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Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Yitang Semiconductor Tech Beijing Co Ltd and Beijing E Town Semiconductor Technology have submitted a patent application for Plasma Equipment. This invention was developed by Yu Xiaocui, Zhao Zhongsheng, Hou Jianhua, Zhao Junzhao, Wang Chunlei, Luo Gonglin, Guan Changle and Song Yongming.
The patent appli..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Haipu Co Ltd has filed a patent application for Field Performance Control Method and System for Multiple Light-emitting Devices. This invention was developed by Choi Bo Yun.
The patent application number is CN202511864432 20251211. The patent publication number is CN122248612 (A). International Patent Cla..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Semiconductor Manufacturing International (Shanghai) and Semiconductor Mfg International Beijing Corp have sought patent for Package Ring Structure and Forming Method Thereof. This invention was developed by Chen Kai and Zhang Tianfu.
The patent application number is CN202411855747 20241216. The patent pu..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Shenzhen Semipeak Tech Co Ltd, Shanghai Kaijie Semiconductor Tech Co Ltd, Changdian Microelectronics Jiangyin Co Ltd and Zhejiang Dingjing Technology have applied Chinese patent for Lead Bonding Method and Lead Bonding Device. Guo Liangkui, Yao Lun, Chang Chengjian, Cheng Guangliang, Yu Long and Li Wenjie de..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Shanghai Yaogan Tech Co Ltd patent application for Method for Integrating Wafer-level Module with Heat Dissipation Structure and Module. This invention was developed by Han Yinan.
The patent application number is CN202610156444 20260203. The patent ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Semiconductor Manufacturing International (Shanghai) and Semiconductor Mfg International Beijing Corp have sought patent for Chip Architecture and Forming Method Thereof. This invention was developed by Wang Jinen, Yan Dayong, Qiang Li, Na Qing and Zhao Yajun.
The patent application number is CN2024118562..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Hubei 3D Semiconductor Integration Innovation Center Co Ltd has filed a patent application for Semiconductor Device and Preparation Method Thereof. This invention was developed by Chen Runpeng, Li Linyu, Liu Wei and Cheng Cui.
The patent application number is CN202411836206 20241213. The patent publicatio..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Alpha & Omega Semiconductor LP has submitted a patent application for Semiconductor Package Having Low Side Field Effect Transistor. This invention was developed by Philbrick Rhys, Niu Zhiqiang, Bode Madhur, Pan Ji, Wang Xiaobin, Yan Xun Xue and Wang Long-ching.
The patent application number is CN20251186..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has received Alpha & Omega Semiconductor LP patent application for Semiconductor Package with Suppressed Electrical Coupling. Niu Zhiqiang, Bode Madhur, Jian Yin, Yan Xun Xue, Wang Long-ching and Li Guanhong developed the invention.
The patent application number..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- United Semi Integrated Circuit Mfg Xiamen Co Ltd has applied Chinese patent for Semiconductor Structure. Xie Feng, Du Bing, Gu Hailong, Tan Wenyi and Xu Hongfu developed it.
The patent application number is CN202411864000 20241217. The patent publication number is CN122249055 (A). International Patent Cla..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Hubei Jiangcheng Laboratory has submitted a patent application for Semiconductor Structure and Preparation Method Thereof. Xie Huaqiang, Luo Chao, Cheng Tiantian and Wan Yixian developed the invention.
The patent application number is CN202610439896 20260403. The patent publication number is CN122249049 (..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Wuyuan Semiconductor Tech Qingdao Co Ltd patent application for Wafer Regeneration Method. The invention was developed by Che Guoliang and Guo Shunhua.
The patent application number is CN202610421990 20260401. The patent publication number is CN122..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Xi'an ESWIN Silicon Wafer Technology and Xi'an ESWIN Material Technology have applied Chinese patent for Wafer Local Morphology Risk Assessment Method and System, Equipment, Medium and Product. Ma Qiangqiang and Li Kangkang developed it.
The patent application number is CN202610367443 20260324. The patent..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Tsingsoft Microvision Hangzhou Tech Co Ltd has filed a patent application for Wafer Turnover Device. This invention was developed by Chen Shijiang, Zhou Jile and Chen Kai.
