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10:36:17 Wed 12 Aug 2026

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Industry

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(43)

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(34)

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(31)

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(29)

(26)

Applied Materials

(19)

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(19)

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(18)

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(17)

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(16)

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(16)

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(15)

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(13)

Yangtze Memory Technologi

(13)

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(12)

Realtek Semiconductor Cor

(12)

Semiconductor Components

(12)

Mitsubishi Electric

(11)

Semiconductor Energy Labo

(11)

(10)

(10)

GlobalFoundries

(9)

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(9)

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(8)

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(8)

Infineon Technologies

(8)

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(8)

(8)

STMicroelectronics Intern

(8)

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(8)

(8)

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(7)

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(7)

(7)

Rongyao Terminal

(7)

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(7)

Spreadtrum Semiconductor

(7)

Winbond Electronics

(7)

Huahong Semiconductor Mfg

(6)

Micron Technology Inc [us

(6)

(6)

(5)

Fujian Jinhua Integrated

(5)

Hangzhou Firstack Tech Co

(5)

Spreadtrum Communications

(5)

Taiwan Semiconductor Manu

(5)

Zhejiang Liufang Semicond

(5)

Baoding City Putianao Ele

(4)

Beijing Integrated Circui

(4)

Beijing Unisoc Communicat

(4)

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(4)

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(4)

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(4)

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(4)

(4)

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(4)

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(4)

Semiconductor Manufacturi

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(4)

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(4)

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(4)

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(4)

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(4)

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(4)

Alpha and Omega Semicondu

(3)

BOE Technology Group

(3)

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(3)

Beijing Chaoxian Memory R

(3)

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(3)

CSMC Technologies

(3)

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(3)

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(3)

EV Group E Thallner

(3)

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(3)

Harbin Inst Of Technology

(3)

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(3)

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(3)

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(3)

IRICO Hefei LCD Glass

(3)

Infineon Tech Americas Co

(3)

Institute of Semiconducto

(3)

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(3)

Jingling Ningbo New Energ

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(3)

Lisen Noco Company

(3)

Maxone Semiconductor Suzh

(3)

(3)

(3)

(3)

Nuvoton Technology

(3)

Renesas Electronics

(3)

(3)

Robert Bosch Co Limited

(3)

(3)

SK Hynix Nand Product Sol

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SanDisk Technologies

(3)

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(3)

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(3)

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Taiwan Semiconductor Co L

(3)

United Microelectronics C

(3)

University of Electronic

(3)

Wuhan Chuxing Technology

(3)

Xiaomi Automobile Technol

(3)

Zhejiang Ruitaixin Machin

(3)

ACM Research, Shanghai

(2)

ASM International Holding

(2)

Advanced Micro Devices

(2)

Anhui Lianghuo Semiconduc

(2)

Anhui University

(2)

(2)

(2)

BOE Technology Group; Bei

(2)

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(2)

Beijing Inst Technology

(2)

Beijing Institute of Mech

(2)

Beijing Superstring Acade

(2)

Beijing University

(2)

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(2)

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(2)

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(2)

Chipone Technology, Beiji

(2)

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(2)

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(2)

Forehope Electronic Ningb

(2)

(2)

Gexin USA Integrated Circ

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(2)

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(2)

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(2)

Guangxi Huaxin Zhenbang S

(2)

(2)

Hangzhou Fullsemi Semicon

(2)

Hangzhou Shuotian Tech Co

(2)

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(2)

Harbin Keyou Semiconducto

(2)

Hefei Haitu Microelectron

(2)

Heraeus Electronics

(2)

Huaneng Jiayuguan New Ene

(2)

Hubei Jiangcheng Chip Pil

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Hubei Xinqing Tech Co Ltd

(2)

(2)

(2)

(2)

Institute of Microelectro

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International Business Ma

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JSR Corporation

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

(2)

Lam Res Corp [us]; Lam Re

(2)

Lianshuo Semiconductor Te

(2)

(2)

(2)

Nantong Limeng New Materi

(2)

(2)

Nanya Technology

(2)

Ningbo All Semi Micro Ele

(2)

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(2)

Novatek Microelectronics

(2)

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(2)

Panasonic Intellectual Pr

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Powerchip Semiconductor M

(2)

(2)

Quanzhou Sanan Semiconduc

(2)

Riyuexin Advanced Tech Re

(2)

SAE Technologies Developm

(2)

Samsung Display

(2)

Shaanxi Photoelectron Lea

(2)

Shandong Liguan Microelec

(2)

Shandong University

(2)

Shanghai Bangxin Semicond

(2)

Shanghai New Silicon Poly

(2)

(2)

Shenzhen Liande Semicondu

(2)

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(2)

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(2)

Sumitomo Electric Industr

(2)

Taiwan Semiconductor Manu

(2)

Tianjin Lantian Solar Tec

(2)

Tokyo Electron Ltd [jp];

(2)

(2)

Toshiba Electronic Device

(2)

(2)

(2)

Tsinghua University

(2)

Western Digital Tech Inc

(2)

(2)

(2)

Wuhan Xinxin Semiconducto

(2)

Xi\'an Jiaotong Universit

(2)

Xiamen Sky Semiconductor

(2)

Xian Xinxin Material Tech

(2)

Xincun Technology (Wuhan)

(2)

Xinsheng Intelligent Tech

(2)

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(2)

Zhongke Xinci Tech Zhuhai

(2)

Zhongmao Green Energy Tec

(2)

Zhongtian Jingke Ningbo S

(2)

ams-OSRAM International

(2)

58th Research Inst Of Cet

(1)

(1)

AMS Sensors USA

(1)

(1)

AUO Corporation

(1)

Adeia Semiconductor Bondi

(1)

Advanced Micro Fabricatio

(1)

Advanced Semiconductor En

(1)

Aiwoge Sensing Tech Wuxi

(1)

Akm Electronics Ind Panyu

(1)

Alcatel Submarcom

(1)

(1)

Amer Tech Co Ltd

(1)

Amphenol Canada Corp

(1)

(1)

(1)

Angkun Vision Beijing Tec

(1)

Anhui Changfei Advanced S

(1)

Anhui Hoivway Optoelectro

(1)

Anhui Huaxi Semiconductor

(1)

Anhui Huaxin Micro Nano I

(1)

Anhui Jingtian New Energy

(1)

Anhui Jinshi Super Hard N

(1)

Anhui Lianpeng Zhilian Te

(1)

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(1)

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(1)

Anhui Qingzhi Tech Develo

(1)

Anhui Rujiaosiqi New Mate

(1)

Anhui Sixiang Semiconduct

(1)

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(1)

Anhui Yinfeng Electronics

(1)

Anhui Yuehao Electronic E

(1)

Applied Materials Israel

(1)

Ardenne Asset Gmbh & Co K

(1)

Asml Netheriands B V [nl]

(1)

Atlas Magnetics

(1)

(1)

Avago Technologies Intern

(1)

Avary Tech Co Ltd; Avary

(1)

BOE Huacan Optoelectronic

(1)

BOE Technology Group Co L

(1)

BOE Technology Group; Hef

(1)

(1)

Banben Metal Changzhou

(1)

Baotou City Huashang Rare

(1)

Baya Systems Inc

(1)

Beijing Anku Yingxin Tech

(1)

Beijing Automation Contro

(1)

Beijing Boe Tech Developm

(1)

Beijing Changcheng Instit

(1)

Beijing ESWIN Computing T

(1)

Beijing Huahang Radio Mea

(1)

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(1)

Beijing Innomem Tech Co L

(1)

Beijing Inst Of Smart Ene

(1)

Beijing Inst Technology;

(1)

Beijing Intellectual Prop

(1)

Beijing Jingcai Semicondu

(1)

Beijing Micvic Biotech Co

(1)

Beijing Mingxin Qirui Tec

(1)

Beijing Quantum Informati

(1)

Beijing Semiconductor Spe

(1)

Beijing Shougang Co Limit

(1)

Beijing Technology & Busi

(1)

Beijing Tsing Micro Intel

(1)

Beijing University of Civ

(1)

Beijing University of Pos

(1)

Beijing Xianxin Technolog

(1)

Beijing Yaoneng Tech Co L

(1)

Beijing Youzhuju Network

(1)

Beijing Zhongyuan Yishang

(1)

