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Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Hebei Opto Sensor Electronic Tech Co Ltd has obtained a patent for wafer ultrasonic continuous cleaning device. This invention was developed by Li Hongye, Xia Guangpu and Zhao Haoran.
The patent application number is CN202422698887U 20241106. The patent publication number is CN223775548 (U). International P..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Microcrystalline Semiconductor Mat Suzhou Co Ltd has been granted a patent for Cleaning Device for Photoresist Nozzle. This invention was developed by Ruan Jialong.
The patent application number is CN20252038404U 20250108. The patent publication number is CN223775492 (U). International Patent Classification..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Beijing Kehanlong Semiconductor Equipment Tech Co Ltd for Wafer Grinding Rotating Mechanism. Wang Xiangyang developed the invention.
The patent application number is CN20252071935U 20250113. The patent publication number is CN223776897 (U)...
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- Kowel Co Ltd has submitted a patent application for High-processability Silicon Nitride Ceramic Composite and Manufacturing Method Thereof. This invention was developed by Sung Dok Kyu, Lee Kyung Hoon and Kim Jun Tae.
The patent application number is EP20240894453 20241104. The patent publication number is E..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Chinese Patent for Silicon Wafer Shaping Device has been issued to Anhui Bokai Engineering Tech Co Ltd. This invention was developed by Zhao Hongqu.
The patent application number is CN202520309354U 20250225. The patent publication number is CN223776731 (U). International Patent Classification codes are B24B..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Chinese Patent for Thin Film Processing Device and Semiconductor Production Equipment has been issued to Semiconductor Mfg International Tianjin Co Ltd and Semiconductor Manufacturing International (Shanghai). This invention was developed by Gao Wenliang and Liu Jie.
The patent application number is CN20242..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Chinese Patent for Through Hole Detection and Chip Removal Integrated Device has been issued to Hangzhou Hehua Electrical Eng Co Ltd. This invention was developed by Zhang Peng, Hou Chaoheng, Wu Zhongliang and Xu Yan.
The patent application number is CN202520205225U 20250210. The patent publication number i..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Anhui Jinmingli Logo Tech Manufacturing Co Ltd has received a patent for Metal Material Machining Waste Chip Treatment Device. This invention was developed by Zuo Yibin.
The patent application number is CN202520320910U 20250227. The patent publication number is CN223776674 (U). International Patent Classifi..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Hebei Beifang Jingyi Machinery Mfg Co Ltd has been granted a patent for Efficient Chip Removal Machine for Machine Tool Machining. This invention was developed by Ma Fengshun.
The patent application number is CN202520282212U 20250221. The patent publication number is CN223776672 (U). International Patent Cl..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Xiangyang Fengyueda Machinery Mfg Co Ltd has been granted a patent for Machine Tool Chip Removal and Cleaning Device for Numerical Control Machine Tool. Li Da, Zhao Hongbo and Yin Xiantao developed the invention.
The patent application number is CN202520253673U 20250217. The patent publication number is CN2..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Shenyang Liyuan Machine Tool Access Co Ltd has been granted a patent for Machine Tool Chip Cleaner Capable of Conveniently Fixing Waste Chip Vehicle. Yu Chaoyuan and Feng Su developed the invention.
The patent application number is CN202520207559U 20250210. The patent publication number is CN223776669 (U). ..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Wuxi Yaerte Metal Products Co Ltd has received a patent for Hot-rolled Steel Pipe Cutting Flying Chip Collecting Device. This invention was developed by Zhu Jie and Jin Defang.
The patent application number is CN202422928931U 20241129. The patent publication number is CN223776660 (U). International Patent C..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Shanghai Hanxi Electronic Tech Co Ltd for Movable Semiconductor Circuit Board Maintenance Workbench. Yuan Fei and Hu Shoulan developed the invention.
The patent application number is CN202423107639U 20241217. The patent publication number i..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Shenyang Zhongke Yuchen Tech Co Ltd has secured a patent on Substrate Positioning Device for Additive Manufacturing. Wang Zijian and Xing Fei developed the invention.
The patent application number is CN202422712922U 20241107. The patent publication number is CN223776292 (U). International Patent Classificat..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Xinyi Juying New Mat Co Ltd for Auxiliary Device for Forming Quartz Boat for Diffusion of Solar Cell Silicon Wafer. Zhao Chunqiu developed the invention.
