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Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- Beijing NAURA Microelectronics Equipment has filed a patent application for Semiconductor Device. This invention was developed by Gao Rui. The patent application number is CN202311402107 20231026. The patent publication number is CN119905419 (A). International Patent Classification codes are H01J37/32 and H..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has filed a patent application for Manufacturing Method of Suspension Shielding Layer. This invention was developed by Fu Bo, Zhu Yiming, Yang Hui and Yan Qiangsheng. The patent application number is CN20251072751 20250116. The patent publicatio..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Nanya Tech has submitted a patent application for Semiconductor Device Having Gate Structure and Method for Manufacturing the Same. This invention was developed by Hao Chung-peng. The patent application number is US202519295966 20250811. The patent publication number is US2025365927 (A1). International P..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Samsung Electronics has submitted a patent application for Semiconductor Devices. Lee Hyeran, Park Sohyun, Na Kyoungcho and Yang Seryeun developed the invention. The patent application number is US202519293508 20250807. The patent publication number is US2025365937 (A1). International Patent Classificati..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Samsung Electronics has submitted a patent application for Semiconductor Device. This invention was developed by Cho Hyungki and Choi Minjeong. The patent application number is US202418965037 20241202. The patent publication number is US2025365941 (A1). International Patent Classification code is H10B12/..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Samsung Electronics has submitted a patent application for Semiconductor Memory Devices. This invention was developed by Kim Yujin, Kim Hyeoncheol, Yoo Bowon, Han Seunguk and Han Jinwoo. The patent application number is US202519018660 20250113. The patent publication number is US2025365942 (A1). Internat..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Samsung Electronics has submitted a patent application for Semiconductor Devices and Data Storage Systems Including the Same. This invention was developed by Kim Jinhyuk, Kim Pyeongwoo, Lee Jongmin and Choi Yitaek. The patent application number is US202418965054 20241202. The patent publication number is..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- International Business Machines has submitted a patent application for Thermal Management Structure for Memory Stacks on Logic. Golz John W, Knickerbocker John, Farooq Mukta Ghate and Matsumoto Keiji developed the invention. The patent application number is US202418674173 20240524. The patent publication..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Yangtze Memory Technologies has submitted a patent application for Memory System, Host, Operation Method, and Data Processing System. Ye Ganlin developed the invention. The patent application number is US202418824586 20240904. The patent publication number is US2025362809 (A1). International Patent Class..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device. This invention was developed by Kobayashi Yumiko and Watahiki Tatsuro. The patent application number is US202218872286 20220628. The patent publication number is US2025366116 (A1). International Patent Classification codes a..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- United Microelectronics Corporation has submitted a patent application for Semiconductor Device and Method for Fabricating the Same. This invention was developed by Zhan Zhaoyao, Du Xianfeng, Jiang Xiaohong and Tey Ching Hwa. The patent application number is US202418777584 20240719. The patent publicatio..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Stanley Electric has submitted a patent application for Light-emitting Device and Manufacturing Method of Light-emitting Device. Chiba Hirofumi and Yasuda Yoshiaki developed the invention. The patent application number is US202519214175 20250521. The patent publication number is US2025366273 (A1). Intern..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- LG Electronics has submitted a patent application for Display Device Using Light-emitting Element and Manufacturing Method Therefor. Choi Hwanjoon, Rhee Byungjoon and Kang Eunjeong developed the invention. The patent application number is US202218869650 20220613. The patent publication number is US202536..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- ARM Ltd has submitted a patent application for Tag Way-halting. This invention was developed by Mccombs Jr Edward Martin, Tune Andrew David, Salisbury Sean James and Kumar Akshay. The patent application number is US202418673614 20240524. The patent publication number is US2025363003 (A1). International P..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Samsung Electronics has submitted a patent application for System and Method of Inter/intra-memory Tiering. This invention was developed by Jo Myung Hyun. The patent application number is US202418952207 20241119. The patent publication number is US2025363046 (A1). International Patent Classification code..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- United Microelectronics Corporation has submitted a patent application for Semiconductor Device and Method for Fabricating the Same. This invention was developed by Wang Hui-lin, Chen Wei, Hsu Po-kai, Wang Yu-ping and Chen Hung-yueh. The patent application number is US202519296920 20250811. The patent pu..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- OneTrust has submitted a patent application for Generating Probabilistic Data Structures for Lookup Tables in Computer Memory for Multi-token Searching. Viswanathan Subramanian, Balasubramanian Anand, Shah Milap and Cai Tianchen developed the invention. The patent application number is US202519228077 202..