News For Last 1 Week
Industry
X
Assignee
Country
Status
-
Select All
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Guangzhou Ehang Electronic Co Ltd has sought patent for Micro-fluidic Chip Micro-injection Molding Method Based on Ultrasonic Assistance. This invention was developed by Lan Zhifeng, Shi Ming and Zhang Jianwei.
The patent application number is CN202610708497 20260521. The patent publication number is CN122..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Suzhou Yinaite Electronic Ind Co Ltd has submitted a patent application for Semiconductor Packaging Mold Structure. This invention was developed by Zhong Xuguang, Xia Guangqing, Wu Xiaogang and Yang Zhibing.
The patent application number is CN202610371557 20260325. The patent publication number is CN122401..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Zhongshan Diyuan Electronic Co Ltd has sought patent for Automatic Edge Removing Machine for Electronic Lock Silicon Pad and Edge Removing Method of Automatic Edge Removing Machine. This invention was developed by Ye Hongtao.
The patent application number is CN202610791571 20260603. The patent publication ..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Weishi Advanced Intelligent Tech Suzhou Co Ltd has sought patent for Length Compatible High-precision Crystal Bar Clamping Device for Semiconductor. This invention was developed by Li Wenqi, Lin Yiwei and Liu Ming.
The patent application number is CN202610586933 20260429. The patent publication number is C..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Wuxi Xinzhuo Huguang Semiconductor Co Ltd has submitted a patent application for Mechanical Arm Detection Device and Method. This invention was developed by Zhu Yuping.
The patent application number is CN202610715115 20260522. The patent publication number is CN122401515 (A). International Patent Classific..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Shenzhen Xinghua Diamond Abrasives Co Ltd has applied Chinese patent for Special Grinding Wheel for Grinding Notch Groove of Semiconductor Silicon Carbide Wafer and Preparation Method of Special Grinding Wheel. Xu Jianhua and Bie Yongjun developed it.
The patent application number is CN202610785905 2026060..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Yancheng Jinghong Electronic Mat Co Ltd has submitted a patent application for CMP Polishing Equipment for Lithium Niobate Wafer. Zhou Wei, Yang Zheng and Zhou Jiwei developed the invention.
The patent application number is CN202610873748 20260617. The patent publication number is CN122401272 (A). Internat..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has published Hwatsing Beijing Tech Co Ltd patent application for Wafer Processing Method and Device, Electronic Equipment and Storage Medium. The invention was developed by Zhang Biao, Tian Yun, Gu Shengpan and Lyu Jiafeng.
The patent application number is CN202..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Jiaxing Xinhaitong New Mat Co Ltd has submitted a patent application for High-compatibility, Long-time-efficiency and High-oxidation-resistance Semiconductor Welding Scaling Powder. Zhang Zuhe, Duan Xueying, He Xiangning and Zhang Xinyun developed the invention.
The patent application number is CN202610838..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Siping Rongmingda Tech Co Ltd has filed a patent application for Corrosion-resistant Welding Wire Containing Chromium, Molybdenum and Silicon and Welding Method of Corrosion-resistant Welding Wire. This invention was developed by Zhao Ming.
The patent application number is CN202610872760 20260616. The pate..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Kunshan Qingyi Electromechanical Tech Co Ltd has submitted a patent application for Flexible Solar Cell Series Welding Machine and Flexible Solar Cell Series Welding Method. Liu Hongwei, Xu Jingyi, Yang Wei and Chen Jie developed the invention.
The patent application number is CN202610743588 20260527. The ..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Jurong Xingchen New Mat Co Ltd has submitted a patent application for Industrial Silicon Concentration and Purification Device and Method. This invention was developed by Sun Lichun.
The patent application number is CN202610167445 20260205. The patent publication number is CN122400539 (A). International Pa..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Ninguo Jingtian Dynamo Electric Co Ltd has submitted a patent application for Automatic Feeding Device for Silicon Steel Coil Stamping. This invention was developed by Ni Sheng, Xie Hongwen, Wu Shiming and Xiao Yi.
The patent application number is CN202610637231 20260511. The patent publication number is C..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Guichao Chengde New Material Tech Co Ltd has sought patent for Soil Remediation Method Based on Organic Silicon Compound. This invention was developed by Zhu Wenlin, Geng Yinmin, Zhang Shouwen and Li Xiaofeng.
