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Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has published Samsung Electronics patent application for Memory Device for Controlling Shielded Bit Lines. The invention was developed by Cho Joon-hee, Nam In Cheol, Kang Kyu-chang, Kim Sang-yun, Kim Seon-young, Park Jong-wook, Lee Ho Seok and Jeong Kang-seob.
The..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has published Yageo patent application for Chip Resistor. The invention was developed by Xiao Shengli, Shi Boxun and Lin Guangcheng.
The patent application number is CN202311442745 20231101. The patent publication number is CN119943511 (A). International Patent Cl..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Yageo has filed a patent application for Chip Resistor. This invention was developed by Xiao Shengli, Shi Boxun and Lin Guangcheng.
The patent application number is CN202311460028 20231103. The patent publication number is CN119943515 (A). International Patent Classification codes are H01C1/02, H01C1/084, H..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Guangzhou Zengxin Technology has filed a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Huang Huiling.
The patent application number is CN202411993930 20241231. The patent publication number is CN119943653 (A). International Patent Classification c..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received Xinlian Integrated Circuit Manufacturing patent application for Semiconductor Device and Manufacturing Method Thereof. Yang Xue, Sui Xiaochao and Yu Long developed the invention.
The patent application number is CN202510103347 20250122. The patent pub..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received Youguang Intelligent Semiconductor Technology (Shenzhen) patent application for Continuous Eutectic Machine and Use Method Thereof. Li Jinlong and Li Derong developed the invention.
The patent application number is CN202510102870 20250122. The patent ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received United Microelectronics Corporation patent application for Semiconductor Manufacturing Process Auxiliary Equipment Control Method, Control Assembly and Manufacturing System. Guo Zhizhong, Guo Yongjie, Peng Zhentai, Cai Mingwei, Wang Shengming, Li Ruihong..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received Beijing NAURA Microelectronics Equipment patent application for Semiconductor Process Chamber and Drainage Method. Li Dongfang, Wang Wei, Wang Xijian, Mao Xingfei and Feng Huicai developed the invention.
The patent application number is CN202311458509..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received Wuxi Shangji Semiconductor Technology patent application for Multi-wafer Etching Device. Tian Wenkang, Zhu Jianxiong, Fan Xiong, Wang Zhaofeng and Wang Shikuan developed the invention.
The patent application number is CN202510430705 20250408. The pate..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Samsung Electronics has applied Chinese patent for Semiconductor Package. Baek Seung-duk developed it.
The patent application number is CN202410985252 20240722. The patent publication number is CN119943792 (A). International Patent Classification codes are H01L21/60, H01L23/48, H01L23/482, H01L23/485, H01L2..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has published Sumitomo Electric Industries patent application for Semiconductor Device. The invention was developed by Shimizu Shunto and Arae Sadanori.
The patent application number is CN202411501708 20241025. The patent publication number is CN119943806 (A). Int..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Sumitomo Electric Industries has applied Chinese patent for Semiconductor Device. Arae Sadanori and Shimizu Shunto developed it.
The patent application number is CN202411501974 20241025. The patent publication number is CN119943807 (A). International Patent Classification codes are H01L23/522 and H01L23/528..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Samsung Electronics has filed a patent application for Semiconductor Package. This invention was developed by Baek Seung-duk.
The patent application number is CN202410941984 20240712. The patent publication number is CN119943809 (A). International Patent Classification codes are H01L23/31, H01L23/48, H01L23..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Xinlian Yuezhou Integrated Circuit Manufacturing (Shaoxing) has sought patent for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Zhang Guoxin.
The patent application number is CN202510101460 20250122. The patent publication number is CN119943812 (A). International Pat..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Hubei Jiangcheng Chip Pilot Production Services has sought patent for Semiconductor Structure and Forming Method. This invention was developed by Fang Wanyi, Wang Chenghong, Wang Kun and Ying Cheng.
The patent application number is CN202510110907 20250123. The patent publication number is CN119943813 (A). I..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Shanghai Jita Semiconductor has filed a patent application for Critical Dimension Loss Test Structure and Test Method. This invention was developed by Liu Liming.
