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Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Merck Patent has applied WIPO patent for Composition, Manufacturing Method of Cured Film, Manufacturing Method of Electronic Element, and Use of Composition. Aida Kensuke, Ozaki Yuki and Hayashi Masanobu developed it.
The patent application number is WO2025EP88665 20251222. The patent publication number is ..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Yinguan Semiconductor Technology has applied WIPO patent for Fine-motion Stage and Motion System. Wu Yuhang, Chen Xiaohu, Jiang Xuchu and Wu Huoliang developed it.
The patent application number is WO2025CN144640 20251223. The patent publication number is WO2026138775 (A1). International Patent Classificatio..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- LG Chemical has applied Chinese patent for Compound and Organic Light-emitting Element Comprising Same. Lee Woochul, Hwang Sung-hyun, Cha Yongbum, Kim Moung-gon and Kim Kyunghee developed it.
The patent application number is CN20258004493 20250604. The patent publication number is CN121816341 (A). Internat..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- Samsung Electronics has submitted a patent application for Semiconductor Device and Data Storage System Including Same. This invention was developed by Jeon Woo-yong, Gao Xiuzhen, Sung Jeong-yong, Oh Dong-sik, Zhao Lai, Kim Hyun-ji and Lee Sung-chul.
The patent application number is CN202510918058 20250703..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- Winbond Electronics has submitted a patent application for Memory Element and Manufacturing Method Thereof. This invention was developed by Chen Huangnan.
The patent application number is CN202411706693 20241126. The patent publication number is CN121815656 (A). International Patent Classification code is ..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- Nuvoton Technology has submitted a patent application for Semiconductor Component and Method of Manufacturing the Same. This invention was developed by Pan Qinhan, Tong Yumou and Lin Yanyu.
The patent application number is CN202510649080 20250520. The patent publication number is CN121815715 (A). Internati..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- Nuvoton Technology has submitted a patent application for Semiconductor Device. This invention was developed by Zhang Huayuan.
The patent application number is CN202510750297 20250606. The patent publication number is CN121815716 (A). International Patent Classification codes are H10D30/65 and H10D62/10. C..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- Quanzhou Sanan Semiconductor Technology has submitted a patent application for Light-emitting Element and Light-emitting Device. This invention was developed by Ma Yiming, Han Tao, Yu Yanling, Xie Kunda, Xu Jin, Huang Shaohua, Wang Yuejiao, Huang Xiuli, Zhou Hongyi, Tu Ruqin, Yang Xinxin and Zhang Zhongying.
..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- Xiamen Sanan Optoelectronics has submitted a patent application for Light Emitting Diode and Light Emitting Device. Wu Meijian, Huang Huihuang, Liu Fei, Xu Jin, Wang Qing, Hong Lingyuan, Li Liyang and Zhang Zhongying developed the invention.
The patent application number is CN202511908810 20251217. The pat..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- Huizhou Jufei Optoelectronics has submitted a patent application for Light-emitting Device. Sun Pingru, Ma Wenbo and Xing Meizheng developed the invention.
The patent application number is CN202610182135 20260209. The patent publication number is CN121815856 (A). International Patent Classification codes a..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- Jiangsu Tianxin Micro Semiconductor Equipment has submitted a patent application for Semiconductor Device Capable of Detecting Fracture State of Preheating Ring. This invention was developed by Jia Zhihui, Xie Sen and Xu Xiaokun.
The patent application number is CN202511970493 20251224. The patent publicat..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- Samsung Electronics has submitted a patent application for Semiconductor Device. This invention was developed by Noh Yun-suk, Qin Youzhen, Park Sang-eon, Ryu Hae-min, Lee Ju Hwan and Liu Taiyang.
The patent application number is CN202510832661 20250620. The patent publication number is CN121816047 (A). Int..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- MeetFuture Technology (Shanghai) has submitted a patent application for Semiconductor Carrying Equipment Motion Control Method, Device and Equipment. This invention was developed by Wu Wenlong, Liang Shutian, Miao Feng, Tian Xinglong and Wu Jierong.
The patent application number is CN202511995906 20251226...
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Fujikura has submitted a patent application for Stereolithography Device and Platform. This invention was developed by Kusaka Hiroyuki and Kunai Yuichiro.
