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13:31:58 Wed 29 Apr 2026

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Samsung Electronics

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(45)

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(42)

(35)

(30)

(29)

ChangXin Memory Technolog

(24)

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(23)

Mitsubishi Electric

(21)

Texas Instruments Incorpo

(20)

Sandisk Technology

(18)

(17)

Huawei Technologies

(15)

Taiwan Semiconductor Manu

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(14)

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(13)

Hefei Nexchip Integrated

(10)

Kokusai Electric

(10)

Semiconductor Energy Labo

(10)

(9)

United Microelectronics C

(9)

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(8)

(8)

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(8)

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Beijing NAURA Microelectr

(7)

(7)

Infineon Technologies, Au

(7)

(7)

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(7)

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(6)

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(6)

(6)

(6)

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(6)

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(5)

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GlobalFoundries

(5)

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(5)

Huahong Semiconductor, Wu

(5)

Huazhong University of Sc

(5)

(5)

Qingdao Besland Semicondu

(5)

Semiconductor Components

(5)

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(5)

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(5)

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(5)

Tokyo Electron Ltd [jp];

(5)

ACM Research, Shanghai

(4)

Beijing Baogang Steel Tec

(4)

Everest Semiconductor Co

(4)

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(4)

IRICO Hefei LCD Glass

(4)

Jiangsu Tianxin Micro Sem

(4)

Konico Semiconductor Tech

(4)

Nanya Technology

(4)

(4)

(4)

Rongyao Terminal

(4)

Shandong Huaguang Optoele

(4)

Silicon Storage Technolog

(4)

Texas Instruments

(4)

Tokyo Electron Ltd [jp];

(4)

Wuhan China Star Optoelec

(4)

Zhejiang Chuangxin Integr

(4)

(3)

Adeia Semiconductor Bondi

(3)

Beijing ESWIN Computing T

(3)

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(3)

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(3)

(3)

Fujian Jinhua Integrated

(3)

Guangzhou China Star Opto

(3)

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(3)

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(3)

Horizon Zhengcheng Shangh

(3)

Huahong Semiconductor Mfg

(3)

Huahong Semiconductor, Wu

(3)

Huahong Semiconductor, Wu

(3)

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(3)

KYB Corporation

(3)

(3)

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(3)

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(3)

Nuvoton Technology Japan

(3)

Panasonic Intellectual Pr

(3)

Putian University

(3)

(3)

Renesas Electronics

(3)

Research Institute China

(3)

SCREEN Holdings

(3)

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(3)

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(3)

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(3)

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(3)

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(3)

(3)

(3)

Sumitomo Electric Industr

(3)

Tokuyama Corporation

(3)

Tsinghua University

(3)

Vanguard International Se

(3)

Wuhan University

(3)

Wuhan Xinxin Semiconducto

(3)

Xidian University

(3)

Yongjiang Laboratory

(3)

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(3)

Zing Semiconductor

(3)

(2)

(2)

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(2)

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(2)

Anhui University

(2)

(2)

BOE Technology Group Co L

(2)

Beijing Guolian Wanzhong

(2)

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(2)

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(2)

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(2)

Black Semiconductor Gmbh

(2)

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(2)

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(2)

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(2)

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(2)

China Electronics Technol

(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

Haiguang Yunxin Integrate

(2)

Hangzhou Dianzi Universit

(2)

(2)

Hefei Huayu Semiconductor

(2)

Hefei Kaimeng Tech Co Ltd

(2)

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(2)

Hengshuo Semiconductor (H

(2)

(2)

Hoya Lens Thailand

(2)

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(2)

Huawei Tech Co Ltd [cn];

(2)

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(2)

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(2)

(2)

(2)

Institute of Semiconducto

(2)

JCET Xingke Chippac Korea

(2)

Jade Bird Display, Shangh

(2)

Jian Yushun New Mat Co Lt

(2)

Jiangsu Punuowei Electron

(2)

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(2)

Jiangsu University

(2)

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(2)

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(2)

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(2)

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(2)

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(2)

Kk Toshiba [jp]; Toshiba

(2)

(2)

Lontium Semiconductor Hef

(2)

(2)

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(2)

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(2)

Morgan Advanced Materials

(2)

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(2)

NAMICS Corporation

(2)

(2)

(2)

Nanchang University; Nanc

(2)

Nanjing University

(2)

(2)

(2)

Ningbo Alpha Semiconducto

(2)

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(2)

Powerchip Semiconductor M

(2)

Qingyuan Huigu New Materi

(2)

Quanzhou Sanan Semiconduc

(2)

(2)

(2)

Samsung Display

(2)

Schaeffler Technologies A

(2)

(2)

Shandong Jingcheng New Ma

(2)

Shanghai Awinic Technolog

(2)

Shanghai Institute of Mic

(2)

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(2)

Shanghai University

(2)

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(2)

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(2)

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(2)

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(2)

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(2)

Shenzhen Shengweixu Techn

(2)

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(2)

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(2)

Shenzhen Zhiwei Electroni

(2)

Shinko Electric Industrie

(2)

Silergy Semiconductor Tec

(2)

Southeast University

(2)

Spreadtrum Semiconductor

(2)

Stanley Electric

(2)

(2)

Stelight Instrument

(2)

Suanmiao Tech Beijing Co

(2)

Suzhou Zhongrui Hongxin S

(2)

(2)

(2)

The 10th Research Institu

(2)

The Research Foundation f

(2)

Univ Tohoku [jp]; Nat Ins

(2)

Winbond Electronics

(2)

(2)

Wuxi Micro Nano Core Elec

(2)

Wuxi Nce Power Co Ltd

(2)

Wuyuan Semiconductor Tech

(2)

Xi\'an Jiaotong Universit

(2)

Xiamen University

(2)

Xiamen University; Wuxi C

(2)

Xinai Tech Nanjing Co Ltd

(2)

Yangtze Memory Tech Holdi

(2)

Yangzhou University

(2)

Zhejiang Ruijing Microele

(2)

Zhejiang Runhe Organicsil

(2)

Zhejiang Xinwei Taike Sem

(2)

Zhongke Chaoxin Zhejiang

(2)

Zhuhai Smart Ware Tech Co

(2)

3peak Incorporated

(1)

58th Research Institute o

(1)

ACM Research, Shanghai; S

(1)

AECC Shenyang Engine Rese

(1)

AGH University of Science

(1)

ASM International Holding

(1)

ASML Netherlands; Trumpf

(1)

(1)

AU Optronics Kunshan Co L

(1)

AUO Corporation

(1)

(1)

Accelink Technologies; Wu

(1)

Advanced Micro-Fabricatio

(1)

Advanced Printed Electron

(1)

Advanced Semiconductor En

(1)

(1)

Alithia Power Inc

(1)

Amber Semiconductor Inc

(1)

Ams Osram Int Gmbh [de];

(1)

Analog Devices Internatio

(1)

Angell Tech Shenzhen Co L

(1)

Anhui Changyuan New Mat C

(1)

Anhui Guangshineng New En

(1)

Anhui Jieshitu New Mat Co

(1)

Anhui Jixin Microelectron

(1)

Anhui University; Hefei N

(1)

Anhui Xindong Lianke Micr

(1)

Aotong Carbon Neijiang Te

(1)

Applied Mat Inc [us]; Lu

(1)

Applied Materials Inc (a

(1)

Applied Materials Israel

(1)

Artmem Tech Co Ltd

(1)

(1)

Atomic Soil Llc

(1)

Avago Technologies Intern

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Technology Group Co L

(1)

BOE Technology Group Co L

(1)

BOE Technology Group; Che

(1)

BOE Technology Group; Yun

(1)

(1)

BYD Company; Huizhou Byd

(1)

(1)

BeiJing REJE Automation

(1)

Beijing Automotive Resear

(1)

Beijing BRIO Electronic T

(1)

Beijing Boe Tech Developm

(1)

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(1)

Beijing Chaoxian Memory R

(1)

Beijing Dunsi Integrated

(1)

Beijing Fengmo Photoelect

(1)

Beijing Fortune Precision

(1)

Beijing Gang Yan Diamond

(1)

Beijing Heqi Precision Te

(1)

Beijing Huacheng Electron

(1)

Beijing Inst Of Smart Ene

(1)

Beijing Institute of Mech

(1)

Beijing Intellectual Prop

(1)

Beijing Intellectual Prop

(1)

Beijing Jingyi Automation

(1)

Beijing Juexin Biological

(1)

Beijing Memblaze Tech Co

(1)

Beijing Mxtronics Corp; B

(1)

Beijing Semiconductor Spe

(1)

Beijing Shengwang Shiji C

(1)

Beijing Suplet Power Co L

(1)