The patent application number is CN202510105289 20250122. The patent publication number is CN119943827 (A). International Patent Classification c..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Kunshan Riyue Tongxin Semiconductor has secured a patent on Joint Operation Platform. Liu Zihui, Hu Mingyi, Liu Xinglun and Chen Weiguang developed the invention.
The patent application number is CN202422623099U 20241029. The patent publication number is CN223303816 (U). International Patent Classification ..
Semiconductor
| Fri 05 Dec 2025
Beijing, Dec. 5 -- ASEN Semiconductors Suzhou has been granted a patent for Device for Splicing Electronic Components. Zhou Meng developed the invention.
The patent application number is CN202422728293U 20241109. The patent publication number is CN223277946 (U). International Patent Classification codes are B25H1/08 and F21V3..
Semiconductor
| Fri 05 Dec 2025
Beijing, Dec. 5 -- Guangdong Xingxing Electronic Tech Co Ltd has been awarded a patent for Transfer Fixture for Sprayed Chip. This invention was developed by Liu Wenxian, Wu Gang and Xu Ning.
The patent application number is CN202422485480U 20241015. The patent publication number is CN223277823 (U). International Patent Class..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received Lens Technology Changsha Co Ltd patent application for Substrate and Manufacturing Method Thereof. Xu Xinwu developed the invention.
The patent application number is CN20251035160 20250109. The patent publication number is CN119947012 (A). Internation..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received China Electric Power Research Institute, State Grid Smart Grid Research Institute, State Grid Corporation of China, State Grid Xinjiang Electric Power Co and State Grid Xinjiang, Electric Power Research Institute patent application for Semiconductor Expl..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received Fujian NTS Tech Co Ltd patent application for Semiconductor Chip Packaging Process. Zheng Xuegui, Liu Zheng, Wu Gaoyang and Wang Jianqin developed the invention.
The patent application number is CN20251076315 20250117. The patent publication number is..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Jiangsu Yizheng Electronic Tech Co Ltd has filed a patent application for Single-sided Copper-clad Ceramic Substrate and Preparation Method Thereof. This invention was developed by Wang Dong.
The patent application number is CN202411983164 20241231. The patent publication number is CN119946996 (A). Internat..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Texas Instruments has submitted a patent application for Power Converter with Auxiliary Inductor. Neidorff Robert A and Davies-marsh Michael developed the invention.
The patent application number is CN202411519154 20241029. The patent publication number is CN119945148 (A). International Patent Classificatio..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Tianjin Kale Yunpin Network Tech Co Ltd has submitted a patent application for Packaging Structure of Chip Circuit Board. Shi Ning and Guo He developed the invention.
The patent application number is CN202510115691 20250124. The patent publication number is CN119946980 (A). International Patent Classificati..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received Shenzhen Yihang Communication Tech Co Ltd patent application for Substrate Structure and Electronic Device. Liao Jianxing developed the invention.
The patent application number is CN202510108640 20250121. The patent publication number is CN119946979 (..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Tianma New Display Tech Research Institute Xiamen Co Ltd has submitted a patent application for Display Substrate and Display Device. This invention was developed by Jia Zhenyu, Huang Jiali, Xi Kerui, Wu Tianyi, Zhai Yingteng, Li Langbing and Wang Xiuli.
The patent application number is CN202411977606 20241..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Greatshine Semiconductor Tech Co Ltd has sought patent for UV Light Source Accurate Regulation and Control Method for Wafer Defect Detection and Related Equipment. This invention was developed by Xia Zhenghao, Zhang Kang, Lin Wei and Luo Minghao.
The patent application number is CN202510425621 20250407. The..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Miguang New Materials Technology Shanghai has submitted a patent application for Semiconductor Light Source Control System and Method and Computer Equipment. Lou Hongwei and Zheng Shitao developed the invention.
The patent application number is CN202510118677 20250124. The patent publication number is CN119..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has awarded a patent to Suzhou Fangjue Intelligent Tech Co Ltd for Three-phase Discrete Gallium Nitride Full-bridge Inverter Based on Heat Dissipation of One Aluminum Substrate. Qiu Haijun developed the invention.