The patent application number is WO2025JP32630 20250917. The patent publication number is WO2026140384 (A1). International Patent Classification codes ar..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Sony Group has submitted a patent application for Light-emitting Device. This invention was developed by Koda Rintaro, Higa Yasutaka, Song Gyongsok, Wada Koshiro and Watanabe Hideki.
The patent application number is WO2025JP38315 20251031. The patent publication number is WO2026140501 (A1). International Pa..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Ebara has submitted a patent application for Structural Component Mounting Structure. This invention was developed by Miyamoto Matsutaro and Takayama Makoto.
The patent application number is WO2025JP39764 20251113. The patent publication number is WO2026140572 (A1). International Patent Classification codes..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Semiconductor Device. This invention was developed by Sato Shinya.
The patent application number is WO2025JP40368 20251119. The patent publication number is WO2026140608 (A1). International Patent Classification codes are H01S5/..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Light-emitting Device and Method of Manufacturing Light-emitting Device. Suzuki Yasuhiko developed the invention.
The patent application number is WO2025JP41107 20251126. The patent publication number is WO2026140648 (A1). Inter..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Sony Group has submitted a patent application for Microchip, Microparticle Sorting System, and Microparticle Sorting Method. This invention was developed by Ito Tatsumi, Nakamura Masahiko, Matsumoto Masahiro and Hidaka Isao.
The patent application number is WO2025JP43042 20251210. The patent publication num..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Element Device. This invention was developed by Nagatome Hiroki, Hatano Keisuke and Tsuta Mai.
The patent application number is WO2025JP43234 20251211. The patent publication number is WO2026140902 (A1). International Patent Cla..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Light-emitting Device. This invention was developed by Masuda Wataru and Matsuyama Ryoji.
The patent application number is WO2025JP44076 20251217. The patent publication number is WO2026141082 (A1). International Patent Classifi..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- University of Tokyo has submitted a patent application for Gate Drive Device. This invention was developed by Takamiya Makoto, Hata Katsuhiro and Liang Yaogan.
The patent application number is WO2025JP44410 20251218. The patent publication number is WO2026141156 (A1). International Patent Classification cod..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- ACM Research, Shanghai has submitted a patent application for Semiconductor Apparatus. This invention was developed by Chu Zhenming, Zhang Zhonglong and Zhang Xiaoyan.
The patent application number is WO2025CN129573 20251023. The patent publication number is WO2026138107 (A1). International Patent Classific..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Sanechips Technology has submitted a patent application for Baseband Chip, Transmitter, and Terminal Device. This invention was developed by Yu Han.
The patent application number is WO2025CN133080 20251106. The patent publication number is WO2026138191 (A1). International Patent Classification code is H04B1..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Wuxi China Resources Huajing Microelectronics has submitted a patent application for Semiconductor Device, Manufacturing Method Therefor and Layout Structure Thereof. This invention was developed by Xiao Xuan, Ye Jun, Liu Haonan, Song Yang and He Mingjiang.
The patent application number is WO2025CN134926 20..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- China Satellite Network Innovation has filed a patent application for Beam Management Method, Device, Chip, and Storage Medium. This invention was developed by Mang Ge, Zhang Yang, Chi Dianting and Qi Dongqing.
The patent application number is WO2025CN120962 20250912. The patent publication number is WO2026..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Ebara has filed a patent application for Top Ring and Substrate Polishing Device. This invention was developed by Kashiwagi Makoto.
The patent application number is WO2025JP44695 20251222. The patent publication number is WO2026141237 (A1). International Patent Classification codes are B24B37/10, B24B37/12, B..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has released Resonac Hard Disk patent application for Substrate for Magnetic Recording Medium, Manufacturing Method for Substrate for Magnetic Recording Medium, Magnetic Recording Medium, and Magnetic Storage Device. This invention was developed by Onishi Harumichi, Sug..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- State Intellectual Property Office of China has received Samsung Display patent application for Display Device. Lee Hee-chul developed the invention.
The patent application number is CN20248058197 20240910. The patent publication number is CN121816855 (A). International Patent Classification codes are G09G..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Hisense Broadband Multimedia Technology has submitted a patent application for Laser Chip and Method for Preparation Thereof. This invention was developed by Li Yu, Wang Tao and Chen Hongmin.
