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Semiconductor
| Tue 07 Apr 2026
Beijing, April 7 -- Advanced Micro Devices has applied Chinese patent for Memory Bit Cell with Three-dimensional Cross Field Effect Transistor. Schultz Richard T and Underhill Kelly Welkant developed it.
The patent application number is CN20248017898 20240308. The patent publication number is CN120898542 (A). International Pa..
Semiconductor
| Tue 07 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has released Yanbian University patent application for Mouse Hippocampus Learning and Memory Ability Evaluation Method and System Based on Water Maze. This invention was developed by Jin Qinghua, Xiao Bin, Li Shenghui and Guo Shuhan.
The patent application number..
Semiconductor
| Tue 07 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published No. 10 Institute of CETC patent application for Variable-size Multi-chip Mounter Suction Nozzle Device and Adjusting Method Thereof. The invention was developed by Yan Dejin, Li Yanjiang, Jia Yaoping, Zhang Guoyong, Wang Cong, Li Yingfan, Cao Peilin, W..
Semiconductor
| Tue 07 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published Yangtze Memory Technologies patent application for Semiconductor Structure and Manufacturing Method Thereof, Memory and Memory System. The invention was developed by Zhang Weimin, Cai Zhiyong, Luo Xingan and Zhou Yi.
The patent application number is..
Semiconductor
| Tue 07 Apr 2026
Beijing, April 7 -- ChangXin Technology Group has sought patent for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Wu Saisai.
The patent application number is CN202410675082 20240527. The patent publication number is CN121038271 (A). International Patent Classification code is H10B12..
Semiconductor
| Tue 07 Apr 2026
Beijing, April 7 -- Yangtze Memory Technologies has applied Chinese patent for Semiconductor Device and Forming Method Thereof. Zhang Hao, Tang Zhaoyun and Hua Wenyu developed it.
The patent application number is CN202410675135 20240528. The patent publication number is CN121038272 (A). International Patent Classification cod..
Semiconductor
| Tue 07 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published Xincun Technology (Wuhan) patent application for Memory and Preparation Method Thereof. The invention was developed by Hu Mingyao, Gao Jian, Wang Qianli, Yang Hongxin and Liu Jun.
The patent application number is CN20251122976 20250724. The patent p..
Semiconductor
| Tue 07 Apr 2026
Beijing, April 7 -- Shanghai Jita Semiconductor has sought patent for Semiconductor Device and Preparation Method Thereof. This invention was developed by Zhou Jin and Dong Xinguo.
The patent application number is CN202511205185 20250826. The patent publication number is CN121038307 (A). International Patent Classification co..
Semiconductor
| Tue 07 Apr 2026
Beijing, April 7 -- Rongxin Semiconductor Ningbo has submitted a patent application for DMOS Device and Manufacturing Method Thereof. This invention was developed by Sun Bingshuo, Fang Xinxin, Zhang Siyu, Wang Zilong and Guo Fengqi.
The patent application number is CN202511556942 20251029. The patent publication number is CN1..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Zhixin Semiconductor Co Ltd has sought patent for Gallium Nitride Power Packaging Module and Packaging Method. This invention was developed by Wang Wei, Wang Min, Jiao Shuangfeng, Zhang Tuo, Hu Yongzhe, Dong Yuanquan and Wang Xiaomei.
The patent application number is CN202510988501 20250717. The patent pub..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Chongqing Zhenbao Semiconductor Mat Co Ltd has submitted a patent application for Monocrystalline Silicon Ring Surface Treatment Method. He Qiao, Zhao Qingyun, Wang Wenbin and Yang Zuodong developed the invention.
The patent application number is CN20251143561 20250728. The patent publication number is CN1..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Mitsuboshi Diamond Ind Co Ltd has submitted a patent application for Method for Breaking Substrate with Metal Film. This invention was developed by Murakami Kenji.
The patent application number is CN20251146680 20181016. The patent publication number is CN120895469 (A). International Patent Classification ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Zhejiang Jingke New Mat Co Ltd has sought patent for Silver Paste and Solar Cell. This invention was developed by Hu Jiehui, Zhu Zhening, Tao Yuefei, Ye Zhixian, She Hongyan and Guo Xiaobo.
