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Semiconductor
| Wed 14 Jan 2026
Geneva, Jan. 14 -- Adeia Semiconductor Bonding Technologies Inc has filed a patent application for Build Up Bonding Layer Process and Structure for Low Temperature Copper Bonding. This invention was developed by Fountain Gaius.
The patent application number is WO2025US36134 20250701. The patent publication number is WO2026010..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- World Intellectual Property Organization has released Dreambig Semiconductor Inc patent application for Chiplet Hub Architecture. This invention was developed by Majors Steven, Hausauer Brian, Wang Linghe, Llitzky David, Chakraborty Prasenjit, Clark Kenneth and Maguire David.
The patent application number i..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has released Beijing University patent application for Processor Architecture Supporting In-memory Matrix Operation Based on Static Memory and Processor. This invention was developed by Jia Tianyu and Zhu Zhantong.
The patent application number is CN202510314035 ..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Beijing Baidu Netcom Science & Technology has applied Chinese patent for Memory Access Control Chip, Data Memory Access Method and Data Memory Access System. Chi Zhigang, Liu Yueji and Wu Zhenghui developed it.
The patent application number is CN202510326436 20250319. The patent publication number is CN120..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- World Intellectual Property Organization has published Watanabe Hiroshi patent application for Silicon Brain.
The patent application number is WO2025JP17133 20250509. The patent publication number is WO2026009565 (A1). International Patent Classification codes are G06N3/063, G11C11/54 and G11C16/04.
Th..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Shanghai Fulehua Semiconductor Tech Co Ltd has submitted a patent application for Method for Judging Crack Generation Section of DCB Substrate. This invention was developed by Xu Jiezhao, Zou Xuyang, Yang Qiangjun and Dai Hongxing.
The patent application number is CN202510296251 20250313. The patent public..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has released Suzhou Jincheng Tongyuan Electronic Tech Co Ltd patent application for Full-automatic Chip Appearance Defect and Flatness Detection Device. This invention was developed by Luo Xifeng and Hu Chenguang.
The patent application number is CN202510328346 2..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Beijing Electronic Measuring Equipment Co Ltd has submitted a patent application for Plastic Package Chip Appearance Defect Detection Method and System, Medium and Electronic Equipment. This invention was developed by Cao Shenshen, Zhang Lianlian and Zhao Wenxiu.
The patent application number is CN20251024..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Advanced Ultraviolet Optoelectronics Co Ltd has filed a patent application for Preparation Method for UVC Epitaxial Wafer Structure Having Different Indicator Colors. This invention was developed by Xu Guangyuan, Hou Jie, Zhang Tong and Li Jinmin.
The patent application number is WO2025CN103064 20250624. Th..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- World Intellectual Property Organization has received Beijing Hamamatsu Photon Techniques Inc and Hamamatsu Photonics patent application for Annealing Method and Annealing Apparatus for Cadmium Telluride Series Semiconductor Crystals. Han Yongfei and Chen Liling developed the invention.
The patent applicati..
Semiconductor
| Wed 14 Jan 2026
Geneva, Jan. 14 -- Yangtze Memory Technologies has filed a patent application for Memory Device and Method of Forming the Same. This invention was developed by Li Zhaosong, Wei Jianlan, Zhang Liyuan, Li Sizhe, Mao Xiaoming, Gao Jing, Tang Yi, Wang Zhiguo and Huo Zongliang.
The patent application number is WO2024CN103041 20240..
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- SEMES has filed a patent application for Reel Taking-out Equipment and Method. This invention was developed by Hwang Jae-hee and Kim Seung Won.
The patent application number is CN202411769721 20241204. The patent publication number is CN120207941 (A). International Patent Classification codes are B65G43/00..
Semiconductor
| Wed 14 Jan 2026
Geneva, Jan. 14 -- Arteris Inc has submitted a patent application for Deadlock-free Modification to Network-on-chip Topology. Charif Amir developed the invention.
