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Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- U.S. Patent and Trademark Office has awarded a patent to Kodem Security Ltd for Identifying Active Code Sections Via Memory Forensics. Bartura Idan, Mussinger Aviv, Siman Tov Bustan Moshe, Furman Pavel and Segal Eran developed the invention.
The patent application number is US202418635594 20240415. The p..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- U.S. Patent and Trademark Office has awarded a patent to Panmnesia Inc, Korea Advanced Inst Of Science And Technology and Korea Advanced Institute of Science & Technology for Memory Expander, Computing Systems, and Operating Method of the Host Device. Jung Myoungsoo, Lee Seungjun, Kwon Miryeong, Bae Hanyeor..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Suzhou Yizhu Intelligent Tech Co Ltd has submitted a patent application for Computing Chip, Reduction Operation Method, Related Device and Medium. Zhu Hengye, Hao Shaopu, Xu Ping'an and Jiang Yuxiang developed the invention.
The patent application number is CN202610140559 20260202. The patent publication nu..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Beijing Sohu Internet Information Service Co Ltd has submitted a patent application for Memory Leak Processing Method and Related Device. This invention was developed by Duan Mengyao.
The patent application number is CN202610478639 20260413. The patent publication number is CN122019352 (A). International Pa..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Beijing Skysight Tech Co Ltd and Chengdu Skysight Tech Co Ltd have sought patent for Method and Apparatus for Producing Land-surface Shortwave Radiation Product, and Method and Apparatus for Training Long Short-term Memory Network. This invention was developed by Yu Lei, Liu Yuting, Zheng Yong, Liu Rui and Xi X..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- United States Patent for Heterogeneous Annealing Method and Device has been issued to Adeia Semiconductor Bonding Technologies Inc and Adeia Semiconductor Bonding Technologies. This invention was developed by Fountain Jr Gaius Gillman and Enquist Paul M.
The patent application number is US202519349749 20..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 5 -- Shenzhen Seichitech Semiconductor Tech Co Ltd has submitted a patent application for Docking Device and Test Equipment. This invention was developed by Zhou Jiangmin.
The patent application number is CN202610442675 20260407. The patent publication number is CN122017537 (A). International Patent Classificati..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 5 -- Changsha Jinwei Integrated Circuit Co Ltd has sought patent for Orientation Performance Test System, Method and Device of Gnss Orientation Equipment and Medium. This invention was developed by Jiang Yunxiang, Ma Xinzhuo, Chen Hanwei, Fu Zhengyang, Ge Haonan and Li Shuanggui.
The patent application number is..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- China Unicom Digital Tech Co Ltd has sought patent for Memory Block Management Method and Controller. This invention was developed by Mo Qingliang, Li Feng and Zhang Jianrong.
The patent application number is CN202610486289 20260414. The patent publication number is CN122019198 (A). International Patent Cla..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Hangzhou Arges Tech Co Ltd has sought patent for Visual Analysis Method for Use Condition of Process Memory. This invention was developed by Chen Run, Kang Wei, Li Hao, Zheng Xiaobo, Zou Mingsong, Ding Guangce, Sun Nan and Sun Xiaozhuang.
The patent application number is CN202610434282 20260403. The patent ..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- California Institute Of Technology has submitted a patent application for Resist and Process for Dry Positive Tone Electron Beam Lithography. Scherer Axel and Smith Richard D developed the invention.
The patent application number is WO2026US11819 20260120. The patent publication number is WO2026161352 (A1). ..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Shanghai Optical Communication Co Ltd has submitted a patent application for Semiconductor Equipment and Working Method Thereof. This invention was developed by Yu Liyang and Pan Donglin.
The patent application number is CN202411606098 20241111. The patent publication number is CN122028674 (A). Internationa..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Hubei 3D Semiconductor Integration Innovation Center Co Ltd has submitted a patent application for Bonding Test Structure and Test Method. This invention was developed by Cao Ruixia, Pan Chao, Liu Wei and Cheng Cui.
