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Semiconductor

  |  Tue 11 Aug 2026

Geneva, Aug. 12 -- ASML Netherlands has sought patent for Actuators with Integrated Air Bearings in a Semiconductor Manufacturing Apparatus. This invention was developed by Verma Arjun, Finney Nathan, Chillara Venkata, Kelley John and Shin Taehee. The patent application number is WO2026EP50090 20260106. The patent publication n..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Tokyo Electron has sought patent for Seal Member and Substrate Processing Device. This invention was developed by Miura Mamoru and Nagayama Nobuyuki. The patent application number is WO2026JP01738 20260121. The patent publication number is WO2026163908 (A1). International Patent Classification codes are C23C1..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Tokyo Electron has sought patent for Wafer-type Sensor, Measurement Method, and Measurement Device. This invention was developed by Hatanaka Takayuki, Kondo Shunto, Yokoyama Kimihiro, Ukai Tomofumi, Oyamada Tetsu and Wu Tong. The patent application number is WO2026JP01464 20260119. The patent publication numb..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Tokyo Electron has sought patent for Etching Method and Plasma Treatment Device. This invention was developed by Arima Noriyoshi and Mukaiyama Koki. The patent application number is WO2026JP01016 20260115. The patent publication number is WO2026163826 (A1). International Patent Classification code is H10P50/2..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- Chengdu Haiguang Integrated Circuit Design has sought patent for Chip Power Measurement System and Method in Chip Full Life Cycle Management, and Chip. This invention was developed by Liu Yongjiang, Jin Jungui and Gu Yi. The patent application number is CN20261083569 20260121. The patent publication number i..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- STMicroelectronics International has sought patent for Super-reduced Time-of-flight Histogram Processing. This invention was developed by Assmann Andrea, Baxter Dave, Mcleod Scott and Mellot Pascal. The patent application number is CN202511669254 20251114. The patent publication number is CN122063567 (A). In..

Semiconductor

  |  Tue 11 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published ASML Netherlands patent application for Die Carrier. The invention was developed by Seijger Olav and Dekkers Jeroen. The patent application number is WO2026EP50085 20260106. The patent publication number is WO2026162252 (A1). International Patent Classifi..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published Kokusai Electric patent application for Substrate Processing Device, Substrate Processing Method, Production Method for Semiconductor Device, and Program. The invention was developed by Yanagisawa Yoshihiko and Sakano Atsuya. The patent application number..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published Resonac patent application for Resin Composition and Power Semiconductor Device. The invention was developed by Nagashima Kazushi and Nozaki Akihiro. The patent application number is WO2025JP03443 20250203. The patent publication number is WO2026163424 (A..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published Resonac patent application for Sealing Resin Composition and Power Semiconductor Device. The invention was developed by Nagashima Kazushi and Yamaura Masashi. The patent application number is WO2025JP03441 20250203. The patent publication number is WO2026..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published Star Micronics patent application for Communication System, Terminal Device, and Identification Information Registration Method. The invention was developed by Tokita Daisuke, Igarashi Keisuke and Matsushita Yuichi. The patent application number is WO2026..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published Tokyo Electron patent application for Processing Device, Processing System, and Method for Controlling Processing Device. The invention was developed by Zaizen Hiroshi and Kodama Munehisa. The patent application number is WO2025JP45551 20251225. The paten..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published SCREEN Holdings patent application for Substrate Treatment Method, Substrate Treatment Device, and Substrate Treatment Solution. The invention was developed by Okusa Aoi and Sasaki Yuta. The patent application number is WO2025JP38574 20251104. The patent ..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published Wonik IPS patent application for Substrate Support and Substrate Processing Apparatus. The invention was developed by Choi Jia, Oh Yeong Taek, Park Jung Won and Jung Eun Sun. The patent application number is WO2025KR06955 20250522. The patent publication ..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Beijing University of Posts and Telecommunications patent application for Non-fullerene Acceptor Material with Modified Side Chain and Application of Non-fullerene Acceptor Material in Ternary Planar Heterojunction Organic Solar Cell. The invention was..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Shandong Forest Grass Germplasm Resources Center Shandong Province Yaoxiang Forest Farm patent application for Composting Device and Composting Method for Planting Substrate. The invention was developed by Zhao Lijun, Zhang Wei and Xu Hui. The patent ..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Nanjing Polytechnic Institute patent application for Straw-medicinal Plant Composite Substrate and Application Thereof. The invention was developed by Yin Donghang, Wu Xiaoyun, Zhu Heng, Wang Zhiqiang, Chen Tianyi, Li Bingfeng, Liu Xiaole, Wu Ruizhi, S..

