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Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Huawei Technologies has sought patent for Optical Module, Communication Method, and Chip. This invention was developed by Wu Xiaozhu, Duan Jianhong and Li Ke.
The patent application number is WO2026CN74990 20260126. The patent publication number is WO2026170994 (A1). International Patent Classification code i..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Huawei Technologies has applied WIPO patent for Collaborative Interaction Method for Electronic Device, and Electronic Device, Storage Medium and Chip System. Chen Chao, Zhang Xinlei, Chen Yizhen, Chen Yifan and Pan Xingyu developed it.
The patent application number is WO2026CN73497 20260119. The patent publi..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has published Huawei Technologies patent application for Processing Chip, Power Consumption Control Method, Semiconductor Packaging Structure, and Electronic Device. The invention was developed by Wang Ronghua, Tu Zhenxi, Liu Zhen and Zhou Yongbin.
The patent applicati..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Huawei Technologies has sought patent for Electro-optic Modulator, Chip and Electronic Device. This invention was developed by Zhu Qingming, Wei Juan, An Shaohua and Lou Yannian.
The patent application number is WO2026CN77566 20260206. The patent publication number is WO2026171083 (A1). International Patent C..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has received ASML Netherlands patent application for Linear and Non-linear Modulation of Reference Radiation for Overlay Metrology. Rezvani Naraghi Roxana, Jahani Saman, Jenkins Gregory and Tracy Kathryn developed the invention.
The patent application number is WO2026E..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has published ASML Netherlands patent application for Pressure Relief Valve with Assisted Opening. The invention was developed by Bulson Jeffry.
The patent application number is WO2026EP50513 20260112. The patent publication number is WO2026171422 (A1). International P..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- ASML Netherlands has submitted a patent application for Bonding Tool. Gouteux Louise, Almasi Attaallah, Beukman Arjan and Gijsbertsen Arjan developed the invention.
The patent application number is WO2026EP50301 20260108. The patent publication number is WO2026171416 (A1). International Patent Classification ..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Visteon Global Technology has submitted a patent application for System and Method for Shaping a Glass Substrate. This invention was developed by Chi Ho-hsun, Zhao Feng and Wu Yu-hsien.
The patent application number is WO2025CN77541 20250217. The patent publication number is WO2026170520 (A1). International P..
Semiconductor
| Wed 26 Aug 2026
Geneva, Aug. 27 -- Guangdong OPPO Mobile Telecommunications has submitted a patent application for Synchronization Signal Block Transmission Method and Apparatus, Device, Medium, and Chip. Cui Shengjiang, Zuo Zhisong and Zhao Zhenshan developed the invention.
The patent application number is WO2025CN76984 20250212. The patent p..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has released Resonac patent application for Slurry, Polishing Method, Method for Producing Component, and Method for Producing Semiconductor Component. This invention was developed by Yamaguchi Daisuke, Maeda Masanori, Iwano Tomohiro and Kurata Yuto.
The patent applica..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has received Fujifilm patent application for Transfer Film, Cured Membrane, Semiconductor Package, Pattern Forming Method, and Method for Manufacturing Semiconductor Package. Toyooka Kentaro, Abe Takumi, Hayashi Daisuke and Machida Takashi developed the invention.
The ..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Fuji Electric has sought patent for Semiconductor Device, Method for Manufacturing Semiconductor Module, and Method for Manufacturing Semiconductor Device. This invention was developed by Naito Tatsuya, Okumura Keiji, Sasaki Masahiro, Fujihira Tatsuhiko, Miyagi Suganuma Nao, Sakurai Yosuke and Komiyama Norihir..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- NAMICS Corporation has applied WIPO patent for Resin Composition, Adhesive Agent, Sealing Material, Cured Product, Semiconductor Device, and Electronic Component. Suzuki Fumiya developed it.
The patent application number is WO2026JP01569 20260120. The patent publication number is WO2026172738 (A1). Internatio..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Tokyo Electron has filed a patent application for Stage Control Method, Inspection Device, and Program. This invention was developed by Kagami Fumito.
The patent application number is WO2026JP03689 20260203. The patent publication number is WO2026172826 (A1). International Patent Classification codes are G01R..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Nissan Chemical has submitted a patent application for Adhesive Composition, Laminate, and Method for Manufacturing Processed Semiconductor Substrate. This invention was developed by Usui Yuki and Okuno Takahisa.