The patent application number is CN202411568357 20241105. The patent publication number is C..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Huahong Semiconductor Mfg Wuxi Co Ltd has submitted a patent application for Passivation Layer Manufacturing Process. This invention was developed by Mi Kui, Hu Jiarui and Li Kunle.
The patent application number is CN20261062835 20260116. The patent publication number is CN122028769 (A). International Paten..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Hewlett Packard Enterprise Company (HPE) has been granted a patent for Caching Data of Memory Rows. Benedict Melvin K and Pope Eric L developed the invention.
The patent application number is US202418784267 20240725. The patent publication number is US12693976 (B2). International Patent Classification co..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- BDCM A2 LLC and Metawave Corp have received a patent for Modular, Multi-channel Beamformer Front-end Integrated Circuits for Millimeter Wave Applications. This invention was developed by Rostomyan Narek.
The patent application number is US202117181939 20210222. The patent publication number is US12695210..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- United States Patent for Integrated Circuit, Associated Start-up Circuit and Start-up Method Thereof has been issued to Chengdu Monolithic Power Sys and Chengdu Monolithic Power Systems. This invention was developed by Yang Xiangyi and Mao Wei.
The patent application number is US202418796100 20240806. Th..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Nuvoton Technology Corporation Japan has been granted a patent for Semiconductor Device. Yoshii Ryo, Okawa Ryosuke, Kato Ryou and Yasuda Eiji developed the invention.
The patent application number is US202519264384 20250709. The patent publication number is US12696482 (B2). International Patent Classific..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- International Business Machines has been awarded a patent for Back-end-of-line Vertical-transport Transistor. This invention was developed by Xie Ruilong, Wu Heng, Frougier Julien and Zhang Chen.
The patent application number is US202217655371 20220318. The patent publication number is US12696484 (B2). I..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- REC Solar and REC Solar have been awarded a patent for Solar Cell. This invention was developed by Tang Muzhi and Chong Shu Yunn.
The patent application number is US202118259977 20211220. The patent publication number is US12696577 (B2). International Patent Classification codes are H01L31/0236, H01L31/0..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 5 -- Shenzhen Secon Technical Ind Co Ltd has filed a patent application for Chip High-temperature Test System Structure. This invention was developed by Jin Yingjie and Liang Zhixian.
The patent application number is CN202610180370 20260209. The patent publication number is CN122017528 (A). International Patent ..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- International Business Machines has been granted a patent for Memory Module Guidance and Retention Structure. Dunfee Nathan Lee, Pfeifer Mark David, Lubahn Kenneth E, O'connell Kevin, Rogers Justin Christopher, Marroquin Christopher M and Mroz Stephen P developed the invention.
The patent application num..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- International Business Machines has been granted a patent for Backside MRAM with Frontside Devices. This invention was developed by Xie Ruilong, Wang Junli, Standaert Theodorus E, Anderson Brent A, Chu Albert M and Clevenger Lawrence A.
The patent application number is US202217956244 20220929. The patent..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- International Business Machines has obtained a patent for antifuse and resistor. This invention was developed by Yang Chih-chao, Dutta Ashim and Jayanand Kishan.
The patent application number is US202318470472 20230920. The patent publication number is US12696757 (B2). International Patent Classification..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Dell Products LP and Dell Products have received a patent for Dynamic Mapping of NVME (non-volatile Memory Express) Namespaces to Hosts. This invention was developed by Engel Amit, Zinger Eldad and Grupi Elad.
The patent application number is US202418978309 20241212. The patent publication number is US12..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Kcindustrial Co Ltd has been granted a patent for Preparation Method of High Purity Sic Powder. Kim Tea Hee, Lee Gyu Do, Kim Tae Hee, Lee Chae Young and Lee Chea Young developed the invention.
The patent application number is US202318334906 20230614. The patent publication number is US12692166 (B2). Inte..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Huahong Semiconductor Mfg Wuxi Co Ltd and Huahong Semiconductor, Wuxi have applied Chinese patent for Mask Plate and Layout Generation Method. Yang Hongmei, Ju Biyu, Xia Yin, Dong Jun, Jin Pei and Zhang Qixue developed it.
