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Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- SOI Micro Co Ltd has submitted a patent application for Semiconductor Device and Manufacturing Method Therefor. This invention was developed by Zhang Ji, Ji Minghua, Yu Xiongfei, He Xin, Li Ning and Li Binhong. The patent application number is WO2025CN86605 20250401. The patent publication number is WO20261..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Guangdong OPPO Mobile Telecommunications has submitted a patent application for Transport Block Size Determination Method and Apparatus, Device, Medium, and Chip. Shi Zhihua, Chen Wenhong and Huang Yingpei developed the invention. The patent application number is WO2025CN85962 20250328. The patent publication..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has received BOE Technology Group patent application for Light-emitting Substrate and Manufacturing Method Therefor, Display Module, and Display Device. Sun Yanliu developed the invention. The patent application number is WO2025CN85951 20250328. The patent publication ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Guangdong OPPO Mobile Telecommunications has filed a patent application for Measurement Method and Apparatus, and Device, Chip and Storage Medium. This invention was developed by Hu Rongyi. The patent application number is WO2025CN85926 20250328. The patent publication number is WO2026199525 (A1). Internation..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Guangdong OPPO Mobile Telecommunications has applied WIPO patent for Communication Methods and Apparatuses, and Communication Device, Chip and Storage Medium. Xing Jinqiang, Zhou Rui, Zhang Juan and Liu Qifei developed it. The patent application number is WO2025CN85888 20250328. The patent publication number ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released BOE Technology Group patent application for Light-emitting Substrate and Bonding Method Therefor, Flexible Printed Circuit and Display Device. This invention was developed by Gao Bo, Xu Bo, Chu Yutian, Sun Liang, Dong Enkai, Xie Yuexian and Wang Lili. The ..

Semiconductor

  |  Tue 13 Oct 2026

Beijing, Oct. 12 -- Chengdu BOE Optoelectronics Technology and BOE Technology Group have submitted a patent application for Display Substrate and Display Device. This invention was developed by Yang Mingkun, Liu Lang, Zhang Tiaomei, Liu Zhen, Qiu Haijun, Ma Hongbo, Hu Ming, Jiang Zhiliang, Wu Jianpeng and Gao Wenhui. The pate..

Semiconductor

  |  Tue 13 Oct 2026

Beijing, Oct. 12 -- Chengdu BOE Optoelectronics Technology, BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Pixel Driving Circuit, Driving Method of Pixel Driving Circuit, Display Substrate and Preparation Method of Display Substrate. This invention was developed by Guo Yonglin..

Semiconductor

  |  Tue 13 Oct 2026

Beijing, Oct. 13 -- Jihai Microelectronics has secured a patent on Consumable Chip and Consumable Box. Dai Shuchun, Chen Hao and Yang Yuying developed the invention. The patent application number is CN202520320988U 20250226. The patent publication number is CN223821304 (U). International Patent Classification codes are B41J2/17..

