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13:59:08 Mon 01 Jun 2026

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(20)

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(3)

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(3)

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(3)

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(2)

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(2)

(2)

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(2)

Beijing Chaoxian Memory R

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(2)

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(2)

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(2)

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(2)

Beijing University of Chi

(2)

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(2)

(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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Fudan University

(2)

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(2)

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Global Unichip Corp [tw];

(2)

GlobalFoundries

(2)

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(2)

Guangxi Huaxin Zhenbang S

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(2)

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(2)

(2)

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(2)

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Hefei Xinsheng Optoelectr

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(2)

Hitachi High Technologies

(2)

Hongyang Display (Xianyan

(2)

Horizon Zhengcheng Shangh

(2)

Huaguan Semiconductor Hey

(2)

Huazhong University of Sc

(2)

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(2)

IUCF-HYU Industry-Univers

(2)

(2)

(2)

Inno Saike (Suzhou) Semic

(2)

(2)

(2)

Ji Hua Laboratory

(2)

Jiangsu Heyi Guangxian Te

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Jiangsu Leuven Instrument

(2)

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(2)

Jiangsu Third Generation

(2)

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(2)

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(2)

Jingjiang Jiashenghe Vacu

(2)

Jinsanjiang Zhaoqing Sili

(2)

Kore Semiconductor Inc

(2)

(2)

(2)

Laplace (Guangzhou) Semic

(2)

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(2)

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(2)

(2)

(2)

(2)

Minebea Power Semiconduct

(2)

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(2)

(2)

Nacun Tech Hangzhou Co Lt

(2)

Nanjing University of Sci

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National Central Universi

(2)

(2)

Ningxia Kepaisi Electroni

(2)

Nippon Electric Glass

(2)

Northeastern University

(2)

Northwest Electronic Equi

(2)

Orient Semiconductor Elec

(2)

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(2)

Pengxi Semiconductor Tech

(2)

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(2)

(2)

(2)

(2)

Rayleigh Vision Intellige

(2)

RichWave Technology

(2)

(2)

(2)

(2)

(2)

SK Enpulse Co Ltd [kr]; S

(2)

(2)

Samsung Semiconductor Chi

(2)

Shandong Baocheng Electro

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Shanghai Dixi Semiconduct

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(2)

(2)

Sharp Display Technology

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(2)

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Shinetsu Chemical

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Silicon Motion Tech Corp

(2)

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(2)

Southeast University

(2)

Spreadtrum Semiconductor

(2)

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(2)

(2)

Taiwan Semiconductor Mfg

(2)

Tianjin University

(2)

Tianjin Zhonghuan Advance

(2)

Toray Industries

(2)

Tuojing Jianke Haining Se

(2)

Unisantis Electronics Sin

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(2)

Wuhan China Star Optoelec

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Wuxi China Resources Micr

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(2)

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(2)

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(2)

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(2)

Xiaohua Semiconductor Co

(2)

Xiaomi Technology, Wuhan;

(2)

Xinai Tech Nanjing Co Ltd

(2)

Xinjiang Technical Instit

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Xinsheng Intelligent Tech

(2)

Yamaha Hatsudoki

(2)

Yield Microelectronics

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Zhuiguang Biotechnology S

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3peak Incorporated

(1)

724th Research Institute

(1)

ACM Research, Shanghai; S

(1)

AG Materials Technology C

(1)

(1)

AMS Sensors USA

(1)

(1)

AP Memory Technology

(1)

(1)

Aac Tech Pte Ltd [sg]; AA

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Acken Optoelectronics Ltd

(1)

Acm Research Shanghai Inc

(1)

Actron Tech Corporation

(1)

Actron Technology

(1)

Additive Mfg Ip Gmbh

(1)

Advanced Micro Devices

(1)

Advanced Micro Devices In

(1)

Advanced Semiconductor En

(1)

(1)

(1)

Aihua Wuxi Semiconductor

(1)

Aikesi Holding Beijing Co

(1)

(1)

Aiteman Semiconductor Tec

(1)

(1)

(1)

(1)

Alxa Power Supply Branch

(1)

Amic Tech Corporation

(1)

Amida Technology Inc

(1)

(1)

Anhui Hemei Material Tech

(1)

Anhui Lingbi Bearing Res

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(1)

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(1)

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(1)

Anhui Zhongjiang Material

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Anli Tech Suzhou Co Ltd

(1)

Anyang Normal University

(1)

(1)

(1)

Arison Surface Tech Suzho

(1)

(1)

Asml Netherlands Bv (asm

(1)

Asml Netherlands Bv [nl];

(1)

Asml Netherlands Bv [nl];

(1)

(1)

Axionics Co Ltd

(1)

BOE Huacan Optoelectronic

(1)

BOE Huacan Optoelectronic

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Technology Group; Bei

(1)

BOE Technology Group; Bei

(1)

BOE Technology Group; Hef

(1)

BOE Technology Group; Yun

(1)

BOE Technology Group; Yun

(1)

BYD Semiconductor

(1)

Baoding Victory Electro O

(1)

Beijing Aerospace Inst Me

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Beijing Aerospace Times M

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Beijing Aerospace Times O

(1)

Beijing BOE Optoelectroni

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Beijing Cgb Tech Co Ltd

(1)

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(1)

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(1)

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(1)

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Beijing Institute of Tech

(1)

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(1)

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(1)

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(1)

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(1)

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(1)

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(1)

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Beijing University; Handa

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(1)

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(1)

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(1)

Beiyi Semiconductor Tech

(1)

Beyond Tech Co Ltd

(1)

Biaopu Semiconductor Tech

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Board of Regents of the U

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Boxincheng (Chongqing) Se

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(1)

Brightek Jiangsu Optoelec

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Brooks Automation (German

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(1)

CSMC Technologies

(1)

(1)

(1)

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(1)

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(1)

Changdian Biological Wafe

(1)

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Changzhou Correll Tech Co

(1)

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(1)

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(1)

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(1)

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(1)

Chen Wei Lin [tw]; Kang M

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Chenling Semiconductor Ji

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China Academy Of Aerospac

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China Electronics Standar

(1)

China Jiliang University

(1)

China Ocean Engineering E

(1)

China University of Minin

(1)

China Zhenhua Group Yongg

(1)

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(1)

Chipwell Tech Corp

(1)

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(1)

Chongqing Changan Automob

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(1)

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(1)

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(1)

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(1)

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Chongqing Sailateke Mater

(1)

Chongqing University

(1)

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(1)

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(1)

Chuanzhou Semiconductor T

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Chuyun Tek Shanghai Co Lt

(1)

Chuzhou Huike Optoelectro

(1)

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Ci Takiron Corp

(1)

Cirrus Logic Internationa

(1)

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Cisco Technology

(1)

Climate Bridge Hunan Eco

(1)

Climax Technology Co Ltd

(1)

Contrel Technology

(1)

(1)

Crystal Machine Co Ltd

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Cs Microelectronics Co Lt

(1)

Cssc Hanguang Tech Co Ltd

(1)

