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Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has received Shenzhen Yspring Tech Co Ltd patent application for Chip Packaging Structure. Wen Chuanjing and Zhuang Tengfei developed the invention.
The patent application number is CN202510775805 20250611. The patent publication number is CN120565540 (A). Intern..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Qingdao Jiaen Semiconductor Tech Co Ltd has sought patent for Embedded Double-sided IGBT (insulated Gate Bipolar Translator) Module Packaging Structure and Manufacturing Method. This invention was developed by Wang Pilong, Wang Xinqiang and Yang Yuzhen.
The patent application number is CN202510510960 20250..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Semiconductor Mfg International Beijing Corp and Semiconductor Manufacturing International (Shanghai) patent application for Wafer, Manufacturing Method Thereof, Packaging Structure and Packaging Method. The invention was developed by Wang Yixin, Yan D..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has released Semiconductor Mfg International Beijing Corp and Semiconductor Manufacturing International (Shanghai) patent application for Semiconductor Structure, Forming Method Thereof, Packaging Structure and Method. This invention was developed by Sui Kai.
The..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has released Huatian Tech Jiangsu Co Ltd patent application for 2.5 D Packaging Method and Structure. This invention was developed by Fu Dongzhi and Ma Shuying.
The patent application number is CN202510689232 20250527. The patent publication number is CN120565431..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Jiangsu Pangu Semiconductor Tech Co Ltd patent application for Board-level High-thermal-conductivity Packaging Method and Structure. The invention was developed by Jiang Xinglong and Ma Shuying.
The patent application number is CN202510723698 202505..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has received Shenzhen Meixi Micro Vision Tech Co Ltd patent application for Self-adaptive Alignment Method of Chip Substrate. Yuan Chuzhuo, He Ximing and Wang Shuangqing developed the invention.
The patent application number is CN20251145962 20250729. The patent ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Elane Beijing Data Tech Co Ltd has filed a patent application for Ais Data Pricing Method and Device, Electronic Equipment, Readable Storage Medium and Chip. This invention was developed by Wang Guoliang.
The patent application number is CN202510595379 20250509. The patent publication number is CN120563183..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has released BOE Technology Group, Beijing Zhongxiangying Tech Co Ltd and Beijing BOE Technology Development patent application for Test Management Method and Test Management System for Test Wafer. This invention was developed by Ban Cheng, Zhang Libo, Wang Hong, Pa..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Sichuan Gaojing Solar Energy Technology and Gaojing Solar Energy patent application for Silicon Wafer Automatic Cargo Allocation Optimization Method and Device, Electronic Equipment and Medium. The invention was developed by Zhang Ziqiang, Ma Junsheng,..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Sice Huixin Suzhou Tech Co Ltd has applied Chinese patent for Novel Chip Detection Method. Zhang Gongchang, Wen Mingyou and Huang Mingzhi developed it.
The patent application number is CN202510696482 20250528. The patent publication number is CN120563467 (A). International Patent Classification codes are G..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Shenzhen City Meipusen Semiconductor Co Ltd patent application for Power Semiconductor Fault Detection Method and System Based on Multi-modal Data. The invention was developed by He Chang, Zhang Guangya and Li Junfeng.
The patent application number ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Wuhan Daqo Energy Tech Co Ltd has sought patent for Intelligent Calculation Method and System for Loss of Semiconductor Device. This invention was developed by Wu Meina, Chen Rongqiang, Wang Wenjin, Yu Zizhen and Hu Shiming.
The patent application number is CN202510632117 20250516. The patent publication n..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Zhan Changzhen has sought patent for Self-supporting Silicon Carbon Electrode Plate and Preparation Method Thereof.
The patent application number is CN202510626261 20250515. The patent publication number is CN120565555 (A). International Patent Classification codes are C01B32/225, C01B33/035, H01M4/04, H01M..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Mitsubishi Electric has sought patent for Semiconductor Device. This invention was developed by Miyahara Satoshi.
The patent application number is CN202510166973 20250214. The patent publication number is CN120565550 (A). International Patent Classification codes are H01L23/48, H01L23/52, H01L23/552 and H0..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Xinai Tech Nanjing Co Ltd has submitted a patent application for Packaging Structure of Low-stress Glass Substrate and Rewiring Layer. This invention was developed by Chen Minyao and Tong Jiajun.
