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Semiconductor
| Tue 19 May 2026
Kuala Lumpur, May 19 -- Ismeca Semiconductor Holding SA has been awarded a patent for Device and Method for Limiting Force. This invention was developed by Roy Philippe and Dromard Pascal.
The patent application number is MY2015PI01485 20131219. The patent publication number is MY192591 (A). International Patent Classificatio..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Laoshan National Laboratory and Inst Oceanographic Instr Shandong Academy Of Sciences have submitted a patent application for Water Vapor and Carbon Dioxide Concentration Synchronous Measurement Device and Method Based on TDLAS (tunable Diode Laser Absorption Spectroscopy). This invention was developed by Zha..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Fengshipu Co Ltd has submitted a patent application for Electro-reflective Membrane and Installation Method Thereof. This invention was developed by Li Xiaoxiong, Han Qi, Feng Shi and Qian Jianghua.
The patent application number is CN202410950025 20240715. The patent publication number is CN121348627 (A). I..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Shanghai Qusu Chaowei Tech Co Ltd has submitted a patent application for Implementation Circuit, Method and Application of S-type Activation Function Based on Asic (application Specific Integrated Circuit). This invention was developed by Mu Yuran and Deng Xinfeng.
The patent application number is CN2025114..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Elmos Semiconductor AG application for Ultrasonic Ranging Method. This invention was developed by Kralj Rainer.
The patent application number is CN202510908011 20250702. The patent publication number is CN121348293 (A). International Patent Classifica..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Jiuchen Microelectronic Hangzhou Co Ltd patent application for Chip, Control Method and Device. This invention was developed by Chen Xianshao, Wang Jie and Xu Qiuchan.
The patent application number is CN202511892385 20251216. The patent publication nu..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Semiconductor Mfg North Integrated Circuit Mfg Beijing Co Ltd and Semiconductor Mfg Int Shanghai Co Ltd patent application for Semiconductor Device Reliability Evaluation Method, Device, System, Medium and Equipment. This invention was developed by Xu Fu..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Dongfang Jingyuan Microelectronics Tech Shanghai Co Ltd patent application for Sem Contour-based Photoresist Modeling Method and Equipment, Medium and Product. This invention was developed by Zhao Tianqi and Wang Hangyu.
The patent application number ..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Shanghai Yuwei Semiconductor Tech Co Ltd has filed a patent application for Spectrum Calibration Method, Device, Equipment and System for Monochromator. This invention was developed by Li Zhiming, Yan Zefeng, Lan Yanping, Zheng Fengbiao, Sun Gang and Duan Lifeng.
The patent application number is CN202511464..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Nantong Yueya Semiconductor Co Ltd has filed a patent application for Photoelectric Co-packaging Structure and Manufacturing Method Thereof, Controller and Medium. This invention was developed by Chen Xianming, Zeng Yongzhi, Huang Benxia, Hong Yejie and Li Qiang.
The patent application number is CN202511418..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Xiaoduo Intelligent Tech Beijing Co Ltd has submitted a patent application for Adaptive Rag Memory Enhancement Method. This invention was developed by Liu Xiaoyu, Zhang Xiaobo and Yu Guojun.
The patent application number is CN202510572960 20250506. The patent publication number is CN121350232 (A). Internati..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Bismuth Semiconductor Xian Co Ltd has sought patent for Sintering Jig. This invention was developed by Sun Lei and Lu Jianhui.
The patent application number is CN202511765409 20251127. The patent publication number is CN121346526 (A). International Patent Classification code is F27D5/00.
An abstract rel..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Zhongke Shenzhen Wireless Semiconductor Co Ltd has sought patent for Method for Detecting Performance of Epitaxial Structure of Gallium Oxide-based Diode. This invention was developed by Zhao Baiyu, Gao Fang and Ma Shengheng.
The patent application number is CN202511892949 20251216. The patent publication n..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Guangzhou Kingpan Ind Co Ltd patent application for High Numerical Aperture Extreme Ultraviolet Lithography System and Lithography Method. The invention was developed by Xu Qiao.
