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Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has filed a patent application for Adjustable Mirror Arrangements for Process Chambers, and Related Methods and Apparatus. This invention was developed by Rastegar Abbas.
The patent application number is WO2025US49921 20251007. The patent publication number is WO2026135775 (A1). International..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has filed a patent application for Methods for Processing Substrates. This invention was developed by Chudzik Michael.
The patent application number is WO2025US48948 20251001. The patent publication number is WO2026135767 (A1). International Patent Classification codes are H10B80/00, H10W20/4..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Microchip Technology has filed a patent application for Semiconductor Device with Carrier Heat Sink. This invention was developed by Nagel Steve and Chen Bomy.
The patent application number is WO2025US32633 20250606. The patent publication number is WO2026135730 (A1). International Patent Classification code i..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Lam Research has filed a patent application for Seam-free Gapfill of Dielectric Films. This invention was developed by Chukwunenye Precious Oganihu, Ganesan Jeya Prakash, Ta Phuong Kim, Fan Yunshan, Austin Dustin Zachary and Mclaughlin Kevin.
The patent application number is WO2025US60434 20251218. The patent ..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Parker Hannifin has filed a patent application for Adhesive Compositions for Bonding Elastomer to Substrate. This invention was developed by Agag Tarek, Wheeler Paul and Sheffield John.
The patent application number is WO2025US60262 20251218. The patent publication number is WO2026136633 (A1). International Pa..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Micron Technology has filed a patent application for Memory Device with Multi-connection Mechanism for Combination Packages. This invention was developed by Lin Ying, Boo Kelvin, Lum Wen and Ng Hong.
The patent application number is WO2025US59501 20251212. The patent publication number is WO2026136176 (A1). In..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- SK Hynix Nand Product Solutions has filed a patent application for Devices and Systems for Immersion Cooling. This invention was developed by Boldrini Justin, Brand Jason and Rothman Timothy.
The patent application number is WO2025US57021 20251125. The patent publication number is WO2026135950 (A1). Internatio..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Qualcomm has filed a patent application for Package Comprising a Substrate with an Embedded Passive Device. This invention was developed by Buot Joan Rey Villarba, Patil Aniket and Wang Zhijie.
The patent application number is WO2025US56683 20251121. The patent publication number is WO2026135936 (A1). Internat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Realtek Semiconductor Corporation has filed a patent application for Decision Feedback Equalizer and Decision Feedback Equalization Method. This invention was developed by Yang Jun.
The patent application number is CN202411387973 20240930. The patent publication number is CN121770940 (A). International Patent..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- SK Hynix Nand Product Solutions has filed a patent application for Methods and Systems for Malicious Activity Detection and Prevention. This invention was developed by Cain Gamil A, Huard Ryan, Silveira Andre and Young Wilson.
The patent application number is WO2025US60645 20251219. The patent publication numb..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Oxford Ionics has filed a patent application for a Photonic Chip for an Ion Trap System. This invention was developed by Lewins Chris and Hong Seokjun.
The patent application number is WO2025GB52617 20251128. The patent publication number is WO2026132761 (A1). International Patent Classification codes are G02B..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- SCREEN Holdings has filed a patent application for Substrate Processing Method and Substrate Processing Apparatus. This invention was developed by Endo Toru and Kato Takuji.
The patent application number is WO2025JP42898 20251209. The patent publication number is WO2026134040 (A1). International Patent Classif..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Tokyo Electron has filed a patent application for Inspection and Measurement System and Inspection and Measurement Method. This invention was developed by Kim Hyejin, Asano Masafumi and Matsumoto Takashi.
The patent application number is WO2025JP42141 20251203. The patent publication number is WO2026133960 (A1..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Tohoku University has filed a patent application for Nonvolatile Integrated Circuit. This invention was developed by Yoshida Tomoo, Natsui Masanori and Hanyu Takahiro.
The patent application number is WO2025JP16173 20250428. The patent publication number is WO2026133592 (A1). International Patent Classificatio..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Infineon Technologies has filed a patent application for Power Semiconductor Module and Manufacturing Method Thereof. This invention was developed by Figge Jens.
