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Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Fuding Lanyi New Mat Co Ltd has filed a patent application for Wet Preparation Method and Application of High-purity Silicon Dioxide. This invention was developed by Lin Kai.
The patent application number is CN202610290363 20260311. The patent publication number is CN122126855 (A). International Patent Cla..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Inner Mongolia Rongli Battery Mat Co Ltd has sought patent for Method for Improving Structural Stability of Silicon Carbon Material. This invention was developed by Wu Binbin, Zhang Zhengxiong, Zhu Jie, Han Wei and Dong Zhengqi.
The patent application number is CN202610593177 20260430. The patent publicati..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Jiangsu Hengcheng Semiconductor Mat Co Ltd has submitted a patent application for Preparation Method of Bamboo-based Active Carbon Source for Synthesizing Semiconductor-grade Silicon Carbide Crystal Grains. Jia Hongyu, Lin Yuxiang, Qian Hengliang, Lu Lyuyong and Xiao Shaoyi developed the invention.
The pat..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- State Intellectual Property Office of China has released Enerchip Resonant patent application for Chip Packaging Method and Chip Packaging Structure. This invention was developed by Lee Se-won and Zhou Qin.
The patent application number is CN202411625073 20241114. The patent publication number is CN1221267..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Huizhou Yunchuang Electronics Co Ltd has filed a patent application for Automatic Conveying Device for Electroplating and Using Method Thereof. This invention was developed by Chen Ke'er and Li Helan.
The patent application number is CN202610344493 20260320. The patent publication number is CN122126739 (A)..
Semiconductor
| Wed 19 Aug 2026
Seoul, Aug. 19 -- Korean Intellectual Property Office has received Power Master Semiconductor Co Ltd patent application for Power Module Package. Kwon Soonho, Eom Jooyaung, Kim In Suk, Yoon Ki Myung and Lee Taekkeun developed the invention.
The patent application number is KR20240102058 20240731. The patent publication number..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- IBM Israel Science and Tech Ltd, International Business Machines Corporation and IBM China Co Limited have submitted a patent application for Backside Contact with Partial Sidewall Spacer. This invention was developed by Xie Ruilong, Vega Reinaldo, Yang Xiaoming, Ramachandran Ravikumar, Choi Kisik and Loubet N..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- International Business Machines Corporation, IBM China Co Limited and IBM Israel Science & Tech Ltd have submitted a patent application for Direct Backside Contact Without Placeholder. This invention was developed by Xie Ruilong, Kumar Mahender, Ramachandran Ravikumar, Frougier Julien, Matham Shravan Kumar, Ch..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has received Barman Ujjal patent application for Apparatus, System, Chip and Method for Sorting Particles Within a Sample.
The patent application number is WO2025IB53522 20250403. The patent publication number is WO2026167400 (A1). International Patent Classificatio..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Nederlandse Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek Tno has submitted a patent application for Photonic Integrated Circuit for Bidirectional Optical Communication with Point-ahead Angle. This invention was developed by Cognée Kévin Georges Guy.
The patent application number is WO2026EP..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Sciprios GmbH has submitted a patent application for Substrate Holder with Insert. This invention was developed by Kögl Matthias, Stubhan Tobias and Jakisch Fabian.
The patent application number is WO2026EP53068 20260205. The patent publication number is WO2026167109 (A1). International Patent Classificati..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Zhejiang Jinli Tech Co Ltd has been granted a patent for Tool for Cutting Cvd (chemical Vapor Deposition) Synthetic Diamond in Batches. He Keqiang developed the invention.
The patent application number is CN202423122129U 20241218. The patent publication number is CN223558760 (U). International Patent Class..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Suzhou Long Sight Plastic Co Ltd has received a patent for Stainless Steel Protective Wafer Press-in Tool. This invention was developed by Gu Jun, Huang Fuxing and Zhu Guochao.
