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Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Chengdu BOE Optoelect Tech Co and BOE Technology Group have sought patent for Light-emitting Device and Wearable Device. This invention was developed by Huang Chienpang, Li Qian, Zhang Lin and Li Yaqiu.
The patent application number is WO2025CN127285 20251013. The patent publication number is WO2026108448 (A..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- PSK Holdings has sought patent for Semiconductor Package and Redistribution Processing Method for Semiconductor Package. This invention was developed by Park Jongbum, Jang Dong Hyun and Yoon Sung Jin.
The patent application number is WO2025KR17878 20251104. The patent publication number is WO2026111247 (A1). I..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has published LT Metal patent application for Reliability-improved Bonding Wire for Semiconductor Device. The invention was developed by Lee Tae Hee, Park Moon Su, Yang Seung Ho, Yeon Byeonghoon, Nam Hong Sik, Son Kyoung Hyun and Kim Se Mi.
The patent application number..
Semiconductor
| Thu 04 Jun 2026
Beijing, June 5 -- Beijing Institute of Technology has sought patent for Transient Liquid Phase Connection Method Based on Composite Laminated Structure. This invention was developed by Ma Zhaolong, Zhou Aoran, Zhang Huizhe, Li Ce and Cheng Xingwang.
The patent application number is CN20261042744 20260114. The patent publicat..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Saint-Gobain has filed a patent application for Coated Transparent Substrate Making Fingerprints Invisible. This invention was developed by Wilmet Maxence and Perrot Vincent.
The patent application number is WO2025EP84203 20251125. The patent publication number is WO2026109803 (A1). International Patent Clas..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Shanghai Vanchip Technologies has submitted a patent application for Radio Frequency Switch Circuit Having Cross-feedback Structure, and Chip and Electronic Device. Yang Yanmei and Li Yanli developed the invention.
The patent application number is WO2025CN132898 20251106. The patent publication number is WO202..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has released Lansus Technologies patent application for Electrostatic Protection Circuit and Radio Frequency Front-end Chip. This invention was developed by Shao Yixiang and Guo Jiashuai.
The patent application number is WO2025CN132049 20251103. The patent publication n..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Lansus Technologies has submitted a patent application for Common-input Low Noise Amplifier and Radio Frequency Chip. This invention was developed by Zhang Kun, Zhou Yongfeng and Guo Jiashuai.
The patent application number is WO2025CN132037 20251103. The patent publication number is WO2026108588 (A1). Internat..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has received Lansus Technologies patent application for Low-noise Amplifier and Radio Frequency Chip. Zhang Kun, Zhou Yongfeng and Guo Jiashuai developed the invention.
The patent application number is WO2025CN132004 20251103. The patent publication number is WO20261085..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has released Lansus Technologies patent application for Gain-adjustable Low-noise Amplifier and Radio-frequency Chip. This invention was developed by Zhang Kun, Zhou Yongfeng and Guo Jiashuai.
The patent application number is WO2025CN131793 20251031. The patent publicat..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has published Huawei Technologies patent application for Communication Method, Communication Apparatus, Storage Medium, and Chip System. The invention was developed by Peng Wenjie, Sun Fei and Zhu Zheqi.
The patent application number is WO2025CN129176 20251022. The pate..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- State Intellectual Property Office of China has received AOI Electronics patent application for Semiconductor Chip and Semiconductor Chip Manufacturing Method. Wakisaka Shinji, Fukushima Masato and Furuya Aiko developed the invention.
The patent application number is CN20248042149 20240523. The patent publi..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- IBM has submitted a patent application for Interconnect Layer with Multiple Line Types. This invention was developed by Lanzillo Nicholas A, Lawrence A Clevenger, Anderson Brent Alan, Xie Ruilong, Zhu Wenxi and Vega Roberto.
The patent application number is CN20248036033 20240516. The patent publication num..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- State Intellectual Property Office of China has received Zeus patent application for Substrate Processing Apparatus and Method. Lee Byeong Su, Kim Tae-hoon and Ahn Young Bin developed the invention.
The patent application number is CN20248046787 20240708. The patent publication number is CN121511684 (A). Inte..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- Jiangsu Sunchip Semiconductor has submitted a patent application for Safety Piezoresistor. Jiang Lei, Guo Airong and Zhang Miao developed the invention.
