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Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Toshiba Electronic Devices & Storage Corp and Toshiba have been granted a patent for Semiconductor Device. This invention was developed by Nakamura Kazutoshi, Minamikawa Kazuki and Yoshikawa Daiki.
The patent application number is US202318243646 20230907. The patent publication number is US12684860 (B2)..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Semiconductor Mfg Int Shanghai Corp and Semiconductor Mfg Int Beijing Corp have been granted a patent for Semiconductor Structure and Fabrication Method Thereof. Wang Nan developed the invention.
The patent application number is US202217953864 20220927. The patent publication number is US12684855 (B2). ..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Toshiba Electronic Devices & Storage Corp and Toshiba have been awarded a patent for Semiconductor Device. This invention was developed by Kawamura Keiko, Iwakaji Yoko, Gejo Ryohei and Fuse Kaori.
The patent application number is US202318159322 20230125. The patent publication number is US12684837 (B2)...
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Hefei Kaimeng Tech Co Ltd has applied Chinese patent for Memory Management Method and Storage Device. Peng Chong developed it.
The patent application number is CN20261097220 20260123. The patent publication number is CN121996164 (A). International Patent Classification codes are G06F12/02 and G06F3/06.
..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- State Intellectual Property Office of China has released Muxi Integrated Circuit Nanjing Co Ltd patent application for Data Transmission Method and Device, Computer Equipment and Readable Storage Medium. This invention was developed by Wang Shuang and Hu Chengxiang.
The patent application number is CN20241..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- University Shenzhen Polytechnic has applied Chinese patent for Method for Improving Capacity and Performance of Modular Mobile Solid-state Memory. Huang Fangting developed it.
The patent application number is CN202411577820 20241107. The patent publication number is CN121996147 (A). International Patent Cl..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 31 -- Shanghai Doctor Tech Co Ltd has sought patent for MEMS Probe Performance Test Method and System. This invention was developed by Zhang Jiyang, Jiang Wende and Lou Zhaoyi.
The patent application number is CN20261071885 20260120. The patent publication number is CN121995293 (A). International Patent Classifi..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Nexperia Bv and Nexperia Technology (Shanghai) have obtained a patent for semiconductor device and manufacturing method thereof. This invention was developed by Shi Jinshan, Jiang Ke, Fang Yuan, Zhang Xukun, Zhu Chunlin, Xiang Junli and Zuo Huiling.
The patent application number is US202318340583 202306..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Silicon Magic Semiconductor Tech Hangzhou Co Ltd and Hangzhou Silicon Magic Semiconductor Technology have been awarded a patent for Split-gate MOSFET and Manufacturing Method Thereof. This invention was developed by Dong Shida, Cai Jinyong and Wang Jiakun.
The patent application number is US202218089726..
Semiconductor
| Fri 31 Jul 2026
Seoul, July 31 -- Kim Ha Gi has applied Korean patent for Sige Deposition a Method of Recovering Germanium Oxide from Semiconductor Sige Deposition Process Waste Gas.
The patent application number is KR20230092971 20230718. The patent publication number is KR20250012870 (A). International Patent Classification codes are B01D53..
Semiconductor
| Fri 31 Jul 2026
Seoul, July 31 -- Min Chi Hoon has filed a patent application for a Roll-to-roll Type Low Temperature PECVD. This invention was developed by Min Chi Hoon and Choi Hyun Min.
The patent application number is KR20230092914 20230718. The patent publication number is KR20250012851 (A). International Patent Classification codes are..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Shanghai Yuezhi Semiconductor Tech Co Ltd has sought patent for High-safety Full-automatic Filling Method and System Applied to Fluorine-nitrogen Mixed Gas Filling. This invention was developed by Yang Huanyao, Ren Ru, Pan Huajie and Sun Aoyun.
The patent application number is CN202610431643 20260402. The ..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Jiangsu Yima Machinery Co Ltd has applied Chinese patent for Wafer Type Check Valve. Li Fuhu and Xu Peng developed it.
