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Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Zhao Zhentao has filed a patent application for Laminated Packaging Module.
The patent application number is CN202211458544 20221121. The patent publication number is CN121843550 (A). International Patent Classification codes are H05K1/02, H05K1/11, H05K1/18, H10W70/40, H10W70/63, H10W70/65 and H10W76/12...
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Chengdu Spaceon Electronics Co Ltd has filed a patent application for POP Packaging Structure Based on Three-dimensional Stacking of Switching Substrates and Manufacturing Method of POP Packaging Structure. This invention was developed by Du Runchang, Wang Taolong and Liu Leiji.
The patent application numb..
Semiconductor
| Tue 14 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Gongyan Tuoxin Suzhou Integrated Circuit Co Ltd patent application for Blood Flow Signal Processing Method and Device Based on Silicon-based Photons and Wearable Equipment. Ma Kun, Du Yafei, Cheng Zhanhui, Yang Wenwei and Lu Jiaping developed the invent..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Itda Semiconductor Inc patent application for Programmable Sequencer and System-on-chip Device Using Same. Jeon Ho-yeon, Kim In Kyu and Kim Ah-chan developed the invention.
The patent application number is CN202380101967 20231030. The patent publicat..
Semiconductor
| Mon 13 Jul 2026
Seoul, July 14 -- Korean Intellectual Property Office has published Countec Co Ltd patent application for Counting Module Device. The invention was developed by Lee Boohan, Myoung Kiwon, Oh Younghyo, Lee Heonju and Im Sangok.
The patent application number is KR20230084956 20230630. The patent publication number is KR202500030..
Semiconductor
| Mon 13 Jul 2026
Seoul, July 14 -- Hyundai Motor and Kia have submitted a patent application for Semiconductor Device and Method of Manufacturing the Same. Kim Taehyun, Chun Dae Hwan, Joo Nackyong, Hong Jungyeop, Jung Youngkyun and Park Junghee developed the invention.
The patent application number is KR20230084844 20230630. The patent public..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Riyuexin Advanced Tech Research Kunshan Co Ltd patent application for Integrated Circuit Copper Needle Packaging Structure and Manufacturing Method Thereof. Huang Zhangbin and Yang Weiyuan developed the invention.
The patent application number is CN2..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Chengdu Scilicon Electric Co Ltd has submitted a patent application for Semiconductor Packaging Structure and Packaging Method. Hu Jian developed the invention.
The patent application number is CN202511760599 20251127. The patent publication number is CN121843576 (A). International Patent Classification co..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Nanjing Solid State Devices Co Ltd patent application for Metal-ceramic Composite Cover Plate for Controlling Hydrogen Content in Airtight Packaging Shell and Manufacturing Method of Metal-ceramic Composite Cover Plate. Liu Hai, Yang Jian, Shen Hui, Che..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Shandong Shunxin Gongyan Microelectronics Co Ltd patent application for Chip Flip Packaging Structure with High Heat Dissipation Efficiency. Zhang Yingxin, Qian Kai, Zhao Xu, He Rui and Ni Jie developed the invention.
The patent application number is..
Semiconductor
| Mon 13 Jul 2026
Seoul, July 14 -- Woo Bum Je has filed a patent application for Wafer Storage Container.
The patent application number is KR20240183061 20241210. The patent publication number is KR20250002042 (A). International Patent Classification codes are H01L21/67 and H01L21/673. Cooperative Patent Classification codes are B65D81/2076 ..
Semiconductor
| Tue 14 Jul 2026
Beijing, July 14 -- Central South University, Jiangxi Xinlong Electric Porcelain Electric Appliance and Nanchang University have submitted a patent application for Organic Silicon Coating Coating Method and Device for 25kn Rod Type Porcelain Insulator of High-speed Rail Overhead Line System. This invention was developed by Du Gu..
Semiconductor
| Tue 14 Jul 2026
Beijing, July 14 -- Xi'an ESWIN Silicon Wafer Technology and Xi'an ESWIN Material Technology have filed a patent application for Method and Device for Determining Placement Direction of Silicon Wafer, Equipment and Medium. This invention was developed by Li Kangkang.
