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Semiconductor
| Thu 23 Jul 2026
Beijing, July 23 -- Guangdong University of Technology and Zhuhai Jieli Technology Co Ltd have submitted a patent application for 7t Memory Cells for Static Random Access Memory, Related Methods and Products. This invention was developed by Huang Haitao and Cai Shuting.
The patent application number is CN202511696555 20251119..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 23 -- China Electric Equipment Group and Xuji Electric have submitted a patent application for Valve Layer Unit Based on Reverse Blocking Type IGCT. This invention was developed by Li Fei, Zhang Cheng, Hao Xiaohan, Chen Benqian, Du Yuge, Jia Yanling, Xiao Jin, Jiao Yangyang and Wang Peng.
The patent application ..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Piao Longnan has submitted a patent application for PCB Connected with RGB LED Packaging Structure.
The patent application number is CN202310700061 20230614. The patent publication number is CN121924932 (A). International Patent Classification codes are H10H29/24 and H10H29/85.
State Intellectual Propert..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Chengdu Huaxing Dadi Tech Co Ltd has submitted a patent application for Novel Low-cost High-isolation Multichannel Tr Sip Packaging Structure. This invention was developed by Wang Hongquan, Zhu Wei, Yue Guotao, Zhang Mengdi and Sun Sicheng.
The patent application number is CN202610297202 20260312. The pate..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has received Chipmore Technology and Hefei Chipmore Tech Corporation Limited patent application for Semiconductor Packaging Structure and Preparation Method Thereof. Wang Xiaofeng, Bae Sang-dong, Chen Hao and Zeng Chao developed the invention.
The patent applicat..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- East China Institute Optoelectronic Integrated Device has submitted a patent application for Patterned Preparation Method of Getter in Deep Cavity of Wafer-level Packaging Cap. Chen Jing, Zeng Mingming, Wang Siwei, Song Dongfang, Qiao Wei and Song Ning developed the invention.
The patent application number..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 23 -- Hunan Ximao Semiconductor Co Ltd has sought patent for Capacitor or Inductor Packaging Structure and Packaging Method Thereof. This invention was developed by Liu Hairui, Zhi Feilong, Pei Yanjie, Lu Yiping and Lu Yujiao.
The patent application number is CN202610233990 20260227. The patent publication numbe..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Xidian Wuhu Research Institute has submitted a patent application for Multi-channel Schottky Diode with Stepped Junction Termination Structure and Preparation Method of Multi-channel Schottky Diode. This invention was developed by Xiao Ming, Li Guoliang, Zhang Jincheng and Chen Xing.
The patent application..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Suzhou Laboratory has submitted a patent application for Ferroelectric Random Access Memory and Manufacturing Method Thereof. Wang Xinpeng, Tong Yi and Xiang Heng developed the invention.
The patent application number is CN202610385905 20260327. The patent publication number is CN121924759 (A). Internation..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Alpha & Omega Semiconductor L P has submitted a patent application for Recessed Virtual Single Trench Gate IGBT. Xue Hongyong, Li Wenjun, Guo Zhibo, Zhang Lei, Wang Jian, Bode Madhur and Padmanabhan Karthik developed the invention.
The patent application number is CN202511498860 20251020. The patent public..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Liang Haixia has submitted a patent application for Solar Cell and Manufacturing Method Thereof.
The patent application number is CN202311219233 20230921. The patent publication number is CN121924864 (A). International Patent Classification codes are H10F19/00, H10F71/00 and H10P72/50. Cooperative Patent ..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 23 -- Yuanqixin Shandong Semiconductor Tech Co Ltd has submitted a patent application for Configurable Multi-protocol Bus Conversion Method and Device. This invention was developed by Li Bingkun, Wei Chaofei and Xu Guilong.
The patent application number is CN202511773451 20251128. The patent publication number i..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Guangzhou Zengxin Technology has submitted a patent application for Non-volatile Memory and Preparation Method Thereof. This invention was developed by Liu Xingye.
The patent application number is CN20261086594 20260121. The patent publication number is CN121924755 (A). International Patent Classification ..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has released Institute of Chemistry, Chinese Academy of Sciences patent application for Color-adjustable Light-emitting Diode Capable of Being Used for Counterfeiting Prevention and Preparation Method and Application of Color-adjustable Light-emitting Diode. This in..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- LT Materials has filed a patent application for Heterocyclic Compound, Organic Light-emitting Device, and Composition for Organic Material Layer of Organic Light-emitting Device. This invention was developed by Lee Hyun-ju, Seo Young-beom, Kim Dong Jun, Choi Dae-hyuk and No Young-seok.