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device. Furukawa Reona and Soneda Shinya developed the invention. The patent application number is CN202411451819 20241017. The patent publication number is CN119907250 (A). International Patent Classification codes are H01L23/367, H10..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- Xidian University has submitted a patent application for High-thermal-conductivity AlGaN/InxAl1-xSb High-electron-mobility Transistor and Preparation Method Thereof. This invention was developed by Tao Hongchang, Lu Bowen, Xu Shengrui, Zhang Tao, Su Huake, Gao Yuan, Liu Xu, Wang Xinhao and Hao Yue. The pate..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- Anhui University has submitted a patent application for Bipolar Ion Gated Transistor Based on MOS2 and Preparation Method Thereof. This invention was developed by Xu Zuyu, Pan Yuhang, Cao Shouwei, Wang Zhitong, Zhu Yunlai, Wu Zuheng and Dai Yuehua. The patent application number is CN20251054596 20250114. Th..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device. This invention was developed by Oka Toshihide. The patent application number is CN20228099625 20221005. The patent publication number is CN119908167 (A). International Patent Classification code is H05K1/14. Cooperative Patent ..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received Microsoft Technology Licensing patent application for Cached Random Access Memory (RAM) Counter System. Gal Tama, Yankilevich Yevgeny and Savir Gil developed the invention. The patent application number is US202418674590 20240524. The patent publication numbe..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received Adeia Semiconductor Bonding Technologies patent application for Structures and Methods for Integrated Cold Plate in Xpus and Memory. Mirkarimi Laura, Fountain Jr Gaius Gillman and Haba Belgacem developed the invention. The patent application number is US20251..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received ROHM patent application for Semiconductor Device. Tanaka Bungo developed the invention. The patent application number is US202519296601 20250811. The patent publication number is US2025364404 (A1). International Patent Classification codes are H01L23/31 and H..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received Samsung Electronics patent application for Semiconductor Devices. Kim Sinyeon developed the invention. The patent application number is US202519204817 20250512. The patent publication number is US2025365936 (A1). International Patent Classification codes are ..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received KIOXIA patent application for Semiconductor Memory. Hishida Tomoo, Murakami Sadatoshi, Katsumata Ryota and Iwase Masao developed the invention. The patent application number is US202519293535 20250807. The patent publication number is US2025365965 (A1). Inter..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received Csmc Technologies Fab2 patent application for Semiconductor Device and Preparation Method Therefor. Zhang Sen, He Nailong and Zhao Jingchuan developed the invention. The patent application number is US202318871694 20230208. The patent publication number is US..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received Will Semiconductor Shanghai patent application for Voltage Regulator. Ishida Manabu developed the invention. The patent application number is US202418889132 20240918. The patent publication number is US2025362697 (A1). International Patent Classification code..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received Will Semiconductor Shanghai patent application for Load Drive Circuit. Kimura Hiroyuki developed the invention. The patent application number is US202418884620 20240913. The patent publication number is US2025362699 (A1). International Patent Classification c..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received Samsung Electronics patent application for Semiconductor Device and Manufacturing Method Thereof. Lee Minseung, Lee Kyoungwoo and Ha Seungseok developed the invention. The patent application number is US202519014054 20250108. The patent publication number is ..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received ROHM patent application for Semiconductor Device. Izumi Shota developed the invention. The patent application number is US202519208991 20250515. The patent publication number is US2025366171 (A1). International Patent Classification codes are H10D1/00, H10D1/..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- State Intellectual Property Office of China has received Samsung Electronics patent application for Semiconductor Device and Data Storage System Including Same. Lim Geun-won, Kweon Young-ho, Kim Chung Jin, Lee Jung-ho and Jung Yoon Kyu developed the invention. The patent application number is CN202410914851..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- State Intellectual Property Office of China has received Shanghai Huali Integrated Circuit Manufacturing patent application for Nor Flash Memory Manufacturing Method. Wang Qiwei, Shu Yufei, Yao Shaokang, Tian Zhi and Chen Haoyu developed the invention. The patent application number is CN202311413739 2023102..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- State Intellectual Property Office of China has received Nuvoton Technology patent application for Semiconductor Device and Forming Method. Chen Baian developed the invention. The patent application number is CN202410912002 20240709. The patent publication number is CN119907258 (A). International Patent Cla..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- State Intellectual Property Office of China has received Nuvoton Technology patent application for High Electron Mobility Transistor Device and Manufacturing Method Thereof. Wei Xuzhi and Wen Wenying developed the invention. The patent application number is CN202410914136 20240709. The patent publication nu..