The patent application number is CN202511325943 20250917. The patent publication number is CN121772827 (A). International Patent Classification code..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Infineon Technologies has filed a patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Gan Tai Ki, Zhu Guirong and Ng Chee Yang.
The patent application number is CN202511352305 20250922. The patent publication number is CN121772787 (A). Internationa..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Kokusai Electric has filed a patent application for Substrate Processing Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Program Article. This invention was developed by Hirano Makoto and Arita Haruki.
The patent application number is CN20251136774 20250725. The paten..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Taiwan Semiconductor Manufacturing has filed a patent application for Semiconductor Device. This invention was developed by Ding Yifeng and Zhang Yongting.
The patent application number is CN202511828643 20251205. The patent publication number is CN121772214 (A). International Patent Classification code is H1..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Realtek Semiconductor Corporation has filed a patent application for Linear Amplification Device and Linear Amplification Method Thereof. This invention was developed by Zeng Guanhao and Wang Baizhi.
The patent application number is CN202411367968 20240929. The patent publication number is CN121770476 (A). In..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Daicel has filed a patent application for Urethane Composition, Cured Product, Impact-resistant Adhesive, and Power Semiconductor Sealing Agent. This invention was developed by Maetsu Naritoshi and Fumioka Akito.
The patent application number is CN20248055220 20240821. The patent publication number is CN12177..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Intel has filed a patent application for Method and Apparatus for Improving Heat Dissipation and Mechanical Loading of Integrated Circuit Packages. This invention was developed by Lofgreen Kelly P, Kline Scott A, Petrini John B, Subramaniam Poobalan and Arrington Kenneth James.
The patent application number i..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received Texas Instruments patent application for Circuit Having Multiple Cascode Amplifiers and Controllable Components. Agrawal Prakhar, Agrawal Meghna, Yerramsetty Ashlesha, Juluri Radhika, Sahu Debapriya and Veeramreddi Srinivas developed the invention.
The pate..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received Applied Materials patent application for Pulsed Chemical Vapor Deposition with Programmable Logic Control. Zhou Yang, Kashefi Kevin, Wu Zhiyuan and Lam Hyman W developed the invention.
The patent application number is WO2025US50035 20251008. The patent publ..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received Applied Materials patent application for Porous Faceplate for Uniform Distribution of Radicals. Konina Kseniia, Likhanskii Alexandre and Miller Timothy J developed the invention.
The patent application number is WO2025US49677 20251006. The patent publicatio..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Beijing Xuanjie Technology patent application for Communication Performance Monitoring Method and Device, Electronic Equipment, Chip and Storage Medium. Lu Jun, Wang Xianjin, Liu Hao, Lu Zhiqiang, Li Kailiang and Tong Qiaolin developed the invention.
Th..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Shanghai Awinic Technology patent application for Audio System, Audio Signal Output Method, Chip and Electronic Equipment. Zhang Haijun and Zhou Jianing developed the invention.
The patent application number is CN202511989384 20251225. The patent public..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received Resonac patent application for Film Adhesive for Semiconductors and Manufacturing Method Therefor, Adhesive Tape and Manufacturing Method Therefor, Semiconductor Device and Manufacturing Method Therefor, and Manufacturing Method for Coating Liquid. Ohata Mas..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received Fujikura patent application for Beamformer Integrated Circuit and Phased Array Antenna Module. Kubo Tatsuo and Yamaguchi Yo developed the invention.
The patent application number is WO2025JP35561 20251007. The patent publication number is WO2026133686 (A1)...
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Renesas Electronics patent application for Semiconductor Device Manufacturing Method and Semiconductor Device. Tajima Hideyuki developed the invention.
The patent application number is CN202511234841 20250901. The patent publication number is CN12177270..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Tokyo Electron patent application for Substrate Processing Apparatus and Substrate Processing Method. Umezaki Shota, Hayashida Takahiro and Nakajima Mikio developed the invention.
The patent application number is CN202511309720 20250915. The patent publ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Kokusai Electric patent application for Substrate Processing Apparatus, Determination Method, Method of Manufacturing Semiconductor Device, and Program Product. Hayashihara Hidemoto developed the invention.
