News For Last 1 Week

Assignee

1 - 100 of 2103 Items
 
Sign In / Subscribe 

Semiconductor

  |  Wed 05 Aug 2026

Munich, Aug. 6 -- European Patent Office has published Tokyo Electron patent application for Method for Area Selective Deposition on Extreme Ultra-violet (EUV) Photoresists. The invention was developed by Tapily Kandabara and Huli Lior. The patent application number is EP20240868890 20240710. The patent publication number is ..

Semiconductor

  |  Wed 05 Aug 2026

Munich, Aug. 6 -- Sony Europe BV and Sony Semiconductor Solutions Corporation have filed a patent application for Point Spread Function Estimation System and Method. This invention was developed by Siddiqui Muhammad. The patent application number is EP20240772683 20240919. The patent publication number is EP4781362 (A1). Inte..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has awarded a patent to Chongqing Inst Of Graphene Co Ltd for Drying Mechanism for Graphene Heating Chip Production. Liao Renmei, Wang Dengshi, Ju Yaqi, Qiu Mulan, Zhao Dan, Li Chao and Dong Lingsi developed the invention. The patent application number is CN202422..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Chinese Patent for Pressure Adjusting Device and Semiconductor Processing Equipment has been issued to Shenji Semiconductor Tech Xuzhou Co Ltd. This invention was developed by Wang Shuai. The patent application number is CN202423298374U 20241231. The patent publication number is CN223511579 (U). Internation..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Zhejiang Lingwei Biotechnology Co Ltd has obtained a patent for heat preservation and scald prevention device for split charging of agar culture medium. This invention was developed by Peng Bo, Zhao Xinxin and Wang Xinxia. The patent application number is CN202520109265U 20250117. The patent publication num..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Chaoyang Shuomei High Purity Semiconductor Mat Co Ltd has been granted a patent for Gallium Arsenide-containing Oil Sludge Filter Pressing Structure. Zhang Lei and Yu Shengning developed the invention. The patent application number is CN202422945387U 20241129. The patent publication number is CN223509782 (U..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Wuxi Gongxin Electronic Tech Co Ltd has been awarded a patent for Waterproof Silicon Carbide Chip Sealing Device. This invention was developed by Zou Zhanwei and Shao Hua. The patent application number is CN20242308240U 20241206. The patent publication number is CN223512001 (U). International Patent Classif..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Zing Semiconductor and Taiyuan Jinke Silicon Material Tech Co Ltd have been granted a patent for Water-cooled Jacket. Shi Xuzhong developed the invention. The patent application number is CN20252207881U 20250918. The patent publication number is CN223510036 (U). International Patent Classification codes are..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Mingxing Electronic Guangzhou Nansha Co Ltd has been awarded a patent for Multilayer Circuit Board Pulse Electroplating Device. This invention was developed by Hwang Tae-woon. The patent application number is CN202422960114U 20241203. The patent publication number is CN223510026 (U). International Patent Cl..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Chinese Patent for Thick Plate Strip Precious Metal Linear Electroplating Device has been issued to Kunshan Sokay Automation Tech Co Ltd. This invention was developed by Zhang Wenbiao. The patent application number is CN202423119717U 20241216. The patent publication number is CN223510020 (U). International ..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Kunshan Sokay Automation Tech Co Ltd has been awarded a patent for Scratch-proof Water Retaining Jig for Multi-material-belt Plate Electroplating. This invention was developed by Zhang Wenbiao. The patent application number is CN202423102107U 20241216. The patent publication number is CN223510019 (U). Inter..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Chinese Patent for Quantity-controlled Feeding Device for Electroplating Zinc-nickel Alloy has been issued to Zhejiang Ruitaixin Machinery Tech Co Ltd. This invention was developed by Xie Dongying. The patent application number is CN20242351444U 20241211. The patent publication number is CN223510015 (U). In..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Qingdao Zhixin Weilin Electronic Tech Co Ltd has been awarded a patent for Mobile Phone Key Switch Electroplating Device. This invention was developed by Yuan Qing. The patent application number is CN202422934050U 20241129. The patent publication number is CN223510011 (U). International Patent Classificatio..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Chinese Patent for Special-shaped Metal Connector Electroplating Protection Device has been issued to Baoding City Putianao Electric Tech Instruments Co Ltd. This invention was developed by Wu Qianfei and Wu Xinnian. The patent application number is CN202421728481U 20240722. The patent publication number is..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has awarded a patent to Baoding City Putianao Electric Tech Instruments Co Ltd for Plate Type Metal Connector Electroplating Protection Device. Wu Qianfei and Wu Xinnian developed the invention. The patent application number is CN202421728448U 20240722. The patent..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Hubei Jiangcheng Chip Pilot Production Services has been awarded a patent for Airflow Ring Assembly and Substrate Processing Apparatus. This invention was developed by Fang Wanyi, Wang Chenghong, Wang Kun and Ying Cheng. The patent application number is CN202422499774U 20241016. The patent publication number ..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has awarded a patent to Xiamen Junyi Prec Machinery Co Ltd for Solar Silicon Wafer Vacuum Coating Carrier Plate. Chen Xueliang developed the invention. The patent application number is CN202422922712U 20241128. The patent publication number is CN223509950 (U). Int..

