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Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Zhuhai Siliconcore Tech Co Ltd has submitted a patent application for Design Rule Checking Method for Chip Design, Computer Device and Storage Medium. This invention was developed by Zhao Yi, Feng Rongkun, Mo Xiaolin, Huang Jieying, Li Shaobai and Hu Kunmei.
The patent application number is CN202511902615 2..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Jiangsu Xinyuan Semiconductor Co Ltd has submitted a patent application for Test Control Method and Device of Vehicle-mounted Chip and Storage Medium. This invention was developed by Yin Guohai and Liu Xiaojie.
The patent application number is CN202511400276 20250928. The patent publication number is CN1213..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Beijing Qianhe Yibangyun Information Tech Co Ltd has submitted a patent application for Stacked Chip Architecture of Distributed Cache and Chip. Chen Hao and Zhang Xiangjian developed the invention.
The patent application number is CN202511299915 20250911. The patent publication number is CN121349952 (A). I..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Weidu Microelectronics Guangdong Co Ltd has submitted a patent application for Method for Improving Touch Performance of Tddi Driving Chip, Storage Medium and Tddi Driving Chip. This invention was developed by Li Yue, Li Peiyu, Chen Hangkai and Li Chenyang.
The patent application number is CN202511563483 20..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Nivarox Far SA has submitted a patent application for Method for Manufacturing Silicon Hairspring. This invention was developed by Cusin Pierre and Verardo Marco.
The patent application number is CN202511450558 20190321. The patent publication number is CN121348684 (A). International Patent Classification c..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Shenzhen Lice Intelligent Tech Ltd has submitted a patent application for Transmission-type Optical Phased Array Light Beam Scanning Chip and Combination. This invention was developed by Zhang Zhongxiang.
The patent application number is CN202511921844 20251218. The patent publication number is CN121348631 ..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Beijing Zhongke Huiyi Tech Co Ltd has submitted a patent application for Optical Imaging Module and Semiconductor Wafer Defect Detection Equipment with Same. This invention was developed by Yuan Zhichao, Shen Yanan and Li Jianquan.
The patent application number is CN202511512940 20251022. The patent publica..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Shenzhen Huanguang Shidai Tech Co Ltd has submitted a patent application for Testing System for Optical Chip of Micro-ring Modulator. This invention was developed by Liang Bo and Chen Jialing.
The patent application number is CN202511892156 20251216. The patent publication number is CN121348057 (A). Interna..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Jiangsu Heyi Guangxian Tech Co Ltd has submitted a patent application for Continuous Testing Device for OLED Panel Driving IC. This invention was developed by Wang Wenguang and Wu Jiang.
The patent application number is CN202511717822 20251121. The patent publication number is CN121348046 (A). International..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Hunan Siweite Tech Co Ltd has submitted a patent application for Single Diode Chip Batch Test Method and Test Fixture Thereof. Su Chunhua, Yu Xiaolei and Kong Tianwu developed the invention.
The patent application number is CN202511618255 20251106. The patent publication number is CN121348045 (A). Internati..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Muxi Tech Chengdu Co Ltd has submitted a patent application for Forced Test Circuit of Chip. This invention was developed by Liu Kaifeng.
The patent application number is CN202511526135 20251024. The patent publication number is CN121348040 (A). International Patent Classification code is G01R31/28.
An ..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Shenzhen Feiteng Electronic Tech Co Ltd has submitted a patent application for Method and System for Controlling OLED Automatic Aging Equipment. Xu Yanyan developed the invention.
The patent application number is CN202511475012 20251015. The patent publication number is CN121347923 (A). International Patent..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Imax Osram International BV has submitted a patent application for Method for Fixing Optical Element to Substrate in Beam Path of Optoelectronic Component, and Optoelectronic Component. This invention was developed by Lindberg Gudrun, Kraeuter Gertrud and Eberhardt Angela.
The patent application number is C..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Xintisu Hangzhou Tech Development Co Ltd has submitted a patent application for Silver Paste for Bonding Metal Substrate and Preparation and Sintering Method Thereof. Li Shen, Zhou Nanjia, Zhao Huaiyuan and Chen Xiaopeng developed the invention.
