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Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Fanta Semiconductor Tech Hangzhou Co Ltd has sought patent for Soft Starting Method and Device for Resonance Circuit. This invention was developed by Lin Sicong, Yu Zhiyuan and Lee Jin-bok. The patent application number is CN202610549723 20260424. The patent publication number is CN122092670 (A). Internati..

Semiconductor

  |  Fri 14 Aug 2026

Seoul, Aug. 14 -- Ham Hae Su has sought patent for UV-LED UV-LED Structure with Induction Blow Cooling Means. This invention was developed by Ham Ki Jong. The patent application number is KR20230097884 20230727. The patent publication number is KR20250017313 (A). International Patent Classification codes are B41F15/00, B41F23..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Dingjian Beijing Information Tech Co Ltd has sought patent for Dynamic Load Balancing Method and System Based on Redis and Memory Collaboration. This invention was developed by Yi Chunlei, Yang Qingfei, Cheng Ning, Liu Wei, Liu Kebao, Xu Shichun, Li Qiang and Yan Linsheng. The patent application number is ..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Zhonghao Xinying Hangzhou Tech Co Ltd has sought patent for Flow Blocking Node Diagnosis Method and Device and Storage Medium. This invention was developed by Zheng Hanxun, Liu Zixiang and Chen Chaohui. The patent application number is CN202610546268 20260423. The patent publication number is CN122093290 (..

Semiconductor

  |  Fri 14 Aug 2026

Seoul, Aug. 14 -- Btoz Inc has sought patent for GaN HEMT Method for Fabricating Gan-based Hemt Device. This invention was developed by Kim Dong Hwan and Lee Hyun Jae. The patent application number is KR20230097828 20230726. The patent publication number is KR20250017046 (A). International Patent Classification codes are H01L..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Yuguang New Mat Co Ltd for Mounting and Fixing Frame for Led Screen of Hot-air Balloon. Zhu Longshan developed the invention. The patent application number is CN202423255338U 20241228. The patent publication number is CN223524914 ..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Shanghai Defan Automation Mech and Electrical Equipment Co Ltd has been granted a patent for Chip Cover Opening Machine. Wang Dingchun, Zhang Wei and Luo Lei developed the invention. The patent application number is CN202422973348U 20241204. The patent publication number is CN223526473 (U). International P..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Shanghai Lion Semiconductor Co Ltd has sought patent for Power Module Formed by Combining Sub-modules. This invention was developed by Yuan Xuegan and Yuan Dewei. The patent application number is CN202610269558 20260306. The patent publication number is CN122094160 (A). International Patent Classification ..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Chinese Patent for Chip Rotation Testboard has been issued to Suzhou Forcreat Intelligent Tech Co Ltd. This invention was developed by Gui Yiyong and Zhang Weixiang. The patent application number is CN202422505419U 20241016. The patent publication number is CN223526395 (U). International Patent Classificat..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Shenzhen Hope Microelectronics Co Ltd has filed a patent application for Chip Clock Calibration Method, Device and Circuit. This invention was developed by Lee Young Tae. The patent application number is CN202610542114 20260423. The patent publication number is CN122092833 (A). International Patent Classif..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Hangzhou Angkun Semiconductor Equipment Co Ltd has submitted a patent application for Wafer Defect Identification Method, System and Equipment Based on Local Threshold Calculation, and Medium. This invention was developed by Huang Kangning, Ma Tiezhong and Luo Yong. The patent application number is CN20261..

Semiconductor

  |  Fri 14 Aug 2026

Munich, Aug. 14 -- Olfera Corp has submitted a patent application for Brain-on-a-chip Designs and Layouts and Methods for Using Same. This invention was developed by Lak Parnian and Renault Renaud. The patent application number is EP20240875408 20241003. The patent publication number is EP4788789 (A1). International Patent Cl..