Semiconductor

  |  Wed 05 Aug 2026

Munich, Aug. 6 -- European Patent Office has published TDK patent application for Electronic Component and Substrate with Built-in Electronic Component. The invention was developed by Kuroda Tomofumi, Tomonari Toshio, Goshima Hironari, Yoshida Kenichi and Higashida Keigo. The patent application number is EP20240867859 2024062..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has awarded a patent to Suzhou Wetec Automation Tech Co Ltd for Battery Compartment Lining Silica Gel Chip Mounter. Yu Qinglong developed the invention. The patent application number is CN202423238103U 20241227. The patent publication number is CN223509375 (U). In..

Semiconductor

  |  Wed 05 Aug 2026

Munich, Aug. 6 -- Xiamen Silan Advanced Compound Semiconductor Co Ltd has sought patent for Red-light LED Epitaxial Structure and Preparation Method Therefor. This invention was developed by Liao Yinsheng, Xue Long, Li Senlin, Bi Jingfeng and Lai Yucai. The patent application number is EP20240867345 20240911. The patent publi..

Semiconductor

  |  Wed 05 Aug 2026

Munich, Aug. 6 -- Jiangsu Leadmicro Nano Technology has submitted a patent application for TOPCon Solar Cell and Preparation Method Therefor. This invention was developed by Zhang Xiaojian, Yao Sen, Liao Baochen and Wang Heng. The patent application number is EP20240878808 20240924. The patent publication number is EP4783782 ..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has awarded a patent to Hunan Shuoke Jinglei Semiconductor Tech Co Ltd and Forty Eighth Research Institute of China Electronics Technology Group for Substrate Temperature Measuring Device for Mbe Equipment. Yang Ying, Lyu Wenli, Huang Yao, Chen Danmin, Gong Xin, Chen..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Shenzhen Huiruida Tech Co Ltd has been granted a patent for Semiconductor Vibration Disc with Protection Structure. This invention was developed by Mao Maosheng. The patent application number is CN202422976622U 20241204. The patent publication number is CN223509033 (U). International Patent Classification c..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Casi Vision Tech Luoyang Co Ltd, Zhongke Huiyuan Semiconductor Tech Guangdong Co Ltd and Casi Vision Tech Beijing Co Ltd have secured a patent on Positioning Mechanism. Li Feng, Li Boyin, Wang Wei, Wang Lulu and Zhang Wujie developed the invention. The patent application number is CN202422639575U 20241030. ..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Pufeixin Suzhou Semiconductor Tech Co Ltd has been granted a patent for Bottom Plate Feeding Mechanism and Bottom Plate Supply Equipment. Ma Hong developed the invention. The patent application number is CN202423192835U 20241224. The patent publication number is CN223509209 (U). International Patent Classif..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Changshu Institute of Technology and Jiangxi Hankefan Semiconductor Tech Co Ltd have received a patent for Base Plate Vertical Conveying Mechanism. This invention was developed by Huang Haibin, Liu Cuicui and Zhang Lei. The patent application number is CN202422764411U 20241113. The patent publication number..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Taiwan Semiconductor Co Ltd has submitted a patent application for Dicing Wafer Manufacturing Method. This invention was developed by Jia Jiarong. The patent application number is CN202411959418 20241230. The patent publication number is CN122034159 (A). International Patent Classification codes are B23K26/..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Qilu Aerospace Information Research Inst has submitted a patent application for Cutting Device of Film Material for Flexible Solar Cell Module. This invention was developed by Gong Zeqi, Zhang Taihua and Wang Luhui. The patent application number is CN202610502295 20260416. The patent publication number is C..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has received Saier Tech Rudong Co Ltd patent application for Ultrasonic Assistance-sol-gel Co-deposition Dispersed Wafer Thinning Grinding Wheel and Preparation Method Thereof. Ran Longbing, Wu Qiang and Wang Yubo developed the invention. The patent application nu..