The patent application number is CN202520344886U 20250301. The patent publication numb..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- SJ Semiconductor, Jiangyin has submitted a patent application for Photoelectric Packaging Structure and Manufacturing Method Therefor. Chen Yenheng and Lin Chengchung developed the invention.
The patent application number is EP20240910711 20241211. The patent publication number is EP4815220 (A1). Internation..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Shanghai Boruite Valve Group Co Ltd has submitted a patent application for Special Corrosion-resistant Wafer Gate Valve for Lithium Iron Phosphate Slurry. This invention was developed by Dong Lili.
The patent application number is CN202610679956 20260518. The patent publication number is CN122328557 (A). In..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- European Patent Office has received Mitsubishi Electric Corp and Mitsubishi Electric R&D Centre Europe patent application for Method and Circuit Adapted to Monitor the Junction Temperature of a Power Semiconductor. Quemener Vincent and Degrenne Nicolas developed the invention.
The patent application number i..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Chinese Patent for MEMS Wafer has been issued to Suzhou Haijixin Microelectronics Co Ltd. This invention was developed by Zhao Chenglong, Liu Xinhua, Wan Caixin, He Zhengda and Tan Haifeng.
The patent application number is CN20252065134U 20250113. The patent publication number is CN223779958 (U). Internatio..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Yixing Kaifeng Ceramic Mfg Co Ltd for Four-corner Positioning Tool for Aluminum Oxide Ceramic Wafer Machining. Yang Zengxi developed the invention.
The patent application number is CN202520357457U 20250303. The patent publication number is ..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Chinese Patent for Fixing Clamp for Processing Flat Crystal Wafer has been issued to Shanxi Huaxin Jingtu Tech Co Ltd. This invention was developed by Xiao Yanqing, Li Baoshu, Liu Jianfeng, Liang Lu and Yang Li.
The patent application number is CN202520792032U 20250424. The patent publication number is CN22..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Chinese Patent for Retaining Ring Space Ring Component for Double-sided Polishing of Mask Substrate has been issued to Jinan Guangwei Semiconductor Tech Co Ltd. This invention was developed by Li Mingjun, Huang Yun, Shan Pei, Meng Han, Liu Shuchang, Lu Keke and Guan Lei.
The patent application number is CN2..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Suzhou Dongrui Microelectronics Tech Co Ltd for Chemical Etching and Polishing Treatment Device for Wafer Blank. Chen Gangqing, Wang Zubing, Huang Xuejun, Gu Haihua and Dai Shixiang developed the invention.
The patent application number is ..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Chinese Patent for Rounding Loose Pulley and Quartz Wafer Rounding Processing System Adopting Same has been issued to Liaoyang Hongyu Crystal Co Ltd. This invention was developed by Dong Peng, Li Wei, Zong Yuying, Tominaka Tsuzuki and Liu Zhe.
The patent application number is CN202520738069U 20250418. The p..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Dalian Shengfeng Bearing Mfg Co Ltd has been awarded a patent for Mechanical Part Machining Grinding Machine with Chip Collecting Function. This invention was developed by Shi Zhenwei and Li Dehua.
The patent application number is CN202520331280U 20250226. The patent publication number is CN223776825 (U). I..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Shimukang Tech Zhejiang Co Ltd has received a patent for Rough Grinding and Fine Grinding of Silicon Rod for Integrated Circuit. This invention was developed by Xu Xuejun.
The patent application number is CN202520324257U 20250227. The patent publication number is CN223776824 (U). International Patent Classi..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Hangzhou Fuxin Semiconductor has been granted a patent for Scraper for Pipeline and Pipeline Dust Removal Device. Wang Shaojie and Wang Zizhuo developed the invention.
The patent application number is CN202423132592U 20241218. The patent publication number is CN223775596 (U). International Patent Classifica..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- Printable BV has submitted a patent application for Device and Method for Covering a Substrate. This invention was developed by Hooft Johannes Wilhelmus Gerardus and Donkersloot Jozeph.
The patent application number is EP20240824447 20241031. The patent publication number is EP4812278 (A1). International Pat..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Suqian Qingyang Solar Energy Tech Co Ltd for Hoisting Device for Assembling Solar Cell Module. Zhang Lun, Liu Ailin and Wei Yandong developed the invention.