Semiconductor

  |  Tue 11 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released Wacker Chemie AG patent application for Roller for a Roll Crusher for Comminution of Semiconductor Material. This invention was developed by Mattes Joachim, Grübl Peter, Öchsner Eva and Pech Reiner. The patent application number is WO2025EP52708 20250203..

Semiconductor

  |  Tue 11 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released ASML Netherlands patent application for Semiconductor Substrate Handling System. This invention was developed by Harrold George, Wade Robert and Wiener Roberto B. The patent application number is WO2026EP50091 20260106. The patent publication number is WO2..

Semiconductor

  |  Tue 11 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released ASML Netherlands patent application for Die-to-wafer Bonding Process. This invention was developed by Venugopalan Syam Parayil, Vromen Joost and Wang Sheng. The patent application number is WO2025EP88154 20251218. The patent publication number is WO2026162..

Semiconductor

  |  Tue 11 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released ROCKWOOL patent application for Growth Substrate. This invention was developed by Van Benthem Rudolfus Antonius, De Carvalho Esteves Ana Catarina and Moone Luuk. The patent application number is WO2026EP52312 20260129. The patent publication number is WO20..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released Semiconductor Energy Laboratory patent application for Electronic Apparatus. This invention was developed by Kamada Taisuke, Nakamura Daiki and Kubota Daisuke. The patent application number is WO2026IB50676 20260126. The patent publication number is WO2026..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released Kokusai Electric patent application for Film Formation Reaction Analysis Method, Substrate Processing Method, Semiconductor Device Manufacturing Method, Program, Substrate Processing Device, and Film Formation Reaction Analysis System. This invention was de..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released Kokusai Electric patent application for Processing Method, Semiconductor Device Manufacturing Method, Program, and Processing Device. This invention was developed by Yamazaki Hirohisa. The patent application number is WO2025JP33931 20250925. The patent pub..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released Tokyo Electron patent application for Pattern Forming Method, Patterning Structure, and Pattern Forming Device. This invention was developed by Okabe Noriaki. The patent application number is WO2025JP42369 20251204. The patent publication number is WO20261..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released Tokyo Electron patent application for Electrostatic Chuck. This invention was developed by Tomioka Taketoshi. The patent application number is WO2026JP00969 20260115. The patent publication number is WO2026163817 (A1). International Patent Classification c..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released GlobalFoundries Singapore patent application for Optical Interlink Structure. This invention was developed by Tan You Sian James and Li Chao. The patent application number is WO2025SG50078 20250203. The patent publication number is WO2026164556 (A1). Inter..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released Shenzhen Tong Fang Electronic New Material patent application for High-reliability Lead-free Solder Paste for Semiconductor Packaging and Preparation Method of High-reliability Lead-free Solder Paste. This invention was developed by Liu Yujie, Xiao Dong..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released SanDisk Technologies patent application for Bio-based Epoxy Molding Compounds for Electronic Devices. This invention was developed by Kumaresan Vidya, Devarajan Manish and Janakiraman Vijaya C. The patent application number is CN202510468610 20250415. ..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Semiconductor Energy Laboratory has submitted a patent application for Semiconductor Device and Semiconductor Device Production Method. This invention was developed by Ikezoe Satoshi, Jintyou Masami, Shingu Takashi, Koezuka Junichi, Yamade Naoto, Kakehata Tetsuya and Noguchi Kenichi. The patent application nu..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Semiconductor Energy Laboratory has submitted a patent application for Light-emitting Device. This invention was developed by Kawata Takuya, Kimura Kunio and Ikeda Hisao. The patent application number is WO2026IB50680 20260126. The patent publication number is WO2026163060 (A1). International Patent Classific..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Semiconductor Energy Laboratory has submitted a patent application for Semiconductor Device. This invention was developed by Kawashima Susumu, Shishido Hideaki, Kusunoki Koji, Uochi Hideki and Saito Motoharu. The patent application number is WO2026IB50678 20260126. The patent publication number is WO202616305..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Kokusai Electric has submitted a patent application for Substrate Processing Method, Semiconductor Device Production Method, Program, and Substrate Processing Device. This invention was developed by Horii Sadayoshi, Karasawa Koichi, Ueda Tatsushi and Kakuda Toru. The patent application number is WO2025JP03418..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Kokusai Electric has submitted a patent application for Processing Device, Substrate Processing Device, Display Method, Semiconductor Device Manufacturing Method, and Program. This invention was developed by Yamaoka Yuji and Seki Takatoshi. The patent application number is WO2025JP03055 20250130. The patent p..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Kokusai Electric has submitted a patent application for Substrate Processing Device, Irradiation Unit, Substrate Processing Method, Method for Manufacturing Semiconductor Device, and Program. This invention was developed by Takieda Tsuyoshi. The patent application number is WO2025JP39103 20251107. The patent ..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Hamamatsu Photonics has submitted a patent application for Laser Processing Method, Method for Manufacturing Semiconductor Device, and Laser Processing Device. This invention was developed by Korematsu Katsuhiro, Mitsuyama Yasuhiro and Sakamoto Takeshi. The patent application number is WO2025JP33593 20250924...

