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Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Xinjiang University and Xinjiang Institute Engineering have submitted a patent application for CFD Numerical Simulation Method for Erosion Wear of Elbow of Polycrystalline Silicon Cold Hydrogenation Reactor. This invention was developed by Stahon Atilam, Yang Jiafu, Ma Junyan, Yang Wenwen, Song Yonggang and D..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Xinte Energy Co Ltd and Xinjiang Guiji New Mat Innovation Center Co Ltd have filed a patent application for Broadband-gap Perovskite Precursor Solution, Light Absorption Layer, Single-junction Perovskite and Perovskite/crystalline Silicon Laminated Solar Cell, and Preparation Methods of Single-junction Perovs..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Mianyang Xinhao New Energy Technology and Tsinghua University have submitted a patent application for Broadband-gap Perovskite Solar Cell and Preparation Method Thereof. This invention was developed by Liu Dawei, Lin Hong and Lee Jin-hyun. The patent application number is CN202511208062 20250827. The paten..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Chongqing BOE Display Technology and BOE Technology Group have sought patent for ESD Protection Unit, Array Substrate and Display Device. This invention was developed by Ma Binbin, Zhang Wei, Liu Hongyuan, Chen Yuling, Qi Zhijian, Wang Wei and Xu Tongwei. The patent application number is CN202511211414 202..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Jinergy Photovoltaic Tech Co Ltd and Jinergy Clean Energy Technology Co Ltd have filed a patent application for Plasma Enhanced Chemical Vapor Deposition (PECVD) Process Gradient Laminated Anti-reflection Film and Preparation Method Thereof. This invention was developed by Cui Ning, Mu Xiaochao, Zhang Wei, Ya..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Taizhou Zhong Lai Photoelectric Technology and Shanxi Zhonglai Solar Energy Battery Tech Co Ltd have submitted a patent application for Method for Improving Reliability of Laser-assisted Sintering of Solar Cell and Solar Cell. This invention was developed by Zhang Geng, Xu Zhuo, Song Jian, Guo Fei, Li Feng an..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Niko Semiconductor and Super Group Semiconductor Co Ltd have submitted a patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Tang Songnian, Chen Hetai and Xu Xiuwen. The patent application number is CN202410644059 20240523. The patent publicatio..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Huahong Semiconductor, Wuxi and Shanghai Huahong Grace Semiconductor Manufacturing Corporation have submitted a patent application for Floating Gate Type Split Gate Flash Memory Device and Manufacturing Method Thereof. This invention was developed by Guo Yuhang, Xu Zhaozhao, Zhang Yintong, Dang Yang, Liu Dong..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Zhuhai Gci Sci & Tech Co Ltd and Guangzhou Jiesai Electronic Tech Co Ltd have submitted a patent application for Semiconductor Test Board Manufacturing Method and Semiconductor Test Board. Liang Jinlian, Zhao Junhui, Liu Jiang, Huang Deye and Fang Pengbo developed the invention. The patent application numb..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Shenzhen Huanan Yingcai Tech Co Ltd and Shenzhen Longxinwei Tech Co Ltd have submitted a patent application for Bluetooth Chip Dynamic Management Method and System Based on Intelligent Device. This invention was developed by Chen Haiwen and He Xiaomei. The patent application number is CN202511582133 202510..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Yamaha Smart Machine Co Ltd and Tokyo Univ Of Science Educational Foundation Administrative Organization have submitted a patent application for Chip Holder, Chip Holder Device, and Apparatus for Manufacturing Semiconductor Device. Kikuchi Hiroshi, Li Jin and Miyatake Masaaki developed the invention. The p..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Inoue MTP KK and Inoue Sponge Sheet Co Ltd have submitted a patent application for Polyurethane Foam, Buffer, and Semiconductor Polishing Member. This invention was developed by Koide Masahito and Kariya Eiji. The patent application number is CN20248021109 20240408. The patent publication number is CN12089..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- BOE Technology Group and Beijing BOE Technology Development have sought patent for Display Substrate and Display Device. This invention was developed by Zhang Chunfang, Liu Weixing, Lu Meirong, Wang Huanhuan, Yan Yuwei, Peng Jintao, Teng Wanpeng, Xu Zhiqiang and Guo Kai. The patent application number is CN..