The patent application number is CN202511345207 20250918. The patent pu..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Ningbo Zhigan Guangda Tech Co Ltd has applied Chinese patent for Field-programmable Gate Array Chip, Light Source Modulation System and Light Source Modulation Method Based on FPGA. Zhang Jun and Li Zhuolun developed it.
The patent application number is CN202511425238 20250930. The patent publication number..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Leishen Tech Shenzhen Co Ltd has applied Chinese patent for Leveling Multi-station Control Device. Yang Meijun, Li Dongrong and Luo Jun developed it.
The patent application number is CN202511402560 20250928. The patent publication number is CN121347854 (A). International Patent Classification codes are F16M..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Sanqing Optical Shenzhen Co Ltd patent application for Vertical Cts Photoetching Equipment. Tan Aiying developed the invention.
The patent application number is CN202511634906 20251110. The patent publication number is CN121348668 (A). International P..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Guangzhou Quanguan Intelligent Tech Co Ltd has applied Chinese patent for Chip Removal Machine Intelligent Self-adaptive Control System Based on Working Condition Perception. Zhou Jian developed it.
The patent application number is CN202511895627 20251216. The patent publication number is CN121348773 (A). I..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Pengxi Semiconductor Tech Beijing Co Ltd patent application for Semiconductor Manufacturing Mes System Machine Modeling Configuration Management System and Method. Xiao Wuchuang and Deng Tuanyuan developed the invention.
The patent application number ..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received China Mobile IoT Co Ltd, Bilin Zhilian Chongqing Tech Co Ltd and China Mobile Communications patent application for Memory Error Correction Method and Device, Equipment, Storage Medium and Program Product. Zhou Yan, Lin Ziwei, Zhang Xiongwei, Shi Mingrui..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Shandong University patent application for Active Quenching Circuit and Method for Accelerating Recovery of Negative Feedback Type Avalanche Diode. The invention was developed by Dong Yakui, Sun Linshan, Liu Junliang, Fan Shuzhen and Li Yongfu.
The p..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Zhejiang Jufeng Tech Co Ltd has applied Chinese patent for Oriented/non-oriented Silicon Steel Sheet Stator and Rotor Production Equipment. Guo Pandi, Zhang Huangqing, Liu Guoxiang, Zhou Qiliang, Zhai Zheng and Zhang Xiansong developed it.
The patent application number is CN202511558303 20251029. The patent..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Shenzhen Lihong Kechuang Dev Co Ltd patent application for Rapid Modeling Method and System for Semiconductor Device Model. The invention was developed by Zhong Zhenji and Zhong Huisheng.
The patent application number is CN202511519907 20251023. The ..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- STMicroelectronics International has filed a patent application for Write Assist Scheme for Ultra-low Voltage Memory Design Support. This invention was developed by Pradeep Kumar Verma and Shrivastava Saurabh S.
The patent application number is CN202510965881 20250714. The patent publication number is CN12135..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Zhuhai Siliconcore Tech Co Ltd has submitted a patent application for Design Rule Checking Method for Chip Design, Computer Device and Storage Medium. This invention was developed by Zhao Yi, Feng Rongkun, Mo Xiaolin, Huang Jieying, Li Shaobai and Hu Kunmei.
The patent application number is CN202511902615 2..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Chongqing University has submitted a patent application for Magnetotelluric Dual-target Two-dimensional Inversion Method Based on Finite Memory Quasi-newton Method. Yu Nian, Kong Wenxin, Zhang Shenghong, Zou Wanpeng and Wang Tianqi developed the invention.
The patent application number is CN202511550057 202..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Shinetsu Chemical has filed a patent application for Reflective Photomask Blank and Method for Manufacturing Reflective Photomask. This invention was developed by Kawamura Akihito.
The patent application number is CN202510969186 20250715. The patent publication number is CN121348650 (A). International Paten..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Hefei Nexchip Integrated Circuit patent application for Photoetching Method. The invention was developed by Zhang Xiaoyu, Zhao Zhihao and Li Jianzheng.
The patent application number is CN202511915991 20251218. The patent publication number is CN12134..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Hefei Nexchip Integrated Circuit has filed a patent application for Removal Method of Photoresist. This invention was developed by Zhang Xiaoyu, Zhao Zhihao, Zhen Fuqiang and Li Jianzheng.
