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Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Innoscience Zhuhai Technology patent application for Semiconductor Device and Preparation Method Thereof. Sun Tao developed the invention.
The patent application number is CN202511772000 20251127. The patent publication number is CN121568402 (A). Int..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Hefei Nexchip Integrated Circuit patent application for Wrap-around Gate Transistor and Preparation Method Thereof. Liu Yang, Ma Menghui, Li Qiqi, Li Ting and Zhu Junlong developed the invention.
The patent application number is CN20261091098 2026012..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Shenzhen Shengweixu Technology has filed a patent application for Semiconductor Device and Preparation Method Thereof. This invention was developed by Qiu Junwen and Yang Qian.
The patent application number is CN20261094210 20260123. The patent publication number is CN121568387 (A). International Patent Cl..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Innoscience Zhuhai Technology has applied Chinese patent for Semiconductor Device and Preparation Method Thereof. Sun Tao developed it.
The patent application number is CN202511772020 20251127. The patent publication number is CN121568403 (A). International Patent Classification codes are H10D30/01, H10D30..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has released Hefei Nexchip Integrated Circuit patent application for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Jin Xin, Ge Chenghai, Xiong Pengyu and Lin Taotian.
The patent application number is CN20261083937 2026012..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Sony Semiconductor Solutions Corporation has filed a patent application for Surface Light Emitting Element. This invention was developed by Tachikawa Yoshiteru and Igarashi Yuki.
The patent application number is CN20248046267 20240716. The patent publication number is CN121569411 (A). International Patent ..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has published Yangtze Memory Technologies patent application for Semiconductor Device and Forming Method Thereof. The invention was developed by Yuan Wei, Han Yuhui, Zhang Kun, Liu Huiwen, Liu Zhenyu and Gu Xiaojing.
The patent application number is CN20248001469..
Semiconductor
| Wed 10 Jun 2026
Geneva, June 10 -- Korea National University of Transportation Industry-Academic Cooperation Foundation has submitted a patent application for Power Control System and Driving Method Therefor. This invention was developed by Cho In Ho and Kim Seon Woong.
The patent application number is WO2025KR02475 20250221. The patent publ..
Semiconductor
| Tue 09 Jun 2026
Geneva, June 10 -- World Intellectual Property Organization has released Japan Display patent application for Detection Device. This invention was developed by Mochizuki Kazuhide, Aoki Yoshinori, Ikeda Masataka, Nakamura Takashi, Koide Gen, Mochizuki Marina and Seto Yuta.
The patent application number is WO2025JP40362 2025111..
Semiconductor
| Wed 10 Jun 2026
Geneva, June 10 -- World Intellectual Property Organization has received Samsung SDI patent application for Semiconductor Photoresist Composition and Method of Forming Patterns Using Composition. Im Sangkyun, Kim Young Keun, Moon Sungil and Hwang Seongyeon developed the invention.
The patent application number is WO2025KR0413..
Semiconductor
| Tue 09 Jun 2026
Geneva, June 10 -- ams-OSRAM International has sought patent for Light Emitting Device with Multilayer Structure and Method for Manufacturing Same. This invention was developed by Abass Aimi, Luce Alexander and Alaee Khanghah Rasoul.
The patent application number is WO2025EP83857 20251121. The patent publication number is WO2..
Semiconductor
| Tue 09 Jun 2026
Geneva, June 10 -- World Intellectual Property Organization has released ams-OSRAM International patent application for Light Emitting Device with Multilayer Structure and Method for Manufacture. This invention was developed by Abass Aimi, Alaee Khanghah Rasoul, Luce Alexander, Bin Ahmad Fajri Faris Azim and Lau Chuan Hong.
T..
Semiconductor
| Tue 09 Jun 2026
Geneva, June 10 -- World Intellectual Property Organization has published Mitsubishi Electric patent application for Semiconductor Device and Manufacturing Method for Same. The invention was developed by Onaka Takayuki, Miyawaki Katsumi, Abe Shunichi and Nishio Hayao.
