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Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Beijing Institute Of Computer Technology And Application has submitted a patent application for Sip Packaging Structure Based on Hybrid Bonding Technology. Song Bin, Xi Liang, Ma Yanan, Zhao Xuan, Wang Dantong and Hou Xuewei developed the invention.
The patent application number is CN202511998311 20251228...
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has received Changjiang Electronics Tech Jiangyin Co Ltd patent application for Interconnection Body, Packaging Module and Preparation Method Thereof. Li Peng, Wang Nan, Gu Jiongjiong and Li Quanbing developed the invention.
The patent application number is CN202..
Semiconductor
| Wed 29 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has released Chongqing Beili Xinyan Tech Co Ltd patent application for Multi-valued Rram Read-write Circuit and Read-write Method Thereof. This invention was developed by Yang Yiming, Wang Haitao, Hu Tingting, Liu Zicheng and Liu Yongchen.
The patent application ..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- U.S. Patent and Trademark Office has awarded a patent to Aril Computer Corp for Content-addressable Memory (CAM) Cell with P and N Pass Gates to Same Write Bit Line. Doluca Sinan and Riordan Thomas developed the invention.
The patent application number is US202418780884 20240723. The patent publication ..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Qualcomm Incorproated and Qualcomm have secured a patent on Hybrid Boosting for Memory Write Assist. Dutta Debarghya, Nimmakayala Ramakoti, Sahu Rahul and Singh Diwakar developed the invention.
The patent application number is US202418428482 20240131. The patent publication number is US12682946 (B2). In..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Aiweisenna Tech Co Ltd has submitted a patent application for Optical Interconnection Processor and Memory Module. This invention was developed by Pezewski Brian, Afifi Eyal, Kalman Richard and Min Sungwoo.
The patent application number is CN20248063658 20241002. The patent publication number is CN12196997..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Beijing Xinli Tech Innovation Center Co Ltd has submitted a patent application for Chip-to-wafer Advanced Packaging Method. This invention was developed by Liu Kuo, Han Jianzhong and Xu Peng.
The patent application number is CN202610177274 20260206. The patent publication number is CN121969047 (A). Interna..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation and Huahong Semiconductor, Wuxi have sought patent for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Chen Hualun, Yao Zhiyuan, Fang Mingxu and Wang Li.
The patent application number is CN202610156982 20..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Chongqing Xinlian Microelectronic Co Ltd has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Li Qiumao, Jiang Linfeng and Hayashi Akihiro.
The patent application number is CN20251210556 20251229. The patent publication number is C..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has received Semiconductor Mfg Int Tianjin Co Ltd and Semiconductor Manufacturing International (Shanghai) patent application for Semiconductor Device and Preparation Method Thereof. Cui Jia, Li Qinghua and Xu Luan developed the invention.
The patent application ..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has received Wuxi Xinzhuo Huguang Semiconductor Co Ltd patent application for MOSFET Device. Liu Junwen developed the invention.
The patent application number is CN202610167888 20260205. The patent publication number is CN121985560 (A). International Patent Class..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Xidian University and Shaanxi Junpu Xinhang Tech Co Ltd have applied Chinese patent for Deep Source Etching Wide Band Gap Transistor and Manufacturing Method Thereof. Song Xiufeng, Yu Longyang, Zhao Shenglei, Wang Zhongxu, Hao Yue, Zhang Jincheng and Gao Linhuan developed it.
The patent application number ..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has published BOE Huacan Optoelectronics Guangdong Co Ltd patent application for Multi-channel Transistor and Preparation Method Thereof. The invention was developed by Jiang Zhulin, Wang Rui, Zhang Zhongyu and Chen Kuangli.
The patent application number is CN202..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Yangtze Memory Holdings Co Ltd has submitted a patent application for Semiconductor Device and Preparation Method Thereof, and Storage System. This invention was developed by Liu Lei, Yang Yi and Liu Wenjing.
The patent application number is CN202411499617 20241024. The patent publication number is CN12198..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Hangzhou Xingyuanchi Semiconductor Co Ltd has filed a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Qi Biao, Kim Jae Woo, Shi Haoran, Kim Young-goan, Shao Dali and Li Hui'en.
The patent application number is CN202610397216 20260330. The patent..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has received Yangtze Memory Holdings Co Ltd patent application for Semiconductor Device and Manufacturing Method Thereof. Liu Xiaoxin developed the invention.