The patent application number is CN202511722852 20251121. T..
Semiconductor
| Tue 14 Jul 2026
Beijing, July 14 -- Jiangxi MTC Semiconductor and Jiangxi Yaochi Tech Co Ltd have submitted a patent application for Led Chip Scanning Method and System. This invention was developed by Wen Guosheng, Jin Conglong, Zhu Bingbing, Xu Zhou and Guo Lei.
The patent application number is CN202511913892 20251218. The patent publicati..
Semiconductor
| Tue 14 Jul 2026
Seoul, July 14 -- FLC and SK Hynix have filed a patent application for Collet Pocket and Collet Stocker. This invention was developed by Jung Sic Kim, Jae Yun Hwang, Sung Wan Kim, Jung Bum Woo and Sung Hee Cho.
The patent application number is KR20230083699 20230628. The patent publication number is KR20250001523 (A). Interna..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Display Substrate and Display Device. This invention was developed by Dong Xue, Yuan Guangcai, Li Xinyu, Sun Yanliu, Li Zhongxiao and Zhao Dejiang.
The patent application number is CN20248001586 20240809. Th..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Zhejiang Geely Holding Group and Zhejiang Shikong Daoyu Tech Co Ltd have filed a patent application for Performance Evaluation System and Performance Evaluation Method of Solar Cell. This invention was developed by Wang Kai.
The patent application number is CN202511819930 20251204. The patent publication n..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- China Mobile Group Design Institute and China Mobile Communications have submitted a patent application for Low-temperature Polycrystalline Silicon Thin Film Preparation Method and Low-temperature Polycrystalline Silicon Thin Film. This invention was developed by Zhang Qixuan, Gao Songtao, Liu Xiaoqing, Ding ..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Shihezi University and Kunming University of Science and Technology have submitted a patent application for Tin Dioxide Electron Transport Layer Regulated and Controlled by Functional Group Functionalized Conjugated Organic Molecules and Application of Tin Dioxide Electron Transport Layer in Positive Perovski..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Chengdu BOE Optoelectronics Technology and BOE Technology Group have submitted a patent application for Display Substrate and Display Device. This invention was developed by Takunaga, He Wei, Zhao Yu, Tan Cheng, Fang Kui, Li Haibo, Yang Xiaoyan, Li Xueping, Xin Yanxia, Lee Seek-ping, Ma Qun, Wang Xiaoyun, Liu..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Jiaxing Research Institute Of Zhejiang University and Zhejiang University have filed a patent application for Organic Solar Cell Based on In-situ Crosslinking Self-assembly Monomolecular Layer and Preparation Method Thereof. This invention was developed by Yang Yang and Jia Ziyan.
The patent application nu..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Guangzhou Research Institute Of Xidian University and Xidian University have sought patent for Low-inductance Silicon Carbide Power Module of Electromagnetic Symmetrical Interconnection Structure. This invention was developed by Jiang Xi, Gong Xiaowu, Li Yanzuo, Liu Yuxin, Yuan Song and Yan Zhaoheng.
The p..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Huizhou Jufei Optoelectronics and Shenzhen Jufei Optoelectronics have submitted a patent application for LED Chip and Preparation Method Thereof. Xing Meizheng, Cheng Peng and Zhang Ni developed the invention.
The patent application number is CN202511911062 20251217. The patent publication number is CN1218..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Gaojing Solar Energy and Qinghai Gaojing Solar Energy Tech Co Ltd have filed a patent application for Back Contact Crystalline Silicon Cell and Preparation Method Thereof. This invention was developed by Zhao Guowei, Qiao Le, Fu Mingquan, Liu Xin and Xu Yao.
The patent application number is CN20251213578 2..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Beijing University and Beijing Intellectual Property Operation Man Co Ltd have sought patent for Stacked Transistor and Preparation Method Thereof, Semiconductor Device and Electronic Equipment. This invention was developed by Peng Wanyue, Cheng Yuji, Wu Heng, Bu Weihai, Wang Runsheng, Li Ming and Huang Ru.
