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Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Micron Technology has filed a patent application for Exothermic Reactive Bonding for Semiconductor Die Assemblies and Associated Systems and Methods. This invention was developed by Kirby Kyle K.
The patent application number is US202619667166 20260504. The patent publication number is US20260283056 (A1)..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Micron Technology has submitted a patent application for Composition of a Semiconductor Package for Cryogenic Environments. This invention was developed by Huang Chen Yu and Gan Chong Leong.
The patent application number is US202519190389 20250425. The patent publication number is US20260283054 (A1). Int..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Micron Technology has submitted a patent application for Bridge Package for Wire Bonding in Stacked Semiconductor Devices, and Associated Systems and Methods. Boo Kelvin Tan Aik, Lum Wen Wei, Ye Seng Kim and Ng Hong Wan developed the invention.
The patent application number is US202619538897 20260212. Th..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Vanguard International Semiconductor has submitted a patent application for Semiconductor Structure, Fabrication Method and Package Structure Thereof. This invention was developed by Yu Hsiu-mei, Chang Wei-chan and Lin Bing-yu.
The patent application number is US202519077008 20250311. The patent public..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Micron Technology has submitted a patent application for Elevated Interposer for Wire Bonding in Stacked Semiconductor Devices, and Associated Systems and Methods. This invention was developed by Boo Kelvin Tan Aik, Lum Wen Wei, Ye Seng Kim and Ng Hong Wan.
The patent application number is US202619532982..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Micron Technology has applied United States patent for Substrate for Vertically Assembled Semiconductor Dies. Parekh Kunal R, Kirby Kyle K, Raman Thiagarajan, Zhou Wei and Street Bret K developed it.
The patent application number is US202619679069 20260515. The patent publication number is US20260283039 ..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Micron Technology has applied United States patent for Memory Devices. Simsek-ege Fatma Arzum and Parekh Kunal R developed it.
The patent application number is US202619671916 20260508. The patent publication number is US20260283031 (A1). International Patent Classification codes are H10B12/00 and H10W90/..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Advanced Micro Devices has filed a patent application for Semiconductor Device with an Embedded Active Device. This invention was developed by Loh Gabriel H, Agarwal Rahul, Swaminathan Raja and Wilkerson Brett P.
The patent application number is US202619665193 20260501. The patent publication number is..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received KIOXIA patent application for Semiconductor Apparatus and Method for Manufacturing the Same. Aoyama Takuma, Sanuki Tomoya, Kawato Masatoshi, Watanabe Shinya and Matsuo Mie developed the invention.
The patent application number is US202519324436 20250910. Th..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has published Samsung Electronics patent application for Semiconductor Packge. The invention was developed by Kim Kwangsoo, Chung Hyunsoo and Yong Seokbeom.
The patent application number is US202519313286 20250828. The patent publication number is US20260283018 (A1). In..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received Microchip Technology patent application for Method of Forming a Chiplet Device Prototype. Kovats Julius Andrew developed the invention.
The patent application number is US202519262186 20250708. The patent publication number is US20260283017 (A1). Cooperative ..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- KIOXIA has filed a patent application for Semiconductor Device. This invention was developed by Sano Yuichi.
The patent application number is US202519236455 20250612. The patent publication number is US20260283016 (A1). Cooperative Patent Classification codes are H10W72/59 (US), H10W90/00 (US), H10W90/..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- KIOXIA has sought patent for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Yamasaka Shuto.
The patent application number is US202519233034 20250610. The patent publication number is US20260283015 (A1). International Patent Classification codes are H10B41/27, H10..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Chang Hung-pin, Wu Wei-cheng and Yeh Der-chyang.
The patent application number is US202619669963 20260506. The patent publicatio..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- CXMT has sought patent for Semiconductor Structure, Semiconductor Package, and Method for Forming Semiconductor Structure. This invention was developed by Liu Ying.
The patent application number is US202519407317 20251203. The patent publication number is US20260283006 (A1). International Patent Classifi..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Taiwan Semiconductor has submitted a patent application for Semiconductor Structure. This invention was developed by Huang Ying-jui, Yeh Kung-chen, Chen Wei-yu, Wong Cheng-shiuan, Chiu Chao-wei, Lin Hsiu-jen and Pei Hao-jan.
The patent application number is US202519082139 20250317. The patent publication..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received Samsung Electronics patent application for Semiconductor Device and Method of Manufacturing the Same. Noh Woochoel and Kim Cheonbae developed the invention.
