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Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- Shenzhou Longxin Intelligent Tech Co Ltd has applied Chinese patent for Automatic Chip Testing Device. Chen Jianhao, Xiang Mei and Li Rui developed it. The patent application number is CN20261015905 20260107. The patent publication number is CN121522427 (A). International Patent Classification codes are G01..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- Guizhou Zhenhua Fengguang Semiconductor Co Ltd has submitted a patent application for Electrified Vibration Test Clamp for Surface-mounted Integrated Circuit with Pins. This invention was developed by Liu Guangya, Liu Ganggang, Yang Yun, Xia Zijin and Bao Qian. The patent application number is CN20251173415..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has published Henan Zhongke Qingneng Technology and Shenzhen Zhongke Qingchu Tech Co Ltd patent application for Whole Wafer Temperature Measurement Chip Batch Test Device and Automatic Test Method. The invention was developed by Ding Fei, Liu Nanchuan, Pan Weiwei, Zh..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has published Shanghai Institute Of Measurement and Testing Tech Co Ltd patent application for Accuracy Verification System and Method for Integrated Circuit Radiation Immunity Test System. The invention was developed by Li Jinlong, Wang Zhong, Zhang Lanju and Gui Bi..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- Shanghai GND Etech Co Ltd has submitted a patent application for Auxiliary Equipment for Semiconductor Chip Wafer Detection. Cui Wei developed the invention. The patent application number is CN20261049947 20260115. The patent publication number is CN121522218 (A). International Patent Classification codes a..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- Yangzhou Yicheng Tech Co Ltd has sought patent for Probe Platform for Semiconductor Detection. This invention was developed by Xiong Jiongsheng and Lai Shengxiong. The patent application number is CN202511358070 20250923. The patent publication number is CN121522204 (A). International Patent Classification ..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- Huasheng Electronic Tech Kunshan Co Ltd has submitted a patent application for Online Monitoring Device for Water Quality of Electroplating Bath. This invention was developed by Ye Yunqiang and Yuan Linhong. The patent application number is CN202511634200 20251110. The patent publication number is CN1215221..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Extreme Ultraviolet (EUV) Radiation Source Apparatus, EUV Lithography System, and Method for Generating Extreme Ultraviolet Radiation. Lu Chien-hsing, Tu Chih-chiang, Wen Chih-wei, Tseng Hsin-fu and Hsu Tzu Jeng developed the invention...