..
Semiconductor
| Tue 14 Jul 2026
Beijing, July 14 -- Beijing Xingyun Integrated Circuit Co Ltd and Xingyun Jiwei Chengdu Tech Co Ltd have sought patent for Access Processing Method and Chip System. This invention was developed by Chang Wei, Ji Yu, Pan Zheng and Yu Hongmin.
The patent application number is CN202511959301 20251223. The patent publication numbe..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has released Anstem Co Ltd patent application for Semiconductor Device. This invention was developed by Osada Shigeru, Takagi Yusuke and Kaneko Yujiro.
The patent application number is CN202380102155 20231121. The patent publication number is CN121844759 (A). Int..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Hynetek Semiconductor Co Ltd has submitted a patent application for Soft Switching Control Method and Soft Switching Control Circuit. This invention was developed by Xie Renjian, Ou Yingyang, Liu Xiang and Feng Teng.
The patent application number is CN202511799019 20251202. The patent publication number is..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Xinmai Semiconductor Tech Hangzhou Co Ltd patent application for Charge Pump Circuit, Control Circuit and Control Method. Lin Lizhi and Zhang Yufei developed the invention.
The patent application number is CN202511945346 20251222. The patent publicat..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Jinwuguangzhao Beijing Energy Tech Co Ltd has applied Chinese patent for Concentrator-solar Cell Integrated Structure and Preparation Method Thereof. Meng Wei developed it.
The patent application number is CN202511854260 20251210. The patent publication number is CN121843341 (A). International Patent Class..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Shenzhen Sitan Technology has submitted a patent application for Miniature Light-emitting Device and Preparation Method Thereof. This invention was developed by Jiang Jianxing and Xie Rui.
The patent application number is CN20261007442 20260106. The patent publication number is CN121843323 (A). Internation..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Shenzhen Sitan Technology patent application for Miniature Light-emitting Device and Manufacturing Method Thereof. Jiang Jianxing and Xie Rui developed the invention.
The patent application number is CN20261007440 20260106. The patent publication num..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Hefei Canxin Tech Co Ltd patent application for On-chip Ripple Compensation Circuit with High Precision and Low Delay. Ni Cancan, Zheng Rui and Yue Qinghua developed the invention.
The patent application number is CN202610313408 20260316. The patent ..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Nanjing Guozhao Photoelectric Tech Co Ltd has submitted a patent application for Low-crosstalk High-efficiency Micro-led and Preparation Method Thereof. This invention was developed by Son Jin Ho, Peng Jingsong, Zhang Wei, Yang Jianbing and Liu Siyao.
The patent application number is CN202511668725 2025111..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has released Shenzhen Sitan Technology patent application for Full-color Miniature Light-emitting Structure and Manufacturing Method. This invention was developed by Wu Tao and Xie Rui.
The patent application number is CN20261001868 20260104. The patent publicati..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Xiamen Sitan Integration Tech Co Ltd patent application for Miniature Led Light-emitting Structure, Miniature Light-emitting Device and Manufacturing Method. Li Yong, Wu Zheng and Guan Yunfang developed the invention.
The patent application number is..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has published Xiamen Sitan Integration Tech Co Ltd patent application for Light-emitting Structure, Miniature Light-emitting Device and Preparation Method of Light-emitting Structure. The invention was developed by Li Yong, Wu Zheng and Qiu Chengfeng.
The patent ..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Fudan University has submitted a patent application for Heterogeneous Integration-based Sensing Memory Unit. Xie Hui, Wan Jing and Zhou Peng developed the invention.
The patent application number is CN202511862905 20251211. The patent publication number is CN121843269 (A). International Patent Classificati..
Semiconductor
| Tue 14 Jul 2026
Beijing, July 14 -- Guojing Hechuang Qingdao Tech Co Ltd has submitted a patent application for Thin Film Substrate Interconnection System of Foldable Display Module. This invention was developed by Zhang Fuxuan, Cui Caoxiang, Wang Shiyu, Guo Baijun, Liu Kangzhong, Lyu Yong and Zhang Chunyang.