The patent application number is CN202511844302 20251209. The patent publication number is CN121506648 (A). International Patent Classification codes are H..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- LX Semicon has filed a patent application for Display Device and Control Method Thereof. This invention was developed by Yeo Sung Dae and Yu Sang Duk.
The patent application number is WO2025KR95649 20251015. The patent publication number is WO2026111552 (A1). International Patent Classification code is G09G3..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Seoul Viosys has applied WIPO patent for Nitride-based Semiconductor Device. Baek Yong Hyun, Kim Eun Jin and Yu Hyeon Su developed it.
The patent application number is WO2025KR19491 20251121. The patent publication number is WO2026111513 (A1). International Patent Classification codes are H10D30/01, H10D30/47 ..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- LT Metal has submitted a patent application for Bonding Wire for Semiconductor Device with Improved Reliability. Yeon Byeonghoon, Park Moon Su, Yang Seung Ho, Lee Tae Hee, Nam Hong Sik, Son Kyoung Hyun and Kim Se Mi developed the invention.
The patent application number is WO2025KR08914 20250625. The patent pu..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Wonik IPS has submitted a patent application for Method and Device for Substrate Processing, and Recording Medium for Performing Same. This invention was developed by Lee Sung Hwan, Lee Ju Yong, Nor Yong Ho, Cho Seung Hee, Kim Young Jun and Moon Jae Jung.
The patent application number is WO2025KR06372 20250512..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Foundation of Soongsil University-Industry Cooperation has submitted a patent application for Hybrid Substrate and Manufacturing Method Thereof. Yoo Geon Wook developed the invention.
The patent application number is WO2025KR03207 20250311. The patent publication number is WO2026111044 (A1). International Pate..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has published Resonac patent application for Resin Composition, Resin Film, Laminate, Method for Producing Laminate, Printed Wiring Board, and Semiconductor Package. The invention was developed by Kobayashi Yuzuru, Takayasu Satoshi, Miyasaka Masahiro and Kotake Tomohiko...
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has received Fuji patent application for Substrate Work Machine and Substrate Transport Method. Otsuki Takahiro, Mizuno Takayuki, Hikosaka Takayuki and Shioya Satoshi developed the invention.
The patent application number is WO2024JP41263 20241121. The patent publicatio..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- SHU-HOU Co Ltd has filed a patent application for Printed Matter, Display Device, Solar Cell, and Solar Cell System. This invention was developed by Muraoka Kouji.
The patent application number is WO2024JP41236 20241121. The patent publication number is WO2026110277 (A1). International Patent Classification co..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has released Mitsubishi Electric patent application for Semiconductor Light-receiving Element and Method for Adjusting Semiconductor Light-receiving Element. This invention was developed by Mikami Yohei, Shiratori Yuta, Fukao Tetsuhiro and Onaka Takayuki.
The patent a..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Cellid has applied WIPO patent for Projection Substrate and Eyeglasses-type Terminal. Marui Keita, Inabata Tatsuo and Shozu Toshiaki developed it.
The patent application number is WO2024JP40991 20241119. The patent publication number is WO2026110234 (A1). International Patent Classification code is G02B27/02. ..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Fuji has submitted a patent application for Storage Device and Substrate Work Machine. Ito Hidetoshi, Mori Ryosuke and Nojima Kohei developed the invention.
The patent application number is WO2024JP40922 20241119. The patent publication number is WO2026110222 (A1). International Patent Classification code is B..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Fuji has filed a patent application for Discharge Tool, Storage Device, and Substrate Work Machine. This invention was developed by Ito Hidetoshi, Mori Ryosuke and Nojima Kohei.
The patent application number is WO2024JP40921 20241119. The patent publication number is WO2026110221 (A1). International Patent Cla..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Fuji has submitted a patent application for Discharge Tool, Substrate Work Machine, and Substrate Work System. This invention was developed by Ito Hidetoshi, Mori Ryosuke and Nojima Kohei.
The patent application number is WO2024JP40918 20241119. The patent publication number is WO2026110219 (A1). International..
Semiconductor
| Thu 04 Jun 2026
Beijing, June 5 -- State Intellectual Property Office of China has released Zhejiang Jibao Intelligent Equipment patent application for External Machining Chip Removal Device for Numerical Control Machine Tool and Processing Method. This invention was developed by Shen Jiangyong.
