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Semiconductor

  |  Sat 10 Jan 2026

Beijing, Jan. 10 -- Chengdu Uniic Electronics Co Ltd and Xi'an UniIC Semiconductors have applied Chinese patent for Integrated Circuit and Integrated Circuit Through Hole Offset Detection Method. Zhang Kai, Yin Peng and Wang Zhengwen developed it. The patent application number is CN202510470758 20250415. The patent publicatio..

Semiconductor

  |  Sat 10 Jan 2026

Beijing, Jan. 10 -- North University of China and Shenmou Yuanjian Shanxi Tech Co Ltd have submitted a patent application for Outdoor Fitness Equipment Use Condition Statistical System Based on National Science Security and Protection Chip. This invention was developed by Qin Pinle, Chen Zuojun, Chai Rui, Yu Yi, Zhao Pengcheng a..

Semiconductor

  |  Sat 10 Jan 2026

Beijing, Jan. 10 -- Wuhan Wanji Photoelectric Technology and United Microelectronics Center Co Ltd have submitted a patent application for Optical Chip and Preparation Method of Optical Chip. Xu Yang, Kanesato, Li Yi, Feng Junbo, Feng Chuhuan, Jiang Ping, Lu Youxi and Deng Yongqiang developed the invention. The patent applica..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- LG Chemical has submitted a patent application for Novel Compound and Organic Light-emitting Device Using Same. This invention was developed by Kim Hoon-jun, Han Mi-yeon, Jung Min Woo, Lee Jungha, Oh Joong-suk, Cho Hye Min, Lee Ho Jung, Park Hyung-jin and Heo Jeonghoe. The patent application number is CN20..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Hoya Lens Thailand has filed a patent application for Photochromic Compound, Photochromic Composition, Photochromic Article, and Eyeglasses. This invention was developed by Kawakami Hironori and Kobayashi Kei. The patent application number is EP20240763904 20240227. The patent publication number is EP4674924 ..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Sekisui Chemical has submitted a patent application for Adhesive Composition, Adhesive Tape, Method for Processing Semiconductor Wafer, and Method for Producing Semiconductor Device. Zhang Ye, Ueda Kozo, Ogata Yudai and Takijiri Aya developed the invention. The patent application number is EP20240763870 20240..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has published RTX patent application for System for Detecting Surface of a Coated Conductive Substrate. The invention was developed by Kuczek Andrzej E, Barron Alan C, Marchitto Edward and Wang Zhigang. The patent application number is EP20250186469 20250630. The patent publication nu..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Toray Industries has submitted a patent application for Direct-drawing-type Waterless Lithographic Printing Plate Precursor and Method for Producing Waterless Lithographic Printing Plate Therefrom. Iihara Akihiro and Kuse Yasunori developed the invention. The patent application number is EP20240763604 2024021..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has published Mitsubishi Electric patent application for Compound Semiconductor Device for High Power and High Frequency Operation. The invention was developed by Teo Koon Hoo and Chowdhury Nadim. The patent application number is EP20240782360 20240904. The patent publication number is ..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Micron Technology has submitted a patent application for Split Pillar and Pier Memory Architectures. This invention was developed by Fratin Lorenzo, Fantini Paolo, Varesi Enrico and Pellizzer Fabio. The patent application number is EP20240760800 20240215. The patent publication number is EP4670473 (A1). Inter..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Bundesdruckerei has filed a patent application for Device and Method for Testing a Chip Card. This invention was developed by Lesche Ulrike, Voigt Michael and Kliefoth Rüdiger. The patent application number is EP20250184744 20250624. The patent publication number is EP4675248 (A1). International Patent Cla..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has released Beijing NAURA Microelectronics Equipment patent application for Adapter Apparatus and Semiconductor Process Device. This invention was developed by Liu Dongxu, Ma Hongshuai, Nan Jianhui and Zhao Hongyu. The patent application number is EP20240763177 20240228. The patent p..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has released Hoya Lens Thailand patent application for Ultraviolet Absorber and Spectacle Lens. This invention was developed by Kousaka Masahisa and Ohnishi Tomofumi. The patent application number is EP20240780597 20240328. The patent publication number is EP4671341 (A1). Internationa..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has released Hoya Lens Thailand patent application for Ultraviolet Absorber and Spectacle Lens. This invention was developed by Kousaka Masahisa and Ohnishi Tomofumi. The patent application number is EP20240780595 20240328. The patent publication number is EP4671340 (A1). Internationa..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Hoya Lens Thailand has filed a patent application for Isocyanate Composition, Polymerizable Composition, Resin, Optical Material, and Spectacle Lens. This invention was developed by Kousaka Masahisa, Ohnishi Tomofumi and Tanizawa Hideya. The patent application number is EP20240780411 20240327. The patent publ..