The patent application number is CN202510749264 20250606. The patent publication number is CN120565546 (A). Int..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Guizhou Zhenhua Fengguang Semiconductor Co Ltd patent application for Semiconductor Module Packaging Structure and Semiconductor Module Packaging Method. The invention was developed by Chen Yuan, Zhang Jian, Gan Xianpeng, Geng Feng, Li Ping, Fu Jixian,..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- The 43th Research Institute Of China Electronics Tech Group Corporation has submitted a patent application for Metallized Ceramic Substrate with Vertically Interconnected Trapezoidal Through Holes and Preparation Method Thereof. This invention was developed by Liu Junfu, Wei Xin, Nie Qiangqiang, Wang Yansheng..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- ABLIC has filed a patent application for Semiconductor Device. This invention was developed by Kadoi Kiyoaki.
The patent application number is CN20251015755 20250106. The patent publication number is CN120565528 (A). International Patent Classification code is H01L23/495. Cooperative Patent Classification ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Huatian Tech Jiangsu Co Ltd has sought patent for High-density Double-sided Fine Wiring Fan-out Chip Packaging Structure and Method. This invention was developed by Fu Dongzhi and Ma Shuying.
The patent application number is CN202510506826 20250422. The patent publication number is CN120565521 (A). Interna..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Qili Semiconductor Shaoxing Co Ltd has sought patent for Chip Packaging Heat Dissipation Cover with Silicon Substrate Replacing Metal for Heat Conduction. This invention was developed by Xie Jianyou, Wang Jiawei, Zhang Hong and Zheng Lijie.
The patent application number is CN202510711853 20250529. The pate..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Nanjing Nari Semiconductor Co Ltd has submitted a patent application for Field Decoupling Type Substrate of Power Semiconductor Module. This invention was developed by Mo Shenyang, Li Shuaike, Tong Yan, Wang Yong, Luo Jian and Zhou Liang.
The patent application number is CN202510398781 20250401. The patent..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has released Tianxin Interconnection Tech Co Ltd patent application for Chip Packaging Structure and Packaging Method of Chip Packaging Structure. This invention was developed by Zhong Shijie, He Haiping, Song Guanqiang, Li Yuhong and Tao Du.
The patent applicati..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Sun Yat Sen University Shenzhen and Sun Yat-sen University patent application for High-thermal-conductivity Boron Arsenide Ceramic Substrate and Preparation Method and Application Thereof. The invention was developed by Mou Yun, Liu Ruijie, Wang Xinyua..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has received Guangdong Xinyueneng Semiconductor Co Ltd patent application for Cutting Method of Silicon Carbide Chip. Yuan Hao developed the invention.
The patent application number is CN202510754539 20250606. The patent publication number is CN120565502 (A). Int..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Shanghai Optical Communication Co Ltd has submitted a patent application for Wafer Bearing Device and Semiconductor Equipment. Li Shixiong developed the invention.
The patent application number is CN202410186048 20240219. The patent publication number is CN120565480 (A). International Patent Classification..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Hunan Lianxin Precision Tech Co Ltd has submitted a patent application for Self-positioning Detection Equipment for Chip Production. Cai Guo, Zeng Bin, Li Yuzhi and Hong Woo-jin developed the invention.
The patent application number is CN20251181125 20250804. The patent publication number is CN120565479 (A..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has released Shanghai Xinyuan Micro Entpr Development Co Ltd patent application for Wafer Turnover Device and Wafer Turnover Equipment. This invention was developed by Liu Tao, Peng Bo, Wang Rongxiang, Li Shuang, Xiao Jing, Song Xuanjie and Zhao Qi.
The patent ap..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Wuxi Xivi Tech Co Ltd has submitted a patent application for Intelligent Loading Equipment Compatible with Multi-size Wafer Cassettes and Control Method. This invention was developed by Lu Minjie, Wang Zhaokun and Liu Haohao.
The patent application number is CN20251147153 20250729. The patent publication n..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Sound Semiconductor Equipment Jiangsu Co Ltd patent application for Chip Inserting Machine for Semiconductor Wafer. The invention was developed by Chen Jiongjie, Zhang Xunkun, Hu Lei and Huang Feng.
The patent application number is CN202510827751 20..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Zhejiang Xinwei Taike Semiconductor Co Ltd has submitted a patent application for Method and System for Manufacturing Semiconductor Device. Yi Lan, Wang Chong, Chen Lunxing, Hu Zhijie and Ding Yonglu developed the invention.
