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Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- BOE Technology Group, Chengdu BOE Optoelectronics Technology and Beijing BOE Technology Development have submitted a patent application for Display Substrate and Display Device. This invention was developed by Yuan Changlong, Li Langtao, Zheng Kening, Feng Jingyi, Zhu Li, Wang Dengyu, Cao Xilei and Wu Tong. ..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Institute of Process Engineering,Chinese Academy of Sciences and Longzihu New Energy Laboratory have submitted a patent application for Perovskite Solar Cell Based on Imidazolyl Ionic Liquid Additive and Preparation Method Thereof. This invention was developed by Cai Guilong, Meng Yu, Huo Feng, Liu Hongfei, ..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Sichuan Gaojing Solar Energy Technology, Gaojing Solar Energy and Guangzhou Gaojing Solar Energy Technology have submitted a patent application for High-efficiency Back Contact Solar Cell and Preparation Method Thereof. This invention was developed by Chen Tianyong, Xu Yao, Qiao Le and Fu Mingquan. The pa..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Hubei University and Qianjiang Industrial Technology Research Institute of Hubei University have sought patent for Perovskite Solar Cell Stability Enhancing System Based on Multi-mode Machine Learning. This invention was developed by Liu Kangyan, Li Yuebin, Ke Dixi, Lu Yifan, Zhou Zekun and Wu Congcong. T..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Shanghai Tuling Zhisuan Quantum Tech Co Ltd and Tulingzhisuan Quantum Tech Wuxi Co Ltd have applied Chinese patent for Waveguide Assembly, Control Method of Waveguide Assembly, Optical Chip and Optical Quantum Computer. Sun Yaodong, Yang Lesi, Peng Chuanyan, Zhan Yongxing and Yang Lin developed it. The pa..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Southeast Univ Shenzhen Institute and Southeast University have submitted a patent application for Micro-fluidic Immunoassay Chip Integrating Lateral Flow and Vertical Flow and Analysis Method of Micro-fluidic Immunoassay Chip. Zhao Xiangwei, Zhou Qifan and Lu Yu developed the invention. The patent applic..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Huaneng Clean Energy Res Institute, Huaneng Xinjiang Energy Dev Co Ltd Nanjiang Clean Energy Branch and Huaneng Xinjiang Energy Dev Co Ltd have applied Chinese patent for Silicon Wafer Microdefect Testing Method and System. Gao Hu, Yu Xiaoming, Gong Jun, Xu Junzhao, Liu Rui, Sun Mingxiang, Zhao Dongming, Li ..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Huaqiao University and Fujian Metrology Institute Fujian Glasses Quality Inspection Station have submitted a patent application for Supporting Mechanism for Simultaneous Measurement of Double Surfaces of Large-size Wafer and Measurement Method. This invention was developed by Cheng Fang, Zou Guangmei, Lin Sh..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Huahong Semiconductor, Wuxi and Shanghai Huahong Grace Semiconductor Manufacturing Corporation have submitted a patent application for Technological Method Applied to Manufacturing Process of Semiconductor Device. Zhang Xiaolong, Zhu Rongfeng and Liu Zhangli developed the invention. The patent application..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Shanghai Eswin Computing Tech Co Ltd and Beijing ESWIN Computing Technology have submitted a patent application for Switching Power Supply, Power Management Chip and Equipment. This invention was developed by Yang Wenmin. The patent application number is CN202511165756 20250819. The patent publication num..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Jiangsu Cas Microelectronics Integration Tech Co Ltd and Zhixin Integrated Circuit Xuzhou Co Ltd have submitted a patent application for Grinding Control Method and System Suitable for Ultrathin Wafer Thinning. This invention was developed by Huang Tao, Xiong Wei and Yang Mengru. The patent application nu..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Huahong Semiconductor, Wuxi and Huahong Semiconductor Mfg Wuxi Co Ltd have submitted a patent application for Post-etching Processing Method for Improving Copper Loss of Through Hole Array Region in Semiconductor Device. Feng Shaowen, Zhong Zhaokuai, Chen Tongqing, Xu Zedong, Ji Fan, Wang Jian, Wang Xiaori, ..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Huahong Semiconductor Mfg Wuxi Co Ltd and Huahong Semiconductor, Wuxi have submitted a patent application for Method for Optimizing Silicon Through Hole Grinding. This invention was developed by Cao Min, Yang Linlin, Hui Keshi, Tan Juan, Zhang Shuo, Lee Won-ho, Li Chuanyu, Wang Ranran, Zhang Shoulong and Zha..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Huahong Semiconductor, Wuxi and Shanghai Huahong Grace Semiconductor Manufacturing Corporation have submitted a patent application for Substrate of Radio Frequency Device and Preparation Method Thereof. This invention was developed by Zhou Qiong and Yue Shengnan. The patent application number is CN2025109..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Xi'an ESWIN Material Technology and Xi'an Xinxin Material Tech Co Ltd have submitted a patent application for Wafer Detection Device and Wafer Detection Method. This invention was developed by Su Xuwen, Rong Qijian, Lyu Tianshuang and Meng Liangliang. The patent application number is CN20251196636 2025080..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Xi'an ESWIN Material Technology and Xi'an Xinxin Material Tech Co Ltd have filed a patent application for Method and Device for Determining Process Section of Wafer Defect. This invention was developed by Jia Cong, Wang Lei, Zhao Lixin, Wan Xun and Ding Quanquan. The patent application number is CN2025119..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Suzhou Convert Semiconductor Co Ltd has sought patent for High-speed Envelope Demodulation Circuit for Pulse Width Compensation. This invention was developed by Luo Yin, Yang Yifan, Tan Zaichao and Ding Guohua. The patent application number is CN202511435557 20251009. The patent publication number is CN12..

