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Semiconductor
| Tue 11 Aug 2026
Alexandria, Aug. 11 -- Warren Ryan Paul has sought patent for Ephemeral Virtualized Execution and Memory Confinement Platform for Cpu/gpu Data Zeroization and Immutable Proof-of-erasure. This invention was developed by Warren Ryan Paul.
The patent application number is US202519047096 20250206. The patent publication number is..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Chinese Patent for Terminal Conveying and Positioning Device has been issued to Lianshuo Semiconductor Tech Suzhou Co Ltd. This invention was developed by Wang Chengcai.
The patent application number is CN202423100076U 20241216. The patent publication number is CN223521753 (U). International Patent Classif..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has released DENSO patent application for Semiconductor Device. This invention was developed by Akitsu Yoshinori, Imaizumi Norihisa and Kusama Hirotoshi.
The patent application number is US202619650521 20260417. The patent publication number is US20260231761 (A1). Intern..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has released DWS SRL patent application for Stereolithography Method and Machine for the Production of a Three-dimensional Object. This invention was developed by Costabeber Ettore Maurizio.
The patent application number is US202619631014 20260327. The patent publication..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has published Sichuan Kiloway Tech Co Ltd patent application for High-density One-time Programmable Memory. The invention was developed by Mao Junhua and Peng Jack Zezhong.
The patent application number is US202619529885 20260204. The patent publication number is US20260..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has released Anhui Hoivway Optoelectronics Tech Co Ltd patent application for Ultra-thin Side-emitting LED Package Structure with Built-in Driver IC Die. This invention was developed by Fang Chengying and Zhang Deng.
The patent application number is US202619466502 202602..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Chengdu Analog Circuit Tech Inc has filed a patent application for Non-volatile Memory Cell and Memory. This invention was developed by He Zhongbo, Chen Feilong, Wang Yulong and Xiang Jianjun.
The patent application number is US202519392737 20251118. The patent publication number is US20260231410 (A1). ..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Tachyum Ltd has submitted a patent application for 128 Byte Cache Line Memory Controller for Non-standard Dimm Architecture. This invention was developed by Danilak Radoslav, Herman Pinchas and Radke William.
The patent application number is US202519046076 20250205. The patent publication number is US20..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Power Master Semiconductor Co Ltd has submitted a patent application for Semiconductor Device. This invention was developed by Lee Chang Ju and Park Woo Sung.
The patent application number is US202519194401 20250430. The patent publication number is US20260231467 (A1). International Patent Classificatio..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Kyoto University and University Public Corporation Osaka have submitted a patent application for Method for Producing Light Emitting Device, and Light Emitting Device. This invention was developed by Okamoto Koichi, Kawakami Yoichi, Matsuyama Tetsuya, Wada Kenji, Kaito Seiya and Funato Mitsuru.
The pate..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- General Electric Tech GmbH has submitted a patent application for Assembly. This invention was developed by Barker Carl and Davidson Colin.
The patent application number is US202419154041 20240220. The patent publication number is US20260231816 (A1). International Patent Classification codes are H02M7/0..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Guangdong Xuhong Semiconductor Material has been awarded a patent for Continuous Electroplating Conductive Washing Pool. This invention was developed by Xiao Jianfeng.
The patent application number is CN20242395054U 20241216. The patent publication number is CN223522698 (U). International Patent Classifica..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Riyuexin Semiconductor (Kunshan) has been granted a patent for Electroplating Device for Production and Processing of Semiconductors. Huang Zhongrong and Zhang Chenghui developed the invention.
The patent application number is CN20242370618U 20241212. The patent publication number is CN223522706 (U). Inter..
Semiconductor
| Mon 10 Aug 2026
Beijing, Aug. 11 -- Shanghai Gaosheng Integrated Circuit Equipment has secured a patent on Quick-acting Automatic Gate Valve. Choi Han-kwan and Chen Gang developed the invention.
The patent application number is CN202423192670U 20241224. The patent publication number is CN223524581 (U). International Patent Classification cod..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Wuxi Jinyuan Semiconductor Technology has submitted a patent application for Spray Head Cleaning Device and Cleaning Method. This invention was developed by Lee Ho-chan.