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Hoya Lens Thailand has submitted a patent application for Compound, Mold Release Agent, Isocyanate Composition, Polymerizable Composition, Resin, Optical Material, Spectacle Lens, Method for Producing Resin, and Method for Producing Spectacle Lens. This invention was developed by Kousaka Masahisa and Ohnishi T..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Sumitomo Metal Mining has sought patent for Substrate for SiC Semiconductor Devices, SiC Bonded Substrate, Sic Polycrystal Substrate, and Sic Polycrystal Substrate Manufacturing Method. This invention was developed by Tahara Daisuke and Aoki Katsutoshi. The patent application number is EP20240763686 2024021..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Intel has submitted a patent application for Hybrid Panel with a Glass Substrate and Plated Frame. This invention was developed by Bryks Whitney, Chen Haobo, Duan Gang, Duong Benjamin, Jones Jesse, Marin Brandon C, May Robert, Nie Bai, Ramanuja Pietambaram Srinivas Venkata, Shan Bohan and Tanaka Hiroki. The p..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has published Marvell Asia patent application for Methods for Co-packaging Optical Modules on Switch Package Substrate. The invention was developed by Nagarajan Radhakrishnan L and Patterson Mark. The patent application number is EP20250202427 20220303. The patent publication number is ..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has released GlobalFoundries patent application for Optical Signal Blockers for a Photonic Chip. This invention was developed by Dash Aneesh, Bian Yusheng, Minasamudram Rupa Gopinath, Sridharan Ramya and Siegmund Robert. The patent application number is EP20250151100 20250110. The paten..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- RTX has sought patent for Method for Laser Treating a Metallic Substrate of a Piston Seal Ring. This invention was developed by Thayer Henry H, Taghaddos Elaheh Fattahi, Mohseni Hamidreza, Lee Seung-yub and Furrer David U. The patent application number is EP20250185653 20250626. The patent publication numbe..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Honor Device has submitted a patent application for Method for Use in Call, Device, Chip System, and Storage Medium. Li Haibo developed the invention. The patent application number is EP20230931791 20231117. The patent publication number is EP4676117 (A1). International Patent Classification codes are H04L1/0..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Honor Device has submitted a patent application for Communication Method and Apparatus, and Chip. Li Haibo, Luo Fei and Xue Chao developed the invention. The patent application number is EP20240818332 20240320. The patent publication number is EP4676101 (A1). International Patent Classification codes are H04W..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has published STMicroelectronics International patent application for Fast, Low Area Self-test for Read-only Memory. The invention was developed by Singh Rupesh, Bal Ankur and Hoizal Tejas Kumar. The patent application number is EP20250184581 20250623. The patent publication number is E..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has received STMicroelectronics International patent application for a Current Controlled Buck Regulator Circuit and Corresponding Control Method. Errico Nicola, Gaudiano Rossella, Finazzi Luca, Ferrara Enrico and Floriani Ivan developed the invention. The patent application number is..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Sumitomo Bakelite has submitted a patent application for Bus-bar Substrate, Bus-bar Substrate Device, Stator, and Stator Manufacturing Method. This invention was developed by Kuroda Hirofumi, Kosaka Wataru, Yamamoto Shinya, Nishikawa Atsunori, Harada Takahiro and Sugihara Kotaro. The patent application numb..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- STMicroelectronics International has sought patent for Authentication Method. This invention was developed by Peeters Michael. The patent application number is EP20250185567 20250626. The patent publication number is EP4672049 (A1). International Patent Classification code is G06F21/44. Cooperative Patent Cla..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Hangzhou Zhicun (Witmem) Technology has submitted a patent application for Memory-computing Integrated Chip Architecture, Packaging Method and Apparatus. This invention was developed by Wang Shaodi and Guo Xinjie. The patent application number is EP20250186059 20250627. The patent publication number is EP4672..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- NVIDIA has filed a patent application for Application Programming Interface to Prevent Thread Performance. This invention was developed by Soman Advait, Bharambe Girish Bhaskarrao, Long Ze, Edwards Harold Carter, Brito Gadeschi Gonzalo, Narawane Yashwardhan, Dhar Vikram, Treichler Sean Jeffrey, Parle Apoorv an..