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Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- State Intellectual Property Office of China has published Qingzhi Biotechnology Xuzhou Co Ltd patent application for High-throughput Cell Migration Chip as Well as Preparation Method and Application Method Thereof. The invention was developed by Du Chuan and Jiang Zhenwei.
The patent application number is C..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Beijing Yimeinuo Biotechnology Co Ltd has submitted a patent application for Real-time Fluorescent PCR Instrument Suitable for Micro-fluidic Chip. This invention was developed by Zeng Youhong, Yuan Yatan, Zhang Yize, Liu Lingxuan, Ding Yingying, Ma Xingwei, Chen Hao and Wang Lei.
The patent application numb..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- State Intellectual Property Office of China has published Beijing Yimeinuo Biotechnology Co Ltd patent application for Four-channel Centrifugal Microfluidic Nucleic Acid Amplification Chip with Closed Cavity. The invention was developed by Zeng Youhong, Qin Xuying, Zhang Yize, Liu Lingxuan, Ding Yingying, Ma X..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- Texas Instruments has applied European patent for Comparator with Noise Cancellation for Switching Power Converters. Pradhan Bikash, Jain Mayank, Shah Yash and Baragur Suryanarayana Dattatreya developed it.
The patent application number is EP20240787262 20240916. The patent publication number is EP4781545 (A1)..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- State Intellectual Property Office of China has received Yantai Likai Semiconductor Tech Co Ltd patent application for Composite Cutting Fluid and Method for Multi-wire Cutting of Silicon Carbide. Zou Yong, Wu Yujun, Guo Yingjun, Li Jin, Qiu Xinlei, Kong Dekai, Lyu Chunzhe, Che Meiwei, Cao Quanyu and Wang Li d..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- State Intellectual Property Office of China has released Amer Tech Co Ltd patent application for Long-chain Alkyl Modified Organic Silicon Composition and Preparation Method Thereof. This invention was developed by Yao Jing, Liu Rende, Liang Zhenxing and Li Qinghua.
The patent application number is CN202610..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- European Patent Office has released EV Group E Thallner patent application for Method for Transferring a Functional Unit, Donor Substrate and Apparatus for Carrying Out Such a Method. This invention was developed by Uhrmann Thomas, Thallner Bernhard, Lindner Paul and Wimplinger Markus.
The patent application n..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- Thallner Erich has submitted a patent application for Substrate Stack, Modified Layer System, Method for Handling the Substrate Stack, and Device for Such a Method. This invention was developed by Thallner Erich.
The patent application number is EP20230772497 20230918. The patent publication number is EP4781..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Ningbo Anji Microelectronics Technology has submitted a patent application for Etching Composition. Li Lyu, Wen Qimeng, Xia Deyong, Liu Bing and Wang Zhihao developed the invention.
The patent application number is CN202411635934 20241115. The patent publication number is CN122037939 (A). International Pate..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- ASML Netherlands has applied European patent for Substrate Coupling Systems. Hsu Chia-hao developed it.
The patent application number is EP20240755038 20240816. The patent publication number is EP4781452 (A1). Cooperative Patent Classification codes are G01B2210/56 (KR), G01B7/22 (KR), H10P72/0428 (EP, KR), H1..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- EV Group E Thallner has sought patent for Method for Assessing a Quality of a Bond Between a First Substrate and a Second Substrate in a Substrate Stack, and Device for Such a Method. This invention was developed by Fehkührer Andreas.
The patent application number is EP20230773226 20230918. The patent publica..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- Tokyo Electron has submitted a patent application for Methods and Devices for Improving Bond Strength of Diffusion Barriers. This invention was developed by Gildea Adam and Hoshino Satohiko.
The patent application number is EP20240868895 20240722. The patent publication number is EP4781447 (A1). Cooperative Pa..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- Lam Research has filed a patent application for Integrated Capacitively Coupled Plasma and Remote Inductively Coupled Plasma. This invention was developed by Juarez Francisco J, Frotanpour Ali, Fisher Adam, Kudela Jozef, Schlosser William, Mckerrow Andrew John, Tang Shane, Russell Shoa Allene and Bhimarasetti G..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Guangdong Pusaida Material Tech Co Ltd has submitted a patent application for Dealcoholization Type Organic Silicon Bonding Glue for Electric Kettle and Preparation Method of Dealcoholization Type Organic Silicon Bonding Glue. This invention was developed by Xie Mengxing, Li Zhongjing and Zhan Feng.
