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Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Hubei Xingchen Tech Co Ltd has submitted a patent application for Adapter Plate Structure, Preparation Method Thereof and Packaging Structure. Xiong Neng, Chen Zhen, Zhang Peiyuan, Zeng Hong and Liu Dengwu developed the invention.
The patent application number is CN202510261760 20250306. The patent publicat..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- SEMES has applied Chinese patent for Support Unit and Container Storage System Comprising Same. Lee Sung Ho developed it.
The patent application number is CN202411771433 20241204. The patent publication number is CN120149251 (A). International Patent Classification codes are H01L21/677 and H01L21/687. Coope..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Shenzhen Xinsheng Semiconductor has filed a patent application for Integrated Device Packaging Structure, Acoustic Device and Related Equipment. This invention was developed by Huang Lei, Zou Jie and Feng Duan.
The patent application number is CN202510623356 20250515. The patent publication number is CN1201..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Guangdong Fenghua Semiconductor Technology has been awarded a patent for Ultra-thin Packaging Device. This invention was developed by Tang Qingyuan, Huang Chang and Luo Bo.
The patent application number is CN202422739639U 20241108. The patent publication number is CN223378171 (U). International Patent Class..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received Shenzhen Bromake New Material patent application for Refrigerating System Capable of Adjusting Supercooling Degree and Control Method. Bu Huixing, Li Zhihai and Yao Xin'an developed the invention.
The patent application number is CN202510294276 202503..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published Institute of Semiconductors, Chinese Academy of Sciences patent application for Laser System for Inhibiting Stimulated Brillouin Scattering. The invention was developed by Lin Xuechun, Wu Wenjuan, Zou Shuzhen, Yu Haijuan, He Chaojian and Li Xinyao.
T..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has released Toshiba Elevator patent application for Power Conversion Device. This invention was developed by Kuzumaki Atsuhiko, Murakami Mitsuhiro, Xiang Yun and Shuichi Nojima.
The patent application number is CN202411735013 20241129. The patent publication numb..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has released South West University patent application for Artificial Intelligence Acceleration System Based on 8T-SRAM Calculation and Storage Integrated Macro Cell. This invention was developed by Wang Lidan, Zhang Rui and Duan Shukai.
The patent application numb..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has released Hangzhou Shengdewei Integrated Circuit Tech Co Ltd patent application for Vehicle-mounted Life Detection Method, Related Device and Storage Medium. This invention was developed by Wu Jie, Fu Kan and Zhang Jian.
The patent application number is CN20251..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has awarded a patent to LAPLACE New Energy Technology for Sealing Structure, Furnace Body Assembly and Machining Equipment. Chang Wenping and Liang Xiao developed the invention.
The patent application number is CN202422875250U 20241122. The patent publication numb..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Chinese Patent for Crown Block Track has been issued to Shanghai Guona Semiconductor Technology. This invention was developed by Liang Shuo, Zhang Qing and Ye Ying.
The patent application number is CN202422954292U 20241202. The patent publication number is CN223372595 (U). International Patent Classificatio..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Leshan Jingyuntong Semiconductor Material has been awarded a patent for Cleaning Device for Inner Wall of Auxiliary Chamber of Single Crystal Furnace. This invention was developed by Zhang Xiaohong, Guan Shujun, Hong Hua and Lu Jianhua.
The patent application number is CN202422598796U 20241028. The patent p..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has released Hisense Visual Technology patent application for Display Device and External Device Joint Control Method. This invention was developed by Jia Yazhou, Wu Hanyong and Kang Uk.
The patent application number is CN202311703472 20231212. The patent publicat..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published Spreadtrum Semiconductor (Nanjing) patent application for Data Transmission Method and Device and Computer Readable Storage Medium. The invention was developed by Lei Zhenzhu.
The patent application number is CN202311647483 20231204. The patent publi..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Samsung Display has submitted a patent application for Display Device. Park Jung Mok, Kang Bong-il, Kim Min-hong and Wu Li developed the invention.
The patent application number is CN202411825362 20241212. The patent publication number is CN120143998 (A). International Patent Classification codes are G06F3/..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Zhongcheng Hualong Computer Technology has submitted a patent application for Method and Device for Self-adapting to Different Types of Clock Chips. Wang Jiacheng, Li Liuxiang and Zhang Shaozhong developed the invention.