The patent application number is CN202511939288 20251222. The patent publication number is CN121348678 (A). Internation..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Southeast University has applied Chinese patent for In-memory Top-k Unit Based on Depth-first Search and Implementation Method. Liu Bo, Kang Xilong, Xu Xingyu, Wang Weixuan, Zhang Yang, Cai Hao and Yang Jun developed it.
The patent application number is CN202511519311 20251023. The patent publication number..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Inno Saike (Suzhou) Semiconductor patent application for Power Device Driving Circuit. The invention was developed by Wang Qiang, Tian Shuilin, Xie Bingchuan and Meng Wuji.
The patent application number is CN202511478373 20251016. The patent publicat..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Institute of Automation, Chinese Academy of Sciences has sought patent for Large Model Training Video Memory Optimization Method and System Based on Low-precision Integer Storage. This invention was developed by Li Zhikai, Gu Qingyi, Liu Xuewen and Chen Mengjuan.
The patent application number is CN202511919..
Semiconductor
| Tue 19 May 2026
Kuala Lumpur, May 19 -- Malaysian Patent Office has awarded a patent to Achilles Corp for Substrate Housing Container. Nishijima Masayuki developed the invention.
The patent application number is MY2019PI04478 20170206. The patent publication number is MY192574 (A). International Patent Classification codes are B65D85/86 and ..
Semiconductor
| Tue 19 May 2026
Kuala Lumpur, May 19 -- Sandisk Information Tech Shanghai Co Ltd has obtained a patent for dies prepeeling apparatus and method. This invention was developed by Chienhao Hsu, Chin Tien Chiu, Jinxiang Huang and Suresh Upadhyayula.
The patent application number is MY2015PI700465 20150213. The patent publication number is MY1924..
Semiconductor
| Tue 19 May 2026
Kuala Lumpur, May 19 -- Intel has received a patent for Alignment Fixtures for Integrated Circuit Packages. This invention was developed by Chigullapalli Sruti, Sanchez Rene J, Abazarnia Nader N, Coons Todd R and Goh Tuan Hoong.
The patent application number is MY2016PI703405 20140421. The patent publication number is MY19264..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Taiwan Semiconductor Co Ltd has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Hayashi Fumiyoshi, Wu Shimin, Zhang Xuanting and Xu Wangcheng.
The patent application number is CN202411509659 20241028. The patent publication number ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Jiangsu Third Generation Semiconductor Research Institute patent application for Semiconductor Epitaxial Structure and Preparation Method Thereof, and Semiconductor Device. Yan Qi'ang and Wang Guobin developed the invention.
The patent application numbe..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Xiamen Yinke Qirui Semiconductor Tech Co Ltd has applied Chinese patent for Cutting Method for Led Epitaxial Wafer. Zhang Yinqiao, Zhou Shan, Lu Wei, Lin Fujie and Wang Jianhong developed it.
The patent application number is CN202511924303 20251219. The patent publication number is CN121358070 (A). Internat..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Wuxi Huaxing Photoelectric Res Co Ltd and Jiangsu Hoaxing Laser Tech Co Ltd patent application for Multi-junction Solar Cell Anti-reflection Film Layer and Preparation Method Thereof. Ning Vibration, Zhao Run, Xu Pengfei and Wang Yan developed the invent..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Beijing Zhichuang Xinyuan Tech Co Ltd has submitted a patent application for Molecular Beam Epitaxy Heterogeneous Base Hgcdte Material and Preparation Method Thereof. This invention was developed by Tong Lei.
The patent application number is CN202511522293 20251023. The patent publication number is CN121358..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Xiamen Yinke Qirui Semiconductor Tech Co Ltd patent application for Battery Chip Back Electrode Passivation Method. The invention was developed by Zhang Yinqiao, Zhou Shan, Ye Weimin, Chen Xingyu, Wang Zhouyang and Wang Jianhong.