The patent application number is CN202610544161 20260423. The patent publication number is CN122076755 (A). International Patent Classifi..
Semiconductor
| Tue 11 Aug 2026
Alexandria, Aug. 11 -- KIOXIA has applied United States patent for Memory System and Method. Takasaka Shin, Takahashi Yusuke and Domon Makoto developed it.
The patent application number is US202519235704 20250612. The patent publication number is US20260227915 (A1). International Patent Classification code is G06F3/06. Cooper..
Semiconductor
| Tue 11 Aug 2026
Alexandria, Aug. 11 -- Sony Group has submitted a patent application for Memory Controller, Storage Device, and Computer System. This invention was developed by Takahashi Yuji.
The patent application number is US202419152730 20240122. The patent publication number is US20260227925 (A1). International Patent Classification cod..
Semiconductor
| Tue 11 Aug 2026
Alexandria, Aug. 11 -- Kinaxis has applied United States patent for Co-operative Memory Management System. Ellicott Dylan, Fitzpatrick Alex, Lin Angela, Walker Robert and Creanga Marin developed it.
The patent application number is US202619632609 20260330. The patent publication number is US20260228124 (A1). International Pat..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- NVIDIA has submitted a patent application for Direct-current (DC) Restoration with Clock-to-data Synchronization in Alternating-current (ac)-coupled Link. This invention was developed by Abadi Ofek and Wolkovitz Omer.
The patent application number is US202519047178 20250206. The patent publication numbe..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Infineon Technologies, Austria has submitted a patent application for Resistor Formed on Type III-V Semiconductor Body.
The patent application number is US202519043719 20250203. The patent publication number is US20260231443 (A1). International Patent Classification codes are H10D1/43, H10D30/47 and H10D..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- ASML Netherlands has sought patent for Lithographic Apparatus, Method of Increasing Plasma Concentration, and Method of Manufacturing Devices. This invention was developed by Jagodar Andrea, Galutschek Ernst, Nikipelov Andrey, Jansen Paul, Van Der Horst Ruud Martinus and Milov Igor.
The patent applicati..
Semiconductor
| Tue 11 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has released SK Hynix patent application for Method for Memory ID Allocation, Memory, Memory Module, and Memory System. This invention was developed by Park Min Su, Kim Kyung Whan and Song Choung Ki.
The patent application number is US202619636304 20260401. The patent pu..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Chinese Patent for Overturning Blanking Equipment for Electroplating Production Line has been issued to Shanghai Tongshu Precision Electromechanical Tech Co Ltd. This invention was developed by Cai Shoubing.
The patent application number is CN202423188644U 20241223. The patent publication number is CN22352..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Shenzhen Hoyan Laser Tech Co Ltd has been granted a patent for Full-automatic Tray Placing and Sorting Equipment for Inductors. This invention was developed by Yang Zheng and Wu Jie.
The patent application number is CN202423138224U 20241219. The patent publication number is CN223521831 (U). International P..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Jushi Group Chengdu Co Ltd has received a patent for Automatic Lifting Device for Chip Storage Rack. This invention was developed by Shen Yaohua, Zhuang Jianliang, Lai Jian, He Yunyong and Wei Dong.
The patent application number is CN20242311920U 20241206. The patent publication number is CN223521790 (U). ..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Zhuhai Chenmu Technology has been granted a patent for Semiconductor Stacking Equipment. Huang Mingming developed the invention.
The patent application number is CN202423147159U 20241219. The patent publication number is CN223534315 (U). International Patent Classification codes are B65G13/06, B65G47/24, B..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Amphenol Canada Corp has submitted a patent application for Quadrax Electrical Cable with Wafer Insulation Displacement Contact Connection. This invention was developed by Marten Barbara Heather, Condello Antonio, Patel Ghanshyam, Ljubijankic Zlatan, Jay Peter Ervin and Gibson Karen Anne.
The patent app..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Yaruimei Int Biotechnology Guangdong Hengqin Co Ltd has submitted a patent application for Breathable Adjustable Traditional Chinese Medicine Eyeshade Based on AI Chip. This invention was developed by Tang Xiao.
