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Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- Sinoma Advanced Nitride Ceram Co Ltd has submitted a patent application for Electrode Welding Structure for Ceramic Heater. This invention was developed by Sun Feng, Gao Youshuai, Wang Lu, Lu Xiangrong, Wei Zicheng, Liang Xi, Wang Yufeng, Li Yang, Li Xingli and Huang Shuo.
The patent application number is C..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has released Jiangsu Kaiweitesi Semiconductor Tech Co Ltd patent application for Semiconductor Part Heater Cleaning Method. This invention was developed by Yan Wangxue, Zhu Wenjian, Jin Puyun, Li Weidong, Ding Ruihua, Chen Kaiqing, Gui Chuanshu and Xue Hongyu.
The..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- Li Zhouwen has been granted a patent for Infrared Light and Water Drop Heat Energy Electric Wave Generator Hand Tool.
The patent application number is CN202422380362U 20240929. The patent publication number is CN223404284 (U). International Patent Classification codes are A61N5/00 and A61N5/06.
The abs..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Siping Jihua Advanced Tech Co Ltd has submitted a patent application for Gate Thick-film Resistor and Preparation Method Thereof, and IGBT (insulated Gate Bipolar Translator) Power Module. Zhang Feilin, Wang Xu, Chen Xuelin, Liao Weiqiang, Liu Dongsheng, Yang Dongdong, Wei Na, Wu Changhao, Lu Dan and Gu Chunhu..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has published Zhuhai Injoinic Semiconductor Co Ltd patent application for Multi-split Shared Cable Circuit. The invention was developed by Feng Zihao, Zhou Jiajun and Huang Jinzan.
The patent application number is CN202510619833 20250514. The patent publication nu..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has published Zhejiang Univ Jinhua Research Institute patent application for Low-power-consumption Battery Power Supply Circuit and Method. The invention was developed by Zhao Bo, Du Xiangping, Zheng Mingjun, Zhang Hua and Pan Yun.
The patent application number is..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Hejian Tech Suzhou Co Ltd has sought patent for Method for Etching Thin-film Resistor on Aluminum Wire Etching Machine. This invention was developed by Yang Yang and Ma Lixia.
The patent application number is CN202410171652 20240206. The patent publication number is CN120452966 (A). International Patent Cla..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Anstem Co Ltd has submitted a patent application for Semiconductor Device and Power Conversion Device. This invention was developed by Takagi Yusuke and Kaneko Yujiro.
The patent application number is CN20238089572 20230127. The patent publication number is CN120457541 (A). International Patent Classificati..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Ruishi Chuangxin Shenzhen Semiconductor Co Ltd has submitted a patent application for Differential Power Amplifier, Power Amplifier and Radio Frequency Front-end Module. This invention was developed by Su Li, Hu Zijie, Pu Tianhong, Huang Jianbo and Ni Jianxing.
The patent application number is CN20251034229..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Chengdu Lingtong Semiconductor Co Ltd has submitted a patent application for Reconfigurable Current Multiplexing Radio Frequency Amplifier Circuit. Yi Yuanzhang and Liu Min developed the invention.
The patent application number is CN202510543701 20250428. The patent publication number is CN120454650 (A). In..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Zhongke Yichuang Guangzhou Tech Co Ltd has sought patent for Embedded Hybrid Parallel Power Module Packaging Structure, Packaging Method and Main Drive Inverter. This invention was developed by Hu Biao, Li Yong, Li Lili, Liu Shilei and Ren Guanghui.
The patent application number is CN202510515828 20250423. ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has released Gongmo Semiconductor Tech Suzhou Co Ltd patent application for Switching Control Method Suitable for Bypass Switch in Charging and Discharging Process of Series Battery Pack System. This invention was developed by He Jie, Yao Suyi, Wang Langyuan, Xiao Zh..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Cambridge Nitride Devices Inc has submitted a patent application for Hybrid Material Power Device and Driving Circuit. This invention was developed by Udrea Florin, Neves Phil and Efthymiou Loizos.
The patent application number is CN20238089612 20231228. The patent publication number is CN120457793 (A). Int..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Hefei Xince Semiconductor Co Ltd has received a patent for Cleaning Device for Probe Card. This invention was developed by Su Tao, Yin Xiaohan and Zhang Fuliang.