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Furukawa Electric has submitted a patent application for Optical Semiconductor Element and Method for Producing Optical Semiconductor Element. This invention was developed by Kiyota Kazuaki and Nishizawa Yo. The patent application number is WO2025JP43224 20251211. The patent publication number is WO2026163652..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Fujifilm has submitted a patent application for Treatment Solution for Semiconductor Device, Method for Producing Treatment Solution, Method for Treating Object to be Treated, and Method for Producing Semiconductor Device. This invention was developed by Ohtsu Akihiko, Takahashi Tomonori and Takahashi Kazutaka..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Sharp has submitted a patent application for Terminal Apparatus, Method, and Integrated Circuit. This invention was developed by Miyake Taichi, Kawano Takuma, Tsuboi Hidekazu, Nomura Takaki and Yamada Shohei. The patent application number is WO2025JP42017 20251202. The patent publication number is WO202616361..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- ROHM has submitted a patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. This invention was developed by Taniguchi Satoki, Nasu Kentaro and Morita Kohei. The patent application number is WO2026JP01477 20260119. The patent publication number is WO2026163880 (A1). Inte..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Socionext has submitted a patent application for Semiconductor Integrated Circuit Device. Ono Masachika developed the invention. The patent application number is WO2026JP01100 20260115. The patent publication number is WO2026163835 (A1). International Patent Classification codes are H10D84/83, H10D84/85 and H..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Tokyo Electron has submitted a patent application for Plasma Processing System, Device for Detecting End Point of Plasma Processing, and Method for Detecting End Point of Plasma Processing. Sugita Kippei and Shimatsu Yuhei developed the invention. The patent application number is WO2026JP01021 20260115. The p..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Tokyo Electron has submitted a patent application for Plasma Processing System and Pressure Control Method. This invention was developed by Sugawara Eiichi. The patent application number is WO2026JP00979 20260115. The patent publication number is WO2026163822 (A1). International Patent Classification code is ..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Toray Engineering has submitted a patent application for Method for Forming Coating Film, Coating Film Forming System, and Interposer Substrate. Ikada Toshiaki, Ito Toshifumi, Asai Kazuo and Araki Katsumi developed the invention. The patent application number is WO2026JP01837 20260121. The patent publication ..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Asahi Kasei KK has submitted a patent application for Hardener Composition, One-part Adhesive, Semiconductor Encapsulation Material, Semiconductor Package, and Adhesive for Camera Module. This invention was developed by Maeda Takanori. The patent application number is WO2026JP01664 20260120. The patent public..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Wonik IPS has submitted a patent application for Plasma Source and Substrate Processing Device. Kim Ji Hyun, Hwang Soo Young, Shin Gi Won, Kim Jeong Hun, Jung Eun Sun and Kim Hak Min developed the invention. The patent application number is WO2025KR95768 20251204. The patent publication number is WO2026164391..