The patent application number is CN202510227302 20250227. The patent publication number..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Fudan University has submitted a patent application for Network-on-chip Architecture for Super-large-scale Neural Mimicry Computing. This invention was developed by Ma Wei, Yang Qi, Ma Ning, Ding Chen and Zheng Lirong.
The patent application number is CN202510577007 20250506. The patent publication number i..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Semiconductor Manufacturing International (Shanghai) has submitted a patent application for Semiconductor Dielectric Structure and Preparation Method Thereof. This invention was developed by Zhang Yuanning.
The patent application number is CN202311687690 20231208. The patent publication number is CN12014916..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Xinlian Pioneer Integrated Circuit Manufacturing, Shaoxing has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. Song Jian and Kan Jie developed the invention.
The patent application number is CN202510292369 20250312. The patent publication number is CN120149161 (A). ..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Xincun Technology (Wuhan) has submitted a patent application for Semiconductor Device and Forming Method Thereof. Wang Haiping, Jin Tong, Ming Fan, Ma Lin and Zhang Ridong developed the invention.
The patent application number is CN202510333211 20250320. The patent publication number is CN120149180 (A). Int..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Jiangxi MTC Optoelectronics has submitted a patent application for Chip Identification and Selection Device and Method. This invention was developed by Chen Yuhua, Jin Conglong, Hu Jiahui, Lu Peng and Tang Qiyong.
The patent application number is CN202510229703 20250228. The patent publication number is CN1..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Huawei Technologies has submitted a patent application for Semiconductor Device and Design and Manufacturing Method Thereof. This invention was developed by Zhang Zehao, Bai Yujie, Li Xiaohan, Diao Mengjuan and Li Peng.
The patent application number is CN202311695204 20231211. The patent publication number ..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published Guangdong Fenghua Semiconductor Technology patent application for High-power Semiconductor Package and Preparation Method Thereof. The invention was developed by Li Ziying, Tang Qingyuan, Ding Lulu and Guo Haojie.
The patent application number is CN202..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published Jiangxi MTC Semiconductor patent application for Recycling Method of Bad Patterned Substrate. The invention was developed by Hu Jiahui, Jin Conglong and Gu Wei.
The patent application number is CN202510281007 20250311. The patent publication number is ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published NVIDIA patent application for Signal Processing Techniques. The invention was developed by Cho Yun-seung and Dick Christopher H.
The patent application number is CN202411821490 20241211. The patent publication number is CN120151870 (A). International P..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published Rongyao Terminal patent application for Communication Method, Device, Storage Medium, Program Product, Chip and System. The invention was developed by Ju Ying, Li Mingdong and Guo Delin.
The patent application number is CN202510620635 20250514. The pat..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published Guangdong University of Technology patent application for Integrated Circuit Chip Particle Time Sequence Optimization Method and Device, Equipment and Medium. The invention was developed by Zheng Xin, Zhang Shihan, Zhong Zhixian, Zhang Jiacheng, Gao Hua..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published Huawei Technologies patent application for Operation Method of Memory Array and Memory. The invention was developed by Xu Yannan, Xu Shengqiang, Ding Qingting and Lyu Hangbing.
The patent application number is CN202311718857 20231213. The patent public..
Semiconductor
| Mon 05 Jan 2026
Beijing, Jan. 6 -- University of Electronic Science and Technology of China and Shantou University Medical College have submitted a patent application for Quantitative Experiment Research Method for Influence of Semiconductor Laser on Functional Activity of Neural Stem. This invention was developed by Shen Bohai, Zhou Qiang, She..
Semiconductor
| Mon 05 Jan 2026
Beijing, Jan. 6 -- Hebei University and Baoding Deyou Electrical Equipment Mfg Co Ltd have submitted a patent application for Method for Preparing CIGS (copper Indium Gallium Selenide) Absorption Layer and Solar Cell Using Cigs Absorption Layer Prepared by Using Method. This invention was developed by Wang Xinzhan, Gao Zeran, Ma..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Dingdao Zhixin (Shanghai) Semiconductor has submitted a patent application for Data Processing Device and Method. This invention was developed by Zhang Xutao and Dai Liang.