The patent application number is CN202610662036 20260514. The patent publication number is CN122249021 (A). International Patent Class..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Beijing Qupu Tech Co Ltd has submitted a patent application for Wafer Production and Processing Equipment. This invention was developed by Huang Wei.
The patent application number is CN202610283964 20260310. The patent publication number is CN122249019 (A). International Patent Classification codes are H1..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Jingxin Semiconductor Huangshi Co Ltd has filed a patent application for Multi-station Self-adaptive Intermediate Cleaning System. This invention was developed by Wang Zhiteng, Wang Ziyi and Wang Tianxiang.
The patent application number is CN202610284777 20260310. The patent publication number is CN122248..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Zhejiang Xindao Semiconductor Tech Co Ltd patent application for De-bonding Tool, De-bonding Device and De-bonding Method. The invention was developed by Zhang Xueyou and Wu Xingxin.
The patent application number is CN202610322207 20260316. The pat..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Semiconductor Manufacturing International (Shanghai) and Semiconductor Mfg International Beijing Corp have submitted a patent application for Wafer Hybrid Bonding Structure and Method. Shi Lubin developed the invention.
The patent application number is CN202411856249 20241216. The patent publication numbe..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Harbin Inst of Technology has submitted a patent application for Magnesium-based Segmented Thermoelectric Arm Prepared Based on Melting Deformation Method and Preparation Method Thereof. This invention was developed by Sui Jiehe, Zhu Yuke, Wen Qinzhen, Liu Ming and Liu Zihang.
The patent application numbe..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Shenzhen Xuxin Semiconductor Co Ltd has filed a patent application for Fluorescent-powder-free Multicolor Light-emitting Device Array and Preparation Method Thereof. This invention was developed by Wang Bing, Li Wanren, Wang Xuewen and Shi Yixuan.
The patent application number is CN202610317732 20260316. ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published BOE Huacan Optoelectronics Guangdong Co Ltd patent application for Light Emitting Diode and Preparation Method Thereof. The invention was developed by Song Yuhua, Wei Yang, Wu Zhihao and Tong Zhidi.
The patent application number is CN202610329975 2..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- United Semi Integrated Circuit Mfg Xiamen Co Ltd has sought patent for Gate Dielectric Layer of High-voltage Transistor and Manufacturing Method Thereof. This invention was developed by Huang Qingjun, Guo Yuchun, Zhang Xiong, Zhang Weijun, Zhang Youdi and Tan Wenyi.
The patent application number is CN2024..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Bossemi Semiconductor Co Ltd has applied Chinese patent for Super-junction Metal-oxide-semiconductor Field Effect Transistor with Pin Structure. Ke Yongsheng, Lai Dongming, Meng Xiangji and Yeo Sang-kap developed it.
The patent application number is CN202411868275 20241218. The patent publication number i..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Xili Microelectronics Shenzhen Co Ltd has applied Chinese patent for Planar Gate Sic MOSFET Device and Preparation Method Thereof. Yu Fanbo, Zhou Lie and Zhou Zhihong developed it.
The patent application number is CN202610175514 20260206. The patent publication number is CN122248766 (A). International Pat..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Toshiba; Toshiba Electronic Devices & Storage has submitted a patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Kikuchi Kenji and Tomita Kota.
The patent application number is CN20251195605 20250806. The patent publication number is CN1222487..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Wuyuan Semiconductor Tech Qingdao Co Ltd has submitted a patent application for Power Device and Preparation Method Thereof. This invention was developed by Li He, Chen Weiyu, Yan Tiancai, Zhang Wenxin, Zhao Kenan, Sun Jiuji, Yang Tongtong, Li Ke and Yang Lieyong.
The patent application number is CN202610..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published BOE Huacan Optoelectronics Guangdong Co Ltd patent application for Transistor and Manufacturing Method Thereof. The invention was developed by Zhang Baoying and Wen Jiawei.
The patent application number is CN202610411648 20260331. The patent public..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Wuyuan Semiconductor Tech Qingdao Co Ltd has submitted a patent application for Silicon-based Inductor Structure and Preparation Method Thereof. This invention was developed by Xiao Jiazhan, Fu Xinyue and Wang Xin.
