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Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Menlo Microsystems Inc and Res Foundation Suny have submitted a patent application for Systems and Methods to Protect a MEMS Relay Switch System. This invention was developed by Agamy Mohammed and Harfman Todorovic Maja.
The patent application number is EP20240758975 20240731. The patent publication number ..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Beijing Boe Technology Dev Co Ltd, BOE Technology Group Co Ltd and Hefei BOE Joint Technology have applied European patent for Display Substrate and Manufacturing Method Therefor, and Display Device. Zhang Dacheng, Yuan Zhidong, Zhou Dandan, Li Yongqian, Liu Xiuting and Han Ying developed it.
The patent app..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Tianjin Aiko Solar Energy Tech Co Ltd, Guangdong Aiko Solar Energy Technology Co Ltd, Zhuhai Fushan Aiko Solar Energy Tech Co Ltd, Zhejiang Aiko Solar Energy Tech Co Ltd and Shenzhen Aiko Digital Energy Tech Co Ltd have sought patent for Horizontal Electroplating Apparatus for Solar Cell. This invention was de..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Northwestern Polytechnical University and Research & Development Inst Of Northwestern Polytechnical University In Shenzhen have submitted a patent application for Liquid Drop Micro-fluidic Chip Based on Superstructure Surface, Preparation Method of Liquid Drop Micro-fluidic Chip and Application of Liquid Drop..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 --Huaneng Jiayuguan New Energy Co Ltd, Huaneng Clean Energy Res Institute and Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences have submitted a patent application for Oxygen-containing Hydrogenated Amorphous Silicon Film, Preparation Method Thereof and Photovoltaic Device. ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Nanjing University of Posts and Telecommunications and Nanjing Univ Of Posts And Telecommunications Institute At Nantong Co Ltd have applied Chinese patent for P-type Doping Regulation and Control and Transverse Power Device Preparation Method of Silicon Carbide on Insulator. Yao Jiafei, Tian Wang, Hu Ziwei, ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Zhejiang Aiko Solar Energy Technology, Guangdong Aiko Solar Energy Technology Co Ltd, Tianjin Aiko Solar Energy Technology, Zhuhai Fushan Aixu Solar Energy Technology and Shandong Aiko Solar Energy Tech Co Ltd have submitted a patent application for Inorganic Phase of Perovskite Film Layer of Solar Cell, Sola..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Zhejiang Aiko Solar Energy Technology, Guangdong Aiko Solar Energy Technology Co Ltd, Tianjin Aiko Solar Energy Technology, Zhuhai Fushan Aixu Solar Energy Technology and Shandong Aiko Solar Energy Tech Co Ltd have filed a patent application for Perovskite/crystalline Silicon Laminated Solar Cell and Preparat..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Mianyang Huike Optoelectronics Technology Co Ltd and HKC have submitted a patent application for Semiconductor Device, Array Substrate and Display Panel. This invention was developed by Zhang Qinfan, Wu Chuan, Cao Zhonglin and Ye Lidan.
The patent application number is CN202511687114 20251117. The patent p..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 --STMicroelectronics and Stmicroelectronics Grand Ouest SAS have submitted a patent application for Electronic Device, Wireless Charger, and Method of Operating Electronic Device. This invention was developed by Cimaz Lionel, Borrello Antonio and Dalla Stella Sergio Luiz.
The patent application number is CN20..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Nanjing Shengxin Semiconductor Mat Co Ltd and Nanjing Guosheng Electronic Co Ltd have submitted a patent application for Epitaxial Method for Improving Thickness Flat Region of Heavily-doped as Substrate Thin Layer High-resistance Silicon Epitaxial Wafer. This invention was developed by Wang Yinhai, Deng Xueh..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Shandong Yuehaijin Semiconductor Technology and Chengdu Yuehaijin Semiconductor Mat Co Ltd have submitted a patent application for 12-inch Silicon Carbide Single Crystal and Growth Method and Device Thereof. This invention was developed by Bao Huiqiang, Ge Mingming, Cheng Zhangyong, Liu Dongdong, Yang Shuai a..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Global Unichip Corp and Taiwan Semiconductor Manufacturing have submitted a patent application for Semiconductor Package Device and Semiconductor Wiring Substrate Thereof. This invention was developed by Wang Wei-chiao, Yang Sheng-fan, Hung Chih-chiang, Lin Yuan-hung, Lin Yi-tzeng and Tung Hao-yu.