The patent application number is WO2025US35997 20250701. The patent publication number is WO2026010896 (A1). International Patent Classification codes are G06F15/78..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Beijing Zitiao Network Technology has applied Chinese patent for Memory Management Method and Device, Equipment and Storage Medium. Han Bingtian, Wang Yuelei, Yang Yu, Zhao Jianli and Zhong Bin developed it.
The patent application number is CN202311815996 20231226. The patent publication number is CN120216..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has released Shanghai Integrated Circuit Equipment Materials Industry Innovation Center patent application for Optical Proximity Correction Method, Storage Medium and Terminal. This invention was developed by Zhong Chen and Wang Dong.
The patent application numbe..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Sony Semiconductor Solutions Corp and Sony Depthsensing Solutions SA/NV have sought patent for Circuitry and Method. This invention was developed by Yernaux Florence, Magalhaes Joao Paulo and Hustin Serge.
The patent application number is WO2025EP69136 20250704. The patent publication number is WO202600883..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- IBM and IBM Deutschland have filed a patent application for Inductor Structures in Hybrid Bonded Devices. This invention was developed by Jayanand Kishan, Polomoff Nicholas, Purohit Viswas, Latham Nicholas, Dutta Ashim and Yang Chih-chao.
The patent application number is WO2025EP64066 20250522. The patent p..
Semiconductor
| Wed 14 Jan 2026
Geneva, Jan. 14 -- BOE Technology Group Co Ltd and Chongqing BOE Optoelectronics Technology have filed a patent application for Display Substrate and Display Device. This invention was developed by Qin Chunyan, Li Zhe, Min Taeyup, Sun Zhidan, Li Peng, Hu Faguan, Teng Zhengyuan and Guo Hui.
The patent application number is WO2..
Semiconductor
| Wed 14 Jan 2026
Geneva, Jan. 14 -- BOE Technology Group Co Ltd, Chengdu Boe Optoelect Tech Co and Beijing BOE Technology Development have filed a patent application for Display Substrate and Display Device. This invention was developed by Zheng Kening, Wang Jiayu, Li Langtao and Wang Dengyu.
The patent application number is WO2025CN100426 20..
Semiconductor
| Wed 14 Jan 2026
Geneva, Jan. 14 -- Waftech Sdn Bhd, Shanghai Gona Semiconductor Tech Co Ltd and Zhejiang Gona Semiconductor Tech Co Ltd have submitted a patent application for Substrate Carrier Identification Method, System, and Storage Medium. This invention was developed by Kang Choon Siong.
The patent application number is WO2024CN135139 ..
Semiconductor
| Wed 14 Jan 2026
Geneva, Jan. 14 -- Zeiss Carl Vision Int GmbH and Carl Zeiss Vision Technical Services Guangzhou Ltd have applied WIPO patent for Method of Producing a Polythiourethane Resin Raw Material for Manufacturing of a Spectacle Lens Substrate and Spectacle Lens Substrate. Windbiel Julian, Wan Yucheng and Gloege Thomas developed it.
..
Semiconductor
| Wed 14 Jan 2026
Geneva, Jan. 14 -- Ericsson Telefon Ab LM and Li Xin have submitted a patent application for Substrate for Mounting Electronic Component, Electronic Module, and Base Station. This invention was developed by Li Xin, Qiang Junxiang, Ding Dongqing, Lin Tao, Zhong Fei, Peng Shuangquan and Lu Qinqin.
The patent application number ..
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- Beijing Xchd Science & Tech Development Co Ltd and Beijing Satellite Manufacturing Factory have submitted a patent application for Surface-modified Polyether-ether-ketone, Preparation Method Thereof and Metal Coating Substrate. This invention was developed by Wang Nan, Li Sizhen, Gao Hong, Bai Jingying, Li Ji..
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- Guangzhou Baiyun Tech Co Ltd and Guangdong Baiyun Tech Co Ltd have filed a patent application for Tackifier, Single-component Addition Type Organic Silicon Sealant and Preparation Method of Single-component Addition Type Organic Silicon Sealant. This invention was developed by Ye Lubin, Liu Guanghua, Chen Yon..
