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Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has received Brilliance BV patent application for Improved Photonic Integrated Circuit and Method for the Fabrication Thereof. Geuzebroek Douwe Harmen, Frentrop Raimond, Dekker Ronald, Tiek Tim and Drost Edwin Wilco developed the invention.
The patent application num..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has received Alivedx Suisse SA patent application for Compositions and Methods for Immobilising DFS70 on a Substrate. Ataman Yasemin and Van Den Bogaard Patrick developed the invention.
The patent application number is WO2025EP70642 20250718. The patent publication n..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Sky Wing Communication Electronic Co Ltd has submitted a patent application for Noise Elimination Method and Device Based on Multimode SOC Main Control Chip. Liu Jianhua, Xie Yangfei, Lin Zonglong and Huang Shaomin developed the invention.
The patent application number is CN202510554539 20250429. The paten..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Li Xiulu has submitted a patent application for Storage and Calculation Integrated Chip and Storage Device. This invention was developed by Li Xiulu and Zhu Xiaocong.
The patent application number is CN202510482956 20250417. The patent publication number is CN120316063 (A). International Patent Classificat..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Tianshui Tianguang Semiconductor Co Ltd patent application for Data Processing Method and Device for Cache in Chip Design. Zhao Min, Gao Yanping, Shang Zean, Wen Yeye, Lu Yu, Pu Yaochuan and Li Wenjun developed the invention.
The patent application n..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Beijing Huadian Zhongxin Tech Co Ltd patent application for Multi-path Network Interface Extension System of Communication Chip and Communication Chip. The invention was developed by Liu Nian, Zhang Weitian and Chen Wen.
The patent application numbe..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Jinan Institute of Quantum Technology and Hefei Nat Laboratory patent application for Superconducting Chip Micro-nano Machining Side Wall Inclination Angle Measuring Method, Device and Equipment and Medium. This invention was developed by Liu Yuqi, Su F..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Suzhou Jixinlian Tech Co Ltd has filed a patent application for Metal Ceramic Substrate and Preparation Method Thereof. This invention was developed by Cai Zhihong, Hu Cheng, Li Xiaoqing and Qiu Yiji.
The patent application number is CN202510497525 20250421. The patent publication number is CN120309377 (A)..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Chaozhou Yuechao Innovation Tech Consulting Co Ltd patent application for Preparation Process of Silicon Nitride Ceramic Material. Lin Jia, Lai Hang and Liu Shengdong developed the invention.
The patent application number is CN202510663682 20250522. ..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Yamaha Robotics Holdings Co Ltd and Kurita Water Industries have filed a patent application for Semiconductor Device Bonding Method. This invention was developed by Kikuchi Hiroshi, Tobari Yuta, Hishinuma Hayato, Ri Kinn and Ida Junichi.
The patent application number is WO2025JP22900 20250625. The patent pu..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Res Association For Advanced Systems has applied WIPO patent for Semiconductor Module. Kawano Masaya and Kuroda Tadahiro developed it.
The patent application number is WO2025JP14935 20250416. The patent publication number is WO2026018508 (A1). International Patent Classification code is H04B5/40.
The ab..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Kingsemi Japan Co Ltd has submitted a patent application for Semiconductor Manufacturing Device. This invention was developed by Otani Masami and Chen Zhengdao.
The patent application number is WO2025JP04781 20250213. The patent publication number is WO2026018476 (A1). International Patent Classification co..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Institute Fuer Solarenergieforschung GmbH has submitted a patent application for Method for Producing a Contact Structure in Particular for a Back Contact Solar Cell. This invention was developed by Dullweber Thorsten, Mertens Verena, Brendel Rolf, Haase Felix, Min Byungsul and Peibst Robby.
The patent appl..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has released Genvia patent application for Component for Solid Oxide Electrochemical Devices, Comprising a Metal Substrate Coated with a Ceramic Layer. This invention was developed by Amsellem Olivier and Bestautte Jolan.
The patent application number is WO2025EP6983..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Brilliance BV has submitted a patent application for Photonic Integrated Circuit Comprising a Numerical Aperture Controller for Speckle-reduced Projection and Method Therefor. Geuzebroek Douwe Harmen, Tiek Tim and Drost Edwin Wilco developed the invention.
