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Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- SK Hynix Memory Solutions Inc has submitted a patent application for Apparatus and Method for Improved Workload Balancing for Handling Bandwidth Allocation. This invention was developed by Rouby Patrice, Sebastian Tomy, Goletz Michael and Pelster David J.
The patent application number is CN20248081602 2024..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Medix Pty Limited has submitted a patent application for Novel Silicon Smelting Method. This invention was developed by Heldenhuis Ivo J, Rao Subramanya Chandra and Moorman William D.
The patent application number is CN20248052829 20240918. The patent publication number is CN122459637 (A). International Pa..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has released Tyco Electronic Corp patent application for Crimping Type Power Semiconductor Device with Positioning Belt. This invention was developed by Jayo Joseph and Spann Thomas.
The patent application number is CN20248082900 20241203. The patent publication ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- IPS Ltd has filed a patent application for Substrate Processing Apparatus. This invention was developed by Xu Gangxuan, Wi Kyu Yong and Son Byoungkuk.
The patent application number is CN20248079379 20241127. The patent publication number is CN122459497 (A). International Patent Classification codes are C23..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Friedrich Alexander Univ T Erlangen NU Rnberg has filed a patent application for Contact Device, Heating Conductor Holding Device, Device and Method for Coating a Substrate by Means of CVD. This invention was developed by Komma Jarmo, Rosiwal Sunil, Helmreich Thomas, Neuner Karen and Reichelt Helmut.
The p..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has published SK Mat Co Ltd patent application for Method for Depositing Silicon Oxide Thin Film on Semiconductor Substrate and Method for Manufacturing Semiconductor Device Including Same. The invention was developed by Lee Jin-hee, Lee Ji-hoon, Kwak Jung-hun and K..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Meere Co has submitted a patent application for Spindle Unit and Wafer Processing Device Comprising Same. This invention was developed by Kang Zhiyong, Kang Suk-joong and Yu Sang-tack.
The patent application number is CN20248081438 20241107. The patent publication number is CN122459113 (A). International P..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has released SWM Luxembourg Holding SARL patent application for Filter Comprising Fibrous Substrate Comprising Base Web Having Perforated Through-holes. This invention was developed by Guilchette Patrick and Blin Thomas.
The patent application number is CN2024808..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has released Shanghai Yaogan Tech Co Ltd patent application for Heterogeneous Bare Chip Integrated Structure with Graphical Bonding Layer and Manufacturing Method Thereof. This invention was developed by Han Yinan.
The patent application number is CN202610518403 ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has published Shenzhen Founder Microelectronics Co Ltd patent application for Manufacturing Method of Solder Resist Structure of Homogeneous Interlayer Step and Semiconductor Device. The invention was developed by Deng Jiangtao, Li Rudong, Lai Wangkun, Hu Qiaoling a..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Yangtze Memory Holdings Co Ltd has filed a patent application for Semiconductor Device and Preparation Method Thereof, Semiconductor Packaging Structure and Storage System. This invention was developed by Pan Zhen, Liu Xiaoxin, Miao Lina, Wen Min and Xiao Liang.
The patent application number is CN202510588..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Shenzhen Founder Microelectronics Co Ltd has applied Chinese patent for Connection Bridge for Chip Surface Welding and Power Module. Zhao Chong developed it.
The patent application number is CN202610736069 20260526. The patent publication number is CN122458807 (A). International Patent Classification codes..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has received Xifei Interconnect Holdings Ltd patent application for Direct Connection Type Semiconductor Packaging Substrate and Packaging Method. Zhang Zhejia developed the invention.
The patent application number is CN202610512716 20260417. The patent publicati..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Jiangsu Punuowei Electronic Co Ltd has submitted a patent application for System-in-package Substrate and Processing Method Thereof. Ma Hongwei, Kang Soo Bok, Wu Qi, Lei Yujie and Yin Zuying developed the invention.
The patent application number is CN202610826802 20260609. The patent publication number is ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Chip Carrier Plate and Preparation Method Thereof, and Chip Packaging Structure. This invention was developed by Li Lianyue and Zhou Yanxu.
The patent application number is CN202610560387 20260424. The patent publication number is..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Hangzhou Xinyu Semiconductor Co Ltd has submitted a patent application for Method and Device for Manufacturing Through Hole of Insulating Substrate. Wang Yu and Guo Ran developed the invention.
