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Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Yitang Semiconductor Tech Beijing Co Ltd and Beijing E Town Semiconductor Technology have submitted a patent application for Plasma Equipment. This invention was developed by Yu Xiaocui, Zhao Zhongsheng, Hou Jianhua, Zhao Junzhao, Wang Chunlei, Luo Gonglin, Guan Changle and Song Yongming.
The patent appli..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Haipu Co Ltd has filed a patent application for Field Performance Control Method and System for Multiple Light-emitting Devices. This invention was developed by Choi Bo Yun.
The patent application number is CN202511864432 20251211. The patent publication number is CN122248612 (A). International Patent Cla..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Semiconductor Manufacturing International (Shanghai) and Semiconductor Mfg International Beijing Corp have sought patent for Package Ring Structure and Forming Method Thereof. This invention was developed by Chen Kai and Zhang Tianfu.
The patent application number is CN202411855747 20241216. The patent pu..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Shenzhen Semipeak Tech Co Ltd, Shanghai Kaijie Semiconductor Tech Co Ltd, Changdian Microelectronics Jiangyin Co Ltd and Zhejiang Dingjing Technology have applied Chinese patent for Lead Bonding Method and Lead Bonding Device. Guo Liangkui, Yao Lun, Chang Chengjian, Cheng Guangliang, Yu Long and Li Wenjie de..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Shanghai Yaogan Tech Co Ltd patent application for Method for Integrating Wafer-level Module with Heat Dissipation Structure and Module. This invention was developed by Han Yinan.
The patent application number is CN202610156444 20260203. The patent ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Semiconductor Manufacturing International (Shanghai) and Semiconductor Mfg International Beijing Corp have sought patent for Chip Architecture and Forming Method Thereof. This invention was developed by Wang Jinen, Yan Dayong, Qiang Li, Na Qing and Zhao Yajun.
The patent application number is CN2024118562..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Hubei 3D Semiconductor Integration Innovation Center Co Ltd has filed a patent application for Semiconductor Device and Preparation Method Thereof. This invention was developed by Chen Runpeng, Li Linyu, Liu Wei and Cheng Cui.
The patent application number is CN202411836206 20241213. The patent publicatio..