Semiconductor

  |  Tue 13 Oct 2026

Beijing, Oct. 13 -- Jihai Microelectronics has obtained a patent for consumable chip, chip assembly and consumable box. This invention was developed by Liang Guanyuan, Dai Shuchun, Gao Tao and Chen Hao. The patent application number is CN202520190167U 20250206. The patent publication number is CN223821302 (U). International Pat..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Kokusai Electric has submitted a patent application for Substrate Processing Method, Method for Manufacturing Semiconductor Device, Program, and Substrate Processing Device. This invention was developed by Nohara Shingo, Suzuki Kento, Ishibashi Kiyohisa and Yamane Yoma. The patent application number is WO2025..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Panasonic Intellectual Property Management has submitted a patent application for Light-transmitting Substrate. This invention was developed by Yamamoto Yusuke, Araki Kota, Jeon Sohui and Shibata Kenji. The patent application number is WO2025JP37147 20251022. The patent publication number is WO2026203479 (A..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Rapidus has filed a patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. This invention was developed by Iwai Takaaki. The patent application number is WO2025JP36836 20251020. The patent publication number is WO2026203469 (A1). International Patent Classification code..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Panasonic Intellectual Property Management has submitted a patent application for Chip Recovery Device and Component Mounting System. Suzuki Tetsuya and Shimizu Yoshiyuki developed the invention. The patent application number is WO2025JP30334 20250828. The patent publication number is WO2026203436 (A1). Int..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- MegaChips has sought patent for Information Processing Method, Information Processing Device, and Semiconductor Storage Device. This invention was developed by Koga Tatsunori. The patent application number is WO2025JP25800 20250718. The patent publication number is WO2026203420 (A1). International Patent Clas..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- BOE Technology Group has submitted a patent application for Light-emitting Substrate. This invention was developed by Yao Nianqi, Wang Yicheng, Han Tianyang, Zhang Keyi, Liu Wenqi, Sun Zhongyuan, Jiao Zhiqiang, Wang Zhichong, Luo Chengyuan, Gao Tianhang, Jin Qian and Zhang Fengjie. The patent application numb..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- BOE Technology Group has filed a patent application for Display Substrate and Display Panel. This invention was developed by Liu Libin, Zhang Hao and Cui Song. The patent application number is WO2026CN78209 20260210. The patent publication number is WO2026200314 (A1). International Patent Classification code ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- BOE Technology Group has submitted a patent application for Display Substrate and Display Method and Preparation Method Therefor, Pixel Circuit and Method for Driving Same, and Display Apparatus. Zhou Tingting, Wang Yingtao, Jia Qian, Wang Mingxing, Li Haokun, Sun Xuefei, You Jaegeon and Wang Xinxing developed..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- ACM Research, Shanghai has filed a patent application for Shielding Device and Electroplating Shielding Method. This invention was developed by Wang Jian, Zhou Chao, Wu Meng and Jia Zhaowei. The patent application number is WO2026CN77417 20260206. The patent publication number is WO2026200296 (A1). Internatio..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has published Wuhan Raycus Fiber Laser Technologies patent application for Air-cooled Semiconductor Laser Integrating Fin-type Heat Dissipation. The invention was developed by Wang Wenjuan, Yang Xiong, Yan Chaoqun, Huang Yaxiong and Yan Dapeng. The patent application n..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Innostar Semiconductor Shanghai Co Ltd has submitted a patent application for Preparation Method for Non-Volatile Two-Terminal Memory Cell and Product Thereof. This invention was developed by Yang Yun, Zhang Peng, Chen Liang, Li Xiaobo, Gao Fei, Cheng Zichao, Qiu Shengfen and Ni Jiaqi. The patent applicatio..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Innostar Semiconductor Shanghai Co Ltd has submitted a patent application for Preparation Method for Non-Volatile Two-Terminal Memory Cell, and Product Comprising Same. This invention was developed by Yang Yun, Zhang Peng, Chen Liang, Li Xiaobo, Gao Fei, Cheng Zichao, Qiu Shengfen and Ni Jiaqi. The patent a..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Huawei Technologies has sought patent for Storage Control Method, Storage Device, Storage Controller, and Solid-state Drive. This invention was developed by Gao Feng. The patent application number is WO2026CN73616 20260120. The patent publication number is WO2026200233 (A1). International Patent Classificatio..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Huawei Technologies has applied WIPO patent for Chip Stack Structure, Manufacturing Method Therefor, Chip Package Structure, and Electronic Device. Wu Xiangyu, Wu Shenghao, Ren Nana, Zhang Tonglong and Li Xiaoru developed it. The patent application number is WO2025CN146363 20251227. The patent publication num..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Huawei Technologies has submitted a patent application for Semiconductor Device and Preparation Method Therefor, Wafer, Chip Packaging Structure, and Electronic Device. This invention was developed by Li Wenchang, Yao Yuan, Liu Lei, Song Woeiji, Li Jingyu and Li Shulun. The patent application number is WO2025..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Huawei Technologies has submitted a patent application for Photonic Integrated Chip and Communication Device. This invention was developed by Lu Lizhen, Xu Xinyi, Zhang Yuanhang and Gui Chengcheng. The patent application number is WO2025CN146117 20251226. The patent publication number is WO2026200128 (A1). ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released BOE Technology Group patent application for Transfer Substrate, Transfer Method for Light-emitting Units, and Light-emitting Substrate. This invention was developed by Sun Qian, Wang Mingxing, Zhang Yingxiang, Zhao Jiawei, Gao Tianhang and Yan Huajie. The ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Honor Device has filed a patent application for Communication Method, Communication Apparatus, Chip System, Storage Medium, and Program Product. This invention was developed by Zhang Mingzhu and Chen Mengying. The patent application number is WO2025CN144062 20251219. The patent publication number is WO2026200..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Xiamen University has submitted a patent application for Quaternary Ammonium Salt Organic Semiconductor Material, Preparation Method Therefor, and Use Thereof. This invention was developed by Luo Weiang, Chen Guorong, Lu Huiqiang, Yuan Conghui, Luo Yu and Dai Lizong. The patent application number is WO2025CN1..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released Xiamen University patent application for Catechol-based Organic Semiconductor Material, and Preparation Method Therefor and Use Thereof. This invention was developed by Luo Weiang, Chen Guorong, Lu Huiqiang, Yuan Conghui, Luo Yu and Dai Lizong. The patent ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released Unilumin Group patent application for Multi-color Light Mixing Method, Apparatus and System for Light-emitting Device. This invention was developed by Wang Xuan, Xu Kaiguo and Jiang Xiaosheng. The patent application number is WO2025CN141837 20251211. The..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has received Huawei Technologies patent application for Computing Device, Data Communication Method, Computing Device Cluster, and Chip. Ma Tao, Zheng Fei, Yao Cheng and Wu Dongjun developed the invention. The patent application number is WO2025CN139684 20251203. The p..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Honor Device has applied WIPO patent for Random Access Method and Apparatus, and Storage Medium, Program Product and Chip. Liu Xu and Pang Lingli developed it. The patent application number is WO2025CN138019 20251127. The patent publication number is WO2026199994 (A1). International Patent Classification code..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Innostar Semiconductor Shanghai Co Ltd has submitted a patent application for Preparation Method for Non-volatile Two-terminal Memory Cell, and Product. Yang Yun, Zhang Peng, Chen Liang and Ni Jiaqi developed the invention. The patent application number is WO2025CN105866 20250630. The patent publication num..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Innostar Semiconductor Shanghai Co Ltd has submitted a patent application for Non-Volatile Two-Terminal Memory Cell, Manufacturing Method, and Related Product. This invention was developed by Yang Yun, Chen Liang, Qiao Fulong, Gao Fei, Zhao Liuming and Ni Jiaqi. The patent application number is WO2025CN9505..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Wuhan China Star Optoelectronics Technology has applied WIPO patent for Display Device and Driving Method Therefor. Liu Jianxin and Han Baixiang developed it. The patent application number is WO2025CN87327 20250403. The patent publication number is WO2026199624 (A1). International Patent Classification code..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Yangtze Memory Technologies has submitted a patent application for Semiconductor Devices and Fabricating Methods Thereof. This invention was developed by Li Da, Yuan Bin, Yang Na, Jiang Li, Zhou Wenbin, Miao Zhenyu, Huo Zongliang and Xu Wei. The patent application number is WO2025CN84660 20250325. The paten..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- NVIDIA has sought patent for Accelerating Softmax with Mixed Precision Operations. This invention was developed by Ashcraft Matthew, Elkin Ilyas, Liu Elliot, Zhou Chao, Liu Jian, Siu Ming Yiu, Joseph Cherin, Ohannessian Robert, Tirumala Ajay Sudarshan and Boswell Brent. The patent application number is WO2026..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released Micron Technology patent application for Bridge Package for Wire Bonding in Stacked Semiconductor Devices, and Associated Systems and Methods. This invention was developed by Lum Wen Wei, Ng Hong Wan, Ye Seng Kim and Boo Kelvin. The patent application numb..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Micron Technology has submitted a patent application for Substrate Isolation in a Three Dimensional (3D) Memory Array. This invention was developed by Rajagopal Adharsh, Vamsi Krishna Nittala Pavani, Wong Sok Han, Yastrebenetsky Kolya and Daycock David. The patent application number is WO2026US17444 2026030..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Micron Technology has submitted a patent application for Microelectronic Devices, and Related Methods, Memory Devices and Electronic Systems. Jain Harsh Narendrakumar, Conti Anna Maria, Pedrazzetti Lorenzo, Samara Vladimir, Xu Lifang, Wells David H and Mazzone Giovanni developed the invention. The patent appl..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released Applied Materials patent application for Multi-process Injector Assemblies for Cyclic Processing, and Related Methods, Apparatus, and Processing Chambers. This invention was developed by Truemper Martin, Mariadass Adele, Washington Lori D, Choo Enle, Patil ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Lam Research has sought patent for Process Gas Delivery System. This invention was developed by Lakshmana Manjunatha H, Kumar Ashwin, Malavalli Lingaraju Pradeep Kumar, Doddamani Avinash Gouda and Ramachandraiah Vijayakumar. The patent application number is WO2026US15748 20260218. The patent publication numbe..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Micron Technology has submitted a patent application for Apparatus with Operational State Control Mechanism and Methods for Operating the Same. Dhiman Neha, Giradkar Milind, Banerjee Amiya, Viswanathan Sriram and Garg Nikhil developed the invention. The patent application number is WO2026US15357 20260213. The..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Applied Materials has filed a patent application for Cassette Assemblies for Substrate Processing Systems. This invention was developed by Nguyen Andrew, Subramanian Dhivanraj, Nguyen Chau, Venkatagiriyappa Vijayabhaskara and Yow Sue-ann. The patent application number is WO2026US14988 20260212. The patent pub..