The patent application number is CN202510692227 20250527. The patent publication number is CN122458797 (A). Inter..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has published Hangzhou Xinyu Semiconductor Co Ltd patent application for Interconnection Substrate Manufacturing Method. The invention was developed by Zheng Jianhua and Guo Ran.
The patent application number is CN202510242055 20250303. The patent publication num..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has received Hangzhou Xinyu Semiconductor Co Ltd patent application for Interconnection Substrate Manufacturing Method. Zheng Jianhua and Guo Ran developed the invention.
The patent application number is CN202510242053 20250303. The patent publication number is C..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has released Hangzhou Xinyu Semiconductor Co Ltd patent application for Manufacturing Method of Interconnection Substrate. This invention was developed by Guo Ran.
The patent application number is CN202510115483 20250124. The patent publication number is CN122458..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Hangzhou Xinyu Semiconductor Co Ltd has sought patent for Manufacturing Method of Interconnection Substrate. This invention was developed by Guo Ran.
The patent application number is CN202510115482 20250124. The patent publication number is CN122458793 (A). International Patent Classification codes are H10..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has received Liding Semiconductor Tech Shenzhen Co Ltd and Liding Semiconductor Tech Qinhuangdao Co Ltd patent application for Package Substrate and Manufacturing Method Thereof. Zhang Mingyu and Wu Peicheng developed the invention.
The patent application number ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Shgenzhen Zhongke Sihe Tech Co Ltd has sought patent for Power Chip Packaging Structure and Manufacturing Method Thereof. This invention was developed by Luo Xudong and Shao Dongdong.
The patent application number is CN202610906567 20260623. The patent publication number is CN122458790 (A). International P..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Shanghai Guoxiao Ind Co Ltd has submitted a patent application for Heat Dissipation Device for Coating Chip of Integrated Circuit and Use Method of Heat Dissipation Device. Zhong Muquan developed the invention.
The patent application number is CN202610615494 20260507. The patent publication number is CN122..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has received Harbin Inst Of Technolog, Henan Tanzhen Core Material Tech Co Ltd and Harbin Inst Of Technology Zhengzhou Advanced Research Inst patent application for Diamond-based Gallium Nitride Composite Substrate with Phonon Engineering Interface and Preparation M..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Shenzhen Kemosi Intelligent Tech Co Ltd has sought patent for Intelligent Storage Chip Packaging Defect Classification Method Based on Machine Vision. This invention was developed by Xia Junjie and Deng Haibin.
The patent application number is CN202610759289 20260529. The patent publication number is CN122..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- KC Tech Co Ltd has submitted a patent application for Substrate Support Device Comprising Clamping Pin. This invention was developed by Son Jun-ho and Min Jun-sik.
The patent application number is CN202610594692 20260430. The patent publication number is CN122458744 (A). International Patent Classification..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Shenzhen Bochuang Jingcai Tech Co Ltd has applied Chinese patent for Automatic Conveying Device for Chip Production. Luo Shengsheng and Ma Junping developed it.
The patent application number is CN202610604199 20260506. The patent publication number is CN122458738 (A). International Patent Classification co..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has received Kunshan Xinwulian Electronic Communications Co Ltd patent application for External Clamp Mechanism on Two Sides of Wafer Carrier. Liao Hongwen and Yang Anguang developed the invention.
The patent application number is CN202610594324 20260430. The pat..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Shanghai Atom Qizhi Semiconductor Equipment Co Ltd has submitted a patent application for Process Window Judgment Method, Semiconductor Processing Method and Device. This invention was developed by Huang Yunwen and Pan Yang.
The patent application number is CN202610946404 20260629. The patent publication n..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Tianjin Beisiran Tech Co Ltd has filed a patent application for Semiconductor Chip Packaging Chip Mounter. This invention was developed by He Zhanwen and Yang Mei.
The patent application number is CN202610615669 20260507. The patent publication number is CN122458729 (A). International Patent Classification..
Semiconductor
| Sat 14 Nov 2026
Seoul, Nov. 13 -- Chempole Co Ltd has filed a patent application for Materials for Semiconductor Patterning. This invention was developed by Choi Sang Jun.