Semiconductor

  |  Wed 25 Mar 2026

London, March 26 -- University Warwick and National Research Council Canada have applied UK patent for Semiconductor Device. Maksym Myronov and Sergei Studenikin developed it. The patent application number is GB20240011347 20240801. The patent publication number is GB2643153 (A). International Patent Classification codes are ..

Semiconductor

  |  Wed 25 Mar 2026

London, March 26 -- Fraser Hammerton Group Holdings Ltd has sought patent for an Improved LED Dimmer. This invention was developed by Joshua Hammerton. The patent application number is GB20240013319 20240911. The patent publication number is GB2644006 (A). International Patent Classification codes are H01R13/66, H02G3/08 and ..

Semiconductor

  |  Wed 25 Mar 2026

London, March 26 -- Advanide Holdings Pte Ltd has filed a patent application for Dual-contact Chipcard Module and Chipcard with a Dual-contact Chipcard Module. This invention was developed by Holger Roessner, Joe Lo and Eric De Bruijn. The patent application number is GB20240013517 20240913. The patent publication number is G..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Institute of Semiconductors, Chinese Academy of Sciences has submitted a patent application for Recrystallization Method of Argon-containing Crystalline Material. This invention was developed by He Li, Luo Junwei, Li Sailei, Zhu Yuanhao, Dou Xiuming and Wu Shaoteng. The patent application number is CN2025..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Semiconductor Manufacturing International (Shanghai) has submitted a patent application for Photomask and Forming Method Thereof. This invention was developed by Deng Hai and Ling Wenjun. The patent application number is CN202410580573 20240510. The patent publication number is CN120928644 (A). Internatio..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Calterah Semiconductor Technology, Shanghai has submitted a patent application for Fast Fourier Transform System, Chip, Processing Method and Equipment. This invention was developed by Xu Daren, Tang Ran and Zhang Zhan. The patent application number is CN202410566989 20240508. The patent publication numbe..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Suzhou Yuannao Intelligent Technology has submitted a patent application for Memory Test System. This invention was developed by Chen Wenwen. The patent application number is CN202511471224 20251015. The patent publication number is CN120929320 (A). International Patent Classification code is G06F11/22. ..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has published Tsinghua University patent application for Memory Management Method and Device, Storage Medium and Computer Equipment. The invention was developed by Shu Jiwu, Yan Bin and Wang Qing. The patent application number is CN20251146113 20250728. The pate..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Tsinghua University has submitted a patent application for Memory Access Method and Device, Storage Medium and Computer Equipment. This invention was developed by Shu Jiwu, Yan Bin and Wang Qing. The patent application number is CN20251145625 20250728. The patent publication number is CN120929407 (A). Int..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has received Beijing Institute of Technology patent application for Dialogue Emotion Recognition Method and Device Inspired by Memory Retrieval and Cross-modal Interaction. Wu Xia, Wang Qixin and Li Ziyu developed the invention. The patent application number is ..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Shanghai 2nd Polytechnic University has submitted a patent application for Automatic Novel Generation System and Method Based on Multi-agent Cooperation and Dynamic Memory Updating. This invention was developed by Si Xiaomeng, Song Jianlin and Du Yi. The patent application number is CN20251138739 20250728..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Method for Detecting Defects of Through Hole. This invention was developed by Wang Xiaojuan, Chen Dong, Liu Xiaoyu, Cao Zhangyu and Han Ling. The patent application number is CN202511461587 20251014. The patent publication number is C..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has received Yangtze Memory Technologies patent application for Memory Controller, Memory System and Control Method Thereof. Zhou Teng developed the invention. The patent application number is CN202410565239 20240508. The patent publication number is CN120932693..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Yangtze Memory Technologies has submitted a patent application for Memory Device and Erase Operation Thereof. This invention was developed by Yuan Xiaoya, Lu Xiangdong, Ji Hongyu, Cui Jie, Chen Zhenjia, Huang Wei, Hou Chunyuan, Wei Huazheng and Cao Hong. The patent application number is CN202410564764 202..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Kyulux has filed a patent application for Compound, Light-emitting Material, and Delayed Phosphor. This invention was developed by Cho Yong-ju, Morio Momoko, Suzuki Yoshitake, Huang Songhui, Ozawa Hiroaki, Kanehara Kosei, Suzuki Iori, Hamasaki Taro and Shimoi Yuko. The patent application number is CN20248..