The patent applicati..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 23 -- Yangtze Memory Technologies has sought patent for Memory, Operating Method Thereof and Memory System. This invention was developed by You Kaikai, Jia Jianquan, Jin Lei, Song Yali and Liu Gang.
The patent application number is CN202411489082 20241023. The patent publication number is CN121922178 (A). Intern..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has released Macronix patent application for Memory Device, System and Operating Method Thereof. This invention was developed by Zhang Qinhong, Fan Zhenjia, Ke Siyu and Chen Genghui.
The patent application number is CN202511189194 20250825. The patent publication..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 23 -- Hefei Kaimeng Tech Co Ltd has submitted a patent application for Memory Management Method and Storage Device. This invention was developed by Chai Wenjun and Zhu Qi'ao.
The patent application number is CN202610273528 20251014. The patent publication number is CN121922181 (A). International Patent Classific..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Geke Semiconductor Shanghai Co Ltd has filed a patent application for Processing Method for Improving Process Defects of Image Sensor. This invention was developed by Liu Kaifan, Chen Lin and Wang Shaowei.
The patent application number is CN202411489623 20241023. The patent publication number is CN12192485..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has published Geke Semiconductor Shanghai Co Ltd patent application for Backside Illuminated Image Sensor, Manufacturing Method Thereof and Wafer Bonding Method. The invention was developed by Sun Ran, Li Ming and Huang Jihe.
The patent application number is CN20..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has received China Electronic Technology Group Corporation No. 18 Research Institute patent application for Thin Film Solar Cell String Assembly and Preparation Method Thereof. Guo Hongliang, Li Yuze, Liu Rubin, Yang Yitong, Zhang Heng, Liu Weiwu and Yao Liyong deve..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has received Yangzhou Carbon Zhonghe Technology Innovation Research Center Of Yangzhou University and Yangzhou University patent application for Radiation-proof Ultrathin P-type Crystalline Silicon Cell and Preparation Method Thereof. Wen Xiangli, Jiang Yaoyao, Ding..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has released China Electronic Technology Group Corporation No. 18 Research Institute patent application for Germanium-based Four-junction Quantum Well Solar Cell and Preparation Method Thereof. This invention was developed by Guo Hongliang, Liu Rubin, Zhang Qiming, ..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has published China Electronic Technology Group Corporation No. 18 Research Institute patent application for Germanium Substrate-based Three-junction Gallium Arsenide Solar Cell and Preparation Method Thereof. The invention was developed by Guo Hongliang, Liu Rubin,..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Guangdong Xinyueneng Semiconductor Co Ltd has submitted a patent application for Cellular Structure for Silicon Carbide Power Device and Preparation Method Thereof. This invention was developed by Zeng Xiang, Xiang Qi, Li Tiantian and Yu Kaiqing.
The patent application number is CN202610102515 20260126. Th..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has received Shenzhen Chuangfei Xinyuan Semiconductor Co Ltd patent application for Bidirectional Blocking Semiconductor Device and Preparation Method Thereof. Tian Yuejiao and Yang Xugang developed the invention.
The patent application number is CN202610344768 2..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Unicompound Semiconductor Corp has filed a patent application for Patterning Process for Improving Climbing Coverage of Metal Electrode of Semiconductor Device. This invention was developed by Wu Jing, Huang Guangwei, Chen Jianxing, Zhang Chaomin and Chen Chao.
The patent application number is CN2025118453..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Guangzhou Chenwei Electronic Tech Co Ltd has applied Chinese patent for Preparation Method of Silicon Carbide Ohmic Contact, Ohmic Contact Structure and Silicon Carbide Device. Tang Bin, Chen Xuping, Yin Xiangyang, Liu Wei, Deng Yun, Li Yanqiang and Guo Ming developed it.
The patent application number is C..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has received Wuxi Fouying Microelectronics Tech Co Ltd patent application for High-frequency Silicon Capacitor and Manufacturing Method Thereof. Yin Qing, Chen Tao and Wang Jingxuan developed the invention.