The patent application number is CN202610408584 20260331. The patent publication number is CN1224..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has published Gaoce Yancheng Tech Co Ltd patent application for Silicon Wafer Cleaning Device, Silicon Wafer Cleaning System and Silicon Wafer Cleaning Method. The invention was developed by Xu Cheng, Su Wenqi, Zhou Yanlong, Wang Xingxing, Wang Ruitao and Wang Shans..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has released Suzhou Industrial Park Ruisitong Precision Tech Co Ltd patent application for Device and Method for Cleaning Semiconductor Parts. This invention was developed by Xu Wei and Shi Taoyue.
The patent application number is CN202610404276 20260330. The pat..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Beijing Qunce Weiye Tech Development Co Ltd has submitted a patent application for Rapid Sorting Device on Chip Component Production Line. This invention was developed by Qiu Yuan.
The patent application number is CN202610831853 20260610. The patent publication number is CN122400161 (A). International Pate..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has released Mozhate Semiconductor (Suzhou) patent application for Buffer Cleaning Sheet for Probe Card and Preparation Method Thereof. This invention was developed by Zhang Chenxing, Xu Jun, Liu Bin and Zhang Shijun.
The patent application number is CN2026107274..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has published Maxone Semiconductor Suzhou Co Ltd patent application for Probe Array Surface Repairing Method Based on Laser Etching. The invention was developed by Wang Ailin, Chen Yihao and Yu Haichao.
The patent application number is CN202610574745 20260428. Th..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Aoxin Semiconductor Tech Taicang Co Ltd has submitted a patent application for Manufacturing Method for Substrate Packaging Cavity and Packaging Substrate. This invention was developed by Deng Peng, Ma Shang, Hua Dezheng and Cheng Chuanlei.
The patent application number is CN202610396721 20260330. The pate..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Jiyun Zhihe Tianjin Tech Co Ltd has applied Chinese patent for Waterborne UV Coating Directional Infrared Drying Device and Method Based on Mohpro Metal Oxide Semiconductor Microcrystalline Heating Glass. Tian Xiaoxi, Jia Cheng and Zhang Zhuo developed it.
The patent application number is CN202610690610 20..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has published Great Wall Motor Co Limited patent application for Dual-mode Bluetooth Chip Parameter Adjusting Method and Device and Vehicle. The invention was developed by Zhao Jin.
The patent application number is CN202610438122 20260403. The patent publication ..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 30 -- Jige Semiconductor Ningbo Co Ltd has been granted a patent for Prism Motor Structure, Camera and Electronic Equipment. This invention was developed by Shen Haifeng, Zhang Yulin, Nie Bo and Zou Jun.
The patent application number is CN202520605328U 20250331. The patent publication number is CN223926696 (U). ..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has released Yu Tai Electronics Co Ltd patent application for Electromagnetic MEMS Loudspeaker and Preparation Method Thereof. This invention was developed by Yu Weijing and Yu Dequan.
The patent application number is CN202610517696 20260420. The patent publicati..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Beijing Semiconductor Special Equipment Research Inst The 45th Research Inst of China Electronics Te has submitted a patent application for Automatic Focusing Method and Device, Electronic Equipment and Medium. This invention was developed by Zhang Guangyu, Bao-ao Rigele, Wu Jie, Yang Ziyuan and Hu Qiwei.
..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Shanghai Meadville Science & Tech Co Ltd has applied Chinese patent for Chip Stacking and Packaging Structure and Chip Stacking and Packaging Method. Yan Guoqiu, Tian Hongzhou, Lei Qingman, Xiao Junqi, Zhuang Zhihong, Xie Zhudong and Wang Xiaoben developed it.
The patent application number is CN20261052305..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Yixin Micro Semiconductor Tech Shenzhen Co Ltd has submitted a patent application for Self-alignment Bonding Method and System for TSV (Through Silicon Via) and Chip Micro Bump of Cowos-l Packaging Interposer. This invention was developed by Li Li, Zhang Renfu, Luo Wangbao, Meng Junyu, Zhou Yongqiang and Wang..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Industrial Technology Research Inst has filed a patent application for Semiconductor Module Packaging Structure. This invention was developed by Wu Shixian and Hong Zongyi.
The patent application number is CN20251027743 20250108. The patent publication number is CN122396350 (A). International Patent Classi..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Shanghai Ju Yue Electronics Co Ltd has sought patent for Local Thinning Method for Polyimide Layer in Chip Scale Packaging Structure. This invention was developed by Shang Yue and Li Xin.
