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Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Memsic Semiconductor Wuxi Co Ltd has submitted a patent application for MEMS Gyroscope. This invention was developed by Williams Kete, Ling Fangzhou, Liu Yao and Jiang Leyue. The patent application number is CN202511946942 20251222. The patent publication number is CN121557978 (A). International Patent Clas..

Semiconductor

  |  Mon 08 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has released Changdian Biological Wafer Co Ltd patent application for Sensing Device Having Plurality of Sensing Regions and Sensing Method Using Plurality of Sensing Regions. This invention was developed by Guo Changfu, Li Xuanwo and Lin Bingxin. The patent appli..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Shanghai Pengxi Semiconductor Co Ltd has applied Chinese patent for Semiconductor Level Data Merging Method, Device and Equipment Based on Mergemap Structure. Su Zhou and Bai Zhoujie developed it. The patent application number is CN20261087247 20260122. The patent publication number is CN121560894 (A). Inte..

Semiconductor

  |  Mon 08 Jun 2026

Alexandria, June 9 -- Dnsimple Corp has applied United States patent for Domain Control Plane System and Method. Eden Anthony and Carletti Simone developed it. The patent application number is US202418964991 20241202. The patent publication number is US20260156097 (A1). International Patent Classification codes are G06F21/64 ..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Mitsubishi Chem Corp and National Institute for Materials Science have submitted a patent application for GaN Crystal and Method for Producing GaN Crystal. Odani Takafumi and Oshima Yuichi developed the invention. The patent application number is TW20240129721 20240808. The patent publication number is TW202..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Anhui University has submitted a patent application for 9t-sram (9 T-static Random Access Memory)-based Dual-bit-line Memory Internal Calculation Unit, Circuit and Chip. Peng Chunyu, Xu Shijie, Guo Jiating, Xiang Lubin, Gong Xiaobo, Li Zhihao, Li Taihao, Jiang Zili and Yang Ming developed the invention. The p..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has published Yuxian Microelectronic Guangzhou Co Ltd patent application for Multi-core Chip Wafer, Processing Method and Core Processing Chip. The invention was developed by Chen Zhengsheng, Luo Yong and Ji Xinwei. The patent application number is CN202511692417 ..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Shanghai Iluvatar Chip Semiconductor Co Ltd has submitted a patent application for Cache Structure, Cache Method, Chip and Electronic Equipment. This invention was developed by Wang Xiaojun. The patent application number is CN202511626094 20251107. The patent publication number is CN121560820 (A). Internati..

Semiconductor

  |  Tue 09 Jun 2026

Alexandria, June 9 -- Tokyo Electron has applied United States patent for Substrate Treatment System and Substrate Treatment Method. Tsuchiyama Masashi and Yamamoto Taro developed it. The patent application number is US202619454764 20260121. The patent publication number is US20260153808 (A1). International Patent Classificatio..

Semiconductor

  |  Tue 09 Jun 2026

Alexandria, June 9 -- Resonac has applied United States patent for Photosensitive Resin Film, Printed Wiring Board, and Semiconductor Package. Abe Kohei, Yukioka Ryo, Nojiri Takeshi, Miyasaka Masahiro and Sawamoto Hayato developed it. The patent application number is US202418855850 20240403. The patent publication number is US2..