The patent application number is CN202511808642 20251203..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Sinoma Advanced Nitride Ceram Co Ltd has submitted a patent application for Method for Repairing Ceramic Heater for Semiconductor. This invention was developed by Wang Weiling, Liang Xi, Huang Shuo, Wei Zicheng, Li Xingli, Wang Zaiyi, Zong Tinghui, Wang Yufeng, Wang Lu, Li Yang, Gao Youshuai, Yang Hao, Lu Xia..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Jinruihong Micro Electronic Quzhou Co Ltd has submitted a patent application for Processing Method of Heavily-doped Substrate Silicon Wafer and Epitaxial Wafer Formed by Heavily-doped Substrate Silicon Wafer. This invention was developed by Xu Man, Xu Yulin, Li Bin, Zhu Zhiwei, Gao Pengfei, Liang Xingbo, Liu ..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has released Wuxi China Resources Micro Assembly Tech Co Ltd patent application for Chip Trimming Test Method and Chip Trimming Test System. This invention was developed by Yin Hao, Guo Hailong and Feng Quanshui.
The patent application number is CN202411471290 20..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Hwatsing Beijing Tech Co Ltd has sought patent for Wafer Clamping Mechanism and Wafer Cleaning Device. This invention was developed by Liu Fusheng, Xu Juncheng and Liu Xiaoyan.
The patent application number is CN202610115453 20260128. The patent publication number is CN121925091 (A). International Patent C..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has released China Electronic Product Reliability And Environmental Testing Research Institute The Fifth Electronic Re patent application for Chip Clamping Tool and Chip Cleaning Device. This invention was developed by Xiang Jian, Wang Xiaoqiang, Kang Xiongbing, Zha..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Jiangsu Mingjing Precision Tech Co Ltd has applied Chinese patent for Ceramic Electrostatic Chuck for High-temperature Semiconductor. Cai Kuikui, De Carpendiere Hendrik and Liu Anfeng developed it.
The patent application number is CN20251209585 20251229. The patent publication number is CN121925085 (A). In..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Jiangsu Dongxu Electronic Tech Co Ltd has submitted a patent application for Positioning Method for Silicon Wafer Cutting Technology. This invention was developed by Fan Ming and Liu Meijiao.
The patent application number is CN202310858543 20230713. The patent publication number is CN121925081 (A). Interna..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Hangzhou Xingyuanchi Semiconductor Co Ltd has sought patent for Sliding Type Wafer Box Loading Device for Batch Epitaxial Equipment. This invention was developed by Qi Biao, Shi Haoran, Duan Qiqi, Shao Dali and Liu Zichan.
The patent application number is CN202610387201 20260327. The patent publication num..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Hwatsing Beijing Tech Co Ltd has submitted a patent application for Wafer Processing Device, Liquid Supply Assembly and Wafer Processing Method. This invention was developed by Zhang Meimei, Lu Xiaoxiao, Xu Juncheng and Wang Peng.
The patent application number is CN202610353247 20260323. The patent publica..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Forty Eighth Research Institute Of China Electronics Technology Group Corporation has filed a patent application for Compatible Automatic Wafer Transfer System for Epitaxial Equipment and Wafer Transfer Control Method. This invention was developed by Xie Tianle, Wan Shengqiang and Wu Xian.
The patent appli..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Ebersolic Inc has sought patent for Method for Pre-adjusting Processing Surface of Glass Substrate for Glass Substrate Semiconductor Packaging. This invention was developed by Yoon Sang-min and Kim Youn Joon.
The patent application number is CN202511505625 20251021. The patent publication number is CN12192..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Beijing Zhichuang Xinyuan Tech Co Ltd has sought patent for Substrate Surface Cleaning Method and Device. This invention was developed by Li Kexin.
The patent application number is CN202610107022 20260127. The patent publication number is CN121925052 (A). International Patent Classification codes are H10P7..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has released Jiangsu Tanglong Electronic Tech Co Ltd patent application for Semiconductor Chip Splitting Machine. This invention was developed by Li Jiaxi, Wan Xing and Zhao Yunfei.
The patent application number is CN202610108163 20260127. The patent publication ..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Huzhou Chunhuo Photoelectric Co Ltd has submitted a patent application for Broadband-gap Inverted Perovskite Solar Cell and Preparation Method Thereof. Qin Jinzhao, Hou Tian, Jia Weikuan, Li Rui and Huang Yuelong developed the invention.
The patent application number is CN20261086243 20260122. The patent p..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Ningbo Institute Materials Technology & Eng CAS has applied Chinese patent for Perovskite Solar Cell and Preparation Method Thereof. Yang Mengjin, Ge Ziyi and Gao Simeng developed it.
