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Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Xiaomi Automobile Technology patent application for Video Generation Method and Device, Vehicle, Chip and Storage Medium. The invention was developed by Wang Bing, Ye Hangjun and Sun Haiyang.
The patent application number is CN20251217417 20251229. The..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Elane Beijing Data Tech Co Ltd has sought patent for False Alarm Suppression Method and Device, Electronic Equipment, Readable Storage Medium and Chip. This invention was developed by Geng Jun.
The patent application number is CN202511961101 20251224. The patent publication number is CN121765396 (A). Intern..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Beijing Yiqi Tech Co Ltd has submitted a patent application for 12-channel XLR Audio Playing System Based on SOC Chip Platform and Audio and Video Separation Output Method. This invention was developed by Guan Tian, Wang Gang, Wu Yahui and Li Jinze.
The patent application number is CN202511616941 20251106. ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Hisense Visual Technology has sought patent for Video Compression Model Processing Method and Device, Medium, Chip and Program Product. This invention was developed by Yu Qingxiao, Li Bin, Tian Deli, Wang Zhikui, Han Pengfei, Wu Hanyong, Xing Fang, Jiang Weiwei, Zu Yinpeng, Li Shuai, Gao Yanbo and Li Yiyang.
..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Qualcomm has sought patent for Stacked Integrated Circuit Device Including a Stiffener Die. This invention was developed by Wang Zhongze, Nallapati Giridhar, Sun Yangyang, Badaroglu Mustafa, Kang Woo Tag, Booth Roger, Chidambaram Periannan, Lee Hyun, Chen Xiaonan, Choi Jihong and Song Jaekyu.
The patent applic..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has released Qualcomm patent application for Feedback Communication Memory Capability. This invention was developed by Huang Yi, Ryu Jae Ho, Kim Hobin and Sankar Hari.
The patent application number is WO2025US57734 20251202. The patent publication number is WO20261359..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Qualcomm has submitted a patent application for State Tracking and Control Circuits in an Integrated Circuit (ic) and Related Methods. Kanapathipillai Pradeep, Patel Vinay, Rhodes Daniel Ryan, Koorapati Sagar, Makhija Nitin and Shah Vinit developed the invention.
The patent application number is WO2025US57242 ..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has released Qualcomm patent application for Package Comprising Substrate with Improved Inductor Alignment and/or Spacing. This invention was developed by Kang Kyudong and Shin Heun Gun.
The patent application number is WO2025US57117 20251125. The patent publication n..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- SK Hynix Nand Product Solutions has filed a patent application for Devices and Systems for Immersion Cooling. This invention was developed by Boldrini Justin, Brand Jason and Rothman Timothy.
The patent application number is WO2025US57021 20251125. The patent publication number is WO2026135950 (A1). Internatio..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Qualcomm has filed a patent application for Package Comprising a Substrate with an Embedded Passive Device. This invention was developed by Buot Joan Rey Villarba, Patil Aniket and Wang Zhijie.
The patent application number is WO2025US56683 20251121. The patent publication number is WO2026135936 (A1). Internat..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- SK Hynix Nand Product Solutions has sought patent for Thermal Connections Within a Device Enclosure to Improve Thermal Dissipation. This invention was developed by Singh Hardeep, Morning-smith Andrew, Nangare Sanket and Gregory Wayne.
The patent application number is WO2025US56065 20251119. The patent publicat..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- SK Hynix Nand Product Solutions has submitted a patent application for Devices and Methods for Managing Command Retrieval and Execution. This invention was developed by Fu Zachary, Vemula Neelesh, Patel Dimpesh and Hughes Jonathan.
The patent application number is WO2025US55880 20251118. The patent publication..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published Caterpillar patent application for Dynamic Duty Cycle Control Strategy for DC-DC Converters. The invention was developed by Devi Srevidhya, Jankovic Zeljko R, Ravuri Likhita, Thorne James, Khalil Ahmed, Ramaswamy Jyothiraditya and Wai Jackson.