Cyntec Co Ltd [tw]; Cynte

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DIC Corporation

(1)

(1)

Dainippon Ink & Chemicals

(1)

Dainippon Printing

(1)

Dandong Anshun Microelect

(1)

(1)

Delfine Technology Co Ltd

(1)

Delta Electronics, Shangh

(1)

Dexerials Corporation

(1)

Dongfang Electric Science

(1)

Dongguan Erjibi Electroni

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Dongguan Sizhe Tech Co Lt

(1)

Dongguan Suyuan Automatio

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(1)

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(1)

(1)

Dragonstate Technology Co

(1)

Dugen Hexin Photoelectric

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Ebara Corp [jp]; National

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Echo Giken Co Ltd [jp]; K

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Electronics And Telecommu

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Elitegroup Computer Syste

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Elstar Power Patents Pty

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Emergency Tech Inc

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(1)

(1)

Episil Tech Inc

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(1)

Ever Ohms Technology Co L

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Fly Sky Innotech Inc

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Focuslight Singapore Pte

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Forty Eighth Research Ins

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(1)

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Fujian Academy of Mechani

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Fuzhou University

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Gaize Precision Tech Suzh

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GalaxyCore Shanghai

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General Plastic Industrie

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Geometry Xinneng Chengdu

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(1)

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Guangdong Greater Bay Are

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(1)

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(1)

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(1)

(1)

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(1)

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Hanbo Semiconductor Shang

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State Intellectual Property Office of China Receives Jiangsu Aoguang Electronics Co Ltd Patent Application for Impurity Removing Mechanism for Sand Blasting Balls for Electroplatin..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- State Intellectual Property Office of China has received Jiangsu Aoguang Electronics Co Ltd patent application for Impurity Removing Mechanism for Sand Blasting Balls for Electroplating Sand Blasting and Machining Process of Impurity Removing Mechanism. Xie Daolin, Ren Qingying, Yang Kang, Wu Liming, He Yongme..

State Intellectual Property Office of China Publishes Suzhou Douson Drilling & Prod Equipment Co Ltd, Suzhou Douson Drilling & Prod Equipment Co Ltd and Chengdu Daosen Drilling And..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has published Suzhou Douson Drilling & Prod Equipment Co Ltd, Suzhou Douson Drilling & Prod Equipment Co Ltd and Chengdu Daosen Drilling And Production Equipment Co Ltd patent application for Fluid Chip Catching Control Method and System. The invention was developed ..

Guangdong Inbright Electronic Tech Co Ltd Submits Patent Application for Diode Pin Bending Device

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Guangdong Inbright Electronic Tech Co Ltd has submitted a patent application for Diode Pin Bending Device. Hong Jianfeng and Hong Haishui developed the invention. The patent application number is CN20261026326 20260109. The patent publication number is CN121467576 (A). International Patent Classification co..

Maiwei Silicon Based Tech Qujing Co Ltd Files Chinese Patent Application for Method and Device for Preparing Silicon Smelting Aid from Recycled Silicon Powder

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Maiwei Silicon Based Tech Qujing Co Ltd has filed a patent application for Method and Device for Preparing Silicon Smelting Aid from Recycled Silicon Powder. This invention was developed by Gu Yuanzhang and Yin Hongtao. The patent application number is CN202511979998 20251225. The patent publication number ..

PNC Process Systems and Zhiwei Semiconductor Shanghai Co Ltd Submit Chinese Patent Application for Nozzle Assembly Capable of Preventing Liquid from Being Hung at Bottom

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- PNC Process Systems and Zhiwei Semiconductor Shanghai Co Ltd have submitted a patent application for Nozzle Assembly Capable of Preventing Liquid from Being Hung at Bottom. This invention was developed by Gu Yanpin, Wang Kui and Zhang Hui. The patent application number is CN202511920211 20251218. The patent..

Guangzhou Xinzhi Tech Co Ltd and Guangdong Greater Bay Area Inst Of Integrated Circuit and System Submit Chinese Patent Application for Liquid Injection System Applied to Photoresi..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Guangzhou Xinzhi Tech Co Ltd and Guangdong Greater Bay Area Inst Of Integrated Circuit and System have submitted a patent application for Liquid Injection System Applied to Photoresist Pump. This invention was developed by Liang Junming, Li Linfeng, Meng Xianghe, Guo Ang and Wang Jian. The patent applicatio..

Ningxia Microtek Semiconductor Mat Co Ltd Seeks Patent for Method for Reducing Axial Resistivity Attenuation of N-type Silicon Single Crystal Rod

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Ningxia Microtek Semiconductor Mat Co Ltd has sought patent for Method for Reducing Axial Resistivity Attenuation of N-type Silicon Single Crystal Rod. This invention was developed by He Junjie, Su Bo, Zhou Xiaoyuan, Du Ruiping, Ma Zhandong and Zhou Zhipeng. The patent application number is CN202511479185 2..

Zhongke Huizhu Guangzhou Semiconductor Co Ltd Files Chinese Patent Application for Silicon Carbide Epitaxial Layer and Preparation Method Thereof

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Zhongke Huizhu Guangzhou Semiconductor Co Ltd has filed a patent application for Silicon Carbide Epitaxial Layer and Preparation Method Thereof. This invention was developed by Xue Long, Song Huaping, Yang Junwei and Guo Songbo. The patent application number is CN202511537059 20251027. The patent publicatio..

Beijing Zhongboxin Semiconductor Tech Co Ltd Submits Chinese Patent Application for Algan Based on Porous Aln Growth and Preparation Method Thereof

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Beijing Zhongboxin Semiconductor Tech Co Ltd has submitted a patent application for Algan Based on Porous Aln Growth and Preparation Method Thereof. This invention was developed by Zhang Ziyao and Zhang Lisheng. The patent application number is CN202511396713 20250928. The patent publication number is CN121..

State Intellectual Property Office of China Receives Hypersics Semiconductor Co Ltd Patent Application for Method for Removing High-temperature Chemical Vapor Deposition Attachment..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has received Hypersics Semiconductor Co Ltd patent application for Method for Removing High-temperature Chemical Vapor Deposition Attachments and Crystal Growth Equipment. Pang Xu, Liu Xinyu and Yuan Zhenzhou developed the invention. The patent application number ..

Beijing Tankeblue Semiconductor and Jiangsu Tianke Heda Semiconductor Submit Chinese Patent Application for Silicon Carbide Crystal Growth Method and Device

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Beijing Tankeblue Semiconductor and Jiangsu Tianke Heda Semiconductor have submitted a patent application for Silicon Carbide Crystal Growth Method and Device. This invention was developed by Wang Guangming, Lou Yanfang, Liu Chunjun, Peng Tonghua and Yang Jian. The patent application number is CN20251199559..

Ningbo Guining Semiconductor Mat Co Ltd Applies for Patent on Annular Silicon Rod Growth Method for Silicon Component

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Ningbo Guining Semiconductor Mat Co Ltd has applied Chinese patent for Annular Silicon Rod Growth Method for Silicon Component. Chen Hongrong and Huang Chunlai developed it. The patent application number is CN202511715947 20251121. The patent publication number is CN121472978 (A). International Patent Class..