Semiconductor

  |  Fri 14 Aug 2026

Munich, Aug. 14 -- Centre Nat Rech Scient and University Sorbonne have submitted a patent application for a Microfluidic Chip, Apparatus and Method for in Vitro Fertilization. This invention was developed by Gerena Edison and Haliyo Sinan. The patent application number is EP20230804750 20231006. The patent publication number ..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Nanjing Yili Xinchuang Semiconductor Tech Co Ltd has obtained a patent for wafer chuck size identification device. This invention was developed by Zhang Jingnan and Chen Mingzhan. The patent application number is CN202422979689U 20241204. The patent publication number is CN223527138 (U). International Pate..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Lianshuo Semiconductor Tech Suzhou Co Ltd has obtained a patent for chip dismounting and mounting equipment. This invention was developed by Wang Chengcai. The patent application number is CN202422790961U 20241115. The patent publication number is CN223527133 (U). International Patent Classification code i..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Chinese Patent for Efficient Heat Transfer Ptc (positive Temperature Coefficient) Thermistor has been issued to Zhaoqing Anxinda Electronics Co Ltd. This invention was developed by Yuan Dan, Long Yaokui, Xu Jingbin, Wu Guogui and Deng Jingfa. The patent application number is CN202422368988U 20240927. The p..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Shenzhen Shuaihongyu Tech Co Ltd has obtained a patent for aging test device for memory production. This invention was developed by Fan Zhonghua. The patent application number is CN202422630857U 20241030. The patent publication number is CN223526876 (U). International Patent Classification code is G11C29/5..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Zhejiang Liji Storage Tech Co Ltd has received a patent for Dynamic Random Access Memory. This invention was developed by Chen Xiaoyan. The patent application number is CN20242313003U 20241206. The patent publication number is CN223526873 (U). International Patent Classification codes are G11C11/4091, G11C..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Hangzhou Yuxin Microelectronics Co Ltd has obtained a patent for phase change memory. This invention was developed by Wang Xizheng. The patent application number is CN20242375196U 20241213. The patent publication number is CN223526872 (U). International Patent Classification codes are G11B33/14 and G11C13/..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Zhoulei New Energy Shenzhen Co Ltd has been awarded a patent for Led Module Convenient to Install. This invention was developed by Huang Ying and He Bin. The patent application number is CN202422663149U 20241101. The patent publication number is CN223525065 (U). International Patent Classification codes ar..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has published Advanced Ion Beam Tech Inc patent application for Ion Implanter. The invention was developed by Lai Yuteng. The patent application number is CN202411694875 20241125. The patent publication number is CN122091459 (A). International Patent Classificati..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Guangzhou Youshuo Microelectronics Tech Co Ltd has been granted a patent for Integrated Circuit Lead Frame Capable of Rapidly Dissipating Heat. Liang Linqing developed the invention. The patent application number is CN202422978458U 20241203. The patent publication number is CN223527178 (U). International P..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Hubei Jiangcheng Laboratory has received a patent for Semiconductor Structure. This invention was developed by Yang Zhandi, Liu Shujuan, Peng Haoyang and Jiang Zhongkai. The patent application number is CN202422915583U 20241127. The patent publication number is CN223527171 (U). International Patent Classif..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has awarded a patent to Guizhou Yaguang Electronics Technology Co Ltd for Diode Base Structure. Zhou Shuhao, Xiang Fei, Li Shuang, Chen Ting, Long Yunfei and Zhang Lin developed the invention. The patent application number is CN202422785676U 20241114. The patent ..