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Honor Device has submitted a patent application for Two-dimensional Code Display Method, Electronic Device, Chip and Storage Medium. This invention was developed by Wang Xiaofei and Wang Huan. The patent application number is EP20240855242 20240305. The patent publication number is EP4671960 (A1). Internation..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- STMicroelectronics International has submitted a patent application for Time-of-flight Wake on Attention. This invention was developed by Gaffet Ulysse and Lemarchand Olivier. The patent application number is EP20250183235 20250617. The patent publication number is EP4671928 (A1). International Patent Classif..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- ASML Netherlands has sought patent for Method of Determining a Common Point in Images, Apparatus and Computer Program. This invention was developed by Van Leest Adriaan Johan, Mathijssen Simon Gijsbert Josephus and Kapel Pieter Anthon. The patent application number is EP20240184990 20240627. The patent public..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Samsung Electronics has filed a patent application for Power Semiconductor Devices. This invention was developed by Kim Taehun, Ko Mingu, Kim Youngcheol, Kim Jongseob, Park Jeonghwan and Oh Sewoong. The patent application number is EP20250172030 20250423. The patent publication number is EP4675681 (A2). Coope..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Sony Semiconductor Solutions Corporation has sought patent for Semiconductor Device, Electronic Apparatus, and Method for Producing Semiconductor Device. This invention was developed by Aoki Shumpei. The patent application number is EP20240763558 20240208. The patent publication number is EP4675677 (A1). Inte..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- IMEC VZW has submitted a patent application for a Method for Producing Conductive Lines in an Interconnect Structure of a Semiconductor Chip. This invention was developed by Gupta Anshul, Tokei Zsolt, Decoster Stefan, Delie Gilles and Kundu Souvik. The patent application number is EP20240186142 20240702. Th..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Kokusai Electric has submitted a patent application for Cooling System, Substrate Processing Apparatus, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Program. This invention was developed by Takahashi Akira and Hiyama Shin. The patent application number is EP20250185306 2025062..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Furukawa Electric has filed a patent application for Tape for Semiconductor Processing. This invention was developed by Asanuma Takumi. The patent application number is EP20240763537 20240206. The patent publication number is EP4675670 (A1). International Patent Classification codes are C08G59/02, C08G59/20, ..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Samsung Electronics has submitted a patent application for Memory Device Including a Plurality of Ground Selection Transistors. Lee Taeyun, Park Sang-won and Park Il Han developed the invention. The patent application number is EP20250168173 20250403. The patent publication number is EP4675626 (A1). Internati..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- KIOXIA has filed a patent application for Non-volatile Semiconductor Memory Device. This invention was developed by Takashima Daisaburo. The patent application number is EP20240217106 20241203. The patent publication number is EP4675624 (A1). International Patent Classification codes are G11C16/04, G11C16/24,..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Intel has sought patent for Two-phase Cooling with Assisted Condensation for Semiconductor Devices. This invention was developed by Alelyani Sami, Petrini Joseph B, Lofgreen Kelly P and Diglio Paul J. The patent application number is EP20250178422 20250523. The patent publication number is EP4671778 (A1). Int..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Fraunhofer-Gesellschaft has submitted a patent application for Method for Determining Characteristics of a Semiconductor Layer Structure. This invention was developed by Wörnhör Alexandra, Vahlman Henri, Demant Matthias, Rein Stefan, Haunschild Jonas and Burkhardt Daniel. The patent application number is ..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- STMicroelectronics International has submitted a patent application for Method for Configuring a Microcontroller and Corresponding Microcontroller. This invention was developed by La Terra Salvatore, Cutuli Francesca Maria Grazia and Martorana Rosario. The patent application number is EP20250181840 20250610..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Huawei Technologies has applied European patent for Task Processing Method and Chip. Liao Heng, Liu Hu, Ren Yi, Xiong Lejin and Liu Jianan developed it. The patent application number is EP20240769806 20240305. The patent publication number is EP4675428 (A1). International Patent Classification code is G06F9/4..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- SCREEN Holdings has submitted a patent application for Substrate Treatment Method. This invention was developed by Nishimura Yuta. The patent application number is EP20240763534 20240206. The patent publication number is EP4675360 (A1). International Patent Classification code is G03F7/42. Cooperative Paten..