The patent application number is WO2024JP41866 20241126. T..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has released Saiguang Semiconductor Technology Suzhou patent application for High-precision Lifting Rotating Platform and Operation Method Thereof. This invention was developed by Yang Weixing, Ma Kaijiang and Xu Weixing.
The patent application number is CN202610..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has released Jiangsu Meike Solar Tech Co Ltd patent application for Silicon Wafer Cutting Fluid Recovery Device. This invention was developed by Wang Yicheng, Chen Ming, Yang Jun, Zhang Ming, Ji Mengxia, Liu Fujie and Xu Hui.
The patent application number is CN20..
Semiconductor
| Wed 10 Jun 2026
Geneva, June 10 -- Ads Tech Co Ltd has applied WIPO patent for Receptacle Alignment Device for Detachable Fiber Array for Photonics Integrated Circuit of Cpo Module and Receptacle Alignment Method Using Same. Song Kwangyeoul developed it.
The patent application number is WO2024KR19511 20241203. The patent publication number i..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- He Yi has submitted a patent application for Microfluidic Chip. This invention was developed by He Yi.
The patent application number is CN202511836421 20241212. The patent publication number is CN121571218 (A). International Patent Classification code is B01L3/00. Cooperative Patent Classification codes ar..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- He Yi has submitted a patent application for Microfluidic Chip.
The patent application number is CN202511836419 20241212. The patent publication number is CN121571217 (A). International Patent Classification code is B01L3/00. Cooperative Patent Classification codes are B01L3/5027 (CN), B01L2200/10 (CN) an..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- He Yi has submitted a patent application for Microfluidic Chip.
The patent application number is CN202511836418 20241212. The patent publication number is CN121571216 (A). International Patent Classification code is B01L3/00. Cooperative Patent Classification codes are B01L3/5027 (CN), B01L2200/10 (CN) an..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Lingdong Network Co Ltd has submitted a patent application for Apparatus and System for Generating Ordered Array of Cell Microcarriers on Substrate. This invention was developed by Rojek Katarzyna, Guzowski Jan and Giezinski Konrad.
The patent application number is CN20248034574 20240325. The patent public..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Wuxi Taclink Optoelectronics Tech Co Ltd patent application for Qsfp (quad Small Form-factor Pluggable) Packaging Optical Amplifier Based on Ceramic Substrate Wiring Heating Technology. Xu Xiangguo, Zhu Hua, Wu Wenqing, Li Yan, Hou Jianhua and Gu Leipin..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Gentherm Inc patent application for Method for Using Excess Substrate of Comfort System of Vehicle Seat for Another Comfort System of Vehicle Seat. White Andrew Charles, Lewis Randy Kent Jr, Bovee Luke Andrew, Gonzalez Ricardo Edmundo Flores, Kerzemien ..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- Hubei Changjiang Wanrun Semiconductor Tech Co Ltd has submitted a patent application for Sampling Test Method and Device for Flash Memory Chip and Medium. This invention was developed by Cho Joo-sung, Zhang Jie, Wu Guojun and Li Silin.
The patent application number is CN202511651722 20251112. The patent pu..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has published Shenzhen Jingcun Tech Co Ltd patent application for Stability Testing Method, Device and Equipment for DRAM Particles and Storage Medium. The invention was developed by Zheng Wen.
The patent application number is CN20261001529 20260104. The patent p..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- Wuhan Taicun Tech Co Ltd has filed a patent application for Read Voltage Threshold Determination Method for Flash Memory Error Correction, Flash Memory Device and Computer Program Product. This invention was developed by Wang Can, Sun Chengsi, He Han and Huang Chen.
The patent application number is CN20261..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Shandong Sinochip Semiconductors Ltd patent application for Method and Device for Improving First-time Reading Success Rate of Nandflash in SSD and Medium. Jiang Shubin, Cao Cheng and Yi Ruigang developed the invention.
