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Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Wuhan China Star Optoelectronics Semiconductor Display Technology has applied Chinese patent for Display Panel. Wang Junyuan developed it.
The patent application number is CN202610603294 20260430. The patent publication number is CN122421594 (A). International Patent Classification codes are H10K59/12, H10K..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Wuhan China Star Optoelectronics Semiconductor Display Technology patent application for Display Panel. Wang Junyuan and Ma Liang developed the invention.
The patent application number is CN202610603190 20260430. The patent publication number is CN122..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Nanjing University of Posts and Telecommunications patent application for Organic Semiconductor Power Device with Two-stage Floating Field Plate Structure and Preparation Method Thereof. The invention was developed by Chang Hengdian, Zhang Jun, Bian Jin..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has released VueReal patent application for Integrating Microdevices into a System Substrate. This invention was developed by Fathi Esanola and Chaji Gramreza.
The patent application number is CN202610246547 20190920. The patent publication number is CN122421541 (A)..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Xiamen Sanan Optoelectronics has submitted a patent application for Light Emitting Diode. He Minyou, Liu Xiaoliang, Wang Qing, Hong Lingyuan and Zhang Zhongying developed the invention.
The patent application number is CN202610274499 20221101. The patent publication number is CN122421518 (A). International ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Hengdian Group DMEGC Magnetics patent application for Back Contact Solar Cell Without Main Grid. Ren Yong and Wu Chengkun developed the invention.
The patent application number is CN202610857825 20260615. The patent publication number is CN122421447 (A)..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Hangzhou Fuxin Semiconductor has applied Chinese patent for Manufacturing Method of Semiconductor Device and Semiconductor Device. Lee Su-ju and Lan Zongjin developed it.
The patent application number is CN202610561154 20260424. The patent publication number is CN122421425 (A). International Patent Classifica..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has released Shanghai Huahong Grace Semiconductor Manufacturing Corporation patent application for Super Junction Device and Forming Method. This invention was developed by Wang Fei and Yan Shufan.
The patent application number is CN202610525666 20260420. The pate..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Institute of Semiconductors, Chinese Academy of Sciences has submitted a patent application for Metal Oxide Semiconductor Field Effect Transistor and Preparation Method Thereof. This invention was developed by Shen Zhanwei, Zhang Yang and Xu Jinyi.
The patent application number is CN202610470192 20260410. The..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Chengdu Monolithic Power Systems has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Fu Daping, Yoo Ji Hyung, Lian Yanjie and Yang Haifeng.
The patent application number is CN202511456204 20251013. The patent publication number is CN1..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Huawei Technologies patent application for Chip, Chip Preparation Method and Electronic Equipment. The invention was developed by Dong Yaoqi, Wang Fangwei, He Zifang, Wu Guanjie, Yu Wei and Xu Junhao.
The patent application number is CN20251073870 2025..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Qingdao University of Science and Technology patent application for Low-power-consumption Field Effect Transistor Based on Gap-breaking Heterojunction. The invention was developed by Sang Pengpeng, Wang Muchen, Chen Yibin, Wang Qianwen and Gong Kangrui...
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Foshan Nationstar Semiconductor patent application for Gan-based Enhanced Hemt and Preparation Method Thereof. The invention was developed by Dong Zexin, Zhou Xin, Chen Kai and Yan Pengcheng.
The patent application number is CN202610529041 20260421. ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Beijing University has submitted a patent application for Semiconductor Structure and Preparation Method Thereof, Semiconductor Device and Electronic Equipment. Zhu Jianzhang, Wu Yanqing and Zeng Min developed the invention.
The patent application number is CN202610440470 20260403. The patent publication numb..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Transistor and Forming Method Thereof. This invention was developed by Li Ziliang, Wang Junyao and Gao Wanyi.
The patent application number is CN202511214732 20250828. The patent publication number is CN122421377 (A). International Pate..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Shanghai Jita Semiconductor patent application for Three-dimensional Memory and Manufacturing Method Thereof. The invention was developed by Qian Xiaofeng, Wang Feng, Zhang Hongqiang, Ding Jia, Hu Linhui and Guo Qiusheng.