The patent application number is CN202510401643 20250331. The patent publication number is CN120151541 (A). International Patent Classi..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Hisense Visual Technology has submitted a patent application for Display Device and Switching Processing Method for Bluetooth Audio Output Channel. This invention was developed by Xiu Jianzhu, Dong Na and Zhang Anqi.
The patent application number is CN202311703384 20231212. The patent publication number is ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Yangtze Memory Technologies has submitted a patent application for Memory Operation Method, Memory and Memory System. Zhao Xiangnan, Li Bo, Li Chenhui, Liu Hongtao, Zhang Shuai and Qi Wei developed the invention.
The patent application number is CN202311705591 20231211. The patent publication number is CN12..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received Hangzhou Advanced Research Institute USTC patent application for Edge-end-oriented Low-power-consumption Infrared Intelligent Sensing Chip and Image Processing Method. Miao Jinshui, Guo Hengrui, Li Tengyue, Wan Zhenzhen and Hu Weida developed the inventi..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received ASM International Holding patent application for Substrate Transfer Arm and Apparatus Using the Same. Dan Cunxue and Suwata Masahide developed the invention.
The patent application number is CN202411806684 20241210. The patent publication number is CN12..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received 58th Research Institute of China Electronics Technology Corporation patent application for Wafer-level Fan-out Packaging Method for High-step Stacked Chip Gap Protection. Zhang Xu, Zhao Xinran, Xia Chenhui, Liu Shuli, Wang Gang and Wang Chengqian develop..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received SEMES patent application for Impedance Measurement Method of Substrate Processing Apparatus. Ryu Sang-moon developed the invention.
The patent application number is CN202411531872 20241030. The patent publication number is CN120149144 (A). International..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- StarPower Semiconductor has received a patent for Driving Circuit with Adjustable Driving Capability and Power Semiconductor Test Circuit. This invention was developed by Huang Fuwen.
The patent application number is CN202422755365U 20241112. The patent publication number is CN223379070 (U). International Pat..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Rightleader Shanghai Technology has received a patent for Ultrapure Water High-recovery-rate Preparation System for Semiconductor Industry. This invention was developed by Tan Jingjie, Sun Yafei, Liu Tingting, Wang Xiaoqiang and Su Zhanhua.
The patent application number is CN202422553901U 20241022. The patent..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received Changchun Institute of Optics, Fine Mechanics & Physics of the Chinese Academy of Sciences patent application for High-power Narrow-linewidth Semiconductor Laser. Han Jinliang, Shan Xiaonan, Zhang Jun, Zhang Yawei, Peng Hangyu, Zhang Jiye and Wang Lijun ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received NVIDIA patent application for Output Switch Matrix for Redistributing Phases on Independent Voltage Rails. Geboff Adam developed the invention.
The patent application number is CN202411821737 20241211. The patent publication number is CN120150473 (A). I..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- Nanchang University, Nanchang Laboratory and Nanchang Silicon Based Semiconductor Tech Co Ltd have submitted a patent application for InGaN Laminated Solar Cell and Preparation Method Thereof. This invention was developed by Cao Sheng, Ouyang Zilong, Quan Zhijue and Jiang Fengyi.
The patent application numb..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received Beijing Xuanjie Technology patent application for Image Processing Method and Device, Electronic Equipment, Chip and Storage Medium. Xie Fuming developed the invention.
The patent application number is CN202510371309 20250326. The patent publication num..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received Canon patent application for Memory Controller, Method of Controlling Memory Controller, and Memory Device. Hirata Naoki and Shiraishi Daisuke developed the invention.
The patent application number is CN202411825884 20241212. The patent publication numb..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received Micron Technology patent application for Apparatus and Method for Access Operations During Voltage Transitions. Takahashi Hiroki, Nagashma Odile and Saito Shunichi developed the invention.
The patent application number is CN202411690399 20241125. The pa..
Semiconductor
| Mon 05 Jan 2026
Beijing, Jan. 6 -- Modern Textile Technology Innovation Center Jianhu Laboratory and Zhejiang Dongjin New Mat Co Ltd have submitted a patent application for Preparation Method of Acrylate Low-resistance Wear-resistant Organic Silicon Finishing Agent. This invention was developed by Zhang Shujuan, Kim Se-ho, Wang Ruiying, Wang Ch..