The patent..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Advanced Micro Devices has applied WIPO patent for Chip Package with an Interposer Having a Glass Core and a Substrate Having a Glass Core. Mysore Kaushik, Kulkarni Deepak Vasant and Neerukatti Rajesh Kumar developed it.
The patent application number is WO2025US50821 20251014. The patent publication number is ..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Microsoft Technology Licensing has submitted a patent application for Integrated Logic Circuit with Fused Multiplier and Adder (fma) or Fused Multiplier and Accumulator (fmac) Integrated with Function Evaluation Logic. This invention was developed by Han Kyung-nam, Bhojaraja Dushyanth and Thajudeen Tariq Ahmed...
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has submitted a patent application for Plasma Treatment Facilitating Selective Metal Growth and Preventing Dielectric Damage. Wang Rongjun, Lei Yu, Xu Yi, Cen Jiajie, Zhang Aixi, Zhuang Hao and Qi Zhimin developed the invention.
The patent application number is WO2025US50335 20251009. The pat..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has submitted a patent application for Varying Thickness Isolation Plate for Use in Semiconductor Processing. This invention was developed by Nemani Srinivas D, Achutharaman Vedapuram S, Moradian Ala and Chang Youngki.
The patent application number is WO2025US50226 20251009. The patent public..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received Applied Materials patent application for Pulsed Chemical Vapor Deposition with Programmable Logic Control. Zhou Yang, Kashefi Kevin, Wu Zhiyuan and Lam Hyman W developed the invention.
The patent application number is WO2025US50035 20251008. The patent publ..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has filed a patent application for Adjustable Mirror Arrangements for Process Chambers, and Related Methods and Apparatus. This invention was developed by Rastegar Abbas.
The patent application number is WO2025US49921 20251007. The patent publication number is WO2026135775 (A1). International..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received Applied Materials patent application for Porous Faceplate for Uniform Distribution of Radicals. Konina Kseniia, Likhanskii Alexandre and Miller Timothy J developed the invention.
The patent application number is WO2025US49677 20251006. The patent publicatio..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published Applied Materials patent application for Upwardly-oriented Beamline Implanter Architecture for Contactless Backside Substrate Processing. The invention was developed by Lee Soojae, Olson Joseph C, Sinclair Frank, Kim Taegon and Doshay Sage Toko Garrett.
Th..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has sought patent for Phase Measurement and Control in Linear Acclerator. This invention was developed by Toe Aung, Coumou David J, Kenyon Matthew J, Kirk Michael Lawrence, Jones Joshua Matthew, Peitzsch Scott E and Maki James.
The patent application number is WO2025US48987 20251001. The pate..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has sought patent for Angled Implant for Patterning Feature Surface Roughness Improvement. This invention was developed by Bhatia Swasti, Nanayakkara Charith and Hautala John.
The patent application number is WO2025US48977 20251001. The patent publication number is WO2026135769 (A1). Internat..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has applied WIPO patent for Ion Implantation and Vacuum Bake of Extreme Ultraviolet Photoresist to Improve Fine Patterning Performance. Bhatia Swasti, Hsu Chih-an, Hautala John and Dai Huixiong developed it.
The patent application number is WO2025US48961 20251001. The patent publication numbe..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has filed a patent application for Methods for Processing Substrates. This invention was developed by Chudzik Michael.
The patent application number is WO2025US48948 20251001. The patent publication number is WO2026135767 (A1). International Patent Classification codes are H10B80/00, H10W20/4..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has submitted a patent application for Indirect Reflective Metrology for Surface Condition Measurement. Ponnekanti Hari, Cho Tom, Liao Chien-min, Cho Michael and Hu Chenfei developed the invention.
The patent application number is WO2025US48728 20250930. The patent publication number is WO202..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has sought patent for Deposition of Halide-free Metal Films Using Noble Metal Catalysts. This invention was developed by Kim Yong Jin, Saly Mark, Leoncini Andrea and Tang Jiecong.
The patent application number is WO2025US48414 20250929. The patent publication number is WO2026135762 (A1). Inte..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has submitted a patent application for Passivating Microwave Dielectrics for Semiconductor Manufacturing. Baeza Ruz Esteban, Yue Shiyu, Takeshita Kenji, Baluja Sanjeev, Chan Kelvin, Agarwal Ashutosh and Lei Wei developed the invention.