The patent application number is WO2025EP69827 2025..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Fortaegis Tech Holding BV has submitted a patent application for Secure Memory Transfer in a Network of Controllable Physical Unclonable Function Devices. This invention was developed by Makkes Marc Xander.
The patent application number is WO2025EP69721 20250710. The patent publication number is WO202601753..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Beijing Fengqiao Tech Co Ltd has submitted a patent application for Remote Control System and Method for Multimode Communication Chip of Middle-high Voltage Power Line. Shen Hankun, Du Deshun, Li Shuya, Shi Jiangtao and Li Guodong developed the invention.
The patent application number is CN202510804347 202..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Kungao Xinxin Microelectronics Jiangsu Co Ltd patent application for System-level Fault and Anomaly Detection and Management Method and Device of Vehicle-mounted Ethernet Chip and Storage Medium. Zhou Yuqian, Zheng Haidong and Guan Jinxin developed the ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Chongqing Weitu Information Tech Co Ltd has submitted a patent application for GPU (graphics Processing Unit) Virtualization Resource Allocation Device and Method, Chip and Electronic Equipment. This invention was developed by Ji Jinglin.
The patent application number is CN202510409138 20250402. The patent..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Heilongjiang Smart Interconnection Traffic Tech Co Ltd patent application for Internet of Vehicles Intelligent Traffic Flow Regulation and Control Method and System Based on ETC Chip. This invention was developed by Lin Ying, Wu Jialong and Chen Mingrui..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Suzhou Lasuo Biochip Tech Co Ltd patent application for Feature Extraction Method, System and Equipment for Microbeads in High-density Gene Chip and Medium. The invention was developed by Liu Chaojun, Liu Ruoyu, Xu Jian and Xu Xinyi.
The patent appl..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Guangdong Mingju New Material Tech Co Ltd patent application for Polyurethane-based Thermoplastic Organic Silicon Elastomer as Well as Preparation Method and Application Thereof. Wang Jiqiang, Chen Pingxu, Luo Yongquan, Tian Zhongtao, Zhu Jianfeng and L..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Suzhou Fulaiyige Sealing Tech Co Ltd has sought patent for High-sealing-performance Semiconductor Sealing Ring and Preparation Method and Vulcanizing Machine Thereof. This invention was developed by Zhang Xinli.
The patent application number is CN202510299743 20250314. The patent publication number is CN12..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Anhui North Microelectronics Res Institute Group Co Ltd patent application for Manufacturing Method of TSV (through Silicon Via) with Horn Mouth Shape. The invention was developed by Zhang Shengbing and Yu Lei.
The patent application number is CN202..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Anhui North Microelectronics Res Institute Group Co Ltd has filed a patent application for MEMS Fabry-perot Optical Filter Chip Based on Wafer Direct Bonding. This invention was developed by Zhang Shengbing and Wang Fan.
The patent application number is CN202510396416 20250331. The patent publication numbe..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Godrej Consumer Products Ltd has submitted a patent application for Substrate - Coated Novel Combustible Composition. Yadlapalli Venkateswara Rao, Pendota Bhargava, K Marisamy, Choughule Uday and Bibals Reena developed the invention.
The patent application number is WO2025IN50870 20250610. The patent public..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- University Degli Studi Di Roma Tor Vergata has filed a patent application for Coating Process, in Particular by Solvent-evaporation, for Coating a Substrate, in Particular a Substrate of Complex Shape, with a Composite Coating. This invention was developed by Almonti Daniele, Salvi Daniel, Tagliaferri Vincenzo..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- LX Semiconductor Tech Co Ltd has submitted a patent application for Bandgap Reference Voltage Generation Circuit and Semiconductor Device Having Same. This invention was developed by C I Park, Seo Young-ho and Hong Zhenlin.
The patent application number is CN20238084569 20231205. The patent publication num..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Suzhou Qiancheng New Energy Tech Co Ltd has submitted a patent application for SOC Adjustment Method and Apparatus, and Computer-readable Storage Medium. This invention was developed by Zhang He, Xiao Liujie and Tian Kang.
