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Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Safety Early Warning Method, Device and Equipment for Operation Scene of Semiconductor Factory. Xia Hui, Mao Zhouliang, Xu Minrui, Yan Chuanqi and Huang Shihao developed the invention.
The patent application number is CN202610740384 202..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- LG Display has submitted a patent application for Thin Film Transistor Substrate and Display Device Using the Same. This invention was developed by Chanyong Jeong, Younghyun Ko and Juheyuck Baeck.
The patent application number is KR20230107508 20230817. The patent publication number is KR20250026508 (A). Inte..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has received Samsung Electronics patent application for Semiconductor Package and Manufacturing Method for the Same. Yim Choongbin, Chengtar Wu and Kim Jongkook developed the invention.
The patent application number is KR20230107503 20230817. The patent publication number..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has published PSK Inc patent application for End Effector and Substrate Transfer Apparatus. The invention was developed by Kim Hyung Jin and Oh Hyun Woo.
The patent application number is KR20230107449 20230817. The patent publication number is KR20250026480 (A). Internation..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- SK Hynix has sought patent for Semiconductor Apparatus with Test Function and Semiconductor System Including the Same. This invention was developed by Hyeong Soo Jeong and Hyun Seung Kim.
The patent application number is KR20230107636 20230817. The patent publication number is KR20250026562 (A). International..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Samsung Electronics has filed a patent application for Semiconductor Device Including Bit Line. This invention was developed by Ko Seung Bo, Lee Min Young, Kim Jong Min and Ahn Dong Hyuk.
The patent application number is KR20230107621 20230817. The patent publication number is KR20250026556 (A). Internation..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Hits Co Ltd has applied Korean patent for Method of Cleaning an Edge of a Semiconductor Substrate and Apparatus of Cleaning an Edge of a Semiconductor Substrate. Lee Jae Cheon, Lee Sun Yeol and Oh Jong Seob developed it.
The patent application number is KR20230107692 20230817. The patent publication number ..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has released Samsung Electronics patent application for Semiconductor Device. This invention was developed by Park Gyu Hee, Park Sang Hyun, Lee In Ji and Hase Naoki.
The patent application number is KR20230107673 20230817. The patent publication number is KR20250026576 (A..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Samsung Electronics has submitted a patent application for Test Apparatus and Test Method for Detecting Defects of Elements Included in Integrated Circuit. This invention was developed by Hyoun Soo Park and Seonghoon Park.
The patent application number is KR20230116529 20230901. The patent publication number ..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Solmics Co Ltd has applied Korean patent for Parts for Semiconductor Device Manufacturing Apparatus Semiconductor Device Manufacturing Apparatus Including the Same and Manufacturing Method for Semiconductor Device. Shin Jung Woo, Kim Hyun Uk, Song Ju Young and Yun Yeong Gon developed it.
The patent applicat..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Solmics Co Ltd has filed a patent application for Parts for Semiconductor Device Manufacturing Apparatus Semiconductor Device Manufacturing Apparatus Including Same and Manufacturing Method for Semiconductor Device. This invention was developed by Kim Dong Eun.
The patent application number is KR20230107299..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has released SK Hynix patent application for Electronic Device and Electronic System for Performing a Phase Control Operation. This invention was developed by Shim Jae Min.
The patent application number is KR20230107234 20230816. The patent publication number is KR202500260..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- NVIDIA has submitted a patent application for Artificial Intelligence System for Multi-standard Sample Detection. Sriram Palani, Praveen Varun, Liu Guanhong, Huang Yujie, Murali Venkata Narayanan, Bhat Zachary P, Ji Yanyang and Chen Hongren developed the invention.
The patent application number is CN2025119..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has received Shanxi Dingxin Crystal Mat Co Ltd and Shanxi Huaxin Jingtu Tech Co Ltd patent application for Method and Device for Detecting Crystal Structure Defects of Sapphire Substrate. Song Baile, Xiao Di, Qin Maoxiao and Xiao Yanqing developed the invention.
..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Zhejiang Guoxin Semiconductor Tech Co Ltd has submitted a patent application for Digital Management Method for Packaging Production Process. This invention was developed by Shen Guoping.