The patent applicati..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Jinko Solar Holding Co Ltd has submitted a patent application for Preparation Method of Solar Cell, Solar Cell and Photovoltaic Module. This invention was developed by Zhang Yuanfang, Wang Zhao, Zheng Peiting, Yang Jie and Zhang Xinyu.
The patent application number is CN202511902257 20251216. The patent pub..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Yingweixin Shanghai Tech Co Ltd has submitted a patent application for Group III-V Compound and Silicon Heterogeneous Integrated Single Photon Avalanche Diode and Preparation Method Thereof. This invention was developed by Chen Qingyu, Nie Hui and Zhao Hui.
The patent application number is CN202511483844 20..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Jiangsu Chuangying Solar Energy Tech Co Ltd patent application for Crystalline Silicon Cell Laser Edge Isolation Device. The invention was developed by Tan Miao, Li Chunye, Zhang Guojun, Zhang Changjiang, Long Junyao, Huang Zhirong, He Yingqiao and Han ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- SK Hynix has filed a patent application for Image Sensing Device. This invention was developed by Kim Dong-ha.
The patent application number is CN202411788666 20241206. The patent publication number is CN121358026 (A). International Patent Classification code is H10F39/18. Cooperative Patent Classification co..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Cnac Kaimai Shanghai Infrared Tech Co Ltd has filed a patent application for Back Thinning and Polishing Preparation Method of Infrared Focal Plane Array Chip Assembly. This invention was developed by Li Rong and Zhang Yuxi.
The patent application number is CN202511224811 20250829. The patent publication nu..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Taiwan Semiconductor Manufacturing patent application for Integrated Chip and Forming Method Thereof. The invention was developed by You Bingcheng, Hong Bong-ki, Chen Weilong, Shi Zhicheng and Liu Rencheng.
The patent application number is CN2025113649..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Nanchang Kaixun Photoelectric Co Ltd patent application for Triple-junction Gallium Arsenide Solar Cell Epitaxial Wafer and Preparation Method Thereof. Ning Ruguang, Pan Bin, Cai Jianjiu, Li Hao and Tong Jiaxin developed the invention.
The patent appl..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Xiamen Yinke Qirui Semiconductor Tech Co Ltd patent application for Epitaxial Structure of Three-junction Solar Cell and Manufacturing Method Thereof. The invention was developed by Xia Hongying, Zhang Yinqiao, Wang Yu, Zhou Shan, Zheng Wenjuan and Chen..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has filed a patent application for High-voltage PNP Electrostatic Protection Device. This invention was developed by He Yiming and Su Qing.
The patent application number is CN202511415538 20250930. The patent publication number is CN121358000 (A..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Semiconductor Manufacturing International (Shanghai) has submitted a patent application for Standard Cell Structure of Integrated Circuit and Preparation Method. Liu Qing, Yu Lei, Ji Shiliang and Zhang Haiyang developed the invention.
The patent application number is CN202410933459 20240711. The patent public..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Taiwan Semiconductor Manufacturing patent application for Transistor Device and Forming Method Thereof. The invention was developed by Lin Zhichang, Qiu Zongkai, Jiang Yuxian, Yu Jianlin, Yang Gufeng and Liao Siya.
The patent application number is CN20..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Huawei Technologies patent application for Semiconductor Device and Preparation Method Thereof, Integrated Circuit and Electronic Equipment. Xu Miao, Li Chen, Li Tianran and Liu Yanxiang developed the invention.
The patent application number is CN202410..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Semiconductor Device and Forming Method Thereof. This invention was developed by Zhong Zhengting and Chen Haoyu.
The patent application number is CN202511390085 20250926. The patent publication n..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Hefei Nexchip Integrated Circuit has sought patent for Manufacturing Method of Semiconductor Device. This invention was developed by Liu Sutao and Lin Shimin.
The patent application number is CN202511927061 20251219. The patent publication number is CN121357983 (A). International Patent Classification codes a..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Beijing Ruidi Shikong Information Tech Co Ltd has submitted a patent application for Multi-mode Chip Preparation Method Based on Radio Frequency Digital-analog Mixing. This invention was developed by Xue Xiaofeng, Jiang Cheng, Du Wentao and Wei Shuaipeng.