The patent application number is CN20251098807..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Xiamen Sanan Integrated Circuit patent application for Nitride Semiconductor Device, Radio Frequency Amplifier, and Communication Apparatus. Sun Xiguo, Zhong Jiebin, Liu Shenghou and Liu Boting developed the invention.
The patent application number is C..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Zhuhai Gree Electronic Components patent application for Semiconductor Structure and Semiconductor Device. Huang Huiyan, Chen Hui, Li Huibin, Ma Wanli and Song Bo developed the invention.
The patent application number is CN202511957904 20251223. The pat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Zhuhai Gree Electronic Components patent application for Groove Type MOS Device and Preparation Method Thereof. Zhang Shiliang, Zhang Peng, Feng Yin, Ma Wanli, Zhong Yongsheng and Ge Fangxiu developed the invention.
The patent application number is CN20..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received SK Hynix patent application for Semiconductor Device and Manufacturing Method Thereof. Kim Min-soo developed the invention.
The patent application number is CN202510935036 20250708. The patent publication number is CN121772218 (A). International Patent ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Texas Instruments patent application for High-speed Level Shifter. Singhal Sumit, Gupta Saurabh and Shetty Shivananda developed the invention.
The patent application number is CN202511368551 20250924. The patent publication number is CN121770511 (A). In..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- LG Innotek has applied WIPO patent for Circuit Board and Semiconductor Package. An Hyo Jae and Jung Won Suk developed it.
The patent application number is WO2025KR21442 20251211. The patent publication number is WO2026135009 (A1). International Patent Classification codes are H05K1/02, H05K1/03, H05K1/11, H05K..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Advanced Micro Devices has applied WIPO patent for Chip Package with an Interposer Having a Glass Core and a Substrate Having a Glass Core. Mysore Kaushik, Kulkarni Deepak Vasant and Neerukatti Rajesh Kumar developed it.
The patent application number is WO2025US50821 20251014. The patent publication number is ..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has applied WIPO patent for Ion Implantation and Vacuum Bake of Extreme Ultraviolet Photoresist to Improve Fine Patterning Performance. Bhatia Swasti, Hsu Chih-an, Hautala John and Dai Huixiong developed it.
The patent application number is WO2025US48961 20251001. The patent publication numbe..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Semiconductor Components Industries has applied WIPO patent for Embedded Semiconductor Device Packages and Methods of Manufacture. Sharma Ankit Bhushan developed it.
The patent application number is WO2025US25610 20250421. The patent publication number is WO2026135723 (A1). Cooperative Patent Classification co..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Micron Technology has applied Chinese patent for Tracking Accesses to Memory Using Ring Buffer Structure. Caraccio Danilo, Turconi Marco and Orlando Alessandro developed it.
The patent application number is CN202511360496 20250923. The patent publication number is CN121764833 (A). International Patent Classif..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Puya Semiconductor, Shanghai has applied Chinese patent for Unique Address Verification System and Method for Serial Detection Hub Chip. Zhou Wentian, Shang Haifei and Du Qingquan developed it.
The patent application number is CN202511969312 20251224. The patent publication number is CN121764742 (A). Internat..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Rapidus has applied WIPO patent for Semiconductor Device and Method for Manufacturing Semiconductor Device. Sasaki Hiroki, Kuroda Rihito and Ogawa Hiroyuki developed it.
The patent application number is WO2025JP25055 20250711. The patent publication number is WO2026133610 (A1). International Patent Classificat..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Semiconductor Energy Laboratory has applied WIPO patent for Method for Producing Positive Electrode Active Material. Fukai Shuji, Yoshitomi Shuhei and Kakehata Tetsuya developed it.
The patent application number is WO2025IB62839 20251215. The patent publication number is WO2026133054 (A1). International Patent..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Resonac has applied WIPO patent for Film Adhesive for Semiconductors and Manufacturing Method Therefor, Adhesive Tape and Manufacturing Method Therefor, Semiconductor Device and Manufacturing Method Therefor, and Manufacturing Method for Coating Liquid. Ohata Masaki, Yabushita Satoshi, Nomura Yutaka and Ito Kod..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Stanley Electric has applied WIPO patent for Ultraviolet Semiconductor Light-emitting Element, and Method for Manufacturing Ultraviolet Semiconductor Light-emitting Element. Obata Toshiyuki developed it.