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- China Three Gorges University and Hubei Three Gorges Laboratory have submitted a patent application for Hydroxyl-containing Organic Amine Grafted Organic Silicon High-boiling Residue Catalyst and Cracking Process. This invention was developed by Ji-lin Tianyi, Yang Yizhi, Chen Tianyang, Sun Haoxiang, Chen Zhi..
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- China Three Gorges University and Hubei Three Gorges Laboratory have applied Chinese patent for Organic Amine Grafted Organic Silicon High-boiling Residue Catalyst Containing Primary and Secondary Amino Groups and Organic Silicon High-boiling Residue Catalytic Cracking Process. Ji-lin Tianyi, Yang Yizhi, Sun ..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- SK Hynix Nand Product Solutions Corp Dba Solidigm and SK Hynix have submitted a patent application for Methods and Systems for SLC Copyback Operations. Kathawala Gulzar, Zhang Ming, Wakchaure Yogesh, De Vries Jonathan, Carlton David, Ahn Yushin, Park Taehun and Cho Wanik developed the invention.
The patent ..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Anhui Xindong Lianke Microsystem Co Ltd and Beijing Xindong Zhiyuan Microelectronics Tech Co Ltd have applied Chinese patent for Six-dimensional Force Sensor Device Based on MEMS Principle and Preparation Method Thereof. Mao Defeng and Zhang Longhai developed it.
The patent application number is CN20251056..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Shanghai Maizhen Electronic Tech Co Ltd and Xiamen Haienmai Tech Co Ltd have sought patent for Integrated Chip for Synchronous Thermal Analysis and Synchronous Thermal Analysis System and Method. This invention was developed by Yu Haitao and Li Xinxin.
The patent application number is CN202510459656 202504..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Tokyo Electron Ltd and Tokyo Electron US Holdings have sought patent for Method for Semiconductor Processing. This invention was developed by Yonezawa Ryota, Yu Kai-hung, Leusink Gerrit and O'meara David L.
The patent application number is WO2025US24601 20250414. The patent publication number is WO202601066..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Shanghai Tsinghua Int Innovation Center and Tsinghua University have submitted a patent application for Electron Beam Direct Writing System and Chip Production System. This invention was developed by Zhou Youhua, Zhang Shunde and Wu Huaqiang.
The patent application number is CN202510385170 20250328. The pa..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Guangdong Paier New Material Tech Co Ltd and Shengmaiente New Material Tech Shenzhen Co Ltd have submitted a patent application for Photoetching Mask Protective Film for Semiconductor and Preparation Method Thereof. This invention was developed by Zhang Dandan and Qiu Yanping.
The patent application number..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- BOE Technology Group and Ordos Yuansheng Optoelectronics have submitted a patent application for Array Substrate and Manufacturing Method Thereof. This invention was developed by Yao Lei, Li Yang, Gao Chuyu, Wang Lei, Li Feng, Yang Yang, Zhang Xinwen and Chen Long.
The patent application number is CN202510..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Applied Materials Inc, Mueller Bernhard G and Wenzel Axel have applied WIPO patent for Method of Testing a Packaging Substrate, Method of Operating an Apparatus for Testing of a Packaging Substrate, and Apparatus for Testing a Packaging Substrate. Mueller Bernhard G and Wenzel Axel developed it.
The patent ..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Hangzhou International Science and Technology Innovation Center of Zhejiang University and Sunny Optical Zhejiang Research Institute have submitted a patent application for Photon Integrated Chip and Frequency-modulated Continuous Wave Laser Radar. Fan Zhuping, Zou Jun, Yan Xiongshuo, Zhuang Yuan and Wang Wei..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Beijing Tankeblue Semiconductor and Jiangsu Tianke Heda Semiconductor have filed a patent application for Growth Device and Growth Method of Conductive Silicon Carbide Crystal. This invention was developed by Zhang Xuexia, Lou Yanfang, Liu Chunjun, Peng Tonghua and Yang Jian.