The patent application number is WO2025CN123340 20250923. The patent publication number is WO2026138027 (A1). Intern..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Electronics & Telecommunications Res Institute and Electronics And Telecommunications Research Institute have received a patent for Package for Silicon Photonics Device and Implementation Method Thereof. This invention was developed by Lee Jyung Chan.
The patent application number is US202318106646 2023..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Beijing BOE Sensor Technology Co Ltd and BOE Technology Group have received a patent for Micro-fluidic Chip, Library Preparation Chip and Method for Controlling and Driving Droplet. This invention was developed by Wei Qiuxu, Fan Bolin, Zhao Yingying, Yao Wenliang, Liao Hui, Gao Yongjia and Gu Le.
The pat..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Eagle Xience Tech Limited and Micron Eagle Hydraulics Inc have secured a patent on Health Meter. Whiting Paul, Nagel Henry and Nagel Andreas developed the invention.
The patent application number is US202017782077 20201202. The patent publication number is US12667800 (B2). International Patent Classifica..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Nippon Electric Glass has submitted a patent application for Perforated Glass Substrate for Semiconductor Package, Glass Substrate for Semiconductor Package, and Method for Producing Perforated Glass Substrate for Semiconductor Package. Makita Masaki developed the invention.
The patent application number is W..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Nippon Electric Glass has submitted a patent application for Perforated Glass Substrate for Semiconductor Package, Glass Substrate for Semiconductor Package, and Method for Producing Perforated Glass Substrate for Semiconductor Package. This invention was developed by Makita Masaki.
The patent application num..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Panasonic Intellectual Property Management has submitted a patent application for Chip Resistor and Method for Manufacturing Chip Resistor. Urakawa Tatsuya developed the invention.
The patent application number is WO2025JP44769 20251222. The patent publication number is WO2026141272 (A1). International Patent..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Sony Semiconductor Solutions Corporation has applied WIPO patent for Semiconductor Device and Method of Manufacturing Semiconductor Device. Satou Hideyuki developed it.
The patent application number is WO2025JP42447 20251205. The patent publication number is WO2026140784 (A1). International Patent Classificat..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Tokyo Ohka Kogyo has submitted a patent application for Semiconductor Device Processing Liquid, Substrate Processing Method, and Semiconductor Device Manufacturing Method. This invention was developed by Mori Daijiro and Takashima Hayato.
The patent application number is WO2025JP42427 20251205. The patent pub..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Tokyo Ohka Kogyo has filed a patent application for Processing Liquid for Semiconductor Device, Method for Processing Substrate, and Method for Manufacturing Semiconductor Device. This invention was developed by Mori Daijiro and Takashima Hayato.
The patent application number is WO2025JP42426 20251205. The pa..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has published National Center for Advanced Packaging patent application for Radiation-resistant Packaging Structure and Method for Manufacturing Same. The invention was developed by Chen Lijun.
The patent application number is WO2025CN99243 20250605. The patent publi..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has released Toray Industries patent application for Photosensitive Resin Composition, Cured Product, Method for Producing Cured Product, Semiconductor Device, and Display Device. This invention was developed by Kobayashi Yasuhiro, Yamashita Sahori and Hashimoto Keika.
..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has published Sony Semiconductor Solutions Corporation patent application for Circuit Device and Memory Device. The invention was developed by Kanemura Takuro.
The patent application number is WO2025JP42253 20251204. The patent publication number is WO2026140750 (A1). ..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Resonac has submitted a patent application for Temporary Fixation Film, Laminate for Temporary Fixation, and Production Method for Semiconductor Device. Akasu Yuta, Miyazawa Emi and Enomoto Tetsuya developed the invention.
The patent application number is WO2025JP42244 20251203. The patent publication number ..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Socionext has submitted a patent application for Semiconductor Integrated Circuit Device. This invention was developed by Ono Masachika.
The patent application number is WO2025JP41687 20251128. The patent publication number is WO2026140685 (A1). International Patent Classification code is H10D89/10.
