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Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Institute of Semiconductors, Chinese Academy of Sciences has filed a patent application for Construction Method and Device of Target Knowledge Base, Electronic Equipment, Medium and Product. This invention was developed by Wu Min, Deng Yusong, Yu Lina, Li Weijun and Liu Jingyi.
The patent application numb..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Institute of Semiconductors, Chinese Academy of Sciences has submitted a patent application for Small Sample Fitting-oriented Neural Network Structure Automatic Search Method and Device. This invention was developed by Zhang Xingwang, Lou Zheng, Wu Min, Liu Liyuan, Li Weijun and Yu Lina.
The patent applic..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- State Intellectual Property Office of China has published Nanjing University patent application for On-chip Optical Computing Chip Based on Waveguide Array and Design Method Thereof. The invention was developed by Wang Zhizhang, Zhu Shining, Li Xueyun and Li Tao.
The patent application number is CN202610421..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- State Intellectual Property Office of China has released Tsinghua University patent application for Optical Neural Network Based on Dispersion Nonlinearity and Optical Neural Chip. This invention was developed by Feng Xue, Huang Yidong, Liu Fang, Xiong Jian, Cui Kaiyu, Gao Heyang and Zhang Wei.
The patent a..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Nanjing University of Science & Technology has applied Chinese patent for Integrated Chip Electromagnetic-thermal-flow Multi-physics Field Efficient Transient Analysis Method. Zhang Tiancheng, Ding Dazhi, Song Guo, Peng Yan and Bao Huaguang developed it.
The patent application number is CN202610292215 20260..
Semiconductor
| Wed 23 Sep 2026
Beijing, Sept. 22 -- State Intellectual Property Office of China has awarded a patent to Shinlone Intellectual Manufacture Precision Applied Materials (Suzhou) for Hole Flanging Mechanism for Flanging Die. Shi Xingyang, Zhang Liyin, Chen Yichen, Zhang Yingying, Du Yunlong and Chen Wuxiang developed the invention.
The patent app..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Semiconductor Manufacturing International (Shanghai) has applied Chinese patent for Ion Doping Optimization Method, Doping Method, System and Related Equipment. Wang Lanfang, Zhang Yingchun, Zhao Xiujuan and Lin Haixiao developed it.
The patent application number is CN202411928895 20241224. The patent pub..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- State Intellectual Property Office of China has published Taiwan Semiconductor Manufacturing patent application for Method for Generating Pattern Matching Identifier, System for Generating Cell Layout Design with Pattern Matching Identifier, and Method for Identifying Cell Layout Design. The invention was de..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Loongson Technology has submitted a patent application for Electric Leakage Optimization Method, Device and Equipment of Integrated Circuit and Computer Readable Storage Medium. This invention was developed by Zhang Yang, Liu Dong, Xiao Bin, Song Peishuai, Yang Zhao and Shi Di.
The patent application number..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- State Intellectual Property Office of China has released China FAW Group patent application for High-performance Vehicle Gauge Chip Design Method, Multi-domain Fusion Chip Architecture and Vehicle. This invention was developed by Zhang Kai, Zhu Hangxu, Wang Qiang and Liu Guoliang.
The patent application n..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Institute of Microelectronics, CAS has filed a patent application for Method and Device for Predicting Performance of Semiconductor Device of TCAD Driven by Graph Converter. This invention was developed by Zhang Minrong and Chen Rui.
The patent application number is CN202610370407 20260324. The patent pub..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Xi'an Jiaotong University has filed a patent application for Method for Determining Real Boiler Thermal Load Deviation Coefficient of Water-cooled Wall of Ultra-supercritical N-type Boiler and Related Equipment. This invention was developed by Wei Ziyu, Qiu Junhao, Zhou Yong and Yang Dong.
The patent applic..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Wuxi Wuyue Semiconductor has applied Chinese patent for Intelligent Linkage Adjusting System and Method Based on MPCVD Process Parameters. Lu Qiankun, Fan Zhibin and Wu Mianneng developed it.
The patent application number is CN202610371164 20260325. The patent publication number is CN122284299 (A). Intern..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Huahong Semiconductor, Wuxi has submitted a patent application for Overlay Alignment Mark and Application Method Thereof. This invention was developed by Zhang Shoulong, Ju Biyu, Zhao Zhengyuan, Fan Hang and Zhang Qixue.