Beijing Toyou Feiji Elect

(1)

Beijing Xingchen Weilai S

(1)

Beijing Xinyong Jingda Te

(1)

Beijing Yaoneng Tech Co L

(1)

Beijing Zesheng Tech Co L

(1)

Beijing Zhijiao Heyi Tech

(1)

(1)

Booz Allen Hamilton

(1)

Bosch Huayu Steering Syst

(1)

Brooks Automation US

(1)

CNPC Greatwall Drilling;

(1)

Cambridge GaN Devices

(1)

Capt Semiconductor Shangh

(1)

Carbon Chip Microelectron

(1)

(1)

(1)

Changchun Institute of Op

(1)

Changchun University of S

(1)

Changde Pinchuangyuan Bio

(1)

Changfei Advanced Semicon

(1)

Changmai Semiconductor Ch

(1)

Changzhou Jianuo Silicone

(1)

Changzhou Nachuang Semico

(1)

Changzhou Well-Technologi

(1)

Changzhou Yuanjing Moer M

(1)

Changzhou Zhengbo Intelli

(1)

Chendian Tech Shanghai Co

(1)

Chengdu Boe Display Tech

(1)

Chengdu Boe Optoelectroni

(1)

Chengdu Gaozhen Technolog

(1)

Chengdu Hongke Electronic

(1)

Chengdu Jingxin Mingneng

(1)

Chengdu Pbm Tech Ltd

(1)

Chengdu Shujun Microelect

(1)

Chengdu Weiguang Jidian T

(1)

Chengdu Yunyi Zhichuang T

(1)

Chenling Semiconductor Ji

(1)

China Electronic Technolo

(1)

China Electronics Tech Gr

(1)

China Jiliang University

(1)

China Mobile Group Henan

(1)

China Nat Machinery Insti

(1)

China University of Minin

(1)

Chint New Energy Technolo

(1)

Chipmore Technology; Hefe

(1)

Chipsea Tech Shenzhen Cor

(1)

Chipsea Technology Shenzh

(1)

Chipsea Technology Shenzh

(1)

Chiyoda; National Univ Co

(1)

Chongqing Sanan Semicondu

(1)

Chongqing Xinhui Material

(1)

Chongqing Xinlian Microel

(1)

Chongqing Yineng Tech Co

(1)

Chongqing Yuanshi Intelli

(1)

Chongqing Yuntong Technol

(1)

Chongqing Zhongrun New Ma

(1)

(1)

Chuangyou Digital Tech Gu

(1)

Cig Shanghai Co Ltd; Zhej

(1)

Cirrus Logic Internationa

(1)

City University of Hong K

(1)

Clp Keshentai Information

(1)

(1)

Coligen China Corp

(1)

Commissariat A Lenergie A

(1)

Commissariat a l’Energi

(1)

(1)

(1)

Cr Runan Tech Chongqing C

(1)

Crrc Zhuzhou Institute; C

(1)

Cypress Semiconductor Cor

(1)

Dainippon Printing

(1)

Dalian University of Tech

(1)

Danyang Ruilin Auto Parts

(1)

Dareway Software Co Ltd

(1)

Deca Technologies

(1)

Delft University of Techn

(1)

(1)

(1)

Deqing Chuangzhi Tech Co

(1)

Dexerials Corporation; Un

(1)

Dianxi Industrial Develop

(1)

Dingji Tech Co Ltd

(1)

Diodes Incorporated

(1)

(1)

(1)

Dongfang Jingyuan Microel

(1)

Dongguan Hongyuen Electro

(1)

Dongguan Institute Of Opt

(1)

Dongguan Langxuan Electro

(1)

Dongguan Lizhi Grinding T

(1)

Dongguan Shenye Jingge Te

(1)

Duntai Electronics Shenzh

(1)

(1)

East China Normal Univers

(1)

Edsn Holding Llc

(1)

Elane Beijing Data Tech C

(1)

Electric Power Research I

(1)

Elite Semiconductor Micro

(1)

(1)

Enkris Semiconductor

(1)

Epiroc Rock Drills

(1)

(1)

Excelliance Mos Corp

(1)

(1)

Fakeeyes Co Ltd

(1)

(1)

Faraday Technology

(1)

(1)

(1)

Foshan Guoxing Electronic

(1)

Foshan Zhenzhi Microchip

(1)

Fremont Micro Devices (Sh

(1)

Fs Semi Semiconductor Cor

(1)

Fujian Hongguang Semicond

(1)

Fujian Jingxu Semiconduct

(1)

(1)

Fujimi Incorporated

(1)

Fuzhou College Foreign St

(1)

(1)

GCL System Integration Te

(1)

Ganghua Energy Chuangke S

(1)

Gannan Medical University

(1)

Gansu Changfeng Electroni

(1)

Gansu Inst Of Ecological

(1)

Geke Microelectronics Zhe

(1)

Gene Target Tech Co Ltd

(1)

Gewu Ganzhi Shenzhen Tech

(1)

Gfd Diamond Products Ltd;

(1)

Gigadevice Semiconductor

(1)

Global Unichip Corp [tw];

(1)

Global Unichip; Taiwan Se

(1)

Globalfoundries Dresden M

(1)

Goode Eis Suzhou Corp Ltd

(1)

(1)

Gree Electric Appliances,

(1)

Guangdong Haoningda Ind C

(1)

Guangdong Hetong Technolo

(1)

Guangdong Jinwan Gaojing

(1)

Guangdong Lingguang New M

(1)

Guangdong Nano Smart Mfg

(1)

Guangdong Xincheng Hanqi

(1)

Guangdong Yongzhuo Tech C

(1)

Guangxi Pengyue Ecologica

(1)

Guangzhou Dajin Automatio

(1)

Guangzhou Guangda Innovat

(1)

Guangzhou Leyi Invest Co

(1)

Guangzhou Tekong Electron

(1)

Guangzhou Tongze Tech Co

(1)

Guangzhou Xianyi Electron

(1)

Guangzhou Zhongnuo Microe

(1)

Guilin Star Diamond Super

(1)

Guilin University of Elec

(1)

Guizhou Zhongxin Microele

(1)

Guo Neng Long Yuan Enviro

(1)

Guoci Saichuang Electric

(1)

Guojing Hechuang Qingdao

(1)

Gwangju Institute of Scie

(1)

HGC Wuhan Technology; HGC

(1)

Haiguang Information Tech

(1)

Haiguang Information Tech

(1)

Hainan Normal University;

(1)

Hangzhou Angkun Semicondu

(1)

Hangzhou Anpu Tech Co Ltd

(1)

Hangzhou Cobetter Semicon

(1)

Hangzhou Dahe Thermo-Magn

(1)

Hangzhou Guzi Culture Tec

(1)

Hangzhou Hongying Digital

(1)

Hangzhou Xinyun Semicondu

(1)

Hannam Univ Industry Acad

(1)

Hanwha Chemical Corp

(1)

(1)

He Chou Tech Inc

(1)

Hebei Dingci Electronic T

(1)

Hebei Mingchi Tech Co Ltd

(1)

Hebei Saihan Metal Produc

(1)

Hebei University

(1)

Hebei University of Techn

(1)

Hefei Aichuang Microelect

(1)

Hefei Chipsea Electronic

(1)

Hefei Fengzhiyi Semicondu

(1)

Hefei Institutes of Physi

(1)

Hefei Reliance Memory

(1)

Hefei Shanhai Semiconduct

(1)

Hefei University of Techn

(1)

Hefei University of Techn

(1)

Hefei Visionox Technology

(1)

Hefei Zhenping Electronic

(1)

Hehua Ind Co Ltd

(1)

Heilongjiang Huixin Semic

(1)

Heilongjiang University

(1)

Henan Dadanjiang Tech Co

(1)

Henan Normal University

(1)

Henan Ximei Tech Co Ltd

(1)

Henan Yalian New Mat Co L

(1)

Hesheng Silicon Ind Jiaxi

(1)

Hewlett Packard Developme

(1)

Hf Smat Microtech Company

(1)

Highline Tech Gmbh

(1)

Highview Innovation Tech

(1)

(1)

Hohai University; Nanjing

(1)

Home Control Singapore

(1)

Hongrun Semiconductor (Su

(1)

Hongyuan New Materials, X

(1)

Hoya Lens Thailand Ltd [t

(1)

Huaguan Semiconductor Hey

(1)

Huahong Semiconductor Mfg

(1)

Huahong Semiconductor, Wu

(1)

Huahong Semiconductor, Wu

(1)

Huangshan Qimen Xinfei El

(1)

Huasheng Micro Jiangyin S

(1)

Huatong Xindian Shanghai

(1)