The patent application number is CN202610516744 20260420. The patent publication number is CN12..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- State Intellectual Property Office of China has awarded a patent to Zhuoer Semiconductor Equipment (Suzhou) for Feeding and Discharging Device for Frame Marking. Liu Yonghe, Fu Jianning, Deng Daqiao, Gao Nana, Zhao Wang and Cao Ping developed the invention.
The patent application number is CN202423175986U ..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Shenzhen Dongcheng Hongye Electronics Co Ltd has secured a patent on Placement Mechanism for Detecting COB Integrated Circuit Board. Pan Kangchao and Pan Kangji developed the invention.
The patent application number is CN202423305343U 20241227. The patent publication number is CN223521772 (U). Internationa..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Suzhou Jinci Semiconductor Mat Co Ltd has been awarded a patent for Cooperative Control Equipment for Discharging After Banburying of Semiconductor Ceramic Material. This invention was developed by Gao Liang and Wei Xiujuan.
The patent application number is CN20242364271U 20241212. The patent publication n..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- State Intellectual Property Office of China has awarded a patent to Shaowu Lijiu Intelligent Tech Co Ltd for Bamboo Chip Transfer Device. Song Ling, Fan Zegui, Jiang Shanjun, Fan Xitan, Zhang Yin, Zhu Jianqiang, Shen Jun and Zhang Yongzhong developed the invention.
The patent application number is CN202423..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has published Honeycomb Battery Co patent application for Apparatus for Uniform Deposition of Silicon in Pores of Porous Conductive Particles for Battery Anodes. The invention was developed by Lin Hsun, Lu Sheng-yi, Lin Yen-po, Chai Song-hai, Chang Hao-hsun and Jang Bor Z.
..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Samsung Electronics has applied United States patent for Sample Holder and Method for Manufacturing Specimen Using the Same. Park Sanghyun, Lim Sungryeol, Shin Young-gon, Kim Inhae, Jo Minchul and Lee Soyeon developed it.
The patent application number is US202519339965 20250925. The patent publication n..
Semiconductor
| Mon 10 Aug 2026
Beijing, Aug. 10 -- Tong Yingwei and Anhui Yunxi Quantum Tech Co Ltd have sought patent for Internet of Things Security Chip Based on Multiple Quantum Entropy Sources, Security Authentication Method, Device and System. This invention was developed by Tong Yingwei.
The patent application number is CN202610186044 20260209. The ..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Guangzhou Qinglanshidai Semiconductor Co Ltd has obtained a patent for protective structure of semiconductor module transfer stacking machine. This invention was developed by Zhou Zhou, Guo Litian and Chen Jialiu.
The patent application number is CN202520215280U 20250211. The patent publication number is C..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- State Intellectual Property Office of China has awarded a patent to Ningbo Rongbaoyu Semiconductor Co Ltd for Copper-clad Ceramic Substrate Carrier. Huang Xinsheng developed the invention.
The patent application number is CN20242335908U 20241210. The patent publication number is CN223521358 (U). Internatio..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Voltage-to-time Converter in Analog-to-digital Converter. This invention was developed by Chuang Mei-chen, Vasekar Manoj Bharat, Al-maharmeh Hamza Yacoub and Li Shenggao.
The patent application number is US202519220136 2025..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Co Ltd patent application for Edge-triggered Transceiver in Semiconductor Package and Calibration Method Thereof. This invention was developed by Lin Wei Shuo.
The patent application number is US202519046480 20250205. The p..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Ellenberger & Poensgen has submitted a patent application for Switching Unit. This invention was developed by Steegmueller Peter, Labs Alexander, Regahl Thomas, Koepf Hendrik-christian and Miklis Markus.
The patent application number is US202619630660 20260327. The patent publication number is US2026023..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Eaton Intelligent Power has submitted a patent application for Electric Switching Device. This invention was developed by Askan Kenan and Uvaidov Nissim.
The patent application number is US202419159761 20240311. The patent publication number is US20260230069 (A1). International Patent Classification cod..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Clock Control Device. Morishita Shuei, Nishino Riichi and Moro Masakazu developed the invention.
