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Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Shanmu Shenzhen Biotechnology Co Ltd for Microfluidic Chip. Guo Gang, Chen Xi and Chen Yueyun developed the invention. The patent application number is CN202520538584U 20250326. The patent publication number is CN223931436 (U). Internation..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Chinese Patent for System for Preparing Thermal Insulation Material from Polycrystalline Silicon Waste Residues has been issued to Leshan Gcl New Energy Tech Co Ltd. This invention was developed by Zhang Guorui, Liu Huan, Li Changle, Zhang Minpeng, Nie Tianjian, Xie Yan, Guo Han, Chen Pei, Li Qi, Huang Jinfa ..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Beijing Xindonglai Semiconductor Tech Co Ltd has been granted a patent for Objective Lens Damping Device. This invention was developed by Bi Houhai, Yang Shangyong, Yao Mengming, Wang Yinxun and Wang Ye. The patent application number is CN202520703211U 20250414. The patent publication number is CN223926687..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Shaanxi Lingyun Electronics Group Co Ltd has been granted a patent for Direction Finding System for Navigation Interference Detection. This invention was developed by Wang Hao, Yang Yinzhi, Dong Juan, Li Junxiao and Wang Long. The patent application number is CN202521370560U 20250701. The patent publicatio..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Suzhou Tokyo Welding Co Ltd for High-frequency Chip Type Electronic Component Testing Device. Li Haijun developed the invention. The patent application number is CN202423219705U 20241225. The patent publication number is CN223926540 (U). I..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Sichuan Yingsai Tech Co Ltd has been granted a patent for Four-probe Probe with Storage Module. This invention was developed by Wang Qiqi. The patent application number is CN202520194787U 20250207. The patent publication number is CN223926503 (U). International Patent Classification code is G01R1/073. ..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Kunshan Maipuen Prec Components Co Ltd for Semiconductor Electroplating Probe. Sheng Zekui developed the invention. The patent application number is CN20242396273U 20241216. The patent publication number is CN223926501 (U). International P..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Suzhou Semiconductor General Factory has obtained a patent for light shield for testing photosensitive tube. This invention was developed by Mao Qi, Fan Chenyu and Jin Suping. The patent application number is CN202520434539U 20250313. The patent publication number is CN223926499 (U). International Patent C..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Shaanxi Tianshili Tech Co Ltd has obtained a patent for semiconductor power device test heating table. This invention was developed by Wang Wei. The patent application number is CN202520417899U 20250311. The patent publication number is CN223926493 (U). International Patent Classification codes are G01R1/0..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Shenzhen Cztek Tech Co Ltd has been granted a patent for Drawing Panel of Semiconductor Test Equipment and Semiconductor Test Equipment. This invention was developed by Lu Zhibing and Guo Jun. The patent application number is CN202423316542U 20241231. The patent publication number is CN223926478 (U). Inter..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Chinese Patent for Device for Absorbing Silane Tail Gas in FBR Particle Silicon Production Process has been issued to Leshan GCL New Energy Tech Co Ltd. This invention was developed by Zhu Youkang, Wu Dezhi and Liang Fei. The patent application number is CN20252113854U 20250522. The patent publication numb..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Chengdu Jinjiang Electronics System Eng Co Ltd for Full-function Reconfigurable Digital Array Radar Brick Based on SOC Chip. Zhang Jian, Zhuo Hongli, He Wenyi, Luo Feiying, Chen Jun, Wu Wei, Lv Zhongyun, Zhang Wei, Lu Xingguo and Guan Yu deve..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Tongrui Semiconductor Tech Shanghai Co Ltd for Multi-platform Compatible Test Carrier Plate Based on Wafer Chip Mass Production Test. Zhang Jiayi developed the invention. The patent application number is CN202520400360U 20250310. The paten..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Qili Semiconductor Shaoxing Co Ltd has been granted a patent for Chip Testing Device. This invention was developed by Nie Shuangxia, Zhang Hong, Pan Jihua, Zheng Lijie and Zhang Jianwei. The patent application number is CN202520342590U 20250228. The patent publication number is CN223926566 (U). Internation..