The patent application number is CN202520490013U 20250320. The patent publication n..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Shengruixin Tech Co Ltd for Automatic Heating Device for Degumming Quartz Wafer. Xiong Dewen, Shi Qing, Wu Chu and Chen Zongshan developed the invention.
The patent application number is CN202520114980U 20250116. The patent publica..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Dongguan Villo Tech Co Ltd has been granted a patent for Driving Structure of Wafer Production Dust Removal Device. This invention was developed by Wang Yin'an, Li Huaijun, Xu Wenqi, Chu Shiyun, Chi Haopeng, Yuan Weijie, Cai Junwei, Huang Wenbin, Zhang Kewei, Li Haiyan, Yao Xing and Chen Xiaochen.
The paten..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Zhangqiu Longxin Corundum Products Co Ltd has secured a patent on Novel Silicon Nitride Ceramic Ball Automatic Cleaning Device. Li Qiang, Shi Jie, Chai Huichao and Zheng Cuixia developed the invention.
The patent application number is CN202520102285U 20250116. The patent publication number is CN223775554 (U..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Nantong Hengze Electroplating Co Ltd for Cleaning Device for Electroplating. Lin Jianfeng developed the invention.
The patent application number is CN202422871721U 20241125. The patent publication number is CN223775538 (U). International Pa..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Heguang Photomask Tech Anhui Co Ltd has been awarded a patent for Adhesive Removing Device and Semiconductor Manufacturing Equipment. This invention was developed by Ma Zhenzhen and Zhang Jiancheng.
The patent application number is CN202423243801U 20241226. The patent publication number is CN223775475 (U). ..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Wuxi Xinyun Intelligent Tech Co Ltd has been awarded a patent for Solder Ball Grading Recovery Device for Wafer Cleaning Machine. This invention was developed by Kuang Xianguo, Xue Fucheng, Xi Mingke and Xu Youcheng.
The patent application number is CN20252019897U 20250106. The patent publication number is ..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Shenzhen MCX Electronics Co Ltd has been awarded a patent for Dispensing Device for Chip Production. This invention was developed by Wu Xihe.
The patent application number is CN202422718017U 20241108. The patent publication number is CN223775215 (U). International Patent Classification codes are B05C11/10, ..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Far East Copper Foil Yibin Co Ltd has been granted a patent for Electroplating Chuck and Electroplating Device. This invention was developed by Han Haiya and Wang Mingzhong.
The patent application number is CN202520229740U 20250213. The patent publication number is CN223780386 (U). International Patent Clas..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Keteng Environmental Protection Tech Jiaxing Co Ltd for Hanging Tool for Electroplating of Aviation Connector. Gao Yiqun and Gao Yize developed the invention.
The patent application number is CN202520139155U 20250121. The patent publication..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Guangdong Huaxin Semiconductor Tech Co Ltd has been granted a patent for Vacuum Semiconductor Welding Device. This invention was developed by Yang Bin.
The patent application number is CN202520285231U 20250221. The patent publication number is CN223776203 (U). International Patent Classification codes are B..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Ningbo Junxiang Intelligent Equipment Co Ltd has obtained a patent for cutter structure used after silicon wafer welding. This invention was developed by Xiang Jingjun.
The patent application number is CN20252059761U 20250110. The patent publication number is CN223776135 (U). International Patent Classifica..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Chinese Patent for Pin Cutting Device for Semiconductor Packaging has been issued to Riyuexin Advanced Tech Research Kunshan Co Ltd. This invention was developed by Chen Kunneng.
The patent application number is CN202520254318U 20250218. The patent publication number is CN223776100 (U). International Patent..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Huangshan Chip Microelectronics Co Ltd has been granted a patent for TO-220 Silicon Controlled Rectifier Pin Bending Device. This invention was developed by Wang Minan, Chen Ming, Cao Hongjun, Qi Wenhui, Xie Hejie, Li Zhilong, Feng Ligang, Hu Lingying and Guan Tanglin.
The patent application number is CN202..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Suzhou Quantai Intelligent Equipment Co Ltd has obtained a patent for automatic wafer coating machine. This invention was developed by Pan Jianfu.