Shiji Chenxing Tech Nantong Co Ltd Seeks Patent for Czochralski Silicon Thermal Field and Single Crystal Furnace Structure

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Shiji Chenxing Tech Nantong Co Ltd has sought patent for Czochralski Silicon Thermal Field and Single Crystal Furnace Structure. This invention was developed by Huang Taoming and Wu Jianye. The patent application number is CN202511715090 20251121. The patent publication number is CN121472975 (A). Internatio..

Dongguan Suyuan Automation Equipment Co Ltd Submits Chinese Patent Application for Online Monitoring Method and System for Automatic Electroplating Equipment

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Dongguan Suyuan Automation Equipment Co Ltd has submitted a patent application for Online Monitoring Method and System for Automatic Electroplating Equipment. This invention was developed by Li Kaiming, Tian Fangcheng and Qiao Guoliang. The patent application number is CN202511641616 20251111. The patent pu..

Guangdong Prosper Automation Equipment Co Ltd Files Chinese Patent Application for Electroplating Clamp for Electroplating Production Line

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Guangdong Prosper Automation Equipment Co Ltd has filed a patent application for Electroplating Clamp for Electroplating Production Line. This invention was developed by Wu Yukai, Qiao Wenju, Yu Renshui and Chen Tingting. The patent application number is CN202511918226 20251218. The patent publication numbe..

Chengdu Yicheng Integrated Circuit Co Ltd Applies for Patent on Board-level Electroplating Clamp and Electroplating Device

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Chengdu Yicheng Integrated Circuit Co Ltd has applied Chinese patent for Board-level Electroplating Clamp and Electroplating Device. Chen Kexu, Li Mingchao, Ke Yan, Xiang Chen, Liu Song, Fan Liwei, Shi Yufeng and Jiang Lianbing developed it. The patent application number is CN202511786970 20251201. The pate..

Hebei Heshengyuan Tech Co Ltd Submits Patent Application for Electrolytic Tank Bipolar Plate Electroplating Device with Pre-cleaning Function

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Hebei Heshengyuan Tech Co Ltd has submitted a patent application for Electrolytic Tank Bipolar Plate Electroplating Device with Pre-cleaning Function. Wang Qinghe and Liu Wenchuan developed the invention. The patent application number is CN202511679542 20251117. The patent publication number is CN121472952 ..

Suzhou Donggu Surface Eng Equipment Co Ltd Applies for Patent on Local Electroplating Equipment for Inner Hole

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Suzhou Donggu Surface Eng Equipment Co Ltd has applied Chinese patent for Local Electroplating Equipment for Inner Hole. Zhang Zhan and Zhang Yunlong developed it. The patent application number is CN202511855108 20251210. The patent publication number is CN121472945 (A). International Patent Classification ..

Huawei Technologies; Shenzhen United Blueocean Applied Materials Technology Applies for Patent on Electroplating Solution for Electroplating Gold-silver Alloy and Application There..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Huawei Technologies; Shenzhen United Blueocean Applied Materials Technology has applied Chinese patent for Electroplating Solution for Electroplating Gold-silver Alloy and Application Thereof. Zhu Shaochen, Ren Changyou, Shi Huijuan and Ren Hui developed it. The patent application number is CN20241178976 20..

State Intellectual Property Office of China Publishes Anhui Youpin New Mat Co Ltd Patent Application for Manufacturing Process of Multi-heat-dissipation Base Structure for MPCVD Di..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has published Anhui Youpin New Mat Co Ltd patent application for Manufacturing Process of Multi-heat-dissipation Base Structure for MPCVD Diamond Growth. The invention was developed by Wang Gang, You Shu and Miao Jianguo. The patent application number is CN2025113..

Kaixin Semiconductor Suzhou Co Ltd Applies for Patent on Method for Regulating Carbon-silicon Ratio in Real Time by Introducing Chlorine and Silicon Carbide Coating

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Kaixin Semiconductor Suzhou Co Ltd has applied Chinese patent for Method for Regulating Carbon-silicon Ratio in Real Time by Introducing Chlorine and Silicon Carbide Coating. Xu Yang, He Pengbo and Li Yalin developed it. The patent application number is CN202511639044 20251110. The patent publication number..

State Intellectual Property Office of China Publishes Suzhou Gaoxin Zhongke Semiconductor Co Ltd Patent Application for Preparation Method of High-quality Eb Evaporation Target Mat..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has published Suzhou Gaoxin Zhongke Semiconductor Co Ltd patent application for Preparation Method of High-quality Eb Evaporation Target Material. The invention was developed by Ding Guoqiang. The patent application number is CN202511836021 20251208. The patent pu..

Xichang Shunyi New Energy Tech Development Co Ltd Submits Chinese Patent Application for Method for Preparing High Silicon Steel Through Cvd Siliconizing

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Xichang Shunyi New Energy Tech Development Co Ltd has submitted a patent application for Method for Preparing High Silicon Steel Through Cvd Siliconizing. This invention was developed by Zou Min and Zhong Qingdong. The patent application number is CN202511527127 20251024. The patent publication number is CN..

Shandong Kexun Biochip Tech Co Ltd Submits Chinese Patent Application for Bearing Assembly for Biological Chip and Sample Application Mechanism

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Shandong Kexun Biochip Tech Co Ltd has submitted a patent application for Bearing Assembly for Biological Chip and Sample Application Mechanism. This invention was developed by Wang Chunhua, Wang Wenhao, Su Kechuan, Guo Xiuyong, Wang Yuanguo, Li Ning, Bai Jianlong, Cao Yue, Chen Yuqiang and Zhang Xiufen. Th..

Hunan Xiangjiang Green Building Materials Res Institute Co Ltd Submits Chinese Patent Application for Preparation Method of Nano Silicon Dioxide Modified Asphalt Recycled Fine Aggr..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Hunan Xiangjiang Green Building Materials Res Institute Co Ltd has submitted a patent application for Preparation Method of Nano Silicon Dioxide Modified Asphalt Recycled Fine Aggregate Plant-mixed Hot Recycled High-performance Mixture. This invention was developed by Huang Liang, Tan Zhixiang, Zhang Tao and Y..

State Intellectual Property Office of China Releases Wuxi Suoao Environmental Prot Equipment Co Ltd Patent Application for Pneumatic Rotational Flow Dual-mode Washing System and Me..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- State Intellectual Property Office of China has released Wuxi Suoao Environmental Prot Equipment Co Ltd patent application for Pneumatic Rotational Flow Dual-mode Washing System and Method for Semiconductor Tail Gas. This invention was developed by Huang Honghao and Chu Qianqian. The patent application numb..