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- STMicroelectronics International has submitted a patent application for Band-pass Filter Circuit. Bonnet Benoit developed the invention. The patent application number is EP20250182623 20250613. The patent publication number is EP4672600 (A1). International Patent Classification code is H03H9/54. Cooperative P..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Avago Technologies International Sales has sought patent for Multigate Semiconductor Devices with Varied Threshold Voltage Characteristics. This invention was developed by Ito Akira and Loo Sim. The patent application number is EP20250182702 20250613. The patent publication number is EP4676186 (A1). Internati..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Samsung Electronics has submitted a patent application for Vertical Non-volatile Memory Device. This invention was developed by Kim Sanghun, Kwak Wooahm, Kim Minsu, Park Jiwon, Baek Jaehwan, Shim Hyunseo, Oh Minkyo, Lee Eunhye, Lee Jaechan and Lee Jinhyeong. The patent application number is EP20250166734 2025..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Nexperia has filed a patent application for Semiconductor Device and Method of Ion Implementation in a Semiconductor Device. This invention was developed by Saito Katsuaki. The patent application number is EP20240184707 20240626. The patent publication number is EP4672340 (A1). Cooperative Patent Classifica..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Huawei Technologies has submitted a patent application for Chip Metallization Method and Chip. Liu Yi, Liu Jie and Zhu Jifeng developed the invention. The patent application number is EP20240777560 20240220. The patent publication number is EP4672333 (A1). International Patent Classification codes are H01L23/..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has received STMicroelectronics International patent application for Lead-frame Package with Improved Lead Structure. Talledo Jefferson Sismundo developed the invention. The patent application number is EP20250182413 20250612. The patent publication number is EP4672332 (A1). Internation..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Nexperia has sought patent for a Semiconductor Device and a Method of Manufacturing of the Semiconductor Device. This invention was developed by Ramalingam Vegneswary, Shiu Heiming, Syré Jörg and Wong Fei. The patent application number is EP20240184736 20240626. The patent publication number is EP4672330 (A..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has published Nexperia patent application for a Semiconductor Package. The invention was developed by Mohd Zali Mohd Rozaini, Aranas Brian, Ting Kow Siew and Chaw Wing Onn. The patent application number is EP20240184260 20240625. The patent publication number is EP4672329 (A1). Internat..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has published Avago Technologies International Sales patent application for Heat Dissipation for Semiconductor Circuit. The invention was developed by Zhang Sheng, Margalit Near, Meadowcroft David John Kenneth and Kannan Sukeshwar. The patent application number is EP20250183355 20250617..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Intel has filed a patent application for Micro-structure Array for Mitigation of Hot Spots in Integrated Circuit Packages. This invention was developed by Meng Yuan, Zandavi Seyed, Uppal Aastha, Deb Nabankur, Li Xiaoqian, Chang Je-young, Widodo Trianggono and Brun Xavier. The patent application number is EP20..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Intel has submitted a patent application for Hybrid Panel with a Glass Substrate. This invention was developed by Konchady Manohar, Jimenez Andrew, Nguyen Son, Tanaka Hiroki, Wang Yekan, Pietambaram Srinivas Venkata Ramanuja, May Robert Alan, Vehonsky Jacob, Bryks Whitney, Shan Bohan, Duan Gang, Nie Bai, Hu Xi..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Intel has applied European patent for Methods and Systems for Forming Integrated Circuit Packages Comprising Glass Layers. Jimenez Andrew Matthew, Konchady Manohar, Mohammadighaleni Mahdi, Tanaka Hiroki, Zamani Ehsan, Bryks Whitney M, Chen Haobo, Duan Gang, Duong Benjamin T, Grujicic Darko, Han Jung Kyu, Heato..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Absolics has sought patent for Packaging Substrate and Semiconductor Package Comprising the Same. This invention was developed by Kim Jincheol, Yun Sehan, Jo Jungju, Kim Tae Kyoung and Oh Jun Rok. The patent application number is EP20250165846 20250325. The patent publication number is EP4672317 (A1). Interna..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Nexperia has filed a patent application for a Substrate, in Particular a Lead-frame Substrate Used in a Semiconductor Package for Mounting a Semiconductor Die Element. This invention was developed by Dchar Ilyas and Yandoc Ricardo. The patent application number is EP20240184252 20240625. The patent publicatio..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has received Intel patent application for Fabricating Integrated Circuit Packages with Glass Core Hybrid Panels. Agarwal Soham, Bryks Whitney, Candadai Aaditya Anand, Cao Yi, Darmawikarta Kristof, Duan Gang, Duong Benjamin, Ecton Jeremy, Mohammadighaleni Mahdi, Hernandez Kari, Jimenez An..