The patent application number is CN202610589351 20260429. The patent publication numb..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Samsung SDI has submitted a patent application for Semiconductor Photoresist Composition and Method and System for Forming Pattern Using the Composition. Lee Hyun, Cai Runzhu, Lin Xiubin, Han Jun Hee, Kim Kyoung-mok and Zhang Shuimin developed the invention.
The patent application number is CN202511951993..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Taiwan Semiconductor Manufacturing has sought patent for Optical Device and Method for Generating Signal. This invention was developed by Zhong Mingyang, Wang Ruishen, Huang Taijun, Lu Youcheng, Rusu Stefan and Cho Lan-chou.
The patent application number is CN20251202470 20251229. The patent publication num..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Green Energy Huichong Digital Technology has sought patent for Temperature Compensation Method of RTC Clock Chip. This invention was developed by Hou Ning, Lu Yunfei, Li Enhu, Dong Guangfa and Luo Jianhua.
The patent application number is CN202610551698 20260424. The patent publication number is CN1222863..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Guangdong APT Electronics has been granted a patent for Equipment for Detecting Material Stacking and Material Leakage of Coiled Tape Package. He Jiesheng, Yang Junjie, Ruan Chenghai, Ke Changming, Zeng Zhaoming and Xiao Guowei developed the invention.
The patent application number is CN202423112733U 2024..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 22 -- United States Patent for Cleaning Method, Recording Medium, and Substrate Processing Apparatus has been issued to Kokusai Electric. This invention was developed by Yamakado Yuki, Ichimura Keita, Funaki Katsunori, Tsubota Yasutoshi, Igawa Hiroto, Ueda Tatsushi, Kishimoto Hiroki and Takeshima Yuichiro.
The..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Truly Semiconductors has received a patent for Novel Foam Structure. This invention was developed by Shen Zhou and Song Yanhui.
The patent application number is CN202422856441U 20241122. The patent publication number is CN223660017 (U). International Patent Classification code is C09J7/26.
State Intel..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 22 -- U.S. Patent and Trademark Office has awarded a patent to NVIDIA for Path Prediction for Autonomous or Semi-autonomous Systems and Applications. Sheng Yu, Liu Shaun and Akbarzadeh Amir developed the invention.
The patent application number is US202418811368 20240821. The patent publication number is US127..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Beijing University has applied Chinese patent for Dnn Memory Computation Acceleration Circuit Based on Hybrid Tfet-cmos Memory Multiplication Unit and Control Method of Dnn Memory Computation Acceleration Circuit. Zhang Zeyu, Huang Qianqian, Jia Rundong, Zhao Rong, Wang Kaifeng and Huang Ru developed it.
..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Tsinghua University has filed a patent application for Many-core Storage and Calculation Chip. This invention was developed by Qi Xiaojun, Deng Lei and Zheng Zhong.
The patent application number is CN202511367527 20250923. The patent publication number is CN122285592 (A). International Patent Classification..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Vivo Mobile Communication has submitted a patent application for NPU Architecture, Data Processing Method, Electronic Equipment and Chip. This invention was developed by Jiang Yuqi.
The patent application number is CN202610287549 20260310. The patent publication number is CN122285585 (A). International Pate..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Samsung Electronics has submitted a patent application for Memory Controller, Memory Device and Operating Method. This invention was developed by Lee Jongwon.
The patent application number is CN202511274941 20250908. The patent publication number is CN122285561 (A). International Patent Classification codes..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Shanghai Awinic Technology has sought patent for Communication Method and System, Electronic Equipment and Chip. This invention was developed by Liang Dong.
The patent application number is CN202610387253 20260326. The patent publication number is CN122285558 (A). International Patent Classification codes a..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Rongyao Terminal has submitted a patent application for Information Acquisition Method, Electronic Equipment and Chip System. Li Jun and Chen Shouyan developed the invention.
The patent application number is CN202411966616 20241226. The patent publication number is CN122285192 (A). International Patent Clas..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 22 -- U.S. Patent and Trademark Office has awarded a patent to Micronox for Homogenizer with a Back Flushing Structure. Choi In Soo developed the invention.
The patent application number is US202318521843 20231128. The patent publication number is US12734491 (B2). International Patent Classification codes ar..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Taicang Jinlu Electroplate has been awarded a patent for Leak-proof Environment-friendly Electroplating Bath. This invention was developed by Zhi Jianming.