Semiconductor

  |  Wed 12 Aug 2026

Geneva, Aug. 12 -- Siemens Industry Software has submitted a patent application for Determining Analysis Windows of an Integrated Circuit (ic) Design for Analyzing the IC Design. Abdallah Rehab developed the invention. The patent application number is WO2025US13715 20250130. The patent publication number is WO2026164605 (A1). I..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- The Regents Of The Univ Of Michigan and University of Rochester have submitted a patent application for Digital Molecular Fingerprinting on Organ on a Chip Systems. This invention was developed by Singer Benjamin H, Stephens Andrew, Mcgrath James L, Song Yujing, Su Shiuan-haur and Kurabayashi Katsuo. Th..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Univ Libre De Bruxelles and Univ Norbert Zongo have submitted a patent application for Method for Leaching Gold from a Gold-bearing Substrate. Doneux Thomas, Bougouma Moussa, Soma Fousseni and Herman Claudine developed the invention. The patent application number is US202419153935 20240214. The patent p..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Soitec and Commissariat a Ienergie Atomique Et Aux Energies Alternatives have submitted a patent application for Method for Producing a Semiconductor Structure Comprising an Interface Region Including Agglomerates. This invention was developed by Radu Ionut, Gaudin Gweltaz, Fournel Franck, Widiez Julie and..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Nagano Prefecture and Takano have submitted a patent application for Surface Treatment Method for Silicon Body and Method of Manufacturing Silicon Structural Body. This invention was developed by Sato Akira and Mizusaki Hideaki. The patent application number is US202319149853 20231219. The patent public..

Semiconductor

  |  Tue 11 Aug 2026

Beijing, Aug. 12 -- Shanghai Hedong Electronic Material has submitted a patent application for Gas Uniformizing Assembly, Semiconductor Process Chamber and Semiconductor Thin Film Deposition Equipment. This invention was developed by Jia Shijun, Sun Yuanjun and Pang Bo. The patent application number is CN202610294465 20260311. ..

Semiconductor

  |  Tue 11 Aug 2026

Geneva, Aug. 12 -- ASML Netherlands has submitted a patent application for Apparatus and Method for Quantifying a Lateral Etch Depth. This invention was developed by Hinterding Stijn, Ozturk Fahri Emre, Tarabrin Sergey and Nayak Deepak. The patent application number is WO2025EP87607 20251217. The patent publication number is WO..

Semiconductor

  |  Tue 11 Aug 2026

Geneva, Aug. 12 -- ASML Netherlands has submitted a patent application for Optical Assembly. This invention was developed by Scheffers Paul, Bastiaans Koen, Overes Frank, Del Tin Laura and Koning Johan. The patent application number is WO2026EP50693 20260113. The patent publication number is WO2026162288 (A1). International Pat..

Semiconductor

  |  Tue 11 Aug 2026

Geneva, Aug. 12 -- ASML Netherlands has submitted a patent application for Method for Bonding Semiconductor Substrates. Warming Till, Burgarth Volker, Blumberg Christian, Kieven David and Von Morze Natascha developed the invention. The patent application number is WO2026EP50222 20260107. The patent publication number is WO20261..