The patent application number is CN20261083429 20260121. The patent publication numbe..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Guangbenwei Intelligent Tech Shanghai Co Ltd has applied Chinese patent for Chip System and Calculation Method. Cheng Tangsheng, Li Wenling, Pu Huanan and Li Zuoxi developed it.
The patent application number is CN202610274952 20251203. The patent publication number is CN122018629 (A). International Patent C..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Semiconductor Manufacturing International (Shanghai) and Semiconductor Mfg Corporation have applied Chinese patent for Test Structure and Test Method. Guan Weiming, Liu Yongjie, Zhao Danyang, Yan Shen, Dai Shaolong, Yang Tao and Li Qiang developed it.
The patent application number is CN202411567564 20241104..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Infineon Tech Americas Corp has applied WIPO patent for Act Startup Sequence. Zherebtsov Aleksei, Jonsson Ragnar and Razavi Majomard Seid Alireza developed it.
The patent application number is WO2026US12052 20260121. The patent publication number is WO2026161491 (A1). International Patent Classification code..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- United States Patent for Method and Apparatus for Characterization of a Microlithography Mask has been issued to Zeiss Carl Smt GmbH and Carl Zeiss SMT. This invention was developed by Matejka Ulrich, Deguenther Markus and Perlitz Sascha.
The patent application number is US202318385114 20231030. The pate..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Robert Bosch Gmbh and Robert Bosch have been awarded a patent for Data Structure for a Buffer Memory in a Multi-producer Multi-consumer System. This invention was developed by Killat Matthias and Hirsch Gerd.
The patent application number is US202118251369 20211102. The patent publication number is US126..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- United States Patent for Sterilizing Cover for Touchscreens Comprising UV Emitting Source has been issued to Phase Shield LLC and Bernstein Eric F. This invention was developed by Bernstein Eric F.
The patent application number is US202117224453 20210407. The patent publication number is US12691190 (B2)...
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released State Grid Hebei Electric Power Supply Co Ltd Electric Power Research Inst and State Grid Corporation of China patent application for Cnn-bilstm-based IGBT Residual Life Prediction Method. This invention was developed by Han Cheng, Liu Haoyu, Xing Chao, ..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has received Sadrabadi Mohammad Ghadiri, Patel Chirag, Kyocera Corp and Sabouri Faramarz patent application for On-chip Calibration of Channel-to-channel Phase Variation for Beamforming Integrated Circuits. Sadrabadi Mohammad Ghadiri, Patel Chirag and Sabouri Faramarz de..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Chengdu Xinziguang Semiconductor Tech Co Ltd patent application for Cutting Channel Alignment Mark Generation Method and Device, Storage Medium, Equipment and Product. This invention was developed by Xing Zeguang, Zhuang Boqing, Su Xiaoxi and Sun Mingcon..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has received Ningbo All Semi Micro Electronics Equipment Co Ltd patent application for Semiconductor Process Equipment and Exhaust Method Thereof. Ma Jie and Liang Bingbing developed the invention.
The patent application number is CN20251214085 20251229. The paten..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Changsha University and Guangdong Yonggu Tech Co Ltd patent application for Chip Conveying Device. This invention was developed by Han Zongzhen, Yang Qihua, Zhang Honglue and Huang Yi.
The patent application number is CN202610486275 20260414. The pate..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Wuhan Jiekai Tech Co Ltd patent application for Chip Control Method and Device, Chip, Storage Medium and Program Product. This invention was developed by Song Zhenghua, Zhou Xiaohong, Tao Ling, Tokuhiro and Jiang Lirong.
The patent application number ..
Semiconductor
| Tue 04 Aug 2026
Alexandria, Aug. 5 -- Hamamatsu Photonics KK and Hamamatsu Photonics have received a patent for Photodetector. This invention was developed by Uenoyama Soh.
The patent application number is US202118279263 20211209. The patent publication number is US12693154 (B2). International Patent Classification codes are G01J1/04, G01T1/..