The patent application number is CN202610275355 20260309. The patent publication number is CN121993634 (A). International Patent Classification codes are F16K1/46, F16K15/03 and F16K37/00...
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Shanghai Huixintuo Semiconductor Tech Co Ltd has sought patent for Valve Plate Structure of Transmission Valve. This invention was developed by Zhou Qizheng.
The patent application number is CN202610303385 20260313. The patent publication number is CN121993623 (A). International Patent Classification codes..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- State Intellectual Property Office of China has published Shenzhen Spark Semiconductor Tech Co Ltd patent application for Firmware Updating Method and Firmware Updating Device. The invention was developed by Ma Yunyang, Chen Yunsong, Chen Jianyou, Cheng Mengshuang, Zhang Jinting and Chen Jinlin.
The patent..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- State Intellectual Property Office of China has published Fortior Tech Shenzhen Co Ltd patent application for Singlechip Stack Use Limit Evaluation Method and Device Based on Real-time Interrupt Sampling, Storage Medium and Embedded System. The invention was developed by Li Da, Luo Xue, Bi Lei, Bi Chao and He..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 31 -- State Intellectual Property Office of China has published Zhejiang Xindao Semiconductor Tech Co Ltd patent application for Developing Device and Developing Method. The invention was developed by Miao Junyan.
The patent application number is CN202610343452 20260319. The patent publication number is CN121995..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 31 -- Anhui Jingwei Tech Co Ltd has filed a patent application for Method for Improving Line Edge Roughness of Side Wall of Line of Photoresist. This invention was developed by Wang Yue, Li Haitao, Zhou Hongyu and Sun Shanshan.
The patent application number is CN202610229151 20260226. The patent publication numb..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 31 -- Chengdu Xinziguang Semiconductor Tech Co Ltd has submitted a patent application for Photoetching Method and Photoetching Structure. This invention was developed by Wu Xinde, Du Junhong, Huang Jianwei, Xia Deyang and Wei Yunong.
The patent application number is CN202411562130 20241104. The patent publicatio..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 31 -- State Intellectual Property Office of China has released Robert Bosch Co Limited patent application for Method and Apparatus for Lane Fusion, Controller and Computer Program Product. This invention was developed by Li Xinrun and Wang Leichen.
The patent application number is CN202411554113 20241101. The pa..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 31 -- Ningbo All Semi Micro Electronics Equipment Co Ltd has filed a patent application for Temperature Control System and Method for Process Liquid and Wet Processing Equipment. This invention was developed by Ma Jie, Liang Bingbing, Yu Chen and Zhou Jiahua.
The patent application number is CN20251214255 202512..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Shanghai Shuoji Semiconductor Tech Co Ltd has filed a patent application for Band-gap Reference Circuit. This invention was developed by Fan Dawei, Wang Jing, Yu Liming and Zhou Yao.
The patent application number is CN202610393560 20260327. The patent publication number is CN121996018 (A). International Pa..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Zhejiang Xiandao Thermal Power Technology has applied Chinese patent for Handheld Semiconductor Refrigeration Fan. Wang Leiqing developed it.
The patent application number is CN202511625704 20251107. The patent publication number is CN121993857 (A). International Patent Classification codes are F24F13/14, F2..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Zhejiang See Global Electronic Tech Co Ltd has submitted a patent application for Universal Connecting Mechanism Capable of Achieving Curved Surface Self-adaptive Splicing and LED Box. This invention was developed by Zhang Jiewei and Li Chaofeng.
The patent application number is CN202610106165 20260127. Th..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- The First Co Of China Eighth Engineering Bureau Ltd has submitted a patent application for Curtain Wall Stone Pendant Connecting Structure and Construction Technology Thereof. This invention was developed by Zhang Xu, Jiao Shouxin, Hou Xiangshuai, Liu Ruipu, Ding Yanxi and Zhang Chuansen.
