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Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Zidoo Tech Co Ltd has applied Chinese patent for Audio and Picture Separation System, System on Chip and Media Player. Mao Yongqiang and Li Daolong developed it.
The patent application number is CN202610784135 20260602. The patent publication number is CN122420590 (A). International Patent Classification co..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Zitai Microelectronics Shanghai Co Ltd has filed a patent application for Multi-protocol Wireless SOC Chip Dynamic Protocol Switching Method, Chip and Device. This invention was developed by Xue Daoshan.
The patent application number is CN202610870744 20260616. The patent publication number is CN122420427 (..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has awarded a patent to Forehope Electronic Ningbo Limited Co for Lead Frame and Chip Packaging Structure. He Zhenghong, Wang Ligang, Zhang Cong and Tian Xu developed the invention.
The patent application number is CN202423225153U 20241225. The patent publication ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Jiangsu Lijuan Power Semiconductor Co Ltd has been awarded a patent for Packaging Structure of Semiconductor. This invention was developed by Zhu Ling.
The patent application number is CN202520398470U 20250307. The patent publication number is CN223968207 (U). International Patent Classification codes are B..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Zhongsihang Changsha Semiconductor Tech Co Ltd has been granted a patent for Improved High-efficiency IGBT Chip. This invention was developed by Liu Tao, Tan Hua, Zeng Huan and Gao Chao.
The patent application number is CN202520600960U 20250401. The patent publication number is CN223968205 (U). Internationa..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Jiangsu Junmu Semiconductor Tech Co Ltd has been granted a patent for Silicon Wafer Bearing Flower Basket with Positioning Function. Zhao Ming and Tao Jun developed the invention.
The patent application number is CN202520600059U 20250401. The patent publication number is CN223968187 (U). International Paten..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Jiaxing Ganglin Energy Equipment Co Ltd has obtained a patent for inclined rod flower basket special for photovoltaic solar silicon wafer. This invention was developed by Feng Zhidong and Han Mi-seon.
The patent application number is CN202520461616U 20250314. The patent publication number is CN223968185 (U)..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Jiangsu Linyuan Prec Machinery Co Ltd has been granted a patent for Photovoltaic Flower Basket Suitable for Bearing Silicon Wafers of Multiple Specifications. Zhu Lin, Zhang Jinyuan and Bi Hongliang developed the invention.
The patent application number is CN202520235222U 20250214. The patent publication nu..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Chinese Patent for Packaging Adhesive Film and Solar Cell has been issued to Jiangsu Lushan New Mat Co Ltd. This invention was developed by Tang Haiyang, Wang Yang, Chen Lei and Ji Wengen.
The patent application number is CN202520564747U 20250327. The patent publication number is CN223968142 (U). Internatio..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Shenzhen Nanfang Xingu Microelectronics Co Ltd has received a patent for MOS Tube Chip with Built-in Resistor and Electronic Equipment. This invention was developed by Chen Dongchun and Xie Dasheng.
The patent application number is CN202520503664U 20250320. The patent publication number is CN223968137 (U). ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Shenzhen Nanfang Xingu Microelectronics Co Ltd has been granted a patent for MOS Tube Chip with Built-in Resistor and Electronic Equipment. This invention was developed by Chen Dongchun and Xie Dasheng.
The patent application number is CN202520423013U 20250310. The patent publication number is CN223968136 (..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Chinese Patent for Modularized Heat Dissipation Substrate Structure of New Energy Control Cabinet has been issued to Zhongke Yige Intelligent Tech Jiangsu Co Ltd. This invention was developed by Zhang Zhihua, He Die, Jiang Yao, Wu Hao, Yang Xiaochun, Kim Duk-yong, Jian Yugang and Zhou Lina.
The patent appli..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- First Rare Mat Co Ltd has received a patent for Clamp for Growing Single Crystal Film by Liquid Phase Epitaxy Method. This invention was developed by Zhang Hong, Zhu Jinzhou and Yang Fenghao.
The patent application number is CN202423278260U 20241230. The patent publication number is CN223963601 (U). Interna..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Longmen Laboratory has been awarded a patent for Blanking Pipe for Continuously Czochralski Monocrystalline Silicon. This invention was developed by Wang Xinchang, Jia Hong, Wu Hangjin, Cui Caixia and Jia Qianlin.