Semiconductor

  |  Tue 11 Aug 2026

Geneva, Aug. 12 -- ASML Netherlands has submitted a patent application for Method for Determining Correction Weights. This invention was developed by Passariello Jansen Juliette Marie, Goorden Sebastianus and Donkerbroek Arend. The patent application number is WO2026EP50040 20260105. The patent publication number is WO202616224..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- Rongyao Terminal has submitted a patent application for Load Calculation Method, Processor, Chip System and Electronic Equipment. This invention was developed by Wei Xiao. The patent application number is CN202411651430 20241118. The patent publication number is CN122064551 (A). International Patent Classifi..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- Semiconductor Components Industries has submitted a patent application for Current Sink Serial Communication. Londak Pavel, Matej Jan, Placek Roman and Baker Matthew developed the invention. The patent application number is CN202411920613 20241225. The patent publication number is CN122064620 (A). Internatio..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- Wuhan East Science and Technology has submitted a patent application for Multi-layer Glass Substrate Blind Hole Processing Method, Equipment, Device, System and Production Line. This invention was developed by Zhang Liguo. The patent application number is CN20261015608 20260107. The patent publication number..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- IRICO Hefei LCD Glass has submitted a patent application for Liquid Crystal Substrate Cleaning Control Equipment and Method. This invention was developed by Liu Zhiwei, Jin Lu, Cui Shuangshuang and Gao Yu. The patent application number is CN202610291699 20260311. The patent publication number is CN122078762 ..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- Shenzhen Shixian Technology has submitted a patent application for Glass Substrate Cutting and Splitting Device. This invention was developed by Zhu Hemin, Liu Xin, Wang Ziyong and Wang Lei. The patent application number is CN202610144343 20260202. The patent publication number is CN122079470 (A). Internatio..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Research & Business Foundation Sungkyunkwan Univ and Samsung Electronics have filed a patent application for Electronic Device and Method for Generating Compact Model of Semiconductor Device Including Two-dimensional Material and Contact Metal. This invention was developed by Ha Yoonhoo, Shim Jaewoo, Jang ..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Toshiba Electronic Devices & Storage Corp and Toshiba have filed a patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. This invention was developed by Ezaki Akira and Okuyama Hiroki. The patent application number is US202519355873 20251010. The patent publicati..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- The Florida International Univ Board Of Trustees and Applied Materials have filed a patent application for Power Delivery for AI Computing with Orthogonal Embedding and Edge Access. This invention was developed by Kengeri Subramani, Pulugurtha Markondeyaraj, Pial Mohammad Mohtasim Hamid, Al Duhni Ghaleb Sa..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- Chengdu Polytechnic has submitted a patent application for On-chip Temperature Sensing Method for Integrated Circuit Heat Distribution Monitoring. Chen Binbin and Meng Yifeng developed the invention. The patent application number is CN202610542595 20260423. The patent publication number is CN122062809 (A). I..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- SiEn QingDao Integrated Circuits has submitted a patent application for Method and Device for Testing Minority Carrier Lifetime of Semiconductor Material. Li Zongxin developed the invention. The patent application number is CN202610249765 20260302. The patent publication number is CN122063084 (A). Internatio..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- Xiamen Sanan Integrated Circuit has submitted a patent application for Differential Identification Method and System for Chip-level RF Calibration Substrate. This invention was developed by Cai Wenbi, Jiang Shixian and Zhong Ping. The patent application number is CN20261058248 20260116. The patent publicatio..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- STMicroelectronics International has submitted a patent application for Low Power Voltage Regulator Circuit with Fast Transient Response and Corresponding Method of Operation Thereof. This invention was developed by Gaudiano Richard. The patent application number is CN202511664889 20251113. The patent public..

Semiconductor

  |  Wed 12 Aug 2026

Beijing, Aug. 12 -- Hanwei Electronics Group has submitted a patent application for Temperature Control Method for Semiconductor Laser. Dong Chao, Zhang Tao, Wang Junyang, Fang Yanqun and Ding Shichao developed the invention. The patent application number is CN202610199435 20260211. The patent publication number is CN122064171 ..

Semiconductor

  |  Tue 11 Aug 2026

Alexandria, Aug. 11 -- Warren Ryan Paul has sought patent for Ephemeral Virtualized Execution and Memory Confinement Platform for Cpu/gpu Data Zeroization and Immutable Proof-of-erasure. This invention was developed by Warren Ryan Paul. The patent application number is US202519047096 20250206. The patent publication number is..

Semiconductor

  |  Tue 11 Aug 2026

Beijing, Aug. 11 -- Chinese Patent for Terminal Conveying and Positioning Device has been issued to Lianshuo Semiconductor Tech Suzhou Co Ltd. This invention was developed by Wang Chengcai. The patent application number is CN202423100076U 20241216. The patent publication number is CN223521753 (U). International Patent Classif..