The patent application number is WO2025JP43392 20251211. The patent publication number is WO2026134114 (A1)..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Resonac has applied WIPO patent for Semiconductor Adhesive, Adhesive Tape, Semiconductor Device Manufacturing Method, and Semiconductor Device. Masuno Daisuke, Yamamoto Kazuki, Iihoshi Akihito and Sobue Shogo developed it.
The patent application number is WO2025JP43309 20251211. The patent publication number i..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Tokyo Electron has applied WIPO patent for Bonding Device and Bonding Method. Ishii Takayuki developed it.
The patent application number is WO2025JP43128 20251210. The patent publication number is WO2026134066 (A1). International Patent Classification code is H10W72/00.
The abstract of the patent published b..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shenzhen Goodix Technology has applied Chinese patent for Signal Processing Method, Circuit, Chip and Electronic Equipment. Peng Jiangyang, Yang Yuqing and Dai Jie developed it.
The patent application number is CN202411383860 20240930. The patent publication number is CN121770499 (A). International Patent Cla..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Gree Electric Appliances, Zhuhai has applied Chinese patent for Communication Module and Chip. Long Shicai, Dong Shujian and Li Wenting developed it.
The patent application number is CN202511942319 20251222. The patent publication number is CN121772131 (A). International Patent Classification codes are H01Q1/..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Ningxia Crystal New Energy Materials has applied Chinese patent for Installation Device of Solar Cell Panel Installed on Outer Wall of Building. Xu Haijun, Ru Jianguo, Wang Bin, Tian Qinglong, Feng Xueli, Zhang Guizhi and Deng Bin developed it.
The patent application number is CN202511222430 20250829. The pat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Institute of Microelectronics, CAS has applied Chinese patent for Charge Pump Topological Structure, Integrated Chip and Electronic Equipment. Liu Hongwei, Li Zhiqiang, Yin Minghui, Lin Zihao and Zhang Weihua developed it.
The patent application number is CN202411369002 20240929. The patent publication number..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Zhuhai Nanxin Semiconductor Technology has applied Chinese patent for Voltage Converter, Control Circuit Thereof and Power Supply Chip. Zhang Dengfu developed it.
The patent application number is CN202511918171 20251217. The patent publication number is CN121770314 (A). International Patent Classification cod..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Kokusai Electric has applied Chinese patent for Cleaning Method, Semiconductor Device Manufacturing Method, Program Product, and Substrate Processing Apparatus. Ishibashi Kiyohisa, Yamane Akimasa and Nohara Shingo developed it.
The patent application number is CN202510978389 20250716. The patent publication n..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Hubei Jiangcheng Chip Pilot Production Services has applied Chinese patent for Semiconductor Etching Method and Semiconductor Structure. Zheng Zhenwei developed it.
The patent application number is CN20251256085 20251231. The patent publication number is CN121772628 (A). International Patent Classification co..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Jiangxi MTC Semiconductor has applied Chinese patent for Mini-led Chip, Preparation Method Thereof and Packaging Substrate. Jin Conglong, Hu Jiahui, Zhang Xingxing and Zhang Xue developed it.
The patent application number is CN202511641521 20251111. The patent publication number is CN121772432 (A). Internatio..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Infineon Technologies, Austria has applied Chinese patent for Lateral High Voltage Semiconductor Device and Manufacturing Method Thereof. Peterhensel Tom, Wenzel Annette, Geisenhofer Fabian, Franz Hirler and Muller-meschkamp Lars developed it.
The patent application number is CN202511397506 20250928. The pate..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Silergy Semiconductor Technology (Hangzhou) has applied Chinese patent for Semiconductor Device and Forming Method Thereof. Zhang Li developed it.