Semiconductor

  |  Tue 13 Oct 2026

Beijing, Oct. 13 -- Chinese Patent for Water Cooling Machine in Aluminum Substrate Production Line has been issued to Zhangjiagang Demeisi Machinery Equipment. This invention was developed by Zhou Benfu, Tian Fangyuan and Song Qi. The patent application number is CN202520446036U 20250314. The patent publication number is CN2238..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has received Rapidus patent application for Semiconductor Device. Iwai Takaaki, Ishihara Keita and Tajima Hiroaki developed the invention. The patent application number is WO2025JP43962 20251216. The patent publication number is WO2026203578 (A1). International Paten..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released TDK patent application for Multilayer Substrate Module and Method for Manufacturing Same. This invention was developed by Tsuyutani Kazutoshi and Watanabe Shinsuke. The patent application number is WO2025JP39945 20251114. The patent publication number is..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has published NAMICS Corporation patent application for Epoxy Resin Composition, Cured Product, Semiconductor Device, and Production Method for Semiconductor Device. The invention was developed by Nakayama Yousuke and Yamazawa Tomoya. The patent application number is W..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released Panasonic Intellectual Property Management patent application for Dc Breaker. This invention was developed by Hosoi Hiroyuki, Oishi Masayuki and Fujita Yuga. The patent application number is WO2025JP39064 20251107. The patent publication number is WO2026..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released Shindengen Electric Manufacturing patent application for Trench Schottky Barrier Diode. This invention was developed by Suemoto Ryuji, Osawa Akihiko and Hashimoto Masaki. The patent application number is WO2025JP23031 20250626. The patent publication num..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- FANUC has submitted a patent application for Numerical Control Device. This invention was developed by Oota Yuu. The patent application number is WO2025JP12988 20250328. The patent publication number is WO2026203366 (A1). International Patent Classification codes are B23Q15/12, G05B19/18, G05B19/4093, G05B1..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released Hirata Spinning patent application for Substrate Conveyance Device. This invention was developed by Matsumoto Kei. The patent application number is WO2025JP12979 20250328. The patent publication number is WO2026203363 (A1). According to the abstract rele..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Kyocera has filed a patent application for Optical Element Substrate Manufacturing Method, Optical Communication Substrate, Optical Communication Device, Optical Element Substrate, and Optical Communication Substrate Manufacturing Method. This invention was developed by Kawaguchi Yoshinobu and Kamikawa Takeshi..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released Kyocera patent application for Optical Element Substrate, Method for Manufacturing Optical Element Substrate, and Method for Manufacturing Optical Communication Substrate. This invention was developed by Takeuchi Taro. The patent application number is WO20..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Mitsubishi Electric has applied WIPO patent for Optical Semiconductor Device and Method for Manufacturing Optical Semiconductor Device. Yoneda Yutaka developed it. The patent application number is WO2025JP12698 20250328. The patent publication number is WO2026203261 (A1). International Patent Classification..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Shindengen Electric Manufacturing has applied WIPO patent for Electronic Module. Kyutoku Atsushi and Umeda Soichiro developed it. The patent application number is WO2025JP12544 20250327. The patent publication number is WO2026203223 (A1). The abstract of the patent published by the World Intellectual Pr..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Idemitsu Kosan has filed a patent application for Semiconductor Device. This invention was developed by Sunagawa Misa, Tsuruma Yuki and Tomai Shigekazu. The patent application number is WO2025JP12275 20250326. The patent publication number is WO2026203159 (A1). International Patent Classification codes are ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Idemitsu Kosan has applied WIPO patent for Transistor and Semiconductor Device. Sunagawa Misa, Tsuruma Yuki and Tomai Shigekazu developed it. The patent application number is WO2025JP12262 20250326. The patent publication number is WO2026203156 (A1). International Patent Classification codes are H10D30/01, H1..