Huazhong University of Sc

(1)

Hubei Guoxin Juzhi New Ma

(1)

Hubei Wuzhou New Material

(1)

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(1)

Hubei Xintao Tech Co Ltd

(1)

(1)

Huineng Microelectronic T

(1)

Huiyongjin Photoelectric

(1)

Huizhou Xingao Intelligen

(1)

Hunan Liangang Electromag

(1)

Hunan Shaohong Special Gl

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Hunan Shiguang Diamond Te

(1)

Hunan Yuemo Advanced Semi

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Huzhou Chunhuo Photoelect

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Hygon Information Technol

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Hypervision Surgical Ltd

(1)

ICleague Technology

(1)

IUCF-HYU Industry-Univers

(1)

(1)

(1)

(1)

Im2 Solutions Inc

(1)

Imax Osram Int Bv

(1)

Industry Foundation of Ch

(1)

Infineon Tech Canada

(1)

InfoVision Optoelectronic

(1)

Ingenic Semiconductor Co

(1)

Inner Mongolia University

(1)

(1)

Innovative Electronics Co

(1)

Institute Flexible Electr

(1)

Institute Of New Display

(1)

Institute of Applied Chem

(1)

Institute of Computing Te

(1)

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Int Business Machines Cor

(1)

Intel Ndtm Us Llc [us]; C

(1)

(1)

JSR Corp [jp]; Univ Tokyo

(1)

JSR Corporation

(1)

(1)

Jcet Man Co Ltd

(1)

Jcet Microelectronics Jia

(1)

Ji Hua Laboratory; Shenzh

(1)

Jianghuai Frontier Techno

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Jiangshan Huashun Organic

(1)

Jiangsu Aisen Semiconduct

(1)

Jiangsu Aisen Semiconduct

(1)

Jiangsu Difeida Electroni

(1)

Jiangsu Dongxu Electronic

(1)

Jiangsu Fiber Grid

(1)

Jiangsu Fulate Semiconduc

(1)

Jiangsu Fulehua Power Sem

(1)

Jiangsu Fulehua Semicondu

(1)

Jiangsu Haigude Semicondu

(1)

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(1)

Jiangsu Hengxin Quartz Te

(1)

Jiangsu Jiayun New Mat Co

(1)

Jiangsu Jiazhao Electroni

(1)

Jiangsu Pangu Semiconduct

(1)

Jiangsu Runpeng Semicondu

(1)

Jiangsu Shanshui Semicond

(1)

Jiangsu Shekoy Semiconduc

(1)

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(1)

Jiangsu Solidepu Semicond

(1)

Jiangsu Szyy Group Medica

(1)

Jiangsu Tianke Heda Semic

(1)

Jiangsu Xinyang Electroni

(1)

Jiangsu Youpuna Tech Co L

(1)

Jiangsu Zhongkun Intellig

(1)

Jiangsu Zhongleixin Semic

(1)

Jiangxi Chaolian Semicond

(1)

Jiangxi Hankefan Semicond

(1)

Jiangxi Liankai Tech Co L

(1)

Jiangxi Mubang Hi-Tech; G

(1)

Jiangxi Shanxu Prec Circu

(1)

Jiangxi University of Sci

(1)

Jiangxi Xinjiayi New Mat

(1)

Jiangxi Yuhongjin Electro

(1)

Jiangyin Changdian Advanc

(1)

Jilin Optical & Electroni

(1)

Jilin Yuntou Laisengou Di

(1)

Jinan Qianrui Xinguang Ne

(1)

Jinan University

(1)

Jingjian Semiconductor Ch

(1)

Jingjiang Hongyang Machin

(1)

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(1)

Jingxin Semiconductor Hua

(1)

Jinhao Motor Tech Suzhou

(1)

Jinko Solar Holding Co Lt

(1)

Jinko Solar; Jinko Solar

(1)

John Mezzalingua Associat

(1)

Jrh Tech Quzhou Co Ltd

(1)

(1)

Junper Ningbo Tech Corp

(1)

Keiron Printing Tech B V

(1)

Kim Min Sun; Groeben Tech

(1)

Kimberly Clark Worldwide

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Kk Toshiba [jp]; Toshiba

(1)

Koppers Performance Chemi

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Korea University Research

(1)

Kriisa United Llc

(1)

Kulicke & Soffa Ind Inc

(1)

Kungao Xinxin Microelectr

(1)

Kunlun Core Beijing Tech

(1)

Kunming Institute of Zool

(1)

Kunming University of Sci

(1)

Kunshan Hongma Automation

(1)

Kunshan Weiaite Electrica

(1)

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Hypervision Surgical Ltd and King's College London Seek Patent for a Method and Aparatus for Calibrating Pixel Sensitivity for Pixels of a Hyperspectral Image Sensor

Semiconductor

| Wed 29 Apr 2026

Munich, April 29 -- Hypervision Surgical Ltd and King's College London have sought patent for a Method and Aparatus for Calibrating Pixel Sensitivity for Pixels of a Hyperspectral Image Sensor. This invention was developed by Bahl Anisha, Janatka Mirek, Vercauteren Tom, Shapey Jonathan, Bergholt Mads and Horgan Conor. The pat..

BOE Technology Group Co Ltd and Chongqing BOE Display Technology Submit Patent Application for Display Substrate and Display Apparatus

Semiconductor

| Wed 29 Apr 2026

Munich, April 29 -- BOE Technology Group Co Ltd and Chongqing BOE Display Technology have submitted a patent application for Display Substrate and Display Apparatus. He Xiaoling, Zeng Chao, Wang Rui, Hu Ming, Zhang Shouqiang and Zhang Runxin developed the invention. The patent application number is EP20250751088 20250114. The..

Pxp Corp and SOLABLE Submit Patent Application for Thin Film Solar Cell and Method for Manufacturing Thin Film Solar Cell

Semiconductor

| Wed 29 Apr 2026

Munich, April 29 -- Pxp Corp and SOLABLE have submitted a patent application for Thin Film Solar Cell and Method for Manufacturing Thin Film Solar Cell. Sugimoto Hiroki and Hirai Yoshiaki developed the invention. The patent application number is EP20240823300 20240606. The patent publication number is EP4726783 (A1). Cooperat..

University Tohoku, Nat Institute Inf & Comm Tech and Shinetsu Chemical Apply for Patent on Transistor, Method for Manufacturing Same, and Integrated Circuit

Semiconductor

| Wed 29 Apr 2026

Munich, April 29 -- University Tohoku, Nat Institute Inf & Comm Tech and Shinetsu Chemical have applied European patent for Transistor, Method for Manufacturing Same, and Integrated Circuit. Fukidome Hirokazu, Watanabe Issei, Kawahara Minoru, Akiyama Shoji, Tobisaka Yuji and Kawai Makoto developed it. The patent application n..

Tokyo Electron Ltd and Tokyo Electron US Holdings Seek Patent for Semiconductor Devices and Methods to Reduce Contact Resistivity in Semiconductor Devices

Semiconductor

| Wed 29 Apr 2026

Geneva, April 29 -- Tokyo Electron Ltd and Tokyo Electron US Holdings have sought patent for Semiconductor Devices and Methods to Reduce Contact Resistivity in Semiconductor Devices. This invention was developed by Otsuki Sara, Chin Hidenori and Sakuma Takashi. The patent application number is WO2025US44546 20250902. The pate..

South China Normal University and Guangxian Tech Guangdong Co Ltd Submit Patent Application for Substrate for Electrowetting Equipment and Preparation Method Thereof

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- South China Normal University and Guangxian Tech Guangdong Co Ltd have submitted a patent application for Substrate for Electrowetting Equipment and Preparation Method Thereof. Sun Hailing, Xiao Yuxian, Yuan Si, Fan Junpeng, Chen Hongqing and Zhou Guofu developed the invention. The patent application numb..

Tokyo Electron Ltd and Tokyo Electron US Holdings Submit Patent Application for Methods for Conditioning a Surface Prior to Etching to Optimize Etch Performance

Semiconductor

| Wed 29 Apr 2026

Geneva, April 29 -- Tokyo Electron Ltd and Tokyo Electron US Holdings have submitted a patent application for Methods for Conditioning a Surface Prior to Etching to Optimize Etch Performance. Abel Kate developed the invention. The patent application number is WO2025US40290 20250801. The patent publication number is WO20260847..

Tsinghua University and Quechen Silicon Chemical File Chinese Patent Application for Rapid Synthesis Method of Molecular Sieve Based on Cheap Silicon Source

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Tsinghua University and Quechen Silicon Chemical have filed a patent application for Rapid Synthesis Method of Molecular Sieve Based on Cheap Silicon Source. This invention was developed by Liu Zhendong, Jia Kai, Zhao Yihao, Shao Mingyuan, Que Weidong, Mao Shanbing, Wang Yongqing and Yu Fangqi. The patent..