The patent application number is CN202520474610U 20250318. The patent publication number is CN..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Guoci Saichuang Electric Tongling Co Ltd has been granted a patent for Electroplating Hanger Suitable for Ultrathin Fragile Substrate. Wu Peng, Kwok Sheng Sascom, Jiang Ping, Xu Haoran, Lin Fei and Li Yuanjie developed the invention.
The patent application number is CN202520362419U 20250304. The patent publ..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has awarded a patent to Zhaoqing Huiyitong Electronic Tech Co Ltd for Printed Circuit Board Electroplating Device. Xia Yixia, Yu Weiquan and Yu Xinhui developed the invention.
The patent application number is CN202520369000U 20250305. The patent publication number..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Aitu Anhui New Energy Tech Co Ltd has received a patent for Pretreatment Equipment for Electroplating Element. This invention was developed by Song Liming and Zhou Jianming.
The patent application number is CN202520390967U 20250307. The patent publication number is CN223963579 (U). International Patent Clas..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Zhuiyin Photon Shenzhen Tech Co Ltd has sought patent for Series Connection Light Emitting Diode Structure Capable of Switching Visual Angle and Preparation Method Thereof. This invention was developed by Mei Guanding, Sun Xiaowei and Li Yuhan.
The patent application number is CN202610532512 20260421. The p..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Guangzhou Hongli Bingyi Optoelectronics Tech Co Ltd has filed a patent application for Method for Packaging Mini RGB Led Light-emitting Chip. This invention was developed by Gan Junkun, Li Dongming and Zhu Jingsheng.
The patent application number is CN202610547132 20260423. The patent publication number is ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has released Naweilang Photoelectric Tech Hebei Co Ltd patent application for Light-emitting Chip and Preparation Method Thereof, Light-emitting Device and Display Device. This invention was developed by Chen Zhiwei, Wang Kaijun, Sun Wei, Yan Chunhui, Nie Dawei and D..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Shandong Runma Solar Energy Tech Co Ltd and Ronma Solar Technology Jinhua patent application for Preparation Method of Solar Cell and Solar Cell. The invention was developed by Wang Yueya, Wei Hao, Luo Yueyue, He Liang, Xing Fei, Shi Xiujiang and Zhang ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Beijing Chuangshi Ruixin Tech Co Ltd has submitted a patent application for Preparation Method of Flexible Gallium Arsenide Solar Cell Chip. Ding Liang, Yang Wenyi, Wang Shuo and Li Jianfang developed the invention.
The patent application number is CN202610478272 20260413. The patent publication number is C..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has released Fujian Long Tek Electronic Tech Co Ltd patent application for Double-MOS (Metal Oxide Semiconductor) Transistor Chip. This invention was developed by Liao Weipeng, Lai Haibo and Huang Yuan.
The patent application number is CN202610553056 20260424. The..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Lingtai Semiconductor Qingdao Co Ltd has filed a patent application for Silicon Carbide Stepped Groove Semiconductor Power Device. This invention was developed by Zhang Jie.
The patent application number is CN202610530467 20260421. The patent publication number is CN122421432 (A). International Patent Class..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Xue Liang patent application for High-precision CMOS (complementary Metal Oxide Semiconductor) Wafer Manufacturing Full-process Optimization Method and Pixel Isolation Cutting Process. The invention was developed by Xue Liang.
The patent application ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Fujian Fushun Microelectronics Co Ltd has submitted a patent application for Method for Improving Back Aluminum Process of Semiconductor Power Device and Manufactured Device. This invention was developed by Lin Ligui, Xiong Aihua, Fang Dingming and Mei Haijun.
The patent application number is CN202610502892..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Xijiajia Xiamen Integrated Circuit Co Ltd patent application for High-voltage-resistant Silicon Carbide Jfet Chip and Preparation Method Thereof. The invention was developed by Lin Daokun.
The patent application number is CN202610727929 20260525. The..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Chengdu Mingke Prec Machinery Co Ltd has been granted a patent for Continuous Punching Processing Device for FPC (Flexible Printed Circuit) Reinforced Substrate. Huang Tingting and Zhou Shiyang developed the invention.
The patent application number is CN202520160957U 20250123. The patent publication number ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Jiujiang Roushuo Photoelectric Tech Co Ltd patent application for Perovskite Solar Cell with Top Double-electrode Structure. Chen Yiwang, Li Feng, Hu Xiaotian, Sheng Wangping and Meng Xiangchuan developed the invention.