The patent application numbe..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has released Samsung Electronics patent application for Magnetic Memory Device. This invention was developed by Jeong Jun-ho, Kim Whankyun, Kim Tae-hyun, Shin Hee-ju, Noh Eunsun and Lee Joonmyoung.
The patent application number is CN202511954821 20251223. The patent..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Samsung Electronics has sought patent for Semiconductor Memory Device. This invention was developed by Moon Gi-bong, Lee Sung Bok, Lee Jae-duk, Park Sang-yong, Yoon Na-young and Baek Seung-jae.
The patent application number is CN20251197179 20250806. The patent publication number is CN122421364 (A). Internati..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Yangtze Memory Technologies patent application for Semiconductor Device and Preparation Method Thereof, and Storage System. The invention was developed by Liu Lei, Yu Chengxing and Zhao Linmin.
The patent application number is CN20251072315 20250116...
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has released SK Hynix patent application for Semiconductor Device and Method of Manufacturing Semiconductor Device. This invention was developed by Kim Ki-sun, Oh Jin-ho, Noh Young Jin, Kim Jong-ki, Gwon Tae Hong, Yoo Dong-chul and Choi Eun-yeoung.
The patent applic..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Yangtze Memory Technologies has applied Chinese patent for Semiconductor Structure, Manufacturing Method Thereof and Memory System. Kong Cuicui, Chen Yang, Shen Dingding, Wu Linchun, Wang Di and Peng Zhiyao developed it.
The patent application number is CN20251072250 20250116. The patent publication number ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has applied Chinese patent for Manufacturing Method of Nord Flash Memory Device. Zhang Lianbao developed it.
The patent application number is CN202610771102 20260529. The patent publication number is CN122421359 (A). International Patent Classific..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Shanghai Jita Semiconductor has submitted a patent application for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Wu Jiang.
The patent application number is CN202610573976 20260427. The patent publication number is CN122421354 (A). International Patent Classification..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Semiconductor Manufacturing International (Shanghai) has filed a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Ma Zhimin.
The patent application number is CN20251065550 20250115. The patent publication number is CN122421351 (A). International Pate..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Macronix has submitted a patent application for Memory Device. This invention was developed by Su Yanru.
The patent application number is CN202510140219 20250208. The patent publication number is CN122421349 (A). International Patent Classification codes are H10B41/20, H10B41/30, H10B43/20, H10B43/30 and H1..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Fujian Jinhua Integrated Circuit has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Wu Jianshan, Zhang Yidan and Lin Zhicheng.
The patent application number is CN202610533270 20260421. The patent publication number is CN122421344 (A)..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Semiconductor Structure, Semiconductor Memory and Manufacturing Method Thereof. This invention was developed by Song Furan, Zhuang Pengcheng and Liu Naishuo.
The patent application number is CN202610874649 20260617. The patent publication..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Guangzhou Gaoda Electronic Technology patent application for Automatic Chip Mounter Adaptive to Multi-specification Electronic Components. The invention was developed by Liang Guowei and Liang Jinhua.
The patent application number is CN202610774746 202..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- SK Hynix has sought patent for Shell of Electronic Device, Manufacturing Method and Storage Device Using Shell. This invention was developed by Gong Sun Kyu, Li Donghai, Zhao Jingzhu, Kim Ki-taek, Kim Jong-won and Zhang Bingyi.
The patent application number is CN202511839439 20251208. The patent publication n..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Unimicron Technology patent application for Circuit Board Structure and Manufacturing Method Thereof. The invention was developed by Wang Kaiwei, Lai Yanting, Chen Qingsheng, Liao Weiyu and Huang Junrui.
The patent application number is CN20251245537 2..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Shenzhen Kiwi Microelectronics patent application for Dial-up Current-regulating Constant-current Driving Circuit and Integrated Circuit. The invention was developed by Fu Xiaoping.