Semiconductor

  |  Fri 14 Aug 2026

Munich, Aug. 14 -- Soitec Silicon On Insulator and Commissariat Energie Atomique have filed a patent application for Semiconductor Structure Based on Silicon Carbide for Power Applications and Associated Fabrication Process. This invention was developed by Gaudin Gweltaz, Rouchier Séverin, Bethoux Jean-marc, Widiez Julie, Gelin..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Electric Power Planning & Eng Inst Co Ltd and Nengjian Shidai Shanghai New Energy Storage Technology Research Inst Co Ltd have submitted a patent application for High-reliability Optical Storage Integrated Controller Based on Domestic Chip and Real-time Operating System. Xu Fei, Gu Qinchen, Xu Chen, Bu Xiaoku..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Suzhou Everbright Photonics Tech Co Ltd and Suzhou Everbright Semiconductor Laser Innovation Research Inst Co Ltd have submitted a patent application for Edge-emitting Semiconductor Laser Chip and Preparation Method and Failure Analysis Method Thereof. Shao Ye, Tan Shaoyang, Wang Jun and Min Dayong developed ..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Baic Bjev Bluepark Power System Co Ltd and Beijing Electric Vehicle have submitted a patent application for Method for Inhibiting Expansion of Silicon Negative Electrode. This invention was developed by Song Ranran, Jin Zhaoxing, Liang Ping, Liu Guijuan, Yang Huimin, An Hongli, Wang Fang and Jiang Zhicheng. ..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Nanjing University of Posts and Telecommunications and Nanjing University Of Posts and Telecommunications Inst At Nantong Co Ltd have applied Chinese patent for Phase Change Memory Array Fault Test Circuit. He Nan, Zhang Yunbo, Yao Jiafei, Ban Chaoyi, Cai Zhikuang, Lian Xiaojuan and Wang Lei developed it. ..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- BOE Crystal Core Technology Co Ltd and BOE Technology Group have applied Chinese patent for Light Emitting Substrate, Display Device, and Method of Manufacturing Light Emitting Substrate. Gao Bo, Pei Xiaoguang, Liu Jianlong and Dong Enkai developed it. The patent application number is CN20248001961 2024092..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Qinghai Asia Silicon Industry Polysilicon, Asia Silicon Qinghai, Qinghai Asia Silicon Silicon Mat Co Ltd, Qinghai Asia Silicon Semiconductor Co Ltd, Haidong Hongshi Semiconductor Co Ltd and Qinghai Yagui Silicon Material Engineering Tech Co Ltd have secured a patent on Polycrystalline Silicon Crushed Aggregat..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Chengdu BOE Optoelectronics Technology and BOE Technology Group have submitted a patent application for Touch Display Substrate and Display Device. This invention was developed by Li Chunyan, Li Ting and Kim Hyun-sun. The patent application number is CN20248001986 20240926. The patent publication number is..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Nippon Sheet Glass and Mikuni Color Works have sought patent for Glass Substrate with Functional Film. This invention was developed by Sasaki Teruyuki, Inoue Yuta, Ide Yasuhiro and Tatei Yuka. The patent application number is CN20248064088 20241004. The patent publication number is CN122094923 (A). Interna..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 --Inner Mongolia Zhongqi Core Mat Co Ltd and Beijing University have applied Chinese patent for Embedded Micro-fluidic Active Heat Dissipation Structure Based on Diamond Substrate and Preparation Method of Embedded Micro-fluidic Active Heat Dissipation Structure. Li Qiliang, Zhao Jianbo, Tian Jingfeng, Xu Shaolo..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Cr Microelectronics Holdings Co Ltd and China Resources Runan Tech Chongqing Co Ltd have applied Chinese patent for Semiconductor Module and Semiconductor Device. Liu Yuancheng, Pan Xiaofei, Zhang Xiankun and Zhang Xiaodong developed it. The patent application number is CN202411701254 20241125. The patent ..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Nanjing Microbonding Semiconductor Co Ltd and Siponmicro Wuxi Co Ltd have submitted a patent application for Matching Detection Method and Device for Chip Packaging and Wire Welding Process, and Computer Equipment. Mu Yunfei and Wang Bin developed the invention. The patent application number is CN202610175..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Grg Metrology & Test Group Shanghai Tech Co Ltd, Guangzhou Grg Metrology &test Co Ltd, Grg Metrology & Test Wuxi Co Ltd and Grg Metrology & Test Group Co Ltd have sought patent for Plastic Package Chip Unsealing Device and Method. This invention was developed by Huang Qinbin, Liu Fei, Zhu Yaohui, Ye Junhao an..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Chengdu BOE Optoelectronics Technology and BOE Technology Group have applied Chinese patent for Display Substrate and Display Device. Liu Tingliang, Wang Wei, Guan Xinna, Yang Chao, He Yi, Liu Daiyong, Yang Sheng, Zhang Yuanqi, Tao Xuan and Zhou Peng developed it. The patent application number is CN2024117..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Huaneng Jiayuguan New Energy Co Ltd and Huaneng Clean Energy Research Inst have submitted a patent application for Monocrystalline Silicon Hjt Photovoltaic Module and Packaging Process Thereof. This invention was developed by Lin Zizhen, Chen Chuanke, Wang Wei, Xue Yao, Wang Zhize, Wang Haijun, Li Rui, Li You..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Hefei Eswin Computing Tech Co Ltd and Beijing ESWIN Computing Technology have submitted a patent application for Resistor String Layout Structure, Chip and Electronic Equipment. This invention was developed by Zhang Xiaoheng and Liu Haimin. The patent application number is CN202610194103 20260210. The pate..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Saijing Asia Pacific Semiconductor Technology Zhejiang and Swiss Semiconductor Tech Co Ltd have submitted a patent application for Preparation Method of Silicon Carbide Power Device with Self-alignment Area. This invention was developed by Diaz Regosa Paula, Schneider Nick, Stecconi Tommaso and Christian Lars..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Beijing Xingyun Integrated Circuit Co Ltd and Xingyun Jiwei Chengdu Tech Co Ltd have applied Chinese patent for Chip Control Method and Chip. Yu Zhonglin, Chang Wei, Liu Bing, Ji Yu and Yu Hongmin developed it. The patent application number is CN202610209067 20260212. The patent publication number is CN122..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Shandong Runma Solar Energy Tech Co Ltd and Ronma Solar Technology Jinhua have sought patent for Passivation Structure and Preparation Method Thereof, and Silicon Solar Cell and Preparation Method Thereof. This invention was developed by Yu Wangwang, He Liang, Li Shifeng, Shi Xiujiang and Zhang Haiyang. Th..

