Semiconductor
| Mon 22 Dec 2025
Beijing, Dec. 23 -- Chinese Patent for Superconducting Quantum Chip Packaging Body has been issued to Tsinghua University and Wuxi Dongwei Quantum Tech Co Ltd. This invention was developed by Geng Xiao, Cheng Mingjun, He Kaiyong, Dai Genting, Yang Liangliang, Chen Guodong, Jiang Linpan, Chang Jinlin, Meng Fanzhong, Chen Hongjian..