The patent application number is CN202610422091 20260401. The patent publication number is ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Chengdu Xinziguang Semiconductor Tech Co Ltd has submitted a patent application for Semiconductor Device and Preparation Method Thereof. This invention was developed by Qin Yuting.
The patent application number is CN202411874446 20241218. The patent publication number is CN122248742 (A). International Pat..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Semiconductor Manufacturing International (Shanghai) and Semiconductor Mfg International Beijing Corp have applied Chinese patent for Memory Cell and Forming Method Thereof. Tong Haiyue and Zheng Huan developed it.
The patent application number is CN202411865640 20241217. The patent publication number is ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Yangtze Memory Holdings Co Ltd has sought patent for Memory Device, Manufacturing Method Thereof and Memory System. This invention was developed by Zhou Wenxi, Ouyang Lujia, Yang Tao and Du Xiaolong.
The patent application number is CN202411817103 20241210. The patent publication number is CN122248719 (A)..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Hunan Nami Xiaoxin Semiconductor Co Ltd has been awarded a patent for Grinding Device for Thermosensitive Sheet. This invention was developed by Zhou Shujuan.
The patent application number is CN20252037393U 20250107. The patent publication number is CN223656669 (U). International Patent Classification cod..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Semiconductor Manufacturing International (Shanghai), Semiconductor Mfg International Beijing Corp and Semiconductor Mfg North Integrated Circuit Mfg Beijing Co Ltd have sought patent for Semiconductor Annual Maintenance Production Scheduling Optimization System and Method, Storage Medium and Terminal. This ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Alpha & Omega Semiconductor LP has submitted a patent application for Bigate Switching Device. This invention was developed by Zhang Guangming, Ye Hui, Yu Ziwei, Chen Lin and Jian Yin.
The patent application number is CN202511592696 20251103. The patent publication number is CN122247396 (A). International..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Solus Advanced Materials Co Ltd has submitted a patent application for Organic Light-emitting Compound and Organic Electroluminescent Device Using the Same. This invention was developed by Eum Min Sik, Sim Jae Yi, Lee Yong Hwan and Park Woo Jae.
The patent application number is KR20250018527 20250213. The p..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Guilin University of Electronic Technology and Nanning Guidian Electronic Technology Research Institute Co Ltd have submitted a patent application for Multi-channel Parallel Byzantine Fault-tolerant Consensus Method Based on Multi-committee Mechanism. This invention was developed by Liang Hai, Liu Yang, Yang..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Suzhou Yaoxin Elect Co Ltd has secured a patent on Full-automatic Transistor Pin Forming Device. Li Qin developed the invention.
The patent application number is CN202423174467U 20241223. The patent publication number is CN223655926 (U). International Patent Classification codes are B21F1/00 and B21F23/00..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Yancheng Fangquan Machinery Co Ltd has been granted a patent for Die for Machining Brake Cylinder Seat. This invention was developed by Gao Maoya, Sun Xianfen, Wang Shuai and Pan Jincai.
The patent application number is CN202423220681U 20241226. The patent publication number is CN223655879 (U). Internatio..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Ingenic Semiconductor Co Ltd patent application for Neural Network Quantization Calibration Method Based on Mean Square Error of Feature Map. This invention was developed by Wang Chunyu.
The patent application number is CN202411893534 20241220. The ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published LT Materials patent application for Heterocyclic Compound and Organic Light-emitting Element Comprising Same. The invention was developed by Lee Dong-jin, Jeong Won-jang, Kim Dong Jun and Choi Dae-hyuk.
The patent application number is CN2024807433..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- LT Materials has applied Chinese patent for Heterocyclic Compound and Organic Light-emitting Element Comprising Same. Jeong Won-jang, Lin Naqing, Kim Dong Jun and Choi Dae-hyuk developed it.
The patent application number is CN20248072826 20240909. The patent publication number is CN122249443 (A). Internat..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Jiangsu Fulate Semiconductor Equipment Co Ltd has received a patent for Developing Solution Concentration High-efficiency Automatic Dilution Device. This invention was developed by Gong Xiaolong, Zhou Chun, Liu Suwei, Han Yixuan and Zhang Yuheng.