Semiconductor

  |  Fri 14 Aug 2026

Munich, Aug. 14 -- European Patent Office has received Sanyo Shipyard Co Ltd patent application for Ship Cylindrical Rudder. Nakamura Hiroshi developed the invention. The patent application number is EP20240874411 20240830. The patent publication number is EP4789962 (A1). International Patent Classification codes are B63H25/0..

Semiconductor

  |  Fri 14 Aug 2026

Munich, Aug. 14 -- European Patent Office has published Woodside Energy Technologies Pty Ltd patent application for Method and System for Mercury Removal and Capture in a Hydrocarbon Feed Stream. The invention was developed by Lawer Janelle Louise, Mackay Harry Holmes and Watt Andrew Robson. The patent application number is E..

Semiconductor

  |  Fri 14 Aug 2026

Munich, Aug. 14 -- European Patent Office has received Epiroc Canada Inc patent application for Safety Mechanism for an Overshot, Overshot Including Same, and Method of Using Same. Salvador Patrick and Gauthier Spencer developed the invention. The patent application number is EP20240874149 20240924. The patent publication num..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Xinchaoliu Zhuhai Tech Co Ltd has applied Chinese patent for Universal Calibration Circuit for High-speed Serdes Chip and Working Method Thereof. Zheng Lin, Zhao Xuehui and Wang Tao developed it. The patent application number is CN202610342031 20260319. The patent publication number is CN122092880 (A). Int..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Suzhou Lair Microwave Tech Inc has submitted a patent application for Single Balanced Mixer Integrating Second Harmonic Extraction and Self-shielding Functions and System. This invention was developed by Wang Qimeng, Xing Jingwen, Peng Shuai and Mao Shensi. The patent application number is CN202610529524 2..

Semiconductor

  |  Fri 14 Aug 2026

Munich, Aug. 14 -- Qal Semiconductor Inc has submitted a patent application for Quasi-adiabatic Logic. This invention was developed by Agan Tommy and Lupino James. The patent application number is EP20240875571 20241007. The patent publication number is EP4789295 (A1). International Patent Classification codes are H03K19/094,..