The patent application number is KR20230119451 20230908. The patent publication number is KR20250037080 (A). International Patent Classification codes are C08K5/00, C08L65..
Semiconductor
| Sat 14 Nov 2026
Seoul, Nov. 13 -- Shin Woong Chul has filed a patent application for the Semiconductor Package and the Manufacturing Method Thereof.
The patent application number is KR20230118821 20230907. The patent publication number is KR20250036985 (A). International Patent Classification codes are H05K1/18 and H10W70/40. Cooperative Pa..
Semiconductor
| Sat 14 Nov 2026
Seoul, Nov. 13 -- Lot Ces Co Ltd has submitted a patent application for Exhaust Gas Pretreatment Equipment for Semiconductor Production Facility. This invention was developed by Lee Tae Hyung, Kim Ho Sik, Kim Hyung Jun, Bae Jin Ho, Kim Ji Young, Park Soo Jung, Kim Do Won, Choi Yon Woo and Lee Jong Taek.
The patent application..
Semiconductor
| Sat 14 Nov 2026
Seoul, Nov. 13 -- Essai Inc has submitted a patent application for Low Cross-talk Interconnection Device with Impedance-tuned Hybrid Shielding Structures for Integrated Circuit Device Test Tooling. This invention was developed by Hastings James Ray, Smith Thomas James, Fares Farokh, Ho Chee Wah, Tsui Lum Wai, Barabi Nasser, Shas..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Jiejie Semiconductor Co Ltd has been granted a patent for Copper Gap Bridge and Semiconductor Device. Xu Yuhe, Ni Liangliang, Shi Wen and Li Chengjun developed the invention.
The patent application number is CN202520352018U 20250228. The patent publication number is CN224022254 (U). International Patent Cl..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Shijiazhuang Fengce Electronic Tech Co Ltd has obtained a patent for solder ball flattening device for semiconductor packaging. This invention was developed by Gu Qingbo, Wang Shaojie and Cui Suhang.
The patent application number is CN202520197540U 20250208. The patent publication number is CN224022253 (U)..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Zhejiang Qisheng Electronic Co Ltd has obtained a patent for high-voltage mos tube with heat dissipation structure. This invention was developed by Yu Xingzhe, Chen Weizhao, Zhao Junli, Cai Nan, Su Zhonggen, Li Kunhua, Ge Junxu, Lin Meiyuan, Xu Linchao, Lin Shuting, Zhang Min, Chen Erzhen, Chen Hongming, Zhua..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Fujian Jinshi Energy Co Ltd has been granted a patent for Back Contact Solar Cell Iv Testing Device. Zhou Sihai, Huang Jiarong, Zheng Jianxiang, Zhang Jinyan and Wu Yanping developed the invention.
The patent application number is CN202423237015U 20241227. The patent publication number is CN224022237 (U). ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Haitai Precision Industry Tech Co Ltd for Clamping Tool for Semiconductor Device Production. Long Zhiqing, Jiang Wei and Pei Yanming developed the invention.
The patent application number is CN202520541536U 20250326. The patent pu..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has awarded a patent to GMC Semiconductor Technology Wuxi Co Ltd for Chuck Mechanism and Wafer Processing Equipment. Jiang Hanrong developed the invention.
The patent application number is CN202520531116U 20250325. The patent publication number is CN224022233 (U)..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Guangdong Jixin Semiconductor Co Ltd has been granted a patent for Bonding Clamp for Integrated Circuit Wire Welding Machine. This invention was developed by Chen Chuxiong and Huang Cheng.
The patent application number is CN20252074407U 20250114. The patent publication number is CN224022227 (U). Internatio..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has awarded a patent to Jiangsu Rongfang Semiconductor Tech Co Ltd for Bearing Device for Epitaxial Growth of Silicon Carbide. Liu Sen and Zhang Tingxiao developed the invention.
The patent application number is CN202520586118U 20250331. The patent publication nu..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Ningxia Huanou New Energy Tech Co Ltd has secured a patent on Silicon Wafer Inserting and Taking Device. Liu Xuecheng, Zhang Haipeng, Wu Rui, Wang Yi and Bai Dawei developed the invention.