Bosch Automotive Products

(1)

Bridge Semiconductor

(1)

British Telecommunication

(1)

Brooks Automation US

(1)

Browning Raymond

(1)

(1)

CETHIK Group; Huazhong Un

(1)

(1)

Casi Vision Tech Luoyang

(1)

Cccc Highway Bridges Nati

(1)

Ccteg Coal Mining Researc

(1)

Central Glass Co Limited

(1)

(1)

ChangXin Memory Technolog

(1)

Changchun Xinjie Tech Co

(1)

Changchun Yonggu Tech Co

(1)

Changfei Advanced Semicon

(1)

Changsha Huashi Semicondu

(1)

Changshu Institute of Tec

(1)

Changxin Jidian Beijing S

(1)

Changzhou Correll Tech Co

(1)

Changzhou Jianhualing Aut

(1)

Changzhou Nanfei Microele

(1)

Chaoyang Shuomei High Pur

(1)

Chengdu Analog Circuit Te

(1)

Chengdu BOE Optoelectroni

(1)

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(1)

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(1)

Chengdu Denway Newtype Me

(1)

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(1)

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(1)

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(1)

Chengdu Polytechnic

(1)

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(1)

Chengdu Wanzhong Weilai B

(1)

Chengdu Weiguang Jidian T

(1)

Chengdu Xinghuantianxia T

(1)

Chengdu Yicheng Integrate

(1)

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(1)

Chengdu Zhongwei Crystal

(1)

Chenri Tech Nanjing Co Lt

(1)

Chery Automobile

(1)

China Building Materials

(1)

China Electronics Technol

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China Japan Friendship Ho

(1)

China Resources Microelec

(1)

China Satellite Network I

(1)

China Wafer Level CSP

(1)

Chipsea Technology Shenzh

(1)

Chongqing Inst Green & In

(1)

Chongqing Inst Of Graphen

(1)

Chongqing Kangjia Optoele

(1)

Chongqing Maite Photoelec

(1)

Chongqing Saibao Industri

(1)

Chongqing University of P

(1)

Chongqing Vocational Univ

(1)

Chongqing Yineng Tech Co

(1)

Chongqing Yuntong Technol

(1)

Chongqing Zixingzhe Tech

(1)

Chung Ang University Indu

(1)

Cirrus Logic Internationa

(1)

Cista System Corp [ky]; C

(1)

Cohpros Int Co Ltd

(1)

Core Photoelectric Tech S

(1)

(1)

(1)

Crsc Communication & Info

(1)

(1)

Dalian Institute of Chemi

(1)

Dalian Medical University

(1)

Daoke Jiangsu High Tech M

(1)

Denka Co Limited

(1)

Deyi Microelectronics Co

(1)

Dingdao Zhixin (Shanghai)

(1)

Dongguan Kewei Automation

(1)

Dongguan Tongke Electroni

(1)

Dongguan Tongxin New Mat

(1)

Dongguan Wen Tong Electro

(1)

Dongguan Yuanxin Semicond

(1)

Dongguan Yuncai Printing

(1)

Dongguan Zeyou Tech Co Lt

(1)

Dowa Electronics Material

(1)

Dugen Photoelectric Tech

(1)

(1)

Eaton Intelligent Power

(1)

Ecole Polytechnique Fed D

(1)

Effect Photonics B V

(1)

Einsnext Pte Ltd

(1)

Elane Beijing Data Tech C

(1)

Electric Power Research I

(1)

Ellenberger & Poensgen

(1)

Enkris Semiconductor

(1)

Envirologix Inc

(1)

(1)

Etron Tech Inc [tw]; Inve

(1)

Exsense Microelectronics

(1)

First Research Inst Of Th

(1)

Flat Glass Group

(1)

Forehope Electronic, Ning

(1)

Fujian Fushun Microelectr

(1)

Fujian Jingxu Semiconduct

(1)

Fujian Siboly Envirotech

(1)

Fulian Yuzhan Technology

(1)

Fulongjie Suzhou Hydrogen

(1)

Furukawa Electric

(1)

Fushi Zhitong Electronic

(1)

Fuzhou Enxi Tech Co Ltd

(1)

GCL System Integration Te

(1)

GalaxyCore Shanghai

(1)

Gallant Micro Machining

(1)

Ganjiang Innovation Resea

(1)

Gaojing Solar Energy; Gua

(1)

Gaojing Solar Energy; Qin

(1)

General Electric Tech Gmb

(1)

Giga Force Electronics Co

(1)

GlobalFoundries Singapore

(1)

Globalfoundries Sg Pte Lt

(1)

Globalfoundries Us Inc [u

(1)

(1)

Guangdong Hongyixin Autom

(1)

Guangdong Juhua Printing

(1)

Guangdong Kezhuo Semicond

(1)

Guangdong Mingyang Film T

(1)

Guangdong Pusaida Materia

(1)

Guangdong Tengcai Technol

(1)

Guangdong University of T

(1)

Guangdong Xincheng Hanqi

(1)

Guangdong Xincheng Hanqi

(1)

Guangdong Xinyueneng Semi

(1)

Guangdong Xuhong Semicond

(1)

Guangdong Zhineng Semicon

(1)

Guangdong Zhongke Hongtai

(1)

Guangliwei Beijing Tech C

(1)

Guangzhou Aoshi Tech Co L

(1)

Guangzhou Bingo Software

(1)

Guangzhou Leyi Invest Co

(1)

Guangzhou Medical Univers

(1)

Guangzhou National Labora

(1)

Guangzhou Nuoding Intelli

(1)

Guangzhou Qinglanshidai S

(1)

Guangzhou Shengtainuo New

(1)

Guangzhou Xulong Micro Na

(1)

Guangzhou Zhongneng Speci

(1)

Guangzhou Zhono Electroni

(1)

Gudeng Prec Industral Co

(1)

Gudeng Prec Industrial Co

(1)

Guizhou Hangrui Aviation

(1)

Guizhou Normal University

(1)

Haiguang Information Tech

(1)

Haiguang Integrated Circu

(1)

Haipo Chuzhou Material Te

(1)

(1)

Hangzhou Beihang Universi

(1)

Hangzhou Changchuan Techn

(1)

Hangzhou Cobetter Semicon

(1)

Hangzhou Dianzi Universit

(1)

Hangzhou Fuxin Semiconduc

(1)

Hangzhou Guangzhiyuan Tec

(1)

Hangzhou International Sc

(1)

Hangzhou Jihai Semiconduc

(1)

Hangzhou Jinqi Electronic

(1)

Hangzhou Puxiguangjing Se

(1)

Hangzhou Xinyun Optoelect

(1)

Hans Semiconductor Equipm

(1)

Hanwei Electronics Group

(1)

Hefei BOE Display Technol

(1)

Hefei Boe Ruisheng Tech C

(1)

Hefei Chipsea Electronic

(1)

Hefei Institutes of Physi

(1)

Hefei Kangxinwei Storage

(1)

Hefei Shengchuang Microel

(1)

Hefei Taiwo Intelligent E

(1)

Heidelberg University

(1)

Henan Weina Semiconductor

(1)

Hengdian Group DMEGC Magn

(1)

Heshengyuan Packaging Mat

(1)

Heyuen China Base Electro

(1)

Hisense Visual Technology

(1)

Honeycomb Battery Co

(1)

Hongqi Integrated Circuit

(1)

Hongrun Semiconductor (Su

(1)

Hospital Affiliated To Fu

(1)

Hoya Optical Lab Inc

(1)

Huabanyun Technology Co L

(1)

Huahong Semiconductor Mfg

(1)

Huaneng Qinbei Power Gene

(1)

Huatian Tech Nanjing Co L

(1)

(1)

Huaxin Micro Semiconducto

(1)

Hubei 3d Semiconductor In

(1)

Hubei Central China Tech

(1)

Hubei Huabo Auto Parts Co

(1)

Hubei Jiufengshan Laborat

(1)

Hubei New Huaguang Inf Ma

(1)

Hubei University of Techn

(1)

Hubei Xingchen Technology

(1)

Huizhou Funeng Tech Co Lt

(1)

Huizhou Hengxinglong Tech

(1)

Huizhou Jinsheng New Elec

(1)

Huizhou Xinjinquan Precis

(1)

