zhang Yong, Qin Yan, Zhou Yuhuan, Jiang Jun and Xiang Baili developed it.
The patent application number is CN202511512232 20251022. The patent publication number is CN121487613 (A). Inte..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Huawei Technologies has filed a patent application for Chip, Chip Packaging Structure and Electronic Equipment. This invention was developed by Ning Runtao, Yin Binfeng, Song Chaofan, Lei Yingyi, Hu Fei, Song Yixuan, Wang Yao, Tang Longgu, Wang Yuru and Chen Huibin.
The patent application number is CN20241160..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has released Xiamen Sky Semiconductor Tech Co Ltd patent application for Chip Fan-out Integrated Packaging Structure with Ultra-thin Substrate and Manufacturing Method of Chip Fan-out Integrated Packaging Structure. This invention was developed by Wu Heng and Yu Daqu..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Xiamen Sky Semiconductor Tech Co Ltd has submitted a patent application for Chip Fan-out Integrated Packaging Structure with Low Cost and Ultra-thin Substrate and Manufacturing Method of Chip Fan-out Integrated Packaging Structure. This invention was developed by Wu Heng and Yu Daquan.
The patent applicatio..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Fuji Electric has filed a patent application for Semiconductor Module. This invention was developed by Kiguchi Tatsumasa.
The patent application number is CN202510839708 20250623. The patent publication number is CN121487606 (A). International Patent Classification codes are H10W70/65 and H10W72/00. Coopera..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Samsung Electronics has submitted a patent application for Semiconductor Package and Semiconductor Module Including Same. Park Kwang-ho, Jeon Seong-hwan and Kim Min-jin developed the invention.
The patent application number is CN202510224442 20250227. The patent publication number is CN121487605 (A). Internat..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has released Jiangsu Pangu Semiconductor Tech Co Ltd patent application for Glass Substrate Structure and Manufacturing Method. This invention was developed by Xiao Zhiyi, Wei Wei and Ma Shuying.
The patent application number is CN20251226308 20251230. The patent ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Shanghai Wonsung Alloy Mat Co Ltd has submitted a patent application for Chip Packaging Structure and Chip Packaging Method. Liu Shi developed the invention.
The patent application number is CN20261013922 20260107. The patent publication number is CN121487599 (A). International Patent Classification codes a..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Suzhou Juzhen Photoelectric has applied Chinese patent for Ultra-thin Multi-chip Device. Ying Shuyang, Li Xin and Zhu Xin developed it.
The patent application number is CN20251253950 20251231. The patent publication number is CN121487598 (A). International Patent Classification codes are H10W70/40 and H10W7..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Guangzhou Xingsen Semiconductor Co Ltd has applied Chinese patent for Manufacturing Method of Semiconductor Packaging Substrate and Semiconductor Packaging Substrate. Xu Huajun, Shi Ling and Liu Hezan developed it.
The patent application number is CN202511712773 20251120. The patent publication number is CN..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Nantong Kangyuan Circuit Tech Co Ltd has applied Chinese patent for Processing Method of Fccsp Packaging Substrate Solder Mask Small Window. Cheng Guangming, Yang Wei and Liu Lei developed it.
The patent application number is CN202511319299 20250916. The patent publication number is CN121487591 (A). Interna..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Shanghai Jita Semiconductor has applied Chinese patent for Semiconductor Test Structure and Preparation Method Thereof. Gu Dongguang and Wen Huanyi developed it.
The patent application number is CN202511563695 20251029. The patent publication number is CN121487587 (A). International Patent Classification co..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Semiconductor Manufacturing International (Shanghai) has submitted a patent application for Test Structure and Test Method. This invention was developed by Zhang Hong and Kim Kil-song.
The patent application number is CN20241148260 20240731. The patent publication number is CN121487583 (A). International Pa..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- SK Hynix has sought patent for Semiconductor Package Including Passive Component. This invention was developed by Jin Lan, Yoon Sang-hoon and Lee Ki-yong.
The patent application number is CN202510333358 20250320. The patent publication number is CN121487582 (A). International Patent Classification codes are H..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has published ICleague Technology patent application for Semiconductor Structure and Forming Method Thereof. The invention was developed by Liu Fandong, Chen Bin and Cui Shengqi.
The patent application number is CN202511649136 20251111. The patent publication numb..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Xiamen University has submitted a patent application for Cooling Device and Packaging Structure for Cooling Working Medium Direct Injection Chip. Ma Shenglin, Huang Jiapeng, Wang Zhizhen and Xiao Xiong developed the invention.