The patent application number is WO2025CN103416 20250625. The patent publication numb..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has published BOE Tech Group Co Ltd and Chengdu BOE Optoelectronics Technology patent application for Display Substrate and Display Apparatus. The invention was developed by Wang Yangpeng, Dong Tian and Liu Libin.
The patent application number is WO2025CN103263 20250..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has released Cloud Intelligence Assets Holding Singapore Private Ltd and Hangzhou Alicloud Apsara Information Technology patent application for Memory Expansion System and Method, Switch, and Memory Pool. This invention was developed by Chen Hongxin.
The patent appli..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Shenzhen Ruina Electronic Tech Development Co Ltd has filed a patent application for Wafer-level Chip Manufacturing Method. This invention was developed by Huang Herb He.
The patent application number is WO2025CN102110 20250619. The patent publication number is WO2026016725 (A1). Cooperative Patent Classifi..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Beijing Huadian Zhongxin Tech Co Ltd has filed a patent application for Mainboard Power Supply Management Circuit, Main and Standby Power Supply Switching Method and Chip. This invention was developed by Dong Xuehui, Zhang Haifeng and Feng Zhide.
The patent application number is CN202510277469 20250310. Th..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Hefei Chipsea Electronic Tech Co Ltd has sought patent for Push-pull Output Circuit, Chip and Electronic Equipment. This invention was developed by Ye Xuefeng and Liu Shuaifeng.
The patent application number is CN202510391082 20250331. The patent publication number is CN120320765 (A). International Patent ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- 3peak Incorporated has sought patent for High-voltage Driving Circuit and Chip. This invention was developed by Cao Jianwen.
The patent application number is CN202510391782 20250331. The patent publication number is CN120320750 (A). International Patent Classification codes are H03K17/06 and H03K17/687. Co..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Beijing Qingyun Tech Co Ltd has submitted a patent application for Multi-layer Stacked Chip and Clock Control Method Thereof. This invention was developed by Dong Yupeng.
The patent application number is CN202510772473 20250610. The patent publication number is CN120315536 (A). International Patent Classif..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Wuxi Chip Res Micro Electronics Co Ltd has filed a patent application for Reference Circuit Applied to Large Substrate Working in Negative Pressure Environment in Deep N Well. This invention was developed by Zhou Ye, Miao Yingqiu, Yan Yusen, Zhang Mengyun, Liang Hanping and Pang Chunchun.
The patent applic..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Beijing Yanhuang Guoxin Tech Co Ltd patent application for Method and System for Dynamically Adjusting Driving Rate of Power Management Chip. Wang Huidong, Li Jianwei and Wang Caibao developed the invention.
The patent application number is CN2025107..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Heilongjiang University and China Electronics Tech Group Corporation No. 49 Research Institute patent application for MEMS Gas Flow Chip. The invention was developed by Liu Zhihui, Zhao Xiaofeng, Li Zixu, Li Tao, Liu Xingyu, Wang Yonggang, Chen Jing an..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Nke Fa&robot Wuxi Co Ltd patent application for Encoder Chip Sensor Calibration Detection Platform. Zheng Feng, Zhang Jun, Guo Taolei, Wu Songling, Zou Hai and Lu Songjie developed the invention.
The patent application number is CN202510478068 202504..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Hospital Affiliated To Fuzhou Univ patent application for Preparation Method of Flexible SERS (surface Enhanced Raman Scattering) Substrate of Ascorbic Acid Circulating Negative Silver Bacterial Cellulose Membrane and Application of Flexible Sers Substr..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Fujian Sailong Tech Co Ltd has submitted a patent application for PBT Polyester Chip with Controllable Transparency and Preparation Method Thereof. This invention was developed by Zhang Xibao, Qin Bo, Zhu Fuhe and Zhuo Liqiong.
The patent application number is CN202510392474 20250331. The patent publicatio..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Fujian Sailong Tech Co Ltd has submitted a patent application for Polybutylene Terephthalate (PBT) Polyester Chip with Adjustable Transparency and Processing Method Thereof. Zhang Xibao, Chen Yi, Qin Bo and Zhuo Liqiong developed the invention.