The patent application number is WO2025US47803 20250924. ..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Microchip Technology has submitted a patent application for Semiconductor Device with Patterned Wave Guide and Self-aligned Component Placement. This invention was developed by Nagel Steve and Chen Bomy.
The patent application number is WO2025US32815 20250609. The patent publication number is WO2026135731 (A1)..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Microchip Technology has filed a patent application for Semiconductor Device with Carrier Heat Sink. This invention was developed by Nagel Steve and Chen Bomy.
The patent application number is WO2025US32633 20250606. The patent publication number is WO2026135730 (A1). International Patent Classification code i..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published SanDisk Technologies patent application for Three-dimensional Memory Device Including Symmetric Array Connection Strips and Methods for Forming the Same. The invention was developed by Matsuno Koichi and Funayama Kota.
The patent application number is WO20..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received Semiconductor Components Industries patent application for Leveling Control for Semiconductor Device Package Attachment. Im Seungwon, Baek Jonghwan and Kang Dongwook developed the invention.
The patent application number is WO2025US25615 20250421. The pat..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Semiconductor Components Industries has applied WIPO patent for Embedded Semiconductor Device Packages and Methods of Manufacture. Sharma Ankit Bhushan developed it.
The patent application number is WO2025US25610 20250421. The patent publication number is WO2026135723 (A1). Cooperative Patent Classification co..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has submitted a patent application for Shadow Ring for Edge Etch Rate Control. Knyazik Vladimir developed the invention.
The patent application number is WO2024US60794 20241218. The patent publication number is WO2026135674 (A1). International Patent Classification code is H01J37/32.
World ..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- L&T Semiconductor Tech Limited has submitted a patent application for Identification Power Chip for Grid-integrated Energy Devices. This invention was developed by Carvallo Andres and Sharma Vibhu.
The patent application number is WO2025IB62940 20251216. The patent publication number is WO2026133118 (A1). In..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Semiconductor Energy Laboratory has applied WIPO patent for Method for Producing Positive Electrode Active Material. Fukai Shuji, Yoshitomi Shuhei and Kakehata Tetsuya developed it.
The patent application number is WO2025IB62839 20251215. The patent publication number is WO2026133054 (A1). International Patent..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published Semiconductor Energy Laboratory patent application for Method for Forming Metal Oxide Film. The invention was developed by Isaka Fumito, Takahashi Hironobu, Tezuka Sachiaki, Sawai Hiromi, Ohno Toshikazu and Hata Yuki.
The patent application number is WO202..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received Ge Infrastructure Technology LLC patent application for Enhanced Battery Control Box with Semiconductor Switches for Interfacing of Batteries to Inverters.
The patent application number is WO2025IB62376 20251203. The patent publication number is WO202613..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Cnbm Zhejiang Material Tech Co Ltd has filed a patent application for Differential Feeding Device for Preparing Novel Silicon Monoxide Negative Electrode Material and Preparation Method. This invention was developed by Zhao Zhenhuan, Ding Shidao, Zhang Qingyu, Zhang Lijun, Ma Yuhan and Wu Xiaowen.
The paten..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Zhejiang Liufang Semiconductor Tech Co Ltd patent application for Tail Gas Treatment System and Method for Chemical Vapor Deposition Silicon Carbide Equipment. The invention was developed by Qi Tiefeng, Cai Binxu, Yao Zhoufeng, He Shaolong, Xu Jijiang, ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Nitto Denko has submitted a patent application for Method for Distinguishing Adhesive from Substrate. This invention was developed by Kotani Tomohiro, Yamada Yosuke, Nomura Takayuki and Yamamoto Akiyoshi.
The patent application number is CN20248056529 20240821. The patent publication number is CN121773012 (A)..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Takatori Corp patent application for Semiconductor Wafer Manufacturing Method and Semiconductor Wafer Manufacturing Apparatus. The invention was developed by Matsuda Takeharu and Masuda Makoto.
The patent application number is CN20248054499 20240827...