The patent applic..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Zhongke Aier Beijing Tech Co Ltd has submitted a patent application for Ultrahigh-pressure Semiconductor Pneumatic Diaphragm Valve. Zhang Jian, Liu Yi, Duan Xuwei, Zhang Jun, Gao Xiang, Wei Qing, Fang Zheng, Geng Dezhan, Yan Peisheng and Yang Yi developed the invention.
The patent application number is CN2..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Xichang College has sought patent for 20k Liquid Phase Chip for Simultaneously and Accurately Identifying Various Goose Varieties and Application of 20k Liquid Phase Chip. This invention was developed by Yan Guangwen, Wang Jing, Li Jun, Zhao Jingang, Li Dongdong, Huang Zengwen, Chen Yiqun, Wang Silu, Yang Cha..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Dongwoo Fine-Chem has sought patent for Semiconductor Element Cleaning Solution and Manufacturing Method Thereof. This invention was developed by Cao Jinghua, Im Seung-hyuk, Baek Sung-ho, Han Sung-pil and Cho Baek Hyun.
The patent application number is CN202511591570 20251103. The patent publication number..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Jiangyin Junchi New Material Science & Tech Co Ltd has submitted a patent application for Adhesive Film for Chip Carrier Plate and Preparation Method of Stacked Film. This invention was developed by Dong Qian, Wang Yujie and Du Donghai.
The patent application number is CN202511977676 20251225. The patent p..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Kunshan Sumei New Material Tech Co Ltd has submitted a patent application for Low-modulus High-thermal-conductivity Acrylate-based Chip Mounting Adhesive and Preparation Method Thereof. This invention was developed by Zhang Hongxia, Huang Junda and Xu Cun.
The patent application number is CN202610229876 20..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Omnisun Information Mat Co Ltd has applied Chinese patent for Silicon Dioxide Polishing Solution for Polishing Quartz Glass and Preparation Method of Silicon Dioxide Polishing Solution. Chen Wei, Tang Long, Zhang Cheng, Xu Gen and Li Xin developed it.
The patent application number is CN202511845936 2025120..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- State Intellectual Property Office of China has published Huaiyin Institute of Technology patent application for Coating Based on Nano Material, Preparation Method Thereof and Semiconductor Application. The invention was developed by Liu Yang, Cao Zican, Fan Yuanyuan, Ji Yijun and Fan Baolu.
The patent appli..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Weihai Lanhai Rongzhi New Mat Co Ltd has filed a patent application for Hyperbranched Polymer Grafted Silicon Carbide Composite Filler as Well as Preparation Method and Application Thereof. This invention was developed by Wu Xintao and Bi Xiumei.
The patent application number is CN202610372858 20260325. Th..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Hamamatsu Photonics has submitted a patent application for Manufacturing Method of Semiconductor Device. This invention was developed by Senga Takashi and Okumura Ryuji.
The patent application number is CN202511616257 20251106. The patent publication number is CN121992494 (A). International Patent Classifica..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- State Intellectual Property Office of China has received Jiaxing Nanhu University and Zhongke Chaoxin Zhejiang New Material Tech Co Ltd patent application for Pvt Growth System and Process for Preparing 8-inch Low-defect Silicon Carbide Single Crystal. Xie Chunsong developed the invention.
The patent appli..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Zhuji Jingqing New Material Tech Co Ltd has submitted a patent application for Base Transmission Device for Liquid Phase Epitaxy Horizontal Silicon Carbide Epitaxial Furnace. Lan Tu developed the invention.