The patent application number is CN202510392289 20250331. The ..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Anhui Saichao Electrical Appliance Co Ltd has submitted a patent application for Vehicle-mounted Semiconductor Air Conditioning Device. Lin Wenhua, Wang Saizhun, Han Hong and Liu Jun developed the invention.
The patent application number is CN202510779083 20250612. The patent publication number is CN120307..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Eurokera SNC has submitted a patent application for Glass-ceramic Substrate for a Cooking Device, Glass-ceramic Article, and Production Method. Luais Erwann and Masse Rubens developed the invention.
The patent application number is WO2025EP68676 20250701. The patent publication number is WO2026017406 (A1). ..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has released Beijing Aurasky Electronics Co Ltd patent application for Electrostatic Chuck Power Supply and Semiconductor Process Device. This invention was developed by Zhang Yu, Kang Chenguang, Li Yuzhan, Wang Songtao and Ge Jun.
The patent application number is WO..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has received BOE Tech Group Co Ltd and Beijing BOE Sensor Technology patent application for Photoelectric Conversion Substrate and Flat Panel Detection Apparatus. Li Jinyu, Pang Fengchun, Du Qingxin, Yu Haibo, Geng Yue, Ming Zhenxing and Zhang Peng developed the inventi..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has released Wuxi Leadpro Tech Co Ltd patent application for Substrate In-situ Detection System and In-situ Detection and Transfer Method Therefor. This invention was developed by Yu Xiang.
The patent application number is WO2025CN96174 20250521. The patent publicati..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Shanghai Xincan Electronic Tech Co Ltd has submitted a patent application for Chip Power-on Initialization Method and Device and Chip. Qiu Kaifang and Sun Renjie developed the invention.
The patent application number is CN202510378759 20250328. The patent publication number is CN120315766 (A). Internationa..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Hangzhou Yongxie Tech Co Ltd patent application for Ap or Sta Simulator Based on Real Chip and Test Method Thereof. This invention was developed by Zhang Yuntao, Zeng Huaqing, Ma Changchun and Hou Min.
The patent application number is CN202510556549 ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Zhuhai Print Rite Microelectronics Co Ltd patent application for Consumable Chip and Instruction Processing Method Thereof, Consumable Container and Printing Equipment. Wen Guanguo, Luo Shoujie, Liao Jiansheng, Pan Huifeng, Yang Haihuo and Xie Guangyu d..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Jiangsu Luxin Semiconductor Tech Co Ltd has submitted a patent application for Mask Conveying Device and Method for Semiconductor Chip. This invention was developed by Niu Chengrong, Zhang Yueyuan, Zhang Han, Chen Hu, Qian Qi, You Chun, Xu Jia and Gao Qi.
The patent application number is CN202510694904 202..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Guangdong Xinyueneng Semiconductor Co Ltd patent application for Adjusting Method of Photoresist Angle in Photoetching Process and Preparation Method of Silicon Carbide Chip. Huang Tao developed the invention.
The patent application number is CN20251..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Xiaomi Technology, Wuhan, Xiaomi Intelligent Home Appliance Wuhan Co Ltd and Beijing Xiaomi Mobile Software patent application for Control Method and Device of Air Conditioning Equipment, Electronic Equipment, Chip and Medium. This invention was develop..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Jinbao Composite New Material Tech Wuxi Co Ltd has sought patent for Suspended Conveying Device for Electroplating Surface of Automobile Workpiece. This invention was developed by Hou Jinsong and Xi Jiafeng.
The patent application number is CN202510451875 20250411. The patent publication number is CN120308..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Guangdong Canwin Automatic Equipment Co Ltd has filed a patent application for Device for Automatically Receiving and Collecting Silicon Steel Sheets and Using Method. This invention was developed by Huang Zhuoming.
The patent application number is CN202510493028 20250418. The patent publication number is ..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Nantong Simaier Prec Equipment Co Ltd has filed a patent application for PCB Chip Mounter Suction Nozzle Obstruction Cleaning Device. This invention was developed by Gu Xian, Zhu Huijiang and Xia Ying.
The patent application number is CN202510380263 20250328. The patent publication number is CN120308645 (A..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Jiangsu Micromile Electronics Co Ltd has submitted a patent application for Chip Wafer Film Pasting and Cutting Device and Using Method Thereof. Jiang Chenchen developed the invention.
