Semiconductor
| Fri 31 Jul 2026
Alexandria, July 31 -- Western Digital Technologies has been awarded a patent for Buffer Layers, Interlayers, and Barrier Layers Comprising Heusler Alloys for Sot Based Sensor, Memory, and Storage Devices. This invention was developed by Simmons Randy G, Okamura Susumu, Ho Kuok San, Liu Xiaoyong, Xu Xiaoyu, Takano Hisashi, Gribe..