The patent application number is..
Semiconductor
| Tue 14 Jul 2026
Seoul, July 14 -- Korean Intellectual Property Office has released Ehwa Diamond Industrial patent application for Polishing Wheel for Improving Surface Roughness of Wafers with High Hardness. This invention was developed by Lee Myung Han, Cho Han Gyoung and Yun Joong Cheul.
The patent application number is KR20230084300 20230..
Semiconductor
| Tue 14 Jul 2026
Seoul, July 14 -- Canon has submitted a patent application for Liquid Discharge Devicemethod for Manufacturing Organic Light Emitting Device and Method for Manipulating Head. Ito Shigeru developed the invention.
The patent application number is KR20240082432 20240625. The patent publication number is KR20250001440 (A). Intern..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has published Taras Co Ltd patent application for Multi-bit High Density Read Only Memory Using Multiple Reference Biases. The invention was developed by Bajic Lubisa.
The patent application number is CN20248048274 20240719. The patent publication number is CN121..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Zhuhai Zero Boundary Integrated Circuit Co Ltd and Gree Electric Appliances, Zhuhai have submitted a patent application for Clock Calibration Circuit and Clock Calibration Method. This invention was developed by Liang Zhuowei, Lin Weifeng, Cui Yizhi, Liu Honghua and Yang Ziyi.
The patent application number..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Jingmi Dianchan Beijing Tech Co Ltd has sought patent for Chip Production Process Based on Microcircuit. This invention was developed by Gao Song and Gao Sanhu.
The patent application number is CN202511914287 20251218. The patent publication number is CN121843564 (A). International Patent Classification co..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Yise Semiconductor Tech Jiangsu Co Ltd has submitted a patent application for Chip Surface Mounting Structure and Surface Mounting Method. This invention was developed by Xu Qingzhang and Wu Gaoyang.
The patent application number is CN20261027783 20260109. The patent publication number is CN121843559 (A). ..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Guangdong Lihong Microelectronics Co Ltd patent application for Method for Improving Reliability of IGBT (insulated Gate Bipolar Translator) Device Working in High-temperature Environment. Zeng Ziyu and Li Bing developed the invention.
The patent app..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Zhuhai Zero Boundary Integrated Circuit Co Ltd and Gree Electric Appliances, Zhuhai patent application for Oscillator Circuit and Microcontroller. Dai Nengxing developed the invention.
The patent application number is CN202511734508 20251124. The pat..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has published Tsinghua University and North Integrated Circuit Tech Innovation Center patent application for Adapter Plate, Preparation Method of Adapter Plate, Processor and Preparation Method of Processor. The invention was developed by Song Chang-myung, Wang Qian..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Shenzhen Langshuai Science and Tech Co Ltd has submitted a patent application for Gallium Oxide Field Effect Transistor and Manufacturing Method Thereof. Wang Fei, Deng Jiayu, Cheng Jianglan, Chen Nini, Meng Xianghui and Zhao Jinyue developed the invention.
The patent application number is CN202511895085 2..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Jiang Yanqin has submitted a patent application for Solar Cell Panel.
The patent application number is CN202311230823 20230922. The patent publication number is CN121841263 (A). International Patent Classification codes are B08B1/00, B08B13/00, B08B3/02, B08B3/14 and H02S40/10. Cooperative Patent Classifi..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Changfei Advanced Semiconductor Wuhan Co Ltd has filed a patent application for Preparation Method of Mask Structure. This invention was developed by Deng Hui and Shi Tianchao.
The patent application number is CN20261037751 20260113. The patent publication number is CN121843500 (A). International Patent Cl..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Shenzhen Wending Juxin Tech Co Ltd has sought patent for Wafer Adsorption Device. This invention was developed by Chen Haixia, Qi Zijun and Huang Wenhao.