The patent application number is CN202610431537 20260402. The patent publication number is CN122264737 (A). Internation..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Semiconductor Energy Laboratory has applied Korean patent for Display Device and Electronic Device. Seo Satoshi, Nakamura Daiki, Nishido Yusuke, Sasaki Toshiki, Yamaoka Ryohei and Kaita Akihiro developed it.
The patent application number is KR20257004985 20171116. The patent publication number is KR2025002640..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Samsung Electronics has submitted a patent application for Semiconductor Device. Kang Min Ju, Kim Yong Kwan, Kim Hui Jung, Lee Hyun Jin, Kang Su Jin, Kim Min Soo, Cha In Ho, Chae Hee Jae and Kim Seung Hoon developed the invention.
The patent application number is KR20250015384 20250206. The patent publicati..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Solmics Co Ltd has submitted a patent application for Upper Elelctrode Semiconductor Device Manufacturing Apparatus Including the Same and Manufacturing Method for Semiconductor Device. This invention was developed by Shin Dong Un, Kim Hyun Uk and Song Ju Young.
The patent application number is KR2023010729..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has received Maxius Co Ltd patent application for How to Dramatically Improve Data Storage Performance in Computer Systems with High-speed Data Processing System Semiconductor Boards. Cho Byung Cheol developed the invention.
The patent application number is KR20230107192 ..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has received Zinitix Co Ltd patent application for Method for Testing a Chip. Jung Huy Chan developed the invention.
The patent application number is KR20230107123 20230816. The patent publication number is KR20250026005 (A). International Patent Classification codes are ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has received ASML Netherlands patent application for Assembly for Wavelength Calibration. Cramer Hugo Augustinus Joseph and Edward Stephen developed the invention.
The patent application number is CN20248074656 20241031. The patent publication number is CN12224977..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released ASML Netherlands patent application for Patterning Process Evaluation System and Method. This invention was developed by Van Engel Jozef P, Van T Wisden Mark, Jahani Samir, De Leon Arispe Ignacio, Sahin Ertan, Goldstein Michael, Setija Irwan D and Akbu..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- NVIDIA has applied Chinese patent for Method for Simulating Multi-level Instantiation by Using Non-transformation Lightweight Instance. Muthler Gregory developed it.
The patent application number is CN202511920315 20251218. The patent publication number is CN122265494 (A). International Patent Classificatio..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Beijing Unisoc Communication Tech Co Ltd has submitted a patent application for Image Quality Enhancement Method, Image Quality Enhancement Device, Image Quality Enhancement Equipment, Chip and Chip Module. This invention was developed by Wu Qian, Zhou Tong, Guo Hao, Shao Na, Wang Qiongyao and Zhang Yingqian..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Xinxin Hangtu Suzhou Tech Co Ltd patent application for Heterogeneous Processing Circuit, Matching Method, and Integrated Circuit. This invention was developed by Li Ting.
The patent application number is CN202411849191 20241216. The patent publicat..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has received Tianxing Shuke Tech Co Ltd patent application for Insurance Method, Device, System, Equipment, Medium, Product and Chip. Tong Dong, Liu Zhen, Hou Haichao and Zhao Miaotong developed the invention.
The patent application number is CN202411897732 2024..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Zhisuan Matrix Shenzhen Data Tech Co Ltd has submitted a patent application for Knowledge Graph-based Semiconductor Film Deposition Process Intelligent Recommendation System and Method. Wang Li developed the invention.
The patent application number is CN202610331589 20260318. The patent publication number..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Xinxin Hangtu Suzhou Tech Co Ltd has submitted a patent application for Data Processing Circuit, Method, Device and Integrated Circuit. Chen Baigang developed the invention.
The patent application number is CN202411849519 20241216. The patent publication number is CN122264071 (A). International Patent Cla..
Semiconductor
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Korean Intellectual Property Office has received KCC Corporation patent application for Liquid Filler for Semiconductor. Lee Dong Yul, Kang Hong Gu, Lee Kyung Hwan and Lee Hwan Hee developed the invention.