The patent application number is CN202610492938 20260415. The patent publication number is CN122396346 (A). Internation..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has published Yangzhou Yangjie Electronic Technology patent application for Low-stress High-thermal-conductivity Photovoltaic Bypass Conductive Assembly, Diode and Preparation Method of Low-stress High-thermal-conductivity Photovoltaic Bypass Conductive Assembly. Th..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Suzhou Hengzhuo Prec Machinery Co Ltd has submitted a patent application for Ball Taking Device of Magnetic Attraction Turnover Type Ball Mounter. This invention was developed by Qi Lijuan, Zhang Daidi, Wang Hongwei and Xu Shihui.
The patent application number is CN202610511993 20260417. The patent publica..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Suzhou Hengzhuo Prec Machinery Co Ltd has submitted a patent application for Turnover Ball Taking Device for Semiconductor Ball Mounter. This invention was developed by Qi Lijuan, Zhang Daidi, Wang Hongwei and Xu Shihui.
The patent application number is CN202610511637 20260417. The patent publication numbe..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Beijing Xinli Tech Innovation Center Co Ltd has applied Chinese patent for Method for Manufacturing Advanced Packaged Semiconductor Device and Advanced Packaged Semiconductor Device. Liu Kuo, Han Jianzhong and Xu Peng developed it.
The patent application number is CN202610504104 20260416. The patent public..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has released Guangdong Quanxin Semiconductor Co Ltd patent application for Ultra-thin Emmc Packaging Structure of Embedded Main Control Chip and Preparation Method of Ultra-thin Emmc Packaging Structure. This invention was developed by He Wanting, Li Jinguang and Zh..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Shanghai Xianfeng Tech Co Ltd has sought patent for Semiconductor Structure, Forming Method Thereof and Packaging System. This invention was developed by Chen Junhong, Ke Kunteng, Lin Zhengyi, Chen Zhihui, Gao Yongqiang, Tang Xinlu, Li Jingpei and Lai Junhong.
The patent application number is CN20261033589..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Wuhan Xinxin Semiconductor has sought patent for Frame Unit, Lead Frame, Packaging Structure and Manufacturing Method Thereof. This invention was developed by Wu Zhiyan, Pan Zhigang and Shi Tianfu.
The patent application number is CN202610596516 20260430. The patent publication number is CN122396321 (A). I..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Fujian Fushun Microelectronics Co Ltd has sought patent for Silicon Substrate Heteroepitaxial Layer Monitoring Method and Structure. This invention was developed by Zheng Yi, Lin Ligui, Xiong Aihua and Mei Haijun.
The patent application number is CN202610512840 20260417. The patent publication number is CN..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Liankang Woyuan Electronic Jiashan Co Ltd has filed a patent application for Wafer Thinning, Cutting and Packaging Automatic Processing Device. This invention was developed by Lu Yuyuan.
The patent application number is CN202610340993 20260319. The patent publication number is CN122396278 (A). Internationa..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has received Shenyang Heyan Tech Co Ltd patent application for Calibration Method and Device, Electronic Equipment and Semiconductor Cutting Equipment. Lin Yaokun, Chen Qiang, Chen Hongbiao, Sun Hongbiao, Wu Xuebin, Yu Huping, Yuan Huizhu and Zhang Mingming develope..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Taizhou Wangling Insulating Mat Factory has submitted a patent application for Conveying Device for Semiconductor Circuit Substrate Processing. Wang Gang, Shen Zhenchun, Zhang Shiqiang, Zhang Yan and Jiang Wen developed the invention.
The patent application number is CN202610848854 20260612. The patent pub..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Xinsheng Semiconductor Tech Shanghai Co Ltd has applied Chinese patent for Material Box Supply Mechanism of Semiconductor Chip Packaging Equipment. Zhu Qinghui and Hu Rong developed it.
The patent application number is CN202610563835 20260427. The patent publication number is CN122396265 (A). International..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has received Qingdao Desheng Yinghe Prec Machinery Co Ltd patent application for Semiconductor Precision Substrate Air Floatation Transmission System and Positioning Method. Niu Ming developed the invention.
The patent application number is CN202610545692 2026042..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Baishiwei Electronic Industry Tech Suzhou Co Ltd has filed a patent application for Fragile Wafer Automatic Arrangement Machine Using Magnetic Force to Assist Orientation. This invention was developed by Lyu Xiaofeng, Hu Gaoshang and Feng Zhenyu.