The paten..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Feng Shii Industrial Co Ltd and Amco Tec Int Inc have applied Taiwan patent for Elastic Fixing Device to Detach the M.2 Solid-state Drive from the Elastic Fixing Device by Reverse Operation Without the Need for a Screwdriver and Screws. Zheng Yu-xiang developed it.
The patent application number is TW2024010..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Asml Netherlands BV and Cymer have submitted a patent application for System for Controlling Gas Flow in a Laser Discharge Chamber. This invention was developed by Wang Zhou, Mandrusiak Gary Dwayne, Rokitski Rostislav, Duffey Thomas Patrick and Thosar Aniket Chandu.
The patent application number is TW202401..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- Xi'an ESWIN Material Technology and Xi'an Eswin Silicon Wafer Technology have applied Chinese patent for System and Method for Inhibiting Wafer Scratch in Double-sided Polishing and Double-sided Polishing Equipment. Wang Junfu developed it.
The patent application number is CN202511711576 20251120. The pate..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Suzhou Guoxian Innovation Tech Co Ltd has filed a patent application for Chip Packaging Structure. This invention was developed by Zhang Wenbin.
The patent application number is CN202511783343 20251128. The patent publication number is CN121586468 (A). International Patent Classification code is H10W40/22...
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Huatian Tech Jiangsu Co Ltd has submitted a patent application for Packaging Structure and Packaging Method. This invention was developed by Zhao Kai and Li Danting.
The patent application number is CN202511825551 20251205. The patent publication number is CN121586513 (A). International Patent Classificati..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Cree Led Inc has applied Chinese patent for Anchored Light Mixing Structures in Led Packaging Devices and Related Methods. Favale Joseph M Jr, Hussell Christopher P, Haberern Kevin and Schmidt Robert David developed it.
The patent application number is CN20248049108 20240722. The patent publication number ..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- Jiangsu Huakun Intelligent Tech Co Ltd has submitted a patent application for Semiconductor On-line Visual Dispensing Machine Structure Capable of Conveniently Replacing Glue. This invention was developed by Zhan Zhao and Wang Ling.
The patent application number is CN20251207796 20251229. The patent public..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- Jiangsu Tuozheng Semiconductor Tech Co Ltd has submitted a patent application for Mask Box Transfer Device. This invention was developed by Zhu Tingting, Huang Huaizhou, Zou Jiamin, Ling Shengxin and Jiang Mengyi.
The patent application number is CN202511682856 20251117. The patent publication number is CN..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Jiangsu Pangu Semiconductor Tech Co Ltd patent application for System-level Board-level Packaging Method and Product Thereof. Xiao Zhiyi and Ma Shuying developed the invention.
The patent application number is CN202511774973 20251128. The patent publ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Inst Of Semiconductors Guangdong Academy Of Sciences patent application for Inter-chip Hyperfine Interconnection Packaging Structure and Preparation Method Thereof. Xiang Xun, Hu Chuan, Yan Yingqiang and Chen Zhitao developed the invention.
The paten..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- Semiconductor Mfg North Integrated Circuit Mfg Beijing Co Ltd and Semiconductor Manufacturing International (Shanghai) have filed a patent application for Wastewater Treatment Method, Storage Medium and Terminal. This invention was developed by Zhang Yakun.
The patent application number is CN202411139624 2..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- Semiconductor Mfg North Integrated Circuit Mfg Beijing Co Ltd and Semiconductor Manufacturing International (Shanghai) have filed a patent application for Wastewater Treatment Method, Storage Medium and Terminal. This invention was developed by Zhang Yakun.
The patent application number is CN202411155422 2..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Samsung Electronics Co Ltd and Postech Research & Business Development Foundation have submitted a patent application for Memory Device Including In-memory Operation Circuit and Operating Method Thereof. This invention was developed by Chung Yoon-young and Seong Su-won.
The patent application number is TW20..
Semiconductor
| Fri 12 Jun 2026
Munich, June 12 -- Gigadevice Semiconductor Shanghai Inc, Gigadevice Semiconductor Inc and Gigadevice Semiconductor Hefei Inc have submitted a patent application for Semiconductor Device and Method of Forming the Same. This invention was developed by Xu Yisheng, Qian Meng, Li Xiaokang, Feng Jun and Luo Xiao.
