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Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Jinko Solar Co Ltd and Zhejiang Jinko Solar have submitted a patent application for 0-busbar Solar Cell and Photovoltaic Module. Chen Zhendong, Peng Yingying, Lin Yao, Zhang Ningbo, Wang Luchuang and Ren Qianqian developed the invention.
The patent application number is US202519392431 20251118. The pate..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Jinko Solar Co Ltd and Jinko Solar, Haining have applied United States patent for Back Contact Solar Cell and Photovoltaic Module. Tao Wusong, Qin Niannian, Peng Yingying, Wang Luchuang, Yang Xubing and Xu Zhaofang developed it.
The patent application number is US202519377320 20251103. The patent public..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Yixing Intelligent Tech Nanjing Co Ltd and Yisuan Intelligent Tech Shanghai Co Ltd have submitted a patent application for Cross-language Data Transmission Method Based on Note Register, and Chip Verification Method and System in Mixed Language Verification Environment. Zhang Zhiwen developed the invention.
..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- National Taiwan Univ and Taiwan Semiconductor Manufacturing Co Ltd have applied United States patent for Semiconductor Device and Manufacturing Method Thereof. Chang Che-jia and Lin Shih-yen developed it.
The patent application number is US202519255445 20250630. The patent publication number is US202603..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- National Taiwan Univ and Taiwan Semiconductor Manufacturing Co Ltd have submitted a patent application for Semiconductor Device and Method for Forming the Same. This invention was developed by Chang Che-jia and Lin Shih-yen.
The patent application number is US202519260001 20250703. The patent publicatio..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Lee Sungun and Samsung Electronics have applied United States patent for Non-volatile Memory Device. Hwang Jungseok, Park Jonghoon, Kim Sunghoon, Bae Mookyu, Kim Ahreum, Lee Myunghun, Yang Juyoung, Yu Changyeon, Lee Sungun, Kwak Pansuk and Shin Homoon developed it.
The patent application number is US202..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Handan Jinglv Tech Co Ltd and Handan Institute Of Innovation Peking University have submitted a patent application for Wide-tuning Mode-hopping-free External Cavity Semiconductor Laser Based on Flexible Hinge Rhombic Mechanism. This invention was developed by Wang Yaqi, Zhu Chuanwen, Huang Jieqiong, Ge Zheyi,..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Nantong Nuotong Yimu Medical Tech Co Ltd and Beijing Nuotong Yimu Medical Tech Co Ltd have sought patent for Post-processing Method and System for Smoothing Surface of Low-scattering Silicon Female Die. This invention was developed by Zhu Zhilin, Di Make, Zhao Ershuai, Long Tan, Zhang Chi and Li Jiayi.
The..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Tokyo Electron Ltd and Geminatio have sought patent for Methods for Forming Self-aligned Features. This invention was developed by Greenough Jordan B, Fulford Daniel, Devilliers Anton, Klemes Max J and Callahan May.
The patent application number is US202619537049 20260211. The patent publication number ..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has released SJ Semiconductor, Jiangyin patent application for 2.5d Packaging Structure and Preparation Method. This invention was developed by Chen Yenheng, Lin Chengchung and Yang Jin.
The patent application number is US202319107591 20230608. The patent publication num..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- SJ Semiconductor, Jiangyin has applied United States patent for Three-dimensional Packaging Structure and Manufacturing Method Therefor. Chen Yenheng and Lin Chengchung developed it.
The patent application number is US202319107592 20230601. The patent publication number is US20260334250 (A1). Internatio..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Hyperlume Inc has submitted a patent application for Method of Packaging and Integration for Multi-layer System. This invention was developed by Asad Mohsen.
The patent application number is US202619725010 20260630. The patent publication number is US20260333963 (A1). International Patent Classification..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Taixing Lianzhong Well Cover Co Ltd has been granted a patent for Drainage Well Lid with Buffer Structure. This invention was developed by Luo Jiwei, Luo Jun, Luo Jian and Zhao Youming.