The patent application number is CN202520421255U 20250311. The patent publication number is CN224022219 (U). Internati..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has awarded a patent to Tongfu Chaowei Suzhou Microelectronics Co Ltd for Soldering Flux Dipping Device and Chip Mounting System. Jiao Jie and Ji Honghu developed the invention.
The patent application number is CN202520704263U 20250415. The patent publication num..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Suzhou Yabohan Intelligent Tech Co Ltd has been granted a patent for Multi-station Chip Mounting Tool of Eutectic Chip Mounting Equipment. Wang Huai, Tang Yefei and Cheng Qunqun developed the invention.
The patent application number is CN202520495094U 20250320. The patent publication number is CN224022205 ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has awarded a patent to Beijing Tankeblue Semiconductor and Shenzhen Zhongtou Tianke Semiconductor Co Ltd for Defect Visual Inspection Device for Silicon Carbide Epitaxial Wafer. Zhang Bo, Guo Yu, Peng Tonghua, Yang Jian, Zeng Jiang, Sui Xu, Li Yuxin, Liu Qian, Liu ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has awarded a patent to Huayu Zhizao Shanghai New Mat Co Ltd for Ultra-thin Silicon Steel Strip Surface Defect Online Detection Device. Huang Sui developed the invention.
The patent application number is CN202520446281U 20250314. The patent publication number is ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Henan Minci Microelectronics Co Ltd has secured a patent on Winding Device of Film Casting Machine for Chip Components. Zhou Qingmei, Chen Huajin and Liu Guangyang developed the invention.
The patent application number is CN202520820374U 20250428. The patent publication number is CN224014973 (U). Internati..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has published Brookes Automation USA LLC patent application for Expandable Substrate Carrier Apparatus and Processing Apparatus Including the Same. The invention was developed by Tsang Vincent W, Mora Jorma T and Saini Kalpana.
The patent application number is CN..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has published Imax Osram Int BV patent application for Optoelectronic Semiconductor Component. The invention was developed by Reith Andreas, Listl Stefan and Zitzlsperger Michael.
The patent application number is CN20258008121 20250121. The patent publication num..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has released Xiaoguangzi Wuhan Tech Co Ltd patent application for Nonlinear Luminosity Calibration Method, Reconstruction Method, Calibration Device and Reconstruction Device of Image Sensor. This invention was developed by Hu Qinglei, Li Ning, Huang Kai and Xia Shu..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has published Cygnus Biosciences Beijing Co Ltd patent application for Automatic Focusing Method and System Based on CMOS Image Sensor. The invention was developed by Jiang Mengcheng, Jiang Feng, Zhu Jiapeng, Li Ang, He Mingbo, Li Yan and Peng Tao.
The patent app..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Ainstec Perception Intelligent Research Inst Suzhou Industrial Park Co Ltd has submitted a patent application for Microprogrammed Control Unit (MCU) and Field Programmable Gate Array (FPGA) Heterogeneous MEMS Laser Scanning System and Method and Medium. Gao Jianhui developed the invention.
The patent appli..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Wuxi Yubang Semiconductor Tech Co Ltd has sought patent for Ethernet and Serial Communication Conversion Device and Method for Semiconductor Equipment. This invention was developed by Zhu Xiang and Xie Hangcheng.
The patent application number is CN202610835662 20260610. The patent publication number is CN1..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Wuxi Winsemi Microelectronics Co Ltd has received a patent for Graded Intelligent Electronic Switch, Integrated Circuit Chip, Chip Product and Electromechanical Equipment. This invention was developed by Song Pengliang, Liu Xue and Bai Wenli.
The patent application number is CN20242385305U 20241213. The pa..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Xinyijing Tech Co Ltd for Vertical Wafer Rotating Corrosion Mechanism. Zhou Danxing developed the invention.
The patent application number is CN202620127389U 20260129. The patent publication number is CN224021703 (U). Internationa..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Zhuhai Hongjun New Energy Co Ltd has been granted a patent for Junction Box Structure, Perovskite and Crystalline Silicon Laminated Battery Assembly and Photovoltaic System. This invention was developed by Song Yuanheng, Jiang Qingtang, Zhao Qigui, Hou Hongtao, Wang Yonghong, Li Changhong, Zhang Wei and Wang ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Shanghai Faanshi Semiconductor Tech Co Ltd has been granted a patent for Novel Pushing Mechanism of Semiconductor Pressure Control Valve. This invention was developed by Qiu Yong.