The patent application number is CN202422169524U 2..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Shanghai Jita Semiconductor has submitted a patent application for Semiconductor Device and Preparation Method Thereof. This invention was developed by Wang Shichao, Yan Xiaohui, La Haizhong, Ding Lizhen and Ma Kuai.
The patent application number is CN202510144989 20250210. The patent publication number is ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Renesas Electronics has submitted a patent application for Semiconductor Device. This invention was developed by Morishita Yasuyuki, Narita Koki and Maeda Satoshi.
The patent application number is CN202411528431 20241030. The patent publication number is CN119943810 (A). International Patent Classification ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Navitas Semiconductor Inc has applied Chinese patent for One-sided Direct Cooling Power Supply Module. Jeon Oseul developed it.
The patent application number is CN202411554125 20241101. The patent publication number is CN119943803 (A). International Patent Classification codes are H01L21/60, H01L23/498, H02..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Jiangxi Hairui Electric Co Ltd has obtained a patent for full-automatic feeding and discharging structure for silicon steel sheet machining. This invention was developed by Tan Xueli and Liu Zhiyun.
The patent application number is CN202422742409U 20241111. The patent publication number is CN223303668 (U). ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Chengdu Timemaker Crystal Tech Ltd has applied Chinese patent for Semiconductor Temporary Bonding Structure, Bonding and De-bonding Method and Semiconductor Device. Ye Zhuzhi, Li Hui, Lu Wang and Liu Yujian developed it.
The patent application number is CN20251069711 20250116. The patent publication number ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Beijing Haichuang Microchip Tech Co Ltd has submitted a patent application for Transmission Line Structure and Preparation Method Thereof. This invention was developed by Wang Penghui, Ding Yan, Yan Yuepeng, Liu Jiankun, Lu Yuan, Liu Yanchun and Yu Xinyuan.
The patent application number is CN202510119531 20..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Hangzhou Taixin Microelectronics Co Ltd has submitted a patent application for Thermal Insulation Chip Packaging Structure. Che Hushen, Hu Qinglong and Wang Yumei developed the invention.
The patent application number is CN202411950923 20241227. The patent publication number is CN119943784 (A). Internationa..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Huatian Tech Nanjing Co Ltd has submitted a patent application for Embedded Device Heat Dissipation Substrate Laminated Mounting Structure and Preparation Method Thereof. Li Wei and Liu Weidong developed the invention.
The patent application number is CN20251014743 20250106. The patent publication number is..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- ChipMOS Technologies (Shanghai) has applied Chinese patent for Multifunctional BGA Packaging Structure and Method. Wan Yefu, Shao Ziren and Chen Zhiwen developed it.
The patent application number is CN202411958945 20241230. The patent publication number is CN119943773 (A). International Patent Classificatio..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Advanced Semiconductor Engineering has submitted a patent application for Package Structure. This invention was developed by Zheng Boren, Wang Weiren, Chen Weilong, Wang Haojun and Zhan Kaiwen.
The patent application number is CN20241110341 20240726. The patent publication number is CN119943769 (A). Interna..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has released Tong Hsing Electronic Industries patent application for Semiconductor Packaging Structure. This invention was developed by Yang Dingan.
The patent application number is CN202311464404 20231106. The patent publication number is CN119943768 (A). Interna..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Ebersolic Inc has submitted a patent application for Substrate with Side Protection Layer and Manufacturing Method Thereof. Kim Hye-jin developed the invention.
The patent application number is CN202411551696 20241101. The patent publication number is CN119943766 (A). International Patent Classification cod..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Samsung Electronics has submitted a patent application for Semiconductor Package. Lee Won-hee and Cho Yun-rae developed the invention.
The patent application number is CN202411219787 20240902. The patent publication number is CN119943764 (A). International Patent Classification codes are H01L23/24, H01L23/3..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has published Shenzhen Luguang Electronic Tech Co Ltd patent application for Semiconductor Chip Packaging Method. The invention was developed by Zhu Ligui, Chen Weiwei, Hou Zhijie, Zhu Keshuo, Hou Yujun and Qin Lianjie.
