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Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- Chinese Patent for Automatic Waste Liquid Discharging System of Buffer Unit of Efficient Suction Filtration Device has been issued to Guangdong Zhongjia Detection Tech Co Ltd. This invention was developed by Cheng Huamin, Yu Qian, Cai Ping, Huang Ruqing and Xiao Yuduan.
The patent application number is CN20..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has received Fucai Optoelectronics Co Ltd patent application for Optoelectronic Semiconductor Device. Lin Junyu, Chen Yiming, Wang Yuqi, Wang Zhonghao and Qiu Yiyang developed the invention.
The patent application number is CN202610279257 20200807. The patent publ..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has received Jiangxi Qianzhao Photoelectric Co Ltd patent application for Epitaxial Structure, Preparation Method and Light Emitting Diode. Yang Tianzhi, Yuan Jian, Wang Yue, Cui Xiaohui, Wang Yedong, Li Minhua, He Jian and Liu Zhao developed the invention.
The pa..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Weijiu Suzhou Photoelectric Tech Co Ltd has applied Chinese patent for Antimony-based Oxygen Inhibition Algainp Red Light Micro-led Chip and Preparation Method Thereof. Huang Zhen, Yu Jiaqi and Zhong Guanlun developed it.
The patent application number is CN202610771740 20260601. The patent publication numbe..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has published Jiangsu Third Generation Semiconductor Research Inst Co Ltd patent application for Nitride Semiconductor Epitaxial Wafer, Preparation Method Thereof and Photoelectric Device. The invention was developed by Yan Qi'ang and Wang Guobin.
The patent appli..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Jiangsu Third Generation Semiconductor Research Inst Co Ltd has submitted a patent application for Nitride Semiconductor Epitaxial Wafer, Preparation Method Thereof and Photoelectric Device. Yan Qi'ang and Wang Guobin developed the invention.
The patent application number is CN202411983287 20241231. The pat..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Nanchang Kaixun Photoelectric Co Ltd has sought patent for Ada Modified Pi Gallium Arsenide Solar Cell and Preparation Method Thereof. This invention was developed by Duan Kaiyao, Zhang Mingzhi, Liu Bei, Wang Bin, Mi Wanli, Wang Xiangwu and Lee Joon-seung.
The patent application number is CN202610756294 202..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Wuhan Mindsemi Co Limited has submitted a patent application for Epitaxial Structure and Preparation Method Thereof, and Detector Chip and Preparation Method Thereof. Wei Sihang, Zhou Jianghao and Liu Wei developed the invention.
The patent application number is CN202610404716 20260330. The patent publicati..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has received TCL Zhonghuan New Energy Tech Co Ltd patent application for Preparation Method of P-type Polycrystalline Silicon Layer, Preparation Method of TBC Battery and TBC Battery. Wang Danping, Ye Wenlan and He Qiuxia developed the invention.
The patent applic..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Shenzhen Yuanshixin Intelligent Tech Co Ltd has submitted a patent application for Phase Focusing Image Sensor Capable of Suppressing Crosstalk and Image Acquisition Terminal. This invention was developed by Jung Young Woo, Zheng Jianhua, Du Shuhao and Gao Wei.
The patent application number is CN20261041610..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has published Geke Semiconductor Shanghai Co Ltd patent application for Manufacturing Method for Improving Yield of CMOS Image Sensor. The invention was developed by Wang Shaowei, Chen Lin, Wang Dong and Kang Jixiang.
The patent application number is CN20241193419..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has released Geke Semiconductor Shanghai Co Ltd patent application for Manufacturing Method of Semiconductor Device. This invention was developed by Wang Shaowei and Chen Lin.
The patent application number is CN202411934115 20241225. The patent publication number ..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Chengdu Weiguang Jidian Tech Co Ltd has submitted a patent application for Transverse Overflow Integrating Capacitor Pixel Structure, Preparation Method Thereof and Image Sensor. Zhou Yang and Wen Jianxin developed the invention.
The patent application number is CN202610377083 20260325. The patent publicati..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Dongbu Hitek Co Ltd has filed a patent application for Device Comprising Silicon Controlled Rectifier. This invention was developed by Kim Jong-min and Sun Rongxiang.