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Jiangsu Quanli Microelectronics Co Ltd has been awarded a patent for High and Low Temperature Testing Device for Semiconductor Field Effect Transistor. This invention was developed by Liu He and Jiang Zibiao. The patent application number is CN202520218951U 20260121. The patent publication number is CN2239..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Chinese Patent for Multi-bracket Detection Mechanism of Die Bonder has been issued to Taizhou Xingchen Intelligent Equipment Co Ltd. This invention was developed by Han Mingjia and Han Jie. The patent application number is CN202423286270U 20241231. The patent publication number is CN223926350 (U). Internat..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Ningbo Digital Twin Dongfang Inst Of Science And Technology has applied Chinese patent for Transconductance Equalization Circuit for CMOS Image Sensor Readout Circuit. Zeng Wenjun, Jin Xin and Li Xiangyu developed it. The patent application number is CN202610446810 20260407. The patent publication number i..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Suzhou Qiushi Future Microsystem Tech Co Ltd has filed a patent application for Pixel Unit and Control Method Thereof, Image Sensor and Electronic Equipment. This invention was developed by Guo Junwei. The patent application number is CN202610663602 20260514. The patent publication number is CN122395496 (A..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has released Shenzhen Xintu Zhigan Tech Co Ltd patent application for High Dynamic Range Charge Domain Global Exposure Pixel Structure, Image Sensor and Working Method. This invention was developed by Wang Fei, Wang Jianghua and Qu Zheng. The patent application n..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Chinese Patent for Waste Gas Treatment Device of Semiconductor Silicon Epitaxial Wafer Furnace has been issued to Guoxin Semiconductor Yizheng Co Ltd. This invention was developed by Chen Jun and Zeng Donglin. The patent application number is CN202520298289U 20250224. The patent publication number is CN223..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Sichuan Liuzu Semiconductor Mat Co Ltd has been awarded a patent for Screening Equipment for Semiconductor Material Processing. This invention was developed by Hu Hongjun, Deng Yonglin, Kong Donglin, Ding Songbai, Ran Songlin, Feng Liang and Li Shuilian. The patent application number is CN202520426429U 202..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Shiji Huazhang Shandong New Mat Co Ltd has received a patent for Drying Channel of Silicone Oil Paper Silicon Coating Machine. This invention was developed by Guo Peng, Wu Lexia, Sun Ling and Huang Chuanning. The patent application number is CN202520171438U 20250125. The patent publication number is CN2239..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Henan Kangtai Micro Powder Co Ltd has been granted a patent for Grinding Device for Silicon Carbide Nano Powder. Cui Feng developed the invention. The patent application number is CN202520379337U 20250306. The patent publication number is CN223931506 (U). International Patent Classification codes are B02C4..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Wuxi Haiping Intelligent Tech Co Ltd has been awarded a patent for Automatic Winding Tool for Silicon Steel Sheet Holder. This invention was developed by Gao Yuan, Xu Yueqing, Wang Yongfei and Wang Hu. The patent application number is CN202520337894U 20250227. The patent publication number is CN223927208 (..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Foshan Yaoshi New Material Tech Co Ltd has been awarded a patent for Cvd Diamond Hard Disk Substrate Structure. This invention was developed by Lin Xiaoqi. The patent application number is CN202520603065U 20250401. The patent publication number is CN223927079 (U). International Patent Classification code i..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Yukuaichuangling Intelligent Technology (Nanjing) for Adjustable Voltage Clamping Circuit. Li Ping developed the invention. The patent application number is CN202422433870U 20241009. The patent publication number is CN223926808 (U). Intern..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Henan Shouzheng New Mat Co Ltd has been awarded a patent for Iron Removal Device for Silicon Carbide Micro Powder. This invention was developed by Wang Fuliang, Li Changyu, Cui Liuzhong and Wang Dongsheng. The patent application number is CN20252098441U 20250116. The patent publication number is CN22393159..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Zhongshan Huagong Tech Co Ltd has been granted a patent for Detection Device for Storage Chip Production. This invention was developed by Long Hongxin, Long Xiyu, Long Qi and Zhao Yan. The patent application number is CN20252116236U 20250522. The patent publication number is CN223926896 (U). International ..