Semiconductor

  |  Fri 14 Aug 2026

Munich, Aug. 14 -- Nantstudios LLC has filed a patent application for Modular Led Wall Apparatus, Systems and Methods. This invention was developed by Heinrichs Keaton Arthur, Marshall Gary Robert, Williams Christopher Paul and Soon-shiong Patrick. The patent application number is EP20240875361 20241003. The patent publicatio..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Shandong Shengxin Electronic Tech Co Ltd has applied Chinese patent for Core Particle Three-dimensional Layered Interconnection Packaging Structure. Shen Chunyan, Luan Xinpeng, Zhang Mingjian and Lu Huizhi developed it. The patent application number is CN20261061249 20260116. The patent publication number ..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Sanhe Jianhua High Tech Co Ltd has submitted a patent application for Double-station Pre-alignment System Suitable for Trimming Wafers. Huang Shuo, Du Jianke, Guan Liangyin, Liu Fushan and Li Mengkai developed the invention. The patent application number is CN202610448535 20260407. The patent publication n..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has released Beijing Ziyixin Integrated Circuit Co Ltd patent application for Chip Packaging Technology and Structure with Magnetic-mechanical Composite Positioning Mechanism. This invention was developed by Huang Zhangbin and Yang Weiyuan. The patent application..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Zhizhen Storage Beijing Tech Co Ltd has filed a patent application for Semiconductor Packaging Structure and Manufacturing Method Thereof. This invention was developed by Wang Gefei, Fan Xiaofei, Zhang Zhongkui and Pan Weiliang. The patent application number is CN202610126960 20260129. The patent publicati..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Beijing Ziyixin Integrated Circuit Co Ltd has sought patent for Heat Dissipation Advanced Packaging Structure for Accelerating Air Convection and Manufacturing Method Thereof. This invention was developed by Huang Zhangbin and Yang Weiyuan. The patent application number is CN202610172799 20260206. The pate..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Chuzhou Huarui Microelectronic Tech Co Ltd has submitted a patent application for VDMOS Manufacturing Method. This invention was developed by Li Jiayang, Hu Xingzheng and Xue Lu. The patent application number is CN202610178513 20260209. The patent publication number is CN122094470 (A). International Patent..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Beijing Semiconductor Special Equipment Research Inst The 45th Research Inst Of China Electronics Te has submitted a patent application for Wafer Position Pre-alignment Method and System. This invention was developed by Wang Jialin, Ding Penggang, Ma Wanming and Xin Xiangyu. The patent application number i..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Huatian Tech Nanjing Co Ltd has applied Chinese patent for Novel Pop Packaging Structure Capable of Improving Heat Dissipation and Improving Warpage. Gao Ruifeng and Xie Xianyu developed it. The patent application number is CN20261009008 20260106. The patent publication number is CN122094551 (A). Internati..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Shangrao Lijing Innovation Tech Co Ltd has filed a patent application for Chip Packaging Production Equipment with Glue Filling Mechanism. This invention was developed by Song Haisheng, Xiao Renhai and Wu Xianhong. The patent application number is CN202610119074 20260128. The patent publication number is C..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has published Guangdong Xinyueneng Semiconductor Co Ltd patent application for Method for Protecting Bottom of Groove by Using Photoresist Partial Filling Process in Wet Etching. The invention was developed by Huang Tao and Liang Daqiang. The patent application n..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Shanghai Lingang Kingstone Semiconductor Co Ltd, Beijing Kaishitong Semiconductor Co Ltd and Kingstone Semiconductor Joint Stock Co Ltd have submitted a patent application for Repair Method and System for Ion Implantation, Ion Implanter and Related Equipment Thereof. This invention was developed by Cui Shipei..