Semiconductor

  |  Mon 01 Dec 2025

Alexandria, Dec. 1 -- Semiconductor Energy Laboratory has submitted a patent application for Electronic Device. This invention was developed by Yamazaki Shunpei, Kusunoki Koji, Watanabe Kazunori and Inoue Tatsunori. The patent application number is US202519290724 20250805. The patent publication number is US2025359844 (A1). Int..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Dexerials Corporation has submitted a patent application for Light Emitting Device Producing Method and Black Transfer Film. This invention was developed by Tsukao Reiji, Hayashi Naoki, Noda Daiki, Watanabe Kazumu and Shiraiwa Toshiki. The patent application number is US202318873844 20230426. The patent ..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has released McMaster University patent application for Ultra-thin Strain-relieving Si1-xGex Layers Enabling III-V Epitaxy on Si. This invention was developed by Lewis Ryan, Knights Andrew, Smith Trevor and Mcdermott Spencer. The patent application number is US20251921781..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received iCometrue Company patent application for Logic Drive Using Standard Commodity Programmable Logic IC Chips Comprising Non-volatile Random Access Memory Cells. Lee Jin-yuan and Lin Mou-shiung developed the invention. The patent application number is US202519010..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has published Texas Instruments Incorporated patent application for Switching Frequency Control for Integrated Resonant Half-bridge Isolated DC/DC with Burst Mode Operation. The invention was developed by Formenti Jose V, Martinez Robert, Corry Michael and Chakraborty Sombud..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- State Intellectual Property Office of China has published Tongkun Group Zhejiang Hengteng Differentiation Fiber patent application for Polyester Chip Raw Material Pretreatment Equipment. The invention was developed by Fang Shaofeng, Lu Huiquan, Chen Gui, Zhang Hua, Huang Kai and Zhu Shengqi. The patent applic..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- Beijing Xiaomi Mobile Software has submitted a patent application for Data Transmission Method and Device, Electronic Equipment, Chip and Medium. This invention was developed by Liu Zicheng and Shi Runyu. The patent application number is CN202311408047 20231026. The patent publication number is CN119906752 (A..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- State Intellectual Property Office of China has received Suzhou Institute of Nano-Tech & Nano-Bionics, Chinese Academy of Sciences patent application for Vector Measurement System and Method for Phased Array Chip Calibration and Application. Qin Hua, Yu Run, Liu Dong, Wang Mao, Zhou Qi, Cai Xinhang, Jin Lin an..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- State Intellectual Property Office of China has released National University of Defense Technology PLA patent application for Lossless Compression Circuit, Chip and Equipment for Pulse Waveform Data. This invention was developed by Tie Junbo, Wang Lei, Hu Dewen, Zhou Jiahao, Shen Hui, Yang Zhijie, Yang Jun, Zh..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- Tsinghua University has submitted a patent application for Analog-to-digital Conversion Circuit Based on Boost Module, Chip and Electronic Equipment. Zhong Yi, Gu Mingyang, Jie Lu and Sun Nan developed the invention. The patent application number is CN202411919200 20241224. The patent publication number is CN..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- Huawei Technologies has sought patent for Logic Circuit and Driving Method Thereof, Digital Chip and Electronic Equipment. This invention was developed by Zhang Qiang, Hou Chaozhao, Gan Weizhuo, Zhan Shijie, Wang Jiale and Xu Junhao. The patent application number is CN202311407047 20231026. The patent publica..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- State Intellectual Property Office of China has published STMicroelectronics International patent application for Level Shift Circuit. The invention was developed by Jouanneau Thomas, Bourne Christophe Marie Sylvie Marie, Zambogna Marcelo Maria and Engl Lars S F. The patent application number is CN20241148945..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- Anhui Geen Semiconductor has filed a patent application for Nitride Semiconductor Blue Laser Element. This invention was developed by Chen Chengjie, Zheng Jinjian, Hu Zhiyong, Cao Jun, Lan Jiabin, Xun Feilin, Deng Heqing, Cai Xin, Chen Wanjun, Li Xiaoqin, Zhang Jiangyong and Li Shuiqing. The patent applicatio..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- State Intellectual Property Office of China has received Institute of Semiconductors, Chinese Academy of Sciences patent application for Monolithic Integrated Semiconductor Main Oscillation Power Amplifier Laser. Song Hao, Zhang Ruikang, Lu Dan and Zhao Lingjuan developed the invention. The patent application..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- National University of Defense Technology PLA has submitted a patent application for Wavelength-locked Semiconductor Laser. This invention was developed by Wang Jun, Yu Hao, Wang Hongyan, Zhang Chaofan, Zhang Zhicheng, Li Xiao and Wang Wenxin. The patent application number is CN202510377164 20250328. The pate..