The patent application number is CN202610791931 20260603. The patent p..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Realtek Semiconductor Corporation has submitted a patent application for Encoder and Related Encoding Method. This invention was developed by Zeng Yichen, Zeng Weimin, Cai Zhihong, Chen Wujun and Li Wei.
The patent application number is CN202510295480 20250313. The patent publication number is CN122420531 (A)..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- U.S. Patent and Trademark Office has awarded a patent to Applied Materials for High Performance Heat Exchanger. Vasu Karthick, Hiregoudra Prabhugouda, Reis David, Kutzman Max, Sheelavant Gangadhar, Harris Randy A and Hanson Kyle developed the invention.
The patent application number is US202418764038 20240..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Applied Materials has been granted a patent for Grounding Devices for Substrate Processing Chambers. Hosokawa Aki and Wang Teng Mao developed the invention.
The patent application number is US202217950012 20220921. The patent publication number is US12774530 (B2). International Patent Classification codes ..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- U.S. Patent and Trademark Office has awarded a patent to Samsung Electronics for Substrate Stage and Substrate Processing Apparatus Including the Same. Kim Byeongsang, Oh Sangyeon, Kim Minsung, Kim Yihwan, Lee Jihyeong and Han Sangchul developed the invention.
The patent application number is US20231821591..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Applied Materials has been granted a patent for Electrostatic Chuck with Metal Shaft. This invention was developed by Parkhe Vijay D and Agarwal Ashutosh.
The patent application number is US202217672520 20220215. The patent publication number is US12774524 (B2). International Patent Classification codes ar..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Applied Materials has been granted a patent for Method for Forming High Density Carbon Films with Reduced Substrate Backside Damage. This invention was developed by Kangude Abhijit, Zhang Yuxing, Huang Ruiyun, Feng Jun, Ekanayaka Thilini, Han Xinhai and Zhu Dan.
The patent application number is US202418736..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Texas Instruments has been granted a patent for Methods and Apparatus for Semiconductor Packages with Window Assemblies. Enriquez Osvaldo, Mendoza Rafael S and Liu Jane developed the invention.
The patent application number is US202318142779 20230503. The patent publication number is US12774205 (B2). Inter..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- SEMES has been granted a patent for Substrate Processing Apparatus and Method. Jung Hyunjik and Kim Yong Won developed the invention.
The patent application number is US202318240007 20230830. The patent publication number is US12773855 (B2). International Patent Classification codes are B41J11/00 and H10P7..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- U.S. Patent and Trademark Office has awarded a patent to Corning for Substrate Comprising an Edge Surface. Jiang Weirong, Owusu Samuel Odei, Cheng Yu, Hsu Fang-yu and Lezzi Peter Joseph developed the invention.
The patent application number is US202318222030 20230714. The patent publication number is US127..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Haohong Electric Technology (Hubei) has been granted a patent for Wood Chip Combustion Furnace. This invention was developed by Wang Min.
The patent application number is CN202422952251U 20241129. The patent publication number is CN223969012 (U). International Patent Classification codes are A47J37/06 and A47..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Zhejiang CFMoto Power has been granted a patent for Control Device, Power Supply and All-terrain Vehicle Adopting Control Device. This invention was developed by Shen Wenhui, Yu Hao and Ye Chunlin.
The patent application number is CN202520332805U 20250227. The patent publication number is CN223968222 (U). I..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has awarded a patent to Jiangsu Changjiang Electronics Technology for Multi-layer Chip Stacking Packaging Structure. Liu Kai, Wang Yanyan, Ying Zhan and Wang Yaqin developed the invention.
The patent application number is CN202520463029U 20250317. The patent publica..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Jiangsu Changjiang Electronics Technology has been granted a patent for Package-on-package Structure. This invention was developed by Liu Kai, Ying Zhan and Wang Huihui.
The patent application number is CN202520329594U 20250227. The patent publication number is CN223968206 (U). International Patent Classifi..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Taiwan Semiconductor Manufacturing has obtained a patent for semiconductor structure. This invention was developed by Wu Jiadian, Lin Mingxian and Liao Kunyan.
