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Semiconductor

  |  Wed 25 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has released Metapwr Electronics Co Ltd patent application for High-integrated Substrate Manufacturing Method Therefor, and Power Module. This invention was developed by Hong Shouyu, Liu Hongxiu, Chen Qingdong and Zhang Mingzhun. The patent application number is US20251..

Semiconductor

  |  Wed 25 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has released Kawasaki Heavy Ind Ltd and Kawasaki Robotics USA Inc patent application for Substrate Transfer Apparatus. This invention was developed by Tan Haruhiko, Wahl Weston, Liu Justin, Bharwani Avish Ashok and Kurata Iori. The patent application number is US2024188..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Shenzhen Boluosi Tech Co Ltd patent application for Stacking Packaging Method and System for Ai-dsp Mixed Audio Processing Chip. This invention was developed by Wei Xiangcheng and Hu Chengyuan. The patent application number is CN202511105401 2025080..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Suzhou Xintai Semiconductor Tech Co Ltd patent application for Directional Cleaning Method for Semiconductor Chip. This invention was developed by Wu Mingfang. The patent application number is CN202410548798 20240506. The patent publication number i..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Suzhou Xintai Semiconductor Tech Co Ltd patent application for Method for Cleaning Gaps of Semiconductor Chips. This invention was developed by Wu Mingfang. The patent application number is CN202410548781 20240506. The patent publication number is C..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Nantong Tengyi Precision Tech Co Ltd patent application for Microscopic Etching Model Development Method for Wafer Wet Etching. This invention was developed by Miao Zhigao and Cheng Xiao. The patent application number is CN202511446960 20251011. The..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Zing Semiconductor and Taiyuan Jinke Silicon Material Tech Co Ltd patent application for Substrate Transfer Device and Transfer Method. Jiang Junnan, Zhu Yuanfang, Qiu Yaowu, Wang Wei and Yang Yabin developed the invention. The patent application nu..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Zhengzhou Xinghang Tech Co Ltd patent application for Method and Structure for Flip Chip Mounting by Using Fow Adhesive Film. Zhao Jialei, Hong Won-gon and Fu Yu developed the invention. The patent application number is CN20251171246 20250731. The p..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Nantong Youtuo New Energy Tech Co Ltd patent application for Silicon Wafer Surface High-uniformity Texturing Method Based on Multi-parameter Coupling Regulation and Control. Xu Jianjun, Zhou Tongyi, Xu Rui and Jin Lili developed the invention. The p..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Suzhou Xintai Semiconductor Tech Co Ltd patent application for Semiconductor Chip Cleaning Method. The invention was developed by Wu Mingfang. The patent application number is CN202410548821 20240506. The patent publication number is CN120914084 (A..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Jiangsu Riyu Photovoltaic New Mat Co Ltd patent application for Conductive Silver Paste for N-type Solar Cell and Preparation Method and Application Thereof. The invention was developed by Guo Peng, Zheng Jing and Fan Qiuyang. The patent applicatio..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Shanghai Shenming Aosi Semiconductor Tech Co Ltd patent application for 1T1PFC Cis-ferroelectric Memory Cell and Memory Array. Zhu Zhilong developed the invention. The patent application number is CN20251165893 20250731. The patent publication numbe..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Shenzhen Yitoa Intelligent Control Co Ltd patent application for Ddic Chip Driving Time Sequence Control Method Supporting Variable Refresh Rate. The invention was developed by Hu Qingzhou. The patent application number is CN202510786261 20250612. ..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Dongguan Yilian Information System Co Ltd has sought patent for Ultrathin Chip Suction Method and Device. This invention was developed by Yang Jibao and Qu Haifeng. The patent application number is CN202511200159 20250826. The patent publication number is CN120914155 (A). International Patent Classificati..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Wushi Microelectronics Suzhou Co Ltd has sought patent for High-precision Wafer Bonding Device. This invention was developed by Wan Shiyuan, Ding Shaochun, Shen Da and Xue Yaling. The patent application number is CN202510944227 20250709. The patent publication number is CN120914133 (A). International Pate..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Wushi Microelectronics Suzhou Co Ltd has sought patent for Wafer De-bonding Processing Module and Wafer De-bonding Device. This invention was developed by Wan Shiyuan, Ding Shaochun, Shen Da and Xue Yaling. The patent application number is CN202510944226 20250709. The patent publication number is CN120914..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Wushi Microelectronics Suzhou Co Ltd has sought patent for Cold and Hot Integrated Wafer Processing Device. This invention was developed by Wan Shiyuan, Qian Biao, Shen Da and Xue Yaling. The patent application number is CN202510885116 20250630. The patent publication number is CN120914131 (A). Internatio..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Nanjing Zhengteng Electronic Tech Co Ltd has applied Chinese patent for Transformer Silicon Steel Sheet Lamination Tool. Xie Hui developed it. The patent application number is CN202511367028 20250924. The patent publication number is CN120914020 (A). International Patent Classification codes are H01F27/24..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Shenzhen Haoyun Tech Co Ltd has applied Chinese patent for Led Display Screen Based on Integrated Chip and Control System. Li Xiaojun, Peng Xiangke, Liang Qiuhong, Yu Caiqiong and Cai Lei developed it. The patent application number is CN202511281342 20250909. The patent publication number is CN120913498 (..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Xiamen Anjieli Meiwei Tech Co Ltd has filed a patent application for Manufacturing Method of Tgv Seed Layer and Packaging Substrate, and Packaging Substrate. This invention was developed by Lai Feng, Yan Guoqiu, Kamimiya Shohei, Tian Hongzhou and Hu Rui. The patent application number is CN202511117696 202..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Wuhan Xinchuangyuan Semiconductor Co Ltd has filed a patent application for Fcbga Packaging Substrate and Processing Method Thereof. This invention was developed by Zhang Kai, Ming Xing, Cai Tongqing and Wang Tao. The patent application number is CN202510927602 20250707. The patent publication number is C..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Zhejiang Xinwei Taike Semiconductor Co Ltd has filed a patent application for Method and System for Manufacturing Semiconductor Device. This invention was developed by Yi Lan, Wang Chong, Hu Zhijie, Liu Tong, Zhang Dehua, Liang Jinxue and Chen Lunxing. The patent application number is CN202511444971 20251..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Nami Scient Instrument Equipment Hangzhou Co Ltd has filed a patent application for Small Sample Chip Surface Defect Detection Method Based on Convolutional Neural Network. This invention was developed by Liu Zhiping and Hong Jianli. The patent application number is CN202410550912 20240506. The patent pub..