Semiconductor

  |  Mon 01 Dec 2025

Beijing, Dec. 1 -- Taiwan Semiconductor Manufacturing has applied Chinese patent for Package Structure, Semiconductor Package and Method of Forming Same. Cai Shenghan, Chen Congyu, Hong Wenxing and Chen Yanpu developed it. The patent application number is CN20251010392 20250103. The patent publication number is CN119905495 (A)...

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Crystallization of High-K Dielectric Layer. This invention was developed by Chen Chien-chang. The patent application number is US202519293372 20250807. The patent publication number is US2025366017 (A1). International Paten..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Micron Technology has submitted a patent application for Substrate Isolation in a Three Dimensional (3D) Memory Array. Tarekegn Eyob, Yastrebenetsky Kolya, Scarbrough Alyssa N, Howder Collin and Daycock David A developed the invention. The patent application number is US202519183069 20250418. The patent ..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Structures of SRAM Cell and Methods of Fabricating the Same. Chiu Kuan-chung, Chen Wei-hua, Lee Chieh, Lee Chun-ying, Liu Yi-ching and Huang Chia-en developed the invention. The patent application number is US202519287364 2..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Company patent application for Multi-port SRAM Cell with Metal Interconnect Structures. The invention was developed by Wang Ping-wei, Chang Feng-ming and Chen Jui-lin. The patent application number is US202519287182 2025073..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Semiconductor Device Package and Methods of Formation. Kuo Ting-ting, Huang Li-hsien, Yang Tien-chung, Chuang Yao-chun, Lu Yinlung and He Jun developed the invention. The patent application number is US202519290728 20250805. ..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- CXMT has applied United States patent for Package Structure, Semiconductor Structure, and Electronic Device. Shi Hengrong, Shi Honglong, Li Rui, Cheng Jingwei, Zhang Xing and Liu Qun developed it. The patent application number is US202418966531 20241203. The patent publication number is US2025364389 (A1). ..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Company patent application for Semiconductor Package and Methods of Manufacturing. This invention was developed by Chen Hsien-wei, Lin Meng-liang, Liao Li-ling and Jeng Shin-puu. The patent application number is US202519292132..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Corner Reinforcement Structure for Package Interconnect. This invention was developed by Cheng Chia-jen and Hsu Kuo-ching. The patent application number is US202519286584 20250731. The patent publication number is US202536438..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has published Texas Instruments Incorporated patent application for Interconnect for IC Package. The invention was developed by Camenforte Ruby Ann Merto, Camenforte Floro Lopez and Milo Dolores Babaran. The patent application number is US202519290806 20250805. The patent p..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- LX Semicon has sought patent for Power Semiconductor Module and Power Converter. This invention was developed by Kim Deog Soo, Kim Tae Ryong, Lee Myoung Ho and Kim You Suk. The patent application number is US202519293852 20250807. The patent publication number is US2025364380 (A1). International Patent Cla..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Via Connection Structure Having Multiple Via to Via Connections. This invention was developed by Yeh Ting-yu, Li Shu-cheng, Wen Chun-hsien and Chang Chih-wei. The patent application number is US202519293788 20250807. The pate..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has applied United States patent for Semiconductor Package Structure. Chen Kuo Wen, Lu Hsiang-tai, Tai Chih-hsuan and Wu Ming-chung developed it. The patent application number is US202519292954 20250807. The patent publication number is US2025364373 (A1). Internat..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Company patent application for Memory Structure Having Novel Circuit Routing and Method for Manufacturing the Same. This invention was developed by Lin Meng-han, Huang Chia-en and Liu Yi-ching. The patent application number is..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Micron Technology has submitted a patent application for Front End of Line Interconnect Structures and Associated Systems and Methods. This invention was developed by Kirby Kyle K and Parekh Kunal R. The patent application number is US202519289484 20250804. The patent publication number is US2025364371 (A1..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Through Vias and Guard Rings of Semiconductor Structure and Method of Forming Thereof. Lin Chien-hsun developed the invention. The patent application number is US202519286380 20250731. The patent publication number is US2025364370 (A..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has published International Business Machines patent application for Dual Level Cold Plate for Multiple Semiconductor Die Module. The invention was developed by Muzzy Christopher, Basutkar Monali Naresh, Singer Noah and Crafts James Mansfield. The patent application number ..