The patent application number is US202319152714 20231108. The patent publication number is US20260230066 (A1). International Pa..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Mitsubishi Electric has submitted a patent application for Power Conversion System. This invention was developed by Mukunoki Kaho, Kono Yoshiyuki, Fujii Toshiyuki and Kajiyama Takuya.
The patent application number is US202319157485 20230307. The patent publication number is US20260229989 (A1). Internati..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Chinese Patent for Substrate Feeding Equipment has been issued to Lianshuo Semiconductor Tech Suzhou Co Ltd. This invention was developed by Wang Chengcai.
The patent application number is CN202422708028U 20241107. The patent publication number is CN223534362 (U). International Patent Classification codes ..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Ecole Polytechnique Fed De Lausenne Epfl has submitted a patent application for Substrate Comprising Slots for Holding Optical Components of a Laser Cavity. Bellouard Yves, Nazir Saood Ibni and Delgoffe Antoine developed the invention.
The patent application number is US202319151034 20230127. The patent..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- ASEN Semiconductors Suzhou has received a patent for Unreeling Device for Laminated Board Production. This invention was developed by Cui Jun.
The patent application number is CN20242377350U 20241213. The patent publication number is CN223521938 (U). International Patent Classification codes are B65H16/02 ..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Suzhou Yingnuoweishi Semiconductor Equipment Co Ltd has secured a patent on Receiving Bin with Buffering Function. Zhou Qiang and Liu Yan developed the invention.
The patent application number is CN202423127947U 20241218. The patent publication number is CN223521922 (U). International Patent Classification..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- University of Newcastle upon Tyne has filed a patent application for Flexible AC-DC-AC Electrical Distribution Interconnection System. This invention was developed by Deakin Matthew.
The patent application number is US202419152286 20240201. The patent publication number is US20260229897 (A1). Internatio..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 11 -- Wuxi Haitu Tech Co Ltd has been awarded a patent for Hydraulic Mechanism of Semiconductor Injection Mold. This invention was developed by Yang Jiaguo and Fang Dahong.
The patent application number is CN20242380048U 20241212. The patent publication number is CN223532946 (U). International Patent Classificat..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- ROHM has submitted a patent application for Semiconductor Element and Semiconductor Device. This invention was developed by Okumura Hiroshi.
The patent application number is US202619457777 20260123. The patent publication number is US20260231808 (A1). International Patent Classification codes are H10W72/2..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Co Ltd patent application for Method of Forming Opening in Passivation Layer and Structures Thereof. This invention was developed by Su Chung-hao, Huang Chen-chiu, Chen Dian-hau, Shen Hsiang-ku, Wang Hsing-hsiang and Tu Wen-ch..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Pick-and-place Tool and Process of Using the Same. Tien Tzu Jung and Chang Jen-yuan developed the invention.
The patent application number is US202519046458 20250205. The patent publication number is US20260231802 (A1). Coo..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has released LG Innotek patent application for Circuit Board, and Semiconductor Package Comprising Same. This invention was developed by Noh Jin Mi, Cho Young Jae and Shin Jong Bae.
The patent application number is US202419152555 20240201. The patent publication number is ..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has published Intel patent application for Methods and Apparatus to Connect Interconnect Bridges to Package Substrates. The invention was developed by Gunawan Andrey, Yeon Hong Seung, Lin Ziyin, Shan Bohan, Mousavi Seyyed Yahya, Bai Yiqun, Kanaoka Yosuke, Duan Gang, Pietamb..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- SK Hynix has submitted a patent application for Package Substrate with a Plating Layer and a Semiconductor Package Including the Same. Lee Ki Yong and Park Gi Guk developed the invention.
The patent application number is US202519282281 20250728. The patent publication number is US20260231797 (A1). Coopera..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Samsung Electro-Mechanics has submitted a patent application for Coreless Interposer, Manufacturing Method Thereof, and Semiconductor Package Including the Same. Cha Hyojin, Park Woodeug, Kim Sanghoon, Ko Chanhoon, Ko Kyunghwan and Lee Jinuk developed the invention.