The patent application number is CN202511965095 ..
Semiconductor
| Thu 04 Jun 2026
Beijing, June 5 -- State Intellectual Property Office of China has published Shanghai Zhenhua Port Machinery Heavy Industry patent application for Composite Chip Breaking Tool. The invention was developed by Chen Chuangye, Hu Shulin, Ji Aijun, Chen Yang, Tao Ye, Ji Jiajun and Liu Dong.
The patent application number is CN2025120..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Soitec Silicon On Insulator has filed a patent application for Method for Producing a Multilayer Structure and Intermediate Multilayer Structure. This invention was developed by Biard Hugo.
The patent application number is WO2025EP83913 20251121. The patent publication number is WO2026109745 (A1). Internatio..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has released Heidelberg University patent application for Method of Manufacturing a Photonic Integrated Circuit and Photonic Integrated Circuit. This invention was developed by Pernice Wolfram, Bankwitz Rasmus, Schultzen Philipp and Meyer-hermann Klara Maria.
The pate..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Zhonghuan Advanced Semiconductor Technology has submitted a patent application for Crystal Growth Apparatus and Control Method Therefor. This invention was developed by Chen Yi.
The patent application number is WO2025CN125868 20250930. The patent publication number is WO2026108415 (A1). International Patent ..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- MGI Tech has submitted a patent application for Sequencing Chip and Preparation Method Therefor, Method for Improving Sequencing Quality, Kit and Use Thereof. Su Qiong, Luo Haiyan, Song Chongyang, Yang Jin and Xu Chongjun developed the invention.
The patent application number is WO2024CN133204 20241120. The pa..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Yangtze Memory Technologies has applied WIPO patent for Three-dimensional Memory Devices and Fabricating Methods Thereof. Wu Linchun, Wang Di, Shen Dingding, Zhang Kun and Zhou Wenxi developed it.
The patent application number is WO2024CN132848 20241119. The patent publication number is WO2026107621 (A1). In..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- State Intellectual Property Office of China has published Miraial patent application for Substrate Storage Container. The invention was developed by Fukuda Ryuji.
The patent application number is CN202380100385 20230719. The patent publication number is CN121511682 (A). International Patent Classification c..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- Miraial has applied Chinese patent for Substrate Storage Container. Fukuda Ryuji developed it.
The patent application number is CN202380100323 20230719. The patent publication number is CN121511681 (A). International Patent Classification code is H10P72/10. Cooperative Patent Classification code is H10P72/1..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- Applied Materials has submitted a patent application for Process Chamber Gas Flow Improvement. This invention was developed by Sanchez Errol Antonio C and Zhu Zuoming.
The patent application number is CN20248047114 20240409. The patent publication number is CN121511680 (A). International Patent Classification..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- Lam Research has applied Chinese patent for Multi-station Processing Tool with Precursor Dispensing System. Sathish Karthik Addapa, Premakumar Harish Kumar, Roberts Michael Philip, Barnett Cody, Bapat Shriram Vasant and Blaquiere Ryan developed it.
The patent application number is CN20248046243 20240710. The ..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- State Intellectual Property Office of China has received Central Glass patent application for Method for Producing Purified Fluorine-containing Gas Composition, Method for Producing Semiconductor Device, and Etching Apparatus. Eto Jun, Oomori Hiroyuki and Kikuchi Akiou developed the invention.
The patent appl..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- Kokusai Electric has submitted a patent application for Substrate Processing Method, Semiconductor Device Manufacturing Method, Program, and Substrate Processing Apparatus. This invention was developed by Nohara Shingo, Ishibashi Kiyohisa, Yamane Akimasa and Niimura Junpei.
The patent application number is CN..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- Kokusai Electric has filed a patent application for Gas Supply Method, Semiconductor Device Manufacturing Method, Substrate Processing Apparatus, Program, and Flow Controller. This invention was developed by Tanaka Akemi.
The patent application number is CN202380100325 20231227. The patent publication number ..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Imaging Device, Semiconductor Device, and Electronic Apparatus. This invention was developed by Sogo Yasunori, Inoue Toshinori, Kamei Takahiro, Miyaki Tsubasa, Nitta Yosuke, Aminai Yuriko and Shimizu Kan.