The patent application number is WO2026JP03631 20260202. The patent publication number is WO20261..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has published Tokyo Electron patent application for Substrate Processing Method and Substrate Processing Device. The invention was developed by Takahashi Rei and Kushibiki Masato.
The patent application number is WO2026JP03315 20260130. The patent publication number is..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has released Tokyo Electron patent application for Plasma Processing Device and Substrate Support. This invention was developed by Kato Yuta.
The patent application number is WO2026JP03221 20260130. The patent publication number is WO2026172800 (A1). International Pate..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has received Tokyo Electron patent application for Test Head Frame and Inspection Device. Uchikawa Yasuhiro and Iguchi Yuta developed the invention.
The patent application number is WO2026JP03690 20260203. The patent publication number is WO2026172827 (A1). Internation..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has received Fujifilm patent application for Resin Composition, Cured Product, Laminate, Method for Manufacturing Cured Product, Method for Manufacturing Laminate, Method for Manufacturing Semiconductor Device, and Semiconductor Device. Asakawa Daisuke developed the inv..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has released Fujifilm patent application for Resin Composition, Cured Product, Layered Body, Manufacturing Method for Cured Product, Manufacturing Method for Layered Body, Manufacturing Method for Semiconductor Device, Semiconductor Device, Polyimide, and Synthesis Meth..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has received Fujifilm patent application for Organopolysiloxane, Composition, Transfer Film, Cured Product, Semiconductor Package, and Method for Producing Semiconductor Package. Abe Takumi, Hayashi Daisuke, Machida Takashi, Inada Hiroshi and Yamada Takeru developed the..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Sony Semiconductor Solutions Corporation has filed a patent application for Semiconductor Device, Electronic Apparatus, and Method for Producing Semiconductor Device. This invention was developed by Ishizaki Takeshi.
The patent application number is WO2026JP04467 20260206. The patent publication number is WO2..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has released Japan Steel Works patent application for Bonded Substrate and Method for Manufacturing Bonded Substrate. This invention was developed by Iwata Hirokazu and Maruko Takuya.
The patent application number is WO2026JP04804 20260210. The patent publication numbe..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- LG Innotek has filed a patent application for Circuit Board and Semiconductor Package. This invention was developed by Kang Su Hee, Yoo Jae Hyoun and Lee Hyung Sub.
The patent application number is WO2026KR01701 20260128. The patent publication number is WO2026173311 (A1). International Patent Classification ..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Microchip Technology has filed a patent application for Hazard Detector Contained Within a Fixture Serving an Unrelated Purpose. This invention was developed by Mcfarland Patrick and Eck Arthur B.
The patent application number is WO2025US38424 20250721. The patent publication number is WO2026173629 (A1). Inte..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- SanDisk Technologies has applied WIPO patent for Three-dimensional Memory Device Containing Laterally-undulating Lateral Isolation Trenches and Method of Making Thereof Using at Least Three Rows of Isolation Openings. Zhou Bing, Kanakamedala Senaka and Matsuno Koichi developed it.
The patent application numbe..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Micron Technology has sought patent for Edge Protection for Stacked Semiconductor Systems. This invention was developed by Parekh Kunal R and Zhou Wei.
The patent application number is WO2026US14559 20260209. The patent publication number is WO2026173844 (A1). International Patent Classification codes are H10..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has sought patent for Process Chamber Gas Flow Improvement. This invention was developed by Lau Shu-kwan and Salinas Martin Jeffrey.
The patent application number is WO2025US50251 20251009. The patent publication number is WO2026173644 (A1). International Patent Classification codes are C23C..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has submitted a patent application for Apparatus and Methods for Substrate-to-substrate Bonding. Parkhe Vijay D developed the invention.
The patent application number is WO2025US50005 20251008. The patent publication number is WO2026173643 (A1). International Patent Classification codes are ..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has applied WIPO patent for Radio Frequency (rf) Choke for Particle Reduction and Increased Conductance in Preclean Chamber. Agarwal Prashant, Zhang Kang and Jupudi Ananthkrishna developed it.