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- BOE Technology Group and Beijing BOE Technology Development have applied Chinese patent for Chip Structure and Display Substrate. Liu Wenqi, Jiao Zhiqiang, Jin Qian, An Chul, Sun Mengna, Sun Zhongyuan and Zhou Ying developed it. The patent application number is CN202410526070 20240428. The patent publicati..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Anhui Xinxu Semiconductor Co Ltd and Anhui Anxin Electronic Tech Co Ltd have submitted a patent application for High-reliability Chip and Manufacturing Process Thereof. Wang Liang'en, Li Jianli and Wang Jin developed the invention. The patent application number is CN20251148011 20250729. The patent publica..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- CRRC Zhuzhou Institute and Crosschip Microsystems Inc have submitted a patent application for Driving Circuit, Driving Method and Driving Chip of Power Device. Lin Zhenjun, Liu Haitao, Zhou Simin, Qian Cheng, Liu Yantao and Wang Maolin developed the invention. The patent application number is CN20251113707..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Huada Semiconductor Co Ltd and Shanghai Belling Co Ltd have applied Chinese patent for Hybrid Modulation Method, System and Device of Isolated Power Supply Chip and Medium. Ding Yongqiang, Liu Weiqiang, Xu Jian and Zhu Jiazhen developed it. The patent application number is CN202511235881 20250901. The pate..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Nanchang University; Nanchang Laboratory and Nanchang Silicon Based Semiconductor Tech Co Ltd have sought patent for Thin Film Type Surface Emission Electro-optical Chip Structure and Preparation Method Thereof. This invention was developed by Gao Jiangdong, Zhang Jianli, Jiang Fengyi, Quan Zhijue, Luo Wenbia..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Changchun University of Science and Technology and Shandong Huaguang Optoelectronics have applied Chinese patent for Dry Etching Method of Indium-containing Iii-v Compound Semiconductor Material. Wei Zhipeng, Jia Huimin, Tang Jilong, Wu Dehua, Du Junjun and Zhang Shuhong developed it. The patent applicatio..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Jiangxi MTC Semiconductor and Jiangxi Zhaochi Integration Tech Co Ltd have submitted a patent application for Scribing Method for Distributed Feedback Laser Chip and Application Thereof. This invention was developed by Cai Kunfu, Zhang Peng, Yang Yi, Hu Jiahui and Jin Conglong. The patent application numbe..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Shenghua New Energy Technology, Dongying and Shida Shenghua New Mat Group Co Ltd have applied Chinese patent for Lithium Ion Battery Electrolyte Based on Silicon Spiro Compound, Preparation Method of Lithium Ion Battery Electrolyte and Ternary Lithium Ion Battery. Xiong Dejun, Yue Jin, Dong Jing, Wang Jingche..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Aitens Co Ltd and TOYOCHEM have sought patent for Electromagnetic Wave Shielding Sheet, Shielding Processed Wafer, Semiconductor Device, and Method for Manufacturing Same. This invention was developed by Ando Kenji, Matsudo Kazunori and Matsuo Reiki. The patent application number is CN202511157029 20250819..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Institute Flexible Electronics Technology, Thu Zhejiang and Tsinghua University have submitted a patent application for Silicon Wafer Cleaning Process. This invention was developed by Feng Xue and Wang Qingbo. The patent application number is CN202410676001 20240528. The patent publication number is CN1210..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Dali Chenyu Energy Storage New Mat Co Ltd and Central South University have submitted a patent application for Shape Memory Modified Silicon Negative Electrode, Preparation Method Thereof and Application of Shape Memory Modified Silicon Negative Electrode in Solid-state Lithium Battery. Zhang Yaguang, Wang Pe..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Siplp Microelectronics Chongqing Ltd and Wuxi China Resources Microelectronics Co Ltd have submitted a patent application for Semiconductor Structure and Manufacturing Method of Semiconductor Structure. This invention was developed by Wang Xinlu, Jiang Yang and Wang Huigang. The patent application number i..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Guangdong Taijin Semiconductor Tech Co Ltd and Dongguan Taijin Precision Tech Co Ltd have applied Chinese patent for Sealing Transfer Structure and Chip Packaging Equipment. Huang Meilin developed it. The patent application number is CN202510939412 20250708. The patent publication number is CN120895510 (A)..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Xi'an ESWIN Material Technology and Xi'an Eswin Silicon Wafer Technology have submitted a patent application for Wafer Detection Equipment and Wafer Detection Method. Guo Hongyan, Yang Xuan, Hu Wenlong, Wang Junfu and Ma Chi developed the invention. The patent application number is CN202510863105 20250625...