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Nantong Anyishun Tech Co Ltd has submitted a patent application for Sand Blasting Treatment Device Control Method and System for Semiconductor Cleaning. Pan Hongqi and Zhou Xiaoyong developed the invention. The patent application number is CN202610460555 20260409. The patent publication number is CN12203383..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has published Hwatsing patent application for Retaining Ring and Polishing Head. The invention was developed by Shang Yongchao, Meng Songlin and Wang Yu. The patent application number is CN202610434213 20241031. The patent publication number is CN122033812 (A). In..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Anhui Sixiang Semiconductor Material Tech Co Ltd has submitted a patent application for Edge Over-polishing Prevention Chemical Mechanical Polishing Equipment for Polycrystalline Silicon Ring Machining. Zhou Bo, Qin Guoliang, Tao Min and Zhong Weiyi developed the invention. The patent application number is ..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Hwatsing has submitted a patent application for Substrate Thinning Workbench, Substrate Thinning Device and Substrate Thinning Method. Ma Xu, Liu Yuanhang, Lu Xinchun and Han Xiaokai developed the invention. The patent application number is CN202610466905 20221228. The patent publication number is CN122033784..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Xinzhan Semiconductor Equipment Wuxi Co Ltd has submitted a patent application for Silicon Wafer Thinning Equipment with Double-grinding-wheel Structure. Gao Wenfeng and Jiang Hao developed the invention. The patent application number is CN202610382401 20260326. The patent publication number is CN122033766 ..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Hubei New Huaguang Inf Mat Co has submitted a patent application for High Young's Modulus Amorphous Glass, Preparation Method Thereof and Substrate. Yang Sen, Li Jingwei, Hu Xiangping, Liu Jingying, Meng Fanyan, Hu Jinqing, Zhang Fangming, Li Yanxin and Yao Guanpeng developed the invention. The patent appli..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has released Jingxin Semiconductor Huangshi Co Ltd patent application for Sewage Treatment System for Wafer Processing and Treatment Method. This invention was developed by Mcmaitniaz Guzailinuer, Zhang Xiaochun and Jiang Bowen. The patent application number is CN..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Daoke Jiangsu High Tech Mat Co Ltd has sought patent for 5n9-grade Silicon Dioxide Micro Powder with High Purity and High Specific Surface Area and Preparation Method of 5n9-grade Silicon Dioxide Micro Powder. This invention was developed by Wang Zejun, Jiang Yan, Wang Yan, Lu Xianke, Dong Hongtao, Chen Rong a..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has published Fuzhou Enxi Tech Co Ltd patent application for Preparation Method of Novel Synthetic Silicon Dioxide Microrod. The invention was developed by Tang Xing. The patent application number is CN202610144234 20260202. The patent publication number is CN1220..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Anhui Qingzhi Tech Development Co Ltd has applied Chinese patent for Preparation Method of Nano Silicon Material. Kong Lu, Huang Yongwang, Du Yupeng, Guo Linpei, Gao Xiaowei, Cui Yunlong, Shen Yongqiang and Li Wenting developed it. The patent application number is CN202610131429 20260130. The patent publica..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Anhui Lianpeng Zhilian Tech Co Ltd has applied Chinese patent for Anti-fake Bottle Cap Integrated with NFC Chip and Detection System of Anti-fake Bottle Cap. Wu Yuekun, Wang Nannan and Zhao Dajian developed it. The patent application number is CN202610507669 20260417. The patent publication number is CN1220..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has released Hangzhou Shuotian Tech Co Ltd patent application for Grade-increasing Gray Scale Printing Method, Micro-processing Chip and Printing Equipment. This invention was developed by Li Bin, Tang Yichao, Liu Zhili, Zhang Pengfeng and Wang Yupei. The patent a..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Jinruihong Micro Electronic Jiaxing Co Ltd has submitted a patent application for Method for Controlling Bending Degree of Silicon Wafer Through Double-sided Thinning. Zhou Yumeng, Zhong Chenyang, Gu Xinhui, Liang Xingbo, Zhang Xingxing, Xie Zhirong and Xiao Huanhuan developed the invention. The patent appl..