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Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 21 -- Anhui Medical University has submitted a patent application for Magnetothermal Micro-fluidic Chip and Application Thereof. Chen Zhongrong, Fang Zhixiang, Zhao Gang, Cheng Yue and Wei Mulin developed the invention.
The patent application number is CN202610346616 20260320. The patent publication number is CN1..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 21 -- Hangzhou Institute of Medical Chinese Academy of Sciences has applied Chinese patent for Method for Separating and Detecting Exosome in Whole Blood by Using Micro-fluidic Chip. Tan Yuhong, Jiang Yifei, Li Peixiang, Liu Yating and Wang Chenjing developed it.
The patent application number is CN202610222672 20..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 21 -- State Intellectual Property Office of China has published Shenzhen Yilifang Biotech Co Ltd patent application for Reaction Control Device of Centrifugal Micro-fluidic Chip. The invention was developed by Liao Shengyun and Huang Yubin.
The patent application number is CN202610173429 20260206. The patent pu..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 21 -- Shenzhen Shuxin Biotechnology Co Ltd has submitted a patent application for Pre-cutting Chip and Preparation Method and Application Thereof. This invention was developed by Zeng Qingda, Liu Kun, Huang Yuxia, Kuang Jiehui, Zhao Zhi, Lin Yubin, Jiang Tongtong, Yuan Chaofeng, Wang Haiyang and He Mengting.
Th..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 21 -- Guo Shanshan has applied Chinese patent for Preparation Method and System of Silicon Carbide Micro Powder.
The patent application number is CN202610324964 20260317. The patent publication number is CN122273644 (A). International Patent Classification codes are B02C19/06, B02C21/00, B02C23/14 and B02C23/2..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Nexperia BV patent application for Method for Manufacturing a Semiconductor Package Assembly as Well as Such Semiconductor Package Assembly. This invention was developed by Brown Adam, Chang Ting Wei and Ting Jia Yunn.
The patent application number is US20261..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Sony Semiconductor Solutions Corporation patent application for Semiconductor Device and Laminated Structure. Fujimagari Junichiro developed the invention.
The patent application number is US202318876755 20230623. The patent publication number is US20260271..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Power Pickup for Dual Side Power Structure. Tzeng Jiann-tyng, Lin Wei-cheng and Huang Ching-yu developed it.
The patent application number is US202519071004 20250305. The patent publication number is US20260271702 (A1). Inte..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Ruthenium Oxide Film and Ruthenium Liner for Low-resistance Copper Interconnects in a Device. The invention was developed by Chin Shu-cheng.
The patent application number is US202619660406 20..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- SK Hynix has submitted a patent application for Semiconductor Package and Fabricating Method Thereof. This invention was developed by Chang Heon Yong.
The patent application number is US202519243617 20250619. The patent publication number is US20260271698 (A1). International Patent Classification codes a..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Yangtze Memory Technologies has filed a patent application for Semiconductor Device, Fabrication Method Thereof, and Memory System. This invention was developed by Guo Yali, Wang Fazhan, Yuan Bin, Sun Baoqing, Wei Danyang, Huo Zongliang and Xu Wei.
The patent application number is US202519435514 202512..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Sandisk Technology has submitted a patent application for Bonded Assemblies Including Through-die Via Structures and Methods for Forming the Same. This invention was developed by Nishida Akio, Higashitani Masaaki and Mushiga Mitsuteru.
The patent application number is US202519071286 20250305. The patent ..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Applied Materials has submitted a patent application for In-trench Quality Improvement of Silicon-and-oxygen-containing Materials. This invention was developed by Ghosh Supriya, Singhal Akhil, Wang Rui, Dhawan Sukrant and Singha Roy Susmit.
The patent application number is US202519072150 20250306. The pa..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Samsung Electronics patent application for Semiconductor Device and Method of Fabricating the Same. This invention was developed by Bae Joonyong, Kim Hanseong and Lee Seonwoong.