The patent application number is US202519421627 20251216. The patent publication number is US2026028..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Nuvoton Technology Japan has submitted a patent application for Semiconductor Module and Method for Manufacturing Semiconductor Module. Hayashi Masahiro developed the invention.
The patent application number is US202619669511 20260506. The patent publication number is US20260282997 (A1). International Pa..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Heraeus Electronics has filed a patent application for Substrate Assembly with Surface Structure. This invention was developed by Stoica Stefanie, Hinrich Andreas, Klein Andreas Steffen and Krüger Frank.
The patent application number is US202419471939 20240402. The patent publication number is US2026028..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Mitsubishi Electric has applied United States patent for Solder Bonding Member, Semiconductor Device, Solder Bonding Method, and Method for Manufacturing Semiconductor Device. Yamazaki Koji developed it.
The patent application number is US202218871499 20220620. The patent publication number is US20260282..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Micron Technology has submitted a patent application for Semiconductor Device Assembly Interconnection Pillars and Associated Methods. This invention was developed by Bayless Andrew M, Wirz Brandon P and Bayless Cassie M.
The patent application number is US202619667430 20260504. The patent publication nu..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Semiconductor Components Industries has submitted a patent application for Wirebonding Systems and Related Methods. Wang Lijuan, Huang Jipeng, Sun Sen, Xu Zhenyu and Barias Ian Ceazar Bucayon developed the invention.
The patent application number is US202519081362 20250317. The patent publication number ..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has released JCET STATS ChipPAC, Korea patent application for Semiconductor Device and Method of Making Using Dual-laser Compression Bonding. This invention was developed by Lee Seunghyun, Yun Yeojun and Lee Heesoo.
The patent application number is US202519078098 202503..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Canon has submitted a patent application for Die Bonding System Including Alignment and Bonding Actuators and a Method of Using the Same. Cherala Anshuman, Meissl Mario Johannes, Roy Nilabh K, Choi Byung-jin and Ozturk Ozkan developed the invention.
The patent application number is US202519077892 20250..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has released Qualcomm patent application for Package Comprising Substrate with Improved Solder Resist Layer Configuration. This invention was developed by Buot Joan Rey Villarba, Patil Aniket, Kim Seongho, We Hong Bok and Wang Zhijie.
The patent application number is US20..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Xilinx has filed a patent application for Improving Memory Bandwidth Through Vertical Connections. This invention was developed by Ahmad Sagheer, Gupta Aman and Gaide Brian C.
The patent application number is US202619681923 20260519. The patent publication number is US20260282976 (A1). International Pa..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Samsung Electronics has sought patent for Semiconductor Package. This invention was developed by Kim Hongjin, Kwak Dongok, Jeong Kihong, Lee Jooyeon, Song Sangsub and Lee Taeyoung.
The patent application number is US202519327976 20250912. The patent publication number is US20260282970 (A1). Cooperative..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received KIOXIA patent application for Semiconductor Device, Semiconductor System, and Manufacturing Method for Semiconductor Device. Maekawa Yuya developed the invention.
The patent application number is US202519317282 20250903. The patent publication number is US202..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Unimicron Technology has sought patent for Substrate Structure. This invention was developed by Tain Ra-min, Ko Cheng-ta, Ma Guang-hwa, Tseng Tzyy-jang, Lin Pu-ju and Wang Chin-sheng.
The patent application number is US202519269044 20250715. The patent publication number is US20260282967 (A1). Internatio..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Tenstorrent USA has submitted a patent application for Discrete Pitch Adapter Substrates for Chiplets. Nabovati Aydin and Bailey Daniel William developed the invention.
The patent application number is US202519256663 20250701. The patent publication number is US20260282966 (A1). Cooperative Patent Clas..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received Qualcomm patent application for Package Comprising a Substrate That Includes a Stack of Interconnects. Sun Yangyang, Buot Joan Rey Villarba and Patil Aniket developed the invention.
The patent application number is US202519080714 20250314. The patent publicat..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Advanced Micro Devices has filed a patent application for Integrated Circuity Device with Flexible Routing at Hybrid Bonding Layer. This invention was developed by Liu Hsiang-wei and Wang Liwei.
The patent application number is US202519079308 20250313. The patent publication number is US20260282960 (A1..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has released Shinko Electric Industries patent application for Interconnect Substrate and Method of Making the Same. This invention was developed by Yoshiike Jun, Shimizu Noriyoshi and Sunohara Masahiro.
