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Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Texas Instruments Incorporated patent application for Method for Reducing Magnetism on a Mold Chase. This invention was developed by Bucasas Cesar, Sumalinog Richard and Orias Piel Angelo.
The patent application number is US202418675719 20240528. The patent pub..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released SanDisk Technologies patent application for Unmatched Data Path Delay Compensation for Non-volatile Memory. This invention was developed by Lee Jang Woo, Ramachandra Venkatesh and Darne Siddhesh.
The patent application number is US202418732423 20240603. The pat..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has published Micron Technology patent application for Memory Read Voltage Threshold Tracking Based on Memory Device-originated Metrics Characterizing Voltage Distributions. The invention was developed by Doru Shantilal Rayshi, Khayat Patrick R, Kientz Steven Michael, Ratnam..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- SK Hynix has submitted a patent application for Memory Device for Performing Program Operation and Method of Operating the Same. This invention was developed by Lee Ji Hyun.
The patent application number is US202418963759 20241129. The patent publication number is US2025372186 (A1). International Patent Cl..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has published Sandisk Technology patent application for Fake Fast Plane Detection in Early Program Termination. The invention was developed by Zainuddin Abu Naser, Tian Xuan and Yuan Jiahui.
The patent application number is US202418680066 20240531. The patent publication nu..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Sandisk Technology has submitted a patent application for Non-volatile Memory with Word Line Ramp Sensing for Memory Cell Tracking. Chen Albert, Fu Eric, Yuan Jiahui, Amarnath Anirudh and Yang Xiang developed the invention.
The patent application number is US202418756481 20240627. The patent publication nu..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Sandisk Technology has submitted a patent application for Non-volatile Memory with Location Dependent Bitline Voltage During Program-verify for Current Sensing Compensation. This invention was developed by Yang Xiang, Masuduzzaman Muhammad and Dutta Deepanshu.
The patent application number is US20241867614..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- SanDisk Technologies has filed a patent application for Apparatus and Methods for Negative Threshold Voltages for Nonvolatile Memory Devices. This invention was developed by Cao Wei, Yang Xiang, Yuan Jiahui and Dutta Deepanshu.
The patent application number is US202418731253 20240601. The patent publicatio..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has published Yangtze Memory Technologies patent application for Driving Circuit, Memory Device Using Driving Circuit, and Memory System. The invention was developed by Lei Mingxian and Wei Ruxin.
The patent application number is US202418750892 20240621. The patent publicat..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Micron Technology patent application for Memory Device Including Conductive Contacts Aligned with Support Structures. This invention was developed by Shepherdson Justin David, Meldrim John Mark, Gupta Sidhartha, Wang Yucheng and King Matthew J.
The patent appli..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Micron Technology has filed a patent application for Memory Device Including Conductive Contacts in Treated Tiers. This invention was developed by Gupta Sidhartha, King Matthew J, Hill Richard J, Wang Yucheng, Wang Yiping and Meldrim John Mark.
The patent application number is US202519224077 20250530. The ..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- NVIDIA has submitted a patent application for Retention Mode Low Leakage High Performance Bit Line Clamping Scheme Based on an Output Latch State. Gupta Lalit and Erbagci Cagri developed the invention.
The patent application number is US202418680945 20240531. The patent publication number is US2025372161 (..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- STMicroelectronics International NV has submitted a patent application for Scrambled Dummy Column Memory Architecture for an In-memory Computation Processing System. This invention was developed by Rawat Harsh, Chawla Nitin and Ayodhyawasi Manuj.
The patent application number is US202519206830 20250513. Th..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- ARM Ltd has submitted a patent application for Rapid Power Ready Signaling in a Memory Array. This invention was developed by Sisodia Rajiv Kumar, Singh Disha, Chen Andy Wangkun and Haleshnaik Santhoshnaik.
The patent application number is US202418680911 20240531. The patent publication number is US2025372..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Micron Technology has submitted a patent application for Apparatuses and Methods for Row Decoder with Multiple Section Enable Signal Voltage Domains. This invention was developed by Shin Sang Hoon and Park Sang-kyun.
