Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Xiamen Yinke Qirui Semiconductor Tech Co Ltd has submitted a patent application for Bonding Method of Thin Film Material and Rigid Material. This invention was developed by Chu Kecheng, Zhang Yinqiao, Wang Yu, Ye Weimin, Liu Biaohuang, Lu Wei, Zhou Shan and Xie Kunjiang.
The patent application number is CN2..