The patent application number ..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Xi'an ESWIN Material Technology and Xi'an Eswin Silicon Wafer Technology have sought patent for Preheating Ring, Wafer Epitaxial Growth Equipment, Epitaxial Growth Method and Epitaxial Silicon Wafer. This invention was developed by Liang Penghuan.
The patent application number is CN202510354656 20250325. T..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Asml Netherlands BV and Cymer have filed a patent application for Dual Comb Radiation Source and Heterodyne Detection for Alignment Metrology. This invention was developed by Jahani Saman, Mehta Nikhil, Liu Mingchen, Rezvani Naraghi Roxana and Ghasemkhani Mohammadreza.
The patent application number is WO202..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Smoore International Holdings Ltd and Shenzhen Smoore Technology have submitted a patent application for Aerosol-generating Article and Aerosol-generating Substrate. Li Dandan, Xiong Wei, Fan Jichang, Zheng Wei and Liu Zengri developed the invention.
The patent application number is WO2025CN106514 20250701...
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Smoore International Holdings Ltd and Shenzhen Smoore Technology have submitted a patent application for Manufacturing Device and Manufacturing Method for Aerosol-generating Substrate Segments. Xu Wei developed the invention.
The patent application number is WO2025CN104983 20250627. The patent publication n..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Huaneng Guangxi Clean Energy and Huaneng Clean Energy Res Institute have filed a patent application for Co Gas Sensor Based on MEMS Chip as Well as Preparation Method and Application of Co Gas Sensor. This invention was developed by Liu Facan, Ping Xiaofan, Ouyang Hongming, Liu Mingyi, Cao Xi, Cao Chuanzhao, ..
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- Caihong Group and IRICO Group (Shaoyang) Special Glass have filed a patent application for Alkali-free Glass, Preparation Method Thereof and Magnetic Disk Substrate Glass Based on Alkali-free Glass. This invention was developed by Han Manman, Tang Bingjie, Wu Xiaoxi, Zhu Runtong and Liu Yingzhou.
The paten..
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- Wuhu Dongxu Photoelectric Sci & Tech Co Ltd, Zhejiang Xingke Photoelectric Tech Co Ltd; Tunghsu Technology Group have submitted a patent application for Glass Substrate Post-processing Device, Control Method and Control System. Li Qing, Liu Yuan, Kong Xiumei, He Huaisheng, Li Heran, Li Zhen, Zhao Yule, Li Jun..
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- Beijing Capitalbio Tech Co Ltd, Sichuan National Research Inst of High Performance Medical Devices and Chengdu Boao Crystal Core Bio Technology have filed a patent application for Micro-fluidic Chip and Micro-fluidic System. This invention was developed by Shao Haoying, Xu Youchun and Pan Liangbin.
The pat..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- BOE Technology Group Co Ltd and Chengdu BOE Optoelectronics Technology have applied WIPO patent for Display Substrate and Manufacturing Method Therefor, and Display Panel. Ma Dezhao, Wang Jixing, Yang Yiyan and Gao Tao developed it.
The patent application number is WO2025CN102418 20250620. The patent public..
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- Dalai Nur Coal Industry and Harbin Institute of Technology have submitted a patent application for Preparation Method of Ti-doped Nano Silicon Carbide Material. Wang Zhijiang, Huang Yuhui, Jing Qinghe, Le Shiru and Guo Jie developed the invention.
The patent application number is CN202510417487 20250403. T..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Yangzhou Zexu Electronic Tech Co Ltd has filed a patent application for Wafer Defect Detection Equipment for Semiconductor Processing. This invention was developed by Li Geng, Qian Jiali and Li Yongbei.
The patent application number is CN202510513545 20250423. The patent publication number is CN120213966 (..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Shanghai Ju Yue Electronics Co Ltd has submitted a patent application for Semiconductor Wafer Surface Chip Detection Method and System. This invention was developed by Shang Yue and Yu Xixia.
