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State Intellectual Property Office of China Awards Patent for Double-layer Light-emitting Surface Light Source

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has awarded a patent to Qingdao Zhuoyingshe Technology for Double-layer Light-emitting Surface Light Source. Fang Bing and Wang Tao developed the invention. The patent application number is CN202422772109U 20241113. The patent publication number is CN223595782 (U..

Larix Shenzhen Tech Co Ltd Submits Chinese Patent Application for NAND Flash Memory Life Dynamic Prediction Method for Extreme Temperature Change Environment

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Larix Shenzhen Tech Co Ltd has submitted a patent application for NAND Flash Memory Life Dynamic Prediction Method for Extreme Temperature Change Environment. This invention was developed by Han Rui and Zhu Jianbao. The patent application number is CN202610264949 20260305. The patent publication number is ..

West Lake Instrument Hangzhou Tech Co Ltd Applies for Patent on Processing Method for Approximately Zero-taper Special-shaped Laser Cutting of Silicon Carbide Lens and Laser Cuttin..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- West Lake Instrument Hangzhou Tech Co Ltd has applied Chinese patent for Processing Method for Approximately Zero-taper Special-shaped Laser Cutting of Silicon Carbide Lens and Laser Cutting System. Yu Xiaoying, Liu Dongli and Liu Fengjiang developed it. The patent application number is CN202610663820 2026..

State Intellectual Property Office of China Publishes Inst of Mechanical Manufacturing Technology China Academy of Engineering Physics Patent Application for Method for Removing Fu..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has published Inst of Mechanical Manufacturing Technology China Academy of Engineering Physics patent application for Method for Removing Fused Quartz Substrate Multilayer Oxide Film Through Laser Back Incidence Thermal Stress. The invention was developed by Hai Kuo..

Jiangsu Tanglong Electronic Tech Co Ltd Submits Patent Application for Spot Welding Equipment for Integrated Circuit Chip Processing

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Jiangsu Tanglong Electronic Tech Co Ltd has submitted a patent application for Spot Welding Equipment for Integrated Circuit Chip Processing. Li Jiaxi, Wan Xing and Zhao Yunfei developed the invention. The patent application number is CN202610677387 20260518. The patent publication number is CN122184500 (A..

Wuhan Shengshi Qichuang Tech Co Ltd Submits Chinese Patent Application for Sensor Chip Pin Header and Circuit Board Welding Tool, Process and Processing Equipment

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Wuhan Shengshi Qichuang Tech Co Ltd has submitted a patent application for Sensor Chip Pin Header and Circuit Board Welding Tool, Process and Processing Equipment. This invention was developed by Liu Huan, Qian Zhenqiang, Ke Binbin, Liu Gang, Ke Changtang and Cao Jingyu. The patent application number is CN..

Shateka Tech Jiangsu Co Ltd Files Chinese Patent Application for High-damping Anti-vibration Type Wafer Grinding Machine Tool Body Casting Mold

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Shateka Tech Jiangsu Co Ltd has filed a patent application for High-damping Anti-vibration Type Wafer Grinding Machine Tool Body Casting Mold. This invention was developed by Zhang Jie and Gong Yougao. The patent application number is CN202610487788 20260414. The patent publication number is CN122184281 (A..

Xuzhou Botong Aluminum Ind Co Ltd Seeks Patent for Feeding Mechanism of Aluminum Wafer Punching Machine

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Xuzhou Botong Aluminum Ind Co Ltd has sought patent for Feeding Mechanism of Aluminum Wafer Punching Machine. This invention was developed by Zhang Li, Ren Jun and Tao Lei. The patent application number is CN202610460826 20260409. The patent publication number is CN122184227 (A). International Patent Class..

Zhongke Weifen Tech Development Beijing Co Ltd Seeks Patent for Modified Silicon Dioxide Chromatographic Microspheres and Preparation Method Thereof

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Zhongke Weifen Tech Development Beijing Co Ltd has sought patent for Modified Silicon Dioxide Chromatographic Microspheres and Preparation Method Thereof. This invention was developed by Guo Baosheng. The patent application number is CN202610652902 20260513. The patent publication number is CN122183564 (A)..

State Intellectual Property Office of China Releases Wuxi Fujia Semiconductor Tech Co Ltd Patent Application for Collecting Device for Chip Manufacturing Process

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Wuxi Fujia Semiconductor Tech Co Ltd patent application for Collecting Device for Chip Manufacturing Process. This invention was developed by Jiang Liuyun, Gan Yu, He Weixin, Jiang Lang, Yu Qianru and Yu Zhengmin. The patent application number is CN2..

State Intellectual Property Office of China Publishes Adya Semiconductor Zink Tech Co Ltd Patent Application for Through-substrate Via Structure and Process

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has published Adya Semiconductor Zink Tech Co Ltd patent application for Through-substrate Via Structure and Process. The invention was developed by Uzoh Cyprian Emeka and Katkar Rajesh. The patent application number is CN20248071606 20240920. The patent publicat..

State Intellectual Property Office of China Receives Imax Osram International BV Patent Application for Growth Substrate and Method for Processing Optoelectronic Device

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Imax Osram International BV patent application for Growth Substrate and Method for Processing Optoelectronic Device. Sundgren Petrus developed the invention. The patent application number is CN202380103818 20231107. The patent publication number is C..

State Intellectual Property Office of China Releases Hoya Optical Lab Inc Patent Application for Fluorine-free Hydrophobic Coating

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Hoya Optical Lab Inc patent application for Fluorine-free Hydrophobic Coating. This invention was developed by Knutsson Thomas R. The patent application number is CN20248071987 20240925. The patent publication number is CN122180900 (A). International..

