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Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Lonten Semiconductor Co Ltd has filed a patent application for SGT MOSFET Device Capable of Reducing Switching Loss and Preparation Method Thereof. This invention was developed by Wang Yu, Yang Le, Feng Jiangxu and Ma Zezhong.
The patent application number is CN202511561312 20251029. The patent publication ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Zhongshan Sirui Tech Co Ltd has submitted a patent application for Wafer-level Surface-mounted Inductor Manufacturing Method and Inductor Device. Zhang Qin developed the invention.
The patent application number is CN202511457040 20251013. The patent publication number is CN121416308 (A). International Paten..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Wuxi Dongyuan Electronic Tech Co Ltd has submitted a patent application for On-line Monitoring System and Monitoring Method for Target Disc Temperature of Ion Implanter and Ion Implanter. This invention was developed by You Yuxin and Hu Mingfeng.
The patent application number is CN202410971544 20240718. The..
Semiconductor
| Tue 26 May 2026
Taipei, May 27 -- Kneron Inc has submitted a patent application for Compute-in-memory Architecture. Law Oscar Ming Kin and Liu Chun-chen developed the invention.
The patent application number is TW20230141947 20231101. The patent publication number is TW202514616 (A). International Patent Classification codes are G06F17/16, G..
Semiconductor
| Tue 26 May 2026
Taipei, May 27 -- Adeia Semiconductor Bonding Technologies Inc has filed a patent application for Direct Bonding Methods and Structures for Dies. This invention was developed by Gao Guilian, Fountain Jr, Mrozek Pawel, Zhang Ron and Mirkarimi Laura Wills.
The patent application number is TW20240132938 20240830. The patent publ..
Semiconductor
| Tue 26 May 2026
Taipei, May 27 -- Acm Research Shanghai Inc, Acm Research Korea Co Ltd and Cleanchip Tech Limited have filed a patent application for Liquid Treatment Device. This invention was developed by Xu Fei, Fu Yu-ze, Yin Hong-he, Wu Jun, Wang Hui and Lee Mark.
The patent application number is TW20240118915 20240522. The patent public..
Semiconductor
| Tue 26 May 2026
Taipei, May 27 -- Service Support Specialties Inc has sought patent for Wafer Handling System and Method. This invention was developed by Hillman Gary.
The patent application number is TW20240133033 20240902. The patent publication number is TW202514885 (A). International Patent Classification codes are B25J9/16 and H01L21/67..
Semiconductor
| Tue 26 May 2026
Taipei, May 27 -- Taiwan Patent Office has released Inergy Tech Inc patent application for Semiconductor Package. This invention was developed by Lin Li-zheng and Wen Lan-wei.
The patent application number is TW20230135942 20230920. The patent publication number is TW202514934 (A). International Patent Classification codes ar..
Semiconductor
| Tue 26 May 2026
Taipei, May 27 -- Taiwan Patent Office has received Ganrich Semiconductor Corp patent application for Semiconductor Device. Chen Chih-hao, Shen Yi-ru and Chang Chao-kai developed the invention.
The patent application number is TW20230135815 20230920. The patent publication number is TW202515333 (A). International Patent Class..
Semiconductor
| Tue 26 May 2026
Taipei, May 27 -- Taiwan Patent Office has released Rayleigh Vision Intelligence Co Ltd patent application for Vertically Stacked Light-emitting Diode Structure. This invention was developed by He Jr-hau, Ye Zhi-ting, Tsai Chun-wei, Lien Der-hsien and Cheng Yuk-tong.
The patent application number is TW20240128614 20240731. Th..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has published Zhang Mingyi patent application for Read-write Method and System of Nonvolatile Memory. The invention was developed by Zhang Mingxin, Zhang Mingyi and Liu Zaiqian.
The patent application number is CN202511613779 20251106. The patent publication numbe..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Shenzhen Jingcun Tech Co Ltd has sought patent for Aging Test System and Method for High-speed Dynamic Random Access Memory. This invention was developed by Liu Hua.
The patent application number is CN20251209655 20251229. The patent publication number is CN121415843 (A). International Patent Classification..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has published Shenzhen Jingcun Tech Co Ltd patent application for Test Method for Memory Particles. The invention was developed by Yang Zufang.