The patent application number is CN202520707186U 20250414. The patent publication number is CN224017822 (U). International Pate..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has published Zhejiang Xusheng Electronic Co Ltd patent application for Ultrathin Sensor Silicon Wafer Forming Processing Device and Method. The invention was developed by Fang Xiaoming, Fang Yonghua, Dai Wenxian, Zhan Yufeng, Zhao Jiping, Chen Yuehua, Fang Zhenhong..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Zhangjiang Nat Laboratory has submitted a patent application for Glue Removing Method and System for Removing Residual Photoresist on Surface of Silicon Wafer. This invention was developed by Jin Meng and Zhu Hui'e.
The patent application number is CN202610588871 20260429. The patent publication number is ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Beijing Quantum Information Science Research Inst has applied Chinese patent for Superconducting Quantum Chip Bit Frequency Regulation and Control Method and System. Sun Weijie, Feng Yaqing, Ma Yanjun, Mi Zhenyu, Chen Mo and Yu Haifeng developed it.
The patent application number is CN202610942703 20260629...
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has published Xuancheng Advanced Photovoltaic Tech Co Ltd patent application for Perovskite Thin Film, Preparation Method Thereof and Perovskite Solar Cell. The invention was developed by Xu Jinghua, Guo Mingxuan and Bi Enbing.
The patent application number is CN..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has received Huzhou Chunhuo Photoelectric Co Ltd patent application for Broadband-gap Perovskite Solar Cell Preparation Method and Cell. Qin Jinzhao, Hou Tian, Fu Zhipeng, Jia Weikuan and Huang Yuelong developed the invention.
The patent application number is CN2..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Magnohot Co Ltd has submitted a patent application for Mother Substrate for Display Device. This invention was developed by Iwahashi Naoya, Ishikawa Tomokazu, Yanagisawa Syou and Kataoka Rena.
The patent application number is CN20261064803 20260119. The patent publication number is CN122458667 (A). Interna..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has published Nantong Leneng Electric Power Co Ltd patent application for Perovskite Cell Structure and Perovskite Crystalline Silicon Ore Laminated Cell. The invention was developed by Liu Jun, Wu Jiejin, Guo Wenfeng, Zhang Xiurong and Zhang Qinhui.
The patent a..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Luohuaxin Display Tech Development Jiangsu Co Ltd has submitted a patent application for Light-emitting Module, Detachable Light-emitting Diode Chip and Related Manufacturing Method. This invention was developed by Qu Cheng, Chen Wenjuan, Bi Cheng and Wang Bin.
The patent application number is CN2026108641..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has released Jiangxi Qianzhao Semiconductor Tech Co Ltd patent application for Led Chip and Manufacturing Method Thereof. This invention was developed by Wu Daiqiong, Yan Yufa, Gao Peng, Li Minhua, Xin Tianjiao, Han Xiaoya, Chen Ruimin, He Jian and Xu Jing.
The p..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Jiangsu Third Generation Semiconductor Research Inst Co Ltd has submitted a patent application for P-type Nitride Layer, Preparation Method Thereof and Nitride Semiconductor Device. Yan Qi'ang and Wang Guobin developed the invention.
The patent application number is CN202510109312 20250123. The patent publ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has published Jiangxi Qianzhao Photoelectric Co Ltd patent application for Led Chip and Manufacturing Method Thereof. The invention was developed by Wang Dingguo, Li Yongtong, Liu Shiwei, Li Minhua, Wu Honghao, He Jian and Liu Zhao.
The patent application number ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has released Xixian New District Branch Longji Green Energy Tech Co Ltd patent application for Solar Cell, Photovoltaic Module and Manufacturing Method of Solar Cell. This invention was developed by Li Yunpeng, Wei Junzhe, Fang Liang and Li Junyou.
The patent app..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Jinko Solar Holding Co Ltd has submitted a patent application for Solar Cell, Preparation Method of Solar Cell and Photovoltaic Module. Wang Zhao, Zhang Yuanfang, Yang Jie, Zheng Peiting and Zhang Xinyu developed the invention.
The patent application number is CN202610612245 20251210. The patent publicatio..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has received Riyuexin Advanced Tech Research Kunshan Co Ltd patent application for Packaging Structure and Packaging Method of Image Sensor Chip. Gu Jiayi and Guo Jianyun developed the invention.