The patent application number is CN202510172775 20250217. The patent publication number is CN122318310 (A). International Patent Classificati..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has published Beijing University and Beijing Intellectual Property Operation Man Co Ltd patent application for Stacked Transistor and Preparation Method Thereof, Semiconductor Device and Electronic Equipment. The invention was developed by Peng Wanyue, Cheng Yuji, Wu..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- China Electric Power Research Inst Co Ltd has sought patent for Silicon Carbide Semiconductor Device Based on Modulation Region, Electronic Chip and Electronic Equipment. This invention was developed by Wen Jialiang, Zhou Wenguang, An Ning, An Yunlai, Yang Fei, Chen Guofu, Qin Hongrui, Zou Hongyu, Wu Pengfei a..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has received Wuyuan Semiconductor Tech Qingdao Co Ltd patent application for Epitaxial Wafer and Epitaxial Wafer Preparation Method. Cao Xuewen, Liu Chao, Gou Xuexin, Li Heng and Yang Lieyong developed the invention.
The patent application number is CN202610425140..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Taiwan Semiconductor Co Ltd has applied Chinese patent for Power Semiconductor Element. Li Yuelin and Hong Delin developed it.
The patent application number is CN202510400952 20250401. The patent publication number is CN122318224 (A). International Patent Classification codes are H10D64/20 and H10D8/00. Coo..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Geke Semiconductor Shanghai Co Ltd has applied Chinese patent for Forming Method of Semiconductor Device, Semiconductor Device and Image Sensor. Chen Lin, Hu Shuhuai and Fan Zhiying developed it.
The patent application number is CN202411958776 20241227. The patent publication number is CN122318222 (A). Inte..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has received Jiaxing Bovi Electronic Tech Co Ltd patent application for Chip Mounting Detection Method for Chip Mounter. Deng Ge developed the invention.
The patent application number is CN202610346594 20260320. The patent publication number is CN122318192 (A). In..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Xi'an Jubian Material Tech Co Ltd has submitted a patent application for High-thermal-conductivity and Phase-change Integrated Tr Assembly Heat Dissipation Box Body and Forming Mode. This invention was developed by He Yun.
The patent application number is CN202411947577 20241227. The patent publication numb..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Jiangsu Fulehua Power Semiconductor Research Inst Co Ltd has submitted a patent application for Preparation Method of Multilayer Aluminum-coated Ceramic Heat Sink Substrate for IGBT (Insulated Gate Bipolar Translator). This invention was developed by Gao Yuan, Jian Man, Zhang Tao, Wang Bin and Yang Luo.
The..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Wuhan Yunjing Zhichuang Ecological Tech Co Ltd has applied Chinese patent for Porous High-performance Porous Material Planting Substrate Loaded with Slow-release Nitrogen and Phosphorus and Preparation Method of Porous High-performance Porous Material Planting Substrate. Wei Qingyi and Qian Min developed it.
..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has released Harbin Institute of Technology, Henan Tanzhen Core Material Tech Co Ltd and Harbin Institute pf Technology Zhengzhou Advanced Research Institute patent application for Preparation Method of High-temperature-resistant Transparent Substrate Surface Circuit..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Huangshi Kejia Electronic Co Ltd has submitted a patent application for Circuit Board Clamping Plate for Integrated Circuit Manufacturing. This invention was developed by Han Yunrui, Cao Wenming, Zhan Zhuolin, Qiao Shijian, Cheng Xiaoqing and Gong Wenchun.
The patent application number is CN202610471755 202..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Jiangsu Dipuer Ind Co Ltd has submitted a patent application for Laminated Circuit Board Processing Device for Integrated Circuit Manufacturing and Processing Method Thereof. Huang Jiao and Cao Wansheng developed the invention.
The patent application number is CN202610465225 20260409. The patent publication..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has received Chengdu BOE Optoelectronics Technology and BOE Technology Group patent application for Display Substrate and Display Device. Xu Guanghua, Xu Yuanjie, Wei Yulong, Xie Taofeng and Zhang Daiying developed the invention.
The patent application number is C..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Amflux Holding BV has submitted a patent application for Double-contact Chip Card Module and Smart Card with Double-contact Chip Card Module. This invention was developed by Roesner Holger, Lo Joe and De Bruijn Erik.
