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Semiconductor

  |  Wed 24 Jun 2026

Geneva, June 24 -- P&H Tech has sought patent for Organic Compound and Organic Light-emitting Device Comprising Same. This invention was developed by Cho Yeonju, Lee Yukyung and Park Gwan-hee. The patent application number is WO2025KR20568 20251203. The patent publication number is WO2026127498 (A1). International Patent Clas..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Qingdao Hisense Laser Display has sought patent for Laser and Light Source Device. This invention was developed by Zhang Xin, Cong Qifeng and Guo Mengxiao. The patent application number is CN202411291199 20240913. The patent publication number is CN121663315 (A). International Patent Classification codes a..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- NXP has submitted a patent application for Level Shifter Circuit. Sandiford Quinor, Van Der Heijden Joannes Theodorus, Gaikwad Pramod and Behrendt Jane Levi developed the invention. The patent application number is CN202511281428 20250909. The patent publication number is CN121664173 (A). International Pat..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has released Texas Instruments patent application for Method and Apparatus for Constructing Envelope Detector Circuitry for On-off Keying Modulation. This invention was developed by Shrivastava Kumar Anurag and Muda Himanshu. The patent application number is CN20..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Texas Instruments has submitted a patent application for Method and Apparatus for Sensing Isolation Status in Gate Driver Circuitry. This invention was developed by Rao Anil S, Nanyappa Arun B and Stabler Martin. The patent application number is CN202511196967 20250826. The patent publication number is CN1..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Beijing Telemetry Tech Institute has filed a patent application for Pump-driven Two-phase Flow Cooling Loop for High Heat Flow Feed Source. This invention was developed by Yang Zhifu, Lyu Yuanzheng, Zhao Sicheng, Zhao Mingming and Sun Dexin. The patent application number is CN202511535749 20251027. The pat..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has received Hangzhou Dianzi University patent application for High-isolation Dual-band Substrate Integrated Waveguide Filter Crossing Device and Working Method Thereof. Zhu Fang and Yin Zonghao developed the invention. The patent application number is CN20251168..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Multi-layer Focus Ring for Plasma Semiconductor Processing. This invention was developed by Zhao Jinrong and Peng Yulin. The patent application number is CN202511891968 20220825. The patent publication number is CN121662701 (A). ..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Jiangsu Tianxin Micro Semiconductor Equipment has filed a patent application for Plasma Processing Equipment. This invention was developed by Zhang Yuxin and Li Jin. The patent application number is CN202511784028 20251128. The patent publication number is CN121662700 (A). International Patent Classificati..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has released Jiangsu Shenzhou Semiconductor Technology patent application for Device and Method for Monitoring and Adjusting Plasma Load Impedance. This invention was developed by Zhao Jiajia, Yin Qiaoxing, Zhu Peiwen and Chu Tao. The patent application number is..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Toshiba Memory has submitted a patent application for Plasma Processing Apparatus and Method of Manufacturing Semiconductor Device. This invention was developed by Hamaguchi Junichi, Kawaguchi Hiroko and Fukumoto Masayuki. The patent application number is CN202510261541 20250306. The patent publication numbe..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Shenzhen Longsys Electronics has submitted a patent application for Control Device of Memory Chip. This invention was developed by Xie Lingcong, Wu Zheng and Guo Dan. The patent application number is CN202411280633 20240912. The patent publication number is CN121662134 (A). International Patent Classificatio..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Memory Circuit, Memory Device and Method of Manufacturing Same. This invention was developed by Chen Yanhui, Lin Chih-yu, Nian Yixin and Fujiwara Hidehiro. The patent application number is CN202511314530 20250915. The patent publicatio..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Samsung Electronics has sought patent for Memory System, Memory Device, and Operating Method of Memory Device. This invention was developed by Jung Hae-wook, Lee Yeon-jin and Kim Ho-yeon. The patent application number is CN202511219456 20250828. The patent publication number is CN121662109 (A). International..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- SanDisk Technologies has submitted a patent application for Loop Aware Adaptive Programming Voltage Adjustment for Performance Improvement. Moon Dong-il, Chin Howard and Hu Chengqing developed the invention. The patent application number is CN202510464017 20250414. The patent publication number is CN12166210..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Toshiba Memory has submitted a patent application for Semiconductor Memory Device. This invention was developed by Unno Masaki. The patent application number is CN202510225588 20250227. The patent publication number is CN121662100 (A). International Patent Classification codes are G11C16/04, G11C16/06, G11C5..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Yangtze Memory Technologies has sought patent for Memory, Operation Method of Memory, Memory System and Chip. This invention was developed by Fang Shengyang, Jia Xuening and Du Zhichao. The patent application number is CN202411281664 20240912. The patent publication number is CN121662099 (A). International P..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has released FocalTech Systems patent application for Liquid Crystal Panel Rapid Discharging Circuit, Display Driving Integrated Circuit and Method for Avoiding Splash Screen Caused by Sleep Wake-up. This invention was developed by Wu Zhiyao and Wu Weiyu. The paten..