The patent application number is CN202511492906 2025..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Taiwan Semiconductor Manufacturing patent application for Method for Forming Semiconductor Structure and Semiconductor Device. He Weide, Lin Zhichang, Wang Guanren, Jiang Yuxian and Hu Zuyu developed the invention.
The patent application number is CN202..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Taiwan Semiconductor Manufacturing has filed a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Li Zonglin, Ye Zhikai and Ye Zhuhui.
The patent application number is CN202511401214 20250928. The patent publication number is CN121357971 (A). Internation..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Taiwan Semiconductor Manufacturing patent application for Semiconductor Structure and Forming Method Thereof. Lin Zhibin and Lin Zhichang developed the invention.
The patent application number is CN202511401203 20250928. The patent publication number is..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Texas Instruments patent application for Asymmetric Transmission Line Power Combiner. Das Arnab and Dandu Krishnanshu developed the invention.
The patent application number is CN202510850995 20250624. The patent publication number is CN121357967 (A). ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Shenzhen Jianan Semiconductor Tech Co Ltd patent application for Manufacturing Method of Enhanced Semiconductor Power Device. The invention was developed by Du Weixing and Yang Kai.
The patent application number is CN202511324500 20250917. The patent..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Institute of Microelectronics, CAS patent application for Ring Gate Stacked Semiconductor Device and Preparation Method Thereof. This invention was developed by Yin Huaxiang, Li Qingkun, Zhang Qingzhu, Yao Jiaxin and Cao Lei.
The patent application numb..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Guangzhou Zengxin Technology patent application for Semiconductor Structure and Forming Method of Semiconductor Structure. The invention was developed by Wu Liyu and Shen Baoxin.
The patent application number is CN202511609148 20251104. The patent publ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Shanghai Langxi Tech Co Ltd patent application for Deep Trench Silicon Capacitor and Preparation Method Thereof. The invention was developed by Wang Daxiang, Xu Di, Zhang Xiong and Li Qing.
The patent application number is CN202511463435 20251014. Th..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Lx Semiconductor Tech Co Ltd has sought patent for Resistor Structure of Semiconductor Device and Semiconductor Device Including Resistor Structure. This invention was developed by Li Shiyuan, Park Byeong-cheol and Kim Nam-jin.
The patent application number is CN202510980252 20250716. The patent publication..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Toshiba Memory has submitted a patent application for Semiconductor Memory Device. This invention was developed by Arai Shinya.
The patent application number is CN202510215045 20250226. The patent publication number is CN121357900 (A). International Patent Classification codes are H10B43/20, H10B43/35, H10B43..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Micron Technology has filed a patent application for Microelectronic Devices Including Shape Memory Materials and Related Methods, Memory Devices and Electronic Systems. This invention was developed by Yeduru Srinivasa Reddy and Langaard Swapnil A.
The patent application number is CN202510955298 20250711. The..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Micron Technology patent application for Memory Channel Structure. O 'leshea Michael, Li Donghua and Venkatesan Subramanian developed the invention.
The patent application number is CN202510974346 20250715. The patent publication number is CN121357888 (..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Huahong Semiconductor Mfg Wuxi Co Ltd and Huahong Semiconductor, Wuxi patent application for Selection Gate Forming Method for Estm Flash Memory Device. This invention was developed by Liu Yuxiang, Lyu Chuanjiang, Wang Xiaori and Wang Han.
The patent ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Toshiba Memory patent application for Semiconductor Memory Device. The invention was developed by Arai Shinya and Wada Hideo.
The patent application number is CN202510208767 20250225. The patent publication number is CN121357886 (A). International Pate..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Nanya Technology has applied Chinese patent for Semiconductor Element. Su Guohui developed it.
The patent application number is CN202510154622 20250212. The patent publication number is CN121357880 (A). International Patent Classification code is H10B12/00. Cooperative Patent Classification codes are H10B12..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Huawei Technologies patent application for Memory, Manufacturing Method of Memory, Semiconductor Device and Electronic Equipment. The invention was developed by Huang Kailiang, Jing Weiliang, Sun Ying, Zhuo Yi and Wang Zhengbo.