Semiconductor
| Mon 05 Jan 2026
Beijing, Jan. 6 -- Xiaomi Technology, Wuhan and Beijing Xiaomi Mobile Software have submitted a patent application for Sampled Data Processing Method and Device, Electronic Equipment, Storage Medium and Chip. This invention was developed by Li Chao.
The patent application number is CN202311706572 20231212. The patent publicat..
Semiconductor
| Mon 05 Jan 2026
Beijing, Jan. 6 -- China Resources Runan Tech Chongqing Co Ltd and Cr Microelectronics Holdings Co Ltd have submitted a patent application for Golden Finger Structure for Testing Semiconductor Structure and Testing Equipment. This invention was developed by Li Liangjun, Tian Yong, Gao Yafeng, Man Xiangguo and Gou Xinwei.
The ..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- Jingxincheng Beijing Tech Co Ltd and Hefei Nexchip Integrated Circuit have submitted a patent application for Preparation Method of Semiconductor Device. This invention was developed by Zhang Xiaoling, Song Yutao and Zeng Qunkai.
The patent application number is CN202510603588 20250512. The patent publicati..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have submitted a patent application for Display Substrate and Display Device. This invention was developed by Wang Yu, Zhang Wei, Dong Xiangdan, Wang Hongli and Yan Jun.
The patent application number is CN20238010998 20230928. The patent public..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- Tokyo Electron and Institute National Colleges Tech Japan have submitted a patent application for Temperature Measurement Device, Heat Treatment Device, and Temperature Measurement Method. This invention was developed by Hayashi Masato, Mizobe Yu and Odagawa Hiroyuki.
The patent application number is CN2023..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- Xining Solar Power Branch, Qinghai Upstream of Yellow River Hydropower Devlopment, Xi'an Solar Power Branch of Qinghai Huanghe Hydropower Devlopment, Qinghai Huanghe Hydropower Dev and SPIC Huanghe Hydropower Development have submitted a patent application for P-type Double-sided Passivation Contact Solar Cell..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- Yangzhou University and Yangzhou Carbon Zhonghe Technology Innovation Research Center Of Yangzhou University have submitted a patent application for Grabbing Device and Grabbing Equipment for Quickly Picking Up Silicon Wafers. This invention was developed by Li Lyuzhou, Li Qingyue, Zhu Kai, Ding Jianning, Dong..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- Nanjing University and Jiangsu Jieguan Catalytic Material Tech Co Ltd have submitted a patent application for Novel High-surface Silicon Carbide Material Synthesized at Low Temperature. This invention was developed by Ding Weiping, Liang Chenjia, Zhao Ruiyao, Hou Xiaoxia, Guo Xiangke, Xue Nianhua, Peng Luming,..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Infineon Technologies has applied Chinese patent for Devices Including Phase Change Switching Devices and Methods of Providing Phase Change Switching Devices. Kaemmer Klaus, Marcotte Michael and Bernd Pflum developed it.
The patent application number is CN202411801274 20241209. The patent publication number i..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- SEMES has applied Chinese patent for Substrate Processing Method. Li Guangxi, Kim Hyun-hoo and Cho Myung-chan developed it.
The patent application number is CN202411831357 20241212. The patent publication number is CN120149228 (A). International Patent Classification codes are H01L21/67 and H01L21/677. Cooper..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Realtek Semiconductor Corporation has applied Chinese patent for Coding and Decoding System and Coding Circuit and Decoding Circuit Thereof. Xu Jiongfa developed it.
The patent application number is CN202311718039 20231213. The patent publication number is CN120150711 (A). International Patent Classification ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Beijing Xuanjie Technology has applied Chinese patent for Power Consumption Control Method and Device, Terminal, Chip and Storage Medium. Liu Yuqing developed it.
The patent application number is CN202510370289 20250326. The patent publication number is CN120151996 (A). International Patent Classification cod..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Beijing Xianxin Technology has applied Chinese patent for Display Compensation Method, Display Chip and Display Device. Zhang Duo, Zhang Wenbin, Ran Peipei, Lin Rongzhen and Yan Chenghui developed it.