Semiconductor
| Tue 04 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has published Haixiang Tech Co Ltd patent application for Object Stage for Probe Station. The invention was developed by Wang Qiangsheng, Fu Guoxing, Zhang Xiong and Wang Tingyun.
The patent application number is CN20261099183 20260126. The patent publication numb..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Guangzhou Xinrui Photomask Tech Co Ltd patent application for Inspection Method of Multi-layer Multi-material Photomask. This invention was developed by Liao Decai, Kanenobu, Wu Hongbin, Tian Zhengzhou and Gan Wei.
The patent application number is CN2..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Anhui Jingwei Tech Co Ltd patent application for Method for Solving Photoetching Morphology Abnormity. This invention was developed by Wang Yue, Li Haitao, Zhou Hongyu and Sun Shanshan.
The patent application number is CN202610307663 20260313. The pat..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has received Hangzhou Feishu Tech Co Ltd patent application for Memory Control Method and Memory System. Wang Wenhua, Zhang Bin, Tang Yonglin and Zhong Lingang developed the invention.
The patent application number is CN20251238466 20251231. The patent publication..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has published Beijing Weihexin Tech Co Ltd patent application for Reexecution Method and Device of Memory Access Instruction, Equipment and Storage Medium. The invention was developed by Xun Dandan, Li Zusong and Yang Ye.
The patent application number is CN2026104..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has published Shandong Bosuan Zhixin Information Tech Co Ltd patent application for Data Loading Method, Device and Equipment. The invention was developed by Zhang Wenjin, Wang Zeqian, Fan Qingxin, Yang Jiacheng, Zou Xiaofeng and Kong Lingjun.
The patent applicati..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Robert Bosch Co Limited has applied Chinese patent for MOSFET with Self-aligned Extension Region. Alsmeier Jens-henning, Feiler Wolfgang, Costescu Dan, Bartolf Holger, Schwaiger Stephan and Martinez-limia Angela developed it.
The patent application number is CN20248065141 20240719. The patent publication nu..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Hexagem Ab has applied Chinese patent for Semiconductor Device Including Micro-led Structure. Bjork Mikael, Samuelson Lars and Herring Michael developed it.
The patent application number is CN20248064884 20241001. The patent publication number is CN122029969 (A). International Patent Classification codes ar..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Jiangsu Youzhong Micro Nano Semiconductor Tech Co Ltd has submitted a patent application for Medium Metasurface Structural Color Device and Structural Color Brightness Regulation and Control Method. This invention was developed by Ju Fayin, Li Ning and Liu Yichen.
The patent application number is CN20261046..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Shenzhen Neoway Tech Co Ltd has filed a patent application for Intelligent Response Method and Device Based on Memory System Drive, Equipment and Medium. This invention was developed by Jian Weidong, Guo Jianlin and Wang Chao.
The patent application number is CN20251246413 20251231. The patent publication n..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Verdinov Manufacturing Co has submitted a patent application for Method for Producing Edible, Malleable and Palatable Substrate for Animals and Use of Such Substrate. This invention was developed by Bircan Erdem and Berriot Laurent.
The patent application number is CN20248053386 20240813. The patent publica..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Lam Research has submitted a patent application for Positive Tone Dry Development on Metal Oxide Photoresist. Tan Samantha S H, Li Da, Liu Shanliangzi, Kim Ji Yeon, Coyle Jason Philip and Vrtis Raymond Nicholas developed the invention.
The patent application number is WO2026US12164 20260122. The patent publica..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Shenzhen Bynet Communication Technology has applied Chinese patent for Integrated Packaging System and Method Based on Glass Substrate. Tang Yueyun, Xiao Suqun, Chen Qu, Bi Pengjun, Zeng Hai and Fang Fulin developed it.
The patent application number is CN202610345668 20260320. The patent publication number is..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- GalaxyCore Shanghai has submitted a patent application for Packaging Method and Packaging Structure of Semiconductor Chip. Xia Huan developed the invention.
The patent application number is CN202411561397 20241101. The patent publication number is CN122028783 (A). International Patent Classification codes are..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Changzhou Chengxin Semiconductor has submitted a patent application for Semiconductor Device and Preparation Method Thereof. Zhou Yi, Pan Lin, Wu Xianghui and Qian Kang developed the invention.