Jiangsu Hengxin Quartz Tech Co Ltd, Jiangsu Hengtong Photoelectric Stock and Jiangsu Hengtong Photoconductive New Mat Co Ltd Submit Chinese Patent Application for Device and Method..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Jiangsu Hengxin Quartz Tech Co Ltd, Jiangsu Hengtong Photoelectric Stock and Jiangsu Hengtong Photoconductive New Mat Co Ltd have submitted a patent application for Device and Method for Preparing Deep Ultraviolet Light Mask Quartz Glass Substrate. This invention was developed by Wu Longbo, Xiao Hua, Zhong Y..

Ningbo Hengxin Biotechnology Co Ltd and Shanghai Hengxin Biotechnology Ltd File Chinese Patent Application for Digital Micro-fluidic Chip and Integrated Sequencing System and Metho..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- Ningbo Hengxin Biotechnology Co Ltd and Shanghai Hengxin Biotechnology Ltd have filed a patent application for Digital Micro-fluidic Chip and Integrated Sequencing System and Method. This invention was developed by Wu Chuanyong, Zhou Li and Wang Zhifang. The patent application number is CN202410794788 202..

Guo Neng Long Yuan Environmental, Guoneng Longyuan Catalyst Jiangsu Co Ltd and Guoneng Longyuan Inner Mongolia Environmental Prot Co Ltd Submit Chinese Patent Application for Metho..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Guo Neng Long Yuan Environmental, Guoneng Longyuan Catalyst Jiangsu Co Ltd and Guoneng Longyuan Inner Mongolia Environmental Prot Co Ltd have submitted a patent application for Method for Preparing Silicon Powder by Using Retired Wind Power Blade. This invention was developed by Liu Xianghui, Lu Jinfeng, Lu ..

Xiamen University and Wuxi China Resources Microelectronics Co Ltd Apply for Patent on Method for Improving Sensitivity of MEMS Silicon Carbide Capacitive Pressure Sensor by Using ..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Xiamen University and Wuxi China Resources Microelectronics Co Ltd have applied Chinese patent for Method for Improving Sensitivity of MEMS Silicon Carbide Capacitive Pressure Sensor by Using High Dielectric Constant Film. Wang Jianbo, Huang Wei, Chen Songyan, Li Shaoping, Jin Wenchao, Yan Kai and Zhu Enchen..

Institute Of New Display Tech Henan Academy Of Sciences and Henan Academy Sciences File Chinese Patent Application for Quantum Dot Light Emitting Diode Device and Manufacturing Met..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Institute Of New Display Tech Henan Academy Of Sciences and Henan Academy Sciences have filed a patent application for Quantum Dot Light Emitting Diode Device and Manufacturing Method Thereof. This invention was developed by Tang Zhaobing, Zhou Ziming, Zhou Dexia, Li Ning, Liang Shanshan, Liao Zhibo, Sun Xia..

East China Normal University and Chongqing Institute Of East China Normal University Submit Chinese Patent Application for Ito Nanoparticle Self-assembled Stable Trans-perovskite S..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- East China Normal University and Chongqing Institute Of East China Normal University have submitted a patent application for Ito Nanoparticle Self-assembled Stable Trans-perovskite Solar Cell. This invention was developed by Fang Junfeng, Li Xiaodong and Feng Bo. The patent application number is CN2025113..

HGC Wuhan Technology and HGC Zhangjiagang Semiconductor Seek Patent for High-brightness Flip Led Chip and Preparation Method Thereof

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- HGC Wuhan Technology and HGC Zhangjiagang Semiconductor have sought patent for High-brightness Flip Led Chip and Preparation Method Thereof. This invention was developed by Guo Jiaqi, Xu Xiaoli, Liu Fang, Fang Hua and Sun Leimeng. The patent application number is CN202511449643 20251011. The patent public..

Huasheng Micro Jiangyin Semiconductor Co Ltd and Jiangsu Zhongshengwei Tech Co Ltd Submit Patent Application for Back Contact Solar Cell Edge Passivation Process

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Huasheng Micro Jiangyin Semiconductor Co Ltd and Jiangsu Zhongshengwei Tech Co Ltd have submitted a patent application for Back Contact Solar Cell Edge Passivation Process. Li Sen, Niu Xinwei, Bai Xingliang, Zhou Bo, Zhang Jianzhong and Cao Mengrong developed the invention. The patent application number i..

Beijing Gang Yan Diamond Products Company and Advanced Technology & Materials Apply for Patent on Drill Bit Tool Bit for Silicon Carbide Drawing-out and Preparation Method and Appl..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Beijing Gang Yan Diamond Products Company and Advanced Technology & Materials have applied Chinese patent for Drill Bit Tool Bit for Silicon Carbide Drawing-out and Preparation Method and Application of Drill Bit Tool Bit. Xu Qiang, Liu Yibo, Yin Xiang, Shu Huixing, Yang Zhiwei, Luo Xiaoli and Xu Yanjun deve..

Shenyang Ruisheng Precision Manufacturing and Konfoong Material International Submit Chinese Patent Application for Groove Width Repairing Method of Semiconductor Cavity Sealing Gr..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Shenyang Ruisheng Precision Manufacturing and Konfoong Material International have submitted a patent application for Groove Width Repairing Method of Semiconductor Cavity Sealing Groove and Knocking Tool. This invention was developed by Yao Lijun, Ping Haijun, Zhang Tongbin, Yuan Haijun, Dong Zhiqing, Ran Q..

BOE Technology Group Co Ltd and Chengdu BOE Optoelectronics Technology Apply for Patent on Display Substrate and Display Apparatus

Semiconductor

| Tue 28 Apr 2026

Munich, April 29 -- BOE Technology Group Co Ltd and Chengdu BOE Optoelectronics Technology have applied European patent for Display Substrate and Display Apparatus. Song Gukhwan, Gao Wenhui, Guo Yonglin, Zhang Tiaomei, Lee Youngjang and Hu Ming developed it. The patent application number is EP20230950034 20230828. The patent ..

Shenzhen Xinbanghui Hardware Products Co Ltd Seeks Patent for CNC (computer Numerical Control) Machining Clamping Fixture for LED (light Emitting Diode) Box Body

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Shenzhen Xinbanghui Hardware Products Co Ltd has sought patent for CNC (computer Numerical Control) Machining Clamping Fixture for LED (light Emitting Diode) Box Body. This invention was developed by Sui Yuxuan, Qu Chaohui and Xu Huanghuang. The patent application number is CN202511651420 20251112. The pa..

State Intellectual Property Office of China Receives Dareway Software Co Ltd Patent Application for Secure Multi-party Computing Method and System in Memory Limited Environment

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has received Dareway Software Co Ltd patent application for Secure Multi-party Computing Method and System in Memory Limited Environment. Li Qingzhong, Zheng Yongqing, Min Xinping, Yi Li, Yu Guoxian, Li Xinyun, Chen Bowen, Gui Xiaoqiang and Wang Jun developed the i..

European Patent Office Publishes Proasia Semiconductor Corp Patent Application for Semiconductor Device

Semiconductor

| Wed 29 Apr 2026

Munich, April 29 -- European Patent Office has published Proasia Semiconductor Corp patent application for Semiconductor Device. The invention was developed by Kuo Ming-chi and Lee Wen-chung. The patent application number is EP20250171993 20250423. The patent publication number is EP4727291 (A1). International Patent Classifi..

European Patent Office Publishes Topologic Inc Patent Application for Semiconductor Module, Abnormality Determination System, and Abnormality Determination Method

Semiconductor

| Wed 29 Apr 2026

Munich, April 29 -- European Patent Office has published Topologic Inc patent application for Semiconductor Module, Abnormality Determination System, and Abnormality Determination Method. The invention was developed by Takahashi Arata. The patent application number is EP20240819358 20240605. The patent publication number is E..

Tianxing Shuke Tech Co Ltd Seeks Patent for Image Acquisition Method and Device, Electronic Equipment, Chip and Medium

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Tianxing Shuke Tech Co Ltd has sought patent for Image Acquisition Method and Device, Electronic Equipment, Chip and Medium. This invention was developed by Zhang Yin, Wei Liang, Liu Shuang, Liu Shuwen and Zhang Kejing. The patent application number is CN202410772742 20240614. The patent publication numbe..

