Semiconductor
| Tue 20 Oct 2026
Alexandria, Oct. 19 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing for Interconnect Structures and Manufacturing Method Thereof. Huang Chun-hsien, Chang Ken-yu, Chang Chih-wei, Hsu Peng-fu, Kao Chen-yuan, Lai Chia-han, Tsai Chun-i, Hung Min-hsiu, Tsai Ming-hsing and Cai Yu-syuan de..