The patent application number is CN202511243763 20250902. The ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- IPS Ltd has submitted a patent application for Substrate Processing Apparatus. This invention was developed by Kim Ji-hyun, Jin Kwang-seon and Kim Hak-min.
The patent application number is CN20248038714 20240806. The patent publication number is CN121359238 (A). International Patent Classification codes are..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Suzhou Aiwei Integrated Circuit Tech Co Ltd has submitted a patent application for Driving System and Method of Matrix Lamp, Chip and Display Device. This invention was developed by Li Shuai, Xia Xiang, Zhang Zhong and Hong Tao.
The patent application number is CN202511882246 20251212. The patent publicatio..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Stan International Semiconductor Co Ltd has submitted a patent application for Gamma Correction Method, Display Driving Chip and Image Display Device. This invention was developed by Pang Weiou, Zhu Kaisong, Zhang Ke and Huang Li.
The patent application number is CN202410945957 20240715. The patent publicat..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Pengxi Semiconductor Tech Beijing Co Ltd has submitted a patent application for Tank Car Operation Behavior Analysis Method Based on Improved Yolo Network for Semiconductor Factory Service System. This invention was developed by He Jipei and Su Feng.
The patent application number is CN202511904730 20251217...
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Guangdong Xincheng Hanqi Semiconductor Tech Co Ltd has submitted a patent application for Airtight Packaging Structure and Packaging Method of Chip. This invention was developed by Han Lei and Zhu Kai.
The patent application number is CN202511326808 20250917. The patent publication number is CN121358321 (A)..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Lisuan Tech Shanghai Co Ltd has submitted a patent application for Solder Ball Arrangement Structure and Method in Chip Packaging Substrate, Chip and Electronic Equipment. This invention was developed by Lu Yu, Yang Ke and Zhang Weibo.
The patent application number is CN202511893121 20251216. The patent pub..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Changsha Anmuquan Intelligent Tech Co Ltd has submitted a patent application for Crystal Grain Manufacturing Process, Crystal Grain and Chip. Liu Zheng, Wei Ping, Zheng Boyu, Luo Jiahu and Guo Wenjuan developed the invention.
The patent application number is CN202511489792 20251017. The patent publication n..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Mairuijie Nanjing Semiconductor Tech Co Ltd has submitted a patent application for Long-stroke High-precision Wafer Feeding Manipulator with Positioning Function. Li Bin, Zhu Haibing, Sun Hongtao and Huang Zhenlong developed the invention.
The patent application number is CN202511495370 20251020. The patent..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shenyang Siasun Semiconductor Equipment Co Ltd has submitted a patent application for Wafer Transfer Control Method and System Based on Wafer Box Storage Equipment. This invention was developed by Wang Dongsheng, Cheng Long, Yang Zhiyu, Zhang Meng, Jiao Hongchan, Jin Lei and Li Zhitian.
The patent applicati..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Guangdong Changhua Tech Co Ltd has submitted a patent application for Chip Mounting Device and Chip Mounting Method. This invention was developed by Wang Jinhua and Wang Zhi.
The patent application number is CN202511594899 20251103. The patent publication number is CN121358225 (A). International Patent Clas..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Xinpai Tech Co Ltd has submitted a patent application for Series Assembly Die and Chip for High-power Semiconductor Device Cells. This invention was developed by Liu Tong, Yang Yong, An Jing, Li Yufei, Yu Jia and Luo Yi.
The patent application number is CN202511473626 20251015. The patent publication number..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Kunshan Rongyuan Xinye Machinery Tech Co Ltd has submitted a patent application for Surface Treatment Device for Processing Semiconductor Parts. Zhang Ming, He Debing and Zhang Zhen developed the invention.
The patent application number is CN202511399675 20250928. The patent publication number is CN12135821..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Beijing Shunxing Juyuan Microelectronics Co Ltd has submitted a patent application for Wafer Backflow Method and Wafer Backflow Vacuum Furnace. This invention was developed by Xue Xinghai.