The patent application number is CN202510884311 20250627. The patent publication number is CN120895289 (A). Internati..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Suanmiao Tech Beijing Co Ltd has submitted a patent application for Method and Device for Realizing DRAM (dynamic Random Access Memory) Access and DRAM Controller. Zhao Yan and Yin Leizu developed the invention.
The patent application number is CN202511157290 20250818. The patent publication number is CN12..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Zhejiang Liji Storage Tech Co Ltd has filed a patent application for Fuse Detection Circuit, Fuse Detection Method, and Semiconductor Memory. This invention was developed by Xu Lu.
The patent application number is CN202511525986 20251024. The patent publication number is CN121034365 (A). International Pate..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Qingdao Jinhuiyuan Electronics Co Ltd has filed a patent application for Semiconductor Silicon Wafer Open Washing Device. This invention was developed by Xu Haitao, Li Zhongliang and Cheng Wenjuan.
The patent application number is CN20251187708 20250805. The patent publication number is CN120895523 (A). In..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Suzhou Suzirode Automation Co Ltd has sought patent for Wafer Bearing Structure and Wafer Testing Device. This invention was developed by Zhang Xing, Zhang Mingjing, Chen Wenzhong and Wang Shuai.
The patent application number is CN202510889867 20250630. The patent publication number is CN120895520 (A). Int..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has filed a patent application for Wafer Groove Type Cleaning Spraying Carrying Arm Structure and Control Method Thereof. This invention was developed by Wang Siyuan and Chen Haibing.
The patent application number is CN20251136912 20250725. The patent pub..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Zhejiang Futong Quartz New Mat Co Ltd has submitted a patent application for Quartz Boat Support for Photovoltaic Semiconductor Production. This invention was developed by Ye Guomin, Zhang Yongming, Song Xian, Pan Qiming and Wu Binbin.
The patent application number is CN20251158929 20250730. The patent pub..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published Ruomingxin Equipment (Suzhou) and Ruomingxin Semiconductor Tech Suzhou Co Ltd patent application for Grinding and Cleaning Equipment for Wafer and Cleaning Method of Grinding and Cleaning Equipment. The invention was developed by Cui Jianju, Xu Dongbo,..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published Jiangsu Youpuna Tech Co Ltd and Wuxi Xishan Semiconductor Advanced Mfg Innovation Center patent application for Wafer Centering, Edge Searching and Positioning Method and Wafer Centering, Edge Searching and Positioning Equipment. The invention was deve..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Hangzhou Dunyuan Juxin Semiconductor Tech Co Ltd has filed a patent application for Etching Method for C-type Porous Structure Silicon Product. This invention was developed by Ma Yiming, Zhu Jianmin, Zhou Bo, Lin Shuang and Mitsushi.
The patent application number is CN202510931529 20230529. The patent publ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published Zhejiang Jinruihong Tech Co Ltd patent application for Monocrystalline Silicon Wafer Layer Fault Ring Lossless Identification Method. The invention was developed by Zhang Xin, Liang Xingbo, Gao Pengfei, Wang Leping, Wang Qi and Yang Aibing.
The pate..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Lichuan Hangzhou Semiconductor Equipment Co Ltd has filed a patent application for Method and System for Detecting and Analyzing Polluted Particles on Surface of TSV Wafer After CMP Cleaning. This invention was developed by Lin Bangyu.
The patent application number is CN202510928429 20250707. The patent pu..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Shanghai Yibo Semiconductor Co Ltd has submitted a patent application for Semiconductor Packaging Method, Semiconductor Assembly and Electronic Equipment. This invention was developed by Gao Xiuguang.
The patent application number is CN202510880964 20250627. The patent publication number is CN120895480 (A)..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Chengdu Yicheng Integrated Circuit Co Ltd has sought patent for Method for Embedding Bridge Chip in Glass Substrate. This invention was developed by Wang Chaoyang, Mu Junhong, Zhang Kang, Liu Xinghua and Li Yongqiang.
The patent application number is CN20251197859 20250806. The patent publication number is..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Park Song Mi has filed a patent application for Manufacturing Method of Glass Substrate.
The patent application number is CN20251154857 20250730. The patent publication number is CN120895474 (A). International Patent Classification codes are C03C27/02 and H01L21/48.
According to the abstract released ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published Shanghai Yinjiang Tech Co Ltd patent application for Photovoltaic Front Silver Paste, Preparation Method Thereof, Front Electrode and Solar Cell. The invention was developed by Yao Yuanyuan, Liu Huan, Liu Bing, Chen Xiaolong and Liu Jie.