The patent application number is CN202520214908U 20250211. ..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Safety Early Warning Method, Device and Equipment for Operation Scene of Semiconductor Factory. Xia Hui, Mao Zhouliang, Xu Minrui, Yan Chuanqi and Huang Shihao developed the invention.
The patent application number is CN202610740384 202..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- LG Display has submitted a patent application for Thin Film Transistor Substrate and Display Device Using the Same. This invention was developed by Chanyong Jeong, Younghyun Ko and Juheyuck Baeck.
The patent application number is KR20230107508 20230817. The patent publication number is KR20250026508 (A). Inte..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has received Samsung Electronics patent application for Semiconductor Package and Manufacturing Method for the Same. Yim Choongbin, Chengtar Wu and Kim Jongkook developed the invention.
The patent application number is KR20230107503 20230817. The patent publication number..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has published PSK Inc patent application for End Effector and Substrate Transfer Apparatus. The invention was developed by Kim Hyung Jin and Oh Hyun Woo.
The patent application number is KR20230107449 20230817. The patent publication number is KR20250026480 (A). Internation..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- SK Hynix has sought patent for Semiconductor Apparatus with Test Function and Semiconductor System Including the Same. This invention was developed by Hyeong Soo Jeong and Hyun Seung Kim.
The patent application number is KR20230107636 20230817. The patent publication number is KR20250026562 (A). International..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Samsung Electronics has filed a patent application for Semiconductor Device Including Bit Line. This invention was developed by Ko Seung Bo, Lee Min Young, Kim Jong Min and Ahn Dong Hyuk.
The patent application number is KR20230107621 20230817. The patent publication number is KR20250026556 (A). Internation..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Hits Co Ltd has applied Korean patent for Method of Cleaning an Edge of a Semiconductor Substrate and Apparatus of Cleaning an Edge of a Semiconductor Substrate. Lee Jae Cheon, Lee Sun Yeol and Oh Jong Seob developed it.
The patent application number is KR20230107692 20230817. The patent publication number ..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has released Samsung Electronics patent application for Semiconductor Device. This invention was developed by Park Gyu Hee, Park Sang Hyun, Lee In Ji and Hase Naoki.
The patent application number is KR20230107673 20230817. The patent publication number is KR20250026576 (A..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Samsung Electronics has submitted a patent application for Test Apparatus and Test Method for Detecting Defects of Elements Included in Integrated Circuit. This invention was developed by Hyoun Soo Park and Seonghoon Park.
The patent application number is KR20230116529 20230901. The patent publication number ..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Solmics Co Ltd has applied Korean patent for Parts for Semiconductor Device Manufacturing Apparatus Semiconductor Device Manufacturing Apparatus Including the Same and Manufacturing Method for Semiconductor Device. Shin Jung Woo, Kim Hyun Uk, Song Ju Young and Yun Yeong Gon developed it.
The patent applicat..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Solmics Co Ltd has filed a patent application for Parts for Semiconductor Device Manufacturing Apparatus Semiconductor Device Manufacturing Apparatus Including Same and Manufacturing Method for Semiconductor Device. This invention was developed by Kim Dong Eun.
The patent application number is KR20230107299..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has released SK Hynix patent application for Electronic Device and Electronic System for Performing a Phase Control Operation. This invention was developed by Shim Jae Min.
The patent application number is KR20230107234 20230816. The patent publication number is KR202500260..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- NVIDIA has submitted a patent application for Artificial Intelligence System for Multi-standard Sample Detection. Sriram Palani, Praveen Varun, Liu Guanhong, Huang Yujie, Murali Venkata Narayanan, Bhat Zachary P, Ji Yanyang and Chen Hongren developed the invention.
The patent application number is CN2025119..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has received Shanxi Dingxin Crystal Mat Co Ltd and Shanxi Huaxin Jingtu Tech Co Ltd patent application for Method and Device for Detecting Crystal Structure Defects of Sapphire Substrate. Song Baile, Xiao Di, Qin Maoxiao and Xiao Yanqing developed the invention.
..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Zhejiang Guoxin Semiconductor Tech Co Ltd has submitted a patent application for Digital Management Method for Packaging Production Process. This invention was developed by Shen Guoping.