Beiyi Semiconductor Tech Guangdong Co Ltd Submits Patent Application for Econodual-form Sic Packaging Structure with Low Parasitic Inductance

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Beiyi Semiconductor Tech Guangdong Co Ltd has submitted a patent application for Econodual-form Sic Packaging Structure with Low Parasitic Inductance. Li Mingda developed the invention. The patent application number is CN202511567752 20251030. The patent publication number is CN121463815 (A). International ..

Chengdu Jingxin Mingneng Photovoltaic Tech Co Ltd Applies for Patent on Perovskite Solar Cell and Preparation Method Thereof

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Chengdu Jingxin Mingneng Photovoltaic Tech Co Ltd has applied Chinese patent for Perovskite Solar Cell and Preparation Method Thereof. Xu Maoxia, Luo Shumin and Chen Qian developed it. The patent application number is CN202511692165 20251118. The patent publication number is CN121463637 (A). International P..

Peking Univ Chongqing Carbon Based Integrated Circuit Research Institute Files Chinese Patent Application for CMOS Integrated Circuit and Preparation Method

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Peking Univ Chongqing Carbon Based Integrated Circuit Research Institute has filed a patent application for CMOS Integrated Circuit and Preparation Method. This invention was developed by Wang Chengbo, Zhang Weizhen, Zhai Minglong, Liu Jiayu and Wang Xing. The patent application number is CN202511445323 202..

Suzhou Xinju Semiconductor Co Ltd Submits Patent Application for Micro Led Flip Chip Structure for Improving Laser Lift-off Yield and Preparation Method

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Suzhou Xinju Semiconductor Co Ltd has submitted a patent application for Micro Led Flip Chip Structure for Improving Laser Lift-off Yield and Preparation Method. Huang Chaokui, Jin Feng, Tao Lei and Li Qing developed the invention. The patent application number is CN202511611498 20251105. The patent publica..

State Intellectual Property Office of China Releases Cs Microelectronics Co Ltd Patent Application for Sled Chip Structure and Manufacturing Method

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has released Cs Microelectronics Co Ltd patent application for Sled Chip Structure and Manufacturing Method. This invention was developed by Song Shijin, Zheng Xin, Yang Lei, Ma Linhui and Chen Fuhua. The patent application number is CN202511390420 20250926. The p..

Fujian Jinshi Energy Co Ltd Submits Chinese Patent Application for Method for Manufacturing Back Contact Solar Cell Provided with Combined Mask Layer and Back Contact Solar Cell

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Fujian Jinshi Energy Co Ltd has submitted a patent application for Method for Manufacturing Back Contact Solar Cell Provided with Combined Mask Layer and Back Contact Solar Cell. This invention was developed by Lin Chaohui, Lin Kairui, Huang Xiaodi, Zhang Chaohua, Lin Jinshan, Pi Wenhui, Yang Qinglin, Chen You..

State Intellectual Property Office of China Receives Photovoltaic Industry Tech Branch Of Qinghai Huanghe Hydropower Development Co Ltd, Qinghai Huanghe Hydropower Dev, SPIC Huangh..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has received Photovoltaic Industry Tech Branch Of Qinghai Huanghe Hydropower Development Co Ltd, Qinghai Huanghe Hydropower Dev, SPIC Huanghe Hydropower Development and Xining Solar Power Branch, Qinghai Upstream of Yellow River Hydropower Devlopment; Xi'an Solar Pow..

State Intellectual Property Office of China Releases Southeast University and Nanjing Ic Design Automation Tech Innovation Center Patent Application for ESD (electro-static Dischar..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has released Southeast University and Nanjing Ic Design Automation Tech Innovation Center patent application for ESD (electro-static Discharge) Protection Structure of Three-dimensional Integrated Circuit and Design and Integration Method Thereof. This invention was ..

State Intellectual Property Office of China Receives Semiconductor Mfg Int Tianjin Co Ltd and CSemiconductor Manufacturing International (Shanghai) Patent Application for Formation..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has received Semiconductor Mfg Int Tianjin Co Ltd and Semiconductor Manufacturing International (Shanghai) patent application for Formation Method of Semiconductor Device and Semiconductor Device. Zhang Xiaoyan, Wang Mengying and Chen Liang developed the invention. ..

Wuhan Pulse Core Electronic Tech Co Ltd Submits Patent Application for Low-inductance Current-sharing Silicon Carbide Power Module

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Wuhan Pulse Core Electronic Tech Co Ltd has submitted a patent application for Low-inductance Current-sharing Silicon Carbide Power Module. Li Youkang and Xiang Weiguang developed the invention. The patent application number is CN202511568159 20251030. The patent publication number is CN121463504 (A). Inter..

State Intellectual Property Office of China Releases Jiangsu Yang He Yang Microelectronics Tech Co Ltd Patent Application for Vertical Nanowire Memory Device

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has released Jiangsu Yang He Yang Microelectronics Tech Co Ltd patent application for Vertical Nanowire Memory Device. This invention was developed by Wang Yongcheng. The patent application number is CN202511589803 20251103. The patent publication number is CN1214..

State Intellectual Property Office of China Publishes Shanghai Dixi Semiconductor Tech Co Ltd Patent Application for Flash Memory Structure, Array, Manufacturing Method of Semicond..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has published Shanghai Dixi Semiconductor Tech Co Ltd patent application for Flash Memory Structure, Array, Manufacturing Method of Semiconductor Device, and Integrated Circuit. The invention was developed by Zheng Jianqin. The patent application number is CN20251..

Intel NDTM USA Inc Applies for Patent on Manufacturing Method of Three-dimensional NAND Memory

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Intel NDTM USA Inc has applied Chinese patent for Manufacturing Method of Three-dimensional NAND Memory. Zhao Xiaohuan, Xue James S, Huang Fei, Yuan Kefang and Zou Xiangqin developed it. The patent application number is CN20241150108 20240801. The patent publication number is CN121463447 (A). International ..

Yangtze Memory Holdings Co Ltd Submits Chinese Patent Application for Chip Packaging Structure and Preparation Method Thereof, Semiconductor Device, Storage System and Electronic E..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Yangtze Memory Holdings Co Ltd has submitted a patent application for Chip Packaging Structure and Preparation Method Thereof, Semiconductor Device, Storage System and Electronic Equipment. This invention was developed by Miao Lina, Zhao Yi, Wen Min, Shi Xiuyu, Shen Shuyang and Zhang Yucheng. The patent app..

Siweiku Changzhou Tech Co Ltd Files Chinese Patent Application for Processing Method of MEMS (micro Electro Mechanical System) Radiator

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Siweiku Changzhou Tech Co Ltd has filed a patent application for Processing Method of MEMS (micro Electro Mechanical System) Radiator. This invention was developed by Hua Wenjuan and Li Zhenwei. The patent application number is CN202511736296 20251125. The patent publication number is CN121463405 (A). Inter..

Zhuhai Xinye Electronic Tech Co Ltd Submits Patent Application for Through Hole Filling Electroplating Method and System for Printed Circuit Board

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Zhuhai Xinye Electronic Tech Co Ltd has submitted a patent application for Through Hole Filling Electroplating Method and System for Printed Circuit Board. Guan Sheng, Huang Jiasheng, Zhong Yiyi and Liu Jian developed the invention. The patent application number is CN20261022215 20260108. The patent publica..