The patent application number is CN20251207957 20251229. The patent publication number is CN121415853 (A). International..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- GigaDevice Semiconductor has submitted a patent application for Operation Method of Memory and Memory. Li Qi and Xu Daqing developed the invention.
The patent application number is CN20241108669 20240725. The patent publication number is CN121415841 (A). International Patent Classification codes are G11C16/..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has published Toshiba Memory patent application for Operational Circuit, Memory System, and Control Method. The invention was developed by Kokubu Naoaki, Iwasa Teruyuki and Yamagishi Toshiyuki.
The patent application number is CN202411776971 20241205. The patent p..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Itest Semiconductor Technology (Yiwu) has submitted a patent application for Read-write Test Method and Device for Memory. This invention was developed by Su Guangfeng and Zuo Debing.
The patent application number is CN202511547102 20251028. The patent publication number is CN121415851 (A). International Pa..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Northeastern University at Qinhuangdao has sought patent for Crystal Dielectric Constant Prediction Method and System Based on Causal Diffusion Model. This invention was developed by Huang Jinghui, Zhao Shiqi, Luan Zhen and Hou Pengqing.
The patent application number is CN202511970300 20251225. The patent p..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Shanghai University Of Engineering Science has applied Chinese patent for Three-dimensional Metamaterial, Unit Structure, Preparation Method and Equipment. Ma Zhaoyipei and Li Jun developed it.
The patent application number is CN202511502542 20251021. The patent publication number is CN121416852 (A). Intern..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Chengdu Yichong Semiconductor has submitted a patent application for Grid Bias Circuit and Level Shifter. Qing Jian and Duan Xindong developed the invention.
The patent application number is CN20251200516 20251229. The patent publication number is CN121417881 (A). International Patent Classification code is..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Beijing Kaiyuan Chip Research Institute has sought patent for Data Transmission Method and Device of Network-on-chip, Slicing Component and Storage Medium. This invention was developed by Zhou Shize, Zhao Huatao, Tang Dan and Bao Yungang.
The patent application number is CN202511983806 20251225. The patent ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Sharp has submitted a patent application for Method Executed by Equipment and Equipment. This invention was developed by Luo Chao and Liu Renmao.
The patent application number is CN20241117651 20240726. The patent publication number is CN121419005 (A). International Patent Classification code is H04W72/1263..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received ChangXin Memory Technologies patent application for Chip Structure and Memory. Wang Peihuan developed the invention.
The patent application number is CN202511543752 20230315. The patent publication number is CN121419230 (A). International Patent Class..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Yangtze Memory Technologies has applied Chinese patent for Semiconductor Device and Preparation Method Thereof, and Storage System. Kong Cuicui, Zhang Kun and Zhou Wenxi developed it.
The patent application number is CN20241100935 20240724. The patent publication number is CN121419248 (A). International Pat..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has published Yangtze Memory Technologies patent application for Semiconductor Structure, Manufacturing Method Thereof and Memory System. The invention was developed by He Zhou and Zhang Gang.
The patent application number is CN20241102049 20240724. The patent pub..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Yangtze Memory Technologies has sought patent for Semiconductor Device and Preparation Method Thereof, and Storage System. This invention was developed by He Zhou, Xiao Meng, Zhang Hao and Zhang Gang.
The patent application number is CN20241104401 20240724. The patent publication number is CN121419250 (A). ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Xincun Technology (Wuhan) has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by He Zumao, Liu Jun and Wu Wenhao.
The patent application number is CN202311844856 20231227. The patent publication number is CN121419257 (A). International P..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received Wuhan Xinxin Semiconductor patent application for Semiconductor Device and Preparation Method Thereof. Qin Yuan, Wu Zezheng, Cheng Shifang, Chen Fei and Huang Shengnan developed the invention.
The patent application number is CN202511373726 20250924. ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Semiconductor Manufacturing International (Shanghai) has submitted a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Si Jin, Fan Yiqiu, Wang Wentai, Chong Ermin and Zhang Haiyang.