The patent application number is CN202520341763U 20250228. The patent publication number is CN223922365 (U). Internationa..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Saneheld Fuqing Food Co Ltd has secured a patent on Anti-adhesion Conveying Device for Quick Freezing of Surimi. Chen Yongqing, Wang Jinfeng and Hu Zhenghong developed the invention.
The patent application number is CN202520717695U 20250416. The patent publication number is CN223920450 (U). International P..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Anhui Xinyan Printing Co Ltd has received a patent for Multi-layer Buffering Type Packing Box Liner Support. This invention was developed by Tu Bing, Tu Min and Yu Benwen.
The patent application number is CN202520709335U 20250415. The patent publication number is CN223920097 (U). International Patent Class..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has received Suzhou Dahongxing Semiconductor Testing Tech Co Ltd patent application for Ceramic Circuit Line Sub-pixel Image Measurement Method and System Based on Multispectral Imaging. Shi Mingzhong developed the invention.
The patent application number is CN20..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Jiangsu Fulate Semiconductor Equipment Co Ltd has submitted a patent application for Slot Type Equipment Scheduling Control Method and System Based on Predictive Resource Reservation. This invention was developed by Mao Shengyuan, Zheng Liming and Nie Linglong.
The patent application number is CN2026106651..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has filed a patent application for Semiconductor Device. This invention was developed by Liu Chia-hung, Teng Po-yuan, Tsai Hao-yi, Song Rui-wen and Chen Shih-wei.
The patent application number is US202619730734 20260702. The patent publication number is US202603..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Thermal Dissipation in Semiconductor Devices. Chen Yu Hsiang, Chen Po-yu, Lin Hui-ling and Wu Cheng Hung developed the invention.
The patent application number is US202619728046 20260701. The patent publication number is US..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Stats Chippac Man Pte Ltd has filed a patent application for Semiconductor Package Assembly and a Method for Forming the Same. This invention was developed by Cho Namju, Kim Jongtae and Choi Hangchul.
The patent application number is US202619650385 20260417. The patent publication number is US2026033433..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has released Jcet Man Co Ltd patent application for Package Structure and Method for Manufacturing the Same. This invention was developed by Yang Cheng.
The patent application number is US202619641055 20260407. The patent publication number is US20260334331 (A1). Interna..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Yangtze Memory Tech Holding Co Ltd has submitted a patent application for Semiconductor Device, Method of Manufacturing Thereof, Package Structure and Electronic Device. This invention was developed by Liu Xiaoxin, Zhang Yu, Huo Zongliang, Jin Lei and Xu Feng.
The patent application number is US20251937..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has published Elane Beijing Data Tech Co Ltd patent application for Resource Scheduling Method and Device, Emergency Decision System and Chip. The invention was developed by Wang Nan.
The patent application number is CN202610390706 20260327. The patent publicatio..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Orient Semiconductor Electronics Ltd has submitted a patent application for Semiconductor Package and Manufacturing Method Thereof. This invention was developed by Yang Chia-ming, Tung Yueh-ming, Yen Po-yen, Cheng Hung-yu and Wang Pin-chun.
The patent application number is US202519182681 20250418. The p..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has released Samsung Electronics patent application for Semiconductor Device Including Insulating Layers and Method for Manufacturing the Same. This invention was developed by Jo Yongkun, Son Sungmin, Jang Minho, Kim Jiyeong and Kim Doyeon.
The patent application number ..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Limited patent application for High-density Microbump Arrays with Enhanced Adhesion and Methods of Forming the Same. The invention was developed by Lai Yen-kun, Lii Mirng-ji, Wu Yi-wen, Chang Kuo-chin and Tsai Po-hao.
T..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Rongxin Semiconductor Ningbo has been granted a patent for Take-up Equipment for Electric Power. This invention was developed by Wang Guanhong and Chi Aina.
The patent application number is CN202423226911U 20241226. The patent publication number is CN223920766 (U). International Patent Classification codes..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Beijing Htzw Science & Tech Engineering Automation Co Ltd has been awarded a patent for Winding Device for Semiconductor Electrothermal Film. This invention was developed by Xu Jianwei and He Xiao.