The patent application number is CN202610431537 20260402. The patent publication number is CN122264737 (A). Internation..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Semiconductor Energy Laboratory has applied Korean patent for Display Device and Electronic Device. Seo Satoshi, Nakamura Daiki, Nishido Yusuke, Sasaki Toshiki, Yamaoka Ryohei and Kaita Akihiro developed it.
The patent application number is KR20257004985 20171116. The patent publication number is KR2025002640..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Samsung Electronics has submitted a patent application for Semiconductor Device. Kang Min Ju, Kim Yong Kwan, Kim Hui Jung, Lee Hyun Jin, Kang Su Jin, Kim Min Soo, Cha In Ho, Chae Hee Jae and Kim Seung Hoon developed the invention.
The patent application number is KR20250015384 20250206. The patent publicati..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Solmics Co Ltd has submitted a patent application for Upper Elelctrode Semiconductor Device Manufacturing Apparatus Including the Same and Manufacturing Method for Semiconductor Device. This invention was developed by Shin Dong Un, Kim Hyun Uk and Song Ju Young.
The patent application number is KR2023010729..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has received Maxius Co Ltd patent application for How to Dramatically Improve Data Storage Performance in Computer Systems with High-speed Data Processing System Semiconductor Boards. Cho Byung Cheol developed the invention.
The patent application number is KR20230107192 ..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has received Zinitix Co Ltd patent application for Method for Testing a Chip. Jung Huy Chan developed the invention.
The patent application number is KR20230107123 20230816. The patent publication number is KR20250026005 (A). International Patent Classification codes are ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has received ASML Netherlands patent application for Assembly for Wavelength Calibration. Cramer Hugo Augustinus Joseph and Edward Stephen developed the invention.
The patent application number is CN20248074656 20241031. The patent publication number is CN12224977..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released ASML Netherlands patent application for Patterning Process Evaluation System and Method. This invention was developed by Van Engel Jozef P, Van T Wisden Mark, Jahani Samir, De Leon Arispe Ignacio, Sahin Ertan, Goldstein Michael, Setija Irwan D and Akbu..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- NVIDIA has applied Chinese patent for Method for Simulating Multi-level Instantiation by Using Non-transformation Lightweight Instance. Muthler Gregory developed it.
The patent application number is CN202511920315 20251218. The patent publication number is CN122265494 (A). International Patent Classificatio..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Beijing Unisoc Communication Tech Co Ltd has submitted a patent application for Image Quality Enhancement Method, Image Quality Enhancement Device, Image Quality Enhancement Equipment, Chip and Chip Module. This invention was developed by Wu Qian, Zhou Tong, Guo Hao, Shao Na, Wang Qiongyao and Zhang Yingqian..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Xinxin Hangtu Suzhou Tech Co Ltd patent application for Heterogeneous Processing Circuit, Matching Method, and Integrated Circuit. This invention was developed by Li Ting.
The patent application number is CN202411849191 20241216. The patent publicat..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has received Tianxing Shuke Tech Co Ltd patent application for Insurance Method, Device, System, Equipment, Medium, Product and Chip. Tong Dong, Liu Zhen, Hou Haichao and Zhao Miaotong developed the invention.
The patent application number is CN202411897732 2024..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Zhisuan Matrix Shenzhen Data Tech Co Ltd has submitted a patent application for Knowledge Graph-based Semiconductor Film Deposition Process Intelligent Recommendation System and Method. Wang Li developed the invention.
The patent application number is CN202610331589 20260318. The patent publication number..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Xinxin Hangtu Suzhou Tech Co Ltd has submitted a patent application for Data Processing Circuit, Method, Device and Integrated Circuit. Chen Baigang developed the invention.
The patent application number is CN202411849519 20241216. The patent publication number is CN122264071 (A). International Patent Cla..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has received KCC Corporation patent application for Liquid Filler for Semiconductor. Lee Dong Yul, Kang Hong Gu, Lee Kyung Hwan and Lee Hwan Hee developed the invention.