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Company patent application for Semiconductor Package Structures and Methods of Forming the Same. The invention was developed by Lin Yu-sheng, Chen Chien Hung, Lai Po-chen, Wang Chin-hua and Jeng Shin-puu. The patent applicati..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has sought patent for Hybrid Vapor Chamber Lid. This invention was developed by Sheng Wei-kong, Lin Hsin Ting and Hung Wensen. The patent application number is US202519287218 20250731. The patent publication number is US2025364362 (A1). International Patent Classi..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Inverted Trapezoidal Heat Dissipating Solder Structure and Method of Making the Same. This invention was developed by Hsueh Chang-jung, Chang Yen Wei, Lin Cheng-nan, Lin Wei-hung and Cheng Ming-da. The patent application numb..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has applied United States patent for Thermal Resistor Manufacturing Method. Horng Jaw-juinn, Liu Szu-lin and Lai Wei-lin developed it. The patent application number is US202519293323 20250807. The patent publication number is US2025364359 (A1). International Paten..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has sought patent for Device Level Thermal Dissipation. This invention was developed by Chen Yu-hao, Lee Hui Yu, Kuan Jui-feng and Wu Chien-te. The patent application number is US202519286931 20250731. The patent publication number is US2025364358 (A1). Internatio..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing patent application for Package with Improved Heat Dissipation Efficiency and Method for Forming the Same. Shao Tung-liang, Huang Yu-sheng, Wu Kuo Yang and Yu Chen-hua developed the invention. The patent application number is U..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Company patent application for Semiconductor Device and Manufacturing Method Thereof. The invention was developed by Chiou Wen-chih, Hsieh Ping-yin, Shih Ying-ching, Wang Pu, Cheng Li-hui, Liao Yi-huan and Chen Chih-hao. The ..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received Applied Materials patent application for Dummy Features for Dissipating Heat in Packages Including Advanced Semiconductor Chips. Jinho An, See Guan Huei and Yong Chang Bum developed the invention. The patent application number is US202418672951 20240523. The pa..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Infineon Technologies, Austria has submitted a patent application for Method of Determining a Temperature of a Transistor, Transistor Driver Device and System. This invention was developed by Zhang Hao and Zheng Ziqing. The patent application number is US202519211570 20250519. The patent publication number..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has sought patent for Chip Package Structure with Multiple Gap-filling Layers. This invention was developed by Lai Po-chen, Yew Ming-chih, Lin Po-yao, Wang Chin-hua and Jeng Shin-puu. The patent application number is US202519295174 20250808. The patent publication..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Company patent application for Semiconductor Structures and Methods for Manufacturing the Same. This invention was developed by Su Jui-wen, Tzeng Shi-hua, Lu Chih-hung and Wu Po-chi. The patent application number is US20251929..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Passivation Layer for a Semiconductor Device and Method for Manufacturing the Same. This invention was developed by Liu Li Chun, Wang Chun Tang, Wang Chih Hung, Lee Ching Feng and Yeh Yu-lung. The patent application number is..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Reinforced Structure with Capping Layer. This invention was developed by Juang Jing-ye, Chen Hsien-wei, Lu Chia-ling and Jeng Shin-puu. The patent application number is US202519286373 20250731. The patent publication number is US2025..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Company patent application for Semiconductor Package. Wang Po-han, Kuo Hung-jui, Hu Yu-hsiang and Liao Sih-hao developed the invention. The patent application number is US202519291531 20250805. The patent publication number is..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has released ROHM patent application for Semiconductor Device, Semiconductor Device Assembly, Vehicle, and Method for Manufacturing Semiconductor Device. This invention was developed by Ikeda Daiki, Tanikawa Kohei, Yasunishi Tomohiro and Takahashi Soichiro. The patent appli..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has applied United States patent for Package Structure. Kuo Hung-jui, Tsai Hui-jung, Chang Tai-min and Wang Chia-wei developed it. The patent application number is US202519292885 20250806. The patent publication number is US2025364340 (A1). International Patent Cl..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing has applied United States patent for Methods of Forming Packaging Substrates Including a Stress-absorption Trench. Chen Hsien-wei, Lin Meng-liang and Jeng Shin-puu developed it. The patent application number is US202519292990 20250807. The patent publication number is US2..