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Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Chn Energy Invest Group Co Ltd, Guoneng Shendong Coal Group and National Inst Of Clean and Low Carbon Energy have submitted a patent application for Molecular Dynamics Simulation-based Silicon Dioxide Adsorption Organic Matter Evaluation Method. This invention was developed by Jiang Binbin, Liu Qian, Zhang Xu..
Semiconductor
| Sat 24 Oct 2026
Beijing, Oct. 23 -- Guiyan Semiconductor Mat Yunnan Co Ltd and Kunming University of Science and Technology have submitted a patent application for Composite Special Gold Wire Suitable for High-temperature and High-density Packaging and Preparation Method. This invention was developed by Wang Fei, Gao Yinsen, Pei Hongying, Ma Xi..
Semiconductor
| Sat 24 Oct 2026
Beijing, Oct. 23 -- Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device. This invention was developed by Shindome Aya, Kaneko Ryoma, Kajiwara Eisuke, Shimizu Mariko, Ikeda Naoki, Fujiwara Ikuo and Shimada Miyoko.
The patent application number is CN20261020267 20260108...
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Tokyo Electron Ltd and Tokyo Electron US Holdings have submitted a patent application for Wave-assisted Hybrid Plasma Source. This invention was developed by Ohata Mitsunori, Sridhar Shyam, Ventzek Peter Lowell George and Wang Qiang.
The patent application number is WO2026US16226 20260223. The patent public..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Tokyo Electron Ltd and Tokyo Electron US Holdings have submitted a patent application for Striker for Wafer Bonding. This invention was developed by Son Ilseok and Netzband Christopher Michael.
The patent application number is WO2026US10222 20260106. The patent publication number is WO2026212699 (A1). Inter..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Tokyo Electron Ltd and Tokyo Electron US Holdings have submitted a patent application for Apparatus and Method for Wafer Bonding. Lattin Christopher, Gildea Adam James and Netzband Christopher Michael developed the invention.
The patent application number is WO2026US10219 20260106. The patent publication nu..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Kubendran Rajkumar Chinnakonda, Habibi Mehdi and Ali Hussein have sought patent for Globally Synchronous Locally Asynchronous Event Based Image Sensor Readout.
The patent application number is WO2026US10212 20260105. The patent publication number is WO2026212697 (A1). International Patent Classification co..
Semiconductor
| Sat 24 Oct 2026
Beijing, Oct. 23 -- Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device. Suwa Takeshi, Iwakaji Yoko and Matsudai Tomoko developed the invention.
The patent application number is CN202510908345 20250702. The patent publication number is CN122373807 (A). International Pa..
Semiconductor
| Sat 24 Oct 2026
Beijing, Oct. 23 -- Huahong Semiconductor Mfg Wuxi Co Ltd and Huahong Semiconductor, Wuxi have submitted a patent application for Integrated Etching Method. This invention was developed by Xu Zedong, Lu Shicong, Wang Yuxin, Zhang Fan, Ji Fan, Wang Jian, Ding Jia and Shi Yan.
The patent application number is CN202610417251 202..
Semiconductor
| Sat 24 Oct 2026
Beijing, Oct. 23 -- Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device. This invention was developed by Suwa Takeshi, Iwakaji Yoko and Matsudai Tomoko.
The patent application number is CN202510915226 20250703. The patent publication number is CN122373448 (A). Internat..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Nat Univ Singapore and Applied Materials have applied WIPO patent for in Situ Nucleation of Diamond for Thermal Conductive Applications. Linn Nyi Myat Khine, Sahmuganathan Vicknesh, Saran Rinku, Mirsaidov Utkur, Tan Sze Chieh and Sudijono John developed it.
The patent application number is WO2026US21505 202..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Chengdu Boe Optoelectronics Tech Co Ltd and BOE Technology Group have submitted a patent application for Display Substrate and Display Apparatus. This invention was developed by Du Lili, Qin Chengjie, Hu Ming, Liu Cong, Wang Benlian, Zhang Wei and Huang Weiyun.
The patent application number is US2026197..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Chengdu Boe Optoelectronics Tech Co Ltd and BOE Technology Group have submitted a patent application for Display Substrate and Display Apparatus. This invention was developed by Chu Zhiwen, Feng Aoyuan, Dai Junxiu, Zhou Yang, Qu Yi, Wang Xinxin and Bai Lu.