The patent application number is KR20230108176 20230818. The patent publication number is KR20250026990 ..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Mingyixin Jiangsu Intelligent Equipment Co Ltd has filed a patent application for Visual Inspection Method for Chip Lead Bonding Appearance Quality. This invention was developed by Hu Hong, Tong Haojie, Zhu Weijie, Shi Pengjun, Xie Meiqi, Xue Wei and Jiang Hongliang.
The patent application number is CN202..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Shenzhen Xinyichang Technology has filed a patent application for Method and Device for Detecting Electrode Polarity of Chip. This invention was developed by Chen Wang, Zhou Zan, Li Huan and Li Guojing.
The patent application number is CN202610243274 20260228. The patent publication number is CN122265164 (A..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Hefei Ingenic Technology patent application for Method for Realizing Dilated Convolution Based on Chip Not Supporting Dilated Convolution. The invention was developed by Liu Zihang.
The patent application number is CN202411905697 20241223. The patent..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Guangdong Changxing Semiconductor Technology has filed a patent application for Memory Chip Three-dimensional Stacking Integrated Packaging Interconnection Method and System. This invention was developed by Zhang Zhiqiang, Lu Guanhua and Guo Donglin.
The patent application number is CN202610305744 20260313...
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Lam Research has submitted a patent application for Showerhead with Components Removably Coupled to Each Other. This invention was developed by Lafferty William, Platt Thomas M, Batzer Rachel E, Durbin Aaron and Madrigal Kevin.
The patent application number is CN20248074310 20240918. The patent publication ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Lam Research has sought patent for Showerhead Comprising Plurality of Plenum Chambers and Panel Having Central Gas Distribution Port. This invention was developed by Garg Atul Kumar, Lid Gary B, Shivalinggowda Arun Kumar Hosur, Kondiandarao Sushanth and Birru Krishna.
The patent application number is CN2024..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Applied Materials has submitted a patent application for Multi-stream Gas Circuit, Chamber Fitting, Processing Chamber, and Related Apparatus and Method for Semiconductor. Dubey Abushek, Sanchez Errol Antonio C, Zhu Zuoming, Lau Shu-kwan and Moradia Alla developed the invention.
The patent application numbe..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Biedarmansino SA patent application for Packaging Material for Perovskite-based Solar Cell. This invention was developed by Bonaccorso Francesco, Belani Sanjay, Zappia Michael I and Gabitel Laurent.
The patent application number is CN20248061256 202..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Polyamide Advanced Mat Co Ltd has sought patent for Polyimide Precursor Including Eco-friendly Solvent and Polyimide Film Prepared Therefrom Having Excellent Substrate Adhesion and Excellent Heat Resistance Characteristics. This invention was developed by Park Jun-chul, Kim Sung-yeol, Park Se Joo, Lee Ik-san..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Shenzhen Bochuang Jingcai Tech Co Ltd patent application for Chip Mounter and Chip Mounting Method. The invention was developed by Luo Shengsheng and Ma Junping.
The patent application number is CN202610638392 20260511. The patent publication numbe..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Shenzhen Xinaoxun Tech Co Ltd has applied Chinese patent for Chip Multi-station Cooperative Automatic Packaging Equipment. Yan Xiaofeng, Yu Erhu, Zhang Haichao and Wang Fang developed it.
The patent application number is CN202610306173 20260313. The patent publication number is CN122248713 (A). Internatio..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Applied Materials has submitted a patent application for Light Emitting Plasma for Activation in a Processing Chamber and Related Apparatus and Methods. This invention was developed by Rastegar Abbas.
The patent application number is CN20248075628 20241115. The patent publication number is CN122270599 (A). ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Takiron Ci Co Ltd has submitted a patent application for Substrate Film for Packaging Film. This invention was developed by Oshima Koki, Mori Keiichi and Sasahara Kazuyoshi.
The patent application number is CN20248075242 20240913. The patent publication number is CN122270515 (A). International Patent Clas..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Takiron Ci Co Ltd patent application for Substrate Film for Packaging Film. The invention was developed by Oshima Koki, Mori Keiichi and Sasahara Kazuyoshi.
The patent application number is CN20248074957 20240913. The patent publication number is C..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Takiron Ci Co Ltd has submitted a patent application for Substrate Film for Packaging Film. Oshima Koki, Mori Keiichi and Sasahara Kazuyoshi developed the invention.
