Semiconductor
| Fri 14 Aug 2026
Beijing, Aug. 15 -- China Building Materials Glass New Material Research Inst Group Co Ltd has submitted a patent application for Glass Substrate for Electronic Packaging. This invention was developed by Cui Jiedong, Shi Lifen, Zhao Fengyang, Ni Jia, Sun Chenrui, Shan Chuanli, Han Na, Wang Weiwei, Liu Junfei, Cao Xin and Ke Zhen..