The patent application number is US202619455390 20260121. The patent publicatio..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Texas Instruments Incorporated patent application for Merged Trenches Surrounded by Wider Trench for Isolating Semiconductor Devices. Mathur Guruvayurappan, Ali Abbas, Yang Hao, Haider Asad, Sadovnikov Alexei and Aghroam Umamaheswari developed the invention.
..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Infineon Technologies patent application for Semiconductor Device with a First Isolation Trench and Method of Manufacturing. The invention was developed by Schlösser Till, Disney Donald Ray and Weis Rolf.
The patent application number is US202619442047 2026..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Deep Trench Isolation Structures and Methods of Forming the Same. Tseng Yen Chang developed the invention.
The patent application number is US202519070755 20250305. The patent publication number is US20260271685 (A1). Inte..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Samsung Electronics has applied United States patent for Semiconductor Device. Park Dongsik, Jang Hyeonwoo, Chang Jihoon, Shin Sooho, Kim Dongwan and Yoon Chansic developed it.
The patent application number is US202619468389 20260203. The patent publication number is US20260271684 (A1). International P..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Dendrite Mitigation of Passive Components. Chiu Chen-nan, Huang Li-hsien, Chang Jui Shen, Lu Yinlung and Chuang Yao-chun developed it.
The patent application number is US202619665175 20260501. The patent publication number i..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Method for Manufacturing Semiconductor Structure Using Multi-layered Hard Mask. The invention was developed by Lee Shen-yang, Lin Pinyen, Chao Huang-lin, Chang Hsu-kai, Chang Hsiang-pi and Lu Ch..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Applied Materials patent application for Methods for Reshaping Masking Layer Openings. The invention was developed by Hsu Chen-chih, Sherman Steven, Lin Yung-chen and Liang Shurong.
The patent application number is US202519071085 20250305. The patent publica..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published International Business Machines patent application for Reusable Flexible Probe with Ferromagnetic Alignment for Chip Testing. The invention was developed by Vega Reinaldo, Ando Takashi, Wolpert David and Rana Uzma.
The patent application number is US20251907..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Applied Materials has filed a patent application for Die-level Warp Control in Device Manufacturing. This invention was developed by Subrahmanyan Pradeep Kumar and Sun Changwoo.
The patent application number is US202519254493 20250630. The patent publication number is US20260271675 (A1). Cooperative Pate..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Yamaha Robotics Co Ltd and Tokyo University of Science Foundation patent application for Chip Holding Tool, Chip Holding Device, and Device for Manufacturing Semiconductor Device. This invention was developed by Kikuchi Hiroshi, Miyatake Masaaki and Li Jin.
..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Lam Research has submitted a patent application for Multl-station Tool with Rotatable Top Plate Assembly. This invention was developed by Leeser Karl Frederick and Lavoie Adrien.
The patent application number is US202619662946 20260429. The patent publication number is US20260271672 (A1). International P..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Beijing NAURA Microelectronics Equipment patent application for Processing Chamber and Semiconductor Processing Equipment. This invention was developed by Wang Fulai.
The patent application number is US202318875527 20230616. The patent publication number is U..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Wafer Transport Method and Apparatus. Shen Yu-chun, Chiang Wen-chih, Kuo Yuan-cheng, Hsiao Kai-hung, Jen Chi-chung and Huang Chih-hsiung developed the invention.
The patent application number is US202619662616 20260429. Th..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published UTAC Headquarters patent application for Semiconductor Device Carriers and Methods of Making and Using. The invention was developed by Robles Roel Adeva and Chow Chee Kay.
The patent application number is US202619664425 20260430. The patent publication num..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Daikin Finetech has submitted a patent application for Substrate Processing Module and Substrate Processing Device. This invention was developed by Toyotama Hidefumi and Deguchi Yasunori.