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Intel has sought patent for Dynamic Substrate Thermal Displacement Compensation. This invention was developed by Oka Mihir, Mellody James, Srinivasan Kartik, Tan Wei, Cetegen Edvin, Gokhale Shripad, Kaya Mine and Singh Yuvraj. The patent application number is EP20250173862 20250501. The patent publication num..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Intel has submitted a patent application for Technologies for Air Gaps in Semiconductor Dies with Aluminum Oxide Liners. This invention was developed by Peer Akshit, Dutta Ananya, Sukrittanon Supanee, Naskar Sudipto and Kobrinsky Mauro J. The patent application number is EP20250185048 20250624. The patent pub..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has released TNO patent application for Method for Light-induced Release of One or More Components from a Donor Substrate to an Acceptor Substrate, and a Donor Substrate and System Therefor. This invention was developed by Arutinov Gari and Van Den Brand Jeroen. The patent application n..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- ASML Netherlands has submitted a patent application for Substrate Storage System, Substrate Handling Apparatus, Method of Temporarily Storing a Substrate. Bruls Richard Joseph developed the invention. The patent application number is EP20240184065 20240624. The patent publication number is EP4672308 (A1). Int..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has published SCREEN Holdings patent application for Substrate Treatment Device and Substrate Treatment Method. The invention was developed by Ozaki Koh, Urata Shingo and Takeda Daisuke. The patent application number is EP20240760308 20240219. The patent publication number is EP467230..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Nissan Chemical has applied European patent for Method for Manufacturing Semiconductor Substrate, Method for Manufacturing Processed Semiconductor Substrate, and Composition for Peeling and Dissolving. Yagyu Masafumi, Okuno Takahisa and Shinjo Tetsuya developed it. The patent application number is EP202407601..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- ASML Netherlands has submitted a patent application for Electrostatic Lens. This invention was developed by Toonen Wiebe Floris, Krecinic Faruk and Wieland Marco Jan-jaco. The patent application number is EP20240184756 20240626. The patent publication number is EP4672297 (A1). International Patent Classificat..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published PSK Inc patent application for Substrate Processing Method. The invention was developed by Lee Yoon-young and Son Jin-chul. The patent application number is CN20238078091 20230914. The patent publication number is CN120188266 (A). International Patent..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Applied Materials has submitted a patent application for Reducing Etch-related Aspect Ratios with DC Bias Pulses. This invention was developed by Li Deyang, Srinivasan Sridhar, Zhou Yiquan, Rauf Shahid, Liu Guanting, Kenney Jason A, Liao Zhong, Joubert Olivier Pierre, Dasher Steven J, Eppler Alexander and Nic..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Tokyo Electron has submitted a patent application for Substrate Processing Method and Substrate Processing System. Kaneko Tomohiro developed the invention. The patent application number is CN20238077797 20231107. The patent publication number is CN120188264 (A). International Patent Classification codes are ..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Applied Materials has submitted a patent application for Method for Blocking Dielectric Surfaces Using Blocking Molecules to Allow Selective Epitaxial Deposition. This invention was developed by Bajaj Jitika, Sen Srobona, Li Xuebin, Margaitis Joe, Pai Bhavas and Ramachandran Gopi Chandran. The patent applica..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Lam Research has filed a patent application for System and Method for Increasing Heat Transfer Contact Area Associated with Edge Ring. This invention was developed by Gandur Baraganandara Chandra Kayush, Ghani Sandeep, Kellogg Michael C and Wong Brian Kwok. The patent application number is CN20238077213 2023..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received Lam Research patent application for Cup Baffle for Showerhead of Substrate Processing System. Pols Andrew and Alcuri Conor Charles developed the invention. The patent application number is CN20238075624 20231018. The patent publication number is CN1201..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received Applied Materials patent application for Polymorphic Voltage Pulse Train for Uniformity and Etch Profile Tuning. Cui Linying, Rogers James, Byun Da-sok, Dhindsa Rajinder and Hernandez Kevin developed the invention. The patent application number is CN20..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- ASML Netherlands has submitted a patent application for Charged Particle Beam Detector with Adaptive Detection Area Set for Multiple Fields of View. This invention was developed by Xia Zhenyang, Wang Yongxin, Ji Xiaoyu, Jiang Jun, Kanai Kenichi and Zhou Yongjian. The patent application number is CN2023807671..