Semiconductor

  |  Wed 25 Mar 2026

London, March 26 -- Advanced RISC Machines has submitted a patent application for Performance Monitoring. This invention was developed by Matteo Maria Andreozzi, Giovanni Stea, Raffaele Zippo and Riccardo Bertini. The patent application number is GB20240012437 20240823. The patent publication number is GB2643579 (A). Internat..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Shanghai Huali Integrated Circuit Manufacturing has applied Chinese patent for Patterned Etching Method. Zhang Guanjun developed it. The patent application number is CN20251166241 20250730. The patent publication number is CN120933158 (A). International Patent Classification codes are H01L21/033, H01L21/3..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Nanya Technology has sought patent for Semiconductor Structure and Forming Method Thereof. This invention was developed by Zhu Yanhe and Tan Yongen. The patent application number is CN20251190494 20250805. The patent publication number is CN120933227 (A). International Patent Classification codes are H01L..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- North Integrated Circuit Tech Innovation Center has submitted a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Wang Jian, Wu Xusheng and Liu Taoran. The patent application number is CN202410565215 20240508. The patent publication number is CN1209..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Hubei Xingchen Technology has applied Chinese patent for Semiconductor Device and Manufacturing Method Thereof. Wang Yiqun, Xie Dong, Yang Daohong, Tao Ye and Cao Ruixia developed it. The patent application number is CN202511468706 20251014. The patent publication number is CN120933277 (A). International ..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has published Advanced Micro Devices patent application for Memory Training Enhancement. The invention was developed by Wiley Aaron D. The patent application number is CN20248021844 20240328. The patent publication number is CN120936978 (A). International Patent..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Microsoft Technology Licensing has sought patent for Direct Reading of Compressed Data into In-memory Repository. This invention was developed by Sakowski Katarzyna, Dumitru Mircea, Netz Amir and Petculescu Cristian. The patent application number is CN20248020007 20240429. The patent publication number is..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has released Taiyo Holdings patent application for Structure for Light-emitting Panel and Method for Manufacturing Same. This invention was developed by Takahashi Motonori and Odagiri Yuto. The patent application number is CN20248019918 20240318. The patent publ..