The patent application number is US202519299035 20250813. The patent publication number is..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Micron Technology has applied United States patent for Clock Signal Generator Generating Four-phase Clock Signals. Shimizu Hiroshi and Kojima Mieko developed it.
The patent application number is US202519210535 20250516. The patent publication number is US2025372150 (A1). International Patent Classification..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Micron Technology has applied United States patent for Apparatuses and Methods for Increasing Timing Margins for Decision Feedback Equalization. Huber Brian W and Mitsubori Shingo developed it.
The patent application number is US202519207630 20250514. The patent publication number is US2025372149 (A1). Int..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Micron Technology has submitted a patent application for Sense Amplifier Retention Improvement. This invention was developed by Vimercati Daniele.
The patent application number is US202519207142 20250513. The patent publication number is US2025372146 (A1). International Patent Classification codes are G11C..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Micron Technology patent application for Probabilistic Data Integrity Scans Using Risk Factor Estimation. This invention was developed by Mason Robert Winston, Gangavarapu Phani Raghavendra Yasasvi, Shukla Pitamber and Su Qun.
The patent application number is U..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has published Sandisk Technology patent application for Apparatus and Methods for Decoder Module Architectures for Non-volatile Memory. The invention was developed by Irizarry Nicolas, Petti Christopher J, Patel Jaydip and Islam Ashraf B.
The patent application number is US..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Memory Device and Method of Operating the Same. This invention was developed by Hong Hyunsung.
The patent application number is US202418676826 20240529. The patent publication number is US2025372135 (A1). International Patent..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- SK Hynix has submitted a patent application for Semiconductor Device. This invention was developed by Cho Kyung Jun, Park Jae Hyung, Lee Jae Seung, Oh Su Hyun and Lee Jin Hyung.
The patent application number is US202418922931 20241022. The patent publication number is US2025372134 (A1). International Paten..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has received Micron Technology patent application for Memory Devices. Fukuzumi Yoshiaki, Tanaka Shuji, Kamata Yoshihiko, Fujiki Jun and Tanaka Tomoharu developed the invention.
The patent application number is US202519308112 20250822. The patent publication number is US2025..
Semiconductor
| Tue 09 Dec 2025
Beijing, Dec. 9 -- State Intellectual Property Office of China has released Anxinmei Technology, Hubei patent application for Flip Chip Packaging Structure and Packaging Method. This invention was developed by Lu Jinfa.
The patent application number is CN20251037947 20250109. The patent publication number is CN119963509 (A). In..
Semiconductor
| Tue 09 Dec 2025
Beijing, Dec. 9 -- Beijing Xuanjie Technology has filed a patent application for Image Processing Method and Device, Electronic Equipment, Storage Medium and Chip. This invention was developed by Liu Peikun and Zhao Chun.
The patent application number is CN202510128872 20250127. The patent publication number is CN119963468 (A)...
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Micron Technology patent application for Apparatus with Multi-interface Test Mechanism and Methods for Operating the Same. This invention was developed by Nwengela Bokuba, Chang Raymond, Sreeramaneni Raghukiran and Gajera Nevil N.
The patent application number ..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has published Micron Technology patent application for Methods of Forming Microelectronic Devices, and Related Microelectronic Devices. The invention was developed by Simsek-ege Fatma Arzum.
The patent application number is US202519195481 20250430. The patent publication nu..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Micron Technology has submitted a patent application for Threshold Voltage Compensation for a Memory System Sense Amplifier. This invention was developed by Bedeschi Ferdinando, Di Vincenzo Umberto and Muzzetto Riccardo.
The patent application number is US202519190460 20250425. The patent publication numbe..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Realtek Semiconductor Corporation has filed a patent application for Karaoke Device and Voice Scoring System Thereof. This invention was developed by Chu Yen-hsun and Kao Yu-che.