The patent application number is CN202410988551 20240722. The patent ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Semiconductor Manufacturing International (Shanghai) has filed a patent application for Semiconductor Device, Forming Method and Gate-all-around Transistor Structure. This invention was developed by Fan Yiqiu.
The patent application number is CN202410996922 20240723. The patent publication number is CN12141..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Wuhan Xinxin Semiconductor has filed a patent application for Semiconductor Device and Forming Method Thereof. This invention was developed by Shi Bo, Wang Min, Geng Wuqian and Xue Guangjie.
The patent application number is CN202511597562 20251103. The patent publication number is CN121419273 (A). Internati..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Inno Saike (Suzhou) Semiconductor has submitted a patent application for Semiconductor Device and Preparation Method Thereof. This invention was developed by Yu Renxu.
The patent application number is CN202511500468 20251020. The patent publication number is CN121419280 (A). International Patent Classificat..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Beijing University has submitted a patent application for Transistor with High On-state and High Switching Speed and Preparation Method Thereof. Sun Wei, Liu Zhihan and Zhao Mengyu developed the invention.
The patent application number is CN202410989145 20240723. The patent publication number is CN121419284..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received Semiconductor Manufacturing International (Shanghai) patent application for Semiconductor Structure and Forming Method Thereof. Si Jin, Hua Wentao, Chong Ermin and Zhang Haiyang developed the invention.
The patent application number is CN202410988595 ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received Hefei Nexchip Integrated Circuit patent application for Semiconductor Device and Manufacturing Method Thereof. Wang Wenzhi and Liu Zheru developed the invention.
The patent application number is CN20251205112 20251229. The patent publication number is..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Superesd Semiconductor Technology has submitted a patent application for Sectional Type Grid-control Darlington Transistor Structure and Manufacturing Method Thereof. This invention was developed by Dong Peng, Shi Nianbo, Zhang Ke and Yang Jian.
The patent application number is CN202511620243 20251106. The ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Intel has filed a patent application for Nanobelt-based Transistor Fabrication Techniques Including a. This invention was developed by Xu Guowei, Zhang Yang, Chu Tao, Zhang Feng, Zhang Kan, Ghani Tahir, Goroncka Oleg, Lin Chun-chieh, Lin Chin-hsu, Yeung Charles W and Hong Tingxiang.
The patent application n..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Bridgelux has submitted a patent application for Photoluminescent Wavelength Conversion Light Emitting Device. This invention was developed by Zhang Jingqiong and Li Yi-qun.
The patent application number is CN202511684408 20251117. The patent publication number is CN121419411 (A). International Patent Class..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Xincun Technology (Wuhan) has submitted a patent application for Memory and Forming Method Thereof. This invention was developed by Chen Bin, Yang Hongxin, Yin Ran, Jin Tong, Gao Jian and Liu Jun.
The patent application number is CN202511339249 20250918. The patent publication number is CN121419551 (A). Int..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Hubei Jiangcheng Chip Pilot Production Services has filed a patent application for De-bonding Method and Bonding Glue. This invention was developed by Wang Song.
The patent application number is CN202511482806 20251016. The patent publication number is CN121419572 (A). International Patent Classification co..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received Laplace Wuxi Semiconductor Technology patent application for Material Transfer Method. Liu Junqing, Gao Jiangang, Xu Feng and Dong Xuedi developed the invention.
The patent application number is CN202511588332 20251031. The patent publication number i..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- GigaDevice Semiconductor has submitted a patent application for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Gao Zhouli.
The patent application number is CN202410994025 20240723. The patent publication number is CN121419660 (A). International Patent Classification ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Inter One Co Ltd has sought patent for Ultra-wide-angle Light Emitting Diode Module. This invention was developed by Na Jung-hoon.
The patent application number is CN20248002662 20240607. The patent publication number is CN121420154 (A). International Patent Classification codes are F21K9/237, F21K9/68, F21..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Applied Materials has submitted a patent application for Movable Central Reflectors for Semiconductor Processing Equipment and Related Systems and Methods. Moradia Alla, Pandey Vishwas Kumar, Washington Lori D and Chopra Saurabh developed the invention.
The patent application number is CN20248038172 20240118...