The patent application number is KR20230108176 20230818. The patent publication number is KR20250026990 ..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Mingyixin Jiangsu Intelligent Equipment Co Ltd has filed a patent application for Visual Inspection Method for Chip Lead Bonding Appearance Quality. This invention was developed by Hu Hong, Tong Haojie, Zhu Weijie, Shi Pengjun, Xie Meiqi, Xue Wei and Jiang Hongliang.
The patent application number is CN202..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Shenzhen Xinyichang Technology has filed a patent application for Method and Device for Detecting Electrode Polarity of Chip. This invention was developed by Chen Wang, Zhou Zan, Li Huan and Li Guojing.
The patent application number is CN202610243274 20260228. The patent publication number is CN122265164 (A..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Hefei Ingenic Technology patent application for Method for Realizing Dilated Convolution Based on Chip Not Supporting Dilated Convolution. The invention was developed by Liu Zihang.
The patent application number is CN202411905697 20241223. The patent..
Semiconductor
| Sun 20 Sep 2026
Beijing, Sept. 19 -- Guangdong Changxing Semiconductor Technology has filed a patent application for Memory Chip Three-dimensional Stacking Integrated Packaging Interconnection Method and System. This invention was developed by Zhang Zhiqiang, Lu Guanhua and Guo Donglin.
The patent application number is CN202610305744 20260313...
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Lam Research has submitted a patent application for Showerhead with Components Removably Coupled to Each Other. This invention was developed by Lafferty William, Platt Thomas M, Batzer Rachel E, Durbin Aaron and Madrigal Kevin.
The patent application number is CN20248074310 20240918. The patent publication ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Lam Research has sought patent for Showerhead Comprising Plurality of Plenum Chambers and Panel Having Central Gas Distribution Port. This invention was developed by Garg Atul Kumar, Lid Gary B, Shivalinggowda Arun Kumar Hosur, Kondiandarao Sushanth and Birru Krishna.
The patent application number is CN2024..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Applied Materials has submitted a patent application for Multi-stream Gas Circuit, Chamber Fitting, Processing Chamber, and Related Apparatus and Method for Semiconductor. Dubey Abushek, Sanchez Errol Antonio C, Zhu Zuoming, Lau Shu-kwan and Moradia Alla developed the invention.
The patent application numbe..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Biedarmansino SA patent application for Packaging Material for Perovskite-based Solar Cell. This invention was developed by Bonaccorso Francesco, Belani Sanjay, Zappia Michael I and Gabitel Laurent.
The patent application number is CN20248061256 202..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Polyamide Advanced Mat Co Ltd has sought patent for Polyimide Precursor Including Eco-friendly Solvent and Polyimide Film Prepared Therefrom Having Excellent Substrate Adhesion and Excellent Heat Resistance Characteristics. This invention was developed by Park Jun-chul, Kim Sung-yeol, Park Se Joo, Lee Ik-san..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Shenzhen Bochuang Jingcai Tech Co Ltd patent application for Chip Mounter and Chip Mounting Method. The invention was developed by Luo Shengsheng and Ma Junping.
The patent application number is CN202610638392 20260511. The patent publication numbe..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Shenzhen Xinaoxun Tech Co Ltd has applied Chinese patent for Chip Multi-station Cooperative Automatic Packaging Equipment. Yan Xiaofeng, Yu Erhu, Zhang Haichao and Wang Fang developed it.
The patent application number is CN202610306173 20260313. The patent publication number is CN122248713 (A). Internatio..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Applied Materials has submitted a patent application for Light Emitting Plasma for Activation in a Processing Chamber and Related Apparatus and Methods. This invention was developed by Rastegar Abbas.
The patent application number is CN20248075628 20241115. The patent publication number is CN122270599 (A). ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Takiron Ci Co Ltd has submitted a patent application for Substrate Film for Packaging Film. This invention was developed by Oshima Koki, Mori Keiichi and Sasahara Kazuyoshi.
The patent application number is CN20248075242 20240913. The patent publication number is CN122270515 (A). International Patent Clas..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Takiron Ci Co Ltd patent application for Substrate Film for Packaging Film. The invention was developed by Oshima Koki, Mori Keiichi and Sasahara Kazuyoshi.