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Sharp has submitted a patent application for Light-emitting Element, Method for Manufacturing Light-emitting Element, and Light-emitting Material. This invention was developed by Qu Yang. The patent application number is WO2025JP11548 20250324. The patent publication number is WO2026203028 (A1). Internation..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released Socionext patent application for Semiconductor Device, Semiconductor Product, and Information Processing Device. This invention was developed by Bando Yoji. The patent application number is WO2025JP11462 20250324. The patent publication number is WO2026203..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Lam Research has submitted a patent application for Porous Component for a Processing Tool. This invention was developed by Gehani Sandeep, Bodapati Bolla Reddy, Patil Ravikumar, Powar Amit Suresh and Varadharajan Srikkanth. The patent application number is WO2026US18964 20260312. The patent publication numbe..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- SK Hynix Nand Product Solutions has submitted a patent application for Spatial Prioritization for Memory Writes. This invention was developed by Carlton David B, Wakchaure Yogesh, Vishwanath Darshan Mallapur and Khan Mohammad Nasim Imtiaz. The patent application number is WO2026US18576 20260310. The patent pu..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Microchip Technology has submitted a patent application for Field Effect Transistor Having a Gate Oxide with a Low Dielectric Constant. This invention was developed by Pandey Shesh Mani. The patent application number is WO2026US18543 20260310. The patent publication number is WO2026198281 (A1). International ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Qualcomm has sought patent for Package Comprising a Substrate with Improved Via Interconnect Configuration for Improved Thermal Performance. This invention was developed by Buot Joan Rey Villarba, Kang Kuiwon and Moon Hyun-il. The patent application number is WO2026US18098 20260306. The patent publication num..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released Applied Materials patent application for Scalable and Dynamic Multi-modal Chip Design Hotspot Classification. This invention was developed by Berkens Martinus Maria, Madhavan Sriram, Liu Tianchi and Dudekula Dastagiri. The patent application number is WO20..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Microchip Technology has sought patent for Method of Forming a Chiplet Device Prototype. This invention was developed by Kovats Julius Andrew. The patent application number is WO2025US46064 20250912. The patent publication number is WO2026198096 (A1). Cooperative Patent Classification codes are H10W70/60 (EP)..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has received Microchip Technology patent application for Fabrication Method Combining Laser Direct Imaging (LDI) and Photomask Processing. Kovats Julius Andrew developed the invention. The patent application number is WO2025US45862 20250911. The patent publication nu..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Silicon Storage Technology has filed a patent application for Dual Step Multi-level Cell Program Method for Non-volatile Memory. This invention was developed by Bedarida Lorenzo, Surico Stefano, Sivero Stefano, Do Nhan, Jourba Serguei, Moioli Giuseppe, Thiery Jean Francois, Liu Xian, Vo An, Bartoli Simone, Le ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has published Applied Materials patent application for Clamp for Clamping a Substrate, Carrier for Holding a Substrate in a Vacuum Deposition Process, and Method of Clamping a Substrate to a Carrier. The invention was developed by Li Yuehlin and Lin Chun-hung. The pa..

Semiconductor

  |  Tue 13 Oct 2026

Beijing, Oct. 13 -- Loncin Motor has been granted a patent for Bearing Frame of General Type Outside-groove Electroplating Hanger for Cylinder Hole. This invention was developed by Nie Jin, Wen Jiayong, He Chao, Xu Guangfu and Huang Tanjuan. The patent application number is CN20242325985U 20241204. The patent publication number..