The patent application number is US202419167158 20240322. The patent publication number is US20260271665 (A1). Intern..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Tokyo Electron has filed a patent application for Substrate Processing Apparatus and Method for Cleaning Substrate Processing Apparatus. This invention was developed by Sakurai Hiroki, Mizuguchi Shoki, Mori Kanta, Goto Daisuke, Higashijima Jiro, Ogata Nobuhiro and Nakamura Kazunori.
The patent applicatio..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Applied Materials has sought patent for Spin-dry Chamber for Cleaning Various Sized Substrates. This invention was developed by Rye Jason A.
The patent application number is US202519073889 20250307. The patent publication number is US20260271651 (A1). Cooperative Patent Classification codes are H10P72/04..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- STATS ChipPAC has submitted a patent application for Method for Making Semiconductor Packages. This invention was developed by Seo Dongjun, Moon Jisik, Koo Kyowang and Lee Jungsub.
The patent application number is US202619663306 20260430. The patent publication number is US20260271649 (A1). International..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published KIOXIA patent application for Semiconductor Device and Method for Manufacturing the Same. The invention was developed by Yamamoto Yukihiro.
The patent application number is US202519325743 20250911. The patent publication number is US20260271648 (A1). Coope..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received KIOXIA patent application for Grinding Device and Semiconductor Device Manufacturing Method. Kawasaki Tomonori developed the invention.
The patent application number is US202519331714 20250917. The patent publication number is US20260271646 (A1). Internationa..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- SCREEN Holdings has applied United States patent for Substrate Processing Method. Sasaki Kazunari, Hemmi Takashi, Nakano Teppei, Ota Takashi and Iwahata Shota developed it.
The patent application number is US202419480021 20240419. The patent publication number is US20260271643 (A1). International Patent ..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- ASM has applied United States patent for Method of Forming a Dielectric Layer. Mullapudi Kamesh developed it.
The patent application number is US202619555993 20260304. The patent publication number is US20260271636 (A1). International Patent Classification codes are H10P14/60 and H10P14/69. Cooperative..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Applied Materials patent application for Atomic Layer Deposition with Carbon Inhibition Profile Tuning. This invention was developed by Ghosh Supriya, Singhal Akhil, Wang Rui, Wu Lihua, Dhawan Sukrant, Singha Roy Susmit and Khaja Abdul Aziz.
The patent applic..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing Co Limited has sought patent for Capacitor Circuit Providing Self-adjusting Capacitance and Methods for Forming the Same. This invention was developed by Huang Kuo-ching, Chang Kuo-pin and Ting Yu-wei.
The patent application number is US202619663870 20260430. The pate..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Tsinghua University patent application for Three-dimensional Integrated Sensing-memory-computing Chip, Method for Manufacturing the Same, and Computing Method Therefor. This invention was developed by Hao Zhibiao, Tang Jinpu, Pan Wen, Luo Yi, Yang Zhaolong and..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group patent application for Display Substrate and Display Device. Li Shuo and Liu Bin developed the invention.
The patent application number is US202418993582 20240514. The patent publication numbe..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Lam Research has submitted a patent application for Systems and Techniques for Gas Delivery for Semiconductor Processing. Ong Michael Grayson, Galli Federico and Dix Joseph Alan developed the invention.
The patent application number is WO2026US17259 20260302. The patent publication number is WO2026187647 (A1..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Lam Research has applied WIPO patent for Low-stress Film for High-aspect-ratio Metal Contact Fill. Liu Gang L, Suh Tae Won, Chandrashekar Anand, Chen Xitong and Murali Arun developed it.
The patent application number is WO2026US17257 20260302. The patent publication number is WO2026187645 (A1). International..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Lam Research has applied WIPO patent for Void-free Carbon Gapfill. Puthenkovilakam Ragesh, Reddy Kapu Sirish, Subramanian Ashwanth, Maliekkal Vineet, Dodhia Aarsh Nilesh, Patel Roshan Ashokbhai, Ramanan Vinayak, Hu Yiming and Zhang Pengyi developed it.
The patent application number is WO2026US17161 20260227...