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has released PPG Industries, Ohio patent application for Composition and Method for Treating a Substrate and Treated Substrate. This invention was developed by Dimigilio John L, Mcmillen Mark W, Essare Stephen L, Rakiewicz Edward F, Han Amy, De La Garza Gustavo Ornel..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Atotech Deutschland GmbH has applied Chinese patent for Method for Activating Surface of Non-conductive or Carbon Fiber-containing Substrate for Metallization. Beier Andreas and Welz Yair developed it.
The patent application number is CN20248043699 20240903. The patent publication number is CN121420089 (A). I..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Nihon Micronics has filed a patent application for Gripping Mechanism and Conveying Device. This invention was developed by Saito Takahiro, Shimoyama Kaemasa and Fukushi Naoki.
The patent application number is CN20248044039 20240614. The patent publication number is CN121419864 (A). International Patent Class..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Qingdao Xinhexin Tech Co Ltd has submitted a patent application for Semiconductor Packaging Structure and Manufacturing Method Thereof. Ni Qingyu, Huang Jiting, Lyu Xianghua and Pan Yingjie developed the invention.
The patent application number is CN20241113616 20240726. The patent publication number is CN1..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received Shandong Baocheng Electronics Co Ltd patent application for Low-temperature Packaging Device of Semiconductor Chip and Packaging Process of Low-temperature Packaging Device. Wang Yongheng, Gu Zaiyi, Zhuang Xuye and Hao Chengde developed the invention.
..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Forehope Semiconductor Ningbo has sought patent for High-density Substrate Packaging Structure and Preparation Method Thereof. This invention was developed by Zhong Lei, Xu Yupeng and He Zhenghong.
The patent application number is CN202511584045 20251031. The patent publication number is CN121419664 (A). Inte..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has released Zhongru Leming Beijing Tech Co Ltd patent application for Chip Packaging Device and Chip Packaging Method. This invention was developed by Yang Gang.
The patent application number is CN202511575605 20251031. The patent publication number is CN12141965..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has published Nanjing Huarui Microchip Co Ltd patent application for Chip Mounting Device for Semiconductor Chip Processing. The invention was developed by Hu Xingzheng and Li Jiayang.
The patent application number is CN202511531391 20251024. The patent publicatio..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Packaging Substrate and Preparation Method Thereof. This invention was developed by Shen Liping.
The patent application number is CN202511746817 20251125. The patent publication number is CN121419652 (A). International Patent Class..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Suzhou Guoxian Innovation Tech Co Ltd has sought patent for Glass Substrate, Preparation Method Thereof and Chip Packaging Structure. This invention was developed by Zhou Yanxu.
The patent application number is CN202511746530 20251125. The patent publication number is CN121419651 (A). International Patent C..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received Suzhou Guoxian Innovation Tech Co Ltd patent application for Chip Packaging Structure, Preparation Method of Chip Packaging Structure and Electronic Equipment. Zhang Wenbin developed the invention.
The patent application number is CN202511739208 20251..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has published Darwin Prec Industry Co Ltd patent application for Substrate and Manufacturing Method of Blind Hole of Substrate. The invention was developed by Liu Chaokai and Lin Qiwei.
The patent application number is CN202511688288 20251118. The patent publicati..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Boxincheng (Chongqing) Semiconductor Technology has submitted a patent application for Manufacturing Method of Package Substrate, Package Substrate, Glass Substrate and Electronic Device. Yang Lin, Wang Chaoqun and Yu Bing developed the invention.
The patent application number is CN202511587431 20251031. The ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received Shenzhen Tupozhe Tech Co Ltd patent application for Lead Frame Processing Equipment for Semiconductor. Wang Jihua, Xiao Xiaogang, Liao Xiangwei, Peng Xianjue, Zhou Jiaming and Pan Zhongfu developed the invention.
The patent application number is CN202..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Infineon Technologies has sought patent for Method for Producing Molded Electronic Device. This invention was developed by Bayer Christoph, Wetzel Stefan, Bohm Markus, Scharf Thorsten and Treu Josef.
The patent application number is CN202510985231 20250717. The patent publication number is CN121419636 (A). In..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Nanjing Nenglixin Tech Co Ltd has submitted a patent application for Power Semiconductor Packaging Structure. Li Jiayu and Long Teng developed the invention.