The patent application number is US202619552212 20260227. The patent..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Unimicron Technology has submitted a patent application for Package Carrier Structure and Manufacturing Method Thereof. This invention was developed by Tain Ra-min, Ma Guang-hwa, Tseng Tzyy-jang and Wang Chin-sheng.
The patent application number is US202519257449 20250701. The patent publication number i..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Samsung Electronics has filed a patent application for Semiconductor Package and Method of Manufacturing the Same. This invention was developed by Kim Chanhee, Park Eunkyeong, Kang Heeyoub, Lee Wonjae, Yong Seokbeom and Ahn Sungoh.
The patent application number is US202519398775 20251124. The patent pu..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Qualcomm has submitted a patent application for Multichip Module Including Folded Substrate. This invention was developed by Buot Joan Rey Villarba, Patil Aniket and Wang Zhijie.
The patent application number is US202519080490 20250314. The patent publication number is US20260282953 (A1). International P..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has published Infineon Technologies patent application for Power Semiconductor Package Including a Contact Pin with a Pointed Tip and Method of Fabrication Thereof. The invention was developed by Schwarz Alexander and Stäber Tobias.
The patent application number is US202..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Taiwan Semiconductor has submitted a patent application for Semiconductor Device and Method of Forming the Same. This invention was developed by Lin Yung-chi, Chung Ming-tsu and Tsai Yan-zuo.
The patent application number is US202619681111 20260519. The patent publication number is US20260282946 (A1). In..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Niterra has submitted a patent application for Semiconductor Element Mounting Substrate. This invention was developed by Sano Isuzu, Kondo Yosuke, Nishimura Mitsuru, Usami Kenzo, Watanabe Yukihiro and Murase Tatsunori.
The patent application number is US202419469252 20240321. The patent publication numbe..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- IMEC VZW has filed a patent application for Method for Forming an Interconnect Structure. This invention was developed by Chew Soon Aik, Adelmann Hanns Christoph, Tokei Zsolt, Park Seongho and Soulie Jean-philippe.
The patent application number is US202619562205 20260310. The patent publication number ..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Fujian Jinhua Integrated Circuit has submitted a patent application for Method of Forming Semiconductor Device. Zhong Rongxiang, Hsia Chung-ping, Lai Jianpeng and Liu Yue developed the invention.
The patent application number is US202619669984 20260506. The patent publication number is US20260282938 (A1)..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Samsung Electronics has sought patent for Semiconductor Package and Method for Manufacturing the Same. This invention was developed by Lee Soohwan, Kim Yeongseon and Jo Gyeongjae.
The patent application number is US202519378498 20251104. The patent publication number is US20260282937 (A1). Cooperative ..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received KIOXIA patent application for Semiconductor Device Manufacturing Method, and Semiconductor Device. Yamada Ryoji developed the invention.
The patent application number is US202519237928 20250613. The patent publication number is US20260282936 (A1). Cooperative..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- United Microelectronics Corporation has submitted a patent application for Method for Fabricating Physically Unclonable Function Device. This invention was developed by Lin Hung-chan and Chen Chang-yih.
The patent application number is US202619676838 20260514. The patent publication number is US2026028..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has published JCET STATS ChipPAC, Korea patent application for Semiconductor Package and a Method for Forming the Same. The invention was developed by Park Seonghwan, Park Kyounghee and Rhee Wonsang.
The patent application number is US202619565532 20260313. The patent p..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Qorvo has filed a patent application for Electromagnetic Compartmental Shielding for Multichip Cavity System-in-package (sip) Module. This invention was developed by Hasnine Md.
The patent application number is US202519406318 20251202. The patent publication number is US20260282931 (A1). International ..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- JCET STATS ChipPAC, Korea has submitted a patent application for Semiconductor Device and Method of Forming Aip Module with Embedded Substrate. This invention was developed by Lee Seunghyun, Yun Yeojun and Lee Heesoo.
The patent application number is US202519079781 20250314. The patent publication number..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Niterra has applied United States patent for Semiconductor Element Mounting Substrate. Sano Isuzu, Kondo Yosuke, Nishimura Mitsuru, Watanabe Yukihiro, Usami Kenzo and Murase Tatsunori developed it.
The patent application number is US202419469192 20240321. The patent publication number is US20260282922 (A..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received United Microelectronics Corporation patent application for Semiconductor Device and Manufacturing Method Thereof. Yang Chin-chia, Lin Da-jun, Tsai Fu-yu and Tsai Bin-siang developed the invention.