An abst..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has received Resonac patent application for Photosensitive Resin Composition, Photosensitive Resin Film, Printed Wiring Board and Production Method for Same, and Semiconductor Package. Yamada Kumpei, Konno Yuko, Nojiri Takeshi and Otsuki Daisuke developed the invention...
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has published Tokyo Electron patent application for Sealing Structure, Pressure Container and Sealing Method. The invention was developed by Hsu Fu Chieh, Ishii Toru, Lee Cheng Hsiung, Igarashi Reita, Hung Chun Hung and Kuo Chi Ming.
The patent application number is WO..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Tokyo Electron has submitted a patent application for Semiconductor Processing System and Method of Operating the Same. This invention was developed by Hsu Fu Chieh, Lee Cheng Hsiung, Hung Chun Hung and Kuo Chi Ming.
The patent application number is WO2025JP43249 20251211. The patent publication number is WO2..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Tokyo Electron has submitted a patent application for Semiconductor Equipment and Pressure Control Method Thereof. This invention was developed by Hsu Fu Chieh, Lee Cheng Hsiung, Hung Chun Hung and Kuo Chi Ming.
The patent application number is WO2025JP43229 20251211. The patent publication number is WO202614..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Tokyo Electron has sought patent for Information Processing Method, Computer Program, and Information Processing Device. This invention was developed by Kondo Taisei.
The patent application number is WO2025JP43210 20251211. The patent publication number is WO2026140897 (A1). International Patent Classificatio..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Murata Manufacturing has submitted a patent application for Low-temperature Fired Ceramic Substrate. This invention was developed by Sugimoto Yasutaka and Senshu Yutaka.
The patent application number is WO2025JP43208 20251211. The patent publication number is WO2026140896 (A1). International Patent Classifica..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Tokyo Electron has submitted a patent application for Substrate Conveyance Control Method and Substrate Processing System. This invention was developed by Murakami Kosei, Egashira Atsushi, Wang Nan and Kubota Issei.
The patent application number is WO2025JP43199 20251211. The patent publication number is WO20..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Hitachi has submitted a patent application for Quantum Semiconductor Device and Quantum Computer. This invention was developed by Kusuno Nobuhiro and Yazaki Masako.
The patent application number is WO2025JP41926 20251202. The patent publication number is WO2026140712 (A1).
An abstract released by the World ..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Tsinghua University has submitted a patent application for Optical Neural Network Based on Dispersive Nonlinearity, and Optical Neural Chip. Gao Heyang, Xiong Jian, Liu Fang, Huang Yidong, Feng Xue, Cui Kaiyu and Zhang Wei developed the invention.
The patent application number is WO2025CN87294 20250403. The p..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has released Sony Semiconductor Solutions Corporation patent application for Semiconductor Device and Method for Producing Semiconductor Device. This invention was developed by Suda Masayuki.
The patent application number is WO2025JP41762 20251201. The patent publicati..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have received a patent for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Chang Hung-pin, Wu Wei-cheng and Yeh Der-chyang.
The patent application number is US202318316237 20230512. The patent publicati..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have obtained a patent for semiconductor structure and method for forming the same. This invention was developed by Chang Jen-yuan.
The patent application number is US202217814003 20220721. The patent publication number is US12666997 (B2). I..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have received a patent for Semiconductor Structure and Forming Method Thereof. This invention was developed by Kao Min-feng, Yaung Dun-nian, Liu Jen-cheng and Lin Hsing-chih.
The patent application number is US202318150184 20230104. The pate..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have secured a patent on Anti-fuse Cells with Backside Power Rails. Yang I-hsin and Chang Meng-sheng developed the invention.
The patent application number is US202418428920 20240131. The patent publication number is US12666957 (B2). Interna..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has received Spreadtrum Semiconductor (Nanjing) patent application for Channel Access Method and Apparatus, and Device. Quan Yingqiao, Pan Zhengang, Ren Qiwei, Gu Xiangxin and Xu Zhikun developed the invention.
The patent application number is WO2025CN145947 20251226..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Idemitsu Kosan has submitted a patent application for Polyformal Resin, Resin Composition, Cured Product, Film, Coating Liquid Composition, Prepreg, and Electronic Substrate. Hikosaka Takaaki, Morishita Hironobu, Nakamura Masato and Fukita Momoe developed the invention.