The patent application number is CN20248076637 20241205. The patent publication number is C..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has published Simin Photonics Holding Co Ltd patent application for Photonic Integrated Circuit Structure. The invention was developed by Danham Eric.
The patent application number is CN20248076406 20241205. The patent publication number is CN122319383 (A). Intern..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has received Lem International SA patent application for Current Transducer Having Lead Frame Conductor and Sensor Chip for Circuit Board Mounting. Verneret Xavier and Gilioli Fabio developed the invention.
The patent application number is CN20248076413 20241202. ..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has awarded a patent to Xi'an Xingxun Lianmeng Culture Media Co Ltd for Sound Box Convenient to Move. Tian Tao and Tian Chao developed the invention.
The patent application number is CN202520256704U 20250218. The patent publication number is CN223755121 (U). Inter..
Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- Fujian Longsu Household Product Co Ltd has secured a patent on Efficient Cooling Device of Injection Molding Equipment. Wu Yaozhi, Zeng Shuixiu and Zeng Xiuhua developed the invention.
The patent application number is CN202520196008U 20250208. The patent publication number is CN223750188 (U). International ..
Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- Inner Mongolia Heguang New Mat Co Ltd has been granted a patent for Square Silicon Core Specification Changing Machine. Li Shuai, Wang Wangui, Liu Xiaoming and Wu Haixiao developed the invention.
The patent application number is CN202520182987U 20250206. The patent publication number is CN223749954 (U). Int..
Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- Qingdao Fangxu Tech Development Co Ltd has been granted a patent for Full-automatic Chamfering Machine for Sapphire Wafer Plane Machining. Xiao Di, Zhang Yanyu and Meng Fanqi developed the invention.
The patent application number is CN202520182715U 20250206. The patent publication number is CN223749953 (U)...
Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- Chinese Patent for Full-automatic Compression Molding Die for Silicon Oxide Plate has been issued to Nantong Zhongye Hydraulic Press Machine Co Ltd. This invention was developed by Qiang Sheng, Ding Can, Wu Xuan and Li Xiaohong.
The patent application number is CN202422634243U 20241030. The patent publicati..
Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- Chinese Patent for Cutting and Chip Collecting Device for Shaving Board has been issued to Wanhua Ecological New Mat Chenzhou Co Ltd. This invention was developed by Jin Jianqian, Guo Gang and Ran Xiaofeng.
The patent application number is CN202520259239U 20250218. The patent publication number is CN2237498..
Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- Huizhou Shunli Sporting Goods Co Ltd has received a patent for Bee Silicon Air Column Three-dimensional Protection Lining and Helmet. This invention was developed by Liang Zebiao.
The patent application number is CN202520618981U 20250403. The patent publication number is CN223745837 (U). International Paten..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Wofu Semiconductor Co Ltd has applied Chinese patent for Power Semiconductor Package. Lin Yusheng and Dez Geza developed it.
The patent application number is CN20248076021 20241121. The patent publication number is CN122319791 (A). International Patent Classification codes are H10W70/40 and H10W74/10. Coope..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has published Samsung Electronics and Beijing Samsung Telecom R&D Ct patent application for Context Interaction Method and Device and Memory Device. The invention was developed by Wang Weiwei, Xu Lixiang and Wang Hong.
The patent application number is CN2026104671..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has published Chengdu BOE Optoelectronics Technology and BOE Technology Group patent application for Display Substrate and Display Device. The invention was developed by Xu Qian, Song Jiang, Hu Ming and Wu Jianpeng.
The patent application number is CN20248002459 2..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has published Novel Crystal Tech Inc patent application for Method for Manufacturing Semiconductor Device and Semiconductor Device. The invention was developed by Fukuda Yusuke.
The patent application number is CN20248075946 20241122. The patent publication number..
Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- Chinese Patent for Buffer Positioning Mechanism has been issued to Guangdong Tianxing Measurement Tech Co Ltd. This invention was developed by Hong Jinlong and Zhu Kai.
The patent application number is CN202520324693U 20250227. The patent publication number is CN223749493 (U). International Patent Classific..
Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- Chengdu Vulcan Semiconductor Mat Co Ltd has been awarded a patent for Automatic Sand Blasting Equipment for Silicon Carbide Barrel. This invention was developed by Tian Yanqing, Li Yuyin, Zou Jun and Lan Chuanyu.
The patent application number is CN202520208452U 20250210. The patent publication number is CN2..
Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- Chinese Patent for Constant Volume Tank for Semiconductor Machine has been issued to Shanghai Yiding Tech Group Co Ltd. This invention was developed by Guo Wei.
The patent application number is CN202520248405U 20250217. The patent publication number is CN223749400 (U). International Patent Classification co..
Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- Chongqing Qingyun Additive Material Tech Co Ltd has been awarded a patent for Linear Cutting Tool for Metal Substrate. This invention was developed by Chen Shuang and Hu Song.
The patent application number is CN202520200658U 20250207. The patent publication number is CN223748715 (U). International Patent Cl..
Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has awarded a patent to Luohong Tech Zhuhai Co Ltd for Anti-falling Drill Bit Facilitating Chip Removal and Used for Aluminum Material Machining. Yang Qi and Liang Yan developed the invention.
The patent application number is CN202520201709U 20250208. The patent p..
Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- Xingyao Semiconductor Wuhan Co Ltd has been awarded a patent for Wafer Retaining Ring. This invention was developed by Yang Dong.
The patent application number is CN202422320179U 20240923. The patent publication number is CN223749359 (U). International Patent Classification codes are B24B37/32 and B24B53/01..
Semiconductor
| Sat 03 Oct 2026
Beijing, Oct. 3 -- Inner Mongolia Heguang New Mat Co Ltd has been awarded a patent for Square Silicon Core Polishing and Repairing Machine. This invention was developed by Li Shuai, Wang Wangui, Liu Xiaoming and Wu Haixiao.
The patent application number is CN202520182977U 20250206. The patent publication number is CN223749336..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Jingcan Photoelectric Guangdong Co Ltd has submitted a patent application for Chip, Semiconductor Packaging Structure and Packaging Method. This invention was developed by Zhang Jianping.
The patent application number is CN202610405102 20260331. The patent publication number is CN122318893 (A). Internationa..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has published Heilongjiang Huixin Semiconductor Co Ltd patent application for Semiconductor Packaging Structure and Semiconductor Chip. The invention was developed by Shan Lianyu, Feng Kexin, Zhong Shengrong, Xie Yingxi, Niu Bing, Hua Qing, Huang Hao, Sheng Shuang, F..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Ebersolic Inc has applied Chinese patent for Element Package, Package Substrate Including Same, and Method of Manufacturing Same. Kim Young-keun and Kim Hye-jin developed it.
The patent application number is CN202511966752 20251224. The patent publication number is CN122318891 (A). International Patent Clas..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Yuerun Integrated Circuit Shaoxing Co Ltd has submitted a patent application for Chip Packaging Structure and Chip Packaging Method. This invention was developed by Li Zongyi and Hu Minjia.
The patent application number is CN202610481512 20260413. The patent publication number is CN122318890 (A). Internatio..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Beijing Huafeng Jixin Electronics Co Ltd has submitted a patent application for Chip Plastic Packaging Method, Chip Plastic Packaging Structure and Chip Packaging Structure. This invention was developed by Yang Zezhong.
The patent application number is CN202610313987 20260316. The patent publication number ..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Heilongjiang Huixin Semiconductor Co Ltd has submitted a patent application for Packaging Method of Semiconductor Chip. This invention was developed by Shan Lianyu, Feng Kexin, Zhong Shengrong, Xie Yingxi, Niu Bing, Hua Qing, Huang Hao, Sheng Shuang, Feng Yuxiang, Zhang Chaoyi, Wen Jian and Han Yalin.
The p..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Advanced Semiconductor Engineering has submitted a patent application for Package Structure and Method of Manufacturing the Same. This invention was developed by Qiu Weizhen, Liao Yawen, Hong Fanting and Chen Renjun.
The patent application number is CN202510608608 20250513. The patent publication number is ..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- SJ Semiconductor has filed a patent application for Semiconductor Packaging Structure and Preparation Method Thereof. This invention was developed by Zhou Zuyuan and Zhang Hang.