Robert Bosch Co Limited Files Chinese Patent Application for Method for Transferring Chips of Wafer and Corresponding Device

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Robert Bosch Co Limited has filed a patent application for Method for Transferring Chips of Wafer and Corresponding Device. This invention was developed by Pinter Stefan. The patent application number is CN20248071492 20241015. The patent publication number is CN122180647 (A). International Patent Classifi..

Wuxi Xinzhuo Huguang Semiconductor Co Ltd Submits Chinese Patent Application for Preparation Method of Semiconductor Device

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Wuxi Xinzhuo Huguang Semiconductor Co Ltd has submitted a patent application for Preparation Method of Semiconductor Device. This invention was developed by Shen Yuli, Tang Danni, Cheng Hanyue and Yuan Lefan. The patent application number is CN202610169327 20260205. The patent publication number is CN12218..

Chongqing Xinlian Microelectronic Co Ltd Seeks Patent for Method for Improving Reliability of Metal Interconnection Layer and Preparation Method of Semiconductor Structure

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Chongqing Xinlian Microelectronic Co Ltd has sought patent for Method for Improving Reliability of Metal Interconnection Layer and Preparation Method of Semiconductor Structure. This invention was developed by Zhang Nianheng, Li Bao and Cai Xianzhu. The patent application number is CN202610123059 20260129...

Jiangsu Jingkai Semiconductor Tech Co Ltd Submits Chinese Patent Application for Micro-force Control System and Method for Picking and Placing Thin Film Chip

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Jiangsu Jingkai Semiconductor Tech Co Ltd has submitted a patent application for Micro-force Control System and Method for Picking and Placing Thin Film Chip. This invention was developed by Pan Hanye. The patent application number is CN202610652792 20260513. The patent publication number is CN122180360 (A..

State Intellectual Property Office of China Releases Beijing Xinyuewei Semiconductor Tech Co Ltd, Wuhu Xin Yue Micro Semiconductor Co Ltd and Hefei Xin Yue Micro Semiconductor Co L..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Beijing Xinyuewei Semiconductor Tech Co Ltd, Wuhu Xin Yue Micro Semiconductor Co Ltd and Hefei Xin Yue Micro Semiconductor Co Ltd patent application for Supporting Structure, Wafer Box and Preparation Method of Wafer Box. This invention was developed by..

Wuhu Xin Yue Micro Semiconductor Co Ltd Applies for Patent on Suspension Type Wafer Carrier for Semiconductor Wafer Production

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Wuhu Xin Yue Micro Semiconductor Co Ltd has applied Chinese patent for Suspension Type Wafer Carrier for Semiconductor Wafer Production. Li Yue, Zhang Liang and Guo Xiaonan developed it. The patent application number is CN202610645629 20260512. The patent publication number is CN122180346 (A). Internationa..

State Intellectual Property Office of China Receives Shanghai Xinshang Micro Fitting Tech Co Ltd Patent Application for Air Bath Device and Semiconductor Production Equipment

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Shanghai Xinshang Micro Fitting Tech Co Ltd patent application for Air Bath Device and Semiconductor Production Equipment. Wang Gang, Luo Bing, Yang Yuqi, Cheng Hang, Wang Sainan, Zhang Shun, Zhang Hongbo and Cheng Binbin developed the invention. The..

Anhui Juhe Microelectronics Co Ltd Applies for Patent on Cutting Method, Cutting Device and Chip

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Anhui Juhe Microelectronics Co Ltd has applied Chinese patent for Cutting Method, Cutting Device and Chip. Chen Jingfeng and Wu Jihua developed it. The patent application number is CN202610619632 20260507. The patent publication number is CN122180325 (A). International Patent Classification codes are H10P5..

Suzhou Weiqing Semiconductor Co Ltd Seeks Patent for Method for Forming Semiconductor Groove

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Suzhou Weiqing Semiconductor Co Ltd has sought patent for Method for Forming Semiconductor Groove. This invention was developed by Shi Wenhua, Hu Bowen, Li Shuai, Zhang Guangjing, Zhang Junchao and Pu Dong. The patent application number is CN202610135838 20260130. The patent publication number is CN1221803..

Zhangjiang Nat Laboratory Submits Patent Application for Patterning Method and Patterning System for Semiconductor Process

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Zhangjiang Nat Laboratory has submitted a patent application for Patterning Method and Patterning System for Semiconductor Process. Li Zhonghua and Ji Shengxiang developed the invention. The patent application number is CN202411767097 20241203. The patent publication number is CN122180320 (A). Internationa..

Zhongke Huizhu Guangzhou Semiconductor Co Ltd Applies for Patent on Silicon Carbide Epitaxial Wafer and Preparation Method and Application Thereof

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Zhongke Huizhu Guangzhou Semiconductor Co Ltd has applied Chinese patent for Silicon Carbide Epitaxial Wafer and Preparation Method and Application Thereof. Yang Junwei, Lin Haobo, Song Huaping and Guo Songbo developed it. The patent application number is CN202610117779 20260128. The patent publication num..

State Intellectual Property Office of China Releases Chengdu Pro Microwave Electronic Tech Co Ltd Patent Application for Preparation Method of Epitaxial Structure, Epitaxial Struct..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Chengdu Pro Microwave Electronic Tech Co Ltd patent application for Preparation Method of Epitaxial Structure, Epitaxial Structure and Semiconductor Device. This invention was developed by Yin Yuzhe, He Li and Zhao Guangyu. The patent application num..

Korean Intellectual Property Office Receives ApS Inc Patent Application for Manufacturing Method of Wafer Frame Continuous Processing Mask and Wafer Frame Continuous Mask Manufactu..

Semiconductor

| Sun 30 Aug 2026

Seoul, Aug. 31 -- Korean Intellectual Property Office has received ApS Inc patent application for Manufacturing Method of Wafer Frame Continuous Processing Mask and Wafer Frame Continuous Mask Manufactured Thereby. Kwon Oeun, Moon Jong Woon and Kim Hwi Su developed the invention. The patent application number is KR20240105966..