Semiconductor

  |  Wed 25 Mar 2026

London, March 26 -- UK Patent Office has released Dyson Technology patent application for Patch for Applying to a User's Skin. This invention was developed by Zaka Ul Islam Mujahid and Andrew James Bower. The patent application number is GB20240013470 20240913. The patent publication number is GB2644051 (A). International Pat..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has released Sony patent application for Surface Light Emitting Device. This invention was developed by Shinto Tatsuya, Watanabe Hideki, Higa Yasutaka, Song Kyung-seok, Yamaguchi Shuhei, Wada Koshiro and Koda Rintaro. The patent application number is CN202480205..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has received Anhui Geen Semiconductor patent application for Semiconductor Light-emitting Element with Plasmon Coupling Layer. Xun Feilin, Zheng Jinjian, Deng Heqing, Li Xiaoqin, Chen Chengjie, Cai Xin, Zhong Zhibai, Yang Lixun, Hu Zhiyong and Zhang Jiangyong devel..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Yangtze Memory Technologies has sought patent for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Wang Huan, Zhou Chengbao, Xiao Liang, Zhang Mingkang and Zhao Yingcheng. The patent application number is CN20248000730 20240308. The patent publication number is CN..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has received Roehm patent application for Semiconductor Device. Mori Seigo and Nakano Yuki developed the invention. The patent application number is CN20248020659 20240328. The patent publication number is CN120937525 (A). International Patent Classification cod..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Roehm has applied Chinese patent for Semiconductor Device. Oi Nobutaka developed it. The patent application number is CN20248020670 20240307. The patent publication number is CN120937526 (A). International Patent Classification codes are H10D12/00, H10D30/60, H10D62/10 and H10D62/80. Cooperative Patent Cl..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- LG Chemical has submitted a patent application for Organic Light Emitting Device. Kim Kyunghee, Lee Woochul, Kim Moung-gon, Cha Yongbum and Hwang Sung-hyun developed the invention. The patent application number is CN20248019943 20240502. The patent publication number is CN120937543 (A). International Pate..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Ocean University China has submitted a patent application for Dielectric Elastomer Rotation Driver for Deep Sea. This invention was developed by Tang Chao, Wu Zeguo and Li Guorui. The patent application number is CN202511105414 20250807. The patent publication number is CN120934371 (A). International Pate..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has received Hubei Ruihua Photoelectric and Shenzhen Refond Optoelectronics patent application for Preparation Method of Led Packaging Structure and LED Packaging Structure. Zhang Cheng, Zhou Lingge and Zhu Yiming developed the invention. The patent application ..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Guangzhou Photoelectric Cunsuan Chip Integration Innovation Center has submitted a patent application for Terahertz Intensity Probe and Packaging Method and Receiving Light Path Design Thereof. Wang Qiaobin, Wang Ximiao, Deng Shaozhi and Zhang Fei developed the invention. The patent application number is ..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Heilongjiang Huixin Semiconductor Co Ltd has sought patent for Semiconductor Circuit and Plastic Packaging Method Thereof. This invention was developed by Feng Yuxiang, Huang Hao and Feng Kexin. The patent application number is CN20251169124 20250731. The patent publication number is CN120933258 (A). Inte..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- Hitech Semiconductor Wuxi has submitted a patent application for Quality Feedback Production Scheduling System. Zhao Tengjun developed the invention. The patent application number is CN202510940069 20250709. The patent publication number is CN120930982 (A). International Patent Classification codes are G0..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- GigaDevice Semiconductor has submitted a patent application for Storage Device and Method for Executing Memory Operation of Storage Device. This invention was developed by Liu Gucheng. The patent application number is CN202410578591 20240510. The patent publication number is CN120929001 (A). International..