The patent application number is CN202411508574 20241025. The patent publication number is CN121985531 (..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Hefei Weiyun Semiconductor Tech Co Ltd has submitted a patent application for Rotation Adjustment Type Ion Beam Etching Uniformity Correction Structure. Yuan Wei and Wang Jun developed the invention.
The patent application number is CN202610275297 20260309. The patent publication number is CN121983488 (A)...
Semiconductor
| Wed 29 Jul 2026
Beijing, July 30 -- Hangzhou Dianzi University and Information Science Academy of China Electronics Technology Group have submitted a patent application for Chip Circuit Device of K-band Receiving Assembly. This invention was developed by Liu Jun, Wang Zhiqiang, Li Xiao, Hong Li, Peng Yiyao, Su Guodong, Choi Jeong-woo, Zhao Xuez..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Shenzhen Xinyou Microelectronics Tech Co Ltd has filed a patent application for Chip Packaging Method. This invention was developed by Sheng Yan, Zhang Bowei and Li Jian.
The patent application number is CN202511940083 20251222. The patent publication number is CN121969206 (A). International Patent Classif..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Shenzhen Xinyou Microelectronics Tech Co Ltd has filed a patent application for Ultrathin DFN Device Packaging Processing Method. This invention was developed by Sheng Yan, Zhang Bowei and Li Jian.
The patent application number is CN202511931184 20251219. The patent publication number is CN121969205 (A). I..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Huatian Tech Baoji Co Ltd has sought patent for Multi-fc Packaging Frame Structure and Processing Method Thereof. This invention was developed by Hu Pan, Wang Yonghui, Zhang Lin, Chen Guolan, Deng Daobin, Pei Mingming and Lin Xingjiang.
The patent application number is CN20261082087 20260121. The patent pu..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has published Tsinghua University and North Integrated Circuit Tech Innovation Center patent application for Fan-out Packaging Integrated Heat Dissipation Structure and Preparation Method Thereof. The invention was developed by Wu Yongbo, Song Chang-myung, Wang Qian..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Chengdu BOE Optoelectronics Technology, BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Display Substrate and Display Device. This invention was developed by Qu Yi, Xiao Xingliang, Tao Xuan, Chen Du, Chen Jiaxing, He Liangliang and Li Zhengkun.
The patent..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Kechuang Zhilian Tech Co Ltd and Guangzhou Xinweida Intelligent Tech Co Ltd have filed a patent application for Injection Molding Packaging Process Based on RFID Chip. This invention was developed by Zhang Xiaoqing and Yu Zhichun.
The patent application number is CN202511989389 20251226. The patent publica..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Suzhou Novosense Microelectronics and Shanghai Naxi Microelectronics Co Ltd have submitted a patent application for Isolation Chip and Isolation System. This invention was developed by Shao Yuting, Zhao Minqi, Wu Fan, Chen Qihui, Liu Qingran and Ye Jian.
The patent application number is CN20261072017 20260..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Zhejiang Jingsheng Mechanical & Electrical and Zhejiang Qiushi Semiconductor Equipment have submitted a patent application for Wafer Laser Annealing Control Method, Wafer Laser Annealing Method and Related Device. Wang Yue, Jin Qianchi, Zhu Liang and Chen Shunan developed the invention.
The patent applicat..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Hunan University and Hunan Normal University have submitted a patent application for Micro Light Emitting Diode Display Device and Manufacturing Method Thereof. This invention was developed by Leng Meiying, He Kun and Pan Anlian.
The patent application number is CN202511443607 20251010. The patent publicat..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Saijing Asia Pacific Semiconductor Technology Zhejiang and Swiss Semiconductor Tech Co Ltd have applied Chinese patent for Semiconductor Device with More Uniform Thermal Stress Distribution on Surface of Chip. Diaz Regosa Paula, Schneider Nick, Stecconi Tommaso and Christian Lars Nohr developed it.
The pat..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Liding Semiconductor Tech Shenzhen Co Ltd and Liding Semiconductor Tech Qinhuangdao Co Ltd have submitted a patent application for Manufacturing Method of Package Substrate. This invention was developed by Yang Yue and Wu Peicheng.
The patent application number is CN202411505489 20241025. The patent public..