The patent application number is CN20251223135 20251230. The patent publication number is CN12199248..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- State Intellectual Property Office of China has published Yuangang Aodawan Area Guangdong Quantum Science Center patent application for Liquid Phase Method Silicon Carbide Single Crystal Growth System and Growth Method. The invention was developed by Tang Shuxian, Dong Lei, Ke Shanming, Li Chen, Lu Yuanhao an..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- State Intellectual Property Office of China has published Ningbo Institute Materials Technology & Eng Cas patent application for Diamond Film Growth Heat Dissipation Substrate for High-power Microwave Plasma Equipment and Application of Diamond Film Growth Heat Dissipation Substrate. The invention was develop..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Hubei Honghua High Temperature Mat Co Ltd has applied Chinese patent for High-purity Silicon Chemical Vapor Deposition System and Method Based on Composite Ceramic Lining. Wu Han, Du Jiakun, Wei Jianguo, Zhu Daoquan, Wang Shengming, Fang Dunping and Wu Jianhua developed it.
The patent application number is..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Sucai Metal Jiangsu Co Ltd has sought patent for Vacuum Coating Process for Metal Substrate and Anti-aging Anti-corrosion Film. This invention was developed by Gao Wenbin and Yang Xu.
The patent application number is CN20251257861 20251231. The patent publication number is CN121992357 (A). International Pa..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Changsha Huayi Semiconductor Co Ltd has submitted a patent application for Method and Apparatus for PVD Deposition on Square Substrate. This invention was developed by Fan Hao and Yang Meigao.
The patent application number is CN20251237376 20251231. The patent publication number is CN121992356 (A). Interna..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Shengxian New Material Tech Suzhou Co Ltd has submitted a patent application for Preparation Method of Mask Plate for Evaporation of High-resolution OLED (organic Light Emitting Diode). This invention was developed by Jiang Chengzhong, Wang Chenxu and Zhou Haoyu.
The patent application number is CN20251193..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- State Intellectual Property Office of China has received Hangzhou Yunhui Hardware Electroplating patent application for Intelligent Control Method and System for Electroplating Soft Treatment. Luo Hao developed the invention.
The patent application number is CN202610467533 20260410. The patent publication nu..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Sanlei Ningbo New Materials Technology has submitted a patent application for Ionic Liquid Aluminizing Electroplating Equipment Under Inert Atmosphere. Wu Daoguang, Liu Wenwu and Bu Songsong developed the invention.
The patent application number is CN202610137493 20260130. The patent publication number is CN..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Shenzhen Xinfuhua Surface Tech Co Ltd has submitted a patent application for Cyanide-free and Lead-free Cupronickel Tin Electroplating Process. Qiu Yonghua developed the invention.
The patent application number is CN202610112837 20260127. The patent publication number is CN121992463 (A). International Pate..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Chengdu Qingshi Laser Tech Co Ltd has sought patent for Graphite Rod Ceramic Coating for Epitaxial Support of Semiconductor Wafer and Laser Cladding Preparation Method of Graphite Rod Ceramic Coating. This invention was developed by Cai Guoshuang, Li Zuoyu, Sun Ze, Du Zhihua, Qi Huan and Yang Yi.
The paten..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- State Intellectual Property Office of China has published Zhangjiagang Yangzijiang Cold Rolled Sheet Co Ltd, Jiangsu Shagang Institute of Research of Iron and Steel, Jiangsu Shagang Iron and Steel and Jiangsu Shagang Group patent application for High-rolling-ability Production Method of Series High-grade Non-..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Jiangxi Normal University has submitted a patent application for Bi2WO6/ZnIn2S4/Ag Ternary Hierarchical Heterojunction as Well as Preparation Method and Application Thereof. This invention was developed by Duan Qixi, Sun Hai, Zhu Zhenyu, Liang Yan, Yang Yong and Fang Zhaolong.
The patent application number..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- State Intellectual Property Office of China has published Xi'an Lanqiao New Energy Tech Co Ltd patent application for Method for Preparing Monodisperse Silicon Dioxide Microspheres with Controllable Particle Size Based on Seed Growth Method. The invention was developed by Feng Pingping, Wang Xiujuan, Ma Sheng..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Ningjin County Qingwei New Energy Tech Co Ltd has sought patent for Preparation Method and Device of Lithium Ion Battery Silicon-based Negative Electrode Precursor Silicon Material. This invention was developed by Kou Cuiqing and Liu Meng.