The patent application number is CN202510548695 20250428. The patent publication number is CN120148429 (A). I..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Zhejiang Chuangxin Integrated Circuit has filed a patent application for Formation Method of Semiconductor Structure. This invention was developed by Zhou Luhao, Wu Yongyu, Tao Ran, Wang Jianghong and Huang Tianzhe.
The patent application number is CN202510370175 20250326. The patent publication number is CN1..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Rongyao Terminal has filed a patent application for Channel Selection Method, Electronic Equipment, Chip System and Storage Medium. This invention was developed by Yan Shitao.
The patent application number is CN202311659198 20231204. The patent publication number is CN120151956 (A). International Patent Class..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- NVIDIA has filed a patent application for Signal Processing Techniques Using Signal Information. This invention was developed by Cho Yun-seung and Dick Christopher H.
The patent application number is CN202411821492 20241211. The patent publication number is CN120151871 (A). International Patent Classification..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- TAESUNG has filed a patent application for Cleaning Device for Substrate Bearing Jig. This invention was developed by Kim Jong-hak and Kwon Min Jun.
The patent application number is CN202510194997 20250221. The patent publication number is CN120152179 (A). International Patent Classification codes are H05K3/0..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Infineon Technologies has filed a patent application for Electronic System with Integrated Master Circuit and Integrated Slave Circuit. This invention was developed by Leisenheimer Stefan.
The patent application number is CN202411797887 20241209. The patent publication number is CN120145979 (A). International..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Harbin Institute of Technology has filed a patent application for Method for Constructing Linear Matrix Neural Network Computing Chip Based on Mach-zehnder Interferometer. This invention was developed by Liu Chaoming, Lin Sen, Huo Mingxue, Wang Tianqi, Qi Chunhua and Zhou Jiaming.
The patent application numbe..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Institute of Microelectronics, CAS has sought patent for Optical Interconnection System on Optical Chip and Optical Chip. This invention was developed by Fu Tianyang, Yang Yan, Sun Fujun, Yang Gang, Yang Zaili, Xiao Jing, Gao Hong, Tang Wei and Wang Yuxing.
The patent application number is CN202510221532 2025..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Nanjing University has sought patent for Timing Sequence Driven Chip Global Layout Method. This invention was developed by Qian Chao, Shi Yunqi, Lin Xi and Xue Ke.
The patent application number is CN202510207721 20250225. The patent publication number is CN120145961 (A). International Patent Classification co..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Realtek Semiconductor Corporation has sought patent for Method for Configuring Buffer and Image Synthesis Device. This invention was developed by Zhou Kaixiang and You Zhenwei.
The patent application number is CN202311706661 20231212. The patent publication number is CN120147105 (A). International Patent Clas..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Samsung Electronics has sought patent for Sense Amplifier Circuit and Semiconductor Memory Device Including Same. This invention was developed by Kim Kyung-min, Kim Donggun, Ryu Myung-sik, Park Su-jin, Baek In-seok, Won Bok-yeon and Yoon Jongmoon.
The patent application number is CN202411172427 20240826. The ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Great Wall Motor has sought patent for Dynamic Driving Route Adjusting Method and System, Medium, Chip System and Vehicle. This invention was developed by Xing Chengyong.
The patent application number is CN202510453863 20250411. The patent publication number is CN120148278 (A). International Patent Classifica..
Semiconductor
| Mon 05 Jan 2026
Beijing, Jan. 6 -- Hangzhou Zhijiang Silicone Chemicals Co Ltd and Hangzhou Zhijiang Advanced Mat Co Ltd have filed a patent application for Transparent Yellowing-resistant Epoxy Adhesive Composition for LED Chip Mounting, Preparation Method and Application. This invention was developed by He Danwei, Tao Xiaole, Jiang Chao, Gong..