Semiconductor

  |  Wed 25 Mar 2026

Alexandria, March 25 -- Kulicke & Soffa Ind Inc has submitted a patent application for Systems for Bonding a Semiconductor Element to a Substrate Using Reducing Gas and Related Methods. Muthyala Dhiraj, Grant Timothy Paul, Palumbo Thomas J and Tarabulski Matthew developed the invention. The patent application number is US2025..

Semiconductor

  |  Wed 25 Mar 2026

Alexandria, March 25 -- Infineon Technologies Americas Corp has submitted a patent application for Bandwidth for Wirebond Integrated Circuit Package. This invention was developed by Huang Shaowu and Wu Dance. The patent application number is US202519330576 20250916. The patent publication number is US20260082959 (A1). Coopera..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Qidong Xishi Intelligent Tech Co Ltd has submitted a patent application for Etching Device for Instrument Chip Processing. Zhang Yu, Zhao Xu and Wei Jingfan developed the invention. The patent application number is CN202511437433 20251009. The patent publication number is CN120914148 (A). International Pa..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Yangzhou Ruimai Tech Co Ltd has submitted a patent application for Integrated Circuit Film Expanding Device and Integrated Circuit Film Expanding Method. This invention was developed by Yue Junwen. The patent application number is CN202511100274 20250807. The patent publication number is CN120914142 (A). ..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Huatian Tech Jiangsu Co Ltd has submitted a patent application for Flattening Device and Method for Warped Wafer. This invention was developed by Tang Ziming, Hou Gangliang, Chen Xiaolong and Ma Shuying. The patent application number is CN20251139330 20250728. The patent publication number is CN120914138 ..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Shenzhen Ruiwowei Semiconductor Tech Co Ltd has submitted a patent application for Semiconductor Chip Packaging Method and Chip Packaging Piece. This invention was developed by Shen Guang, Qi Shan and He Yide. The patent application number is CN20251130157 20250724. The patent publication number is CN1209..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Xiamen Anjieli Meiwei Tech Co Ltd has submitted a patent application for Manufacturing Method of Redistribution Layer of Package Substrate and Package Substrate. This invention was developed by Xie Teng, Yan Guoqiu, Kamimiya Shohei, Tian Hongzhou and Hu Rui. The patent application number is CN202511117699..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Jiangsu Punuowei Electronic Co Ltd has submitted a patent application for Copper Pillar Bump Processing Method Applied to High-density Interconnection and Chip Packaging Structure. Xiao Juanbo, Zong Xinru, Yang Fei, Zou Yin, Zhao Xiaoqiang and Ma Hongwei developed the invention. The patent application num..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Jingxincheng Beijing Tech Co Ltd; Hefei Nexchip Integrated Circuit has submitted a patent application for Method for Preventing Semiconductor Device from Electrochemical Corrosion and Semiconductor Device. Hao Xiaoqiang, Tao Lei, Zhou Yufen and Li Xiao developed the invention. The patent application numbe..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Suzhou Xintai Semiconductor Tech Co Ltd has submitted a patent application for Method for Obliquely Cleaning Semiconductor Chip. Wu Mingfang developed the invention. The patent application number is CN202410548805 20240506. The patent publication number is CN120914083 (A). International Patent Classificat..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Wuxi Mengxi Intelligent System Co Ltd has submitted a patent application for Radio Frequency MEMS Switch and Preparation Method Thereof. This invention was developed by Liu Zewen and Wei Jiangtao. The patent application number is CN202510818953 20250618. The patent publication number is CN120914061 (A). I..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Shanghai Silang Tech Co Ltd has submitted a patent application for Execution Method and Device of Molecular Dynamics Constraint Algorithm, Chip and Medium. This invention was developed by Yang Yuhang, Li Huan and Zhang Bingyao. The patent application number is CN20251159182 20250730. The patent publicatio..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Carbon Chip Microelectronics Tech Shenzhen Co Ltd has submitted a patent application for SOC Chip, Bridging Integrated Chip and DRAM. This invention was developed by Su Xiaofeng and Lu Jiang. The patent application number is CN20251124988 20250723. The patent publication number is CN120913623 (A). Interna..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has released Intel patent application for Apparatus and Method for Prefetching from a Second Level Translation Lookaside Buffer (TLB) to a First Level TLB. This invention was developed by Pugsley Seth H. The patent application number is US202418890548 20240919. The pate..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- KIOXIA has filed a patent application for Semiconductor Storage Device and Method of Manufacturing the Same. This invention was developed by Tsuji Masaki and Yamada Kenta. The patent application number is US202519070132 20250304. The patent publication number is US20260080910 (A1). International Patent..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- KIOXIA has submitted a patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Ohashi Takashi. The patent application number is US202519071888 20250306. The patent publication number is US20260080911 (A1). International Patent Classification cod..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- KIOXIA has filed a patent application for Semiconductor Storage Device. This invention was developed by Deguchi Masashi. The patent application number is US202519076744 20250311. The patent publication number is US20260080918 (A1). International Patent Classification codes are G11C16/04, G11C5/06, H10B..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- CXMT has filed a patent application for Control Circuit and Memory. This invention was developed by Shao Yanian, Eom Yoonjoo and Song Jiajin. The patent application number is US202519395391 20251120. The patent publication number is US20260080932 (A1). International Patent Classification codes are G11C..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has received KIOXIA patent application for Storage Device. Nakayama Masahiko developed the invention. The patent application number is US202519076932 20250311. The patent publication number is US20260080924 (A1). International Patent Classification code is G11C11/16. Co..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- KIOXIA has submitted a patent application for Memory Device. This invention was developed by Nakata Yuki and Matsuo Kouji. The patent application number is US202519057236 20250219. The patent publication number is US20260080940 (A1). International Patent Classification codes are G11C16/04, G11C5/06, H1..