Hunan Aochuangpu Tech Co

(1)

Hunan Charmhigh Electrome

(1)

Hunan Disaster Prevention

(1)

Hunan Greatwall Galaxy Te

(1)

Hunan Lianchuangxing Elec

(1)

Hunan Meicheng New Materi

(1)

Hunan Qilai Tech Developm

(1)

Hunan Shuoke Jinglei Semi

(1)

Hunan Yongshan Lithium In

(1)

Hunan Yongxincheng Intell

(1)

Hunan Zerui New Mat Co Lt

(1)

Huzhou Micro Nano Zhenxin

(1)

(1)

(1)

Ics Intelligent Control S

(1)

(1)

Idemitsu Kosan; Japan Dis

(1)

Imec Vzw [be]; KU Leuven

(1)

Industrial Technology Res

(1)

Infineon Tech Ag [de]; In

(1)

Infineon Technologies Ame

(1)

Inha Univ Research And Bu

(1)

Innatera Nanosystems

(1)

Inner Mongolia Baotou Ste

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Inner Mongolia Xinte Sili

(1)

Inner Mongolia Zhongqi Co

(1)

(1)

(1)

JSW Aktina System

(1)

(1)

Jenoptik Optical Systems

(1)

Ji Hua Laboratory

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Jiangsu Changjing Tech Co

(1)

Jiangsu Fuxu Tech Manufac

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Jiangsu Hanwei Semiconduc

(1)

Jiangsu Heyi Guangxian Te

(1)

Jiangsu Huanneng Silicon

(1)

Jiangsu Lilong Semiconduc

(1)

Jiangsu Lixiang Optics Te

(1)

Jiangsu Nepes Semiconduct

(1)

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Jiangsu Shunxing Refracto

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Jiangsu Tanglong Electron

(1)

Jiangsu Tianke Heda Semic

(1)

Jiangsu Wuxi Jingwei Tian

(1)

Jiangsu Yuefan Semiconduc

(1)

Jiangsu Zhengkai Electron

(1)

Jiangsu Zhongtian Power T

(1)

Jiangxi Changlong Tech Co

(1)

Jiangxi Haiduo Silicone M

(1)

Jiangxi Latticepower Semi

(1)

Jiangxi Pengbowei Technol

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Jiangxi Provincial Academ

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Jiangxi Qianzhao Photoele

(1)

Jiangxi Qianzhao Semicond

(1)

Jiangxi Tianyi Semiconduc

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Jiangxi Yaochi Tech Co Lt

(1)

Jiangxi Yibo E Technology

(1)

Jiaxing Dazhe Solar Energ

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Jiaxing Starpower Microel

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Jierlin Chongqing New Ene

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Jihai Microelectronics

(1)

(1)

Jinan Jingbo Electronic C

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Jinan Qianrui Xinguang Ne

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Jindieshikong Beijing Tec

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Jingchewei Jiangsu Semico

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Jingfeng Xinchi Shanghai

(1)

Jinglong Technology (Suzh

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Jingxin Semiconductor Hua

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Jinling Institute of Tech

(1)

Jinruihong Micro Electron

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Jrh Tech Quzhou Co Ltd

(1)

Jsg Japan Co Ltd

(1)

Jushi Group Chengdu Co Lt

(1)

KK Nihon Micronics

(1)

(1)

Kenfa System Co Ltd

(1)

Kenmec Mech Engineering C

(1)

Kepeida Semiconductor Anh

(1)

Kexin Semiconductor Tech

(1)

(1)

King Abdullah University

(1)

Kingfar Int Inc [cn]; Nan

(1)

Koscn Industrial Mfg Shen

(1)

Kulicke And Soffa Ind Inc

(1)

Kulicke and Soffa Industr

(1)

Kunming University of Sci

(1)

Kunshan Feibi Electronic

(1)

Kyoto Univ [jp]; Universi

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(1)

L&t Semiconductor Tech Li

(1)

(1)

(1)

Langfang Zetian Yinuo Mac

(1)

Laplace (Guangzhou) Semic

(1)

Laplace Wuxi Semiconducto

(1)

Lattice Art Semiconductor

(1)

Lenovo (Beijing) Limited

(1)

(1)

Lianglyu Eng System Co Lt

(1)

Liangxin Electrical Appli

(1)

Lianyungang Zhaohua Tech

(1)

Liding Semiconductor Tech

(1)

Linwu County Southern Min

(1)

Lisen Noco Hardware Co Lt

(1)

Longyou Yunshen Platemaki

(1)

Loongson Technology

(1)

Lumentum Operations

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(1)

Luster Lighttech

(1)

(1)

(1)

Mas Automation Equipment

(1)

Masteel Hefei Iron & Stee

(1)

Mattson Tech Inc [us]; Be

(1)

Maxio Technology (Hangzho

(1)

(1)

Mi2 Factory Gmbh

(1)

Mianyang Science And Tech

(1)

Microchip Tech Inc [us];

(1)

Microchip Touch Solutions

(1)

Microcrystalline Semicond

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Micronap Co Ltd

(1)

Mikros Tech Llc

(1)

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Mitsu Chemicals Inc

(1)

Modernatx Inc [us]; Micro

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Moqu Tech Shenzhen Co Ltd

(1)

NGK Spark Plugs

(1)

NTT Inc [jp]; Nippon Tele

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Nagano Prefecture [jp]; T

(1)

Nan Ya Plastics

(1)

Nanchang Shineon Photoele

(1)

Nanjing Inst Of Atomic Ma

(1)

Nanjing Rise Electronic T

(1)

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Zhejiang University Shaoxing Research Inst Submits Patent Application for CSP (chip Scale Package) Test Switching Device

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Zhejiang University Shaoxing Research Inst has submitted a patent application for CSP (chip Scale Package) Test Switching Device. Sang Shijie, Lin Hai, Zhang Bin, Guo Qing and Xu Junliang developed the invention. The patent application number is CN20261026721 20260109. The patent publication number is CN12..

Riyuexin Advanced Tech Research Kunshan Co Ltd Submits Patent Application for Novel Photoresist Edge Washing Method

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Riyuexin Advanced Tech Research Kunshan Co Ltd has submitted a patent application for Novel Photoresist Edge Washing Method. Huang Zhangbin developed the invention. The patent application number is CN202610225217 20260225. The patent publication number is CN122063816 (A). International Patent Classificatio..

Shenzhen Weice Semiconductor Tech Co Ltd and Tianjin Weice Semiconductor Tech Co Ltd Submit Chinese Patent Application for Particle Swarm Neural Network Pid Parameter Optimization ..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Shenzhen Weice Semiconductor Tech Co Ltd and Tianjin Weice Semiconductor Tech Co Ltd have submitted a patent application for Particle Swarm Neural Network Pid Parameter Optimization System Based on FPGA. This invention was developed by Zhong Bangyu, Wang Xuerang, Zhu Haozhen and Zeng Zihui. The patent appl..

Beijing Ziguang Qingteng Micro System Co Ltd Submits Chinese Patent Application for Interconnected Chip-oriented Low-power-consumption Control System

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Beijing Ziguang Qingteng Micro System Co Ltd has submitted a patent application for Interconnected Chip-oriented Low-power-consumption Control System. This invention was developed by Lin Min, Dong Yu, Huang Jinhuang and Guo Lei. The patent application number is CN202610105017 20260126. The patent publicati..

Deyi Microelectronics Co Ltd Submits Chinese Patent Application for Flash Memory Controller and Memory Management Method Based on Flash Memory Controller

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Deyi Microelectronics Co Ltd has submitted a patent application for Flash Memory Controller and Memory Management Method Based on Flash Memory Controller. This invention was developed by Luo Ting. The patent application number is CN202511932876 20251219. The patent publication number is CN122064284 (A). In..

Shandong Inspur Science Research Inst Co Ltd Submits Chinese Patent Application for Storage Control Method and Device of Sram (static Random Access Memory), Equipment and Medium

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Shandong Inspur Science Research Inst Co Ltd has submitted a patent application for Storage Control Method and Device of Sram (static Random Access Memory), Equipment and Medium. This invention was developed by Li Bingkun, Wei Chaofei, Xu Guilong, Jiang Kai and Dong Junyi. The patent application number is ..