The patent application number is CN202510286..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Ebersolic Inc has submitted a patent application for Package Substrate and Semiconductor Package. This invention was developed by Woo Yong-ha.
The patent application number is CN202411540595 20241031. The patent publication number is CN119943762 (A). International Patent Classification codes are H01L23/15 a..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has published Guangdong Haiji Display Tech Co Ltd patent application for TGV Substrate with High Flatness and Preparation Method Thereof. The invention was developed by Wang Chunbo, Sun Hai Wei, Zhai Ming and Sang Jian.
The patent application number is CN202510102..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- STATS ChipPAC has submitted a patent application for Semiconductor Devices and Methods of Making and Using Preformed Bridge Die. Cai Peiyan, Chen Guizhong and Lin Yaojian developed the invention.
The patent application number is CN202411381956 20240930. The patent publication number is CN119943752 (A). Inte..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has submitted a patent application for Isolation Structure and Forming Method Thereof. Duan Wenting, Hu Jun and Fang Ziquan developed the invention.
The patent application number is CN20251020346 20250106. The patent publication number is CN1199..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has published Guangdong JL DC Advanced Mfg Co Ltd patent application for Self-adaptive Positioning Suction Head and Chip Carrying Device. The invention was developed by Zhou Hailong, Dong Min and Liu Jiaofeng.
The patent application number is CN202510284068 202503..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has released Shenzhen Jincancan Information Tech Co Ltd patent application for Intelligent Storage Device for Wafer Storage and Use Method. This invention was developed by Yue Minglei, Wang Meiqing and Dong Ni.
The patent application number is CN202510112855 20250..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Sanhe Jianhua High Tech Co Ltd has applied Chinese patent for Positioning Device for Semiconductor Equipment. Yang Jian, Zhang Hongwei and Luo Yang developed it.
The patent application number is CN202510127438 20250205. The patent publication number is CN119943733 (A). International Patent Classification co..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Tianxin Electronic Tech Nanjing Co Ltd has sought patent for Positioning Device for Chip Packaging. This invention was developed by Chen Yigao, Su Yuyan, Zheng Yingying and Ni Ping.
The patent application number is CN20251099490 20250122. The patent publication number is CN119943732 (A). International Paten..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has released Optorun Co Ltd patent application for Substrate Positioning Structure and Substrate Positioning Method. This invention was developed by Zhang Yonglin, Huang Zhengzhong and Shen Yancheng.
The patent application number is CN202311461248 20231106. The pa..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Zhuhai Hongjun New Energy Co Ltd has submitted a patent application for Transferring Equipment of Photovoltaic Silicon Wafer Coating JIG. This invention was developed by Zhang Wei, Hou Hongtao, Li Changhong and Jiang Qingtang.
The patent application number is CN202510194939 20250221. The patent publication ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Wuxi Yingjie Intelligent Equipment Co Ltd has filed a patent application for Blanking Device for Solar Cell Production. This invention was developed by Ling Yong, Zheng Zhiqiang and Chen Haifeng.
The patent application number is CN202510112905 20250124. The patent publication number is CN119943727 (A). Inte..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Kunbo Tech Tianjin Co Ltd has submitted a patent application for Plastic Packaging Processing Device for Chip Packaging and Use Method. This invention was developed by Sun Jia and Zhang Jinlei.
The patent application number is CN202510148185 20250211. The patent publication number is CN119943722 (A). Intern..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received Suzhou Xintai Semiconductor Tech Co Ltd patent application for Cleaning Equipment Control System and Method for Semiconductor Processing Based on Image Recognition. Wu Mingfang, Su Yongxin and Qi Yi developed the invention.
The patent application numb..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Jiangsu Newisdom Device Co Ltd has applied Chinese patent for Automatic Film Expanding Machine for Wafer Blue Film Installation. Xiang Jun developed it.