The patent application number is US202619464466..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Beijing Boe Tech Development Co Ltd and BOE Technology Group have submitted a patent application for Display Substrate and Method for Manufacturing the Same, Display Panel and Display Device. Liu Wenqi, Sun Zhongyuan, Jiao Zhiqiang, Li Xinyu, Li Wei, An Che, Sun Qian, Wang Mingxing, Zhang Keyi, Yan Huajie,..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Beijing Boe Tech Development Co Ltd, BOE Mled Tech Co Ltd and BOE Technology Group have submitted a patent application for Encapsulation Film Element, Display Substrate and Display Module. This invention was developed by Zhang Shubai, Jin Liangliang, Li Jiaxin, Sun Wenjia, Zhao Le and Yang Zezhou.
The p..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 --Beijing Boe Tech Development Co Ltd, Chongqing Boe Optoelectronics Tech Co Ltd and BOE Technology Group have submitted a patent application for Array Substrate and Manufacturing Method Therefor. This invention was developed by Wang Rui, Cao Jing, Huang Zhonghao, Qi Chengjun, Wang Chunlei, Shen Wei, Wu Xu, N..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Jiangsu Urban and Rural Construction College has sought patent for Semiconductor Chip Image Segmentation Method and System Based on Multi-modal Memory Mechanism. This invention was developed by Tao Yucheng, Han Bangguo, Cao Peng, Gao Ting, Wang Shuxin and Du Daozhong.
The patent application number is CN20261..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Danish Graphene ApS has submitted a patent application for Graphene Oxide Additives for Silicon Anode Materials. Ottesen Martin, Buhl Kristian Birk and Bezza Ilham developed the invention.
The patent application number is WO2026EP60449 20260410. The patent publication number is WO2026215482 (A1). Internatio..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- International Solar Energy Res Center Konstanz EV has filed a patent application for Interdigitated Back Contact Solar Cell and Method of Producing an Interdigitated Back Contact Solar Cell. This invention was developed by Buchholz Florian and Linke Jonathan.
The patent application number is WO2026EP60374 2..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Yunnan Qijing Xinguang Semiconductor Equipment Co Ltd has submitted a patent application for Three-camera Visual Automatic Alignment and Flat Edge Correction Method of Silicon Carbide Wafer Laser Implicit Cutting Equipment. This invention was developed by Wang Min, Li Kui and Tan Xin.
The patent applicatio..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Fraunhofer-Gesellschaft has submitted a patent application for Communication Device for OOK Transmission with Variable Chip Length. This invention was developed by Ceran Marco and Jungnickel Volker.
The patent application number is WO2026EP60244 20260408. The patent publication number is WO2026215376 (A1). ..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Quanzhou Vocational and Technical University has submitted a patent application for Ceramic Substrate Surface Visual Inspection Method and Device, Electronic Equipment and Storage Medium. Zheng Yi, Wu Weixin, Yoo Jun Hee, Cai Quan, Li Hongyun and Wu Jiangwei developed the invention.
The patent application nu..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- World Intellectual Property Organization has released Carl Zeiss SMT patent application for Handling Device and Method for Handling an Element for a Semiconductor Technology Apparatus. This invention was developed by Wissel Kurt Stephan and Petasch Thomas.
The patent application number is WO2026EP60115 2026..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Hunan Aochuangpu Tech Co Ltd has submitted a patent application for Method and System for Calculating Angle and Grid Coordinates of Large-size Chip Array. This invention was developed by Hu Weitao, Yang Shunbo, Yang Gang, Wang Huirong and Xiang Zhouzhou.
The patent application number is CN202610692157 2026..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Hubei Weichu Photoelectric Co Ltd has submitted a patent application for Liquid Crystal Glass Substrate Polaroid Quality Detection Method and Device Based on Image Processing. Zhang Haopeng and Zeng Huajian developed the invention.
The patent application number is CN202610504149 20260416. The patent public..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Rilian Tech Group Co Ltd has submitted a patent application for Method and Device for Determining Tin Penetration Rate of Semiconductor and Electronic Equipment. This invention was developed by Yang Yanqing, Su Yuxuan and Xu Huaan.
The patent application number is CN202610481935 20260413. The patent public..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Leiniao Carbon Based Shanghai Battery Tech Co Ltd has submitted a patent application for Mxene Doped Silicon Carbon Negative Electrode Material, Preparation and Application in Gel-state Soft Package Lithium Ion Battery. Tong Shanghui developed the invention.