The patent application number is CN202610511459 20260417. Th..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Gudeng Prec Industral Co Ltd has submitted a patent application for Substrate Transfer Method and System. This invention was developed by Qiu Mingqian, Li Baiting and Pan Yongjin.
The patent application number is CN202610467018 20260410. The patent publication number is CN122396260 (A). International Paten..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Hefei Qiangyou Tech Co Ltd has submitted a patent application for Tray Capable of Rapidly Placing IC Chip. Chen Jianhong, Chen Huizhen, Chen Yixuan, Wang Yukai and Chen Yinzhen developed the invention.
The patent application number is CN202610532662 20260421. The patent publication number is CN122396257 (A..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has received Nantong Qinwei Semiconductor Tech Co Ltd patent application for Semiconductor Packaging Carrier Tape Structure Capable of Preventing Chip from Jumping and Being Scratched and Forming Method of Semiconductor Packaging Carrier Tape Structure. Liu Zhiqing ..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Jiangsu Wuxi Jingwei Tiandi Semiconductor Tech Co Ltd has applied Chinese patent for Process Cavity Inflation Control Method of Process Cavity and Semiconductor Process Equipment. Liang Defu developed it.
The patent application number is CN202610873557 20260617. The patent publication number is CN122396255..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has received Aikesi Holding Beijing Co Ltd patent application for Manipulator Scheduling Method and Device in Semiconductor Cleaning Equipment. Liu Bin, Zhu Donghe, Fu Huichu, Zhu Kuan and Fu Jinchao developed the invention.
The patent application number is CN202..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Shanghai Cheyitian Technology has submitted a patent application for Semiconductor Etching Process Monitoring Method, Device and System and Electronic Equipment. This invention was developed by Zhang Nannan.
The patent application number is CN202610848019 20260612. The patent publication number is CN122396..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Suzhou Baoshiman Semiconductor Equipment Co Ltd has applied Chinese patent for Thin Film Stripping Device, Semiconductor Sintering Mold and Sintering Method. Zhang Chenchen, Wang Lingen, Chen Pengfei, Jin Renliang, Tian Tiancheng and Gao Zhexuan developed it.
The patent application number is CN202610837493..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Haixiang Tech Co Ltd has filed a patent application for Etching Machine for Chip Processing. This invention was developed by Wang Qiangsheng, Wang Qilin, Zhang Xiong and Wang Tingyun.
The patent application number is CN202610524712 20260420. The patent publication number is CN122396247 (A). International P..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Jiangyin Ace Elect Equip Co Ltd has submitted a patent application for Full-automatic Tray Disc Chip Detection Equipment and Detection Method. This invention was developed by Ma Haofeng, Huang Yu, Zhang Song, Shi Wenjun, Xue Jing, Wu Bing, Chen Huifeng and Wu Zhongqi.
The patent application number is CN202..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has released Anhui Fosan Semiconductor Tech Co Ltd patent application for Dispensing and Packaging Equipment for Discrete Semiconductor Device. This invention was developed by Yan Rongqiang, Guo Yangui and Zhou Haisheng.
The patent application number is CN2026104..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Guangdong Xincheng Hanqi Semiconductor Tech Co Ltd has submitted a patent application for Wafer Laser Cutting Protection Method and Wafer Laser Cutting Method. This invention was developed by Zhu Kai, Han Lei and Kasuke.
The patent application number is CN202610389558 20260327. The patent publication numbe..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Anhui Huaxin Micro Nano Integrated Circuit Co Ltd has sought patent for Method for Protecting Wafer in Bulk Silicon Wet Etching Process. This invention was developed by Li Zhichao.
The patent application number is CN202610503702 20260416. The patent publication number is CN122396230 (A). International Pate..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Suzhou Laboratory has applied Chinese patent for Nanoscale Memristor Unit and Preparation Method Thereof, Nanoscale Memristor Array and Preparation Process Thereof, Storage and Calculation Integrated Chip and Application Thereof. Yang Yalin, Yang Ying, Gu Hong and Xu Wentao developed it.
The patent applica..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Beijing Innomem Tech Co Ltd has filed a patent application for Structure and Material of Rram Memory Device and Preparation Process Thereof. This invention was developed by Pan Xiongbo and Wang Kun.