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Thin-film Transistors for Detecting Miniature Targets has been issued to Taiwan Semiconductor Manufacturing Co Ltd. This invention was developed by Lee Wei, Cheng Chung-liang, Liu Pei-wen, Su Ke-wei and Cheng Kuan-lun. The patent application number is US202217876920 20220729. The..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Semiconductor Device Structure with Magnetic Structure and Method for Forming the Same. This invention was developed by Chen Wei-chung and Wu Jun-yi. The patent application number is US202318512281 20231117. The patent publication nu..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Trench-type BEOL Memory Cell has been issued to Taiwan Semiconductor Manufacturing Co Ltd. This invention was developed by Chen Tzu-yu, Shih Sheng-hung and Tu Kuo-chi. The patent application number is US202217672382 20220215. The patent publication number is US12648149 (B2). Inte..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Sisnap Ab has been awarded a patent for 3D Semiconductor Detector System. This invention was developed by Danielsson Mats and Terenzi Luca. The patent application number is US202418669740 20240521. The patent publication number is US12645000 (B2). International Patent Classification codes are G01T1/24, H..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- Tinko Instr Suzhou Co Ltd has filed a patent application for Power Frequency Alternating Current Load Power Regulation Control Circuit Based on Multiple Silicon Controlled Rectifiers. This invention was developed by Fan Fan, Wu Xiaogang and Zhao Xueling. The patent application number is CN202311739400 20231..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Nanjing Weice Semiconductor Tech Co Ltd patent application for Normal-high Temperature Automatic Temperature Control Method for Probe Station for Semiconductor Test. Zhang Yonggang, Zhang Shiyan and Qin Lin developed the invention. The patent applicat..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Gain Cell Memory Device Using Enhanced Sensing Scheme and Methods for Operating the Same has been issued to Taiwan Semiconductor Manufacturing Co Limited. This invention was developed by Hsieh Wei Ting, Chen Kuen-yi, Ting Yu-wei, Ong Yi Ching and Huang Kuo-ching. The patent appli..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Memory Circuit and Method of Operating the Same. This invention was developed by Kao Yun-feng and Chiang Katherine H. The patent application number is US202418752079 20240624. The patent publication number is US12646550 (B2). Interna..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Pre-charger Circuit of Memory Device and Methods for Operating the Same. This invention was developed by Hamada Masaya, Hara Takumi and Yabuuchi Makoto. The patent application number is US202318331558 20230608. The patent publication..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- Shenzhen Maxking Electronic Co Ltd has submitted a patent application for Intelligent Household Multi-device Linkage Power Utilization Control Method Based on MOS Tube. This invention was developed by Wu Aihua. The patent application number is CN202511824010 20251205. The patent publication number is CN1215..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group has been granted a patent for Display Substrate and Driving Method Therefor, and Display Device. This invention was developed by Hu Yao, Li Ruoxiang, Chen Qian, Wang Feifan, Luo Guangshun, Sun Kuo and Ran Qifu. The patent application number..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- Shanghai Rongzhouxin Tech Co Ltd has filed a patent application for Compound Semiconductor Photoresist Stripping Liquid as Well as Preparation Method, Application and Cleaning Method Thereof. This invention was developed by Zhao Yong, Tai Qile and Han Fusen. The patent application number is CN202511863334 2..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Shanghai Xianfeng Tech Co Ltd patent application for Photoetching Alignment Mark, Chip and Photoetching Alignment Method for Preparation of Chip. This invention was developed by Chen Junhong, Gao Yongqiang, Tang Xinlu, Lin Zhengyi, Chen Zhihui and Li Yiy..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Chengdu Yicheng Integrated Circuit Co Ltd patent application for Workbench Mechanism for Controlling Warping Degree of Glass Substrate During Photoetching. Wang Yanhuan, Xiang Chen, Hu Xi, Jiang Junbo, Wu Yang and Zong Shibiao developed the invention. ..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- Ningbo All Semi Micro Electronics Equipment Co Ltd has filed a patent application for Substrate Operation Method of Spin Coating and Developing Equipment, Spin Coating and Developing Equipment and System. This invention was developed by Wang Hongming, Wang Chong, Hao Binrong, Shen Yunqing and Zhou Peng. The..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- Guangzhou China Star Optoelectronics Tech Co Ltd has filed a patent application for Array Substrate and Display Panel. This invention was developed by Li Jun and Hu Lei. The patent application number is CN202511843456 20251208. The patent publication number is CN121522926 (A). International Patent Classific..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Pro Micron GmbH has been granted a patent for Method for Controlling and/or Monitoring a Workpiece Machining Process. This invention was developed by Wunderlich Rainer and Dix Martin. The patent application number is US202118251419 20211027. The patent publication number is US12643197 (B2). International..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Xgiga Communication Tech Co Ltd patent application for Coupling Method for Improving High and Low Temperature Heat Effect and Silicon Optical Module. This invention was developed by Zhou Rui, Guo Siyuan and Zhu Ningning. The patent application number ..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- Guangbenwei Intelligent Tech Shanghai Co Ltd has sought patent for Photonic Device Based on Flexible Substrate and Design Method Thereof. This invention was developed by Zhang Rizhen and Cheng Tangsheng. The patent application number is CN202511579789 20251030. The patent publication number is CN121522804 (..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Jiaxing Jiasai Information Tech Co Ltd patent application for Forged Signal Identification and Alarm Method for Single Beidou Satellite Positioning Chip. Zhuang Min developed the invention. The patent application number is CN202511667355 20251114. The..