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- World Intellectual Property Organization has released Lam Research patent application for Pretreatment and Inhibition for Atomic Layer Deposition Selective to Material Composition. This invention was developed by Agnew Douglas Walter, Bihari Nupur, Smith Joel David, Ganesan Jeya Prakash, Lemaire Paul C, Mandi..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- World Intellectual Property Organization has released Lam Research patent application for High-modulus Carbon Gapfill Films. This invention was developed by Puthenkovilakam Ragesh, Zhang Yue, Reddy Kapu Sirish, Subramanian Ashwanth, Patel Roshan Ashokbhai, Hu Yiming, Ramanan Vinayak and Zhang Pengyi.
The pat..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- SK Hynix Nand Product Solutions has applied WIPO patent for Monolithic Enclosure for a Printed Circuit Board. Singh Hardeep developed it.
The patent application number is WO2026US16563 20260225. The patent publication number is WO2026187548 (A1). International Patent Classification codes are H05K1/02 and H05..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- World Intellectual Property Organization has published Lam Research patent application for Edge Gas Injection Nozzles for Outer Electrode. The invention was developed by Alhart Scott David Eugene, Keller Lindsay Carl, Holland John, Phillips Peter Bradley and Bise Ryan.
The patent application number is WO2026..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- World Intellectual Property Organization has released Ommatidia Lidar SL patent application for Compound Focal and Pupil Plane 3D Image Sensor. This invention was developed by Rubio Guivernau Jose Luis, Pandraud Gregory and Margallo Balbas Eduardo.
The patent application number is WO2026EP55920 20260304. T..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Die Technische Universitat Dresden has submitted a patent application for Organic Electrochemical Transistors with a Double-sided Structure. Kleemann Hans, Solgi Ali, Yoon Yeohoon and Leo Karl developed the invention.
The patent application number is WO2026EP55890 20260304. The patent publication number is..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Guangdong Juhua Printing Display Technology has filed a patent application for Ink, Thin Film and Light Emitting Device. This invention was developed by Cai Liangqiang and Zhan Tao.
The patent application number is CN202411940410 20241226. The patent publication number is CN122278257 (A). International Pa..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- State Intellectual Property Office of China has received Jiangsu Hegui Nano Tech Co Ltd patent application for Dust-free Environment-friendly Silicon Dioxide Performance Additive Mixing and Dispersing Method. Yang Xiaojuan developed the invention.
The patent application number is CN202610511529 20260417. ..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Marine Chemical Research Inst Co Ltd has submitted a patent application for Carbonyl Iron Absorbent Based on High-compactness Silicon Dioxide Shell Coating Modification, Corrosion-resistant Antioxidant Wave-absorbing Coating and Application. This invention was developed by Wang Junjun, Wang Yue, Jeon Ho-won,..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Zhongyi Silicon Materials Suzhou Nano New Material Tech Co Ltd has filed a patent application for Single-component Organic Silicon Modified Polyurethane Microcapsule System Water-based Ceramic Coating and Preparation Method Thereof. This invention was developed by Rong Lulu, Wang Zhijun, Chen Hailong, Li Lif..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Beijing Leiaofei Tech Co Ltd has submitted a patent application for Polyurethane Synthetic Organic Silicon Material for Protecting Outer Wall of Tower Drum of Wind Driven Generator and Preparation Method of Polyurethane Synthetic Organic Silicon Material. This invention was developed by Nan Dongxuan, Qiu Jin..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Tsinghua University has submitted a patent application for Composite Dielectric Film and Preparation Method and Application Thereof. Nan Cewen, Yang Minzheng, Yan Jiayu and Shen Yang developed the invention.
The patent application number is CN202610294823 20260311. The patent publication number is CN12227..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Jilin University has sought patent for Automobile Seat with Rapid Cooling Function Based on Semiconductor Refrigeration. This invention was developed by Chen Jiaming, Zhang Yingchao, Liu Haipeng, Wang Guohua and Chang He.