The patent application number is CN202423189680U 20241224. The patent publication number is CN223557730 (U). International Patent ..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Wuxi Zhongxinglian Intelligent Equipment Co Ltd has been granted a patent for Dismounting and Clamping Device for Substrate Separation. Peng Yonghang developed the invention.
The patent application number is CN202423229010U 20241226. The patent publication number is CN223557712 (U). International Patent Cl..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Zhongke Huaqing Quanzhou Fine Ceramics Research Inst Co Ltd has submitted a patent application for Preparation Method of Silicon Nitride Powder. This invention was developed by Tian Zhuo, Liu Jinchao, Shi Chunxi and Xiao Qun.
The patent application number is CN202610347406 20260320. The patent publication ..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Xi'an Institute Of Optics And Precision Mechanics Of CAS has submitted a patent application for Independently Replaceable Space Beam Combining Semiconductor Laser Array. This invention was developed by Zhang Junyue, Li Te and Chen Lang.
The patent application number is CN20261027712 20260109. The patent pu..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Dongguan Kepengda Electronic Tech Co Ltd has submitted a patent application for Preparation Method of Gold Electrode NTC Thermal Sensitive Ceramic Chip and Gold Electrode NTC Thermal Sensitive Ceramic Chip. This invention was developed by Lin Zhihua.
The patent application number is CN202610277710 20260309..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- State Intellectual Property Office of China has published Shaanxi Yuanjie Semiconductor Tech Co Ltd patent application for Integrated Chip with Power Monitoring Function and Preparation Method Thereof. The invention was developed by Sheng Mengwei, Li Mahui, Pan Yanting, La Xiaobo and Hou Huihui.
The patent..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- State Intellectual Property Office of China has received Guangdong Nanhai Etetb Tech Co Ltd and Foshan Ruina New Material Tech Co Ltd patent application for Glass Powder for Front Conductive Paste of Topcon Solar Cell and Preparation Method of Glass Powder. Chen Juan, Qiu Huiguang, Huang Lianghui and Zeng Wen..
Semiconductor
| Tue 18 Aug 2026
Beijing, Aug. 19 -- State Intellectual Property Office of China has published Motor Xiqi Aircraft Engine Factory Hubei Co Ltd patent application for Interstellar Laser Communication Silicon Tritium Ball Nuclear Fusion Laser Emission Propeller. The invention was developed by Zhang Jian.
The patent application number is CN20241..
Semiconductor
| Wed 19 Aug 2026
Seoul, Aug. 19 -- Agency Defense Development has sought patent for Rotational Displacement Limitting Device for Controlling Resonance Phenomenon. This invention was developed by Shin Jong Il, Chun Young Ju and Kwon Young Min.
The patent application number is KR20230100662 20230801. The patent publication number is KR202500194..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Mikros Tech LLC has submitted a patent application for Liquid-cooling Embedded Chip Lid. Mcgowan Jesse D, Matter Drew M, Vivio Joseph Andrew and Sullivan Joseph T developed the invention.
The patent application number is WO2026US11784 20260120. The patent publication number is WO2026169428 (A1). Internation..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- National Inst Of Advanced Industrial Science And Technology has submitted a patent application for Optical Semiconductor Module. This invention was developed by Amano Takeru, Noriki Akihiro and Nakamura Fumi.
The patent application number is WO2025JP42436 20251205. The patent publication number is WO2026167..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Mitsubishi Gas Chemical Co Inc has submitted a patent application for Etching Solution for Copper Thin Film and Method for Manufacturing Semiconductor Substrate. Mikami Tatsuhiko and Yamashita Kohji developed the invention.
The patent application number is WO2025JP41077 20251126. The patent publication numb..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has received Panasonic Intellectual Property Management patent application for Light-emitting Panel Device and Mobile Body. Asai Yosuke, Kurosaki Ryo and Tomomatsu Shunsuke developed the invention.