Semiconductor

  |  Tue 09 Jun 2026

Alexandria, June 9 -- U.S. Patent and Trademark Office has received Resonac patent application for Photosensitive Resin Composition, Cured Product, and Semiconductor Element. Kawauchi Fumihiko, Fernandez Zapico Guillermo and Makino Tatsuya developed the invention. The patent application number is US202418859389 20240118. The pa..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Beijing ESWIN Computing Technology has sought patent for Chip Communication Interface, Chip System and Computer Readable Storage Medium. This invention was developed by Liu Chuanjun, Wang Zhikun, Liu Cheng and Chen Jian. The patent application number is CN202511774183 20251128. The patent publication number i..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Beijing Hongsi Electronic Tech Co Ltd has submitted a patent application for SPI Slave Controller and Chip. Zhang Wenjing, Lang Xiaoguang, Zhang Jianlong and Wang Xinlong developed the invention. The patent application number is CN20261076814 20260121. The patent publication number is CN121560789 (A). Inter..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has received Haiguang Information Technology patent application for Data Prefetching Method and Device and Chip. Pan Bukun developed the invention. The patent application number is CN202511746472 20251124. The patent publication number is CN121560781 (A). Internatio..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Beijing Xuanjie Technology has sought patent for Calling Monitoring Method and Device, Equipment, Medium and Chip. This invention was developed by Bai Shaokang, Zhen Shiquan, Liu Peng and Sun Zhaosheng. The patent application number is CN202511588187 20251031. The patent publication number is CN121560674 (A)...

Semiconductor

  |  Tue 09 Jun 2026

Alexandria, June 9 -- U.S. Patent and Trademark Office has released SK Hynix patent application for Controller for Performing Permanent Data Erase Operation and Operating Method Thereof. This invention was developed by Jin Byoung Min, Kwon Ku Ik and Hong Gyu Yeul. The patent application number is US202519297488 20250812. The pa..

Semiconductor

  |  Tue 09 Jun 2026

Alexandria, June 9 -- Micron Technology has submitted a patent application for Safe Area for Critical Control Data. Vlasov Aleksei, Evans Tim, Lauber John E, Morkre Larry and Willie Daniel B developed the invention. The patent application number is US202619460956 20260127. The patent publication number is US20260154001 (A1). In..

Semiconductor

  |  Tue 09 Jun 2026

Alexandria, June 9 -- Micron Technology has sought patent for Adjusted Rate Control in a Memory Sub-system. This invention was developed by Huang Ying and Liu Beichen. The patent application number is US202418966947 20241203. The patent publication number is US20260153988 (A1). International Patent Classification code is G06F3/..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has released Shenzhen Kemosi Intelligent Tech Co Ltd patent application for Storage Chip Compatibility Testing Method and Device and Medium. This invention was developed by Xia Junjie and Yang Xin. The patent application number is CN20261091304 20260123. The paten..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Jinan Maiwei Intelligent Tech Co Ltd has submitted a patent application for Information Statistics Circuit and Integrated Circuit. This invention was developed by Yan Chao, Yang Zuolin, Xing Zongqi and Yuan Tao. The patent application number is CN202511586770 20251031. The patent publication number is CN121..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Xi'an Unisoc Tech Co Ltd has sought patent for Abnormity Processing Method for Chip Platform. This invention was developed by Gao Jun. The patent application number is CN202511695501 20251118. The patent publication number is CN121560605 (A). International Patent Classification codes are G06F11/07 and G06N5..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has received Sugon Information Industry, Sugon Information Industry (Beijing) and Dawning Int Information Industry Co Ltd patent application for Abnormity Repair Method, Device and Equipment of Substrate Management Controller System, Medium and Program Product. Zheng..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has received Zhongdianke Jincang Beijing Technology patent application for Plug-in Memory Allocation Method and Device, Medium and Program Product. He Shupei and Li Xiang developed the invention. The patent application number is CN202511787684 20251128. The patent..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Institute of Computing Technology, CAS has submitted a patent application for Non-privacy and Privacy Reasoning Scheduling Method and Device Based on Reconfigurable Chip. This invention was developed by Lu Hang, Li Xiaowei and Li Fuping. The patent application number is CN202511635780 20251110. The patent pub..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Shenzhen Lulin Tech Co Ltd has filed a patent application for Multi-task Processing Oriented SOC Chip Server Computing Power Distribution Method. This invention was developed by Xiong Chunjing. The patent application number is CN202511523367 20251023. The patent publication number is CN121560510 (A). Intern..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Shanghai Pengxi Semiconductor Co Ltd has submitted a patent application for Method and System for Optimizing Rendering Performance of Display Interface of Semiconductor Device, Device and Medium. This invention was developed by Zhang Fei and Wu Yongxian. The patent application number is CN20261087243 202601..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Zhejiang Gewuzhizhi Biotechnology Co Ltd has submitted a patent application for Multi-mode Nerve Disease Diagnosis Chip and Method Based on Space-time Controllable Immune Response. This invention was developed by Zhang Haoyang, Gao Jinbo, Lu Caiting, Yang Baoling, Wu Jingjing, Xu Aihua and Zhang Dongliang. ..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has released The Spot Laboratory patent application for Tetrodotoxin Detection Method Based on Magnetic Control Micro-fluidic Chip. This invention was developed by Zhang Chenqi, Feng Shilun, Liu Bo, Wu Shuo and Zhang Peng. The patent application number is CN202511..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Huasheng Electronic Tech Kunshan Co Ltd has filed a patent application for Device for Detecting Performance of Surface Treating Agent for Electroplating. This invention was developed by Ye Yunqiang and Yuan Linhong. The patent application number is CN202511917545 20251218. The patent publication number is C..