The patent application number is CN202511962483 20251224. The patent publication number is CN121924944 (A). International P..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Yicai Xinguang Tech Ningbo Co Ltd has filed a patent application for Multi-color Miniature Light Emitting Diode Light Emitting Structure Capable of Resisting CMP Quenching and Preparation Method of Multi-color Miniature Light Emitting Diode Light Emitting Structure. This invention was developed by Li Fei and ..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Huaian Aucksun Optoelectronics Tech Co Ltd has sought patent for Interconnected Pixel Array Transfer Method, Interconnected Pixel Array and Micro Pixel Chip. This invention was developed by Liang Fubo, Zhao Yushuai, Liu Zhaoyu, Chang Jong-hoon and Zhao Ya.
The patent application number is CN202610123774 20..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Hefei Taiwo Intelligent Equip Co Ltd has submitted a patent application for Integrated Gray-scale Micro-nano Structure Led Chip and Preparation Method Thereof. This invention was developed by Zhang Yarong, Zheng Tianqi and Li Jinbang.
The patent application number is CN202610127596 20260129. The patent pub..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- China Electronic Technology Group Corporation No. 18 Research Institute has applied Chinese patent for Bragg Reflector with Asymmetric Reflection and Solar Cell. Guo Hongliang, Li Yuze, Liu Rubin, Xue Chao, Zhang Qiming and Zhang Heng developed it.
The patent application number is CN20251229613 20251230. T..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Wuxi Jiangsong Science And Tech Co Ltd has submitted a patent application for Half-piece Type Silicon Wafer Inserting Device and Process. This invention was developed by Wang Xuebei, Hua Chen, Hui Xiang and An Di.
The patent application number is CN202511919304 20251218. The patent publication number is CN..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has received Suzhou Jingtuo Semiconductor Tech Co Ltd patent application for Crystalline Silicon Solar Cell Ozone Gas Passivation Equipment. Ai Fanfan developed the invention.
The patent application number is CN202511812367 20251204. The patent publication number..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Beiyi Semiconductor Tech Guangdong Co Ltd has submitted a patent application for IGBT DBC Substrate Solder Paste Printing Carrier. This invention was developed by Seo Hyung-ki and Zhuang Yunmei.
The patent application number is CN202610372918 20260325. The patent publication number is CN121912700 (A). Inte..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Hubei Xida Semiconductor Tech Co Ltd has applied Chinese patent for Quartz Substrate Constant-temperature Pressure Bonding and Stress Relieving Equipment. Huang Zhenghao and Ma Xiaoge developed it.
The patent application number is CN202610237756 20260228. The patent publication number is CN121912693 (A). I..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Hengmei Photoelectric Co Ltd has submitted a patent application for Preparation Method of Reverse Wavelength Dispersion Optical Compensation Film for OLED (organic Light Emitting Diode) and Polarizer. This invention was developed by Tanizawa Sho, Lu Wanze, Yang Tongsheng and Xu Yongsan.
The patent applicat..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Sucai Metal Jiangsu Co Ltd has sought patent for High-temperature Melting and Laminating Process for PVDF (polyvinylidene Fluoride) Film and Metal Substrate. This invention was developed by Gao Wenbin and Yang Xu.
The patent application number is CN202610126047 20260129. The patent publication number is CN..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Wen Congling has submitted a patent application for Silicon Carbide and Silicon Nitride Ceramic Material and Application Thereof in Cylindrical Connecting Rod of Injection Molding Machine.
The patent application number is CN202610116055 20260128. The patent publication number is CN121912547 (A). Internati..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Anhui Chuangrui Electronic Co Ltd has submitted a patent application for Semiconductor Wafer Scribing and Segmenting Device and Method for Integrated Circuit Manufacturing. Cheng Benzheng, Gong Rui and Xu Guozhu developed the invention.
The patent application number is CN202610274054 20260307. The patent p..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has released Baotou Canadian Solar Energy Tech Co Ltd and Suzhou CSI Solar Power Technology patent application for Preparation Method of Silicon Wafer and Silicon Wafer. This invention was developed by Liu Shilong, Yuan Weijin, Xiong Haibo and Lin Yongsheng.
The ..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has released Hefei Jinjinye Intelligent Control Glass Tech Co Ltd patent application for Polishing Equipment for Processing Semiconductor Glass Substrate. This invention was developed by Wang Anrui, Han Jianzhong and Wang Zhanxun.