The patent application number is CN202510669112 20250523. The patent publication number is CN120214069 (A). Interna..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has published Zhangjiagang Zhongmei Untra Thin Strip Tech Co Ltd, Jiangsu Shagang Institute Research Iron & Steel, Jiangsu Shagang Group and Jiangsu Shagang Iron and Steel patent application for Method for Producing Non-oriented Silicon Steel for Compressor Based on..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has received Henan Liumianding New Material Tech Co Ltd and Institute of Semiconductors, Chinese Academy of Sciences patent application for Screening Method of Diamond Substrate. Ma Nanyang, Li Yunhua, Chen Jian, Wang Zhen, Cao Fanqiu, Jin Peng and Wang Zhanguo deve..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has received Shanghai Zhengshi Tech Co Ltd patent application for Cleaning Method for Reaction Cavity of CVD (chemical Vapor Deposition) Equipment. Jia Yuanbo and Man Weidong developed the invention.
The patent application number is CN202311804518 20231225. The p..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has received Beijing Graphene Inst, Soochow University and Beijing University patent application for Graphene Wafer Batch Preparation Device. Sun Jingyu, Jia Li, Yoo Chung-beom, Cai Ali, Liu Feifan and Wei Wenze developed the invention.
The patent application num..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Ks Gleitlager GmbH has sought patent for Use of a Phosphorus-containing Bronze Alloy for Producing a Sliding Layer on a Metal Substrate by Means of Deposition Welding. This invention was developed by Grauvogl Manfred and Schubert Werner.
The patent application number is WO2025EP62787 20250509. The patent pu..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Semicon Microelectronics Shenzhen Co Ltd has applied Chinese patent for Probe Card and Wafer Test System. Yang Shu, Lu Yifei and Zhang Weijie developed it.
The patent application number is CN202311839424 20231227. The patent publication number is CN120214380 (A). International Patent Classification codes a..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Wuxi Yingbei Prec Hydraulic Co Ltd has submitted a patent application for Thrust Ring Electroplating Process for Reversing System of Heavy Truck. This invention was developed by Tong Zedong.
The patent application number is CN202510361982 20250326. The patent publication number is CN120210903 (A). Internat..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Shanghai Shanxin Semiconductor Co Ltd has applied Chinese patent for Overcurrent Monitoring Circuit Applied to High-side N-type Power Tube and Switching Device. Meng Xiangliang and Wu Yang developed it.
The patent application number is CN202510471661 20250415. The patent publication number is CN120214392 (..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Jiangsu Xierxin Semiconductor Equipment Co Ltd has applied Chinese patent for Equipment Facilitating Uniform Electroplating of Wafer and Electroplating Method Thereof. Zhou Ping and Zhang Shaoping developed it.
The patent application number is CN202510433752 20250408. The patent publication number is CN120..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Nanjing Puneng Communication Tech Co Ltd has submitted a patent application for Power Management Chip Test Analysis System. This invention was developed by Ye Guangpeng, Li Leilei and Shi Qiuming.
The patent application number is CN202510330143 20250320. The patent publication number is CN120214540 (A). In..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has received Longmen Laboratory patent application for Monocrystalline Silicon Sample Corrosion System and Corrosion Process Thereof. Wang Xinchang, Cui Caixia and Jia Qianlin developed the invention.
The patent application number is CN202510694508 20250528. The ..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has released Yancheng Genion Electronic Mat Factory patent application for Doped Modified Lithium Tantalate Wafer Material for High-frequency Surface Acoustic Wave Device and Preparation Method of Doped Modified Lithium Tantalate Wafer Material. This invention was d..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Shanghai Zhengshi Tech Co Ltd has submitted a patent application for Microwave Plasma Chemical Vapor Deposition Device and Heat Dissipation Ring Assembly and Vacuum Cavity Thereof. This invention was developed by Man Weidong.