The patent application number is CN20261088737 20260122. The patent..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Jiangsu Xinlian Semiconductor Co Ltd has applied Chinese patent for Sheet Film Tearing Machine with Wafer Back Appearance Detection Function. Wang Yifan, Wei Binru and He Songlian developed it.
The patent application number is CN202511990247 20251226. The patent publication number is CN121990249 (A). Inter..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Zhejiang Jianmo Tech Co Ltd has sought patent for High-electronegativity Silicon Carbide Flat Sheet Membrane Material and Preparation Method Thereof. This invention was developed by He Jinping, Gao Qi, Qi Yuanfeng, Zhang Yunfei and Shen Hongmei.
The patent application number is CN202610458515 20260409. The..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Yixing Zhongdian Wear Resistant and Fire Resistant Tech Co Ltd has applied Chinese patent for Doped Corrosion-resistant Dioxin-resistant Silicon Carbide Wear-resistant Ceramic Material. Yuan Genfang developed it.
The patent application number is CN202610460807 20260409. The patent publication number is CN1..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- State Intellectual Property Office of China has published Hefei Hongyixin Electronic Tech Co Ltd patent application for High-function Safety Brake Chip of Motorcycle and Power-on Method of High-function Safety Brake Chip. The invention was developed by Zheng Kunkun, Zhang Meng and Zuo Anchao.
The patent ap..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Aptiv Technologies AG has submitted a patent application for Substrate Handling System and Method. J Michael, Lewis Richard, Dean Robert, Bilas Jared, Sudik Joseph and Peterson David R developed the invention.
The patent application number is CN202511580308 20251031. The patent publication number is CN121989..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Jihai Microelectronics has submitted a patent application for Consumable Chip, Chip Assembly and Consumable Box. Su Jing, Liu Weichen, Yang Yali, Liu Yuanbo and Gong Ming developed the invention.
The patent application number is CN202610466066 20260409. The patent publication number is CN121989557 (A). Inter..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Semiconductor Manufacturing International (Shanghai) and Semiconductor Mfg International Beijing Corp have submitted a patent application for Method and Device for Estimating Available Time of Semiconductor Equipment, Storage Medium and Electronic Equipment. Sun Junli, Bai Xue and Zhou Yizhong developed the i..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Ningbo Jiangfeng Xinchuang Technology and Konfoong Material International have submitted a patent application for Air Inlet Tool for Semiconductor Shower Head. This invention was developed by Yao Lijun, Zhang Linqiao and Mao Chengcheng.
The patent application number is CN202610293848 20260311. The patent p..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Yang Xubin and Guangdong University of Technology have filed a patent application for Preparation and Application of Silicon and Acetic Acid Combined Modified Charcoal for Adsorbing Cadmium. This invention was developed by Lin Yiyang, Yang Xubin, Hong Yiting, Lin Aiqi and Yin Guangcai.
The patent applicati..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Hangzhou Weina Hexin Electronic Tech Co Ltd and Wuxi Micro Nano Core Electronic Tech Co Ltd have submitted a patent application for Storage and Calculation Integrated Neural Network Processor with Three-dimensional Integration and Substrate Interconnection. This invention was developed by Wang Zhixuan, Yan Fe..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Hangzhou Weina Hexin Electronic Tech Co Ltd and Wuxi Micro Nano Core Electronic Tech Co Ltd have sought patent for Storage and Calculation Integrated Neural Network Processor with Three-dimensional Integration and Substrate Interconnection. This invention was developed by Wang Zhixuan, Yan Fengyun, Liu Ying a..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- Zhejiang Lante Optics and Zhejiang Lanchuang Photoelectric Tech Co Ltd have submitted a patent application for Secondary Simulation Identification Method and System for Microwave Form on Surface of Glass Wafer. This invention was developed by Wu Ming, Xu Yunming, Feng Xiangxu, Tang Changyong and Shen Jie.