Semiconductor

  |  Thu 26 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has received Calterah Semiconductor Technology, Shanghai patent application for Access Control Method and System, Computer Readable Storage Medium and Terminal Equipment. Ni Jincheng and Shen Yang developed the invention. The patent application number is CN20241..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has released Jiangsu Nepes Semiconductor Co Ltd patent application for Copper-nickel-gold Bump Production Process Based on Display Driving Chip. This invention was developed by Li Feng, Yang Xuesong, Wang Haoyuan and Ding Chao. The patent application number is C..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has released Zhejiang Chuanghao Semiconductor Co Ltd patent application for Package Substrate Manufacturing Method and Package Substrate. This invention was developed by Lan Minghui, Lu Hailin, Fang Yong, Yan Chuanzhao and Chen Yong. The patent application numbe..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Jixin Tuofang Tech Shanghai Co Ltd has applied Chinese patent for Manufacturing Method of Semiconductor Device. Lyu Kaimin, Chen Jun, Zhang Wenhao and Li Fudong developed it. The patent application number is CN202511453105 20251011. The patent publication number is CN120933165 (A). International Patent Cl..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has received Zhejiang Chuanghao Semiconductor Co Ltd patent application for Processing Method of Coreless Packaging Substrate and Coreless Packaging Substrate. Tang Hua, Lian Chengjie, Lu Hailin and Zhang Ting developed the invention. The patent application numb..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Jiangsu Zhuoyuan Semiconductor Co Ltd has filed a patent application for Epitaxial Growth Process of Silicon Carbide Substrate. This invention was developed by Zhang Xinfeng, Wu Zhiliang and Gao Xin. The patent application number is CN202410582620 20240511. The patent publication number is CN120933151 (A)..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has published Wanqun Purification Tech Shanghai Co Ltd patent application for Electricity Storage Device of Electromagnetic Quantum State Chip and Preparation Method of Electricity Storage Device. The invention was developed by Su Jinmiao. The patent application..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Hunan Kairuisi Microelectronic Material Tech Co Ltd has submitted a patent application for High-frequency Dielectric Material, Semiconductor Packaging Substrate and Manufacturing Method Thereof. This invention was developed by Ye Zonghe, Yang Liu, Qin Xianzhi, Tan Yangyang, Tan Zhangjian and Yang Di. The ..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has received Hefei BOE Ruisheng Technology and BOE Technology Group patent application for Light-emitting Substrate. Cheng Hao, Zhang Wei, Yang Zhifu, Huang Longtao, Li Jian, Li Shiwei, Shen Jiajia, Su Xiang, Wu Chunbo, Zhang Fuqun, Zhang Huaiyong, Zhang Teng and Z..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Xinlian Integrated Circuit Manufacturing has submitted a patent application for Semiconductor Structure and Semiconductor Testing Method. This invention was developed by Chen Huixiu and Zhu Xiaotong. The patent application number is CN20251190725 20250805. The patent publication number is CN120933275 (A). I..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Shanghai Guangjian Semiconductor Equipment Co Ltd has applied Chinese patent for Deep Groove Silicon Capacitor Based on Cross-shaped Structure Unit Obliquely Laid and Densely Arranged Array. Meng Qinghua and Ding Changde developed it. The patent application number is CN202511479258 20251016. The patent pu..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Taiwan Semiconductor Manufacturing has applied Chinese patent for Semiconductor Structure and Forming Method Thereof. Chen Jiazhen, Guo Tinghao, Huang Yuzhi, Chen Chengxian and Zhang Jierui developed it. The patent application number is CN202510996400 20250718. The patent publication number is CN120933260 (..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Infineon Technologies has sought patent for Semiconductor Module, Bus Bar and Method for Producing Semiconductor Module. This invention was developed by Spitzer Daniel, Ciametti Giorgio, Reiter Thomas and Formato Gianluca. The patent application number is CN202411606465 20241112. The patent publication numb..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has received Nayu Semiconductor Mat Ningbo Co Ltd patent application for Embedded Power Chip Packaging Structure and Preparation Method Thereof. Gao Chenshan, Ye Huaiyu and Sun Bin developed the invention. The patent application number is CN202511478383 20251016..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Mitsubishi Electric has submitted a patent application for Power Semiconductor Device and Method for Manufacturing Power Semiconductor Device. This invention was developed by Kawahara Fumihito. The patent application number is CN202510476069 20250416. The patent publication number is CN120933245 (A). Intern..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Guangdong Xinjuneng Semiconductor has sought patent for Power Module Chip Junction Temperature Built-in Ntc Packaging Structure and Chip Temperature Measurement Method. This invention was developed by Wang Qin, Cui Xiao, Feng Weijian, Yan Pengxiu, Li Boqiang and Zhong Yifan. The patent application number is..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Changdian Microelectronics Jiangyin Co Ltd has applied Chinese patent for Formation Method of Semiconductor Packaging Structure. Xiang Li, Bao Man, Liu Binjie and Zhang Xingduo developed it. The patent application number is CN202511455321 20251013. The patent publication number is CN120933238 (A). Interna..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Shanghai Xinaoxinyi Tech Co Ltd has submitted a patent application for Preparation Method of Bonded Wafer. This invention was developed by Wang Ziwen, Zhu Wei, Wei Xing and Li Wei. The patent application number is CN202511101327 20250806. The patent publication number is CN120933229 (A). International Pat..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has released Shanghai Integrated Circuit Materials Res Institute Co Ltd patent application for Semiconductor Substrate Corrosion Equipment and Corrosion Method. This invention was developed by Liu Qiang, Wang Shinan and Yu Wenjie. The patent application number i..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Nantong Yourui Semiconductor Co Ltd has submitted a patent application for Correcting Device for Chip Packaging Processing and Use Method Thereof. This invention was developed by Xu Haijian, Wang Hairong, Shen Fanping, Sun Junwei and Wang Zhanwei. The patent application number is CN202511449840 20251011. ..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Lichuan Zhuhai Intelligent Tech Equipment Co Ltd has submitted a patent application for Rapid Calibration Device and Method for Wafer Probe Station. Lin Bangyu, Li Yongchun and Li Zhangqing developed the invention. The patent application number is CN20251153662 20250730. The patent publication number is C..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Wushi Microelectronics Suzhou Co Ltd has submitted a patent application for Semiconductor Centering Mechanism and Semiconductor Bonding Equipment. This invention was developed by Wan Shiyuan, Shen Da and Xue Yaling. The patent application number is CN202510849967 20250624. The patent publication number is..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Shandong Haisheng Nick Microelectronics Co Ltd has applied Chinese patent for Turnover Device of High-precision Semiconductor Packaging Die Bonding Equipment. Ao Zhibin, Li Rui, Ma Lina, Yuan Zongqing, Zhang Jiachen and Liu Xiaodong developed it. The patent application number is CN202511129659 20250813. T..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Hangzhou Dahe Jiangdong New Material Tech Co Ltd has filed a patent application for Coplanar Assembly Device and Method for Ceramic Chip Fork Peek Piece. This invention was developed by Wang Yijun, Ma Yuqi and Cai Deqi. The patent application number is CN202510858861 20250625. The patent publication numbe..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Geke Semiconductor Shanghai Co Ltd has submitted a patent application for Wafer Loading Device Capable of Detecting State of Wafer Box Door and Wafer Loading Method. This invention was developed by Peng Zhaoyang. The patent application number is CN202410586598 20240511. The patent publication number is CN..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Qidong Xinwei Zhizao Tech Co Ltd has filed a patent application for Silicon Optical Chip Laser Bonding Equipment. This invention was developed by Bao Bo, Lyu Shuqin and Ren Lijun. The patent application number is CN202511465659 20251014. The patent publication number is CN120933211 (A). International Pate..