Semiconductor

  |  Fri 05 Jun 2026

Beijing, June 6 -- Shanghai Xihe Tech Co Ltd has sought patent for Laser Radar Chip and Detection Equipment. This invention was developed by Zhou Yi and Feng Dazeng. The patent application number is CN20261050178 20260115. The patent publication number is CN121522607 (A). International Patent Classification codes are G01S17/8..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been awarded a patent for Semiconductor Bonding Tool and Method of Operating the Same. This invention was developed by Yu Tzu-wei, Wang Ching-hung, Lin Yeong-jyh and Li Ching I. The patent application number is US202217664162 20220519. The patent publication ..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Semiconductor Package and Manufacturing Method Thereof. This invention was developed by Liu Zi-jheng, Yu Ting-yang, Lee Ming-tan and Kuo Hung-jui. The patent application number is US202217894084 20220823. The patent publication numbe..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has received a patent for Semiconductor Device Having an Inductor Disposed Within a First Bonding Layer and a Second Bonding Layer. This invention was developed by Chuang Harry-haklay, Huang Wen-tuo, Teng Li-feng, Wu Wei-cheng and Wang Yu-jen. The patent applicat..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Analog-cells-boundary Region with Buried Power Grid Segment, Semiconductor Device Including Same and Method of Manufacturing Same has been issued to Taiwan Semiconductor Manufacturing Co Ltd. This invention was developed by Syu Ming-cheng, Yang Yu-tao, Lu Chung-ting, Kang Po-zeng, K..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Wafer Transport Method and Apparatus. Hsiao Kai-hung, Jen Chi-chung, Shen Yu-chun, Kuo Yuan-cheng, Huang Chih-hsiung and Chiang Wen-chih developed the invention. The patent application number is US202318112980 20230222. The patent pu..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Structure and Formation Method of Device with Ferroelectric Layer. This invention was developed by Madia Oreste and Vellianitis Georgios. The patent application number is US202217732873 20220429. The patent publication number is US12..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Display Substrate with Sub-pixels of Different Shapes and Display Device has been issued to Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group. This invention was developed by Deng Jiangtao, Huang Yan, Yu Chi, Liu Biao, Cai Jianchang, Shu Xiaoqing and Zhang Yi. The ..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Electronic Chips with Surface Mount Component has been issued to Stmicroelectronics France and Stmicroelectronics Alps SAS. This invention was developed by Forest Jeremie, Knopik Vincent and Schwartz Laurent. The patent application number is US202117457203 20211201. The patent pu..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has received a patent for Trapping Layer for a Radio Frequency Die and Methods of Formation. This invention was developed by Cheng Yu-hung and Li Ching I. The patent application number is US202217869135 20220720. The patent publication number is US12648226 (B2). ..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Gate Patterning for Stacked Device Structure Using Self-assembled Monolayer. This invention was developed by Shih Che Chi, Chiu Tsungkai, Yang Ku-feng and Liao Szuya. The patent application number is US202318459952 20230901. The pate..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has received a patent for Method for Forming Semiconductor Device Structure. This invention was developed by Cheng Chia-yun and Chang I-ming. The patent application number is US202318315524 20230511. The patent publication number is US12648216 (B2). International..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has published Chongqing Huafeng Dijiete Printing Mat Co Ltd patent application for Lipophilic Alkali-soluble Resin, Preparation Method and Lithographic Printing Plate Photosensitive Resist. The invention was developed by Liu Siqi, Sha Yizhou, Liang Yong and Zheng Qic..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Changzhou Jianuo Silicone Co Ltd has submitted a patent application for Room-temperature Quick-drying Water-based Organic Silicon Resin and Preparation Method Thereof. This invention was developed by Hu Leijie, Hu Mengjin, Zhou Fuming and Cheng Yuhong. The patent application number is CN202511771734 2025112..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Tonghua Hongxin Abrasive Co Ltd has applied Chinese patent for Preparation Method of Silicon Carbide Granulation Powder. Mo Zhenghao, Wang Xia and Sun Baoquan developed it. The patent application number is CN202511614609 20251106. The patent publication number is CN121517220 (A). International Patent Classi..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has published Ningbo Jiangfeng Tongchuang Special Ceramic Tech Co Ltd patent application for Preparation Method of Large-size High-purity Compact Silicon Carbide Ceramic. The invention was developed by Yao Lijun, Gao Xiong and Liying Zhou. The patent application n..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Wei Zijian and Unimicron Technology patent application for Metallized Glass Substrate and Manufacturing Method Thereof. Wei Zijian developed the invention. The patent application number is CN202411104175 20240813. The patent publication number is CN12..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Quzhou Nabeixiao Quartz Tech Co Ltd patent application for Manufacturing Method of Synthetic Silicon Dioxide Powder. This invention was developed by Watabe Hiroyuki, Cheng Liqun and Chen Jiyuan. The patent application number is CN202511592196 20251103..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Hami Yizhou Zhengcheng Coal Sales Center has submitted a patent application for Composite Carbonaceous Reducing Agent for Silicon Smelting and Preparation Method Thereof. This invention was developed by Yan Zhengming. The patent application number is CN202511915945 20251218. The patent publication number is..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Hefei Huayu Semiconductor Co Ltd patent application for Pickup Device for Chip Testing. This invention was developed by Tian Chao. The patent application number is CN202511842498 20251209. The patent publication number is CN121516554 (A). Internationa..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Yangtze River Delta Optoelectronics Academy Of Peking Univ has filed a patent application for Reusable Electroplating Template as Well as Preparation Method and Application Thereof. This invention was developed by Zhu Rui, Huangfu Yiming, Li Xingying, Sha Rui and Wu Jiang. The patent application number is C..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Zhao Zhuo has submitted a patent application for Technical Method for Cleaning Surface of Non-oriented Silicon Steel Through Plasma in Laboratory. This invention was developed by Zhou Yanwen, Li Fuqiang, Ren Tingdong, Liu Xuming, Geng Zhiyu and Li Yiming. The patent application number is CN202511807265 2025..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Jiuyang Sunshine Pcb Tech Co Ltd has submitted a patent application for High-temperature Oxygen-free Plasma Stress Release Method for PCB Pattern Electroplating Clamping Film. This invention was developed by Su Wei and Song Xiuquan. The patent application number is CN202510547255 20250428. The patent public..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Beijing Integrated Circuit Equipment Innovation Center Co Ltd has sought patent for Process Chamber Protection Layer Preparation Method and Semiconductor Process Equipment. This invention was developed by Dong Yunhe, Du Songmo, Du Xian and Deng Yuan. The patent application number is CN202511767295 20251127...

