Semiconductor
| Tue 27 Oct 2026
Alexandria, Oct. 26 -- Infineon Technologies has received a patent for Leaded Semiconductor Package Formation Using Lead Frame with Structured Central Pad. This invention was developed by Gruber Martin, Law Tien Shyang, Meyer Thorsten, Escher-poeppel Irmgard, Yeo Si Hao Vincent, Bonifacio Eric Lopez, Mohamed Azizi Mohamad Azian,..