The patent ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has received Huameijing Tech Co Ltd patent application for Diffusion Bonding Method of Nanometer Bicrystal Copper-to-copper Bonding Piece for Power Semiconductor Element. Zhuang Heqiao and Tong Lifen developed the invention.
The patent application number is CN202..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Qili Semiconductor Shaoxing Co Ltd has submitted a patent application for Ultrasonic Fingerprint Chip Packaging Method Based on Box Dam Dispensing and Vacuum Coating. This invention was developed by Xie Jianyou.
The patent application number is CN202511228590 20250829. The patent publication number is CN12..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Shinkong Tech Singapore Pte Ltd has submitted a patent application for Packaging Method of Semiconductor Device. Jin Yonggang developed the invention.
The patent application number is CN202511200777 20250826. The patent publication number is CN121034971 (A). International Patent Classification codes are G0..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Yixin Micro Semiconductor Tech Shenzhen Co Ltd has submitted a patent application for Three-dimensional Heterogeneous Integrated Packaging Method and System Based on Glass Substrate. This invention was developed by Zhou Yongqiang, Wang Jiaqing, Zhang Renfu and Luo Wangbao.
The patent application number is ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has released Chengdu Yicheng Integrated Circuit Co Ltd patent application for Anti-warping Structure for Packaging Chip and Manufacturing Method Thereof. This invention was developed by Chen Yonglin, Zhang Kang and Jiang Junbo.
The patent application number is CN..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Wuyuan Semiconductor Tech Qingdao Co Ltd has submitted a patent application for Substrate Etching Method. Chen Jiawen, Zhai Hongjie, Wang Hongye, Yan Tiancai, Yang Lieyong and Chen Weiyu developed the invention.
The patent application number is CN202511168130 20250820. The patent publication number is CN12..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has received New Vision Tech Pte Ltd patent application for Nozzle Assembly and Plasma Processing Assembly. Wu Yongding, Chen Bin and Chen Chunqiang developed the invention.
The patent application number is CN202410666807 20240527. The patent publication number i..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has received Zhejiang Linggui Tech Co Ltd patent application for Novel Silicon Carbon Material as Well as Preparation Process and Application Thereof. Wang Yuyang and Wang Wei developed the invention.
The patent application number is CN20251188551 20250805. The p..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Hubei Gaogui New Mat Co Ltd has submitted a patent application for Titanium-coated Silicon Carbon Material as Well as Preparation Method and Application Thereof. Zhou Feng, Zhu Lei, Xu Wei, Zheng Anchu, Xu Zhenxing, Zhu Dezhi and Huang Dan developed the invention.
The patent application number is CN2025118..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published China Chemical Donghua Anhui New Mat Co Ltd and Wuhan Xianjian Tech Co Ltd patent application for Graphene-based Silicon Carbon Negative Electrode Material. The invention was developed by Huang Yonggang, Yang Kai and Xu Wei.
The patent application n..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has received Dali Chenyu Energy Storage New Mat Co Ltd and Central South University patent application for Modified Sandwich Silicon Electrode, Preparation Thereof and Application of Modified Sandwich Silicon Electrode in Solid-state Lithium Battery. Zhang Yaguang, ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Suzhou Zhuomu Industrial Intelligent Tech Co Ltd has sought patent for Transformer Iron Core Silicon Steel Sheet Lamination Machine. This invention was developed by Yuan Bo.
The patent application number is CN202510453454 20250411. The patent publication number is CN121034833 (A). International Patent Clas..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Hewtech Lianyungang Electronics Co Ltd has submitted a patent application for Jig for Fixing Chip and Cooling Fin. Chen Shiming and Chen Jing developed the invention.
The patent application number is CN20251170181 20250731. The patent publication number is CN120895547 (A). International Patent Classificati..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Shanghai Xinaoxinyi Tech Co Ltd has sought patent for Preparation Method of Semiconductor Device. This invention was developed by Dai Rongwang, Wang Ziwen, Wei Xing and Li Wei.
The patent application number is CN20251147428 20250728. The patent publication number is CN120895529 (A). International Patent Cl..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has received Xi'an ESWIN Material Technology and Xi'an Eswin Silicon Wafer Technology patent application for Bearing Device and Wafer Cleaning Equipment. Guo Hongyan, Jia Xiaodong, Guo Dun and Ye Sen developed the invention.