Semiconductor

  |  Wed 25 Mar 2026

Alexandria, March 25 -- Xilinx has submitted a patent application for Robust Single Event Upset (SEU) Tolerant High-performance Flip-flop. This invention was developed by Alam Tabrez, Rahul Kumar, Yachareni Santosh and Ahmad Ishtiaque. The patent application number is US202418889154 20240918. The patent publication number is ..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Beijing University and Shanghai Jiao Tong University patent application for Preparation Method of Stacked Transistor, Stacked Transistor and Semiconductor Device. This invention was developed by Wu Heng, Sun Fangcheng, Wang Yimeng, Wang Runsheng, Li Mi..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Hangzhou Xiahesheng Biomedical Tech Co Ltd has submitted a patent application for Production System and Production Process of Silicon Carbide Ceramic Precursor. This invention was developed by Yu Lujun. The patent application number is CN202511111260 20250808. The patent publication number is CN120919936 ..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- Dual Strategies LLC has sought patent for Fluid Dosing Substrate Dispenser. This invention was developed by Wetzer Michael. The patent application number is US202519401503 20251126. The patent publication number is US20260076517 (A1). International Patent Classification codes are A47K10/32 and A47K10/3..

Semiconductor

  |  Wed 25 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has published Mitsubishi Electric patent application for Semiconductor Apparatus. The invention was developed by Hisaka Takayuki. The patent application number is US202219108684 20221227. The patent publication number is US20260082989 (A1). Cooperative Patent Classifica..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- The Spot Laboratory has submitted a patent application for Micro-fluidic Chip Based on Photocuring Liquid Drops and Escherichia Coli Detection Method. This invention was developed by Liu Bo, Su Danfeng, Feng Shilun and Wang Kun. The patent application number is CN20251192371 20250805. The patent publicati..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Chizhou Jucheng Electronic Tech Co Ltd has sought patent for Dispensing Device with Rapid Curing Function for Semiconductor Packaging. This invention was developed by Zhang Yongping, Zhang Chengjun and Zhang Jinyu. The patent application number is CN202511256478 20250904. The patent publication number is ..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Shenzhen Xintongkang Tech Co Ltd has submitted a patent application for Glue Sealing Device and Method for Semiconductor Diode. This invention was developed by Tan Chao. The patent application number is CN202511295660 20250911. The patent publication number is CN120920290 (A). International Patent Classif..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Wuxi Ruihongxing Semiconductor Equipment Co Ltd has sought patent for Metal Oxide Semiconductor (mos) Tube Sorting Device. This invention was developed by Li Dongya. The patent application number is CN202511392903 20250927. The patent publication number is CN120920396 (A). International Patent Classificat..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Ganzhou Yihao New Mat Co Ltd patent application for Aluminum Substrate Discharging Robot with Cleaning Function. This invention was developed by Ding Haibing, Liu Xuanji, Wang Haiyang and Wang Tiecheng. The patent application number is CN20251147668..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Jiangsu Chuangying Solar Energy Tech Co Ltd has submitted a patent application for Photovoltaic Crystalline Silicon Cell Laser Lift-off Equipment and Application Method. This invention was developed by Long Junyao, Huang Zhirong, Li Tao and Han Di. The patent application number is CN202511223845 20250829...