The patent application nu..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- Semiconductor Energy Laboratory has applied Chinese patent for Semiconductor Device and Method for Manufacturing Semiconductor Device. Nakada Masataka, Kurosaki Daisuke, Jintyou Masami and Koezuka Junichi developed it.
The patent application number is CN20248046720 20240708. The patent publication number is C..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- State Intellectual Property Office of China has published Sony Semiconductor Solutions Corporation patent application for Semiconductor Device, Semiconductor Module, and Wireless Communication Apparatus. The invention was developed by Saito Tatsuma.
The patent application number is CN20248046822 20240619. The..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- Sony has submitted a patent application for Semiconductor Device, Semiconductor Module, and Wireless Communication Apparatus. Soga Ikuo developed the invention.
The patent application number is CN20248046817 20240619. The patent publication number is CN121511660 (A). International Patent Classification codes ..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- ASML Netherlands has submitted a patent application for Source Container, Light Source, EUV Utilization System and Method for Controlling Source Material. This invention was developed by Frenzel Anthony J and Stewart Iv John Thomas.
The patent application number is CN20248046940 20240627. The patent publica..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- Microchip Technology has submitted a patent application for Power Receiving Device Interface Controller. Park Allen, Darshan Yair and Jakubowski Marcin developed the invention.
The patent application number is CN20248046418 20240702. The patent publication number is CN121511582 (A). International Patent Class..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- State Intellectual Property Office of China has released ASML Netherlands patent application for Direct Aberration Retrieval for Charged Particle Devices. This invention was developed by Goosen Maikel Robert, Huisman Thomas and Yin Weihua.
The patent application number is CN20248047166 20240626. The patent pu..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- Rongyao Terminal has submitted a patent application for Interface Display Method, Electronic Equipment, Storage Medium and Chip. This invention was developed by Liu Rui.
The patent application number is CN20238099794 20230915. The patent publication number is CN121511451 (A). International Patent Classificati..
Semiconductor
| Fri 05 Jun 2026
Beijing, June 5 -- Infineon Technologies has filed a patent application for Adaptive Ringing Cancellation in CAN Receiver. This invention was developed by Garrone Alessandro and Pihet Eric.
The patent application number is CN202511101833 20250807. The patent publication number is CN121509144 (A). International Patent Classifi..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Applied Materials has applied WIPO patent for Method for Forming Slated Device Structures Using Blazed Structure Template. Luo Yingdong, Jiang Lei, Wang Wenhui, Godet Ludovic and Sell David Alexander developed it.
The patent application number is WO2025US56455 20251120. The patent publication number is WO20261..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has published Lam Research patent application for Cooling, Sealing, and Gas Injection for Efficient, Extended Lifetime Inductively-coupled-plasma Sources. The invention was developed by Konkola Paul, Smith Shaun Tyler, Sakiyama Yukinori and Leeser Karl Frederick.
The pa..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has released Lam Research patent application for Metal-containing Byproduct Removal from Plasma Chamber. This invention was developed by Hsu Kuo-hsiang, Wang Yan-yu, Tsai Hao-tso, Chou Ya-shin, Shih Ching-hua and Yeh Ting-yu.
The patent application number is WO2025US559..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Micron Technology has submitted a patent application for Microelectronic Devices, and Related Methods and Electronic Systems. This invention was developed by Conti Anna Maria, King Matthew J and Kim Terry H.
The patent application number is WO2025US55752 20251117. The patent publication number is WO2026112001 ..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Micron Technology has sought patent for Format for Commands and Completion Records Used with Shared Work Queue. This invention was developed by Labat Pierre, Rajgopal Suresh, Bert Luca and Stonelake Paul.
The patent application number is WO2025US55711 20251117. The patent publication number is WO2026111993 (A1..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has released Rambus patent application for Base Die for Stacked Memory Device with Memory Controllers and Interconnect. This invention was developed by Miller Michael Raymond.
The patent application number is WO2025US55596 20251114. The patent publication number is WO20..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Applied Materials has applied WIPO patent for Coupler for a Slit Valve Gate Having a Rotatable Joint. Amir Ofer and Zaragoza Ramon developed it.