The patent application number is US2025..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Yangtze Memory Technologies has filed a patent application for Semiconductor Device and Fabrication Method Thereof. This invention was developed by Li Siqian, Liu Gang, Song Dongmen, Zheng Yuhuan, Gao Jing, Yang Yonggang and Xu Wei.
The patent application number is US202519176803 20250411. The patent pu..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- United Microelectronics Corporation has filed a patent application for Semiconductor Structure. This invention was developed by Ho Kai-kuang, Chang Jen-hsien and Chiang Meng-ting.
The patent application number is US202519063251 20250225. The patent publication number is US20260231794 (A1). Cooperative P..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Taiwan Semiconductor Manufacturing Co Limited has applied United States patent for Dielectric Interposer for Packaging Structures and Methods of Forming the Same. Tien Tzu Jung and Chang Jen-yuan developed it.
The patent application number is US202519045593 20250205. The patent publication number is US2..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Taiwan Semiconductor Manufacturing Co Limited has sought patent for Semiconductor Die Bonding Structure and Methods of Forming the Same. This invention was developed by Tien Tzu Jung and Chang Jen-yuan.
The patent application number is US202519045216 20250204. The patent publication number is US20260231..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has published Alpha and Omega Semiconductor International patent application for Lead Frame Strip Having Molding Buses and Method of Using the Same to Fabricate Semiconductor Packages. The invention was developed by Bobde Madhur, Wang Long-ching and Xue Yan Xun.
The patent..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Nexperia BV has sought patent for Encapsulated Semiconductor Package and a Method of Manufacturing Such Encapsulated Semiconductor Package. This invention was developed by Yandoc Ricardo Lagmay.
The patent application number is US202619530479 20260205. The patent publication number is US20260231786 (A1). ..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has released Texas Instruments Incorporated patent application for Insulation Structure for Electrical Isolation. This invention was developed by Zhang Rongwei, Sung Hank and Tuncer Enis.
The patent application number is US202519043129 20250131. The patent publication numb..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Texas Instruments Incorporated has submitted a patent application for Package-integrated Lead Frame Antennas. Chauhan Satyendra S, Ali Hassan Omar, Herbsommer Juan and Ginsburg Brian P developed the invention.
The patent application number is US202519043327 20250131. The patent publication number is US202..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Texas Instruments Incorporated has filed a patent application for Digital Signal Isolator Device. This invention was developed by Gupta Arvind, Barot Kashyap Jayendra, Shrivastava Kumar Anurag, Ostrowicki Gregory and Khanolkar Vijaylaxmi.
The patent application number is US202519039378 20250128. The paten..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Taiwan Semiconductor Manufacturing Co Limited has submitted a patent application for Wafer-to-wafer Bonding Alignment Pattern and Related Methods. This invention was developed by Chen Sz-fan, Yu Tzu-wei and Chen Chun-chang.
The patent application number is US202519044664 20250204. The patent publication..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- SK Hynix has submitted a patent application for Semiconductor Device Including a Guard Ring Structure. Chang Heon Yong developed the invention.
The patent application number is US202519325532 20250911. The patent publication number is US20260231773 (A1). International Patent Classification code is H10B12/..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Yangtze Memory Technologies has filed a patent application for Seal Ring Structure in a Semiconductor Device and Methods for Forming the Same. This invention was developed by Li Qian, Xiao Liang and Wu Shu.
The patent application number is US202619578658 20260325. The patent publication number is US202602..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Stats Chippac Man Pte Ltd has applied United States patent for Semiconductor Device and Method of Making Ipd Structure on Glass Substrate. Lee Yongtaek, Hong Seungman, Kwon Ohyoung and Bae Sojeong developed it.
The patent application number is US202519047268 20250206. The patent publication number is US..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Taiwan Semiconductor Manufacturing Co Ltd has sought patent for Semiconductor Package Structure and Method for Forming the Same. This invention was developed by Liu Tzuan-horng and Su An-jhih.
The patent application number is US202519047094 20250206. The patent publication number is US20260231770 (A1). ..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Panel-level Chip Package with Seal Ring Structure and Method of Forming the Same. This invention was developed by Su An-jhih and Lin Yen-liang.