Jiangsu Punuowei Electronic Co Ltd Submits Chinese Patent Application for Capacitor-embedded Packaging Substrate and Processing Method Thereof

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Jiangsu Punuowei Electronic Co Ltd has submitted a patent application for Capacitor-embedded Packaging Substrate and Processing Method Thereof. This invention was developed by Ye Zhongzheng, Deng Zhicheng, Yang Fei and Ma Hongwei. The patent application number is CN202511406062 20250929. The patent publicat..

Guixin Tech Shenzhen Co Ltd Files Chinese Patent Application for Bandwidth Self-adaption Method Based on Physical Layer Signaling, Chip and User Equipment

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Guixin Tech Shenzhen Co Ltd has filed a patent application for Bandwidth Self-adaption Method Based on Physical Layer Signaling, Chip and User Equipment. This invention was developed by Zhao Yueying and Wang Shengjian. The patent application number is CN20241110929 20240726. The patent publication number is..

State Intellectual Property Office of China Receives Guangdong Jingci New Mat Co Ltd Patent Application for Preparation Method of High-purity Polycrystalline Silicon Carbide Substr..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has received Guangdong Jingci New Mat Co Ltd patent application for Preparation Method of High-purity Polycrystalline Silicon Carbide Substrate. Chen Wenjie, Hong Yuzhe, Chang Xinfeng, Xu Canjun, Chen Guanliang, Chen Guangjin and Zhou Dong developed the invention. ..

State Intellectual Property Office of China Releases Yunnan Jiatailai New Mat Co Ltd and Baotou Meike Silicon Energy Patent Application for Czochralski Silicon Single Crystal Cruci..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has released Yunnan Jiatailai New Mat Co Ltd and Baotou Meike Silicon Energy patent application for Czochralski Silicon Single Crystal Crucible and Crystal Pulling Method. This invention was developed by Yang Jian, Fan Tongshuai, Lan Zhiyong and Wen Yong. The pate..

Shengjisheng Semiconductor Tech Beijing Co Ltd Submits Patent Application for End Effector Mounting and Fixing Device and Use Method Thereof

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Shengjisheng Semiconductor Tech Beijing Co Ltd has submitted a patent application for End Effector Mounting and Fixing Device and Use Method Thereof. Wang Yu developed the invention. The patent application number is CN202511883159 20251215. The patent publication number is CN121468623 (A). International Pat..

Sichuan Diya Biotechnology Group Co Ltd Submits Chinese Patent Application for Preparation Method and Application of Bionic Self-perfusion Microfluidic Chip Based on Combined Drivi..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Sichuan Diya Biotechnology Group Co Ltd has submitted a patent application for Preparation Method and Application of Bionic Self-perfusion Microfluidic Chip Based on Combined Driving. This invention was developed by Du Qijun, Zhang Fan, Wang Shuqi, Hu Wenqi, Wu Di and Lu Qinrui. The patent application numbe..

Xi'an Weihua Precision Tech Co Ltd Submits Patent Application for Liquid Separation-convergence Integrated Liquid Drop Micro-fluidic Chip and Liquid Drop Preparation Method

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Xi'an Weihua Precision Tech Co Ltd has submitted a patent application for Liquid Separation-convergence Integrated Liquid Drop Micro-fluidic Chip and Liquid Drop Preparation Method. Hao Nanjing, Guo Jiahao, Guo Zhiye, Liu Huan and Zhang Xiaotian developed the invention. The patent application number is CN20..

Ningbo Jiangfeng Tongxin Semiconductor Mat Co Ltd Applies for Patent on High-reliability Silver-free Amb Ceramic Substrate and Preparation Method Thereof

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Ningbo Jiangfeng Tongxin Semiconductor Mat Co Ltd has applied Chinese patent for High-reliability Silver-free Amb Ceramic Substrate and Preparation Method Thereof. Yu Xiaodong, Narisaki, Cheng Lin, Wang Bozhen and Yin Kexin developed it. The patent application number is CN202511646058 20251111. The patent p..

State Intellectual Property Office of China Receives Siaien Jiujiang New Mat Co Ltd Patent Application for Silicon Powder Treatment Process for Producing Silicon Nitride Ceramics

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- State Intellectual Property Office of China has received Siaien Jiujiang New Mat Co Ltd patent application for Silicon Powder Treatment Process for Producing Silicon Nitride Ceramics. Gu Yujun and Li Xiuquan developed the invention. The patent application number is CN202511784714 20251201. The patent public..

State Intellectual Property Office of China Publishes Zhejiang Fulede Semiconductor Material Tech Co Ltd Patent Application for Method for Preparing Silicon Carbide Material Based ..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- State Intellectual Property Office of China has published Zhejiang Fulede Semiconductor Material Tech Co Ltd patent application for Method for Preparing Silicon Carbide Material Based on High-solid-content Low-viscosity Slurry. The invention was developed by Zhang Wen, Ma Yuqi and Wang Fu. The patent applic..

Shenyang Xingguang New Mat Co Ltd Submits Chinese Patent Application for Glass Carbon Mold, Recrystallized Silicon Carbide Product and Preparation Method

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Shenyang Xingguang New Mat Co Ltd has submitted a patent application for Glass Carbon Mold, Recrystallized Silicon Carbide Product and Preparation Method. This invention was developed by Hao Jianliang, Ren Yun, Liu Changchun, Ren Jiang, Han Ruirong, Hao Yan, Li Bin and Zhang Na. The patent application numbe..

Qingdao Guolin Ceramic New Material Tech Co Ltd Submits Patent Application for Preparation Method of Aluminum Oxide Substrate

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Qingdao Guolin Ceramic New Material Tech Co Ltd has submitted a patent application for Preparation Method of Aluminum Oxide Substrate. Ding Xiangpeng, Ding Qi and Li Hu developed the invention. The patent application number is CN202511708525 20251120. The patent publication number is CN121470936 (A). Intern..

Taiwan Patent Office Releases Taiwan Semiconductor Mfg Co Ltd and National Taiwan University Patent Application for Method for Manufacturing Spintronic Device

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Taiwan Patent Office has released Taiwan Semiconductor Mfg Co Ltd and National Taiwan University patent application for Method for Manufacturing Spintronic Device. This invention was developed by Li Jiun-yun, Wu Yu-jui, Liu Chia-you, Tai Chia-tse and Li Tsung-ying. The patent application number is TW20250102..

State Intellectual Property Office of China Publishes Chongqing Qingsheng New Mat Co Ltd Patent Application for Preparation Method of High-strength Silicon Dioxide Aerogel Composit..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- State Intellectual Property Office of China has published Chongqing Qingsheng New Mat Co Ltd patent application for Preparation Method of High-strength Silicon Dioxide Aerogel Composite Material. The invention was developed by Zhang Yu, Wu Yongpeng, Hu Xinyu, Li Zhongsheng, Lin Yu, He Bin, Ding Xingxing and Li..