The patent application number is CN202..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published Ningbo Zhongwu Sterilization Tech Co Ltd and Ningbo Flexo Electronics Tech Co Ltd patent application for Photon De-bonding Temperature Accurate Regulation and Control Method and System for Wafer Level Packaging. The invention was developed by Wang Shen..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Hwatsing Beijing Tech Co Ltd has submitted a patent application for Vertical Scrubbing Device, Wafer Processing Equipment, Wafer Scrubbing Method and Storage Medium. Li Deng, Liu Hongwang, Cao Zili and Li Changkun developed the invention.
The patent application number is CN202511178930 20250418. The patent..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Shanghai Xinyuan Micro Entpr Development Co Ltd has submitted a patent application for Treatment Liquid Circulation System for Wafer Processing. This invention was developed by Zhang Yuhui, Peng Bo, Li Zhifeng, Chen Jiawei and Zhang Yu.
The patent application number is CN202511155061 20250818. The patent p..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Brookes Automation USA LLC has submitted a patent application for Substrate Mapping Apparatus and Method Thereof. This invention was developed by Suynougatov Roman, Wang Ruibing R, Shah Kaniyalal, Graciano John, Wise Alan, Hansen Claus and Pastor Evan.
The patent application number is CN202511151198 202106..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Luo Guilian has submitted a patent application for Pre-bonding Device and Method Compatible with Multi-size Semiconductor Wafers.
The patent application number is CN202511150502 20250818. The patent publication number is CN121035001 (A). International Patent Classification codes are G01B11/00, G01B11/02, ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Shandong Hanxin Tech Co Ltd has sought patent for Semiconductor Chip Packaging Module. This invention was developed by An Fengwei and Zhang Xiaozhong.
The patent application number is CN202511126843 20250812. The patent publication number is CN121034998 (A). International Patent Classification codes are B2..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Origin Quantum Computing Technology Hefei Co Ltd has submitted a patent application for Method for Forming Holes in Substrate and Application of Method. This invention was developed by Jia Zhilong.
The patent application number is CN202410629270 20240521. The patent publication number is CN121034987 (A). I..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Wuxi Yongjing Electronic Co Ltd has submitted a patent application for Wafer Defect Detection Equipment for Semiconductor Processing and Method Thereof. This invention was developed by Jin Yongchun and Shin Dong-jin.
The patent application number is CN202511183939 20250822. The patent publication number is..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published Anhui Microchip Changjiang Semiconductor Mat Co Ltd patent application for Method for Judging Number of Stacking Faults Caused by Self-seed Crystal End of 4H Conductive Silicon Carbide Wafer. The invention was developed by Pan Qinghua, Zhou Guodong and..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has received United Semi Integrated Circuit Mfg Xiamen Co Ltd patent application for Semiconductor Substrate Defect Detection Method. Luo Qingshu, Cai Yan, Lin Congzhe, Chen Qiaolin and Tan Wenyi developed the invention.
The patent application number is CN2024106..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Zhongqing Zhitu Nantong Tech Co Ltd has sought patent for Contact-type Image Sensor Based on Adaptive Multispectrum. This invention was developed by Chen Guodong and Li Zhifeng.
The patent application number is CN202511135912 20250814. The patent publication number is CN120897114 (A). International Patent ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Beijing Unisoc Communication Tech Co Ltd has submitted a patent application for Channel State Information Reporting Method, Communication Device, Chip and Module Equipment. This invention was developed by Ma Dawei.
The patent application number is CN202410525862 20240428. The patent publication number is C..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Beijing Zesheng Tech Co Ltd has submitted a patent application for Method for Judging Key Signal by Stress Sensing Chip. This invention was developed by Zhao Penghui, Zhou Ying, Sun Yongming and Xiang Yihai.
The patent application number is CN202511171626 20250821. The patent publication number is CN120896..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has received Suzhou Laboratory patent application for Gallium Nitride-based Diffraction Type Surface Emitting Semiconductor Laser. Yu Xiaoqi, Xiong Kanglin, Wang Junfei, Sun Zhiwei, Zheng Yuzhen, Xia Suman, Wang Huaibing and Yang Hui developed the invention.
The ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published Changchun University of Science and Technology and North China Municipal Engineering Design & Research Institute patent application for Low-divergence-angle Narrow-linewidth High-power Semiconductor Laser. The invention was developed by Wei Zhipeng, Ta..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published Ningbo Air Touch Intelligent Tech Co Ltd patent application for Antenna Packaging Chip for Substrate Array Packaging. The invention was developed by Lin Shuiyang, Song Ying and Niu Jiabao.
The patent application number is CN202510937969 20250708. Th..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has released Shenzhen Zhongke Guangxin Semiconductor Tech Co Ltd patent application for Vcsel Chip Manufacturing Method and Laser. This invention was developed by Zheng Junxiong, Dong Bo, Guo Dingkai, Huang Shuang and Zheng Chunhai.
The patent application number ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Riyuexin Advanced Tech Research Kunshan Co Ltd has submitted a patent application for Fan-out Packaging Structure of Vcsel Wafer and Manufacturing Method. This invention was developed by Guo Jianyun and Lai Zhongliang.
The patent application number is CN202511132727 20250813. The patent publication number ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Huatian Tech Nanjing Co Ltd has sought patent for Anti-magnetic Shielding Packaging Structure Based on PCB Substrate and Packaging Method Thereof. This invention was developed by Li Baiying, Zhou Jianwei and Wang Ruipeng.
The patent application number is CN202511173730 20250821. The patent publication numb..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published Nantong Shangyangtong Integrated Circuit Co Ltd patent application for Packaging Structure and Method of Power Semiconductor Device and Electronic Equipment. The invention was developed by Shen Chengkai.
The patent application number is CN2025112430..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has received Tongfu Tongke Nantong Microelectronics Co Ltd patent application for Chip Structure and Forming Method Thereof, and Chip Packaging Structure and Method Thereof. Jiang Qian, Oh Myung Min, Ji Hongbin and Li Dequan developed the invention.
The patent ap..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Tianjian Carbon Mat Co Ltd has sought patent for Diamond Film Growing on Silicon Wafer by Taking Atomic Lattice of Silicon Wafer as Template. This invention was developed by Sung Chien-min, Zhang Hongtao, Tong Yi, Zhang Shixing, Li Xiaotong, Liang Yapeng and Wang Hongtao.
The patent application number is C..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has released Suzhou Nanowin Science and Tech Co Ltd patent application for Composite Substrate Structure and Preparation Method and Application Thereof. This invention was developed by Li Jinjuan, Wang Shengchun and Wang Jianfeng.
The patent application number is..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published Shenzhen Hexin Electronics Co Ltd patent application for High-stability Semiconductor Transistor Packaging Structure. The invention was developed by Wang Zhiqiang and Wang Zhihui.
The patent application number is CN20251163099 20250731. The patent p..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Shanghai Gnd Etech Co Ltd has submitted a patent application for Wafer Jacking Device and Wafer Transfer Equipment. This invention was developed by Xia Zihuan.
The patent application number is CN202511250481 20250903. The patent publication number is CN121035046 (A). International Patent Classification cod..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Suzhou Xixing Semiconductor Tech Co Ltd has submitted a patent application for Y-axis Double-drive Wafer Transfer Device, Transfer System and Non-orthogonal Residual Error Correction Method. Wang Jing, Li Gaofei, Chen Chang, Zhang Jin, Jin Yujie, Chen Zhaoyun, Chen Junru, Wu Dong and Tao Dashuai developed the..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Wuxi Yongjing Electronic Co Ltd has submitted a patent application for Semiconductor Wafer Clamp. This invention was developed by Jin Yongchun and Shin Dong-jin.
The patent application number is CN202511183937 20250822. The patent publication number is CN121035043 (A). International Patent Classification c..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Chengdu Siyue Intelligent Equipment Co Ltd has submitted a patent application for Gantry Type Wafer Double-specification Manipulator Based on Single-shaft Synchronous Driving. This invention was developed by Zhao Jianpu, Li Shouzuo and Lee Ho-young.
The patent application number is CN202511563197 20251030...
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Geke Semiconductor Shanghai Co Ltd has submitted a patent application for Technological Method for Improving Performance of CMOS Image Sensor. This invention was developed by Chen Lin and Wang Shaowei.