The patent applic..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Shengjisheng Korea Semiconductor Tech Co Ltd has submitted a patent application for Wafer Particle Removing Device and Method. This invention was developed by Kim Tae-hun, Kim Young-keun, Bae Yun-jeong, Kong Longhao and Jung Yoon Soo.
The patent application number is CN202411143571 20240820. The patent pub..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Xinju Shenzhen Semiconductor Tech Co Ltd has submitted a patent application for Electroplating Process Module. This invention was developed by Lang Markus, Schlee Martin and Wu Guoming.
The patent application number is CN202411412502 20241011. The patent publication number is CN121593158 (A). International..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- European Patent Office has published Axelera Ai BV patent application for Processor for In-memory Computing. The invention was developed by Cosemans Stefan, Uytterhoeven Roel and Hager Pascal.
The patent application number is EP20240218163 20241206. The patent publication number is EP4756632 (A1). Internati..
Semiconductor
| Fri 12 Jun 2026
Munich, June 12 -- European Patent Office has published Nitelab Optoelectronics Co Ltd patent application for Gan-based Multi-light-zone Led Chip, Light Source Module with the Same, and Preparation Method Thereof. The invention was developed by Li Wenjie.
The patent application number is EP20250164006 20250316. The patent pub..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Integritag Digital GmbH has applied European patent for a Smart Indicator Label, a Method of Fabrication Thereof, and a Memory Medium or Device with a Code Data Record for the Method. Viro Vladimir developed it.
The patent application number is EP20240826888 20241213. The patent publication number is EP4754..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Interface Optpelectronics Shenzhen Co Ltd, Interface Technology Chengdu Co Ltd and General Interface Solution have applied Taiwan patent for Structure for Improving Halo Phenomenon and Method of Preparing the Same. Lee Hsuan-yun developed it.
The patent application number is TW20240100780 20240108. The pate..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Sino American Silicon Prod Inc has applied Taiwan patent for Solar Cell. Kuo Tai-chao, Yu Hung-kai and Lai Meng-yi developed it.
The patent application number is TW20240101181 20240111. The patent publication number is TW202529585 (A). International Patent Classification codes are H10F19/80 and H10F77/00.
..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Idemitsu Kosan Co, Nikkiso Co Ltd and National University Corporation Tokai National Higher Education and Research System have applied Taiwan patent for Uv-emitting Element. Kushimoto Maki, Deki Manato, Honda Yoshio, Amano Hiroshi, Tomai Shigekazu and Oyama Masashi developed it.
The patent application numbe..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Huang Man Chi has filed a patent application for Solar Cell Self-energy Hybrid IC. The patent application number is TW20240100562 20240105. The patent publication number is TW202529594 (A). International Patent Classification code is H10F77/124.
According to the abstract released by the Taiwan Patent Offic..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Taiwan Patent Office has received ICT Integrated Circuit Testing Ges Fur Halbleiterpruftechnik Mbh patent application for Electron Beam Apparatus, Foil or Grid Lens, and Method of Operating an Electron Beam Apparatus. Kruit Pieter developed the invention.
The patent application number is TW20240132850 20240..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Beijing E Town Semiconductor Technology Co Ltd and Mattson Technology have sought patent for Plasma Processing Apparatus. This invention was developed by Butcher Kenneth Scott Alexander and Georgiev Vasil Milchev.
The patent application number is TW20240136750 20240926. The patent publication number is TW20..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Ho Chung Wen has sought patent for Package Structure and Manufacturing Method Thereof.
The patent application number is TW20240100485 20240104. The patent publication number is TW202529259 (A). International Patent Classification codes are H01L21/56, H01L21/768, H01L23/28 and H01L23/535. Cooperative Patent..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Ho Chung Wen has sought patent for Chip Package Structure and Manufacturing Method Thereof.
The patent application number is TW20240100572 20240105. The patent publication number is TW202529289 (A). International Patent Classification codes are H01L21/768, H01L23/498 and H01L23/528. Cooperative Patent Clas..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- European Patent Office has published Seoul Viosys patent application for Light-emitting Element and Light-emitting Device Comprising Same. The invention was developed by Baek Yong Hyun.
The patent application number is EP20240846050 20240724. The patent publication number is EP4753413 (A1). International Pa..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Hefei Nexchip Integrated Circuit patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Wang Mingxing, Gao Zhijie, Li Yangyang and Yang Jie.