The patent application number is US202519213380 20250520. The patent publication number is US2025372065 (A1). International Pate..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Semiconductor Energy Laboratory has submitted a patent application for Liquid Crystal Display Device and Electronic Device Including the Same. This invention was developed by Umezaki Atsushi.
The patent application number is US202418639746 20240418. The patent publication number is US2025372058 (A1). Inter..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- TCL China Star Optoelectronics Technology has submitted a patent application for Source Driving Chip and Display Module. This invention was developed by Chen Weifeng and Lan Qingsheng.
The patent application number is US202418964414 20241130. The patent publication number is US2025372021 (A1). Internationa..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Die Ejector Having Independently Engaged Ejector Rods, Method of Performing Die Pick-up with the Die Ejector, and Die Ejector System Including the Die Ejector. Chiu Chih-yuan, Peng Chi-chun, Du Yu-hong, Hsiao Wei-ting and Eitan Amram ..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Disco has applied United States patent for Method for Processing Substrate. Onodera Hiroshi developed it.
The patent application number is US202519202377 20250508. The patent publication number is US2025367861 (A1). International Patent Classification codes are B24B7/20 and B29C41/12. Cooperative Patent Cl..
Semiconductor
| Mon 08 Dec 2025
Beijing, Dec. 9 -- Realtek Semiconductor Corporation has filed a patent application for Method and Device for Measuring Linearity of Circuit to be Measured. This invention was developed by Wang Zhijie and Lin Yuzhang.
The patent application number is CN202311472644 20231107. The patent publication number is CN119966531 (A). Int..
Semiconductor
| Mon 08 Dec 2025
Beijing, Dec. 9 -- Institute of Semiconductors, Chinese Academy of Sciences has submitted a patent application for Tunable Frequency Source Chip. Wang Hanyu, Zhao Zeping, Feng Haolei and Liu Jianguo developed the invention.
The patent application number is CN202510163598 20250214. The patent publication number is CN119966529 (A..
Semiconductor
| Sun 07 Dec 2025
Geneva, Dec. 8 -- International Business Machines Corporation, IBM China Company Ltd and IBM Israel Science & Tech Ltd have sought patent for Multichip Semiconductor Build with Flexible Power and Signal Distribution Interconnections. This invention was developed by Medikonda Manasa, Li Tao, Xie Ruilong and Rubin Joshua.
The p..
Semiconductor
| Mon 08 Dec 2025
Geneva, Dec. 8 -- BOE Tech Group Co Ltd, Chengdu BOE Optoelectronics Tech Co Ltd and Beijing BOE Technology Development have sought patent for Display Substrate and Display Apparatus. This invention was developed by Sun Huaping, Zhang Kai, Wei Xinyu, Song Erlong and Zhang Fan.
The patent application number is WO2024CN121870 2..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Company patent application for System Including an Active Interposer and Method for Manufacturing the Same. This invention was developed by Huang Tze-chiang, Lee Yun-han, Tam King-ho, Zhong Yong, Liu Yu-hao and Chen Yen-ming.
..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Micron Technology patent application for Semiconductor Devices with Redistribution Structures Configured for Switchable Routing. This invention was developed by Jensen Travis M and Hembree David R.
The patent application number is US202519301843 20250815. The p..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Taiwan Semiconductor Manufacturing has applied United States patent for Integrated Circuit Packages and Methods. Tsai Sheng-han, Chen Tsung-yu, Hung Wensen and Chen Yen-pu developed it.
The patent application number is US202418733053 20240604. The patent publication number is US2025372572 (A1). Internation..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has published Samsung Electronics patent application for Semiconductor Package and Method of Manufacturing Semiconductor Package. The invention was developed by Chung Hyunsoo and Kim Kwangsoo.
The patent application number is US202519028805 20250117. The patent publication ..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has published Samsung Electronics patent application for Semiconductor Packages and Method for Fabricating the Same. The invention was developed by Kim Youngbae.
The patent application number is US202418980655 20241213. The patent publication number is US2025372566 (A1). ..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Sumitomo Electric Industries has submitted a patent application for Semiconductor Device and Method of Manufacturing Semiconductor Device. This invention was developed by Moriyama Yutaka and Hashinaga Tatsuya.