The patent application number is CN202610776475 ..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Leiniao Carbon Based Shanghai Battery Tech Co Ltd has filed a patent application for Mxene Composite Modified Material for Enhancing Interface Between Silicon Negative Electrode and Solid Electrolyte, Mxene Composite Modified Layer, Preparation Method and Application. This invention was developed by Tong Shan..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- World Intellectual Property Organization has released Idemitsu Kosan patent application for Electronic Substrate Material, Resin, and Production Method for Resin. This invention was developed by Chiba Kazunori, Hikosaka Takaaki, Morishita Hironobu and Fukita Momoe.
The patent application number is US202319141..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Shenzhen Xinkailai Industry Machine has filed a patent application for Radio Frequency Voltage Balancing Circuit, Filter, Chuck and Semiconductor Device. This invention was developed by Li Jieren, Niu Yubo and Zhong Weihong.
The patent application number is CN202610246183 20260228. The patent publication num..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Beijing Huacheng Electronic Co Ltd has submitted a patent application for Radio Frequency Power Supply, Radio Frequency Power Supply System and Semiconductor Process Equipment. This invention was developed by Ru Jiali, Li Jiabo and Li Guangjian.
The patent application number is CN20251020671 20250106. The ..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- World Intellectual Property Organization has received Barberan SA patent application for Method for Texturing a Substrate, and Textured Substrate. Barberan Latorre Jesus Francisco developed the invention.
The patent application number is WO2026ES70182 20260410. The patent publication number is WO2026215554 ..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- World Intellectual Property Organization has received ASML Netherlands patent application for Material Removal Apparatus and Methods of Removing Material from an Object Support. Koevoets Adrianus and Van Hal Paulus developed the invention.
The patent application number is WO2026EP56567 20260310. The patent pu..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Fogale Optique has submitted a patent application for Method and Device for Measuring Interfaces of a Structured Semiconductor Element. Petitgrand Sylvain and Legros Eric developed the invention.
The patent application number is WO2026EP56286 20260307. The patent publication number is WO2026214922 (A1). Int..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- World Intellectual Property Organization has released ASML Netherlands patent application for Metrology Apparatus, Substrate and Metrology Method. This invention was developed by Tabery Cyrus, Huisman Simon and Hesp Niels.
The patent application number is WO2026EP56168 20260305. The patent publication number ..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- IBM United Kingdom Ltd and International Business Machines have sought patent for Bio-field-effect Transistor with Enhanced Temporal Stability. This invention was developed by Hsieh Kuan Yu, Zafar Sufi and Goldfarb Dario.
The patent application number is WO2026EP55464 20260227. The patent publication number..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Xinsheng Silicon Material Tech Suzhou Co Ltd has submitted a patent application for Rapidly Circulating Polycrystalline Silicon Preparation System and Process. This invention was developed by Li Hongqiang, Chen Liqun and Ma Fang.
The patent application number is WO2026CN89951 20260410. The patent publicatio..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- World Intellectual Property Organization has published Ying Wucheng patent application for Boundary Prediction Model for Zero-voltage Switching Turn-on of Semiconductor Switching Device, Generation Method, and Boundary Determination Method. The invention was developed by Ying Wucheng.
The patent application..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Roudian Wuhan Tech Co Ltd has submitted a patent application for Continuous Silicon Nanowire Negative Electrode Material Based on ALD Seed Layer Induced Mesoporous Confinement and Preparation Method Thereof. This invention was developed by Xu Bojun, Zhang Xuanxuan, Wu Xinbei and Xiao Yi.
The patent applica..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Xi'an Xinsanli Composite Material Tech Co Ltd has submitted a patent application for High-energy-density Nano Silicon Anode with Double-shell-core Structure. Boom Hennigama Lianage Marika, Li Guodong, Li Haoduo, Si Lianhua and Li Tiehong developed the invention.
The patent application number is CN202610519..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Sanechips Technology has submitted a patent application for Vehicle Fault Processing Method and Vehicle Chip. This invention was developed by Huang Xinxing and Lei Guang.
The patent application number is US202319143470 20230418. The patent publication number is US2026217264 (A1). International Patent Classifi..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Nanjing University of Science & Technology has submitted a patent application for Micro-nano Structure Enhanced Semiconductor Heterogeneous Interface Heat Transport Simulation Method. This invention was developed by Luo Wenzhu, Yin Ershuai and Li Qiang.