The patent application number is CN20251164339 20250731. The patent publication nu..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Lianyungang Shengquan Quartz Tech Co Ltd has filed a patent application for Built-in Wafer Pushing Device for Semiconductor Quartz Tube. This invention was developed by Xu Bingran, Xu Bingjie and Li Gang.
The patent application number is CN20251163439 20250731. The patent publication number is CN120565467 ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Shanghai Xinyuan Micro Entpr Development Co Ltd patent application for Swing Arm Track Planning Method and Wafer Cleaning Machine. The invention was developed by Kang Ying, Zhang Xiaolong and Wang Yanhua.
The patent application number is CN202511618..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Safe Instr Chengde Co Ltd has filed a patent application for Efficient Cleaning and Degumming Integrated Equipment for Semiconductor Chip Manufacturing. This invention was developed by Sun Jianwen, Wang Yingli, Li Guannan, Zhang Hengqiang, Chen Hongli, Chen Zhen and Lin Fangning.
The patent application num..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- SC New Energy Technology has submitted a patent application for Semiconductor Process Furnace. Liu Huaiyue, Long Xiao and Lin Xiaojiao developed the invention.
The patent application number is CN202510960062 20250711. The patent publication number is CN120565463 (A). International Patent Classification cod..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Guojing Hechuang Qingdao Tech Co Ltd patent application for Flexible Substrate Processing Device. The invention was developed by Lyu Yong, Zhang Fuxuan, Cui Caoxiang, Zhang Chunyang, Guo Baijun and Li Xiaodong.
The patent application number is CN202..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Wentian Jingce Instrument Tech Suzhou Co Ltd has submitted a patent application for Heating and Cooling System for Wafer Bonding Equipment. This invention was developed by Zhao Tianbiao, Yang Peiyu and Jiang Jie.
The patent application number is CN202510754290 20250606. The patent publication number is CN1..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Fuzhou Langning Mould Co Ltd has sought patent for Efficient Silicon Wafer Cleaning Equipment for Manufacturing Solar Photovoltaic Cell Panel. This invention was developed by Zhang Wu.
The patent application number is CN202510740080 20250605. The patent publication number is CN120565458 (A). International ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has received Xinlian Integrated Circuit Manufacturing patent application for Statistical Process Control Method and Device. Liang Dongsheng, Xiang Lin, Wang Zheng, Liu Mengmeng, Li Shuwen and Wu Jianghua developed the invention.
The patent application number is C..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Qingdao Besland Semiconductor Tech Co Ltd has submitted a patent application for Control Method of Semiconductor Wafer Processing Equipment, Equipment and Medium. This invention was developed by Yang Zhen and Hara Keiryu.
The patent application number is CN202510597835 20250509. The patent publication numb..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Intel NDTM USA Inc has applied Chinese patent for FOSB Wafer Cassette Management Method and Wafer Handling System. Yang Yueqin, Li Hanlin and Dou Maoquan developed it.
The patent application number is CN202410231318 20240229. The patent publication number is CN120565441 (A). International Patent Classifica..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has released Suzhou Weixin Intelligent Tech Co Ltd patent application for Method for Non-contact Testing of Quantum Efficiency (EQE) and Short-circuit Current (ISC) of Solar Cell. This invention was developed by Zhang Yu, He Yifei and Xu Jianbing.
The patent appl..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Anhui Annuqi Tech Co Ltd patent application for Manufacturing Method of Semiconductor Structure. The invention was developed by Zhou Zhihu, He Chenggong and He Jun.
The patent application number is CN202510688941 20250527. The patent publication num..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Sanju Semiconductor Suzhou Co Ltd has filed a patent application for Metal Connecting Piece and Chip or Substrate Bonding Structure and Manufacturing Method Thereof. This invention was developed by Feng Kun, Zhao Haijun, Sun Sen and Ge Zhengdong.
The patent application number is CN202510630307 20250516. Th..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has released Powerchip Semiconductor Manufacturing Corporation patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Ni Peirong, Lyu Junlin, Lin Xiaojiang and Zhang Shouren.
The patent application number ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has received Shaoxin Labs patent application for Hgte Zero-dimensional Semiconductor Patterning Method Based on Orthogonal Ligand. Zhou Peng, Wang Jianlu, Guo Tianle, Liu Jingjing, Hu Zhourui and Qin Yilu developed the invention.