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Jiangsu Chuangyi Prec Forging Co Ltd patent application for Cold Forging Die for Red Copper IGBT (insulated Gate Bipolar Translator) Radiating Substrate. This invention was developed by Chen Xuefeng, Chen Fei, Zhu Jun, Nie Xiangyi and Zhang Chaozhong. ..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Shenzhen Rongda Circuit Co Ltd patent application for Process Manufacturing Method of Aluminum Substrate. This invention was developed by Lai Yuebin and Huang Zhangjian. The patent application number is CN20251192547 20250805. The patent publication..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- Flowserve Man Co has sought patent for Method and Device for Removing Reactive Particles from a Vacuum Environment, and Process Plant for Producing Monocrystalline Silicon Ingots. This invention was developed by Hencke Rayk, Lähn Stefan, Drechsel Julian, Meggers Nils and Schreiner Jochen. The patent a..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- Enpulse Co Ltd has submitted a patent application for Polishing Pad, Preparation Method Thereof and Preparation Method of Semiconductor Device Using the Same. This invention was developed by Shin Yujin, Kim Kyunghwan, Yoon Jongwook and Seo Jangwon. The patent application number is US202519277426 202507..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Changchun Zhiran Photoelectric Tech Co Ltd patent application for Femtosecond Laser Trepanning Method and Device for Silicon Nitride Ceramic. The invention was developed by Wang Fuguo, Zhang Benlei, Xiao Jingsong and Yang Hang. The patent applicati..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Sinochip Semiconductor Tech Co Ltd has submitted a patent application for Vcsel Chip Cleaning Device and Cleaning Process. Liang Gaoming, Lee Wang-rim, Chen Yun, Yu Juan, Tian Zhengru, Tang Xiujuan, Yao Shun and Han Hao developed the invention. The patent application number is CN202511449764 20251011. The..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Siwei Semiconductor Haining Co Ltd has submitted a patent application for Intelligent Chip Repairing Device and Method. Liao Jianfu and Yin Jie developed the invention. The patent application number is CN202511361800 20250923. The patent publication number is CN120921008 (A). International Patent Classifi..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Hangzhou Zhixin Semiconductor Co Ltd has applied Chinese patent for Maintenance Method of Semiconductor Heater. Liu Zhiyang and Ye Dingyun developed it. The patent application number is CN202510899545 20250701. The patent publication number is CN120921006 (A). International Patent Classification code is B..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Multi-wire Cutting Method for Improving Cutting Morphology of Small-size Silicon Wafer. This invention was developed by Liu Xiaoping, Cao Qigang, Zhang Youhai, Wang Zhongbao, Wa..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- Venclose Inc has sought patent for Ablation Systems with Reduced Energy Loss. This invention was developed by Przygoda Darius and Behzadian Negin. The patent application number is US202418887444 20240917. The patent publication number is US20260076729 (A1). International Patent Classification codes are..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Zhejiang Xinding Plastic Co Ltd has submitted a patent application for Intelligent Tray Chip Embedded Type Injection Molding Device. This invention was developed by Ai Shangqi, Seo Eun-young, Jin Xiaoxin, Lai Jingting, Zhou Weiwen, Yang Chao, Ruan Chenlu, Zeng Yiying and Zeng Jianshu. The patent applicati..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Du Boyi patent application for Multipoint Material Injection Packaging Mold of Transistor Semiconductor. The invention was developed by Du Boyi, Wang Yanmeng and Zhou Yue. The patent application number is CN202510826445 20250619. The patent publica..