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received Infineon Technologies patent application for Method for Balancing Grid Height in Embedded Nonvolatile Memory Based on Hkmg Technology. Ramkumar Krishnaswamy and Shetty Shivananda developed the invention. The patent application number is CN20258000648 2..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Microsoft Technology Licensing has sought patent for Virtual Machine Live Migration Via Directly Connected Non-volatile Memory Fast Devices. This invention was developed by De Kort Martin, Kurjanowicz Matthew David, Pavlenko Yuri, Kou Lei and Kumar Sandeep. The patent application number is CN20238078022 2023..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Micron Technology has filed a patent application for Selective Guide Cycle. This invention was developed by Liu Zhao. The patent application number is CN20238077532 20230621. The patent publication number is CN120188150 (A). International Patent Classification code is G06F12/16. Cooperative Patent Classifica..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received ASML Netherlands patent application for Systems, Methods, and Software for Overlay Model Construction and Application. Fu Jiyou and Zhang Chenyu developed the invention. The patent application number is CN20238078029 20231013. The patent publication nu..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has published ASML Netherlands patent application for Substrate Support and Lithographic Apparatus. The invention was developed by Seeger Thomas Nicholas Michael, Huang Zhuangxiong and Rosset Nicolas J J. The patent application number is CN20238077937 20231003. T..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Carl Zeiss SMT has sought patent for Mirror Element, Lithographic System and Method of Providing Mirror Element. This invention was developed by Karl Matthias. The patent application number is CN20238078035 20231012. The patent publication number is CN120188075 (A). International Patent Classification codes ..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Hoya Lens Thailand has submitted a patent application for Holding Jig and Method for Manufacturing Optical Element. This invention was developed by Annaka Satoshi and Ito Mitsuhide. The patent application number is CN20238078000 20231110. The patent publication number is CN120188074 (A). International Pate..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Saint-Gobain Ceramics has submitted a patent application for Chemical Mechanical Planarization Slurry and Method of Polishing Substrate. This invention was developed by Zhou Renjie, Bottiglieri Stephen, Fu Lin and Guan Junlong. The patent application number is CN20238045380 20230609. The patent publication n..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has released Guangzhou Zhongnuo Microelectronics patent application for Consumable Allowance Updating Method and Device for Consumable Chip, Chip and Equipment. This invention was developed by Li Qin, Lin Wei and Luo Shaocong. The patent application number is CN202..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Tsinghua University has applied Chinese patent for Organic Semiconductor Material and Organic Field Effect Transistor. Han Jiangli, Ma Ding and Dong Guifang developed it. The patent application number is CN202510327887 20250319. The patent publication number is CN120187189 (A). International Patent Classific..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has received LG Electronics patent application for Display Device Having Semiconductor Light Emitting Device. Kim Ji-won, Choi Jeong-sik, Kim Ki-seok and Kim Ju-ho developed the invention. The patent application number is CN202411875659 20241219. The patent publica..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- Intel has filed a patent application for Thin Film Transistors Having Multi-layer Contact Metallization. This invention was developed by Madisetti Shailesh Kumar, Mathew Suraj, Liu Huiying, Qin Xiaoye, Nikitin Vladimir, Dolejsi Moshe, Mousumi Jannatul Ferdous, George Gregory J, Sharma Abhishek Anil, Le Van H a..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has released Chongqing Kangjia Optoelectronic Technology patent application for Epitaxial Wafer, Manufacturing Method Thereof and Light-emitting Chip. This invention was developed by Gu Pengjun and Xin Haihui. The patent application number is CN202311723295 2023121..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has published GlobalFoundries patent application for Bipolar Transistor Structures with Sloped Base Sidewalls and Related Methods. The invention was developed by Raghunathan Uppili S, Shank Steven M, Derrickson Alexander M, Jain Vibhor, Luce Cameron E, Mctaggart Sarah A and Lydon-nuhfer ..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has received STMicroelectronics International patent application for Memory Cell. Bacquie Valentin and Rubeck Sarah developed the invention. The patent application number is EP20250183180 20250617. The patent publication number is EP4672895 (A1). International Patent Classification co..