The patent application number is CN20248074957 20240913. The patent publication number is C..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Takiron Ci Co Ltd has submitted a patent application for Substrate Film for Packaging Film. Oshima Koki, Mori Keiichi and Sasahara Kazuyoshi developed the invention.
The patent application number is CN20248074955 20240913. The patent publication number is CN122270512 (A). International Patent Classificati..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- SII Printek has submitted a patent application for Head Chip, Liquid Ejecting Head, Liquid Ejecting Recording Apparatus, and Method of Manufacturing Head Chip. Hitoshi Nakayama developed the invention.
The patent application number is CN20248073103 20241127. The patent publication number is CN122270380 (A)...
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Shenzhen Goodix Technology has submitted a patent application for Signal Processing Method, Circuit, Chip and Electronic Equipment. This invention was developed by Peng Jiangyang, Yang Yuqing and Li Bohao.
The patent application number is CN202411913349 20241220. The patent publication number is CN122268332..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Shanghai Chaowei Wuji Electronic Tech Co Ltd has submitted a patent application for Phase Interpolator Linearity Calibration System, Method and Chip. Ding Li developed the invention.
The patent application number is CN202610738814 20260527. The patent publication number is CN122268330 (A). International P..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Jiangsu Maxscend Microelectronics Co Limited patent application for Substrate and Surface Acoustic Wave Multiplexer. This invention was developed by Xie Yuntao, Song Chongxi, Zhou Zheng and Ouyang Xuheng.
The patent application number is CN202610458..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- South China University of Technology has submitted a patent application for Linear Adjustable Capacitive Negative Feedback Amplification Circuit and Bandwidth Expansion Method. Zhao Mingjian, Chen Jiao, Wang Yunfang and Li Shaolong developed the invention.
The patent application number is CN202610239629 2..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Palwonn Electronic Shenzhen Co Ltd patent application for Arbitrary Layer High-density Interconnection Structure and Method Based on Glass Substrate and Pspi. This invention was developed by Li Shaolin, Liu Meng and Su Huayou.
The patent application..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Forehope Semiconductor Ningbo Limited Co patent application for 2.5 D Bridging Packaging Structure and 2.5 D Bridging Packaging Method. The invention was developed by Xu Yupeng.
The patent application number is CN202610711970 20260522. The patent p..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Forehope Semiconductor Ningbo Limited Co has submitted a patent application for 2.5 D Bridging Packaging Structure and 2.5 D Bridging Packaging Process. He Zhenghong, Zhong Lei, Jian Zhihong and Xu Yupeng developed the invention.
The patent application number is CN202610711964 20260522. The patent publica..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Prilit Optronics has submitted a patent application for Heavy Industry System and Flip Chip Assembly. This invention was developed by Wong Tsz Yan, Li Xingying and Wu Bingsheng.
The patent application number is CN202411838424 20241213. The patent publication number is CN122249068 (A). International Patent C..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Shenzhen Geyi Juchuang Integrated Circuit Co Ltd, GigaDevice Semiconductor, Silead, Suzhou Furuisi Information Tech Co Ltd, Hefei Geyi Integrated Circuit Co Ltd, Etown Mem Tek Ltd Xi'an and Shanghai Geyi Electronics Co Ltd patent application for Lead F..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Forehope Semiconductor Ningbo Limited Co patent application for 2.5 D Bridging Packaging Method and 2.5 D Bridging Packaging Structure. This invention was developed by Xu Yupeng.
The patent application number is CN202610711965 20260522. The patent p..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Intel has applied Chinese patent for Bottom-up Electroplating of Glass Vias. Kandanur Shankar S, Rahman Muhammad M and Pittambaram Subramanian Venkata Ramanan developed it.
The patent application number is CN202511675708 20251116. The patent publication number is CN122249058 (A). International Patent Classi..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has received South China University of Technology patent application for Laser Direct Writing Embedded Liquid Cooling Chip with Manifold Structure and Preparation Method Thereof. Zhou Xiaoyu, Pan Minqiang and Li Chao developed the invention.