The patent application number is CN202511718426 20251120. The patent publication number is CN121843487 (A). International Patent Classification codes are..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Shanghai Yuwei Semiconductor Tech Co Ltd has applied Chinese patent for Clamping and Positioning Device. Xia Yangrui, Feng Risheng, Sun Gang, Zhao He and Duan Lifeng developed it.
The patent application number is CN20261068153 20260119. The patent publication number is CN121843486 (A). International Patent..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- GMC Semiconductor Technology Wuxi Co Ltd has submitted a patent application for Wafer Loading Device and CMP Equipment. This invention was developed by Yang Siyuan, Dang Dong'ao, Wu Junyi, Li Xinbing and Li Xuheng.
The patent application number is CN20251220845 20251230. The patent publication number is CN..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Xi'an ESWIN Silicon Wafer Technology and Xi'an ESWIN Material Technology patent application for Wafer Edge Etching Device and Method Based on Gravity Adaptive Limiting. Cheng Chenchen and Hao Ning developed the invention.
The patent application numbe..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has published Chengdu Scilicon Electric Co Ltd patent application for Chip Bonding Device Capable of Improving Bonding Precision. The invention was developed by Hu Jian.
The patent application number is CN202511682419 20251117. The patent publication number is CN..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Qingdao Jinhuiyuan Electronics Co Ltd has submitted a patent application for Wafer High-temperature Annealing Equipment. This invention was developed by Xu Haitao, Xu Aiqin, Cheng Wenjuan, Li Zhongliang and Li Depeng.
The patent application number is CN202610119133 20260128. The patent publication number i..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Shengjisheng Ningbo Semiconductor Technology patent application for Airflow Control System and Airflow Control Method. Eom Ki-ryoung developed the invention.
The patent application number is CN202511990386 20251226. The patent publication number is C..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Xi'an Longwei Semiconductor Co Ltd has submitted a patent application for Etching, Degumming and Cleaning Integrated Equipment and Etching, Degumming and Cleaning Method. Wang Xin developed the invention.
The patent application number is CN202511967811 20251224. The patent publication number is CN121843457..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Tengyun Chuangxin Semiconductor Mat Shanghai Co Ltd has submitted a patent application for Method for Optimizing Pattern Contour Through Low-temperature Ion Implantation Process. Chen Minteng and Yang Xiujing developed the invention.
The patent application number is CN20251207714 20251229. The patent publi..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Tengyun Chuangxin Semiconductor Mat Shanghai Co Ltd has submitted a patent application for Method for Selectively Regulating and Controlling Pattern Size Through Low-temperature Ion Implantation Process. This invention was developed by Chen Minteng and Yang Xiujing.
The patent application number is CN20251..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Nanjing Dishitai Optoelectronics Tech Co Ltd has submitted a patent application for Preparation Method for Reducing Angle of Inverted Trapezoidal Isolation Column of Photoresist. Ye Ziyun, Xu Yachen, Shi Yongkang and Feng Xiaomeng developed the invention.
The patent application number is CN202511990599 202..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- China Electronics Technology Group Corporation No. 13 Research Institute has submitted a patent application for Transistor Preparation Method and Array Buried Trench Diamond Field Effect Transistor. This invention was developed by Liu Qingbin, Ma Mengyu, He Zezhao, Zhou Chuangjie, Yu Hao, Li Pengyu, Yu Cui an..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has released Jiashan Fudan Research Institute and Fudan University patent application for Complementary Field Effect Transistor Device with Isolation Structure and Preparation Method Thereof. This invention was developed by Gu Hanzhi, Wu Chunlei, Ma Jian, Xia Yiming..
Semiconductor
| Mon 13 Jul 2026
Seoul, July 14 -- Korean Intellectual Property Office has received Celfras Semiconductor Inc patent application for Aerosol Generation Apparatus. Min Dong Jin, Lee Sang Yoon and Song Eun Seok developed the invention.
The patent application number is KR20240182306 20241210. The patent publication number is KR20250002035 (A). I..
Semiconductor
| Tue 14 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has published Shenzhen CEC Greatwall Information Safety System Co Ltd patent application for Memory Bank Fault Analysis Method and Device, Equipment and Storage Medium. The invention was developed by Chen Ruibo and Fu Rudan.