The patent application number is WO2025US49998 20251008. The patent publication number is WO2026173..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has submitted a patent application for Trench Tip Squaring in Self-aligned Multi-patterning Process. This invention was developed by Sherman Steven, Kanakasabapathy Sivanandha Krishnan, Mallick Abhijit Basu and Lin San-kuei.
The patent application number is WO2025US49859 20251007. The patent..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has sought patent for Methods and Systems for Arc Suppression During Semiconductor Fabrication Processes. This invention was developed by Bobek Sarah Michelle, Tanaka Tsutomu, He Allan, Feng Jun, Lee Weiyi, Li Mingjie, Liao Bryan, Shanbhag Jeevan, Dzilno Dmitry A and Zhu Dan.
The patent appl..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has submitted a patent application for in Situ Cleaning of Deposition Chamber with Microwave Plasma. Zhang Zhejun, Li Jianheng, Peng Li Jia, Chen Hanhong, Aubuchon Joseph, Baluja Sanjeev, Chen Victoria L, Zhang Hao and Lin Chi-chou developed the invention.
The patent application number is WO..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has sought patent for Metal Deposition and Etch by Use of a Substrate Processing Chamber. This invention was developed by Nemani Srinivas D, Citla Bhargav S, Shukla Shreyas, Johnson Erik and Yieh Ellie Y.
The patent application number is WO2026US14661 20260210. The patent publication number ..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has submitted a patent application for Systems and Methods for Depositing Materials on Substrates. Gau Justin, Imanguzhin Dauren, Alex Nithin, Nemani Srinivas D, Lubomirsky Dmitry, Shukla Shreyas, Khan Adib, Baky Md Abdullah Hil and Yieh Ellie Y developed the invention.
The patent applicatio..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has applied WIPO patent for Process Chamber Improvement. Cong Zhepeng, Smith Nimrod and Cosenza Gracia Maria developed it.
The patent application number is WO2026US13046 20260129. The patent publication number is WO2026173741 (A1). International Patent Classification codes are C23C16/44, C30..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Micron Technology has sought patent for Microelectronic Devices Including Back Gate Structures and Back Gate Plates, and Related Memory Devices and Electronic Systems. This invention was developed by Servalli Giorgio, Karda Kamal M, Hasunuma Eiji and Mariani Marcello.
The patent application number is WO2026US..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has submitted a patent application for Pre-treatment for Sam Removal Improvement with Less Carbon Residue. This invention was developed by Kashefi Kevin, Ju Zheng, Cen Jiajie, Zhou Ruinan and Wu Zhiyuan.
The patent application number is WO2026US14744 20260210. The patent publication number i..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Lam Research has sought patent for High Voltage Pin Design for Electrostatic Chucks. This invention was developed by Truong Khoa Dang, Behziz Behnam, Hung Pamela and Wu Benny.
The patent application number is WO2026US11919 20260121. The patent publication number is WO2026173713 (A1). International Patent Clas..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has submitted a patent application for Die Stress Modulation for Improved Device Layer Stacking. See Guan Huei, Lim Yin Wei, Mane Anil Uttam, Varghese Sony and Zhang Yan developed the invention.
The patent application number is WO2026US11358 20260115. The patent publication number is WO20261..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Lam Research has submitted a patent application for Contact Compartment for Substrate Holder of Electroplating Apparatus. Buckalew Bryan L, Hosack Chad Michael, Thorkelsson Kari, Banik Stephen J and Mayer Steven T developed the invention.
The patent application number is WO2026US13710 20260203. The patent pub..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has published Corning Research & Development patent application for High Density Out of Plane Fiber to Chip Interface. The invention was developed by Ten Have Eric Stephan, Spreemann Martin and Matiss Andreas.
The patent application number is WO2026US14857 20260211. Th..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- World Intellectual Property Organization has released Micron Technology patent application for Transistors Including Annular Gates, and Related Microelectronic Devices and Electronic Systems. This invention was developed by Pulugurtha Srinivas, Popp Martin W and Shimizu Yui.
The patent application number is W..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Ideal Power has submitted a patent application for Overcurrent Protection for Bidirectional Power Semiconductor Devices. This invention was developed by Tayebi Seyed Milad and Yu Ruiyang.
The patent application number is WO2026US13169 20260130. The patent publication number is WO2026173744 (A1). International..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has submitted a patent application for Independently Powered Backplane with Optical Transceivers. Bhansali Ameet, Chiruvolu Shivkumar and Patibandla Nag developed the invention.