The patent application number is CN202520261171U 20250219. The patent publication number is CN223660264 (U). International Patent Classification codes a..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Ideal Energy Shanghai has obtained a patent for radio frequency feed-in device for pecvd reaction cavity and pecvd equipment. This invention was developed by Li Peng, Ouyang Liang and Yang Feiyun.
The patent application number is CN202423144355U 20241219. The patent publication number is CN223660211 (U). ..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Advanced Micro-Fabrication Equipmen has received a patent for Gas Spray Header Assembly and Plasma Processing Device. This invention was developed by Li Xiaolei, Zhang Zhao, Zhang Kai, Li Haonan and Zhang Furong.
The patent application number is CN202423187355U 20241223. The patent publication number is CN2..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Ideal Energy Shanghai has been granted a patent for Cooling System of PECVD (Plasma Enhanced Chemical Vapor Deposition) Equipment. Yang Rongjian, Li Peng and Yang Feiyun developed the invention.
The patent application number is CN202423151472U 20241220. The patent publication number is CN223660209 (U). In..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Shanghai Jita Semiconductor has received a patent for Deposition Apparatus. This invention was developed by Cao Xueting, Li Gang, Gui Jian, Pang Hongrong, Huang Ping and Dong Jing.
The patent application number is CN202520125187U 20250117. The patent publication number is CN223660205 (U). International Pa..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Beijing NAURA Microelectronics Equipment has been awarded a patent for Air Inlet Structure and Semiconductor Process Equipment. This invention was developed by Li Xiaoting, Chen Jingyong, Chen Erqing, Wang Chao and Zhou Ce.
The patent application number is CN202423121266U 20241217. The patent publication nu..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Suzhou Zhongke Zhongyi Semiconductor Material has been awarded a patent for Vapor Phase Precipitation Equipment. This invention was developed by Li Rui, Luo Minjie and Chen Hao.
The patent application number is CN202520291787U 20250224. The patent publication number is CN223660199 (U). International Paten..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Advanced Micro-Fabrication Equipmen has been granted a patent for Semiconductor Process Platform. Tao Heng, He Weiye, Xu Can, Wang Nengyu, Yang Runqing, Wu Hongxing, Liao Lacai, Sang Chengsong, Liu Xuebin, Chen Dong, Liu Qing and Liu Wenyi developed the invention.
The patent application number is CN202423..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Shengweixu Technology for Shielding Assembly and Semiconductor Processing Equipment. Chen Zuhong developed the invention.
The patent application number is CN20252038940U 20250107. The patent publication number is CN223660182 (U). I..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- State Intellectual Property Office of China has awarded a patent to Suzhou Tongfu Chaowei Semiconductor for Protective Device. Li Fuyang, Ni Jianming and Dong Fuqiang developed the invention.
The patent application number is CN202520142477U 20250121. The patent publication number is CN223657804 (U). Inter..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- State Intellectual Property Office of China has released Goertek Microelectronics patent application for Sleep Wake-up Enable Circuit, Chip and Electronic Equipment. This invention was developed by Zhang Yang, Ye Liuxin and Ren Yongqiang.
The patent application number is CN202610590245 20260429. The patent ..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- State Intellectual Property Office of China has released Vivo Mobile Communication patent application for Electronic Equipment, Information Processing Method, Electronic Equipment and Chip. This invention was developed by Li Yang and Yang Hongyuan.
The patent application number is CN202610522102 20260420. T..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Muxi Integrated Circuit (Shanghai) has sought patent for Isolation Protection Device of Chip IP Power Switch. This invention was developed by Duan Fen.
The patent application number is CN202610498509 20260415. The patent publication number is CN122284791 (A). International Patent Classification codes are ..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- Dongguan University of Technology has submitted a patent application for Evaporator Structure for Two-phase Heat Dissipation of Semiconductor Device. This invention was developed by Tang Tingting, Ou Jiaming, Li Zhiyong, Shu Yuxuan, Fang Xueqian and Zheng Mingfang.
The patent application number is CN2026105..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 22 -- State Intellectual Property Office of China has published Nuvoton Technology patent application for Waveform Generation Circuit, Control Chip and Waveform Generation Method. The invention was developed by Guo Menghuang.