The patent application number is WO2025US55194 20251112. The patent publication number is WO2026111944 (A1). International Patent Classification code is H10P72/00.
..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Micron Technology has sought patent for Shared Work Queue to Receive Commands with Address for Completion Record. This invention was developed by Labat Pierre, Rajgopal Suresh, Bert Luca and Stonelake Paul.
The patent application number is WO2025US55163 20251112. The patent publication number is WO2026111941 (..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Microchip Technology has filed a patent application for Top Metal Layout Design Pattern to Improve Polyimide Film Adhesion for Passivated Devices. This invention was developed by Feng Zhiming, Liu Robin (haibing), Dou Xinyuan, Zitouni Moaniss, Lewis William R, Khosropour Pejman and Daemen Eleonore.
The paten..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Micron Technology has submitted a patent application for Vertical Planar Cells with In-pillar Channel Structures. Fujiki Jun, King Matthew J and Fukuzumi Yoshiaki developed the invention.
The patent application number is WO2025US55007 20251111. The patent publication number is WO2026111927 (A1). International ..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Qualcomm has sought patent for Scan Chain Segmentation for an Integrated Circuit. This invention was developed by Tiwari Rajesh Kumar, Yadav Yogesh, Patil Srinivas and P Malek Mohammed Zuber.
The patent application number is WO2025US54979 20251111. The patent publication number is WO2026111926 (A1). Internat..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Texas Instruments has submitted a patent application for Branch Prediction Using Multiple Tables. This invention was developed by Lies Garrett.
The patent application number is WO2025US54734 20251110. The patent publication number is WO2026111911 (A1). International Patent Classification code is G06F9/38. Coop..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Applied Materials has submitted a patent application for Plasma Uniformity Control System and Methods for Processing a Semiconductor Substrate. This invention was developed by Sarode Vishwanath Yogananda and Ramaswamy Kartik.
The patent application number is WO2025US51015 20251015. The patent publication numbe..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Applied Materials has submitted a patent application for System and Method for Cleaning a Chamber. Ke Chang, Zhang Peiyu, Wang Changgong, Yuan Xiaoxiong, Kedia Aviral, Paul Sangeeta and Joy Anand developed the invention.
The patent application number is WO2025US49070 20251001. The patent publication number is ..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has received Microchip Technology patent application for System and Method for Debugging Clb Logic Element States Using Only One Pin. Kolinger Attila and Booth Josh developed the invention.
The patent application number is WO2025US35627 20250627. The patent publication ..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Microchip Technology has submitted a patent application for High Temperature Strain Gauge and Method. Mcfarland Patrick, Nagel Steve, Chen Bomy and Eck Arthur developed the invention.
The patent application number is WO2025US30754 20250523. The patent publication number is WO2026111777 (A1). International Pate..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Microchip Technology has submitted a patent application for Trimming an Offset Voltage Drift Based on Measurements at Two Temperatures. Nolan Jim, Rai Milan and Blake Kumen developed the invention.
The patent application number is WO2025US30747 20250523. The patent publication number is WO2026111776 (A1). Inte..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- SanDisk Technologies has submitted a patent application for Die-to-wafer Bonded Memory Structures and Methods of Making the Same. This invention was developed by Li Guangyuan, Shao Qing, Totoki Yuji, Toyama Fumiaki and Hou Lin.
The patent application number is WO2025US26654 20250428. The patent publication num..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has released Semiconductor Components Industries patent application for Direct Bonded Metal (dbm) and Connection Technology. This invention was developed by He Peng, Wang Jianfeng, Shi Xiaomin, Xing Anan and Jin Xincheng.
The patent application number is WO2025US14486..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has received Applied Materials patent application for Monolithic Semiconductor Processing Chamber. Sarode Vishwanath Yogananda and Babayan Steven E developed the invention.
The patent application number is WO2024US57334 20241125. The patent publication number is WO20261..
Semiconductor
| Fri 05 Jun 2026
Geneva, June 5 -- Applied Materials has submitted a patent application for Grounding Device for Plasma Processing Chamber. This invention was developed by Pan Yu-herng, An Hsiang and Wu Yu-hsuan.
The patent application number is WO2024US56567 20241120. The patent publication number is WO2026111721 (A1). International Patent Cla..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Nihon Micronics has applied WIPO patent for Electrical Contact Structure, Contactor, and Electrical Connection Device. Kudo Keisuke and Sakurada Daichi developed it.