The patent application number is CN20252040338U 20250108. The patent publication number is CN223968203 (U). International Patent Classification codes ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Wuxi Huaying Microelectronics Technology has been granted a patent for Semiconductor Processing Device. Wen Ziying and Wang Ji developed the invention.
The patent application number is CN202422937457U 20241129. The patent publication number is CN223968173 (U). International Patent Classification code is H10..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- BOE Technology Group has received a patent for Light-emitting Substrate, Display Substrate and Display Module. This invention was developed by Liu Naiwei, Zhang Peilin, Jin Meiling, Wang Tianyu, Li Linfeng, Guo Zongjie, Tian Chao, Li Hehe, Lin Yicheng, Zhang Qingkai and Sun Yuanhao.
The patent application num..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Taiwan Semiconductor Manufacturing has been granted a patent for Semiconductor Device. This invention was developed by Chen Liangyin, Chen Jianhao and Wang Baoming.
The patent application number is CN202520220037U 20250212. The patent publication number is CN223968138 (U). International Patent Classification ..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Guangdong Jusen Precision Technology has been granted a patent for Buffer Type Hardware Hinge in Cup. This invention was developed by Qi Zhi.
The patent application number is CN202520169874U 20250124. The patent publication number is CN223964337 (U). International Patent Classification codes are E05D11/10, ..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Suzhou Mingdian Intelligent Technology has been awarded a patent for Efficient Electroplating Bath Body Structure of VCP Electroplating Equipment. This invention was developed by Zhao Wenchuang and Cheng Shaoxue.
The patent application number is CN202520359867U 20250304. The patent publication number is CN223..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has awarded a patent to Mianyang Juxing Permanent Magnetic Material for Charging Device for Neodymium-iron-boron Magnet Electroplating. Liang Yamian, Wang Liming, Tan Lin and Huang Huiqing developed the invention.
The patent application number is CN20252106178U 2025..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Suzhou Mingdian Intelligent Technology has secured a patent on Novel Efficient Electroplating Liquid Circulating Filtering Device of VCP Electroplating Equipment. Zhao Yu and Li Qin developed the invention.
The patent application number is CN202520359868U 20250304. The patent publication number is CN223963588..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received MFLEX Yancheng patent application for Flexible Circuit Board Based on Optimized Pattern Electroplating and Manufacturing Method Thereof. Yao Jimin and Wang Xuhao developed the invention.
The patent application number is CN202610615837 20260507. The pate..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Wuxi Huamei Technology patent application for High-frequency and High-speed PCB Metal Substrate Precision Machining System. Wang Zhong developed the invention.
The patent application number is CN202610568893 20260428. The patent publication number is CN..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Unimicron Technology patent application for Circuit Board Structure and Manufacturing Method Thereof. The invention was developed by Wang Kaiwei, Lai Yanting, Chen Qingsheng, Liao Weiyu and Huang Junrui.
The patent application number is CN20261016309 2..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Unimicron Technology patent application for Circuit Board Structure and Manufacturing Method Thereof. Wang Kaiwei, Lai Yanting, Chen Qingsheng, Liao Weiyu and Huang Junrui developed the invention.
The patent application number is CN20261020024 20260108...
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Infineon Technologies, Austria has submitted a patent application for Substrate Assembly with Test Interface for Configuring Onboard Circuit Arrangement. This invention was developed by Somasundaram Shankar, Kessler Andreas, Westmarland Peter and Yeaman Paul.
The patent application number is CN20251228750 202..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Spreadtrum Semiconductor (Nanjing) has filed a patent application for Communication Processing Method and Communication Device. This invention was developed by Lei Zhenzhu.
The patent application number is CN20251072815 20250116. The patent publication number is CN122420995 (A). International Patent Classif..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Huawei Technologies has submitted a patent application for Data Processing Method, Device, Chip and System Thereof. This invention was developed by Zhang Mingxing, Huang Kechao, Zhou Zhengchun and Meng Xianglin.
The patent application number is CN20251086910 20250117. The patent publication number is CN122420..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Huawei Technologies has submitted a patent application for Safety Control Method, Equipment, Medium, Program Product, Device and Chip. This invention was developed by Zhang Ming.