The patent application number is CN202510481622 20250417. The patent publication number is CN121358213 (A). Internation..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shanghai Xinaoxinyi Tech Co Ltd has submitted a patent application for Substrate Oxidation Method and Semiconductor Device. This invention was developed by Wang Ziwen, Lu Qiong, Dai Rongwang, Wei Xing and Li Wei.
The patent application number is CN202511923054 20251218. The patent publication number is CN12..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Wanjiang Center For Development Of Emerging Industrial Tech has submitted a patent application for Bifunctional Covering Layer Applied to Semiconductor Gas Sensor and Preparation Method of Bifunctional Covering Layer. This invention was developed by Deng Zanhong, Zhang Ruofan, Meng Gang, Wang Shimao, Tao Ruhua..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Shenzhen Kincoto Electronic Equipment Co Ltd has submitted a patent application for Mini Chip Visual Inspection and Accurate Placement System and Method. This invention was developed by Chen Zhifeng and Liu Fuyu.
The patent application number is CN202511898274 20251216. The patent publication number is CN12..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Darwin Prec Industry Co Ltd has submitted a patent application for Surface-enhanced Raman Spectrum To-be-detected Object Drying System and Quick-drying Surface-enhanced Raman Spectrum Wafer. Yang Tingjie developed the invention.
The patent application number is CN202511780889 20251128. The patent publicatio..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Nanjing Qianshi Intelligent Mfg Co Ltd has submitted a patent application for Residual Silicon Thickness Measuring Device and Method. This invention was developed by Huang Yingjun and Zhou Ze.
The patent application number is CN202511913038 20251218. The patent publication number is CN121346671 (A). Interna..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Guangzhou Yumai Electronic Tech Co Ltd has submitted a patent application for Silicon Wafer Cleaning Device and Cleaning Method. Li Kunting and Chen Jingli developed the invention.
The patent application number is CN202511510566 20251022. The patent publication number is CN121358207 (A). International Paten..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Huahong Semiconductor Mfg Wuxi Co Ltd has submitted a patent application for Method for Improving Silicon Weed Defect in Groove-shaped Contact Hole Etching Process of Semiconductor Device. This invention was developed by Yang Jialin, Yu Peng, Ruihuan Wang, Sun Jian, Yu Tao and Zhou Qian.
The patent applicat..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Geke Semiconductor Shanghai Co Ltd has submitted a patent application for Ion Implantation Process of Image Sensor. This invention was developed by Chen Lin and Liu Kaifan.
The patent application number is CN202410854882 20240627. The patent publication number is CN121358184 (A). International Patent Classi..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Taiwan Semiconductor Co Ltd has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Hayashi Fumiyoshi, Wu Shimin, Zhang Xuanting and Xu Wangcheng.
The patent application number is CN202411509659 20241028. The patent publication number ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Beijing Zhichuang Xinyuan Tech Co Ltd has submitted a patent application for Molecular Beam Epitaxy Heterogeneous Base Hgcdte Material and Preparation Method Thereof. This invention was developed by Tong Lei.
The patent application number is CN202511522293 20251023. The patent publication number is CN121358..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Jinko Solar Holding Co Ltd has submitted a patent application for Preparation Method of Solar Cell, Solar Cell and Photovoltaic Module. This invention was developed by Zhang Yuanfang, Wang Zhao, Zheng Peiting, Yang Jie and Zhang Xinyu.
The patent application number is CN202511902257 20251216. The patent pub..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Yingweixin Shanghai Tech Co Ltd has submitted a patent application for Group III-V Compound and Silicon Heterogeneous Integrated Single Photon Avalanche Diode and Preparation Method Thereof. This invention was developed by Chen Qingyu, Nie Hui and Zhao Hui.
The patent application number is CN202511483844 20..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Beijing Ruidi Shikong Information Tech Co Ltd has submitted a patent application for Multi-mode Chip Preparation Method Based on Radio Frequency Digital-analog Mixing. This invention was developed by Xue Xiaofeng, Jiang Cheng, Du Wentao and Wei Shuaipeng.