The patent application number is CN202511704582 20251119. The patent publication number is CN121419626 (A). International Patent Classification codes ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Wuhan Shantuo Microelectronics Co Ltd has submitted a patent application for Heat Dissipation Substrate and Preparation Method Thereof, and Semiconductor Power Module. Chiang Wei-shih and Liu Hongchao developed the invention.
The patent application number is CN202511571616 20251030. The patent publication n..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Hangzhou Fuxin Semiconductor has submitted a patent application for STI Structure and Manufacturing Method Thereof, and Semiconductor Device and Manufacturing Method Thereof. Wang Zhigang developed the invention.
The patent application number is CN202511484081 20251016. The patent publication number is CN12..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received Shanghai Cheyitian Technology patent application for Process End Point Detection Method and Semiconductor Equipment. Zhang Nannan, Zhang Liming, Yun Yanwu and Ren Congqun developed the invention.
The patent application number is CN202511983433 20251226...
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has released Xinlian Yuezhou Integrated Circuit Manufacturing (Shaoxing) patent application for Method for Detecting Morphology of Semiconductor Groove. This invention was developed by Song Shaokun, Han Tingyu and Wang Jue.
The patent application number is CN2025115..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Gaize Precision Tech Suzhou Co Ltd has filed a patent application for Vacuum Detection Equipment for Wafer. This invention was developed by Zhou Yichu, Ren Jie, Lu Lijun and Liu Lili.
The patent application number is CN202511791451 20251201. The patent publication number is CN121419604 (A). International Pa..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Shanghai Unique Test Tech Co Ltd has submitted a patent application for Layout of 32-site Translation Type CIS (contact Image Sensor) Chip Sorting Machine. This invention was developed by Chen Long, Han Lufeng, Liu Yongfeng, Wang Huanlong, Xia Cheng, Yan Hefei, Shao Zhipei and Yu Jiajun.
The patent applicat..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Sushi Yite Shanghai Testing Tech Co Ltd has applied Chinese patent for Local Layer Removing Method for Chip. Huang Zhiguo, Zhang Wenling and Wang Weibing developed it.
The patent application number is CN202511481331 20251016. The patent publication number is CN121419601 (A). International Patent Classificat..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has released Hwatsing Beijing Tech Co Ltd patent application for Substrate Processing Apparatus, Cleaning Apparatus, and Cleaning Method. This invention was developed by Xu Juncheng and Liu Fusheng.
The patent application number is CN202511999350 20251229. The pat..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has published BOE Huacan Optoelectronics Guangdong Co Ltd patent application for Transfer Substrate and Transfer Method of Light-emitting Device, Light-emitting Device and Display Panel. The invention was developed by Xiong Ziyang, Yu Bing, Zhang Wei and Wu Zhihao.
..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Sanhe Jianhua High Tech Co Ltd has submitted a patent application for Efficient Wafer Pre-alignment Device. This invention was developed by Yang Jian, Zhou Hao, Wang Jinrui and Luo Yang.
The patent application number is CN202511438324 20251010. The patent publication number is CN121419590 (A). International..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received Shanghai Tour U Tech Co Ltd patent application for Conversion Device for Thinned Wafer Transfer Box. Yan Gaofei, Li Jie, Li Shouyin, Han Pengshuai and Ge Linfeng developed the invention.
The patent application number is CN202511858739 20251210. The pa..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Fujian Jinshi Energy Co Ltd has submitted a patent application for Silicon Wafer Basket Conveying System. Liang Xiaoyang, Lian Xiaohong, He Weilin and Tao Wenqiang developed the invention.
The patent application number is CN202511468637 20251015. The patent publication number is CN121419586 (A). Internation..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Shenzhen Jinleiman Tech Co Ltd has filed a patent application for Communication Module Chip Packaging and Welding Device and Method Thereof. This invention was developed by Lei Zhiyong and Pang Rui.