ApS Inc Files Korean Patent Application for Manufacturing Method of Wafer Frame Continuous Processing Mask and Wafer Frame Continuous Mask Manufactured Thereby

Semiconductor

| Sun 30 Aug 2026

Seoul, Aug. 31 -- ApS Inc has filed a patent application for Manufacturing Method of Wafer Frame Continuous Processing Mask and Wafer Frame Continuous Mask Manufactured Thereby. This invention was developed by Kwon Oeun, Moon Jong Woon and Kim Hwi Su. The patent application number is KR20240105956 20240808. The patent publica..

Korean Intellectual Property Office Receives Nitto Denko Corp and Nitto Seiki KK Patent Application for Tape Processing Apparatus for Semiconductor Work and Tape Exchange Method fo..

Semiconductor

| Sun 30 Aug 2026

Seoul, Aug. 31 -- Korean Intellectual Property Office has received Nitto Denko Corp and Nitto Seiki KK patent application for Tape Processing Apparatus for Semiconductor Work and Tape Exchange Method for Semiconductor Work. Okuno Chouhei developed the invention. The patent application number is KR20240090200 20240709. The pat..

Nuoshi Tech Zhejiang Co Ltd Files Chinese Patent Application for Micro Led Micro Display Chip

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Nuoshi Tech Zhejiang Co Ltd has filed a patent application for Micro Led Micro Display Chip. This invention was developed by Yan Gaige, Wang Xiaonan and Zhu Youliang. The patent application number is CN202610633902 20260509. The patent publication number is CN122180234 (A). International Patent Classificat..

Jiangsu Third Generation Semiconductor Research Inst Co Ltd Seeks Patent for Light Emitting Diode Epitaxial Wafer and Preparation Method and Application Thereof

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Jiangsu Third Generation Semiconductor Research Inst Co Ltd has sought patent for Light Emitting Diode Epitaxial Wafer and Preparation Method and Application Thereof. This invention was developed by Yan Qi'ang and Wang Guobin. The patent application number is CN202411802059 20241209. The patent publication..

Jiangsu Third Generation Semiconductor Research Inst Co Ltd Submits Chinese Patent Application for Epitaxial Wafer, and Preparation Method and Application of Epitaxial Wafer

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Jiangsu Third Generation Semiconductor Research Inst Co Ltd has submitted a patent application for Epitaxial Wafer, and Preparation Method and Application of Epitaxial Wafer. This invention was developed by Yan Qi'ang and Wang Guobin. The patent application number is CN202411802062 20241209. The patent pub..

Jiangxi Yaochi Tech Co Ltd Files Chinese Patent Application for Forward-installed Led Chip and Preparation Method Thereof

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Jiangxi Yaochi Tech Co Ltd has filed a patent application for Forward-installed Led Chip and Preparation Method Thereof. This invention was developed by Jin Conglong, Hu Jiahui, Xu Zhou and Cao Guangliang. The patent application number is CN202610272389 20260306. The patent publication number is CN12218021..

Zhongmao Green Energy Tech Xi'an Co Ltd Applies for Patent on Cadmium Telluride Thin-film Solar Cell Based on P-type Copper-containing Oxide Back Contact Layer and Preparation Meth..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Zhongmao Green Energy Tech Xi'an Co Ltd has applied Chinese patent for Cadmium Telluride Thin-film Solar Cell Based on P-type Copper-containing Oxide Back Contact Layer and Preparation Method of Cadmium Telluride Thin-film Solar Cell. Ma Qianqian and Ding Ye developed it. The patent application number is C..

State Intellectual Property Office of China Receives Ruishi Shenzhen Display Tech Co Ltd Patent Application for Rare Earth Ion Co-doped Two-dimensional Semiconductor Material with ..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Ruishi Shenzhen Display Tech Co Ltd patent application for Rare Earth Ion Co-doped Two-dimensional Semiconductor Material with Optimized Proportion and Preparation Method and Application Thereof. Zhao Tianlong, Zhao Yingxue, Yue Yi and Zhao Hongquan dev..

State Intellectual Property Office of China Receives Nat Ct Advanced Packaging Co Ltd NCAP China Patent Application for Photoelectric Co-packaging Semiconductor Device Structure an..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Nat Ct Advanced Packaging Co Ltd NCAP China patent application for Photoelectric Co-packaging Semiconductor Device Structure and Preparation Method Thereof. Dai Fengwei, Gao Li and Liu Fengman developed the invention. The patent application number is..

Geke Semiconductor Shanghai Co Ltd Seeks Patent for Backside Illuminated Image Sensor Forming Method and Image Sensor

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Geke Semiconductor Shanghai Co Ltd has sought patent for Backside Illuminated Image Sensor Forming Method and Image Sensor. This invention was developed by Wang Chunlin, Zeng Tian and Zou Wen. The patent application number is CN202411809086 20241209. The patent publication number is CN122180165 (A). Intern..

State Intellectual Property Office of China Releases Geke Semiconductor Shanghai Co Ltd Patent Application for Forming Method of Semiconductor Device, Semiconductor Device and Imag..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Geke Semiconductor Shanghai Co Ltd patent application for Forming Method of Semiconductor Device, Semiconductor Device and Image Sensor. This invention was developed by Zeng Tian and Zou Wen. The patent application number is CN202411808609 20241209. ..

State Intellectual Property Office of China Receives Geke Semiconductor Shanghai Co Ltd Patent Application for Non-stack Image Sensor and Preparation Method Thereof

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Geke Semiconductor Shanghai Co Ltd patent application for Non-stack Image Sensor and Preparation Method Thereof. Zeng Tian, Xu Jian and Zou Wen developed the invention. The patent application number is CN20261066683 20260116. The patent publication n..