The patent application number is..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Jonark Cnc Equipment Jiangsu Co Ltd has sought patent for Numerical Control Milling Machine Convenient for Chip Removal. This invention was developed by Qian Zhengbei, Zhang Xiaoming, Yang Wei, Mi Yuejun, Wang Lei and Gao Xingtong.
The patent application number is CN202610123766 20260129. The patent public..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Jianmin Hardware Tech Dongguan Co Ltd has filed a patent application for Aluminum Shell Magical Color Pattern Substrate Engraving Equipment. This invention was developed by Lin Shunjie.
The patent application number is CN202610218989 20260224. The patent publication number is CN121912223 (A). International..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has published Zhejiang Tuofengwei Semiconductor Tech Co Ltd patent application for Press Fitting Device and Method for High-power Semiconductor Device Module. The invention was developed by Liu Kaifeng and Jiang Xiaofeng.
The patent application number is CN202610..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has released Xi'an Mingyang Electric Power Tech Co Ltd patent application for Multi-specification Adjustable Press-fitting Equipment for Silicon Steel Iron Core Production. This invention was developed by Lu Yujun, Zhang Hongsheng and Lu Zhenmin.
The patent appli..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Suzhou Xiangyuanlong Electromechanical Co Ltd has filed a patent application for Rapid Positioning and Welding Structure for Steel Frame of Semiconductor Equipment. This invention was developed by Deng Yongbing, Long Xiaoyong and Kong He.
The patent application number is CN202610363578 20260324. The patent..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has received Shenzhen Shengyuan Semiconductors Co Ltd patent application for Wire Welding Machine Protection Device for Semiconductor Manufacturing. Chen Libin and Jia Runjie developed the invention.
The patent application number is CN202511949816 20251223. The p..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Zidian Semiconductor Tech Shenzhen Co Ltd has submitted a patent application for Dust Removal Method of Chip Test Equipment and Chip Test Equipment. This invention was developed by Jiang Ting and Zhou Jiangao.
The patent application number is CN20261089700 20260122. The patent publication number is CN12191..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has released Shenzhen Xinchuangyuan Prec Intelligent Manufacturing Co Ltd patent application for Method and System for Selecting Cover Tape Film Material Meeting Cpk Value of Semiconductor Packaging. This invention was developed by Chang Guoqiang, He Zhiping and Li ..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has published Zhuiguang Biotechnology Shenzhen Co Ltd patent application for Micro-fluidic Chip, Bonding Jig and Preparation Method of Micro-fluidic Chip. The invention was developed by Xie Hainan, Zhang Weipeng and Xie Wei.
The patent application number is CN202..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Black Semiconductor Netherlands BV has submitted a patent application for Carrier Stack for Transferring Two-dimensional (2d) Material to Target Substrate, and Method for Transferring 2d Material to Target Substrate. This invention was developed by Barnes Matthew David, Buscema Michel, Van Ryan Richard, Winkl..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Suanmiao Tech Beijing Co Ltd has submitted a patent application for Three-dimensional Integrated Circuit Chip and Design Method Thereof. This invention was developed by Yan Chao, Zhang Yusheng and Liu Ming.
The patent application number is CN20261030757 20260109. The patent publication number is CN12192516..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has published Shenzhen Liande Semiconductor Tech Co Ltd patent application for Assembly Equipment and Preparation Method of Semiconductor Structure. The invention was developed by Li Lihui, Wang Mingjun and Yang Xiao.
The patent application number is CN2026108914..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has received Shenzhen Shengling Electronic Information Co Ltd patent application for New Energy Automobile Control Chip Base Stable in Installation. Wu Yuanxin, Luo Xionglan, Wu Yuanhui, Wu Ruisheng, Wu Tiansheng and Wu Sisheng developed the invention.
The patent..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Tongfu Chaowei Suzhou Microelectronics Co Ltd has submitted a patent application for Chip, Chip Preparation Method and Chip Packaging Structure. This invention was developed by Zhu Shipeng, Zhu Jun, Jiao Jie and He Zhidan.
The patent application number is CN20261057698 20260116. The patent publication numb..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Shenzhen Sunshine Circuit Tech Co Ltd has submitted a patent application for Power Chip Packaging Method, Plastic Package Chip Unit and Power Module. Wang Shiming, Zhao Kaiguo, Xu Huasheng, Yan Jiahao and Zhang Boshen developed the invention.