The patent application number is US202519046898 20250206. The patent publicatio..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Sony Semiconductor Solutions Corporation has filed a patent application for Semiconductor Device and Method for Manufacturing Semiconductor Package and Semiconductor Device. This invention was developed by Dong Wenshuang, Kakoiyama Naoki and Otsuka Yasushi.
The patent application number is US202319150273 ..
Semiconductor
| Mon 10 Aug 2026
Munich, Aug. 10 -- Sony Advanced Visual Sensing AG and Sony Semiconductor Solutions Corporation have sought patent for Pixel Circuit with Memory Circuit and Image Sensor for Event Detection. This invention was developed by Davami Parham, Zannoni Massimo and Berner Raphael.
The patent application number is EP20240759195 202408..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Samsung Electronics has sought patent for Semiconductor Device and Method for Manufacturing the Same. This invention was developed by Jeong Jin Woo and Sim Jeong Gu.
The patent application number is US202519329749 20250916. The patent publication number is US20260231755 (A1). International Patent Classi..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has published Samsung Electronics patent application for Semiconductor Package. The invention was developed by Jung Jaemok, Park Chanwook, Park Sungkeun, Ha Taeoh and Yang Hyun.
The patent application number is US202619529865 20260204. The patent publication number is US..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Structure. This invention was developed by Liao Wan-jiun, Lu Ze-xian, Huang Chia-en, Chen Jung-hsuan, Chiang Ting-wei and Li Hui-wen.
The patent application number is US202519045561 20250205. The patent public..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Taiwan Semiconductor Manufacturing Co Ltd has sought patent for Semiconductor Device Structure and Methods of Forming the Same. This invention was developed by Huang Wei Shun, Chen Li-yi, Yu Po, Li Cheng-yu and Cheng I-i.
The patent application number is US202519043728 20250203. The patent publication n..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Nanya Tech has submitted a patent application for Manufacturing Method of Semiconductor Structure. This invention was developed by Ji Cheng Yan.
The patent application number is US202619634098 20260331. The patent publication number is US20260231745 (A1). International Patent Classification codes are H10W..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Co Ltd patent application for Semiconductor Device and Methods of Formation. Lin Wei-jung, Chao Yi-hsiang, Chang Chih-wei, Lai Chia-han, Lee Pei-hsuan, Chi Chih-chien, Hung Min-hsiu, Tsai Ming-hsing and Lin Sheng-hsuan develop..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Applied Materials has filed a patent application for Low Resistance Hybrid Bonded Interconnects. This invention was developed by Sreenivasan Raghav, Ryan Kevin, Devries Scott Alexander and Ge Qian.
The patent application number is US202519046785 20250206. The patent publication number is US20260231841 (A1..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Renesas Electronics has submitted a patent application for Semiconductor Device. This invention was developed by Hata Toshiyuki and Nakashiba Yasutaka.
The patent application number is US202619443797 20260108. The patent publication number is US20260231839 (A1). International Patent Classification codes..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has received Texas Instruments Incorporated patent application for Flip Chip Package for Semiconductor Devices. Murugan Rajen Muricon, Gupta Chittranjan Mojan, Tang Yiqi and Chen Jie developed the invention.
The patent application number is US202619634662 20260331. The pat..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Mitsubishi Electric has filed a patent application for Semiconductor Apparatus and Method for Manufacturing Semiconductor Apparatus. This invention was developed by Yoneda Yutaka.
The patent application number is US202319148314 20230406. The patent publication number is US20260231837 (A1). International P..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- International Business Machines has applied United States patent for Fine-pitch Integration Without Interposer and TSV. Chen Qianwen, Polomoff Nicholas Alexander, Sakuma Katsuyuki, Yu Roy R, Knickerbocker John, Rubin Joshua Mark and Belyansky Michael P developed it.
The patent application number is US20..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has received MonolithIC 3D patent application for 3D Semiconductor Device and Structure with Metal Layers. Cronquist Brian and Or-bach Zvi developed the invention.