The patent application..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Dongguan Qiyang Hardware Co Ltd has applied Chinese patent for Heat Dissipation Packaging Structure for High-power-density IGBT (Insulated Gate Bipolar Translator) Module. Zhang Changhua developed it.
The patent application number is CN202610445607 20260407. The patent publication number is CN122249051 (A..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Zhuhai Haoyinbao Printing Consumables has submitted a patent application for Consumable Chip Shielding and Packaging Structure. This invention was developed by Chen Guisong.
The patent application number is CN202610296883 20260312. The patent publication number is CN122249047 (A). International Patent Class..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Samsung Electronics has submitted a patent application for Semiconductor Device. This invention was developed by Ryu Sang-hyuk, Jung Seung-jin, Lyu Sung Nam, Lee Sun-jung and Lee Do-sun.
The patent application number is CN202511883931 20251215. The patent publication number is CN122249045 (A). Internation..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Shanghai Yaogan Tech Co Ltd has applied Chinese patent for Photoelectric Integrated Packaging Structure Based on Core Particle Stacking and Preparation Method Thereof. Han Yinan developed it.
The patent application number is CN202610156433 20260203. The patent publication number is CN122249041 (A). Intern..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Guangzhou Eagle Intelligent Tech Co Ltd has submitted a patent application for Single-chip Fully-integrated Led Constant-current Color Temperature Switching Automobile Lamp Driving Chip. This invention was developed by Liao Yuanlong, Guo Zongqing, Tang Li, Zhong Lianguang and Li Chunzhen.
The patent appli..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Rongyao Terminal patent application for Communication Method, Electronic Equipment, Chip System and Readable Storage Medium. The invention was developed by Ji Kun.
The patent application number is CN202411884060 20241218. The patent publication numbe..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Beijing Xuanjie Technology patent application for Cell Switching Method, Terminal, Device, Medium, Product and Chip System. The invention was developed by Yang Zhiwu.
The patent application number is CN202610204357 20260211. The patent publication nu..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Tunghsu Azure Renewable Energy Co Ltd has been awarded a patent for Photovoltaic Silicon Wafer Polishing Jig and Photovoltaic Silicon Wafer Polishing Device. This invention was developed by Yang Ningfeng, Fang Yong and Zhai Hu.
The patent application number is CN202422468953U 20241011. The patent publicat..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Jiangsu DGKF Photoelectric Tech Co Ltd has obtained a patent for calcium fluoride wafer wet type polishing device. This invention was developed by Wang Deyong, Wang Qingguo, Dai Yanrui and Jia Jian.
The patent application number is CN202423317123U 20241231. The patent publication number is CN223656738 (U)..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Hubei Xida Semiconductor Tech Co Ltd has been granted a patent for Polishing Device for Quartz Substrate Processing. Ma Xiaoge, Huang Zhenghao and Li Jian developed the invention.
The patent application number is CN202422893233U 20241127. The patent publication number is CN223656732 (U). International Pat..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Shanghai Leading Semiconductor Tech Development Co Ltd has been granted a patent for Multifunctional Chip Mounting Device and Wafer Polishing Production Line. Liu Weiwei, Wang Yongcheng, Jiang Yaqiang and Meng Fanbin developed the invention.
The patent application number is CN202423323031U 20241231. The p..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has awarded a patent to Jiaxing Port Area Industrial Sewage Treat Co Ltd for Organic Silicon Wastewater Pretreatment Device. Wang Hongwei, Tao Lei, Wang Fei and Shen Wenming developed the invention.
The patent application number is CN20252028676U 20250107. The p..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Beijing Jingyuxing Technology patent application for Crystal Oscillator Chip Installation Method with Four-corner Elastic Support and Airtight Packaging Method Thereof. The invention was developed by Hou Haitao and Wang Jiabin.
The patent application..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Qiyimoer Quzhou Integrated Circuit Design Co Ltd has filed a patent application for Self-biased Equalization Circuit and Chip Particle Integrated Chip and Equipment Thereof. This invention was developed by Tian Mochen, Wang Yu, Wen Dexin and Zhu Jundong.
