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Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Suzhou Lasuo Biochip Tech Co Ltd patent application for Constant-temperature Fixing Device for Gene Chip and Control Method of Constant-temperature Fixing Device. This invention was developed by Xu Xinyi, Ge Fan and Liu Chaojun.
The patent applicati..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released The Spot Laboratory patent application for Multi-target Full-process Nucleic Acid Detection Chip Based on Rpa, Crispr/cas and Ewod Technologies and Application Thereof. This invention was developed by Zhang Fangzhou, Fei Shifang, Liu Bo and Feng Shilun..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Zhejiang Aoshou Material Tech Co Ltd has submitted a patent application for Cutting Fluid for Large-size Silicon Wafer as Well as Preparation Method and Application of Cutting Fluid. Hou Jun, Li Chuanyou, Lyu Jing and Sun Yao developed the invention.
The patent application number is CN202510985188 2025071..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has published Zhejiang Aoshou Material Tech Co Ltd patent application for Silicon Wafer Cutting Fluid as Well as Preparation Method and Application Thereof. The invention was developed by Hou Jun, Li Chuanyou, Sun Yao and Lyu Jing.
The patent application number ..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Samsung Electronics and Samsung Display patent application for Semiconductor Nanoparticles, Method for Producing Semiconductor Nanoparticles, and. This invention was developed by Lee Jun-ho, Kim Sung Woo, Chang Ho-geun, Kim Kwanghee and Kim Sun-gi.
..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Beijing North Shitong Tech Co Ltd has submitted a patent application for Method for Accurately Regulating and Controlling Surface Performance of Nano Silicon Dioxide Particles Based on Emulsification Method. This invention was developed by Zhang Zhiying.
The patent application number is CN20251131270 2025..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Zhejiang Kefeng Silicone Co Ltd patent application for Two-component Organic Silicon Pouring Sealant Containing Aluminum Hydroxide and Preparation Method of Two-component Organic Silicon Pouring Sealant. This invention was developed by Weng Yanfang, Yu..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has received Cyge Electronic Tech Hunan Co Ltd patent application for High-temperature-resistant Curing Material for Chip Inductor and Use Method of High-temperature-resistant Curing Material. Su Liliang, Su Xueyuan, Song Shuhua, Liu Tao, Liu Di, Liu Mingyang, Long..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Beijing Xulun Tech Co Ltd has filed a patent application for Adhesive Resin and Chip Mounting Adhesive Film Prepared from Same. This invention was developed by Lyu Jianyong, Wang Ruikun, Zhang Miaomiao and Li Zheng.
The patent application number is CN202511167441 20250820. The patent publication number is..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has published Hefei Zhongju Hecheng Photoelectric Mat Co Ltd patent application for High-stability Monocrystalline Silicon Alkali Polishing Additive and Use Method Thereof. The invention was developed by Peng Guoqing, Lyu Pu, Wang Weikang, He Yeqian, Huang Dexin an..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Jiangsu Shanshui Semiconductor Tech Co Ltd has submitted a patent application for Rapid Cutting Type Silicon Wafer Rough Polishing Slurry and Preparation Method Thereof. Li Xing, Li Shiquan, Wang Chenwei, Lei Shuangshuang and Liu Fei developed the invention.
The patent application number is CN202510973587..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Guangdong Xinhaoyuan Tech Co Ltd has submitted a patent application for High-wear-resistance Silicon Pu Composite Layer, Preparation Method Thereof and Application of High-wear-resistance Silicon Pu Composite Layer in Preparation of Ball Field Surface Layer. This invention was developed by Li Muhua, Feng Zha..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Suzhou Macroocean New Mat Co Ltd has sought patent for Organic Silicon Modified Polyester as Well as Preparation Method and Application Thereof. This invention was developed by Peng Shenlai and Wang Yao.
The patent application number is CN202511257529 20250904. The patent publication number is CN120904466..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Guangdong Poloma New Material Tech Co Ltd has filed a patent application for Self-repairing Silicon Resin, Preparation Method Thereof, OCA (optical Clear Adhesive) Containing Self-repairing Silicon Resin and Application of Self-repairing Silicon Resin. This invention was developed by He Na, Hong Liang, Cai J..
Semiconductor
| Sun 22 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has published Ultra Memory Inc patent application for Computing System and Semiconductor Integrated Circuit Module. The invention was developed by Otani Kazuhiko.