The pat..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Youxing Shark Shanghai Science And Tech Co Ltd has filed a patent application for Low-density Adhesive Organic Silicon Pouring Sealant and Preparation Method Thereof. This invention was developed by Xu Xinxin, Lei Yong and Peng Xuanzhi.
The patent application number is CN202610235370 20260227. The patent pu..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Micron Technology Inc and Micron Technology have been awarded a patent for Receiver Decision Feedback Equalization Calibration. This invention was developed by Brox Martin, Hein Thomas, Balakrishnan Mani, Nenadovic Miljana, Madhewar Hemant and Bach Martin.
The patent application number is US202418984778 ..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Texas Instr Incorporated and Texas Instruments have received a patent for Microelectronic Device Package with Integral Slotted Waveguide Antenna. This invention was developed by Bakshi Harshpreet Singh Phull, Ankamah-kusi Sylvester, Jogalekar Aditya Nitin, Murugan Rajen, Tang Yiqi and Herbsommer Juan.
Th..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Applied Materials Inc and Applied Materials have been awarded a patent for Substrate Support Assembly with Improved Thermal Uniformity. This invention was developed by Parkhe Vijay D.
The patent application number is US202318244180 20230908. The patent publication number is US12695071 (B2). International..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Lam Res Corp and Lam Research have obtained a patent for control of mask CD. This invention was developed by Chen Chen, Ozel Taner, Xu Qing, Wong Merrett, Jiang Beibei, Pi Shuang, Agarwal Daksh and Mukhopadhyay Amit.
The patent application number is US202218011477 20220225. The patent publication number ..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Lam Res Corp and Lam Research have secured a patent on Synchronization of RF Pulsing Schemes and of Sensor Data Collection. Drewery John Stephen, Wu Ying, Paterson Alexander Miller and Albarede Luc developed the invention.
The patent application number is US202118009978 20211015. The patent publication n..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Micron Technology Inc and Micron Technology have obtained a patent for triple via chain for advanced interconnect in a memory device. This invention was developed by Davis James Eric, Tomayer Joshua Daniel, Rori Fulvio, Cerafogli Chiara, Marr Kenneth William and Wambeke Ivo Thomas.
The patent application..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Taiwan Semiconductor Manufacturing Co Ltd and Taiwan Semiconductor Manufacturing have received a patent for Dual Tracking for Fly Bit Line Static Random Access Memory (SARM) Architecture. This invention was developed by Katoch Atul.
The patent application number is US202418756659 20240627. The patent pub..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Etron Tech Inc and Invention and Collaboration Laboratory have been awarded a patent for CMOS SRAM Structure with Bulk NMOS Transistors and Fully Insulated PMOS Transistors in One Bulk Wafer. This invention was developed by Lu Chao-chun.
The patent application number is US202318137620 20230421. The paten..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- Shenzhen Sireda Tech Co Ltd has obtained a patent for miniature semiconductor water cooling machine. This invention was developed by Wang Guohua and Li Zelin.
The patent application number is CN202422783820U 20241114. The patent publication number is CN223512368 (U). International Patent Classification code..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Ningbo Jiuxin New Material Tech Co Ltd has submitted a patent application for Hydrophobic Weather-resistant Anti-reflection Coating for Flexible Substrate and Preparation Method of Hydrophobic Weather-resistant Anti-reflection Coating. Li Cencen, Gao Jingtong, Zhang Ping, Tang Yue, Liu Hongkun, Zeng Weihua and..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Applied Materials Inc and Applied Materials have obtained a patent for rotary electrical feedthrough integration for process chamber. This invention was developed by Tomko Andrew, Guo Yang, Forster John, Harrelson Wade, Subramani Anantha, Baluja Sanjeev, Ganta Sathya Swaroop, Chan Anthony and Murtagh Mike.
..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Infineon Tech Americas Corp and Cypress Semiconductor Corporation have secured a patent on Radio Transmitter. Ponton Davide, Manente Davide, Karman Saleh and Petricli Ibrahim developed the invention.
The patent application number is US202318478816 20230929. The patent publication number is US12695473 (B2..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Texas Instr Incorporated and Texas Instruments have secured a patent on Low-latency Data Acquisition Using Sigma-delta Modulators. Ivanov Misha, Bucksch Roland and Romano Mattia developed the invention.