The patent application number is WO2025..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Tokyo Electron has submitted a patent application for Information Processing Method, Information Processing Device, and Computer Program. Kawamura Koji and Takahashi Chihiro developed the invention.
The patent application number is WO2025JP42982 20251210. The patent publication number is WO2026140856 (A1). In..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has received Sony Semiconductor Solutions Corporation patent application for Ranging Device and Ranging System. Hamamatsu Masamune, Sekiya Akito, Watanabe Akihiro, Ohkawa Takeshi and Ohara Seiya developed the invention.
The patent application number is WO2025JP42853 ..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has received Mitsubishi Heavy Industries patent application for Substrate Tube, Electrolysis Cell Stack Provided with Same, Electrolysis Cell Cartridge and Electrolysis Cell Module, and Method for Manufacturing Electrolysis Cell Stack. Mizoguchi Tomoki, Mori Ryutaro, Ik..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has received Hamamatsu Photonics patent application for Semiconductor Laser Bar Unit, Layered Structure, and Method for Manufacturing Semiconductor Laser Bar Unit. Kageyama Nobuto developed the invention.
The patent application number is WO2025JP30350 20250828. The p..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Tohoku University has sought patent for Nonvolatile Integrated Circuit. This invention was developed by Yoshida Tomoo, Natsui Masanori and Hanyu Takahiro.
The patent application number is WO2025JP20771 20250609. The patent publication number is WO2026140296 (A1). International Patent Classification code is G1..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Guangdong OPPO Mobile Telecommunications has filed a patent application for Sensing Service Execution Method and Apparatus, and Device, Chip and Storage Medium. This invention was developed by Liang Bin, Xu Jing and Wu Danyang.
The patent application number is WO2024CN142236 20241225. The patent publication n..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- AGC Inc has sought patent for Antireflection Film–coated Transparent Substrate. This invention was developed by Zukeran Tomohiro and Takemoto Kazuya.
The patent application number is WO2025JP18263 20250520. The patent publication number is WO2026140283 (A1). International Patent Classification codes are C03..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has published Guangdong University of Technology patent application for Preparation Method and Apparatus for Metallization Slurry for Package Substrate. The invention was developed by Da Xianhao, Li Zebo, He Weiwei, Yang Guannan, Huang Guanghan, Zhang Yu and Cui Chengqi..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has published BOE Technology Group patent application for Pixel Circuit and Driving Method Therefor, and Display Substrate. The invention was developed by Dong Tian.
The patent application number is WO2024CN141743 20241224. The patent publication number is WO20261371..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Rapidus has filed a patent application for Semiconductor Cooling Device, Semiconductor Component, Method for Manufacturing Semiconductor Cooling Device, and Method for Manufacturing Semiconductor Component. This invention was developed by Hasegawa Kiyohisa and Okamoto Keishi.
The patent application number i..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Resonac has sought patent for Prepreg, Metal-clad Laminate, Printed Wiring Board, and Semiconductor Package. This invention was developed by Sakaguchi Takako, Ando Haruki, Saga Kohei, Morita Koji, Yoshimura Natsumi, Kasuga Keiichi, Mameda Keisuke and Abe Shinichiro.
The patent application number is WO2024JP46..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Western Digital Tech Inc and SanDisk Technologies have been awarded a patent for Laser Cutting with Electron Removal. This invention was developed by Zhong Guocheng, Huang Yiqin, Xue Dongpeng, Zhang Cong, Chiu Hope and Jiang Weiting.
The patent application number is US202217837175 20220610. The patent pu..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Ebara has sought patent for Retainer, Top Ring, and Substrate Processing Apparatus. This invention was developed by Kamada Naoki, Kato Yuichi, Yamaki Satoru and Nabeya Osamu.
The patent application number is WO2025JP39898 20251114. The patent publication number is WO2026140582 (A1). International Patent Class..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Tokyo Electron has applied WIPO patent for Substrate Processing Device. Nakamura Keigo, Ishikawa Manabu and Amikura Norihiko developed it.
