Semiconductor
| Tue 09 Jun 2026
Taipei, June 9 -- Resonac has filed a patent application for Resin Composition, Prepreg, Laminate, Resin Film, Printed Wiring Board, and Semiconductor Package. This invention was developed by Nakano Yuta, Ueno Fumitaka, Matsuoka Shiori, Iwanaga Kohta, Nakamura Shota, Tsukahara Tomoaki and Hidaka Yoshiki.
The patent application ..