The patent application number is ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has received Dongguan Lizhi Grinding Tech Co Ltd patent application for Polishing Process of Semiconductor-level Monocrystalline Silicon Wafer Substrate. Zhou Qingyi, He Jinyuan and Gong Ting developed the invention.
The patent application number is CN20251067632..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Jiangsu Kaiweitesi Semiconductor Tech Co Ltd has submitted a patent application for Composite Functional Component for Semiconductor Reaction Equipment. This invention was developed by Ding Ruihua, Zhang Mu, Zhu Wenjian, Chen Kaiqing, Xue Hongyu, Gui Chuanshu and Yan Wangxue.
The patent application number ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Hefei Silergy Semiconductor Tech Co Ltd has filed a patent application for Inductor Structure and Manufacturing Method Thereof, Power Supply Module and Power Converter. This invention was developed by Dai Ke, Noritaka, Lou Xin, Huang Qiukai, Yan Jiajia and Li Chao.
The patent application number is CN202510..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- China Three Gorges University has filed a patent application for Spin Transistor Based on Edge Engineering Mos2 Nanobelt Heterojunction and Design Method. This invention was developed by Hu Gongwei, Eno, Chen Qiao, Liu Min, Yang Xianwei and Pan Liqing.
The patent application number is CN202510720867 202505..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Zhuhai Linglong Yuxin Tech Co Ltd has submitted a patent application for Chip Pin Multiplexing Control Circuit, Control Method Thereof and Chip. Chen Hao, Yang Yicong, Zhu Guozhong and Han Shuo developed the invention.
The patent application number is CN202510511978 20250423. The patent publication number ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Guanghe Technology, Guangzhou has applied Chinese patent for Correction Method and Device for Dielectric Constant of Circuit Board, Equipment and Storage Medium. Ni Haoran, Wang Guohui, Zhang Wenjie and He Dong developed it.
The patent application number is CN202510683724 20250526. The patent publication n..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Muxi Integrated Circuit (Shanghai) has applied Chinese patent for Method and Device for Generating Function Coverage Rate Based on Variable-length Data Packet and Medium. Yang Hanjia developed it.
The patent application number is CN20251174755 20250801. The patent publication number is CN120562354 (A). Int..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Shandong Aerospace Artificial Intelligence Safety Chip Res Institute has submitted a patent application for Artificial Intelligence Acceleration Operation Chip. Chen Weihua, Du Hui and Han Zhiwei developed the invention.
The patent application number is CN202510500055 20250421. The patent publication numbe..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has released Yuanqixin Shandong Semiconductor Tech Co Ltd patent application for Computational Graph Processing Method and Device Under Data Stream Architecture Chip and Electronic Equipment. This invention was developed by Tong Qisheng, Ge Junzheng and Liu Min.
..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Juzheng Tech Jiangsu Co Ltd has sought patent for Label Chip Equipped with Iic Interface and Design Method Thereof. This invention was developed by Kou Hongxia, Lu Jun and Zeng Hui.
The patent application number is CN20251154632 20250730. The patent publication number is CN120560732 (A). International Pate..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Juzheng Tech Jiangsu Co Ltd has submitted a patent application for Label Chip and Method and Device for Instruction Configuration of Iic Interface Information of Label Chip. This invention was developed by Kou Hongxia, Lu Jun and Zeng Hui.
The patent application number is CN20251154226 20250730. The patent..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has received Nanjing Panda Electronics Co patent application for Dynamic Upgrading Method Suitable for Small Memory and Small Storage Embedded Chip Cluster. Xie Jin, Wu Xiaohai, Li Zhiwei, Kuang Lin and Wang Jian developed the invention.
The patent application nu..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Suzhou Yuannao Intelligent Technology has applied Chinese patent for System on Chip, Management Method, Electronic Device, Storage Medium and Program Product. Zhang Chuang developed it.
The patent application number is CN20251163008 20250731. The patent publication number is CN120561075 (A). International ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Zhuhai Linglong Yuxin Tech Co Ltd has applied Chinese patent for Uart-based Multifunctional Interface Circuit, Control Method Thereof and Chip. Yang Yicong, Su Longjian, Chen Caiyue and Zhu Guozhong developed it.
The patent application number is CN202510665934 20250522. The patent publication number is CN1..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Muxi Integrated Circuit (Shanghai) has applied Chinese patent for Address Translation System Based on Shader Tracking Data. Wang Dongxing and He Yuyang developed it.