The patent application n..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Shanghai Pengxi Semiconductor Co Ltd patent application for Diversified Presentation Method for Equipment Pictures in Semiconductor Equipment State Monitoring System. This invention was developed by Zhang Fei and Wu Yongxian.
The patent application nu..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shanghai Qianzhan Innovation Res Institute Co Ltd has applied Chinese patent for Micro-channel Radiator for Thermal Management of Integrated Circuit. Cai Gaozhe, Lai Ziwen, Zhang Shuo, Feng Shilun, Zhou Ting and Zhao Jianlong developed it.
The patent application number is CN202511338020 20250918. The patent..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Jiangmen Yamin Electronic Tech Co Ltd has submitted a patent application for Aluminum Substrate Production Process for Cutting Circuit Through Mold. This invention was developed by Tong Chaoliang.
The patent application number is CN202511519781 20251023. The patent publication number is CN121357807 (A). Int..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Bangyan Tech Co Ltd has filed a patent application for Multi-cpu Trusted Measurement System, Method and Device Based on Special Trusted Chip. This invention was developed by Chen Haiyan and Zhu Guosheng.
The patent application number is CN202511380407 20250925. The patent publication number is CN121351078 (..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Jiangsu Xinyuan Semiconductor Co Ltd has submitted a patent application for Test Control Method and Device of Vehicle-mounted Chip and Storage Medium. This invention was developed by Yin Guohai and Liu Xiaojie.
The patent application number is CN202511400276 20250928. The patent publication number is CN1213..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Shenzhen Zhouhong Semiconductor Technology patent application for Electronic Storage Chip Operation Fault Diagnosis Method and System. This invention was developed by Jiang Wen, Cai Liangyong and Zhu Houquan.
The patent application number is CN202511621..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Beijing Fire Gene Dx Tech Co Ltd has sought patent for Micro-fluidic Chip and Use Method Thereof. This invention was developed by Wang Hong, Wang Hu, Lin Xiao and Song Keqing.
The patent application number is CN202511544623 20251028. The patent publication number is CN121360623 (A). International Patent Cla..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Zhejiang Provincial People's Hospital patent application for Micro-fluidic Chip for Detecting Platelet Aggregation Function. Wang Zhen, Li Kaiqiang and Hao Ke developed the invention.
The patent application number is CN202511460090 20251014. The patent ..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Digifluidic Biotech has sought patent for Micro-fluidic Chip Capable of Realizing Two Reactions and Use Method Thereof. This invention was developed by Chen Tianlan, Liu Chenghai, Wu Zheng, Wu Xiangjun, Cheng Kexuan, Song Leiguang and Yang Yunran.
The patent application number is CN202410959880 20240717. The ..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Guangxi Juxin Technology has submitted a patent application for Semiconductor Laser Chip. This invention was developed by Fu Jianbo, Zong Hua, Jiang Shengxiang, Meng Linghai, Hu Xiaodong and Luo Zhengbiao.
The patent application number is CN202511345691 20250919. The patent publication number is CN121355699 (..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Xiamen Yinke Qirui Semiconductor Tech Co Ltd has submitted a patent application for Bonding Method of Thin Film Material and Rigid Material. This invention was developed by Chu Kecheng, Zhang Yinqiao, Wang Yu, Ye Weimin, Liu Biaohuang, Lu Wei, Zhou Shan and Xie Kunjiang.
The patent application number is CN2..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shenzhen Huicun Semiconductor Co Ltd has filed a patent application for Power Semiconductor Module Low-inductance Packaging Structure and Packaging Method. This invention was developed by Luo Xiyan, Lai Chenchen and Li Tianwen.
The patent application number is CN202511542484 20251027. The patent publication..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Guangdong Xincheng Hanqi Semiconductor Tech Co Ltd has submitted a patent application for Airtight Packaging Structure and Packaging Method of Chip. This invention was developed by Han Lei and Zhu Kai.
The patent application number is CN202511326808 20250917. The patent publication number is CN121358321 (A)..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Zhejiang Chuanghao Semiconductor Co Ltd patent application for Production Method of Package Substrate with Rough Surface Solder Mask. The invention was developed by Fang Yong, Lu Hailin, Yan Chuanzhao and Zhao Zhen.