The patent application number is US202619632342 20260329. The patent publication number is US20260231832 (A1)..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Taiwan Semiconductor Manufacturing Co Ltd has sought patent for Semiconductor Package and Method of Manufacturing the Same. This invention was developed by Chen Yu-hao, Su An-jhih, Liu Tzuan-horng, Lin Yen-liang and Weng Chung-ming.
The patent application number is US202519046517 20250206. The patent pu..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has received Einsnext Pte Ltd patent application for Three-dimensional Semiconductor Integrated Circuit with Inter-die Connections and Method for Manufacturing the Same. Jia Yantao, Hung Ming-te and Chen Tsung Yu developed the invention.
The patent application number is ..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Alpha and Omega Semiconductor International has applied United States patent for Semiconductor Package Having Dual Transistors and Method of Making the Same. Niu Zhiqiang, Bobde Madhur, Li Kuan-hung, Wang Long-ching, Xue Yan Xun and Wen Chunya developed it.
The patent application number is US202519045283 ..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Texas Instruments Incorporated has sought patent for Functional Isolation for Small Package Sizes. This invention was developed by Ankamah-kusi Sylvester, Chaudhry Usman and Chaudhry Saminah.
The patent application number is US202519042991 20250131. The patent publication number is US20260231812 (A1). Coo..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Nan Ya Plastics has filed a patent application for Release Film for Molding and Chip Packaging Method. This invention was developed by Liao Te-chao, Tsao Chun-che, Yuan Ching-yao and Kao Li-yu.
The patent application number is US202519207680 20250514. The patent publication number is US20260231811 (A1). I..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has received Infineon Technologies patent application for Method for Producing a Semiconductor Module Arrangement. Hohlfeld Olaf Rüdiger, Lis Adrian and Unrau Arthur developed the invention.
The patent application number is US202619530957 20260205. The patent publication ..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has received Siemens patent application for Semiconductor Module Arrangement Comprising at Least One Semiconductor Element. Sewiolo Benjamin developed the invention.
The patent application number is US202419154062 20240205. The patent publication number is US20260231766 (A..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Structure Including Thermal Module Having Flow Channel. Chen Hung Lin, Pan Chung-yueh and Cheng Chih-kai developed the invention.
The patent application number is US202519045552 20250205. The patent publication number is US..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Taiwan Semiconductor Manufacturing Co Limited has submitted a patent application for Semiconductor Packages and Methods of Forming the Same. This invention was developed by Wu Wei.
The patent application number is US202519043703 20250203. The patent publication number is US20260231760 (A1). Cooperative ..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- ROHM has submitted a patent application for Insulation Signal Transmission Element and Semiconductor Device. Matsubara Hiroaki developed the invention.
The patent application number is US202619456903 20260122. The patent publication number is US20260231759 (A1). International Patent Classification codes a..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Taiwan Semiconductor Manufacturing Co Ltd has filed a patent application for Capacitor Device and Manufacturing Method Thereof. This invention was developed by Lee Chien-chang, Chang Jen-yuan and Lai Chia-ping.
The patent application number is US202619635870 20260401. The patent publication number is US..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Co Ltd patent application for Integrated Circuit (ic) Device and Method. Chang Yi-jui, Cheng Po-wen, Li Johnny Chiahao, Chang Wei-ling and Chen Wei-ren developed the invention.
The patent application number is US20251922070..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Winbond Electronics has submitted a patent application for Semiconductor Device Structure and Manufacturing Method Thereof. This invention was developed by Chang Hao-chuan and Wei Hung-yu.
The patent application number is US202519245424 20250623. The patent publication number is US20260231743 (A1). Inte..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- JSR Corporation has submitted a patent application for Method for Manufacturing Semiconductor Substrate. This invention was developed by Ozaki Yuki, Kimata Hironori and Serizawa Ryuichi.
The patent application number is US202619630590 20260327. The patent publication number is US20260231739 (A1). Internat..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has received Samsung Electronics patent application for Semiconductor Device. Chung Myungjin, Jang Sumi, Kim Jinkyu, Song Inhyun, Lim Wangkyu, Heo Suhaeng and Won Seokjun developed the invention.
The patent application number is US202519298404 20250813. The patent public..
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