The patent application number is CN202422584832U 20241025. The patent publication number is CN223405531 (U). International Patent Classification c..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Shanghai Fangcheng Microelectronic Co Ltd has sought patent for Low-noise Ring Oscillator. This invention was developed by Xu Haojie and Zeng Lei.
The patent application number is CN202510531997 20250425. The patent publication number is CN120454717 (A). International Patent Classification codes are H03K19/..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has published Tianshui Tianguang Semiconductor Co Ltd patent application for Operational Amplifier and Electronic Equipment. The invention was developed by Li Yang, Wang Haoming, Li Yinglong, Zhang Lingling, Dong Hemin, Zhang Kai, Liu Huan, Xin Rongzu and Huang Zitao..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Hynetek Semiconductor Co Ltd has submitted a patent application for Zero-crossing Commutation Control Method, Electronic Equipment and Storage Medium. This invention was developed by Cui Yao, Liu Xiang, Xie Renjian and Ou Yingyang.
The patent application number is CN202510590067 20250508. The patent publica..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Xintong Semiconductor Tech Xiamen Co Ltd has submitted a patent application for Image Positioning Method and Electronic Equipment. This invention was developed by Zhou Xiang and Liu Bo.
The patent application number is CN202510621216 20250514. The patent publication number is CN120451272 (A). International ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Ruishi Chuangxin Shenzhen Semiconductor Co Ltd has applied Chinese patent for Radio Frequency Front-end Module and Electronic Equipment. Zhang Lei, Fang Xinwei, Ma Zhurong, Hu Zijie and Ni Jianxing developed it.
The patent application number is CN202510383777 20250328. The patent publication number is CN120..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has released Guangzhou Xingsen Semiconductor Co Ltd patent application for Embedded Element Circuit Board Preparation Method, Circuit Board and Electronic Equipment. This invention was developed by Lin Siwen, Cui Zhuo and Chen Zongyuan.
The patent application numb..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Suzhou Juqian Semiconductor Co Ltd has submitted a patent application for Silicon-based Capacitor and Manufacturing Method Thereof. Huang Zilun, Cheng Weiqi and Jiao Shilong developed the invention.
The patent application number is CN202510633216 20250516. The patent publication number is CN120456570 (A). I..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Zhejiang Jingxin Lyuzuan Tech Co Ltd and Zhejiang Jingsheng Mechanical & Electrical for Mocvd Coating Device. Zheng Lixia, Fu Chunlei and Kang Yajun developed the invention.
The patent application number is CN202422878654U 20241125. The pat..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Hubei Lixin Semiconductor Co Ltd has sought patent for Vertical Type Homodromous Bridge Rectifier. This invention was developed by Zhang Shengjun and Zhang Jinyu.
The patent application number is CN202510589621 20250508. The patent publication number is CN120453255 (A). International Patent Classification c..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Hefei Xince Semiconductor Co Ltd has been granted a patent for Light Source Jig for Testing Light Sensation Product. Zhao Kai, Sun Zhaofan and Su Huating developed the invention.
The patent application number is CN202422651024U 20241031. The patent publication number is CN223406807 (U). International Patent..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Xinmengda Semiconductor Tech Jinan Co Ltd has submitted a patent application for Mainboard Assembly for Memory Component Testing and Method of Using Same. Pu Bide and Yin Heguo developed the invention.
The patent application number is CN202510529885 20250424. The patent publication number is CN120452519 (A)..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Sichuan Qimingxin Semiconductor Tech Co Ltd has submitted a patent application for Simplified Passive Cross Modulation Detection and Elimination Method and System. This invention was developed by Li Yangyang, Liang Hongming and Guo Rui.
The patent application number is CN202510594973 20250509. The patent pu..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Chinese Patent for Automatic Solder Ball Adding Device has been issued to Guangdong Hongqixin Intelligent Equipment Co Ltd. This invention was developed by Luo Houyong and Wu Peng.
The patent application number is CN202422232333U 20240912. The patent publication number is CN223406148 (U). International Pate..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Shenzhen East IC Tech Co Ltd has submitted a patent application for Miniature Chip Packaging Structure with Hybrid Wire Bonding and Packaging Method. This invention was developed by Lin Ziliang, Fang Zhiwu, Fang Liwen and Long Jie.