The patent application number is CN202610464915 20260409. The patent publication number is CN122396214 (A). ..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Origin Quantum Computing Technology Hefei Co Ltd has submitted a patent application for Circuit Preparation Method, Quantum Device and Superconducting Quantum Chip. This invention was developed by Jia Zhilong and Yang Hui.
The patent application number is CN202511842683 20251209. The patent publication num..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Institute of Semiconductors, Chinese Academy of Sciences has sought patent for Magnetic Tunnel Junction Logic Device and Magnetic Tunnel Junction Logic Device Array. This invention was developed by Zhu Lijun and Liu Qianbiao.
The patent application number is CN202610838478 20260611. The patent publication ..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Shanghai New Silicon Polymer Semiconductor Co Ltd has submitted a patent application for Wafer Planarization Method and Semiconductor Substrate. This invention was developed by Huang Kai.
The patent application number is CN202610412652 20260331. The patent publication number is CN122396205 (A). Internation..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has received Shanghai New Silicon Polymer Semiconductor Co Ltd patent application for Wafer Surface Processing Method and Semiconductor Substrate. Huang Kai developed the invention.
The patent application number is CN202610414828 20260331. The patent publication ..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has received Huaneng Qinghai Power Generation Co Ltd and Huaneng Clean Energy Research Inst patent application for Production System and Method for Monitoring Perovskite Solar Cell on Line. Xiong Jiguang, Li Mengjie, Zhang Yun, Qin Xiaojun, Zhao Zhiguo, Xiao Ping, X..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has released Huaneng Clean Energy Research Inst and Huaneng Renewables Corp Ltd patent application for Perovskite Solar Cell Preparation Method Based on Mos2-cspbbr3 Heterogeneous Interface and Device. This invention was developed by Chen Xiangbao, Wang Sen, Zhang Y..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has released Sandieji Guangdong Tech Co Ltd and Sandieji Sichuan Tech Co Ltd patent application for Preparation Method and Device of TGV Glass Substrate. This invention was developed by Li Shan, Li Shuang, Li Borui, Dong Shuyin, Qiu Lei, Li Wenlei, Xue Sen, Cai Xing..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Zhongshan Xincheng Semiconductor Co Ltd has submitted a patent application for Manufacturing Method and Structure of Composite Organic Packaging Substrate with Glass Core Added Layer. This invention was developed by Xu Qiang, Huang Xiaodong and Gu Xin.
The patent application number is CN202610307432 202603..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Jiangsu Maxscend Microelectronics Co Limited has filed a patent application for Manufacturing Method of Semiconductor Structure and Semiconductor Structure. This invention was developed by Xu Chaosheng, Zhao Xingen, Ye Shifen, Sun Duo, Huang Wenjie and Zhang Wenxing.
The patent application number is CN2025..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Guangdong Cheng Li Tai Tech Co Ltd has submitted a patent application for Precision Micro MBL Bridge Rectifier Production Equipment and Method Based on Chip Combination Packaging. Xu Qian, Hong Jihong and Hong Jizhong developed the invention.
The patent application number is CN202610529382 20260421. The pa..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has received Guangdong Quanxin Semiconductor Co Ltd patent application for Heat Dissipation EMMC Packaging Structure. He Wanting, Li Jinguang and Zhao Chunban developed the invention.
The patent application number is CN202610494290 20260415. The patent publicatio..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Beijing Ziyixin Integrated Circuit Co Ltd has submitted a patent application for Glass-based High-heat-dissipation Conduction Material and Chip Interconnection Packaging Process. This invention was developed by Huang Zhangbin and Yang Weiyuan.
The patent application number is CN202610523276 20260420. The p..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has released Jiangsu Vocational College of Information Technology patent application for Fan-out Type Packaging Structure Integrated with Embedded Type Heat Dissipation Limiting Frame and Preparation Method of Fan-out Type Packaging Structure. This invention was dev..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Suzhou Junhua Semiconductor Tech Co Ltd has submitted a patent application for Independent Chip Radiator and Preparation Method and Packaging Assembly Thereof. This invention was developed by Feng Kanning, Bao Jie, Chen Hongwen, Chen Chao and Liu En.
The patent application number is CN202610531017 20260421..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Yirui Imaging Tech Hefei Co Ltd has applied Chinese patent for Manufacturing Method of Aluminum-copper Alloy Interconnection Structure, Interconnection Structure and Semiconductor Device. Zhao Peng, Deng Jiachun and Dong Hui developed it.