The patent application number is US202418902584 20240930. The patent publication number is US12695463 ..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Texas Instr Incorporated and Texas Instruments have obtained a patent for compensated digital-to-analog converter (DAC). This invention was developed by Agrawal Meghna and Sahu Debapriya.
The patent application number is US202418639466 20240418. The patent publication number is US12695460 (B2). Internati..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- University Zhejiang and Zhejiang University have been awarded a patent for Low-density Liquid-phase Chip for Gossypium Hirsutum L. Based on Targeted Capture Sequencing and Use Thereof. This invention was developed by Hu Yan, Han Zegang, Si Zhanfeng, Fang Lei and Zhang Tianzhen.
The patent application num..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Research & Business Foundation Sungkyunkwan University, Samsung Electronics Co Ltd and Research & Business Found Sungkyunkwan University have obtained a patent for sense amplifier flip-flop and integrated circuit including the same. This invention was developed by Kong Bai-sun, Joo Bomin and Lee Jaeha.
T..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- STMicroelectronics International NV and STMicroelectronics International NV have secured a patent on Electronic Oscillator with Independent Controls of Variable Capacities. Ayraud Michel and Ramalho Teixeira Jr Fernando Jose developed the invention.
The patent application number is US202418943506 2024111..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Texas Instr Incorporated and Texas Instruments have received a patent for Methods and Apparatus to Adjust Linear Redriver Devices. This invention was developed by Wente Douglas Edward, Erdogan Mustafa U and Rane Amit.
The patent application number is US202418790834 20240731. The patent publication number..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Texas Instr Incorporated and Texas Instruments have obtained a patent for switching converter deadtime control. This invention was developed by Lu Xuemei, Ban Pengcheng, Wang Yubo, Zhou Zhaofu and Tang Hua.
The patent application number is US202418427937 20240131. The patent publication number is US12695..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- ST Microelectronics SRL and STMicroelectronics International NV have obtained a patent for driver circuit with discharge control, corresponding electronic system and vehicle. This invention was developed by Cannavacciuolo Salvatore and D'angelo Vittorio.
The patent application number is US202418441537 20..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- Ningbo Jiangfeng Tongxin Semiconductor Mat Co Ltd has obtained a patent for double-sided sintering jig for copper-clad ceramic substrate. This invention was developed by Xing Zhong, Yuan Feng, Heng Dongjie, Yao Lijun, Bian Yijun and Zhang Huiran.
The patent application number is CN202422550758U 20241022. Th..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- State Intellectual Property Office of China has awarded a patent to Laplace (Guangzhou) Semiconductor Technology for Sealing Door Mechanism and Semiconductor Process Equipment. Long Zhanyong, Zhou Liang, Jin Wenkai, Wang Qinqin and Lin Jiaji developed the invention.
The patent application number is CN20242311..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- Jiangsu Shunxing Refractory Tech Co Ltd has obtained a patent for reinforced silicon mullite brick. This invention was developed by Wu Junliang, Shen Chi, Yu Yidong and Han Xueliang.
The patent application number is CN202422941634U 20241130. The patent publication number is CN223512500 (U). International Pa..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- Saisi Exploration Hubei New Material Tech Co Ltd has been granted a patent for Self-bonding Silicon Carbide Sintering Device. This invention was developed by Tan Chuanqi, Zhu Hongxi and Zhou Hechen.
The patent application number is CN20242339152U 20241209. The patent publication number is CN223512484 (U). I..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Chengdu Wanzhong Weilai Biotechnology Co Ltd has secured a patent on Substrate Surface Modification Device for Gene Sequencing Chip. Zhang Zhifeng and Li Jianlong developed the invention.
The patent application number is CN202422884766U 20241126. The patent publication number is CN223509881 (U). Internation..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- Ferrotec Jiangsu Quartz Technology has submitted a patent application for High-pressure Steam Quartz Substrate Cleaning Process and Device Thereof. This invention was developed by Xu Mingxiang, Chen Haiyuan, Zhong Jianya, Zhang Yueqing and Yang Jun.
The patent application number is CN202511765701 20251127. Th..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- Jiangxi Tianyi Semiconductor Co Ltd has filed a patent application for Integrated Circuit Packaging Chip Sorting Machine. This invention was developed by Huo Jianlong and Wang Chao.