The patent application number i..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published BOE Technology Group and Hefei Xinsheng Optoelectronic Technology Co Ltd patent application for Thin Film Transistor, Preparation Method Thereof and Display Substrate. The invention was developed by Wang Ming, Ni Liusong, Xu Chen, Hu Yingbin and Wu Kang..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Anhui Ruina Semiconductor Tech Co Ltd has submitted a patent application for Semiconductor Cell, Semiconductor Device and Manufacturing Method of Semiconductor Cell. Zhang Yu and Yu Hengwen developed the invention.
The patent application number is CN202610616572 20260507. The patent publication number is CN..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Runxin Microelectronics Dalian Co Ltd has filed a patent application for Depletion Type GaN Chip and Cascade Type GaN Device. This invention was developed by Ren Yongshuo, Liang Huinan, Wang Ronghua and Dong Li.
The patent application number is CN202610883177 20260618. The patent publication number is CN122..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Wuxi Nce Power Co Ltd has filed a patent application for Power Device of Field Plate Substrate Structure and Manufacturing Method Thereof. This invention was developed by Ye Peng, Pan Ancheng, Yang Zhuo, Zhu Yuanzheng and Huang Xuequan.
The patent application number is CN202610428180 20260402. The patent pu..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Fujian Long Tek Electronic Tech Co Ltd has submitted a patent application for Preparation Method of Chip with Split Gate Transistor and Chip. Liao Weipeng, Lai Haibo and Huang Yuan developed the invention.
The patent application number is CN202610553055 20260424. The patent publication number is CN122421382..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Guangdong Xinyueneng Semiconductor Co Ltd has submitted a patent application for Silicon Carbide Semiconductor Cellular Structure Preparation Method and Cellular Structure. This invention was developed by Shao Yonghua, He Junxian, Zhang Zheng and Jiang Xingjiao.
The patent application number is CN2026103268..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Hangzhou Xingyuanchi Semiconductor Co Ltd has filed a patent application for Preparation Method of Semiconductor Device and Semiconductor Device. This invention was developed by Kim Jae Woo and Kim Young-goan.
The patent application number is CN202610839865 20260611. The patent publication number is CN12242..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Beijing Chaoxian Memory Research Inst patent application for Semiconductor Device, Method of Manufacturing Semiconductor Device, Transistor and Electronic Apparatus. Chen Yuting, Yuan Peng, Xiang Jinjuan, Ma Xueli, Wang Guilei and Zhao Chao developed the..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Suzhou Guangbang Electronic Tech Co Ltd patent application for Automatic Chip Mounter for Circuit Board Production and Processing. Shuai Dengping developed the invention.
The patent application number is CN202610679630 20260518. The patent publication..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Henan Academy Of Sciences Inst Of Applied Physics Co Ltd has applied Chinese patent for Module Thermal Management Method and System Based on Vehicle Gauge Grade Sic MOSFET Chip. Zhang Haixia, Yang Sen, Ding Ran, Zhao Hongdan, Wu Yunteng, Su Zhan, Zang Zhenli, An Haoping and Zong Yuan developed it.
The paten..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Zhejiang Chuanghao Semiconductor Co Ltd has submitted a patent application for High-binding-force Resin Plug Hole Substrate and Manufacturing Method and Application Thereof. This invention was developed by Li Xiang, Tang Hua, Fang Yong, Lu Hailin and Lan Minghui.
The patent application number is CN202610633..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Jiangsu Punuowei Electronic Co Ltd has submitted a patent application for Stepped Semi-embedded Heat Dissipation Substrate and Processing Method Thereof. Chen Man, Lu Minchen, Zhang Zhili, Yang Fei, Zong Xinru, Ma Hongwei and Kang Soo Bok developed the invention.
The patent application number is CN202610726..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Dongguan Zhicheng Semiconductor Mat Co Ltd patent application for Low-warpage LTCC (Low Temperature Co-fired Ceramic) Multilayer Ceramic Substrate and Preparation Method Thereof. The invention was developed by Su Xingbo.
The patent application number..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Taiwan Semiconductor Manufacturing has been granted a patent for Microelectromechanical Device and Method for Making the Same. Liao Shih-yu and Hung Tsai-hao developed the invention.