Semiconductor

  |  Tue 09 Jun 2026

Alexandria, June 9 -- Micron Technology has filed a patent application for Plane Balancing in a Memory System. This invention was developed by Kane John J, Harris Byron D and Shivhare Vivek. The patent application number is US202619458566 20260123. The patent publication number is US20260154005 (A1). International Patent Classi..

Semiconductor

  |  Tue 09 Jun 2026

Alexandria, June 9 -- U.S. Patent and Trademark Office has received Intel patent application for Apparatus and Method for Configuring Operational Boundaries for Binned Processor Chips. Murphy Ingrid, Kandula Phani Kumar, Lee Pack Jason, Strapp Daniel, Lara Rivera Mario, Verma Pranjal, Sebastian Somu, Valiyakalayil Mohamed Mansoo..

Semiconductor

  |  Tue 09 Jun 2026

Alexandria, June 9 -- U.S. Patent and Trademark Office has published STMicroelectronics International NV patent application for Supply Control Circuit and Corresponding Device. The invention was developed by Ruta Marco, Tomaiuolo Francesco, Conte Antonino and Buono Luigi. The patent application number is US202519392874 20251118..

Semiconductor

  |  Tue 09 Jun 2026

Alexandria, June 9 -- U.S. Patent and Trademark Office has released NVIDIA patent application for Machine Perception. This invention was developed by Topan Sever Ioan, Leung Karen Yan Ming, Chen Yuxiao, Tupekar Pritish, Schmerling Edward Fu, Nilsson Hans Jonas, Cox Michael and Pavone Marco. The patent application number is US20..