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has received Chipone Technology, Beijing patent application for Backlight Driving Method and Device, Chip and Display Equipment. Sun Yanteng, Xu Qifei, Zhang Haichuan and Feng Mei developed the invention. The patent application number is CN202511984051 20251225. Th..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Guangzhou China Star Optoelectronics Semiconductor Display Technology has submitted a patent application for Display Device. This invention was developed by Xiao Jianfeng, Yang Keming, Xiao Wei and Dai Jiahua. The patent application number is CN202411276458 20240911. The patent publication number is CN1216..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Wuhan China Star Optoelectronics Semiconductor Display Technology has applied Chinese patent for Display Device. Duan Yanqiang developed it. The patent application number is CN202511973122 20251224. The patent publication number is CN121661913 (A). International Patent Classification code is G09F9/30. Coop..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Qorvo has submitted a patent application for Low Leakage ESD Protection. This invention was developed by Bender Thorsten and Kuehn Jeffrey C. The patent application number is CN202511232253 20250901. The patent publication number is CN121663410 (A). International Patent Classification codes are H02H3/08 an..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Shengjisheng Ningbo Semiconductor Technology has applied Chinese patent for Assembled Magnet, Semiconductor Equipment and Semiconductor Material Preparation Method. Li Xiaoya developed it. The patent application number is CN202511876667 20251212. The patent publication number is CN121662543 (A). Internationa..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Shandong Huaguang Optoelectronics has applied Chinese patent for Dual-band Semiconductor Laser Device and Preparation Method Thereof. Zhang Xin, Wang Chaowang, Liu Fei and Xu Longmeng developed it. The patent application number is CN202511722973 20251121. The patent publication number is CN121663336 (A). Int..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has received Shandong Huaguang Optoelectronics patent application for Single Transverse Mode Semiconductor Laser with Self-stable Light Mode and Manufacturing Method Thereof. Ren Fuyang, Zhang Xiuping, Liu Bin, Sun Xiao and Zhang Xiaodong developed the invention. T..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Shandong Huaguang Optoelectronics has applied Chinese patent for High-resolution Double-beam Fundamental Transverse Mode Semiconductor Laser Chip. Ren Fuyang, Cui Qingshang, Guo Bin and Hu Xinshu developed it. The patent application number is CN202511752132 20251126. The patent publication number is CN121663..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Shandong Huaguang Optoelectronics has filed a patent application for Efficient Semiconductor Laser Pumping Module. This invention was developed by Sun Sujuan, Jiang Jianmin, Zhu Zhen, Wang Dechao, Wei Xiaofeng and Fu Chuanshang. The patent application number is CN202511818580 20251204. The patent publication..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Chongqing Normal University has submitted a patent application for External Cavity Semiconductor Laser Packaging Structure Based on Tail Fiber Direct Pumping. Jiang Lidan, Zhang Peng, Jiang Maohua, Wang Tao and Zhu Renjiang developed the invention. The patent application number is CN202511817242 20251204. Th..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Yangguang Lechong Technology has sought patent for Gun Lock Control Method, Charging Pile, Gun Lock, Computer Equipment and Chip. This invention was developed by Zhai Jiwen, Yang Qi and Bi Feifei. The patent application number is CN202411275298 20240911. The patent publication number is CN121663259 (A). Inte..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Kunshan Fengjingtuo Electronics has applied Chinese patent for Substrate Structure, Gain Adjustment Module and Communication Equipment. Mao Lijian developed it. The patent application number is CN202411272715 20240911. The patent publication number is CN121663208 (A). International Patent Classification code..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Zhuhai Nanxin Semiconductor Technology has applied Chinese patent for Boost Circuit, Audio Power Amplifier, Chip and Electronic Equipment. Liu Kang, Yang Zhifei, Yang Tao and Yue Zhenbo developed it. The patent application number is CN202511855557 20251209. The patent publication number is CN121663991 (A). I..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has received Infineon Technologies, Austria patent application for Power Factor Correction in Power Converters. Ausseresse Pierrick developed the invention. The patent application number is CN202511287115 20250910. The patent publication number is CN121663973 (A). ..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Lianyungang JARI Electronics has sought patent for High-voltage Gate Driving Chip Integrated with Bootstrap Function and Process Implementation Method Thereof. This invention was developed by Zhang Yu, Hu Zhi, Zhao Lijuan, Liu Zhongchao, Yang Xueying, Zhang Xing, Li Shu, Du Yuying, Shen Menglong and Liu Yiqin..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- Xiamen Ocean Vocational College has submitted a patent application for Dead Zone Adjusting System and Adjusting Method of Half-bridge Driving Chip. This invention was developed by Ren Lianfeng and Jiang Fan. The patent application number is CN202610170058 20260206. The patent publication number is CN12166395..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- China FAW Group has submitted a patent application for Control Circuit, Chip and Method for Synchronous Rectification. This invention was developed by Shi Yanming, Liu Zhiqiang, Wang Yongzhi, Wang Long, Zhong Hua and Meng Qingzhang. The patent application number is CN202511781350 20251129. The patent publi..