The patent application number is US202318318698 20230516. The patent publication number is US12774206 (B2). International ..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Chinese Patent for Buffer Structure of Door Hinge has been issued to Guangdong Jusen Precision Technology. This invention was developed by Qi Zhi.
The patent application number is CN202520169992U 20250124. The patent publication number is CN223964331 (U). International Patent Classification codes are E05D11..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Sotac Intelligent Tech Shanghai Co Ltd has submitted a patent application for Satellite Communication Module, Satellite Communication Chip and Terminal. This invention was developed by Zhu Shousi, Peng Youxiang and Zhu Zhenhua.
The patent application number is CN202610650700 20260512. The patent publication..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Chinese Patent for Y Chip Capacitor has been issued to Success Electronics Huizhou Co Ltd. This invention was developed by Yang Hao and Li Hai.
The patent application number is CN202520485493U 20250319. The patent publication number is CN223967121 (U). International Patent Classification codes are H01G4/12 ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Shanghai Yunmai Xinlian Tech Co Ltd has applied Chinese patent for Virtio Packet Ring-based Virtualized Network Message Receiving Method, Chip and Network Card. Feng Quanquan developed it.
The patent application number is CN202610895457 20260622. The patent publication number is CN122420259 (A). Internation..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Shanghai Yunmai Xinlian Tech Co Ltd has submitted a patent application for Data Packet Forwarding Method Based on Queue Number Checking, Chip and Network Card. This invention was developed by Zhao Qianwei, Hu Di, Yan Lei and Wei Honggang.
The patent application number is CN202610886589 20260618. The patent ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Zhoushan Donghai Microchip Ocean Digital Science Research Inst patent application for Block Chain Data Privacy Access Control Method and System. The invention was developed by Sun Weihao and Ba Yutao.
The patent application number is CN202610681530 2..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Shanghai Vanchip Electronic Tech Co Ltd has submitted a patent application for Positive and Negative Level Conversion Circuit, Radio Frequency Front-end Module, Chip and Electronic Equipment. This invention was developed by Xu Xiaoyu and Huang Zhiwei.
The patent application number is CN202610526385 20260420..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Photonic Tech Shanghai Co Ltd has filed a patent application for Voltage Mode Phase Interpolator, Circuit and Chip System. This invention was developed by You Xuewei.
The patent application number is CN202610857193 20260615. The patent publication number is CN122419418 (A). International Patent Classificati..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Chongqing Shengpu Electronics Co Ltd has submitted a patent application for Integrated Switch Filter Chip and Preparation Method Thereof. This invention was developed by Leng Junlin, Chen Yen-kuang, Ma Jinyi and Li Yafei.
The patent application number is CN202610520316 20260420. The patent publication numbe..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Guangzhou Leyi Invest Co Ltd patent application for Piezoelectric Driving Silicon-based MEMS Double-resonator Structure. Pang Wei and Yang Qingrui developed the invention.
The patent application number is CN20251072947 20250116. The patent publication..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Elite Semiconductor Memory Tech Inc has applied Chinese patent for Audio Amplifier Chip and Method for Adaptively Adjusting Starting Time Thereof. Chen Yaozhou developed it.
The patent application number is CN20251067486 20250116. The patent publication number is CN122419394 (A). International Patent Classi..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Huanshiyu Tech Jiangsu Co Ltd has sought patent for Device and Method for Testing Ultraviolet Attenuation of Crystalline Silicon Photovoltaic Cell. This invention was developed by Huang Yongzheng.
The patent application number is CN202610555562 20260424. The patent publication number is CN122419375 (A). Int..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Jiangsu Chengqing New Energy Co Ltd has submitted a patent application for Flexible Support Frame for Solar Cell Panel. This invention was developed by Li Meimei.
The patent application number is CN202610597669 20260430. The patent publication number is CN122419341 (A). International Patent Classification c..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Navitas Semiconductor Inc patent application for Systems and Methods for Stable Operation of Asymmetric Half-bridge Circuits Using Slope Compensation. Zha Zhenxu, Yu Changhu, Yeo In-sil and Cao Haixiao developed the invention.
The patent application n..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Wuxi Chipown Micro Electronics Ltd has filed a patent application for Power Supply Circuit, Power Supply Method and Control Chip of Isolated Converter. This invention was developed by Yi Yangbo, Nie Hongyu, Li Haisong and Gao Wei.