Semiconductor
| Mon 05 Jan 2026
Beijing, Jan. 6 -- Tianjin Heavy Equip Eng Res Co and Liaoning University of Technology have filed a patent application for Method for Preparing Silicon Oxide Passive Film Around Gray Cast Iron Flake Graphite. This invention was developed by Gao Jianjun, Hu Jiandong, Qu Shanyi, Li Qingchun, Chen Shuying, Wang Jun and Chang Guowe..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- Xining Solar Power Branch, Qinghai Upstream of Yellow River Hydropower Devlopment, Xi'an Solar Power Branch of Qinghai Huanghe Hydropower Devlopment, Qinghai Huanghe Hydropower Dev and SPIC Huanghe Hydropower Development have filed a patent application for TBC Solar Cell and Preparation Method Thereof. This in..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- Shenyang Ruisheng Precision Manufacturing and Konfoong Material International have filed a patent application for Machining Method for Air Passage Hole in Semiconductor Workpiece. This invention was developed by Yao Lijun, Xing Tianlong, Zhang Tongbin, Ran Qilin, Wang Weixiang, Xu Yangchun and Song Jie.
The..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- Mingzheng Zhejiang Electronic Equipment Co Ltd and Anhui Mingzheng Electronic Equipment Co Ltd have filed a patent application for Semiconductor Wafer Grinding and Polishing Tool. This invention was developed by Zheng Yong.
The patent application number is CN202510448138 20250410. The patent publication num..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- BOE Technology Group and Chongqing BOE Display Technology have filed a patent application for Display Substrate and Display Device. This invention was developed by Zhang Shouqiang, Qiu Yuanyou, Zhang Runxin, Zeng Chao, Weng Hongtao, Wang Rui, Ding Xiang, Yang Ni and Liu Yifan.
The patent application number ..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- BOE Technology Group and Beijing BOE Technology Development have filed a patent application for Quantum Dot Light Emitting Diode Device, Manufacturing Method Thereof and Display Device. This invention was developed by Fang Bing and Zhang Yichi.
The patent application number is CN20238010717 20230918. The pa..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- BOE Technology Group and Beijing BOE Technology Development have filed a patent application for Array Substrate and Display Device. This invention was developed by Yao Nianqi, Hu Hehe, Zhao Kun, Yuan Guangcai, Ning Ce, Li Zhengliang, Huang Jie and Guo Hui.
The patent application number is CN20238010833 2023..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- ASML Netherlands has applied Chinese patent for Inspection Device. Safinowski Paul and Brouns Derk Servatius Gertruda developed it.
The patent application number is CN202510166139 20191017. The patent publication number is CN120143551 (A). International Patent Classification codes are G03F1/62, G03F1/84 and G..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Huawei Technologies has filed a patent application for Adder, Chip and Electronic Equipment. This invention was developed by Han Kai, Huang Mingqiang, Lee Moon-seok and Wang Yunhe.
The patent application number is CN202311708303 20231213. The patent publication number is CN120144087 (A). International Patent ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- H3C Holdings has filed a patent application for Optical Engine Chip and Photoelectric Sealing Module. This invention was developed by Ruan Zuliang, Lu Jianjun, Wang Xue, Pan Tao and Tong Lei.
The patent application number is CN202510288792 20250311. The patent publication number is CN120143369 (A). Internatio..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has released ABLIC patent application for Protection Circuit and Semiconductor Device Including Same. This invention was developed by Tomioka Tsutomu.
The patent application number is CN202411778272 20241205. The patent publication number is CN120150683 (A). Interna..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has released HKC patent application for Array Substrate and Display Panel. This invention was developed by Choi Hyun-ok, Li Zeyao, Zhu Xianfei, Lan Tian and Xu Pei.
The patent application number is CN202510633847 20250516. The patent publication number is CN12014352..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has released Tsinghua University patent application for Heterogeneous Integrated Sensing, Storage and Calculation Integrated Circuit, Chip and Manufacturing Method Thereof. This invention was developed by Wang Lai, Pan Wen, Tang Jinpu, Yang Zhaolong, Hao Zhibiao and ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published HKC patent application for Array Substrate and Display Device. The invention was developed by Li Zeyao and Xu Pei.
The patent application number is CN202510619056 20250514. The patent publication number is CN120143511 (A). International Patent Classifi..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Shanghai Jita Semiconductor has been granted a patent for Device for Chemically Unsealing Chip Package. Li Shiqi and Zhou Shan developed the invention.
The patent application number is CN202422594962U 20241025. The patent publication number is CN223377033 (U). International Patent Classification codes are G01..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Uhoyan Technology Suzhou has been granted a patent for Developing Cavity Structure of Gluing Developing Machine. Zhou Xiubin and An Liyu developed the invention.