Highview Innovation Tech Co Ltd Submits Chinese Patent Application for Image Chip Focusing Assembly and Camera Module

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Highview Innovation Tech Co Ltd has submitted a patent application for Image Chip Focusing Assembly and Camera Module. This invention was developed by Mai Lianzhi and Li Jing. The patent application number is CN202511458307 20251013. The patent publication number is CN121151666 (A). International Patent C..

State Intellectual Property Office of China Releases Jiangsu Runpeng Semiconductor Co Ltd Patent Application for Auxiliary Welding Device for Chip Packaging

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Jiangsu Runpeng Semiconductor Co Ltd patent application for Auxiliary Welding Device for Chip Packaging. This invention was developed by Xu Ran and Wang Hui. The patent application number is CN202511281904 20250909. The patent publication number is ..

Yangtze Memory Technologies Submits European Patent Application for Input Buffer in Memory Devices and Memory Systems

Semiconductor

| Wed 29 Apr 2026

Munich, April 29 -- Yangtze Memory Technologies has submitted a patent application for Input Buffer in Memory Devices and Memory Systems. This invention was developed by Yang Tao, Lee Byoung Woon, Xie Shu and Chen Jiawei. The patent application number is EP20240785966 20240830. The patent publication number is EP4728517 (A1)...

European Patent Office Receives Yangtze Memory Technologies Patent Application for Memory Devices and Methods for Forming the Same

Semiconductor

| Wed 29 Apr 2026

Munich, April 29 -- European Patent Office has received Yangtze Memory Technologies patent application for Memory Devices and Methods for Forming the Same. Li Danyang, Wang Yu and Sun Xikai developed the invention. The patent application number is EP20240782166 20240829. The patent publication number is EP4728516 (A1). Intern..

Kungao Xinxin Microelectronics Jiangsu Co Ltd Submits Chinese Patent Application for Method and Device for Encrypting, Locking and Controlling Hardware of Ethernet Chip Function Mo..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- Kungao Xinxin Microelectronics Jiangsu Co Ltd has submitted a patent application for Method and Device for Encrypting, Locking and Controlling Hardware of Ethernet Chip Function Module. This invention was developed by Xu Fasheng. The patent application number is CN202511385219 20250926. The patent publica..

State Intellectual Property Office of China Publishes Shaoxin Labs Patent Application for Post-processing Method for Ligand-induced Mercury-based Zero-dimensional Semiconductor Siz..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has published Shaoxin Labs patent application for Post-processing Method for Ligand-induced Mercury-based Zero-dimensional Semiconductor Size Focusing. The invention was developed by Zhou Peng, Wang Jianlu, Guo Tianle, Liu Jingjing, Hu Zhourui and Qin Yilu. The ..

Qingyuan Huigu New Material Tech Co Ltd Submits Chinese Patent Application for Organopolysiloxane Composition and Semiconductor Device

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- Qingyuan Huigu New Material Tech Co Ltd has submitted a patent application for Organopolysiloxane Composition and Semiconductor Device. This invention was developed by Zheng Haiting, Fu Shuangli, Yang Shihai and Huang Guangyan. The patent application number is CN202511169969 20250820. The patent publicati..

State Intellectual Property Office of China Publishes Jiangsu Dongxu Electronic Tech Co Ltd Patent Application for UV Curing Adhesive Film for Wafer Cutting Protection and Preparat..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has published Jiangsu Dongxu Electronic Tech Co Ltd patent application for UV Curing Adhesive Film for Wafer Cutting Protection and Preparation Method Thereof. The invention was developed by Chen Chao, Fan Ming and Liu Meijiao. The patent application number is C..

State Intellectual Property Office of China Receives Shenzhen Samcien Semiconductor Mat Co Ltd Patent Application for Temporary Bonding Glue for Wafer Thinning in High-temperature-..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has received Shenzhen Samcien Semiconductor Mat Co Ltd patent application for Temporary Bonding Glue for Wafer Thinning in High-temperature-resistant Process. Wang Peng, Ye Zhenwen, Luo Xin and Huang Mingqi developed the invention. The patent application number ..

State Intellectual Property Office of China Releases BOE Technology Group and Chengdu BOE Optoelectronics Technology Patent Application for Display Substrate and Display Device

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released BOE Technology Group and Chengdu BOE Optoelectronics Technology patent application for Display Substrate and Display Device. This invention was developed by Yu Chi, He Fan, Wei Yulong, Xu Guanghua, Du Lili, Xie Taofeng and Hu Ming. The patent applic..

Hanwha Chemical Corp Seeks Patent for Post-processing Method for Preventing Cell Degradation of Perovskite-based Solar Cell Module and Perovskite-based Solar Cell Module Processing..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Hanwha Chemical Corp has sought patent for Post-processing Method for Preventing Cell Degradation of Perovskite-based Solar Cell Module and Perovskite-based Solar Cell Module Processing Thereby. This invention was developed by Han Sung-hoon, Jin Ming and Kim Min-gun. The patent application number is CN202..

Beijing Xingchen Weilai Space Tech Research Institute Files Chinese Patent Application for Space Condensation Type Solar Cell System Based on Condensation-heat Dissipation Collabor..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Beijing Xingchen Weilai Space Tech Research Institute has filed a patent application for Space Condensation Type Solar Cell System Based on Condensation-heat Dissipation Collaborative Design. This invention was developed by Zhang Zheyu, Zhang Shancong, Yan Dongdong, Wu Huaisheng, Shi Jianfang, Feng Jiangtao ..

Shixi Guangzhou Biotechnology Co Ltd Submits Patent Application for Sequence for Forming Editing Substrate with RNA Editing Target Site

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Shixi Guangzhou Biotechnology Co Ltd has submitted a patent application for Sequence for Forming Editing Substrate with RNA Editing Target Site. Yang Wenbing and Zhang Rui developed the invention. The patent application number is CN20238096584 20230331. The patent publication number is CN121152627 (A). In..

Zhejiang Ruijing Microelectronic Tech Co Ltd Submits Patent Application for Horizontal Hall Sensor and Semiconductor Device

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Zhejiang Ruijing Microelectronic Tech Co Ltd has submitted a patent application for Horizontal Hall Sensor and Semiconductor Device. Cheng Xiaofeng, Zhou Lin and Bian Chenghao developed the invention. The patent application number is CN202511402036 20250928. The patent publication number is CN121152550 (A..

State Intellectual Property Office of China Publishes Jiangsu Difeida Electronics Co Ltd Patent Application for Printed Circuit Board (PCB) Substrate Printing Equipment

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has published Jiangsu Difeida Electronics Co Ltd patent application for Printed Circuit Board (PCB) Substrate Printing Equipment. The invention was developed by Chen Shijie. The patent application number is CN202511427044 20250930. The patent publication number ..

Suzhou Sutong Semiconductor Tech Co Ltd Submits Chinese Patent Application for Access Point, Station and Method Executed by Access Point

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Suzhou Sutong Semiconductor Tech Co Ltd has submitted a patent application for Access Point, Station and Method Executed by Access Point. This invention was developed by Park Sungjin and Kim Dae Hong. The patent application number is CN202510707487 20250529. The patent publication number is CN121152049 (A..

State Intellectual Property Office of China Receives China Nat Machinery Institute Group Jiangsu Branch Co Ltd Patent Application for Assembly Tool for Wafer Ultrasonic Scribing Kn..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has received China Nat Machinery Institute Group Jiangsu Branch Co Ltd patent application for Assembly Tool for Wafer Ultrasonic Scribing Knife and Use Method of Assembly Tool. Zhuang Bailiang, Feng Shilong, Zhang Yundian, Shang Luhua, Zhu Zhuozhi, Yang Haoqing and..

Lontium Semiconductor Hefei Co Ltd Applies for Patent on Method for Bridge Chip to Actively Switch Source End Resolution and Related Product

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Lontium Semiconductor Hefei Co Ltd has applied Chinese patent for Method for Bridge Chip to Actively Switch Source End Resolution and Related Product. Shi Yu, Song Weijian, Chen Qingdong, Wang Hao and Wang Liang developed it. The patent application number is CN202511685494 20251117. The patent publication..

State Intellectual Property Office of China Receives Jiangsu Heyi Guangxian Tech Co Ltd Patent Application for OLED Flexible Screen and Glass Substrate Laser Separation Equipment a..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has received Jiangsu Heyi Guangxian Tech Co Ltd patent application for OLED Flexible Screen and Glass Substrate Laser Separation Equipment and Separation Method. Shen Fafu developed the invention. The patent application number is CN202511328772 20250917. The pat..

Sipearl Files European Patent Application for a Method of Managing Memory in a High-performance Computing System

Semiconductor

| Wed 29 Apr 2026

Munich, April 29 -- Sipearl has filed a patent application for a Method of Managing Memory in a High-performance Computing System. This invention was developed by Dolbeau Romain. The patent application number is EP20240731978 20240607. The patent publication number is EP4728385 (A1). International Patent Classification codes ..