Semiconductor

  |  Sun 11 Jan 2026

Munich, Jan. 12 -- European Patent Office has published STMicroelectronics International patent application for Phase Change Material Based Memory Circuit. The invention was developed by Bacquie Valentin, Jeannot Simon, Cabout Thomas, Boccaccio Christian and Sandrini Jury. The patent application number is EP20250180963 202506..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Zhejiang Juexin Microelectronics has submitted a patent application for Preparation Method of Tellurium-cadmium-mercury Infrared Detector Chip. This invention was developed by Shuai Nong, Li Weiwei, Chen Lu, Gong Hanhong and Mao Jianhong. The patent application number is CN202510350061 20241022. The patent p..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- East China jiaoTong University has submitted a patent application for Integrated Chip Breaking Device. This invention was developed by Shu Shengrong, Zhu Maodong, Liu Fuhai, Wang Weichang, Tan Rongkai, Zhang Yulin and Chen Zhilong. The patent application number is CN202510592377 20250509. The patent publicat..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- HKC has submitted a patent application for Microfluidic Chip. This invention was developed by Pu Yang and Xu Pei. The patent application number is CN202510552041 20250429. The patent publication number is CN120189992 (A). International Patent Classification codes are B01L3/00 and G01B11/00. Cooperative Paten..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences has submitted a patent application for Micro-fluidic Chip as Well as Preparation Method and Application Thereof. This invention was developed by Ma Baiwen, Ren Zexuan, Zhang Wei, Li Jiahao, Hu Chengzhi and Qu Jiuhui. The patent appli..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Shanghai University has submitted a patent application for Micro-fluidic Chip for Intracellular Substance Delivery Based on Magnetic Response Membrane. This invention was developed by Wu Jinbo, Mao Zhiyu, Wen Weijia, Zhang Mengying, Yuan Ziqun, Hu Guohui and Xue Chang. The patent application number is CN20..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Advanced Micro-Fabrication Equipmen has applied Chinese patent for Gas Transmission Device, Semiconductor Processing Device and Working Method of Semiconductor Processing Device. Wang Guoyuan, Hu Gancheng, Jiang Yong, Guo Shiping and Zhang Zhao developed it. The patent application number is CN202311776666 20..

Semiconductor

  |  Mon 12 Jan 2026

Beijing, Jan. 12 -- Shenzhen Xinkailai Industry Machine has applied Chinese patent for Motion Control Device, Magnetic Control Device and Semiconductor Equipment. Li Quanchen, Chen Jiaojiao and Zhang Junsheng developed it. The patent application number is CN202510428514 20250407. The patent publication number is CN120193243 (A)..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- State Intellectual Property Office of China has released Tokyo Electron patent application for Plasma Processing Apparatus and Plasma Processing Method. This invention was developed by Koshimizu Chishio and Uesaka Yuketo. The patent application number is CN20238077908 20231106. The patent publication number ..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- Tokyo Electron has submitted a patent application for Plasma Processing Apparatus, Power Supply System, and Method of Controlling Frequency of Generation Source. Uesaka Yuketo developed the invention. The patent application number is CN20238077844 20231113. The patent publication number is CN120188575 (A). I..

Semiconductor

  |  Sun 11 Jan 2026

Beijing, Jan. 12 -- ASML Netherlands has applied Chinese patent for Droplet Flow Alignment Mechanism and Method Thereof. Duvall William, Weber Gerardus D M and Swerdlow Ed M developed it. The patent application number is CN20238079217 20231107. The patent publication number is CN120188574 (A). International Patent Classificat..
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