The patent application number is CN202510527648 20250425. The patent publica..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Shanghai Quansheng Printing Co Ltd has submitted a patent application for Dispensing Device for Integrated Circuit Board Production and Processing. This invention was developed by Liu Tao.
The patent application number is CN202510936040 20250708. The patent publication number is CN120456439 (A). Internation..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Shenzhen Amedia Tech Co Ltd has submitted a patent application for Dynamic Underclocking Protection Method and Device During Overheating of Set Top Box Chip. This invention was developed by Yang Bo, Jiang Sai, Kuang Junlu, Shi Changhe, Feng Feng and Mao Fei.
The patent application number is CN202510934700 2..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Gowin Semiconductor Corp Ltd has submitted a patent application for Method and Device for Converting SLVS-EC to C-PHY Interface and Integrated Circuit Chip. Chen Zhuwen, Zheng Chuanlin, Guo Siwei, Liu Jiajun and Liu Haisheng developed the invention.
The patent application number is CN202510481466 20250416. ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Nationz Technologies Inc has submitted a patent application for Signal Calibration Module, Analog-to-digital Converter, Chip and Signal Calibration Method. Shi Daolin and Zhao Hui developed the invention.
The patent application number is CN202410173845 20240207. The patent publication number is CN120454719 ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Tuoer Microelectronics Co Ltd has submitted a patent application for Multi-loop Control DC-DC Conversion Circuit and Chip. Mu Siyu and Shi Pengju developed the invention.
The patent application number is CN202510601601 20250512. The patent publication number is CN120454486 (A). International Patent Classifi..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- 3peak Incorporated has submitted a patent application for Charging System and Charging Chip. This invention was developed by Cao Jianwen and Zhang Yongyu.
The patent application number is CN202510622148 20250514. The patent publication number is CN120454258 (A). International Patent Classification code is H..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Chengdu Yicheng Integrated Circuit Co Ltd has submitted a patent application for Glass Core Plate, Chip Packaging Structure and Preparation Method of Glass Core Plate. Liu Xinghua, Zhang Kang and He Tianhao developed the invention.
The patent application number is CN202510677605 20250526. The patent publica..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Shenzhen Liande Semiconductor Tech Co Ltd has submitted a patent application for Transfer Device and Semiconductor Processing Equipment. Ye Weile, Xiao Kangnan, Lai Taixin and Li Lihui developed the invention.
The patent application number is CN202510528101 20250425. The patent publication number is CN12045..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- Ningbo Yunde Semiconductor Mat Co Ltd has submitted a patent application for Cleaning Method and Cleaning Device for Polished Silicon Part. This invention was developed by Lu Xubin, Huang Haiou, Cai Xinyu and Xu Hongfei.
The patent application number is CN202510642442 20250519. The patent publication number..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- Univ Shenzhen Polytechnic has submitted a patent application for Liquid Inlet Device for Micro-fluidic Chip. This invention was developed by Ouyang Zhihuang, Xue Yan, Guo Li, Liu Chenyang, Lu Weiming, Ji Qiutong, Tang Ju, Tang Chenyi, Zhu Laixi, Lin Ye and Tan Luyao.
The patent application number is CN20251..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- Cygnus Biosciences Beijing Co Ltd has submitted a patent application for Gene Chip and Reuse Method Thereof. Wan Mingming, Qiao Shuo, Duan Haifeng and Wang Shujin developed the invention.
The patent application number is CN202410174644 20240207. The patent publication number is CN120460033 (A). Internationa..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Guangdong Xincheng Hanqi Semiconductor Tech Co Ltd has submitted a patent application for Novel Micro Bump Structure Forming Method and Flip Chip Bonding Method. This invention was developed by Ran Qingsong, Hong Ruibin, Xie Sisi, Liu Zhiyun and Yang Huihui.
The patent application number is CN202510507138 2..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Shenzhen East IC Tech Co Ltd has submitted a patent application for BGA Chip Packaging Method. Lin Ziliang, Fang Zhiwu, Fang Liwen and Long Jie developed the invention.
The patent application number is CN202510498526 20250421. The patent publication number is CN120453179 (A). International Patent Classifica..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Cyge Electronic Tech Hunan Co Ltd has submitted a patent application for Method for Preparing Integrated Chip Inductor Without Material Sheet Terminal. This invention was developed by Su Liliang, Su Xueyuan, Song Shuhua, Liu Tao, Liu Di, Liu Mingyang, Long Qingshou and Liu Mingsong.