Zhejiang Weiming Semiconductor Co Ltd Submits Patent Application for NAND Performance Optimization Method Based on Static Data Identification and Independent MCU Compressed Storage

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Zhejiang Weiming Semiconductor Co Ltd has submitted a patent application for NAND Performance Optimization Method Based on Static Data Identification and Independent MCU Compressed Storage. Zhu Jiawei and Xu Junjie developed the invention. The patent application number is CN202610541816 20260423. The paten..

Univ Shenzhen Polytechnic Submits Chinese Patent Application for Equipment and Method for Preparing Large-size Polycrystalline Diamond Wafers in Batches

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Univ Shenzhen Polytechnic has submitted a patent application for Equipment and Method for Preparing Large-size Polycrystalline Diamond Wafers in Batches. This invention was developed by Yu Hongyu, Wang Tao and Yuan Ning. The patent application number is CN202610219913 20260224. The patent publication numbe..

Imec Vzw and KU Leuven Submit WIPO Patent Application for FET for Single Target Sensing

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- Imec Vzw and KU Leuven have submitted a patent application for FET for Single Target Sensing. This invention was developed by Lin Han Chung, Martens Koen, Liu Lijun, Van Dorpe Pol and Santermans Sybren. The patent application number is WO2026EP52008 20260127. The patent publication number is WO2026162485 (A..

Nxai GmbH Submits WIPO Patent Application for Tiled Flash Linear Attention for Efficient Linear RNN and Xlstm Kernels

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- Nxai GmbH has submitted a patent application for Tiled Flash Linear Attention for Efficient Linear RNN and Xlstm Kernels. The patent application number is WO2026EP52331 20260129. The patent publication number is WO2026162641 (A1). International Patent Classification code is G06N3/044. Cooperative Patent Cla..

Chengdu Xinziguang Semiconductor Tech Co Ltd Submits Chinese Patent Application for Method for Improving Process Defects of Low-temperature Deposition Technology

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Chengdu Xinziguang Semiconductor Tech Co Ltd has submitted a patent application for Method for Improving Process Defects of Low-temperature Deposition Technology. This invention was developed by Yang Du. The patent application number is CN202411658120 20241119. The patent publication number is CN122061124 ..

Xinjirong Semiconductor Shanghai Co Ltd Submits Patent Application for Atomic Layer Deposition Device

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Xinjirong Semiconductor Shanghai Co Ltd has submitted a patent application for Atomic Layer Deposition Device. Xia Shiwei and Chen Kelu developed the invention. The patent application number is CN202610504714 20260416. The patent publication number is CN122061128 (A). International Patent Classification co..

State Intellectual Property Office of China Receives Guangdong Kezhuo Semiconductor Equipment Co Ltd Patent Application for Wafer Cutting Channel Edge Breakage Defect Compensation ..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Guangdong Kezhuo Semiconductor Equipment Co Ltd patent application for Wafer Cutting Channel Edge Breakage Defect Compensation Method and System Based on Artificial Intelligence. Wei Donglei and Wang Bi'an developed the invention. The patent applicat..

State Intellectual Property Office of China Receives Jiangsu Acrel Elec Appliance Mft Co Ltd, Acrel Co Ltd and Jiangsu Ankerui Microgrid Research Inst Co Ltd Patent Application for..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Jiangsu Acrel Elec Appliance Mft Co Ltd, Acrel Co Ltd and Jiangsu Ankerui Microgrid Research Inst Co Ltd patent application for Chip-based Multifunctional Reset Circuit and Method. Yu Chenglong, Li Haiquan, Zhao Wenyi, Yang Weitao, Liu Yannan and Cheng ..

State Intellectual Property Office of China Receives First Research Inst Of The Ministry Of Public Security Of Prc Patent Application for Sehal-based Open Architecture On-chip Oper..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received First Research Inst Of The Ministry Of Public Security Of Prc patent application for Sehal-based Open Architecture On-chip Operating System and Management Method Thereof. Sun Meng, Gan Xin, Zhang Feng, Lu Yu and Sun Huiyang developed the invention. T..

State Intellectual Property Office of China Receives Shenzhen Jinwei Semiconductor Mat Co Ltd Patent Application for Wafer Polishing Solution as Well as Preparation Method and Appl..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Shenzhen Jinwei Semiconductor Mat Co Ltd patent application for Wafer Polishing Solution as Well as Preparation Method and Application Thereof. Xiao Kai, Zhou Fubing, Wei Huan, Xiao Wei and Tang Shengfeng developed the invention. The patent applicati..

Jiaji Huankong Xi'an Tech Co Ltd Seeks Patent for Pecvd-based Electrostatic Neutralization Method and Device

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Jiaji Huankong Xi'an Tech Co Ltd has sought patent for Pecvd-based Electrostatic Neutralization Method and Device. This invention was developed by Chen Bo, Lai Zheng, Cai Shuai and Liang Penggang. The patent application number is CN202610562539 20260427. The patent publication number is CN122081900 (A). In..

State Intellectual Property Office of China Publishes Shanghai Pylon New Energy Tech Co Ltd Patent Application for Data Storage Method and Device of EEPROM (electrically Erasable P..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Shanghai Pylon New Energy Tech Co Ltd patent application for Data Storage Method and Device of EEPROM (electrically Erasable Programmable Read-only Memory). The invention was developed by Wang Jiaxing, Chen Yugen, Xu Min and Wang Biao. The patent ap..

State Intellectual Property Office of China Publishes Zibo Yileite Health Tech Co Ltd Patent Application for Numerical Control Machining Center with Waste Chip Collecting Device

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Zibo Yileite Health Tech Co Ltd patent application for Numerical Control Machining Center with Waste Chip Collecting Device. The invention was developed by Lyu Qingdong. The patent application number is CN202610533647 20260422. The patent publicatio..

Quinas Tech Limited Files WIPO Patent Application for Semiconductor Device and Methods of Fabrication

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Quinas Tech Limited has filed a patent application for Semiconductor Device and Methods of Fabrication. This invention was developed by Tekin Serdar, Hayne Manus, Hodgson Peter and Hall Jonathan. The patent application number is WO2026GB50113 20260129. The patent publication number is WO2026162939 (A1). Int..

Wuhan Guide Sensmart Tech Submits Patent Application for Aiming Point Position Memory Backtracking Method and System

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Wuhan Guide Sensmart Tech has submitted a patent application for Aiming Point Position Memory Backtracking Method and System. Pi Yuhu, Cui Chang Hao, Han Chengde and Huang Sheng developed the invention. The patent application number is CN202511914596 20251218. The patent publication number is CN122062660 (..

Forehope Electronic Ningbo Limited Co Submits Chinese Patent Application for Sensor Packaging Structure and Preparation Method Thereof

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Forehope Electronic Ningbo Limited Co has submitted a patent application for Sensor Packaging Structure and Preparation Method Thereof. This invention was developed by He Zhenghong and Jiang Ruidong. The patent application number is CN202610526555 20260421. The patent publication number is CN122079059 (A)...

Nanchang Shineon Photoelectric Tech Co Ltd Submits Chinese Patent Application for Cutting Fluid and Application and Device of Cutting Fluid in Cutting of Chip-scale Packaged LED (l..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Nanchang Shineon Photoelectric Tech Co Ltd has submitted a patent application for Cutting Fluid and Application and Device of Cutting Fluid in Cutting of Chip-scale Packaged LED (light-emitting Diode). This invention was developed by Fan Zhencan, Yuan Haibo and Zhu Lei. The patent application number is CN2..

Toshiba Electronic Devices & Storage Corp and Toshiba File United States Patent Application for Semiconductor Device and Method for Manufacturing Semiconductor Device

Semiconductor

| Mon 10 Aug 2026

Alexandria, Aug. 11 -- Toshiba Electronic Devices & Storage Corp and Toshiba have filed a patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. This invention was developed by Ezaki Akira and Okuyama Hiroki. The patent application number is US202519355873 20251010. The patent publicati..

The Florida International Univ Board Of Trustees and Applied Materials File United States Patent Application for Power Delivery for AI Computing with Orthogonal Embedding and Edge ..