The patent application number is CN202610538151 2026042..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Signify has submitted a patent application for Light Emitting Diode Filament. Hikmet Rifat, Van Bommel Ties and Heijmans Martinus developed the invention.
The patent application number is WO2026EP59106 20260330. The patent publication number is WO2026215049 (A1). International Patent Classification codes ar..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Cambridge Mechatronics has filed a patent application for a Method of Controlling an Actuator Assembly. This invention was developed by Brown Andrew Benjamin Simpson and Heijne Nicholas.
The patent application number is WO2026EP58092 20260323. The patent publication number is WO2026214984 (A1). Internationa..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- ASML Netherlands has submitted a patent application for Method and System for Determining Optical Aberrations and Lithographic Apparatus Including the System. This invention was developed by Gui Li and Leenders Martinus.
The patent application number is WO2026EP57556 20260318. The patent publication number ..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- World Intellectual Property Organization has received ASML Netherlands patent application for Actuator System for Positioning an Object. Shasho Jeffrey, Nayfeh Samir A, Wilson Andrew, Del Puerto Santiago E, Loganathan Muthukumaran, Verdirame Justin, Kalluri Ravi and Lynch Finnegan developed the invention.
The..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- World Intellectual Property Organization has received Nexperia BV and Nexperia Technology (Shanghai) patent application for a Semiconductor Power Package. Cao Pulong, Wang Ruitong and Gong Wei developed the invention.
The patent application number is WO2025CN87482 20250407. The patent publication number is ..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Guangdong OPPO Mobile Telecommunications has sought patent for Data Collection Triggering Method and Apparatus, Device, Medium, and Chip. This invention was developed by Shen Yang, Fan Jiangsheng and Chen Jingran.
The patent application number is WO2025CN87448 20250407. The patent publication number is WO2026..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- World Intellectual Property Organization has published BOE Tech Group Co Ltd and BOE MLED Technology patent application for Light-emitting Substrate. The invention was developed by Li Xueqiao, Mi Lantian, Xiong Zhijun, Chen Zedan, Ma Junjie, Yu Haibo and Yang Shanwei.
The patent application number is WO2025..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- TetraMem has sought patent for Computing Systems Incorporating High-bandwidth RRAM Stacks. This invention was developed by Ge Ning and Zhang Minxian.
The patent application number is WO2026US22560 20260406. The patent publication number is WO2026213626 (A1). International Patent Classification code is H10B6..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Caihong Display Devices has applied WIPO patent for Cooling Air Device for Substrate Glass Forming by Overflow Process and Method Thereof. Luo Ting, Ren Yongjing, Hu Weidong and Zhang Zhijun developed it.
The patent application number is US202519437330 20251231. The patent publication number is US2026217588 (..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- State Intellectual Property Office of China has received Shanghai Zhuide New Material Tech Co Ltd patent application for Flexible Transparent Semiconductor Display Film Material. Yang Zijiang, Wang Yuhui, Zhang Anbing, Cong Xinlong, Wang Yubin, Wu Wei, Kang Ning and Lyu Zhiwen developed the invention.
The ..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- World Intellectual Property Organization has released Canon patent application for Method for Manufacturing Substrate Bonded Body and Method for Manufacturing Liquid Ejection Substrate. This invention was developed by Ishikawa Tetsushi.
The patent application number is US202619574677 20260323. The patent publ..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Yangtze Memory Technologies has sought patent for Memory Control Method, Memory and Memory System. This invention was developed by Li Jianjie.
The patent application number is CN202610280649 20220901. The patent publication number is CN122369545 (A). International Patent Classification codes are G11C16/04 ..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Toshiba Memory has submitted a patent application for Storage Device. Suzuki Yoshinao, Maejima Hiroshi, Hashimoto Toshifumi and Isobe Katsuaki developed the invention.
The patent application number is CN202510815459 20250618. The patent publication number is CN122369544 (A). International Patent Classifica..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Yangtze Memory Technologies has sought patent for Memory Data Erasing Method, Storage Device and Storage System. This invention was developed by Li Bo and Zhang Yi.