The patent application number is CN202511746801 20251125. The patent publication nu..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Wuhan Xinxin Semiconductor has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. Zhang Peng, Ye Guoliang, Song Shengjin, Hu Sheng and Zhu Peng developed the invention.
The patent application number is CN202511554532 20251028. The patent publication number is CN1214875..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has published Taiwan Semiconductor Manufacturing patent application for Semiconductor Package and Method of Manufacturing the Same. The invention was developed by Wang Yuhan, Chen Yanming, Zhong Mingci and Lin Yongqi.
The patent application number is CN202511466214 ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has released United Microelectronics Corporation patent application for Semiconductor Element and Manufacturing Method Thereof. This invention was developed by Hu Dengchuan, Lin Jufu, Lin Chuanlan, Chen Chunhong and Tu Qiaohui.
The patent application number is CN2..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Shenzhen Honghuang Tech Co Ltd has applied Chinese patent for Chip Clamping Equipment for Series Pressure Corrosion of Semiconductor Chip. Chen Qian, Huang Lei and Zeng Jintai developed it.
The patent application number is CN202511697788 20251119. The patent publication number is CN121487557 (A). Internatio..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Southwest China Research Institute Electronic Equipment has sought patent for Suction Nozzle for Bare Chip Friction Eutectic and Friction Eutectic Method. This invention was developed by Chen Haozhang, Li Yue, Li Jiangjian, Wen Zehai, Dong Dong, Xiang Weiwei, Xu Rongqing, Wu Yilong, Zhang Pingsheng, Wang You, ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has released China Resources Runan Tech Chongqing Co Ltd patent application for Jig for Preparing Semiconductor Structure. This invention was developed by Yu Tao, Deng Gangxiang, Zhang Xiaodong, Liu Fei and Pan Xiaofei.
The patent application number is CN202411467..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Shanghai Jet Plasma Tech Co Ltd has applied Chinese patent for Wafer Compression Ring Structure and Plasma Processing Equipment. Li Junliang and Yang Ping developed it.
The patent application number is CN202511894569 20251215. The patent publication number is CN121487554 (A). International Patent Classifica..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has released Laplace Wuxi Semiconductor Technology patent application for Double-paddle Connecting Assembly and Paddle Assembly. This invention was developed by Hu Chengfeng, Liu Zaifu and Zhu Bin.
The patent application number is CN202511387135 20250925. The pate..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has published Tuojing Jianke Haining Semiconductor Equipment patent application for Positioning Device and Method and Storage Medium. The invention was developed by Wang Zhaowei and Wang Chen.
The patent application number is CN202511705901 20251119. The patent pu..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has released Tuojing Jianke Haining Semiconductor Equipment patent application for Bonding Device, Bonding Method and Medium. This invention was developed by Li Xuan, Wang Chen and Wang Zhaowei.
The patent application number is CN202511668829 20251113. The patent ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Anhui Ruina Semiconductor Tech Co Ltd has sought patent for Irregular Wafer Bonding Thinning Method and System. This invention was developed by Yu Hengwen and Wang Xiaolu.
The patent application number is CN202511628573 20251107. The patent publication number is CN121487545 (A). International Patent Classif..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- State Intellectual Property Office of China has received Dongguan Attach Point Intelligent Equipment Co Ltd patent application for Inclination Adjusting Mechanism for Chip Thermocompression Bonding and Adjusting Method Thereof. Chen Shubin and Xu Huansu developed the invention.
The patent application number..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Dongguan Attach Point Intelligent Equipment Co Ltd has submitted a patent application for Method and Device for Adjusting Parallelism of Bonding Surface in Chip Bonding Equipment. This invention was developed by Chen Shubin and Xu Huansu.
The patent application number is CN202511421449 20250930. The patent ..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Shandong Liansheng Electronic Equipment Co Ltd has sought patent for Stable Clamping Mechanism for Four-inch to Six-inch Silicon Wafer Flower Basket. This invention was developed by Wang Zhiguang, Liao Hongzhan, Cui Shaomeng, Chen Xue and Zhang Jiafeng.
The patent application number is CN202511731359 202511..
Semiconductor
| Wed 03 Jun 2026
Beijing, June 3 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Manipulator and Semiconductor Process Equipment. Li Jinlong developed the invention.
The patent application number is CN20241145384 20240731. The patent publication number is CN121487535 (A). International Patent Classification co..
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