The patent application number is CN202411940022 20241226. The patent publication number is CN122318885 (A). International Patent C..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has published Jinan Jingheng Electronics Co Ltd patent application for Formic Acid Vacuum Sintering Method for Improving Bonding Quality of Metalized Layer of Chip. The invention was developed by Liu Lianxiang, Yao Jianjun and Yan Tian.
The patent application numb..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- AVIC Fushida Tech Co Ltd has sought patent for High-reliability External-pressure-free Ultralow-void-rate Chip Vacuum Eutectic Welding Method. This invention was developed by Liu Biao, Luo Chi, Liu Shuai, Zhao Pengsen and Lei Jie.
The patent application number is CN202610392381 20260327. The patent publicat..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has received Zhengqi Power Tech Hangzhou Co Ltd patent application for Plastic Package Double-sided Heat Dissipation High-power Silicon Carbide Power Supply Module and Manufacturing Method Thereof. Qian Hangtong, Chen Xiufu, Duan Zhenpeng, Jiang Changwen, Yuan Xuhong..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has published Harbin Inst of Technology patent application for Signal Transmission Path Optimization Method for Integrated Radio Frequency Terminal Chip. The invention was developed by Wang Yang, Hu Jianjiang, Wu Tianhao, Wang Cong and Wang Qiaonan.
The patent app..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has published Zhengqi Power Tech Hangzhou Co Ltd patent application for Plastic Package Single-side Cooling Silicon Carbide Power Supply Module and Manufacturing Method Thereof. The invention was developed by Qian Hangtong, Chen Xiufu, Duan Zhenpeng, Jiang Changwen, ..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has released Tsinghua University and The 43th Research Inst of China Electronics Technology Group Corporation patent application for RDL Structure with Composite Inorganic Medium Embedded in TCV Ceramic Substrate and Preparation Method of Rdl Structure. This inventio..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Shennan Circuits Co Limited has applied Chinese patent for Package Substrate and Processing Method Thereof. Yu Chunhao, Wang Hao and Liu Xiaofeng developed it.
The patent application number is CN202610244535 20260228. The patent publication number is CN122318872 (A). International Patent Classification code..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Jian Mulinsen Photoelectric Co Ltd has filed a patent application for Substrate Capable of Reducing Cutting Metal Chips and Preparation Method Thereof. This invention was developed by Wang Xicheng, Xiao Linghua, Zhang Sheng, Yang Xiaoqiang, Liu Dehua and Li Qinyu.
The patent application number is CN20261041..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has released Prismlab 3D Tech Co Ltd patent application for Package Substrate, Chip Assembly Applicable to Package Substrate, and Preparation Method of Package Substrate. This invention was developed by Gao Bin, Zhao Yang, Liu Jie, Wang Pu, Hou Feng, Hao Yong and Wan..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Nanya Technology has applied Chinese patent for Semiconductor Device. Chiang Hsu developed it.
The patent application number is CN202511567665 20251030. The patent publication number is CN122318868 (A). International Patent Classification codes are H10B12/00, H10B80/00, H10W70/63 and H10W70/65. Cooperative ..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Jiangsu Pangu Semiconductor Tech Co Ltd has filed a patent application for Packaging Structure of Plastic Packaging Adapter Plate and Manufacturing Method Thereof. This invention was developed by Liu Su and Ma Shuying.
The patent application number is CN202610414866 20260331. The patent publication number i..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Suzhou Guoxian Innovation Tech Co Ltd has sought patent for Package Carrier, Preparation Method Thereof and Chip Packaging Structure. This invention was developed by Zhou Yanxu.
The patent application number is CN202610398169 20260330. The patent publication number is CN122318866 (A). International Patent C..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Forehope Semiconductor Ningbo Limited Co has sought patent for 2.5 D Substrate Packaging Structure and Preparation Method of 2.5 D Substrate Packaging Structure. This invention was developed by He Zhenghong.
The patent application number is CN202610757458 20260529. The patent publication number is CN1223188..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Forehope Semiconductor Ningbo Limited Co has filed a patent application for 2.5 D Substrate Packaging Structure and Preparation Method of 2.5 D Substrate Packaging Structure. This invention was developed by He Zhenghong.