The patent application number is CN20261083772 2026012..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Quanzhou Sanan Semiconductor Technology has applied Chinese patent for Light Emitting Diode and Light Emitting Device. Wang Xiongbin, Zhan Boqi, Geng Quanquan and Lee Ga-eun developed it.
The patent application number is CN20251235070 20251230. The patent publication number is CN121586348 (A). Internationa..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- Saiguang Semiconductor Technology Suzhou has applied Chinese patent for Precise Movement Three-axis Platform. Yang Weixing, Ma Kaijiang and Xu Weixing developed it.
The patent application number is CN20261088168 20260122. The patent publication number is CN121589615 (A). International Patent Classification..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- European Patent Office has published Seoul Semiconductor patent application for Light Emitting Apparatus. The invention was developed by Lim Kwang Bea and Jang Bo Ram I.
The patent application number is EP20240852240 20240803. The patent publication number is EP4755153 (A1). International Patent Classificat..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Hon Hai Precision Industry has applied European patent for Semiconductor Structure and Fabricating Method Thereof. Shen Chih-yen developed it.
The patent application number is EP20250165722 20250324. The patent publication number is EP4756865 (A1). Cooperative Patent Classification codes are H10P14/3206 (EP..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Taiwan Patent Office has released Win Semiconductors patent application for Heterojunction Bipolar Transistor Device. This invention was developed by Liao Yu-an, Syu Rong-hao and Tsai Shu-hsiao.
The patent application number is TW20240106947 20240227. The patent publication number is TW202529541 (A). Intern..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Powerchip Semiconductor Manufacturing Corporation has applied Taiwan patent for Semiconductor Device and Method for Forming the Same. Lin Meng-han developed it.
The patent application number is TW20240101446 20240112. The patent publication number is TW202529559 (A). International Patent Classification code..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Taiwan Patent Office has released Nanya Technology patent application for Semiconductor Device with Sidewall Oxidized Dielectric. This invention was developed by Chen Te-yin.
The patent application number is TW20240108810 20240311. The patent publication number is TW202529560 (A). International Patent Class..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Shanghai Integrated Circuit Equipment Materials Industry Innovation Center has sought patent for Baking Device and Vapor Deposition Equipment. This invention was developed by He Peng, Ren Nianhua and Li Xiujun.
The patent application number is CN20251229627 20251230. The patent publication number is CN1215..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Taiwan Patent Office has published Toyoda Gosei patent application for Light Emitting Element and Light Emitting Device. The invention was developed by Matsui Shinichi, Omoya Hideki, Mizutani Koichi, Makino Hiroaki and Oya Masaki.
The patent application number is TW20240138184 20241008. The patent publicati..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published Nanya Technology patent application for Semiconductor Structure and Manufacturing Method Thereof. The invention was developed by Li Zhenzhang.
The patent application number is CN202511809133 20251203. The patent publication number is CN121586259 (A)..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Shanghai Yinguan Semiconductor Technology has sought patent for Flexible Connecting Piece, Driving Mechanism, Motion Platform and Leveling and Focusing Device. This invention was developed by Gong Wei, Wang Zhenhua, Yang Shu, Lu Congshan and Li Yunpeng.
The patent application number is CN202511794320 20251..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Hubei Jiufengshan Laboratory has sought patent for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Yuan Jun, Chen Wei, Cheng Zhijie, Wu Yangyang and Ou Hiroshi.
The patent application number is CN202511821442 20251204. The patent publication number is CN121586282 (A)..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Quanzhou Sanan Semiconductor Technology has sought patent for Light Emitting Diode Epitaxial Structure and Light Emitting Device. This invention was developed by Yan Tongwei, Chen Yanchun, Zhang Ruijie, Huang Shaohua and Zhang Zhongying.
The patent application number is CN202511657125 20251112. The patent ..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Microsoft Technology Licensing has submitted a patent application for Determining Localization Lengths in Hybrid Superconductor-semiconductor Devices Using Multiple Fishbone Structures Having Hybrid Wires. This invention was developed by Van Hoogdalem Kevin Alexander, Laeven Tom Marijn, Bourdet Léo Robin and ..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- KIOXIA has submitted a patent application for Memory Device. This invention was developed by Matsushita Naoki.
The patent application number is TW20240133339 20240903. The patent publication number is TW202529101 (A). International Patent Classification codes are G11C11/16 and G11C5/06. Cooperative Patent C..