Semiconductor

  |  Tue 11 Aug 2026

Beijing, Aug. 11 -- Shanghai Yingxin Resonance Electromechanical Tech Co Ltd has been granted a patent for MEMS Micromirror with Electrical Insulation Structure. This invention was developed by Liu Lei. The patent application number is CN202422837231U 20241120. The patent publication number is CN223522295 (U). International P..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- General Electric Tech GmbH has submitted a patent application for Assembly. This invention was developed by Barker Carl and Davidson Colin. The patent application number is US202419154041 20240220. The patent publication number is US20260231816 (A1). International Patent Classification codes are H02M7/0..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Semihow Co Ltd has submitted a patent application for Semiconductor Package with Top-side Base Plate. This invention was developed by Kim Myounghwan, Baek Kyoungwon and Song Inhyuk. The patent application number is US202519357903 20251014. The patent publication number is US20260231784 (A1). Internation..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has released DENSO patent application for Semiconductor Device. This invention was developed by Akitsu Yoshinori, Imaizumi Norihisa and Kusama Hirotoshi. The patent application number is US202619650521 20260417. The patent publication number is US20260231761 (A1). Intern..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has released DWS SRL patent application for Stereolithography Method and Machine for the Production of a Three-dimensional Object. This invention was developed by Costabeber Ettore Maurizio. The patent application number is US202619631014 20260327. The patent publication..

Semiconductor

  |  Tue 11 Aug 2026

Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has received NVIDIA patent application for Generative Artificial Intelligence (AI) to Generate Information Related to a Complex System. Lyle Ruthie D, Mentovich Elad, Ganju Siddha, Hester Kenneth W and Albrignt Ryan developed the invention. The patent application number ..

Semiconductor

  |  Tue 11 Aug 2026

Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has released Micron Technology patent application for Enhanced System Detection Design of Solid-state Drives (SSD) for Hot-plug Capability. This invention was developed by Chen Huayu. The patent application number is US202519044793 20250204. The patent publication number..

Semiconductor

  |  Tue 11 Aug 2026

Alexandria, Aug. 11 -- Kinaxis has applied United States patent for Co-operative Memory Management System. Ellicott Dylan, Fitzpatrick Alex, Lin Angela, Walker Robert and Creanga Marin developed it. The patent application number is US202619632609 20260330. The patent publication number is US20260228124 (A1). International Pat..

Semiconductor

  |  Tue 11 Aug 2026

Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has released SK Hynix patent application for Method for Memory ID Allocation, Memory, Memory Module, and Memory System. This invention was developed by Park Min Su, Kim Kyung Whan and Song Choung Ki. The patent application number is US202619636304 20260401. The patent pu..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has released Anhui Hoivway Optoelectronics Tech Co Ltd patent application for Ultra-thin Side-emitting LED Package Structure with Built-in Driver IC Die. This invention was developed by Fang Chengying and Zhang Deng. The patent application number is US202619466502 202602..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Kyoto University and University Public Corporation Osaka have submitted a patent application for Method for Producing Light Emitting Device, and Light Emitting Device. This invention was developed by Okamoto Koichi, Kawakami Yoichi, Matsuyama Tetsuya, Wada Kenji, Kaito Seiya and Funato Mitsuru. The pate..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Power Master Semiconductor Co Ltd has submitted a patent application for Semiconductor Device. This invention was developed by Lee Chang Ju and Park Woo Sung. The patent application number is US202519194401 20250430. The patent publication number is US20260231467 (A1). International Patent Classificatio..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has received Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Semiconductor Device. Matsushita Kenichi and Iwakaji Yoko developed the invention. The patent application number is US202519241483 20250618. The patent publication number is US20260..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Infineon Technologies, Austria has submitted a patent application for Resistor Formed on Type III-V Semiconductor Body. The patent application number is US202519043719 20250203. The patent publication number is US20260231443 (A1). International Patent Classification codes are H10D1/43, H10D30/47 and H10D..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Chengdu Analog Circuit Tech Inc has filed a patent application for Non-volatile Memory Cell and Memory. This invention was developed by He Zhongbo, Chen Feilong, Wang Yulong and Xiang Jianjun. The patent application number is US202519392737 20251118. The patent publication number is US20260231410 (A1). ..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- U.S. Patent and Trademark Office has published Sichuan Kiloway Tech Co Ltd patent application for High-density One-time Programmable Memory. The invention was developed by Mao Junhua and Peng Jack Zezhong. The patent application number is US202619529885 20260204. The patent publication number is US20260..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Tachyum Ltd has submitted a patent application for 128 Byte Cache Line Memory Controller for Non-standard Dimm Architecture. This invention was developed by Danilak Radoslav, Herman Pinchas and Radke William. The patent application number is US202519046076 20250205. The patent publication number is US20..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- ASML Netherlands has sought patent for Lithographic Apparatus, Method of Increasing Plasma Concentration, and Method of Manufacturing Devices. This invention was developed by Jagodar Andrea, Galutschek Ernst, Nikipelov Andrey, Jansen Paul, Van Der Horst Ruud Martinus and Milov Igor. The patent applicati..