The patent application number is CN202511492906 2025..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Heshan Zhongfu Xingye Circuit Co Ltd has submitted a patent application for Manufacturing Process of Thermoelectric Separation Substrate and Thermoelectric Separation Substrate. This invention was developed by Xiao Hongbing and Wang Xianfeng.
The patent application number is CN202511295261 20250911. The pat..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shandong Inspur Huixin Microelectronics Tech Co Ltd has submitted a patent application for Method for Bonding Lead on Printed Circuit Board of Packaging-free Power Chip and Bonding Structure. Du Jun, Zhao Rongzhuang, Li Xingliang, Zhang Shibo, Tang Fuguo and Xia Wei developed the invention.
The patent appli..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Jiangmen Yamin Electronic Tech Co Ltd has submitted a patent application for Aluminum Substrate Production Process for Cutting Circuit Through Mold. This invention was developed by Tong Chaoliang.
The patent application number is CN202511519781 20251023. The patent publication number is CN121357807 (A). Int..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Wuxi Guoxin Micro High Tech Co Ltd has submitted a patent application for Can Bus Wake-up Device and Can Bus Communication Chip. Zheng Jiang, Xiao Zuonan, Kuang Qihe and Wang Zhonglin developed the invention.
The patent application number is CN202511884133 20251215. The patent publication number is CN121356..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- GLF Microelectronics Sichuan Co Ltd has submitted a patent application for Trimming Circuit with Power-on Feedback, Trimming Method and Chip. Sun Ni, Kang Ziyang and Zhao Jing developed the invention.
The patent application number is CN202511501909 20251021. The patent publication number is CN121356553 (A)...
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Suzhou 3ctest Electronic Tech Co Ltd has submitted a patent application for Square Wave Generating Device Based on Semiconductor Switch. This invention was developed by Zhu Yuxuan, Yu Hui and Shi Jian.
The patent application number is CN202511902036 20251217. The patent publication number is CN121356534 (A)..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Heilongjiang Huixin Semiconductor Co Ltd has submitted a patent application for Pulse Circuit, PCB and Chip. Feng Yuxiang, Zhong Zunheng and Feng Kexin developed the invention.
The patent application number is CN202511295932 20250911. The patent publication number is CN121356530 (A). International Patent Cl..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Mingtech Co Ltd has submitted a patent application for Method and System for Reading Different Electronic Tags Through Single Radio Frequency Chip and Double Antennas. This invention was developed by Yang Huijun and Feng Haiqing.
The patent application number is CN202410940218 20240715. The patent publicati..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Navitas Semiconductor Inc has submitted a patent application for Flyback Power Converter Primary Side Controller and Method of Operating Same. Huang Jianchun developed the invention.
The patent application number is CN202510973471 20250715. The patent publication number is CN121356291 (A). International Pat..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Mellanox Technologies patent application for Tunneling of Peripheral Bus Protocol Traffic Over Consistent Fabric and Inter-chip or Inter-die Bus. Daniel Thomas, Boshtin Ilya, Snir Alexander, Goldfarb Noam, Fudim Max and Bhattacharyya Santosh developed th..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Nanchang University has submitted a patent application for Preparation Method of Wafer-level MoS2 Film Vertical Structure Memristor. This invention was developed by Wang Zhendong, Lai Ziyun and Wang Qisheng.
The patent application number is CN202511360494 20250923. The patent publication number is CN1213581..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Weijian Intelligent Packaging Technology (Shenzhen) has filed a patent application for Head Binding Device, Correction Mounting System and Die Bonding Equipment. This invention was developed by Lei Weizhuang and Wang Qing.
The patent application number is CN202511901546 20251216. The patent publication numb..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Weijian Intelligent Packaging Technology (Shenzhen) has submitted a patent application for Head Binding Device, Correction Mounting System and Die Bonding Equipment. Liu Jianxi and Zeng Haodong developed the invention.
The patent application number is CN202511901547 20251216. The patent publication number i..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Shunsin Technology, Zhong Shan patent application for LGA Packaging Structure Capable of Being Welded on Two Sides and Manufacturing Process of LGA Packaging Structure. Chen Shanheng developed the invention.