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Tokyo Electron patent application for Holding Tray Cleaning Apparatus, Substrate Processing Apparatus, and Substrate Processing Method. This invention was developed by Kodama Munehisa.
The patent application number is CN20248052397 20240809. The patent ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Medtrum Tech Co Ltd patent application for Multi-substrate Structure Enhanced Analyte Sensor. Yang Cuijun developed the invention.
The patent application number is CN202380101472 20230922. The patent publication number is CN121772869 (A). Internationa..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Nat Ct Advanced Packaging Co Ltd Ncap China patent application for Preparation Method of Semiconductor Packaging Structure and Semiconductor Packaging Structure. The invention was developed by Deng Jiancheng, Dai Fengwei, Zheng Fengxia and Liu Fengman.
..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Hubei Jiangcheng Chip Pilot Production Services has applied Chinese patent for Chip Packaging Structure and Manufacturing Method Thereof. Wang Song, Sun Yuan and Liu Hong developed it.
The patent application number is CN20251255596 20251231. The patent publication number is CN121772837 (A). International Pa..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Gechuang Dongzhi Shanghai Industrial Intelligent Tech Co Ltd has filed a patent application for Wafer Bonding Control Method and Wafer Bonding Control System. This invention was developed by Cheng Bowen, Li Hejing, Xu Mingguang, Ma Dongsheng, Xia Zhidong, Yang Tao and Liu Binbin.
The patent application numb..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Intel has filed a patent application for Method and Apparatus for Improving Heat Dissipation and Mechanical Loading of Integrated Circuit Packages. This invention was developed by Lofgreen Kelly P, Kline Scott A, Petrini John B, Subramaniam Poobalan and Arrington Kenneth James.
The patent application number i..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Xi'an Institute Of Space Radio Technology has submitted a patent application for Self-reinforced BGA Packaging Device Structure and Assembling Method Thereof. Jia Liang, Wang Hui, Wu Yanpei, Li Wenjian, Huang Chao, Wang Hong, Wang Xin, Hou Guiwen, Liu Xiao, Wang Junqi and Zhai Haiyan developed the invention.
..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Infineon Technologies has filed a patent application for Power Semiconductor Module and Manufacturing Method Thereof. This invention was developed by Figge Jens.
The patent application number is CN202511325943 20250917. The patent publication number is CN121772827 (A). International Patent Classification code..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Intel has submitted a patent application for Loading Mechanism for Grid Array Packaging. Rangel Louis Gil, Triska Joshua, Mohan Shyamjith and Peterson Jarrod developed the invention.
The patent application number is CN202511197967 20250826. The patent publication number is CN121772825 (A). International Pat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Infineon Technologies patent application for System and Method for Mounting Housing to Substrate of Semiconductor Module. This invention was developed by Dreps Florian, Steininger Christian, Troska Georg and Strothmann Guido.
The patent application numb..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Forehope Semiconductor Ningbo Limited Co has filed a patent application for Stack Packaging Structure and Preparation Method Thereof. This invention was developed by Li Li, He Zhenghong, Lee Won-sung and Cao Xiuwen.
The patent application number is CN202511894048 20251216. The patent publication number is C..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Wuxi China Resources Huajing Microelectronics patent application for Power Module Packaging Structure. The invention was developed by Shao Zhifeng, Tao Junhui, Zou Zhenxing, Zuo Yang and Yuan Hailong.
The patent application number is CN202411359857 2..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Shenzhen Xinhai Microelectronic patent application for Warping Control Method and System for Ultrathin BGA Packaging. The invention was developed by Li Guang, Li Junlin, Zhao Zhiyong, Dong Chunyun and Long Bingxuan.
The patent application number is C..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Wuyuan Semiconductor Tech Qingdao Co Ltd has submitted a patent application for Multi-layer Wafer Stacking Structure and Trimming and Packaging Method Thereof. Cao Xuewen, Zhang Yurui and Guo Shunhua developed the invention.
The patent application number is CN20251253401 20251231. The patent publication num..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Xinlian Integrated Circuit Manufacturing has sought patent for Package and Manufacturing Method Thereof. This invention was developed by Gong Junneng and Xu Dawu.