Semiconductor

  |  Wed 24 Jun 2026

Beijing, June 24 -- STMicroelectronics International has submitted a patent application for Current Sensing Circuit. This invention was developed by Lecomte Bernard. The patent application number is CN202511298983 20250911. The patent publication number is CN121663941 (A). International Patent Classification codes are G01R19/25..

Semiconductor

  |  Wed 24 Jun 2026

Geneva, June 24 -- World Intellectual Property Organization has published NVIDIA patent application for Object Location Estimation Using Neural Network. The invention was developed by Chi Zhegui, Liu Anqi and Du Jinwei. The patent application number is WO2024CN138451 20241211. The patent publication number is WO2026123243 (A1)...

Semiconductor

  |  Wed 24 Jun 2026

Geneva, June 24 -- NVIDIA has submitted a patent application for System and Method of Emulating Data Types. This invention was developed by Xu Ruqing, Springer Paul, Ootomo Hiroyuki, Gu Hanfeng and Liu Bing. The patent application number is WO2024CN138449 20241211. The patent publication number is WO2026123242 (A1). Internation..

Semiconductor

  |  Wed 24 Jun 2026

Geneva, June 24 -- World Intellectual Property Organization has received LG Chem patent application for Compound and Organic Light-emitting Element Comprising Same. Yoon Jung Min, Hong Sung Kil, Kim Hanna, Lee Jae Tak, Han Su Jin, Heo Dong Uk and Park Jongjin developed the invention. The patent application number is WO2025KR2..

Semiconductor

  |  Wed 24 Jun 2026

Geneva, June 24 -- World Intellectual Property Organization has received Seoul Viosys patent application for Light-emitting Device. Ahn Young Taek and Ryu Seung Ryeol developed the invention. The patent application number is WO2025KR21530 20251212. The patent publication number is WO2026127701 (A1). International Patent Class..