Semiconductor

  |  Mon 10 Aug 2026

Beijing, Aug. 11 -- Shanghai Gaosheng Integrated Circuit Equipment has secured a patent on Quick-acting Automatic Gate Valve. Choi Han-kwan and Chen Gang developed the invention. The patent application number is CN202423192670U 20241224. The patent publication number is CN223524581 (U). International Patent Classification cod..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- NVIDIA has submitted a patent application for Direct-current (DC) Restoration with Clock-to-data Synchronization in Alternating-current (ac)-coupled Link. This invention was developed by Abadi Ofek and Wolkovitz Omer. The patent application number is US202519047178 20250206. The patent publication numbe..

Semiconductor

  |  Tue 11 Aug 2026

Beijing, Aug. 11 -- Riyuexin Semiconductor (Kunshan) has been granted a patent for Electroplating Device for Production and Processing of Semiconductors. Huang Zhongrong and Zhang Chenghui developed the invention. The patent application number is CN20242370618U 20241212. The patent publication number is CN223522706 (U). Inter..

Semiconductor

  |  Tue 11 Aug 2026

Beijing, Aug. 11 -- Guangdong Xuhong Semiconductor Material has been awarded a patent for Continuous Electroplating Conductive Washing Pool. This invention was developed by Xiao Jianfeng. The patent application number is CN20242395054U 20241216. The patent publication number is CN223522698 (U). International Patent Classifica..

Semiconductor

  |  Tue 11 Aug 2026

Alexandria, Aug. 11 -- Sony Group has submitted a patent application for Memory Controller, Storage Device, and Computer System. This invention was developed by Takahashi Yuji. The patent application number is US202419152730 20240122. The patent publication number is US20260227925 (A1). International Patent Classification cod..

Semiconductor

  |  Tue 11 Aug 2026

Alexandria, Aug. 11 -- KIOXIA has applied United States patent for Memory System and Method. Takasaka Shin, Takahashi Yusuke and Domon Makoto developed it. The patent application number is US202519235704 20250612. The patent publication number is US20260227915 (A1). International Patent Classification code is G06F3/06. Cooper..

Semiconductor

  |  Tue 11 Aug 2026

Beijing, Aug. 11 -- Wuxi Jinyuan Semiconductor Technology has submitted a patent application for Spray Head Cleaning Device and Cleaning Method. This invention was developed by Lee Ho-chan. The patent application number is CN202610544161 20260423. The patent publication number is CN122076755 (A). International Patent Classifi..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Rtm Inc and PSK Inc have submitted a patent application for Method for Detecting Abnormality in Process, Program Stored in Recording Medium, and Substrate Processing Apparatus. This invention was developed by Hwang Gyu Il, Lee Seung Heui and Ha Tae Kyung. The patent application number is US202619465982 ..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Chengdu Boe Optoelectronics Tech Co Ltd and BOE Technology Group have submitted a patent application for Display Substrate and Display Apparatus. Fang Fei, Xu Jingjing, Tian Xuewei, Liu Ke, Qi Puyu, Guo Dan, Shi Ling and Ai Shuai developed the invention. The patent application number is US202619566328 2..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Beijing Boe Tech Development Co Ltd, Yunnan Invensight Optoelectronics Tech Co Ltd and BOE Technology Group have submitted a patent application for Display Substrate and Preparation Method Therefor, and Display Device. Yan Junkai, Su Dongdong, Zhang Dacheng, Li Ruquan, Yang Xiong, Huang Yinhu, Zou Jianming..

Semiconductor

  |  Mon 10 Aug 2026

Alexandria, Aug. 11 -- Beijing Boe Tech Development Co Ltd and BOE Technology Group have submitted a patent application for Array Substrate and Display Panel. Wang Lizhong, Guo Hui, Yuan Guangcai and Ning Ce developed the invention. The patent application number is US202419150914 20240731. The patent publication number is US2..
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