The patent application number is CN202..
Semiconductor
| Tue 14 Jul 2026
Beijing, July 14 -- Silicon Motion Tech Corp has submitted a patent application for Data Storage Device and Memory Controller. This invention was developed by Huang Hancheng.
The patent application number is CN202510128828 20250205. The patent publication number is CN121838842 (A). International Patent Classification codes ar..
Semiconductor
| Tue 14 Jul 2026
Beijing, July 14 -- Silicon Motion Tech Corp has submitted a patent application for Clock Pulse Phase Control Circuit and Electronic Device. Huang Hancheng developed the invention.
The patent application number is CN202510128825 20250205. The patent publication number is CN121838832 (A). International Patent Classification co..
Semiconductor
| Tue 14 Jul 2026
Beijing, July 14 -- BOB Financial Technology has submitted a patent application for Large Model Memory Management and Interaction Method Based on Dynamic Cognitive Map. Bi Lixin developed the invention.
The patent application number is CN202511974737 20251225. The patent publication number is CN121835894 (A). International Pa..
Semiconductor
| Tue 14 Jul 2026
Seoul, July 14 -- Dongguk University Industry-Academic Cooperation Foundation has submitted a patent application for Slant Gate-based High Electron Mobility Transistor. Kim Hyun Seok, Lee Junho, Kangwooseok, Choijun Hyeok and Kimdohyung developed the invention.
The patent application number is KR20230083585 20230628. The pate..
Semiconductor
| Tue 14 Jul 2026
Seoul, July 14 -- Korean Intellectual Property Office has received Invention and Collaboration Laboratory patent application for Semiconductor Structure. Lu Chao Chun developed the invention.
The patent application number is KR20240085776 20240628. The patent publication number is KR20250001468 (A). International Patent Class..
Semiconductor
| Tue 14 Jul 2026
Seoul, July 14 -- UIF University Industry Foundation, Yonsei University has submitted a patent application for Dispatching Method Based on Equipment and Lot Priority and Apparatus Therefor. This invention was developed by Kim Byun Min and Mo Jeong Hoon.
The patent application number is KR20230083815 20230628. The patent publi..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Kyocera Wireless Tech Corporation has sought patent for MEMS Resonator with Coupler. This invention was developed by Sager Erez.
The patent application number is CN20248058582 20240904. The patent publication number is CN121844496 (A). International Patent Classification codes are H03H9/00, H03H9/24 and H0..
Semiconductor
| Mon 13 Jul 2026
Seoul, July 14 -- Korean Intellectual Property Office has published Coorstek GK patent application for Semiconductor Heat Treatment Member. The invention was developed by Ogama Kenta and Doi Kanta.
The patent application number is KR20240085353 20240628. The patent publication number is KR20250003364 (A). International Patent..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Zhongxing Lianhua Tech Beijing Co Ltd has submitted a patent application for Channel Simulation System and Method for Realizing 2ghz Bandwidth Based on RFSOC (radio Frequency System on Chip). This invention was developed by Yang Shengling, Liu Yu, Zhang Bin and Cheng Junqiang.
The patent application number..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has published Chengdu Kingnotion High Tech Co Ltd patent application for Multi-channel Frequency-adjustable Signal Generation System Based on FPGA (field Programmable Gate Array). The invention was developed by Yan Bo, Zhu Min, Deng Yifeng, Wen Xuebin, Zeng Yingchun..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Shanghai Xinxiangcheng Semiconductor Co Ltd has submitted a patent application for Resonant Frequency Locking Circuit Device and Control Method, Equipment, Medium and Product Thereof. This invention was developed by Jin Weidong and Xiao Zhiming.
The patent application number is CN202610313673 20260316. The..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Shanghai Xinxiangcheng Semiconductor Co Ltd has filed a patent application for Frequency Locking Circuit Device and Control Method, Equipment, Medium and Product Thereof. This invention was developed by Jin Weidong and Xiao Zhiming.