The patent application number is US202519217078 20250523. The patent publication number is US2025..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Semiconductor Die, Semiconductor Package and Method for Manufacturing Semiconductor Die. This invention was developed by Chen Wei-ting, Tang Tzu-chun, Tsai Chung-hao and Yu Chen-hua.
The patent application number is US2024187..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing patent application for Semiconductor Structure and Method of Manufacture. Hsu Hsi-cheng, Weng Jui-chun, Lee Chih-chung, Chiang Ji-hong and Lee Kuo-hao developed the invention.
The patent application number is US202418732957 20..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has published Texas Instruments Incorporated patent application for Inductor Module with Packaged Semiconductor Die. The invention was developed by Montoya Jonathan Andrew, Stepniak Frank, Manack Christopher Daniel, Kulkarni Makarand Ramkrishna and Stark Leslie Edward.
The ..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing patent application for Heterogeneous Integration Structures to Solve Ivr Overshoot Problem. This invention was developed by Chen Yen-ming, Wang Chuei-tang, Shang Shu An and Hsiao Yu-ming.
The patent application number is US202..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Heterogeneous Integration Structure to Solve Ivr Overshoot Problem. Chen Yen-ming, Wang Chuei-tang, Shang Shu An and Hsiao Yu-ming developed the invention.
The patent application number is US202418890176 20240919. The patent publicat..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Semiconductor Structure, and Method for Fabricating a Stacked Die. Hsieh Feng-chien, Hu Wei-li and Tu Chien Nan developed the invention.
The patent application number is US202418680621 20240531. The patent publication number ..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Semiconductor Device Package and Methods of Formation. Yang Tien-chung, Huang Li-hsien, Wu Ming-feng, Liu Yung-sheng, Chen Chun-jen and He Jun developed the invention.
The patent application number is US202519293082 20250807...
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has received STMicroelectronics International NV patent application for Method of Manufacturing Semiconductor Devices and Corresponding Semiconductor Device. Rovitto Marco and Zalaffi Samuele developed the invention.
The patent application number is US202519215057 20250521...
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing patent application for Back-side Warpage Control Layer to Improve Bonding Bulge / Non-bonding. The invention was developed by Chen Chen-shien, Lin Chi-yen, Hsu Feng-chang, Chen Hsu-hsien and Weng Wu-an.
The patent application..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- GlobalFoundries Singapore has filed a patent application for Protective Moisture Barrier and Crack Stop Structure for IC Chip Using Air Gap in Liner in Deep Trench. This invention was developed by Li Xiaodong, Yi Wanbing and Qiu Weichu.
The patent application number is US202418731564 20240603. The patent p..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Company patent application for Semiconductor Package and Method of Manufacturing Semiconductor Package. Chang Hung-min, Lin Chien-chang, Hung Wensen, Kuo Hsuan-cheng, Wang Shih-hui and Sheu Tzu-shiun developed the invention.
T..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has published STMicroelectronics International NV patent application for Destressing Structure for Semiconductor Packages and Method of Manufacturing the Same. The invention was developed by Paul Indrajit and Yoo Inpil.
The patent application number is US202418679248 202405..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Mark Structure for Nanostructure Device and Methods of Forming the Same. This invention was developed by Liu Chia-chu and Lin Li-kai.
The patent application number is US202418796839 20240807. The patent publication number is US202537..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Applied Materials patent application for Interposer Devices with Mutliple Interposer Cores. This invention was developed by Kengeri Subramani, Suri Tameesh, Patel Meghna Maheshkumar and Patel Khyat Kamal.
The patent application number is US202519219146 20250527..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- SK Hynix Nand Product Solutions has submitted a patent application for Integrated Circuit Structure with Filled Recesses. Lin Kevin L, Kabir Nafees A, Blackwell James Munro and Hourani Rami developed the invention.