The patent application number is CN20238095707 20230314. The patent publication number is CN1208831..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Shanghai Junsenming Electronic Tech Co Ltd has applied Chinese patent for Power Supply Device for Semiconductor Device. Hou Jingbo, Zhang Yue, Cao Hui, Wu Chuanlin and Xu Changcheng developed it.
The patent application number is CN20251132214 20250725. The patent publication number is CN120879558 (A). Int..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Zhejiang Chenxu Iot Tech Co Ltd has sought patent for Deeply Integrated Circuit Breaker with Beidou Positioning and Intelligent In-situ Protection Capacitor Power Taking Functions. This invention was developed by Zhu Wanli, Li Chuntao, Yang Youpeng, Wang Taofeng, Jang Sung-han and Jiang Kaihao.
The patent..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Suzhou Jiagang Semiconductor Co Ltd has sought patent for Composite Substrate Structure and Preparation Method Thereof. This invention was developed by Xiong Min and Zhu Jie.
The patent application number is CN20251151041 20250729. The patent publication number is CN120879321 (A). International Patent Cla..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Hebei Dingci Electronic Tech Co Ltd has submitted a patent application for High-hardness Heat-resistant Aluminum Nitride Multilayer Ceramic Substrate and Preparation Method Thereof. This invention was developed by Gao Shan, Jin Huajiang, Li Jie, Liang Pengjie, Li Lei and Zhang Chenxu.
The patent applicati..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Changchun Changguang Fine Porcelain Composite Mat Co Ltd has filed a patent application for Preparation Method of Silicon Carbide Boat. This invention was developed by Dong Binchao, Zhou Lixun and Cao Qi.
The patent application number is CN202511447069 20251011. The patent publication number is CN12090394..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Hebei Dingci Electronic Tech Co Ltd has submitted a patent application for Insulating Aluminum Oxide Multilayer Ceramic Substrate and Preparation Method Thereof. This invention was developed by Jin Huajiang, Gao Shan, Chen Xinqiao, Wang Jin, Guo Zining and Zhao Muyang.
The patent application number is CN2..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has published Wuxi Lianqiang Intelligent Equipment Co Ltd patent application for Multifunctional Automatic Control Method and Device for Semiconductor Truncation. The invention was developed by Li Jiannan, Liu Yi, Yu Shenghui, Zhou Jianghui, Wang Dongxu and Lin Xu...
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has received Guangdong Kezhuo Semiconductor Equipment Co Ltd patent application for Large-stroke Wafer Cutting Machine Suitable for Large-size Wafer Cutting. Wei Yuhong and Wei Donglei developed the invention.
The patent application number is CN202511309492 2025..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Jinko Solar Holding Co Ltd has applied Chinese patent for Manufacturing Method of Silicon Single Crystal Rod and Silicon Wafer. He Xiaolin, Li Jing, Luo Yuan and Zhao Peng developed it.
The patent application number is CN202511445965 20251010. The patent publication number is CN120902131 (A). Internationa..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Guangdong Kezhuo Semiconductor Equipment Co Ltd patent application for High-stability Wafer Bearing Platform for Wafer Cutting Machine. This invention was developed by Wei Yuhong and Huang Yanrong.
The patent application number is CN202511417783 202..
Semiconductor
| Sun 22 Mar 2026
Beijing, March 23 -- Hana Micron Inc has applied Chinese patent for Semiconductor Package and Manufacturing Method Thereof. Lim Jae-seong, Kim Dong-hyun, Jang Joo-hwan, Kim Kwang-il and Jang Yong-kyu developed it.
The patent application number is CN20248016843 20240402. The patent publication number is CN120883372 (A). Intern..
Semiconductor
| Sun 22 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has published Youl Chon Chemical Co Ltd patent application for System for Fixing Semiconductor Wafer on Electrostatic Chuck and Method for Fixing Semiconductor Wafer on Electrostatic Chuck Using Same. The invention was developed by Li Zhiwen, Do Sang-gil, Yoo Kyung..
Semiconductor
| Sun 22 Mar 2026
Beijing, March 23 -- Daikin Youke Co Ltd has sought patent for Substrate Processing Module and Substrate Processing Apparatus. This invention was developed by Deguchi Yasunori and Toyotaka Hidefumi.