Semiconductor

  |  Wed 25 Mar 2026

London, March 26 -- Oxford Quantum Circuits Ltd has applied UK patent for a Quantum Computation Chip and a Method of Fabricating a Quantum Computation Chip. Connor Daniel Shelly, Yashwanth Balaji and Kowsar Shahbazi developed it. The patent application number is GB20240008495 20240613. The patent publication number is GB26436..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Shenyang Heyan Tech Co Ltd has applied Chinese patent for Wafer Cleaning System and Control Method and Device of Wafer Cleaning System. Zhao Yiping, Yu Huping, Wei Shuqi, Qi Piao, Wu Debao, Xu Peng and Li Wenlong developed it. The patent application number is CN202511464711 20251014. The patent publicatio..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has published Sinochip Semiconductor Tech Co Ltd patent application for VCSEL (vertical Cavity Surface Emitting Laser) Chip Wafer Batch Transferring and Cleaning Equipment and Process. The invention was developed by Wang Guanghui, Chen Yun, Yu Juan, Lee Wang-rim, L..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Changzhou Sipai Intelligent Tech Co Ltd has sought patent for Ultrasonic Cleaning Equipment for Wafer Cleaning. This invention was developed by Zhang Wei. The patent application number is CN202511256136 20250904. The patent publication number is CN120933202 (A). International Patent Classification codes a..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has released Hwatsing Beijing Tech Co Ltd patent application for Loading Port Device, Front-end Loading Device, Wafer Processing Equipment and Detection Method. This invention was developed by Lu Xinchun, Zhao Dewen, Han Xiaokai and Ma Xu. The patent application..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has received Hangzhou Leading Thermal Power Tech Co Ltd patent application for Rapid Adhesive Tape Stripping Device for Semiconductor Product and Adhesive Tape Stripping Method. Chen Feng and Feng Rui developed the invention. The patent application number is CN2..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Beneq has submitted a patent application for Atomic Layer Deposition Apparatus and Method for Coating Substrate. This invention was developed by Peros Alexander and Zhu Zhen. The patent application number is CN20248024865 20240410. The patent publication number is CN120936742 (A). International Patent Cla..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Suqian Hengjia Prec Electromechanical Co Ltd has submitted a patent application for Linkage Chip Removal Type Part Cutting Equipment. Yan Zhixiang, Xu Fenglong and Liu Leicheng developed the invention. The patent application number is CN202511313560 20250915. The patent publication number is CN120940728 (..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Lichuan Hangzhou Semiconductor Equipment Co Ltd has filed a patent application for Method and System for Detecting and Analyzing Heavy Metal Residues of TSV (through Silicon Via) Wafer After CMP (chemical Mechanical Polishing) Cleaning. This invention was developed by Lin Bangyu and Weng Xinjing. The pate..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Teikoku Pipe Systems Co Ltd has submitted a patent application for Mounting Device, Tape Stripping Device, Substrate Transfer Device, Tape Stripping Method, and Substrate Transfer Method. Li Haochong and Katsushima Yoshinori developed the invention. The patent application number is CN20248024704 20240405...