The patent application number is CN20242398761U 20241216. The patent publication number is CN223775247 (U). International Patent Classification codes are B05C13/..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Shandong Qianyuan Semiconductor Tech Co Ltd has filed a patent application for Fixing Clamp for Performance Improvement Test of LED Epitaxial Wafer Substrate Material. This invention was developed by Lyu Zunhua and Huang Yishun.
The patent application number is CN202610650527 20260512. The patent publicatio..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- China Electronic Product Reliability and Environmental Testing Research Instituite The Fifth Electronic Re has applied Chinese patent for Elemental Analysis Method, Device and System for Chip Adhesion Layer and Computer Equipment. Zhou Bo, He Xiao and Chen Zhenhai developed it.
The patent application number..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Zhongke Shanhaiwei Hangzhou Semiconductor Tech Co Ltd has filed a patent application for Defect Detection Device for Deep-ultraviolet Wide-band Large-view-field Large-numerical-aperture Bright-field Wafer. This invention was developed by Akina.
The patent application number is CN202610797176 20260604. The p..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Tsingsoft Microvision Hangzhou Tech Co Ltd has submitted a patent application for Pattern-free Wafer Defect Classification Method Based on Multi-feature Joint Judgment. Chen Shijiang, Zhou Jile and Chen Kai developed the invention.
The patent application number is CN202610729649 20260526. The patent publica..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has received Gaozhesi Tech Guangzhou Co Ltd patent application for Ink Box Nozzle Wafer Surface Defect Visual Detection Device. Yan He, Du Jiajun and Kong Lingming developed the invention.
The patent application number is CN202610809804 20260605. The patent public..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Mingyixin Jiangsu Intelligent Equipment Co Ltd has filed a patent application for Module Chip Automatic Appearance Detection Equipment. This invention was developed by Ma Xiao'an, Tong Haojie, Chu Feng, Liu Kaiqiang, Feng Xilong, Jiang Hongliang, Xie Meiqi and Xue Wei.
The patent application number is CN202..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Wuxi Hisemi Electronics Tech Co Ltd has submitted a patent application for Efficient Chip Detecting and Packaging Equipment. Lan Xilin developed the invention.
The patent application number is CN202610502524 20260416. The patent publication number is CN122330114 (A). International Patent Classification code..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Ningbo College Of Health Sciences Municipal Health Cadre Training School has submitted a patent application for Disc-type Microfluidic Chip Detection Kit and Detection Method. This invention was developed by Li Yuzheng, Lin Gan, Shen Yuchen, Yang Lifeng, Fu Yuhe, Xiao Jie, Jiang Lingli and Cen Yeping.
The p..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Guanghan Hongda Carbide Solution Co Ltd has obtained a patent for sintering furnace for silicon carbide ceramic production. This invention was developed by Xie Xianjian, Shi Liantao and Xie Xiaohui.
The patent application number is CN202520294451U 20250224. The patent publication number is CN223783346 (U). ..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Wuhan Silai Energy Tech Co Ltd has received a patent for Automatic Material Level Mistaken Touch Detection and Chip Removal Device for Hot Melting Slag. This invention was developed by Ni Lei and Yang Shu.
The patent application number is CN20242352753U 20241210. The patent publication number is CN223783335..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Chinese Patent for Clamping Jig and Substrate Conveying Device has been issued to Zhejiang Laibao Tech Co Ltd. This invention was developed by Shentu Jiangmin, Wang Lianbin, Zhu Yu and Gong Yang.
The patent application number is CN202520263129U 20250219. The patent publication number is CN223780344 (U). Int..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Xinhe Tech Jiangsu Co Ltd has been awarded a patent for Rotatable Bearing Disc for Semiconductor Wafer Storage. This invention was developed by Qin Mingzhou and Yan Bin.
The patent application number is CN202423283464U 20241230. The patent publication number is CN223778880 (U). International Patent Classifi..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Nanning Biange Tech Co Ltd has submitted a patent application for Compression Resistance Detection Method for OLED (Organic Light Emitting Diode) Metal Grid Touch Screen. Hong Ji, Xue Yufang, Huang Weilong and Chen Zhirong developed the invention.