The patent application number is CN202311822790 20231227. The patent publication ..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Lishi Electrode Tech Hangzhou Co Ltd has submitted a patent application for Distributed Anode Structure Capable of Adjusting Distance Between Cathode and Anode to Improve Electroplating Uniformity and Operation Method Thereof. This invention was developed by Xue Junwei, Li Zhengwu, Ruan Haitao and Zhao Qite.
..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Beijing Kewei Quantum Tech Co Ltd has submitted a patent application for Ceramic Substrate Structure for Chip Atomic Clock. Chen Xiaojuan, Wang Hongjia and Ma Huihuang developed the invention.
The patent application number is CN202510569341 20250501. The patent publication number is CN120215242 (A). Intern..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Shenzhen Jingyuan Information Tech Co Ltd has filed a patent application for Methods and Related Products for Optimizing Lithographic Processes. This invention was developed by Luo Zhaofeng.
The patent application number is CN202510570325 20250429. The patent publication number is CN120215221 (A). Internat..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Advanced Nano Fabrication Tech Anft Private Limited has submitted a patent application for an Apparatus of Single Substrate Multi-electron Beam Lithography Array and a Method of Fabrication Thereof. This invention was developed by Roy Angshuman.
The patent application number is WO2025IB56556 20250627. The p..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Shenzhen Jingyuan Information Tech Co Ltd has applied Chinese patent for Conversion Method of Bevel Edge in Integrated Circuit Layout, Medium, Product and Equipment. Xu Zengxu developed it.
The patent application number is CN202510378043 20250326. The patent publication number is CN120215199 (A). Internati..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Vector Photonics Ltd has submitted a patent application for Photonic Integrated Circuit. Ring William Sean, Ivanov Pavlo, O'dowd Anna Roisin and Orchard Jonathan Robert developed the invention.
The patent application number is WO2025GB51459 20250702. The patent publication number is WO2026008986 (A1). Inter..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Vector Photonics Ltd has submitted a patent application for Photonic Integrated Circuit. This invention was developed by Taylor Richard, Hill Calum, Ivanov Pavlo and O'dowd Anna Roisin.
The patent application number is WO2025GB51457 20250702. The patent publication number is WO2026008984 (A1). International..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Fujifilm Electronic Mat Europe NV has submitted a patent application for Photosensitive Polyimide Precursor Composition, Cured Film, Laminate, Method for Producing Cured Film and Semiconductor Device. Van De Steen Maxim developed the invention.
The patent application number is WO2025EP68724 20250701. The pa..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Att Advanced Temperature Test Systems Gmbh has submitted a patent application for Chuck System, Method and Use for Holding a Semiconductor Wafer on a Chuck. This invention was developed by Eibl Markus and Gutekunst Markus.
The patent application number is WO2025EP68563 20250701. The patent publication numbe..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has published Hangzhou Yixin Micro Tech Co Ltd patent application for Airflow Sensor Chip for Welding Anomaly Detection and Detection Method Thereof. The invention was developed by Li Yun, Chen Yi, Du Peng and Wang Haoyu.
The patent application number is CN202510..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has released Xiamen Dingliangzhu Biological Tech Co Ltd patent application for Modified Silicon Dioxide Microcapsule, Composition as Well as Preparation and Application of Modified Silicon Dioxide Microcapsule. This invention was developed by Wu Xibin.
The patent..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Xiamen Sihe Microelectronics Co Ltd has filed a patent application for Manufacturing Method for Packaging Test Dummy Chip and Test Dummy Chip. This invention was developed by Chen Wu, Huang Mian, Ding Kunpeng, Lu Peiliang, Ma Yi and Sun Guohua.
The patent application number is CN202510371356 20250327. The ..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Chengdu Haiguang Microelectronics Tech Co Ltd has filed a patent application for Testing System for Testing Chip and Chip Testing Method. This invention was developed by Pang Xiang.
The patent application number is CN202510360777 20250325. The patent publication number is CN120214542 (A). International Pat..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Foshan Youfanghuodi Supply Chain Man Co Ltd has sought patent for Path-optimized MOSFET Chip Signal Transmission System. This invention was developed by Liu Shuiyang and Wang Zhijin.