The patent application number is WO2026US14945 20260211. The patent publication number is WO2026173996 (A1). Inter..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has filed a patent application for Device for Surface Property Modulation. This invention was developed by Penmethsa Harish V, Li Ming-jui and May Robert Alan.
The patent application number is WO2026US13971 20260204. The patent publication number is WO2026173787 (A1). International Patent Cl..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Applied Materials has submitted a patent application for Etch Stop Layer for 3D Memory. Pranatharthiharan Balasubramanian, Seo Jongbeom, Kang Chang Seok, Grant Devika S, Makala Raghuveer Satya, Kitajima Tomohiko, Hao Ruiying, Sung Min Gyu and Chung Hoi Sung developed the invention.
The patent application numb..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Jingweifeng Photoelectric Technology for Silicon-based Liquid Crystal Chip and Display Device. Li Lan developed the invention.
The patent application number is CN202422684432U 20241104. The patent publication number is CN223582273 (..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Guangzhou China Star Optoelectronics Semiconductor Display Technology has obtained a patent for array substrate and display panel. This invention was developed by Zhu Maoxia.
The patent application number is CN202423317185U 20241231. The patent publication number is CN223582279 (U). International Patent Clas..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Hangzhou Zhongan Electronics has secured a patent on Mould Temperature Controller Suitable for Semiconductor Industry. Li Jilei, Bu Jianming, He Tingyu, Liao Jian, Chai Junbiao, Yu Liang and Bu Yucheng developed the invention.
The patent application number is CN20252033907U 20250108. The patent publication n..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- China Zhenhua Group Yongguang Electronics, State Run No 873 Factory has secured a patent on High-voltage MOS Array Module and Test Circuit Thereof. Wang Jiajia, Xiang Yuejun, Wang Zeng, Wang Mingkang, Ma Luyao, Yuan Kun, Jiang Xingbiao and Lu Haoyu developed the invention.
The patent application number is CN..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Xi'an Electronic Engineering Research Institute has obtained a patent for general test system for discrete semiconductor device. This invention was developed by Bai Zhenqiang, Cheng Xinyi, Mao Ani, Zhang Xiaoling, Wang Zhenchen, Guan Pei, Liu Yuan and Han Xin.
The patent application number is CN202520260758U..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has awarded a patent to Taiwan Semiconductor Manufacturing for Semiconductor Structure. Lin Jiahui, Chen Cheng, You Zhihao, Wang Weimin, Cui Renfen and Yu Zhenhua developed the invention.
The patent application number is CN202422864699U 20241122. The patent publica..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has awarded a patent to Deck Microelectronics Shenzhen for Packaging Structure with Packaging Surface Rewiring Function and Packaging Chip. Li Cheng and Feng Yi developed the invention.
The patent application number is CN202422978252U 20241202. The patent publicati..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has awarded a patent to Deck Microelectronics Shenzhen for Packaging Structure with Built-in Discrete Device and Isolator Chip. Li Cheng and Feng Yi developed the invention.
The patent application number is CN202422987219U 20241202. The patent publication number is..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Taiwan Semiconductor Manufacturing has obtained a patent for package structure including package cover having plurality of fins. This invention was developed by Xie Bingying, Chen Zhihao, Zheng Lihui and Shi Yingqing.
The patent application number is CN202422277452U 20240918. The patent publication number is..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Beijing Xiaomi Mobile Software has been awarded a patent for Surge Protection Circuit, Chip and Electronic Equipment. This invention was developed by Li Weiwei and Fang Qiaoyong.
The patent application number is CN202422962652U 20241202. The patent publication number is CN223583798 (U). International Patent ..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Shanghai Electric Fuji Electric Technology has secured a patent on Power Supply Circuit for Driving Insulated Gate Bipolar Transistor. Jin Dezhi, Qi Liang, Wang Xu, Chen Jianghong, Li Shoufa, Lu Bo and Chen Jiajia developed the invention.
The patent application number is CN202423182342U 20241223. The patent ..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Chongqing Yuntong Technology has been granted a patent for Slow Start Control Circuit of MOS (metal Oxide Semiconductor) Tube and Power Electronic Equipment. This invention was developed by Huang Xiaoyi, Jiang Kaiyue, Hu Shaoguo and Liao Guangchao.