The patent application number is WO2025JP39144 20251107. The patent publication number is WO2026140542 (A1). International Patent Classification codes are H10P14/60 and H1..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Dainippon Ink & Chemicals has submitted a patent application for Curable Resin, Resin Containing Haloethyl Group, Method for Producing Curable Resin, Curable Composition, Cured Object, Prepreg, Circuit Board, Build-up Film, Semiconductor-sealing Material, and Semiconductor Device. Kim Youngchan, Hazama Masaki ..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Nippon Catalytic Chemical Industrial has applied WIPO patent for Aqueous Inkjet Composition and Method for Forming Printing Substrate Using Said Composition. Yamamoto Tatsuya developed it.
The patent application number is WO2025JP37155 20251022. The patent publication number is WO2026140455 (A1). Internationa..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Resonac has submitted a patent application for Semiconductor Device and Method for Producing Semiconductor Device. This invention was developed by Tamura Shinobu, Uematsu Daichi and Kanai Shunsuke.
The patent application number is WO2025JP36345 20251015. The patent publication number is WO2026140433 (A1). Int..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Rapidus has sought patent for Semiconductor Device and Method for Manufacturing Semiconductor Device. This invention was developed by Takahashi Kota.
The patent application number is WO2025JP34381 20250929. The patent publication number is WO2026140402 (A1). International Patent Classification code is H10D30/..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- Kokusai Electric has submitted a patent application for Substrate Processing Method, Method for Manufacturing Semiconductor Device, Program, and Substrate Processing Device. Yamazaki Hirohisa, Usuki Kenshiro and Ikeda Yuma developed the invention.
The patent application number is WO2025JP33134 20250919. The p..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have secured a patent on Semiconductor Device and Method of Manufacturing the Same. Liao Wei-hao, Chen Cheng-hao, Dai Yu-teng, Chu Hwei-jay, Lu Chih Wei, Tien Hsi-wen and Yao Hsin-chieh developed the invention.
The patent application number ..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have received a patent for Integration of Via and Bottom Electrode for Memory Cell. This invention was developed by Chu Wen-ting, Shih Sheng-hung, Chen Tzu-yu and Tu Kuo-chi.
The patent application number is US202318316429 20230512. The pate..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Taiwan Semiconductor Manufacturing Co Limited and Taiwan Semiconductor Manufacturing have been awarded a patent for Direct Non-ohmic Switch for Voltage Instability Protection and Methods for Forming the Same. This invention was developed by Chen Ching-en, Huang Kuo-ching, Hsieh Wei Ting, Chang Kuo-pin and T..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Korea Institute Of Science And Technology and Korea Institute of Science and Technology have secured a patent on Heterojunction Semiconductor Flexible Substrate, Manufactring Method Thereof, and Electronic Device Using the Same. Baek Seung Hyub, Yoon Jungho, Kim Jin Sang, Kim Min Seok, Hur Sunghoon, Song Hy..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- J Metrics Tech Co Ltd, Sonicmems Zhengzhou Tech Co Ltd and Peking University Shenzhen Graduate School have been awarded a patent for Wafer Level Ultrasonic Chip Module Having Suspension Structure. This invention was developed by Jin Yu-feng, Ma Sheng-lin, Zhao Qian-cheng, Lee Hung-ping, Gong Dan, Chiu Yi-hs..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Chengdu BOE Optoelect Tech Co and BOE Technology Group have received a patent for Display Substrate and Display Device. This invention was developed by Xu Yuanjie, Huang Yao, Cai Jianchang, Zhang Jing, Wang Binyan, Long Yue, Li Shuang and Xie Taofeng.
The patent application number is US202218255277 20220..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Chengdu BOE Optoelect Tech Co and BOE Technology Group have been awarded a patent for Display Substrate and Display Apparatus. This invention was developed by Wang Mengqi, Chen Wenbo, Hu Ming, Jiang Zhiliang, Yu Ziyang and Qiu Haijun.
The patent application number is US202218032348 20220429. The patent p..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- BOE Technology Group Co Ltd and Hefei BOE Joint Technology have been awarded a patent for Display Substrate and Display Device. This invention was developed by Feng Xuehuan, Yuan Can and Li Yongqian.
