Semiconductor
| Wed 08 Apr 2026
Beijing, April 8 -- State Intellectual Property Office of China has awarded a patent to Huaqiao University for Packaging Substrate Three-dimensional Measuring Device. Liang Jia, Yi Dingrong, Wu Dongliang, He Xiaoqian, Zhang Fanshu, Liu Binye, Liu Chuyue, Chen Chaofan, Guo Zibin, Qiu Shunshun and Wang Houjie developed the inventi..