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Anhui Yingtai Mante Electronic Co Ltd has been granted a patent for System for Burning and Reading Verification Chip in Parallel. Shen Qiang, Shu Qicai and Hu Yunfeng developed the invention. The patent application number is CN202520108246U 20250117. The patent publication number is CN223926890 (U). Intern..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Sichuan Liuzu Semiconductor Mat Co Ltd has been granted a patent for Smelting Furnace for Semiconductor Material Processing. Hu Hongjun, Deng Yonglin, Kong Donglin, Ding Songbai, Ran Songlin, Feng Liang and Li Shuilian developed the invention. The patent application number is CN202520424806U 20250312. The ..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Beijing Shudu Information Tech Co Ltd has submitted a patent application for End-taste-known Shared Cache Priority Allocation Method and Device and Switch Chip. This invention was developed by Xu Sheng and Yan Qin. The patent application number is CN202610847594 20260612. The patent publication number is C..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has published Qiyimoer Quzhou Integrated Circuit Co Ltd patent application for On-chip Interconnection Network and Chip Particle Integration System. The invention was developed by Tian Mochen, Wang Yu, Wen Dexin and Zhu Jundong. The patent application number is C..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Jining Inst of Quality and Metrology Jining Semiconductor and Display Product Quality Supervision An has been awarded a patent for Concrete Strength Detection Equipment for Civil Construction Engineering Quality Detection. This invention was developed by Du Xiaodong, Ding Shuying and Sun Siyuan. The patent..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Zhejiang Jingsheng Mechanical & Electrical and Zhejiang Qiushi Semiconductor Equipment have been granted a patent for Wafer Edge Clamping Type Spin-drying Mechanism. This invention was developed by Pu Tao, Xia Xilin, Chai Honglu, Zhao Qi, Wang Kai, Zhang Hangjun and Xie Longhui. The patent application numb..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Jiangsu Entepu Intelligent Equipment Co Ltd has received a patent for Noise Reduction Device of Screw Type Water Chilling Unit. This invention was developed by Wang Yi, Liu Qinghu, Hu Bing and Cui Peng. The patent application number is CN202423277375U 20241230. The patent publication number is CN223925137 ..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Guangdong Telepower Tech Co Ltd has applied Chinese patent for Kernel-driven Security Chip Access Control Method and Related Equipment Thereof. Hu Yangqi and Li Huanjia developed it. The patent application number is CN202610305940 20260313. The patent publication number is CN122394834 (A). International Pa..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Chuxiong Shaohua Biological Tech Co Ltd has received a patent for Automatic Filling Equipment for Pepper Seedling Substrate. This invention was developed by Wang Xuexiang and Cai Lintao. The patent application number is CN202520613330U 20250402. The patent publication number is CN223929097 (U). Internation..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Suzhou Yudacheng Semiconductor Tech Co Ltd has been granted a patent for Wireless Cavity Detection Device Convenient to Use. Gu Xinyou developed the invention. The patent application number is CN202520569981U 20250328. The patent publication number is CN223925732 (U). International Patent Classification co..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Shenglan Semiconductor Changzhou Co Ltd has been granted a patent for Thickness Detection Device in Preparation Process of Pzt Piezoelectric Film Wafer. This invention was developed by Zhao Yuyao and Huang Jinglong. The patent application number is CN202520159812U 20250123. The patent publication number is..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Ismeca Semiconductor Holding SA for Sensor Assembly and Component Handling Assembly. Eigeldinger Ralf, Carvalho Alves Edgar, Oberli Matthias and Viverger Philippe developed the invention. The patent application number is CN20239000482U 202..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Univ Eastern Liaoning has received a patent for Vertical Strawberry Planting Device. This invention was developed by Wang Shuang, Yu Jiajie, Li Xiaohong and Zhang Xiang. The patent application number is CN202520429946U 20250312. The patent publication number is CN223929001 (U). International Patent Classif..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Kunming Chengxin Survey And Design Co Ltd for Quarry Water Retention and Soil Fixation Type Green Covering Substrate Laying Device. Wu Shaozhou, Peng Yu, Xiong Yangang, Liu Shengli, Wang Zhenxin, Du Wei and Wu Chongzheng developed the inventi..