The patent application number is CN202610720541 20260525. The patent publication numbe..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received ROHM patent application for Semiconductor Device. Hara Tomohiko and Mikado Kensuke developed the invention.
The patent application number is US202619665658 20260501. The patent publication number is US20260271806 (A1). International Patent Classification co..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Samsung Electronics patent application for Semiconductor Device and Method of Manufacturing the Same. The invention was developed by Han Jinwoo and Kim Mingyu.
The patent application number is US202619551802 20260227. The patent publication number is US202..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Micron Technology has submitted a patent application for Heat Transfer Structures for Semiconductor Apparatuses. Griffin Amy Rae, Kawakita Keizo, Singh Akshay N and Bhushan Bharat developed the invention.
The patent application number is US202619540196 20260213. The patent publication number is US2026027..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- ROHM has submitted a patent application for Semiconductor Device. Inokuchi Hiroyuki developed the invention.
The patent application number is US202619653505 20260421. The patent publication number is US20260271796 (A1). International Patent Classification codes are H10W70/698, H10W90/00 and H10W90/10. ..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Yangtze Memory Technologies patent application for Semiconductor Devices, Systems, and Methods for Forming the Same. The invention was developed by Chen Liang, Wei Danyang, Liu Wei, Li Wen, Huang Shiqi, Huo Zongliang, Chen Jiahao and Miao Lin.
The patent a..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Intel has filed a patent application for Technologies for Base Die Placement in High-bandwidth Memory Systems. This invention was developed by Deshpande Nitin A, Pelto Christopher M, Iyer Anand V, Sharma Abhishek Anil and Majhi Prashant.
The patent application number is US202519075591 20250310. The pat..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Micron Technology has sought patent for Hybrid-bond Interface Structure Including Multiple Dielectric Layers. This invention was developed by Su Ying-tsun.
The patent application number is US202619541312 20260216. The patent publication number is US20260271780 (A1). International Patent Classification co..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Shindengen Electric has submitted a patent application for Semiconductor Module. This invention was developed by Kuwano Ryoji, Ikeda Takashi and Inaba Hayato.
The patent application number is US202419164152 20240307. The patent publication number is US20260271776 (A1). International Patent Classificati..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Micron Technology has submitted a patent application for Memory Packages with Self-tuning Protective Material. This invention was developed by Chung Min-hua, Bin Moideen Mohamad Zainudeen and Gan Chong Leong.
The patent application number is US202619553997 20260302. The patent publication number is US202..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing has filed a patent application for Semiconductor Packages and Methods of Forming. This invention was developed by Shih Chao-wen, Hou Shang-yun, Shih Ying-ching, Yu Chi-yang, Cheng Li-hui and Cheng Jung Wei.
The patent application number is US202519263366 20250708. The p..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Alliance Mat Co Ltd has submitted a patent application for Manufacturing Method of Semiconductor Device. This invention was developed by Xie Shi Rou, Chen Chun Fa, Hu Kuan Chun, Chen Xuan You, Lee Chen Ju, Wu Hsueh Chung, Huang Chi Hua and Lin Chin Kai.
The patent application number is US202519305805 2..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Mitsubishi Electric has sought patent for Semiconductor Device. This invention was developed by Okada Kazuya.
The patent application number is US202519435450 20251229. The patent publication number is US20260271769 (A1). International Patent Classification codes are H10W72/90 and H10W90/00. Cooperative..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Infineon Technologies has submitted a patent application for Power Semiconductor Package Including Stacked Contact Clips, System and Method for Fabricating a Power Semiconductor Package. This invention was developed by Schindler Uwe, Gatterbauer Johann, Zollner Franz, Bauer Michael, Schwab Stefan, Grassma..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- ROHM has submitted a patent application for Semiconductor Device. Kikuchi Tomohira developed the invention.