Semiconductor

  |  Tue 09 Jun 2026

Alexandria, June 9 -- U.S. Patent and Trademark Office has published Hitachi High Technologies patent application for Semiconductor Device Manufacturing System. The invention was developed by Aramaki Tooru, Zhang Xicen, Kashiwagi Yuki, Kono Joji, Kakinuma Takefumi, Okayama Masataka and Saito Go. The patent application number ..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Nanjing University has filed a patent application for Terahertz Echo Wall Mode Waveguide on Light Control Chip. This invention was developed by Tu Xuecou, Gu Dingxuan and Rui Yunjie. The patent application number is CN202511620318 20251106. The patent publication number is CN121559772 (A). International Paten..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has published Jiangsu Changjiang Electronics Technology patent application for Optical Chip Packaging Structure and Preparation Method Thereof. The invention was developed by Zhou Shasha, Xia Shiwei, Zhang Cuicui and Ding Ke. The patent application number is CN20251..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Wuhan Yilut Tech Co Ltd has submitted a patent application for Microminiature Awg Chip Manufacturing Method and System. Qin Hui, Gao Dingshan and Lu Sicheng developed the invention. The patent application number is CN202610101352 20260126. The patent publication number is CN121559672 (A). International Pate..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has published Blumitek Electronic Shanghai Co Ltd patent application for Display Flash Point Eliminating Film with Micro-nano Structure and OLED Display Screen. The invention was developed by Liao Weijun, Yang Dongyu, Hou Aiquan and Liu Xiaoxin. The patent applica..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Shenzhen Xincun Tech Co Ltd has submitted a patent application for Control Method and Device for Improving Data Access Speed of Ddr (double Data Rate) Chip. This invention was developed by Zhang Bo. The patent application number is CN20261086617 20260122. The patent publication number is CN121560249 (A). In..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Beijing Xuanjie Technology has submitted a patent application for Chip Temperature Control Method and Device, Electronic Equipment, Chip and Storage Medium. Zhang Ben and Li Peng developed the invention. The patent application number is CN202511588148 20251031. The patent publication number is CN121560137 (A)..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has published Beijing Semiconductor Special Equipment Res Inst 45th Res Inst China Elec patent application for Temperature Control Device and Semiconductor Equipment. The invention was developed by Wang Chao, Li Jianhui, Guan Hongwu, Tian Shiwei, Zhao Hongyu and Li J..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Tuojing Chuangyi Shenyang Semiconductor Equipment has applied Chinese patent for Air Inlet Rate Control System and Method and Gas Supply Equipment. Wu Yue, Ju Zichen, Zhang Zhimin, Feng Peng and Zhang Youwei developed it. The patent application number is CN202511772419 20251127. The patent publication numbe..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- China FAW Group has sought patent for Time Synchronization Circuit Based on Double-SOC Chip Architecture and Vehicle. This invention was developed by Li Qing. The patent application number is CN202511788755 20251130. The patent publication number is CN121559833 (A). International Patent Classification code ..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Meijie Semiconductor Equipment Wuxi Co Ltd has submitted a patent application for Method for Manufacturing Gray Scale Pattern on Wafer. This invention was developed by Yan Bo. The patent application number is CN20261014739 20260107. The patent publication number is CN121559818 (A). International Patent Clas..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has released Guangliwei Shanghai Tech Co Ltd patent application for Clock Frequency Self-adaption Test Method and Device, Readable Storage Medium and Chip. This invention was developed by Chang Wenlong, Tian Yihan and Li Zhaoyuan. The patent application number is ..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Guizhou Zhenhua Fengguang Semiconductor Co Ltd has filed a patent application for Design Method of Pin-free Chip Type Integrated Circuit Electrified Vibration Device and Clamp of Pin-free Chip Type Integrated Circuit Electrified Vibration Device. This invention was developed by Xiong Li, Liu Guangya, Liu Gangg..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has released Hangzhou Changchuan Technology patent application for Site Result Matching Method of Multi-row Pattern and Chip Testing Machine. This invention was developed by Bi Ran, Zhao Fei, Lu Jiaxing and Fang Qisheng. The patent application number is CN2025114388..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Gree Electric Appliances, Zhuhai has applied Chinese patent for Test Circuit and Chip. Su Lili, Liu Yiming, Li Chunyan and Liao Yongbo developed it. The patent application number is CN202511712097 20251120. The patent publication number is CN121559271 (A). International Patent Classification code is G01R31/26..

Semiconductor

  |  Mon 08 Jun 2026

Alexandria, June 9 -- Saphlux LLC has submitted a patent application for Mechanisms for Fabricating Micro-leds. Chen Chen and Song Jie developed the invention. The patent application number is US202519385030 20251110. The patent publication number is US20260156990 (A1). International Patent Classification codes are H10H20/825..