The patent application number is CN20261097370 20260123. The pat..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Jiangsu Punuowei Electronic Co Ltd has submitted a patent application for Heterogeneous Integrated Substrate and Processing Method Thereof. This invention was developed by Chen Man, Yang Fei, Zong Xinru, Ma Hongwei and Sun Jiankai.
The patent application number is CN202511905496 20251217. The patent public..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Zhejiang Aoshou Material Tech Co Ltd has submitted a patent application for Chelating Type Semiconductor Chip Cleaning Agent as Well as Preparation Method and Application Thereof. Lyu Jing, Deng Ying, Hou Jun and Shu Shunxin developed the invention.
The patent application number is CN202511821429 20251205...
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Huizhou Speed Semiconductor Mat Co Ltd has submitted a patent application for OLED Panel Protection Delay UV Curing Filling Adhesive and OLED Display Module Production Method. This invention was developed by Hao Jianguo, Meng Lingbin, Huang Biwei and Li Wenyu.
The patent application number is CN20251190891..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Shanghai Niupa New Material Tech Co Ltd has applied Chinese patent for Novel Heat-resistant Organic Silicon Applied to Semiconductor Dust-free Workshop and Preparation Method of Novel Heat-resistant Organic Silicon. Wang Huiliang and Zhang Zhanxing developed it.
The patent application number is CN202610882..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Zhongshan Kangdisiwei Tech Co Ltd has submitted a patent application for UV Curing Slurry for First Protective Layer of Chip Resistor and Preparation Method of UV Curing Slurry. Wei Zhuokeng developed the invention.
The patent application number is CN202610275682 20260309. The patent publication number is ..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Zhongshan Kangdisiwei Tech Co Ltd has sought patent for UV Curing Slurry for Mk Layer of Chip Resistor and Preparation Method of UV Curing Slurry. This invention was developed by Wei Zhuokeng.
The patent application number is CN202610275744 20260309. The patent publication number is CN121914572 (A). Intern..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Jiangxi Sugao Mat Co Ltd has submitted a patent application for Pc Chip Carrier Tape Packaging Material and Preparation Method Thereof. This invention was developed by Hu Yijin, Kuang Huilin and Kuang Huibin.
The patent application number is CN20261079839 20260121. The patent publication number is CN121914..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Zhengzhou Institute Of Technology has submitted a patent application for Amino Modified Organic Silicon Material as Well as Preparation Method and Application Thereof. This invention was developed by Wang Lan, Feng Dandan, Cai Feng, Liu Congjun, Li Yuanyuan and Liu Mingyang.
The patent application number i..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has received Jiangsu Baotan Special Ceramics Tech Co Ltd patent application for Lost Foam Coating for Casting Molding of Silicon Nitride Combined with Silicon Carbide and Preparation Method of Lost Foam Coating. Xu Yuhu, Hei Xiangyuan and Wang Daohong developed the ..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Hubei Zhongci New Mat Co Ltd has submitted a patent application for Silicon Nitride Ceramic Formula and Preparation Process of Bearing Roller Matched with Silicon Nitride Ceramic Formula. This invention was developed by Xu Zudong, Bai Xiaolong and Cai Zhongming.
The patent application number is CN202610388..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has published Harbin Institute Of Technology patent application for High-polarity System Nano Silicon Nitride Photosensitive Ceramic Paste and Preparation Method Thereof. The invention was developed by Qiao Jing, Dong Hao, Li Longqiu, Shi Haotian, Tang Chenwei and Z..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Hebei Dingci Electronic Tech Co Ltd has sought patent for Tape-casting Slurry for Aluminum Oxide Multilayer Ceramic Substrate and Preparation Method and Application of Tape-casting Slurry. This invention was developed by Ai Xiaopei, Li Jie, Liang Pengjie, Li Lei, Zhu Bohua, Yan Kun, Gao Shan, Jin Huajiang and..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has released Shanghai Xinanna Electronic Tech Co Ltd and Zhejiang Xinchuangna Electronic Tech Co Ltd patent application for Colloidal Silicon Dioxide with High Solid Content and Preparation Method Thereof. This invention was developed by Wei Siqi and Kong Hui.
Th..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has received Guizhou Xicheng New Material Tech Co Ltd patent application for Substrate Growth Pulling Method for Ultra-long Few-walled Carbon Nanotube Array. Chen Xin, Wang Yimin and Qi Zhenzhen developed the invention.