The patent application number is CN202510704726 20250529. The patent publication number is CN120560972 (A). International Patent Classificati..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Jiangsu Chuangsite Display Tech Co Ltd has filed a patent application for Low-power-consumption Display Screen Driving Method and System Based on OLED Technology. This invention was developed by Shi Wei.
The patent application number is CN202510710106 20250529. The patent publication number is CN120564622 ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has received Jiangsu Jiuzhan Material Tech Co Ltd patent application for Novel Preparation Method of Phenothiazine and Derivative for Semiconductor Photoresist. Chen Junchao, Yu Yifei, Zhou Jun, Han Wenming, Zhang Hu and Ji Wenxin developed the invention.
The pat..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Samsung Electronics has filed a patent application for Gate-all-around Field Effect Transistor with In-trench Spacer and Method of Manufacturing Same. This invention was developed by Baek Rok-hyun and Jung Jin-su.
The patent application number is CN202280102938 20221230. The patent publication number is CN..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has received Fuji Electric patent application for Semiconductor Device. Matsui Toshiyuki, Naito Tatsuya, Noguchi Seiji, Yamada Takuya, Furukawa Nobuaki, Hamasaki Ryutaro, Ikura Yoshihiro and Shuhei Tatemichi developed the invention.
The patent application number ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Shanxi Chenxian Photoelectric Tech Co Ltd has sought patent for COF Chip Binding Point Adhesive Structure. This invention was developed by Wang Xiaofei and Zhou Yufa.
The patent application number is CN202510668919 20250523. The patent publication number is CN120571733 (A). International Patent Classificat..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Zhejiang Weiming Semiconductor Co Ltd has submitted a patent application for UART Baud Rate Adaptive Method. This invention was developed by Zhu Jiawei.
The patent application number is CN202510689366 20250527. The patent publication number is CN120567736 (A). International Patent Classification codes are ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Pro Med Beijing Tech Co Ltd has applied Chinese patent for Micro-fluidic Chip for Fluid Viscosity Detection and Manufacturing Method Thereof. Yu Zhanjiang, Xing Xiaoxing, Guan Wei, Ma Fei, Pan Zhihong and Gao Weiwei developed it.
The patent application number is CN20251174060 20250801. The patent publicati..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has released Xindong Microelectronic Tech Wuhan Co Ltd patent application for Performance Control Parameter Optimizing Method and Device for Serdes Chip. This invention was developed by Chen Jingcheng, Ma Zhongjie and Hu Xiaoyu.
The patent application number is C..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Zhaoyuan Xinhui New Mat Co Ltd has filed a patent application for Reaction Kettle for Preparing Silicon Dioxide Catalyst. This invention was developed by Wang Minjun, Xu Guoxin, Wang Xiaomeng and Wang Xiaofei.
The patent application number is CN202510700174 20250528. The patent publication number is CN1205..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- East China Institute Optoelectronic Integrated Device has submitted a patent application for Anti-adhesion Bracket for Sintering Double-sided Glass Glaze of LTCC (low Temperature Co-fired Ceramic) Substrate and Preparation Method of Anti-adhesion Bracket. This invention was developed by Xue Jun, Song Chul-woo..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Xi'an Boxin New Material Tech Co Ltd patent application for Special Fiber Reinforced Silicon Nitride Aerogel Composite Material, Preparation Method and Application. The invention was developed by Zhang Jiaxu, Feng Lei and Yang Peng.
The patent appli..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has released Guangzhou Zhongnuo Microelectronics patent application for Communication Verification Method and Device for Consumable Chip, Chip, Equipment and Storage Medium. This invention was developed by Lin Wei and Li Qin.
The patent application number is CN20..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Huawei Technologies has filed a patent application for Transmission Network Chip, Network Device and Method for Processing Bit Stream. This invention was developed by Zheng Shuqian, Shao Xulong and Gao Qiao.
The patent application number is CN202410235729 20240229. The patent publication number is CN120567..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Xuzhou Huijing Semiconductor Mat Co Ltd has submitted a patent application for Cleaning Device for Semiconductor Wafer. This invention was developed by Zhang Jingzhai and Zhang Limei.