The patent application number is CN202510343782 20250322. The patent publication number is CN120215357 (A). International Pa..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Foshan Chandi Precision Medical Tech Co Ltd has applied Chinese patent for Electrochemical Workstation Electrode Voltage Modulation Method and Modulation Circuit Based on Lmp91000 Chip. Zeng Chijia, Li Lingchao, Liu Jianlei and Zhuang Xiwei developed it.
The patent application number is CN202510348167 2025..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- World Intellectual Property Organization has published Union Mat Inc patent application for Single-crystal Wafer and Method for Producing Same. The invention was developed by Sakuragi Shiro and Sakuragi Godai.
The patent application number is WO2024JP24140 20240703. The patent publication number is WO202600..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Mitsui High Tec Inc has applied WIPO patent for Substrate for Semiconductor Device, Method for Manufacturing Same, and Semiconductor Device. Furuno Ryota, Fukuda Koji and Tanaka Kazuki developed it.
The patent application number is WO2025JP24229 20250704. The patent publication number is WO2026009977 (A1). ..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has received Open Security Res Inc patent application for Random Number Detection Method, Chip and System. Liu Feng, Zou Shuanglu, Chen Qiang, Ma Bo and Fan Junfeng developed the invention.
The patent application number is CN202510342732 20250321. The patent publ..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Tianjin Bool Tech Co Ltd has submitted a patent application for Real-time Log Storage Method, Chip Equipment and Storage Medium. This invention was developed by Yan Fangchao, Yang Chenguang and Du Hanyu.
The patent application number is CN202510703613 20250529. The patent publication number is CN120215844 ..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Hefei Panxin Electronics Co Ltd has submitted a patent application for High-sensitivity Touch Capacitor Chip Device and System. This invention was developed by Ji Xia and Yue Weijie.
The patent application number is CN202510694163 20250528. The patent publication number is CN120215748 (A). International Pa..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Duntai Electronics Shenzhen Co Ltd has submitted a patent application for Touch Control Processing Method, Touch Control Chip and Electronic Equipment. Gong Yougang and Zhao Zhiliang developed the invention.
The patent application number is CN202510309285 20250314. The patent publication number is CN120215..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Xianzhike Semiconductor Tech Dongguan Co Ltd has submitted a patent application for Damping Die Bonding Equipment Based on Vibration Offset and Application of Damping Die Bonding Equipment in Semiconductor Packaging. This invention was developed by Deng Shengli.
The patent application number is CN202510552..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has received Hefei Lanma Cabin Intelligent Tech Co Ltd patent application for Time Synchronization Method Based on Inter-chip Communication and Chip Communication System. Shang Xiaodong and Lee Heun-chul developed the invention.
The patent application number is C..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has published Chongqing Jixin Technology Co Ltd patent application for Band-gap Reference Circuit, Temperature Compensation Method and Integrated Circuit. The invention was developed by Peng Jiahao, Liu Tao, Wang Xu, Wu Xuemei, Wang Shoulin, Jiang Fengming and Yang ..
Semiconductor
| Wed 14 Jan 2026
Geneva, Jan. 14 -- World Intellectual Property Organization has received Omnitron Sensors patent application for Optical Array with Self-aligned Collimated Fibers and MEMS Mirrors. Huang Trent developed the invention.
The patent application number is WO2025US35959 20250630. The patent publication number is WO2026010885 (A1). ..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- World Intellectual Property Organization has received Tokyo Electron Ltd and Tokyo Electron US Holdings patent application for Selective Deposition on an Existing Patterned Mask. Dorfner Alec developed the invention.
The patent application number is WO2025US22805 20250402. The patent publication number is W..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Shanghai Daishi Intelligent Tech Co Ltd has submitted a patent application for Multi-mems IMU Chip Module, Performance Optimization Method and Computer System. Bian Jiang and Wang Yang developed the invention.