The patent application number is CN202610358457 20260323. The patent..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Tianma New Display Technology Research Inst Xiamen Co Ltd has applied Chinese patent for Display Panel and Display Device. Jiang Wenxin, Wu Tianyi, Zhai Yingteng, Hu Yuqi and Xie Mengmeng developed it.
The patent application number is CN202610607589 20260430. The patent publication number is CN122396171 (A..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Ningbo Jinshengxin Image Tech Co Ltd has submitted a patent application for OLED Chip Packaging Structure. Gou Pengfei and Long Xiangli developed the invention.
The patent application number is CN202610316479 20260316. The patent publication number is CN122396160 (A). International Patent Classification co..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has released Shenzhen Xihe Solar Energy Co Ltd patent application for Carbon-based Perovskite Solar Cell Module, Solar Cell System and Application. This invention was developed by Fan Xinchuan, Liu Fang, Wei Xiaozhen, Zhang Kai, Liu Zhenxing, Wang Anle and Yang Shih..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Shenzhen Xihe Solar Energy Co Ltd has sought patent for Perovskite Solar Cell and Preparation Method and Application Thereof. This invention was developed by Fan Xinchuan, Liu Fang, Wei Xiaozhen, Zhang Kai, Liu Zhenxing, Wang Anle and Yang Shihe.
The patent application number is CN202610288014 20260310. Th..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Guangdong Hengqin Xinqiao Liandong Tech Co Ltd has applied Chinese patent for Micro Light-emitting Chip and Manufacturing Method Thereof. Cao Liang, Wu Dongling, Kang Yi and Xia Kairui developed it.
The patent application number is CN202610486695 20260414. The patent publication number is CN122396136 (A). ..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Xinping Semiconductor Shenzhen Co Ltd has submitted a patent application for Micro-led Wafer Structure and Preparation Method Thereof. Xu Benbo and Liao Yating developed the invention.
The patent application number is CN202610514956 20260417. The patent publication number is CN122396127 (A). International ..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Great Bay Area Univ has submitted a patent application for High-polarizability Circularly Polarized Light Emitting Diode and Preparation Method and Application Thereof. This invention was developed by Su Qiang and Xia Yuanjie.
The patent application number is CN202610284368 20260310. The patent publication..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Inst Advanced Technology Univ Science & Technology China has applied Chinese patent for Deposition Post-processing Method of Antimony Selenide Thin Film and Solar Cell. Chen Ruizhe developed it.
The patent application number is CN202610295306 20260311. The patent publication number is CN122396086 (A). Inte..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Guangzhou Guangda Innovation Tech Co Ltd has applied Chinese patent for Vertical Stacked Image Sensor Responding to Multiple Wavebands. Dong Sheng, Yang Xiye and Yu Gang developed it.
The patent application number is CN202610547489 20260423. The patent publication number is CN122396081 (A). International P..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has received Beijing Inst Technology patent application for Hyperspectral Quantum Dot Image Sensor with In-pixel Reconfigurable Energy Band Alignment. Bi Cheng, Zou Jintao, Tang Xin, Zhou Yaoqiang, Motai Yasuyasu and Mou Ge developed the invention.
The patent app..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has published Shenzhen Xintu Zhigan Tech Co Ltd patent application for Charge Domain Global Exposure Pixel Structure, Image Sensor, Manufacturing Method and Working Method. The invention was developed by Wang Fei, Hu Weihan, Wang Jianghua and Qu Zheng.
The patent..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Zhuiguang Biotechnology Shenzhen Co Ltd has sought patent for Array Type Photoelectric Tweezer Chip and Manufacturing Method Thereof. This invention was developed by Liu Jing, Xie Hainan and Xie Wei.
The patent application number is CN202610378280 20260326. The patent publication number is CN122396078 (A)...
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Geke Semiconductor Shanghai Co Ltd has filed a patent application for Image Sensor and Preparation Method for Improving Yield of Image Sensor. This invention was developed by Chen Lin and Wang Shaowei.
The patent application number is CN202610569987 20260427. The patent publication number is CN122396077 (A..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Huawei Technologies has submitted a patent application for Chip, Preparation Method Thereof and Electronic Equipment. This invention was developed by Zhang Min, Li Hao and Zhang Heng.
The patent application number is CN20251060162 20250113. The patent publication number is CN122396047 (A). International Pa..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Ningbo Inst Of Fudan University has filed a patent application for Silicon Carbide CMOS Integrated Circuit Structure. This invention was developed by Yang Mingze, Li Shidan, He Xuanting, Zuo Yuanhui, Sun Botao and Lei Guangyin.