The patent application number is CN202610804989 20260605. Th..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Zhuhai Zhenghe Microchip Tech Co Ltd has submitted a patent application for Fmcw Millimeter Wave Radar Communication Modulation Waveform, Modulation Method and Radar System. This invention was developed by Lu Hongtao.
The patent application number is CN202610722505 20260525. The patent publication number is..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Hubei Univ Of Economics and Management Changjiang Vocational College has filed a patent application for Electric Leakage Detection Mechanism for Semiconductor Electromechanical Integrated Equipment. This invention was developed by Shu Song.
The patent application number is CN202610355074 20260323. The paten..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has released Shanghai Enflame Tech Co Ltd patent application for AI Chip Simulation Test Circuit and Test Device. This invention was developed by Zhang Qiang and Liu Qing.
The patent application number is CN202610714865 20260522. The patent publication number is C..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has released Shanghai Guansi Decoration Eng Co Ltd patent application for Multi-parameter Collaborative Test and Intelligent Diagnosis Method for Integrated Circuit Control Board. This invention was developed by Ma Guangkuo.
The patent application number is CN2026..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- National Instituite Of Measurement and Testing Technology has sought patent for Power Semiconductor Switch Loss On-line Detection Method and Device, Medium and Equipment. This invention was developed by Quan Guanyu, Luo Ling and Chen Dejin.
The patent application number is CN202610804616 20260605. The paten..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Beijing Golden Ant Guochuang Tech Co Ltd has submitted a patent application for Advanced Process and Wide Bandgap Semiconductor Probe Test Method and System. This invention was developed by Zhou Xigang.
The patent application number is CN202610713294 20260522. The patent publication number is CN122330639 (A..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has released Xiaomi Intelligent Home Appliance Wuhan Co Ltd, Beijing Xiaomi Mobile Software and Xiaomi Technology, Wuhan patent application for Refrigerator Load Power Calibration Method and System, Medium, Product and Chip System. This invention was developed by Wan..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Chongqing Jingtong Electronics Co Ltd has secured a patent on Transfer Mechanism for Chip Testing. Guo Xiaohui developed the invention.
The patent application number is CN202423276865U 20241227. The patent publication number is CN223779221 (U). International Patent Classification codes are B08B5/04, B65D25/..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Anhui Samaer New Energy Tech Co Ltd for Conveying Device for Large Silicon Steel Sheet Production. Peng Guanjie developed the invention.
The patent application number is CN202520416936U 20250311. The patent publication number is CN223779166..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Changzhou Yunda New Tech Research and Development Co Ltd for Quartz Wafer Arranging Mold Loading Mechanism. Ding Fei developed the invention.
The patent application number is CN202423200016U 20241225. The patent publication number is CN2237..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Shandong Jiarui Jingxin New Mat Co Ltd has been awarded a patent for Internal Circulation Type Silicon Carbide Micro-powder Shaping Equipment. This invention was developed by Lyu Hong, Gong Shengzhi, Li Mei and Cao Jingwang.
The patent application number is CN20252051358U 20250109. The patent publication nu..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Anyang Hailiang Chemical Tech Co Ltd has been granted a patent for Automatic Batching Device for Electroplating Additives. This invention was developed by Zhang Hailiang and Jiang Jinhua.
The patent application number is CN20242287882U 20240827. The patent publication number is CN223774679 (U). Internationa..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Zhongshan Yuanshi Micro Tech Co Ltd has submitted a patent application for Communication Mode Control Method of Intelligent Consumable Chip and Intelligent Consumable Chip. This invention was developed by Xie Bing.
The patent application number is CN202610428121 20260402. The patent publication number is CN..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Chongqing Semi Chip Electronic Co Ltd has submitted a patent application for Static Pre-wetting Developing Method for Reducing Developing Bubble Defect in Semiconductor Integrated Circuit Manufacturing. This invention was developed by Li Guangbo, Wang Lu, Xu Shengjian, Gui Lin and Li Yunfeng.
The patent app..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Xingantong Tech Wuhan Co Ltd has sought patent for Control Method of Programmable MEMS Inductor. This invention was developed by Fu Shi, Zhang Naichuan and Niu Yuling.