The patent application number is CN202411936010 20241226. The patent publication number is CN119943712 (A). International Patent Classification code is H01..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Tianjin Jizhaoyuan Tech Co Ltd has submitted a patent application for Radio Frequency Power Supply Control Method in Dual-frequency Plasma Processing. This invention was developed by Li Shuyu and Wang Yimei.
The patent application number is CN202411817393 20241211. The patent publication number is CN1199437..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received Nantong Yourui Semiconductor Co Ltd patent application for Chip Packaging Positioning Jig and Use Method Thereof. Xu Haijian, Wang Hairong, Song Liuliu, Yang Jian and Sun Junlei developed the invention.
The patent application number is CN202510431843 ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Hangzhou Changchuan Technology has submitted a patent application for Semiconductor Automatic Test Equipment. This invention was developed by Weng Shuicai, Chen Qi, Cheng Haibin, Qiu Cheng, Wang Dingwei, Yan Bangmin and He Bing.
The patent application number is CN202411950271 20241226. The patent publicatio..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- ChipMOS Technologies (Shanghai) has submitted a patent application for Packaging Process for Enhancing Stability of Sop (small Outline Package) Multiple Base Islands. Zhang Lina and Wan Yefu developed the invention.
The patent application number is CN202510107650 20250123. The patent publication number is C..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Delta Electronics has applied Chinese patent for Semiconductor Packaging Structure and Manufacturing Method Thereof. Jiang Xinjun, Cai Changjin, Chen Rongli and Cai Yuxuan developed it.
The patent application number is CN202311446863 20231102. The patent publication number is CN119943680 (A). International ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has published Ningbo BYD Semiconductor Co Ltd patent application for Preparation Method of Semiconductor Device and Semiconductor Device. The invention was developed by Dong Guoquan, Zhang Zengcheng, Lin Chui, Zhou Liang and Zeng Zhong.
The patent application numb..
Semiconductor
| Fri 05 Dec 2025
Beijing, Dec. 5 -- Chinese Patent for Automatic Chip Cleaning System of Numerical Control Milling Machine has been issued to Shenzhen Lingge Intelligent Tech Co Ltd. This invention was developed by He Yong, Sun Changshun and Yang Liliang.
The patent application number is CN202422393767U 20240930. The patent publication number..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has released Wuxi Xiantong Semiconductor Tech Co Ltd patent application for Power Integrated Circuit with Two VDMOS (vertical Double-diffused Metal Oxide Semiconductor) Connected in Series and Manufacturing Method Thereof. This invention was developed by Song Lijun.
..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Wuxi Xiantong Semiconductor Tech Co Ltd has filed a patent application for Trench Gate Field Effect Transistor, Power Chip and Manufacturing Method Thereof. This invention was developed by Song Lijun and Song Pengliang.
The patent application number is CN202411771680 20241204. The patent publication number ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- NXP USA has submitted a patent application for Semiconductor Device with Multi-step Gate and Multi-step Field Plate and Manufacturing Method Thereof. Grote Bernhard and Bruce Mcrae Green developed the invention.
The patent application number is CN202411357676 20240927. The patent publication number is CN119..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received Beijing BOE Display Tech Co and BOE Technology Group patent application for Thin Film Transistor and Preparation Method Thereof, Array Substrate and Display Device. Bai Jinchao, Zhao Xinxin, Ding Xiangqian, Liu Bo, Ma Runze, Wang Yongda and Wang Mengnan ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received Ruishi Chuangxin Shenzhen Semiconductor Co Ltd patent application for Low-noise Amplifier, Radio Frequency Chip and Radio Frequency Front-end Module. Zhang Yi, Song Nan, Li Meiyu and Ni Jianxing developed the invention.
The patent application number i..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has released Shenzhen Smartchip Microelectronics Tech Company Limited and China Gridcom Co Ltd patent application for Semiconductor Device and Manufacturing Method Thereof, Chip and Electronic Equipment. This invention was developed by Liao Gang, Wang Zheng, Wen Lei,..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Xinlian Yuezhou Integrated Circuit Manufacturing (Shaoxing) has submitted a patent application for High Electron Mobility Transistor and Preparation Method Thereof. This invention was developed by Li Xiang.