The patent application number is CN20251081873 20250116. The patent publication number is CN122419812 (A). International Patent Cla..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Spreadtrum Semiconductor (Nanjing) patent application for Communication Method and Communication Device. Xu Zhikun, Pan Zhengang, Shao Shijia and Ren Qiwei developed the invention.
The patent application number is CN20251081965 20250117. The patent pu..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Chengdu Aerospace Communication Equipment has submitted a patent application for High-speed Frequency Hopping Anti-interference Communication System and Method Based on Cx8242 Chip. This invention was developed by Zhong Binghui, Xia Qiyu, Ran Zhengfei, Chen Siyu and Yao Kuanhong.
The patent application number..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- STMicroelectronics International has submitted a patent application for Programmable High-speed Frequency Divider. This invention was developed by Tiwari Jayant Narayan.
The patent application number is CN20261058219 20260116. The patent publication number is CN122419453 (A). International Patent Classificati..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has published Shenzhen SI Semiconductors patent application for Preceding-stage Signal Conditioning Circuit of Counting Circuit and Integrated Circuit Testing Machine. The invention was developed by Cai Yexin, Pan Guohao and Yang Yingying.
The patent application num..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Semiconductor Components Industries has submitted a patent application for Comparator Circuit, Offset Compensation System and Method. This invention was developed by Horsky Pavel, Jan Plojar and Kutej Jiri.
The patent application number is CN202510399062 20250401. The patent publication number is CN122419420 ..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Chengdu Lingtong Semiconductor Co Ltd has filed a patent application for Multiphase Switch Control Radio Frequency Multiplier and Frequency Multiplication System. This invention was developed by Li Xingcun and Zhu Wei.
The patent application number is CN202610554182 20260424. The patent publication number i..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has received Infineon Technologies patent application for Motor Controller and Method for Estimating Motor Shaft Angle And/or Motor Shaft Rotational Speed of Motor. Schaefer Juergen, Amari Gabriele, Jeffremov Mark and Fourenda Adrianus developed the invention.
The p..
Semiconductor
| Fri 06 Nov 2026
Beijing, Nov. 5 -- Xi'an Jiaotong University has applied Chinese patent for Solid-liquid Mixed Thermoelectric Energy Conversion Device Based on Electronic Chip Waste Heat Management. Zhang Qianji, Ren Qinlong and Katahiro developed it.
The patent application number is CN202610489288 20260414. The patent publication number is CN..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- United States Patent for Integrated Circuit Device Having a Substrate with a Stepped Configuration to Accommodate at Least Two Different Solder Ball Sizes has been issued to Qualcomm. This invention was developed by Patil Aniket, Gupta Piyush, Aldrete Manuel, Wang Zhijie and Kumar Rajneesh.
The patent appl..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Allegro MicroSystems has received a patent for High Voltage Integrated Circuit Package with Core. This invention was developed by Keogh Andrew Bernard, Mangtani Vijay, Thompson Andrew, Taylor William P, Salato Maurizio and Duigan Joseph.
The patent application number is US202318302998 20230419. The patent ..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- STMicroelectronics International has been granted a patent for Method for Manufacturing Several Integrated Circuit Packages. Herard Laurent, Laurent Patrick and Zanellato Olivier developed the invention.
The patent application number is US202318529064 20231205. The patent publication number is US12777964 (..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Samsung Electronics has received a patent for Wet Atomic Layer Etching Method and Method of Manufacturing the Same. This invention was developed by Rhee Minwoo, Moon Bumki, Hahn Seungho, Lim Kyeongbin and Kim Wooyoung.
The patent application number is US202418405791 20240105. The patent publication numbe..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Skyworks Solutions has secured a patent on Multi Chip Front End Module with Shielding Vias. Abdulhadi Abdulhadi Ebrahim developed the invention.
The patent application number is US202318133248 20230411. The patent publication number is US12777943 (B2). International Patent Classification codes are H01L23/0..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- SK Hynix has secured a patent on Semiconductor Device and Manufacturing Method of Semiconductor Device. Choi Won Geun developed the invention.