Semiconductor

| Mon 10 Aug 2026

Alexandria, Aug. 11 -- The Florida International Univ Board Of Trustees and Applied Materials have filed a patent application for Power Delivery for AI Computing with Orthogonal Embedding and Edge Access. This invention was developed by Kengeri Subramani, Pulugurtha Markondeyaraj, Pial Mohammad Mohtasim Hamid, Al Duhni Ghaleb Sa..

Nagano Prefecture and Takano Submit United States Patent Application for Surface Treatment Method for Silicon Body and Method of Manufacturing Silicon Structural Body

Semiconductor

| Mon 10 Aug 2026

Alexandria, Aug. 11 -- Nagano Prefecture and Takano have submitted a patent application for Surface Treatment Method for Silicon Body and Method of Manufacturing Silicon Structural Body. This invention was developed by Sato Akira and Mizusaki Hideaki. The patent application number is US202319149853 20231219. The patent public..

Soitec and Commissariat a Ienergie Atomique Et Aux Energies Alternatives Submit United States Patent Application for Method for Producing a Semiconductor Structure Comprising an In..

Semiconductor

| Mon 10 Aug 2026

Alexandria, Aug. 11 -- Soitec and Commissariat a Ienergie Atomique Et Aux Energies Alternatives have submitted a patent application for Method for Producing a Semiconductor Structure Comprising an Interface Region Including Agglomerates. This invention was developed by Radu Ionut, Gaudin Gweltaz, Fournel Franck, Widiez Julie and..

Research & Business Foundation Sungkyunkwan Univ and Samsung Electronics File United States Patent Application for Electronic Device and Method for Generating Compact Model of Semi..

Semiconductor

| Mon 10 Aug 2026

Alexandria, Aug. 11 -- Research & Business Foundation Sungkyunkwan Univ and Samsung Electronics have filed a patent application for Electronic Device and Method for Generating Compact Model of Semiconductor Device Including Two-dimensional Material and Contact Metal. This invention was developed by Ha Yoonhoo, Shim Jaewoo, Jang ..

Univ Libre De Bruxelles and Univ Norbert Zongo Submit Patent Application for Method for Leaching Gold from a Gold-bearing Substrate

Semiconductor

| Mon 10 Aug 2026

Alexandria, Aug. 11 -- Univ Libre De Bruxelles and Univ Norbert Zongo have submitted a patent application for Method for Leaching Gold from a Gold-bearing Substrate. Doneux Thomas, Bougouma Moussa, Soma Fousseni and Herman Claudine developed the invention. The patent application number is US202419153935 20240214. The patent p..

The Regents Of The Univ Of Michigan and University of Rochester Submit United States Patent Application for Digital Molecular Fingerprinting on Organ on a Chip Systems

Semiconductor

| Mon 10 Aug 2026

Alexandria, Aug. 11 -- The Regents Of The Univ Of Michigan and University of Rochester have submitted a patent application for Digital Molecular Fingerprinting on Organ on a Chip Systems. This invention was developed by Singer Benjamin H, Stephens Andrew, Mcgrath James L, Song Yujing, Su Shiuan-haur and Kurabayashi Katsuo. Th..

Suzhou Chengjun Semiconductor Equipment Co Ltd Submits Patent Application for Automatic Powder Supplementing Device for Silicon Carbide Crystal Growing Furnace

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Suzhou Chengjun Semiconductor Equipment Co Ltd has submitted a patent application for Automatic Powder Supplementing Device for Silicon Carbide Crystal Growing Furnace. Dong Jianshu and Cheng Shishu developed the invention. The patent application number is CN202610413529 20260331. The patent publication nu..

Fujian Fushun Microelectronics Co Ltd Seeks Patent for Silicon Wafer Back Crystal Growth Prevention Air Curtain Isolation Device for Thick Epitaxial Growth

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Fujian Fushun Microelectronics Co Ltd has sought patent for Silicon Wafer Back Crystal Growth Prevention Air Curtain Isolation Device for Thick Epitaxial Growth. This invention was developed by Zheng Yi, Lin Ligui, Xiong Aihua and Mei Haijun. The patent application number is CN202610512725 20260417. The pa..

Zhongtian Jingke Ningbo Semiconductor Mat Co Ltd Submits Patent Application for Preparation Method and Preparation Device of Silicon Carbide Single Crystal and Silicon Carbide Sing..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Zhongtian Jingke Ningbo Semiconductor Mat Co Ltd has submitted a patent application for Preparation Method and Preparation Device of Silicon Carbide Single Crystal and Silicon Carbide Single Crystal. Chen Dou, Tang Jun, Ma Yuan, Guan Weiwei, Pan Yaobo, Xue Weiming and Vouret developed the invention. The pa..

State Intellectual Property Office of China Publishes Zhongtian Jingke Ningbo Semiconductor Mat Co Ltd Patent Application for Crucible for Silicon Carbide Crystal Growth and Silico..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Zhongtian Jingke Ningbo Semiconductor Mat Co Ltd patent application for Crucible for Silicon Carbide Crystal Growth and Silicon Carbide Crystal Growth Method. The invention was developed by Chen Dou, Tang Jun, Guan Weiwei, Pan Yaobo, Xue Weiming and Vo..

State Intellectual Property Office of China Publishes Jiangsu Tianke Heda Semiconductor and Beijing Tankeblue Semiconductor Patent Application for Method for Reducing Silicon Carbi..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Jiangsu Tianke Heda Semiconductor and Beijing Tankeblue Semiconductor patent application for Method for Reducing Silicon Carbide Crystal Defects. The invention was developed by Zhou Xing, Sun Peiran, Peng Tonghua, Yang Jian, Lou Yanfang, Zhang Ping, Zo..

Shenzhen Icreate Tech Co Ltd Submits Patent Application for Anode Plate and Horizontal Pulse Electroplating Anode Device

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Shenzhen Icreate Tech Co Ltd has submitted a patent application for Anode Plate and Horizontal Pulse Electroplating Anode Device. Zheng Liejian and Wang Zheng developed the invention. The patent application number is CN202610127022 20260129. The patent publication number is CN122082078 (A). International P..

State Intellectual Property Office of China Publishes Dongguan Yuanxin Semiconductor Co Ltd Patent Application for Semiconductor Electroplating Method and System

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Dongguan Yuanxin Semiconductor Co Ltd patent application for Semiconductor Electroplating Method and System. The invention was developed by Chen Min, Xia Nengli and Lim Chun-woo. The patent application number is CN202610407233 20260331. The patent p..

Hunan Lianchuangxing Electronic Tech Co Ltd Files Chinese Patent Application for Double-sided Multi-layer PCB Electroplating Equipment and Process

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Hunan Lianchuangxing Electronic Tech Co Ltd has filed a patent application for Double-sided Multi-layer PCB Electroplating Equipment and Process. This invention was developed by Cheng Jun and Xie Tuanying. The patent application number is CN202610158780 20260204. The patent publication number is CN12208207..

State Intellectual Property Office of China Publishes Xindong Micro Shanghai Semiconductor Tech Co Ltd Patent Application for Electroplating Equipment and Method for Isolating Exte..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Xindong Micro Shanghai Semiconductor Tech Co Ltd patent application for Electroplating Equipment and Method for Isolating External Oxygen and Prolonging Service Life of Circulating Electroplating Liquid. The invention was developed by Wei Yongyan, Yin ..

State Intellectual Property Office of China Receives Riyuexin Advanced Tech Research Kunshan Co Ltd Patent Application for Novel Integrated Circuit Electroplating Method

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Riyuexin Advanced Tech Research Kunshan Co Ltd patent application for Novel Integrated Circuit Electroplating Method. Ling Jian developed the invention. The patent application number is CN202610178229 20260208. The patent publication number is CN1220..

Shanghai Hedong Electronic Material Submits Chinese Patent Application for Gas Uniformizing Assembly, Semiconductor Process Chamber and Semiconductor Thin Film Deposition Equipment

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Shanghai Hedong Electronic Material has submitted a patent application for Gas Uniformizing Assembly, Semiconductor Process Chamber and Semiconductor Thin Film Deposition Equipment. This invention was developed by Jia Shijun, Sun Yuanjun and Pang Bo. The patent application number is CN202610294465 20260311. ..