The patent application number is US202519300576 20250814. The patent publication number is U..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- SanDisk Technologies has filed a patent application for Three-dimensional Memory Device Containing Top Source Contact to Doped Semiconductor Source Tips and Methods for Forming the Same. This invention was developed by Kitazawa Keigo and Ohaga Motoo.
The patent application number is US202418789145 20240730..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- SanDisk Technologies has submitted a patent application for Three-dimensional Memory Device Containing Top Source Contact to Doped Semiconductor Source Tips and Methods for Forming the Same. This invention was developed by Noguchi Masato.
The patent application number is US202418789041 20240730. The patent..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Interconnect Structure Including Topological Material. This invention was developed by Lu Meng-pei, Yang Shin-yi, Chen Cian-yu, Chiang Yun-chi and Lee Ming-han.
The patent application number is US202519297761 20250812. The pa..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released International Business Machines patent application for Multichip Semiconductor Build with Flexible Power and Signal Distribution Interconnections. This invention was developed by Medikonda Manasa, Li Tao, Xie Ruilong and Rubin Joshua M.
The patent application n..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Samsung Electronics has applied United States patent for Semiconductor Chip for Bonding Semiconductor Device, and Bonding Semiconductor Device and Electronic System Including the Same. Hyun Seung, Kim Sungchul, Kim Cheolgyu, Park Jung-hwan, Jung Kwangyoung and Choi Yoojin developed it.
The patent applicati..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- SK Hynix has submitted a patent application for Semiconductor Device and Method for Fabricating the Same. This invention was developed by Kim Gil Seop and Jin Hyun Woo.
The patent application number is US202418963767 20241129. The patent publication number is US2025372516 (A1). International Patent Classif..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Texas Instruments Incorporated has submitted a patent application for Isolation Circuitry on Semiconductor Die. This invention was developed by Calabrese Giacomo, Bertoni Nicola, Lueders Michael and Herzer Stefan.
The patent application number is US202418676314 20240528. The patent publication number is US..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Samsung Electronics patent application for Semiconductor Package and Method of Manufacturing the Semiconductor Package. This invention was developed by Kim Geunwoo, Shin Jiwon, Kwon Donguk, Myung Wooram and Woo Kwangbok.
The patent application number is US20251..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Taiwan Semiconductor Manufacturing has applied United States patent for Semiconductor Packages and the Manufacturing Processes Thereof. Chiu Chao-wei, Kuo Hsuan-ting, Wu Po-ching, Lin Hsiu-jen and Su An-jhih developed it.
The patent application number is US202519261184 20250707. The patent publication numb..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Mitsubishi Electric has applied United States patent for Semiconductor Device and Method for Manufacturing Semiconductor Device. Tanaka Koji developed it.
The patent application number is US202218873591 20221122. The patent publication number is US2025372496 (A1). International Patent Classification code i..
Semiconductor
| Mon 08 Dec 2025
Beijing, Dec. 9 -- State Intellectual Property Office of China has published Rongyao Terminal patent application for Antenna Switching Capability Adjusting Method and Device, Storage Medium and Chip System. The invention was developed by Shi Juan and Wang Yun.
The patent application number is CN202311435140 20231030. The patent..
Semiconductor
| Mon 08 Dec 2025
Beijing, Dec. 9 -- Beijing Smartchip Microelectronics Technology has submitted a patent application for Lin Bus Receiver Circuit, Chip and Electronic Equipment. Pan Jie, Yuan Yidong, Hu Yi, Shen Hongwei and Song Yiwei developed the invention.
The patent application number is CN20251030278 20250108. The patent publication number..
Semiconductor
| Mon 08 Dec 2025
Beijing, Dec. 9 -- Beijing Institute of Radio Metrology and Measurement has submitted a patent application for Optocoupler Isolation Interface Circuit, Integrated Circuit and Electronic Equipment. This invention was developed by Zhang Qi, Cui Yidan, Fan Yaning, Lu Ying, Gao Xing, Liu Changjian, Xie Shuxiang, Dong Siyuan, Gu Yush..