Semiconductor

  |  Mon 08 Jun 2026

Alexandria, June 9 -- U.S. Patent and Trademark Office has published Korea Photonics Technology Inst patent application for Light-emitting Device Having a Cavity Structure and Method of Manufacturing the Same. The invention was developed by Baek Jong Hyeob, Ryu Yung Ryel and Jeon Seong Ran. The patent application number is US..

Semiconductor

  |  Mon 08 Jun 2026

Alexandria, June 9 -- Gigadevice Semiconductor Shanghai Inc, Gigadevice Semiconductor Inc and Gigadevice Semiconductor Hefei Inc have submitted a patent application for Semiconductor Device and Method of Forming the Same. This invention was developed by Qian Meng, Li Xiaokang, Xu Yisheng, Luo Xiao and Feng Jun. The patent app..

Semiconductor

  |  Mon 08 Jun 2026

Alexandria, June 9 -- Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device. This invention was developed by Nakamura Kazutoshi. The patent application number is US202519368737 20251024. The patent publication number is US20260156918 (A1). International Patent Classifica..

Semiconductor

  |  Mon 08 Jun 2026

Alexandria, June 9 -- U.S. Patent and Trademark Office has published Nitelab Optoelectronics Co Ltd patent application for Gan-based Multi-light-zone LED Chip, Light Source Module, and Preparation Method Thereof. The invention was developed by Li Wenjie. The patent application number is US202519053676 20250214. The patent pub..

Semiconductor

  |  Mon 08 Jun 2026

Alexandria, June 9 -- U.S. Patent and Trademark Office has published Tower Semiconductor Ltd patent application for Powerless Event Monitor. The invention was developed by Roizin Yakov and Pikhay Evgeny. The patent application number is US202418967638 20241203. The patent publication number is US20260156924 (A1). Internationa..

Semiconductor

  |  Mon 08 Jun 2026

Alexandria, June 9 -- U.S. Patent and Trademark Office has released Toshiba and Toshiba Electronic Devices & Storage patent application for Semiconductor Device. This invention was developed by Nakamura Kazutoshi. The patent application number is US202519369796 20251027. The patent publication number is US20260156919 (A1). In..

Semiconductor

  |  Mon 08 Jun 2026

Alexandria, June 9 -- Panjit Semiconductor Xuzhou Co Ltd has sought patent for Semiconductor Package Structure. This invention was developed by Fang Ting Yu, Wei Bing, Wan Cuifeng, Ho Chung Hsiung, Wang Yung-hui and Wu Jeng Sian. The patent application number is US202519040215 20250129. The patent publication number is US2026..