The patent application number ..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- Wuhan Xinxin Semiconductor has applied Chinese patent for Discharging Circuit and Memory. Wu Jun and Cui Qiaohong developed it.
The patent application number is CN202511714599 20251120. The patent publication number is CN121565218 (A). International Patent Classification codes are G06F13/40 and G11C7/10. C..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- Wuhan Xinxin Semiconductor has filed a patent application for Potential Control Circuit and Memory. This invention was developed by Wu Jun and Lu Zhongzhou.
The patent application number is CN202511714268 20251120. The patent publication number is CN121565216 (A). International Patent Classification codes ..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- Ningbo Lingkai Semiconductor Tech Co Ltd has submitted a patent application for Nor Flash Memory Array with Single Tube Structure. Jin Bo and Zhang Wende developed the invention.
The patent application number is CN202511719646 20251121. The patent publication number is CN121565214 (A). International Patent..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- Wuhan China Star Optoelectronics Semiconductor Display Technology has submitted a patent application for Display Device. This invention was developed by Zhang Yang, Chen Tao and Wang Shanglong.
The patent application number is CN202511803360 20251202. The patent publication number is CN121565081 (A). Inter..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has published Conhui (Huizhou) Semiconductor patent application for Glass Key Appearance Defect Identification Method and System Based on Improved YOLOv5 Network. The invention was developed by Lin Zhijian, Ding Li, Wang Hai and Zeng Xinyong.
The patent applicati..
Semiconductor
| Wed 10 Jun 2026
Geneva, June 10 -- Sealink Corp has applied WIPO patent for Rotating Shaft Sealing Device and Processing Apparatus for Semiconductor Substrate Using Same. Rhee Hee Jang developed it.
The patent application number is WO2025KR16848 20251022. The patent publication number is WO2026116779 (A1). International Patent Classification..
Semiconductor
| Wed 10 Jun 2026
Geneva, June 10 -- Sealink Corp has sought patent for Linear Feedthrough and Processing Apparatus for Semiconductor Substrate Using Same. This invention was developed by Rhee Hee Jang.
The patent application number is WO2025KR16823 20251022. The patent publication number is WO2026116778 (A1). International Patent Classificati..
Semiconductor
| Wed 10 Jun 2026
Geneva, June 10 -- OKins Electronics has submitted a patent application for Semiconductor Test Apparatus Including Multiple Probe Pins. This invention was developed by Jun Jin Kook, Lee Chan Ho, Lee Yong Kwan and Kim Jong Kwan.
The patent application number is WO2025KR12726 20250821. The patent publication number is WO2026116..
Semiconductor
| Wed 10 Jun 2026
Geneva, June 10 -- Saip Co Ltd has sought patent for Compact Modeling Method and Apparatus for Semiconductor Element Defined by User. This invention was developed by Kim Dae Yong.
The patent application number is WO2025KR10671 20250721. The patent publication number is WO2026116663 (A1). International Patent Classification co..
Semiconductor
| Tue 09 Jun 2026
Geneva, June 10 -- World Intellectual Property Organization has published National Inst Of Advanced Industrial Science And Technology patent application for Optical Substrate. The invention was developed by Suda Satoshi, Kurosu Takayuki and Amano Takeru.
The patent application number is WO2025JP27604 20250804. The patent publ..
Semiconductor
| Tue 09 Jun 2026
Geneva, June 10 -- Shanghai U Eastar Electro Mech Co Ltd has applied WIPO patent for Insertion Testing Mechanism for Memory Chip Testing. Xu Bin, Ji Xiaofeng, Yang He, Zhang Guofeng, Peng Chao, Li Yibo and Wang Xiaoyong developed it.
The patent application number is WO2025CN117189 20250827. The patent publication number is WO..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has published Shanghai Pengxi Semiconductor Co Ltd patent application for Method for Supervising Wafer Carrier of Virtual Semiconductor Factory. The invention was developed by Ding Meirong and Zhang Shuo.