The patent application number is CN202510986127 20250716. The patent publication number is CN120897534 (A..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Toshiba; Toshiba Electronic Devices & Storage has filed a patent application for Semiconductor Device and Semiconductor Circuit. This invention was developed by Matsudai Tomoko, Iwakaji Yoko and Itokazu Yuko.
The patent application number is CN20251147802 20210722. The patent publication number is CN120897..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has received Shenzhen Xiuyuan Electronic Tech Co Ltd patent application for Three-dimensional Chip Stacking Device and Preparation Method Thereof. Hu Chuan and Chen Xianwen developed the invention.
The patent application number is CN20251185011 20250804. The pate..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has released Golden Phoenix Laboratory patent application for Low-noise Double-path Digital Auxiliary Phase-locked Loop Circuit for Large-area-array Image Sensor. This invention was developed by Tang Fang.
The patent application number is CN202511152598 20250818...
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Suzhou Full Way Jiexin Electronic Tech Co Ltd has sought patent for Substrate Selection Circuit with Function of Adjusting Threshold Voltage of Switching Tube Based on NMOS (N-channel Metal Oxide Semiconductor) Switching Tube. This invention was developed by Ma Yingchen, Hu Shengzhe, Xu Yanlin, Wang Zhou, Seo..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has released Anhui Chuangrui Electronic Co Ltd patent application for Chip Mounting Device and Method for Manufacturing Integrated Circuit. This invention was developed by Cheng Benzheng, Gong Rui and Xia Chaohui.
The patent application number is CN202511136127 2..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has released Suzhou Fengke Shijie Intelligent Equipment Co Ltd patent application for Probe Row and Solar Cell Measuring Device. This invention was developed by Wang Yu.
The patent application number is CN202511198609 20250826. The patent publication number is CN..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Jiangmen Zhongyang Circuit Tech Co Ltd has filed a patent application for Method for Controlling Warping of Semiconductor Test Printed Circuit Board. This invention was developed by Lai Jianchun and Wu Yibo.
The patent application number is CN202511417076 20250930. The patent publication number is CN120897..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Forewin Electronics Corp has filed a patent application for Manufacturing Method of Low-line-resistance OLED Circuit Board. This invention was developed by Huangfu Ming and Chen Wei.
The patent application number is CN202511183196 20250822. The patent publication number is CN120897352 (A). International Pa..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Nantong Hualong Microelectronics Co Ltd has submitted a patent application for Leveling Method and System for Processing PCB (printed Circuit Board) in Integrated Circuit. Zheng Jianhua, Su Jianguo, Zhang Yuanyuan, Sun Bin and Zhu Jian developed the invention.
The patent application number is CN20251140325..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Shanghai Jifeng Shangchi Electric Co Ltd has submitted a patent application for Multi-winding Motor Control System and Method Based on Multi-core Chip and Interrupt Alignment. This invention was developed by Lin Xiao, Bo Xiaoguang, Peng Zihao, Li Borun and Fan Xuanwei.
The patent application number is CN20..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Mentouch Co Ltd has submitted a patent application for Method Executed by User Equipment, User Equipment and Semiconductor Chipset. This invention was developed by Ryu Sang-keun.
The patent application number is CN202510469114 20250415. The patent publication number is CN120897257 (A). International Patent..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has released Zhongyin Microelectronics Chengdu Co Ltd patent application for Power Supply Combining Circuit and SOC Chip Internal Multi-input Power Supply Circuit. This invention was developed by Liu Yong and Wang Hongpeng.
The patent application number is CN2025..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Shenzhen Dstech Co Ltd has submitted a patent application for Control Method of Cot Conversion Circuit, Cot Conversion Circuit and Chip. This invention was developed by Du Jiahao, Lei Ou and Wang Kecheng.
The patent application number is CN202511162888 20250819. The patent publication number is CN121036481..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has published Dongguan Yitie Metal Product Co Ltd patent application for Ultrathin Silicon Steel Sheet Riveting Process and Equipment. The invention was developed by Hu Yonghe and Zhong Guijie.
The patent application number is CN202511218972 20250828. The patent ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has received Yehong Tech Chengdu Co Ltd and Yehong Tech Co Ltd patent application for Ball Grid Array Packaging Image Sensor Module with Anti-glare Characteristic. Xie Peijun, Lu Hongjie and Zhang Junde developed the invention.