Semiconductor
| Fri 12 Jun 2026
Munich, June 12 -- Intel has submitted a patent application for Diode Structure with Adjacent Base Regions. This invention was developed by Sharma Anand and Dhakad Harshit.
The patent application number is EP20250217879 20251124. The patent publication number is EP4757535 (A1). International Patent Classification code is H10D..
Semiconductor
| Fri 12 Jun 2026
Munich, June 12 -- Schneider Electric China has submitted a patent application for Hemt Device and Method of Fabricating the Same. Chen Jiamin developed the invention.
The patent application number is EP20240223467 20241227. The patent publication number is EP4757528 (A1). International Patent Classification codes are H10D30/..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Powerchip Semiconductor Manufacturing Corporation has submitted a patent application for Package Architecture with Interposer. Lu Chun-lin and Chang Shou-zen developed the invention.
The patent application number is TW20240101395 20240112. The patent publication number is TW202529294 (A). International Pate..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Sinoma Advanced Nitride Ceram Co Ltd has filed a patent application for Antibacterial Silicon Nitride Fiber Composite Material as Well as Preparation Method and Application Thereof. This invention was developed by Sun Feng, Wang Zaiyi, Yuan Lei, Dong Kaixun, Zhang Linlin, Xing Peiji, Zhao Qingpeng, Xiao Shans..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Shanghai Chipanalog Microelectronics Co Ltd patent application for Current Sensor Chip Packaging Structure and Packaging Method. Zhong Shenke, Shi Guangda, Shen Feng and Yu Zeqin developed the invention.
The patent application number is CN20261094706..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Weijian Intelligent Packaging Technology (Shenzhen) has sought patent for Chip Taking and Mounting Device and Die Bonding Equipment. This invention was developed by Lei Weizhuang and Wang Qing.
The patent application number is CN202610105414 20260126. The patent publication number is CN121586501 (A). Inter..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Shenzhen Chenyue Storage Electronic Technology has submitted a patent application for Hot Pressing Device for Semiconductor Processing. This invention was developed by Hu Wang'an, Zhang Fengfeng, Chen Shi, Qian Hai and Wang Chang.
The patent application number is CN202511835998 20251208. The patent publicati..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Sichuan Qisai Microelectronics Co Ltd has sought patent for Copper Bridge Chip Packaging Process Based on External Carrier and Packaged Copper Bridge Chip Plastic Package Body. This invention was developed by Yang Ning.
The patent application number is CN202511754090 20251126. The patent publication number..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Jingyitong Sichuan Semiconductor Tech Co Ltd patent application for Semiconductor Sintering Mold and Semiconductor Sintering System. Chen Lifeng, Yang Yonggang, Wang Qiang, Huang Guoquan and Zhang Ruifeng developed the invention.
The patent applicati..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Suzhou Guoxian Innovation Tech Co Ltd has sought patent for Support Plate Structure, Preparation Method of Support Plate Structure and Chip Structure. This invention was developed by Zhou Yanxu.
The patent application number is CN202511784133 20251128. The patent publication number is CN121586493 (A). Inte..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Suzhou Guoxian Innovation Tech Co Ltd has sought patent for Packaging Substrate and Preparation Method of Chip Packaging Structure. This invention was developed by Zhou Yanxu.
The patent application number is CN202511784049 20251128. The patent publication number is CN121586491 (A). International Patent Cl..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Suzhou Guoxian Innovation Tech Co Ltd patent application for Substrate Structure, Preparation Method Thereof and Chip Packaging Structure. Zhou Yanxu developed the invention.
The patent application number is CN202511783929 20251128. The patent public..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published Hangzhou International Science and Technology Innovation Center of Zhejiang University patent application for Preparation Method of Semiconductor Through Hole, Semiconductor Interposer and Preparation Method of Semiconductor Interposer. The invention w..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Chip Carrier Plate and Manufacturing Method Thereof, and Chip Packaging Structure. This invention was developed by Zhou Yanxu.
The patent application number is CN202511787167 20251129. The patent publication number is CN121586482 ..
Semiconductor
| Fri 12 Jun 2026
Munich, June 12 -- KIOXIA has applied European patent for Semiconductor Memory Device and Method for Manufacturing Semiconductor Memory Device. Miyachi Katsunori developed it.
The patent application number is EP20250198008 20250826. The patent publication number is EP4753395 (A1). International Patent Classification code is H10..