The patent application number is CN202610313670 20260316. The patent publi..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Hangzhou Dianzi University has submitted a patent application for High-q-value and High-selectivity Band-pass Filter of Dielectric Integrated Suspension Line Based on LTCC (low Temperature Co-fired Ceramic). This invention was developed by Yang Xinhuan, Wang Gaofeng, Yuan Bo, Su Penghui, Wu Zhanbo and Wen Qin..
Semiconductor
| Tue 14 Jul 2026
Beijing, July 14 -- Huzhou Cixin Electronic Tech Co Ltd has applied Chinese patent for Method and Device for Preparing High-purity High-alpha-phase Silicon Nitride Powder. Li Xiaozhen, Fan Qingyang, Xing Mengjiang, Yang Yuanyuan, Yang Hongyu, Luo Yanling, Chai Liang and Zhang Yifang developed it.
The patent application number..
Semiconductor
| Tue 14 Jul 2026
Beijing, July 14 -- Anshan Angang Iron Oxide Co Ltd has submitted a patent application for Slurry Accelerated Sedimentation Equipment Based on Iron Oxide Powder Silicon Removal Process. Gao Xiang, Zhao Mingtao, Xu Peng, Feng Zhixin, Xiu Weiwei, Zhang Tingjin and Zhou Siqi developed the invention.
The patent application number..
Semiconductor
| Mon 13 Jul 2026
Seoul, July 14 -- Ninebell Co Ltd has submitted a patent application for Ai-based Failure Diagnosis Method of Wafer Transfer Robot. This invention was developed by Lee Young Dae and Hong Su Bin.
The patent application number is KR20230084980 20230630. The patent publication number is KR20250003049 (A). International Patent Cl..
Semiconductor
| Mon 13 Jul 2026
Seoul, July 14 -- Korean Intellectual Property Office has received Hansol IONES patent application for Semiconductor Processing Chamber and Manufacturing Method Thereof. Ji Young Yeon and Kwon Chang Sup developed the invention.
The patent application number is KR20230084769 20230630. The patent publication number is KR2025000..
Semiconductor
| Mon 13 Jul 2026
Seoul, July 14 -- EST Inc has submitted a patent application for Carrier Body for Manufacturing a Large Size Display and Substrate Processing Apparatus for Manufacturing a Large Size Display Therewith. This invention was developed by Kim Young Gon, Lee Nam Hui, Kim Hee Tae, Hyun Min Choul and Kim Dong Woo.
The patent applicat..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Quantum Tech Inc has submitted a patent application for Novel Synthesis of Colloidal Quantum Dot Ink and Application of Colloidal Quantum Dot Ink in Semiconductor Equipment. This invention was developed by Mehta Joshua, He Xin, Wu Congduan, Vasisht Parth and Liu Junpeng.
The patent application number is CN..
Semiconductor
| Mon 13 Jul 2026
Seoul, July 14 -- Korean Intellectual Property Office has published SK Trichem and SK Hynix patent application for 4 4 .precursor Containing Group Iv Transition Metal and Deposition Method of Film Using the Same. The invention was developed by Kim Daeyeong, Kim Daehee, Lee Sang Kyung, Park Yong Joo, Chun Jiseul, Lee Jaechul, Don..
Semiconductor
| Mon 13 Jul 2026
Seoul, July 14 -- Korean Intellectual Property Office has published SK Trichem and SK Hynix patent application for 4 4 .precursor Containing Group Iv Transition Metal and Deposition Method of Film Using the Same. The invention was developed by Kim Daeyeong, Kim Daehee, Kim Han Byul, Lee Sang Kyung, Park Yong Joo, Chun Jiseul, Le..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has released Beijing Feinno Communication Tech Co Ltd patent application for Intelligent Chip Equipment Security Authentication Method and System Based on Quantum Sim Card. This invention was developed by Liu Jinxin.
The patent application number is CN20261096834..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Anhui Yunxi Quantum Tech Co Ltd has applied Chinese patent for Quantum Hybrid Security Chip Based on Integrated Real-time Quantum Random Source and Security Processing Unit and Key Management Method. Tong Yingwei, Deng Xiaopeng, Kan Xuxin and Tong Jianwei developed it.