The patent application number is CN20261087242 20260122. T..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Cixin Tech Suzhou Co Ltd has submitted a patent application for Receiving Circuit of Fourth-order Pulse Amplitude Modulation Signal and High-speed Communication Chip. This invention was developed by Nie Wen, Shen Hui, Qian Zhongjun, Wei Shaoyu and Jiang Jingyi.
The patent application number is CN2026107055..
Semiconductor
| Wed 10 Jun 2026
Geneva, June 10 -- World Intellectual Property Organization has published Microtek Holdings Inc patent application for Compostable Cold Pack Comprising an Absorbant Substrate Loaded with Water. The invention was developed by Formato Richard.
The patent application number is WO2025US57204 20251126. The patent publication numbe..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- Albert Suzhou Tech Co Ltd has applied Chinese patent for Precise Gantry Motion Platform for Wafer Detection. Shang Yuyou developed it.
The patent application number is CN20261037407 20260113. The patent publication number is CN121572248 (A). International Patent Classification code is B25H1/10. Cooperative..
Semiconductor
| Wed 10 Jun 2026
Geneva, June 10 -- Patentix Inc has filed a patent application for Single-crystal Film, Laminated Structure, Semiconductor Device, Electronic Apparatus, and System. This invention was developed by Shimizu Yuri and Kono Ai.
The patent application number is WO2025JP40979 20251125. The patent publication number is WO2026116303 (..
Semiconductor
| Wed 10 Jun 2026
Geneva, June 10 -- Ookuma Diamond Device Co Ltd has submitted a patent application for Integrated Circuit Device, Production Method for Integrated Circuit Device, and Electromechanical Instrument Operated by Integrated Circuit Device. Yamaguchi Takahiro developed the invention.
The patent application number is WO2025JP40667 2..
Semiconductor
| Tue 09 Jun 2026
Geneva, June 10 -- Central Glass Co Limited has applied WIPO patent for Polymer, Liquid Repellent Material Containing Said Polymer, Photosensitive Composition Containing Said Polymer, Cured Product Obtained by Curing Said Photosensitive Composition, Pattern Film-equipped Substrate, Method for Manufacturing Said Pattern Film-equi..
Semiconductor
| Tue 09 Jun 2026
Geneva, June 10 -- World Intellectual Property Organization has published Nexwafe Gmbh patent application for Method for Producing a Semiconductor Wafer by Means of Epitaxial Deposition, Seed Wafer and Method for Seed Wafer Production. The invention was developed by Siebke Frank, Arcega Solenn Aries, Vlasenko Timur and Seeliger ..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has released Yuerun Integrated Circuit Shaoxing Co Ltd patent application for Chip Packaging Method and Chip Packaging Structure. This invention was developed by Tao Jiaqiang, Yang Wenhao, Li Hui, Wang Tianyu and Lu Fangling.
The patent application number is CN20..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Tianjin Zhongke Jinghe Electronic Technology has sought patent for Pressure Head Device and Bonding Machine. This invention was developed by Yao Zhiguang, Gao Zhiwei and Mu Fengwen.
The patent application number is CN202511965534 20251224. The patent publication number is CN121568592 (A). International Pat..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Yangzhou Xinli Integrated Circuit Co Ltd patent application for Flip Chip Packaging Structure and Shape Differentiation Design Method Thereof. Zhong Xiaohui developed the invention.
The patent application number is CN202511749354 20251126. The patent..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has published Changfei Advanced Semiconductor Wuhan Co Ltd patent application for Integrated Semiconductor Device and Preparation Method Thereof, Power Module, Power Conversion Circuit and Vehicle. The invention was developed by Wang Shuai, Peng Nan, Lu Jipeng and L..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Packaging Substrate and Preparation Method Thereof, and Chip Packaging Structure. This invention was developed by Zhao Yanfei and Zhou Yanxu.