The patent application number is CN202510321330 20250318. The patent publication number is CN1202..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- World Intellectual Property Organization has received Softpv Inc patent application for Apparatus for Manufacturing Silicon Balls. Ahn Hyeon Woo and Lee Sung Gue developed the invention.
The patent application number is WO2025KR09527 20250703. The patent publication number is WO2026010399 (A1). Internationa..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Shenzhen Zhangrui Electronic Co Ltd has applied Chinese patent for Display Method Based on Mtk Vehicle-mounted Platform, System on Chip and Vehicle-mounted Platform. Liu Li, Deng Yuenan, Wang Jiazhi, Zhang Hongliang and Gong Liheng developed it.
The patent application number is CN202510117528 20250124. The..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Shenzhen Chaoying Intelligent Tech Co Ltd has sought patent for Data Loss Detection Method and System for Storage Chip. This invention was developed by Xia Junjie and Lin Huasheng.
The patent application number is CN202510690728 20250527. The patent publication number is CN120216406 (A). International Pate..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Zhuhai Weidu Xinchuang Tech Co Ltd has submitted a patent application for Verification Control Method of Vehicle-gauge-level SOC (system on Chip) Chip and Related Equipment. This invention was developed by Zhang Hui, Luo Jun, Liu Wendong, Zhou Chunyuan and Gao Wei.
The patent application number is CN202510..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has released Shenzhen Yunbao Intelligent Co Ltd patent application for Lock Resource Management Device, System, Method and Chip. This invention was developed by Zhang Xueli and Zhang Jianyuan.
The patent application number is CN202510356572 20250325. The patent p..
Semiconductor
| Tue 13 Jan 2026
Beijing, Jan. 14 -- Yang Jijuan has submitted a patent application for Automatic Execution Eap System and Method for Integrated Circuit Production and Manufacturing. This invention was developed by Yang Jijuan.
The patent application number is CN202510290406 20250312. The patent publication number is CN120216185 (A). Internat..
Semiconductor
| Tue 13 Jan 2026
Geneva, Jan. 14 -- Dawon Powertron Co Ltd has submitted a patent application for Apparatus and Method for Generating Non-sinusoidal High Voltage Pulse in Semiconductor Manufacturing Facility Using Plasma. This invention was developed by Kim Young Woo.
The patent application number is WO2024KR09404 20240703. The patent publica..
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- Hebei Tongguang Semiconductor Co Ltd has submitted a patent application for Chemical Mechanical Polishing Method for Large-size Silicon Carbide Substrate. This invention was developed by Zhang Wang, Zheng Xiangguang, Li Da, Liu Shaohua, Li Qingxuan and Cui Jingguang.
The patent application number is CN2025..
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- Dongguan Lizhi Grinding Tech Co Ltd has filed a patent application for Processing Technology of Silicon Carbide Wafer Substrate. This invention was developed by He Jinyuan, Gong Ting and Zhou Qingyi.
The patent application number is CN202510591036 20250508. The patent publication number is CN120206312 (A)...
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has received Guojing Hechuang Qingdao Tech Co Ltd patent application for Flexible Substrate Stripping Device and Stripping Method Thereof. Zhang Fuxuan, Cui Caoxiang, Zhu Ruiping, Lyu Yong, Guo Baijun, Zhang Chunyang and Li Xiaodong developed the invention.
The p..
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has released Binzhou Xindaxin Mechanical And Electrical Tech Co Ltd and Binzhou Polytechnic patent application for Automatic Processing Equipment for Semiconductor Element Pins. This invention was developed by Lyu Qian, Cui Chaoxia, Zhang Yue, Song Wei, Qiao Deyu an..
Semiconductor
| Wed 14 Jan 2026
Beijing, Jan. 14 -- State Intellectual Property Office of China has received Zhengzhou Zhiji Tongda Cnc Tech Co Ltd patent application for Automatic Double-workbench Feeding and Discharging Device of Conical Motor Silicon Steel Sheet Notching Robot. Cao Zhijun, Dong Mingchuan, Cao Xiaodong, Shen Dengju and Zhao Xiaojian develope..
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