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Nanchang Zhongwei Semiconductor Equipment Co Ltd has applied Chinese patent for Flow Guide Ring and Chemical Vapor Deposition Device. Pan Lin, Luo Jiahao, Xie Zhennan, Liu Congling, Guo Quanyong, Zhou Ning and Jiang Yong developed it. The patent application number is CN20261046542 20260114. The patent publi..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Wuxi Xinhan Electronic Tech Co Ltd has submitted a patent application for Cvd (chemical Vapor Deposition) Jet Gasification Device and Method for Improving Uniformity of Semiconductor Film. This invention was developed by Qian Qiang, Tang Jiancheng and Zheng Shaoping. The patent application number is CN20251..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Chongyi Zhangyuan Tungsten and Hunan University of Science and Technology patent application for Method for Removing Phosphorus and Silicon from Sodium Tungstate Solution. Zhang Xin, Yang Qiumin, Xu Guozuan, Zhang Longhui, Lin Liping, Mao Li and Fu Yu de..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Shandong Aobo Biotechnology Co Ltd has sought patent for Process for Preparing Mannitol by Taking Glucose as Substrate Through Efficient and Green Biological Method. This invention was developed by Cao Meng, Wang Shuhua, Gao Qiang, Hu Wei, Guo Yumeng and Zhang Tingting. The patent application number is CN20..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Shanghai Bonaiya Biotechnology Co Ltd has sought patent for Rapid Nucleic Acid Amplification Chip. This invention was developed by Mi Jun and Zhang Jieying. The patent application number is CN202310481279 20230428. The patent publication number is CN121518260 (A). International Patent Classification codes a..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Shenzhen Daofengning Tech Co Ltd has submitted a patent application for Preparation Method of High-thermal-conductivity Filler Modified Organic Silicon Pouring Sealant. This invention was developed by Huang Yingxue, Lu Jinbo and Deng Linlin. The patent application number is CN20251228102 20251230. The paten..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Tianfu Jiangxi Laboratory has filed a patent application for Binder Preparation Method, Binder, Positive Wafer Pole Piece and Wafer Semiconductor All-solid-state Battery. This invention was developed by Chen Hang, Chen Yu, Xiang Yong and Jiang Yan. The patent application number is CN202511563050 20251029. T..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Hubei Hangju Tech Co Ltd has submitted a patent application for Reusable Ablation-resistant Silicon Resin Heat-proof Coating and Preparation Method Thereof. This invention was developed by Xiang Shiping, Yin De, Huang Gengqiao, Qin Yi, Huang Yiyong, Wang Junxun, Wu Yi, Tian Kang, Xiao Yong and Chen Haiya. T..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Air Chongqing New Mat Co Ltd patent application for Isocyanate and Organic Silicon Composite Modified Epoxy Resin Closed Prime Paint and Preparation Method Thereof. This invention was developed by Liu Chaohui and Dong Xiyun. The patent application num..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Chc North Paint & Coatings Industry Res and Design Institute patent application for Water-based Thermal Insulation Coating Prepared Based on Hydrophobic Silicon Dioxide Aerogel and Preparation Method of Water-based Thermal Insulation Coating. Li Zhibao, ..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Fujian Yuanxiang New Mat Co Ltd has applied Chinese patent for Preparation Method of Special Silicon Dioxide Delustering Agent for UV Paint. Wang Fangke, Ding Jiannan, Tan Yuquan and Hu Fei developed it. The patent application number is CN20251251656 20251231. The patent publication number is CN121517954 (A..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Fujian Yuanxiang New Mat Co Ltd patent application for Preparation Method of High-transparency Silicon Dioxide Delustering Agent. This invention was developed by Wang Fangke, Ding Jiannan, Tan Yuquan and Hu Fei. The patent application number is CN2025..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Hesheng Silicon Ind Shanshan Co Ltd patent application for Light-weight High-flame-retardant Organic Silicon Composite Material and Preparation Method Thereof. Zhou Yijie, Wu Fei, Zhang Zhixiong, Zhou Jing, Zhang Xiangdong, Zhang Botao, Zhang Xiangchun, ..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Xinjiang Hesheng Silicon Industry New Mat Co Ltd has applied Chinese patent for Process Control Method for Producing High-temperature-resistant Organic Silicon Raw Rubber by Dynamic Vulcanization Method. Zhang Zhandong, Luo Yedong, Qu Longxue, Qin Wei, Liu Shaolong and Yang Zhenguo developed it. The patent ..