The patent application number is CN..
Semiconductor
| Tue 07 Apr 2026
Beijing, April 7 -- Minebea Power Semiconductor Inc has filed a patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. This invention was developed by Morizuka Tsubasa, Shiraishi Masaki and Furukawa Tomoyasu.
The patent application number is CN20248019852 20240221. The patent publicatio..
Semiconductor
| Tue 07 Apr 2026
Beijing, April 7 -- Navitas Semiconductor Inc has submitted a patent application for Integrated Bidirectional Four-quadrant Switch with Driver and Input/output Circuit. Hessner Andreas, Kinzer Daniel M, De Sade Vincent and Marco Giandella developed the invention.
The patent application number is CN20248024309 20240415. The pa..
Semiconductor
| Tue 07 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has released Zhuhai Suijing Tech Co Ltd patent application for Multi-image Sensor Architecture, Imaging Device, Chip and Electronic Equipment. This invention was developed by Wang Zhenpeng and Gu Yuanbao.
The patent application number is CN202511583126 20251031. ..
Semiconductor
| Tue 07 Apr 2026
Beijing, April 7 -- Galabs AB has submitted a patent application for Photonic System Comprising Photonic Chip and Multi-plane Conversion Device. Buelow Andreas, Autebert Christopher, Denoual Bart and Sivankutty Sunil developed the invention.
The patent application number is CN20248024171 20240410. The patent publication numbe..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Inner Mongolia Huarong Power Tech Co Ltd has submitted a patent application for Service Flow Copying Method, Device and System Based on Switch Chip. This invention was developed by Qu Zhigang, Lu Langlang, Meng Saifu, Jia Zehui and Gao Yun.
The patent application number is CN202511361872 20250923. The pate..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Qili Semiconductor Shaoxing Co Ltd has submitted a patent application for Ultrathin Packaging Method for Ultrasonic Fingerprint Chip Based on Laser Hole Digging and Metal Hole Filling. This invention was developed by Xie Jianyou.
The patent application number is CN20251171329 20250731. The patent publicati..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has received Southern Power Grid New Electric Power System Beijing Res Institute Co Ltd patent application for Power Chip Security Protection Method and Device. Yang Yingjie, Xi Wei, Qin Ziyue, Wang Xiaoxing, Liu Menglian, Xi Qing, Liu Dehong, Liang Jiapeng and Yang..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has received BOE Technology Group and Chengdu BOE Optoelectronics Technology patent application for Display Substrate and Display Device. Guan Xinxing, Chen Youchun, Bai Shanshan and Li Yansong developed the invention.
The patent application number is CN202511842..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Shanghai Anputai Future Energy Tech Research and Development Co Ltd has filed a patent application for Perovskite/silicon Laminated Solar Cell and Preparation Method Thereof. This invention was developed by Ji Tianbai, Liu Xin and Li Mengyu.
The patent application number is CN202511246033 20250902. The pat..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has received Nanjing Youtian Metal Tech Co Ltd patent application for Full-perovskite Laminated Solar Cell and Manufacturing Process Thereof. Qian Yue, Wei Jie and Chen Huaihao developed the invention.
The patent application number is CN20251190042 20250805. The ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Leiyu Optoelectronics Tech Suzhou Co Ltd has sought patent for Micro-led Display Chip and Preparation Method. This invention was developed by Zhang Xu, Chong Wing Cheung, Lu Ziyuan, Zeng Hongtu and Zhang Nao.
The patent application number is CN202510820989 20250618. The patent publication number is CN12089..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- State Intellectual Property Office of China has released Xiamen Yinke Qirui Semiconductor Tech Co Ltd patent application for Epitaxial Structure of Gaas Solar Cell and Growth Method Thereof. This invention was developed by Wang Yu, Zhang Yinqiao, Xia Hongying, Zeng Shiyu, Zheng Wenjuan and Wu Zhipeng.
The ..
Semiconductor
| Mon 06 Apr 2026
Beijing, April 7 -- Xiamen Yinke Qirui Semiconductor Tech Co Ltd has sought patent for Epitaxial Structure of Three-junction Solar Cell and Preparation Method Thereof. This invention was developed by Xia Hongying, Zhang Yinqiao, Wang Yu, Zheng Wenjuan and Ye Qianqian.
The patent application number is CN202511415050 20250930. ..
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