The patent application number is US202519013609 20250108. The patent publication number is US12666813 (B2..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Chengdu BOE Optoelect Tech Co and BOE Technology Group have obtained a patent for display substrate and display panel. This invention was developed by Wang Tsanghong, Li Chunyang and Huang Hsinwei.
The patent application number is US202117789587 20210923. The patent publication number is US12666798 (B2)...
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Hue Inc and Jade Bird Display, Shanghai have received a patent for Micro Led, Micro Led Panel and Micro Led Chip. This invention was developed by Guo Jian, Xu Huiwen and Li Qiming.
The patent application number is US202318116405 20230302. The patent publication number is US12666779 (B2). International Pa..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have received a patent for Shifted Micro-lenses for Increased Imaging Device Performance. This invention was developed by Huang Cheng Yu, Wu Wen-hau, Chiang Wei-chieh, Chou Keng-yu, Chang Chih-kung, Chuang Chun-hao and Huang Cheng Yu.
The pa..
Semiconductor
| Wed 08 Jul 2026
Alexandria, July 9 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have secured a patent on Semiconductor Device and Manufacturing Method Thereof. Chen Liang-yin, Chui Chi On, Yen Te-jui and Chen Kuo-ju developed the invention.
The patent application number is US202318487317 20231016. The patent publication..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has received Resonac patent application for Photosensitive Resin Composition, Photosensitive Resin Film, Printed Wiring Board, Production Method Therefor, and Semiconductor Package. Yamada Kumpei, Konno Yuko, Nojiri Takeshi and Otsuki Daisuke developed the invention.
T..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has received Resonac patent application for Photosensitive Resin Composition, Photosensitive Resin Film, Printed Wiring Board, Production Method Therefor, and Semiconductor Package. Yamada Kumpei, Konno Yuko, Nojiri Takeshi and Otsuki Daisuke developed the invention.
T..
Semiconductor
| Thu 09 Jul 2026
Geneva, July 10 -- World Intellectual Property Organization has released Kokusai Electric patent application for Processing Device, Substrate Processing Device, Method for Producing Semiconductor Apparatus, and Program. This invention was developed by Yamaoka Yuji and Seki Takatoshi.
The patent application number is WO2024JP459..
Semiconductor
| Thu 09 Jul 2026
Beijing, July 10 -- Microchip Technology has submitted a patent application for High Voltage Wake-up Signaling Input/output for 10base-t1s System Base Chip. This invention was developed by Shelton Paul E, Belsumit Lior, Yang Xinwei, Iyer Venkatraman and El Shafy Eyal.
The patent application number is CN20248046740 20240716. The..
Semiconductor
| Thu 09 Jul 2026
Beijing, July 10 -- State Intellectual Property Office of China has received Lam Research patent application for Atmospheric Exposure Prevention in Gas Delivery Systems. Barnett Cody, Chandrasekharan Ramesh and Bamford Thadeous developed the invention.
The patent application number is CN20248058193 20240826. The patent publicat..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- State Intellectual Property Office of China has released Nanjing Microbonding Semiconductor Co Ltd and Siponmicro Wuxi Co Ltd patent application for Basepad Structure and and (quad Flat No-lead) Multi-core Sealed Chip. This invention was developed by Mu Yunfei and Wang Bin.
The patent application number is..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- State Intellectual Property Office of China has received Southeast University patent application for Air Cavity Packaging Structure for W Wave Band. Xu Xiaojie and Hao Zhangcheng developed the invention.
The patent application number is CN202511975394 20251225. The patent publication number is CN121816079 ..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- Jiangsu Xinde Semiconductor Technology has applied Chinese patent for Electromagnetic Shielding Packaging Structure and Preparation Method Thereof. Zhang Haojie, Chen Yong, Liu Yi and Gong Zhen developed it.
The patent application number is CN20261031553 20260112. The patent publication number is CN1218160..
Semiconductor
| Fri 10 Jul 2026
Beijing, July 10 -- State Intellectual Property Office of China has released Quanzhou Sanan Semiconductor Technology patent application for Light-emitting Diode Packaging Body and Light-emitting Device. This invention was developed by Li Xinglong, Shi Junpeng, Chen Weihong, Chen Shunyi, Chen Qinghe, Wu Jiawei and Wang Jieling.
..
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