The patent application number is CN202511936031 20251219. The patent publication number is CN121772260 (A). International Patent Classification codes are H10D30/01..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Tokyo Electron has applied Chinese patent for Bonding Device, Bonding System, Bonding Method, Transfer Device, and Transfer Method. Sakai Mitsuhiro, Mine Yosuke, Sakai Masataka, Michinaka Satoshi, Yamazaki Tsuyoshi, Fukuoka Tetsuo, Noda Takahiro, Mizomoto Yasutaka and Kataoka Masamichi developed it.
The paten..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- ASML Netherlands has applied Chinese patent for Method for Determining Positioning Correction of Photolithographic Process. Jin Wenjie and S S K Renzen developed it.
The patent application number is CN20248056115 20240802. The patent publication number is CN121773376 (A). International Patent Classification c..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Wacker Chemie AG has applied Chinese patent for Silicone-based Resin Composition and Semiconductor Device Including the Same. Kim Tae-joon, Lee Jun-kyu, Joo Young-hyuk and Choi Jonghak developed it.
The patent application number is CN20248055810 20240227. The patent publication number is CN121773163 (A). Inte..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has sought patent for Phase Measurement and Control in Linear Acclerator. This invention was developed by Toe Aung, Coumou David J, Kenyon Matthew J, Kirk Michael Lawrence, Jones Joshua Matthew, Peitzsch Scott E and Maki James.
The patent application number is WO2025US48987 20251001. The pate..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has sought patent for Angled Implant for Patterning Feature Surface Roughness Improvement. This invention was developed by Bhatia Swasti, Nanayakkara Charith and Hautala John.
The patent application number is WO2025US48977 20251001. The patent publication number is WO2026135769 (A1). Internat..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Applied Materials has sought patent for Deposition of Halide-free Metal Films Using Noble Metal Catalysts. This invention was developed by Kim Yong Jin, Saly Mark, Leoncini Andrea and Tang Jiecong.
The patent application number is WO2025US48414 20250929. The patent publication number is WO2026135762 (A1). Inte..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- SK Hynix Nand Product Solutions has sought patent for Methods and Systems for Authentication Within a Storage Device. This invention was developed by Cain Gamil.
The patent application number is WO2025US60183 20251217. The patent publication number is WO2026136586 (A1). International Patent Classification code..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- The University of Texas has sought patent for Low-loss Full-bandwidth Three-dimensional Forward Tapered Edge Coupler for Photonic Integrated Circuit. This invention was developed by Fan Linran and Chen Paokang.
The patent application number is WO2025US60150 20251217. The patent publication number is WO20261365..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Qualcomm has sought patent for Stacked Integrated Circuit Device Including a Stiffener Die. This invention was developed by Wang Zhongze, Nallapati Giridhar, Sun Yangyang, Badaroglu Mustafa, Kang Woo Tag, Booth Roger, Chidambaram Periannan, Lee Hyun, Chen Xiaonan, Choi Jihong and Song Jaekyu.
The patent applic..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- SK Hynix Nand Product Solutions has sought patent for Thermal Connections Within a Device Enclosure to Improve Thermal Dissipation. This invention was developed by Singh Hardeep, Morning-smith Andrew, Nangare Sanket and Gregory Wayne.
The patent application number is WO2025US56065 20251119. The patent publicat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Hisense Visual Technology has sought patent for Video Compression Model Processing Method and Device, Medium, Chip and Program Product. This invention was developed by Yu Qingxiao, Li Bin, Tian Deli, Wang Zhikui, Han Pengfei, Wu Hanyong, Xing Fang, Jiang Weiwei, Zu Yinpeng, Li Shuai, Gao Yanbo and Li Yiyang.
..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- NVIDIA has sought patent for Different Neural Network Encoders for Different Portions of Information Set. This invention was developed by S Acharya, Ginsburg Brian and Jia Fei.
The patent application number is CN202511382335 20250925. The patent publication number is CN121766365 (A). International Patent Clas..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Resonac has sought patent for Slurry, Multi-component Slurry, Polishing Method, Method for Producing Component, and Method for Producing Semiconductor Component. This invention was developed by Noda Chiaki.