The patent application number is CN202510493470 20250418. The patent publication number is CN120308417 (A). International ..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has received Tokyo Electron Ltd and Tokyo Electron US Holdings patent application for Substrate Processing System Using an Optical Pattern. Maleev Ivan developed the invention.
The patent application number is WO2025US22819 20250402. The patent publication number is ..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Chengdu Geehy Tech Co Ltd has sought patent for Leakage Compensation Circuit, Crystal Oscillator Circuit, and Microprocessor Chip. This invention was developed by Zhong Jiale, Mei Dinglei and Wang Feng.
The patent application number is WO2025CN107449 20250708. The patent publication number is WO2026016931 (..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- Suzhou Uigreen Micro & Nanotechnology Co Ltd has applied WIPO patent for Mems-based Wafer Test Probe. Qian Xiaochen and Fu Changyong developed it.
The patent application number is WO2024CN138656 20241212. The patent publication number is WO2026016390 (A1). International Patent Classification code is G01R1/0..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- Hangzhou Microquanta Semiconductor Corporation Ltd has submitted a patent application for Method for Improving Stability of Perovskite Solar Cell. This invention was developed by Yao Jizhong, Yan Buyi and Zhang Lijian.
The patent application number is WO2024CN136911 20241204. The patent publication number i..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- Fudan University and Shanghai Integrated Circuit Manufacturing Innovation Center have sought patent for Sensing-storage-computing-integrated Neuromorphic Device and Fabrication Method Therefor. This invention was developed by Meng Jialin, Wang Tianyu, Chen Lin, Sun Qingqing and Zhang Wei.
The patent applica..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Maijiaoli Shanghai Semiconductor Tech Co Ltd patent application for System for Applying Potential to Wafer. Shi Zhubin and Liu Xianghua developed the invention.
The patent application number is CN202510525325 20250425. The patent publication number i..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Zhenhe Tech Jiangsu Co Ltd patent application for Chip Bi Electrical Performance Aging Test Method and System. This invention was developed by He Junming, You Li, Gao Xiansheng and Cao Ziyan.
The patent application number is CN202510799876 20250616. ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Fuzhou Pujing Semiconductor Co Ltd has applied Chinese patent for Dew Detection Device for Chip Testing. Wang Zhaomeng developed it.
The patent application number is CN202510692582 20250527. The patent publication number is CN120314758 (A). International Patent Classification codes are G01R1/02 and G01R31/..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Jiangsu Xinyuan Semiconductor Co Ltd has sought patent for Chip Aging Test and Analysis Method. This invention was developed by Yin Guohai, Jin Weijun and Liu Xiaojie.
The patent application number is CN202510393768 20250331. The patent publication number is CN120314748 (A). International Patent Classifica..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Chitwing Dongguan Technology Co Ltd has filed a patent application for Manual Test Tool and Test Method for Semiconductor Module. This invention was developed by Li Danwen, Chen Deji, Yang Junyi, Xia Shanyan, Guo Weiqiang and Li Junfeng.
The patent application number is CN202510500476 20250421. The patent ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Keithley Instruments has submitted a patent application for Characterizing Power Device on Wafer Using Automated Parametric System. This invention was developed by Pronin Aleksandr Nikolaevich and Yu Jin-kwang.
The patent application number is CN20251048001 20250113. The patent publication number is CN1203..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Tuoer Microelectronics Co Ltd patent application for Self-adaptive Detection Comparison Circuit and Chip. Mu Siyu and Shi Pengju developed the invention.
The patent application number is CN202510339763 20250321. The patent publication number is CN120..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Aiwei Jiangsu Power Electronics Co Ltd has applied Chinese patent for E-comp and PTC Two-in-one Power Semiconductor Device. Zhang Liangjun developed it.
The patent application number is CN202510467086 20250415. The patent publication number is CN120319742 (A). International Patent Classification codes are ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Xiaoduan Shenzhen Computing Tech Co Ltd patent application for Semiconductor Structure Based on 3D Packaging, Packaging Method and Semiconductor Device. Zheng Shengwei and Bai Dawei developed the invention.