The patent application number is CN202422930615U 20241129. The patent publication number is CN223377601 (U). International Patent Classification cod..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Lansus Technologies has been granted a patent for Directional Coupler and Radio Frequency Chip. This invention was developed by Yu Weisheng, Guo Jiashuai, Hu Bin, Yang Jia, Huang Kaifeng and Chen Linfeng.
The patent application number is CN202422681325U 20241104. The patent publication number is CN223378424 (..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Jiangsu Xinde Semiconductor Technology has been granted a patent for High-heat-dissipation Staggered Chip Stacking Packaging Structure. Zhao Yue, Zhang Zhong, Long Xinjiang and Xie Yulong developed the invention.
The patent application number is CN202422760501U 20241112. The patent publication number is CN223..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Hubei Jiangcheng Chip Pilot Production Services has been granted a patent for Substrate Processing Apparatus and Substrate Offset Detection Assembly. This invention was developed by Liu Changming.
The patent application number is CN202422545491U 20241022. The patent publication number is CN223376572 (U). Inte..
Semiconductor
| Mon 05 Jan 2026
Beijing, Jan. 6 -- Chemical Institute Henan Provincial Academy of Sciences and Henan Academy Sciences have sought patent for Nanometer Organic Silicon Modified Reaction Type Polypropylene Glycol for Toughening Epoxy Resin Anhydride System Coating. This invention was developed by Li Weihua, Zhang Pengke, Zheng Haibing and Cao Wen..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Chinese Patent for Interaction Circuit of Chip and External Equipment, Mainboard and Electronic Equipment has been issued to Loongson Zhongke Chengdu Technology. This invention was developed by Wang Hongwei.
The patent application number is CN202422530693U 20241018. The patent publication number is CN22337770..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Chinese Patent for Pressure Head Device for Chip Testing and Temperature Control Testing Machine has been issued to Hangzhou Changchuan Technology. This invention was developed by Li Zhezhe, Fang Yunnan and Liu Yipeng.
The patent application number is CN202422410913U 20240930. The patent publication number is..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Chinese Patent for Controller with Vertically Arranged MOS (metal Oxide Semiconductor) Transistors has been issued to Wuxi Jinghui Electronics. This invention was developed by Shen Liang, Xia Ying and Hu Huifeng.
The patent application number is CN202422615948U 20241029. The patent publication number is CN223..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- SK Hynix has submitted a patent application for Controller and Storage Device. This invention was developed by Cui Baijun.
The patent application number is CN202411281996 20240913. The patent publication number is CN120144044 (A). International Patent Classification code is G06F3/06. Cooperative Patent Classi..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Harbin Institute of Technology has submitted a patent application for Beam Type Chip Mounter Surface Mounting Process Optimization Method Based on Simulated Annealing. This invention was developed by Yang Lilong, Lu Guangyu, Liu Zhitai, Li Zhengkai, Yu Xinghu, Yu Jinyong and Gao Huijun.
The patent application..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Tsinghua University has submitted a patent application for Intelligent Optical Computing Chip Cluster Architecture and System. This invention was developed by Fang Lu, Jiang Yizhou, Lee Sang-yong and Zhou Tiankuang.
The patent application number is CN202510379745 20250328. The patent publication number is CN1..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have applied Chinese patent for Display Substrate, Display Device and Manufacturing Method of Display Substrate. Li Haoyu, Chen Youchun, Lu Hongting, Wu Yu and Shi Ling developed it.
The patent application number is CN20238010825 20230922. The..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- BOE Technology Group and Beijing BOE Technology Development have applied Chinese patent for Light-emitting Chip, Display Substrate and Display Device. Sun Xuefei, Wang Yingtao, Zhou Tingting, Ryu Jae-gun, Jia Qian, Lee Ho-gon, Wang Qian, Li Wei, Liu Weixing, Wang Wei, Sun Shuang, Zhang Fangzhen, Wang Xinxing, ..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 6 -- BOE Technology Group and Chongqing BOE Optoelectronics Co Ltd have applied Chinese patent for Touch Display Substrate and Touch Display Device. Wu Zhongshan, Wang Xiaoyuan, Yin Xiaofeng, Chen Junming, Wan Bin and Yang Guodong developed it.
The patent application number is CN20238010724 20230918. The patent ..
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