Shanghai Xinwei Semiconductor Co Ltd Seeks Patent for Semiconductor Device and Preparation Method of Semiconductor Device

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Shanghai Xinwei Semiconductor Co Ltd has sought patent for Semiconductor Device and Preparation Method of Semiconductor Device. This invention was developed by Yin Jie, Tang Sishi, Lei Jiacheng and Zhang Wei. The patent application number is CN202610317083 20260316. The patent publication number is CN12218..

Beijing Zhongke Xinweite Tech Development Co Ltd Applies for Patent on Preparation Method and Structure of Metal-oxide Semiconductor Field Effect Transistor

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Beijing Zhongke Xinweite Tech Development Co Ltd has applied Chinese patent for Preparation Method and Structure of Metal-oxide Semiconductor Field Effect Transistor. Zhang Yanfei, Li Qing, Wen Xiaoxia, Wang Dandan, Liu Mengxin, Li Ya and Zhang Danyang developed it. The patent application number is CN20261..

Institute Electronic Eng China Academy Eng Physics Submits Chinese Patent Application for Silicon Carbide Bipolar Semiconductor Device with Heterojunction and Preparation Method Th..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Institute Electronic Eng China Academy Eng Physics has submitted a patent application for Silicon Carbide Bipolar Semiconductor Device with Heterojunction and Preparation Method Thereof. This invention was developed by Li Zhiqiang, Li Juntao, Li Lingfeng, Liao Zhengxiang, Zhang Lin, Li Lianghui and Xu Xinglia..

Zhanxun Semiconductor Chengdu Co Ltd Submits Chinese Patent Application for Wireless Local Area Network Authorized Flow Identification and Service Quality Guarantee Method and Devi..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Zhanxun Semiconductor Chengdu Co Ltd has submitted a patent application for Wireless Local Area Network Authorized Flow Identification and Service Quality Guarantee Method and Device, Wireless Access Point, Terminal Chip, Terminal Chip Module and Terminal Equipment. This invention was developed by Jiang Dawei..

State Intellectual Property Office of China Receives University of Macau and Shenzhen Futian District Aoda Hetao Integrated Circuit Research Institute Patent Application for First ..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received University of Macau and Shenzhen Futian District Aoda Hetao Integrated Circuit Research Institute patent application for First Chip, Second Chip and Single-channel Bidirectional Isolation System. Mai Peiran, Jiang Yang, Liang Zhi'ao, Jia Siman and Ma Xu..

State Intellectual Property Office of China Releases Hangzhou Dixin Tech Co Ltd Patent Application for Control Method of Serial Peripheral Interface Applied to Beam Forming Chip, B..

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Hangzhou Dixin Tech Co Ltd patent application for Control Method of Serial Peripheral Interface Applied to Beam Forming Chip, Beam Forming Chip and Radio Frequency Front End. This invention was developed by Li Yan, Song Zhihao, Zhang Luan and Wu Ruili. ..

State Intellectual Property Office of China Publishes Hangzhou Dixin Tech Co Ltd Patent Application for Circuit of Serial Peripheral Interface, Beam Forming Chip and Radio Frequenc..

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has published Hangzhou Dixin Tech Co Ltd patent application for Circuit of Serial Peripheral Interface, Beam Forming Chip and Radio Frequency Front End. The invention was developed by Li Yan, Song Zhihao, Zhang Luan and Wu Ruili. The patent application number is ..

State Intellectual Property Office of China Publishes Beijing Maoruixin Tech Co Ltd Patent Application for Turn-off Circuit of High-side Driver, Chip and Electronic Equipment

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has published Beijing Maoruixin Tech Co Ltd patent application for Turn-off Circuit of High-side Driver, Chip and Electronic Equipment. The invention was developed by Fan Bo, Jiao Yutao, Li Jiawei and Sheng Lin. The patent application number is CN202610147489 202..

Zitai Microelectronics Shanghai Co Ltd Submits Patent Application for Low-power-consumption Bluetooth SOC Adaptive Clock Gating Structure and Chip

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Zitai Microelectronics Shanghai Co Ltd has submitted a patent application for Low-power-consumption Bluetooth SOC Adaptive Clock Gating Structure and Chip. Xue Daoshan developed the invention. The patent application number is CN202610637348 20260511. The patent publication number is CN122178879 (A). Intern..

State Intellectual Property Office of China Publishes Beijing Maoruixin Tech Co Ltd Patent Application for Relaxation Oscillator Circuit, Control Method, Integrated Chip and Electr..

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has published Beijing Maoruixin Tech Co Ltd patent application for Relaxation Oscillator Circuit, Control Method, Integrated Chip and Electronic Equipment. The invention was developed by Yang Xiufang, Fan Bo, Jiao Yutao and Sheng Lin. The patent application numbe..

Guangxi Tiexiang Tech Co Ltd Submits Chinese Patent Application for Resistor Adjusting Method and System Based on MEMS Technology

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Guangxi Tiexiang Tech Co Ltd has submitted a patent application for Resistor Adjusting Method and System Based on MEMS Technology. This invention was developed by Zhang Mingxin, Li Jun, Yao Yuqiang, Fu Longfei, Zhu Haipeng, He Pei and Lou Hanwei. The patent application number is CN202610654548 20260513. Th..

Shenzhen Microsource Semiconductor Co Ltd Applies for Patent on Low-dropout Linear Voltage Stabilizing Circuit, Chip and Electronic Equipment

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Shenzhen Microsource Semiconductor Co Ltd has applied Chinese patent for Low-dropout Linear Voltage Stabilizing Circuit, Chip and Electronic Equipment. Nie Dan and Yuan Tao developed it. The patent application number is CN202610652681 20260513. The patent publication number is CN122178724 (A). Internationa..