The patent application number is CN202520733109U 20250417. The patent publication number is CN223920653 (U). ..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Yancheng Hongli Abrasive Co Ltd has been awarded a patent for Green Silicon Carbide Finished Product Charging Device. This invention was developed by Zhou Pingfeng, Zhou Pinghua, Li Yingying, Zheng Hui and Liao Xiaoyan.
The patent application number is CN202520651503U 20250409. The patent publication numbe..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Nantong Jinweier Intelligent Equipment Co Ltd has secured a patent on Embossing and Cooling Device for EVA (Ethylene Vinyl Acetate) Adhesive Film for Packaging Solar Cell. Liu Meiyuan and Xin Wensheng developed the invention.
The patent application number is CN202520558014U 20250327. The patent publication..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Chongqing Jingbiao Electronic Tech Co Ltd has obtained a patent for integrated workbench for semiconductor special gas equipment. This invention was developed by He Jie and Ji Xuefeng.
The patent application number is CN202520295923U 20250221. The patent publication number is CN223917937 (U). International..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Changzhou Weipu Semiconductor Equipment Co Ltd has received a patent for Clamp for Mask Detection. This invention was developed by Liu Jun, Liu Jianming and Gu Quanchi.
The patent application number is CN202520412201U 20250310. The patent publication number is CN223917724 (U). International Patent Classifi..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Hefei Ruishida Electronic Tech Co Ltd has obtained a patent for clamping assembly for integrated circuit packaging substrate detection. This invention was developed by Wang Fei, Wang Jifa and Wu Dongbo.
The patent application number is CN202520371036U 20250305. The patent publication number is CN223917720 ..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Chinese Patent for Grinding Wire and Grinding Structure has been issued to CMC Semiconductor Mat Shenzhen Co Ltd. This invention was developed by Li Shuhong, Li Haojie, Chen Bin, Chen Dongli and Li Guangxi.
The patent application number is CN202520330212U 20250226. The patent publication number is CN223917..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Xinsheng Intelligent Tech Hunan Co Ltd has applied Chinese patent for Data Compression Method and System for SSD. Ma Yi, Wu Xinxian, Yang Wanyun and Xiong Wei developed it.
The patent application number is CN202610846973 20260612. The patent publication number is CN122394566 (A). International Patent Class..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Sinochip Semiconductor Tech Co Ltd has submitted a patent application for VCSEL Chip Lens Defect Intelligent Identification and Diagnosis Method and System. This invention was developed by Yao Shun, Wang Jianjun, Dong Jingwen, Jiang Tao, Jiang Aiting, Wang Xiaoqin and Peng Lingyong.
The patent application ..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has received Beiyi Semiconductor Tech Guangdong Co Ltd patent application for Chip Welding Detection Method. Li Mingda and Bi Wanqing developed the invention.
The patent application number is CN202610532518 20260421. The patent publication number is CN122391160 (..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has received Zhongjia Weishi Shenzhen Semiconductor Tech Co Ltd patent application for Panel Particle Defect-oriented Anomaly Detection Method, Device, Equipment and Medium. Zhao Baiyang, Wu Xiaofei, Tang Yufeng and Zeng Min developed the invention.
The patent ap..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has received Zhongjia Weishi Shenzhen Semiconductor Tech Co Ltd patent application for Visual Detection Method and Device Based on Visual Language Model, Equipment and Medium. Zhao Baiyang, Xu Xuecheng and Tang Yufeng developed the invention.
The patent applicati..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has sought patent for Photo Detector and Manufacturing Method Thereof. This invention was developed by Chiang Chen-hao.
The patent application number is US202619687385 20260526. The patent publication number is US20260333944 (A1). International Patent Classifica..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Hubei Xida Semiconductor Tech Co Ltd has secured a patent on Cooling System for Quartz Body Cutting. Huang Zhenghao, Ma Xiaoge and Li Jian developed the invention.
The patent application number is CN20252088612U 20250115. The patent publication number is CN223918329 (U). International Patent Classification..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Sede Laibo Jiaxing Tech Intelligent Manufacturing Co Ltd has been awarded a patent for Silicon Single Crystal Rod Inside Diameter Slicer for Semiconductor. This invention was developed by Xu Xuejun.