The patent application number is CN202610251890 20211025. The patent publication number is CN122369543 (A). International Patent Classificatio..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Beijing Linghang Huaxin Tech Co Ltd has filed a patent application for Control Method for Programming Initial Voltage of NAND Memory, NAND Memory and Vehicle. This invention was developed by Shao Guoyu.
The patent application number is CN202610225329 20260225. The patent publication number is CN122369542 (..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- Samsung Electronics has submitted a patent application for Semiconductor Memory Device. This invention was developed by Kim Seung-hoon, Kang Soo-jin, Lee Hyun-jin, Kim Yong Kwan, Kim Min-soo, Kim Hui-jung, Chae Hee-jae, Cha In-ho and Kang Min-joo.
The patent application number is CN202511856981 20251210. The..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- State Intellectual Property Office of China has received Xincun Technology (Wuhan) patent application for Phase Change Memory and Operation Method Thereof. Zhou Guangle, Zhang Wenguang and Cai Wang developed the invention.
The patent application number is CN202610319174 20260316. The patent publication num..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- State Intellectual Property Office of China has released Samsung Electronics patent application for Receiver Circuit Including Asymmetric Bandwidth Compensation Circuit. This invention was developed by Kim Woo Jung, Ahn Hyun-woo, Lin Bocheng and Kim Dong-sung.
The patent application number is CN20251200560..
Semiconductor
| Fri 23 Oct 2026
Beijing, Oct. 22 -- State Intellectual Property Office of China has published Samsung Electronics patent application for Voltage Converter, Method of Operating Same, and Memory Device. The invention was developed by Joo Seong-won, Park Su-min, Kwon Yong-jin, Shin Hong-seok, Park Jae-hyun and Lee Sun-kyu.
The patent application ..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Disco has sought patent for Calculating Method, Detecting Apparatus, and Chip Manufacturing Method. This invention was developed by Masada Takayuki and Nomura Yutaro.
The patent application number is US202519430904 20251223. The patent publication number is US2026216827 (A1). International Patent Classificati..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Infineon Technologies has submitted a patent application for Soldering Method. This invention was developed by Heinrich Alexander and Simmann Maximilian.
The patent application number is US202619454655 20260121. The patent publication number is US2026216807 (A1). International Patent Classification codes are ..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Datang Mobile Communications Equipment has sought patent for Resource Determination Method and Apparatus, Device, Medium, and Chip. This invention was developed by Gao Xuejuan, Shen Shuling, Zhao Yue and Si Qianqian.
The patent application number is WO2026CN86078 20260326. The patent publication number is WO2..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Huawei Technologies has submitted a patent application for Memory, Processor Chip and Electronic Device. Zhang Xuan, Shang Xinchao, Min Yancan, Xiang Zenglong and He Zhilong developed the invention.
The patent application number is WO2026CN83859 20260317. The patent publication number is WO2026214353 (A1). In..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- World Intellectual Property Organization has received Huawei Technologies patent application for Image Processing Method, Electronic Device, Storage Medium, and Chip System. Li Quewei, Li Xinyu, Zhao Jingke, Guo Chaoxiang, Xu Chao and Wang Shu developed the invention.
The patent application number is WO2026CN..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- ACM Research, Shanghai has submitted a patent application for Chemical Solution Supply System, Solution Replacement Method, Substrate Processing Device, and Medium. Hu Haibo, Zhang Xiaoyan and Tao Zewei developed the invention.
The patent application number is WO2026CN78805 20260212. The patent publication ..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- T Head Shanghai Semiconductor Co Ltd has sought patent for Resource Control Method, Resource Controller and Resource Control System. This invention was developed by Liu Jingbo, Zheng Xinqian and Qin Junjie.
The patent application number is WO2026CN78544 20260211. The patent publication number is WO202621428..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- Honeywell International has submitted a patent application for Semiconductor Package Manufacturing Methods Using Hybrid Die Bonding with Spin-on Siloxane Materials. Sundaram Venky, Kerkar Awdhoot, Balantrapu Krishna, Oneill Mark, Nguyen Tiffany, Gebrebrhan Amanuel, Varaprasad Desaraju (prasad), Wu Zeyu and Hua..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- World Intellectual Property Organization has received Micron Technology patent application for Low Resistance Structures in Systems. Parekh Kunal R, Zaleski Mark, Singh Akshay N, Badrieh Fuad, Kawakita Keizo and Bhushan Bharat developed the invention.
The patent application number is WO2026US22130 20260402. T..