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Shanghai Lingang Kingstone Semiconductor Co Ltd, Beijing Kaishitong Semiconductor Co Ltd and Kingstone Semiconductor Joint Stock Co Ltd have applied Chinese patent for Repair Method and System for Ion Implantation, Ion Implanter and Related Equipment. Cui Shipei, Xia Shiwei, Wang Xinlei and Zhang Shanfeng dev..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has received Suzhou Lijin Semiconductor Co Ltd patent application for Roughening Method and Roughening Device of Light-emitting Device. Xiong Wenjun, Xu Qiming, Deng Biao, Liu Legong and Wang Wenjun developed the invention. The patent application number is CN2026..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Global Sensor Technology Co Ltd has filed a patent application for Chip Packaging Structure and Preparation Method Thereof. This invention was developed by Ye Fan, Wang Yaqin, Huang Li, Gao Jianfei, Wang Chunshui and Huang Sheng. The patent application number is CN202610107974 20260127. The patent publicat..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- HLJ Tech Co Ltd has submitted a patent application for Ultrahigh-speed Photodetector. This invention was developed by Reilwin, Zeng Yanjun, Lai Lihong and Lin Bingcheng. The patent application number is CN202411692608 20241125. The patent publication number is CN122094200 (A). International Patent Classifi..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has released Haowei Integrated Circuit Group Co Ltd patent application for Manufacturing Method of Longitudinal Low-capacity High-voltage Unidirectional Tvs Device and Device. This invention was developed by Liu Kaizhe, Xu Chengzong, Cai Yannan and Gu Qifan. The ..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Xidian University and Guangzhou Research Inst Of Xidian University have submitted a patent application for Monolithic Integrated Structure of Transverse Complementary Logic Device and Vertical GaN. This invention was developed by You Shuzhen, Gao Wenxiang, Lei Yilong, Yu Jiayao, Jia Weixuan, Yun Keqi, Hao Yue..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Chongqing Semi Chip Electronic Co Ltd and No. 24 Research Inst Of Cetc have submitted a patent application for Complete Set of High-current Wide-power-supply All-dielectric Isolation Bcd-on-soi Integration Technology and ESD Self-protection Vdmos Device. This invention was developed by Qian Cheng, Lin Chengpe..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has received Shanghai Lion Semiconductor Co Ltd patent application for Module for Free Combination. Yuan Xuegan and Yuan Dewei developed the invention. The patent application number is CN202610268693 20260306. The patent publication number is CN122094159 (A). Int..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has published Carsem Semiconductor Suzhou Co Ltd patent application for Semiconductor Side-by-side Packaging Structure and Preparation Method Thereof. The invention was developed by Chen Zhuanling, Shi Yan, Bi Shubei, Wang Lei and Lu Lisheng. The patent applicati..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has released Xidian University and Guangzhou Research Inst Of Xidian University patent application for Shield Grid Enhanced Voltage-resistant GaN Vertical Device and Preparation Method Thereof. This invention was developed by You Shuzhen, Gao Wenxiang, Lei Yilong, Y..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has published Feizeng Semiconductor Shanghai Co Ltd patent application for Semiconductor Structure and Forming Method Thereof. The invention was developed by Chen Ximing, Zhou Yongchang, Peng Dingkang, Li Haonan, Zhang Yongjie and Li Xiaogang. The patent applicat..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Episil Tech Inc has submitted a patent application for Semiconductor Assembly and Manufacturing Method Thereof. Zhang Yuanzhou, Liu Yuanliang, Li Yizhen and Chen Yanzhang developed the invention. The patent application number is CN20251090790 20250121. The patent publication number is CN122094138 (A). Inte..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Semiconductor Manufacturing International (Shanghai) and Semiconductor Mfg International Beijing Corp have filed a patent application for Storage Structure and Forming Method Thereof. This invention was developed by Qiao Chunyu, Liu Cui and Tai Guojun. The patent application number is CN202411710998 202411..