The patent application n..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- Inst Mechanical Mfg Tech China Acad Eng Physics has filed a patent application for Three-dimensional Magnetic Field Auxiliary Laser Welding Device for Aluminum-based Silicon Carbide. This invention was developed by Liu Yang, Xu Fu, Huang Xuefeng, Li Jialei, Li Ning and Zheng Wenjie.
The patent application n..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- Hubei Yangxin Micron Prec Machinery Co Ltd has filed a patent application for Cutting Device for Wire Harness. This invention was developed by Xiao Dan, Xiao Haiqing and Li Hua.
The patent application number is CN202510695769 20250528. The patent publication number is CN120460635 (A). International Patent C..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- Jinzhou City Jinli Electric Co Ltd has filed a patent application for Surface Treatment Equipment for Silicon Controlled Rectifier Production. This invention was developed by Zheng Jinchun.
The patent application number is CN202510857162 20250625. The patent publication number is CN120460386 (A). Internatio..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Shanghai Leiweihao Intelligent Tech Co Ltd has filed a patent application for Internet of Vehicles Data Abnormity Early Warning System and Method Based on Edge Computing Chip. This invention was developed by Li Xia, Li Fengqi and Ling Yuanyuan.
The patent application number is CN202510804643 20250617. The p..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Qili Semiconductor Shaoxing Co Ltd has filed a patent application for Heat Dissipation Cover with Silicon Substrate Replacing Metal for Heat Conduction. This invention was developed by Xie Jianyou, Wang Jiawei, Zhang Hong and Zheng Lijie.
The patent application number is CN202510652205 20250520. The patent ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Shanghai Belling Co Ltd has filed a patent application for Preparation Method and System of Integrated Circuit Chip and Integrated Circuit Chip. This invention was developed by Yang Xiaolong, Ke Junji, Nie Jiping, Zhang Jin, Lin Sen and Wu Wei.
The patent application number is CN202510639666 20250519. The p..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Qili Semiconductor Shaoxing Co Ltd has filed a patent application for Method for Replacing Novel Design Method of Glass Substrate to Reduce Power Consumption of Super-computing Chip. This invention was developed by Xie Jianyou, Wang Jiawei and Zheng Wenhuang.
The patent application number is CN202510614260 ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Zhejiang Jingke New Mat Co Ltd has filed a patent application for Silver Paste and Solar Cell. This invention was developed by Guo Xiaobo, Tao Yuefei, Ye Zhixian, Zhu Zhening, Xu Ze, Bi Yue and Hu Jiehui.
The patent application number is CN202510941272 20250708. The patent publication number is CN120452883 ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has published Ruishi Chuangxin Shenzhen Semiconductor Co Ltd patent application for Control Circuit and Control Chip of Radio Frequency Front-end Module and Radio Frequency Front-end Module. The invention was developed by Gao Tianbao and Ni Jianxing.
The patent ap..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has published Huachen Xinguang Wuxi Semiconductor Co Ltd patent application for Semiconductor Laser Chip Structure and Manufacturing Method Thereof. The invention was developed by Hou Jida and Wei Ming.
The patent application number is CN202510935055 20250708. The..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has published Nanjing Panda Electronics Co and Nanjing Panda Electronic Equipment Co Ltd patent application for Method for Separating Positive Electrode Active Material and Substrate of Lithium Battery. The invention was developed by Yang Gaojie, Chen Fei and Jiao Pe..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has published Yeyimiao Nanjing Tech Co Ltd patent application for Chip Picking and Positioning Equipment for Chip Packaging. The invention was developed by Cheng Huibin, Tan Shuhuan and Liu Yi.
The patent application number is CN202510663785 20250522. The patent p..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has published Chongqing Zhenbao Tech Co Ltd patent application for Transformer Coupling Plasma Window for Semiconductor Etching Equipment and Preparation Method of Transformer Coupling Plasma Window. The invention was developed by He Qiao, Zhang Jie, Wang Wenbin and ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has published Xinmengda Semiconductor Tech Jinan Co Ltd patent application for Chip or Wafer and System for Detecting Chip or Wafer. The invention was developed by Pu Bide and Yin Heguo.