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Chinese Patent for Ceramic Substrate and Chip Packaging Structure has been issued to Zhuhai Zero Boundary Integrated Circuit Co Ltd and Gree Electric Appliances, Zhuhai. This invention was developed by Li Chunyan, Liao Yongbo, Liu Leiren and Wu Haolin. The patent application number is CN202423158299U 20241..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Guangdong Qipai Technology has been granted a patent for Semiconductor Packaging Structure. This invention was developed by Gou Shaofeng, Liu Xiaoxiong, Wang Renhuai, Rao Xilin, Zhao Liming and Dong Shupeng. The patent application number is CN202520483131U 20250319. The patent publication number is CN22392..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Mitsubishi Electric has been granted a patent for Semiconductor Device and Power Conversion Device. Masumoto Hiroyuki developed the invention. The patent application number is CN20229000946U 20220712. The patent publication number is CN223928811 (U). International Patent Classification code is H10W70/40. C..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Origin Quantum Computing Technology Hefei Co Ltd has been granted a patent for Test Structure, Superconducting Quantum Chip and Superconducting Quantum Computer. This invention was developed by Jia Zhilong. The patent application number is CN202520136795U 20250120. The patent publication number is CN223928..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Shaanxi Kezhi Yuanda Tech Co Ltd has received a patent for Probe Testing Mechanism of Semiconductor Testing and Braiding All-in-one Machine. This invention was developed by Wang Wei and Yao Hui. The patent application number is CN202423302654U 20241231. The patent publication number is CN223928805 (U). Int..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Zhejiang Xindong Tech Co Ltd for Vacuum Adsorption Device for Special-shaped Sample in Semiconductor Production. Liu Liyue, Sun Yantao, Liu Cong and Lin Haiya developed the invention. The patent application number is CN202520133577U 202501..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Chizhou Jucheng Electronic Tech Co Ltd for Pressing Structure for Chip Packaging. Zhang Yongping and Zhang Jinyu developed the invention. The patent application number is CN202520456968U 20250313. The patent publication number is CN2239287..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Wuxi Bojing Electron Co Ltd has secured a patent on Automatic Pick-and-place Device for to Tube Socket. Li Zhiqiang developed the invention. The patent application number is CN202520416177U 20250311. The patent publication number is CN223928772 (U). International Patent Classification codes are H10P72/00 a..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Suzhou Longchi Semiconductor Tech Co Ltd has been granted a patent for Semiconductor Wafer Cleaning Equipment. This invention was developed by Shao Lei. The patent application number is CN20252031154U 20250106. The patent publication number is CN223928764 (U). International Patent Classification codes are ..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Suzhou Zhongke Guangju Tech Co Ltd has been awarded a patent for LED Display System-level Packaging Structure. This invention was developed by Qu Hongxia and Ye Zhequan. The patent application number is CN202423323979U 20241231. The patent publication number is CN223928742 (U). International Patent Classif..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Suzhou Xinju Semiconductor Co Ltd has secured a patent on Packaging Structure of Led Chip. Li Qing, Li Jin, Zhao Ke and Yue Han developed the invention. The patent application number is CN202520400047U 20250307. The patent publication number is CN223928737 (U). International Patent Classification codes are..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Hangzhou Xinju Semiconductor Co Ltd has received a patent for Packaging Structure of Led Chip. This invention was developed by Li Qing, Li Jin, Zhao Ke and Yue Han. The patent application number is CN202520398955U 20250307. The patent publication number is CN223928736 (U). International Patent Classificati..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Xiamen Sitan Integration Tech Co Ltd for Stripping Jig and Substrate Stripping Equipment. Qiu Chengfeng developed the invention. The patent application number is CN202520367033U 20250304. The patent publication number is CN223928733 (U). I..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Xinsheng Jiechuang Photoelectric Tech Changzhou Co Ltd has been granted a patent for Photoelectric Chip Stacking Packaging Structure. This invention was developed by Yin Lingyun, Shang Haiming and Liu Jianjun. The patent application number is CN202520487735U 20250319. The patent publication number is CN223..