The patent application number is CN20251231182 20251230. The patent publication number is CN121772812 (A). International Patent Classification co..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Chengdu Yicheng Integrated Circuit Co Ltd patent application for Method for Preventing Copper Nodules from Being Formed on Board-level Packaging Edge. This invention was developed by Chen Yonglin, Jiang Junbo, Wu Yang, Hu Xi and Zong Shibiao.
The pate..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Yuerun Integrated Circuit Shaoxing Co Ltd has submitted a patent application for Fan-out Packaging Method and Fan-out Packaging Structure. This invention was developed by Li Zongyi, Luo Wenzhi, Xia Jiang, Pan Bo, Liu Xin and Zhang Nuoqi.
The patent application number is CN202511886081 20251215. The patent p..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Guangdong Xincheng Hanqi Semiconductor Tech Co Ltd patent application for Chip Storage and Packaging Method and Packaging Structure Based on Hidden Box Dam. This invention was developed by Zhu Kai, Liu Huabao, Tan Xinyi, Han Lei, Feng Shenhuai, Zheng Han..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shanghai Optical Communication Co Ltd has sought patent for Semiconductor Structure and Preparation Method Thereof, Chip, Integrated Circuit and Electronic Equipment. This invention was developed by Liu Yanhua.
The patent application number is CN202411329542 20240923. The patent publication number is CN1217..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Shenzhen Xinsheng Semiconductor and Beijing Xinsheng Semiconductor Co Ltd patent application for Chip Packaging Structure and Preparation Method Thereof. Han Yun, Zou Jie and Feng Duan developed the invention.
The patent application number is CN202512..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Hongrun Semiconductor (Suzhou) patent application for Semiconductor Integrated Circuit Chip Welding Method. This invention was developed by Li Fanxing, Wang Chaoqun, Shen Hongxing and Zhang Deli.
The patent application number is CN202511991015 20251226...
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Siliconware Technology (Suzhou) has submitted a patent application for Semiconductor Packaging Structure and Manufacturing Method Thereof. This invention was developed by Jiang Jifeng.
The patent application number is CN202411361582 20240927. The patent publication number is CN121772798 (A). International P..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Chip Carrier Plate and Manufacturing Method Thereof, and Chip Packaging Structure. Zhou Yanxu developed the invention.
The patent application number is CN202511924182 20251218. The patent publication number is CN121772796 (A). Inte..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Nat Ct Advanced Packaging Co Ltd Ncap China patent application for Chip Packaging Structure and Manufacturing Method Thereof. This invention was developed by Dai Fengwei, Zhong Xiaoyu and Liu Fengman.
The patent application number is CN20251234541 202..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Suzhou Keyang Semiconductor has submitted a patent application for Packaging Structure and Method for Improving Heat Dissipation of Chip and Reducing Thickness of Product. Shao Changzhi, Dong Fang, Lyu Jun and Xi Jianchao developed the invention.
The patent application number is CN202511790760 20251201. The p..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Pingtouge Shanghai Semiconductor Technology Co Ltd has submitted a patent application for Interposer, Chip Package Structure and Electronic Device. This invention was developed by Ma Chao and Fu Huili.
The patent application number is CN202511679712 20251114. The patent publication number is CN121772792 (A)..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Nat Ct Advanced Packaging Co Ltd Ncap China has filed a patent application for High-density Rewiring Layer, Preparation Method Thereof and Semiconductor Packaging Structure. This invention was developed by Xu Cheng, Dai Fengwei, Liu Fengman and Yin Xiang.
The patent application number is CN20251237078 20251..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Suzhou Guoxian Innovation Tech Co Ltd patent application for Chip Carrier Plate and Preparation Method and Packaging Structure Thereof. Zhou Yanxu developed the invention.
The patent application number is CN202511794489 20251201. The patent publicatio..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Infineon Technologies has filed a patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Gan Tai Ki, Zhu Guirong and Ng Chee Yang.