The patent application number is CN20251139..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Huawei Technologies has applied Chinese patent for Chip Packaging Structure and Packaging Method Thereof. Zong Fei, Ren Hui, Gao Fei, Zhang Can and Qin Long developed it.
The patent application number is CN202410917921 20240709. The patent publication number is CN121358316 (A). International Patent Classifi..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Guangdong Xinxing Laser Plasma Technology Research Institute has submitted a patent application for Semiconductor Packaging Structure and Preparation Method Thereof. Zhu Kun and Yan Xueqing developed the invention.
The patent application number is CN202511416230 20250929. The patent publication number is CN..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Yangtze Memory Technologies has applied Chinese patent for Semiconductor Structure, Manufacturing Method Thereof and Memory System. Zhao Tingting, Huo Zongliang, Gao Jing, Li Sizhe, Zhang Wenbo and Zhang Zengpeng developed it.
The patent application number is CN202410955646 20240716. The patent publication ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Huahong Semiconductor, Wuxi patent application for Be-sonos Embedded Memory Structure and Process Method. Chen Hao, Lyu Chuanjiang and Wang Xiaori developed the invention.
The patent application number is CN202511415100 20250929. The patent publicatio..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Samsung Electronics has applied Chinese patent for Memory Device. Kim Yun-jae and Han Jin-woo developed it.
The patent application number is CN202510741080 20250605. The patent publication number is CN121357881 (A). International Patent Classification code is H10B12/00. Cooperative Patent Classification cod..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Yangtze Memory Technologies has filed a patent application for Semiconductor Structure, Manufacturing Method Thereof and Memory System. This invention was developed by Zhao Tingting, Huo Zongliang, Gao Jing, Li Sizhe, Zhang Wenbo and Zhang Zengpeng.
The patent application number is CN202410956444 20240716. ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Zhuhai Gree Electronic Components patent application for Semiconductor Device and Preparation Method Thereof. The invention was developed by Cai Hongwei, Zhang Quan, Ma Wanli and Yan Zhengkun.
The patent application number is CN202511572915 20251030...
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Huahong Semiconductor, Wuxi has submitted a patent application for LDMOS Device and Preparation Method Thereof. This invention was developed by Jiao Peng, Zhang Lei and Wang Xiaori.
The patent application number is CN202511406372 20250929. The patent publication number is CN121357930 (A). International Pate..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Guangzhou Zengxin Technology has sought patent for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Wang Binbin.
The patent application number is CN202511527840 20251023. The patent publication number is CN121357934 (A). International Patent Classification codes are H1..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Wuhan Xinxin Semiconductor patent application for Semiconductor Device and Manufacturing Method Thereof. The invention was developed by Lei Ting, Xue Guangjie and Sun Chun.
The patent application number is CN202511588007 20251031. The patent publicat..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Powerchip Semiconductor Manufacturing Corporation patent application for Semiconductor Structure. The invention was developed by Ni Peirong, Lyu Junlin and Zhuang Zhihao.
The patent application number is CN202410989543 20240723. The patent publicatio..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Yuexin Semiconductor Technology patent application for N Well and Deep P Well Junction Test Structure, Preparation Method and Test Method. The invention was developed by Zhao Zhongwen, Chen Dan, Wang Xiaoli, Gao Peixiong and Zhang Yonghua.
The patent..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Fuji Electric has sought patent for Semiconductor Module. This invention was developed by Isozaki Makoto.
The patent application number is CN202510704057 20250529. The patent publication number is CN121358318 (A). International Patent Classification codes are H10D80/20, H10W40/25, H10W40/60, H10W70/69, H10W..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Hunan Yuemo Advanced Semiconductor has applied Chinese patent for Packaging Method of Multi-chip Module. Zhou Liang, Wei Yaocheng, Ma Xiaobo, Yi Haomin, Zhang Hong and Xu Zhiming developed it.
The patent application number is CN202511914823 20251218. The patent publication number is CN121358324 (A). Interna..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shanghai University Of Engineering Science has applied Chinese patent for High-mobility Field Effect Transistor Based on Organic Double-quantum Well Structure and Preparation Method of High-mobility Field Effect Transistor. Lyu Aifeng and Gu Yumei developed it.