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Fujian Jinshi Energy Co Ltd has obtained a patent for back contact solar cell and cell string thereof. This invention was developed by Zhou Sihai, Zhang Hong, Li Ping, Wang Yipeng, Zeng Qinghua and Lin Zhanfen. The patent application number is CN20252098259U 20250116. The patent publication number is CN223..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Guangxi Xinyi Photoelectric Tech Co Ltd has obtained a patent for embedded image sensor packaging structure. This invention was developed by Wu Xianquan and Shi Yongde. The patent application number is CN202520836504U 20250429. The patent publication number is CN223928711 (U). International Patent Classifi..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Fujian Jinshi Energy Co Ltd has secured a patent on Back Contact Solar Cell Interconnection Structure. Yang Yusheng, Zhou Sihai, Huang Jiarong and Zheng Jianxiang developed the invention. The patent application number is CN202520164594U 20250124. The patent publication number is CN223928709 (U). Internatio..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Changshu CSI Advanced Solar and Canadian Solar for Strip-shaped Silicon Wafer, Strip-shaped Battery and Photovoltaic Module. Xu Chengqi, Xia Jin, Xiong Haibo, Shao Zhiqiang and Zou Le developed the invention. The patent application number ..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Zhejiang Shenhu Tech Co Ltd has been granted a patent for High-precision Chip Mounter Head Mechanism. Xie Zhengjun developed the invention. The patent application number is CN202423265421U 20241230. The patent publication number is CN223928697 (U). International Patent Classification code is H05K13/04. ..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Hualai Semiconductor Tech Co Ltd for Adjustable LED Lamp Bead Module. Zeng Yu, Li Xiaohua and Yao Kaixiang developed the invention. The patent application number is CN202520616682U 20250403. The patent publication number is CN2239..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Shenzhen Chuanming Innovation Tech Co Ltd has secured a patent on Light-emitting Diode (LED) Table Lamp Capable of Adjusting Size of Light Source. Huang Caifeng and Huang Cuiyun developed the invention. The patent application number is CN202520177379U 20250204. The patent publication number is CN223924724 ..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Yunnan Chuanzhi Semiconductor Mat Co Ltd for Cleaning Carrier for Photovoltaic Master Alloy Production. Tang Chaohui and Jiang Jilin developed the invention. The patent application number is CN202520409659U 20250310. The patent publication..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Huizhou Xinbo Glass Tech Co Ltd for Glass Substrate Cleaning Device. Pan Hui developed the invention. The patent application number is CN202520368275U 20250305. The patent publication number is CN223932230 (U). International Patent Classif..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Chinese Patent for Scraping Mechanism and Polycrystalline Silicon Slurry Anti-blocking Device has been issued to Anhui Zhanwei Gas Co Ltd. This invention was developed by Guo Caimin, Wu Guodong, Wang Shuai, Wang Jianbin and Feng Xiangyang. The patent application number is CN202520366278U 20250304. The pate..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Suzhou Zhongbocheng Electrical and Mech Equipment Co Ltd has obtained a patent for dry ice cleaning device for semiconductor packaging jig. This invention was developed by Lu Hongfei. The patent application number is CN202520153867U 20250122. The patent publication number is CN223932167 (U). International ..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Shandong Mingxin Woke New Mat Co Ltd has been granted a patent for Water Washing Purification Device for Silicon Carbide Raw Material Processing. This invention was developed by Lyu Bin. The patent application number is CN20252084549U 20250114. The patent publication number is CN223932080 (U). Internationa..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Xiamen Pecton Semiconductor Technology has been awarded a patent for Panel Assembly Precision Detection Equipment. This invention was developed by Wang Zhifeng, Shi Nengjie, Liu Jia and Liu Lifeng. The patent application number is CN202520372781U 20250305. The patent publication number is CN223932026 (U). ..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Jiangxi Hengrui Electronic Tech Co Ltd for Feeding Equipment for Aluminum Substrate Processing. Miao Mengmeng, Zhao Jiajun and Wang Jiancheng developed the invention. The patent application number is CN202520461222U 20250317. The patent pu..