Semiconductor

  |  Tue 13 Oct 2026

Beijing, Oct. 13 -- Chinese Patent for Universal Outside-groove Electroplating Assembly for Cylinder Hole has been issued to Loncin Motor. This invention was developed by Nie Jin, Wen Jiayong, He Chao, Xu Guangfu and Huang Tanjuan. The patent application number is CN20242325899U 20241204. The patent publication number is CN2238..

Semiconductor

  |  Tue 13 Oct 2026

Beijing, Oct. 13 -- Chinese Patent for Cylinder Hole General Type Outside-groove Electroplating Device has been issued to Loncin Motor. This invention was developed by Nie Jin, Wen Jiayong, He Chao, Xu Guangfu and Huang Tanjuan. The patent application number is CN20242325880U 20241204. The patent publication number is CN2238237..

Semiconductor

  |  Tue 13 Oct 2026

Beijing, Oct. 13 -- Semiconductor Integrated Display Technology has been granted a patent for Glass Substrate Support Structure for Vacuum Thermal Evaporation. Pan Jie developed the invention. The patent application number is CN202520463233U 20250317. The patent publication number is CN223823692 (U). International Patent Classi..

Semiconductor

  |  Tue 13 Oct 2026

Beijing, Oct. 13 -- Kunshan Shengcheng Photoelectric Technology has been granted a patent for Insulation Structure for Magnetron Sputtering Coating Substrate Transmission. This invention was developed by Lin Chaoliang, Yin Peiyan, Song Xiaojin, Hu Yuhang, Li Wei, Yang Xing, Zhou Wenbin and Zu Guoliang. The patent application nu..