The patent application number is CN202511756123 20251126. The patent publication number ..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Xinchuang Tianmen Electronic Tech Co Ltd has filed a patent application for Fan-out Chip Packaging Structure and Packaging Process Thereof. This invention was developed by Li Qiang, Mao Zhixin, Li Yanfeng and Yu Wenwu.
The patent application number is CN202511705816 20251120. The patent publication number ..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Chip Packaging Structure and Chip Packaging Structure Preparation Method. This invention was developed by Zhang Wenbin and Zhou Yanxu.
The patent application number is CN202511756060 20251126. The patent publication number is CN12..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Jiangsu Pangu Semiconductor Tech Co Ltd has applied Chinese patent for High-density Chip Packaging Structure and Preparation Method Thereof. Zeng Junpeng and Ma Shuying developed it.
The patent application number is CN202511752203 20251126. The patent publication number is CN121568583 (A). International Pa..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Suzhou Guoxian Innovation Tech Co Ltd has sought patent for Chip Packaging Structure and Chip Packaging Structure Preparation Method. This invention was developed by Zhang Wenbin.
The patent application number is CN202511746721 20251125. The patent publication number is CN121568582 (A). International Paten..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Suzhou Guoxian Innovation Tech Co Ltd has filed a patent application for Package Carrier and Preparation Method Thereof, Package Chip and Electronic Equipment. This invention was developed by Zhou Yanxu.
The patent application number is CN202511755935 20251126. The patent publication number is CN121568576 ..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Suzhou Guoxian Innovation Tech Co Ltd has applied Chinese patent for Chip Packaging Structure, Chip Packaging Method and Chip Packaging Module. Zhang Wenbin developed it.
The patent application number is CN202511746921 20251125. The patent publication number is CN121568572 (A). International Patent Classif..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Wuhan Luobo Semiconductor Tech Co Ltd patent application for Method, Device and Equipment for Focusing Wafer Through Point Spectrum and Storage Medium. Mei Shuang, Jiang Chen, Hua Kai, Wang Xiangtong and Hu Yanchao developed the invention.
The patent..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Linhai Daihe Photoelectric Co Ltd has applied Chinese patent for Small White Box Chip Inserting Device with Automatic Calibration Function. Wang Zengyan and Wang Yanpeng developed it.
The patent application number is CN202511687710 20251118. The patent publication number is CN121568544 (A). International P..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Chengdu Gaotong Isotope Co Ltd Cnnc has applied Chinese patent for Controllable Radiation Treatment Temperature Control System for Semiconductor Modification. Wang Wei, Deng Zhiyong, Xu Chengcheng, Zeng Songbai, Meng Zhonghua, Yang Tianwei, Zhang Min, Hui Junjie, Du Yuran and Zhao Danlei developed it.
The ..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Quanxin Semiconductor Technology (Wuxi) has submitted a patent application for Rotary Spraying Type Wet Process All-in-one Machine. This invention was developed by Ouyang Xiaoquan.
The patent application number is CN20251214384 20251229. The patent publication number is CN121568541 (A). International Paten..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Jingxin Semiconductor Huangshi Co Ltd has submitted a patent application for Regenerated Wafer Scanning Method and Scanning System. Zhang Guangfa, Liu Xiao and Yu Wenbo developed the invention.
The patent application number is CN202511466918 20251014. The patent publication number is CN121568537 (A). Inter..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has released Jiangsu Jiejie Microelectronics Co Ltd patent application for Manufacturing Method of Mesa Type Semiconductor Device. This invention was developed by Tang Chunchen and Zhang Yi.
The patent application number is CN20261077185 20260121. The patent publ..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Beijing Zhongke Peian Integrated Circuit Tech Co Ltd has submitted a patent application for Implementation Method of Ultrathin Semiconductor and Heat Dissipation Method Based on Ultrathin Semiconductor. Zeng Chuanbin and Tian Daqing developed the invention.