The patent application number is CN202610214307 20260213. The patent publication number is CN122028781 (A). Intern..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device. This invention was developed by Sakai Norikazu, Nishimura Kazuhiro, Masumoto Hiroyuki, Egusa Minoru and Wada Fumio.
The patent application number is CN20251176517 20250801. The patent publication number is CN122028778 (A). Inte..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. Sato Yuji, Uegaki Shin and Nakata Yosuke developed the invention.
The patent application number is CN202511520053 20251023. The patent publication number is CN122028774 (A). Inter..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Advanced Semiconductor Engineering has submitted a patent application for Package Structure. This invention was developed by Li Weijun and Zhang Weihao.
The patent application number is CN202510308537 20250317. The patent publication number is CN122028772 (A). International Patent Classification code is H10..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Guangdong Ada Semiconductor Equipment Co Ltd has applied Chinese patent for Lead Bonding Method and System for Chip Packaging of Integrated Stacked Suspended Structure. He Yunbo, Ji Haizhong, Yan Yijun, Liu Junjie and Ye Wentao developed it.
The patent application number is CN202610502956 20260416. The pate..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Ruckus IP has applied WIPO patent for Radiating Elements Having a Radiator and a Molded Plastic Substrate and Related Antenna Arrays and Methods. Chen Edmund and Noghanian Sima developed it.
The patent application number is WO2026US12108 20260122. The patent publication number is WO2026161527 (A1). Internation..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- China Resources Runan Tech Chongqing Co Ltd has submitted a patent application for Manufacturing Method of Semiconductor Structure. This invention was developed by Zhou Wenwu.
The patent application number is CN202411549836 20241031. The patent publication number is CN122028755 (A). International Patent Cla..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Package Carrier and Preparation Method Thereof, and Semiconductor Package Structure. Zhou Yanxu developed the invention.
The patent application number is CN202610499016 20260415. The patent publication number is CN122028754 (A). In..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Beijing Huafeng Jixin Electronics Co Ltd patent application for Bridging Chip and Chip Packaging Structure with Same. This invention was developed by He Qibin, Qiao Hailong and Zhao Xudong.
The patent application number is CN20251209753 20251229. The ..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released NXP USA patent application for Substrate Package. This invention was developed by Sun Yongqing, Liu Huanhuan, Li Yiming and Zang Yuan.
The patent application number is CN202411557500 20241104. The patent publication number is CN122028750 (A). Internatio..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has published Moqu Tech Shenzhen Co Ltd patent application for Metal Substrate Power Device Package. The invention was developed by Zhao Zhentao.
The patent application number is CN202510292694 20250312. The patent publication number is CN122028748 (A). Internatio..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has received Suzhou Guoxian Innovation Tech Co Ltd patent application for Manufacturing Method of Glass Substrate, Glass Substrate and Packaging Structure. Zhou Yanxu developed the invention.
The patent application number is CN202610495495 20260415. The patent pub..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- ChangXin Technology Group has submitted a patent application for Semiconductor Structure, Manufacturing Method Thereof and Semiconductor Device. This invention was developed by Zhang Zhong.
The patent application number is CN202411596593 20241108. The patent publication number is CN122028743 (A). Internationa..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has published Mitsubishi Electric patent application for Signal Transmission Element. The invention was developed by Yoshino Manabu and Shitomi Takuichiro.
The patent application number is CN202511265942 20250905. The patent publication number is CN122028740 (A). ..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Nanjing University has filed a patent application for Semiconductor Device and Preparation Method Thereof. This invention was developed by Tang Faquan, Wang Penglin, Chen Dunjun, Zhou Yugang and Zhang Rong.
The patent application number is CN202610214958 20260213. The patent publication number is CN12202873..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Semiconductor Components Industries has sought patent for Cooling Assembly and Method for Manufacturing a Cooling Device. This invention was developed by Im Seung-won.