Semiconductor
| Fri 12 Jun 2026
Munich, June 12 -- SK Hynix has sought patent for Memory Device and Method of Manufacturing Memory Device. This invention was developed by Jung Yun Oh, Han Yun Cheol, Yeom Hye In and Nam Sang Hyuk.
The patent application number is EP20250219929 20251202. The patent publication number is EP4753394 (A1). International Patent Clas..
Semiconductor
| Fri 12 Jun 2026
Munich, June 12 -- European Patent Office has published Huawei Technologies patent application for Communication Method and Apparatus, Storage Medium, and Chip System. The invention was developed by Gan Ming, Zhao Yue and Guo Yuchen.
The patent application number is EP20240855746 20240816. The patent publication number is EP475..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Zhuhai Dalue Tech Co Ltd has filed a patent application for Micro-fluidic Printing Chip with Buffer Liquid Storage Tank, System and Liquid Drop Printing Method. This invention was developed by Chen Huaying, Wang Lei, Zhao Wentao, Liu Xiaoying and Zhang Xintao.
The patent application number is CN20251247208..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Beijing Cas Microneedle Tech Ltd has applied Chinese patent for Soluble Microneedle. Lu Di, Sun Yang, Xu Jiajia, Liu Han and Wang Yong developed it.
The patent application number is CN202610129514 20260129. The patent publication number is CN121588023 (A). International Patent Classification codes are A61K..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Beijing Cas Microneedle Tech Ltd patent application for Dexmedetomidine Hydrochloride Soluble Microneedle. This invention was developed by Lu Di, Sun Yang, Xu Jiajia, Liu Han and Wang Yong.
The patent application number is CN202610129501 20260129. Th..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published International Physical Diagnosis Research Inst Of Chongqing Medical University patent application for Up-conversion Light-transmitting Self-driven Micro-fluidic Chip for Respiratory Tract Pathogen Detection and Preparation Method of Up-conversion Light..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- ASML Netherlands has filed a patent application for Data Processing Method, Charged Particle Evaluation Method and System. This invention was developed by Bottari Tiziano, Onose Alexandru, Traganowska Magdalena, Pisarenko Michael, Keane Michael S M and Kuiper Vincent Sylvester.
The patent application number ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Intra Nanosystems Ltd has filed a patent application for Machine Learning Model Training Method for Random Substrate. This invention was developed by Bogdan Paul A, Qiao Peng, Wang Yikang, Krzydon Kevin W, Joseph George V, Kania Steven, Arriens Roger, Dallacotti Alessandro, Kailey Robert F and Rajanarayana Sa..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released ASML Netherlands patent application for Multi-device Training Flow to Reduce Process Recipe Time for Computationally Guided Inspection. This invention was developed by Lin Chenxi and Wang Zhihuan.
The patent application number is CN20248048764 20240701..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Hitachi High Technologies has sought patent for Method and Program for Operating Semiconductor Device Evaluation Device by Means of Character String. This invention was developed by Ishikawa Chikara, Yamauchi Toshinori, Shinoda Shinichi and Toyoda Yasutaka.
The patent application number is CN20248049763 2024..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Nihon Micronics has sought patent for Probe. This invention was developed by Nasu Mika.
The patent application number is CN20248048732 20240724. The patent publication number is CN121586845 (A). International Patent Classification codes are G01R1/067, G01R1/073 and G01R31/28. Cooperative Patent Classificatio..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Powerchip Semiconductor Manufacturing Corporation has submitted a patent application for Memory Device and Method of Manufacturing the Same. This invention was developed by Chen Hsin-hsu and Huang Tzung-bin.
The patent application number is TW20240100092 20240102. The patent publication number is TW20252957..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Anhui Gerui New Material Tech Co Ltd has sought patent for Mica Powder for In-situ Constructed Silicon Elastomer Coated Cosmetics and Preparation Method of Mica Powder. This invention was developed by Zheng Hao, Wang Kai, Sang Rui, Chai Xiuan and Li Shuang.
The patent application number is CN202511838676 2..
Semiconductor
| Fri 12 Jun 2026
Munich, June 12 -- Honor Device has sought patent for Method for Adjusting Video Duration, Electronic Device, Storage Medium, and Chip. This invention was developed by Yang Haining.
The patent application number is EP20240916780 20241228. The patent publication number is EP4753252 (A1). International Patent Classification code ..