The patent application number is CN202610757452 20260529. The patent publication number..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has received Suzhou Guoxian Innovation Tech Co Ltd patent application for Chip Packaging Structure and Manufacturing Method. Zhou Yanxu developed the invention.
The patent application number is CN202610410152 20260331. The patent publication number is CN122318863 ..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Nanjing Huatian Advanced Packaging Co Ltd has sought patent for Ultrathin 2.5 D Packaging Structure and Packaging Method Thereof. This invention was developed by Fu Dongzhi and Liu Weidong.
The patent application number is CN202610401768 20260330. The patent publication number is CN122318862 (A). Internatio..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Nanjing Huatian Advanced Packaging Co Ltd has submitted a patent application for 2.5 D Packaging Structure and Method Using Vertical Lead. This invention was developed by Fu Dongzhi and Liu Weidong.
The patent application number is CN202610401767 20260330. The patent publication number is CN122318861 (A). I..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has published Suzhou Guoxian Innovation Tech Co Ltd patent application for Chip Packaging Structure and Manufacturing Method. The invention was developed by Zhou Yanxu.
The patent application number is CN202610400917 20260330. The patent publication number is CN12..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Jiangsu Changjiang Electronics Technology has applied Chinese patent for Three-dimensional Packaging Structure and Forming Method Thereof. Xu Songhua, Xu Chen, Ding Ke and Qi Jin developed it.
The patent application number is CN202610348873 20260320. The patent publication number is CN122318859 (A). Interna..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Hangzhou Weiying Sensing Electronic Co Ltd has submitted a patent application for Substitutive Integrated Circuit Element and Preparation Method Thereof. Chi Hai, Zhang Xiaotian, Xu Zhenyu, Song Yawei and Song Xueqian developed the invention.
The patent application number is CN202411951271 20241226. The pat..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Shenzhen Union Memory Information System Co Ltd has submitted a patent application for Chip Packaging Method and Structure Beneficial to Heat Dissipation. Long Jianfei developed the invention.
The patent application number is CN202610490680 20260414. The patent publication number is CN122318842 (A). Interna..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Shenzhen Union Memory Information System Co Ltd has applied Chinese patent for Chip Packaging Method and Structure for Enhancing Heat Dissipation. Long Jianfei developed it.
The patent application number is CN202610490679 20260414. The patent publication number is CN122318841 (A). International Patent Class..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Shenzhen Shengweixu Technology has filed a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Wang Lihan and Wang Jinghao.
The patent application number is CN202610787286 20260603. The patent publication number is CN122318837 (A). International Patent ..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Zhejiang Liufang Semiconductor Tech Co Ltd has sought patent for Processing Method of Polycrystalline Silicon Carbide Wafer with High Thermal Conductivity. This invention was developed by Li Xiangxiang.
The patent application number is CN202610196470 20260211. The patent publication number is CN122318829 (A..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Wuyuan Semiconductor Tech Qingdao Co Ltd has submitted a patent application for Test Structure, Detection Method and System for Multi-layer Stacked Integrated Circuit. This invention was developed by Qi Xiaoyu, Chen Weiyu, Yan Tiancai, Sun Zhongyin, Wang Xin and Yang Lieyong.
The patent application number i..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- Wuhan Baizhen Semiconductor Tech Co Ltd has sought patent for Cantilever Type Clamping Device for Wafer Etching Processing. This invention was developed by Xiao Zhenfang and Wang Qingsong.
The patent application number is CN202610462395 20260409. The patent publication number is CN122318817 (A). Internation..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has published Sichuan Jiazhao Electronics Co Ltd patent application for Non-contact Supporting Equipment for Thin Wafer and Wafer Testing Method. The invention was developed by Zhong Xin, Miao Xiaobo and Zheng Donglai.
The patent application number is CN2026101551..
Semiconductor
| Sun 04 Oct 2026
Beijing, Oct. 3 -- State Intellectual Property Office of China has received Guangdong Jingci New Mat Co Ltd patent application for Electrostatic Chuck Using Aluminum-based Silicon Carbide Base and Preparation Method of Electrostatic Chuck. Tang Yongle, Chen Wenjie, Yang Ying, Li Guoming, Deng Qiyong, Hong Yuzhe and Chang Xinfeng..