Semiconductor

  |  Mon 08 Jun 2026

Alexandria, June 9 -- Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device and Method for Manufacturing Same. This invention was developed by Onzuka Shinji. The patent application number is US202619457007 20260122. The patent publication number is US20260157135 (A1). In..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Tianjin Lilin Bit Co Ltd has filed a patent application for Novel Roller Bit with Buffer Structure. This invention was developed by Li Zhaoxi, Zhang Yingtao and Sun Qingwei. The patent application number is CN202511738038 20251125. The patent publication number is CN121556791 (A). International Patent Class..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Epistar has submitted a patent application for Semiconductor Device. Hsu Chi-shiang, Chiang Tsung-hsun, Lin Yi-hung and Chen Chao-hsing developed the invention. The patent application number is TW20230151562 20231229. The patent publication number is TW202527339 (A). International Patent Classification codes..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Semiconductor Manufacturing has applied Taiwan patent for Semiconductor Structure. Kuo Chun-tsung, Hsu Hung-wen and Lu Jiech-fun developed it. The patent application number is TW20240107485 20240301. The patent publication number is TW202527336 (A). International Patent Classification codes are H01L23/4..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan-Asia Semiconductor has filed a patent application for Integrated Circuit. This invention was developed by Lai Wen-tsung and Lin Kun-de. The patent application number is TW20230151166 20231227. The patent publication number is TW202527335 (A). International Patent Classification codes are H01L21/98 and..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Nanya Technology has filed a patent application for Semiconductor Device. This invention was developed by Lin Ding-lun and Chen Kie-dong. The patent application number is TW20250107364 20230510. The patent publication number is TW202527331 (A). International Patent Classification codes are H01L21/027 and H01..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Semiconductor Device and Method of Forming the Same. This invention was developed by Cheng Kai-fang and Chang Hsiao-kang. The patent application number is TW20240104188 20240202. The patent publication number is TW202527328 (A). Internat..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Semiconductor Manufacturing has filed a patent application for Contact Structure and Manufacturing Method Thereof. This invention was developed by Wen Ke-gang, Wu Yu-bey, Chen Hsin-feng, Hsiao Tsung-chieh, Chiu Chih-pin and Wang Liang-wei. The patent application number is TW20240118705 20240521. The pat..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Semiconductor Manufacturing has applied Taiwan patent for Integrated Device and Method of Forming Same. Chen Yu-chun, Hsu Wei-cheng, Huang Kuan-chieh, Shih Hung-ling, Wang Chen-jong and Yaung Dun-nian developed it. The patent application number is TW20240105634 20240217. The patent publication number is..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Patent Office has released Taiwan Semiconductor Manufacturing patent application for Electronic Device and Manufacturing Method Thereof. This invention was developed by Lo Ting-ya, Lee Cheng-chin, Lee Shao-kuan, Huang Hsin-yen and Chang Hsiao-kang. The patent application number is TW20240104902 20240207..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Nanya Technology has applied Taiwan patent for Semiconductor Device Having at Least One Air Gap and Method for Manufacturing the Same. Lin Yuan-yuan developed it. The patent application number is TW20240106299 20240222. The patent publication number is TW202527324 (A). International Patent Classification cod..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Amazing Cool Tech Corporation has submitted a patent application for Advanced Semiconductor Device Capable of Solving Problems Such as Leakage Current and Increased Resistance Caused by the Circuit Miniaturization in Semiconductor Device. This invention was developed by Tsai Hsien-tsung, Shih Yang-ming and Hsu ..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Semiconductor Manufacturing has sought patent for Integrated Circuit and Manufacturing Method Thereof. This invention was developed by Datye Isha, Vaziri Sam and Bao Xinyu. The patent application number is TW20240105022 20240207. The patent publication number is TW202527309 (A). International Patent Cla..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- United Microelectronics Corporation has submitted a patent application for Semiconductor Structure and Fabrication Method Thereof. This invention was developed by Chung Yao-hsien, Tsai Fu-yu and Tsai Bin-siang. The patent application number is TW20230149771 20231220. The patent publication number is TW202527..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Corintis Sa has submitted a patent application for Semiconductor Assemblies and Methods for Cooling a Semiconductor Assembly and a Method for Manufacturing a Semiconductor Assembly. This invention was developed by Fahrni Malik, Francescon Andrea and Van Erp Remco. The patent application number is TW202401249..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Semiconductor Manufacturing has sought patent for Semiconductor Package and Heat Dissipation Method Thereof. This invention was developed by Liu Shih-wei, Jiang Sing-da, Wu Tsun-yen and Yan Kathy Wei. The patent application number is TW20240120202 20240531. The patent publication number is TW202527300 (..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Patent Office has received AUO Corporation patent application for Semiconductor Structure and Manufacturing Method Thereof. Chen Fu-yang, Sun Shuo-yang, Hsieh Hao-lun, Chang Chun, Li Xiao-yun, Chang Yu-hao and Jhan Jhih-jhu developed the invention. The patent application number is TW20230150645 202312..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Integrated Circuit and Manufacturing Method Thereof. Datye Isha, Vaziri Sam and Bao Xinyu developed the invention. The patent application number is TW20240105635 20240217. The patent publication number is TW202527293 (A). International P..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Xsense Tech Corp has submitted a patent application for Thermal Dissipation Substrate Structure. This invention was developed by Huang Chorng-jye and Huang Chien-sheng. The patent application number is TW20230149313 20231218. The patent publication number is TW202527291 (A). International Patent Classificati..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Lintec has filed a patent application for Method for Manufacturing Semiconductor Device, Method for Determining Identity of Semiconductor Device, and System for Manufacturing Semiconductor Device. This invention was developed by Matsuno Sayaka and Takano Ken. The patent application number is TW20240141378 2024..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Patent Office has received Nanya Technology patent application for Method for Measuring Semiconductor Package. Hung Kuo-chiang developed the invention. The patent application number is TW20250111036 20230817. The patent publication number is TW202527275 (A). International Patent Classification codes are..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Patent Office has released Nuvoton Technology Japan patent application for Semiconductor Device and Semiconductor Module. This invention was developed by Taguchi Masahide and Yui Takashi. The patent application number is TW20240137707 20241003. The patent publication number is TW202527272 (A). Interna..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Chip Package Structure and Method for Forming the Same. Lan Chun-yen, Wang Yu-hsun, Wang Pu, Cheng Li-hui and Shih Ying-ching developed the invention. The patent application number is TW20240127045 20240719. The patent publication number..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Patent Office has received Taiwan Semiconductor Manufacturing patent application for Package Structure, Cooling Feature, and Method for Cooling Package Structure. Tsai Sheng-han, Chen Tsung-yu, Hung Wen-sen and Chen Yen-pu developed the invention. The patent application number is TW20240119996 20240530...