The patent application number is CN202520286647U 20250221. T..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Zhiwei Intelligent Technology for Circuit for Improving Load Capacity of MOS Tube Switching System During Power Supply. Li Bingsong developed the invention.
The patent application number is CN202520259792U 20250218. The patent publi..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Wuxi Anjing Jingyi Intelligent Technology has been granted a patent for Anti-static Vacuum Release Box for Chip. Wang Jian developed the invention.
The patent application number is CN202422931272U 20241129. The patent publication number is CN223584391 (U). International Patent Classification codes are H05F1/..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has awarded a patent to Zhongrun New Energy, Chuzhou for Diffusion Furnace for Solar Cell. Wei Fei, Li Chi and Feng Ping developed the invention.
The patent application number is CN202422647447U 20241031. The patent publication number is CN223584632 (U). Internatio..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has awarded a patent to Taiwan Semiconductor Manufacturing for Memory Unit and Integrated Circuit. Shen Wenchao developed the invention.
The patent application number is CN202422333319U 20240924. The patent publication number is CN223584621 (U). International Paten..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Guangdong Changxing Semiconductor Technology has submitted a patent application for Packaging Abnormity Monitoring Method and System for Multi-layer Stacked Storage Chip. Zhang Zhiqiang, Lu Guanhua and Guo Donglin developed the invention.
The patent application number is CN202610252128 20260303. The patent p..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Tsinghua University has applied Chinese patent for Modeling Method of Semiconductor Device. Zhao Biao, Wang Yingting, Liu Changbing, Wang Zongze, Zeng Rong, Wu Jinpeng, Yu Zhanqing, Curou and Cui Bin developed it.
The patent application number is CN202610209373 20260212. The patent publication number is CN12..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- South China Normal University has sought patent for Automatic Layout Method of Analog Integrated Circuit and Related Device. This invention was developed by Wang Tao, Zhong Qinghua, Zhou Chaoxing and Wang Deming.
The patent application number is CN202610257425 20260304. The patent publication number is CN122..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has released Nanjing University of Science & Technology patent application for Geometric Structure Design Method for Radiation Resistance Optimization of Flip-chip Bonding Type Superconducting Quantum Chip. This invention was developed by Nie Qi, Zhu Ye, Zhang Baifu..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Xidian University has submitted a patent application for Efficient Automatic Power Consumption Optimization Method and Device for Chip Physical Design. This invention was developed by Zhang Ran, Li Kang, Xu Xinnan, Ma Xueyuan, Han Shuo, Yao Shiyi, Hou Jingru, Zhan Hongliang and Huang Zhenglei.
The patent app..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Guangdong Vocational & Technical College has submitted a patent application for Finite Element Analysis-based Chip Parameter Optimization Method and System. This invention was developed by Ding Shoubin, Huang Baozhang, Zheng Minru, Peng Dingkang, Li Song, Lin Jiahao, Chen Haitao and Tian Yichen.
The patent a..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has released SK Hynix patent application for Image Signal Processor and Method for Processing Image Signal. This invention was developed by Kim Dong Ik, Yang Zhenluo, Zhang Checun and Choi Jun-hyeok.
The patent application number is CN202511600268 20251104. The pat..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Beijing Xinjian Technology has applied Chinese patent for Automatic Measurement Method for Electron Microscopic Image Obtained in Semiconductor Technology. Yang Liu developed it.
The patent application number is CN202610169787 20260205. The patent publication number is CN122156087 (A). International Patent C..
Semiconductor
| Thu 27 Aug 2026
Geneva, Aug. 27 -- Advanced RISC Machines has submitted a patent application for Access to Configuration State Table in Memory. This invention was developed by Dall Christoffer.
The patent application number is WO2026GB50071 20260121. The patent publication number is WO2026172081 (A1). International Patent Classification code..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Beijing ESWIN Computing Technology has applied Chinese patent for Display Panel Control Method, Display Control Chip and Display Equipment. Ge Hongyang, Zhang Duoduo and Hu Benchuan developed it.