The patent application number is CN202511352305 20250922. The patent publication number is CN121772787 (A). Internationa..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- SK Hynix has submitted a patent application for Semiconductor Package and Package Substrate. Lee Jun-shin and Seo Hyun-chul developed the invention.
The patent application number is CN202511319940 20250916. The patent publication number is CN121772786 (A). International Patent Classification codes are H10D80/..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Unimicron Technology has sought patent for Substrate Structure and Manufacturing Method Thereof. This invention was developed by Zhan Zhikai, Tan Ruimin, Lin Puru, Cheng Shiliang, Ke Zhengda and Wang Jinsheng.
The patent application number is CN202511119208 20250811. The patent publication number is CN1217727..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Chengdu Monolithic Power Systems has filed a patent application for Power Circuit Package. This invention was developed by Pu Yingjiang and Jiang Hang.
The patent application number is CN202510910747 20250702. The patent publication number is CN121772784 (A). International Patent Classification codes are H1..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Forehope Semiconductor Ningbo Limited Co has applied Chinese patent for 2.5 D Interposer Packaging Structure and Packaging Method. He Zhenghong, Zhong Lei and Xu Yupeng developed it.
The patent application number is CN202610256283 20260304. The patent publication number is CN121772783 (A). International Pat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Nanjing University and Hefei Nat Laboratory patent application for Ceramic Substrate Structure and Integrated Packaging Structure Thereof. Lu Hai, Guo Yue, Ren Fangfang, Zhou Feng, Xu Weizong and Zhou Dong developed the invention.
The patent applicati..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Nat Ct Advanced Packaging Co Ltd Ncap China patent application for Semiconductor Packaging Structure and Preparation Method Thereof. The invention was developed by Jin Fei, Dai Fengwei and Liu Fengman.
The patent application number is CN202511947968 ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Nat Ct Advanced Packaging Co Ltd Ncap China has applied Chinese patent for Chip Module Packaging Structure and Preparation Method Thereof. Xu Cheng, Dai Fengwei, Su Peng, Sun Peng and Liu Fengman developed it.
The patent application number is CN202511929164 20251219. The patent publication number is CN12177..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Nat Ct Advanced Packaging Co Ltd NCAP China has submitted a patent application for Semiconductor Packaging Structure and Preparation Method Thereof. This invention was developed by Xu Cheng, Dai Fengwei, Su Peng and Liu Fengman.
The patent application number is CN202511923176 20251218. The patent publicatio..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Advanced Semiconductor Engineering has submitted a patent application for Package Structure. This invention was developed by Cai Wenhao.
The patent application number is CN202510259249 20250306. The patent publication number is CN121772773 (A). International Patent Classification codes are H10W70/60, H10W70..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Jiangsu Xinde Semiconductor Technology patent application for Packaging Structure and Packaging Assembly. The invention was developed by Wei Xinwen, Zhang Haojie, Liu Yi, Zhou Jinpu, Tang Jiwen and Liu Ying.
The patent application number is CN2025125..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Semikron Danfoss Electronics As patent application for Power Semiconductor Module with Two-part Conduction Device and Equipment with Power Semiconductor Module. Frenznik Eric, Klemm Georg and Holtyes Martin developed the invention.
The patent applicat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Shanghai Xianfeng Tech Co Ltd patent application for Preparation Method of Fan-out Type Packaging Structure. This invention was developed by Chen Junhong, Lin Zhengyi, Chen Zhihui, Li Yiying, Gao Yongqiang and Tang Xinlu.
The patent application number..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Tongfu Microelectronics has filed a patent application for Forming Method of Packaging Structure. This invention was developed by Li Haoyi, Tao Yujuan and Zhu Qiuyun.
The patent application number is CN20251218990 20251229. The patent publication number is CN121772766 (A). International Patent Classificatio..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shanghai Chuangxian Semiconductor Co Ltd has submitted a patent application for Method for Removing Oxidation Film of Power Semiconductor Wafer. This invention was developed by Zhang Chang, You Haitao, Sun Wenda, Liu Xingquan, Zhang Yihan and Wang Yijia.
The patent application number is CN20251253137 202512..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shanghai Weijing Electronic Tech Co Ltd has submitted a patent application for Integrated Circuit and Packaging Method Thereof. This invention was developed by Katsura.