The patent application number is CN202510525253 20250424. The patent publicat..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has released Cygnus Biosciences Beijing Co Ltd patent application for Gene Sequencing Chip and Preparation Method Thereof. This invention was developed by Wan Mingming, Duan Haifeng, Xin Yu and Qiao Shuo.
The patent application number is CN202410175687 20240207. T..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has released Dongguan Juming Electronic Tech Co Ltd patent application for LED Driving Chip and LED Lamp Strip. This invention was developed by Lin Maoyu, Liang Jianming, Li Ming and Xu Wenlong.
The patent application number is CN202510818250 20250618. The patent ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has released Nanjing Junxin Tech Co Ltd and Runic Tech Limited patent application for Real-time Clock Duty Ratio Calibration Circuit, Real-time Clock Chip and Frequency Divider. This invention was developed by Huang Haiping, Liu Haitao and Zhang Ming.
The patent a..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has released Anhui University and Hefei Zhongke Kingda Vision Technology patent application for Polarity Reinforcement Technology-based Three-node Flip Tolerant Latch Circuit and Chip. This invention was developed by Zhao Qiang, Li Jiaqing, Shi Qi, Pan Dongqing, Hao ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has released Navitas Semiconductor Inc patent application for System and Method for Operating PFC Circuit in Discontinuous/critical Conduction Mode. This invention was developed by Gupta Milind.
The patent application number is CN202510130394 20250205. The patent ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has released State Power Investment Heli Chuangxin Wuxi Tech Co Ltd patent application for Non-contact Monitoring Method for Wafer High-energy Hydrogen Ion Implantation Process. This invention was developed by Wei Naiwei, Wang Yulong, Guo Ruyong, Wang Wanlin and Ge T..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Shaanxi Huaxin Semiconductor Tech Co Ltd has secured a patent on Integrated Circuit Packaging Line Degumming Device. Guo Junfeng, Dan Hanwu and Liu Wentao developed the invention.
The patent application number is CN202422348185U 20240925. The patent publication number is CN223405457 (U). International Paten..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Chengdu Haiguang Microelectronics Tech Co Ltd has applied Chinese patent for Semiconductor Packaging Piece, Heat Dissipation Structure Forming Method and Heat Dissipation Management System. Zhan Yangyang developed it.
The patent application number is CN202510560792 20250429. The patent publication number is..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Hangzhou Xinju Semiconductor Co Ltd has submitted a patent application for Microled Packaging Structure Containing Color Conversion Layer. This invention was developed by Yue Han, Liu Jiaqing, Zhang Guanggeng and Li Qing.
The patent application number is CN202510947924 20250710. The patent publication numbe..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Sapien Semiconductor Inc has applied Chinese patent for Display Driving Device and Method Capable of Controlling Pixel Brightness. Jung Dae Young, Jung Hyun-tae, Kim Do-kyung, Jeon Jong-gu, Lee Keun-taek and Cho In-young developed it.
The patent application number is CN202510891872 20231204. The patent publ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Jiangsu Zhongjing Semiconductor Co Ltd has submitted a patent application for Wafer Carrying Table and Wafer Processing Equipment. This invention was developed by Ma Zhengfang and Zhu Guofeng.
The patent application number is CN202510939914 20250709. The patent publication number is CN120453220 (A). Interna..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Hunan Xiang Yi Laboratory Instr Development Co Ltd for Equipment for Providing Low-temperature Table Top Through Semiconductor Refrigeration. Tang Chunlai, Wu Yurong, Wu Liwen, Li Mulin and Wei Qiang developed the invention.
The patent appl..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- Shanghai Weice Semiconductor Tech Co Ltd has been awarded a patent for Quick Connection Type Suction Head and Auxiliary Wrench Thereof. This invention was developed by Zhang Chengjun.
The patent application number is CN202422853587U 20241122. The patent publication number is CN223406998 (U). International P..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Xiamen Junmoxin Semiconductor Co Ltd has secured a patent on Tool Structure for Machining Core Shaft of Molecular Pump. Bai Xiaoxin, Peng Renqing, Cai Xiangmian, Chen Ruiyong and Chen Zhida developed the invention.
The patent application number is CN202422917576U 20241128. The patent publication number is C..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Jinzhou Jingchen Semiconductor Co Ltd for Split Type Vapor Deposition Gas Inlet Tool. Li Zhuang, Zhang Jiming and Qi Jiaxing developed the invention.