Semiconductor
| Wed 29 Jul 2026
Beijing, July 30 -- Xiamen Faratronic, Harbin University of Science and Technology, Anhui Tongfeng Electronics and Nantong Xinjianghai Power Electronics Co Ltd have submitted a patent application for Semiconductor Core-shell Structure Filling Phase Optimized Polyethersulfone Dielectric for Capacitor and Preparation Method of Sem..
Semiconductor
| Wed 29 Jul 2026
Beijing, July 30 -- Zhejiang Jingsheng Mechanical & Electrical and Hangzhou Huixiang Electro Hydraulic Tech Development Co Ltd have applied Chinese patent for Superconducting Magnet for Monocrystalline Silicon Drawing Process and Process Magnetic Field Adjusting Method. Zhang Feng, Zhu Liang, Zhang Ying, Wu Zhibin and Niu Jiazhe..
Semiconductor
| Wed 29 Jul 2026
Beijing, July 30 -- Xidian University and Suzhou Keyang Semiconductor have sought patent for Wafer-level Acoustic Function Testing Method and Supporting Substrate. This invention was developed by Yang Peipei, Shao Changzhi, Jin Ke, Zheng Yanwen, Ji Ping, Yang Chunyu, Lyu Jun and Shan Guangbao.
The patent application number is..
Semiconductor
| Wed 29 Jul 2026
Beijing, July 30 -- BOE Technology Group and Wuhan BOE Photoelectric Technology Co Ltd have applied Chinese patent for Display Substrate and Display Device. Cheng Liang, Jiang Peng, Wang Hui, Liu Jiantao, Tian Zihan, Ding Jun, Huang Junling and Liu Xin developed it.
The patent application number is CN202411541554 20241031. Th..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have been granted a patent for CMOS Schmitt Trigger Receiver for Thin Oxide Technology. This invention was developed by Peng Yung-chow, Chen Yung-shun and Chang Chin-chiang.
The patent application number is US202418788634 20240730. The pate..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Taiwan Semiconductor Manfuacturing Co Ltd and Taiwan Semiconductor Manfuacturing Company Ltd have secured a patent on Systems and Methods for Duty-cycle and Phase Error Detector (DPED) with Chopping Cancellation Technique. Lin Wei Shuo developed the invention.
The patent application number is US20241876..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have obtained a patent for phase interpolator layout. This invention was developed by Chen Wei Chih and Lin Wei Shuo.
The patent application number is US202418635102 20240415. The patent publication number is US12683592 (B2). International ..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have obtained a patent for rfic with substrate partition. This invention was developed by Hsieh Hsieh-hung, Yeh Tzu-jin and Chang Wei Ling.
The patent application number is US202318320709 20230519. The patent publication number is US1268356..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- NTT Inc and Nippon Telegraph & Telephone have been awarded a patent for Semiconductor Chip and Optical Module. This invention was developed by Kanazawa Shigeru, Shindo Takahiko and Chin Meishin.
The patent application number is US202018040763 20200820. The patent publication number is US12683360 (B2). I..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have secured a patent on Ion Generators of Ion Implanters with Movable Repeller. Meng Ying-chieh developed the invention.
The patent application number is US202318362897 20230731. The patent publication number is US12683112 (B2). Internatio..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have been granted a patent for Clock Generation Circuits for Memory Devices with Built-in Self Test. Lee Chun-ying, Wang Yih, Chang Tung-cheng, Huang Chia-en and Tsai Jui-che developed the invention.
The patent application number is US20231..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- SK Hynix Inc and University Hanyang Ind University Coop Found have been awarded a patent for Method of Operating a Three-dimensional Semiconductor Memory Device. This invention was developed by Min Kyung Hoon, Song Ji Ho, Sim Jae Min, Song Yun Heub, Kang In Ku and Hong Sung In.
The patent application nu..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have been awarded a patent for Magnetoresistive Random-access Memory (MRAM) Cell and Method of Operation Thereof. This invention was developed by Wang Ching-huang, Wang Hung Cho, Chiang Tien-wei, Chuang Harry-hak-lay and You Wen-chun.
The p..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- BOE Technology Group Co Ltd and Ordos Yuansheng Optoelectronics have been awarded a patent for Display Substrate and Display Device. This invention was developed by Liu Liangliang, Duan Sihui, Xue Zhiyong, Zhang Qianqian, Peng Liman, Wu Yan and Gao Le.