The patent application number is CN20251236015 20251230. The patent publication number is CN121772764 (A). International Patent Classificat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Hefei Jiufu Semiconductor Technology has sought patent for Miniature Fixing Tool for Semiconductor Installation. This invention was developed by Yuan He and Zhao Jiangmin.
The patent application number is CN202511824815 20251205. The patent publication number is CN121772689 (A). International Patent Classific..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shenzhen Kangteshi Intelligent Tech Co Ltd has sought patent for Clamping Device Convenient for Manufacturing Integrated Circuit Chip. This invention was developed by Lan Zhifeng, Wu Feiyan and Wu Guanqi.
The patent application number is CN20261010422 20260106. The patent publication number is CN121772686 (..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Jiangsu Wuxi Jingwei Tiandi Semiconductor Tech Co Ltd has submitted a patent application for Semiconductor Process Device and Semiconductor Equipment. This invention was developed by Zhang Gang and Liang Defu.
The patent application number is CN20251255202 20251231. The patent publication number is CN121772..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- AMI Precision Control Tech Shandong Co Ltd has submitted a patent application for Multi-degree-of-freedom Adaptive Alignment and Leveling Device for Wafer Bonding. Yan Peng and Mou Yanshun developed the invention.
The patent application number is CN202511821088 20251205. The patent publication number is CN1..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Guangxi Zhuang Autonomous Region Hydropower Man Center and GuangXi University patent application for Ecological Flow Monitoring Method and System Based on Microwave Doppler Effect and Optimized Bidirectional Long-short Term Memory Network. The invention..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Harman International Industries has sought patent for Method for Setting Sequence Number of Light-emitting Device, Light-emitting Device and Medium. This invention was developed by Gan Shuibao.
The patent application number is CN202411380179 20240929. The patent publication number is CN121771648 (A). Intern..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Shanghai Awinic Technology patent application for Audio System, Audio Signal Output Method, Chip and Electronic Equipment. Zhang Haijun and Zhou Jianing developed the invention.
The patent application number is CN202511989384 20251225. The patent public..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Haiguang Yunxin Integrated Circuit Design Shanghai Co Ltd has submitted a patent application for Online Computing Method and Device, Computer Equipment and Storage Medium. This invention was developed by Yu Zhanle.
The patent application number is CN202511885053 20251212. The patent publication number is CN..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Beijing Zhixin Semiconductor Tech Co Ltd, Beijing Smartchip Microelectronics Technology Co Limited and Tianjin Binhai New Area Information Tech Innovation Center patent application for Multi-mode Network Service Data Cache Management Method and System. ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Wuxi Zhixian Weilai Tech Co Ltd patent application for Correlation Analysis Method for Multi-source Defect Data of Semiconductor Wafer. Guan Jian and Li Yunhao developed the invention.
The patent application number is CN202511766463 20251127. The pate..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Huazhong University of Science and Technology has sought patent for Circuit Structure for Realizing One-step Solution of System of Linear Equations Based on Memristor Array. This invention was developed by Huang Juncheng, Miao Xiangshui, Yan Boyang, Cai Zifei, Li Nan and Wang Xingsheng.
The patent applicati..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Lam Research has filed a patent application for Seam-free Gapfill of Dielectric Films. This invention was developed by Chukwunenye Precious Oganihu, Ganesan Jeya Prakash, Ta Phuong Kim, Fan Yunshan, Austin Dustin Zachary and Mclaughlin Kevin.
The patent application number is WO2025US60434 20251218. The patent ..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received pSemi Corporation patent application for Inductive Components, Systems, and Methods. Giuliano David M and Sano Kazuhisa developed the invention.
The patent application number is WO2025US60377 20251218. The patent publication number is WO2026136699 (A1). I..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Parker Hannifin has filed a patent application for Adhesive Compositions for Bonding Elastomer to Substrate. This invention was developed by Agag Tarek, Wheeler Paul and Sheffield John.
The patent application number is WO2025US60262 20251218. The patent publication number is WO2026136633 (A1). International Pa..
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