The patent application number is US202418646765 20240426. The patent publication number is US12777939 (B2). International Patent Classification codes are H01L23/00,..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Renesas Electronics has obtained a patent for semiconductor device. This invention was developed by Yamamoto Yuki and Arie Hiroyuki.
The patent application number is US202418435425 20240207. The patent publication number is US12777938 (B2). International Patent Classification codes are H01L21/265, H01L21..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- SK Hynix has been granted a patent for Stack Package Including Insert Die for Reinforcement. This invention was developed by Kim Jin Woong and Kim Jong Yeon.
The patent application number is US202318186274 20230320. The patent publication number is US12777936 (B2). International Patent Classification codes..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Samsung Electronics has been awarded a patent for Semiconductor Device and Method of Manufacturing the Semiconductor Device. This invention was developed by Kim Myoungsoo and Kim Jisung.
The patent application number is US202318110233 20230215. The patent publication number is US12777935 (B2). Internationa..
Semiconductor
| Thu 05 Nov 2026
Geneva, Nov. 4 -- Wuhu Gcl System Integration New Energy Tech Co Ltd and GCL System Integration Technology have submitted a patent application for Topcon Solar Cell and Preparation Method Therefor, and Photovoltaic Module. This invention was developed by He Baoyang, Guo Xiangtai, Zhang Xinchao, Yu Zongbao, Gao Siyuan, Fang Mingw..
Semiconductor
| Thu 05 Nov 2026
Geneva, Nov. 4 -- NVIDIA Corp and Zheng Peng have applied WIPO patent for Neural Network Matrix Operation Optimization. Klimiashvili George, Demouth Julien, Chang An-cheng, Hoehnerbach Markus, Liu Jian, Mao Huizi, Zheng Peng and Pool Jeffrey Michael developed it.
The patent application number is WO2025CN91229 20250425. The pa..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has awarded a patent to Nanjing Qinheng Microelectronics for Gate Drive Circuit and Chip. Wang Chunhua developed the invention.
The patent application number is CN202520631956U 20250407. The patent publication number is CN223967847 (U). International Patent Classifi..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Jiangsu Yunyi Electric has been granted a patent for Lightweight Integrated Chip Type Vehicle Rectifier. Jiang Long and Ma Jun developed the invention.
The patent application number is CN202423141546U 20241219. The patent publication number is CN223967807 (U). International Patent Classification codes are H02..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Shenzhen Atom Intelligent Manufacturing Technology has been awarded a patent for Water-cooled High-power Semiconductor Laser. This invention was developed by He Yun and Li Zebin.
The patent application number is CN202520663794U 20250409. The patent publication number is CN223967504 (U). International Patent C..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has awarded a patent to Deck Microelectronics Shenzhen for Antenna Structure Applied to Terahertz, Terahertz System on Chip and Power Transmission Architecture. Xiao Xiangyu and Li Cheng developed the invention.
The patent application number is CN202520727478U 20250..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has awarded a patent to Uniroyal Electronics Industry for Electroplating-free Thick Film Chip Resistor. Jiang Fei, Wang Tianyu, Xu Yuhua, Peng Ronggen and Wang Tengwei developed the invention.
The patent application number is CN20242365434U 20241212. The patent publ..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- State Intellectual Property Office of China has awarded a patent to Chaoshijie Display Technology for Goa Circuit, Array Substrate and Display Panel. Pan Fuhong and Lin Peixin developed the invention.
The patent application number is CN202520552410U 20250326. The patent publication number is CN223967023 (U). ..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- Zhejiang Chuangxin Integrated Circuit has obtained a patent for semiconductor process chamber and semiconductor equipment. This invention was developed by Chen Yang.
The patent application number is CN202520806823U 20250425. The patent publication number is CN223966811 (U). International Patent Classification..
Semiconductor
| Thu 05 Nov 2026
Beijing, Nov. 5 -- BOE Technology Group has obtained a patent for display substrate and display device. This invention was developed by Wang Lizhong, Guo Hui, Huang Rui and Ning Ce.