Jiaji Huankong Xian Tech Co Ltd Submits Patent Application for Plasma Enhanced Chemical Vapor Deposition Method and Device

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Jiaji Huankong Xian Tech Co Ltd has submitted a patent application for Plasma Enhanced Chemical Vapor Deposition Method and Device. Kim Dong-gyu, Tang Mingwei and Kim Tae-geon developed the invention. The patent application number is CN202610562578 20260427. The patent publication number is CN122081901 (A)..

Inner Mongolia Zhongqi Core Mat Co Ltd Submits Patent Application for Deposition Equipment Based on Diamond Semiconductor Wafer

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Inner Mongolia Zhongqi Core Mat Co Ltd has submitted a patent application for Deposition Equipment Based on Diamond Semiconductor Wafer. Zhao Jianbo, Tian Jingfeng and Zhao Chunxia developed the invention. The patent application number is CN202610437211 20260403. The patent publication number is CN12208189..

Jiaji Huankong Xi'an Tech Co Ltd Seeks Patent for Method and Device for Performing Chemical Vapor Deposition on Wafer

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Jiaji Huankong Xi'an Tech Co Ltd has sought patent for Method and Device for Performing Chemical Vapor Deposition on Wafer. This invention was developed by Kim Dong-gyu, Ren Mengyuan and Park Jong-oh. The patent application number is CN202610554252 20260424. The patent publication number is CN122081890 (A)..

State Intellectual Property Office of China Receives Anhui University Patent Application for Medium-temperature-zone High-performance N-type Mg3Sb2-based Magnetic Nano Composite Th..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Anhui University patent application for Medium-temperature-zone High-performance N-type Mg3Sb2-based Magnetic Nano Composite Thermoelectric Material and Preparation Method Thereof. Qian Jun, Gao Yan, Song Jiming, Xu Qing, Li Zhou and Fang Xianxian devel..

Heshengyuan Packaging Mat Xuzhou Co Ltd Seeks Patent for Substrate Size Measuring Device for Packaging Bag Processing

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Heshengyuan Packaging Mat Xuzhou Co Ltd has sought patent for Substrate Size Measuring Device for Packaging Bag Processing. This invention was developed by Lee Ha-ha. The patent application number is CN20261087270 20260122. The patent publication number is CN122083869 (A). International Patent Classificati..

State Intellectual Property Office of China Publishes Jierlin Chongqing New Energy Tech Co Ltd Patent Application for Automatic Detection Manipulator for Integrated Circuit Pins

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Jierlin Chongqing New Energy Tech Co Ltd patent application for Automatic Detection Manipulator for Integrated Circuit Pins. The invention was developed by Li De. The patent application number is CN202610356350 20260323. The patent publication numbe..

VON ARDENNE Asset Submits Patent Application for Substrate, Method and Manufacturing Device for Manufacturing the Substrate

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- VON ARDENNE Asset has submitted a patent application for Substrate, Method and Manufacturing Device for Manufacturing the Substrate. Wemme Alexander, Deus Carsten, Busch Alexander, Niederhausen Thomas, Kús Peter, Hrbek Tomás, Matolínová Iva and Himmler Anja developed the invention. The patent applicatio..

World Intellectual Property Organization Releases ROCKWOOL Patent Application for Growth Substrate

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released ROCKWOOL patent application for Growth Substrate. This invention was developed by Van Benthem Rudolfus Antonius, De Carvalho Esteves Ana Catarina and Moone Luuk. The patent application number is WO2026EP52312 20260129. The patent publication number is WO20..

World Intellectual Property Organization Receives Infineon Technologies Patent Application for Amplifier Circuit Having a Coil Structure with Mutually Inductively Coupled Coils

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has received Infineon Technologies patent application for Amplifier Circuit Having a Coil Structure with Mutually Inductively Coupled Coils. Musolff Christian developed the invention. The patent application number is WO2026EP51852 20260126. The patent publication numbe..

ASML Netherlands Submits WIPO Patent Application for Optical Assembly

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- ASML Netherlands has submitted a patent application for Optical Assembly. This invention was developed by Scheffers Paul, Bastiaans Koen, Overes Frank, Del Tin Laura and Koning Johan. The patent application number is WO2026EP50693 20260113. The patent publication number is WO2026162288 (A1). International Pat..

State Intellectual Property Office of China Receives Suzhou Henteen Environmental Protection Engineering Patent Application for Waste Gas Combustion Furnace for Semiconductor Produ..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Suzhou Henteen Environmental Protection Engineering patent application for Waste Gas Combustion Furnace for Semiconductor Production. Sun Ping developed the invention. The patent application number is CN202610532613 20260421. The patent publication num..

State Intellectual Property Office of China Releases State Power Investment Heli Electric Wuxi Tech Co Ltd Patent Application for Microwave Plasma Semiconductor Tail Gas Treatment ..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released State Power Investment Heli Electric Wuxi Tech Co Ltd patent application for Microwave Plasma Semiconductor Tail Gas Treatment Device and Control Method Thereof. This invention was developed by Wang Xiaohui, Ishizuki So, Wang Zhiyu, Chen Yusong, Li Bao,..

ASML Netherlands Submits Patent Application for Method for Bonding Semiconductor Substrates

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- ASML Netherlands has submitted a patent application for Method for Bonding Semiconductor Substrates. Warming Till, Burgarth Volker, Blumberg Christian, Kieven David and Von Morze Natascha developed the invention. The patent application number is WO2026EP50222 20260107. The patent publication number is WO20261..

World Intellectual Property Organization Releases ASML Netherlands Patent Application for Semiconductor Substrate Handling System

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released ASML Netherlands patent application for Semiconductor Substrate Handling System. This invention was developed by Harrold George, Wade Robert and Wiener Roberto B. The patent application number is WO2026EP50091 20260106. The patent publication number is WO2..

ASML Netherlands Seeks Patent for Actuators with Integrated Air Bearings in a Semiconductor Manufacturing Apparatus

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- ASML Netherlands has sought patent for Actuators with Integrated Air Bearings in a Semiconductor Manufacturing Apparatus. This invention was developed by Verma Arjun, Finney Nathan, Chillara Venkata, Kelley John and Shin Taehee. The patent application number is WO2026EP50090 20260106. The patent publication n..

World Intellectual Property Organization Publishes ASML Netherlands Patent Application for Die Carrier

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published ASML Netherlands patent application for Die Carrier. The invention was developed by Seijger Olav and Dekkers Jeroen. The patent application number is WO2026EP50085 20260106. The patent publication number is WO2026162252 (A1). International Patent Classifi..

ASML Netherlands Submits WIPO Patent Application for Method for Determining Correction Weights

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- ASML Netherlands has submitted a patent application for Method for Determining Correction Weights. This invention was developed by Passariello Jansen Juliette Marie, Goorden Sebastianus and Donkerbroek Arend. The patent application number is WO2026EP50040 20260105. The patent publication number is WO202616224..

World Intellectual Property Organization Releases ASML Netherlands Patent Application for Die-to-wafer Bonding Process

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released ASML Netherlands patent application for Die-to-wafer Bonding Process. This invention was developed by Venugopalan Syam Parayil, Vromen Joost and Wang Sheng. The patent application number is WO2025EP88154 20251218. The patent publication number is WO2026162..

ASML Netherlands Submits WIPO Patent Application for Apparatus and Method for Quantifying a Lateral Etch Depth

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- ASML Netherlands has submitted a patent application for Apparatus and Method for Quantifying a Lateral Etch Depth. This invention was developed by Hinterding Stijn, Ozturk Fahri Emre, Tarabrin Sergey and Nayak Deepak. The patent application number is WO2025EP87607 20251217. The patent publication number is WO..

World Intellectual Property Organization Releases Wacker Chemie AG Patent Application for Roller for a Roll Crusher for Comminution of Semiconductor Material

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released Wacker Chemie AG patent application for Roller for a Roll Crusher for Comminution of Semiconductor Material. This invention was developed by Mattes Joachim, Grübl Peter, Öchsner Eva and Pech Reiner. The patent application number is WO2025EP52708 20250203..

World Intellectual Property Organization Releases Texas Instruments Patent Application for Electronic Device and Method of Singulating

Semiconductor

| Tue 11 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released Texas Instruments patent application for Electronic Device and Method of Singulating. This invention was developed by Liao Liu, Wyant Michael, Guo Qi, He Shan and Brija Danny. The patent application number is WO2026US12615 20260127. The patent publicatio..