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has published Taijia Corp patent application for Quantum-dot Light Conversion Film, Preparation Method and Application Thereof and Anti-ultraviolet Blue-free Yellow Light for Chip Process. The invention was developed by Qiu Tianyi. The patent application number is US202..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Inner Mongolia Xinggu Tech Co Ltd patent application for Crystal Silicon Plate Film Laminating Machine. This invention was developed by Wan Denghua and Liu Yuechen. The patent application number is CN202511453198 20251013. The patent publication num..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Chuzhou Yinxing New Mat Co Ltd patent application for Preparation Method of Nano Silicon Dioxide Modified Polyurethane Thermal Insulation Material. The invention was developed by Lin Xun. The patent application number is CN202511102456 20250807. Th..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Dongguan Tlc Electronic Tech Co Ltd patent application for Hole Transport Material, Preparation Method Thereof and Perovskite Solar Cell. The invention was developed by Xu Jiaju, Luo Yuewei, Chen Jinbiao, Chen Junmin, Fang Liyu and Lin Mengping. Th..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- Seakr Eng LLC has submitted a patent application for Scalable Partitioning of Functions Within Application Specific Integrated Circuit or Microelectronics Device. This invention was developed by Lowry Anthony. The patent application number is US202418885177 20240913. The patent publication number is US..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Hebei Dingci Electronic Tech Co Ltd has filed a patent application for High-hardness Aluminum Oxide Multilayer Ceramic Substrate. This invention was developed by Gao Shan, Jin Huajiang, Li Jie, Liang Pengjie, Li Lei, Zhang Chenxu and Zhang Xueli. The patent application number is CN202511460976 20251014. T..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Shandong Huamei New Material Tech Co Ltd patent application for Silicon Carbide Ceramic Slurry for 3D Printing and Ceramic Boat Prepared from Silicon Carbide Ceramic Slurry. The invention was developed by Wang Dong, Li Weiqiang, Bi Jianqiang, Yin Dong..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Zhejiang Jinchen Glass Co Ltd patent application for Manufacturing Method of Glass Substrate for Refrigerator Glass Door. The invention was developed by Jin Yongtang. The patent application number is CN202510729712 20250603. The patent publication ..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Jiangsu Zhuoyuan Semiconductor Co Ltd patent application for Preparation Process of Silicon Carbide Powder for Growing Silicon Carbide Crystals. Zhang Xinfeng, Wu Zhiliang and Huang Jie developed the invention. The patent application number is CN202..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Tanyan Tech Service Wuxi Co Ltd patent application for Preparation Method of Pitch-based Porous Carbon for High-performance Silicon Carbon. This invention was developed by Zheng Junhua. The patent application number is CN202511101113 20250807. The p..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- Mixx Tech Inc has filed a patent application for System and Method for an Extended Buried Oxide Layer for Silicon Photonic Integrated Circuits. This invention was developed by Schaevitz Rebecca Kayla and Raghuraman Vivek. The patent application number is US202519333147 20250918. The patent publication ..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- Silith Tech Suzhou Co Ltd has submitted a patent application for Integrated Optical Chip and Application Method Thereof, and Integrated Optical System. This invention was developed by Zhang Xingyu and Zhang Ke. The patent application number is US202218994068 20221028. The patent publication number is U..