The patent application number is US202519064851 202..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Univ Industry Cooperation Group Kyung Hee University and University Industry Cooperation Group Of Kyung University have obtained a patent for system and method for performing layer optimization of stacked resistive random-access memory device by using artificial intelligence technology. This invention was ..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Infineon Technologies Americas Corp and Cypress Semiconductor Corporation have secured a patent on Techniques for Voltage Reference Circuits with Adaptive Power Cycling. Lovelace David and Lin Adrian developed the invention.
The patent application number is US202418633165 20240411. The patent publicatio..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have obtained a patent for photoresist composition. This invention was developed by Zi An-ren and Chang Ching-yu.
The patent application number is US202318152600 20230110. The patent publication number is US12681384 (B2). International Pate..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Interface Tech Chengdu Co Ltd, General Interface Solution Ltd and Interface Optoelectronics (ShenZhen) have been granted a patent for Frictional Alignment Device for Curved Substrate and Method of Use Thereof. Chen Po-lun, Chen Yun-pei and Chen Chien-cheng developed the invention.
The patent application..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Taiwan Semiconductor Manufacturing Co Limited and Taiwan Semiconductor Manufacturing have been awarded a patent for Interposer with Planar Sidewall Surface for Optical Coupling and Methods of Forming the Same. This invention was developed by Tsai Tsung-fu, Wang Chao-jen, Yu Chen-hua, Liu Chung-shi and Lu S..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Cai Pengfei, Qi Fan and Sifotonics Tech Beijing Co Ltd have obtained a patent for dual-polarized light detection and ranging receiving end based on optical chip.
The patent application number is US202217983185 20221108. The patent publication number is US12681152 (B2). International Patent Classificati..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have secured a patent on Gachemical Vapor Deposition Apparatus with Cleaning Gas Flow Guiding Member. Lin Yi-ming, Tseng Tung-ching, Yang Sheng-chun, Yeh Chih-hung and Lee Tsung-lin developed the invention.
The patent application number is ..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have secured a patent on System for Determining Transistor Operating Characteristics. Chen Chu Fu and Huang Ping-hsiang developed the invention.
The patent application number is US202418624250 20240402. The patent publication number is US12..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have been granted a patent for Methods for Reducing Vibration of Semiconductor Manufacturing Apparatuses and Semiconductor Manufacturing Apparatuses. Ho Yi-chen, Wang Wei-ming, Liao Ker-hsun, Liao Chih Ping, Lin Chien Ting, Lin Chi-hsun and Ya..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Chengdu BOE Optoelectronics Technology and BOE Technology Group have filed a patent application for Display Substrate and Display Device. This invention was developed by Liang Cuicui, Chen Jing, Liu Cheng, Liu Bin, Yang Ming and Bao Jiandong.
The patent application number is CN20248001770 20240830. The pat..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Chengdu BOE Optoelectronics Technology and BOE Technology Group have submitted a patent application for Display Substrate and Display Device. Guan Xinxing, Zhang Ruqin, Fang Fei, Zhou Weifeng and Shi Ling developed the invention.
The patent application number is CN20248001761 20240829. The patent publicati..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Sumitomo Bakelite and Promerus have sought patent for Photosensitive Composition Containing PFAS-free Polycyclic Olefin Polymer and Semiconductor Device. This invention was developed by Masuda Takanobu, Nishida Kento, Sugiyama Hiromichi, Kuboyama Toshiharu, Tomiyama Eiko, Otoguro Akihiko, Skilski Donald and N..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Samsung Electronics and Samsung Semiconductor China Res And Development Co Ltd have filed a patent application for Package Substrate and Method of Manufacturing the Same. This invention was developed by Yang Zhenrong.
The patent application number is CN202610125340 20260129. The patent publication number i..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Xidian University and Xidian Wuhu Research Institute have submitted a patent application for Preparation Method of U-shaped Pr Mask and Silicon Carbide Power Device. This invention was developed by Zhou Yu, Chi Benben, Liu Gang, Xing Yali and Liu Heng.
The patent application number is CN202511944578 202512..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Xi'an ESWIN Silicon Wafer Technology and Xi'an ESWIN Material Technology have applied Chinese patent for Defective Wafer Interception Method, Device, Equipment and Medium. Wan Xun, He Xin, Cheng Yu and Hu Yizhou developed it.