The patent application number is US202519096617 20250331. Th..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received Fuji Electric patent application for Semiconductor Device and Method of Manufacturing Semiconductor Device. Utsumi Makoto developed the invention.
The patent application number is US202619460608 20260127. The patent publication number is US20260282916 (A1). I..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received Hitachi Astemo patent application for Semiconductor Device. Shimazu Hiromi, Kanazawa Takuro, Takahara Hidehiko and Tamura Mitsutoshi developed the invention.
The patent application number is US202318878786 20230515. The patent publication number is US202602..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has published Hitachi Astemo patent application for Semiconductor Device. The invention was developed by Hatanaka Ayumu, Seki Takeshi, Uetake Masahiro, Noie Akihiko and Yamachi Nayuta.
The patent application number is US202218872895 20220622. The patent publication numb..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Western Digital Technologies has filed a patent application for Composite Cooling Disk for Continuous Transient Cooling for Semiconductor Chip. This invention was developed by Hirano Toshiki, Bandic Zvonimir, Zebian Hussam and Vucinic Dejan.
The patent application number is US202619679523 20260515. The p..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has published Micron Technology patent application for Fin Design Molding Structure for Exposed Semiconductor Package for Convection Heat Transfer. The invention was developed by Leow See Hiong, Chong Chin Hui, Pan Ling, Tan Kelvin Aik Boo, Ye Seng Kim and Ng Hong Wan.
Th..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor patent application for Package Structure and Manufacturing Method Thereof. The invention was developed by Chuang Kris Lipu and Hung Wensen.
The patent application number is US202519082148 20250317. The patent publication number is US2026..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Interconnect Level with High Resistance Layer and Method of Forming the Same. This invention was developed by Chan Hong-wei, Huang Wen-sheh, Chen Yu-hsiang and Cheng Yung-shih.
The patent application number is US202619468302 202602..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Taiwan Semiconductor has applied United States patent for Semiconductor Package Structure and Method of Forming the Same. Huang Kuo-ching, Chuang Harry-haklay, Chen Kuen-yi, Teng Li-feng, Hsieh Chih-ren, Wu Wei-cheng and Ong Yi Ching developed it.
The patent application number is US202519278843 20250724...
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Nanya Technology has filed a patent application for Semiconductor Die Structure with Air Gaps and Method for Preparing the Same. This invention was developed by Huang Chin-ling.
The patent application number is US202619669061 20260506. The patent publication number is US20260282892 (A1). International ..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- IBM has submitted a patent application for Sandwich Structure for Via and Interconnect. Clevenger Lawrence Alfred, Yang Chih-chao, Dutta Ashim and Rudra Kamal developed the invention.
The patent application number is US202519079837 20250314. The patent publication number is US20260282891 (A1). Cooperat..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has released ChangXin Memory Technologies patent application for Method of Forming Semiconductor Structure and Semiconductor Structure. This invention was developed by Li Ting and Chou Hou-hong.
The patent application number is US202619670351 20260507. The patent publicat..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has published Tokyo Electron patent application for Method of Forming a Semiconductor Device with Air Gaps for Low Capacitance Interconnects. The invention was developed by Tapily Kandabara, Clark Robert D and Smith Jeffrey.
The patent application number is US202619667127..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Samsung Electronics has sought patent for Semiconductor Devices. This invention was developed by Kim Eunjung.
The patent application number is US202619672321 20260508. The patent publication number is US20260282886 (A1). International Patent Classification codes are H10B12/00, H10W20/41 and H10W20/42. ..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Memory Circuit, Semiconductor Device, and Electronic Device. Kanda Yasuo developed the invention.
The patent application number is US202419167280 20240325. The patent publication number is US20260282882 (A1). International Pa..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Vertical Transistors Occupying Reduced Chip Area and the Methods Forming the Same. Chiu Yi-hsun, Huang Yu-xuan, Chuang Cheng-chi, Chang Shang-wen and Tsai Ching-wei developed the invention.
The patent application number is US202619..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has released Socionext patent application for Semiconductor Integrated Circuit Device. This invention was developed by Hino Toshio.
The patent application number is US202619668922 20260506. The patent publication number is US20260282879 (A1). International Patent Classifi..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Taiwan Semiconductor has submitted a patent application for Cell Boundary Region with Buried Power Grid Segment, Semiconductor Device Including Same, and Method of Manufacturing Same. This invention was developed by Syu Ming-cheng, Yang Yu-tao, Kundu Amit, Peng Yung-chow, Kang Po-zeng, Chou Wen-shen and L..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Socionext has applied United States patent for Semiconductor Device. Okamoto Atsushi, Wang Wenzhen and Takeno Hirotaka developed it.