The patent application number is WO2025JP40762 20251121. The patent publication number is WO2026110905 (A1). International Patent Classificatio..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Nuvoton Technology Japan has submitted a patent application for Semiconductor Laser Element and Method for Manufacturing Semiconductor Laser Element. This invention was developed by Okawauchi Yoshihiko, Makita Koji, Hayashi Shigeo, Fukudome Toshiya and Sato Hitoshi.
The patent application number is WO2025JP406..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Tokyo Electron has applied WIPO patent for Substrate Processing System and Adjustment Method. Hatanaka Takayuki, Ohtani Ryuji, Kondo Shunto, Osada Genki, Takada Gakuto, Makabe Toshiyuki, Kimura Makoto, Yokoyama Kimihiro, Taniguchi Yuta, Masui Akihiro and Saito Ryosuke developed it.
The patent application numbe..
Semiconductor
| Thu 04 Jun 2026
Beijing, June 5 -- State Intellectual Property Office of China has published Jihai Microelectronics patent application for Consumable Chip and Consumable Box. The invention was developed by Liu Weichen.
The patent application number is CN202511771878 20251127. The patent publication number is CN121515609 (A). International Pate..
Semiconductor
| Thu 04 Jun 2026
Beijing, June 5 -- State Intellectual Property Office of China has released Ji Hua Laboratory patent application for Large-size Substrate Leveling Device and Method and Ink-jet Printing Equipment. This invention was developed by Cao Donghao, Wang Shuhui, Li Qi and Lin Shuying.
The patent application number is CN20261061004 2026..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Nihon Micronics has submitted a patent application for Support Structure for Electrical Contact, Electrical Contact, and Electrical Connection Device. This invention was developed by Nasu Mika.
The patent application number is WO2025JP39736 20251113. The patent publication number is WO2026110696 (A1). Internat..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Toray Industries has filed a patent application for Photosensitive Resin Composition, Cured Product, Organic El Display Device, and Semiconductor Device. This invention was developed by Sugisaki Yuma and Fukuhara Sho.
The patent application number is WO2025JP36962 20251021. The patent publication number is WO2..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Nihon Micronics has applied WIPO patent for Probe, Electrical Connection Device, and Method for Manufacturing Probe. Nara Yuto and Fukushi Naoki developed it.
The patent application number is WO2025JP36003 20251010. The patent publication number is WO2026110525 (A1). International Patent Classification code is..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Resonac has submitted a patent application for Resin-coated Substrate, Resin-coated Substrate Manufacturing Method, Printed Wiring Board, and Electronic Component Device. This invention was developed by Miyasaka Masahiro, Takayasu Satoshi, Kotake Tomohiko and Kobayashi Yuzuru.
The patent application number is ..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Fasford Technology has applied WIPO patent for Bond Head Unit, Die Bonding Device, Die Bonding Method, and Method for Manufacturing Semiconductor Device. Hoshino Yuto, Saegusa Ryo and Matsuzoe Akio developed it.
The patent application number is WO2025JP34109 20250926. The patent publication number is WO2026110..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Mitsubishi Electric has filed a patent application for Multilayer Substrate Provided with Built-in Mover. This invention was developed by Sugiyama Yuta.
The patent application number is WO2025JP05965 20250221. The patent publication number is WO2026110371 (A1). International Patent Classification codes are H05..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Fuji has submitted a patent application for Substrate Work Machine and Method for Placing Support Member. Nakai Kenji developed the invention.
The patent application number is WO2024JP41618 20241125. The patent publication number is WO2026110353 (A1). International Patent Classification code is H05K13/04.
Wo..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Resonac has submitted a patent application for Resin Composition, Resin Film, Laminate, Method for Producing Laminate, Printed Wiring Board, and Semiconductor Package. This invention was developed by Miyasaka Masahiro, Takayasu Satoshi, Kotake Tomohiko and Kobayashi Yuzuru.