Semiconductor

  |  Wed 24 Jun 2026

Geneva, June 24 -- World Intellectual Property Organization has received GDM Holding LLC patent application for Multimodal Memory for Machine-learned Agents. Yi Xi, Chen Feifan, Andersen Jesper Sparre and Walker Iv developed the invention. The patent application number is WO2025US53241 20251030. The patent publication number ..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Nanjing Yunguang Tech Co Ltd has filed a patent application for Display Panel for Improving Light Emitting Efficiency of OLED (organic Light Emitting Diode) and Preparation Method Thereof. This invention was developed by Jin Xiaohu, Wang Yuhang and Liu Yulong. The patent application number is CN20251190827..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Guangxi Huaxin Zhenbang Semiconductor Co Ltd has filed a patent application for Neuromorphic Computing Chip Based on Single-transistor Synaptic Array. This invention was developed by Fan Yaqiong, Zhang Yanshuo, Wu Rui, Zhao Chun, Liu Yuli and Lai Zelian. The patent application number is CN202511771853 2025..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has published Hubei Zhongsiwei Photoelectric Co Ltd patent application for Led Flip Chip Packaging Structure and Packaging Method Based on Low-temperature Welding Slurry. The invention was developed by Cheng Shengpeng, Shao Xuejiang, He Dang and Cheng Peng. The p..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Chongqing Hanbo Display Tech Research and Development Center Co Ltd has submitted a patent application for Sub-millimeter Light Emitting Diode and Preparation Method Thereof. This invention was developed by Wang Yunliang and Du Fei. The patent application number is CN202410964659 20240903. The patent publi..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Nanjing Visionics Microelectronic Tech Co Ltd has submitted a patent application for Packaging Structure and Packaging Method of Light-sensitive Product Capable of Preventing Light Leakage on Side Surface of Chip. This invention was developed by Jiang Chao, Li Zhonghuan, Yu Kunzhi, Sheng Li, Li Cheng, Li Yuan..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has released Guangdong Aiko Solar Energy Technology Co Ltd, Zhejiang Aiko Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Zhuhai Fushan Aixu Solar Energy Technology and Tianjin Aiko Solar Energy Technology patent application for Back Contact Solar C..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Zhejiang Guiyi New Energy Tech Co Ltd has filed a patent application for Crystalline Silicon Bc Battery Texturing Additive and Texturing Method Thereof. This invention was developed by Peng Li, Cao Xiaan and Zhou Hao. The patent application number is CN202511830724 20251206. The patent publication number i..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has published Suzhou Fangsheng Photoelectricity Shares Co Ltd patent application for Method for Preparing Thin-film Solar Cell by Using Mask and Thin-film Solar Cell. The invention was developed by Nan Peng, Wang Kaili, Hao Puti, Zhang Meie, Zhu Yinghui and Liao Lia..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- The 44th Institute of China Electronics Technology Group Corporation has applied Chinese patent for Miniature Laser Alarm Photoelectric Detection Module with Large Photosensitive Surface 2.5 D Chip Stack and Manufacturing Method of Miniature Laser Alarm Photoelectric Detection Module. Dong Xufeng, Qiu Yangtin..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Angell Tech Shenzhen Co Ltd has submitted a patent application for Anti-esd Enhanced Power Semiconductor Device Based on Groove Structure. Yang Zhixiong, Peng Xin, Feng Hao, Shan Jianan and Liu Yong developed the invention. The patent application number is CN202610120764 20260129. The patent publication nu..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has published Wuxi China Resources Microelectronics Co Ltd patent application for Test Layout Structure of Semiconductor Device, Semiconductor Layout Structure and Manufacturing Method Thereof. The invention was developed by Yang Xiaofang, Guo Chongyong and Jin Xing..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has published Shanghai Yiding Tech Group Co Ltd patent application for Chip Stripping Device and Chip Stripping and Picking System. The invention was developed by Guo Qingda, Ding Hongwei and Ding Shuangwei. The patent application number is CN202511769534 2025112..