The patent application number is CN20251129696..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Zhejiang University has submitted a patent application for Platform Potential Neuron Transistor, Preparation Method and Working Method. This invention was developed by Yu Bin and Wang Hailiang.
The patent application number is CN202511588856 20251103. The patent publication number is CN121357958 (A). Intern..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Sun Peng, Yang Jiye and Xing Junjun.
The patent application number is CN202511367763 20250924. The patent publicatio..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has applied Chinese patent for Semiconductor Device and Manufacturing Method Thereof. Ma Jian, Wu Shangze, Hu Jun and Liu Donghua developed it.
The patent application number is CN202511367761 20250924. The patent publication number is CN12135794..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Hefei Nexchip Integrated Circuit patent application for Semiconductor Device and Preparation Method Thereof. Meng Juan, Wu Yan, Xu Chunlong and Chen Xinquan developed the invention.
The patent application number is CN202511903161 20251217. The patent ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Samsung Electronics has filed a patent application for Semiconductor Device. This invention was developed by Li Mingxuan.
The patent application number is CN202510260893 20250306. The patent publication number is CN121357989 (A). International Patent Classification codes are H10D62/10 and H10D84/85. Coopera..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- United Microelectronics Corporation has submitted a patent application for Semiconductor Structure. This invention was developed by Du Mingxiang, Cai Minghua, Chen Junlin, Zheng Junwen, Huang Yaxin and Yang Yongfang.
The patent application number is CN202410924843 20240711. The patent publication number is ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Liu Sutao.
The patent application number is CN202511926555 20251219. The patent publication number is CN121357982 (A). International Patent Classifi..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has applied Chinese patent for High-voltage Pnp Structure Electrostatic Protection Device. He Yiming developed it.
The patent application number is CN202511415531 20250930. The patent publication number is CN121357999 (A). International Patent C..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Xiamen Sanan Optoelectronics has applied Chinese patent for Light Emitting Diode and Light Emitting Device. Yang Renlong, Zhang Liming, Xiao Teng and Lan Xiaoyun developed it.
The patent application number is CN202511586797 20251031. The patent publication number is CN121358072 (A). International Patent Cla..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has applied Chinese patent for High-voltage Electrostatic Protection Circuit. He Yiming developed it.
The patent application number is CN202511415647 20250930. The patent publication number is CN121358001 (A). International Patent Classification..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received United Microelectronics Corporation patent application for Resistive Memory Cell and Manufacturing Method Thereof. Lin Shiming, Shi Yulong and Li Kunru developed the invention.
The patent application number is CN20241155374 20240802. The patent public..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Tuojing Jianke Haining Semiconductor Equipment has submitted a patent application for De-bonding Equipment and De-bonding Method. This invention was developed by Wu Ziqi, Ma Shuangyi and Yang Meng.
The patent application number is CN202511927579 20251218. The patent publication number is CN121358200 (A). In..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released North Integrated Circuit Tech Innovation Center patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Bao Mingjun and Wu Xusheng.
The patent application number is CN202410940390 20240712. The patent..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Yangtze Memory Technologies has submitted a patent application for Operation Method of Memory, Memory and Memory System. This invention was developed by Zheng Siwen, Huang Wei, Deng Lang, Wan Weijun, Chen Ge and Han Jinchi.
The patent application number is CN202410948307 20240715. The patent publication num..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Samsung Electronics patent application for Memory Device Including Memory Cells Stacked in Three Dimensions. Kang Kyu-chang, Seo Young-hun, Yoo Chang Sik, Kim Sang-yun, Park Young-seok and Yoon Hyun-chul developed the invention.
The patent application..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Winbond Electronics patent application for Memory Device and Data Erasing Method Thereof. The invention was developed by Zheng Rujie, Zheng Longji, Cai Sanxuan and Zhuang Yuzheng.
The patent application number is CN202510524082 20250424. The patent p..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Samsung Electronics patent application for Memory Device, Memory System and Data Format Conversion Method. Kim Ho-yeon and Yoon Jong-ryun developed the invention.