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Zhejiang Zhenghe Silicon Mat Co Ltd has submitted a patent application for Phenyl Silicone Oil for Adjusting Stripping Force of Organic Silicon Release Agent and Preparation Method of Phenyl Silicone Oil. This invention was developed by Fang Wei, Xu Zhiliang, Yu Yangrong, Mao Xinxing and Wei Jiayong. The pa..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Guangdong Hanlin Material Tech Co Ltd and Qingyuan High Tech Park Tech Collaborative Innovation Institute Co Ltd patent application for Preparation Method of Fluorine-free Water Repellent Agent Based on Organic Silicon Modified Long-chain Alkyl Polyureth..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- MediaTek has been granted a patent for Semiconductor Package Using Substrate Block Integration. This invention was developed by Chen Wei-chih and Chen Shi-bai. The patent application number is US202318215830 20230629. The patent publication number is US12648497 (B2). International Patent Classification c..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- United States Patent for Light Emitting Component Array Substrate has been issued to AUO Corporation. This invention was developed by Tseng Wen-hsien and Pai Chia-hui. The patent application number is US202318399910 20231229. The patent publication number is US12648494 (B2). International Patent Classifica..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- Samsung Electronics has secured a patent on Semiconductor Package Including Buffer Chip Bonded to Memory Dies Using Wires. Lee Manho, Seo Jungmin, Shin Kwangseob, Choi Woosin and Choi Junghwan developed the invention. The patent application number is US202318206201 20230606. The patent publication number i..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Mitsubishi Electric for Semiconductor Device and Method of Manufacturing Semiconductor Device. Tanigaki Tsuyoshi developed the invention. The patent application number is US202118569607 20210623. The patent publication number is US12648473 (B2). Inte..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- Shinko Electric Industries has been granted a patent for Wiring Substrate. This invention was developed by Shirotori Toshiki, Hoshina Ryota and Nakamura Kenta. The patent application number is US202418403954 20240104. The patent publication number is US12648468 (B2). International Patent Classification cod..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- STMicroelectronics Grenoble 2 has been awarded a patent for Electronic Circuit. This invention was developed by Pulvermüller Corine-christine and Airault Pierre. The patent application number is US202318344253 20230629. The patent publication number is US12648466 (B2). Cooperative Patent Classification co..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- LG Innotek has been granted a patent for Circuit Board and Semiconductor Package Comprising Same. Kwon Myung Jae, Nam Sang Hyuck and Yeo Ki Su developed the invention. The patent application number is US202218293165 20220729. The patent publication number is US12648462 (B2). International Patent Classifica..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Microchip Technology for Integrated Circuit (ic) Package Including an Inductive Device Formed in a Conductive Routing Region. Martin Matthew, Chen Bomy and Kovats Julius developed the invention. The patent application number is US202318351591 2023071..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Juniper Networks Inc and Hewlett Packard Enterprise Company (HPE) for Semiconductor Package Enabling Reduction in Semiconductor Package Size. Kugel Valery, Ahmed Omar and Su Peng developed the invention. The patent application number is US202318165..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing Co Ltd for Thermal Dissipation in Power IC Using Pyroelectric Materials. Ong Yi Ching, Huang Kuo-ching and Chuang Harry-hak-lay developed the invention. The patent application number is US202217749418 20220520. Th..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Nanya Tech has secured a patent on Semiconductor Device Structure with Liner Layer Having Tapered Sidewall and Method for Preparing the Same. Huang Tse-yao developed the invention. The patent application number is US202519234594 20250611. The patent publication number is US12648433 (B2). International Pa..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Nanya Tech has been granted a patent for Semiconductor Device and Method for Fabricating the Same. Chuang Ying-cheng developed the invention. The patent application number is US202318398236 20231228. The patent publication number is US12648432 (B2). International Patent Classification codes are H10B12/00..