The patent application number is WO2025JP37994 20251029. The patent p..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- GFE Fremat GmbH has submitted a patent application for Sputter Target for Providing a Target Material for Coating a Substrate in a Sputtering Process, Combination, Sputtering Apparatus, and Sputtering Method. Hüttl Grit developed the invention.
The patent application number is WO2026EP52858 20260204. The p..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Chinese Patent for Waste Liquid Recovery Mechanism of Hardware Electroplating Bath has been issued to Fujian Jinzhizu New Material Tech Co Ltd. This invention was developed by Cai Zhihua, Luo Liqun, Chen Rongsi and Ma Xingyan.
The patent application number is CN20242331671U 20241210. The patent publication..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Chinese Patent for Paper Core Feeding Device of Solar Cell Packaging Film Winding Machine has been issued to Nantong Jinweier Intelligent Equipment Co Ltd. This invention was developed by Chang Heng and Xin Wensheng.
The patent application number is CN202423235916U 20241226. The patent publication number i..
Semiconductor
| Wed 19 Aug 2026
Seoul, Aug. 19 -- Simmtech Co Ltd has submitted a patent application for Cavity Type Passive Chip Embedded Bybrid Glass Substrate and Manufactruing Method Thereof and Semiconductor Package Including the Same. Jong Tae Lee, Jun Soo Chang and Mun Sang You developed the invention.
The patent application number is KR20230100249 2..
Semiconductor
| Wed 19 Aug 2026
Seoul, Aug. 19 -- IMH Inc has sought patent for Manufacturing Process of Substrate for Semiconductor Device Integrated with Heat Dissipating Device. This invention was developed by Lee Jong Eun.
The patent application number is KR20230100207 20230801. The patent publication number is KR20250019280 (A). International Patent Cl..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has published Drychemicals Co Ltd patent application for Wafer Cleavage Separation Device and Cleavage Separation Method. The invention was developed by Chiba Tetsuya and Endo Koji.
The patent application number is WO2025JP19510 20250529. The patent publication numbe..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Shenzhen Foxwell Tech Co Ltd has been granted a patent for Tire Pressure Monitoring Sensor Circuit System and Equipment Based on NXP Control Chip. This invention was developed by Wu Liangjun, Lian Qingling, Bai Yunfei, Chi Cunjin and Feng Honggui.
The patent application number is CN202522171514U 20251014. ..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- State Intellectual Property Office of China has awarded a patent to Wuhan Huagong Laser Engineering and Huagong Tech Company Ltd for Substrate Preheating Device for Alloy Laser Additive Manufacturing. Huang Zhiwei, Qi Xinyi, Wan Renqin, Du Jianwei, Wang Jiangang, Liu Yong and Yeung Lee-kwan developed the inve..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has released Korea Research Inst Of Chemical Technology patent application for Dimethyl Sulfoxide (DMSO)-based Preparation Method for Perovskite Material and Perovskite Solar Cell Using Same. This invention was developed by Yoo Soo Bin, Yun Hyun Sung, Kang Bong Joo and ..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Dongguan Dianjin Surface Treat Co Ltd has received a patent for Plating Basket and Electroplating Equipment. This invention was developed by Guo Jian.
The patent application number is CN202422712885U 20241107. The patent publication number is CN223561745 (U). International Patent Classification codes are C..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- State Intellectual Property Office of China has awarded a patent to Coventya Environmental Plating Tech Jiangsu Co Ltd for Anode Bar and Electroplating Reaction Device. Ye Luhua, Wan Chenggang and Yang Shichang developed the invention.
The patent application number is CN202422663087U 20241101. The patent p..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Taizhou Suda Metal Products Co Ltd has been awarded a patent for Connector Base Electroplating Clamp Tool. This invention was developed by Zhao Wei, Zhang Lu and Zhu Qiulan.