Semiconductor

  |  Tue 24 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has released Inventec Pudong Tech Corp and Inventec patent application for Monitoring Structure Without Chip. This invention was developed by Cheng Wei-chen, Shih Yi-cheng, Wu Yu, Lin Hsin-hung and Tai Yu Shu. The patent application number is US202519239361 20250616. Th..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Shenzhen Aerospace Dongfanghong Satellite Co Ltd patent application for Spacecraft Based on Spherical Solar Cell Array as Shell and Thermal Control Design Method Thereof. The invention was developed by Sun Risi, Wang Cuilin, Yoon Mu-hyun, Gong Jinlai,..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Laser Mfg Institute Henan Academy Of Sciences has applied Chinese patent for Blood Vessel Chip System Fused with 3D Printing and Operation Method. Gao Chuang, Zheng Yayun, Jiang Haoqing, Li Hao, Li Wei, Chen Jialiang and Xu Hongxing developed it. The patent application number is CN202511152951 20250818. T..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Shanghai Infectious Disease And Biological Safety Res Institute has sought patent for Microfluidic Real-time Quantitative PCR Chip System. This invention was developed by Mao Hongju, Li Yan, Cheng Xunjia and Wu Fan. The patent application number is CN20251170396 20250731. The patent publication number is ..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Qingzhi Biotechnology Xuzhou Co Ltd patent application for Magnetic Sorting Chip for Cell Sorting and Preparation Method Thereof. Jiang Zhenwei and Du Chuan developed the invention. The patent application number is CN202511101760 20250807. The paten..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Shenzhen Anpin Silicone Mat Co Ltd has sought patent for Organic Silicon Immersed Cooling Liquid for Data Center and Application Method of Organic Silicon Immersed Cooling Liquid. This invention was developed by Wu Nan, Tong Zhuoran, Ding Xiaowei and Ding Xiaobin. The patent application number is CN202511..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Wynca Tinyo Silicon Co Ltd has sought patent for Two-component Liquid Silicone Rubber for Organic Silicon Leather Bonding Layer as Well as Preparation Method and Application of Two-component Liquid Silicone Rubber. This invention was developed by Lu Boji, Li Zhiyuan, Wang Xiaopan, He Dong, Wu Jiawei and Zhou..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Hangzhou Huayi New Mat Co Ltd has submitted a patent application for Light-cured Organic Silicon Release Agent as Well as Process Method and Application Thereof. Zhou Haifeng, He Yuechi and Xu Bin developed the invention. The patent application number is CN202511469683 20251015. The patent publication num..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Wuxi Yuanding Environmental Protection Tech Co Ltd patent application for Ionic Liquid Modified Super-hydrophobic Silicon Dioxide Additive for Epoxy Resin Anticorrosive Paint as Well as Preparation Method and Application of Ionic Liquid Modified Super-..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Gu Xuelian has submitted a patent application for Lanthanum Gallium Silicon Thin Film Material Substrate and Preparation Method Thereof. This invention was developed by Gu Xuelian and Cai Lingyun. The patent application number is CN202410561087 20240508. The patent publication number is CN120924032 (A). I..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Qingdao Besland Semiconductor Tech Co Ltd has filed a patent application for Antistatic Material for Wafer Loader and Preparation Method Thereof. This invention was developed by Hara Keiryu, Jian Dunliang and Chen Na. The patent application number is CN202511219698 20250828. The patent publication number ..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Zhuhai Aokeda Tech Research Institute, Kailuan Group and Kailuan New Mat Co Ltd patent application for X-ray Protection Material Based on Semiconductor Material as Well as Preparation Method and Application of X-ray Protection Material. Li Liang, Liu B..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Qingdao Besland Semiconductor Tech Co Ltd patent application for Corrosion-resistant Composition for Wafer Clamping Piece and Preparation Method of Corrosion-resistant Composition. Jian Dunliang, Hara Keiryu and Jia Lingyan developed the invention. ..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Quzhou Zhongtong Chemical Co Ltd patent application for Coated Spherical Silicon Dioxide Flame Retardant and Preparation Method Thereof. This invention was developed by Tian Yonghong, Xu Lisi, Xu Yisheng and Lan Jian. The patent application number i..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Yellow River Delta Jingbo Res Institute Of Chemical Industry Co Ltd has submitted a patent application for Preparation Method and Application of Titanium-containing Organic Silicon Resin. This invention was developed by Huang Rui, Zhang Jingjing, Zhuang Rui, Chen Dianlong, Wang Dongzhe, Wang Yuanrong, Li Rui..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- Chongqing Sanxia Paints Co Ltd has submitted a patent application for Tung Oil Modified Organic Silicon Biological Resin, Degradable Camouflage Coating and Preparation Method of Degradable Camouflage Coating. This invention was developed by Xiang Quan, Zhou Rui, He Yang and You Kexin. The patent applicati..