Taiwan Patent Office Releases Unique Materials Co Ltd Patent Application for Light-emitting Device

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Taiwan Patent Office has released Unique Materials Co Ltd patent application for Light-emitting Device. This invention was developed by Tseng Huan-wei, Chou Chun-wei and Liao Chia-chun. The patent application number is TW20250101852 20231003. The patent publication number is TW202519086 (A). International Pa..

Taiwan Patent Office Releases Iii V Tech Gmbh Patent Application for Dopant-free Semiconductor Device, Method of Manufacturing, and Electrical Circuit Element

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Taiwan Patent Office has released Iii V Tech Gmbh patent application for Dopant-free Semiconductor Device, Method of Manufacturing, and Electrical Circuit Element. This invention was developed by Tavakolimehrjardi Mahdi, Amirmazlaghani Mina and Raissi Farshid. The patent application number is TW20240123136 2..

Ganrich Semiconductor Corp Applies for Patent on Semiconductor Component

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Ganrich Semiconductor Corp has applied Taiwan patent for Semiconductor Component. Chen Chih-hao, Shen Yi-ru and Chang Chao-kai developed it. The patent application number is TW20230141218 20231027. The patent publication number is TW202519028 (A). International Patent Classification codes are H10D1/66, H10D3..

Aimechatec Ltd Files Taiwan Patent Application for Microstructure Transfer Stamping Device and Microstructure Transfer Stamping Method Characterized by Forming a Fine Bump Pattern ..

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Aimechatec Ltd has filed a patent application for Microstructure Transfer Stamping Device and Microstructure Transfer Stamping Method Characterized by Forming a Fine Bump Pattern on Both Surfaces of a Substrate with High Precision and Pursuing the Improvement of Production. This invention was developed by Kurih..

Taiwan Patent Office Receives Ever Ohms Technology Co Ltd Patent Application for Chip Resistor and Method for Manufacturing the Same Capable of Optimizing the Heat Dissipation Effi..

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Taiwan Patent Office has received Ever Ohms Technology Co Ltd patent application for Chip Resistor and Method for Manufacturing the Same Capable of Optimizing the Heat Dissipation Efficiency in Operation. Zhan Qing-hui, Zeng Jing-yuan, Cai Feng-zhao, Guo Lian-teng, Guo Shu-wei and Li Hua-jun developed the inven..

State Intellectual Property Office of China Receives Nanjing Hengxinyuan Tech Co Ltd Patent Application for Airborne Intelligent Control Module Packaging Method Based on Sip Techno..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has received Nanjing Hengxinyuan Tech Co Ltd patent application for Airborne Intelligent Control Module Packaging Method Based on Sip Technology. Shi Yuan, Wang Caizheng, Guo Song, Lyu Chengmei and Hu Ting developed the invention. The patent application number is ..

Chengdu Yicheng Integrated Circuit Co Ltd Submits Chinese Patent Application for Packaging Structure and Packaging Method of Integrated Passive Device

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Chengdu Yicheng Integrated Circuit Co Ltd has submitted a patent application for Packaging Structure and Packaging Method of Integrated Passive Device. This invention was developed by Zhang Yongchao, Zhang Kang, Liu Qing and Qiu Yuling. The patent application number is CN202511609490 20251105. The patent pu..

State Intellectual Property Office of China Releases Jiangsu Runpeng Semiconductor Co Ltd Patent Application for Chip Packaging Equipment

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- State Intellectual Property Office of China has released Jiangsu Runpeng Semiconductor Co Ltd patent application for Chip Packaging Equipment. This invention was developed by Li Zhongqiu, Liang Qingqing and Cao Yongdi. The patent application number is CN202511297405 20250911. The patent publication number i..

Shanghai Wendao Yixin Tech Co Ltd Submits Chinese Patent Application for Switch Chip Architecture Supporting Ocp Oam

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Shanghai Wendao Yixin Tech Co Ltd has submitted a patent application for Switch Chip Architecture Supporting Ocp Oam. This invention was developed by Xie Xiaoyan and Yang Zongwei. The patent application number is CN202511537616 20251027. The patent publication number is CN121462532 (A). International Patent..

State Intellectual Property Office of China Releases Xi'an ESWIN Material Technology and Xi'an Eswin Silicon Wafer Technology Patent Application for Cleaning Device

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- State Intellectual Property Office of China has released Xi'an ESWIN Material Technology and Xi'an Eswin Silicon Wafer Technology patent application for Cleaning Device. This invention was developed by Cai Peifeng and Zhou Qinxue. The patent application number is CN202511659712 20251113. The patent publicat..

Shenzhen Chuanshida Tech Co Ltd, Hunan Xiangxin New Mat Co Ltd and Shenzhen Yunzaishang Semiconductor Mat Co Ltd Seek Patent for Semiconductor Electrostatic Chuck Polishing Equipm..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Shenzhen Chuanshida Tech Co Ltd, Hunan Xiangxin New Mat Co Ltd and Shenzhen Yunzaishang Semiconductor Mat Co Ltd have sought patent for Semiconductor Electrostatic Chuck Polishing Equipment. This invention was developed by Zhang Guihua, Liu Chang, Hu Binghuang, Yi Xiaonian and Liu Jinhao. The patent applic..

Jiangquan Semiconductor Ganzhou Co Ltd Applies for Patent on Lead Frame Automatic Tape Pasting Device for Semiconductor Device Manufacturing

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Jiangquan Semiconductor Ganzhou Co Ltd has applied Chinese patent for Lead Frame Automatic Tape Pasting Device for Semiconductor Device Manufacturing. Yin Guojiang, Dang Gaofei and Huang Hao developed it. The patent application number is CN202511691863 20251118. The patent publication number is CN121470274 ..

Northwest Electronic Equipment Tech Research Institute Second Research Institute Of China Electronic Submits Chinese Patent Application for Raw Ceramic Chip Lamination Device and M..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Northwest Electronic Equipment Tech Research Institute Second Research Institute Of China Electronic has submitted a patent application for Raw Ceramic Chip Lamination Device and Method Utilizing Electrostatic Adsorption. This invention was developed by Ma Shijie, Wei Jie, Sun Lina, Zhang Jiahuan, Li Wei and L..

Guixin Tech Shenzhen Co Ltd Seeks Patent for Point-to-point Broadcast and Discovery Method, Chip and User Equipment

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Guixin Tech Shenzhen Co Ltd has sought patent for Point-to-point Broadcast and Discovery Method, Chip and User Equipment. This invention was developed by Wang Shengjian, Zhao Yueying and Dai Jie. The patent application number is CN20241113952 20240726. The patent publication number is CN121462149 (A). Inter..

Zhongying Qingchuang Tech Co Ltd Files Chinese Patent Application for Signal Interference Suppression Processing Method for Network Communication Chip

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Zhongying Qingchuang Tech Co Ltd has filed a patent application for Signal Interference Suppression Processing Method for Network Communication Chip. This invention was developed by Qu Chenggang, Yu Dapeng, Jin Haoyang, Huang Wentao, Xu Jun and Wang Yinping. The patent application number is CN20261005433 20..