The patent application number is CN202511652948 20251112. The patent publication number is CN122028734 (A). International Patent Classificatio..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has received Applied Materials patent application for Pulsed Voltage Source with Multiple Stages for Plasma Processing Applications. Dash Shreeram Jyoti developed the invention.
The patent application number is WO2026US12068 20260122. The patent publication number is WO..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Shenzhen Xianxing Equipment Tech Co Ltd has sought patent for Integrated Device for Integrated Circuit and Electromagnetic Shielding and Packaging Structure Thereof. This invention was developed by Yang Junkun.
The patent application number is CN202610151740 20260203. The patent publication number is CN1220..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Samsung Electronics has submitted a patent application for Film Package, Semiconductor Module Including Same, and Display Device. This invention was developed by Jo Min-woo, Ha Jeong-kyu, Cho Seung-hyun and Jeong Jae-min.
The patent application number is CN202510975467 20250715. The patent publication number ..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has published Inno Saike (Suzhou) Semiconductor patent application for Semiconductor Device and Manufacturing Method Thereof. The invention was developed by Li Qing.
The patent application number is CN202610475642 20260410. The patent publication number is CN12202..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Hefei Nexchip Integrated Circuit has sought patent for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Song Furan and Liu Naishuo.
The patent application number is CN202610479111 20260413. The patent publication number is CN122028725 (A). International Patent Classifi..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has received United Microelectronics Corporation patent application for Semiconductor Element and Manufacturing Method Thereof. Lin Jianting, Lin Jufu and Lin Chuanlan developed the invention.
The patent application number is CN202411670983 20241121. The patent pu..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Fujian Jinhua Integrated Circuit has applied Chinese patent for Semiconductor Memory Structure and Preparation Method Thereof. Lai Huixian and Feng Liwei developed it.
The patent application number is CN202610169983 20220421. The patent publication number is CN122028720 (A). International Patent Classificat..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Hefei Nexchip Integrated Circuit has applied Chinese patent for Semiconductor Device and Manufacturing Method Thereof. Li Fei and Dong Zongyu developed it.
The patent application number is CN202610500449 20260416. The patent publication number is CN122028718 (A). International Patent Classification codes ar..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Jiangsu Tianke Heda Semiconductor and Beijing Tankeblue Semiconductor patent application for Method for Reducing Machining Stress of Large-size Silicon Carbide Wafer. This invention was developed by Chao Huan, Peng Tonghua, Yang Jian, Zhang Wenwen, Liu C..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Wuhan Xinxin Semiconductor has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. Yu Qinxu, Wang Sen, Luo Qingwei, Liu Nian, Pan Dong and Xiang Pengcheng developed the invention.
The patent application number is CN202511116206 20250808. The patent publication number is..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Shenzhen Pengxinwei Integrated Circuit Manufacturing has sought patent for Semiconductor Manufacturing Method and Semiconductor Device. This invention was developed by Wang Lei.
The patent application number is CN202411574073 20241105. The patent publication number is CN122028715 (A). International Patent Cla..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Method for Manufacturing Semiconductor Device and Composition for Coating Patterned Photoresist. This invention was developed by Cheng Joy, Zhang Lilin and Wei Jialin.
The patent application numb..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Method for Monitoring Resistance Fluctuation of Gamma Resistor. This invention was developed by Shao Yingya, Wang Xuechun and Li Jian.
The patent application number is CN202610475623 20260413. The patent publication number is CN12202871..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Chongqing Eagle Valley Optoelectronic Ltd patent application for Method and System for Reducing Preparation Fragmentation Rate of Ultrathin Semiconductor Test Sample. This invention was developed by Gu Jialin, Bu Hui, Liu Congji, Gong Hongjie, Jian Maoyu..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has received Gechuang Dongzhi Wuhan Tech Co Ltd patent application for Multivariable-based Semiconductor Diagnosis Method, Device and Equipment and Storage Medium. Xu Mingguang developed the invention.
The patent application number is CN202610122401 20260128. The ..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has received Microchip Technology patent application for High Performance Schottky Barrier Diode Structure. Sharma Yogesh Kumar and Pandey Shesh Mani developed the invention.