The patent application number is CN202610234683 20260227. The patent publication number is CN122032902 (A). International Pate..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- State Intellectual Property Office of China has released Jiangxi Changlong Tech Co Ltd patent application for Automatic Chip Resistor Sorting and Classifying Device Based on Industrial Visual Inspection. This invention was developed by Long Xiang, Li Weizhong, Tian Renzhong, Jia Bixi and Jia Longtao.
The pa..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- State Intellectual Property Office of China has received Suzhou Shanshuyuan Semiconductor Equipment Co Ltd patent application for Gluing Device for Semiconductor Wafer Processing. Tang Weidong and Zhou Xiaojuan developed the invention.
The patent application number is CN202610198843 20260211. The patent pub..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- SiEn QingDao Integrated Circuits has submitted a patent application for Fluid Shunting Device and Semiconductor Equipment. This invention was developed by Liu Jinlin and Peng Jie.
The patent application number is CN202411622441 20241113. The patent publication number is CN122032776 (A). International Patent C..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Microchip Tech Inc and Microsemi SoC have been awarded a patent for High-level-synthesis for RISC-V System-on-chip Generation for Field Programmable Gate Arrays. This invention was developed by Ma David, Choi Jongsok and Lian Ruolong.
The patent application number is US202318208381 20230612. The patent p..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Lianyungang Zhaohua Tech Co Ltd has applied Chinese patent for High-adhesion Epoxy Resin Composition and Application Thereof in Semiconductor Chip Packaging. Song Fangfang, Qiu Zhaowu and Jang Je-hyun developed it.
The patent application number is CN202610255013 20260304. The patent publication number is CN..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- Siaien Jiujiang New Mat Co Ltd has filed a patent application for Method for Producing and Processing Silicon Nitride Powder. This invention was developed by Li Xiuquan and Gu Yujun.
The patent application number is CN202610305785 20260313. The patent publication number is CN122032705 (A). International Pat..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- State Intellectual Property Office of China has received University of Electronic Science and Technology of China patent application for Full-process Integrated Micro-fluidic Integrated Thin-layer Chromatography-surface Enhanced Raman Scattering Analysis Chip. Xie Ruiqi, Guo Xiaowei and Xu Zhuoyi developed the..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- Dalian Institute of Chemical Physics, Chinese Academy of Sciences has filed a patent application for Bimetal Monatomic Catalyst, Preparation Method and Application. This invention was developed by Feng Liang, Shi Yushu and Liu Anglong.
The patent application number is CN202411632669 20241115. The patent pub..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Guangzhou Zhono Electronic Tech Co Ltd and Guangzhou Zhono Elect Tech Co Ltd have obtained a patent for method and device for detecting a connection of a chip to a printing device. This invention was developed by Cui Zhishu.
The patent application number is US202318319523 20230518. The patent publication..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- European Patent Office has published NXP patent application for Communication Terminal, Universal Integrated Circuit Card and Method Therefor. The invention was developed by Tiwari Rohit.
The patent application number is EP20250192623 20250729. The patent publication number is EP4783545 (A1). International Pat..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- European Patent Office has published Huawei Technologies patent application for Power Supply Circuit, Wireless Communication System and Chip. The invention was developed by Wu Jianfeng, Han Zhifang, Liu Chang and Qin Zhongming.
The patent application number is EP20240923289 20240903. The patent publication num..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Power Generation Device and Electrical Apparatus. Yoshino Yoshitaka and Yoshida Toshikazu developed the invention.
The patent application number is EP20240868034 20240826. The patent publication number is EP4783415 (A1). Internat..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- European Patent Office has released Innatera Nanosystems patent application for Feature Extraction and Encoding of Spiking Neural Networks Using Convolutional Neural Network and Trainable Encoders for Deployment in Neuromorphic Chips. This invention was developed by Pérez Belizón Rafael Javier, Nagy Sebastian..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- State Intellectual Property Office of China has released Jiangsu Lixiang Optics Tech Co Ltd patent application for Polyester-organic Silicon Rubber Blended Thermosetting Pressure-sensitive Adhesive Tape as Well as Preparation Method and Application Thereof. This invention was developed by Zhang Xiaoliang.
T..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- State Intellectual Property Office of China has published Shenzhen Jingheng Photoelectric Tech Co Ltd patent application for Heat-resistant Low-residue Protective Adhesive Tape Suitable for Cutting Ultrathin Wafer. The invention was developed by Hwang Se-il, Chen Sanyou, Chen Zongwei and Yang Mingjun.