The patent application number is CN202510148559 20250211. The patent publication number is CN11994716..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has released Yaoxinwei Shanghai Electronic Tech Co Ltd patent application for Super-junction MOS Device and Preparation Method Thereof. This invention was developed by Wang Baojian and Yin Xiaobao.
The patent application number is CN20251009908 20250103. The paten..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Wuxi Fouying Microelectronics Tech Co Ltd has filed a patent application for Funnel Type Silicon Capacitor. This invention was developed by Chen Tao.
The patent application number is CN202510148972 20250211. The patent publication number is CN119947131 (A). International Patent Classification codes are H01L..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences has submitted a patent application for Preparation Method of Limited Memory Cell. This invention was developed by Li Xi, Xie Chenchen and Song Zhitang.
The patent application number is CN202411964014 20241230. The patent..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Shanghai Huali Integrated Circuit Manufacturing has sought patent for Preparation Method of SONOS (silicon Oxide Nitride Oxide Semiconductor) Memory Device. This invention was developed by Liu Zhenghong, Chen Haoyu, Huang Guanqun, Qi Ruisheng and Wang Jiaxing.
The patent application number is CN20251039615 ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Beijing Chaoxian Memory Research Institute has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. Lyu Haochang, Luo Jie, Ping Yanlei and Hou Linjie developed the invention.
The patent application number is CN202311443155 20231101. The patent publication number is CN..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has released Huahong Semiconductor, Wuxi and Shanghai Huahong Grace Semiconductor Manufacturing Corporation patent application for Etox Nor Type Flash Memory Device and Preparation Method Thereof. This invention was developed by Du Yixing, Gu Lin, Chen Guanglong and ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has submitted a patent application for Flash Memory Structure and Flash Memory. This invention was developed by An Jianguo and Yan Qiangsheng.
The patent application number is CN20251072974 20250116. The patent publication number is CN119947099 ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Shanghai Huali Integrated Circuit Manufacturing has submitted a patent application for Anti-fuse OTP Memory and Manufacturing Method Thereof. Huang Chuyi, Liu Wen and Hu Xiaoming developed the invention.
The patent application number is CN20251008157 20250102. The patent publication number is CN119947094 (A..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Tsinghua University has submitted a patent application for Semiconductor Device and Preparation Method Thereof. This invention was developed by Tang Jianshi, Su Yanbo, Pan Liyang, Gao Bin, Qian He and Wu Huaqiang.
The patent application number is CN202411808376 20241210. The patent publication number is CN1..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Nanya Technology has submitted a patent application for Memory Device and Manufacturing Method Thereof. Huang Zhonglin developed the invention.
The patent application number is CN202410218734 20240228. The patent publication number is CN119947084 (A). International Patent Classification code is H10B12/00. C..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has released Jiangsu Pangu Semiconductor Tech Co Ltd patent application for High-speed High-precision Intelligent Chip Mounter. This invention was developed by Zhang Dengke.
The patent application number is CN202510266284 20250307. The patent publication number is..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received Zhongke Guangzhi Chongqing Tech Co Ltd patent application for High-speed Glue Dipping Chip Mounter. Yang Ziliang, Lin Hongfei and Qin Zhanyang developed the invention.
The patent application number is CN202510146021 20250210. The patent publication nu..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Jiangxi Mingqi Electric Power Equipment Co Ltd has been granted a patent for Winding Device for Processing Finished Oriented Silicon Steel Sheet. This invention was developed by Zheng Feiwu and Ye Renlan.
The patent application number is CN202422742411U 20241111. The patent publication number is CN223303806..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Guangzhou Siruixinke Semiconductor Co Ltd has secured a patent on Hall Module, Chip and Electronic Equipment. Guo Yusen developed the invention.
The patent application number is CN202421703265U 20240717. The patent publication number is CN223274098 (U). International Patent Classification codes are H03K17/9..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Iclegend Microelectronics Shanghai Co Ltd has secured a patent on Differential Radio Frequency Switch Circuit and Chip. Wu Xueying developed the invention.