The patent application number is WO2026US12028 20260121. The patent publication number is WO202..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Chroma ATE (Suzhou) has submitted a patent application for Semiconductor Packaging Component Pressure Testing Module with Multiple Pressure Blocks and Semiconductor Packaging Component Testing Equipment. Lyu Menggong and Chen Jianming developed the invention.
The patent application number is CN202411575354 20..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Xinlian Integrated Circuit Manufacturing has applied Chinese patent for Test Bonding Pad Structure for Semiconductor Device Test and Semiconductor Device. He Qiqing, Zhao Xiaoyan and Li Zhongren developed it.
The patent application number is CN20261075821 20260120. The patent publication number is CN122028704..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has received STMicroelectronics International patent application for Electronic Chip Comprising Crack Detection Device. Juan Guillaume developed the invention.
The patent application number is CN202511619384 20251106. The patent publication number is CN122028702 (A)..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Accelink Technologies has filed a patent application for Suction Nozzle Device Suitable for Pd Array Chip and Maintenance Method Thereof. This invention was developed by Li Shiyu, Zhong Xing, Hu Yan, Li Jing and Yue Aiwen.
The patent application number is CN202411557616 20241104. The patent publication number..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Ningbo All Semi Micro Electronics Equipment Co Ltd patent application for Plate Core Assembly, Cover Body Assembly, Hot Plate Module and Semiconductor Processing Equipment. This invention was developed by Dong Jinjin, Pan Zequan and Liang Bingbing.
Th..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Piao Longnan patent application for Substrate Bonding Apparatus.
The patent application number is CN202310447171 20230424. The patent publication number is CN122028691 (A). International Patent Classification codes are B81C3/00, H10P72/00 and H10P72/..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Shenyang Heyan Tech Co Ltd has sought patent for Loading and Unloading Sorting Device and Semiconductor Processing System. This invention was developed by Liu Jiameng, Li Jiabin, Chen Qiang, Li Yuan, Long Hao, Zhan Zhigang and Wu Hongbai.
The patent application number is CN202610357275 20260323. The patent ..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Shanghai Xinyuan Micro Entpr Development Co Ltd has sought patent for Substrate Processing System and Substrate Transfer Method. This invention was developed by Liu Tao, Peng Bo, Li Shuang, Wang Rongxiang and Li Ze.
The patent application number is CN202411593067 20241108. The patent publication number is C..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has received Guangdong Aiko Solar Energy Technology Co Ltd, Zhejiang Aiko Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Zhuhai Fushan Aixu Solar Energy Technology and Tianjin Aiko Solar Energy Technology patent application for Loading Basket for Lo..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Canon has submitted a patent application for Specification Method, Pattern Transfer Method, Article Manufacturing Method, Program, Information Processing Apparatus, and Lithographic System. This invention was developed by Kajitani Masaharu.
The patent application number is CN20248063000 20241001. The patent p..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Changjiang Electronics Tech Jiangyin Co Ltd has filed a patent application for Glue Flushing Device, Semiconductor Equipment and Thickness Detection Method. This invention was developed by Chen Langlang, Ren Yu and Jin Huixiang.
The patent application number is CN202610198237 20260210. The patent publicatio..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released ACM Research, Shanghai patent application for Spraying Device and Substrate Processing Equipment. This invention was developed by Wang Hui, Zhang Fengrong, Pang Hao and Chen Fuping.
The patent application number is CN202411563876 20241104. The patent pu..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Xi'an ESWIN Silicon Wafer Technology and Xi'an ESWIN Material Technology patent application for Silicon Wafer Defect Treatment Method, Surface Treatment Liquid, Silicon Wafer and Cleaning Device. This invention was developed by Zhang Shenshen.
The pat..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- HKC has submitted a patent application for Epitaxial Substrate, Semiconductor Device and Preparation Method of Epitaxial Layer. Fan Shengcai and Xu Pei developed the invention.
The patent application number is CN202610469578 20260410. The patent publication number is CN122028666 (A). International Patent Clas..
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