The patent application number is CN202511641422 20251111. The patent publication number is CN121419583 (A). I..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received State Power Investment Heli Chuangxin Wuxi Tech Co Ltd patent application for Irradiation Platform and Transmission Device for Wafer Proton Irradiation Process and Irradiation Process. Shen Xuanyu, Jiang Xin, Guo Ruyong, Gong Heli, Wei Naiwei, Wang Yulon..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Zhengpai Tech Ningbo Co Ltd has submitted a patent application for Monitoring Method and Monitoring Wafer for Laser Annealing Process. Huang Xing developed the invention.
The patent application number is CN202511597967 20251103. The patent publication number is CN121419580 (A). International Patent Classifi..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Shenzhen Borfeet Tech Co Ltd has submitted a patent application for Automatic Wafer Expanding Structure. Sun Yong, Xu Zhigang, Liu Yimin and Yang Qisheng developed the invention.
The patent application number is CN202511572120 20251030. The patent publication number is CN121419579 (A). International Patent ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Hubei Yuxun Communication Tech Co Ltd has sought patent for PLC Chip Packaging Stress Dynamic Balance Control Method and System. This invention was developed by Xiao Leijun and Fu Lili.
The patent application number is CN202511497406 20251020. The patent publication number is CN121419573 (A). International ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Shandong Moke Intelligent Tech Co Ltd has submitted a patent application for Automatic Substrate Lead Bonding Production Line. This invention was developed by Ding Mingzhi, Wang Qingyu, Liu Jianbo and Xue Yongkang.
The patent application number is CN202511434960 20251009. The patent publication number is CN..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- ACM Research, Shanghai; Acm Res Korea Inc; Qingxin Tech Co Ltd has submitted a patent application for Substrate Heat Treatment Apparatus, Heat Treatment Method, and Coating and Developing Apparatus. This invention was developed by Wu Jun, Xu Fei, Na Hongliang, Wang Hui and Lee Kang-sik.
The patent applicati..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has published Suzhou Gaoxin Zhongke Semiconductor Co Ltd patent application for Cleaning Device for Semiconductor Manufacturing Process. The invention was developed by Zhang Zhen, Zhang Xianfu and Xia Weichao.
The patent application number is CN202511534040 202510..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received Taiwan Semiconductor Manufacturing patent application for Integrated Circuit Package and Method of Manufacturing Same. He Yizhen, Huang Haoyun and Xu Xiangcheng developed the invention.
The patent application number is CN202511319717 20250916. The paten..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has released Zhejiang University patent application for Device for Etching Semiconductor Atomic Layer by Atomic Layer in Air Environment and Etching Method. This invention was developed by Zhu Wule, Sun Qi, Wu Sidong, Jia Bingchun, Zhao Ruochen, Li Yuelong, Zhen Zong..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has published Chongqing Weitesen Electronic Tech Co Ltd and Wuxi Xichan Microchip Semiconductor Co Ltd patent application for Longitudinal Uniform Doping Ion Implantation Method. The invention was developed by Liu Min.
The patent application number is CN2025115027..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has released Tianhe Solar Dongtai Photoelectric Co Ltd and Trina Solar patent application for ALD Deposition Method and Solar Cell. This invention was developed by Ma Binglong, Sun Yalong, Bai Haolei, He Zaoyang and Huang Jian.
The patent application number is CN2..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has released Beijing BOE Technology Development and BOE Technology Group patent application for Phase Change Switch Structure, Array Substrate and Display Device. This invention was developed by Tan Qiuyun and Meng Hu.
The patent application number is CN2024110156..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Chint New Energy Technology has submitted a patent application for Preparation Method of Transparent Conductive Oxide Layer and Solar Cell Structure. Li Zijia, Chen Koucheng, Li Xiaowei, Jia Zhen, Wang Shumao and Wang Wensong developed the invention.
The patent application number is CN202410999747 20240724. T..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Japan Display has filed a patent application for Mother Substrate for Display Device. This invention was developed by Yanagisawa Syou, Imai Nobuo and Ogawa Hiroshi.
The patent application number is CN20251100036 20250721. The patent publication number is CN121419477 (A). International Patent Classification co..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has published Shenzhen Weineng Semiconductor Tech Co Ltd patent application for Secondary Packaging Led Transparent Film Screen Production Process. The invention was developed by Li Jie and Xie Yunpei.
