Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Qualcomm has sought patent for Stacked Integrated Circuit Device Including a Stiffener Die. This invention was developed by Wang Zhongze, Nallapati Giridhar, Sun Yangyang, Badaroglu Mustafa, Kang Woo Tag, Booth Roger, Chidambaram Periannan, Lee Hyun, Chen Xiaonan, Choi Jihong and Song Jaekyu.
The patent a..