The patent application number is CN202511842176 20251209. The patent publication ..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Zhiwei Semiconductor Shanghai Co Ltd and Hefei Zhiwei Semiconductor Co Ltd have applied Chinese patent for Multi-position Wafer Taking and Placing Device. Chen Xinlai, Zhang Hui, Lu Saihao, You Jia, Zhu Junjie and Gong Shuaihao developed it.
The patent application number is CN20251210306 20251229. The pate..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Hwatsing and Hwatsing Beijing Tech Co Ltd have filed a patent application for Moving Device for Wafer Film Pasting and Wafer Film Pasting Equipment. This invention was developed by Liu Zhidong, Fu Yongxu, Liu Yuanhang, Zhao Dewen and Li Sen.
The patent application number is CN20251101321 20250721. The pate..
Semiconductor
| Wed 29 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has received Shanghai Xinliji Semiconductor Co Ltd patent application for Video Stream Processing Method and Device for Video Monitoring Scene Based on Yolo Model. Cheng Hao and Tang Wenkai developed the invention.
The patent application number is CN202610459518 ..
Semiconductor
| Thu 30 Jul 2026
Seoul, July 30 -- Agp Co Ltd has submitted a patent application for a Multi-chip Carry Package and Manufacturing Method of the Package. This invention was developed by Lee Min Pyo and Ha Min Ki.
The patent application number is KR20230090865 20230713. The patent publication number is KR20250011777 (A). International Patent Cl..
Semiconductor
| Thu 30 Jul 2026
Seoul, July 30 -- LG Innotek has submitted a patent application for Semiconductor Package. Yoo Joo Young and Kim Yong Suk developed the invention.
The patent application number is KR20230091976 20230714. The patent publication number is KR20250011489 (A). International Patent Classification codes are H01L23/00, H01L23/482 and..
Semiconductor
| Thu 30 Jul 2026
Seoul, July 30 -- Korean Intellectual Property Office has received Koes Co Ltd patent application for Solar Cell Module Manufactoring Method. Ko Ji Hoon, Kim Dong Min and Jang Nam Hak developed the invention.
The patent application number is KR20230091860 20230714. The patent publication number is KR20250011437 (A). Internati..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- SambaNova Systems has been granted a patent for Scannable Memory Subsystem. This invention was developed by Ziaja Thomas and Jordan Paul.
The patent application number is US202418752638 20240624. The patent publication number is US12682973 (B2). International Patent Classification codes are G11C29/10, G..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- U.S. Patent and Trademark Office has awarded a patent to Yangtze Memory Technologies for Memory Device and Operation Method Thereof, Memory System, and Storage Medium. Li Da, Wang Ya, Tian Yaoyao, Qi Wei, Chen Wenping, Xu Feng and Zhang Shuai developed the invention.
The patent application number is US2..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- SunRise Memory Corporation has secured a patent on Memory Structure Including Three-dimensional Nor Memory Strings and Method of Fabrication. Harari Eli developed the invention.
The patent application number is US202318175259 20230227. The patent publication number is US12682953 (B2). International Pate..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- U.S. Patent and Trademark Office has awarded a patent to Sony Semiconductor Solutions Corporation for Semiconductor Storage Device. Ishikawa Nobuyuki, Watanabe Koji, Shimada Tomoko, Motomura Tetsuo, Naritake Isao, Ikeda Kazufumi, Nagamatsu Kenichi, Ojiro Tsukasa and Kinoshita Yoshihiko developed the invent..
Semiconductor
| Thu 30 Jul 2026
Alexandria, July 30 -- Silicon & System Co Ltd has secured a patent on Acoustic Element Integrated Circuit, Probe, and Diagnosis Device. Tadaki Yoshitaka, Kikuchi Hiroshi, Ogaya Kaoru, Takemoto Yoshiaki and Umemura Shin-ichiro developed the invention.
The patent application number is US202418414011 20240116. The patent public..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Roehm has filed a patent application for Semiconductor Device. This invention was developed by Mori Seigo and Waguri Hajime.
The patent application number is CN20248064499 20240919. The patent publication number is CN121986567 (A). International Patent Classification code is H10D30/66. Cooperative Patent C..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Yangtze Memory Holdings Co Ltd has sought patent for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Zhao Yi, Huo Zongliang, Wen Min, Xiao Liang and Zhou Wenbin.