The patent application number is CN20248074955 20240913. The patent publication number is CN122270512 (A). International Patent Classificati..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- SII Printek has submitted a patent application for Head Chip, Liquid Ejecting Head, Liquid Ejecting Recording Apparatus, and Method of Manufacturing Head Chip. Hitoshi Nakayama developed the invention.
The patent application number is CN20248073103 20241127. The patent publication number is CN122270380 (A)...
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Shenzhen Goodix Technology has submitted a patent application for Signal Processing Method, Circuit, Chip and Electronic Equipment. This invention was developed by Peng Jiangyang, Yang Yuqing and Li Bohao.
The patent application number is CN202411913349 20241220. The patent publication number is CN122268332..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Shanghai Chaowei Wuji Electronic Tech Co Ltd has submitted a patent application for Phase Interpolator Linearity Calibration System, Method and Chip. Ding Li developed the invention.
The patent application number is CN202610738814 20260527. The patent publication number is CN122268330 (A). International P..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Jiangsu Maxscend Microelectronics Co Limited patent application for Substrate and Surface Acoustic Wave Multiplexer. This invention was developed by Xie Yuntao, Song Chongxi, Zhou Zheng and Ouyang Xuheng.
The patent application number is CN202610458..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- South China University of Technology has submitted a patent application for Linear Adjustable Capacitive Negative Feedback Amplification Circuit and Bandwidth Expansion Method. Zhao Mingjian, Chen Jiao, Wang Yunfang and Li Shaolong developed the invention.
The patent application number is CN202610239629 2..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Palwonn Electronic Shenzhen Co Ltd patent application for Arbitrary Layer High-density Interconnection Structure and Method Based on Glass Substrate and Pspi. This invention was developed by Li Shaolin, Liu Meng and Su Huayou.
The patent application..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Forehope Semiconductor Ningbo Limited Co patent application for 2.5 D Bridging Packaging Structure and 2.5 D Bridging Packaging Method. The invention was developed by Xu Yupeng.
The patent application number is CN202610711970 20260522. The patent p..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Forehope Semiconductor Ningbo Limited Co has submitted a patent application for 2.5 D Bridging Packaging Structure and 2.5 D Bridging Packaging Process. He Zhenghong, Zhong Lei, Jian Zhihong and Xu Yupeng developed the invention.
The patent application number is CN202610711964 20260522. The patent publica..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Prilit Optronics has submitted a patent application for Heavy Industry System and Flip Chip Assembly. This invention was developed by Wong Tsz Yan, Li Xingying and Wu Bingsheng.
The patent application number is CN202411838424 20241213. The patent publication number is CN122249068 (A). International Patent C..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Shenzhen Geyi Juchuang Integrated Circuit Co Ltd, GigaDevice Semiconductor, Silead, Suzhou Furuisi Information Tech Co Ltd, Hefei Geyi Integrated Circuit Co Ltd, Etown Mem Tek Ltd Xi'an and Shanghai Geyi Electronics Co Ltd patent application for Lead F..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Forehope Semiconductor Ningbo Limited Co patent application for 2.5 D Bridging Packaging Method and 2.5 D Bridging Packaging Structure. This invention was developed by Xu Yupeng.
The patent application number is CN202610711965 20260522. The patent p..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Intel has applied Chinese patent for Bottom-up Electroplating of Glass Vias. Kandanur Shankar S, Rahman Muhammad M and Pittambaram Subramanian Venkata Ramanan developed it.
The patent application number is CN202511675708 20251116. The patent publication number is CN122249058 (A). International Patent Classi..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has received South China University of Technology patent application for Laser Direct Writing Embedded Liquid Cooling Chip with Manifold Structure and Preparation Method Thereof. Zhou Xiaoyu, Pan Minqiang and Li Chao developed the invention.
The patent application..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Dongguan Qiyang Hardware Co Ltd has applied Chinese patent for Heat Dissipation Packaging Structure for High-power-density IGBT (Insulated Gate Bipolar Translator) Module. Zhang Changhua developed it.
The patent application number is CN202610445607 20260407. The patent publication number is CN122249051 (A..
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