The patent application number is CN20248022908 20240322. The patent publication number is CN120883349 (A). International Patent ..
Semiconductor
| Sun 22 Mar 2026
Munich, March 23 -- European Patent Office has received HGF patent application for Stacked Semiconductor Die Architecture with Dies Stacked Orthogonal to a Base Die or Substrate. Walczyk Joe, Tadayon Pooya and Brun Xavier developed the invention.
The patent application number is EP20250190054 20250717. The patent publication ..
Semiconductor
| Sun 22 Mar 2026
Beijing, March 23 -- Semiconductor Tech Co Ltd has submitted a patent application for Universal Lithographic Tool. This invention was developed by Smith Thomas and Bleule Hans-peter.
The patent application number is CN20238093897 20231212. The patent publication number is CN120883142 (A). International Patent Classification c..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Kuwana Metal Ind Co Ltd has applied Chinese patent for Vaporizer and Method for Supplying Material Gas to Semiconductor Manufacturing Apparatus. Sasaki Akira developed it.
The patent application number is CN20248017784 20240226. The patent publication number is CN120882899 (A). International Patent Classi..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Youl Chon Chemical Co Ltd patent application for Film for Semiconductor Bonding. This invention was developed by Li Zhiwen, Do Sang-gil, Yoo Kyung-seok, Lee Kyu Wan, Lee Chang-woo, Jang Young-hun, Cao Hanbin, Ha Tae-yong and Song Kyung-mi.
The paten..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Westra Mat Inc has submitted a patent application for Method for Obtaining Water-processable N-type Conductive Polymers. Li Qifan, Huang Junda, Yang Chiyuan and Fabiano Simone developed the invention.
The patent application number is CN20248008174 20240209. The patent publication number is CN120882782 (A)..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has received Westra Mat Inc patent application for Method for Obtaining Water-processable N-type Conductive Polymers. Li Qifan, Huang Junda, Yang Chiyuan and Fabiano Simone developed the invention.
The patent application number is CN20248007986 20240209. The pat..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has published Toshiba and Toshiba Electronic Devices & Storage patent application for Drive Circuit and Semiconductor Device. The invention was developed by Koyama Masahiro and Fujiwara Yasuyuki.
The patent application number is CN202411141787 20240820. The pate..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has received Toshiba and Toshiba Electronic Devices & Storage patent application for Drive Circuit and Semiconductor Device. Fujiwara Yasuyuki and Liu Yiyao developed the invention.
The patent application number is CN20241182192 20240808. The patent publication ..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Shenzhen Qinuo Tech Co Ltd has submitted a patent application for Fast Charge Control Circuit and Method Based on Ld969jl1 Chip. This invention was developed by Liang Xianhua.
The patent application number is CN20251152939 20250730. The patent publication number is CN120879864 (A). International Patent Cl..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Tianshui Huatian Tech Co Ltd has submitted a patent application for Elqfp Packaging Lead Frame Structure and Packaging Piece Thereof. Li Ke, Zheng Zhiquan, Zhang Jinbing, Zheng Yongfu, Liang Xiuli and Deng Xudong developed the invention.
The patent application number is CN20251118705 20250723. The patent ..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Hisense Home Appliances Group patent application for Semiconductor Device. This invention was developed by Liang Meng, Shi Bo, Zhou Wenjie, Liu Jian, Cen Jinsheng and Jiang Wei.
The patent application number is CN202510729907 20250530. The patent pu..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Hisense Home Appliances Group has filed a patent application for Semiconductor Device and Electrical Device. This invention was developed by Liang Meng, Liu Jian, Zhou Wenjie, Sun Xiyong, Wu Xiaojing, Jiang Wei, Cheng Zhangming and Shi Bo.
The patent application number is CN202510726449 20250530. The pate..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Beijing Bige Bosi Information Tech Co Ltd has submitted a patent application for Interposer Electronic Module for Semiconductor Interposer Process and Manufacturing Method Thereof. This invention was developed by Xu Xingxuan.
The patent application number is CN202410652449 20240524. The patent publication..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has received Nanya Technology patent application for Semiconductor Element with Filling Layer and Manufacturing Method Thereof. Lin Yuanyuan developed the invention.