Semiconductor

  |  Tue 13 Oct 2026

Beijing, Oct. 13 -- Chinese Patent for Clamp of Semiconductor Device has been issued to Jiangsu Jicui Institute of Organic Optoelectronics. This invention was developed by Huang Jing, Yin Yao, Gan Tianyue and Geng Wenkang. The patent application number is CN202422937264U 20241129. The patent publication number is CN223820305 (U..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Information Processing Device and Method, and Program. This invention was developed by Yoshida Tomoharu and Tsuruma Takeyuki. The patent application number is WO2026JP08634 20260306. The patent publication number is WO2026204251..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released Sony Semiconductor Solutions Corporation patent application for Photodetection Element. This invention was developed by Daicho Akira, Kaneda Yuma, Fujimoto Takuma and Suzuki Ryoji. The patent application number is WO2026JP08633 20260306. The patent publi..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has published Fujifilm patent application for Resin Composition, Transfer Film, Cured Product, Laminate, Method for Producing Cured Product, Method for Producing Laminate, Method for Producing Semiconductor Device, and Semiconductor Device. The invention was developed b..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has published Mitsubishi Gas Chemical patent application for Resin Composition, Cured Product, Resin Composite Sheet, Prepreg, Metal Foil-clad Laminate, Printed Wiring Board, and Semiconductor Device. The invention was developed by Itoh Syouichi, Kamata Yuji, Yamamoto K..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Semiconductor Device. Aiba Ruito developed the invention. The patent application number is WO2026JP07955 20260303. The patent publication number is WO2026204165 (A1). International Patent Classification codes are H10D30/60, H10D..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Stanley Electric has applied WIPO patent for Semiconductor Light-emitting Device and Method for Manufacturing Semiconductor Light-emitting Device. Ito Hayao developed it. The patent application number is WO2026JP07700 20260302. The patent publication number is WO2026204137 (A1). International Patent Classific..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Sony Semiconductor Solutions Corporation has applied WIPO patent for Semiconductor Element and Semiconductor Device. Fukai Yutaro developed it. The patent application number is WO2026JP07351 20260227. The patent publication number is WO2026204107 (A1). International Patent Classification codes are H10D30/67, ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- NAMICS Corporation has submitted a patent application for Curable Resin Composition, Adhesive, Sealing Material, Cured Product, Semiconductor Device and Electronic Component. This invention was developed by Saito Atsushi, Iwashita Honoka and Suzuki Fumiya. The patent application number is WO2026JP07082 202602..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Panasonic Holdings has sought patent for Solar Cell. This invention was developed by Yamamoto Takayuki, Sekimoto Takeyuki and Shirataki Hiroshi. The patent application number is WO2026JP06492 20260220. The patent publication number is WO2026204023 (A1). International Patent Classification codes are H10K30/4..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released Panasonic Intellectual Property Management patent application for Semiconductor Chip. This invention was developed by Asano Yuto and Yamawaki Shota. The patent application number is WO2026JP06374 20260220. The patent publication number is WO2026204016 (A..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Semiconductor Device. This invention was developed by Shingu Takuya and Sato Daichi. The patent application number is WO2026JP05739 20260217. The patent publication number is WO2026203963 (A1). International Patent Classificatio..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has released Sony Semiconductor Solutions Corporation patent application for Spatial Light Modulator. This invention was developed by Isomae Yoshitomo. The patent application number is WO2026JP05677 20260217. The patent publication number is WO2026203955 (A1). Intern..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Sony Semiconductor Solutions Corporation has sought patent for Semiconductor Device. This invention was developed by Haneda Masaki and Matsumoto Koichi. The patent application number is WO2026JP05247 20260213. The patent publication number is WO2026203912 (A1). International Patent Classification codes are ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has published Nissha patent application for Gas-sensitive Material, Semiconductor Gas Sensor, and Gas Detection Method. The invention was developed by Hanada Mariko. The patent application number is WO2026JP04419 20260206. The patent publication number is WO2026203865 ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Sony Semiconductor Solutions Corporation has sought patent for Light-emitting Device. This invention was developed by Shiomi Michinori, Tanaka Masayuki, Yokozeki Mikihiro, Watanabe Tomomasa and Takanohashi Masashi. The patent application number is WO2026JP03726 20260203. The patent publication number is WO2..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Power Supply Device and Semiconductor Device. This invention was developed by Hotta Kaihei. The patent application number is WO2026JP03596 20260202. The patent publication number is WO2026203810 (A1). International Patent Classifi..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Sony Semiconductor Solutions Corporation has filed a patent application for Semiconductor Device and Storage Element. This invention was developed by Naritake Isao and Kanda Yasuo. The patent application number is WO2026JP03326 20260130. The patent publication number is WO2026203800 (A1). International Pate..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Sony Semiconductor Solutions Corporation has sought patent for Information Processing Device and Program. This invention was developed by Sakoda Gen and Shimizu Kazuhiro. The patent application number is WO2026JP03304 20260130. The patent publication number is WO2026203797 (A1). International Patent Classif..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has received Murata Manufacturing patent application for Substrate and Electronic Component Module. Nakano Koichi developed the invention. The patent application number is WO2026JP02377 20260126. The patent publication number is WO2026203748 (A1). International Paten..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- World Intellectual Property Organization has received Fasford Technology patent application for Semiconductor Manufacturing Device, Application Device, Application Method, and Method for Manufacturing Semiconductor Device. Yoda Mitsuo and Horikawa Kazuo developed the invention. The patent application number i..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Ushio Electric has submitted a patent application for Light Receiving/emitting Package. Komiya Takeshi and Moriyasu Kengo developed the invention. The patent application number is WO2026JP01636 20260120. The patent publication number is WO2026203719 (A1). International Patent Classification codes are H10F55..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Furukawa Electric has filed a patent application for Substrate Assembly and Intervening Component. This invention was developed by Nishizaki Kensho, Nasu Hideyuki, Yoshida Wataru and Nagashima Kazuya. The patent application number is WO2026JP01495 20260119. The patent publication number is WO2026203710 (A1). ..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Panasonic Intellectual Property Management has submitted a patent application for Drive Circuit. This invention was developed by Mukoyama Ayumu. The patent application number is WO2026JP01056 20260115. The patent publication number is WO2026203692 (A1). International Patent Classification codes are H02M3/07..

Semiconductor

  |  Wed 14 Oct 2026

Geneva, Oct. 13 -- Rapidus has filed a patent application for Semiconductor Device Manufacturing Method and Semiconductor Device. This invention was developed by Sasaki Yuichiro, Iwai Takaaki, Ishihara Keita, Kawakami Tappei and Hasegawa Tomo. The patent application number is WO2026JP00281 20260107. The patent publication numbe..
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