The patent application number is CN202610562380 20260424. The patent publication number is CN122157591 (A). Inter..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- SAIC GM Wuling Automobile has applied Chinese patent for Display Screen Driving Integrated Circuit Control Method and Device, Equipment and Storage Medium. Wu Zhengdong, Wei Luyi, Huang Jufeng, Du Wen, Huang Guirong, Wang Zhe, Wu Guangzhi, He Mingying and Lin Zhigui developed it.
The patent application numbe..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Realtek Semiconductor Corporation has sought patent for Processing Circuit of Display and Related Control Method. This invention was developed by Lin Deyou and Chen Fangxiong.
The patent application number is CN202411775577 20241205. The patent publication number is CN122157605 (A). International Patent Clas..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Shenzhen Xinkailai Industry Machine has sought patent for Noise Reduction Heat Exchange Device and Semiconductor Equipment. This invention was developed by Pan Chengfang, Liu Falong and Liu Qinming.
The patent application number is CN20261076450 20260120. The patent publication number is CN122157625 (A). Int..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has published Samsung Electronics patent application for Non-volatile Memory, Memory Device, and Method of Operating Non-volatile Memory. The invention was developed by Jung Yong-taek and Yoo Hyun Jun.
The patent application number is CN202511790416 20251201. The p..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Memory Circuit and Control Method Thereof. Ichikawa Masayuki developed the invention.
The patent application number is CN202511710780 20251120. The patent publication number is CN122157714 (A). International Patent Classification codes..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has published SK Hynix patent application for Memory Generating Pass/failure Information and Operating Method of Memory. The invention was developed by Kwon Jae and Park Jae-hyun.
The patent application number is CN202510445274 20250410. The patent publication numb..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has published Fudan University patent application for Equipment for AI Chip System Architecture Verification and Working Method. The invention was developed by Li Zhicheng, Xu Zihan, Liu Qi, Yu Jie, Liu Ming and Zhang Xumeng.
The patent application number is CN2026..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Winbond Electronics has submitted a patent application for Flash Memory Device and Erasing Method Thereof. Chen Zongren developed the invention.
The patent application number is CN202511503781 20251021. The patent publication number is CN122157740 (A). International Patent Classification codes are G11C16/16 ..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Samsung Electronics has applied Chinese patent for Nonvolatile Memory Device. Futatsuyama Takuya and Park Ji Yoon developed it.
The patent application number is CN202511456314 20251013. The patent publication number is CN122157736 (A). International Patent Classification codes are G11C16/08, G11C16/12 and G1..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has received Xincun Technology (Wuhan) patent application for Phase Change Memory Array Initialization Method and Phase Change Memory. Kuang Rui, Zhou Guangle, Zhou Jiawei, Sun Jianwu and Ding Hangchen developed the invention.
The patent application number is CN202..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Dingdao Zhixin (Shanghai) Semiconductor has submitted a patent application for Control Method of Static Memory, System on Chip and Electronic Equipment. Yang Yongliang and Shi Wanggen developed the invention.
The patent application number is CN202610245308 20260228. The patent publication number is CN1221577..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Memory Circuit and Programming Method Thereof. This invention was developed by Uno Kazumasa, Otsubo Hiromasa, Zhu Taide, Watanabe Ryuta and Kojima Hidemitsu.
The patent application number is CN202511507639 20251021. The patent publicat..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Toshiba Memory has applied Chinese patent for Memory System and Semiconductor Memory Device. Sugahara Akio developed it.
The patent application number is CN202511165963 20250820. The patent publication number is CN122157722 (A). International Patent Classification codes are G11C11/4074, G11C11/408, G11C11/40..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- SanDisk Technologies has submitted a patent application for Stacked Memory Assembly with Fault Detection and Repair Functionality. This invention was developed by Sabod Jamal, Shukla Rohit and Pachamuthu Jeyakumar.
The patent application number is CN202510477803 20250416. The patent publication number is CN1..
Semiconductor
| Wed 26 Aug 2026
Beijing, Aug. 27 -- Kokusai Electric has filed a patent application for Jet Apparatus, Substrate Processing Apparatus, Substrate Processing Method, Method of Manufacturing Semiconductor Device, and Program Product. This invention was developed by Nakade Sakito and Okajima Yusaku.
The patent application number is CN202511652660 ..