The patent application number is CN20..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Shenzhen Bositong Tech Co Ltd has submitted a patent application for Encryption Chip Random Mask Generation System and Method for Preventing Side Channel Attack. This invention was developed by Xu Ming.
The patent application number is CN202610272664 20260306. The patent publication number is CN121841595 (..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- State Intellectual Property Office of China has received Huangshan Chip Microelectronics Co Ltd patent application for Method for Filling Through Hole of DPC Ceramic Substrate. Li Li, Wang Minan, Huang Yonghui, Xu Liping, Ye Minqiang and Yu Chengcheng developed the invention.
The patent application number ..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Wuhan Xinchuangyuan Semiconductor Co Ltd has applied Chinese patent for Manufacturing Method Based on Ets Process Lead Etching-back and Packaging Substrate. Liu Hao, Peng Dandan, Li Gang, Zhao Chao and Xu Jingping developed it.
The patent application number is CN20251236578 20251231. The patent publication..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Xi'an Institute Of Space Radio Technology has submitted a patent application for Manufacturing Method of High-flatness Enclosure Frame Welding Area of Copper-based LTCC Substrate. Seo Mi-yeon, Wang Feng, Zhang Ya'nan, Liu Xu, Dong Shanshan, Jia Xuzhou, Dong Yichen and Yang Shicheng developed the invention.
..
Semiconductor
| Tue 14 Jul 2026
Seoul, July 14 -- Korean Intellectual Property Office has released Isac Res Inc patent application for Initiated Chemical Vapor Deposition Apparatus for Depositing High Quality Thin Film Through Buffer Chamber. This invention was developed by Ahn Young Chel, Jeong Seong Jun, Park Hyung Sang, Kwon Iksun and Kwon Hyoug.
The pat..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Guangdong Zhigui Tech Co Ltd has submitted a patent application for Plant Silicon Water Capable of Improving Lipid Metabolism and Preparation Method of Plant Silicon Water. Xu Xiaoguang and Zhu Hanyue developed the invention.
The patent application number is CN202610200702 20260211. The patent publication ..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Robert Bosch Co Limited has applied Chinese patent for Microstructured IC Chip. Scheuerle Andreas, Kaiser Christoph, Rambach Martin, Schmitz Volker, Boy J ยจ 1 Rgen and Tavassollizadeh Ali developed it.
The patent application number is CN202511406006 20250929. The patent publication number is CN121843571 (..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Shgenzhen Zhongke Sihe Tech Co Ltd has filed a patent application for Manufacturing Method of Electromagnetic Shielding Structure for Plane Structure Chip Board-level Plastic Package. This invention was developed by Zhu Jianfang, Ding Kunpeng and Shao Dongdong.
The patent application number is CN2026101528..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- The 43th Research Institute Of China Electronics Technology Group Corporation has filed a patent application for Chip Inversion Structure Based on Thick Film Substrate and Processing Method Thereof. This invention was developed by Liu Junfu, Li Yanlong, Chen Taotao, Tang Chunjiang, Wang Yansheng and Zuo Biao...
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Tianshui 749 Electronic Co Ltd has submitted a patent application for Universal Array Clamp for Automatic Bonding of Metal Ceramic Packaging Integrated Circuit and Bonding Method. This invention was developed by Zhang Yongxiang, Zhao Liangbi, Yan Leyang, Wang Yuhu, Sheng Kangjing, Zhang Chen and Lu Xiangru.
..
Semiconductor
| Mon 13 Jul 2026
Beijing, July 14 -- Jingan Optoelectronics Co Ltd has applied Chinese patent for Silicon Nitride Ceramic Substrate and Preparation Method Thereof, Metallized Substrate and Semiconductor Device. Zeng Baixiang, Luo Jiancheng, Zhang Jiahao, Xie Binhui and Hong Jiayue developed it.
The patent application number is CN202511783464 ..
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