The patent application number is WO2024JP44805 20241218. The patent publication number is WO2026133464 (..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Rapidus has sought patent for Semiconductor Design System and Semiconductor Design Method. This invention was developed by Hashimoto Michitaka.
The patent application number is WO2024JP44743 20241218. The patent publication number is WO2026133444 (A1). International Patent Classification code is G06F30/398.
..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Sumitomo Metal Mining has sought patent for Production Method and Production Device for Silicon-carbide Single-crystal Substrate. This invention was developed by Maruyama Takahiro.
The patent application number is WO2025JP44501 20251219. The patent publication number is WO2026134322 (A1). International Patent ..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- AGC Inc has sought patent for Glass Composition, Glass Paste, Substrate with Coating Layer, and Sealed Package. This invention was developed by Hishinuma Akihiro and Sato Hinako.
The patent application number is WO2025JP43482 20251212. The patent publication number is WO2026134134 (A1). International Patent Cl..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Fuji Electric has sought patent for Semiconductor Device and Method for Producing Semiconductor Device. This invention was developed by Ishigaya Yuki.
The patent application number is WO2025JP43227 20251211. The patent publication number is WO2026134085 (A1). International Patent Classification codes are H10D1..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Kyocera has sought patent for Bypass Diode Storage Package, Bypass Diode Device Using Same and Solar Cell Module. This invention was developed by Nakajima Yoshiki, Iino Yuji, Shibata Masamitsu, Kazama Takeshi, Murakami Kensaku and Kanemaru Yutaka.
The patent application number is WO2025JP42811 20251208. The pa..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Niterra has sought patent for Printed Circuit Board and Semiconductor Package. This invention was developed by Kan Yohei, Otsuka Jun, Okayama Hiroki and Torazawa Masahiro.
The patent application number is WO2025JP38321 20251031. The patent publication number is WO2026133766 (A1). International Patent Classific..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Zhuhai Gree Electronic Components has sought patent for Groove Type MOS Device and Preparation Method Thereof. This invention was developed by Zhang Shiliang, Zhang Peng, Feng Yin, Zhong Yongsheng, Zhan Yancong and Li Xinyao.
The patent application number is CN202511933628 20251219. The patent publication num..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Mitsubishi Electric has sought patent for Semiconductor Device and Method for Manufacturing Semiconductor Device. This invention was developed by Soneda Shinya, Konishi Kazuya, Fujii Hidenori, Tanaka Koji and Furukawa Reona.
The patent application number is CN202511215380 20250828. The patent publication numb..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Unimicron Technology has sought patent for Substrate Structure and Manufacturing Method Thereof. This invention was developed by Zhan Zhikai, Tan Ruimin, Lin Puru, Cheng Shiliang, Ke Zhengda and Wang Jinsheng.
The patent application number is CN202511119208 20250811. The patent publication number is CN1217727..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Infineon Technologies has sought patent for Semiconductor Module Including Housing. This invention was developed by Troska Georg.
The patent application number is CN202511343096 20250919. The patent publication number is CN121772738 (A). International Patent Classification codes are H10W40/20, H10W40/22, H10W..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Xinlian Integrated Circuit Manufacturing has sought patent for Preparation Method of Electric Fuse, Electric Fuse and Semiconductor Integrated Structure. This invention was developed by Zhong Peng, Huang Yan and Zhao Xiaoyan.
The patent application number is CN202511994584 20251226. The patent publication num..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Hefei Nexchip Integrated Circuit has sought patent for Manufacturing Method of Semiconductor Device and Semiconductor Device. This invention was developed by Wu Minggang, Fang Xiaoting and Chen Guanzhong.
The patent application number is CN202610252765 20260303. The patent publication number is CN121772724 (A..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Nanya Technology has sought patent for Preparation Method for Forming Patterned Photoresist Layer on Substrate. This invention was developed by Yang Zhengwei.
The patent application number is CN202510529902 20250425. The patent publication number is CN121772705 (A). International Patent Classification codes a..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Hefei Jiufu Semiconductor Technology has sought patent for Miniature Fixing Tool for Semiconductor Installation. This invention was developed by Yuan He and Zhao Jiangmin.