..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Manufacturing Co Limited and Taiwan Semiconductor Manufacturing have obtained a patent for fine pitch chip interconnect structure for bump bridge and high temperature storage improvement and methods for forming the same. This invention was developed by Huang Han-hsiang, Chen Chien-shen..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have been granted a patent for Extended Via Connect for Pixel Array. This invention was developed by Wang Ming-tsong, Kao Min-feng, Lin Kuan-hua, Yaung Dun-nian, Liu Jen-cheng, Lin Hsing-chih, Liu Ko Chun and Lin Meng-hsien.
The patent appl..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have been granted a patent for Dummy Metal-insulator-metal Structures Within Vias. This invention was developed by Hsiao Yuan-yang and Shen Hsiang-ku.
The patent application number is US202217901352 20220901. The patent publication number i..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have secured a patent on Contact Arrangements for Deep Trench Capacitors. Kuo Fu-chiang, Chern Meei-shiou and Hou Jyun-ting developed the invention.
The patent application number is US202318169600 20230215. The patent publication number is ..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have secured a patent on Ruthenium Oxide Film and Ruthenium Liner for Low-resistance Copper Interconnects in a Device. Chin Shu-cheng developed the invention.
The patent application number is US202318352299 20230714. The patent publication ..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have been granted a patent for Aluminum Structures. This invention was developed by Lin Chi-feng, Kuo Chia-pang, Hsi-chen Tsai, Yang Sean, Lin Yue-guo and Su Hung-wen.
The patent application number is US202318179676 20230307. The patent pub..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg, Taiwan Semiconductor Mfg Cmpany Ltd and Taiwan Semiconductor Manufacturing have secured a patent on Local Interconnect. Lin Chung-yi, Wu Cheng-hsien and Wang Yen-sen developed the invention.
The patent application number is US202318447549 20230810. The patent publication number..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg, Taiwan Semiconductor Manufacturing Co and Taiwan Semiconductor Manufacturing have received a patent for Multi-function Etching Sacrificial Layers to Protect Three-dimensional Dummy Fins in Semiconductor Devices. This invention was developed by Kung Ta-hsiang, Chuang Yen, Lin Yuan-..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Korea Advanced Institute of Science and Technology and Korea Advanced Institute of Science & Technology have secured a patent on Method of Manufacturing Soi Wafer. Lee Jungchul developed the invention.
The patent application number is US202318353387 20230717. The patent publication number is US12685096 ..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Western Digital Tech Inc and SanDisk Technologies have obtained a patent for integrated die ejector for die attach ejector devices. This invention was developed by Chen Joyce, Zhang Jim, Liu Bin, Zhou Juan, Qian Zhonghua, Yan Simon, Wang Jianhua and Shi Kaijian.
The patent application number is US202318..
Semiconductor
| Fri 31 Jul 2026
Beijing, July 31 -- China Mobile Group Guangdong Co Limited and China Mobile Communications have submitted a patent application for Model Computing Power Optimization Method and Device, Electronic Equipment, Chip and Medium. Xie Pan and Zhou Shiqi developed the invention.
The patent application number is CN20261009301 2026010..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Manufacturing Co Limited and Taiwan Semiconductor Manufacturing have secured a patent on Phase Change Material Switch with Improved Thermal Dissipation and Methods for Forming the Same. Huang Kuo-ching, Li Fu-hai and Ong Yi Ching developed the invention.