The patent application number is CN202511108066 20250808. The patent publication number ..
Semiconductor
| Wed 23 Sep 2026
Beijing, Sept. 22 -- SAE Technologies Development, Dongguan has submitted a patent application for Method for Treating Plastic Substrate. This invention was developed by Wang Yinguo.
The patent application number is CN202411915170 20241224. The patent publication number is CN122279492 (A). International Patent Classification co..
Semiconductor
| Wed 23 Sep 2026
Beijing, Sept. 22 -- Maanshan Iron & Steel has filed a patent application for 1500MPa-grade High-fatigue-performance Hot-formed Steel Substrate and Production Method Thereof as Well as Hot-formed Steel and Production Method Thereof. This invention was developed by Deng Zongji, Li Gongmin, Zhang Hangzhou, Zhang Jun, Cui Lei, Wang..
Semiconductor
| Wed 23 Sep 2026
Beijing, Sept. 22 -- Bright Farming has sought patent for SNP (Single Nucleotide Polymorphism) Site Combination for Dairy Cow Heat Stress Identification, Liquid Phase Chip and Application. This invention was developed by Yang Zhiqiang, Wu Tianyou, Zhao Hui, Wu Jie, Ma Peipei, Li Daoquan, Zhang Xingyi and Zhang Ruihua.
The pat..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Nexjperia BV, Nexperia BV and Nexperia Technology (Shanghai) have submitted a patent application for Frame Module for a Semiconductor Integrated Circuit, Ic, as Well as a Power Module Comprising Such a Frame Module and a Method of Manufacturing Such a Frame Module. Gong Wei and Hogerl Jürgen developed th..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Hefei BOE Ruisheng Tech Co Ltd and BOE Technology Group have filed a patent application for Wiring Substrate and Electronic Device. This invention was developed by Wu Xintao, Luo Ningyu, Xu Zouming, Han Tingwei, Wang Jie and Xu Jiawei.
The patent application number is US202619656283 20260423. The paten..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Tsmc China Co Limited and Taiwan Semiconductor Manufacturing Co Ltd have applied United States patent for Wafer Boat Handling System and Operation Method Thereof. Zhao Xin, Jin Xiao, Gao Chunjie, Zhang Lan and Zhou Pianpian developed it.
The patent application number is US202519081927 20250317. The pat..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group have applied United States patent for Flexible Display Substrate and Manufacturing Method Therefor, and Display Apparatus. Yang Yixiang, Chen Liqiang and Yang Shuquan developed it.
The patent application number is US202619659872 20260427...
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group have submitted a patent application for Display Substrate and Display Apparatus. This invention was developed by Wang Mengqi, Chen Wenbo, Hu Ming, Jiang Zhiliang, Yu Ziyang and Qiu Haijun.
The patent application number is US202619658754 2..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Beijing BOE Tech Development Co Ltd and BOE Technology Group have filed a patent application for Display Substrate and Display Apparatus. This invention was developed by Xu Cheng, Zhou Dandan, Zhang Yue and You Juanjuan.
The patent application number is US202418993530 20240516. The patent publication n..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Hefei BOE Ruisheng Tech Co Ltd and BOE Technology Group have submitted a patent application for Light-emitting Substrate and Manufacturing Method Therefor, Backlight Module and Display Apparatus. Wang Xiao, Wang Chenyang, Zhang Bing and Gao Liang developed the invention.
The patent application number i..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Korea Research Instituite Of Standdards and Science and Icuf Hyu Industry Univ Cooperation Foundation Hanyang Univ have submitted a patent application for Skyrmion Memory Device and Crossbar Array Circuit Using Same. This invention was developed by Yang Seung Mo, Choi Jin Young, Park Jea Gun, Moon Kyoung-..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Stmicroelectronics Austria GmbH and STMicroelectronics Grenoble 2 have applied United States patent for Wireless Power Transmitter. Tisserand Bruno, Rampetsreiter Martin, Wutte Rene and Denda Martin developed it.
The patent application number is US202219130811 20221130. The patent publication number is..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Tokyo Electron Ltd and Tokyo Electron US Holdings have applied WIPO patent for Processing Method to Dissipate Fluid Accumulation on a Spinning Wafer. Javadpour Farzam developed it.