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Tianjin Zhonghuan Advanced & Material Technology and Zhonghuan Advanced Semiconductor Technology have applied Chinese patent for Silicon Wafer and Processing Method Thereof. Wu Xiaodong, Bu Shuaibo, Liu Kun, Wang Zunyi, Xie Yunlan, Li Xiaolong and Guo Jingtao developed it. The patent application number is ..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Xi'an ESWIN Material Technology and Xi'an Eswin Silicon Wafer Technology have filed a patent application for Silicon Wafer Processing Method, Device, Processing Equipment, Program Product and Medium. This invention was developed by Guo Hongyan, Chen Guanglin, Zhou Wei, Zhang Liyi and Zhou Guoqing. The pate..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Xi'an ESWIN Material Technology and Xi'an Xinxin Material Tech Co Ltd have submitted a patent application for Wafer Cleaning Method and Wafer. This invention was developed by Guo Hongyan, Choi Won-jin, Zuo Bin, Zhang Shuxing and Xia Xinchao. The patent application number is CN202510852496 20250624. The pat..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Chengdu Yisiwei Computing Tech Co Ltd and Beijing ESWIN Computing Technology have applied Chinese patent for Display Driving Circuit, Display Driving Method, Chip and Electronic Equipment. Cho Hyun-ho developed it. The patent application number is CN202511383844 20250925. The patent publication number is C..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Sihertz Micro Tech Shanghai Co Ltd has applied Chinese patent for Semiconductor Wafer Bonding Device and Bonding Method. Osada Atsushi and Wang Xiaohan developed it. The patent application number is CN20251129357 20250724. The patent publication number is CN120895483 (A). International Patent Classificatio..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Nanjing Huarui Microchip Co Ltd has applied Chinese patent for Wafer Feeding and Discharging Device and Detection System Thereof. Hu Xingzheng and Li Jiayang developed it. The patent application number is CN202511287865 20250910. The patent publication number is CN121035029 (A). International Patent Classi..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Nantong Shenfengfan Tech Co Ltd has applied Chinese patent for Packaging Device with Automatic Isolation Structure for Chip Processing and Method. Kim Yang-yeop developed it. The patent application number is CN202511245415 20250902. The patent publication number is CN121035018 (A). International Patent Cla..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Shenzhen Xingyue Photoelectric Tech Co Ltd has applied Chinese patent for Led Semiconductor Packaging Dispensing Detection Device. Wang Xiaowei and Du Juan developed it. The patent application number is CN202511147999 20250816. The patent publication number is CN121034983 (A). International Patent Classifi..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Hunan Guoxin Semiconductor Tech Co Ltd has applied Chinese patent for Power Semiconductor Packaging Structure and Packaging Method. Du Longchun, Liu Hongwei, Liu Xiaopeng, Cai Zhao and Wang Xianchi developed it. The patent application number is CN202511125531 20250812. The patent publication number is CN12..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Zhixin Semiconductor Co Ltd has applied Chinese patent for Heat Dissipation Substrate for Power Semiconductor Module and Power Semiconductor. Zhang Tuo, Yan Fan, Wang Min, Jiao Shuangfeng, Wang Wei, Wang Xiaomei, Hu Yongzhe and Dong Yuanquan developed it. The patent application number is CN202510937756 202..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Rongtai Semiconductor Jiangsu Co Ltd has applied Chinese patent for Stacked Chip Advanced Package. Hua Wenqiang and Chen Xianbiao developed it. The patent application number is CN20251180956 20250804. The patent publication number is CN120895545 (A). International Patent Classification codes are H01L23/367..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Suzhou Laboratory has applied Chinese patent for Diffraction Type Surface Emitting Semiconductor Laser. Yu Xiaoqi, Xia Suman, Xiong Kanglin, Sun Zhiwei, Zheng Yuzhen, Wang Junfei, Wang Huaibing and Yang Hui developed it. The patent application number is CN202511546437 20251028. The patent publication numbe..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Wuxi Kuangtong Semiconductor Co Ltd has applied Chinese patent for Terminal Structure of Super-junction Semiconductor Device and Super-junction Semiconductor Device. Zhao Yong and Liao Wei developed it. The patent application number is CN202511213633 20250828. The patent publication number is CN120897493 (..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Adicate Inc DBA Indi Semiconductor Co Ltd has applied Chinese patent for Non-cascaded MIMO Channel Extender for Radar Chip. Elad Danny and Corcos Dan developed it. The patent application number is CN20248017034 20240223. The patent publication number is CN120898378 (A). International Patent Classification ..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- ASM Tech Singapore Pte Ltd has applied Chinese patent for Bonding System and Bonding Method for Bonding Lens with Image Sensor. Lin Yaozong, Kwan Ka Shing, Jeong Jin and Ou Baolin developed it. The patent application number is CN202510662945 20250522. The patent publication number is CN121037549 (A). Inter..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has received Wondersolar Co Ltd patent application for Solar Cell Stability Test System and Method. Sheng Yusong, Cheng Ying, Peng Yishu, Zhao Junqiang, Chen Xiayan and Jiang Youyu developed the invention. The patent application number is CN202511142315 20250815...