The patent application number is CN202421759101U 20240723. The patent publication number is CN223274095 (U). International Patent Classification codes a..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has published Shandong University and BTR New Material Group patent application for Nanometer Silicon Material with Various Morphological Structures and Preparation Method and Application Thereof. The invention was developed by Xia Shengqing, Jiang Yiming, Liu Chao, ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Imerys Graphite & Carbon Switzerland Ltd has applied Chinese patent for Carbon-coated Silicon Oxide/graphite Composite Particle and Preparation Method and Application Thereof. Spahr Michael, Gulas Michal, Umeno Tatsuo, Taki Hiroyuki and Perez Pascual developed it.
The patent application number is CN20251012..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Shizuishan Mingwei Carbon Energy New Material Tech Co Ltd has obtained a patent for feeding device for silicon carbide furnace core graphite production. This invention was developed by Ma Liming.
The patent application number is CN202422901686U 20241127. The patent publication number is CN223303751 (U). Int..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has awarded a patent to Huizhou Jinsheng New Electronic Tech Co Ltd for Rectifier Distribution Structure for Electroplating Liquid Production. Huang Ye, Zeng Wensheng, Mao Jieru and Pan Guixue developed the invention.
The patent application number is CN20242257020..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Huatian Technology Xi'an Co Ltd has filed a patent application for Semiconductor Chip Packaging Method and Semiconductor Chip. This invention was developed by Zhang Ruiming, Ma Mianzhi and Gao Le.
The patent application number is CN20251014744 20250106. The patent publication number is CN119943673 (A). Inte..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has released Zhuhai Gree Electronic Components and Gree Electric Appliances, Zhuhai patent application for Etching Method for Reducing Wafer Fragmentation Rate and Wafer. This invention was developed by Hou Yuxi, Wang Yong and Liu Xinxin.
The patent application nu..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences has submitted a patent application for Preparation Method of Heterostructure and Heterostructure. Ou Xin, Xu Wenhui, Qu Zhenyu, Zhao Tiancheng and You Tiangui developed the invention.
The patent application number is CN2..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- State Intellectual Property Office of China has received Hebei Tongguang Semiconductor Co Ltd patent application for Cleaning Method for Removing Metal Ion Residues on Surface of Large-size Silicon Carbide Substrate. Yan Lan, Zheng Xiangguang, Gao Yanjing, Tang Huan and Zhang Xiaoyun developed the invention.
..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Anhui Anxin Electronic Tech Co Ltd has submitted a patent application for Silicon Carbide Wafer Processing Method for Reducing Thinning Stress. This invention was developed by Wang Liang'en.
The patent application number is CN20251071521 20250116. The patent publication number is CN119943648 (A). Internatio..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Northwest Electronic Equipment Tech Research Institute Second Research Institute of China Electronic has submitted a patent application for Plasma Activation Device and Method for High-vacuum Wafer Bonding. This invention was developed by Qiao Li, Wang Chengjun, Chen Hong, Shi Xiaona, He Junmin, Li Wenhao and ..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Huatian Huichuang Technology Xi'an has submitted a patent application for Aashing-cleaning Method for Cleaning Etching Chamber and Inductively Coupled Plasma Etching Method. This invention was developed by Chen Zhiqi, Bai Xingxing, Hou Yangkun, Zhou Jiaqi and Yuan Wanli.
The patent application number is CN2..
Semiconductor
| Thu 04 Dec 2025
Beijing, Dec. 5 -- Anhui University of Science and Technology has submitted a patent application for W-WN Heterojunction Composite Material Based on In-situ Growth on Carbon and Preparation Method Thereof. This invention was developed by Lu Haowen, Gao Juan and Lan Leilei.
The patent application number is CN202510138323 20250..
Semiconductor
| Fri 05 Dec 2025
Beijing, Dec. 5 -- Taike Semiconductor Equipment Shenzhen Co Ltd has been granted a patent for Ceramic Substrate Clamping Mechanism. This invention was developed by Peng Yiqing, Xian Pingdong, Huang Mingchun, Huang Weimin, Wang Mingliang, Zeng Haiqiao and Tan Jianjun.
The patent application number is CN202422785829U 20241114...
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