Semiconductor
| Fri 23 Oct 2026
Geneva, Oct. 22 -- World Intellectual Property Organization has published Microchip Technology patent application for Method for Adaptive Common-mode Disturbance Compensation at Baud Rate in Ethernet Physical Layer Transceivers and Ethernet Physical Layer Transceiver Providing Adaptive Common-mode Disturbance Compensation at Bau..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- U.S. Patent and Trademark Office has released Microchip Technology patent application for Electrical Component Package with Component-accommodating Cavity. This invention was developed by Pandey Shesh Mani and Estrada Fernando.
The patent application number is US202619545438 20260220. The patent publicati..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Qualcomm has sought patent for Hybrid Recess Depth Substrate Structure. This invention was developed by Choi Seongryul, Buot Joan Rey Villarba and Kang Kuiwon.
The patent application number is US202519298696 20250813. The patent publication number is US20260324522 (A1). International Patent Classification..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- U.S. Patent and Trademark Office has released Texas Instruments Incorporated patent application for Semiconductor Package with Bridge Clip. This invention was developed by Facal Charmaine Grace, Colte Jason B, Montoya Jonathan Andrew and Molina John Carlo C.
The patent application number is US202519402443..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Fuji Electric has submitted a patent application for Semiconductor Device. This invention was developed by Hirao Akira, Fukuda Taisuke and Osaki Koji.
The patent application number is US202619688153 20260526. The patent publication number is US20260324519 (A1). International Patent Classification codes ..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Qualcomm has filed a patent application for Thermal Via Interposer Substrate. This invention was developed by Buot Joan Rey Villarba, Moon Hyun-il and Kang Kuiwon.
The patent application number is US202519296720 20250811. The patent publication number is US20260324516 (A1). International Patent Classifica..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Taiwan Semiconductor Manufacturing Co Limited has sought patent for Hybrid-bonding Stack Including a Processor Die and Multi-cache-level Memory Dies and Methods of Forming the Same. This invention was developed by Wang Yu-jen, Huang Kuo-ching, Chen Yu-sheng, Shen Kuei-hung, Ong Yi Ching and Chuang Harry-ha..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Samsung Electronics has submitted a patent application for Micro Semiconductor Chip Transfer Substrate and Method of Manufacturing Display Apparatus. This invention was developed by Kim Dongkyun, Hwang Kyungwook, Hwang Junsik, Kim Hyunjoon, Hong Seogwoo, Kim Dongho and Park Joonyong.
The patent applicatio..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- United Microelectronics Corporation has submitted a patent application for Semiconductor Device and Method for Fabricating the Same. This invention was developed by Lin Chien-ting, Wang Yu-ping and Hsu Min-shiang.
The patent application number is US202519207427 20250514. The patent publication number is..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Semiconductor Package Structure with Stiffener Mold and Method of Forming the Same. Yew Ming-chih, Chang Chieh-ming, Yan Kathy Wei, Chen Chen-shien and Chang Kuo-chin developed it.
The patent application number is US202519174..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Samsung Electronics has submitted a patent application for Semiconductor Package Including Multiple Molding Layers. This invention was developed by Lee Eun Young and Lee Sangkyu.
The patent application number is US202519414712 20251210. The patent publication number is US20260324494 (A1). International ..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device and Method of Manufacturing Semiconductor Device. This invention was developed by Kaguchi Naoto, Ajisaka Shimon and Kudo Tomohito.
The patent application number is US202219109322 20221111. The patent publication number is US20..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- U.S. Patent and Trademark Office has received Innolux patent application for Semiconductor Device and Semiconductor Package. Yen Chung-wen, Chang Ti-chung and Yueh Jui-jen developed the invention.
The patent application number is US202619466486 20260201. The patent publication number is US20260324491 (A1)..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- U.S. Patent and Trademark Office has published Sandisk Technology patent application for Fine Pitch Vertically Connected Semiconductor Packages. The invention was developed by Chen Han-shiao, Vodrahalli Nagesh, Yang Xuyi, Huang Yiqin, Yu Fen, Zhang Cong and Chen Hsuan-ling.
The patent application number i..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- JCET Man Co Ltd has applied United States patent for Package Structure and Method for Forming the Same. Yang Cheng developed it.