Semiconductor

  |  Fri 14 Aug 2026

Seoul, Aug. 14 -- Korean Intellectual Property Office has received Time Link Co Ltd patent application for Light Emitting Device. Jung Jae Hyun developed the invention. The patent application number is KR20230098283 20230727. The patent publication number is KR20250017481 (A). International Patent Classification codes are F21..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has received University Of Pecs patent application for Semiconductor-based High-energy Terahertz Radiation Source. Hebling John, Toth Gabor, Krizan Gunther, Tibor Zach and Almasi Giancarlo developed the invention. The patent application number is CN20248054871 20..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- Len Tech Co Ltd has submitted a patent application for LED Driving Circuit and Led Driving Device. Lu Weipeng, Wu Yundong, Meng Weiwei and Lin Xiaoqing developed the invention. The patent application number is CN202610531490 20260421. The patent publication number is CN122093978 (A). International Patent C..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has received Shenzhen Kaishang Weiye Electronic Tech Co Ltd patent application for Led Indicating Circuit. Xu Qimin developed the invention. The patent application number is CN202510591157 20250508. The patent publication number is CN122093977 (A). International ..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has published Shanghai Xinliji Semiconductor Co Ltd patent application for Data Transmission Method, Device and System Based on Hierarchical Port Domain. The invention was developed by Li Baolong and Luan Guipeng. The patent application number is CN202610525061 2..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has released Shaanxi Sanjiaofeng Information Tech Co Ltd patent application for Internet Access Quality Monitoring System and Method for Sensing User Experience in Real Time. This invention was developed by Zhao Xin. The patent application number is CN20261028007..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- China Starnet Network Application Research Inst Co Ltd has submitted a patent application for Method, Chip, Computing Device, Storage Medium and Program Product for Burst Communication System. This invention was developed by Li Peilin, Li Bin, Zhuang Yunsheng, Li Jianing and Xu Tongtong. The patent applica..

Semiconductor

  |  Thu 13 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has received Nantong Weisi Paier Semiconductor Tech Co Ltd patent application for Method for Reducing Appearance Marks on Copper Surface After AMB Solder Etching. Chen Juming, Zhou Xin and Wu Li'e developed the invention. The patent application number is CN202610..

Semiconductor

  |  Fri 14 Aug 2026

Seoul, Aug. 14 -- Korean Intellectual Property Office has published Jinwoong Ind Co Ltd patent application for New Compound and Organic Light Emitting Device Comprising the Same. The invention was developed by Lee Nam Geol, Lee Keum Hee, Kim Young Joon, Lee Sang Jin, Yoo Seung Il and Lee So Hee. The patent application number ..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Chinese Patent for Electrostatic Chuck Copper Electrode Film Laminating Device has been issued to Anhui Huaxi Semiconductor Tech Co Ltd and Xuancheng Advanced Photovoltaic Tech Co Ltd. This invention was developed by Wang Jiaqi, Sun Xiaodong, Gu Yong, Qu Changming, Cai Ailing, Chen Zhankai, Guo Tie, Xie Chenc..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Changzhou Chuanggao Exhibition Products Co Ltd has received a patent for Light-emitting Profile and Light-emitting Column. This invention was developed by Li Yibo. The patent application number is CN202422964454U 20241203. The patent publication number is CN223525046 (U). International Patent Classificatio..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Kunshan Yijiao Decoration Eng Co Ltd has received a patent for Led Light-emitting Unit and Light-emitting Assembly. This invention was developed by Wang Xingsong and Wang Li. The patent application number is CN202423202716U 20241225. The patent publication number is CN223525036 (U). International Patent Cl..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Shenzhen Mulinsheng Microelectronic Co Ltd has submitted a patent application for Multi-objective Optimization Method for High-voltage Silicon Carbide Module. This invention was developed by Zhan Maosheng. The patent application number is CN202610193197 20260210. The patent publication number is CN12209267..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Chengdu Monolithic Power Systems has submitted a patent application for Electronic Circuit, Integrated Circuit and Reversed Polarity Protection Circuit. Yang Xiangyi and Zhao Zhuoyi developed the invention. The patent application number is CN202411688981 20241125. The patent publication number is CN122092169..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Ningbo Chima Winch has submitted a patent application for Winch Control Method and System, Intelligent Terminal and Medium. This invention was developed by Zheng Mingkui. The patent application number is CN202511985720 20251225. The patent publication number is CN122092715 (A). International Patent Classif..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has released Wuxi China Resources Microelectronics Integrated Circuit patent application for Driving Control Circuit, Working Method, Driving Control Chip and Voltage Reduction System. This invention was developed by Liu Jun. The patent application number is CN2024..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Hangzhou Beihang University International Innovation Inst Beihang University International Innovatio has filed a patent application for Sensing Analysis Self-healing Control Method and Device for Integrated Circuit Power Supply. This invention was developed by Zhao Jinsong, Lyu Chen, Ma Jian, Tan Xiaojun, Ton..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- State Intellectual Property Office of China has published NVIDIA patent application for System and Method for Data Center Power Distribution. The invention was developed by Karutuli Vidya, Lee Thomas, Bell Andrew, Qiu Zirui, Black Mike, Dimitrov Rouslan and Gorla Gaurav. The patent application number is CN20..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Forty Eighth Research Inst Of China Electronics Technology Group Corporation has submitted a patent application for Integrated Semiconductor Laser Chip and Preparation Method Thereof. This invention was developed by Zeng Qingping, Zhang Yuexin, Zhang Hao, He Feng, Yu Lang and Zhou Meng. The patent applicat..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Anhui Geen Semiconductor has submitted a patent application for Anti-reflection Semiconductor Laser Device. Zheng Jinjian, Chen Wanjun, Zhong Zhibai, Zhang Jiangyong, Deng Heqing and Yang Lixun developed the invention. The patent application number is CN202610552699 20260424. The patent publication number is..