The patent application number is CN202422998804U 20241205. The patent publication number i..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Ordos Longji Photovoltaic Tech Co Ltd has sought patent for Solar Cell and Photovoltaic Module. This invention was developed by Yang Sanchuan.
The patent application number is CN202510955714 20250711. The patent publication number is CN120456671 (A). International Patent Classification codes are H10F19/80, ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Taicang Dingyi Semiconductor Tech Co Ltd for Automatic Plastic Packaging Mechanism. Luo Wenjun developed the invention.
The patent application number is CN202422933626U 20241129. The patent publication number is CN223408299 (U). Internation..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Changzhou Pulansi Semiconductor Mat Co Ltd has been granted a patent for Gas Atomization Metal Powdering Device. This invention was developed by Hu Lei, Jin Xing, He Haixia and Yu Rong.
The patent application number is CN202422917021U 20241128. The patent publication number is CN223406005 (U). International..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Jiangsu Baohong Semiconductor Mat Co Ltd for Clamping Device for Quartz Tube Processing. Zhao Hai and Cui Yahui developed the invention.
The patent application number is CN202422908139U 20241128. The patent publication number is CN223406841..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Xinji Metal Shenzhen Co Ltd has been granted a patent for Electroplated Part Cleaning Device for Electroplating Processing. This invention was developed by Ye Fupeng.
The patent application number is CN20242292775U 20240828. The patent publication number is CN223405519 (U). International Patent Classificati..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Chinese Patent for IC Chip Pressing Device has been issued to Shenzhen Yisenhua Tech Co Ltd. This invention was developed by Meng Zhigang and Zhu Shudan.
The patent application number is CN20242366905U 20241212. The patent publication number is CN223408439 (U). International Patent Classification codes are ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Suzhou Xinshangsi Automation Equipment Co Ltd has been granted a patent for Automatic Cleaning Equipment for Polycrystals on Surface of Wafer. This invention was developed by Yan Bo.
The patent application number is CN202422738449U 20241111. The patent publication number is CN223405463 (U). International Pa..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Hefei Xince Semiconductor Co Ltd for Novel Gravity Type Chip Finished Product Test Sorting Machine. Su Huating, Yin Xiaohan and Huang Min developed the invention.
The patent application number is CN202422585167U 20241025. The patent publica..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Shenzhen Zhongxincheng Microelectronic Co Ltd has received a patent for Chip Selection Equipment for Integrated Circuit Production. This invention was developed by Huang Yingbing and Huang Yinghuan.
The patent application number is CN202422754922U 20241112. The patent publication number is CN223405413 (U). ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Guangxi Xiangsheng Household Material Tech Co Ltd for Wood Chip Winnowing Mechanism. Liang Yibo, Li Siyi, Lu Wenji, Huang Tao, Huang Huiqiang, Chen Yaozhen and Yang Peisheng developed the invention.
The patent application number is CN202422..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Heyuan Xingtong Time Frequency Electronic Co Ltd has been awarded a patent for Diagonal Dispensing Structure for Quartz Crystal Wafer. This invention was developed by Li Liang.
The patent application number is CN202422647656U 20241031. The patent publication number is CN223405240 (U). International Patent C..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Ningxia Hexing Carbon Based Mat Co Ltd has obtained a patent for jet mill for reducing conductivity of silicon carbide. This invention was developed by Gu Wenhua, Lv Hongjun, Gu Xu, Huang Tao, Zhang Zhiming and Ye Qian.
The patent application number is CN202422655265U 20241031. The patent publication number..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Xia Xiaotao for Granulation System for Silicon Carbide Ceramics.
The patent application number is CN202422349415U 20240924. The patent publication number is CN223405009 (U). International Patent Classification codes are B02C23/10, B02C4/08..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Luoxi Medical Tech Hebei Co Ltd and Luoxi Medical Tech Hangzhou Co Ltd for Sample Treatment Device for Protein Chip Detection. Yang Yanfang, Cao Yating and Hu Liang developed the invention.
The patent application number is CN202422801106U 2..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- Suzhou Xingde Electronics Co Ltd has been granted a patent for Transmission Type Semiconductor Substrate Transfer Printing Clamp. Tang Xingjun and Wang Ya developed the invention.
