Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 18 -- Guangdong University of Technology has applied Chinese patent for Laser Bonding Interconnection Process. Zhang Yu, Yang Shihong, Liu Huitao, Wei Dongye, Li Yutao, Weng Ming, Wang Jianchen, Yang Guannan and Cui Chengqiang developed it.
The patent application number is CN20251001840 20250102. The patent publ..