The patent application number is CN202520522261U 20250324. The patent publication number is CN223918326 (U)...
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Tianjin Wanming Jialong Tech Development Co Ltd has been granted a patent for Drilling Chip Removal Mechanism and Equipment Provided with Same. Zhao Lian and Su Chang developed the invention.
The patent application number is CN202423244868U 20241227. The patent publication number is CN223918134 (U). Intern..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Sino Nitride Semiconductor Co has submitted a patent application for GaN-SiC Optical Interconnection Structure and Control Processing System. This invention was developed by Zhuang Wenrong, Wu Yao, Ao Hui and Zhang Ruihua.
The patent application number is CN202610512153 20260417. The patent publication num..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Yuanxi Semiconductor Tech Shanghai Co Ltd has submitted a patent application for Distributed Broadband Group Delay Compensation Method and Glass Substrate Phased Array Antenna. This invention was developed by Ma Yuchu, Zhang Jianlin, Shi Hanjun, Yuan Yongbin and Liu Zehong.
The patent application number is..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Hue Inc has applied United States patent for Micro Light Emitting Diode Chip and Method for Forming the Same. Guo Jian, Feng Feng and Bai Chengzhen developed it.
The patent application number is US202619533293 20260209. The patent publication number is US20260333964 (A1). International Patent Classifica..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Integrated Circuit Device and Method of Manufacturing the Same. This invention was developed by Chen Sung-wen Huang, Chu Yi-shin, Lin Hsing-chih and Liao Yin-kai.
The patent application number is US202519185386 20250422. Th..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Method of Forming Deep Trench Isolation in Radiation Sensing Substrate and Image Sensor Device. This invention was developed by Liang Yao-hsiang, Lu Chi-ming, Huang Chih-chang, Huang Chih-hui, Hsu Ching-ho and Tsao Jung-chih.
..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has sought patent for Photonic Structure and Methods of Manufacturing. This invention was developed by Liao Shih-yu.
The patent application number is US202619468158 20260203. The patent publication number is US20260333892 (A1). International Patent Classificatio..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has released Meyer Burger Switzerland AG patent application for Method for Manufacturing a Solar Cell Module and Solar Cell Module and Junction Box. This invention was developed by Rath Christian.
The patent application number is US202318993133 20230711. The patent publi..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has awarded a patent to Dongguan Zhenghan Electroplating Co Ltd for Automatic Material Conveying Device of Fog Tin Wire Electroplating Production Line. Wen Zhihong, Deng Xiaoling and Chen Lihua developed the invention.
The patent application number is CN202520695..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Guangzhou Shiyang Energy Tech Co Ltd has secured a patent on Crystal Spot Welding Machine Convenient to Fix. Huang Weisheng, Wu Xinpeng, Zou Wenjian and Cheng Nan developed the invention.
The patent application number is CN202520557038U 20250327. The patent publication number is CN223916900 (U). Internatio..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has awarded a patent to Nantong Jiaobang Digital Tech Co Ltd for Transverse Shear Automatic Feeding Machine for Silicon Steel Coil Strip Material Machining. Yang Liyong, Chen Xiaowei, Yuan Xin and Zhang Yaping developed the invention.
The patent application numbe..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Wang Jinglin has submitted a patent application for Self-adaptive Energy-saving Control System and Method Based on Silicon Controlled Rectifier. This invention was developed by Wang Jinglin.
The patent application number is CN202610452578 20260408. The patent publication number is CN122394412 (A). Internat..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Image Sensing Structure and Method for Manufacturing the Same. Hu Wei-li, Cheng Yun-wei, Wu Cheng-ming, Lee Kuo-cheng and Hsieh Feng-chien developed the invention.
The patent application number is US202619728352 20260702. T..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Guangzhou China Star Optoelectronics Semiconductor Display Technology has filed a patent application for Display Panel, Method for Manufacturing Same, and Display Device. This invention was developed by Cao Weiran, Li Shan, Su Zhirong, Liu Zhongjie, Hsu Yuanjun, Yu Daoping and Zhao Bin.