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Semiconductor Manufacturing has sought patent for Semiconductor Device and Methods of Forming Same. This invention was developed by Hung Chen-yen, Huang Chien-yuan and Ku Shih-chang. The patent application number is TW20240116662 20240506. The patent publication number is TW202527263 (A). International ..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Patent Office has received Taiwan Semiconductor Manufacturing patent application for Package Structure and Method for Forming the Same. Lan Chun-yen, Wang Yu-hsun, Wang Pu, Cheng Li-hui, Shih Ying-ching and Lin Yu-wei developed the invention. The patent application number is TW20240115662 20240426. The ..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Semiconductor Manufacturing has applied Taiwan patent for Semiconductor Package Structure, Wafer-level Semiconductor Structure and Methods of Forming the Same. Wang Jhih-yu, Wang Po-han, Hu Yu-hsiang and Kuo Hung-jui developed it. The patent application number is TW20240107422 20240301. The patent publi..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Patent Office has published Taiwan Semiconductor Manufacturing patent application for Integrated Package and Forming Method Thereof and Semiconductor Device. The invention was developed by Lin Yu-hung, Tsui Ren-fen, Yee Kuo-chung and Yu Chen-hua. The patent application number is TW20240106523 20240223. ..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Patent Office has published Taiwan Semiconductor Manufacturing patent application for Semiconductor Package and Manufacturing Method Thereof. The invention was developed by Liu Tzuan-horng, Su An-jhih and Weng Chung-ming. The patent application number is TW20240105564 20240216. The patent publication nu..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Semiconductor Manufacturing has applied Taiwan patent for Semiconductor Package and Method of Manufacturing the Same. Lien Yu-jen, Hsieh Cheng-chieh, Yu Chen-hua, Shen Ke-han and Kuo Hung-yi developed it. The patent application number is TW20240103706 20240131. The patent publication number is TW2025272..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Phoenix Pioneer Technology has filed a patent application for Method for Manufacturing Package Substrate. This invention was developed by Wang Ying-tung and Hsu Shih-ping. The patent application number is TW20230151203 20231228. The patent publication number is TW202527255 (A). International Patent Classificat..

Semiconductor

  |  Mon 08 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has published Central Glass and National Univ Corporation Yamaguchi Univ patent application for Transplanting Method, Culture Carrier Substrate, Package, Culture Carrier Substrate with Cell Sheet, Method for Producing Culture Carrier Substrate with Cell Sheet, Cryopr..