The patent application number is CN202610802459 20260604. The patent publicat..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- U.S. Patent and Trademark Office has awarded a patent to Beijing Boe Technology Dev Co Ltd, BOE Technology Group Co Ltd and Hefei BOE Ruisheng Technology for Light-emitting Substrate and Manufacturing Method Therefor, Backlight Module, and Display Apparatus. Geng Xiaolin, Zhang Bing, Gao Liang and Tang Hai ..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- U.S. Patent and Trademark Office has awarded a patent to Beijing Boe Technology Dev Co Ltd and BOE Technology Group for Substrate Integrated with Passive Device, and Production Method Therefor. Wang Ke, Yao Qi, Liu Yingwei, Xiao Yuelei, Li Yue, Yuan Guangcai and Cao Zhanfeng developed the invention.
The ..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Taiwan Semiconductor Manufacturing has received a patent for Through Via with Guard Ring Structure. This invention was developed by Yang Chih Hsin, Chen Dian-hau, Wang Mao-nan and Lai Yen Lian.
The patent application number is US202318304527 20230421. The patent publication number is US12777934 (B2). Int..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Wuxi Kun Core Electronic Tech Co Ltd has been granted a patent for Thickness Detection Mechanism of Wafer Thinning Machine. This invention was developed by Zhang Zerun.
The patent application number is CN202520588929U 20250331. The patent publication number is CN223971381 (U). International Patent Classific..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Yancheng Guangyue Mould Tech Co Ltd has been granted a patent for Die Steel Milling Cutting Chip Cleaning Device. This invention was developed by Gao Jiankang and Ko Sang-yun.
The patent application number is CN202520703708U 20250415. The patent publication number is CN223971340 (U). International Patent Cl..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has awarded a patent to Jiangsu Changte Tech Co Ltd for Cutting Equipment with Waste Chip Collecting Function. Wang Zhenzhou, Shen Yuan, Zhang Chen'ao and Yin Zhongqiang developed the invention.
The patent application number is CN202520559870U 20250327. The patent..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has awarded a patent to Yantai Qiyang Machinery Co Ltd for Chain Plate Type Rotary Cylinder Chip Removal Machine. Zhang Haixia, Sun Yi, Zhu Wenbin and Yang Zhiyuan developed the invention.
The patent application number is CN202422849171U 20241121. The patent publi..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Jiangxi Liyuan Haina Tech Co Ltd has been granted a patent for Silicon Controlled Rectifier Wire Inlet Assembly and Silicon Controlled Rectifier Power Supply. This invention was developed by Mei Han, Peng Qingqing and Zhang Qi.
The patent application number is CN202520201639U 20250208. The patent publicatio..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Qingdao Yichen Leishuo Tech Co Ltd has been granted a patent for Tunable Semiconductor Saturable Absorption Mirror Based on Quantum Stark Effect. Jiang Cheng, Zhang Ziyang, Jia Xiansheng and Chen Hongmei developed the invention.
The patent application number is CN202520253530U 20250218. The patent publicati..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Fujian Ruiwei Optoelectronics Tech Co Ltd has been granted a patent for Anti-falling Cylindrical Mirror Substrate. This invention was developed by Li Jiandong and Su Zilong.
The patent application number is CN202520693419U 20250414. The patent publication number is CN223966714 (U). International Patent Clas..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has awarded a patent to Allystar Tech Shenzhen Co Ltd for Satellite Signal Separation Circuit, Chip and Receiver. Li Yuying and Liang Minmin developed the invention.
The patent application number is CN202520171815U 20250124. The patent publication number is CN2239..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Realtek Semiconductor Corporation has obtained a patent for packet processing method and network device. This invention was developed by Xing Hao-chen, Wang Feng-lin, Wang Ming-xu and Cui Tao.
The patent application number is US202418770707 20240712. The patent publication number is US12777002 (B2). Inte..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Foshan Juya Aluminum Co Ltd has received a patent for Aluminum Wafer Punching Device. This invention was developed by Huang Ziheng, Guan Zhaokun, Liang Xiongyong and Cheng Jinfu.
The patent application number is CN202520118871U 20250119. The patent publication number is CN223970704 (U). International Patent..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Guangdong Ice And Snow Refrigeration Tech Co Ltd has been granted a patent for Ice Chip Removing Roller Device for Frozen Products. This invention was developed by Xu Baichuan, Xu Heshan, Huang Ancai and Zhong Fumao.