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Geze Intelligent Control Sensing Tech Shanghai Co Ltd has submitted a patent application for Bernoulli Chuck Capable of Adsorbing Ultrathin Wafer. This invention was developed by Qin Zhijun, Zhou Tingcheng, Zhou Yichu, Ren Jie, Bao Luhong, Wang Yudong and Wang Lei. The patent application number is CN202511..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Shanghai Jet Plasma Tech Co Ltd has applied Chinese patent for Calibration Device and Calibration Method of Wafer Compression Ring Lifting Mechanism. Chai Zitong, Zhang Zhenyu, Yang Ping and Xu Guoqing developed it. The patent application number is CN202511773365 20251128. The patent publication number is ..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has published Xinhui Lianxin Jiangsu Tech Co Ltd patent application for Wafer Bonding Visual System and Wafer Bonding Alignment Method. The invention was developed by Ren Chaoqun, Zhang Qiyuan, Yan Xin, Yu Zhangwei and Chen Zijian. The patent application number i..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has published Hefei Nanuo Semiconductor Co Ltd patent application for Transfer Device for Wafer Positioning and Clamping. The invention was developed by Wang Hao. The patent application number is CN202511872897 20251212. The patent publication number is CN1216659..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has published Mifan Tech Nantong Co Ltd patent application for Feeding Device of Semiconductor Panel-level Forming System. The invention was developed by Ge Chunhua, Tian Jiefeng and Cao Kaizhong. The patent application number is CN202511853354 20251210. The pate..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has received CSG Holding and Yichang CSG Polysilicon Co Ltd patent application for Photovoltaic Silicon Wafer Traceability Method Based on Multi-channel Wafer Inserting, Cleaning and Detecting Equipment. Kinpei, Li Yicheng, Chen Weiguo, He Chuan, Li Pu, Zhou Xiaokan..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Nanjing Yili Xinchuang Semiconductor Tech Co Ltd has submitted a patent application for Semiconductor Chip Packaging Defoaming Device and Packaging Defoaming Process. Chen Mingzhan and Zhang Jingnan developed the invention. The patent application number is CN202511752643 20251126. The patent publication nu..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has received Xiamen Junmoxin Semiconductor Co Ltd patent application for Dry Ice Cleaning Device and Method for Semiconductor Packaging. Chen Zhida, Chen Ruiyong, Bai Xiaoxin, Peng Renqing and Cai Xiangmian developed the invention. The patent application number i..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- K C Tech Co Ltd has filed a patent application for Substrate Cleaning Device and Rotary Chuck of Substrate Cleaning Device. This invention was developed by Kim Hyoung-chul, Li Tonghua and Jung Yu-sun. The patent application number is CN202511209415 20250827. The patent publication number is CN121665964 (A)..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- KC Tech Co Ltd has filed a patent application for Supercritical Substrate Processing Apparatus. This invention was developed by Kim Hyoung-chul and Jung Yu-sun. The patent application number is CN202511209414 20250827. The patent publication number is CN121665963 (A). International Patent Classification co..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- DBS Co Ltd has applied Chinese patent for Substrate Processing Apparatus Mounted with Heating Unit. Lee Taek-youb developed it. The patent application number is CN20251082659 20250120. The patent publication number is CN121665957 (A). International Patent Classification codes are H10P72/00 and H10P72/76. C..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Shanghai Optical Communication Co Ltd has applied Chinese patent for Method for Monitoring Wafer Transfer-out Temperature of Annealing Equipment. Zhou Jin developed it. The patent application number is CN202411238973 20240904. The patent publication number is CN121665950 (A). International Patent Classific..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has published Hwatsing and Hwatsing Beijing Tech Co Ltd patent application for Wafer Ring Bearing Device and Wafer Film Pasting Equipment. The invention was developed by Liu Zhidong, Fu Yongxu, Liu Yuanhang, Zhao Dewen and Li Sen. The patent application number is..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Ultratrend Tech Hangzhou Co Ltd has filed a patent application for Aluminum Nitride Substrate Cleaning Method. This invention was developed by Han Lin, Wang Qikun, Li Xiang, Li Xiao, Lei Dan, You Zhongwei and Wu Liang. The patent application number is CN202511651796 20251112. The patent publication number ..