The patent appli..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Co Ltd patent application for Semiconductor Structures and Methods of Forming the Same. Chiang Katherine H, Ho Yen-chung and Wu Yong-jie developed the invention.
The patent application number is US202519181385 20250417. The..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has sought patent for Semiconductor Structure. This invention was developed by Kuo Li-chung, Chang Po-ying, Yang Chen-chuan, Lin Yun-han, Wu Wen-lang and Lee Chang-tai.
The patent application number is US202619728316 20260702. The patent publication number is US..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Suzhou Qiti Tech Co Ltd has applied Chinese patent for Method for Predicting Cycle Life of Artificial Intelligence Chip Under Thermal-mechanical Coupling Effect. Zhu Zuoquan and Wu Peiyun developed it.
The patent application number is CN202610469627 20260410. The patent publication number is CN122389804 (A..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has released Sony Semiconductor Solutions Corporation patent application for Imaging Element and Electronic Device. This invention was developed by Ando Atsuhiro, Hatano Keisuke, Nagata Kengo, Furuhashi Takahisa, Masuda Yoshiaki and Noudo Shinichiro.
The patent applicati..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Liu Dan has submitted a patent application for Design Method and Device of Silicon Light Circuit, Storage Medium and Electronic Equipment.
The patent application number is CN202610443604 20260407. The patent publication number is CN122389803 (A). International Patent Classification codes are G06F30/394 an..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Image Sensor Structures and Methods for Forming the Same. The invention was developed by Lin Kun-hui, Lee Kuo-cheng, Lin Ping-hao and Chang Po Chun.
The patent application number is US20261973..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Deep Trench Isolation Structure for High Resolution CIS Pixel. This invention was developed by Lu Jiech-fun, Tsao Tsun-kai, Hsu Hung-wen, Kuo Wen-chang, You Bing Cheng and Shih Chih Cheng.
The patent application number is U..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Light Absorbing Layer to Enhance P-type Diffusion for DTI in Image Sensors. This invention was developed by Cheng Yu-hung, Fang Yu-siang, Li Ching I, Hsia Yu-yao and Tsai Min-ying.
The patent application number is US2026197..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Image Sensor Device and Manufacturing Method Thereof. Lu Jiech-fun, Kuo Ming-yu and Chang Hung-chang developed the invention.
The patent application number is US202519182577 20250417. The patent publication number is US2026..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has published Omnivision Technologies patent application for Hybrid Image Pixels for Phase Detection and Auto Focus. The invention was developed by Deng Wei, Yang Xiaodong, Pang Chin Poh, Liu Guansong, Meng Da and Li Hongjun.
The patent application number is US2026197279..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Image Sensor Device with Light Retention Structure. This invention was developed by Wang Yi-hsuan, Chiang Wei-chieh, Huang Cheng-yu and Chou Keng-yu.
The patent application number is US202619721016 20260626. The patent publ..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has filed a patent application for Zig-zag Signal Shielding for Pixel Array. This invention was developed by Huang Kuan-chieh, Yang Hao-lin, Yaung Dun-nian, Hsiao Chia-chi, Chung Chi-hsien, Wang Tzu-jui, Hsu Wei-cheng, Wang Chen-jong and Liao Yi-han.
The patent ..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Co Ltd patent application for Multiple Wavelength Band Light Sensor Device. Jiang Sin-yi, Chen Sung-wen Huang, Chen Hsiang-lin, Chu Yi-shin and Liao Yin-kai developed the invention.
The patent application number is US202619..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Image Sensor Device and Method of Manufacturing the Same. Yaung Dun-nian, Hsiao Chia-chi, Chung Chi-hsien, Wang Tzu-jui, Chuang Chun-hao and Wang Chen-jong developed the invention.
The patent application number is US2026197..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Shanghai Thinktech Information Tech Co Ltd has submitted a patent application for CRC (Cyclic Redundancy Check) Module Form Verification Device and Method for Vehicle-gauge-level Chip. This invention was developed by Leng Yong, Xiong Minquan, Wu Song, Liu Gongzhe, Cai Chang, Chen Jie and Feng Hua.