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Zhejiang Luhong Science & Tech Co Ltd has submitted a patent application for Recycling System and Treatment Method for Wafer Manufacturing Working Fluid. This invention was developed by Guo Feng, Wu Henghan, Wen Luhong, Fan Jiaqi, Tu Manyan and Chen Yingbin. The patent application number is CN202411623822 2..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has received Beijing Shougang Co Limited patent application for Edge Cutting Method for High-grade Non-oriented Silicon Steel Hot-rolled Strip Steel. Li Guoyue, Li Zhenshan, Zhang Tao, Liu Weiwei, Li Yupeng, Jiao Jinsha, Zhang Peng, Zhou Na, Chen Bo, Zhang Xingguang,..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has received Huatian Tech Nanjing Co Ltd patent application for Packaging Structure and Packaging Method of MEMS Safety Photoelectric Sensor. Chen Xinglong, Li Pengxuan, Gao Ruifeng and Jiang Min developed the invention. The patent application number is CN20261008..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Robert Bosch Co Limited has filed a patent application for MEMS Component and Device with MEMS Component. This invention was developed by Melnikov Andrey, Hoffmann Thomas, Schindler Jens and Sorge Andreas. The patent application number is CN202511660123 20251113. The patent publication number is CN122035774..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Robert Bosch Co Limited has submitted a patent application for MEMS Component Having MEMS Element with Chamber and Asic Component. This invention was developed by Waibler Hans-peter. The patent application number is CN202511641148 20251111. The patent publication number is CN122035773 (A). International Pat..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Toshiba Memory has submitted a patent application for Laser Processing Apparatus, Laser Lift-off Method, and Method for Manufacturing Semiconductor Device. This invention was developed by Okubo Takuro and Hayashi Hidekazu. The patent application number is CN202610207844 20211206. The patent publication number..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Wuhan DR Laser Technology has filed a patent application for Optical Modulation System, Laser Processing Equipment and Processing Method of Solar Cell. This invention was developed by Liang Qiaochun, Zhang Hang, Duan Yufei and Xu Yifan. The patent application number is CN202411636608 20241115. The patent publ..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Yixing Jitai Electronics Co Ltd has sought patent for High-thermal-conductivity Tungsten-copper Composite Heat Dissipation Substrate and Preparation Method Thereof. This invention was developed by Qiu Fangyan and Bao Weijie. The patent application number is CN202610507638 20260417. The patent publication nu..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Nanjing University of Science & Technology has applied Chinese patent for Radar and Infrared Compatible Stealth Material with High-entropy Alloy/spinel Core-shell Structure and Preparation Method of Radar and Infrared Compatible Stealth Material. Sun Qingya, Yang Xiaoning, Zhang Qiyue, Liu Yuhang, Hao Tiancong..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has published Qingzhi Biotechnology Xuzhou Co Ltd patent application for High-throughput Cell Migration Chip as Well as Preparation Method and Application Method Thereof. The invention was developed by Du Chuan and Jiang Zhenwei. The patent application number is C..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Beijing Yimeinuo Biotechnology Co Ltd has submitted a patent application for Real-time Fluorescent PCR Instrument Suitable for Micro-fluidic Chip. This invention was developed by Zeng Youhong, Yuan Yatan, Zhang Yize, Liu Lingxuan, Ding Yingying, Ma Xingwei, Chen Hao and Wang Lei. The patent application numb..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has published Beijing Yimeinuo Biotechnology Co Ltd patent application for Four-channel Centrifugal Microfluidic Nucleic Acid Amplification Chip with Closed Cavity. The invention was developed by Zeng Youhong, Qin Xuying, Zhang Yize, Liu Lingxuan, Ding Yingying, Ma X..

