Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Intel has received a patent for Dam Surrounding a Die on a Substrate. This invention was developed by He Liang, Deng Yue, Gamba Jason M, Nie Bai, Jiang Jisu, Kanaoka Yosuke, Han Jung Kyu, Armstrong Mitchell, Duan Gang, Devine Kimberly A and May Robert Alan.
The patent application number is US202117481245..