Semiconductor

  |  Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Shandong Lingxiao New Mat Co Ltd patent application for Preparation Method of Amphiphilic Silane Modified Block Type Organic Silicon Ether. Li Kuankuan, Wang Linfei, Li Conghao, Fang Fang, Jiang Xiaojun and Ding Guiqing developed the invention. The ..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Zhangjiagang Yangzijiang Cold Rolled Sheet Co Ltd, Jiangsu Shagang Group and Jiangsu Shagang Institute Research Iron & Steel patent application for Method for Improving Iron and Steel Loss Full-length Uniformity of Middle and Low Grade Silicon Steel. M..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Anhui Dongxun Sealing Tech Co Ltd patent application for Silicon Carbide Substrate and Substrate Preparation Method. This invention was developed by Xu Chengming, Hu Erying, Zhai Suzhen, Li Qiuying, Zhang Peili, Li Yong, Kong Pei, Luo Kehai and Ma Zhen..

Semiconductor

  |  Wed 25 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has received Toshiba KK and Toshiba Electronic Devices & Storage patent application for Control Circuit, Drive Circuit, and Semiconductor Circuit. Sagawa Michio, Shimokawa Manami and Niikura Yuichiro developed the invention. The patent application number is US2025192093..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- MK Chem Tech Co Ltd has applied Chinese patent for Palladium Plating Composition, Method for Manufacturing Substrate for Semiconductor Package Using Same, and Substrate for Semiconductor Package Manufactured by Method. Han Deok-gon, Sung Tae-hyun and Lee Tae-ho developed it. The patent application number ..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 25 -- Jiangsu Huanneng Silicon Carbon Ceram Co Ltd has applied Chinese patent for CVD (chemical Vapor Deposition) Silicon Carbide Heater Processing System and Process Thereof. Ye Minghua developed it. The patent application number is CN20251193951 20250806. The patent publication number is CN120924946 (A). Inte..
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