The patent application number is WO2..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has released Sumitomo Electric Industries patent application for Compound Semiconductor Single Crystal Substrate and Method for Manufacturing Compound Semiconductor Single Crystal. This invention was developed by Oeki Yuichi, Hirota Ryu, Hirose Kotaro, Yamamura Masataka,..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has released Semiconductor Energy Laboratory patent application for Semiconductor Device. This invention was developed by Yamazaki Shunpei, Hamada Toshiki and Yakubo Yuto.
The patent application number is WO2025IB61701 20251117. The patent publication number is WO202611..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Semiconductor Energy Laboratory has submitted a patent application for Semiconductor Device. This invention was developed by Tsuda Kazuki and Inoue Tatsunori.
The patent application number is WO2025IB61700 20251117. The patent publication number is WO2026110000 (A1). International Patent Classification codes a..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has published Semiconductor Energy Laboratory patent application for Semiconductor Device and Display Device. The invention was developed by Kawashima Susumu, Shishido Hideaki, Kusunoki Koji and Watanabe Kazunori.
The patent application number is WO2025IB61699 20251117...
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Semiconductor Energy Laboratory has submitted a patent application for Organic Compound and Light-emitting Device. This invention was developed by Kubota Tomohiro, Tosu Keito, Watabe Takeyoshi, Ohsawa Nobuharu, Takeda Kyoko and Yoshiyasu Yui.
The patent application number is WO2025IB61698 20251117. The patent ..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has released Semiconductor Energy Laboratory patent application for Semiconductor Device. This invention was developed by Toyotaka Kouhei, Furutani Kazuma and Yakubo Yuto.
The patent application number is WO2025IB61696 20251117. The patent publication number is WO202610..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Brooks Automation (Germany) has applied WIPO patent for Process Aware, Defectivity Based Contamination Control Recipe Development in Chip Manufacturing. Saraswatula Jagdish, Li Fan and Wu Cathy developed it.
The patent application number is WO2025EP83751 20251121. The patent publication number is WO2026109679 ..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Hitachi Energy has submitted a patent application for Semiconductor Module and Method for Manufacturing. This invention was developed by Santolaria Lluis, Truessel Dominik, Maleki Milad and Beyer Harald.
The patent application number is WO2025EP83568 20251119. The patent publication number is WO2026109594 (A..
Semiconductor
| Thu 04 Jun 2026
Beijing, June 5 -- Suzhou Walun Machinery has filed a patent application for Straightness Straightening Device of Chip Mounter Cutter and Straightening Method of Straightness Straightening Device. This invention was developed by Tang Gangbiao.
The patent application number is CN202511550365 20251028. The patent publication numb..
Semiconductor
| Thu 04 Jun 2026
Beijing, June 5 -- Chongqing Hengnuo Electronics has submitted a patent application for Chip Detection Device for Chip Processing and Production. This invention was developed by Lin Zhongtian, Fu Wenwu and Jiang Muhua.
The patent application number is CN202511943455 20251222. The patent publication number is CN121514174 (A). In..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has released ASML Netherlands patent application for Projection-based Die-to-database Alignment for Image-based Inspection. This invention was developed by Chieh Seng-wei, Zuo Hongquan, Qiu Kangsheng and Pu Lingling.
The patent application number is WO2025EP81065 202510..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- ASML Netherlands has submitted a patent application for Method for Modeling Metrology Data Over a Substrate Area and Associated Apparatuses. This invention was developed by Hu Lan.
The patent application number is WO2025EP80137 20251020. The patent publication number is WO2026109232 (A1). International Patent ..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- World Intellectual Property Organization has released ASML Netherlands patent application for Metrology Target. This invention was developed by Mccabe Alexander and Verma Alok.
The patent application number is WO2025EP78639 20251006. The patent publication number is WO2026109208 (A1). International Patent Clas..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- ASML Netherlands has filed a patent application for Charged Particle-optical Element. This invention was developed by Krecinic Faruk, Wieland Marco, Mangnus Albertus, Löw Peter, Koning Johan and Toonen Wiebe.
The patent application number is WO2025EP78625 20251006. The patent publication number is WO202610920..
Semiconductor
| Thu 04 Jun 2026
Geneva, June 5 -- Siemens has filed a patent application for System for Identifying a Semiconductor Assembly Comprising a Substrate. This invention was developed by Schmenger Jens and Betz Stefan.
The patent application number is WO2025EP78305 20251002. The patent publication number is WO2026109201 (A1). International Patent ..
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