The patent application number is CN20248003772 20240830. The patent publication number is CN121986565 (..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Advanced Chip Circuits Mat Inc has submitted a patent application for Ultrathin Composite Dielectric for Printed Circuit Boards. Amla Jayesh, Amra Khairul and Amla Tarun developed the invention.
The patent application number is CN20248049997 20240730. The patent publication number is CN121986550 (A). Inter..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has received Zongren Tech Pingtan Co Ltd patent application for Quantizer, Modulator and Signal Processing Method. Chen Jinyi, Lu Yuling, Chen Mengbang and Cai Ronghuai developed the invention.
The patent application number is CN20251234216 20251230. The patent p..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Guizhou Mugongguixin Microelectronics Co Ltd has submitted a patent application for High-speed Low-power-consumption Comparator. This invention was developed by Liao Yong, Liang Jiangshan, Bai Jinsong and Yuan Yongbin.
The patent application number is CN202511818855 20251204. The patent publication number ..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has released Sony Semiconductor Solutions Corporation patent application for Surface Light Emitting Element. This invention was developed by Yokoyama Hiroki, Maeda Osamu, Subedi Bipin, Otoguro Yuta, Higashi Ryoma and Jogan Naoki.
The patent application number is ..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Airoha Technology has received a patent for Source Follower Circuit with Feedback Loop and Self-biased Diode-connected Metal-oxide-semiconductor Load. This invention was developed by Wu Chung-ru, Wu Min-hua and Hsieh Yi-keng.
The patent application number is US202418826142 20240905. The patent publicati..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- U.S. Patent and Trademark Office has awarded a patent to Allegro MicroSystems for Power-thru Booster. Mangtani Vijay and Salato Maurizio developed the invention.
The patent application number is US202418813518 20240823. The patent publication number is US12683602 (B2). International Patent Classificatio..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Fuji Electric has received a patent for Semiconductor Device and Overcurrent Protection Device. This invention was developed by Sato Shigeki.
The patent application number is US202418605427 20240314. The patent publication number is US12683600 (B2). International Patent Classification codes are G01R19/0..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Mitsubishi Electric has obtained a patent for semiconductor element driving apparatus. This invention was developed by Imanishi Motoki and Sano Shohei.
The patent application number is US202418793701 20240802. The patent publication number is US12683598 (B2). International Patent Classification codes ar..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- KUKA Deutschland GmbH has been granted a patent for Method for Controlling at Least One Servomotor in a Braking Manner, Robot, and Com- Puter Program Product. Keyl Hartmut and Hofmann Josef developed the invention.
The patent application number is US202017778575 20201110. The patent publication number i..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- United States Patent for Power Convertor Circuit and Control Circuit Thereof has been issued to PowerX Semiconductor. This invention was developed by Chien Min Chu.
The patent application number is US202418661728 20240513. The patent publication number is US12683493 (B2). International Patent Classifica..
Semiconductor
| Wed 29 Jul 2026
Alexandria, July 30 -- Wisconsin Alumni Research Foundation has obtained a patent for high-efficiency drive circuit and bidirectional fet. This invention was developed by Gupta Chirag, Pasayat Shubhra S and Ludois Daniel.
The patent application number is US202318371248 20230921. The patent publication number is US12683482 (B2..
Semiconductor
| Thu 30 Jul 2026
Seoul, July 30 -- Beijing E Town Semiconductor Technology has applied Korean patent for Gas Distribution Element and Heat Treatment Device Containing the Same. Haiwei Li, Jianmin Ji and Wenyi Li developed it.
The patent application number is KR20240089368 20240708. The patent publication number is KR20250011074 (A). Internati..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Chuzhou Huarui Microelectronic Tech Co Ltd has sought patent for Manufacturing and Detecting Method of Vdmos Device. This invention was developed by Li Jiayang, Hu Xingzheng and Xue Lu.
The patent application number is CN202610148948 20260203. The patent publication number is CN121969121 (A). International..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has released Hefei Nexchip Integrated Circuit patent application for Semiconductor Test Structure and Method. This invention was developed by Chen Wenjing, Shao Yingya and Wang Xuechun.
The patent application number is CN202610425182 20260402. The patent publicat..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Zhiwei Semiconductor Shanghai Co Ltd and Hefei Zhiwei Semiconductor Co Ltd have sought patent for Wafer Clamping, Lifting and Overturning Device. This invention was developed by Wan Xiaoqiang, Zhang Hui and Wang Kui.