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has sought patent for Display Defect Monitoring Structure. This invention was developed by Chen Chu Fu and Liao Chun Hao. The patent application number is US202519294294 20250808. The patent publication number is US2025364336 (A1). International Patent Classificat..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Critical Dimension Uniformity (CDU) Control Method. This invention was developed by Wang Hsin-chih, Shen Yu-tien, Lai Yu-tse, Yang Chih-kai, Chang Hsiang-ming, Chang Chun-yen and Chang Ya-hui. The patent application number ..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Wavelord has submitted a patent application for Method for Manufacturing Engineered Growth Substrate for Group Iii Nitride Power Device Having High-quality Nucleation Region. Song June O developed the invention. The patent application number is US202519216205 20250522. The patent publication number is US20..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing patent application for Device with Through Via and Related Methods. Chen Chun-yuan, Su Huan-chieh, Tsai Ching-wei, Chang Shang-wen, Chiu Yi-hsun and Wang Chih-hao developed the invention. The patent application number is US202..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Company patent application for Semiconductor Devices Including Low-K Metal Gate Isolation and Methods of Fabrication Thereof. This invention was developed by Wang Sheng-tsung, Chang Chia-hao, Huang Lin-yu, Chuang Cheng-chi and ..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing has filed a patent application for Self-aligned Scheme for Semiconductor Device and Method of Forming the Same. This invention was developed by Wu Cai-ling, Hsueh Hsiu-wen, Wang Wei-ren, Huang Po-hsiang, Chen Chii-ping and Wang Jen Hung. The patent application number is U..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Company patent application for Integrated Circuit Structure and Manufacturing Method Thereof. The invention was developed by Hsiung Te-chih, Wang Peng, Wu Jyun-de and Lin Huan-just. The patent application number is US20251929..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has filed a patent application for Contact Features of Semicondcutor Devices. This invention was developed by Yen Tsui-ling and Chen Chien-hung. The patent application number is US202519293756 20250807. The patent publication number is US2025364326 (A1). Internati..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has applied United States patent for Semiconductor Structure with Dielectric Feature. You Jia-chuan, Chang Chia-hao, Pan Kuan-ting, Ju Shi-ning, Chiang Kuo-cheng and Wang Chih-hao developed it. The patent application number is US202519291270 20250805. The patent p..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing patent application for Integrated Circuit Structure and Manufacturing Method Thereof. This invention was developed by Hsiung Te-chih, Wu Jyun-de, Wang Peng and Lin Huan-just. The patent application number is US202519291408 202..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Company patent application for Redistribution Layer and Methods of Fabrication Thereof. The invention was developed by Ma Zhen De, Chiu Chih-pin, Hsu Lee-wen, Wang Liang-wei and Chen Dian-hau. The patent application number is..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing has applied United States patent for Integrated Circuit Package and Method. Tseng Ting-chen, Liao Sih-hao, Wang Po-han, Hu Yu-hsiang and Kuo Hung-jui developed it. The patent application number is US202519293005 20250807. The patent publication number is US2025364321 (A1)..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing has filed a patent application for Semiconductor Device with Air Gaps and Method of Fabrication Thereof. This invention was developed by Chang Chia-hao, Huang Lin-yu, Yu Li-zhen, Chuang Cheng-chi, Cheng Kuan-lun and Wang Chih-hao. The patent application number is US202519..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Semiconductor Structure with Air Gap and Method for Manufacturing the Same. This invention was developed by Cheng Kai-fang and Chang Hsiao-kang. The patent application number is US202519292350 20250806. The patent publication..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Taiwan Semiconductor Manufacturing Company has filed a patent application for Semiconductor Device and Methods of Formation Via Etching Operations. This invention was developed by Lai Ying-yu, Wang Chih-yun, Lin Chih-hsuan and Chen Hsi Chung. The patent application number is US202519293130 20250807. The pa..

Semiconductor

  |  Sun 30 Nov 2025

Alexandria, Dec. 1 -- Powerchip Semiconductor Manufacturing Corporation has sought patent for Manufacturing Method of Semiconductor Structure. This invention was developed by Chen Kuo Hsiung, Chen Ya-ting, Chen Chun-ta, Lin Chang Tsung and Lee Shih-ping. The patent application number is US202519292851 20250806. The patent publi..
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