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has received Jiangsu Qingyan Microelectronics Co Ltd patent application for Super-junction MOSFET Electrostatic Protection Device, Super-junction MOSFET and Preparation Method of Super-junction MOSFET. Yang Fan, Jiang Yibo and Wu Xia developed the invention. The ..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has received Xingyao Semiconductor Wuhan Co Ltd patent application for RGB (red, Green, Blue) Miniature Light-emitting Diode and Manufacturing Method and Device of RGB Miniature Light-emitting Diode. Fang Shiwei, Wang Siwei and Qing Jianing developed the invention. ..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has received Minebea Power Semiconductor Inc patent application for Semiconductor Device. Shiraishi Masaki developed the invention. The patent application number is CN20248019678 20240201. The patent publication number is CN120898532 (A). International Patent Cla..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has received North Integrated Circuit Tech Innovation Center and Tsinghua University patent application for Germanium-silicon Heterojunction Bipolar Transistor and Manufacturing Method Thereof. Zhao Yue and Fu Jun developed the invention. The patent application n..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has received Huayi Microelectronics Co Ltd patent application for SGT-MOSFET Device with Gradually-changed Epitaxial Structure and Preparation Method of SGT-MOSFET Device. Su Yi and Fan Wei developed the invention. The patent application number is CN202511244200 ..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- ACM Research, Shanghai, Acm Res Korea Inc and Qingxin Tech Co Ltd have sought patent for Wafer Processing Device. This invention was developed by Tian Liangang, Wang Hui, He Bin and Kim Kyoung-jun. The patent application number is CN202410676436 20240528. The patent publication number is CN121034989 (A). I..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has received Suzhou Jiarui Xinguang Tech Co Ltd patent application for Semiconductor Structure and Preparation Method Thereof. Li Zengcheng, Liu Zhi, Huang Siyi, Li Fangzhi and Wu Si developed the invention. The patent application number is CN202511524732 2025102..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has received Shenzhen Liande Semiconductor Tech Co Ltd patent application for Die Bonding Method, Die Bonding System, Die Bonding Equipment and Readable Storage Medium. Li Lihui, Lai Taixin, Xiao Qingxiong and Hu Mingliang developed the invention. The patent appl..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Beijing Integrated Circuit Equipment Innovation Center Co Ltd has sought patent for Semiconductor Device and Preparation Method Thereof. This invention was developed by Sun Chunyu. The patent application number is CN20251113045 20250722. The patent publication number is CN121035049 (A). International Paten..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has received No. 24 Research Institute and Chongqing Customs Tech Center patent application for Integrated Circuit Structure and Manufacturing Method Thereof. Li Huawei and Zheng Xiaoling developed the invention. The patent application number is CN202511174515 20..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has published Shenzhen Xinketai Semiconductor Co Ltd patent application for Lc Series-parallel Composite Boost Circuit and Boost Method Thereof. The invention was developed by Liu Longjiao and Liu Changrong. The patent application number is CN202410666636 2024052..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has published Wuxi Xinzhuo Huguang Semiconductor Co Ltd patent application for Capacitor and Manufacturing Method Thereof. The invention was developed by Zhang Jianwei, Qian Baida, Yang Yujun, Shen Yuli and Ding Chao. The patent application number is CN2025113556..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has published Beijing Zhongke Xinweite Tech Development Co Ltd patent application for Semiconductor Device and Preparation Method Thereof. The invention was developed by Li Qing, Zhang Yanfei, Liu Mengxin, Wen Xiaoxia and Wu Haizhou. The patent application number..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Toshiba; Toshiba Electronic Devices & Storage has sought patent for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Hyodo Isao. The patent application number is CN202410913075 20240709. The patent publication number is CN120897486 (A). International Patent Classif..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has published United Semi Integrated Circuit Mfg Xiamen Co Ltd patent application for Structure of Single-transistor Double-resistance Type Memory and Manufacturing Method Thereof. The invention was developed by Lin Weikun, Tan Wenyi, Yao Bin and Kong Dejin. The ..