Semiconductor
| Mon 08 Dec 2025
Beijing, Dec. 9 -- State Intellectual Property Office of China has received STMicroelectronics International patent application for Electronic Chip Connected to External Voltage. Cimaz Lionel developed the invention.
The patent application number is CN202411602493 20241111. The patent publication number is CN119966390 (A). Inte..
Semiconductor
| Mon 08 Dec 2025
Geneva, Dec. 8 -- World Intellectual Property Organization has received Innovision Tech Suzhou Co Ltd patent application for Photoelectric Device Based on Alignment Bonding, and Preparation Method Therefor. Zhu Youliang, Lin Xiao, Pan Anlian and Wang Yazhou developed the invention.
The patent application number is WO2025CN849..
Semiconductor
| Tue 09 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has published Cypress Semiconductor Corporation patent application for Systems, Methods, and Devices for Interference Cancellation in Wireless Device Radar Operation. The invention was developed by Shaw Amit and Uln Kiran.
The patent application number is US202418733359 202..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Feed-through Via Device, Layout, and Method. Huang Sheng-feng, Huang Ching-yu, Huang Yuan Yu, Lin Wei-cheng and Tzeng Jiann-tyng developed the invention.
The patent application number is US202418912207 20241010. The patent pu..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Yangtze Memory Technologies has submitted a patent application for Semiconductor Structures and Fabrication Methods Thereof, Semiconductor Devices and Fabrication Methods Thereof. This invention was developed by Xiao Wenjing, Mei Libo, Wang Huan, Xiao Liang, Pan Zhen and Liu Yaqin.
The patent application n..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has received Texas Instruments Incorporated patent application for Microelectronic Device Package with Hybrid Isolation Laminate. Poddar Anindya, Lo Chun Ping and Arora Vivek developed the invention.
The patent application number is US202418679587 20240531. The patent publi..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Semiconductor Components Industries has applied United States patent for Compact Semiconductor Packaging Using a Leadless Discrete Component. Park Jeonghyuk, Han Gyuwan and Lee Keunhyuk developed it.
The patent application number is US202418731625 20240603. The patent publication number is US2025372494 (A1..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Texas Instruments Incorporated has applied United States patent for System and Method for Devices with Dummy Metal Traces. Armstrong Frank developed it.
The patent application number is US202418640540 20240419. The patent publication number is US2025372492 (A1). International Patent Classification codes ar..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Semiconductor Package and Method of Forming the Same. Chen Wei-yu, Wong Cheng-shiuan, Chiu Chao-wei, Chen Hsin Liang, Kuo Hsuan-ting, Pei Hao-jan, Lin Hsiu-jen, Cheng Chia-shen, Chen Cheng-ting, Shih Hao-jan and Tsao Chih-chia..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Amkor Technology Singapore Holding patent application for Semiconductor Devices and Methods of Manufacturing Semiconductor Devices. This invention was developed by St Amand Roger D and Nicholls Louis W.
The patent application number is US202519301958 20250816. ..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- STMicroelectronics International NV has submitted a patent application for Method of Manufacturing Semiconductor Devices and Corresponding Semiconductor Device. Crema Paolo developed the invention.
The patent application number is US202519214519 20250521. The patent publication number is US2025372488 (A1)...
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Texas Instruments Incorporated has applied United States patent for Interconnect Array. Yabuuchi Nicole, Quijano Lorraine Duldulao and Danganan Vincy Ann developed it.
The patent application number is US202418680299 20240531. The patent publication number is US2025372487 (A1). International Patent Classifi..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Intel has submitted a patent application for Through Semiconductor Via as a Well Tap Structure. Park Changyok developed the invention.
The patent application number is US202418678793 20240530. The patent publication number is US2025372482 (A1). International Patent Classification code is H01L23/48. Coopera..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Company patent application for Heat Dissipation for Hot Spots. Tsai Sheng-han, Chen Tsung-yu, Hung Wensen and Chen Yen-pu developed the invention.
The patent application number is US202519280631 20250725. The patent publicatio..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Shinko Electric Industries patent application for Semiconductor Device and Method of Manufacturing the Semiconductor Device. This invention was developed by Nishihara Yoichi.