The patent application number is CN202520571539U 20250328. The patent publication number is..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Zhejiang Hanhua Semiconductor Tech Co Ltd has obtained a patent for silicon wafer ultrasonic cleaning equipment. This invention was developed by Zhou Panpan, Jiang Yeying, Zhang Wenqing and Liu Jinzhu.
The patent application number is CN202520418883U 20250311. The patent publication number is CN223970524 (U..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Taiwan Semiconductor Manufacturing has received a patent for Advanced Node Interconnect Routing Methodology. This invention was developed by Tzeng Jiann-tyng and Peng Shih-wei.
The patent application number is US202318446025 20230808. The patent publication number is US12777917 (B2). International Patent..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing for Interconnection Structure and Methods of Forming the Same. Lee Cheng-chin, Chang Hsiao-kang, Huang Hsin-yen, Yang Kuang-wei, Wu Yen Ju and Lee Shao-kuan developed the invention.
The patent application number i..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Taiwan Semiconductor Manufacturing has been granted a patent for Fishbone Structure Enhancing Spacing with Adjacent Conductive Line in Power Network. This invention was developed by Yang Kuo-nan, Chao Chien-ju, Fan Fang-yu, Tsai Yi-chuin and Wang Chung-hsing.
The patent application number is US2022175756..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- United States Patent for Back End Dielectric-based Memory Structure in a Semiconductor Device has been issued to Taiwan Semiconductor Manufacturing. This invention was developed by Chiang Katherine H and Kao Yun-feng.
The patent application number is US202318336791 20230616. The patent publication number..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Shin-Etsu Handotai KK has secured a patent on Method for Carrying Wafer and Wafer-carrying Apparatus. Satoh Seiji developed the invention.
The patent application number is US202218571976 20220621. The patent publication number is US12777887 (B2). International Patent Classification codes are B25J11/00 an..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- U.S. Patent and Trademark Office has awarded a patent to RC Tech Co Ltd for Chemical Supply Device for Use in Semiconductor Manufacturing Process. Lim Tae Hwa and Kim Myeong Mun developed the invention.
The patent application number is US202418433046 20240205. The patent publication number is US12777873 ..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Taiwan Semiconductor Manufacturing has been awarded a patent for Trimming Method of Stacked Structure and Stacked Structure Formed Therefrom. This invention was developed by Ting Kuo-chiang, Wang Eva, Shih Chao-wen, Kuo Sheng-an, Hong Shi-dong and Lin Chen-sheng.
The patent application number is US202318..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Taiwan Semiconductor Manufacturing has been granted a patent for Method of Fabricating Magneto-resistive Random Access Memory (MRAM). This invention was developed by Lin Han-ting, Yang Chang-lin, Huang Chien-hua, Chang Sheng-yuan and Lin Chung-te.
The patent application number is US202418756105 20240627...
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- United States Patent for Display Substrate and Display Device has been issued to Chengdu Boe Optoelect Tech Co and BOE Technology Group. This invention was developed by Li Jianbo, Deng Kaijie, Zhang Wei, Wang Yu and Dong Xiangdan.
The patent application number is US202218547647 20221122. The patent publi..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- U.S. Patent and Trademark Office has awarded a patent to Infovision Optoelectronics, Kunshan for Array Substrate and Manufacturing Method Thereof. Zheng Huilong, Wang Xingang and Chung Te-chen developed the invention.
The patent application number is US202118558365 20211223. The patent publication numbe..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Taiwan Semiconductor Manufacturing has been granted a patent for Semiconductor Device and Manufacturing Method Thereof. Chen Guan-lin, Ju Shi Ning, Cheng Jung-chien, Chiang Kuo-cheng and Wang Chih-hao developed the invention.
The patent application number is US202318099783 20230120. The patent publicatio..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- SK Hynic Inc has been granted a patent for Memory Device and Method of Manufacturing Memory Device. This invention was developed by Oh Jae Young, Choi Eun Seok and Lee Dong Hwan.
The patent application number is US202318356033 20230720. The patent publication number is US12777645 (B2). International Pate..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Key Foundry has secured a patent on Single Poly Non-volatile Memory Device and Manufacturing Method Thereof. Kim Su Jin, Cho Min Kuck, Lee Jung Hwan and Jung In Chul developed the invention.