The p..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- State Intellectual Property Office of China has released Sichuan Zhanyuan Electronic Mat Co Ltd and Deyang Zhanyuan New Material Tech Co Ltd patent application for Polishing Solution for Silicon Wafer Substrate and Preparation Method Thereof. This invention was developed by Xiang Ding'ai, Gao Manrong and Xia T..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Han Yuwei has filed a patent application for Infrared Stealth Type Porous Silicon Heat Insulation Car Cover Material and Preparation Method Thereof. This invention was developed by Han Yuwei.
The patent application number is CN202610368196 20260324. The patent publication number is CN122037754 (A). Internat..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- ASML Netherlands has sought patent for Radiation System. This invention was developed by Smid Pieter Henry.
The patent application number is EP20240762682 20240830. The patent publication number is EP4781250 (A1). International Patent Classification codes are G03F7/00 and H05G2/00. Cooperative Patent Classific..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Shanghai Lanbao Paint Co Ltd has filed a patent application for Pet Anti-burst Electroplating Primer and Preparation Method Thereof. This invention was developed by Jiang Bin and Fu Yuxiang.
The patent application number is CN202610367419 20260324. The patent publication number is CN122037739 (A). Internati..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- Hospital Affiliated To Fuzhou Univ has filed a patent application for Multi-cavity Micro-fluidic Chip Level Instant-preparation Infusion Device. This invention was developed by Fang Rui and Weng Wenhui.
The patent application number is CN202610381356 20260326. The patent publication number is CN122031818 (A..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Texas Instr Incorporated and Texas Instruments have secured a patent on Three-dimensional Cluster Simulation on Gpu-less Systems. Paul Subhajit, Devshatwar Nikhil Nandkishor, Karthik Shravan and N Santhana Bharathi developed the invention.
The patent application number is US202318309213 20230428. The pat..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Applied Materials Inc and Applied Materials have secured a patent on CMP Inner Ring in Smart Head. Decena Michael Prestoza, Balakrishnan Parthiban, Ling Yuan, Huang Chao-jian, Sun Sylvia, N Sridhar K, Yang Tsu-hui, Chang Chih An, Wang Tk and Wen Simpson developed the invention.
The patent application num..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Texas Instr Incorporated and Texas Instruments have secured a patent on Watertight Housing Designs for Ultrasonic Lens Cleaning. Magee David P and Chen Hailong developed the invention.
The patent application number is US202418429076 20240131. The patent publication number is US12691476 (B2). Internationa..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Applied Materials Inc and Applied Materials have received a patent for Lithography Stitching. This invention was developed by Guo Jing, Xu Yongan and Wilkinson William.
The patent application number is US202318131737 20230406. The patent publication number is US12693597 (B2). International Patent Classif..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Inha University Research and Business Foundation, University Inha Res & Business Found and Samsung Electronics have secured a patent on Organometallic Compound Comprising a Metal Combined with at Least One Ligand Containing Four or More Fluorine Atoms, Resist Composition Comprising the Same, and Method of F..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Taiwan Semiconductor Manufacturing Co Ltd and Taiwan Semiconductor Manufacturing have received a patent for Integrated Photodetector with Embedded Semiconductor Region. This invention was developed by Rusu Stefan and Huang Tai-chun.
The patent application number is US202318314176 20230509. The patent pub..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Zhejiang Ruitaixin Machinery Tech Co Ltd has been granted a patent for Automatic Dosing Device for Electroplating Zinc-nickel Alloy. Xie Dongying developed the invention.
The patent application number is CN20242351288U 20241211. The patent publication number is CN223510032 (U). International Patent Classifi..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Nantong Weiteng Semiconductor Tech Co Ltd has been granted a patent for Plating Solution Recovery Device for Electroplating of Wafer Cutting Blade. This invention was developed by Zhu Kaihua, Han Yangtong, Zhang Lianjia and Wu Honglei.
The patent application number is CN20242369832U 20241212. The patent pub..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Baoding City Putianao Electric Tech Instruments Co Ltd has secured a patent on Clamp for Electroplating Metal Connector. Wu Xinnian and Wu Qianfei developed the invention.
The patent application number is CN202421717266U 20240719. The patent publication number is CN223510022 (U). International Patent Classi..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Longyou Yunshen Platemaking Co Ltd has received a patent for Plate Roller Electroplating Bath. This invention was developed by Lv Hairong, Tian Jinfeng, Liu Kailun, Wei Kaiqiang and Li Qi.