The patent application number is CN202422990914U 20241205. The patent publication number is CN223561740 (U). International Patent Cla..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Shenzhen Hengxinyuan Prec Hardware Co Ltd has been granted a patent for Continuous Electroplating Centralizing Jig. This invention was developed by He Dabin, He Qiao and He Zhiheng.
The patent application number is CN202423180049U 20241223. The patent publication number is CN223561734 (U). International Pa..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Yunnan Heyide New Mat Co Ltd has obtained a patent for light-induced horizontal electroplating equipment. This invention was developed by Hua Yongyun, Du Xuefeng, Lei Shenhao, Ding Xiaojuan and Li Juping.
The patent application number is CN20242379399U 20241213. The patent publication number is CN223561733..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Coventya Environmental Plating Tech Jiangsu Co Ltd has obtained a patent for acid zinc-nickel electroplating reaction device. This invention was developed by Ye Luhua, Wan Chenggang and Yang Shichang.
The patent application number is CN202422663092U 20241101. The patent publication number is CN223561729 (U..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Fujian Inst Of Research On The Structure Of Matter Chinese Academy Of Sciences has filed a patent application for Aza Fused Ring Organic Semiconductor Compound Containing Aromatic Ring Substituted Side Chain and Preparation Method and Application of Aza Fused Ring Organic Semiconductor Compound. This inventio..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- State Intellectual Property Office of China has released Zhejiang Uivoled Photoelectric Tech Co Ltd patent application for Organic Compound, OLED (organic Light Emitting Diode) with Compound and Application. This invention was developed by Liu Yunqi, Han Yufeng, Zhang Lei, Zhang Huaxing, Wu Kongwu, Zhao Xiaoy..
Semiconductor
| Tue 18 Aug 2026
Beijing, Aug. 19 -- Liyang Tianmu Pilot Battery Material Tech Co Ltd has sought patent for Multilayer Carbon-coated Mesoporous Silicon Carbon Negative Electrode Material and Preparation Method and Application Thereof. This invention was developed by Li Shaozhong, Cheng Wenbo, Wang Shuo, Liu Bainan and Luo Fei.
The patent appl..
Semiconductor
| Wed 19 Aug 2026
Seoul, Aug. 19 -- Korean Intellectual Property Office has released IT&T patent application for Test Head of Automated Semiconductor Test Equipment. This invention was developed by Chang Kyung Hun.
The patent application number is KR20230100760 20230802. The patent publication number is KR20250019776 (A). International Patent ..
Semiconductor
| Wed 19 Aug 2026
Seoul, Aug. 19 -- OS Co Ltd has sought patent for Substrate Processing Apparatus with Suseptor Heated by Microwaves and Substrate Processing Method Using It. This invention was developed by Lee Eung Goo.
The patent application number is KR20240001465 20240104. The patent publication number is KR20250019556 (A). International ..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has published Tokyo Electron Ltd and Tokyo Electron US Holdings patent application for Control System and Method. The invention was developed by Box Brayden and Fulford Daniel.
The patent application number is WO2025US53933 20251104. The patent publication number is ..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has published The Florida International University Board Of Trustees and Applied Materials patent application for Magnetic Thin Film Process Chamber Design for High-density Power Converters. The invention was developed by Kengeri Subramani, Pulugurtha Markondeyaraj, Pia..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has published Tokyo Electron Ltd and Tokyo Electron US Holdings patent application for Methods That Utilize Photosensitive Organometallic Oxides Formed by Chemical Vapor Polymerization. The invention was developed by Tapily Kandabara and Matsuki Nobuo.
The patent app..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Ytools Inc has submitted a patent application for Out-coupling Techniques for Accelerator-based Light Sources in Semiconductor Metrology and Inspection Applications. This invention was developed by Schumaker William.
The patent application number is WO2025US37039 20250709. The patent publication number is W..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has released Patentix Inc patent application for Laminated Structure, Semiconductor Device, Electronic Equipment, and System. This invention was developed by Shimizu Yuri.