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Samsung Electronics has been granted a patent for Semiconductor Devices. Kim Eunjung developed the invention. The patent application number is US202318382661 20231023. The patent publication number is US12648431 (B2). International Patent Classification code is H10B12/00. Cooperative Patent Classificatio..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing Co Ltd for Ferroelectric Structure Lining Conductive Interconnect Structure. Huang Kuo-ching, Chen Yu-sheng and Ong Yi Ching developed the invention. The patent application number is US202318326218 20230531. The p..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Nanya Tech has secured a patent on Semiconductor Structure Having Dielectric Liner and Method of Manufacturing the Same. Hsu Feng-wen developed the invention. The patent application number is US202318232837 20230811. The patent publication number is US12648429 (B2). International Patent Classification co..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- KIOXIA has been awarded a patent for Semiconductor Device. This invention was developed by Inden Tomoya. The patent application number is US202318184802 20230316. The patent publication number is US12648428 (B2). International Patent Classification codes are H10B80/00, H10W20/00, H10W20/40, H10W20/42, H1..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Flexible Mol And/or BEOL Structure has been issued to International Business Machines. This invention was developed by Anderson Brent A, Chu Albert M, Lanzillo Nicholas Anthony, Clevenger Lawrence A, Vega Reinaldo and Xie Ruilong. The patent application number is US202218083818 2..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- SK Hynix has obtained a patent for methods of manufacturing semiconductor devices including separation patterns. This invention was developed by Kim Myung Ok. The patent application number is US202318366684 20230808. The patent publication number is US12648421 (B2). International Patent Classification code..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing Co Ltd for Semiconductor Structure Having Vertical Conductive Graphene and Method for Forming the Same. Yeh Ching-fu, Chung Chin-lung, Li Shu-wei, Chan Yu-chen, Yang Shin-yi and Lee Ming-han developed the invention. ..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Beijing NAURA Microelectronics Equipment has been awarded a patent for Chuck Structure of Semiconductor Cleaning Apparatus and Semiconductor Cleaning Apparatus. This invention was developed by Xu Lu, Zhao Hongyu, Li Aibing and Zhang Songming. The patent application number is US202117910830 20210222. The pa..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Florida State University Research Foundation for Perovskite-sensitized Near-infrared-to-green Upconversion. Nienhaus Lea developed the invention. The patent application number is US202318471987 20230921. The patent publication number is US12648349 ..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- LG Chem has received a patent for Apparatus and Method for Evaluating Light Stability of Material for Organic Layer of Organic Light-emitting Element. This invention was developed by Yang Hak Kyun, Kim Jeonghyun, Lee Heejoo and Yoo Wonjong. The patent application number is US202118026176 20211116. The pa..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Micron Technology for Providing Recovered Data to a New Memory Cell at a Memory Sub-system Based on an Unsuccessful Error Correction Operation. Ratnam Sampath K, Rayaprolu Vamsi Pavan, Kaynak Mustafa N, Parthasarathy Sivagnanam, Muchherla Kishore Kuma..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- Micron Technology has obtained a patent for apparatuses and methods for refresh management entry timing. This invention was developed by Mizukane Yoshio. The patent application number is US202418743869 20240614. The patent publication number is US12645377 (B2). International Patent Classification code is G..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Winbond Electronics for Erase Method for Non-volatile Memory Device and Non-volatile Memory Device Using the Same. Huang Koying developed the invention. The patent application number is US202318334399 20230614. The patent publication number is US1264..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- Yangtze Memory Technologies has been awarded a patent for Memory Systems and Operation Methods Thereof to Improve Wear Leveling of a Memory Device. This invention was developed by Liu Jingsheng. The patent application number is US202218148799 20221230. The patent publication number is US12645365 (B2). Inte..