The patent application number is CN202511824815 20251205. The patent publication number is CN121772689 (A). International Patent Classific..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Beijing NAURA Microelectronics Equipment has sought patent for Uncovering Mechanism and Semiconductor Process Equipment. This invention was developed by Li Xiang, Guo Qiyao and Ma Enze.
The patent application number is CN202411365780 20240927. The patent publication number is CN121772640 (A). International Pa..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Xincun Technology (Wuhan) has sought patent for Gate Material and Semiconductor Device. This invention was developed by Yang Haibo, Liu Jun, Zhou Guangle and Xiong Bowen.
The patent application number is CN202511932895 20251219. The patent publication number is CN121772608 (A). International Patent Classifica..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Tokyo Electron has sought patent for Plasma Processing Apparatus. This invention was developed by Tanaka Kazumitsu and Iijima Yuki.
The patent application number is CN20248056190 20240809. The patent publication number is CN121773709 (A). International Patent Classification codes are C23F1/08, H05H1/00, H05H1..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published HPSP patent application for High-pressure Substrate Processing Apparatus. The invention was developed by Kim Joo Ho.
The patent application number is WO2025KR21589 20251212. The patent publication number is WO2026135045 (A1). International Patent Classific..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published NVIDIA patent application for Fast and Secure Memory Address Translation in a Virtual Machine Computing System. The invention was developed by Basak Abhishek, Patel Piyush, Valavala Himaja S, Kansal Rohan, Dunning Lucien, Hossain Hemayet, Gandhi Wishwesh An..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published Applied Materials patent application for Upwardly-oriented Beamline Implanter Architecture for Contactless Backside Substrate Processing. The invention was developed by Lee Soojae, Olson Joseph C, Sinclair Frank, Kim Taegon and Doshay Sage Toko Garrett.
Th..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published SanDisk Technologies patent application for Three-dimensional Memory Device Including Symmetric Array Connection Strips and Methods for Forming the Same. The invention was developed by Matsuno Koichi and Funayama Kota.
The patent application number is WO20..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published SK Hynix Nand Product Solutions patent application for Hardware Security Modules Integrated in Memory Devices and Systems. The invention was developed by Cain Gamil and Wilson Young.
The patent application number is WO2025US59717 20251215. The patent publi..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Huawei Technologies patent application for Internal Memory, Chip and Related Electronic Equipment. The invention was developed by Xiao Shihai, Zheng Yu, Ni Leibin, Wu Wei and Li Tao.
The patent application number is CN202411398209 20240930. The patent ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Xiaomi Automobile Technology patent application for Video Generation Method and Device, Vehicle, Chip and Storage Medium. The invention was developed by Wang Bing, Ye Hangjun and Sun Haiyang.
The patent application number is CN20251217417 20251229. The..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published Semiconductor Energy Laboratory patent application for Method for Forming Metal Oxide Film. The invention was developed by Isaka Fumito, Takahashi Hironobu, Tezuka Sachiaki, Sawai Hiromi, Ohno Toshikazu and Hata Yuki.
The patent application number is WO202..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published Tokyo Electron patent application for Substrate Processing System and Substrate Processing Method. The invention was developed by Kitamura Kazuaki, Horinouchi Ryo, Egashira Atsushi, Hagishima Yuji, Kai Takashi, Hara Yoshitaka and Goto Shuhei.
The patent ap..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Zhejiang Juexin Microelectronics patent application for Hgcdte Chip and Preparation Method Thereof. The invention was developed by Li Weiwei, Dong Keen, Liu Xiaobin and Mao Jianhong.
The patent application number is CN20251230269 20251230. The patent p..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Taiwan Semiconductor Manufacturing patent application for Semiconductor Structure and Method for Forming the Same. The invention was developed by He Weide, Huang Shaoze, Chang Jin-ho and Hong Xinyang.
The patent application number is CN202511800486 202..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Zhuhai Gree Electronic Components patent application for Semiconductor Structure and Preparation Method of Semiconductor Structure. The invention was developed by Liu Yingcong, Li Huibin, Ma Wanli, Song Bo and Sun Zhaoze.
The patent application number ..
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