Semiconductor

  |  Wed 05 Aug 2026

Munich, Aug. 6 -- Texas Instruments has applied European patent for Comparator with Noise Cancellation for Switching Power Converters. Pradhan Bikash, Jain Mayank, Shah Yash and Baragur Suryanarayana Dattatreya developed it. The patent application number is EP20240787262 20240916. The patent publication number is EP4781545 (A1)..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has received Yantai Likai Semiconductor Tech Co Ltd patent application for Composite Cutting Fluid and Method for Multi-wire Cutting of Silicon Carbide. Zou Yong, Wu Yujun, Guo Yingjun, Li Jin, Qiu Xinlei, Kong Dekai, Lyu Chunzhe, Che Meiwei, Cao Quanyu and Wang Li d..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has released Amer Tech Co Ltd patent application for Long-chain Alkyl Modified Organic Silicon Composition and Preparation Method Thereof. This invention was developed by Yao Jing, Liu Rende, Liang Zhenxing and Li Qinghua. The patent application number is CN202610..

Semiconductor

  |  Wed 05 Aug 2026

Munich, Aug. 6 -- European Patent Office has released EV Group E Thallner patent application for Method for Transferring a Functional Unit, Donor Substrate and Apparatus for Carrying Out Such a Method. This invention was developed by Uhrmann Thomas, Thallner Bernhard, Lindner Paul and Wimplinger Markus. The patent application n..

Semiconductor

  |  Wed 05 Aug 2026

Munich, Aug. 6 -- Thallner Erich has submitted a patent application for Substrate Stack, Modified Layer System, Method for Handling the Substrate Stack, and Device for Such a Method. This invention was developed by Thallner Erich. The patent application number is EP20230772497 20230918. The patent publication number is EP4781..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Ningbo Anji Microelectronics Technology has submitted a patent application for Etching Composition. Li Lyu, Wen Qimeng, Xia Deyong, Liu Bing and Wang Zhihao developed the invention. The patent application number is CN202411635934 20241115. The patent publication number is CN122037939 (A). International Pate..

Semiconductor

  |  Wed 05 Aug 2026

Munich, Aug. 6 -- ASML Netherlands has applied European patent for Substrate Coupling Systems. Hsu Chia-hao developed it. The patent application number is EP20240755038 20240816. The patent publication number is EP4781452 (A1). Cooperative Patent Classification codes are G01B2210/56 (KR), G01B7/22 (KR), H10P72/0428 (EP, KR), H1..

Semiconductor

  |  Wed 05 Aug 2026

Munich, Aug. 6 -- EV Group E Thallner has sought patent for Method for Assessing a Quality of a Bond Between a First Substrate and a Second Substrate in a Substrate Stack, and Device for Such a Method. This invention was developed by Fehkührer Andreas. The patent application number is EP20230773226 20230918. The patent publica..