The patent application number is CN202511471618 2..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has released Beijing Integrated Circuit Equipment Innovation Center Co Ltd patent application for Polycrystalline Silicon Etching Method and Semiconductor Process Equipment. This invention was developed by Li Meng, Lin Yuanwei, Xu Da, Yan Zhiwei and Zhao Zhenhong.
..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Hubei Jiangcheng Laboratory has submitted a patent application for Method for Reconstructing Wafer and Reconstructed Wafer. This invention was developed by Gao Biao, Luo Chao, Xie Huaqiang and Cheng Tiantian.
The patent application number is CN202511664278 20251113. The patent publication number is CN12156..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Hefei Yaozheng Quantum Tech Co Ltd patent application for Ion Trap Chip Structure and Manufacturing Method. Bao Yu and Tao Sijing developed the invention.
The patent application number is CN202511760699 20251127. The patent publication number is CN12..
Semiconductor
| Tue 09 Jun 2026
Geneva, June 10 -- World Intellectual Property Organization has released Picmore Tech Suzhou Ltd and Picmore Tech Pte Ltd patent application for Photonic Integrated Chip and Forming Method Therefor. This invention was developed by Wang Peng and Li Xianyao.
The patent application number is WO2025CN125582 20250930. The patent p..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Lantu Automotive Tech Co Ltd patent application for Vehicle Data Processing Method and Device, Chip and Vehicle. Qiu Jun, Fei Bo, Zhao Hai, Li Huayao and Fan Qiang developed the invention.
The patent application number is CN202511706036 20251119. The..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Jiangsu Weidian Hexing Tech Co Ltd patent application for Retractable Self-adaptive Protection Device for Photovoltaic Solar Cell Panel. Feng Lei developed the invention.
The patent application number is CN202511652450 20251112. The patent publicatio..
Semiconductor
| Tue 09 Jun 2026
Geneva, June 10 -- World Intellectual Property Organization has published BOE Tech Group Co Ltd and Fuzhou BOE Optoelectronics Technology patent application for Array Substrate, Chip on Film, Display Panel and Apparatus, and Resistance Test Method. The invention was developed by Wang Jinliang, Wang Wenchao, Chen Weiming, Lin Shu..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Shanghai Vanchip Electronic Tech Co Ltd has sought patent for Voltage Fast Switching Enhancement Circuit and Method, Dcdc Power Supply, Chip and Equipment. This invention was developed by Li Chunling and Li Feng.
The patent application number is CN20261083796 20260122. The patent publication number is CN12..
Semiconductor
| Tue 09 Jun 2026
Geneva, June 10 -- World Intellectual Property Organization has received BOE Tech Group Co Ltd and Beijing BOE Display Technology patent application for Array Substrate and Display Device. Gao Xiaojuan, Li Cheng, Chen Gaowei, Liu Fangyi, Wang Yaodong, Xue Hailin, Wu Hao, Zhang Xiaoping, Fan Litao, Zheng Yangli, Zhang Xiaojie, Zh..
Semiconductor
| Tue 09 Jun 2026
Geneva, June 10 -- World Intellectual Property Organization has received Boya Advanced Mat Co Ltd patent application for Method and System for Growing Crystal by Means of Epitaxy, and Method and System for Growing Epitaxial Wafer by Means of Epitaxy. Wang Yu, Zeng Chenduo, Zhao Yutao and Gu Peng developed the invention.
The p..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Quanzhou Haichuan Semiconductor Co Ltd patent application for Integrated Power Supply Driving Control Chip Circuit with High Adaptability to Power Supply Voltage. Wang Zhaoyun, Guo Jingsong and Li Fan developed the invention.
The patent application n..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Quanzhou Haichuan Semiconductor Co Ltd has submitted a patent application for Charging Power Supply Chip Circuit. This invention was developed by Wang Zhaoyun, Guo Jingsong and Li Fan.
The patent application number is CN20261084500 20260122. The patent publication number is CN121566715 (A). International P..