The patent application number is CN202510437577 20240723. The patent publication number is CN120..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Nanya Technology has submitted a patent application for Semiconductor Element with Filling Layer and Manufacturing Method Thereof. This invention was developed by Lin Yuanyuan.
The patent application number is CN202410989409 20240723. The patent publication number is CN120878664 (A). International Patent ..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Guangzhou Zhongshan New Mat Co Ltd has submitted a patent application for Heat Dissipation Substrate and Preparation Method and Application Thereof. This invention was developed by Li Zihan, Tang Junjie and Lu Kunfu.
The patent application number is CN202511367206 20250924. The patent publication number i..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has received Guangzhou Zhongshan New Mat Co Ltd patent application for Heat Dissipation Substrate and Preparation Method Thereof. Wang Xinyun, Chen Yibin, Hu Shengbao and Chen Qibing developed the invention.
The patent application number is CN202511219407 202508..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has published Li Jiashan patent application for Hole Transport Material, Preparation Method Thereof and Perovskite Solar Cell.
The patent application number is CN202510829781 20250620. The patent publication number is CN120904197 (A). International Patent Class..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has published Foshan Yalanshi Tech Co Ltd and Guangdong Nanhai Etetb Tech Co Ltd patent application for Printing System of Photovoltaic Solar Cell Electrode. The invention was developed by Jiang Yunzi, Huang Lianghui, Liu Jiajing and Hu Yongneng.
The patent appl..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Sichuan Micron Vip New Mat Co Ltd has applied Chinese patent for Automatic Compounding Method and Device for Vacuum Insulated Panel Core Material. Wu Shengxuan, Hu Wei, Zhang Xu, Yu Yao and Cheng Xueyu developed it.
The patent application number is CN202511320194 20250916. The patent publication number is..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Ningbo Guining Semiconductor Mat Co Ltd patent application for Preparation Method of Coating for Casting Polycrystalline Silicon Component. This invention was developed by Chen Hongrong, Huang Chunlai and Luo Yong.
The patent application number is C..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Anhui Baiqiang Tech Co Ltd patent application for Wire Welding Device for Integrated Circuit Board Processing. This invention was developed by Li Haomin.
The patent application number is CN202511127581 20250813. The patent publication number is CN12..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has received Wuxi Jinglonghuate Electrical Co Ltd patent application for High-magnetic-induction Low-iron-loss Oriented Silicon Steel Laser Cutting Equipment. Bo Xiling, Wu Rangping, Xie Yong and Yuan Xiaodong developed the invention.
The patent application numb..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has published Zhejiang Tianmu Solar Tech Co Ltd patent application for Defect Repair Laser Scribing Equipment for Thin Film Solar Cell. The invention was developed by Tan Xiangdong.
The patent application number is CN202511300465 20250912. The patent publication..
Semiconductor
| Sun 22 Mar 2026
Munich, March 23 -- 1QB Information Tech Inc has submitted a patent application for a Quantum Chip and Methods for Optimizing a Quantum Circuit Operations Scheduling Thereon. Silva Allyson, Webb Zachary, Zhang Xiangyi, Chen Ka Wai, Liu Xiao, Lemieux Jessica, Kramer Miles Xavian, Scherer Artur and Ronagh Pooya developed the inven..
Semiconductor
| Sun 22 Mar 2026
Munich, March 23 -- AMS Sensors Belgium BV has submitted a patent application for Photomask, Method for Manufacturing a Semiconductor Device and Semiconductor Device. This invention was developed by Chen Xi.
The patent application number is EP20240721664 20240424. The patent publication number is EP4710166 (A1). International..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Shanghai Lingnai Semiconductor Tech Co Ltd has submitted a patent application for Single-tube Flash Memory Array with Assembly Structure. This invention was developed by Xue Lei and Jin Bo.
The patent application number is CN202511403639 20250929. The patent publication number is CN120881996 (A). Internat..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Jiangsu Daoyuan Tech Group Co Ltd patent application for Multi-time Programmable Memory Device for Controlling Short Circuit and Preparation Method Thereof. This invention was developed by Cheng Chen, Wang Bin, Sun Meng, Hu Zesong and Xiong Aoran.
T..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Jiangsu Daoyuan Tech Group Co Ltd patent application for Multi-time Programmable Memory Device and Preparation Method Thereof. This invention was developed by Cheng Chen, Wang Bin, Zhou Kang, Sun Meng and Qiao Gongguo.