Semiconductor

  |  Wed 05 Aug 2026

Munich, Aug. 6 -- Tokyo Electron has submitted a patent application for Methods and Devices for Improving Bond Strength of Diffusion Barriers. This invention was developed by Gildea Adam and Hoshino Satohiko. The patent application number is EP20240868895 20240722. The patent publication number is EP4781447 (A1). Cooperative Pa..

Semiconductor

  |  Wed 05 Aug 2026

Munich, Aug. 6 -- Lam Research has filed a patent application for Integrated Capacitively Coupled Plasma and Remote Inductively Coupled Plasma. This invention was developed by Juarez Francisco J, Frotanpour Ali, Fisher Adam, Kudela Jozef, Schlosser William, Mckerrow Andrew John, Tang Shane, Russell Shoa Allene and Bhimarasetti G..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Guangdong Pusaida Material Tech Co Ltd has submitted a patent application for Dealcoholization Type Organic Silicon Bonding Glue for Electric Kettle and Preparation Method of Dealcoholization Type Organic Silicon Bonding Glue. This invention was developed by Xie Mengxing, Li Zhongjing and Zhan Feng. The pat..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Youxing Shark Shanghai Science And Tech Co Ltd has filed a patent application for Low-density Adhesive Organic Silicon Pouring Sealant and Preparation Method Thereof. This invention was developed by Xu Xinxin, Lei Yong and Peng Xuanzhi. The patent application number is CN202610235370 20260227. The patent pu..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Micron Technology Inc and Micron Technology have been awarded a patent for Receiver Decision Feedback Equalization Calibration. This invention was developed by Brox Martin, Hein Thomas, Balakrishnan Mani, Nenadovic Miljana, Madhewar Hemant and Bach Martin. The patent application number is US202418984778 ..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Texas Instr Incorporated and Texas Instruments have received a patent for Microelectronic Device Package with Integral Slotted Waveguide Antenna. This invention was developed by Bakshi Harshpreet Singh Phull, Ankamah-kusi Sylvester, Jogalekar Aditya Nitin, Murugan Rajen, Tang Yiqi and Herbsommer Juan. Th..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Applied Materials Inc and Applied Materials have been awarded a patent for Substrate Support Assembly with Improved Thermal Uniformity. This invention was developed by Parkhe Vijay D. The patent application number is US202318244180 20230908. The patent publication number is US12695071 (B2). International..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Lam Res Corp and Lam Research have obtained a patent for control of mask CD. This invention was developed by Chen Chen, Ozel Taner, Xu Qing, Wong Merrett, Jiang Beibei, Pi Shuang, Agarwal Daksh and Mukhopadhyay Amit. The patent application number is US202218011477 20220225. The patent publication number ..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Lam Res Corp and Lam Research have secured a patent on Synchronization of RF Pulsing Schemes and of Sensor Data Collection. Drewery John Stephen, Wu Ying, Paterson Alexander Miller and Albarede Luc developed the invention. The patent application number is US202118009978 20211015. The patent publication n..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Micron Technology Inc and Micron Technology have obtained a patent for triple via chain for advanced interconnect in a memory device. This invention was developed by Davis James Eric, Tomayer Joshua Daniel, Rori Fulvio, Cerafogli Chiara, Marr Kenneth William and Wambeke Ivo Thomas. The patent application..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Taiwan Semiconductor Manufacturing Co Ltd and Taiwan Semiconductor Manufacturing have received a patent for Dual Tracking for Fly Bit Line Static Random Access Memory (SARM) Architecture. This invention was developed by Katoch Atul. The patent application number is US202418756659 20240627. The patent pub..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Etron Tech Inc and Invention and Collaboration Laboratory have been awarded a patent for CMOS SRAM Structure with Bulk NMOS Transistors and Fully Insulated PMOS Transistors in One Bulk Wafer. This invention was developed by Lu Chao-chun. The patent application number is US202318137620 20230421. The paten..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Shenzhen Sireda Tech Co Ltd has obtained a patent for miniature semiconductor water cooling machine. This invention was developed by Wang Guohua and Li Zelin. The patent application number is CN202422783820U 20241114. The patent publication number is CN223512368 (U). International Patent Classification code..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Ningbo Jiuxin New Material Tech Co Ltd has submitted a patent application for Hydrophobic Weather-resistant Anti-reflection Coating for Flexible Substrate and Preparation Method of Hydrophobic Weather-resistant Anti-reflection Coating. Li Cencen, Gao Jingtong, Zhang Ping, Tang Yue, Liu Hongkun, Zeng Weihua and..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Applied Materials Inc and Applied Materials have obtained a patent for rotary electrical feedthrough integration for process chamber. This invention was developed by Tomko Andrew, Guo Yang, Forster John, Harrelson Wade, Subramani Anantha, Baluja Sanjeev, Ganta Sathya Swaroop, Chan Anthony and Murtagh Mike. ..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Infineon Tech Americas Corp and Cypress Semiconductor Corporation have secured a patent on Radio Transmitter. Ponton Davide, Manente Davide, Karman Saleh and Petricli Ibrahim developed the invention. The patent application number is US202318478816 20230929. The patent publication number is US12695473 (B2..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Texas Instr Incorporated and Texas Instruments have secured a patent on Low-latency Data Acquisition Using Sigma-delta Modulators. Ivanov Misha, Bucksch Roland and Romano Mattia developed the invention. The patent application number is US202418902584 20240930. The patent publication number is US12695463 ..