The patent application number is CN20251230..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Suzhou Lingdu Perception Tech Co Ltd has applied Chinese patent for Infrared Focal Plane Array MEMS Chip and Preparation Method Thereof. Zuo Yuancheng, Ding Xuefeng and Li Xin developed it.
The patent application number is CN202610109207 20260127. The patent publication number is CN121913458 (A). Internati..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Beijing Ziyixin Integrated Circuit Co Ltd has sought patent for Packaging Structure for Continuous Blood Glucose Monitoring Chip and Process Thereof. This invention was developed by Guo Guiguan, Lin Zixiang and Guo Jianyun.
The patent application number is CN20261056899 20260116. The patent publication num..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Hangzhou Dechuang Energy Equip Co Ltd has submitted a patent application for Automatic Picking and Placing Mechanism for Silicon Steel Iron Core and Operation Method of Automatic Picking and Placing Mechanism. This invention was developed by Dong Qiang and Zhu Zixia.
The patent application number is CN2026..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Funing Xiexin Photovoltaic Tech Co Ltd has submitted a patent application for Feeding Mechanism for Silicon Wafer Sorting Machine. This invention was developed by Chen Xunliang and Kuraso.
The patent application number is CN202610236701 20260228. The patent publication number is CN121913275 (A). Internatio..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has released Guangzhou Xujing Tech Co Ltd patent application for Glass Substrate Cassette with Supporting Cantilever Provided with Rigid Flexible Short Damping Piece. This invention was developed by Chen Jing, Chen Liping and Huang Guangping.
The patent applicati..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has received Zhejiang Aoshou Material Tech Co Ltd patent application for Semiconductor Wafer Amination Cleaning Solution and Preparation Method and Application Thereof. You Xingyu, Lyu Jing, Ren Haonan, Hou Jun and Xiao Lincheng developed the invention.
The paten..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- Guangdong Jingci New Mat Co Ltd has applied Chinese patent for Silicon Carbide Chemical Vapor Deposition Equipment and Deposition Method Thereof. Chen Wenjie, Xu Canjun, Deng Qiyong, Hong Yuzhe, Chang Xinfeng and Tang Jiacheng developed it.
The patent application number is CN202610221040 20260224. The pate..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has released Songshan Lake Materials Laboratory and Hunan University patent application for Atomic-scale Thin V2o3 Two-dimensional Material, Cvd Synthesis Method and Application Thereof, and Electrical Device. This invention was developed by Liu Jianteng, Duan Xidon..
Semiconductor
| Wed 22 Jul 2026
Beijing, July 23 -- State Intellectual Property Office of China has received Beijing Sevenstar Huachuang Integrated Circuit Equipment Co Ltd patent application for Glass Substrate Frame Caching Device and Glass Substrate Coating Processing System. Pan Zhonghuai, Tian Yongan and Guo Liang developed the invention.
The patent ap..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 23 -- Zhuhai Yiteli New Mat Co Ltd has sought patent for High-volume-fraction Aluminum Silicon Carbide Surface Nickel Plating Method. This invention was developed by Yan Mingwei, Wang Jiahao, Wang Zhen and He Juan.
The patent application number is CN202511426111 20250930. The patent publication number is CN12193..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 23 -- Harbin Institute Of Technology Suzhou Research Institute has submitted a patent application for High-magnetism Composite Film Layer for Glass Substrate as Well as Preparation Method and Application of High-magnetism Composite Film Layer. This invention was developed by Song Xin, Zhang Xin, Yao Yan, Liu Yueyan..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 23 -- Shanghai Gaofan Tech Co Ltd has submitted a patent application for Cotton Fabric Modified Silicon Dioxide Super-hydrophobic Finishing Agent and Preparation Method Thereof. This invention was developed by Wu Kunming, Dai Pengcheng and Wu Fangfang.
The patent application number is CN202610188505 20260210. Th..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 23 -- Jingyan Yinong Beijing Seed Sci Tech Co Ltd has submitted a patent application for Broccoli Whole Genome 6k Liquid Phase Breeding Chip as Well as Special Single Nucleotide Polymorphism Variation Site and Application Thereof. Zhang Jian, Zhang Quan, Zhong Xionghui, Ding Yunhua, Guo Ning, Li Pan, Xu Yong, Wang ..
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