The patent application number ..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Hangzhou Suoqi Electronic Tech Co Ltd has sought patent for Circuit Board Chip Mounter. This invention was developed by Gu Zhenghua and Lou Yundan.
The patent application number is CN20251181094 20250804. The patent publication number is CN120881970 (A). International Patent Classification codes are H05K1..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Shenzhen Shen Eataunt Electronic Co Ltd patent application for Fixture System for Hole Plugging of Glass Substrate. This invention was developed by Huang Junxiang.
The patent application number is CN202411984726 20241230. The patent publication numb..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Hubei Wensu Intelligent Tech Co Ltd has submitted a patent application for Electrostatic Elimination Equipment for Integrated Circuit Board. This invention was developed by Li Chunfu and Wang Xianlong.
The patent application number is CN202511290482 20250910. The patent publication number is CN120881838 (..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Calterah Semiconductor Technology, Shanghai has submitted a patent application for UWB Resource Scheduling Method, UWB Network, Device and Medium. Yu Zhongxing and Zhang Daiqin developed the invention.
The patent application number is CN202410503241 20240424. The patent publication number is CN120881510 (..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has received Tsinghua University and Beijing Electronic Holding Co Ltd patent application for Double-film Double-backboard MEMS Microphone, Preparation Method and Electronic Equipment. Ren Tianling, Liu Xingyu, Yang Yi, Yan Haoxian, Kang Qiaoqiao, Wang Qian, Zhang ..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Nanya Technology has submitted a patent application for Semiconductor Element and Manufacturing Method Thereof. This invention was developed by Wu Jianping and Rao Ruixiu.
The patent application number is CN202510433572 20240806. The patent publication number is CN120878706 (A). International Patent Class..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Nanya Technology has applied Chinese patent for Semiconductor Element and Manufacturing Method Thereof. Wu Jianping and Rao Ruixiu developed it.
The patent application number is CN20241168874 20240806. The patent publication number is CN120878705 (A). International Patent Classification code is H01L23/544..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has received Zhiju Semiconductor Nantong Co Ltd patent application for Chip Packaging Structure and Packaging Method. Fu Wei and Cai Qinjia developed the invention.
The patent application number is CN20251108641 20250721. The patent publication number is CN12087..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Zhiju Semiconductor Nantong Co Ltd has applied Chinese patent for Chip Packaging Structure and Packaging Method. Fu Wei and Cai Qinjia developed it.
The patent application number is CN20251106394 20250721. The patent publication number is CN120878698 (A). International Patent Classification codes are H01L..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Shanghai Yixin Ind Co Ltd has submitted a patent application for High-reliability Chip Packaging Structure. Chen Raosuo, Zhu Xutao, Zhou Gang, Huang Haocheng, Xue Licheng, Zhou Wei, Zhou Qijun, Feng Hailu, Wang Yilei, Zhang Yang and Wang Ruihuan developed the invention.
The patent application number is CN..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- SiEn QingDao Integrated Circuits has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. Wang Mingkang developed the invention.
The patent application number is CN20251130266 20250724. The patent publication number is CN120878636 (A). International Patent Classificati..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Wuyuan Semiconductor Tech Qingdao Co Ltd has filed a patent application for Preparation Method of Through Hole and Semiconductor Structure. This invention was developed by Yan Guochao.
The patent application number is CN202510951771 20250710. The patent publication number is CN120878635 (A). International..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has received Suzhou Xixing Semiconductor Tech Co Ltd patent application for Wafer Transfer Device and Semiconductor Equipment. Wu Dong, Wang Jing, Zhang Jin, Jin Yujie, Li Gaofei, Chen Junru, Chen Zhaoyun, Chen Chang and Tao Dashuai developed the invention.
The ..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Suzhou Ruijiewei Tech Group Co Ltd has submitted a patent application for Automatic Packaging Equipment and Packaging Method for Single-chip Processor. This invention was developed by Shen Haijun, Guo Huirong, Zhang Renfei, Ding Jiawei and Zhang Zhixiang.
The patent application number is CN202511395548 20..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Ningbo Xinlian Photoelectric Co Ltd has sought patent for Silicon Wafer Crystal Orientation Confirmation Method for Contact Type Photoetching Machine. This invention was developed by Chen Chunsheng, Shi Zengshuang and Zhao Peipei.