The patent application number is CN202610258648 202..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has received Winbond Electronics patent application for Semiconductor Structure and Forming Method Thereof. Wang Yubai, Zhang Weizhe and Peng Dexuan developed the invention.
The patent application number is CN202510153647 20250212. The patent publication number ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Shanghai Qiankun Electronic Mat Co Ltd and Shanghai Artificial Intelligence Innovation Center patent application for Method for Forming Polyimide Protective Layer on Wafer and Wafer Stack Structure. This invention was developed by Wang Xiaohui, Bai Lei..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Shenzhen Yuanmingjie Technology patent application for Chip Binding Mechanism, Die Bonding Equipment and Chip Binding Method. The invention was developed by Bao Weihai and Li Lijie.
The patent application number is CN202610661056 20260514. The patent..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- HF Smat Microtech Co has filed a patent application for Multi-core Stacked Packaging Structure and Preparation Method Thereof. This invention was developed by Tan Xiaochun and Wang Yake.
The patent application number is CN202610289204 20260310. The patent publication number is CN122249085 (A). Internation..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Rongxin Semiconductor Huaian has filed a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Zhou Zhongan, Zeng Yi and Wang Kang.
The patent application number is CN202610696640 20260520. The patent publication number is CN122248975 (A). Internatio..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Xi'an Polytechnic University has submitted a patent application for Method for Collaborative Optimization of Performance of ITO/InON: SnO2: ZnON Thin Film Transistor. This invention was developed by Xu Yuchen, Jin Zhiyang, Luo Chi, Zhao Ming, Wang Chunlan and Yang Lichao.
The patent application number is ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Guangdong OPPO Mobile Telecommunications has applied Chinese patent for Measurement Configuration Method and Device, Chip and Computer Readable Storage Medium. Wu Hao, You Xin and Lin Xue developed it.
The patent application number is CN202380104143 20231219. The patent publication number is CN122270945 (A)..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Robert Bosch Co Limited patent application for Micromechanical Holding Device, Image Sensor Device, and Method for Manufacturing a Micromechanical Holding. This invention was developed by Lassl Andreas, Classen Johannes, Wenzel Matthias, Reinmuth Joche..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Applied Materials patent application for Composite Structure for Semiconductor Process Chamber. This invention was developed by Chen Yikai, Choudhury Sourab, Li Tianshu, Pal Aniruddha and Yang Yaohong.
The patent application number is CN20248074779 20..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Rongxin Semiconductor Huaian has applied Chinese patent for Semiconductor Device and Manufacturing Method Thereof. Gao Bo developed it.
The patent application number is CN202610696637 20260520. The patent publication number is CN122249040 (A). International Patent Classification codes are H10W20/00 and H1..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Chenwei Equipment Technology Suzhou patent application for Selective Filling Method from Bottom to Top and Semiconductor Structure. The invention was developed by Cao Subo, Wang Wujie, Liang Ange and Xiao Qianqian.
The patent application number is CN..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Jiangsu Leuven Instruments has submitted a patent application for Preparation Method of Air Gap in Semiconductor Structure and Semiconductor Structure. Choi Ho-san, Shi Xiaoli, Li Zichao, Xu Kaidong, Wang Jingru and Tao Zheng developed the invention.
The patent application number is CN202411854759 20241216...
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Nanya Technology patent application for Manufacturing Method of Semiconductor Structure. The invention was developed by Lin Lihan and Jian Changru.
The patent application number is CN202511901355 20251216. The patent publication number is CN122249035..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released United Semi Integrated Circuit Mfg Xiamen Co Ltd patent application for Manufacturing Method of Semiconductor Device. This invention was developed by Huang Qingjun, Ouyang Jinjian, Liu Jian and Tan Wenyi.
The patent application number is CN202411874..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- JRH Tech Quzhou Co Ltd has submitted a patent application for Method for Preparing Low-surface-defect Epitaxial Wafer on High-cop Silicon Single Crystal Substrate. This invention was developed by Li Bin, Zhang Xin, Zhu Tao, Yu Xiahui, Tang Qiong, Gao Pengfei, Liang Xingbo and Yang Aibing.