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Chinese Patent for Display Circuit, Display Device and Stage Lighting Equipment has been issued to Shenzhen Zhixin Semiconductor Tech Co Ltd. This invention was developed by Xie Jing, Wu Dongsheng and Li Guotian. The patent application number is CN202423318708U 20241231. The patent publication number is CN..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Haobo Electronic Tech Nanjing Co Ltd for Flasher with Built-in LED Lamp Constant Voltage Source. Zhang Jiahao, Ge Minmin, Zhang Feng, Zhang Jiayi and Wang Xin developed the invention. The patent application number is CN202520206828U 202502..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Xinxin Semiconductor Co Ltd for Differential Signal Amplification Device for High-speed Data Transmission in Chip. Cui Jin developed the invention. The patent application number is CN202520445684U 20250314. The patent publication ..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Ruishi Chuangxin Shenzhen Semiconductor Co Ltd has received a patent for Power Amplifier, Chip and Radio Frequency Front-end Module. This invention was developed by Ni Jianxing, Su Li, Hu Zijie and Pu Tianhong. The patent application number is CN20252015096U 20250103. The patent publication number is CN223..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Shaanxi Reactor Microelectronics Co Ltd has secured a patent on Dead Time Adjusting Circuit and Active Clamping Forward Power Supply Chip. Yang Shihong, Li Xuemin and Wang Hu developed the invention. The patent application number is CN202520347837U 20250228. The patent publication number is CN223928228 (U)..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Xiaomi Automobile Technology has filed a patent application for Vehicle Communication Method and Device, Vehicle, Chip and Storage Medium. This invention was developed by Chang Zhibo. The patent application number is CN202610465645 20260409. The patent publication number is CN122395699 (A). International Pat..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- ASML Netherlands has submitted a patent application for Nozzle Device. This invention was developed by Rollinger Bob, Lukens Joshua M, Waschenko Georgy Olegovich, Ershov Alexander I and Amada Yoshiho. The patent application number is CN202610733358 20200904. The patent publication number is CN122395787 (A). ..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has received Xiaomi Automobile Technology patent application for Audio Transmission Method and Device, Vehicle, Chip and Storage Medium. Yang Xi developed the invention. The patent application number is CN202610442648 20260403. The patent publication number is CN12..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Rongyao Terminal has applied Chinese patent for Image Acquisition Method, Electronic Equipment, Storage Medium and Chip System. Zhang Guicheng and Lyu Fuxing developed it. The patent application number is CN20251061963 20250114. The patent publication number is CN122395489 (A). International Patent Classific..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Realtek Semiconductor Corporation has applied Chinese patent for Image Processing Device and Image Processing Method. Wu Zongxuan and Zheng Jingsheng developed it. The patent application number is CN20251193298 20250806. The patent publication number is CN122395425 (A). International Patent Classification co..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has awarded a patent to Xiamen Biotime Biotechnology for Micro-fluidic Chip Capable of Releasing Pressure. Hu Xiongbang and Zheng Zheming developed the invention. The patent application number is CN202520543978U 20250326. The patent publication number is CN22393143..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Chinese Patent for Aging Test Equipment has been issued to Changmai Semiconductor Chengdu. This invention was developed by Gao Guanghui and Yao Jinguang. The patent application number is CN20252050375U 20250109. The patent publication number is CN223926564 (U). International Patent Classification codes are..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- Changmai Semiconductor Chengdu has obtained a patent for damping mechanism and aging equipment. This invention was developed by Liu Renfeng, Zhang Bin, Chen Jie, Li Shuxin and Zhuo Xiaohui. The patent application number is CN202520370965U 20250305. The patent publication number is CN223926490 (U). Internat..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Hisense Visual Technology has filed a patent application for Video Decoding Method, Video Coding Method and Chip. This invention was developed by Li Bin, Yu Qingxiao, Tian Deli, Wang Zhikui, Han Pengfei, Wu Hanyong, Xing Fang, Jiang Weiwei and Zu Yinpeng. The patent application number is CN20251056652 202501..