The patent application number is CN202520760827U 20250421. The patent publication number is CN223966797 (U). International Patent Classification co..
Semiconductor
| Wed 04 Nov 2026
Beijing, Nov. 4 -- Taijidian China Co Ltd and Taiwan Semiconductor Manufacturing have been granted a patent for Wafer Detection System. Chen Dingcao, Zhang Peng, Pei Dafei, Wang Heng, Wang Yuncheng and Pi Fengdong developed the invention.
The patent application number is CN202520514638U 20250321. The patent publication number..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Fuji Electric has been granted a patent for Semiconductor Device. This invention was developed by Masuda Shinichi and Yamamoto Takuya.
The patent application number is US202418584127 20240222. The patent publication number is US12777929 (B2). International Patent Classification codes are H01L25/07, H10W4..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Nanya Technology has received a patent for Semiconductor Device with Protection Layer and Method for Fabricating the Same. This invention was developed by Wu Chun-heng.
The patent application number is US202318507423 20231113. The patent publication number is US12777919 (B2). International Patent Classif..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- SK Hynix has received a patent for Semiconductor Device Including a Plug Structure. This invention was developed by Yoon Young Gwang.
The patent application number is US202318499224 20231101. The patent publication number is US12777918 (B2). International Patent Classification codes are H01L29/04, H01L29/0..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Micron Technology has been granted a patent for Microelectronic Devices Including Contact Structures, and Related Electronic Systems and Methods. This invention was developed by Xuan Zhou, Ong Biow Hiem and Yu Sijia.
The patent application number is US202418427720 20240130. The patent publication number is..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Micron Technology has been granted a patent for Microelectronic Devices Including Contact Structures, and Related Memory Devices, Electronic Systems, and Methods. Clampitt Darwin A, Vadivel Shruthi Kumara and Neumeyer David developed the invention.
The patent application number is US202217930365 20220907. ..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Nanya Technology has secured a patent on Method of Manufacturing Semiconductor Device. Ho Jui Wen developed the invention.
The patent application number is US202418738057 20240609. The patent publication number is US12777906 (B2). International Patent Classification codes are H01L21/321, H01L21/3213, H01L2..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- United States Patent for Substrate Manufacturing Method, Embedded Substrate and Semiconductor has been issued to Zhuhai Access Semiconductor. This invention was developed by Huang Juchen, Chen Xianming, Huang Benxia, Huang Gao, Lin Wenjian and Hong Yejie.
The patent application number is US202318454022 202..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Applied Materials has received a patent for Interfacial Layer for Anneal Capping Layer. This invention was developed by Zheng Yi, Fang Jun, Ma Qiang and Che Xiaozhou.
The patent application number is US202318398532 20231228. The patent publication number is US12777901 (B2). International Patent Classificat..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Tokyo Electron has received a patent for Selective Deposition of Passivating Layer During Spacer Etching. This invention was developed by Liu Eric Chih-fang, Biolsi Petr, Biolsi Peter, Chang Shihsheng and Chen Ya-ming.
The patent application number is US202318160779 20230127. The patent publication number ..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Nanya Technology has been awarded a patent for Semiconductor Device and Method for Manufacturing the Same. This invention was developed by Wu Jian-ping and Jao Jui-hsiu.
The patent application number is US202418665866 20240516. The patent publication number is US12777898 (B2). International Patent Classi..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- Samsung Electronics has obtained a patent for method of splitting semiconductor chip using mechanical machining and semiconductor chip split by the same. This invention was developed by Shin Seunghun, Ko Yeongkwon, Jung Jihun and Heo Junyeong.
The patent application number is US202318371774 20230922. The p..
Semiconductor
| Fri 06 Nov 2026
Alexandria, Nov. 5 -- United States Patent for Susceptor Height Adjustment has been issued to Applied Materials. This invention was developed by Parkhe Vijay D.
The patent application number is US202318236115 20230821. The patent publication number is US12777889 (B2). International Patent Classification codes are H01L21/67, H01..
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