Semiconductor
| Tue 29 Oct 2024
Alexandria, Oct. 29 -- Applied Materials has submitted a patent application for methods of forming interconnect structures. Kaliappan Muthukumar, Kim Yong Jin, Leal Cervantes Carmen, Bhuyan Bhaskar Jyoti, Xie Xiangjin, Haverty Michael, Kashefi Kevin, Saly Mark, Dangerfield Aaron and Mendoza-Gutierrez Jesus Candelario developed t..