The pate..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Hefei Comprehensive National Science Center Energy Research Inst Anhui Energy Laboratory has sought patent for Design Method of Low-delay Isolated Internal and External Controllable Synchronous Signal Silicon Controlled Rectifier Drive Circuit. This invention was developed by Yang Zhiqing, Song Jiahao, Xing H..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Hu Zhihong has submitted a patent application for Hardware Security Protection Chip and Protection Method Based on Radio Frequency Resonance Field Isolation.
The patent application number is CN202610558543 20260425. The patent publication number is CN122394784 (A). International Patent Classification codes..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Shanghai Spiderman Robot Co Ltd has filed a patent application for Programmable Power Chip Circuit. This invention was developed by Liu Qiang, Zhao Dong and He Jun.
The patent application number is CN202610803126 20260605. The patent publication number is CN122394372 (A). International Patent Classificatio..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has published Yichang Power Supply Co Of State Grid Hubei Electric Power Co Ltd patent application for Low-loss Integrated Power Conversion Module and Method for Direct-current Distribution Network Based on High-temperature Superconducting Strip. The invention was d..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has received Jieen Micro Semiconductor Shanghai Co Ltd patent application for Series Resonant Converter and Control Method Thereof. Dai Zhonghui, Zhang Yu and Li Qiang developed the invention.
The patent application number is CN202610353809 20260320. The patent p..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Lii Semiconductor Inc has sought patent for Power Switch Tube Control Circuit and Control Method of Switching Power Supply. This invention was developed by Zhong Peiqiang, Tang Shaolin and Zhong Jianpeng.
The patent application number is CN202610552137 20260424. The patent publication number is CN122394348..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Wuhan Hezhi Digital Energy Tech Co Ltd has submitted a patent application for LLC Resonant Converter and Synchronous Rectification Control Method, System and Chip Thereof. This invention was developed by Huang Fuyuan, Hong Jie, Xiao Haifeng, Li Xinhai, Ma Jingming, Zhao Liuchang, Zhang Qi, Zhou Xiaowei and Yu..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has received Quanzhou Fengyun New Energy Tech Co Ltd patent application for Battery Management Chip Parameter Configuration Control System and Method. Huang Jianfu and Wu Gengsheng developed the invention.
The patent application number is CN202610864656 20260616...
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Shangyu Semiconductor Material Res Center has submitted a patent application for Silicon-carbon Negative Electrode Material and Preparation Method and Application Thereof. Zhang Yicheng, Fang Mengzhu and Liu Zhaofei developed the invention.
The patent application number is CN202610362465 20260324. The pate..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Shanghai Shengzhou Juneng Semiconductor Tech Co Ltd has submitted a patent application for Radio Frequency Impedance Matching System and Method of Integrated Lightweight Special Reasoning Chip. Zhao Junjun, Yin Qiaoxing, Zhu Peiwen and Xie Tianhong developed the invention.
The patent application number is ..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Institute of Electrical Engineering, Chinese Academy of Sciences has submitted a patent application for Secondary Electron Spectrum Detection and Imaging System and Method. This invention was developed by Duan Ruibin, Xu Yuefan, Ru Yadong, Zhu Guoshun, Zuo Tingting, Gao Zhaoshun, Han Li, Xiao Liye, Jiang Zhiq..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has published Shanghai Xipu Hanxin Electronic Tech Co Ltd patent application for Processing Technology of Electron Generator. The invention was developed by Ye Zhiqiang and Ye Han.
The patent application number is CN202610532337 20260421. The patent publication n..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has filed a patent application for System and Method of Bump Map Determination and Bump Array Formation. This invention was developed by Chen Peng-ren, Mou Jong-i, Cheng Wen-hao, Chen Cheng-hung, Cheng Chan-chung, Liu Chun-chen and Hsu Shih Hsuan.
The patent app..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has received ams-OSRAM International patent application for Method for Producing an Electronic Component, and Electronic Component. Schwarz Thomas developed the invention.