Shanghai Huahong IC Co Ltd Applies for Patent on Bootstrap Charge Pump Structure

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Shanghai Huahong IC Co Ltd has applied Chinese patent for Bootstrap Charge Pump Structure. Luo Yi, Fan Xing and Zhao Wenguang developed it. The patent application number is CN202610270221 20260306. The patent publication number is CN122178710 (A). International Patent Classification code is H02M3/07. T..

Changzhou Guiyuan New Energy Mat Co Ltd Files Chinese Patent Application for Low-expansion Silicon-carbon Negative Electrode Material Based on Composite Porous Carbon Substrate and..

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Changzhou Guiyuan New Energy Mat Co Ltd has filed a patent application for Low-expansion Silicon-carbon Negative Electrode Material Based on Composite Porous Carbon Substrate and Preparation Method of Low-expansion Silicon-carbon Negative Electrode Material. This invention was developed by Ren Chunlei, Huang ..

Kunshan Semi Kentonghui Semiconductor Tech Co Ltd Submits Chinese Patent Application for Electric Arc Detection Processing Method and Device for Radio Frequency Plasma Processing S..

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Kunshan Semi Kentonghui Semiconductor Tech Co Ltd has submitted a patent application for Electric Arc Detection Processing Method and Device for Radio Frequency Plasma Processing System. This invention was developed by Duan Yaoduo and Dang Junfeng. The patent application number is CN202610309281 20260313. ..

Jiangmen Branch of Zhonglian Taiping Zhuhai Political and Law Consulting Service Co Ltd Submits Chinese Patent Application for Online Health Management Method and System Based on I..

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Jiangmen Branch of Zhonglian Taiping Zhuhai Political and Law Consulting Service Co Ltd has submitted a patent application for Online Health Management Method and System Based on Intelligent Chip. This invention was developed by Xu Yina, Xu Lian, Xu Teli and Xu Yi. The patent application number is CN202610..

Wenzhou Yingjie Machinery Equipment Co Ltd Granted Patent for Special Water-cooling Red Copper Conductive Seat Assembly for Electroplating Equipment

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Wenzhou Yingjie Machinery Equipment Co Ltd has been granted a patent for Special Water-cooling Red Copper Conductive Seat Assembly for Electroplating Equipment. Hu Guoli developed the invention. The patent application number is CN202421609384U 20240709. The patent publication number is CN223598556 (U). Int..

State Intellectual Property Office of China Awards Patent for High-reliability Ceramic Chip Capacitor

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has awarded a patent to Success Electronics Huizhou Co Ltd for High-reliability Ceramic Chip Capacitor. Yang Hao and Li Hai developed the invention. The patent application number is CN20242356723U 20241211. The patent publication number is CN223598548 (U). Intern..

Anhui Chengde Gonggao Steel Proc Co Ltd Granted Patent for High-efficiency Heat Dissipation Silicon Steel Sheet Laminated Structure

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Anhui Chengde Gonggao Steel Proc Co Ltd has been granted a patent for High-efficiency Heat Dissipation Silicon Steel Sheet Laminated Structure. Han Bing, Feng Gangyin, Li Guofang and Dong Hui developed the invention. The patent application number is CN202520269271U 20250220. The patent publication number i..

Megahunt Tech Co Ltd Gains Patent for Circuit for Testing Power Supply Reliability of Chip

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Chinese Patent for Circuit for Testing Power Supply Reliability of Chip has been issued to Megahunt Tech Co Ltd. This invention was developed by Qi Mengchao, Li Li, Zhang Fang and Wang Biao. The patent application number is CN202422972485U 20241203. The patent publication number is CN223597863 (U). Interna..

Jiefeng Test Tech Kunshan Co Ltd Granted Patent for Testing Device for Semiconductor Device

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Jiefeng Test Tech Kunshan Co Ltd has been granted a patent for Testing Device for Semiconductor Device. Qiu Weiguang, Chen Xinjun, Xie Jingqi and Bai Ming developed the invention. The patent application number is CN202422868658U 20241125. The patent publication number is CN223597818 (U). International Pate..

State Intellectual Property Office of China Awards Patent for Self-positioning Chip Inspection Test Socket

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has awarded a patent to Beizhen Electronic Tech Co Ltd for Self-positioning Chip Inspection Test Socket. Fan Caifeng developed the invention. The patent application number is CN202422796820U 20241118. The patent publication number is CN223597716 (U). Internationa..

Qingdao Xinfu New Material Tech Co Ltd Secures Patent for Finished Product Detection Machine for Semiconductor Rubber Ring Production

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Qingdao Xinfu New Material Tech Co Ltd has secured a patent on Finished Product Detection Machine for Semiconductor Rubber Ring Production. Zhang Shixin, Zhang Jinguo, Ma Jinfu, Yan Xu and Sun Mingchao developed the invention. The patent application number is CN20242359485U 20241212. The patent publication..

Xi'an Lumcore Optoelectronics Tech Co Ltd Granted Chinese Patent for Microstructure Semiconductor Laser Bar Detection Probe

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Xi'an Lumcore Optoelectronics Tech Co Ltd has been granted a patent for Microstructure Semiconductor Laser Bar Detection Probe. This invention was developed by Zhang Duoshi, Xu Bin, Qiu Bocang, Zhao Yongchao, Ren Zhanqiang, Li Yujia and Guo Xianwu. The patent application number is CN202422875953U 20241125...

State Intellectual Property Office of China Awards Patent for Manual Rotation Impact Test Tool for MEMS Inertial Product

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has awarded a patent to Xi'an Junjie Xinchuang Electronic Tech Co Ltd for Manual Rotation Impact Test Tool for MEMS Inertial Product. Ma Jiangang, Yang Dong, Xue Dongmei, Liu Cong, Liu Gang, Wang Kun and Yan Fukang developed the invention. The patent application ..