The patent application number is CN202610751041 20260528. The paten..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has received Zhejiang Aiko Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Zhuhai Fushan Aixu Solar Energy Technology and Tianjin Aiko Solar Energy Technology patent application for Method for Improving Electroplating Binding Force and Battery Piece..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Hangzhou Hongpai Semiconductor Co Ltd has submitted a patent application for Gallium Nitride Epitaxial Wafer and Gallium Nitride High-electron-mobility Transistor Using Same. Huang Xu and Li Miao developed the invention.
The patent application number is CN202610926424 20260625. The patent publication numbe..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Wuxi Guangyu Electronic Tech Co Ltd has submitted a patent application for Depletion Type MOS Tube Structure with Low Pinch-off Risk and Optimization Method Thereof. This invention was developed by Guo Jin.
The patent application number is CN202610604065 20260513. The patent publication number is CN1224584..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has published State Grid Gansu Electric Power Co Electric Power Research Institute, Beijing Smartchip Microelectronics Technology Co Limited and State Grid Gansu Electric Power patent application for Super Junction Semiconductor Device and Manufacturing Method. The ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has received Yangzhou Yangjie Electronic Technology and Yangzhou Jieguan Microelectronics Co Ltd patent application for High-voltage Silicon Carbide MOS Device with ESD Protection Structure and Manufacturing Method. Chen Runsheng, Wang Yi, Liang Yao, Wang Yanan and ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Huahong Semiconductor Mfg Wuxi Co Ltd has submitted a patent application for Method for Improving Polycrystalline Silicon Etching Residues. This invention was developed by Yu Tao, Feng Yuyan, Shi Qingye, Ruihuan Wang, Zhou Jiacheng and Yu Peng.
The patent application number is CN202610667626 20260514. The ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has released Huahong Semiconductor Mfg Wuxi Co Ltd patent application for Manufacturing Method of Semiconductor Device and Semiconductor Device. This invention was developed by Hu Bingzhou, Wu Zijie, Li Kunle and Ma Zicheng.
The patent application number is CN202..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Suzhou Zhongnuo Electronic Tech Co Ltd has submitted a patent application for Feeding System of Chip Mounter and Operation Method of Feeding System. This invention was developed by Li Peiji.
The patent application number is CN202610588373 20260430. The patent publication number is CN122458399 (A). Internat..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Geke Semiconductor Shanghai Co Ltd has submitted a patent application for Working Signal Acquisition Method of Semiconductor Machine and Semiconductor Machine. This invention was developed by Xu Tingfeng, Wu Zhengpeng and Chen Mianfeng.
The patent application number is CN202510104146 20250122. The patent p..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Power Logics Co Ltd has sought patent for Substrate Assembly Manufacturing Method. This invention was developed by Shin Doo-sik, Im Hee-chul, Kim Young-jin, Jang Dong-hoon and Hwang Ji-young.
The patent application number is CN20261064295 20260119. The patent publication number is CN122458337 (A). Internat..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Shenzhen Xiangshengxing Tech Co Ltd has submitted a patent application for Circuit Board Substrate Feeding Structure and Etching Equipment. This invention was developed by Tang Mingsong and Xu Yanchun.
The patent application number is CN202610732571 20260526. The patent publication number is CN122458331 (A..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Zhejiang Wanyu Photoelectric Tech Co Ltd has applied Chinese patent for Vehicle Lamp Control System and Method Based on Priority and Step-down Chip. Jin Jiawei and Chen Yao developed it.
The patent application number is CN202610685987 20260519. The patent publication number is CN122458283 (A). Internationa..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Xinyuanchuang Tech Shenzhen Co Ltd has submitted a patent application for Load and Dimming Compensation Circuit for Led Driving Chip. This invention was developed by He Guanyuan, Xu Yuanzhe, Huang Yiping and Huang Chaowu.
The patent application number is CN202610546766 20260423. The patent publication numb..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has published Jiyun Zhihe Tianjin Tech Co Ltd patent application for Nanometer Transparent Semiconductor Electric Heating Structure, Preparation Method and Semiconductor Electric Heating Module. The invention was developed by Tian Xiaoxi, Jia Cheng and Zhang Zhuo.