The patent application number is WO2026JP04302 20260205. The patent publication number is WO202..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Patentix Inc has submitted a patent application for Laminated Structure, Semiconductor Device, Electronic Equipment, and System. This invention was developed by Yagura Toya and Shimizu Yuri.
The patent application number is WO2026JP04301 20260205. The patent publication number is WO2026168563 (A1). Internat..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Jiangmen Qinjian Semiconductor Tech Co Ltd has submitted a patent application for Led String, String Combination, and System. This invention was developed by Tam Yim Ying.
The patent application number is WO2025CN118124 20250830. The patent publication number is WO2026166082 (A1). International Patent Class..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has received 1finity Inc, Tian Yan, Zhang Lei and Sun Gang patent application for Method and Apparatus for Determining Chip Duration of Device-to-reader/writer Transmission.
The patent application number is WO2025CN76235 20250207. The patent publication number is WO..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has published NVIDIA Corp and Abel Daniel Gershon patent application for Tensor Transposition.
The patent application number is WO2025CN76037 20250206. The patent publication number is WO2026165767 (A1). International Patent Classification code is G06F17/16. Cooperativ..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has released Nexperia BV and Nexperia Technology (Shanghai) patent application for a Method of Manufacturing a Semiconductor Package and a Semiconductor Package. This invention was developed by Cao Pulong, Wang Ruitong and Gong Wei.
The patent application number is W..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Suzhou Kaiboyun Information Tech Co Ltd has obtained a patent for frame body structure for semiconductor wafer box carrying and air storage equipment. This invention was developed by Wang Shanqian and Fan Hutai.
The patent application number is CN202423282871U 20241230. The patent publication number is CN2..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Chinese Patent for Fixing Clamp for Packaging Semiconductor Structure has been issued to Dongguan Haiyi Prec Machinery Co Ltd. This invention was developed by Xie Jian and Liu Jianping.
The patent application number is CN202422874859U 20241125. The patent publication number is CN223558248 (U). Internationa..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Changzhou Xueshili Tools Co Ltd has received a patent for Aluminum Alloy Machining Reamer Capable of Enhancing Chip Removal Effect. This invention was developed by Yuan Zhifang and Tang Bingbing.
The patent application number is CN202422884061U 20241126. The patent publication number is CN223557410 (U). In..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Chinese Patent for Steel Coil Slitting Device for Transformer Silicon Steel Sheet Machining has been issued to Dongguan Yingde Prec Hardware Co Ltd. This invention was developed by Liu Ziyang, Liu Runzhi and Shan Shuyi.
The patent application number is CN202423126567U 20241218. The patent publication numbe..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Zhuhai Injoinic Semiconductor Co Ltd has submitted a patent application for Power Supply Circuit and Power Supply Chip. This invention was developed by Huang Shicheng and Yao Shouxiang.
The patent application number is CN20261096756 20260123. The patent publication number is CN122119155 (A). International ..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Inner Mongolia Tairu Power Tech Co Ltd has submitted a patent application for Smart Grid Power System Equipment Coordination Control System Based on Domestic Chip. Ai Kewei, Li Yanchun, Zhang Na, Baik Sule and Zhao Peng developed the invention.
The patent application number is CN202610238074 20260228. The ..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Mix Design Semiconductor Tech Limited has submitted a patent application for Power Distribution Control Method and System for Multi-port Charger. This invention was developed by Nie Xiaozhi.
The patent application number is CN20261097755 20260124. The patent publication number is CN122119057 (A). Internati..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- State Intellectual Property Office of China has received Improve Beijing Biotechnology Co Ltd patent application for Water-based Silicon Modified Acrylic Resin as Well as Preparation Method and Application Thereof. Cui Xiao, Xiao Fei and Liu Quan developed the invention.
The patent application number is CN..