The patent application number is WO2026US10231 20260106. The patent publication number is WO2026187432 (A1). International Pat..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Tokyo Electron Ltd and Tokyo Electron US Holdings have submitted a patent application for Method and Apparatus for Hybrid Bonding. Gardner Mark I, Mukhopadhyay Partha and Fulford H Jim developed the invention.
The patent application number is WO2026US10227 20260106. The patent publication number is WO20261..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Applied Materials Israel Ltd and Applied Materials have submitted a patent application for Lubricating a Rail Interface. This invention was developed by Dvir Eran, Yonaei Amit, Nakash Shmuel, Wass Oren and Feldman Marat.
The patent application number is WO2025US51692 20251020. The patent publication number..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Toyochem Co Ltd and Artience have applied WIPO patent for Conductive Adhesive Sheet, Connection Structure, and Solar Cell Module. Nishinohara Satoshi and Nagai Yoshiki developed it.
The patent application number is WO2026JP08162 20260304. The patent publication number is WO2026186793 (A1). International Pa..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Kaifeng Kuake New Mat Co Ltd and Henan University have submitted a patent application for Monodisperse Silicon Dioxide Nano-particles for Photonic Crystals and Preparation Method of Monodisperse Silicon Dioxide Nano-particles. This invention was developed by Feng Ying, Ma Hengyin, Fan Guangyan, Chen Kai, Li ..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Guozhuang New Material Tech Jiangsu Co Ltd and Beijing Xinfeng Aerospace Equipment have applied Chinese patent for Preparation Method of Silicon Precursor with Ultra-small Particle Size. Xia Xisheng, Liu Fengjiao, Wen Xia, Mao Bangxiao, Ma Xiaomin and Gao Shan developed it.
The patent application number i..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Hoya Lens Thailand Ltd and Haibara Riku have applied WIPO patent for Method for Manufacturing Ophthalmic Lens. Haibara Riku developed it.
The patent application number is WO2026JP07317 20260227. The patent publication number is WO2026186608 (A1). International Patent Classification codes are G02B1/14, G02C..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Sumitomo Electric Ind Ltd and Sumitomo Electric Printed Circuits Inc have submitted a patent application for Copper Nano-ink, Printed Circuit Board Substrate, and Method of Manufacturing Printed Circuit Board Substrate. This invention was developed by Aikawa Kenichiro, Okada Issei, Hidani Takuto and Mikag..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Mahidol Univ and SCG Packaging Public Co Limited have applied WIPO patent for Portable Light Emitting Diode Irradiation Control Device. Hachawee Kosin, Limwongsaree Somchoke, Rujitanaroj Pim-on, Sarntanayoot Porndanai, Kanathananun Maysinee and Manuskiatti Woraphong developed it.
The patent application num..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Meng Lin and Applied Materials have filed a patent application for Method of a Critical Dimension Measurement on a Substrate, a Method of Manufacturing One or More Sub-pixel Structures, and Apparatus for Inspecting the Substrate. This invention was developed by Knaub Nikolai, Cook Benjamin John, Meng Lin and ..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Chongqing Technology & Business University and Xi'an Jiaotong University have applied Chinese patent for Microfluidic Constant-speed Electrophoresis Chip for Circrna Separation, Purification and Enrichment and Application of Microfluidic Constant-speed Electrophoresis Chip. Xu Zhi, Gomes Correia Jose Igino, ..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Guilin Moyuan Material Tech Co Ltd and Guilin Champion Union Diamond Co Ltd have submitted a patent application for Inclined Electroplating Grinding Piece Rigid Grinding Wheel and Assembling Method. Song Jingxin, Long Huiling, Song Youpeng and Liang Anning developed the invention.
The patent application n..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Zhejiang Lante Optics and Zhejiang Lanchuang Photoelectric Tech Co Ltd have sought patent for Preparation Method of Large-size Ultrahigh-flatness Lithium Niobate Wafer. This invention was developed by Shan Xuebin, Wu Ming, Xu Yunming, Feng Xiangxu and Xu Minjie.
The patent application number is CN20261045..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 21 -- Shanghai Donglida Health Research Instituite Co Ltd and University of Shanghai for Science and Technology have applied Chinese patent for Cold and Hot Compress Integrated Intelligent Eyeshade Based on Two-dimensional Mxene Photo-thermal Material and Semiconductor Chilling Plate. Shi Quan, He Yingbing, Zhu Zh..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Chip-stacked Device. Shimooka Yoshiaki developed the invention.