..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has published Fenglei Artificial Intelligence Tech Shanghai Co Ltd patent application for UWB Digital Key Ranging and Living Radar Coexisting MAC Scheduling Compiling Method and Device, Chip and Medium. The invention was developed by Lyu Lei.
The patent applicati..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Gechuang Communication Zhejiang Co Ltd has sought patent for Chip Rapid Reset Method and Programmable Distributed Network Chip. This invention was developed by Luo Bin and He Xianling.
The patent application number is CN202610903275 20260623. The patent publication number is CN122457570 (A). International ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Chinese Patent for Light-emitting Module and Light-emitting Device has been issued to Shenzhen Xunguang Technology. This invention was developed by Huang Wei, Cao Yuxing, Li Xiangyang and Yang Daoqun.
The patent application number is CN202520626312U 20250403. The patent publication number is CN224022185 (U..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Shenzhen Xunguang Technology has obtained a patent for light emitting device. This invention was developed by Huang Wei, Cao Yuxing, Yang Daoqun and Li Xiangyang.
The patent application number is CN202520626347U 20250403. The patent publication number is CN224022182 (U). International Patent Classification..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Shenzhen Xunguang Technology has been granted a patent for Light Emitting Device. Huang Wei, Cao Yuxing, Li Xiangyang and Yang Daoqun developed the invention.
The patent application number is CN202520626327U 20250403. The patent publication number is CN224022181 (U). International Patent Classification cod..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Chinese Patent for Epitaxial Wafer for Improving Current Expansion has been issued to Hunan Lanxin Microelectronic Tech Co Ltd. This invention was developed by Zhu Shuai, Yang Yunfeng, Tan Xiangwang and Zhou Ying.
The patent application number is CN202520206008U 20250210. The patent publication number is C..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has awarded a patent to Xiamen Sitan Integration Tech Co Ltd for Chip Cleaning Jig and Chip Cleaning Device. Peng Hu, Wu Yongbo and Chen Yigong developed the invention.
The patent application number is CN202520309770U 20250225. The patent publication number is CN..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has awarded a patent to GCL System Integration Technology and Hefei GCL System Integration New Energy Technology for Connection Structure for Solar Cell String. Zhang Luo, Sun Guoliang and Huang Gengwen developed the invention.
The patent application number is CN..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- State Intellectual Property Office of China has awarded a patent to Zhongshan Huagong Tech Co Ltd for High-precision Storage Chip Pin Alignment Tool. Long Hongxin, Long Xiyu, Long Qi and Zhao Yan developed the invention.
The patent application number is CN20252130027U 20250523. The patent publication numbe..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Jiangsu Discover Prec Machinery Co Ltd has secured a patent on Feeding Device of Circuit Board Chip Mounter. Hao Jing developed the invention.
The patent application number is CN202520692446U 20250414. The patent publication number is CN224022132 (U). International Patent Classification code is H05K13/02. ..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Chengdu Weikete Electronic Co Ltd has received a patent for High-speed Pick-and-place Head Structure of SMT Chip Mounter. This invention was developed by Wu Yonghui and Chen Daquan.
The patent application number is CN202520689632U 20250414. The patent publication number is CN224022131 (U). International Pa..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Kunshan Huitao Machinery Tech Co Ltd has been granted a patent for Aluminum Substrate Feeding Mechanism. This invention was developed by Zhang Xiaoxuan and Zhang Xiang.
The patent application number is CN20252066841U 20250113. The patent publication number is CN224022127 (U). International Patent Classific..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Hefei Science Zhikong Tech Co Ltd has sought patent for Dual-channel Chip Module Based on Edge Computing and Cloud Collaboration and Control Method. This invention was developed by Shen Zhiwei, Liu Nian, Hua Liping, Xue Zhongming, Zhu Pengfei, Li Xuefeng, Wang Gan, Li Daolong and Li Yu.
The patent applicat..
Semiconductor
| Fri 13 Nov 2026
Beijing, Nov. 13 -- Power Home Scientific and Tech Co Ltd has obtained a patent for fixing structure for electronic device and chip package. This invention was developed by Yu Xingzheng, You Keqiang and Lyu Lihong.
The patent application number is CN202520176367U 20250127. The patent publication number is CN224021927 (U). Int..
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