The patent application number is CN20241075..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Gaoying Dongguan Plastic Tech Co Ltd has submitted a patent application for Low-energy-consumption Electroplating Method, Device and Equipment Based on Recycled Plastic. This invention was developed by Yan Siguang, Zhang Huifeng, Wen Jinrui, Su Meiqiang, Fu Yuchun and Wang Jun.
The patent application numbe..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Sun Yat-sen University has submitted a patent application for Element for Providing Clear Sky Effect and Preparation Method Thereof. This invention was developed by Zhang Yi, Liang Yaohui, Yao Zanjie and Jiang Xing.
The patent application number is CN202510734172 20250603. The patent publication number is ..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- China University of Geosciences, Wuhan has submitted a patent application for Deep Learning Logging Lithology Identification Method with Additional Stratigraphic Unit Division. This invention was developed by Jang Harim, Liu Hui, Cai Guorong, Li Zhanglin, Liu Yang, Wang Liangyu, Weng Zhengping, Wu Chonglong a..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Futeng Hebei Energy Saving Tech Co Ltd has applied Chinese patent for Composite Interlayer High-efficiency Energy-saving Hollow Glass Based on Silicon Dioxide Aerogel. Jin Chenglong, Zhang Manren, Han Wei and Tian Wenming developed it.
The patent application number is CN202510811418 20250618. The patent pu..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- Shanghai Zenfocus Semi-Tech has submitted a patent application for Chip Aging Test Apparatus. Han Yangyang, Liu Jumeng and Tao Kewen developed the invention.
The patent application number is WO2025CN83362 20250319. The patent publication number is WO2026016520 (A1). International Patent Classification codes..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Hoya, Hoya Electronics Korea Co Ltd, Hoya Optoelectronic Taiwan Co Ltd and Chongqing Maite Photoelectric Co Ltd patent application for Phase Shift Mask and Manufacturing Method of Display Device. The invention was developed by Ma Bengang and Kanetani K..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Sands Tech Co Ltd has submitted a patent application for Reverse Photomask Using Phase Shift Film Pattern for Reflective Pattern and Blank Mask for Manufacturing Same. Yoon Jong-won, Yang Chul Kyu, Park Min-gyu, Woo Mi-kyung and Kim Yong-dae developed the invention.
The patent application number is CN20241..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Zhai Jixin has filed a patent application for Optical Signal Modulation Structure, Preparation Method Thereof and Chip. The patent application number is CN202510763469 20250609. The patent publication number is CN120315197 (A). International Patent Classification codes are G02B6/12, G02B6/122, G02B6/125 and G..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Beijing Xianlong Tech Co Ltd has filed a patent application for Method and System for Detecting Chip Based on Material Belt Round Hole Guide Contrast and Light Transmission. This invention was developed by Yao Zhixin and Li Pengjie.
The patent application number is CN202510787152 20250613. The patent publi..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Topped Person Tianmen Pump Co Ltd patent application for Anti-corrosion Silicon Carbide Ceramic Pump. Wu Dengwen, Liu Yang, Wang Chao and Sheng Yu developed the invention.
The patent application number is CN202510509525 20250422. The patent publicati..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Anhui Microchip Changjiang Semiconductor Mat Co Ltd patent application for Method for Optimizing Geometric Surface Type of Silicon Carbide Cutting Blade. The invention was developed by Yao Zhiyong, Jiang Chengchen and Chen Haibing.
The patent applic..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Method for Bonding Single Crystal Silicon Rod with Crystal Orientation Below 150cm. This invention was developed by Liu Xiaoping, Cao Qigang, Yang Kai, Wang Liguang, Zhang Yankun..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Xiamen Baoshili Dustless Tech Co Ltd patent application for PTFE (polytetrafluoroethylene) Bar Cutting Machine Tool with Chip Suction Function. This invention was developed by Ma Chuanshun and Deng Huaqing.
The patent application number is CN20251054..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Flexell Space Co Ltd has submitted a patent application for Thin-film Type Solar Cell Device, Thin-film Type Solar Cell Module, and Manufacturing Method Therefor. Noh Shin Young and Ahn Tae Hun developed the invention.