Hunan Zerui New Mat Co Ltd Submits Patent Application for Preparation Method of Silicon Carbide Fiber with In-situ Boron Nitride Coating on Surface

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Hunan Zerui New Mat Co Ltd has submitted a patent application for Preparation Method of Silicon Carbide Fiber with In-situ Boron Nitride Coating on Surface. Yi Jun, Tang Yun and Huang Xiaozhong developed the invention. The patent application number is CN202610257922 20260304. The patent publication number ..

State Intellectual Property Office of China Releases Chengdu Zhongwei Crystal Mat Co Ltd Patent Application for Semiconductor Surface Treating Agent, Application Thereof and Silico..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released Chengdu Zhongwei Crystal Mat Co Ltd patent application for Semiconductor Surface Treating Agent, Application Thereof and Silicon Carbide Laser Modified Layer Stripping Method. This invention was developed by Guo Meng, Yang Shuangze and Yang Huai. The..

World Intellectual Property Organization Releases Hitachi High Technologies Patent Application for Semiconductor Information Provision Method and Semiconductor Information Provisio..

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released Hitachi High Technologies patent application for Semiconductor Information Provision Method and Semiconductor Information Provision System. This invention was developed by Senuma Yuhei, Okuda Tomoyuki, Li Yuan and Yamauchi Toshinori. The patent applicati..

Sharp Submits Patent Application for Conductive Element Substrate and Method for Manufacturing Same

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Sharp has submitted a patent application for Conductive Element Substrate and Method for Manufacturing Same. Suga Katsuyuki developed the invention. The patent application number is WO2025JP02785 20250129. The patent publication number is WO2026163305 (A1). International Patent Classification codes are H10K..

Mitsubishi Electric Submits Patent Application for Modulator-integrated Semiconductor Laser Element and Method for Producing Modulator-integrated Semiconductor Laser Element

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Mitsubishi Electric has submitted a patent application for Modulator-integrated Semiconductor Laser Element and Method for Producing Modulator-integrated Semiconductor Laser Element. Hokama Yohei, Watatani Chikara and Tsuji Toshiya developed the invention. The patent application number is WO2025JP02724 2025..

State Intellectual Property Office of China Receives Beijing Semiconductor Special Equipment Research Inst The 45th Research Inst Of China Electronics Te Patent Application for Mul..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Beijing Semiconductor Special Equipment Research Inst The 45th Research Inst Of China Electronics Te patent application for Multi-path Air Pressure Acquisition System, Method and Equipment of Semiconductor Equipment and Medium. Jin Hanyi, Jing Haishi an..

Beijing Automation Control Equipment Inst Seeks Patent for High-precision Silicon Piezoresistive Sensitive Film and Design Method Thereof

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Beijing Automation Control Equipment Inst has sought patent for High-precision Silicon Piezoresistive Sensitive Film and Design Method Thereof. This invention was developed by Zu Jianjing, Zhu Xiao, Yu Zhangze and Bai Nan. The patent application number is CN20251238786 20251231. The patent publication numb..

Semiconductor Energy Laboratory Submits WIPO Patent Application for Semiconductor Device and Semiconductor Device Production Method

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Semiconductor Energy Laboratory has submitted a patent application for Semiconductor Device and Semiconductor Device Production Method. This invention was developed by Ikezoe Satoshi, Jintyou Masami, Shingu Takashi, Koezuka Junichi, Yamade Naoto, Kakehata Tetsuya and Noguchi Kenichi. The patent application nu..

Semiconductor Energy Laboratory Submits WIPO Patent Application for Light-emitting Device

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Semiconductor Energy Laboratory has submitted a patent application for Light-emitting Device. This invention was developed by Kawata Takuya, Kimura Kunio and Ikeda Hisao. The patent application number is WO2026IB50680 20260126. The patent publication number is WO2026163060 (A1). International Patent Classific..

Semiconductor Energy Laboratory Submits WIPO Patent Application for Semiconductor Device

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Semiconductor Energy Laboratory has submitted a patent application for Semiconductor Device. This invention was developed by Kawashima Susumu, Shishido Hideaki, Kusunoki Koji, Uochi Hideki and Saito Motoharu. The patent application number is WO2026IB50678 20260126. The patent publication number is WO202616305..

Semiconductor Energy Laboratory Files WIPO Patent Application for Semiconductor Device

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Semiconductor Energy Laboratory has filed a patent application for Semiconductor Device. This invention was developed by Kusunoki Koji and Watanabe Kazunori. The patent application number is WO2026IB50677 20260126. The patent publication number is WO2026163057 (A1). International Patent Classification codes a..

World Intellectual Property Organization Releases Semiconductor Energy Laboratory Patent Application for Electronic Apparatus

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released Semiconductor Energy Laboratory patent application for Electronic Apparatus. This invention was developed by Kamada Taisuke, Nakamura Daiki and Kubota Daisuke. The patent application number is WO2026IB50676 20260126. The patent publication number is WO2026..

Beijing Inst Technology Seeks Patent for View Field Modulation Hyperspectral Imaging Technology Based on MEMS Micromirror Array

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Beijing Inst Technology has sought patent for View Field Modulation Hyperspectral Imaging Technology Based on MEMS Micromirror Array. This invention was developed by Liu Qiangqiang, Chi Kunping, Zhou Yanchen, Ni Jihui and Xie Huikai. The patent application number is CN202610331333 20260318. The patent publ..

The 715th Research Inst Of China State Shipbuilding Corporation Limited Applies for Patent on Hot-wire Type MEMS Underwater Acoustic Sensor Self-calibration Method Based on Thermoa..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- The 715th Research Inst Of China State Shipbuilding Corporation Limited has applied Chinese patent for Hot-wire Type MEMS Underwater Acoustic Sensor Self-calibration Method Based on Thermoacoustic Effect. Tong Haoyang, Cao Meng, Cao Zeng and Chen Yi developed it. The patent application number is CN20261082..

Ningbo Research Inst Northwestern Polytechnical University Submits Chinese Patent Application for Low-pressure-drop Runner Assembly for Thermal Flow Sensing Chip

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Ningbo Research Inst Northwestern Polytechnical University has submitted a patent application for Low-pressure-drop Runner Assembly for Thermal Flow Sensing Chip. This invention was developed by Li Jiayao, Yan Yuchao, Chang Honglong, Deng Jinjun and Feng Lufan. The patent application number is CN2026105266..

Browning Raymond Submits WIPO Patent Application for Photoelectron Wafer Inspection Tool

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Browning Raymond has submitted a patent application for Photoelectron Wafer Inspection Tool. The patent application number is WO2025IB51118 20250203. The patent publication number is WO2026162971 (A1). International Patent Classification code is H01J37/285. Cooperative Patent Classification codes are H01J2..

Chongqing Zixingzhe Tech Co Ltd Seeks Patent for Packaging Structure Suitable for Silicon Optical Gyroscope Under Middle and High Pressure and Packaging Process Thereof

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Chongqing Zixingzhe Tech Co Ltd has sought patent for Packaging Structure Suitable for Silicon Optical Gyroscope Under Middle and High Pressure and Packaging Process Thereof. This invention was developed by Zou Wei, Liu Wenxuan, Xu Wenyuan, Ren Zhuoheng, Yu Huaiyong, Yuan Dequan and Pan Yang. The patent ap..

Northeastern University Files Chinese Patent Application for Laser Cladding Crack Inhibition Method Based on Prefabricated Stress Release Structure and Substrate Structure

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Northeastern University has filed a patent application for Laser Cladding Crack Inhibition Method Based on Prefabricated Stress Release Structure and Substrate Structure. This invention was developed by Kim Cheon-young, Xiang Dingding, Yan Jiahao, Li Yongsheng and Jin Jie. The patent application number is CN..

Shenzhen Nashe Intelligent Equipment Co Ltd Submits Chinese Patent Application for Supporting Structure and Chemical Vapor Deposition Reaction Equipment

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Shenzhen Nashe Intelligent Equipment Co Ltd has submitted a patent application for Supporting Structure and Chemical Vapor Deposition Reaction Equipment. This invention was developed by Zhong Guofang, Huang Shuaishuai, Liu Lianghui, Xiao Yunzhang and Chen Bingan. The patent application number is CN20261023..