The patent application number is US202318487546 20231016. The patent publication number is US12777639 (B2). Intern..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing for Backside Metal ROM Device, Layout, and Method. Chen Chien-ying, Lin Ku-feng and Ruiz Jr Preciliano Asinas developed the invention.
The patent application number is US202418661093 20240510. The patent publicati..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Dali Hongxin Electronic Mat Co Ltd has been awarded a patent for Multi-stage Cleaning Machine for Recycling Thick Sheets of Monocrystalline Silicon. This invention was developed by Wu Jinbing, Dong Weifeng, Chen Fahu and Bai Yinfeng.
The patent application number is CN202520514181U 20250324. The patent publ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has awarded a patent to Power Investment Chuangu Solar Energy Tech Wuxi Co Ltd for Cleaning Equipment for Solar Cell Module Production. Huang Xinming, Li Yaling and Zhang Lili developed the invention.
The patent application number is CN202520554484U 20250326. The ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has awarded a patent to Fujian Xienkai Electronic Co Ltd for Cleaning Mechanism for Glass Substrate Cleaning Equipment. Chen Fuliang, You Renwen, Chen Wenhuai, Tatono and Yu Hongxia developed the invention.
The patent application number is CN202520498520U 20250320..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Shenglan Semiconductor Changzhou Co Ltd has been granted a patent for Nondestructive Testing Equipment for Pzt Piezoelectric Film Wafer. Zhao Yuyao and Ma Youcao developed the invention.
The patent application number is CN202520103436U 20250116. The patent publication number is CN223966447 (U). Internationa..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Saint Gobain Safety Glass France patent application for Method for Producing Heat-treated Substrate Having Structured Functional Coating. Hermange Francois and Letocart Philippe developed the invention.
The patent application number is CN20248080045 2..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Xinai Tech Nanjing Co Ltd has sought patent for Packaging Substrate and Electronic Device. This invention was developed by Luo Yadong.
The patent application number is CN202610442459 20260403. The patent publication number is CN122421790 (A). International Patent Classification code is H10W70/652. Cooperati..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Suzhou Inst Of Industrial Technology has sought patent for Etching Device for Semiconductor Chip Processing. This invention was developed by Lyu Yanan, Zhou Feibin, Yu Shuang, Wang Ying and Zhang Mingmin.
The patent application number is CN202610348251 20260320. The patent publication number is CN122421695 ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- United Semi Integrated Circuit Mfg Xiamen Co Ltd has applied Chinese patent for Method for Selecting Multiple Target Scanning Lines on Wafer. Huang Qingjun, Liu Zhaote, Cai Zhengmiao, Huang Kaibin, Chen Qingrong and Tan Wenyi developed it.
The patent application number is CN20251058435 20250114. The patent ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Wuxi Xinzhuo Huguang Semiconductor Co Ltd patent application for Etching Method of Semiconductor Structure and Preparation Method of Semiconductor Device. Li Xuesong, Zheng Yanan, Yu Qing and Peng Yi developed the invention.
The patent application num..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- East China Inst Optoelectronic Integrated Device has submitted a patent application for High-concentration Thick Silicon Layer Doping Method. This invention was developed by Gu Zhiqi, Wang Fu, Chen Binggen, Qiu Chenguang and Feng Rui.
The patent application number is CN202610830525 20260610. The patent publ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Wuxi Xinzhuo Huguang Semiconductor Co Ltd patent application for Automatic Adjusting Method and System for Improving Stability Between Furnace Tubes and Silicon Nitride Furnaces. Lin Liwei developed the invention.
The patent application number is CN20..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Zhongke Shenzhen Wireless Semiconductor Co Ltd has submitted a patent application for Gallium Nitride-based Diode Epitaxy Method and Device for Improving Reverse Withstand Voltage. Wu Yizhen, Wang Lianshan and Ma Shengheng developed the invention.
The patent application number is CN202610893888 20260622. Th..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has released Fujian Fushun Microelectronics Co Ltd patent application for Ultrahigh-resistance Monocrystalline Silicon Epitaxial Layer and Growth Method Thereof. This invention was developed by Zheng Yi, Lin Ligui, Xiong Aihua and Mei Haijun.
The patent applicatio..
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