Semiconductor

  |  Fri 30 Oct 2026

Beijing, Oct. 30 -- China Constr 8th Engineering Division has been awarded a patent for Efficient Dust Removal Device for Semiconductor Clean Workshop Construction. This invention was developed by Shi Hongliang, Xiao Yao, Wang Miao, Huang Siqi, Jiang Bin, Choi Keun-joo, Bian Tengfei and Zhu Chunyang. The patent application numb..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Shanghai Chuanxin Semiconductor has applied Chinese patent for Polishing Method. Huang Zaohong, Ji Minghua and Cai Xiaofeng developed it. The patent application number is CN202610602971 20260430. The patent publication number is CN122401172 (A). International Patent Classification codes are B24B1/00, B24B3..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Ningbo Sanfeng Enterprise Machinery and Electronics has applied Chinese patent for Cutter Chip Flushing Structure for High-pressure Pump Body Machining. Wang Zichen and Wang Wenyao developed it. The patent application number is CN202610877788 20260617. The patent publication number is CN122401153 (A). Intern..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has released Zhejiang A&F University patent application for Preparation Method and Application of Delignification Rotary-cut Wood Chip In-situ Growth MOF Composite Membrane. This invention was developed by Sun Qingfeng, Ma Xiaofan and Wang Xu. The patent applicat..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Xiamen University has applied Chinese patent for Method for Long-acting Hydrophilization-dynamic Bubble Removal and Multi-outlet Flow Resistance Balance of Micro-fluidic Chip. Zhu Mengya, Cao Xiaoyu, Yang Liulin and Chen Yijie developed it. The patent application number is CN202610800077 20260604. The patent..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Jiangsu Vocational College of Information Technology has submitted a patent application for Fan-out Type Packaging Structure for Inhibiting Chip Offset and Preparation Method of Fan-out Type Packaging Structure. This invention was developed by Wang Lei. The patent application number is CN202610517519 2026042..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Shanghai Xianfeng Tech Co Ltd has submitted a patent application for Graphical Discontinuous Metal Layer Rotating Plate Peptizing Structure and Peptizing Method. This invention was developed by Chen Junhong, Chuang Chih-jen, Lin Zhengyi, Chen Zhihui, Gao Yongqiang, Tang Xinlu and Zhang Junhao. The patent a..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Yangtze Memory Technologies has filed a patent application for Semiconductor Structure and Manufacturing Method of Semiconductor Structure. This invention was developed by Yan Meng, Wang Huan, Yin Peng'an, Xiao Wenjing and Wu Shu. The patent application number is CN202610253391 20220526. The patent publicati..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Phytium Technology has applied Chinese patent for Package Substrate and Design Method Thereof, Computer Readable Storage Medium and Equipment. Liu Chao, Huang Chenjun and Wei Jinxiu developed it. The patent application number is CN202610284970 20260309. The patent publication number is CN122396323 (A). Inter..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has published Xinlian Yuezhou Integrated Circuit Manufacturing (Shaoxing) patent application for Semiconductor Device and Manufacturing Method Thereof. The invention was developed by Lu Mingjie and Yuan Jiagui. The patent application number is CN202610846158 2026..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Hefei Junlian Automotive Electronics has submitted a patent application for Heat Dissipation Method of Multi-layer Chip Stacking Structure. Chen Zhaoyin, Jia Huaxiang and Gao Yang developed the invention. The patent application number is CN202610493965 20260415. The patent publication number is CN122396300 (..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Xinlian Pioneer Integrated Circuit Manufacturing, Shaoxing has submitted a patent application for Semiconductor Structure and Slicing Method of Semiconductor Structure. Wang Yan and Wang Bingqi developed the invention. The patent application number is CN202610446680 20260407. The patent publication number is..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Macronix has sought patent for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Lai Erkun and Long Xianglan. The patent application number is CN202510147892 20250211. The patent publication number is CN122396293 (A). International Patent Classification codes are H10..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- Shanghai Xinwei Technology Research Cente has filed a patent application for Method of Manufacturing Conductive Structure and Method of Manufacturing Semiconductor Device. This invention was developed by Qiao Qifeng and Xie Zheng. The patent application number is CN20251039520 20250109. The patent publicatio..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has received SJ Semiconductor patent application for Through Hole Contact Structure and Manufacturing Method Thereof. Pan Yuanjie, Sun Qidong and Xu Hu developed the invention. The patent application number is CN20251029053 20250108. The patent publication number..

Semiconductor

  |  Sat 31 Oct 2026

Beijing, Oct. 30 -- State Intellectual Property Office of China has received Infineon Technologies patent application for Semiconductor Device with First Isolation Trench and Method of Manufacture. Disney David R, Weiss Robert and Schlosser Thomas developed the invention. The patent application number is CN20261032824 20260112...
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