The patent application number is US202619542754 20260218. The patent publication number is US20260271805 (A1). Inter..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Yangtze Memory Tech Holding Co Ltd has filed a patent application for Memory Devices, Fabrication Methods, and Operating Methods Thereof. This invention was developed by Fan Dongyu, Zheng Hao, Liu Lei, Xia Zhiliang, Zhou Wenxi, Huo Zongliang and Gao Tingting.
The patent application number is US20251933..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Toshiba Electronic Devices & Storage Corp and Toshiba have submitted a patent application for Semiconductor Device. This invention was developed by Tsujimura Toshihiro and Liu Jia.
The patent application number is US202519359831 20251016. The patent publication number is US20260271779 (A1). Internation..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Powertech Tech Inc has applied United States patent for Semiconductor Package Module and Method of Manufacturing the Same. Chang Chien Shang-yu and Chen Chih Hao developed it.
The patent application number is US202619555908 20260304. The patent publication number is US20260271774 (A1). International Pa..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- ProAsia Semiconductor Corp has applied United States patent for Wafer Processing Method. Chen Hsi-chih developed it.
The patent application number is US202619556196 20260304. The patent publication number is US20260271676 (A1). International Patent Classification codes are H10P74/20 and H10W46/00. Coop..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- ProAsia Semiconductor Corp has applied United States patent for Thermal Processing Apparatus. Lai Kang-cheng and Cheng Tun-yuan developed it.
The patent application number is US202519408996 20251204. The patent publication number is US20260271655 (A1). Cooperative Patent Classification codes are H10P72..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Xiamen Industrial Technology Research Instituite Co Ltd patent application for Memory and Control Method Thereof. This invention was developed by Bai Lixia, Pan Tianlong, Chen Yuhuang, Yin Jiayu, Zheng Zhexin and Liu Meidong.
The patent application number i..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- World Intellectual Property Organization has released CXMT patent application for Semiconductor Structure and Forming Method Therefor. This invention was developed by Liu Guoquan, Tang Zhengtao, Hu Yang, Lyu Hui, Qian Hongyun and Wu Xiaopeng.
The patent application number is WO2025CN131565 20251031. The pa..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- State Intellectual Property Office of China has received Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Anti-deflagration Cyclone Filtering Device. Ma Xuwu, Cao Qigang, Zhang Youhai, Zhang Yankun, Yang Kai and Wang Liguang developed the invention.
The patent application number ..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Toshiba Electronic Devices & Storage Corp and Toshiba have filed a patent application for Semiconductor Device and Manufacturing Method. This invention was developed by Tsuda Hiroki, Oshino Kenta, Kozaki Keisuke and Okeda Hirofumi.
The patent application number is US202519309571 20250825. The patent pu..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- World Intellectual Property Organization has received Fuji Electric patent application for Semiconductor Device and Manufacturing Method for Same. Narita Syunki developed the invention.
The patent application number is WO2026JP02026 20260122. The patent publication number is WO2026186338 (A1). Internationa..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Hur Jae, Yeung Chun Wing, Luo Yanbin, Chu Tao, Hung Ting Hsiang, Mleczko Michal, Lin Chung Hsun, Lin Chia Ching, Hu Lin, Ghani Tahir, Xu Guowei, Zhang Yang, Zhang Kan, Wang Qiwen and Zhang Feng patent application for NP Ratio Tuning Techniques for Nanoribbon-b..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Adeia Semiconductor Bonding Technologies Inc has applied WIPO patent for Integrated Cooling Assembly with Upper and Lower Channels. Haba Belgacem and Fountain Gaius Gillman developed it.
The patent application number is WO2026US16077 20260220. The patent publication number is WO2026187520 (A1). Internation..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Unidt Shanghai Co Ltd has submitted a patent application for Multimodal Explicit Memory System, Apparatus, Storage Medium, and Program Product. This invention was developed by Cai Hua, Xu Qing, Zhao Shuang, Zhang Haode, Wang Haoran, Li Shuaishuai, Xia Tian and Zhao Kangning.
The patent application number i..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Beijing Eswin System Tech Co Ltd and Beijing ESWIN Computing Technology have sought patent for Processing System, Processing Method, Chip, and Storage Medium. This invention was developed by Huang Tai and Liu Xin.