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Fudan University and Jiashan Fudan Res Institute have sought patent for Ring Gate Transistor and Manufacturing Method Thereof. This invention was developed by Li Yuchun, Zhu Xiaona, Zhang Wei, Liu Haiyang and Zhang Hongmei. The patent application number is CN202511544024 20251028. The patent publication nu..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Runxin Microelectronics Dalian Co Ltd has sought patent for Depletion Type GaN Device and Hemt Cascade Type Device. This invention was developed by Ren Yongshuo, Xu Lingrui, Wang Ronghua and Liang Huinan. The patent application number is CN202511565085 20251030. The patent publication number is CN121038321..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has published Beijing Quantum Information Science Res Institute and Tsinghua University patent application for Superconducting Diode and Preparation Method Thereof. The invention was developed by Zhu Yuying, Wang Heng, Zhang Ding and Xue Qikun. The patent applica..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has published Weicheng Semiconductor Equipment Suzhou Co Ltd patent application for Wafer Scrubbing Device, Equipment and Method. The invention was developed by Li Wei and Mao Deji. The patent application number is CN202511173169 20250821. The patent publication ..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has published Liaoning Hanjing Semiconductor Mat Co Ltd patent application for Automatic Boat Carrying Device for Annealing Quartz Boat. The invention was developed by Wang Xing and Zhu Jianing. The patent application number is CN202511549763 20251028. The patent..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has published BeiJing REJE Automation and Tianjin Ruijie Core Guide Robot Co Ltd patent application for Wafer Center Calibration Method and System. The invention was developed by Dong Chunjie, Liu Dongmei, Wang Yong and Wang Qiang. The patent application number i..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Nanjing Nari Semiconductor Co Ltd and State Grid Jiangsu Electric Power Co Res Inst have applied Chinese patent for Multi-chip Parallel Half-bridge IGBT Device. Wang Rui, Zhao Shilin, Chang Feihao, Xu Yang, Chen Yang and Li Hongtao developed it. The patent application number is CN20251114062 20250723. The ..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Shenzhen Univ of Technology has applied Chinese patent for Fault-free Path Selection Method and System for Network-on-chip. Shao Cuiping, Heng Chao, Li Huiyun and Tang Zhimin developed it. The patent application number is CN202510969925 20250715. The patent publication number is CN121037291 (A). Internatio..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has released Huahong Semiconductor, Wuxi and Shanghai Huahong Grace Semiconductor Manufacturing Corporation patent application for Split-gate Flash Memory and Manufacturing Method Thereof. This invention was developed by Zhang Gaoming, Yu Tao and Li Binghan. The ..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has released Xinlian Power Tech Shaoxing Co Ltd patent application for High Electron Mobility Transistor and Preparation Method Thereof. This invention was developed by Li Xiang. The patent application number is CN202511555002 20251029. The patent publication num..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Shenzhen South China Microelectronics Co Ltd has filed a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Tian Liang, Zhang Yu, Huang Sheng, Xia Jinghua, Niu Yingxi, Cao Ye and Wu Chufen. The patent application number is CN202511211230 20250828. ..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Jiangsu Changjing Tech Co Ltd has filed a patent application for Semiconductor Structure. This invention was developed by Chen Fangsheng, Yang Guojiang and Rui Qiang. The patent application number is CN202511554211 20251029. The patent publication number is CN121038334 (A). International Patent Classificat..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Wuyuan Semiconductor Tech Qingdao Co Ltd has filed a patent application for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Chen Tianhua, Yang Ruifeng, Qi Xiaoyu, Yan Tiancai, Yang Lieyong and Chen Weiyu. The patent application number is CN202511168112 20250820. The ..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has released Hongyuan New Materials, Xuzhou and Hongyuan Green Energy Co Ltd patent application for Method for Adjusting Sheet Resistance Uniformity of Topcon Route Boron Diffusion Process. This invention was developed by Yang Hao, Chen Xiangwen and Zhao Shuchen. ..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has released Hunan Huisi Photoelectric Tech Co Ltd patent application for Quantum Dot Based on Quaternary Antimonide Cover Layer and Growth Method Thereof. This invention was developed by Chen Siming, Yang Junjie and Pan Shujie. The patent application number is C..