Semiconductor

  |  Sat 06 Jun 2026

Alexandria, June 6 -- Texas Instruments Incorporated has secured a patent on Static Power Reduction in Caches Using Deterministic Naps. Olorode Oluleye and Nourani Mehrdad developed the invention. The patent application number is US202418894180 20240924. The patent publication number is US12645283 (B2). International Patent Cla..

Semiconductor

  |  Sat 06 Jun 2026

Beijing, June 6 -- Tuojing Chuangyi Shenyang Semiconductor Equipment has submitted a patent application for High-concentration Ozone Generation System and Preparation Method. This invention was developed by Cai Dongpo, Song Yu and Gao Li. The patent application number is CN202511897591 20251216. The patent publication number ..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Method of Manufacturing Semiconductor Substrate and Method of Manufacturing Semiconductor Device has been issued to Mitsubishi Electric. This invention was developed by Hiza Shuichi and Nishimura Kunihiko. The patent application number is US202118265434 20210204. The patent publica..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Tokyo Electron for Substrate Transfer Method and Semiconductor Manufacturing System. Goto Ryota, Hirose Hiroshi, Suzuki Kiyoshi and Miyashita Koichi developed the invention. The patent application number is US202318842565 20230220. The patent publica..

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Tokyo Electron has been granted a patent for Liquid Supply Device, Liquid Supply Method, and Storage Medium. This invention was developed by Osada So, Okuda Katsuya, Iwanaga Naohiro and Kosai Kazuki. The patent application number is US202418917045 20241016. The patent publication number is US12648390 (B2)...

Semiconductor

  |  Fri 05 Jun 2026

Alexandria, June 6 -- Lam Research has secured a patent on Metal Etch. Fan Yiwen, Yang Wenbing, Lin Ran, Tan Samantha Siamhwa, Weidman Timothy William and Mukherjee Tamal developed the invention. The patent application number is US202118257085 20211206. The patent publication number is US12648381 (B2). International Patent Clas..
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