Semiconductor
| Tue 18 Aug 2026
Beijing, Aug. 19 -- Shandong Hanya Network Tech Co Ltd has submitted a patent application for Inductively Coupled Plasma Etching Machine and Method Based on Semiconductor Device Production. This invention was developed by Sun Yanli, Li Danzhou and Wang Ge.
The patent application number is CN202610257193 20260304. The patent p..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has published Konkuk Univ Industry Academic Cooperation Foundation patent application for Output Voltage Variable Ev Charger Based on Bidirectional Power Semiconductor and Charging Method Thereof. The invention was developed by Kim Bonggook, Lee Do Hong and Cho Young Ho..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Lordin Co Ltd has submitted a patent application for Novel Light-emitting Layer Material and Organic Light-emitting Diode Comprising Same. This invention was developed by Kim Eun Bi, Han Ga Ram and Park Bu Bae.
The patent application number is WO2026KR02050 20260204. The patent publication number is WO20261..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Snt Co Ltd has filed a patent application for Automatic Assembly System of Camera Holder and Substrate. This invention was developed by Choi Sin Ryong, Noh Sang Soo and Kang Weon Soon.
The patent application number is WO2026KR01863 20260202. The patent publication number is WO2026168898 (A1). International ..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has released Corintis SA patent application for Semiconductor Assemblies and Methods for Cooling a Semiconductor Assembly and a Method for Manufacturing a Semiconductor Assembly. This invention was developed by Fahrni Malik and Teodoro Federica.
The patent applicatio..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has received IBM United Kingdom Ltd and International Business Machines patent application for Detecting and Addressing Power Side Channels in Semiconductor Architecture and Microarchitechture. Santiago-fernandez William, Bose Pradip, Bertran Monfort Ramon, Buyuktosunog..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- State Intellectual Property Office of China has awarded a patent to Guangdong Fangzhou Zhizao Tech Co Ltd for Circuit Film Feeding Device with Chip Removing Function. Kong Linghai and Li Haitao developed the invention.
The patent application number is CN202423225322U 20241226. The patent publication number..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Shenzhen Liande Semiconductor Tech Co Ltd has been granted a patent for Material Taking and Placing Device of Semiconductor Support. Zhong Luquan, Hu Jin, Lai Taixin, Nong Yangfeng and Liao Wei developed the invention.
The patent application number is CN202422687727U 20241105. The patent publication number..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Suzhou Benrui Photoelectric Tech Co Ltd has been granted a patent for Touch Screen Substrate Cutting Device. This invention was developed by Tang Minchao and Han Qiang.
The patent application number is CN202423166823U 20241223. The patent publication number is CN223558584 (U). International Patent Classifi..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Wuxi Duoenduo Automation Co Ltd has been awarded a patent for Framing Clamp for Silicon Material Cleaning. This invention was developed by Wang Cunfa, Wu Xiaojie and Yang Pengcheng.
The patent application number is CN202423258051U 20241227. The patent publication number is CN223558447 (U). International Pa..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Zhejiang Jinli Tech Co Ltd has been awarded a patent for Mounting Platform for Cvd (chemical Vapor Deposition) Laser Cutting Machine. This invention was developed by He Keqiang.
The patent application number is CN202423166791U 20241223. The patent publication number is CN223557558 (U). International Patent..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- State Intellectual Property Office of China has published Beijing Inst Technology patent application for Cmos-mems Three-dimensional Integration Technology. The invention was developed by Tang Yue, Wang Hua, Xie Huikai, Wang Xiaoyi and Gao Wenwei.
The patent application number is CN202610271073 20260306. T..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has published Tachyum Ltd patent application for 128 Byte Cache Line Memory Controller for Non-standard Dimm Architecture. The invention was developed by Danilak Radoslav, Herman Pinchas and Radke William.