The patent application number is CN202423109167U 20241217. The patent publication number is CN223407648 (U). International Paten..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Jiangsu Finetal Powder Tech Co Ltd for Filtering Device for Spherical Silicon Dioxide Slurry. Liu Ya and Chen Guangrong developed the invention.
The patent application number is CN202422650054U 20241031. The patent publication number is CN2..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- Anhui Linheng Auto Parts Co Ltd has been granted a patent for Plane Machining Process Device for Silicon Material Cutting. This invention was developed by Gu Linfa and Feng Hui.
The patent application number is CN202422233618U 20240912. The patent publication number is CN223407221 (U). International Patent ..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- Shenzhen Xinyizhi Electronics Co Ltd has sought patent for Welding Equipment for Integrated Circuit Board Processing. This invention was developed by Wu Wei.
The patent application number is CN202510793561 20250613. The patent publication number is CN120460835 (A). International Patent Classification codes ..
Semiconductor
| Fri 06 Feb 2026
Beijing, Feb. 7 -- Jiangsu Meike Solar Tech Co Ltd has sought patent for Cooling Liquid Mixing and Conveying Device for Silicon Material Processing. This invention was developed by Wu Jiqing, Wang Yicheng, Zhang Ming, Yang Jun, Xu Yang, Liu Fujie, Ji Mengxia and Xu Hui.
The patent application number is CN202510679014 20250526..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Zhejiang Ruifeng Electronic Tech Co Ltd for Clamp for Chip Testing. Wang Lansong and Tang Guofeng developed the invention.
The patent application number is CN202422681156U 20241104. The patent publication number is CN223406810 (U). Internat..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Hefei Jingweite Electronics Co Ltd for Tuning Fork Type Quartz Wafer Corrosion Device. Dong Shuxia, Li Ting, Zha Xiaobing and Wu Tao developed the invention.
The patent application number is CN202422668563U 20241104. The patent publication ..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Research Micro Jiangsu Semiconductor Tech Co Ltd has been granted a patent for Mixed Air Inlet Device and Semiconductor Manufacturing Equipment. This invention was developed by Qin Zhijian, Gao Peipei, Yan Huaiyu and Zou Xiang.
The patent application number is CN202422929432U 20241129. The patent publicatio..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Taicang Jiewo Hardware Machinery Co Ltd has been awarded a patent for Electroplating Hanger for Electroplating Metal Products. This invention was developed by Wang Xiaodong.
The patent application number is CN202422999541U 20241205. The patent publication number is CN223409763 (U). International Patent Clas..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Chinese Patent for Hanging Tool for Electroplating of Lens Cone of Vehicle-mounted Camera has been issued to Guangdong Tianchong Prec Machinery Co Ltd. This invention was developed by Chen Shunqi, Li Yang and Yang Xiaoqiang.
The patent application number is CN202422950251U 20241202. The patent publication n..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Ningxia Hexing Carbon Based Mat Co Ltd has been awarded a patent for Polishing Sand Blasting Machine for Silicon Nitride and Silicon Carbide Combined Bricks. This invention was developed by Gu Xu, Ye Qian, Chee Sze Keat, Huang Tao and Xu Jiazhen.
The patent application number is CN202422869947U 20241125. Th..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Chinese Patent for Automobile Ornament Electroplating Hanger has been issued to Nanjing Wanou Auto Parts Co Ltd. This invention was developed by Zheng Zhi, Wu Jianping and Shi Min.
The patent application number is CN202422704561U 20241106. The patent publication number is CN223409758 (U). International Pate..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Shandong Semiconductor Res Institute for Semiconductor Electroplating Equipment with Draining and Discharging Functions. Rong Huilin, Li Zhifeng and Li Ru developed the invention.
The patent application number is CN202422740201U 20241111. T..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- Jiangsu Jiecheng Electronic Tech Co Ltd has obtained a patent for metal surface treatment electroplating device. This invention was developed by Wu Zhigang, Zhang Youxia and Zhen Xianxin.
The patent application number is CN202422524740U 20241018. The patent publication number is CN223409754 (U). Internation..
Semiconductor
| Sat 07 Feb 2026
Beijing, Feb. 7 -- State Intellectual Property Office of China has awarded a patent to Huizhou Yunchuang Electronics Co Ltd for Automatic Internal and External Plating Electroplating Equipment. Chen Ke'er and Li Helan developed the invention.
The patent application number is CN202422304490U 20240921. The patent publication nu..
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