Semiconductor
| Thu 05 Nov 2026
Geneva, Nov. 4 -- Mitsubishi Gas Chemical Co Inc has filed a patent application for Resin Composition, Cured Product, Resin Composite Sheet, Prepreg, Metal Foil–clad Laminate, Printed Wiring Board, and Semiconductor Device. This invention was developed by Kataoka Shunichi, Tokunaga Naoya, Itoh Syouichi, Yamamoto Katsuya and In..