The patent application number is US202619640022 20260406. The patent publication number is US20260324485 (A1). International Patent Classification codes are H10W72/00, H10W72/..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Packages and Methods of Forming the Same. Ho Yi Chen and Wen Li-an developed the invention.
The patent application number is US202519177681 20250414. The patent publication number is US20260324482 (A1). Cooper..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Xilinx has applied United States patent for Loop-back Redistribution Layer Design to Improve Integrated Circuit Package Reliability. Kim Myongseob, Chang Cheang Whang and Liu Henley developed it.
The patent application number is US202519177990 20250414. The patent publication number is US20260324477 (A1)...
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Fuji Electric has submitted a patent application for Semiconductor Device. This invention was developed by Nishizawa Tatsuo.
The patent application number is US202619693844 20260601. The patent publication number is US20260324476 (A1). International Patent Classification code is H10W70/66. Cooperative P..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Samsung Electronics has submitted a patent application for Semiconductor Package Including Noise Reducing Structure. This invention was developed by Ko Hyojung, Moon Hyunjong, Choi Inho and Lee Kwangjin.
The patent application number is US202519424995 20251218. The patent publication number is US2026032..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Mitsubishi Electric has filed a patent application for Power Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Shikasho Yuji, Ichikawa Keitaro, Kawahara Fumihito and Shikano Taketoshi.
The patent application number is US202619707770 20260615. The patent publication num..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Kore Semiconductor Co Ltd has submitted a patent application for Interposer Structure and Manufacturing Method Thereof. Chen Wei-ming and Ni Ching-yu developed the invention.
The patent application number is US202619644129 20260410. The patent publication number is US20260324469 (A1). International Pate..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- U.S. Patent and Trademark Office has received Fuji Electric patent application for Semiconductor Device. Gohara Hiromichi, Taniguchi Katsumi, Matsuzawa Kensuke and Nakamura Yoko developed the invention.
The patent application number is US202619692843 20260529. The patent publication number is US20260324..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- U.S. Patent and Trademark Office has published Toshiba patent application for Mounting Board. The invention was developed by Sato Katsuya and Yamamoto Tetsuya.
The patent application number is US202619463671 20260129. The patent publication number is US20260324463 (A1). International Patent Classificati..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- U.S. Patent and Trademark Office has published MediaTek patent application for Semiconductor Package Using Combination of Different Packaging Technologies for Die Complex Expansion. The invention was developed by Gadey Siva, Nalamalpu Ankireddy, Kumashikar Mahesh K, Kumar Arvind, Subbareddy Dheeraj Reddy a..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Toshiba Electronic Devices & Storage Corp and Toshiba have submitted a patent application for Semiconductor Device. Ishii Masashi and Liu Yuzeng developed the invention.
The patent application number is US202619464058 20260129. The patent publication number is US20260324460 (A1). International Patent Cl..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Intel has submitted a patent application for Glass Substrate Device with Embedded Components. This invention was developed by Chen Haobo, Nie Bai, Ecton Jeremy D, Shan Bohan, Arrington Kyle Jordan, Duan Gang, Xu Dingying, Feng Hongxia, Lin Ziyin, Pietambaram Srinivas Venkata Ramanuja, Bai Yiqun, Marin Bran..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- ROHM has filed a patent application for Semiconductor Device. This invention was developed by Mita Maki, Imo Norio and Mikami Moe.
The patent application number is US202619466988 20260202. The patent publication number is US20260324453 (A1). International Patent Classification codes are H10W70/40, H10W7..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- U.S. Patent and Trademark Office has received Mitsubishi Electric patent application for Semiconductor Device, Method of Manufacturing Semiconductor Device, and Power Conversion Apparatus. Hino Yasunari developed the invention.
The patent application number is US202619549872 20260225. The patent publicati..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- Ibiden has submitted a patent application for Method for Manufacturing Wiring Substrate. Bhandari Ramesh and Sakai Jun developed the invention.
The patent application number is US202619638608 20260403. The patent publication number is US20260324450 (A1). International Patent Classification codes are B32B3..
Semiconductor
| Fri 23 Oct 2026
Alexandria, Oct. 22 -- ThinSiC has filed a patent application for Carbon Assisted Semiconductor Dicing and Method. This invention was developed by Miller Stephen Daniel, Seo Jinho, Ravi Tirunelveli Subramaniam and El Dakrouri Ashraf Ahmed.
The patent application number is US202619462377 20260128. The patent publication number i..
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