The patent application number is CN20251166070 20250731. The patent publica..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Jiangsu Lucky Micro Semiconductor Co Ltd has submitted a patent application for Batch Assembling and Positioning Equipment for Copper Substrates and Shells of Semiconductor Devices. Huang Guanghua developed the invention.
The patent application number is CN20251125631 20250724. The patent publication numb..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Yilong Semiconductor Equipment (Wuxi) has applied Chinese patent for Feeding Mechanism of Die Bonder. Hu Guojun, Yang Tong, Xi Yandong and Li Haiyang developed it.
The patent application number is CN202511393774 20250928. The patent publication number is CN120878615 (A). International Patent Classificatio..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Zhejiang Qingxin Technology has filed a patent application for Automatic Adjusting, Overturning and Carrying Module. This invention was developed by Cai Qingxin, Qiu Shaohui and Yang Jie.
The patent application number is CN202510941973 20250709. The patent publication number is CN120878612 (A). Internatio..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Saijing Asia Pacific Semiconductor Technology Zhejiang patent application for Lead Frame Feeding Device Based on Light Spot Recognition and Control Method. This invention was developed by Qian Xianjun.
The patent application number is CN202510816774..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Sichuan Mingtai Microelectronics Co Ltd has sought patent for Semiconductor Packaging Frame Clamping and Transferring Device. This invention was developed by Li Shehong, Xie Hongxing, Zhuang Huizhi and Cheng Jiayuan.
The patent application number is CN202511395132 20250928. The patent publication number i..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Shenzhen Tianyue New Material Tech Co Ltd has submitted a patent application for Intelligent Monitoring Device for Wafer Electroplating. Chen Yue, Wang Chao and Wu Maosheng developed the invention.
The patent application number is CN20251140917 20250728. The patent publication number is CN120878600 (A). I..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Suzhou Zhongchuangbo Environmental Science And Tech Co Ltd has sought patent for Ultrasonic Magnetic Cleaning Line for Wafer. This invention was developed by Li Jianjun and Guo Song.
The patent application number is CN20251118460 20250723. The patent publication number is CN120878597 (A). International Pa..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Lean Bote Semiconductor Co Ltd has submitted a patent application for Intelligent Tracking and Abnormity Early Warning Method for Wafer Storage. This invention was developed by Yang Xi, Tan Xianjun, Gu Xilan, Liao Xin, Cao Jinlong, Liu Zhaozhen and Shu Yanan.
The patent application number is CN20251118131..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Zing Semiconductor has applied Chinese patent for Cleaning Equipment and Cleaning Environment Adjusting Method. Yang Buming, Shi Hongtao and Hu Jianping developed it.
The patent application number is CN20251114362 20250722. The patent publication number is CN120878593 (A). International Patent Classificat..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Wuxi Xinqibo Electronics Co Ltd patent application for Static Elimination Station for Chip Sorting. This invention was developed by Gu Weimin, Han Xinfeng and Wang Jia.
The patent application number is CN202510992403 20250718. The patent publication..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has published Suzhou Lingwei Electronic Tech Co Ltd patent application for Chip Appearance Detection, Classification and Rejection Equipment and Method Based on Visual Module. The invention was developed by Fan Hongmei and Hong Xiaolong.
The patent application n..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Xinchuang Tianmen Electronic Tech Co Ltd has applied Chinese patent for Semiconductor Multi-chip Automatic Packaging Forming Equipment and Packaging Process. Li Qiang, Mao Zhixin, Li Yanfeng and Yu Wenwu developed it.
The patent application number is CN202510954668 20250711. The patent publication number ..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Qipi Tech Co Ltd has applied Chinese patent for Chip Inclination Angle Detection Method, Chip Inclination Angle Detection System and Chip Bonding Device. Yang Guansong developed it.
The patent application number is CN20251104465 20250721. The patent publication number is CN120878575 (A). International Pat..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Lichuan Hangzhou Semiconductor Equipment Co Ltd has filed a patent application for Method for Detecting and Analyzing Trace Etching Effect of Si Wafer After Iwc (induced Wolfram Carbide) Cleaning. This invention was developed by Lin Bangyu, Weng Xinjing and Yamamoto Reona.