The patent application number is CN202610492133 20260414. The patent publication number is CN122331416 (A). International Patent Classificat..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has released Tulingzhisuan Quantum Tech Wuxi Co Ltd and Shanghai Tuling Zhisuan Quantum Tech Co Ltd patent application for Waveguide Assembly, Control Method of Waveguide Assembly, Optical Chip and Optical Quantum Computer. This invention was developed by Sun Yaodong..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has received Shenzhen Xinshijia Semiconductor Tech Co Ltd patent application for Silicon-based White Light OLED (Organic Light Emitting Diode) Colorization Enhanced Collimation Light Emitting Structure and Preparation Method Thereof. Lu Yan, Sun Xinran and Zhang Lian..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has published Xindong Micro Shanghai Semiconductor Tech Co Ltd patent application for Oblique Wafer Detection Method and Oblique Wafer Detection Device. The invention was developed by Wang Yitian, Wei Yongyan, Yin Qiongling, Wang Steven He, Zhou Zhiwei, Xu Yanan, Lin..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Henan Shijia Photons Tech Co Ltd has submitted a patent application for Rapid Test Calibration Method for Wavelength of Sgdbr Semiconductor Tunable Laser. This invention was developed by Zhang Hui, Ge Qing, Xie Haiyang, Yao Lei, Feng Feng, Wang Hongshen, Hu Wenqing, Gao Feifei and Chang Xiasen.
The patent a..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- General Eng Res Instituite China Acad Eng Physics has filed a patent application for All-sic High-temperature Radiation-resistant Piezoresistive Pressure Sensor Chip and Preparation Method Thereof. This invention was developed by Zhang Quanwei, Wang Jue, Han Haijun, Li Huafeng, Zhang Peng, Deng Yongxin, Liu Ya..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has published Shenzhen SDG Information Co Ltd patent application for Dual-parameter MEMS (Micro Electro Mechanical System) Optical Fiber Sensing Method, Device and Equipment of Hollow-core Optical Fiber and Medium. The invention was developed by Lin Chuxuan, Liu Desi..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has published Jiangsu Dalibang Prec Manufacturing Co Ltd patent application for Flatness Detection Device for Integrated Circuit Substrate Processing. The invention was developed by Zhao Chong.
The patent application number is CN202610779075 20260602. The patent p..
Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Beijing Huacheng Electronic Co Ltd has filed a patent application for Gas Circuit Disc and Semiconductor Process Equipment. This invention was developed by Yang Zonglin and Shi Wenjun.
The patent application number is CN20251012558 20250103. The patent publication number is CN122328627 (A). International Pa..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Jiangsu Chenda Semiconductor Tech Co Ltd has been granted a patent for Fireproof Ventilation Exhaust Duct for Semiconductor Processing. Hong Xieqing developed the invention.
The patent application number is CN202520350408U 20250303. The patent publication number is CN223782409 (U). International Patent Clas..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Xinai Tech Nanjing Co Ltd for Glass Substrate Manufacturing Equipment with Glass Defect Inspection Function. Da Weixu and Feng Huijing developed the invention.
The patent application number is CN202423298036U 20241230. The patent publicatio..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- Dongguan Yanzhan Automation Tech Co Ltd has been awarded a patent for Integrated Circuit (ic) Chip Shaping Machine. This invention was developed by Gu Shiping.
The patent application number is CN202520215006U 20250211. The patent publication number is CN223777889 (U). International Patent Classification cod..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Yunnan Chuanzhi Semiconductor Mat Co Ltd for Monocrystalline Silicon Rod Cutting and Fixing Device. Jiang Jilin and A Chaohai developed the invention.
The patent application number is CN202520310379U 20250225. The patent publication number ..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Xuzhou Huijing Semiconductor Mat Co Ltd for Semiconductor Chip Cutting Device. Qiu Xiaofang developed the invention.
The patent application number is CN202423132595U 20241218. The patent publication number is CN223777491 (U). International ..
Semiconductor
| Wed 07 Oct 2026
Beijing, Oct. 7 -- State Intellectual Property Office of China has awarded a patent to Ningbo Tuanliu Electronic Mat Co Ltd for High Ceramic Composite Substrate Cutting Device. He Boyang, Zhang Shaofei and Hui Lei developed the invention.
The patent application number is CN202520150411U 20250122. The patent publication number..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- European Patent Office has received Hitachi Energy patent application for Power Semiconductor Module and Assembly Method. Fisher Noam, Truessel Dominik, Roesch Andreas, Guillon David and Santolaria Lluis developed the invention.