The patent application number is CN202510643413 20250519. The patent publication number ..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Nanjing University patent application for Method for Obtaining Mobility and Trap Capture Time and Release Time Through Semiconductor Time-of-flight (tof) Current Based on Automatic Fitting Algorithm. The invention was developed by Shen Keyin, Wu Ying, D..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released INOVA Semiconductors patent application for Efficiely Transmittable Bit Sequences with Restricted Difference and. This invention was developed by Kruger Fabian and Neumann Roland.
The patent application number is CN20248041483 20240307. The patent pub..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received GS Yuasa International patent application for Electricity Storage Device. Okamoto Shota, Arimoto Shoichi and Nakamura Koji developed the invention.
The patent application number is CN20248040426 20240614. The patent publication number is CN121359341 (..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Sony patent application for Light Emitting Device and Manufacturing Method Thereof. This invention was developed by Yamaguchi Shuhei, Watanabe Hideki, Higa Yasutaka, Song Kyung-seok, Shinto Tatsuya, Wada Koshiro and Koda Rintaro.
The patent applicatio..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Institute of Semiconductors, Chinese Academy of Sciences has submitted a patent application for Laser with Gradient Duty Cycle Period Modulation Grating Structure. This invention was developed by Ren Menghan, Cao Yulian, Liu Jianguo, Liu Zeqiu and Jia Shuohong.
The patent application number is CN20241094402..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Shandong Huaguang Optoelectronics has applied Chinese patent for Pumping Source, Pumping Source Assembly, Pumping Source Manufacturing System and Pumping Source Manufacturing Method. Li Peixu, Zhang Guangming, Liu Chengcheng, Du Junjun, Liu Qi and Wu Dehua developed it.
The patent application number is CN20..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Huawei Technologies has submitted a patent application for Cold Source and Negative Capacitance Field Effect Transistor and Method. This invention was developed by Wang Jiechen.
The patent application number is CN20238099004 20230705. The patent publication number is CN121359607 (A). International Patent Cl..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- LG Innotek has submitted a patent application for Circuit Board and Semiconductor Package Including Same. Jung Sung-ho, Moon Byung Youl and Choi Hee-yeon developed the invention.
The patent application number is CN20248039725 20240415. The patent publication number is CN121359631 (A). International Patent Cla..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Tokyo Electron has submitted a patent application for Plasma Processing Apparatus and Potential Control Method. This invention was developed by Kawada Yuki, Matsumoto Naoki and Yamada Kazuhito.
The patent application number is CN20248041221 20240614. The patent publication number is CN121359625 (A). Internati..
Semiconductor
| Tue 19 May 2026
Beijing, May 19 -- Guangxi Juxin Technology has submitted a patent application for Semiconductor Laser Chip. This invention was developed by Fu Jianbo, Zong Hua, Jiang Shengxiang, Meng Linghai, Hu Xiaodong and Luo Zhengbiao.
The patent application number is CN202511345691 20250919. The patent publication number is CN121355699 (..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shenzhen Xunguang Technology has submitted a patent application for Optical Assembly, Semiconductor Integrated Light Source and Lighting Device. This invention was developed by Huang Wei, Cao Yuxing and Li Xiangyang.
The patent application number is CN202511901906 20251217. The patent publication number is CN..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Applied Materials has submitted a patent application for Etching Metal Oxides Using Fluorine and Metal Halides. This invention was developed by Woods Kristopher Nathan, Cui Zhe and Saly Mark.
The patent application number is CN202511466337 20200611. The patent publication number is CN121358194 (A). Internatio..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Etching Method and Semiconductor Process Equipment. This invention was developed by Zhu Mengjiao, Wang Jing and Chen Qingyuan.
The patent application number is CN202511573843 20251030. The patent publication number is CN121358187 ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Sichuan University has submitted a patent application for Znsb Alloying and Se Doping Regulation P-type Bi2te3 Thermoelectric Material and Preparation Method of Znsb Alloying and Se Doping Regulation P-type Bi2te3 Thermoelectric Device. Ang Ran, Li Ruiheng and Zheng Jie developed the invention.
The patent app..
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