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- The 44th Institute of China Electronics Technology Group Corporation has submitted a patent application for Reconstruction Preparation Process of Compound Wafer. This invention was developed by Huang Xiaofeng, Fan Peng, Liu Cong, Ma Yu, Tan Li, Zhang Yuanyuan, Zhang Tao, Choi Dae-keon, Peng Shiyi and Zhong Ta..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has released Shanghai Lingjing Guangqi Tech Co Ltd patent application for Large-linewidth Deep Trench Planarization Method and Wafer. This invention was developed by Liu Zhigang. The patent application number is CN202511915320 20251218. The patent publication num..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has published Guangdong Aiko Solar Energy Technology Co Ltd, Zhejiang Aiko Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Zhuhai Fushan Aixu Solar Energy Technology and Tianjin Aiko Solar Energy Technology patent application for Silicon Wafer Gette..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has published Suzhou Nanowin Science and Tech Co Ltd patent application for Substrate Structure with Low Dislocation Density and Growing Method and Application Thereof. The invention was developed by Wang Jianfeng, Li Jinjuan, Li Xuan and He Lun. The patent appli..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Beijing Pingtouge Information Tech Co Ltd has submitted a patent application for Method for Forming Capacitor in Packaging Substrate, Packaging Substrate and Packaging Chip. Liu Huan, Pang Tingting, Hu Yong and Chen Yanbin developed the invention. The patent application number is CN202411223662 20240902. T..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Xiamen Semiconductor Industry Tech Research and Development Co Ltd has submitted a patent application for Resistive Random Access Memory and Preparation Method Thereof. This invention was developed by Su Xiaoli, Chen Anqiao and Qiu Taiwei. The patent application number is CN202511926896 20251219. The paten..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Xiamen Semiconductor Industry Tech Research and Development Co Ltd has submitted a patent application for Resistive Random Access Memory and Manufacturing Method Thereof. This invention was developed by Su Xiaoli, Chen Anqiao and Qiu Taiwei. The patent application number is CN202511791535 20251201. The pat..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Nanjing Yunguang Tech Co Ltd has sought patent for Preparation Method of Anode Structure, Silicon-based OLED Device and Display Panel. This invention was developed by Sun Hecheng, Zou Cheng, Yang Xiaoxuan and Yu Xinyang. The patent application number is CN202511877120 20251212. The patent publication numbe..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Nanjing Yunguang Tech Co Ltd has submitted a patent application for Display Panel for Improving Light Emitting Efficiency of OLED (organic Light Emitting Diode) and Preparation Method Thereof. Jin Xiaohu, Wang Yuhang and Liu Yulong developed the invention. The patent application number is CN202511908282 20..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Suzhou Hongan Machinery Co Ltd has submitted a patent application for Method for Detecting and Correcting Center Offset in Wafer Conveying Process. This invention was developed by Xu Danping, Xiong Yiming, Shi Xun, Liu Daqing and Zhu Yue. The patent application number is CN202511928295 20251219. The patent..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Shanghai Zhongke Feice Semiconductor Tech Co Ltd has sought patent for Wafer Detection Control Method, Wafer Detection System and Storage Medium. This invention was developed by Yang Ting, Zhang Pengbin, Chen Lu, Wei Xinhe and Dong Kunling. The patent application number is CN202511716868 20251120. The pate..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Huancheng Intelligent Equipment Chengdu Co Ltd has filed a patent application for Pressure Applying Mechanism for Wafer Bonding and Wafer Bonding Equipment. This invention was developed by Liu Lin, Liu Rui, Xie Jiajian and Lin Zhenzhang. The patent application number is CN202610172054 20260206. The patent ..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Suzhou Sicui Chegui Semiconductor Industry Technology Research Inst Co Ltd has sought patent for Chip Packaging Method and Chip Packaging Structure. This invention was developed by Chu Xuchun, Li Junjie, Shen Xulin, Wang Yu and Xie Guoliang. The patent application number is CN202511948283 20251222. The pat..