The patent application number is US202619551854 20260227. The patent publication number is US20260271767 (A1). International Patent Classification codes are H10W70/40, H10W72/50, H10W74/00 and H1..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received ROHM patent application for Semiconductor Module Manufacturing Device and Semiconductor Module Manufacturing Method. Shimizu Tetsuya, Sato Oji and Hiiragi Hikaru developed the invention.
The patent application number is US202619657435 20260424. The patent pub..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Skytech Inc has filed a patent application for Method for Forming Bumps on Substrate. This invention was developed by Liu Kuo-ju, Liu Chi-hsiang, Yi Ching-liang and Cheng Yao-syuan.
The patent application number is US202519202248 20250508. The patent publication number is US20260271762 (A1). Cooperativ..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Samsung Electronics patent application for Semiconductor Package and Method of Manufacturing the Semiconductor Package. This invention was developed by Kim Youngbae, Yoon Youngjun, Shin Narae and Ha Jeongkyu.
The patent application number is US202619665178 20..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Jiashan Fudan Research Instituite patent application for Semiconductor Device, Semiconductor Package, and Semiconductor Packaging Method. This invention was developed by Xu Wenlong, Zhang Bocheng, Zhu Bao, Zhang Lilong, Zhang Wei, Yu Nianwen and Ding Shijin.
..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Semiconductor Package, Semiconductor Device, and Method of Manufacturing Semiconductor Package. Mitarai Shun developed the invention.
The patent application number is US202419166117 20240202. The patent publication number is ..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Avago Technologies International Sales has submitted a patent application for Die for Warpage Control in Semiconductor Packages. Wang Tao developed the invention.
The patent application number is US202519071269 20250305. The patent publication number is US20260271747 (A1). Cooperative Patent Classificati..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Semiconductor Components Industries patent application for Semiconductor Device Packages with Reduced Form Factor. This invention was developed by Hu Cheng, Chi Heejo, Im Seungwon, Baek Jonghwan, Chang Jie, Xing Anan, Lee Keunhyuk, Won Bosung, Wu Dinghao and Y..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Siemens has applied United States patent for Circuit Assembly with a Circuit Carrier and a Semiconductor Component. Pfefferlein Stefan, Heimann Matthias, Müller Bernd, Oschmann Philipp, Hensler Alexander and Strogies Jörg developed it.
The patent application number is US202318877032 20230510. The paten..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device. This invention was developed by Shikasho Yuji, Ichikawa Keitaro, Sakamoto Takuya and Hyodo Sora.
The patent application number is US202619457985 20260123. The patent publication number is US20260271743 (A1). International ..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- ROHM has filed a patent application for Semiconductor Device. This invention was developed by Sano Naoyuki.
The patent application number is US202619556357 20260304. The patent publication number is US20260271742 (A1). International Patent Classification codes are H10W70/40 and H10W90/00. Cooperative P..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Ibiden has submitted a patent application for Method for Manufacturing Wiring Substrate. This invention was developed by Suzuki Jo and Nagata Hiroyasu.
The patent application number is US202619557279 20260305. The patent publication number is US20260271740 (A1). International Patent Classification codes ..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Sumitomo Electric Industries patent application for Semiconductor Device. Hashinaga Tatsuya and Shimizu Hayato developed the invention.
The patent application number is US202619529563 20260204. The patent publication number is US20260271737 (A1). Internatio..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- GlobalFoundries has submitted a patent application for Structure and Method of Switchable Ground Shield for Inductors. Vanukuru Venkata Narayana Rao, Kunnathodi Muhammed Shafi and Baipadi Varuna A developed the invention.
The patent application number is US202519072442 20250306. The patent publication nu..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Alliance Mat Co Ltd patent application for Manufacturing Method of Semiconductor Device. Xie Shi Rou, Chen Chun Fa, Hu Kuan Chun, Chen Xuan You, Lee Chen Ju, Wu Hsueh Chung, Huang Chi Hua and Lin Chin Kai developed the invention.
The patent application numb..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing Co Ltd has filed a patent application for Large Area Interposers, Systems Comprising the Same, and Methods for Producing the Same. This invention was developed by Tien Tzu Jung, Chen Jia-ren and Chu Li-hsin.