Semiconductor
| Wed 10 Jun 2026
Geneva, June 10 -- Beijing Smartchip Microelectronics Technology Co Limited has submitted a patent application for Reconfigurable Interconnection Circuit for Multi-core Processor, Implementation Method, and Chip. This invention was developed by Li Jinwang, Zhao Dongyan, Li Dejian, Tan Lang, Yang Lixin, Cong Rongzi, Liu Yinghao a..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- Shanghai Yiding Tech Group Co Ltd has sought patent for Device and Method for Supplying Grinding Fluid in Semiconductor Production Process. This invention was developed by Ding Hongwei, Dai Hongjian and Luo Xiaoqing.
The patent application number is CN20261037703 20260113. The patent publication number is ..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- Jiangsu Zijing Mat Co Ltd has submitted a patent application for Semiconductor Silicon Wafer Polishing Equipment. This invention was developed by Zhuo Hongjun, Xu Yiming and Jin Long.
The patent application number is CN20261022853 20260108. The patent publication number is CN121572171 (A). International Pa..
Semiconductor
| Wed 10 Jun 2026
Geneva, June 10 -- World Intellectual Property Organization has released Tokyo Electron Ltd and Tokyo Electron US Holdings patent application for Fully Self-aligned Contact Between Backside Power and Interconnect Using Replacement Metal Contact Integration. This invention was developed by Smith Jeffrey, Tapily Kandabara, Liu Eri..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- Nantong Ouleide Intelligent Tech Co Ltd has submitted a patent application for Glass Wafer Laser Cutting Head with Cooling Mechanism. This invention was developed by Jiang Weihua, Du Tao, Xu Jinxian, Yan Lingling and Xu Shuxiang.
The patent application number is CN202610112081 20260127. The patent publicat..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Yingtian Ind Shenzhen Co Ltd patent application for Laser Etching Device for Mini LED Substrate Bonding Pad and Etching Method Thereof. Zou Xianfeng, Jiang Zhidong and Yao Ying developed the invention.
The patent application number is CN20261083500 2..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has published Henan Hongchang Electronics Co patent application for Lead Welding Method for Semiconductor Chip. The invention was developed by Chen Jianmin, Ding Yanan, Zhang Wentao, Han Xiao and Zhao Liping.
The patent application number is CN202610109671 202601..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- Guangdong Canwin Automatic Equipment Co Ltd has submitted a patent application for Silicon Steel Sheet Shearing and Taking Assembly and Silicon Steel Sheet Machining Equipment Thereof. Huang Jianming, Huang Chaoming, Huang Zhuoming and Han Jiaqing developed the invention.
The patent application number is C..
Semiconductor
| Wed 10 Jun 2026
Beijing, June 10 -- Zhongjing Fenghuo Beijing Tech Co Ltd has submitted a patent application for Heat Conduction Substrate with Micro-channel Heat Dissipation Structure and Preparation Method Thereof. This invention was developed by Zhu Ruiping, Chen Wangshou and Zhao Zibin.
The patent application number is CN202511685352 202..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Rnr Labs Inc has submitted a patent application for Semiconductor Process Apparatus and Semiconductor Processing Method Using the Same. This invention was developed by Ryu Jeong-do, Cho Joo-hyun, Ryu Sung-hoon and Kang Sung-ho.
The patent application number is CN20248047776 20240711. The patent publication..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has released Triumph Photovoltaic Mat Co Ltd patent application for Method and Equipment for Preparing Perovskite Solar Cell Module. This invention was developed by Wang Yunfei, Zhang Kuanxiang, Jiang Jiwen, Tao Siquan, Chen Keyu, Chen Chen, Chen Tao, Wu Youqiang, X..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Skyai Inc has applied Chinese patent for Embedded Photonic Integrated Circuit in Semiconductor Package for High Bandwidth Memory and Computing. Aggarwal Avneesh, Sani Subbar, Winterbottom Peter and Boss Michael developed it.