Semiconductor

  |  Tue 23 Jun 2026

Geneva, June 24 -- Gebr Schmid GmbH has applied WIPO patent for System for Processing Substrate Surfaces. Götz Harry developed it. The patent application number is WO2025EP86400 20251210. The patent publication number is WO2026125508 (A1). International Patent Classification codes are H05K3/06, H10P72/00 and H10P72/30. Coope..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Zhejiang Chuanghao Semiconductor Co Ltd has submitted a patent application for Packaging Substrate and Manufacturing Method. This invention was developed by Zhong Senxiang, Zhang Qinyuan, Liu Mingsheng, Chen Junqiang and Zhang Shuwei. The patent application number is CN202610156920 20260204. The patent pub..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Xiamen Sky Semiconductor Tech Co Ltd has submitted a patent application for Glass Interposer Stack Substrate with Passive Element and Semiconductor Package Structure. This invention was developed by Zhang Long, Ruan Wenbiao and Yu Daquan. The patent application number is CN20251254439 20251231. The patent ..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has published Zhejiang Chuanghao Semiconductor Co Ltd patent application for Packaging Substrate Processing Method and Packaging Substrate. The invention was developed by Zhong Senxiang, Zhang Qinyuan, Gu Min, Lian Chengjie and Zhang Shuwei. The patent applicatio..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Shandong Longguan Tianxu Solar Energy Co Ltd has filed a patent application for High-strength and High-flatness Glass Substrate for Chip Packaging and Preparation Method of High-strength and High-flatness Glass Substrate. This invention was developed by Xing Yepeng, Tian Yingliang and Qian Qiwei. The paten..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has published Sun Yat-sen University and Sun Yat Sen University Shenzhen patent application for Liquid-cooled Ceramic Substrate with Embedded Micro-nano Structure and Manufacturing Method of Liquid-cooled Ceramic Substrate. The invention was developed by Huang Yiqia..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has received Magnohot Co Ltd patent application for Mother Substrate for Display Device and Display Device. Takahashi Hideyuki and Yanagisawa Syou developed the invention. The patent application number is CN202511272126 20250908. The patent publication number is ..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Shanghai Institute Technology has applied Chinese patent for Direct Contact Type Liquid Cooling Circulation Heat Dissipation Device for Chip and Working Method of Direct Contact Type Liquid Cooling Circulation Heat Dissipation Device. Zhai Meng, Huang Haoxiang and Pan Zhenhai developed it. The patent appli..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Wuhan Yuxin Semiconductor Co Ltd has submitted a patent application for Integrated Circuit Chip Packaging Structure and Method. This invention was developed by Liu Shijun, Wang Tao, Liu Guolong and Zheng Ke. The patent application number is CN202511860240 20251210. The patent publication number is CN121666..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has released Hefei Xingbo Communication Tech Co Ltd patent application for Heat Dissipation Structure of High-voltage-resistant High-power Chip Pin Diode and Processing Method of Heat Dissipation Structure. This invention was developed by Zhang Liumi, Chen Long, Wu ..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Aipu Tech Co Ltd has sought patent for Semiconductor Device and Semiconductor Package. This invention was developed by Chen Wenliang. The patent application number is CN202510920993 20250704. The patent publication number is CN121666067 (A). International Patent Classification code is H10W20/43. Cooperativ..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has published Suzhou Longchi Semiconductor Tech Co Ltd patent application for Semiconductor Device and Preparation Method Thereof, Chip and Electronic Equipment. The invention was developed by Yang Qiang, Tao Ke and Hu Minghua. The patent application number is CN..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Origin Quantum Computing Technology Hefei Co Ltd has submitted a patent application for Superconducting Quantum Chip, Substrate and Processing Method Thereof. This invention was developed by Jia Zhilong. The patent application number is CN202411199843 20240829. The patent publication number is CN121666047 ..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- State Intellectual Property Office of China has received Zhicheng Shangxin Anhui Semiconductor Co Ltd patent application for Gallium Nitride Chip Heat Dissipation Packaging Method Based on Contact Thermal Resistance Optimization. Wang Jinjun, Gao Ju, Cai Yimeng and Qi Yue developed the invention. The paten..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Zhejiang Dijixin Semiconductor Co Ltd has submitted a patent application for Packaging Device and Packaging Process of Discrete Semiconductor Device. This invention was developed by Tan Liyong, Chen Lei and Li Jiajun. The patent application number is CN202511855204 20251210. The patent publication number i..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- SK Hynix Memory Solutions Inc has submitted a patent application for UART Communication Using Optical Signals for Telemetry. This invention was developed by Hamm Heiko. The patent application number is CN20248051040 20240625. The patent publication number is CN121666575 (A). International Patent Classifica..

Semiconductor

  |  Tue 23 Jun 2026

Beijing, June 24 -- Hangzhou Guangzhiyuan Tech Co Ltd has applied Chinese patent for Computing and Memory Chip Packaging Structure and Device and Resource Pooling System. Meng Huaiyu, Shen Yichen, Yu Shanshan, Zhu Jian and Xu Yelong developed it. The patent application number is CN202411224030 20240902. The patent publication..

Semiconductor

  |  Tue 23 Jun 2026

Geneva, June 24 -- World Intellectual Property Organization has released Est Inc patent application for Large-area Bonding Type Substrate Fixing Device and Manufacturing Method Therefor. This invention was developed by Han Byung Jun, Oh Su Hak, Kim Young Gon, Baek Seung Ho, Park Jae Hyuk and Lim Jong Woo. The patent applicati..

Semiconductor

  |  Tue 23 Jun 2026

Geneva, June 24 -- World Intellectual Property Organization has published Korea Institute of Science and Technology patent application for Resistive Memory Device Based on Difference in Ion Mobility and Method for Manufacturing Same. The invention was developed by Jeong Yeonjoo, Jang Hyun Jae, Lee Kyeong Seok, Kim Inho, Kim Jaew..

Semiconductor

  |  Tue 23 Jun 2026

Geneva, June 24 -- World Intellectual Property Organization has released Niterra Mat Co Ltd patent application for Ceramic Circuit Board and Semiconductor Device Using Same. This invention was developed by Takeuchi Yuta. The patent application number is WO2025JP43559 20251212. The patent publication number is WO2026127137 (A1..
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