The patent application number is US202619646746 20260414. The patent publication number is US20260282877 (A1). International Patent Classification codes are H10D84/85, H1..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Taiwan Semiconductor has submitted a patent application for Interconnect Structure. Lee Chia Chen, Chen Yi-yi, Wu Chia-tien and Lu Chi-yu developed the invention.
The patent application number is US202519081690 20250317. The patent publication number is US20260282876 (A1). International Patent Classifica..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- SK Hynix has sought patent for Semiconductor Device and Manufacturing Method of Semiconductor Device. This invention was developed by Lee Sang Yong, Kwon Sae Jun, Oh Sang Hyun, Kim Sang Min and Park Jin Taek.
The patent application number is US202619669611 20260506. The patent publication number is US202..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor patent application for Semiconductor Structure and Method of Formation. The invention was developed by Chiang Katherine H, Sun Hung-chang, Chen Chieh-fang, Lin Chung-te, Wu Chen-jun and Hsu Pin-cheng.
The patent application number is US2..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- IBM has sought patent for Subtractive Interconnect Structure with Top Via. This invention was developed by Sirikkathuge Nilanka W, Yang Chih-chao, Dutta Ashim and Rudra Kamal.
The patent application number is US202519079970 20250314. The patent publication number is US20260282872 (A1). International Pa..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Samsung Electronics has submitted a patent application for Semiconductor Memory Device. Noh Woo Choel and Kim Cheonbae developed the invention.
The patent application number is US202519419372 20251215. The patent publication number is US20260282870 (A1). International Patent Classification codes are H10B..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor patent application for Semiconductor Device. Chen Yi-ren and Chi Po-cheng developed the invention.
The patent application number is US202619682793 20260520. The patent publication number is US20260282869 (A1). International Patent Classif..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has released Micron Technology patent application for Memory Devices Including Staircase Structures and Merged Source Tier Structures. This invention was developed by Luo Shuangqiang and Lomeli Nancy M.
The patent application number is US202619671844 20260508. The patent ..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- SK Hynix has submitted a patent application for Stacked Memory Devices. This invention was developed by Kim Dong Keun.
The patent application number is US202519268393 20250714. The patent publication number is US20260282865 (A1). International Patent Classification codes are H10B80/00, H10D80/30, H10W20/..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Taiwan Semiconductor has sought patent for Semiconductor Device. This invention was developed by Liang Victor Chiang, Chu Chung-hao, Chen Chia-chung, Huang Chi-feng and Yang Ching-yu.
The patent application number is US202619668800 20260505. The patent publication number is US20260282862 (A1). Internatio..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Microchip Technology has submitted a patent application for Fabrication Method Combining Laser Direct Imaging (LDI) and Photomask Processing. This invention was developed by Kovats Julius Andrew.
The patent application number is US202519257684 20250702. The patent publication number is US20260282859 (A..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Nanya Technology has filed a patent application for Method of Forming Semiconductor Device. This invention was developed by Chen Tai-wei.
The patent application number is US202519078307 20250313. The patent publication number is US20260282855 (A1). Cooperative Patent Classification codes are H10P50/00 (U..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor patent application for Method for Filling Gap. The invention was developed by Lin Sung-en, Cheng Po-hsien, Peng Yu-yun, Fang Chia-yu, Ko Chung-ting and Huang Tai-chun.
The patent application number is US202619666535 20260504. The patent ..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- EV Group E Thallner has sought patent for Method for Surface Treatment of a Substrate and Method for Bonding Such a Substrate to a Further Substrate, and a Device for Carrying Out Such Methods. This invention was developed by Kerepesi Peter.
The patent application number is US202319163709 20230321. The..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- QOMPLX has submitted a patent application for System and Method for Adaptive Semiconductor Process Control. This invention was developed by Park David, Crabtree Jason, Hopper Jason and Kelley Richard.
The patent application number is US202519078225 20250312. The patent publication number is US20260282849..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received ASML Netherlands patent application for Substrate Processing. Van Hal Paulus Albertus and Koevoets Adrianus Hendrik developed the invention.
The patent application number is US202419168305 20240321. The patent publication number is US20260282845 (A1). Interna..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has released Google patent application for Feed-forward Device Fabrication. This invention was developed by Burkett Brian James.
The patent application number is US202619668137 20260505. The patent publication number is US20260282844 (A1). International Patent Classific..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received KIOXIA patent application for Crystal Evaluation Method. Yoshioka Kyosuke and Kanno Yurika developed the invention.