The patent appli..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Jiangsu Jingkai Semiconductor Tech Co Ltd has sought patent for Defect Detection Method for Element Mounting in Chip Stack Packaging. This invention was developed by Pan Hanye.
The patent application number is CN202610703780 20260521. The patent publication number is CN122249028 (A). International Patent ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has published Jiaxing Jiuzong Intelligent Technology patent application for Full-automatic Reel Disc Chip Detection Machine. The invention was developed by Li Enquan, Wu Shengsong, Wang Mengzhe, Yang Kangjie, Li Zeguang and Liu Longwei.
The patent application nu..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- ASM International Holding has submitted a patent application for Load Locking Device Including Microwave Heater and Substrate Processing Apparatus. This invention was developed by Hab Samuel and Banna Saurabh.
The patent application number is CN202511871219 20251212. The patent publication number is CN12224..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Tsingsoft Microvision Hangzhou Tech Co Ltd has submitted a patent application for Wafer Positioning Device and Wafer Positioning Method. Chen Shijiang, Zhou Jile and Chen Kai developed the invention.
The patent application number is CN202610662037 20260514. The patent publication number is CN122249010 (A)..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Shenyang Heyan Tech Co Ltd patent application for Feeding Control Method and Device of Semiconductor Processing Equipment and Storage Medium. This invention was developed by Lu Yan, Wang Xiaoduo, Yu Huping, Zhan Zhigang, Meng Fanbin, Zhao Bo, Zhang Min..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Shengjisheng Korea Semiconductor Tech Co Ltd has submitted a patent application for Device and Method for Removing Static Electricity on Surface of Wafer. This invention was developed by Lee So-hyeon, Lee Byoung-woo and Woo Sang-yun.
The patent application number is CN20251195593 20250806. The patent publ..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Shandong Huayu Space Tech Co Ltd patent application for Driving Chip Processing and Screening Equipment. This invention was developed by Zhan Xinglong, Su Dezhi, Wang Aiguo, Zhao Xiaochen and Wang Lei.
The patent application number is CN202610351035..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Zhongke Hefei Microelectronics Research Inst Co Ltd has filed a patent application for Method and System for Intelligently Adjusting Technological Parameters of Semiconductor Heteroepitaxial Layer. This invention was developed by Song Wei and Chang Fengyi.
The patent application number is CN202610329950 2..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has received Beijing NAURA Microelectronics Equipment patent application for Semiconductor Process Chamber. Li Xinyu and Li Xugang developed the invention.
The patent application number is CN202411864477 20241217. The patent publication number is CN122248992 (A)..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has received Beijing Chaoxian Memory Research Inst patent application for Semiconductor Structure and Preparation Method Thereof, Semiconductor Device and Electronic Equipment. Xiang Jinjuan, Ma Xueli, Wang Guilei and Zhao Chao developed the invention.
The paten..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Shenzhen Pengxinwei Integrated Circuit Manufacturing has sought patent for Preparation Method of Semiconductor Structure. This invention was developed by Zhou Yongjian, Fu Tengfei and Quan Dunhang.
The patent application number is CN202411861396 20241216. The patent publication number is CN122248977 (A). In..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- Zhejiang Chuangxin Integrated Circuit has sought patent for Preparation Method of Germanium-silicon Epitaxial Structure. This invention was developed by Wang Yiting, Liu Luanhui, Ye Shaofeng, Zhao Chao, Xu Xiaojun and Li Rong.
The patent application number is CN202610374467 20260325. The patent publicatio..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has received Wuxi China Resources Microelectronics Co Ltd patent application for Beta-ga2o3 Epitaxial Structure, Manufacturing Method Thereof and Semiconductor Device. Wang Minrui, Hu Zhihao and Zhai Xiaolin developed the invention.
The patent application number..
Semiconductor
| Sat 19 Sep 2026
Beijing, Sept. 19 -- State Intellectual Property Office of China has released Tsinghua University patent application for Formation Method of Semiconductor Structure, Semiconductor Structure and Electronic Equipment. This invention was developed by Gao Bin, Wu Huaqiang, Ma Chengxiang, Liu Kaimeng, Tang Jianshi, Qian He and Liu Ji..
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