University Tohoku, Nat Institute Inf & Comm Tech and Shinetsu Chemical Seek Patent for Integrated Circuit and Method for Manufacturing Same

Semiconductor

| Wed 29 Apr 2026

Munich, April 29 -- University Tohoku, Nat Institute Inf & Comm Tech and Shinetsu Chemical have sought patent for Integrated Circuit and Method for Manufacturing Same. This invention was developed by Fukidome Hirokazu, Suemitsu Tetsuya, Watanabe Issei, Kawahara Minoru, Akiyama Shoji, Tobisaka Yuji and Kawai Makoto. The patent..

European Patent Office Releases Mediatek Patent Application for Compute-near Memory on a Base Die with Access to Multi-stack Memory

Semiconductor

| Wed 29 Apr 2026

Munich, April 29 -- European Patent Office has released Mediatek patent application for Compute-near Memory on a Base Die with Access to Multi-stack Memory. This invention was developed by Kumar Arvind, Kumashikar Mahesh K and Nalamalpu Ankireddy. The patent application number is EP20250198073 20250826. The patent publication..

The Research Foundation for the State University of New York Applies for Patent on Semiconductor Devices Including Electrodes and Plurality of Pillars, and Methods of Forming Same

Semiconductor

| Wed 29 Apr 2026

Geneva, April 29 -- The Research Foundation for the State University of New York has applied WIPO patent for Semiconductor Devices Including Electrodes and Plurality of Pillars, and Methods of Forming Same. Beckmann Karsten, Ogden Sean and Raymond Mark developed it. The patent application number is WO2025US51708 20251020. The..

Hangzhou Guzi Culture Tech Co Ltd Submits Chinese Patent Application for Dynamic Key Generation Method and System for Physical Unclonable Chip

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- Hangzhou Guzi Culture Tech Co Ltd has submitted a patent application for Dynamic Key Generation Method and System for Physical Unclonable Chip. This invention was developed by Tan Jianfeng, Zhao Yan, Gong Wei and Qian Jinjin. The patent application number is CN202511435997 20251009. The patent publication..

State Intellectual Property Office of China Receives Research Institute China Mobile Communications and China Mobile Communications Patent Application for Data Interaction Method a..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has received Research Institute China Mobile Communications and China Mobile Communications patent application for Data Interaction Method and Device Based on Security Chip and Security Chip. Lu Ming developed the invention. The patent application number is CN20..

Dianxi Industrial Development Research Institute Dalian University Of Technology Submits Chinese Patent Application for Energy-saving Polycrystalline Silicon Raw Material Ultrasoni..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- Dianxi Industrial Development Research Institute Dalian University Of Technology has submitted a patent application for Energy-saving Polycrystalline Silicon Raw Material Ultrasonic Resonance Pre-crushing Screening Tower with Hard Impurity Removing Function and Application Thereof. This invention was develop..

Jiangsu Shanshui Semiconductor Mat Co Ltd Submits Chinese Patent Application for High-dispersity Silicon Oxide-based Polishing Solution for Silicon Wafer and Preparation Method of ..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- Jiangsu Shanshui Semiconductor Mat Co Ltd has submitted a patent application for High-dispersity Silicon Oxide-based Polishing Solution for Silicon Wafer and Preparation Method of High-dispersity Silicon Oxide-based Polishing Solution. This invention was developed by Wang Chenwei, Jiang Lijiao, Liu Fei, Li S..

Shanghai Lanbao Paint Co Ltd Submits Chinese Patent Application for Anti-burst Electroplating Primer and Preparation Method Thereof

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- Shanghai Lanbao Paint Co Ltd has submitted a patent application for Anti-burst Electroplating Primer and Preparation Method Thereof. This invention was developed by Jiang Bin, Fu Yuxiang, Jiang Lei and Wan Yiping. The patent application number is CN202511602076 20251104. The patent publication number is C..

Hubei Wuzhou New Material Tech Co Ltd Submits Chinese Patent Application for Low-temperature Fast Curing Non-oriented Silicon Steel Coating and Preparation Method Thereof

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- Hubei Wuzhou New Material Tech Co Ltd has submitted a patent application for Low-temperature Fast Curing Non-oriented Silicon Steel Coating and Preparation Method Thereof. This invention was developed by Song Yu, Li Linwei, Xiong Zhi and Huang Danli. The patent application number is CN202511715592 2025112..

State Intellectual Property Office of China Receives Hunan Liangang Electromagnetic Mat Co Ltd and LYSTEEL Patent Application for Coating Liquid for Improving Compatibility of Sili..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has received Hunan Liangang Electromagnetic Mat Co Ltd and LYSTEEL patent application for Coating Liquid for Improving Compatibility of Silicon Steel and Insulating Paint as Well as Preparation Method and Application of Coating Liquid. Xiao Guihua, Zhang Wanghui, H..

Sichuan Micron Biotechnology Co Ltd Submits Chinese Patent Application for Perampanel Long-acting Sustained-release Microsphere as Well as Preparation Method and Application Thereo..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Sichuan Micron Biotechnology Co Ltd has submitted a patent application for Perampanel Long-acting Sustained-release Microsphere as Well as Preparation Method and Application Thereof. This invention was developed by Chen Zhihao, Jia Lufan and Liu Rui. The patent application number is CN202511574576 2025103..

Qinghai CSG New Energy Tech Co Ltd Applies for Patent on Comprehensive Production Method of High-purity Crystalline Silicon

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Qinghai CSG New Energy Tech Co Ltd has applied Chinese patent for Comprehensive Production Method of High-purity Crystalline Silicon. Dong Xianjun, Liang Bo and Hu Kaiwen developed it. The patent application number is CN202511340035 20250919. The patent publication number is CN121158788 (A). International..

State Intellectual Property Office of China Releases Xiamen University and Wuxi China Resources Microelectronics Co Ltd Patent Application for Preparation Method of Pressure-driven..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Xiamen University and Wuxi China Resources Microelectronics Co Ltd patent application for Preparation Method of Pressure-driven MEMS (micro Electro Mechanical System) Silicon Carbide High-temperature Miniaturized Digital Switch. This invention was deve..

State Intellectual Property Office of China Releases Shenzhen Research Institute Of Shandong University Patent Application for Manufacturing Method of Silicon Nanowire

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Shenzhen Research Institute Of Shandong University patent application for Manufacturing Method of Silicon Nanowire. This invention was developed by Tian Wei, Tao Jifang and Wen Lianggong. The patent application number is CN202511686362 20251118. The..

State Intellectual Property Office of China Receives Northwestern Polytechnical University and Xi'an Jingwei Sensing Tech Co Ltd Patent Application for Processing Method of Open ME..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has received Northwestern Polytechnical University and Xi'an Jingwei Sensing Tech Co Ltd patent application for Processing Method of Open MEMS Chip. Li Pengfei, Yan Xin, Yang Yunjie, Lu Qianbo, Wang Haiyan and Niu Haobin developed the invention. The patent appli..

State Intellectual Property Office of China Publishes Anhui Xindong Lianke Microsystem Co Ltd and Beijing Xindong Zhiyuan Microelectronics Tech Co Ltd Patent Application for MEMS (..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has published Anhui Xindong Lianke Microsystem Co Ltd and Beijing Xindong Zhiyuan Microelectronics Tech Co Ltd patent application for MEMS (micro Electro Mechanical System) Chip with Vertical Buffer Stop Structure and Manufacturing Method Thereof. The invention was..

State Intellectual Property Office of China Releases Zhejiang Ruijing Microelectronic Tech Co Ltd Patent Application for Vertical Hall Sensor and Semiconductor Device

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Zhejiang Ruijing Microelectronic Tech Co Ltd patent application for Vertical Hall Sensor and Semiconductor Device. This invention was developed by Cheng Xiaofeng, Bian Chenghao and Xie Weijun. The patent application number is CN202511399618 20250928..

State Intellectual Property Office of China Receives China Electronics Tech Group Corporation No. 49 Research Institute and Harbin Institute of Technology Patent Application for PD..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has received China Electronics Tech Group Corporation No. 49 Research Institute and Harbin Institute of Technology patent application for PDMS Substrate with Micro-island Bridge Array Fixed Support and Preparation Method of PDMS Substrate. Liu Chengli, Peng Xiyuan,..

State Intellectual Property Office of China Receives Yantai Engineering University Research Institute Patent Application for Perovskite Solar Cell Based on Carbon Electrode and All..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has received Yantai Engineering University Research Institute patent application for Perovskite Solar Cell Based on Carbon Electrode and All-air Preparation Method Thereof. Bai Li, Wang Yanhui, Xu Chongyang, Wu Sheng and Liu Xuewen developed the invention. The p..