The patent application number is EP20250166111 20250325. The patent publication ..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- European Patent Office has published Hitachi Energy patent application for Power Semiconductor Module and Assembly Method. The invention was developed by Fisher Noam, Santolariy Lluis, Roesch Andreas, Guillon David and Beyer Harald.
The patent application number is EP20250166089 20250325. The patent publicat..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- European Patent Office has released Plansee patent application for Substrate Holder for an Electrostatic Chuck. This invention was developed by Geiger Sebastan, Knitel Serafin, Wagner Josef and Schmidt Hennrik.
The patent application number is EP20250166240 20250326. The patent publication number is EP481503..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- ASML Netherlands has submitted a patent application for Method and Computer Program Product for Bonding Substrates. Van Kraaij Markus Gerardus Martinus Maria, Venugopalan Syam Parayil, Middlebrooks Scott Anderson and Wang Sheng developed the invention.
The patent application number is EP20250166784 20250327. T..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- SK Hynix has applied European patent for Apparatus and Method of Transmitting Pass Voltage in Memory Device. Jo Eun Woo developed it.
The patent application number is EP20250223663 20251216. The patent publication number is EP4814961 (A1). International Patent Classification codes are G11C11/408, G11C16/08 and..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- Kokusai Electric has sought patent for Substrate Processing Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Program. This invention was developed by Mineta Riku and Joda Takuya.
The patent application number is EP20260168202 20260326. The patent publication number is EP..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- Kokusai Electric has applied European patent for Gas Supply Method, Method of Manufacturing Semiconductor Device, Gas Supply System, Substrate Processing Apparatus and Program. Nakatani Shunsuke and Goshima Kentaro developed it.
The patent application number is EP20250224649 20251217. The patent publication nu..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- European Patent Office has released Kokusai Electric patent application for Method of Processing Substrate, Method of Manufacturing Semiconductor Device, Program, and Substrate Processing Apparatus. This invention was developed by Nohara Shingo, Ishibashi Kiyohisa and Yamane Yoma.
The patent application number..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- European Patent Office has released Ebara patent application for Substrate Processing Device and Substrate Processing Method. This invention was developed by Kitamura Kei, Sasaya Yusuke, Kodera Kenji and Takenaka Hiroyuki.
The patent application number is EP20240893937 20241025. The patent publication number..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- Carrier has sought patent for Solid Desiccant Dehumidification with Translating Substrate and Condenser Heat Regeneration. This invention was developed by Oggianu Stella Maris, Kueck Aaron, Hernandez-alvarado Freddy and Covington Jefferi.
The patent application number is EP20260158307 20260212. The patent pu..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- STMicroelectronics International has applied European patent for Streaming Dataflow Based Recurrent Neural Network Accelerator. Singh Surinder Pal, Massa Riccardo and Boesch Thomas developed it.
The patent application number is EP20260164195 20260312. The patent publication number is EP4814801 (A1). Internatio..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- Idemia France has applied European patent for Metal Chip Card and Method for Producing Such a Chip Card. Gac Philippe, Groult Tiphaine and Duval Agnès developed it.
The patent application number is EP20260167382 20260324. The patent publication number is EP4814787 (A1). International Patent Classification c..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- European Patent Office has published Samsung Electronics patent application for Merged-height Cell Semiconductor Device Structure and Methods of Forming Same. The invention was developed by Kwon Jiwook, Simka Harsono, Shaji Sandra Maria, Huang Victor, Zhu Xuelian, Kumar Aravindh and Choi Subin.
The patent ap..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- European Patent Office has received Shenzhen Hosonsoft patent application for Method, Apparatus and Device for Printing Images on Substrate Based on AI Vision. Chang Zhiguo, Zhang Xiaofeng, Xu Guomin and Peng Zhuoran developed the invention.
The patent application number is EP20260168627 20260327. The patent p..
Semiconductor
| Thu 08 Oct 2026
Munich, Oct. 7 -- Altera has filed a patent application for Techniques for Transmitting Data Through a Network-on-chip in an Integrated Circuit. This invention was developed by Weber Scott, Shirvaikar Tara and Kumar Rajiv.
The patent application number is EP20260160851 20260226. The patent publication number is EP4814731 (A1)..
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