The patent application number is WO2025KR07432 20250530. The patent publication number is..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Flexell Space Co Ltd has submitted a patent application for Thin-film Solar Cell Module and Method for Manufacturing Same. This invention was developed by Noh Shin Young and Ahn Tae Hun.
The patent application number is WO2025KR07430 20250530. The patent publication number is WO2026019063 (A1). Internationa..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Flexell Space Co Ltd has submitted a patent application for Thin-film Solar Cell Device, Thin-film Solar Cell Module, and Manufacturing Method Thereof. Noh Shin Young and Ahn Tae Hun developed the invention.
The patent application number is WO2025KR07428 20250530. The patent publication number is WO20260190..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has received Flexell Space Co Ltd patent application for Thin-film Solar Cell Device, Thin-film Solar Cell Module, and Manufacturing Method Thereof. Noh Shin Young and Ahn Tae Hun developed the invention.
The patent application number is WO2025KR07423 20250530. The p..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- LumiLEDs Singapore Pte Ltd and LumiLEDs have submitted a patent application for Monolithic LED Array and Method of Manufacturing Thereof. This invention was developed by Basin Grigoriy, Fouksman Mikhail, Lesch Norbert and Spinger Benno.
The patent application number is WO2025US37560 20250714. The patent pub..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- Amicro Tech Co Ltd has submitted a patent application for Robot Map Exploration Method Based on Reachable Boundary Points, and Chip. This invention was developed by Chen Jinjie, Huang Huibao, Zhou Hewen, Zhang Ziqian and Ma Danyun.
The patent application number is WO2025CN77284 20250214. The patent publicat..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Jiangnan Institute Computing Tech patent application for Wafer-level Chip Simulation Method, Device and Equipment and Storage Medium. This invention was developed by Wang Liyi, Hu Xiahui, Liu Qinglin and Wu Yingying.
The patent application number is ..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has published Xi'an ESWIN Material Tech Co Ltd and Xi'an ESWIN Silicon Wafer Technology patent application for Support Structure for Epitaxial Growth Apparatus, Epitaxial Growth Apparatus and Epitaxial Wafer. The invention was developed by Liang Penghuan.
The patent..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Guangdong Leadyo Ic Testing Co Ltd patent application for Testing Board Card Cooling Device for Chip Testing Machine. The invention was developed by Hayashi Nozomu, Zhang Yifeng, Yuan Jun, Sun Xiaohui and Cao Helei.
The patent application number is ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Guanghua Science And Tech Research Institute Guangdong Co Ltd, Guangdong Guanghua Sci Tech Co Ltd and Guangdong Toneset Science & Tech Co Ltd patent application for Method for Filling and Plating Metal in Through Hole of Substrate. The invention was de..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Guojing Hechuang Qingdao Tech Co Ltd has submitted a patent application for Method for Optimizing Luminous Efficiency of TFT (thin Film Transistor) Material. Zhang Fuxuan, Cui Caoxiang, Zhu Ruiping, Lyu Yong, Guo Baijun, Zhang Chunyang and Li Xiaodong developed the invention.
The patent application number ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Guangzhou Zhongge Electronic Tech Co Ltd patent application for Fm-index Calculation Acceleration Device Based on FPGA Chip. The invention was developed by Park Young-ho and Wang Changli.
The patent application number is CN202510470565 20250415. The..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Hubei Changjiang Wanrun Semiconductor Tech Co Ltd has submitted a patent application for System and Method for Testing DRAM (dynamic Random Access Memory) Chip. This invention was developed by Wu Guojun and Yao Dong.
The patent application number is CN202510808853 20250617. The patent publication number is..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Beijing Qingyun Tech Co Ltd has submitted a patent application for Storage Wafer Structure and Forming Method of Three-dimensional Integrated Device. This invention was developed by Zhao Ruyue.
The patent application number is CN202510791344 20250613. The patent publication number is CN120319294 (A). Inter..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Silicon Motion Tech Corp has applied Chinese patent for Data Storage Device, Data Storage Medium and Data Refreshing Method. Wu Hongyi developed it.
The patent application number is CN202411302487 20240918. The patent publication number is CN120319291 (A). International Patent Classification code is G11C16..
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