Hangzhou Hongying Digital Tech Co Ltd Submits Chinese Patent Application for Substrate Water Content Control Device and Substrate Water Content Control Method

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Hangzhou Hongying Digital Tech Co Ltd has submitted a patent application for Substrate Water Content Control Device and Substrate Water Content Control Method. This invention was developed by Cao Lifeng and Huang Junjun. The patent application number is CN202511508240 20251021. The patent publication numb..

Beijing Yaoneng Tech Co Ltd Files Chinese Patent Application for Passivation Device and Method for Perovskite Solar Cell

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Beijing Yaoneng Tech Co Ltd has filed a patent application for Passivation Device and Method for Perovskite Solar Cell. This invention was developed by Wu Yiliang, Sun Mengjie, Duan Ye and Wen Zhenxing. The patent application number is CN202511318476 20250915. The patent publication number is CN121152520 ..

State Intellectual Property Office of China Publishes PowerChina Northwest Engineering Corporation and Northwestern Polytechnical University Patent Application for Preparation Meth..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has published PowerChina Northwest Engineering Corporation and Northwestern Polytechnical University patent application for Preparation Method of Hole Transport Layer Solution Implanted with Semiconductor Nanocrystals and Preparation Method of Inverted Perovskite S..

Lontium Semiconductor Hefei Co Ltd Files Chinese Patent Application for Silicon-based OLED Micro Display Screen

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Lontium Semiconductor Hefei Co Ltd has filed a patent application for Silicon-based OLED Micro Display Screen. This invention was developed by Wang Dengfeng, Su Jin, Chen Feng, Tai Lianliang, Ren Diansheng and Xia Hongfeng. The patent application number is CN202511676338 20251114. The patent publication n..

State Intellectual Property Office of China Releases Guangzhou Guangda Innovation Tech Co Ltd Patent Application for Vertically Stacked Organic Image Sensor

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Guangzhou Guangda Innovation Tech Co Ltd patent application for Vertically Stacked Organic Image Sensor. This invention was developed by Yang Xiye, Wang Yazhong, Li Shuaiqi and Tan Zhaohong. The patent application number is CN202511239510 20250901. ..

Ganghua Energy Chuangke Shenzhen Co Ltd Files Chinese Patent Application for Perovskite Passivation Structure, Preparation Method Thereof and Perovskite Solar Cell

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Ganghua Energy Chuangke Shenzhen Co Ltd has filed a patent application for Perovskite Passivation Structure, Preparation Method Thereof and Perovskite Solar Cell. This invention was developed by Wu Xiaoxue, Zhou Chuanzhe, Du Yixuan, Huang Liang and Shi Yuxian. The patent application number is CN2025112914..

State Intellectual Property Office of China Releases Huiyongjin Photoelectric Zhejiang Co Ltd Patent Application for Outdoor Light-emitting Diode with Flip Chip and Manufacturing P..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Huiyongjin Photoelectric Zhejiang Co Ltd patent application for Outdoor Light-emitting Diode with Flip Chip and Manufacturing Process of Outdoor Light-emitting Diode. This invention was developed by Lyu Longlong, Jin Zheng, Zhu Yunzhi, Wu Keming and Xi..

Shenzhen Wuxin Material Tech Co Ltd Applies for Patent on Semiconductor Packaging Substrate and Semiconductor Packaging Method

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Shenzhen Wuxin Material Tech Co Ltd has applied Chinese patent for Semiconductor Packaging Substrate and Semiconductor Packaging Method. Lyu Wensong and Wang Hongru developed it. The patent application number is CN202511288541 20250910. The patent publication number is CN121152458 (A). International Paten..

State Intellectual Property Office of China Releases Shenzhen Xunguang Technology Patent Application for Light-emitting Device

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Shenzhen Xunguang Technology patent application for Light-emitting Device. This invention was developed by Huang Wei, Cao Yuxing, Li Xiangyang and Liu Juan. The patent application number is CN202511676682 20251117. The patent publication number is C..

State Intellectual Property Office of China Releases Nanchang University, Nanchang Laboratory and Nanchang Silicon Based Semiconductor Tech Co Ltd Patent Application for Preparatio..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Nanchang University, Nanchang Laboratory and Nanchang Silicon Based Semiconductor Tech Co Ltd patent application for Preparation Method of Laminated Structure for Temporarily Transferring Micro-led Array. This invention was developed by Wang Li, Gu Siy..

State Intellectual Property Office of China Releases Ji Hua Laboratory and Shenzhen Aoshiwei Tech Co Ltd Patent Application for Micro Led Device with Low Defect and High Light Extr..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Ji Hua Laboratory and Shenzhen Aoshiwei Tech Co Ltd patent application for Micro Led Device with Low Defect and High Light Extraction Rate and Manufacturing Method Thereof. This invention was developed by Zhou Jieming, Huang Mingkang, Yue Dachuan, Li X..

State Intellectual Property Office of China Releases Foshan Guoxing Electronic Mfg Co Ltd Patent Application for Manufacturing Method of Light-emitting Device and Light-emitting De..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Foshan Guoxing Electronic Mfg Co Ltd patent application for Manufacturing Method of Light-emitting Device and Light-emitting Device. This invention was developed by Li Chenghui, He Fangping, Xu Hu, Xie Shaojia, Ji Ruiwen, Lin Weijian, Li Wenjia and Li ..

State Intellectual Property Office of China Receives Weiliang Tech Hong Kong Limited Patent Application for Lead Frame, Light-emitting Device and Manufacturing Method Thereof

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has received Weiliang Tech Hong Kong Limited patent application for Lead Frame, Light-emitting Device and Manufacturing Method Thereof. Yin Guangyao and Wang Zhijia developed the invention. The patent application number is CN202511362706 20250922. The patent pub..

Xiamen Hengguang Xinrui Tech Co Ltd Submits Chinese Patent Application for Narrow-spectrum Super-radiation Light-emitting Diode Structure

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Xiamen Hengguang Xinrui Tech Co Ltd has submitted a patent application for Narrow-spectrum Super-radiation Light-emitting Diode Structure. This invention was developed by Li Jianbo. The patent application number is CN20251182697 20250804. The patent publication number is CN121152432 (A). International Pat..

State Intellectual Property Office of China Releases Nanchang University, Nanchang Laboratory and Nanchang Silicon Based Semiconductor Tech Co Ltd Patent Application for Double-col..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Nanchang University, Nanchang Laboratory and Nanchang Silicon Based Semiconductor Tech Co Ltd patent application for Double-color Led Chip Structure and Preparation Method Thereof. This invention was developed by Zhang Jianli, Liu Zheng, Wang Xiaolan, ..

Seeya Tech Co Ltd Files Chinese Patent Application for Polycrystalline Silicon Diode, Manufacturing Method Thereof and Pixel Circuit

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Seeya Tech Co Ltd has filed a patent application for Polycrystalline Silicon Diode, Manufacturing Method Thereof and Pixel Circuit. This invention was developed by Zhu Tianzhi, Liu Binglin and Wu Tong. The patent application number is CN202511292182 20250910. The patent publication number is CN121152416 (..

Zhejiang Guangte Tech Co Ltd Submits Chinese Patent Application for Flip Apd Chip for Laser Radar

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Zhejiang Guangte Tech Co Ltd has submitted a patent application for Flip Apd Chip for Laser Radar. This invention was developed by Liao Shirong, Wan Yuantao and Ye Jinlin. The patent application number is CN202511309284 20250912. The patent publication number is CN121152367 (A). International Patent Class..

NXP USA Inc and Luniversita Degli Studi Di Catania Dieei Seek Patent for Fully Differential CMOS Demodulator

Semiconductor

| Tue 28 Apr 2026

Munich, April 29 -- NXP USA Inc and Luniversita Degli Studi Di Catania Dieei have sought patent for Fully Differential CMOS Demodulator. This invention was developed by Scuderi Angelo, Copani Tino, Giustolisi Gianluca, Eghtesadi Minoo, Pennisi Salvatore and Ragonese Egidio. The patent application number is EP20240207585 20241..

Suzhou Saierte New Mat Co Ltd Files Chinese Patent Application for Large-size Chemical Mechanical Polishing Disk for Polishing Diamond Wafer and Preparation Method of Large-size Ch..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Suzhou Saierte New Mat Co Ltd has filed a patent application for Large-size Chemical Mechanical Polishing Disk for Polishing Diamond Wafer and Preparation Method of Large-size Chemical Mechanical Polishing Disk. This invention was developed by Hu Guangqiu, Hu Kun, Wang Kaiping and Lu Jing. The patent appl..