The patent application number is CN202511929095 20251219. The ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Leiyu Optoelectronics Tech Suzhou Co Ltd has submitted a patent application for Micro Led Micro-display Chip and Manufacturing Method Thereof. This invention was developed by Zhang Xu, Chong Wing Cheung and Lu Ziyuan.
The patent application number is CN202511432053 20250930. The patent publication number is..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Jiangsu Banruo Electronic Ind Co Ltd has filed a patent application for High-power Led Packaging Structure. This invention was developed by Yang Xiaoliang, Feng Anmin, Ma Jiazheng, Chen Wei and Tang Ning.
The patent application number is CN202511312429 20250915. The patent publication number is CN121419409 ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has published Shenzhen Youming Photoelectric Co Ltd patent application for Led Packaging Structure and Manufacturing Process Thereof. The invention was developed by He Zhinian, Yu Kaihua, Wu Xuejian, Zhou Bo, Xu Zhao, Cheng Yinshan and He Min.
The patent applicati..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received Xiamen Yinke Qirui Semiconductor Tech Co Ltd patent application for Led Epitaxial Wafer Growth Method Capable of Reducing Warpage. Zhang Yinqiao, Zhou Shan, Zeng Shiyu, Wu Zhipeng, Ye Qianqian and Wang Jianhong developed the invention.
The patent appl..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has received Jiangxi Qianzhao Photoelectric Co Ltd patent application for Light-emitting Epitaxial Wafer, Preparation Method Thereof and Semiconductor Light-emitting Device. Wang Yue, Cui Xiaohui, Yang Tianzhi, Yuan Jian, Liu Zhao and Wang Yedong developed the invent..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Yangzhou University has submitted a patent application for Photon Multiplication Perforated Back Contact Solar Cell and Preparation Method Thereof. This invention was developed by Wang Qinqin, Guo Kaiyuan, Wu Wangping and Ding Jianning.
The patent application number is CN202511590400 20251103. The patent publ..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Junfeng Solar Energy Jiangsu has submitted a patent application for Monocrystalline Silicon Wafer Assembly Capable of Efficiently Absorbing Light. This invention was developed by Sun Tao, Sun Helan, Zhao Changli, Hu Shen and Chen Guojun.
The patent application number is CN202511600780 20251104. The patent p..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Xiamen Yinke Qirui Semiconductor Tech Co Ltd has sought patent for Manufacturing Method of Thin Film Solar Cell with Low Warping Degree. This invention was developed by Ye Weimin, Liu Biaohuang, Lu Wei, Chu Kecheng and Chen Xingyu.
The patent application number is CN202511982750 20251226. The patent publica..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Zhejiang Guyue Longshan Electronic Tech Development Co Ltd has submitted a patent application for Optocoupler Packaging Structure and Packaging Process. This invention was developed by Zhang Jiping, Schling, Wang Ya, Xia Qi, Zhou Min, Chen Hongxia, Wang Zihan and Han Junjun.
The patent application number is..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has published Taiwan Semiconductor Manufacturing patent application for Integrated Chip and Forming Method Thereof. The invention was developed by Chen Tingrong, Cai Yijie, Guo Mingyu, Li Zongyu and Shi Zhicheng.
The patent application number is CN202511413143 20250..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- State Intellectual Property Office of China has released Fujian Huixin Laser Tech Co Ltd patent application for Multi-junction Solar Cell and Preparation Method Thereof. This invention was developed by Yan Jingzhou, Liu Zhe, Wu Jianguo, Chen Weisong, Zhang Wenqiang, Xue Ting, Lin Yuxing, Liu Shuo and Mi Dongli..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- Micron Technology has sought patent for Semiconductor Device Having ESD Protection Element. This invention was developed by Matsui Miho, Ishihara Takashi and Momota Haruka.
The patent application number is CN20251115952 20250723. The patent publication number is CN121419333 (A). International Patent Classific..
Semiconductor
| Wed 27 May 2026
Beijing, May 27 -- CSMC Technologies has submitted a patent application for ESD Protection Device and Chip. This invention was developed by Li Liping, Xu Chaoqi and Lin Feng.
The patent application number is CN202410986177 20240722. The patent publication number is CN121419332 (A). International Patent Classification code is H1..
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