The patent application number is..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Tongfu Tongke Nantong Microelectronics Co Ltd has sought patent for Multi-layer Stacked Chip Packaging Method and Packaging Structure. This invention was developed by Zhu Jun and Ma Liangjun.
The patent application number is CN202511405195 20250929. The patent publication number is CN120878569 (A). Intern..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Huatian Tech Jiangsu Co Ltd has filed a patent application for Chip Integration Packaging Method and Structure. This invention was developed by Yang Zhihua, Zhao Kai and Ma Shuying.
The patent application number is CN20251130729 20250725. The patent publication number is CN120878567 (A). International Pat..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Stats Chippac Semiconductor Jiangyin Co Ltd has applied Chinese patent for Method and Device for Improving Warping of Packaged Product. Zhang Jianwen developed it.
The patent application number is CN202510903682 20250701. The patent publication number is CN120878556 (A). International Patent Classificatio..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Jiangsu Pangu Semiconductor Tech Co Ltd patent application for High-heat-dissipation Packaging Method and Structure. This invention was developed by Liu Yi, Ma Shuying and Yan Li.
The patent application number is CN20251131170 20250725. The patent p..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Shenzhen Ruiwowei Semiconductor Tech Co Ltd has submitted a patent application for Semiconductor Chip Bonding Method and Chip Bonding Piece. This invention was developed by Shen Guang, Qi Shan and He Yide.
The patent application number is CN20251129024 20250724. The patent publication number is CN12087855..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has published Liaoning Yifei Technology patent application for Chip Support Preparation Method. The invention was developed by Tian Xin, Xu Tao, Zhang Yuan, Wu Lili, Ni Shijun, Yi Hengbin, Zhang Ying and Chang Yanjie.
The patent application number is CN202511498..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Wuhan Shantuo Microelectronics Co Ltd has sought patent for Semiconductor Wafer Thinning Method and Device. This invention was developed by Tang Yukun, Wen Longfang and Shi Tianchao.
The patent application number is CN20251167870 20250731. The patent publication number is CN120878548 (A). International Pa..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Research Micro Jiangsu Semiconductor Tech Co Ltd has sought patent for Preparation Method of Metal Silicide Layer and Semiconductor Structure. This invention was developed by Wang Chuandao and Zhang Wenwen.
The patent application number is CN202510987172 20250717. The patent publication number is CN120878..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- United Microelectronics Corporation has sought patent for Semiconductor Element and Manufacturing Method Thereof. This invention was developed by Zhao Shixing, Wu Yanxiu, Xu Qingzhang, Chen Zhengfang, Xie Wengui, Lin Gaotian, Wang Rongchang, Chen Xinjie, Zhang Yulong and Zhuang Jingyi.
The patent applicat..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Jiangsu Shenzhou Semiconductor Technology has submitted a patent application for Remote Plasma Sheath Characteristic Regulation and Control and Etching Uniformity Optimization Method. This invention was developed by Zhao Junjun and Yin Qiaoxing.
The patent application number is CN20251154440 20250730. The..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Shenzhen Shengweixu Technology has submitted a patent application for Plasma Processing Apparatus. Fukasawa Takayuki developed the invention.
The patent application number is CN20251104570 20250428. The patent publication number is CN120878527 (A). International Patent Classification codes are H01J37/32, ..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Semitel Electronics Co Ltd has applied Chinese patent for Fuse Link for Protecting Semiconductor Equipment and Manufacturing Method. Rong Feng, Qiu Limin, Gong Jian, Wu Hui, Ye Hua, Zhou Yu and Yao Xun developed it.
The patent application number is CN202511113198 20250808. The patent publication number is..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- State Intellectual Property Office of China has released Shanghai Fulehua Semiconductor Tech Co Ltd and Jiangsu Fulehua Power Semiconductor Research Institute patent application for Cu-in Composite Slurry for Chip Sintering and Preparation Method Thereof. This invention was developed by Wang Bin, Chen Hu, Ji..
Semiconductor
| Mon 23 Mar 2026
Beijing, March 23 -- Suzhou Houpu Sensing Tech Co Ltd has submitted a patent application for Three-axis Sensor Chip Packaging Structure and Method. This invention was developed by Zhou Dongping and Wang Lei.
The patent application number is CN20251127276 20250724. The patent publication number is CN120903428 (A). Internationa..
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