The patent application numbe..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Manufacturing Co Limited and Taiwan Semiconductor Manufacturing have obtained a patent for phase change material radio-frequency switch for low power consumption and methods for forming the same. This invention was developed by Kuo Hui Hung, Huang Kuo-ching, Huang Chien Ta, Chang Kuo-p..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have received a patent for Method for Forming a Perpendicular Spin Torque Oscillator (psto) Including Forming a Magneto Resistive Sensor (mr) Over a Spin Torque Oscillator (sto). This invention was developed by Zhu Jian, Tong Ru-ying, Liu Huan..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Beijing BOE Technology Dev Co Ltd and BOE Technology Group have been awarded a patent for Light-emitting Transistor and Display Substrate. This invention was developed by Li Dong.
The patent application number is US202118270918 20210226. The patent publication number is US12684992 (B2). International Pa..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Chengdu BOE Optoelect Tech Co and BOE Technology Group have been granted a patent for Display Substrate and Display Device. This invention was developed by Li Jianbo, Liu Tingliang, Hu Ming, Yang Huijuan, Deng Kaijie, Zhang Wei, Wang Yu and Dong Xiangdan.
The patent application number is US202218547638 ..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Chengdu BOE Optoelect Tech Co and BOE Technology Group have obtained a patent for display substrate and display apparatus. This invention was developed by Li Gen, Yang Huijuan, Shang Tinghua, Jiang Xiaofeng and Zhou Yang.
The patent application number is US202418885159 20240913. The patent publication n..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Chengdu BOE Optoelect Tech Co and BOE Technology Group have been granted a patent for Display Substrate and Display Apparatus. Wang Mengqi, Hu Ming, Jiang Zhiliang, Yu Ziyang and Chen Fei developed the invention.
The patent application number is US202318549608 20230223. The patent publication number is ..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Chengdu Boe Optoelect Tech Co and BOE Technology Group have been granted a patent for Display Substrate and Display Device. Du Lili, Wei Feng and Zhou Hongjun developed the invention.
The patent application number is US202117762506 20210322. The patent publication number is US12684965 (B2). Internationa..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Beijing BOE Technology Dev Co Ltd and BOE Technology Group have received a patent for Light-emitting Device and Method of Manufacturing the Same, Display Substrate. This invention was developed by Li Dong and Zhang Yichi.
The patent application number is US202218260492 20220511. The patent publication n..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- LG Electronics Inc and LG Display have been granted a patent for Display Device Comprising Semiconductor Light Emitting Element. This invention was developed by Yoon Doohyun, Choi Wonseok, Eom Hyeseon and Lee Moonsun.
The patent application number is US202218285192 20220331. The patent publication numbe..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Asahi Kasei Microdevices Corp and Asahi Kasei Microdevices Corpoation have received a patent for Compound Semiconductor Device. This invention was developed by Yasuda Daiki and Sakurai Yoshiki.
The patent application number is US202318330545 20230607. The patent publication number is US12684892 (B2). In..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have been granted a patent for Bonding Structures for Stacked Image Sensor. Yang Hao-lin, Huang Kuan-chieh, Yaung Dun-nian, Chen Yu-chun, Hsu Wei-cheng, Wang Tzu-jui and Wang Chen-jong developed the invention.
The patent application number ..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Manufacturing Co Limited and Taiwan Semiconductor Manufacturing have obtained a patent for shielded deep trench capacitor structure and methods of forming the same. This invention was developed by Lee Chien-chang, Chang Jen-yuan and Lai Chia-ping.
The patent application number is US..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have been granted a patent for Semiconductor Structure and Method for Forming the Same. You Jia-chuan, Pan Kuan-ting, Chiang Kuo-cheng, Wang Chih-hao and Chang Chia-hao developed the invention.
The patent application number is US20231845113..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have been granted a patent for Semiconductor Device and Manufacturing Method Thereof. Cheng Chao-ching, Lee Tsung-en, Lin Bo-jiun and Lee Tung-ying developed the invention.
The patent application number is US202318333508 20230612. The paten..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Mitsumi Electric Co Ltd and Sumitomo Electric Industries have secured a patent on Silicon Carbide Semiconductor Device. Saitoh Yu and Masuda Takeyoshi developed the invention.
