Semiconductor
| Tue 16 Jun 2026
Taipei, June 16 -- Resonac has submitted a patent application for Resin Composition, Resin-attached Metal Foil, Laminate, Printed Wiring Board, and Semiconductor Package. This invention was developed by Tabata Shiori, Hidaka Yoshiki, Somekawa Jyunki, Morita Koji and Hayashi Chihiro.
The patent application number is TW2024015059..