Zhejiang Xingke Photoelectric Tech Co Ltd and Beijing Bojia Tech Co Ltd Gain Patent for Thermocouple Assembly of Liquid Crystal Substrate Platinum Channel and Glass Production Devi..

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Chinese Patent for Thermocouple Assembly of Liquid Crystal Substrate Platinum Channel and Glass Production Device has been issued to Zhejiang Xingke Photoelectric Tech Co Ltd and Beijing Bojia Tech Co Ltd. This invention was developed by Feng Zikang, Zhao Yonghua, Dong Qingmin and Fan Hongbin. The patent a..

Qinghai Huaxin Silicon Ind Co Ltd Gains Patent for Raw Material Proportioning and Weighing Equipment for Silicon Production

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Chinese Patent for Raw Material Proportioning and Weighing Equipment for Silicon Production has been issued to Qinghai Huaxin Silicon Ind Co Ltd. This invention was developed by Li Caiying, Yan Gaoding, An Zongquan and Zhao Shengyu. The patent application number is CN202423281735U 20241230. The patent publ..

Lianyungang Qixiang Electronic Co Ltd Gets Patent for Drying Device for Piezoelectric Quartz Crystal Frequency Chip Production

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Lianyungang Qixiang Electronic Co Ltd has received a patent for Drying Device for Piezoelectric Quartz Crystal Frequency Chip Production. This invention was developed by Xu Dasi, Ma Jinbang, Wang Wanmei and Wang Wanyun. The patent application number is CN202423273762U 20241230. The patent publication numbe..

Dalian Shengguang Tech Development Co Ltd Secures Patent for Novel Sealing Device for Aluminized Silicon Production Process

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Dalian Shengguang Tech Development Co Ltd has secured a patent on Novel Sealing Device for Aluminized Silicon Production Process. Chen Liangliang and Liu Jia developed the invention. The patent application number is CN202520250421U 20250218. The patent publication number is CN223594966 (U). International P..

State Intellectual Property Office of China Receives Wiiss Beijing Tech Co Ltd Patent Application for Six-axis PCB Drilling Machine Automatic Chip Cleaning Assembly and Method Ther..

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Wiiss Beijing Tech Co Ltd patent application for Six-axis PCB Drilling Machine Automatic Chip Cleaning Assembly and Method Thereof. Sun Xingguo and Wang Fan developed the invention. The patent application number is CN202610646276 20260512. The patent..

Wanhua Chemical Group Electronic Mat Co Ltd Applies for Patent on Polishing Pad with Grooves for Reducing Flowing Resistance of Polishing Solution and Wafer Polishing Device

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Wanhua Chemical Group Electronic Mat Co Ltd has applied Chinese patent for Polishing Pad with Grooves for Reducing Flowing Resistance of Polishing Solution and Wafer Polishing Device. Chai Wanli, Jin Yunquan and Xie Yu developed it. The patent application number is CN202610457993 20260409. The patent publi..

State Intellectual Property Office of China Releases Suzhou Canaan Holding Group Co Ltd Patent Application for Anti-cracking Polishing Equipment for Semiconductor Wafer

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Suzhou Canaan Holding Group Co Ltd patent application for Anti-cracking Polishing Equipment for Semiconductor Wafer. This invention was developed by Hong Shanshan and Gao Li. The patent application number is CN202610497452 20260415. The patent public..

Anhui Microchip Changjiang Semiconductor Mat Co Ltd Seeks Patent for Method for Directly Grinding Silicon Surface of Silicon Carbide Crystal Ingot by Filling Carbon Surface

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has sought patent for Method for Directly Grinding Silicon Surface of Silicon Carbide Crystal Ingot by Filling Carbon Surface. This invention was developed by Zuo Xuan, Yao Zhiyong, Zhong Chao, Jiang Chengchen and Cao Dekun. The patent application number ..

State Intellectual Property Office of China Releases Shanghai Inst of Microsystem and Information Technology Chinese Academy Of Sciences Patent Application for Polishing Method of ..

Semiconductor

| Mon 31 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Shanghai Inst of Microsystem and Information Technology Chinese Academy Of Sciences patent application for Polishing Method of Polycrystalline Silicon Carbide. This invention was developed by Song Zhitang, Xu Manlin, Li Yaowen and Liu Weili. The pate..

Suzhou Dingtian Prec Machinery Co Ltd Submits Patent Application for Electronic Display Float Glass Substrate Cleaning Machine

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Suzhou Dingtian Prec Machinery Co Ltd has submitted a patent application for Electronic Display Float Glass Substrate Cleaning Machine. Zhu Wendeng, Li Junpeng and Zhong Guochang developed the invention. The patent application number is CN202610622533 20260508. The patent publication number is CN122184027 ..

State Intellectual Property Office of China Receives Jiangsu Shineng New Energy Tech Co Ltd Patent Application for Crushed Material Discharging Type Silicon Material Cleaning Devic..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Jiangsu Shineng New Energy Tech Co Ltd patent application for Crushed Material Discharging Type Silicon Material Cleaning Device. Yuan Hui, Cheung Hocheung and Wang Huameng developed the invention. The patent application number is CN202610615637 2026..

State Intellectual Property Office of China Publishes Shanxi High Tech Huaye Electronic Group Co Ltd Patent Application for Sorting Method for LED Packaging

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has published Shanxi High Tech Huaye Electronic Group Co Ltd patent application for Sorting Method for LED Packaging. The invention was developed by Zhang Yi, Zhang Ting, Cai Meng and Zhang Shengdun. The patent application number is CN20261074899 20260120. The pa..