The patent application number is WO2026US14086 20260205. The ..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has published Lanza Laura, Novelis Inc and Damico Jim patent application for Solar Cells on Metallic Substrates. The invention was developed by Kuhn Chad, Macfarlane Theresa Elizabeth, Lanza Laura, Kosmicki Tina, Kirkham Steven, Damico Jim, Costello Barney Isamu and Sim..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has published Astemo Ltd and Hitachi patent application for Power Conversion Device. The invention was developed by Chen Ti, Asai Kyota, Kanno Kiyotaka, Tokuyama Takeshi and Nagasaki Hironori.
The patent application number is WO2025JP45758 20251225. The patent public..
Semiconductor
| Wed 19 Aug 2026
Seoul, Aug. 19 -- Korean Intellectual Property Office has published Hyundai Motor and Kia patent application for Semiconductor Device and Method for Manufacturing the Same. The invention was developed by Chun Dae Hwan, Joo Nackyong, Hong Jungyeop, Jung Youngkyun and Park Junghee.
The patent application number is KR20230100244..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- GTG Solution Co Ltd has sought patent for Semiconductor Test Pin. This invention was developed by Lim Jong-gae.
The patent application number is WO2025KR02073 20250212. The patent publication number is WO2026168636 (A1). International Patent Classification codes are G01R1/067 and G01R31/28.
An abstract ..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Xiancai Shenzhen Semiconductor Tech Co Ltd has been granted a patent for Sealing Structure for Diamond Deposition Reaction Cavity. This invention was developed by Xu Bincheng, Wu Jianwei and He Minhao.
The patent application number is CN202423248771U 20241227. The patent publication number is CN223561691 (..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Aihua Wuxi Semiconductor Tech Co Ltd has been granted a patent for ALD Equipment Double-screw-rod Vertical Transmission and Horizontal Transfer Device. Qiao Xingchuan developed the invention.
The patent application number is CN20242369852U 20241212. The patent publication number is CN223561685 (U). Interna..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Chinese Patent for Cover Type Bright Annealing Furnace has been issued to Hebei Junjian Semiconductor Technology and Hebei Qingfeng Machinery Co Ltd. This invention was developed by Wang Jiashu, Fu Heng, Li Lifen, Wang Zian and Ge Xiaozhou.
The patent application number is CN202422830209U 20241120. The pat..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Guangdong Zhongding Tech Development Co Ltd has applied Chinese patent for Low-dielectric Lcp (liquid Crystal Polymer) Composite Material as Well as Preparation Method and Application Thereof. Yang Ru, Li Feng and Yang Rong developed it.
The patent application number is CN202610200789 20260211. The patent ..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has released Centre National De La Recherche Scient CNRS, University Paris Cite and University De Montpellier patent application for Laser Light Source Emitting in the Terahertz Gap Using Landau Polaritons. This invention was developed by Consejo Christophe, Teppe Fréd..
Semiconductor
| Tue 18 Aug 2026
Beijing, Aug. 19 -- Xiamen Qilei Optoelectronics Tech Co Ltd has sought patent for Key Capable of Emitting Noctilucence and Noctilucent Component. This invention was developed by Yao Mingxian.
The patent application number is CN202610506580 20260416. The patent publication number is CN122117680 (A). International Patent Class..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- World Intellectual Property Organization has published App Co Ltd patent application for Semiconductor Plasma Treatment Apparatus and Efem Using Same. The invention was developed by Yoo Kyoung Seok, Kang Bang Kwon, Park Sang Hoon and Joo Kyeong Jin.
The patent application number is WO2026KR01978 20260203. T..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Henan Fuhuai Semiconductor Mat Co Ltd has secured a patent on Bucket Fixing Structure for Quartz Sand Chlorination Purification Discharging Car. Huang Wenlong developed the invention.
The patent application number is CN202423293046U 20241230. The patent publication number is CN223560797 (U). International ..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- Quick Intelligent Equip Co Ltd has received a patent for Chip Sucking and Clamping Correction Mechanism. This invention was developed by Zhang Heng, Li Jie and Chen Lei.