Shanghai Yingshengtong Semiconductor Equipment Co Ltd Applies for Patent on Device and Method for Calibrating Stage Positioning Precision on Wafer Chamfering Equipment

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Shanghai Yingshengtong Semiconductor Equipment Co Ltd has applied Chinese patent for Device and Method for Calibrating Stage Positioning Precision on Wafer Chamfering Equipment. Chen Zhangliang and Zhang Junqing developed it. The patent application number is CN202511696541 20251119. The patent publication..

State Intellectual Property Office of China Publishes Shenzhen Xindepu Tech Co Ltd Patent Application for Silicon Carbide Wafer Electrochemical Mechanical Polishing Device

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has published Shenzhen Xindepu Tech Co Ltd patent application for Silicon Carbide Wafer Electrochemical Mechanical Polishing Device. The invention was developed by Kan Kaile and Zhang Maoliang. The patent application number is CN202511309867 20250915. The patent..

Jingxin Semiconductor Huangshi Co Ltd Seeks Patent for Wafer Polishing and Grinding Equipment and Grinding Method Thereof

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Jingxin Semiconductor Huangshi Co Ltd has sought patent for Wafer Polishing and Grinding Equipment and Grinding Method Thereof. This invention was developed by Zhang Xiaochun, Tao Sheng and Zhang Bingyong. The patent application number is CN202511260645 20250904. The patent publication number is CN1211569..

Shenzhen Lichi Semiconductor Tech Co Ltd Files European Patent Application for File Sharing Method, System, Storage Medium and Chip Applied to Multi-domain SOC

Semiconductor

| Tue 28 Apr 2026

Munich, April 29 -- Shenzhen Lichi Semiconductor Tech Co Ltd has filed a patent application for File Sharing Method, System, Storage Medium and Chip Applied to Multi-domain SOC. This invention was developed by Luo Yongjun and Xu Xiaofeng. The patent application number is EP20250205537 20250930. The patent publication number i..

Quick Intelligent Equip Co Ltd and Jiangsu Quick Core Equipment Tech Co Ltd Submit Chinese Patent Application for Chip Welding Suction Nozzle Assembly Capable of Being Replaced Aut..

Semiconductor

| Tue 28 Apr 2026

Beijing, April 29 -- Quick Intelligent Equip Co Ltd and Jiangsu Quick Core Equipment Tech Co Ltd have submitted a patent application for Chip Welding Suction Nozzle Assembly Capable of Being Replaced Automatically. This invention was developed by Dou Xiaoming, Chen Jijun, Yao Chao, Liu Yuan and Zhu Renzhong. The patent applic..

European Patent Office Releases Hannam University Industry Academy Cooperation Foundation Patent Application for a Method for Manufacturing Ceria Nanoparticle for Semiconductor CMP..

Semiconductor

| Wed 29 Apr 2026

Munich, April 29 -- European Patent Office has released Hannam University Industry Academy Cooperation Foundation patent application for a Method for Manufacturing Ceria Nanoparticle for Semiconductor CMP Process Using Room Temperature Liquid Phase Precipitation Method. This invention was developed by Woon Jung Kim. The paten..

FX Replay Inc Seeks Patent for System and Method for Backtesting Minibroker

Semiconductor

| Wed 29 Apr 2026

Geneva, April 29 -- FX Replay Inc has sought patent for System and Method for Backtesting Minibroker. This invention was developed by Collao Benitez Rodrigo A, Goocher John H and Rodriguez Aaron S. The patent application number is WO2025US51300 20251016. The patent publication number is WO2026085356 (A1). International Patent..

The Research Foundation for the State University of New York Submits Patent Application for Semiconductor Devices Including Memory Elements and Threshold Switches, and Methods of F..

Semiconductor

| Wed 29 Apr 2026

Geneva, April 29 -- The Research Foundation for the State University of New York has submitted a patent application for Semiconductor Devices Including Memory Elements and Threshold Switches, and Methods of Forming Same. Beckmann Karsten, Pieniazek Nicholas, Cady Nathaniel, Collison Wenli, Herman Joshua and Romero Daniel develop..

World Intellectual Property Organization Releases Cmatrics Inc Patent Application for Diamond Cvd Reactor Apparatuses and Methods for Use with In-situ Processing

Semiconductor

| Wed 29 Apr 2026

Geneva, April 29 -- World Intellectual Property Organization has released Cmatrics Inc patent application for Diamond Cvd Reactor Apparatuses and Methods for Use with In-situ Processing. This invention was developed by Malakoutian Mohamadali and Chowdhury Srabanti. The patent application number is WO2025US50905 20251014. The ..

State Intellectual Property Office of China Receives Hefei Shanhai Semiconductor Tech Co Ltd Patent Application for Suppressor Circuit, Signal Transmitting Device and Communication..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has received Hefei Shanhai Semiconductor Tech Co Ltd patent application for Suppressor Circuit, Signal Transmitting Device and Communication System. Ran Qianfan and Wang Zhaogang developed the invention. The patent application number is CN202511657868 20251113. ..

State Intellectual Property Office of China Releases Everest Semiconductor Co Ltd Patent Application for Clock Oscillation Circuit, Key Detection System and Chip

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Everest Semiconductor Co Ltd patent application for Clock Oscillation Circuit, Key Detection System and Chip. This invention was developed by Zhang Baohua, Wang Junda, Yu Qing and Lin Kun. The patent application number is CN202511282779 20250909. Th..

Zhuhai Boya Tech Co Ltd Seeks Patent for Low-power-consumption Oscillating Circuit and Flash Memory

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- Zhuhai Boya Tech Co Ltd has sought patent for Low-power-consumption Oscillating Circuit and Flash Memory. This invention was developed by Ma Liang. The patent application number is CN202511245797 20250902. The patent publication number is CN121150663 (A). International Patent Classification codes are G11C..

Shanghai Dandi Communication Tech Co Ltd Files Chinese Patent Application for Broadband Adjustable Low Noise Amplifier and Radio Frequency Integrated Circuit

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- Shanghai Dandi Communication Tech Co Ltd has filed a patent application for Broadband Adjustable Low Noise Amplifier and Radio Frequency Integrated Circuit. This invention was developed by Zhang Huashuo and Li Jun. The patent application number is CN202511207871 20250827. The patent publication number is ..

State Intellectual Property Office of China Publishes Southeast University and Southeast University Wuxi Institute Of Integrated Circuit Technology Patent Application for Ultra-wid..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has published Southeast University and Southeast University Wuxi Institute Of Integrated Circuit Technology patent application for Ultra-wideband Balanced Second Harmonic Mixer Based on Schottky Diode. The invention was developed by Zhang Zihan, Cheng Ke and Guo Ji..

State Intellectual Property Office of China Releases Heilongjiang Huixin Semiconductor Co Ltd Patent Application for High-power-consumption Chip Driving Circuit, PCB and Driving Ch..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Heilongjiang Huixin Semiconductor Co Ltd patent application for High-power-consumption Chip Driving Circuit, PCB and Driving Chip Thereof. This invention was developed by Feng Yuxiang, Dai Xianhui, Feng Kexin, Xie Yingxi and Guo Jiajie. The patent a..

State Intellectual Property Office of China Releases Yangtze River Delta Research Institute UESTC, Huzhou and Huzhou Biaopu Environmental Testing Tech Co Ltd Patent Application for..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Yangtze River Delta Research Institute UESTC, Huzhou and Huzhou Biaopu Environmental Testing Tech Co Ltd patent application for Preparation Method and Application of Mesoporous Copper Oxide Semiconductor Catalyst. This invention was developed by Xie Ho..

State Intellectual Property Office of China Releases Kunming University of Science and Technology, Institute of Process Engineering,Chinese Academy of Sciences and Hebei Chuangjie ..

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- State Intellectual Property Office of China has released Kunming University of Science and Technology, Institute of Process Engineering,Chinese Academy of Sciences and Hebei Chuangjie Env Engineering Co Ltd patent application for Preparation Method of Multi-element Solid Waste-based Adsorbent Without Adding ..

Qingyuan Huigu New Material Tech Co Ltd Applies for Patent on Die Bonding Organic Silicon Composition, Die Bonding Material and Optical Semiconductor Device

Semiconductor

| Wed 29 Apr 2026

Beijing, April 29 -- Qingyuan Huigu New Material Tech Co Ltd has applied Chinese patent for Die Bonding Organic Silicon Composition, Die Bonding Material and Optical Semiconductor Device. Zheng Haiting, Wang Lingyu, Fu Shuangli and Yang Shihai developed it. The patent application number is CN202511169970 20250820. The patent ..

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