Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Jiangsu Shangda Semiconductor Co Ltd has submitted a patent application for Sputtering Pretreatment Device for Cof Packaging Base Material. This invention was developed by Wang Jian, Lu Wen, Sun Bin, Gu Lin, Qi Shengli, Han Shaohua, Sun Fei, Liu Minghan, Yang Jie, Ye Bin, Kim Jung-won, Ye Xinzhi, Huang Chunsh..