Semiconductor
| Fri 12 Jun 2026
Munich, June 12 -- Shenzhen Goodix Technology has sought patent for Data Transmission Method, and Chip and Storage Medium. This invention was developed by Yu Xinhua, Yang Chunmei, Mao Jian, Wang Jihui and Dai Xuewei.
The patent application number is EP20240858096 20240712. The patent publication number is EP4753236 (A1). Intern..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Lam Research has submitted a patent application for Process Chamber Precoating with Capture and Sealing Layers. Kwon Byoung-sik, Newlon Brian, Wang Ruisong, Yin Xin, Ha Jong-seok, Hamma Sumona and Shaikh Fayaz A developed the invention.
The patent application number is CN20248049588 20240724. The patent publ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Spark Plug Mat Co Ltd patent application for Sintered Silicon Nitride, Tool for Friction Stir Welding, and Method for Producing Tool for Friction Stir Welding. This invention was developed by Fukasawa Takayuki, Funaki Kai, Abe Yutaka, Yuasa Akimasa and ..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Powerchip Semiconductor Manufacturing Corporation has submitted a patent application for High Electron Mobility Transistor and Method of Manufacturing the Same. This invention was developed by Chou Jih-wen, Huang Yu-jen, Chang Chia-hao and Wu Tian-li.
The patent application number is TW20240100060 20240102...
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Monolithic Power Systems has submitted a patent application for Semiconductor Device. Mayol Ignacio Cortes developed the invention.
The patent application number is TW20250111484 20231212. The patent publication number is TW202529566 (A). International Patent Classification codes are H10D30/60, H10D62/10 an..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Powerchip Semiconductor Manufacturing Corporation has submitted a patent application for Semiconductor Process. This invention was developed by Chou Jih-wen.
The patent application number is TW20240100915 20240109. The patent publication number is TW202529546 (A). International Patent Classification codes a..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Nanya Technology has submitted a patent application for Semiconductor Structure. Hsu Yueh developed the invention.
The patent application number is TW20250111607 20231120. The patent publication number is TW202529527 (A). International Patent Classification code is H10B12/00.
Taiwan Patent Office has re..
Semiconductor
| Fri 12 Jun 2026
Munich, June 12 -- European Patent Office has published NVIDIA patent application for Unsupervised Network Anomaly Detection. The invention was developed by Zohar Guy, Shteingart Hanan and Zahavi Eitan.
The patent application number is EP20250219061 20251127. The patent publication number is EP4753224 (A1). International Patent..
Semiconductor
| Fri 12 Jun 2026
Munich, June 12 -- European Patent Office has published STMicroelectronics International patent application for Glitch Rejection for FSK Demodulation. The invention was developed by Cirillo Giovanni Amedeo, Porcaro Carlo and Vitali Andrea Lorenzo.
The patent application number is EP20250216446 20251117. The patent publication n..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Sichuan Tobacco Corp Liangshanzhou Branch has submitted a patent application for Coconut Coir-carbonized Tartary Buckwheat Shell Composite Substrate for Tobacco Seedling Raising and Seedling Raising Plate. This invention was developed by Ling Aifen, Ye Xiefeng, Liu Ting, Yu Xinmiao, Gao Jun, Ma Peng, Zhou Han..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Panasonic Intellectual Property Management has submitted a patent application for Bonding Sheet, Semiconductor Device, Method for Manufacturing Semiconductor Device, and Apparatus for Manufacturing Semiconductor Device. This invention was developed by Kitaura Hidetoshi, Niimi Hideki and Fujimoto Hironobu.
Th..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- SOI Tec Silicon On Insulator Tech has filed a patent application for Separable Semiconductor Substrate Made of Polycrystalline Silicon Carbide. This invention was developed by Boudet Thierry, Bijar Harshad, Figuet Christophe, Reddison Don and Lagrange Michel.
The patent application number is CN20248049550 ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Applied Materials has submitted a patent application for Method for Analyzing Uniformity for Semiconductor Manufacturing and Associated Apparatus and System. Vellore Kim Ramkumar, Ishikawa Tetsuya and Moradia Alla developed the invention.
The patent application number is CN20248048444 20240319. The patent pu..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published Tokyo Electron patent application for Substrate Processing Method and Substrate Processing Apparatus. The invention was developed by Yano Eiji and Matsuki Katsufumi.
The patent application number is CN20248047146 20240716. The patent publication numbe..
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