The patent application number is US202319110392 20230912. The patent publication number is US202603..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Low Temperature Substrate Bonding Method. The invention was developed by Lin Keng-chu, Yeh Wei-ting, Peng Yu-yun and Liang Zheng-yong.
The patent application number is US202619730080 20260702...
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Interconnect Structures and Manufacturing Method Thereof. Huang Chun-hsien, Chang Ken-yu, Chang Chih-wei, Hsu Peng-fu, Kao Chen-yuan, Lai Chia-han, Tsai Chun-i, Hung Min-hsiu, Tsai Ming-hsing and Cai Yu-syuan developed the inv..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Limited has sought patent for Package Substrate Including Fiber-reinforced Dielectric Layer, Package Structure Including the Package Substrate and Method of Forming the Same. This invention was developed by Hsu Kuo-ching and Chen Yu-huan.
The patent application numb..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Shanghai Pengxi Semiconductor Co Ltd has sought patent for Multi-level State Cascaded Semiconductor Manufacturing Execution Plan and Life Cycle Management Method and System. This invention was developed by Zhong Minxun, Cheng Zhenming and Chen Yao.
The patent application number is CN202610838498 20260611. ..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Interposer Substrate, Package Structure and Manufacturing Method of Package Structure. Lai Hsin-yu, Ling Chia-yu, Chiang Katherine H and Lin Chung-te developed it.
The patent application number is US202619634095 20260331. The..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Limited has submitted a patent application for Stress Protection Structures for Low-k Dielectric Layers Under Bonding Pads and Methods for Forming the Same. Lii Mirng-ji, Chen Chen-shien, Hsu Chien Hao, Chang Kuo-chin and Tu Wei-hsiang developed the invention.
The p..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Limited has submitted a patent application for Alignment Mark Via Assemblies for a Composite Interposer and Methods of Using the Same. Tsao Wei-an, Hu Yu-hsiang, Wang Po-han and Kuo Hung-jui developed the invention.
The patent application number is US202619730153 20..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Limited has filed a patent application for Semiconductor-on-insulator (SOI) Structure with Variable Resistivity Epitaxial Semiconductor Layers and Methods of Making the Same. This invention was developed by Cheng Yu-hung, Lin Yung-lung, Wu Yun-chi, Li Ping-cheng and Li..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Package Structure with Transmission Line and Method for Manufacturing the Same. The invention was developed by Liao Wen-shiang.
The patent application number is US202619728995 20260702. The pa..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- STATS ChipPAC has sought patent for Semiconductor Device Comprising Different Shielding Layers to Provide Reduced Electromagnetic Interference and Method for Making the Same. This invention was developed by Kim Youngsang, Koo Kyowang, Kim Kyungmoon, Kim Junghoon and Kim Heeyoun.
The patent application n..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Limited patent application for Thermal Interface Material Layer Protection Structures and Methods of Forming the Same. The invention was developed by Lin Wei-hung.
The patent application number is US202619722889 2026062..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Intel Products IP LLC has applied United States patent for Methods and Apparatus to Protect Sockets for Integrated Circuit Packages from Damage During Shock Events. Pei Min, Prabhugoud Mohanraj, Johnson Jordan Daniel, Willems Dawson Leander and Neumann Daniel J developed it.
The patent application numbe..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has published Wolfspeed patent application for Localized Structural Surface Enhancement Features for Power Electronic Device Attaches. The invention was developed by Mohammad Nafis Bakhtiyar, Boshkovski Filip, Mcpherson Brice and Papagianis Argirios.
The patent applicati..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Limited has sought patent for Package Structure Including a Package Lid Having a Plurality of Fins and Methods of Forming the Same. This invention was developed by Hsieh Ping-yin, Chen Chih-hao, Shih Ying-ching and Cheng Li-hui.
The patent application number is US20..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Device and Methods of Formation. This invention was developed by Luo Guanyu, Li Sheng-chan, Chen Sheng-chau and Cheng Chung-liang.
The patent application number is US202619726218 20260630. The patent publicati..
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