State Intellectual Property Office of China Receives Zhejiang Jinweike Houseware Tech Co Ltd Patent Application for Preparation Method for Spraying Silicon Dioxide Insulating Layer..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Zhejiang Jinweike Houseware Tech Co Ltd patent application for Preparation Method for Spraying Silicon Dioxide Insulating Layer on Outer Surface of Inner Container of Vacuum Cup. Sheng Wei, Deng Huangfei, Li Dan, Zhu Xiulan and Liu Jiangxiong developed ..

Futula New Energy Tech Jiangsu Co Ltd Seeks Patent for Device Capable of Improving Coating Stability of Flexible Solar Cell Slit

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Futula New Energy Tech Jiangsu Co Ltd has sought patent for Device Capable of Improving Coating Stability of Flexible Solar Cell Slit. This invention was developed by Xu Ning, Zhu Maoqian, Miao Xuefeng and Jin Junzhe. The patent application number is CN202610530469 20260421. The patent publication number i..

Huahong Ruiguang Beijing Optoelectronic Devices Mfg Co Ltd Submits Patent Application for Glue Filling Device and Method for Chip Assembly

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Huahong Ruiguang Beijing Optoelectronic Devices Mfg Co Ltd has submitted a patent application for Glue Filling Device and Method for Chip Assembly. Wang Shuai, Bao Zhebo and Liu Mengying developed the invention. The patent application number is CN202610267310 20260305. The patent publication number is CN12..

Liaoning Jiangfeng Insulation Mat Co Ltd Submits Chinese Patent Application for Anti-blocking Double-helix Driving Ball Silicon Thermal Insulation Material Spraying and Mixing Devi..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Liaoning Jiangfeng Insulation Mat Co Ltd has submitted a patent application for Anti-blocking Double-helix Driving Ball Silicon Thermal Insulation Material Spraying and Mixing Device. This invention was developed by Xing Bo, Zhang Ying, Hu Xiuming, Lian Yuli, Wang Ziquan, Zhou Jialu, Zhu Wanli, Wang Tingping,..

State Intellectual Property Office of China Releases SDR Diagnostics Ltd Patent Application for Micro-fluidic Chip for Blood Detection and Blood Detection Method

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released SDR Diagnostics Ltd patent application for Micro-fluidic Chip for Blood Detection and Blood Detection Method. This invention was developed by Liu Lei, Wu Liya, Wang Yueqiang, Wang Liqiang and Zhang Yinan. The patent application number is CN2026101505..

State Intellectual Property Office of China Receives Beijing Xinmai Microbial Tech Co Ltd Patent Application for Micro-fluidic Chip for Coating Biological Substance Through Magneti..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has received Beijing Xinmai Microbial Tech Co Ltd patent application for Micro-fluidic Chip for Coating Biological Substance Through Magnetic Force and Preparation Method of Micro-fluidic Chip. Li Zixi and Yang Xiaohui developed the invention. The patent applicat..

State Intellectual Property Office of China Publishes NGK Co Ltd Patent Application for Core Substrate

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has published NGK Co Ltd patent application for Core Substrate. The invention was developed by Noda Asami and Ida Hirotatsu. The patent application number is CN20258005820 20250128. The patent publication number is CN122181236 (A). International Patent Classifica..

Adya Semiconductor Zink Tech Co Ltd Files Chinese Patent Application for Integrated Cooling Assembly for Advanced Device Packaging and Method of Manufacturing Same

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Adya Semiconductor Zink Tech Co Ltd has filed a patent application for Integrated Cooling Assembly for Advanced Device Packaging and Method of Manufacturing Same. This invention was developed by Katkar Rajesh and Haba Begosem. The patent application number is CN20248071851 20240924. The patent publication ..

State Intellectual Property Office of China Publishes Chengdu BOE Optoelectronics Technology and BOE Technology Group Patent Application for Array Substrate and Display Device

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has published Chengdu BOE Optoelectronics Technology and BOE Technology Group patent application for Array Substrate and Display Device. The invention was developed by Wang Binyan, Li He, Zhang Jingwen, Liu Cong, Song Jiang, Wang Miao, Cao Dan, Guo Yonglin, Hu Ming ..

Suanmiao Tech Beijing Co Ltd Seeks Patent for Data Quantification Method and Device, Computer Readable Storage Medium and Chip

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Suanmiao Tech Beijing Co Ltd has sought patent for Data Quantification Method and Device, Computer Readable Storage Medium and Chip. This invention was developed by Wang Hao and Yan Chao. The patent application number is CN20268000112 20260129. The patent publication number is CN122180968 (A). Internationa..

Hubei Jiangcheng Laboratory Applies for Patent on Method for Optimizing Edge of Reconstructed Wafer and Reconstructed Wafer

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Hubei Jiangcheng Laboratory has applied Chinese patent for Method for Optimizing Edge of Reconstructed Wafer and Reconstructed Wafer. Xie Huaqiang, Luo Chao, Gao Biao and Wan Yixian developed it. The patent application number is CN202610286936 20260310. The patent publication number is CN122180420 (A). Int..

State Intellectual Property Office of China Releases Harbin Crystal Pipe Factory Patent Application for High-power Transistor Crimping Packaging Structure with Positioning Buckle

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Harbin Crystal Pipe Factory patent application for High-power Transistor Crimping Packaging Structure with Positioning Buckle. This invention was developed by Zhang Yang, Xie Shengtao, Yu Jianing, Ma Xiukun, Ye Chan, Ma Xuguang and Xin Xiaodong. The ..

Qiangmao Semiconductor Xuzhou Co Ltd Submits Chinese Patent Application for Semiconductor Packaging Structure

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Qiangmao Semiconductor Xuzhou Co Ltd has submitted a patent application for Semiconductor Packaging Structure. This invention was developed by Wan Cuifeng, Fang Tingyu, Wu Zhengxian, Wang Yonghui, Ho Chung-hsiung and Wei Bing. The patent application number is CN202411776448 20241204. The patent publication..