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Ceratec Co Ltd has filed a patent application for Laser Etching Apparatus and Method. This invention was developed by Lim Heung-bin, Joo Hyung Jin and Lim Hyun-soo. The patent application number is CN20258001220 20250324. The patent publication number is CN121038738 (A). International Patent Classification..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Ningbo Meishen Electronic Co Ltd has applied Chinese patent for Wafer Debonding Device. Zhang Chunbin, Lee Chang-gook, Yao Hongguang, Wang Fei, Zhang Runping and Ying Luguang developed it. The patent application number is CN202511251757 20250903. The patent publication number is CN121035019 (A). Internatio..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has released Nantong Ruipo Electromechanical Co Ltd patent application for PCVB Board Etching Machine. This invention was developed by Shi Aihua. The patent application number is CN202511220391 20250829. The patent publication number is CN120897353 (A). Internati..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- State Intellectual Property Office of China has released Luohuaxin Display Tech Development Jiangsu Co Ltd patent application for Light Emitting Diode and Forming Method Thereof. This invention was developed by Li Yong, Qu Cheng and Chen Wenjuan. The patent application number is CN202511393384 20250928. Th..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Shenzhen Amazing Semiconductor Co Ltd has filed a patent application for Synchronous Rectification Control Device and Adaptive Conduction Control Method and System. This invention was developed by Qin Zhiqiang and Zhou Yin. The patent application number is CN20251150974 20250729. The patent publication num..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Shenzhen Baochuang Electronic Equipment Co Ltd has submitted a patent application for High-precision Heterogeneous Integrated Pre-sintering Patching System and Pre-sintering Patching Method Thereof. This invention was developed by Liu Fangzhao, Liu Jiajia, Li Bingqiang and Huang Haobang. The patent applica..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Huahong Integrated Circuit Chengdu Co Ltd has submitted a patent application for Nonvolatile Memory and Forming Method Thereof. This invention was developed by Cao Jingwen, Xu Jiong and Ma Jiayu. The patent application number is CN202511168204 20250820. The patent publication number is CN121038278 (A). Int..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Xidian University and Guangzhou Research Institute of Xidian University have submitted a patent application for Enhanced High-voltage-resistant Aln Channel Transistor Based on Nio Depletion Technology and Preparation Method Thereof. This invention was developed by Wu Yinhe, Fang Yu, Zhao Shenglei, Cao Chuangz..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Beijing Intellectual Property Operation Man Co Ltd has submitted a patent application for Semiconductor Device and Forming Method Thereof. Sun Mengxing and Wu Xusheng developed the invention. The patent application number is CN202410643043 20240522. The patent publication number is CN121038339 (A). Interna..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Huaian Aucksun Optoelectronics Tech Co Ltd has submitted a patent application for Light-emitting Diode and Light-emitting Element. This invention was developed by Zhu Tao, Lyu Tengfei, Huang Licheng, Ye Daqian, Lian Weijie, Guo Yuan, Song Changwei and Lu Ling. The patent application number is CN20251118590..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Hangzhou Hesheng Tech Co Ltd has submitted a patent application for Packaging Structure and Method for On-chip Ultrasonic Module. This invention was developed by Ren Weiping, Xing Jianing and Chen Chao. The patent application number is CN202511195720 20250826. The patent publication number is CN121038583 (..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Jingxincheng Beijing Tech Co Ltd and Hefei Nexchip Integrated Circuit have submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Song Furan and Zhou Ruling. The patent application number is CN202511569345 20251030. The patent publication n..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Beijing Advanced Memory Tech Co Ltd and Beijing Advanced Memory Tech Co Ltd have submitted a patent application for Etching Method of Phase Change Material Layer of Phase Change Memory. This invention was developed by Wang Zhiyuan, Yang Wei and Chen Qinghong. The patent application number is CN202511292623..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Weicheng Semiconductor Equipment Suzhou Co Ltd has submitted a patent application for Wafer Positioning Equipment and Method. This invention was developed by Li Wei, Mao Deji and Chen Xin. The patent application number is CN202511173264 20250821. The patent publication number is CN121035031 (A). Internatio..