Shenzhen Lixin Semiconductor Co Ltd Submits Chinese Patent Application for Method and Circuit for Realizing Constant Power Output of ADC (analog to Digital Converter) and Atomizati..

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Shenzhen Lixin Semiconductor Co Ltd has submitted a patent application for Method and Circuit for Realizing Constant Power Output of ADC (analog to Digital Converter) and Atomization Control Chip. This invention was developed by Zhu Xiaoan, He Guojun, Chen Wei, Zhang Ding and Liu Xiyuan. The patent applicat..

Suzhou Mingyi Microelectronic Tech Co Ltd Submits Chinese Patent Application for Multi-grid Distributed Driving Structure of GaN Chip and Switching Circuit Unit

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Suzhou Mingyi Microelectronic Tech Co Ltd has submitted a patent application for Multi-grid Distributed Driving Structure of GaN Chip and Switching Circuit Unit. This invention was developed by Cai Zhonghua and Mo Haifeng. The patent application number is CN202511984222 20251226. The patent publication numb..

3peak Incorporated Submits Patent Application for On-off Control Circuit and Chip for Hall Device

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- 3peak Incorporated has submitted a patent application for On-off Control Circuit and Chip for Hall Device. Weng Weixuan developed the invention. The patent application number is CN202511563255 20251029. The patent publication number is CN121461952 (A). International Patent Classification code is H03K17/14. ..

Suzhou Zhongxing Huichuang Tech Co Ltd Files Chinese Patent Application for Spraying Hole Structure, Spraying Hole Chip Comprising Spraying Hole Structure and Ink-jet Printing Head

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Suzhou Zhongxing Huichuang Tech Co Ltd has filed a patent application for Spraying Hole Structure, Spraying Hole Chip Comprising Spraying Hole Structure and Ink-jet Printing Head. This invention was developed by Fu Weixin. The patent application number is CN20261018282 20260108. The patent publication numbe..

Xian Aerospace Huayang Mech And Electrical Equipment Co Ltd Seeks Patent for Mesh Type Drying Device and Drying Method for Flexographic Printing Substrate

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Xian Aerospace Huayang Mech And Electrical Equipment Co Ltd has sought patent for Mesh Type Drying Device and Drying Method for Flexographic Printing Substrate. This invention was developed by Shi Longfei, Chen Long, Li Yu, Wang Rui, Wang Jianlin, Yang Zhijiang, Zhang Danyang and Cheng Pan. The patent appli..

Anli Tech Suzhou Co Ltd Files Chinese Patent Application for Continuous Polishing Equipment Using Silicon Carbide Substrate Polishing Solution

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Anli Tech Suzhou Co Ltd has filed a patent application for Continuous Polishing Equipment Using Silicon Carbide Substrate Polishing Solution. This invention was developed by Dong Qiang, Cao Yin and Qian Zhihao. The patent application number is CN202511986511 20251226. The patent publication number is CN1214..

State Intellectual Property Office of China Publishes Changdian Microelectronics Jiangyin Co Ltd Patent Application for Wafer Thinning Method, Grinding Control Device and Related E..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- State Intellectual Property Office of China has published Changdian Microelectronics Jiangyin Co Ltd patent application for Wafer Thinning Method, Grinding Control Device and Related Equipment. The invention was developed by Hua Yongchun. The patent application number is CN202511913202 20251217. The patent ..

Dragonstate Technology Co Ltd Submits Patent Application for Bipolar Plate and Method for Manufacturing the Same Wherein the Bipolar Plate Comprises a Metal Substrate and Two Silic..

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Dragonstate Technology Co Ltd has submitted a patent application for Bipolar Plate and Method for Manufacturing the Same Wherein the Bipolar Plate Comprises a Metal Substrate and Two Silicone Sealing Layers to Realize Automatic Production and Reduce the Production Cost of the Bipolar Plate. Cheng Lei developed ..

Hangzhou Tongling Information Tech Co Ltd Submits Chinese Patent Application for Setting Method of Robot NFC Chip Intelligent Body

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Hangzhou Tongling Information Tech Co Ltd has submitted a patent application for Setting Method of Robot NFC Chip Intelligent Body. This invention was developed by Yang Chenliang. The patent application number is CN202511294792 20250911. The patent publication number is CN121463006 (A). International Patent..

Taiwan Patent Office Releases Fly Sky Innotech Inc Patent Application for Semiconductor Package Structure

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Taiwan Patent Office has released Fly Sky Innotech Inc patent application for Semiconductor Package Structure. This invention was developed by Chen Shih-chi. The patent application number is TW20230141586 20231030. The patent publication number is TW202518699 (A). International Patent Classification codes ar..

Taiwan Patent Office Receives Lingsen Precision Ind Ltd and Sooner Power Semiconductor Co Ltd Patent Application for Chip Packaging Structure and Method for Manufacturing Air Chamb..

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Taiwan Patent Office has received Lingsen Precision Ind Ltd and Sooner Power Semiconductor Co Ltd patent application for Chip Packaging Structure and Method for Manufacturing Air Chamber That Protects Chip Functional Area Wherein the Chip Packaging Structure Includes a Substrate, a Chip Fixed to the Substrate, ..

AG Materials Technology Co Ltd Submits Taiwan Patent Application for Die Bonding Structure and Method of Manufacturing the Same

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- AG Materials Technology Co Ltd has submitted a patent application for Die Bonding Structure and Method of Manufacturing the Same. This invention was developed by Chuang Tung-han, Tsai Hsing-hua and Chou Chung-hsin. The patent application number is TW20230143982 20231115. The patent publication number is TW20..

Jinsanjiang Zhaoqing Silicon Mat Company Limited Submits Patent Application for Preparation Method of Silicon Dioxide for High-transparency and High-dispersion Pe Anti-blocking Age..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- Jinsanjiang Zhaoqing Silicon Mat Company Limited has submitted a patent application for Preparation Method of Silicon Dioxide for High-transparency and High-dispersion Pe Anti-blocking Agent. Yang Mengying, Huang Min, He Jinli, Wei Yanying, Lyu Fei and Huang Dan developed the invention. The patent applicati..

Adeia Semiconductor Bonding Technologies Inc Files Taiwan Patent Application for Conductive Materials for Direct Bonding

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Adeia Semiconductor Bonding Technologies Inc has filed a patent application for Conductive Materials for Direct Bonding. This invention was developed by Theil Jeremy Alfred, Uzoh Cyprian Emeka, Gao Guilian, Haba Belgacem and Mirkarimi Laura Wills. The patent application number is TW20240119238 20240524. The ..