Semiconductor

  |  Fri 14 Aug 2026

Munich, Aug. 14 -- European Patent Office has released Univ Koc patent application for a Suspended Piezoresistive Silicon Nanowire-based Sensor with Mechanical Stress Amplification. This invention was developed by Karimzadehkhouei Mehrdad, Alaca Erden and Ghourichaei Masoud Jedari. The patent application number is EP202309549..

Semiconductor

  |  Fri 14 Aug 2026

Munich, Aug. 14 -- European Patent Office has released IQE patent application for III-N Semiconductor Structures for HEMT Devices. This invention was developed by Laboutin Oleg and Engel Zachary. The patent application number is EP20240772936 20240902. The patent publication number is EP4789512 (A1). International Patent Clas..

Semiconductor

  |  Fri 14 Aug 2026

Munich, Aug. 14 -- Wolfspeed has submitted a patent application for Gate Trench Power Semiconductor Devices Having Shaped Deep Support Shields That Reduce Cell Pitch and On-state Resistance. This invention was developed by Kim Woongsun, Islam Naeem, Ryu Sei-hyung and Sampath Madankumar. The patent application number is EP202407..

Semiconductor

  |  Fri 14 Aug 2026

Munich, Aug. 14 -- Wolfspeed has applied European patent for Gate Trench Power Semiconductor Devices Having Deep Support Shields and Methods of Fabricating Such Devices. Kim Woongsun, Islam Naeem, Ryu Sei-hyung and Sampath Madankumar developed it. The patent application number is EP20240777087 20240906. The patent publication n..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- University of Electronic Science and Technology of China has submitted a patent application for Ultra Wide Band Millimeter Wave Filter Based on Tgv. This invention was developed by Zhang Jihua, Li Shuqi, Kong Xin, Liu Jinxu and Chen Hongwei. The patent application number is CN202610361471 20260324. The pat..

Semiconductor

  |  Fri 14 Aug 2026

Beijing, Aug. 14 -- Chinese Patent for Microscope Adjustable Base for Appearance Detection of Semiconductor Module has been issued to Guangzhou Qinglanshidai Semiconductor Co Ltd. This invention was developed by Liao Xiaozhou, He Shiyong and Li Wei. The patent application number is CN20252072151U 20250113. The patent publicat..
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