The patent application number is US202519234488 20250611. The patent publication number is US20260282842 (A1). International Patent Classific..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has published SCREEN Holdings patent application for Chuck Pin, Substrate Holding Device, and Substrate Processing Device. The invention was developed by Shinohara Takashi.
The patent application number is US202519393571 20251119. The patent publication number is US202602..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Samsung Electronics has submitted a patent application for Semiconductor Chip Protect Film. This invention was developed by Choi Yun Seok and Jung Du Sik.
The patent application number is US202519419697 20251215. The patent publication number is US20260282835 (A1). International Patent Classification cod..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has released Shinko Electric Industries patent application for Electrostatic Chuck and Substrate Fixing Device. This invention was developed by Takagi Shun and Ishii Hiroshi.
The patent application number is US202619563386 20260311. The patent publication number is US2026..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Applied Materials has sought patent for Electrostatic Chuck with Conductive Mesh. This invention was developed by Chadha Arvinder Manmohan Singh, Verma Abhishek Kumar, Li Jian, Balasubramanian Ganesh, Bera Kallol and Rocha Juan C.
The patent application number is US202519077287 20250312. The patent publi..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Tokyo Electron has submitted a patent application for Bonding Apparatus, Bonding System, and Bonding Method. Yamasaki Yutaka and Terada Takashi developed the invention.
The patent application number is US202619648316 20260415. The patent publication number is US20260282827 (A1). International Patent Clas..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Taiwan Semiconductor has sought patent for Shelf Status Determination. This invention was developed by Chang Ching-jung and Li Guancyun.
The patent application number is US202619680216 20260518. The patent publication number is US20260282822 (A1). International Patent Classification codes are G06T7/73, H..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has published Tokyo Electron patent application for Substrate Processing Apparatus and Method of Operating Substrate Processing Apparatus. The invention was developed by Kubo Hideaki.
The patent application number is US202619552849 20260227. The patent publication number ..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has published Shin-Etsu Polymer patent application for Substrate Storage Container and Method for Manufacturing Substrate Storage Container. The invention was developed by Hasegawa Akihiro and Mimura Hiroshi.
The patent application number is US202319471373 20231225. The p..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received Advanced RISC Machines patent application for Film Tray Semiconductor Chip Carrier. Delacruz Javier, Scott George John and Nelson Cameron Cole developed the invention.
The patent application number is US202519081961 20250317. The patent publication number is ..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has published SCREEN Holdings patent application for Substrate Processing Apparatus and Maintenance Method. The invention was developed by Yamagami Kota and Hirai Takanori.
The patent application number is US202619442647 20260107. The patent publication number is US202602..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- Taiwan Semiconductor has sought patent for System and Method for Semiconductor Cleaning Operation. This invention was developed by Chen Kuan-chung.
The patent application number is US202519080980 20250317. The patent publication number is US20260282814 (A1). International Patent Classification code is H1..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received United Microelectronics Corporation patent application for Controlling Method for Semiconductor Process Auxiliary Apparatus, Control Assembly and Manufacturing System. Lee Jui-hung, Wei Ke-wei, Wang Shi-hao, Tsai Min-wei, Lu Ping-yi, Kuo Chih-chung, Wang Sheng..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- KIOXIA has applied United States patent for Semiconductor Mounting Apparatus and Semiconductor Mounting Method. Nakahara Taishi developed it.
The patent application number is US202519232986 20250610. The patent publication number is US20260282809 (A1). Cooperative Patent Classification codes are H10P72/0..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor patent application for Laser Beam Adjustment in Semiconductor Device Fabrication. This invention was developed by Wang Wei-fu, Yeo Yee-chia, Wang Li-ting and Wang Yi-chao.
The patent application number is US202619673700 20260511. The pate..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received Lam Research patent application for Pedestal Stem Cooling System. Hiester Jacob Lee, Breiling Patrick Girard, Cmelak Bryan Anthony and Gage Christopher developed the invention.
The patent application number is US202419480261 20240502. The patent publication n..
Semiconductor
| Tue 29 Sep 2026
Alexandria, Sept. 28 -- U.S. Patent and Trademark Office has received Beijing NAURA Microelectronics Equipment patent application for Reaction Chamber of Semiconductor Processing Equipment, and Semiconductor Processing Equipment. Li Miaomiao, Yang Laibao and Ma Yuhu developed the invention.
The patent application number is US20..
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