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Wuyuan Semiconductor Tech Qingdao Co Ltd has submitted a patent application for Preparation Method of TSV Vertical Interconnection Structure. This invention was developed by Yan Guochao, Gao Shilong, Qi Xiaoyu, Su Yunxing, Wang Xin, Yan Tiancai, Yang Lieyong and Chen Weiyu. The patent application number is..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Nantong Wiices New Energy Tech Co Ltd has submitted a patent application for Trench Gate Field Effect Transistor and Manufacturing Method Thereof. This invention was developed by Su Jianhua. The patent application number is CN202511546045 20251028. The patent publication number is CN121035093 (A). Internat..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Southern Power Grid New Electric Power System Beijing Res Institute Co Ltd has submitted a patent application for Distance Protection Method and Waveform Symmetry-based Chip-level Relay for Preventing Ta Saturation Operation Refusal. This invention was developed by Xi Wei, Yang Yingjie, Liu Dehong, Liang Jiap..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Wuxi Aifute Semiconductor Tech Co Ltd has submitted a patent application for Radio Frequency Matcher Online Calibration Method, System and Device and Storage Medium. Wu Wei developed the invention. The patent application number is CN20251164375 20250731. The patent publication number is CN120896654 (A). In..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Qiyimoer Shanghai Semiconductor Tech Co Ltd has submitted a patent application for Phase Interpolator Unit Circuit and Phase Interpolator. This invention was developed by Jin Qingqing, Tian Mochen, Wen Dexin, Zhu Jundong and Wang Yu. The patent application number is CN20251191692 20250805. The patent publi..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Shanghai Xinwei Semiconductor Co Ltd has submitted a patent application for HEMT Device and Preparation Method Thereof. This invention was developed by Guo Dexiao, Xin Yajie and Lei Jiacheng. The patent application number is CN20251142223 20250728. The patent publication number is CN120897479 (A). Internat..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Semiconductor Mfg Co Ltd and Semiconductor Manufacturing International (Shanghai) have submitted a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Shen Jianfei and Yao Shengqiang. The patent application number is CN202410466516 20240417. The patent..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Xidian University and Guangzhou Research Institute of Xidian University have submitted a patent application for Cascode Device Based on Conversion from Pgan to Ugan and Preparation Method Thereof. This invention was developed by You Shuzhen, Wang Liang, Lei Yilong, Zhou Ting, Wang Yi, Zhang Jincheng and Hao Y..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Yangzhou Guoyu Electronics Co Ltd has submitted a patent application for ESD Device and Manufacturing Method Thereof. Zhang Youxin, Ma Wenli, Li Hao, Dong Wenjun and Li Lin developed the invention. The patent application number is CN20251143535 20250728. The patent publication number is CN120897516 (A). In..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Sichuan Qimingxin Semiconductor Tech Co Ltd has submitted a patent application for Blind Retransmission and Merging Transmission Method and System. Li Yangyang and Liang Hongming developed the invention. The patent application number is CN202511280037 20250909. The patent publication number is CN121036927 ..

Semiconductor

  |  Mon 06 Apr 2026

Beijing, April 7 -- Hangzhou Hesheng Tech Co Ltd has submitted a patent application for Packaging Structure and Method for On-chip Ultrasonic Module. Xing Jianing, Ren Weiping and Chen Chao developed the invention. The patent application number is CN202510954683 20250711. The patent publication number is CN120897662 (A). Inte..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Chengdu Jingxin Mingneng Photovoltaic Tech Co Ltd has applied Chinese patent for Hole Transport Layer, Preparation Method Thereof and Solar Cell. Luo Liang, Wu Renshuang and Liang Zhen developed it. The patent application number is CN202511155151 20250818. The patent publication number is CN121038502 (A). ..

Semiconductor

  |  Tue 07 Apr 2026

Beijing, April 7 -- Leiyu Optoelectronics Tech Suzhou Co Ltd has applied Chinese patent for Miniature Light Emitting Diode Display and Preparation Method Thereof. Tang Wenxin, Wang Qianjing and Chong Wing Cheung developed it. The patent application number is CN202511576615 20251031. The patent publication number is CN12103848..
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