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Texas Instr Incorporated and Texas Instruments have obtained a patent for compensated digital-to-analog converter (DAC). This invention was developed by Agrawal Meghna and Sahu Debapriya. The patent application number is US202418639466 20240418. The patent publication number is US12695460 (B2). Internati..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- University Zhejiang and Zhejiang University have been awarded a patent for Low-density Liquid-phase Chip for Gossypium Hirsutum L. Based on Targeted Capture Sequencing and Use Thereof. This invention was developed by Hu Yan, Han Zegang, Si Zhanfeng, Fang Lei and Zhang Tianzhen. The patent application num..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Research & Business Foundation Sungkyunkwan University, Samsung Electronics Co Ltd and Research & Business Found Sungkyunkwan University have obtained a patent for sense amplifier flip-flop and integrated circuit including the same. This invention was developed by Kong Bai-sun, Joo Bomin and Lee Jaeha. T..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- STMicroelectronics International NV and STMicroelectronics International NV have secured a patent on Electronic Oscillator with Independent Controls of Variable Capacities. Ayraud Michel and Ramalho Teixeira Jr Fernando Jose developed the invention. The patent application number is US202418943506 2024111..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Texas Instr Incorporated and Texas Instruments have received a patent for Methods and Apparatus to Adjust Linear Redriver Devices. This invention was developed by Wente Douglas Edward, Erdogan Mustafa U and Rane Amit. The patent application number is US202418790834 20240731. The patent publication number..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Texas Instr Incorporated and Texas Instruments have obtained a patent for switching converter deadtime control. This invention was developed by Lu Xuemei, Ban Pengcheng, Wang Yubo, Zhou Zhaofu and Tang Hua. The patent application number is US202418427937 20240131. The patent publication number is US12695..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- ST Microelectronics SRL and STMicroelectronics International NV have obtained a patent for driver circuit with discharge control, corresponding electronic system and vehicle. This invention was developed by Cannavacciuolo Salvatore and D'angelo Vittorio. The patent application number is US202418441537 20..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Ningbo Jiangfeng Tongxin Semiconductor Mat Co Ltd has obtained a patent for double-sided sintering jig for copper-clad ceramic substrate. This invention was developed by Xing Zhong, Yuan Feng, Heng Dongjie, Yao Lijun, Bian Yijun and Zhang Huiran. The patent application number is CN202422550758U 20241022. Th..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has awarded a patent to Laplace (Guangzhou) Semiconductor Technology for Sealing Door Mechanism and Semiconductor Process Equipment. Long Zhanyong, Zhou Liang, Jin Wenkai, Wang Qinqin and Lin Jiaji developed the invention. The patent application number is CN20242311..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Jiangsu Shunxing Refractory Tech Co Ltd has obtained a patent for reinforced silicon mullite brick. This invention was developed by Wu Junliang, Shen Chi, Yu Yidong and Han Xueliang. The patent application number is CN202422941634U 20241130. The patent publication number is CN223512500 (U). International Pa..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Saisi Exploration Hubei New Material Tech Co Ltd has been granted a patent for Self-bonding Silicon Carbide Sintering Device. This invention was developed by Tan Chuanqi, Zhu Hongxi and Zhou Hechen. The patent application number is CN20242339152U 20241209. The patent publication number is CN223512484 (U). I..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Chengdu Wanzhong Weilai Biotechnology Co Ltd has secured a patent on Substrate Surface Modification Device for Gene Sequencing Chip. Zhang Zhifeng and Li Jianlong developed the invention. The patent application number is CN202422884766U 20241126. The patent publication number is CN223509881 (U). Internation..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Ferrotec Jiangsu Quartz Technology has submitted a patent application for High-pressure Steam Quartz Substrate Cleaning Process and Device Thereof. This invention was developed by Xu Mingxiang, Chen Haiyuan, Zhong Jianya, Zhang Yueqing and Yang Jun. The patent application number is CN202511765701 20251127. Th..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Jiangxi Tianyi Semiconductor Co Ltd has filed a patent application for Integrated Circuit Packaging Chip Sorting Machine. This invention was developed by Huo Jianlong and Wang Chao. The patent application number is CN202610234683 20260227. The patent publication number is CN122032902 (A). International Pate..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has released Jiangxi Changlong Tech Co Ltd patent application for Automatic Chip Resistor Sorting and Classifying Device Based on Industrial Visual Inspection. This invention was developed by Long Xiang, Li Weizhong, Tian Renzhong, Jia Bixi and Jia Longtao. The pa..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has received Suzhou Shanshuyuan Semiconductor Equipment Co Ltd patent application for Gluing Device for Semiconductor Wafer Processing. Tang Weidong and Zhou Xiaojuan developed the invention. The patent application number is CN202610198843 20260211. The patent pub..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- SiEn QingDao Integrated Circuits has submitted a patent application for Fluid Shunting Device and Semiconductor Equipment. This invention was developed by Liu Jinlin and Peng Jie. The patent application number is CN202411622441 20241113. The patent publication number is CN122032776 (A). International Patent C..