Semiconductor

  |  Mon 08 Jun 2026

Alexandria, June 9 -- Canon has submitted a patent application for Liquid Ejection Substrate, Liquid Ejection Head, and Method for Manufacturing Liquid Ejection Substrate. This invention was developed by Yaginuma Seiichiro. The patent application number is US202519408965 20251204. The patent publication number is US20260151998 ..

Semiconductor

  |  Mon 08 Jun 2026

Alexandria, June 9 -- NVIDIA has applied United States patent for Enhanced Object Identification Using One or More Neural Networks. Choi Jiwoong and Alvarez Lopez Jose Manuel developed it. The patent application number is US202519258563 20250702. The patent publication number is US20260154959 (A1). International Patent Classifi..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- State Intellectual Property Office of China has published JinHong Gas patent application for Parallel Pretreatment System and Method for Semiconductor Precursor Detection. The invention was developed by Wang Yitong and Yan Wei. The patent application number is CN202511712972 20251120. The patent publication n..

Semiconductor

  |  Tue 09 Jun 2026

Beijing, June 9 -- Wuxi Suoao Prec Valve Co Ltd has applied Chinese patent for Method for Testing Opening and Closing Response Time of Pneumatic Valve for Semiconductor. Tang Xiaodan and Lee Byung-geun developed it. The patent application number is CN202511888757 20251215. The patent publication number is CN121558337 (A). Int..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Nihon Micronics has filed a patent application for Electrical Connecting Apparatus. This invention was developed by Hasegawa Ken. The patent application number is TW20240133464 20240904. The patent publication number is TW202527629 (A). International Patent Classification codes are G01R1/04, G01R1/073 and H05K..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- ASTI Global, Taiwan has applied Taiwan patent for Chip Transferring and Bonding Device, Chip Bonding Device and Chip Transferring and Bonding Method. Liao Chien-shou developed it. The patent application number is TW20230149376 20231219. The patent publication number is TW202527628 (A). International Patent Cla..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Valqua has submitted a patent application for High Frequency Substrate and Method for Manufacturing High Frequency Substrate. This invention was developed by Okawa Koji, Ando Naohiro, Kanazawa Yukio and Saeki Atsuo. The patent application number is TW20240140007 20241021. The patent publication number is TW202..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Nitto Denko has submitted a patent application for Metal Core Substrate and Method of Producing the Metal Core Substrate. This invention was developed by Ikeda Takahiro and Shibata Shusaku. The patent application number is TW20240149408 20241218. The patent publication number is TW202527614 (A). International ..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Patent Office has published Kyocera patent application for Wiring Board and Semiconductor Device. The invention was developed by Itou Seiichirou, Gondo Iori and Harazono Masaaki. The patent application number is TW20240141569 20241030. The patent publication number is TW202527612 (A). International Pate..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Patent Office has received Kyocera patent application for Wiring Board and Semiconductor Device. Itou Seiichirou, Gondo Iori and Harazono Masaaki developed the invention. The patent application number is TW20240141566 20241030. The patent publication number is TW202527611 (A). International Patent Class..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Patent Office has received Kyocera patent application for Wiring Board and Semiconductor Device. Itou Seiichirou, Gondo Iori and Harazono Masaaki developed the invention. The patent application number is TW20240141567 20241030. The patent publication number is TW202527607 (A). International Patent Class..

Semiconductor

  |  Tue 09 Jun 2026

Taipei, June 9 -- Taiwan Patent Office has released Applied Materials patent application for Dual Channel Showerhead Conductance Optimization for Uniform Radial Flow Distribution. This invention was developed by Kumar Barath, Ayalasomayajula Neela, Suresh Sumesh and Pande Pratik. The patent application number is TW20240140805 2..
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