The patent application number is CN20251209746 20251229. The patent publication number is ..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has published Zhiwei Semiconductor Shanghai Co Ltd and PNC Process Systems patent application for Splash-proof Liquid Crystal Round Chuck Supporting Structure. The invention was developed by Lin Jian, Shen Yilin and Xie Zhaojun.
The patent application number is C..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Beijing Semiconductor Special Equipment Research Institute The 45th Research Institute Of China Electronics Te has filed a patent application for Vacuum Pressure-bearing Alignment Platform. This invention was developed by Jing Maosheng, Zhang Guangyu, Wu Jie, Yang Ziyuan and Sun Shuai.
The patent applicati..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Laser Manufacturing Institute Henan Academy Of Sciences has submitted a patent application for Wafer Carrier Layer Height Automatic Calibration Method and Related Device. This invention was developed by Yi Wendi, Lu Han, Yanagizu, Dai Han, Jiang Haoqing, Yang Hao, Chen Peipei, Hao Hongwei, Wang Jingrui, Gu Li..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Zhiwei Semiconductor Shanghai Co Ltd and PNC Process Systems have filed a patent application for Wafer Loading, Overturning and Soaking Mechanism. This invention was developed by Fei Zhangyu, Gao Weihua, Yang Liuliu, Shi Qintian and Zhang Tianbo.
The patent application number is CN202511993765 20251226. Th..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has received Dongguan Zhongke Huizhu Semiconductor Co Ltd patent application for Method for Removing Metal Pollution on Surface of Sic Substrate by Liquid Phase Method. Yang Junwei, Du Kai, Song Huaping and Guo Songbo developed the invention.
The patent applicati..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Zhiwei Semiconductor Shanghai Co Ltd and PNC Process Systems have submitted a patent application for Small-flow Liquid Precise Conveying System and Control Method. Zhang Gaomin, Chen Xinlai, Ma Dong and Wang Kui developed the invention.
The patent application number is CN20251244727 20251231. The patent pu..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has released Xi'an Xinxin Material Tech Co Ltd and Xi'an ESWIN Material Technology patent application for Wafer Cleaning System and Method. This invention was developed by Kang Jian.
The patent application number is CN202511907326 20251217. The patent publication..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- State Intellectual Property Office of China has released BOE Huacan Optoelectronics Guangdong Co Ltd patent application for Film Source Separating Device. This invention was developed by Tang Miao, Jiang Ke, Liu Jianwei and Zhang Wei.
The patent application number is CN202511855283 20251210. The patent pub..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Anhui Wotian Sensing Tech Co Ltd has submitted a patent application for Wafer Corrosion Process and Corrosion Method. This invention was developed by Pan Changhua.
The patent application number is CN202511931900 20251219. The patent publication number is CN121969044 (A). International Patent Classification..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Semiconductor Device and Preparation Method Thereof. Niu Kunlong and Zhang Xiaoliang developed the invention.
The patent application number is CN202610419234 20260401. The patent publication number is CN121969040 (A). International Pat..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Semiconductor Structure and Preparation Method Thereof. Zhang Jing and He Yang developed the invention.
The patent application number is CN202610407639 20260331. The patent publication number is CN121969039 (A). International Patent Cl..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Guangxi Rengu Energy Saving Tech Co Ltd has sought patent for Chip Continuous Extraction Device for Dry Etching Machine. This invention was developed by Wang Shifa.
The patent application number is CN202610139285 20260202. The patent publication number is CN121969037 (A). International Patent Classificatio..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Qingdao Sirui Intelligent Tech Co Ltd has sought patent for Activation and Surface Protection Method for Ion Implantation Sic. This invention was developed by Wang Yuyue, Tian Long, Zhang Cong, Li Chenran, Zhang Rui, Xu Biao, Zhang Yuzhao, Ma Guoyu and Hu Haixin.
The patent application number is CN20261041..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 30 -- Chongqing Xinlian Microelectronic Co Ltd has submitted a patent application for Etching Stop Layer for Reducing Rc Delay and Preparation Method Thereof. This invention was developed by Huang Junxian, Song Xiangjin and Zeng Guoxing.
The patent application number is CN202511988529 20251226. The patent public..
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