The patent application number is WO2025CN109885 20250722. The patent publication number is WO..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Toshiba Electronic Devices & Storage Corp and Toshiba have applied United States patent for Semiconductor Device. Kobayashi Yusuke, Inokuchi Tomoaki, Gangi Hiro, Ichinoseki Kentaro, Nishiwaki Tatsuya, Fukuda Taichi, Sakata Hiroki, Baba Shotaro and Nemoto Hiroki developed it.
The patent application numb..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Asano Naoki.
The patent application number is US202519301555 20250815. The patent publica..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Semiconductor Device. The invention was developed by Arima Kazusa and Yoshikawa Daiki.
The patent application number is US202519229925 20250605. The patent publication number is U..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Toshiba Electronic Devices & Storage Corp and Toshiba have submitted a patent application for Semiconductor Device. This invention was developed by Kachi Tsuyoshi.
The patent application number is US202519300192 20250814. The patent publication number is US20260271351 (A1). International Patent Classif..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Iucf Hyu Industry Univ Cooperation Foundation Hanyang Univ and Samsung Electronics have sought patent for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Kim Sangwook, Lee Kwanghee, Ryu Seonghwan, Yang Jeeeun and Park Jinseong.
The patent application number is..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Semiconductor Device. The invention was developed by Kobayashi Yusuke, Kato Takahiro, Gejo Ryohei, Fukuda Taichi, Sakano Tatsunori and Yamamoto Takato.
The patent application numb..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Semiconductor Device and Method for Manufacturing the Same. Minamikawa Kazuki and Tamai Ryuichi developed the invention.
The patent application number is US202519358701 20251015. T..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Semiconductor Device. The invention was developed by Kobayashi Yusuke, Ohashi Teruyuki, Matsudai Tomoko, Kato Kota and Yamamoto Takato.
The patent application number is US20261944..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Advanced Micro Devices Inc and ATI Technologies have applied WIPO patent for Memory Device with Command Blocking. Litt Michael and Yao Yubin developed it.
The patent application number is WO2026US12801 20260128. The patent publication number is WO2026187465 (A1). International Patent Classification codes a..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Toshiba Electronic Devices & Storage Corp and Toshiba have filed a patent application for Semiconductor Device. This invention was developed by Arita Keigo, Gejo Ryohei, Fukuda Taichi, Sakano Tatsunori and Yamamoto Takato.
The patent application number is US202619444295 20260109. The patent publication..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Majestic Labs has submitted a patent application for Cable Configurations for Disaggregated Memory. This invention was developed by Rabii Shahriar and Johnston Margaret.
The patent application number is WO2026US17310 20260302. The patent publication number is WO2026187676 (A1). International Patent Classif..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Denka Co Limited has submitted a patent application for Composition for Provisional Fixation, Method for Producing Wafer, and Composition. This invention was developed by Yamamoto Shota, Shirota Mizuki, Tanigawa Hoshino Takako and Takahashi Yusuke.
The patent application number is WO2026JP08036 20260303. T..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Denka Co Limited has applied WIPO patent for Composition for Provisional Fixation, Method for Producing Wafer, and Composition. Yamamoto Shota, Shirota Mizuki, Tanigawa Hoshino Takako and Takahashi Yusuke developed it.
The patent application number is WO2026JP08013 20260303. The patent publication number i..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Denka Co Limited has sought patent for Composition for Temporary Fixation, Method for Producing Wafer, and Composition. This invention was developed by Yamamoto Shota, Shirota Mizuki, Tanigawa Hoshino Takako and Takahashi Yusuke.
The patent application number is WO2026JP08008 20260303. The patent publicati..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Xenergic AB has applied WIPO patent for Memory Device and Method with Improved Internal Timing. Luo Xiao, Mohammadi Babak and Meraji Reza developed it.
The patent application number is WO2026EP56215 20260306. The patent publication number is WO2026185449 (A1). International Patent Classification codes are ..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Hyting GmbH has applied WIPO patent for Device for Emitting Heat and Use of a Mixing Unit and a Method for Operating a Device for Emitting Heat. Hannig Tim developed it.
The patent application number is WO2026EP56074 20260305. The patent publication number is WO2026185387 (A1). International Patent Classif..
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