The patent application number is US202519215532 20250522. The patent publication numbe..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Company patent application for Heat-dissipating Lid Module. This invention was developed by Wang Chien-chang, Wang Kuan-min, Wu Bang Li, Chang Kuo-chin, Yan Kathy Wei and He Jun.
The patent application number is US202418679798..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Altera has submitted a patent application for Modular Heatsink for Integrated Circuit Package. This invention was developed by Konakalla Srinivasarao and Varadarajan Krishnakumar.
The patent application number is US202418677669 20240529. The patent publication number is US2025372474 (A1). International Pat..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Company patent application for Package and Manufacturing Method Thereof. This invention was developed by Chen Chih-hao, Cheng Li-hui and Shih Ying-ching.
The patent application number is US202418679251 20240530. The patent pub..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Texas Instruments Incorporated has applied United States patent for Topside Cooling Band for Multiple Electronic Components. Molina John Carlo, Magallanes Rommel Rigo A and Yabuuchi Nicole developed it.
The patent application number is US202418676814 20240529. The patent publication number is US2025372472 ..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Samsung Electronics has applied United States patent for Semiconductor Packages. Chang Gunho developed it.
The patent application number is US202519023833 20250116. The patent publication number is US2025372471 (A1). International Patent Classification codes are H01L23/31 and H01L25/07. Cooperative Paten..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has published International Business Machines patent application for Testing Structure for Semiconductor Devices. The invention was developed by Johnson Mark Christopher, Knickerbocker John, Ahsan Ishtiaq and Nieves Pablo.
The patent application number is US202418731542 202..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- SCREEN Holdings has applied United States patent for Substrate Processing Method, Substrate Processing Apparatus, Computer Program, and Storage Medium. Matsui Hiroakira, Sugioka Shinji and Nakano Harumasa developed it.
The patent application number is US202519214451 20250521. The patent publication number ..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Disco has submitted a patent application for Treatment Method for Sheet, Manufacturing Method for Chip, and Manufacturing Method for Substrate. Saito Yoshinobu developed the invention.
The patent application number is US202519191175 20250428. The patent publication number is US2025372453 (A1). Internationa..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Samsung Electronics patent application for Planarization Method for Back-end-of-line Region of Integrated Circuit Device. This invention was developed by Oh Joongsuk, Choi Jaemyung, Kim Johnsoo, Kim Byounghoon and Seo Kang-ill.
The patent application number is ..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Applied Materials patent application for Methods for Forming Low Resistivity Contacts. This invention was developed by Zhang Le, Lu Yiyang, Wan Yiyang, Hsu Chih-hsun, Ye Weifeng, Zhang Shumao, Zhang Wei, Zhu Qihao, Wu Liqi and Lu Jiang.
The patent application n..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing patent application for Semiconductor Devices and Methods of Manufacture. This invention was developed by Hsu Yu-ju, Liao Ssu-yu, Su Tsu-hui and Fan Chun-hsiang.
The patent application number is US202418826480 20240906. The pat..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing patent application for Shallow-trench Isolation Protection Structure for Nanostructure Field-effect Transistor Device and Methods of Forming. Kao Wan-yi, Wang Chunyao and Lee Tze-liang developed the invention.
The patent appli..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- Mitsubishi Electric has submitted a patent application for Semiconductor Manufacturing Apparatus and Method for Manufacturing Semiconductor Apparatus. This invention was developed by Nakamura Takuyo and Yamamoto Shigehisa.
The patent application number is US202519011356 20250106. The patent publication num..
Semiconductor
| Mon 08 Dec 2025
Alexandria, Dec. 9 -- U.S. Patent and Trademark Office has published SCREEN Holdings patent application for Centering Device and Substrate Processing Apparatus. The invention was developed by Kajino Itsuki, Ueno Hiroyuki, Shoji Kazuhiro and Shinohara Ryotaro.
The patent application number is US202519214261 20250521. The patent ..
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