The patent application number is CN20242388721U 20241213. The patent publication number is CN223510021 (U). Internation..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Baoding City Putianao Electric Tech Instruments Co Ltd has secured a patent on Special-shaped Metal Connector Electroplating Protection Device. Wu Qianfei and Wu Xinnian developed the invention.
The patent application number is CN202421728414U 20240722. The patent publication number is CN223510006 (U). Inte..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Shenzhen Matrix Multi Technology has received a patent for Substrate Supporting Assembly. This invention was developed by Zhang Liang, Chen Weizhong, Li Yongjie, Gong Wenzhi, Shao Shouqian and Zhang Xiaojun.
The patent application number is CN20242386801U 20241213. The patent publication number is CN223509961..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Chengdu Denway Newtype Metal Mat Co Ltd has been granted a patent for Switching Mechanism and Substrate Hanging Device in Evaporation Cavity. This invention was developed by Qin Lei.
The patent application number is CN202422736739U 20241111. The patent publication number is CN223509937 (U). International Pa..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- Intel has filed a patent application for Buffer Status Report in Multi-station Device Block Acknowledgment. This invention was developed by Cariou Laurent.
The patent application number is EP20250225610 20251219. The patent publication number is EP4783500 (A1). International Patent Classification code is H04..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- European Patent Office has received Niterra Mat Co Ltd patent application for Ceramic Scribe Substrate, Method for Manufacturing Ceramic Scribe Substrate, Method for Manufacturing Ceramic Substrate, and Method for Manufacturing Ceramic Circuit Substrate. Matsumoto Yukihisa and Hoshino Naoto developed the invent..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- ASML Netherlands has submitted a patent application for Die Carrier for a Bonding Tool. Seijger Olav Johannes and Dekkers Jeroen developed the invention.
The patent application number is EP20250154318 20250128. The patent publication number is EP4783233 (A1). International Patent Classification codes are B25B1..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- SCREEN Holdings has filed a patent application for Substrate Processing Device. This invention was developed by Oka Shogo, Mori Ryohei, Morita Tomokazu and Osada Naoyuki.
The patent application number is EP20240868175 20240910. The patent publication number is EP4783230 (A1). International Patent Classificatio..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- SCREEN Holdings has applied European patent for Substrate Processing Device. Oka Shogo, Fujikawa Yuhei, Mori Ryohei, Morita Tomokazu and Osada Naoyuki developed it.
The patent application number is EP20240868174 20240910. The patent publication number is EP4783229 (A1). International Patent Classification code..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- European Patent Office has received SCREEN Holdings patent application for Substrate Processing Device and Substrate Processing Method. Yashiki Hiroyuki, Wakita Asuka and Endo Toru developed the invention.
The patent application number is EP20240868037 20240826. The patent publication number is EP4783228 (A1)...
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- Tokyo Electron has submitted a patent application for Substrate Processing System, Joining Device, and Joining Method. This invention was developed by Shinozuka Shinichi.
The patent application number is EP20240871907 20240913. The patent publication number is EP4783225 (A1). Cooperative Patent Classification ..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- Mi2 Factory GmbH has filed a patent application for Method for Ion Implantation into a Substrate. This invention was developed by Csato Constantin and Krippendorf Florian.
The patent application number is EP20250154162 20250127. The patent publication number is EP4783223 (A1). International Patent Classifica..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Zengguo Shaoxing Tech Co Ltd has applied Chinese patent for High-purity Silicon Carbide Ceramic and Preparation Method Thereof. Zhou Guofeng, Fang Yan, Chen Jian, Xia Qiji, Dong Shuwei, Wang Ce and Yu Maochun developed it.
The patent application number is CN202610320731 20260317. The patent publication numb..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- State Intellectual Property Office of China has released Yixing Zhongdian Wear Resistant And Fire Resistant Tech Co Ltd patent application for Rare Earth Modified Silicon Carbide-based Corrosion-resistant Dioxin-resistant Wear-resistant Material. This invention was developed by Yuan Genfang.
The patent appl..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- Qingdao Besland Semiconductor Tech Co Ltd has been granted a patent for High-flux Semiconductor Pneumatic Diaphragm Pump Device. This invention was developed by Ren Guangjie and Chang Sheng.
The patent application number is CN202423197338U 20241223. The patent publication number is CN223511082 (U). Internat..