BOE Huacan Optoelectronics Guangdong Co Ltd Submits Chinese Patent Application for Graphite Plate and Metal Organic Compound Chemical Vapor Deposition Equipment

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- BOE Huacan Optoelectronics Guangdong Co Ltd has submitted a patent application for Graphite Plate and Metal Organic Compound Chemical Vapor Deposition Equipment. This invention was developed by Mao Jiatian, Zhou Xuyang, Qu Limin and Chen-zhang Xiaoxiong. The patent application number is CN202511840455 2025..

State Intellectual Property Office of China Receives Wuxi China Resources Microelectronics Co Ltd Patent Application for Spray Head and Processing Method Thereof, Reaction Chamber ..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Wuxi China Resources Microelectronics Co Ltd patent application for Spray Head and Processing Method Thereof, Reaction Chamber of Semiconductor Machine and Film Forming Method in Reaction Chamber. Zhang Jian and Jin Xingcheng developed the invention. ..

State Intellectual Property Office of China Releases Shenzhen Maike Shiwei Tech Co Ltd Patent Application for Protective Layer for Enhancing OLED Mask Technology Durability

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released Shenzhen Maike Shiwei Tech Co Ltd patent application for Protective Layer for Enhancing OLED Mask Technology Durability. This invention was developed by Li Shiyun. The patent application number is CN202511685928 20251118. The patent publication numbe..

State Intellectual Property Office of China Publishes Sunplus Tech Co Ltd and Gao Xiteng Patent Application for African Swine Fever Virus Detection Chip and Application Thereof

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Sunplus Tech Co Ltd and Gao Xiteng patent application for African Swine Fever Virus Detection Chip and Application Thereof. The invention was developed by Lin Weihao, Li Yichan, Jung Chae-hwa, Qiu Mingtang, Ren Shuyi and Gao Xiteng. The patent appli..

World Intellectual Property Organization Publishes Resonac Patent Application for Resin Composition and Power Semiconductor Device

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published Resonac patent application for Resin Composition and Power Semiconductor Device. The invention was developed by Nagashima Kazushi and Nozaki Akihiro. The patent application number is WO2025JP03443 20250203. The patent publication number is WO2026163424 (A..

Resonac Applies for Patent on Resin Composition and Power Semiconductor Device

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Resonac has applied WIPO patent for Resin Composition and Power Semiconductor Device. Nagashima Kazushi and Nozaki Akihiro developed it. The patent application number is WO2025JP03442 20250203. The patent publication number is WO2026163423 (A1). International Patent Classification code is C08G59/18. The abs..

World Intellectual Property Organization Publishes Resonac Patent Application for Sealing Resin Composition and Power Semiconductor Device

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published Resonac patent application for Sealing Resin Composition and Power Semiconductor Device. The invention was developed by Nagashima Kazushi and Yamaura Masashi. The patent application number is WO2025JP03441 20250203. The patent publication number is WO2026..

Mitsubishi Electric Seeks Patent for Semiconductor Optical Integrated Element and Method for Manufacturing Semiconductor Optical Integrated Element

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Mitsubishi Electric has sought patent for Semiconductor Optical Integrated Element and Method for Manufacturing Semiconductor Optical Integrated Element. This invention was developed by Nagira Takashi, Matsumoto Keisuke and Kuramoto Kyosuke. The patent application number is WO2025JP03432 20250203. The paten..

Kokusai Electric Submits WIPO Patent Application for Substrate Processing Method, Semiconductor Device Production Method, Program, and Substrate Processing Device

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Kokusai Electric has submitted a patent application for Substrate Processing Method, Semiconductor Device Production Method, Program, and Substrate Processing Device. This invention was developed by Horii Sadayoshi, Karasawa Koichi, Ueda Tatsushi and Kakuda Toru. The patent application number is WO2025JP03418..

Toyotsu Vehitecs Co Ltd Submits WIPO Patent Application for Photocurable Resin Containing Soft-magnetic Material and Method for Forming Photocurable Resin Containing Soft-magnetic ..

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Toyotsu Vehitecs Co Ltd has submitted a patent application for Photocurable Resin Containing Soft-magnetic Material and Method for Forming Photocurable Resin Containing Soft-magnetic Material on Substrate. This invention was developed by Nakagawa Masanori, Tani Naoki and Ito Ryuichi. The patent application ..

JSG Japan Co Ltd Submits WIPO Patent Application for Silicon Nitride Substrate Manufacturing Method and Silicon Nitride Substrate

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- JSG Japan Co Ltd has submitted a patent application for Silicon Nitride Substrate Manufacturing Method and Silicon Nitride Substrate. This invention was developed by Kusano Dai and Chen Xianbing. The patent application number is WO2025JP03265 20250131. The patent publication number is WO2026163386 (A1). Int..

Kokusai Electric Submits WIPO Patent Application for Processing Device, Substrate Processing Device, Display Method, Semiconductor Device Manufacturing Method, and Program

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Kokusai Electric has submitted a patent application for Processing Device, Substrate Processing Device, Display Method, Semiconductor Device Manufacturing Method, and Program. This invention was developed by Yamaoka Yuji and Seki Takatoshi. The patent application number is WO2025JP03055 20250130. The patent p..

State Intellectual Property Office of China Releases Suzhou Zhongju Kexin Tech Co Ltd Patent Application for Equipment for Growing Silicon Carbide Crystals

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released Suzhou Zhongju Kexin Tech Co Ltd patent application for Equipment for Growing Silicon Carbide Crystals. This invention was developed by Dai Xiaosong, Sun Xiaoxiao, Zhang Yongwei and Wei Dayong. The patent application number is CN202610182119 20260209..

Jiangsu Wuxi Jingwei Tiandi Semiconductor Tech Co Ltd Submits Chinese Patent Application for Wafer Processing Method and Device and Electroplating Equipment

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Jiangsu Wuxi Jingwei Tiandi Semiconductor Tech Co Ltd has submitted a patent application for Wafer Processing Method and Device and Electroplating Equipment. This invention was developed by Gu Rui, Han Yanfen and Liang Defu. The patent application number is CN202610143645 20260202. The patent publication n..

Fulongjie Suzhou Hydrogen Energy Tech Co Ltd Applies for Patent on Tool for Electroplating Electrode Net

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Fulongjie Suzhou Hydrogen Energy Tech Co Ltd has applied Chinese patent for Tool for Electroplating Electrode Net. Tang Yazhong, Qin Nan, Zhou Junjian, Wang Yanyue and Liu Pan developed it. The patent application number is CN202610340236 20260319. The patent publication number is CN122061237 (A). Internati..

Ningbo Riyue Electric Wire & Cables Mfg Co Ltd Submits Patent Application for Wire Electroplating Equipment for Cable Manufacturing and Use Method of Wire Electroplating Equipment

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Ningbo Riyue Electric Wire & Cables Mfg Co Ltd has submitted a patent application for Wire Electroplating Equipment for Cable Manufacturing and Use Method of Wire Electroplating Equipment. Ying Cunshi and Zhang Aihong developed the invention. The patent application number is CN202610110516 20260127. The pa..

World Intellectual Property Organization Publishes SCREEN Holdings Patent Application for Substrate Treatment Method, Substrate Treatment Device, and Substrate Treatment Solution

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published SCREEN Holdings patent application for Substrate Treatment Method, Substrate Treatment Device, and Substrate Treatment Solution. The invention was developed by Okusa Aoi and Sasaki Yuta. The patent application number is WO2025JP38574 20251104. The patent ..

World Intellectual Property Organization Publishes Kokusai Electric Patent Application for Substrate Processing Device, Substrate Processing Method, Production Method for Semicondu..

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published Kokusai Electric patent application for Substrate Processing Device, Substrate Processing Method, Production Method for Semiconductor Device, and Program. The invention was developed by Yanagisawa Yoshihiko and Sakano Atsuya. The patent application number..

Panasonic Intellectual Property Management Applies for Patent on Chip Collection Device and Chip Collection Method

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Panasonic Intellectual Property Management has applied WIPO patent for Chip Collection Device and Chip Collection Method. Ishitani Yasuyuki developed it. The patent application number is WO2025JP36712 20251017. The patent publication number is WO2026163527 (A1). International Patent Classification code is H..

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