Suzhou Dasheng Tech Co Ltd Submits Patent Application for Directive MEMS Microphone, Beam Forming Method and Device, and Electronic Equipment

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Suzhou Dasheng Tech Co Ltd has submitted a patent application for Directive MEMS Microphone, Beam Forming Method and Device, and Electronic Equipment. Fan Dashen developed the invention. The patent application number is CN20261001152 20260104. The patent publication number is CN121462957 (A). International ..

Beijing Hongtu Semiconductor Co Ltd Applies for Patent on Image Reconstruction Method, Image Sensor and Terminal Equipment

Semiconductor

| Mon 01 Jun 2026

Beijing, June 1 -- Beijing Hongtu Semiconductor Co Ltd has applied Chinese patent for Image Reconstruction Method, Image Sensor and Terminal Equipment. Zhang Wei, Zhang Mingfeng and Liu Wei developed it. The patent application number is CN202511625829 20251107. The patent publication number is CN121462894 (A). International P..

State Intellectual Property Office of China Releases Funing Xiexin Photovoltaic Tech Co Ltd Patent Application for Adjusting Device for Grooving of Photovoltaic Silicon Wafer Guide..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- State Intellectual Property Office of China has released Funing Xiexin Photovoltaic Tech Co Ltd patent application for Adjusting Device for Grooving of Photovoltaic Silicon Wafer Guide Wheel. This invention was developed by Zhou Wenguang, Shi Cunzhen and Zhang Xiang. The patent application number is CN20251..

State Intellectual Property Office of China Releases Xinjiang Hesheng Silicon Industry New Mat Co Ltd Patent Application for Green Preparation Method of Super-hydrophobic Super-ole..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- State Intellectual Property Office of China has released Xinjiang Hesheng Silicon Industry New Mat Co Ltd patent application for Green Preparation Method of Super-hydrophobic Super-oleophylic Silicon Dioxide Modified Organic Silicon Coating. This invention was developed by Qu Longxue, Luo Yedong, Liu Shaolong,..

State Intellectual Property Office of China Receives Zhongke Micro New Mat Shenzhen Co Ltd Patent Application for Fluorine-free Super-hydrophobic Coating Based on Organic Silicon M..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- State Intellectual Property Office of China has received Zhongke Micro New Mat Shenzhen Co Ltd patent application for Fluorine-free Super-hydrophobic Coating Based on Organic Silicon Modified Polyurea and Preparation Method of Fluorine-free Super-hydrophobic Coating. Yao Simeng and Wang Wanyang developed the i..

State Intellectual Property Office of China Receives Anhui Hemei Material Tech Co Ltd Patent Application for High-stress-resistance Pmma (polymethyl Methacrylate) Composite Film, P..

Semiconductor

| Sun 31 May 2026

Beijing, June 1 -- State Intellectual Property Office of China has received Anhui Hemei Material Tech Co Ltd patent application for High-stress-resistance Pmma (polymethyl Methacrylate) Composite Film, Preparation Method and Flexible OLED (organic Light Emitting Diode) Device. Xu Lei, Qian Qinglan, Zhang Xue, Li Chenglong and Wa..

Freiberger Compound Mat GmbH Submits Taiwan Patent Application for Method for the Production of a Iii-v Substrate, in Particular a Gaas and Inp Substrate

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Freiberger Compound Mat GmbH has submitted a patent application for Method for the Production of a Iii-v Substrate, in Particular a Gaas and Inp Substrate. This invention was developed by Fliegel Wolfram, Scheffer-czygan Max, Deutsch Denny, Weinert Berndt, Dietrich Marc and Eichler Stefan. The patent applica..

Beijing Sevenstar Huachuang Integrated Circuit Equipment Co Ltd Applies for Patent on Wafer Boat Transferring Device

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Beijing Sevenstar Huachuang Integrated Circuit Equipment Co Ltd has applied Taiwan patent for Wafer Boat Transferring Device. Zhang Wen-ping and Pan Zhong-huai developed it. The patent application number is TW20240138826 20241011. The patent publication number is TW202518655 (A). International Patent Classif..

Jiangsu Alpha Semiconductor Equipment Co Ltd Submits Taiwan Patent Application for Gas Distribution Method Applied to Wafer Processing Equipment

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Jiangsu Alpha Semiconductor Equipment Co Ltd has submitted a patent application for Gas Distribution Method Applied to Wafer Processing Equipment. This invention was developed by Chen Jia-wei. The patent application number is TW20240151356 20241227. The patent publication number is TW202518645 (A). Internati..

Hermes Epitek Corp Submits Taiwan Patent Application for Heating Apparatus and Pretrement Method for Wafer

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Hermes Epitek Corp has submitted a patent application for Heating Apparatus and Pretrement Method for Wafer. This invention was developed by Gwo Shang-jr and Chang Ching-wen. The patent application number is TW20230139610 20231017. The patent publication number is TW202518619 (A). International Patent Classi..

Taiwan Patent Office Receives Suzhou Zhenkun Technology Co Ltd Patent Application for Semiconductor Chip Packaging Method for Reducing Cutting Burrs and Lead Frame Thereof

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Taiwan Patent Office has received Suzhou Zhenkun Technology Co Ltd patent application for Semiconductor Chip Packaging Method for Reducing Cutting Burrs and Lead Frame Thereof. Zhou Xiao-jun and Tang Ji-ci developed the invention. The patent application number is TW20230141427 20231027. The patent publicatio..

Taiwan Patent Office Receives GVD Corp Patent Application for Surface Activated Chemical Vapor Deposition and Uses Thereof

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Taiwan Patent Office has received GVD Corp patent application for Surface Activated Chemical Vapor Deposition and Uses Thereof. Chen Benny, O'shaughnessy W Shannan and You Siheng Sean developed the invention. The patent application number is TW20240124599 20240701. The patent publication number is TW20251808..

Hefei Pinetech Electronics Co Ltd Submits Taiwan Patent Application for Integrated Chip with Calibration Function and Method for Calibrating Chip

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Hefei Pinetech Electronics Co Ltd has submitted a patent application for Integrated Chip with Calibration Function and Method for Calibrating Chip. This invention was developed by Zhang Jin-lei. The patent application number is TW20240149473 20241218. The patent publication number is TW202518048 (A). Interna..

Climax Technology Co Ltd Applies for Patent on Method and System of Adaptably Detecting Dirt, Occlusion and Smudge on Camera Lens and Image Sensor

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Climax Technology Co Ltd has applied Taiwan patent for Method and System of Adaptably Detecting Dirt, Occlusion and Smudge on Camera Lens and Image Sensor. Chen Yi-kai, Huang Chun-chi and Chang Wen-yi developed it. The patent application number is TW20230140983 20231026. The patent publication number is TW20..

Delfine Technology Co Ltd Submits Taiwan Patent Application for Wafer Horizontal Electroplating Clamp

Semiconductor

| Sun 31 May 2026

Taipei, June 1 -- Delfine Technology Co Ltd has submitted a patent application for Wafer Horizontal Electroplating Clamp. This invention was developed by He Zhi-gang and Liu Yi-xian. The patent application number is TW20240109841 20240316. The patent publication number is TW202517838 (A). International Patent Classification c..

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