Semiconductor
| Wed 05 Aug 2026
Munich, Aug. 6 -- European Patent Office has published Huawei Technologies patent application for Computing Device and Computing Chip. The invention was developed by Wu Wei, Qian Zhengyang, Niu Xinxiang, Ni Leibin and Liu Haobo.
The patent application number is EP20240881556 20241021. The patent publication number is EP4782987 ..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Zhejiang Liufang Semiconductor Tech Co Ltd has submitted a patent application for Isostatic Pressing Graphite Base Material for Silicon Carbide Vapor Phase Method Crystal Growth and Preparation Method of Isostatic Pressing Graphite Base Material. Hu Renhao, He Shaolong, Li Xiangxiang and Ding Liuning developed..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Zhejiang Liufang Semiconductor Tech Co Ltd has sought patent for Method for Improving Graphite Pore Silicon Carbide Coating. This invention was developed by Hu Renhao, He Shaolong, Ding He and Ding Liuning.
The patent application number is CN202511894313 20251216. The patent publication number is CN12203639..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- University of Electronic Science and Technology of China has submitted a patent application for Near-room-temperature N-type Multi-metal Co-doped Pbte-based Thermoelectric Material and Preparation Method Thereof. This invention was developed by Xiao Yu, Zhang Ruiyuan, Zhang Haoyu and Oto Nobusho.
The patent a..
Semiconductor
| Thu 06 Aug 2026
Beijing, Aug. 6 -- State Intellectual Property Office of China has published Xinte Energy Co Ltd patent application for Reactor and Method for Producing Granular Silicon. The invention was developed by Hu Hui, Guo Yanbin, Huang Jinfeng, Shao Wei, Min Zhonglong, Lyu Xueqian and Liu Xingping.
The patent application number is CN..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Globalfoundries SG Pte Ltd and GlobalFoundries Singapore have obtained a patent for semiconductor devices and methods of forming the same. This invention was developed by Tan Juan Boon, Sun Jianxun and Lee Shu Hui.
The patent application number is US202318479107 20231001. The patent publication number is..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Texas Instr Incorporated and Texas Instruments have been awarded a patent for Transistor Device with Sinker Contacts and Methods for Manufacturing the Same. This invention was developed by Chisholm Michael F, Yang Hong, Xiong Yufei and Liu Yunlong.
The patent application number is US202117322274 20210517..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Applied Materials Inc and Applied Materials have obtained a patent for methods and mechanisms for coupling sensors to transfer chamber robot. This invention was developed by Ummethala Upendra, Criminale Phillip, Myles Andrew, Zhang Chunlei and Shah Vivek B.
The patent application number is US202217903581..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Gudeng Prec Industrial Co Ltd and Gudeng Precision Industrial have obtained a patent for substrate container equipped with stabilizing support and smooth tray connection. This invention was developed by Lyu Jyun-ming, Lee Kuo-hua, Shen En-nien, Chiu Ming-chien and Chuang Chia-ho.
The patent application n..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Taiwan Semiconductor Manufacturing Co Ltd and Taiwan Semiconductor Manufacturing have been awarded a patent for Apparatus for Processing Substrates or Wafers. This invention was developed by Chiu Yuling, Yin Li-chao, Yang Yu-lung and Lin Hung-bin.
The patent application number is US202418584828 20240222...
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Nanya Technology Corp and Nanya Tech have received a patent for Bracing Structure, Semiconductor Device with the Same, and Method for Fabricating the Same. This invention was developed by Cheng Min-chung.
The patent application number is US202318395799 20231226. The patent publication number is US1269670..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Taiwan Semiconductor Manufacturing Co Limited and Taiwan Semiconductor Manufacturing have received a patent for Resistive Memory Device with Enhanced Local Electric Field and Methods of Forming the Same. This invention was developed by Chiang Hung-li, Wang Jer-fu, Chiu Jung-piao, Chen Tzu-chiang and Chang M..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Chengdu BOE Optoelect Tech Co, Chengdu BOE Tech Co Ltd, BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group have been awarded a patent for Array Substrate and Display Apparatus. This invention was developed by Li Shuo and Shi Ling.
The patent application number i..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 6 -- Nantong Limeng New Material Technology has been granted a patent for Winding Device for Production of Semiconductor Film-reducing Film. Sun Zhihuai, Kim Yong-ki and Mao Rongzhen developed the invention.
The patent application number is CN202422874917U 20241125. The patent publication number is CN223509311 (U)..
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