The patent application number is CN202610830544 20260610. The patent publicatio..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has received Xiaomi Intelligent Home Appliance Wuhan Co Ltd, Beijing Xiaomi Mobile Software and Xiaomi Technology, Wuhan patent application for Semiconductor Circuit, Electric Control Board and Air Conditioner. Shan Lianyu, Cai Hongliang and Wen Jian developed the i..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has published Huahong Semiconductor Mfg Wuxi Co Ltd, Shanghai Huahong Grace Semiconductor Manufacturing Corporation and Huahong Semiconductor, Wuxi patent application for Planar Gate Power Device and Manufacturing Method Thereof. The invention was developed by Yang ..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has published Suzhou Longchi Semiconductor Tech Co Ltd patent application for Ohmic Contact Structure of Semiconductor Device and Preparation Method Thereof. The invention was developed by Gao Xiuxiu.
The patent application number is CN202610833283 20260610. The ..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Zhejiang Zhengbang Electronic Co Ltd has sought patent for Thyristor Cathode Structure with Composite Gradient Short Circuit Point and Preparation Method Thereof. This invention was developed by Geng Kaiyuan, Liu Jiqing, Li Youkang, Chen Fanrong, Zhang Hongchao and Li Xiaoming.
The patent application numbe..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has published Guangdong Brightking Electronic Co Ltd patent application for Composite Thermal Oxidation and Plasma Passivation Process for Suppressing Leakage Current of Silicon Wafer Body. The invention was developed by Guo Shuai, Yu Cailin and Deng Yulong.
The ..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has received Beijing Chaoxian Memory Research Inst patent application for Semiconductor Structure, Manufacturing Method Thereof and Electronic Equipment. Wang Guilei, Li Gengfei, Lyu Haochang, Dong Shucheng and Dong Bowen developed the invention.
The patent appli..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has published Beijing Chaoxian Memory Research Inst patent application for Semiconductor Structure, Manufacturing Method Thereof and Electronic Equipment. The invention was developed by Ding Yaxin, Wang Guilei, Li Gengfei, Lyu Haochang, Dong Shucheng and Dong Bowen...
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- State Intellectual Property Office of China has received Huahong Semiconductor Mfg Wuxi Co Ltd patent application for Preparation Method of Flash Memory Device. Yu Tao, Shi Qingye, Ruihuan Wang, Zhu Jianbin and Yu Peng developed the invention.
The patent application number is CN202610352447 20260320. The p..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Suzhou R&d Center Of No 214 Research Inst Of China North Industries Group Corporation has sought patent for Method for Packaging Electric Signal Leading-out End of Miniature Ceramic-based High-power Heating Type Chip Device. This invention was developed by Zhao Yi, Zhang Tianjun, Liu Xiaoqing, Li Ran and Yang..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Jiangxi Bowei Tech Co Ltd has sought patent for Automatic Immersion Cleaning Equipment for PCB Manufacturing. This invention was developed by Shao Fushu and Zhou Huahong.
The patent application number is CN202610756670 20260529. The patent publication number is CN122395844 (A). International Patent Classif..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Sichuan Meijiesen Circuit Tech Co Ltd has submitted a patent application for Method for Pasting Heat-conducting Ceramic Chip on High-frequency Circuit Board. This invention was developed by Peng Chuan, Tian Fei, Tan Haibo, Feng Hongyan, Chen Ming, Tang Qingjun and Peng Xuemin.
The patent application number..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 30 -- Shenzhen Huayue Semiconductor Co Ltd has secured a patent on Electronic Watch Changing Along with Rhythm of Sound. Pan Huajin developed the invention.
The patent application number is CN202520652684U 20250409. The patent publication number is CN223926774 (U). International Patent Classification codes are F..
Semiconductor
| Sat 31 Oct 2026
Beijing, Oct. 30 -- Anhui Songyu Semiconductor Tech Co Ltd has filed a patent application for Gas-solid Closed Fluidized Reactor. This invention was developed by Wu Hailong, Zhang Binbin and Bao Xuesong.
The patent application number is CN202610434461 20260403. The patent publication number is CN122399681 (A). International P..
1
to
100 of
1866 Items
Next >>
![Close [X]](../images/close.gif){kind=small}
![Close [X]](https://www.globalipnews.com/images/close.gif){kind=small}