The patent application number is CN202423197577U 20241224. The patent publication number is CN223560729 (U). International Patent Classif..
Semiconductor
| Wed 19 Aug 2026
Beijing, Aug. 19 -- State Intellectual Property Office of China has awarded a patent to Shanghai Xincai Semiconductor Tech Co Ltd for Integrated Circuit Pickup Device. Chen Feng developed the invention.
The patent application number is CN20242369510U 20241212. The patent publication number is CN223560724 (U). International Pa..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Tokyo Electron Ltd and Tokyo Electron US Holdings have submitted a patent application for Design/topography Based Z-height & Optical Proximity Correction (opc) Optimization & Co-optimization. Power Dave, Grzeskowiak Jodi and Conklin David developed the invention.
The patent application number is WO2025US532..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Tokyo Electron Ltd and Tokyo Electron US Holdings have applied WIPO patent for In-situ Hybrid Bonding Test Measurements. Mukhopadhyay Partha and Fulford H Jim developed it.
The patent application number is WO2025US49556 20251006. The patent publication number is WO2026169294 (A1). International Patent Class..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- The Florida International University Board Of Trustees and Applied Materials have submitted a patent application for Power Delivery for AI Computing with Orthogonal Embedding and Edge Access. Kengeri Subramani, Pulugurtha Markondeyaraj, Pial Mohammad Mohtasim Hamid, Al Duhni Ghaleb Saleh Ghaleb and Khasgiwala ..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Tokyo Electron Ltd and Shim Youngsuk have submitted a patent application for Nanostructure-based High-performance Radical and Cation Measurement Device and Method for Manufacturing Same. Won Jaihyung, Kim Doyeon, Shim Youngsuk, Lee Naeil, Choi Joongki, Cho Yun-haeng and Shim Hyomin developed the invention.
..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- LG Innotek Co Ltd and Seoul National University R&DB Foundation have submitted a patent application for Antenna Substrate and Antenna Substrate Module Comprising Same. Kim Su Cheoul, Oh Jeong Taek, Ha Ji Hun, Oh Jung Suek, Yang Chan Woo and Choi Jae Hyun developed the invention.
The patent application numbe..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Dunna Manideep, Bharadia Dinesh, Mercier Patrick and The Regents of The University of California have filed a patent application for Active Backscatter Integrated Circuit for 3gpp/wifi/ble Ambient IoT Application. This invention was developed by Bharadia Dinesh, Kuo Shih-kai, Dunna Manideep and Mercier Patrick..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- The University Of Tokyo and Daikin India have submitted a patent application for Resin, Polyimide Production Method, Polyamic Acid, Functional Material, Diamine Compound, Diamine Compound Production Method, Resin Composition, High-frequency Substrate Film, Metal-clad Laminate, and Circuit Board. Enomoto Yukiko..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Beijing BOE Tech Development Co Ltd, Mianyang BOE Optoelectronics Tech Co Ltd and BOE Technology Group have sought patent for Display Substrate and Display Apparatus. This invention was developed by Xu Yuanjie, Zhang Daiying, Xu Hongfei, Xu Guanghua, Li Shuang and Lu Xiaogang.
The patent application number ..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Hefei BOE Ruisheng Tech Co Ltd and BOE Technology Group have sought patent for Electroplating Shielding Frame and Electroplating Device. This invention was developed by Zhang Jianying, Hu Haifeng, Wang Haixin, Jiang Xiane, Wang Wei, He Xuefang, Yang Caigui, Liu Huan and Huang Jing.
The patent application nu..
Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Guo Can, Tran Sang, Valaboju Bhaskar, Arepalli Naveen Kumar Goud, Zhang Rongtian, Hari Anjana, Pragallapati Pradeep VK, Rawat Nitin and Qualcomm have filed a patent application for Efficient Bad Block Management for Raw Nand-based Non-volatile Memory (NVM) Devices. This invention was developed by Hari Anjana, ..
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