The patent application number is CN20248045416 20241227. The patent publication nu..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Chengdu Jingxin Mingneng Photovoltaic Tech Co Ltd has submitted a patent application for Interface Passivation Layer and Preparation Method Thereof, Perovskite Solar Cell and Photovoltaic Module. Huang Di, Yang Tian and Tang Xiao developed the invention.
The patent application number is CN202511954002 2025..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Shenzhen Goldenken New Mat Co Ltd has sought patent for Mip Chip Flip Packaging Structure and Packaging Process Thereof. This invention was developed by Li Zhisen and Ge Xiubin.
The patent application number is CN20261076710 20260121. The patent publication number is CN121568487 (A). International Patent C..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Jinko Solar Holding Co Ltd has submitted a patent application for Preparation Method of Solar Cell, Solar Cell and Photovoltaic Module. Zhou Yuyao, Feng Xiu, Xu Menglei, Yang Jie and Zhang Xinyu developed the invention.
The patent application number is CN20261091942 20260122. The patent publication number ..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Emg Automation GmbH has submitted a patent application for Apparatus and Method for Real-time Determination of Planar Dielectric Covering on Substrate. This invention was developed by Bahmer Frank, Bublitz Ju Rg and Germer Thomas.
The patent application number is CN20248047600 20240708. The patent publicat..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has released Zhuhai Fushan Aixu Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Tianjin Aiko Solar Energy Technology, Guangdong Aiko Solar Energy Technology Co Ltd and Zhejiang Aiko Solar Energy Technology patent application for Back Contact Solar ..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Angell Tech Shenzhen Co Ltd has sought patent for Power Semiconductor Device with Integrated Field Plate Structure and Manufacturing Method Thereof. This invention was developed by Liang Jiajin, Chen Xiaoliang, Gao Jianzhi and Shan Jianan.
The patent application number is CN20261062610 20260119. The patent..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Nanjing University of Posts and Telecommunications and Nanjing Univ Of Posts And Telecommunications Institute At Nantong Co Ltd patent application for Potential Clamping Silicon Carbide Floating Island Device with Zero Dynamic Resistance Degradation. Ya..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Zhao Yijun has applied Chinese patent for Power MOS Tube with Grid Anti-surge Function. Zhao Yijun developed it.
The patent application number is CN20231040089 20230112. The patent publication number is CN121568415 (A). International Patent Classification codes are H10D12/00, H10D30/00 and H10D62/10.
T..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Shenzhen Founder Microelectronics Co Ltd has submitted a patent application for Groove Silicon Carbide Device and Chip. Cai Zongrui developed the invention.
The patent application number is CN202511698776 20251118. The patent publication number is CN121568407 (A). International Patent Classification codes ..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Shenzhen Founder Microelectronics Co Ltd patent application for Groove Silicon Carbide Device and Chip. Cai Zongrui developed the invention.
The patent application number is CN202511695912 20251118. The patent publication number is CN121568406 (A). I..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Hefei Anxun Precision Tech Co Ltd has submitted a patent application for Sorting Method and System for Avoiding Substrate Mounting Interference. This invention was developed by Yu Huanhuan, Qian Jiajia, Fu Yanan, Shi Hang and Tang Jiamin.
The patent application number is CN202511971974 20251225. The patent..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- State Intellectual Property Office of China has received Nantong Dachuang Cnc Machinery Equipment Co Ltd patent application for PCB Chip Mounter for Circuit Board Production. Shi Yun and Che Bing developed the invention.
The patent application number is CN202511823775 20251205. The patent publication numbe..
Semiconductor
| Tue 09 Jun 2026
Beijing, June 10 -- Kungao Xinxin Microelectronics Jiangsu Co Ltd has submitted a patent application for Method for Realizing Ptp (precision Time Protocol) Main Interface Function by Chip and Switch Chip. This invention was developed by Qian Chao.
The patent application number is CN202511659624 20251113. The patent publicatio..
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