The patent application number is US202519073485 20250307. Th..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received KV Innovations LLC patent application for Three-dimensional Integrated Circuit. Vafai Kambiz and Lu Sainan developed the invention.
The patent application number is US202619541773 20260217. The patent publication number is US20260271726 (A1). International ..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Nexperia BV patent application for Semiconductor Device. The invention was developed by Cao Pulong, Liu Hui and Gong Wei.
The patent application number is US202519372527 20251029. The patent publication number is US20260271725 (A1). International Patent Cl..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing Co Ltd has sought patent for Micro-electromechanical Systems (MEMS) Devices. This invention was developed by Li Yu-hsun.
The patent application number is US202519073306 20250307. The patent publication number is US20260271724 (A1). Cooperative Patent Classification co..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Adeia Semiconductor Bonding Technologies has submitted a patent application for Integrated Cooling Assembly with Upper and Lower Channels and Co-packaged Optics. This invention was developed by Topaloglu Rasit Onur, Haba Belgacem and Zhang Ron.
The patent application number is US202519380286 20251105. ..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing Co Ltd has filed a patent application for Systems and Methods for Liquid Cooling of a Heat-generating Semiconductor Device. This invention was developed by Li Yu-hsun.
The patent application number is US202519073325 20250307. The patent publication number is US2026027..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Peltier Element and Semiconductor Package. This invention was developed by Ogami Tasuku.
The patent application number is US202319126615 20230919. The patent publication number is US20260271719 (A1). International Patent Clas..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received GlobalFoundries patent application for Structure with Alternate Polarity Thermoelectric Materials and Method to Form Same. Gupta Parnika, Pawlak Bartlomiej J and Witt Christian A developed the invention.
The patent application number is US202519069314 2025030..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Semiconductor Package and Method of Fabricating the Same. Wu Chen Sheng, Lin Yung-chi, Chung Ming-tsu and Wang Yu-han developed it.
The patent application number is US202519070435 20250304. The patent publication number is U..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- GlobalFoundries has submitted a patent application for Integrated Circuit Modules Bonded Along Interface Having Electrically Insulative Thermally Conductive Layer. This invention was developed by Karumuri Naveen, Choppalli Satyasuresh Vvss, Turuvekere Sreenidhi, Toh Rui Tze, Das Pallabi, Liu Fangyue, Swam..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Mitsubishi Electric has sought patent for Semiconductor Device. This invention was developed by Nishiyama Taketo.
The patent application number is US202519437157 20251230. The patent publication number is US20260271712 (A1). International Patent Classification codes are H10W40/20, H10W40/60 and H10W76/..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Micron Technology has applied United States patent for Heat Transfer Structures for Semiconductor Apparatuses. Griffin Amy Rae, Li Chenxi and Koopmans Michel developed it.
The patent application number is US202619542304 20260217. The patent publication number is US20260271711 (A1). International Patent C..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- ROHM has submitted a patent application for Semiconductor Device, Method for Manufacturing Semiconductor Device, and Vehicle. This invention was developed by Tsukamoto Yoshihisa, Hayashiguchi Masashi, Sawada Hideki and Abe Hidetoshi.
The patent application number is US202619665227 20260501. The patent pu..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Google patent application for Heatsink Integrated Voltage Regulator Assembly for an Integrated Circuit Package. Roy Richard Stuart developed the invention.
The patent application number is US202519069958 20250304. The patent publication number is US2026027170..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Samsung Electronics has submitted a patent application for Serpentine Structure for Thin Film Resistors and a Method of Fabricating the Same. Kelly Christian John and Singh Sunil Kumar developed the invention.
The patent application number is US202519240912 20250617. The patent publication number is US..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Interconnect Structure Including Multilayered Dielectric Film Scheme and Method for Manufacturing the Same. The invention was developed by Cheng Kai-fang.
The patent application number is US2..
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