Semiconductor
| Wed 26 Aug 2026
Beijing, Aug. 27 -- Beijing NAURA Microelectronics Equipment has applied Chinese patent for Protection Structure, Process Chamber, Protection Piece and Semiconductor Process Equipment. Wang Wei and Wang Yan developed it.
The patent application number is CN202411755725 20241202. The patent publication number is CN122158436 (A). ..
Semiconductor
| Wed 26 Aug 2026
Beijing, Aug. 27 -- Nanjing University of Posts and Telecommunications has filed a patent application for Multilayer Dual-channel Substrate Integrated Waveguide Filter. This invention was developed by Zhou Junyu and Chu Peng.
The patent application number is CN202610554333 20260424. The patent publication number is CN122158904 ..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Beijing University has submitted a patent application for Device Without Semiconductor Channel and Preparation Method Thereof. Chen Yahong, Jiang Huiyan, Sun Wei and Wang Kexin developed the invention.
The patent application number is CN202411760269 20241203. The patent publication number is CN122158423 (A)...
Semiconductor
| Wed 26 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has published Shandong Huaguang Optoelectronics patent application for V-shaped Cavity Narrow Linewidth Semiconductor Laser Chip and Preparation Method Thereof. The invention was developed by Ren Fuyang, Ju Zhiyuan, Liu Qi and Zhang Xiaodong.
The patent application..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Zhuzhou CRRC Times Semiconductor has filed a patent application for Power Semiconductor Module and Motor Controller. This invention was developed by Yu Jun, Shi Haiding, Chang Guiqin, Luo Qiwen, Shi Tingchang, Xiao Qiang, Li Fengchi, He Xionghui and Li Guisheng.
The patent application number is CN20241172647..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- State Intellectual Property Office of China has released Semiconductor Manufacturing International (Shanghai) patent application for Failure Safety Circuit and System on Chip. This invention was developed by Wang Qixuan, Lei Wei and Wang Wang.
The patent application number is CN202411771374 20241203. The pat..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Institute of Microelectronics, CAS has submitted a patent application for Terahertz Second Harmonic Mixer and Integrated Circuit. This invention was developed by Su Yongbo, Jin Zhi, Liu Zhicheng, Zhou Jingtao, Fei Yongming, Wang Xiaoyu, Zhang Runze, Chai Kailong, Wu Nan and Liu Tong.
The patent application n..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Phytium Technology has submitted a patent application for Communication Circuit, Semiconductor Integrated Circuit, System on Chip and Electronic Equipment. This invention was developed by Wang Liming, Wang Yongsheng, Jiang Jianfeng, Luan Xiaokun and He Shanshan.
The patent application number is CN20241179835..
Semiconductor
| Thu 27 Aug 2026
Beijing, Aug. 27 -- Texas Instruments has applied Chinese patent for Data Sampling Point Tuning and Tracking. Ben-bassat Mohamed, Ben-yehezkel Yoav and Alpert Yaron developed it.
The patent application number is CN202511696953 20251119. The patent publication number is CN122159874 (A). International Patent Classification codes ..
Semiconductor
| Wed 26 Aug 2026
Alexandria, Aug. 26 -- Materials Analysis Tech Inc and National Yang Ming Chiao Tung University have sought patent for Electrostatic Discharge Protection Circuit and Integrated Circuit Having Electrostatic Discharge Protection Mechanism. This invention was developed by Ker Ming-dou, Ke Chao-yang and Chen Hung-jen.
The patent ..
Semiconductor
| Wed 26 Aug 2026
Alexandria, Aug. 26 -- Chengdu BOE Optoelect Tech Co and BOE Technology Group have sought patent for Display Substrate and Display Device. This invention was developed by Wang Rong, Song Erlong, Ma Qian, Gao Yagui, Tseng Chengchu, Shu Xiaoqing, Zhang Bo, Fu Yuting, Zhao Jiaxing and Dong Xiangdan.
The patent application number..
Semiconductor
| Wed 26 Aug 2026
Alexandria, Aug. 26 -- Shanghai Institute of Microsystem and Info Tech Chinese Academy of Sciences and Zing Semiconductor have sought patent for Monocrystalline Silicon Wafer and Forming Method Therefor. This invention was developed by Tuo Huan, Liu Yun, Xue Zhongying and Wei Xing.
The patent application number is US202619645..
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