Guojing Hechuang Qingdao Tech Co Ltd Submits Patent Application for Intelligent Chip Packaging Equipment and Packaging Process Thereof

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Guojing Hechuang Qingdao Tech Co Ltd has submitted a patent application for Intelligent Chip Packaging Equipment and Packaging Process Thereof. Zhang Fuxuan, Cui Caoxiang, Wang Shiyu, Guo Baijun, Liu Kangzhong, Lyu Yong and Zhang Chunyang developed the invention. The patent application number is CN20261014..

Shanghai Xianfeng Tech Co Ltd Submits Chinese Patent Application for Asymmetric Same-layer Shielding Structure for Photoelectric Co-packaging, Interposer and Semiconductor Packagin..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Shanghai Xianfeng Tech Co Ltd has submitted a patent application for Asymmetric Same-layer Shielding Structure for Photoelectric Co-packaging, Interposer and Semiconductor Packaging Piece. This invention was developed by Chen Junhong, Chuang Chih-jen, Meng Ting, Lin Zhengyi, Chen Zhihui, Gao Yongqiang and Tan..

Qili Semiconductor Shaoxing Co Ltd Submits Chinese Patent Application for Embedded Substrate Structure with Interposer and Manufacturing Method Thereof

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Qili Semiconductor Shaoxing Co Ltd has submitted a patent application for Embedded Substrate Structure with Interposer and Manufacturing Method Thereof. This invention was developed by Zhou Yong and Li Runyang. The patent application number is CN202610196063 20260211. The patent publication number is CN122..

Guangxi Huaxin Zhenbang Semiconductor Co Ltd Submits Chinese Patent Application for Low-cost Rewiring Packaging Preparation Method

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Guangxi Huaxin Zhenbang Semiconductor Co Ltd has submitted a patent application for Low-cost Rewiring Packaging Preparation Method. This invention was developed by Zhang Yanshuo, Meng Zhonglyu, Bi Zhongquan and Liu Yuli. The patent application number is CN202610346973 20260320. The patent publication numbe..

Forehope Semiconductor Ningbo Limited Co Submits Patent Application for Substrate Wiring Packaging Method and Substrate Wiring Packaging Structure

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Forehope Semiconductor Ningbo Limited Co has submitted a patent application for Substrate Wiring Packaging Method and Substrate Wiring Packaging Structure. He Zhenghong, Zhong Lei and Xu Yupeng developed the invention. The patent application number is CN202610645359 20260512. The patent publication number ..

State Intellectual Property Office of China Releases Hefei Nexchip Integrated Circuit and Anhui University Patent Application for Preparation Method of Semiconductor Structure and ..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Hefei Nexchip Integrated Circuit and Anhui University patent application for Preparation Method of Semiconductor Structure and Gate Structure and Method for Reducing Defects. This invention was developed by Chen Xuegang, Zhang Xin, Ma Yaqiang and Zhou X..

IMT Co Ltd Submits Patent Application for Apparatus for Drying of Semiconductor Wafer

Semiconductor

| Sun 30 Aug 2026

Seoul, Aug. 31 -- IMT Co Ltd has submitted a patent application for Apparatus for Drying of Semiconductor Wafer. Lee Jong Myoung developed the invention. The patent application number is KR20230103425 20230808. The patent publication number is KR20250022416 (A). International Patent Classification codes are G02B26/12, H01L21/..

Hebei Kongtian Zhizao Tech Co Ltd Submits Chinese Patent Application for High-stability Double-track Synchronous High-speed Chip Mounter

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Hebei Kongtian Zhizao Tech Co Ltd has submitted a patent application for High-stability Double-track Synchronous High-speed Chip Mounter. This invention was developed by Liu Zhiwei, Kang Yang, Zhang Yi, Shi Shuai, Zhang Yongwei, Kang Ying, Song Yang, Zhang Yanan and Ren Bo. The patent application number is..

Medtrum Tech Co Ltd Applies for Patent on Dermis Layer Analyte Detection Device with Rigid Substrate

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Medtrum Tech Co Ltd has applied Chinese patent for Dermis Layer Analyte Detection Device with Rigid Substrate. Yang Cuijun developed it. The patent application number is CN202610367452 20260324. The patent publication number is CN122182020 (A). International Patent Classification codes are A61B5/145 and A6..

Boluo Konka Exactitude Science Tech Co Ltd Files Chinese Patent Application for Preparation Method of Thin Copper Core Substrate Composite Outer Layer Circuit

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Boluo Konka Exactitude Science Tech Co Ltd has filed a patent application for Preparation Method of Thin Copper Core Substrate Composite Outer Layer Circuit. This invention was developed by Lei Renqing, Xiao Zunmin, Huang Shangliang and Zhong Xiaohuan. The patent application number is CN202610152309 202602..

Chengdu Dazhan Shidai Nano Tech Co Ltd Submits Chinese Patent Application for Device and Method for Preparing Carbon Nanotubes by Combining Microwave Plasma with Chemical Vapor Dep..

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- Chengdu Dazhan Shidai Nano Tech Co Ltd has submitted a patent application for Device and Method for Preparing Carbon Nanotubes by Combining Microwave Plasma with Chemical Vapor Deposition. This invention was developed by Li Yan, Sun Huahong and Wang Yuhong. The patent application number is CN202411802282 2..

State Intellectual Property Office of China Releases Beijing Inst Technology Patent Application for Annular Scanning Probe Based on MEMS Micromirror

Semiconductor

| Sun 30 Aug 2026

Beijing, Aug. 31 -- State Intellectual Property Office of China has released Beijing Inst Technology patent application for Annular Scanning Probe Based on MEMS Micromirror. This invention was developed by Zhou Chenyang, Chen Qian, Huang Luyang, Xie Huikai, Jin Jiaan and Yu Silei. The patent application number is CN2026105891..

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