Semiconductor
| Sat 02 May 2026
Beijing, May 2 -- Lisen Noco Company has submitted a patent application for Resin Composition, Resin Film, Prepreg, Laminate, Printed Wiring Board, and Semiconductor Package. Ogawa Yuji, Hidaka Keisuke, Tabata Shiori, Kurimoto Shigeru and Mori Kazuhiko developed the invention.
The patent application number is CN20248028582 2024..