The patent application number is US202218690444 20221014. The patent publication number is US12684853 (B2). International Patent..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Manufacturing Co Limited and Taiwan Semiconductor Manufacturing have been granted a patent for Avalanche-protected Transistors Using a Bottom Breakdown Current Path and Methods of Forming the Same. Lei Ming-ta, Jong Yu-chang, Liu Ruey-hsin, Hsia Te-yin, Su Liang-yu, Yang Nan-ying, Tsai..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have secured a patent on Thin-sheet Finfet Device. Passlack Matthias, Holland Martin Christopher and Van Dal Mark developed the invention.
The patent application number is US202418744888 20240617. The patent publication number is US12684804..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg Co Ltd and National Taiwan University have been awarded a patent for Memory Device and Manufacturing Method Thereof. This invention was developed by Chiang Tzu-hao and Hwu Jenn-gwo.
The patent application number is US202218066205 20221214. The patent publication number is US1268..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Western Digital Tech Inc and SanDisk Technologies have secured a patent on Three-dimensional Memory Device Containing Phosphorus-doped Silicon Oxide Ion-gettering Structures and Methods of Forming the Same. Fujimura Nobuyuki, Nakamura Tadashi, Moriyama Takumi and Shimizu Satoshi developed the invention.
..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- BOE Technology Group Co Ltd and Hefei BOE Display Technology have secured a patent on Circuit Board, Chip on Film, Display Apparatus and Bonding Method. Liu Jiantao, Sun Jianwei, Quan Yu, Pan Zhengru, He Liu, Li Qing, Huang Yanting, Zhou Liugang, Chen Yunlu, Wang Jun, Liu Changcheng and Liang Yunyun develo..
Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing have been granted a patent for Semiconductor System Inspection Tool and Methods of Operation. This invention was developed by Lu Jou-hsuan, Yu Sheng-kang, Chien Shang-chieh, Liu Heng-hsin, Chuang Jyun-yan, Cheng Chiao-hua, Hou Ko-ching, Wu Che..
Semiconductor
| Thu 30 Jul 2026
Alexandria, July 31 -- Solana Mobile Inc and Osom Products Inc have secured a patent on Portable Memory Device Configured for Host Device to Manage Access to Digital Assets. Gagne-keats Jason Sean and Anderson Gary developed the invention.
The patent application number is US202418655911 20240506. The patent publication number..
Semiconductor
| Thu 30 Jul 2026
Beijing, July 31 -- Guangzhou National Laboratory and Guangzhou Najing Dingxin Tech Co Ltd have submitted a patent application for Sample Loading Chip. This invention was developed by Liang Yujun, Xia Yanming, Xu Qiang, Sun Fang, Tan Haolin and Zhuang Lei.
The patent application number is CN202610137636 20260130. The patent p..
Semiconductor
| Fri 31 Jul 2026
Seoul, July 31 -- Korean Intellectual Property Office has released SK Hynix patent application for Memory Module Related to Signal Integrity of Clock. This invention was developed by Song Choung Ki.
The patent application number is KR20230093434 20230718. The patent publication number is KR20250013050 (A). International Patent ..
Semiconductor
| Fri 31 Jul 2026
Seoul, July 31 -- Korean Intellectual Property Office has received LG Innotek patent application for Circuit Board and Semiconductor Package Comprising the Same. Kim Sung Min and Heo Seong Ho developed the invention.
The patent application number is KR20230093430 20230718. The patent publication number is KR20250013049 (A). Int..
Semiconductor
| Fri 31 Jul 2026
Seoul, July 31 -- Korean Intellectual Property Office has published LG Innotek patent application for Semiconductor Package. The invention was developed by Kim Yong Suk, Han Jung Eun and Kim Moo Seong.
The patent application number is KR20230093428 20230718. The patent publication number is KR20250013048 (A). International Pa..
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