Semiconductor
| Thu 19 Mar 2026
Geneva, March 19 -- Kyushu Univ National Univ Corporation and NAMICS Corporation have filed a patent application for Photocurable Resin Composition, Adhesive, Sealant, Coating Agent, Cured Product, Semiconductor Device, Electronic Component, and Curing, Bonding, Sealing, and Coating Methods Using Photocurable Resin Composition. ..