The patent application number is C..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Lisuan Tech Shanghai Co Ltd has submitted a patent application for Solder Ball Arrangement Structure and Method in Chip Packaging Substrate, Chip and Electronic Equipment. This invention was developed by Lu Yu, Yang Ke and Zhang Weibo.
The patent application number is CN202511893121 20251216. The patent pub..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Jiangsu Haina Electronic Tech Co Ltd patent application for Self-adaptive Ball Mounting Jig Suitable for Substrate Warping. Wang Hongwei and Wang Dayuan developed the invention.
The patent application number is CN202511916694 20251218. The patent publ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Sanhe Jianhua High Tech Co Ltd has sought patent for Different-size Wafer Bonding Device and Use Method Thereof. This invention was developed by Guan Ziheng, Liu Bingxin and Bai Long.
The patent application number is CN202511373537 20250925. The patent publication number is CN121358307 (A). International Pa..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Jiangsu Nepes Semiconductor Co Ltd has sought patent for UBM Leap Type Wafer Level Packaging Structure. This invention was developed by Zhang Qiaodong, Zhou Yao, Huang Xiao and Zhu Hongwei.
The patent application number is CN202511462923 20251014. The patent publication number is CN121358306 (A). Internatio..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Suzhou Ruijiewei Tech Group Co Ltd patent application for Embedded High-thermal-conductivity Ceramic Packaging Substrate for High-power Scene and Preparation Method of Embedded High-thermal-conductivity Ceramic Packaging Substrate. Zhang Long, Qin Shengl..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Tongfu Microelectronics patent application for Lead Frame and Chip Packaging Module. This invention was developed by Xing Weibing, Wang Rui and Gu Xiamao.
The patent application number is CN202511714497 20251120. The patent publication number is CN12135..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Zhejiang Chuanghao Semiconductor Co Ltd patent application for Package Substrate Manufacturing Method and Package Substrate. Tang Hua, Zhang Linwei, Lu Hailin, Jiao Xuezhi and Yan Chuanzhao developed the invention.
The patent application number is CN2..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Shenzhen Goldenken New Mat Co Ltd patent application for Metal Thinning Method for High-aspect-ratio TGV Semiconductor 3D Packaging Substrate. The invention was developed by Ge Xiubin and Liu Xiangli.
The patent application number is CN202511909190 2..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Jiangsu Fulehua Power Semiconductor Research Institute and Jiangsu Fulehua Semiconductor Technology patent application for Direct Copper-clad Aluminum Ceramic Substrate Step Etching Method. Ding Muyu, Gao Yuan, Zhou Xin and Wang Bin developed the inventi..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Huayi Microelectronics Co Ltd has filed a patent application for Packaging Method for Preventing Layering of Semiconductor Power Device. This invention was developed by Chen Hongming, Sun Jie, Wang Huiping, He Jialun, Li Ai'ai, Chen Junyan and Ma Qian.
The patent application number is CN202511548859 2025102..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Texas Instruments has sought patent for Data and Power Isolation Barrier. This invention was developed by Rajapaksha Divya B, Sperlich Rainer, Kamath Anant Shankar, Devarajan Vijayalakshmi and Ray William.
The patent application number is CN202511478875 20200624. The patent publication number is CN121358284..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Chip Preparation Method and Chip. Song Furan developed the invention.
The patent application number is CN202511907701 20251217. The patent publication number is CN121358275 (A). International Patent Classification code is H10W20/46.
Sta..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Interconnection Structure and Forming Method Thereof. This invention was developed by Guo Jiabang, Lin Yanjun, Liu Renwei, Jiang Mingzhou and Weng Zhenghui.
The patent application number is CN202510842834 20250623. The patent publicatio..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Changsha Anmuquan Intelligent Tech Co Ltd has submitted a patent application for Crystal Grain Manufacturing Process, Crystal Grain and Chip. Liu Zheng, Wei Ping, Zheng Boyu, Luo Jiahu and Guo Wenjuan developed the invention.
The patent application number is CN202511489792 20251017. The patent publication n..
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