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Guangdong Xinye Smart Label Co Ltd has submitted a patent application for RFID Tag Antenna of Spiral Involute Structure Based on Flexible Substrate. This invention was developed by Chen Liping, Xu Haibing, Chen Kun, Peng Zhihui and Yao Feng. The patent application number is CN202511302123 20250912. The pa..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- SCREEN Holdings has submitted a patent application for Substrate Transfer Apparatus Monitoring Method and Substrate Processing Apparatus. Ota Takashi, Kawahara Hiroyuki and Iwao Michinori developed the invention. The patent application number is CN20248023209 20240402. The patent publication number is CN120..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has published Kokusai Electric patent application for Substrate Processing Apparatus, Method for Manufacturing Semiconductor Device, and Program. The invention was developed by Murobayashi Masaki and Hotta Tomoki. The patent application number is CN20238095977 202..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has published SCREEN Holdings patent application for Learning Apparatus, Information Processing Apparatus, Substrate Processing Apparatus, Learning Method, and Processing Condition Determination Method. The invention was developed by Tokuyama Masahiro and Shinohara..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Lam Research has submitted a patent application for Hybrid Deposition and Etch Process for Improved Gap Fill. This invention was developed by Mandia David Joseph, Griffiths Matthew Bertram Edward and Kanakasabapathy Sivananda Krishnan. The patent application number is CN20248024796 20240405. The patent publ..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Jiaxing Focusimple Electronics has applied Chinese patent for Detachable Low-pass Filter Based on Aluminum Oxide Substrate and Preparation Method Thereof. Zhou Chiwei, Ma Bozhi, Zhang Heng, Yu Dangqing, Chen Shangtong, Zhang Haolin and Wan Qiao developed it. The patent application number is CN202511472025 2..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has received Tokyo Electron patent application for Processing Liquid Supply Device and Processing Liquid Supply Method. Adachi Kenji developed the invention. The patent application number is CN20248024346 20240410. The patent publication number is CN120937113 (A)...

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Hefei Yaozheng Quantum Tech Co Ltd has submitted a patent application for Tunable Filter Based on MEMS Micromirror. This invention was developed by Wang Xiaolong, Wu Chao, Zhang Yang and He Ran. The patent application number is CN202511339241 20250918. The patent publication number is CN120933622 (A). Int..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Renet Corp has submitted a patent application for System and Method for Improving Integrated Circuit Yield. This invention was developed by Sachdev Manoj. The patent application number is CN20248019953 20240123. The patent publication number is CN120937112 (A). International Patent Classification codes ar..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- State Intellectual Property Office of China has received Applied Materials patent application for Ion and Neutral Particle Source with Adjustable Outlet Angle. Rowland Christopher A developed the invention. The patent application number is CN20248025339 20240725. The patent publication number is CN120937110..

Semiconductor

  |  Wed 25 Mar 2026

Beijing, March 26 -- Tokyo Electron has applied Chinese patent for Plasma Processing Method and Apparatus. Bassett Derek William, Lauerhaas Jeffrey and Van Elsen Rens developed it. The patent application number is CN20248025283 20240417. The patent publication number is CN120937109 (A). International Patent Classification codes..
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