Semiconductor

  |  Tue 04 Aug 2026

Alexandria, Aug. 5 -- Microchip Tech Inc and Microsemi SoC have been awarded a patent for High-level-synthesis for RISC-V System-on-chip Generation for Field Programmable Gate Arrays. This invention was developed by Ma David, Choi Jongsok and Lian Ruolong. The patent application number is US202318208381 20230612. The patent p..

Semiconductor

  |  Wed 05 Aug 2026

Beijing, Aug. 6 -- Lianyungang Zhaohua Tech Co Ltd has applied Chinese patent for High-adhesion Epoxy Resin Composition and Application Thereof in Semiconductor Chip Packaging. Song Fangfang, Qiu Zhaowu and Jang Je-hyun developed it. The patent application number is CN202610255013 20260304. The patent publication number is CN..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- Siaien Jiujiang New Mat Co Ltd has filed a patent application for Method for Producing and Processing Silicon Nitride Powder. This invention was developed by Li Xiuquan and Gu Yujun. The patent application number is CN202610305785 20260313. The patent publication number is CN122032705 (A). International Pat..

Semiconductor

  |  Thu 06 Aug 2026

Beijing, Aug. 6 -- State Intellectual Property Office of China has received University of Electronic Science and Technology of China patent application for Full-process Integrated Micro-fluidic Integrated Thin-layer Chromatography-surface Enhanced Raman Scattering Analysis Chip. Xie Ruiqi, Guo Xiaowei and Xu Zhuoyi developed the..
1 to 100 of 2103 Items   Next >>
 
Close [X]

 

Please wait..
Close [X]

Email selected articles

Please wait..