The patent application number is CN202510799567 20250616. The patent publication number is CN120571800 (A). International P..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Guangdong Jinwan Gaojing Solar Energy Tech Co Ltd and Gaojing Solar Energy patent application for Device and Method for Automatically Removing Waterproof Monocrystalline Silicon Wafers Based on Visual Inspection. The invention was developed by Xiao Bin..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Youguang Intelligent Semiconductor Technology (Shenzhen) has applied Chinese patent for Chip Test Sorting Machine and Control Method Thereof. Li Jinlong and Wu Houqiang developed it.
The patent application number is CN20251117880 20250723. The patent publication number is CN120571769 (A). International Pat..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Beijing Maizhuji Tech Co Ltd has sought patent for FPD Test Method for Micro-viewpoint Defect of Monocrystalline Silicon Wafer. This invention was developed by Tao Ying.
The patent application number is CN202510801971 20250616. The patent publication number is CN120558988 (A). International Patent Classifi..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Northwest Electronic Equipment Tech Research Institute Second Research Institute Of China Electronic has submitted a patent application for Multi-axis Synergistic Film Winding and Unwinding Device for Green Ceramic Chip Film Coating. This invention was developed by Sun Wentao, Li Fan, Wang Ruipeng, Liu Hongyu..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has received Sichuan Bingji Smart Computing Tech Co Ltd patent application for Remote Automatic Conveying System for Circuit Board Electroplating. Wang Xiaodan, Wang Xi and Zhang Wenli developed the invention.
The patent application number is CN20251180139 202508..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Hanbo Semiconductor Shanghai Co Ltd has submitted a patent application for Apparatus and Method for Reducing Current Change Rate, and Semiconductor Device. Zhang Zhenhua, Huang Helong and Li Rui developed the invention.
The patent application number is CN20251155385 20250730. The patent publication number ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published No 24 Research Institute patent application for Level Shift Circuit. The invention was developed by Guo Liang, Zhang Tao, Liao Pengfei, He Hongwei, Hu Yonggui, Tang Tailong, Li Jiancheng, He Linfeng, Huang Xiaozong, Wang Guoqiang and Wang Yuxin.
The..
Semiconductor
| Tue 17 Feb 2026
Beijing, Feb. 18 -- Shanghai Belling Co Ltd has submitted a patent application for Local Wake-up Circuit and High-voltage Chip. This invention was developed by Wei Hongsen, Zhao Hailiang, Chen Si and Ruan Yi.
The patent application number is CN202510687699 20250527. The patent publication number is CN120567107 (A). Internatio..
Semiconductor
| Tue 17 Feb 2026
Beijing, Feb. 18 -- Hefei Lingchen Microelectronic Co Ltd has sought patent for Protection Control Circuit and Method of Power Amplification System and Power Amplification Chip. This invention was developed by Du Rufeng, Dai Xiaowu, Fang Yu and Wang Haoxiang.
The patent application number is CN202510663913 20250522. The paten..
Semiconductor
| Tue 17 Feb 2026
Beijing, Feb. 18 -- Chengdu Iridium Communications Co Ltd has submitted a patent application for Highly-integrated V-waveband Broadband Multichannel Multimode Detector Front-end Chip. This invention was developed by Ye Song and He Yongxin.
The patent application number is CN20251122181 20250724. The patent publication number ..
Semiconductor
| Tue 17 Feb 2026
Beijing, Feb. 18 -- Suzhou Weixin Intelligent Tech Co Ltd has submitted a patent application for Method for Testing Iv Characteristic of Solar Cell in Non-contact Mode. This invention was developed by Zhang Yu, Xu Jianbing and He Yifei.
The patent application number is CN202510751326 20250606. The patent publication number is..
Semiconductor
| Tue 17 Feb 2026
Beijing, Feb. 18 -- Shanghai Ziying Microelectronics Co Ltd has applied Chinese patent for On-chip Integrated Charge Pump Circuit and Boost Chip Suitable for Automotive Electronics. Dong Yuan, Li Xiang and Zhuang Jian developed it.
The patent application number is CN20251152750 20250730. The patent publication number is CN120..
Semiconductor
| Tue 17 Feb 2026
Beijing, Feb. 18 -- Anhui University has applied Chinese patent for Variable Flux Memory Motor Adopting Consequent Pole Double-layer Staggered Permanent Magnet Structure. Li Ya, Shang Linghua, Ding Shichuan, Li Wei, Hang Jun and Wang Runyu developed it.
The patent application number is CN202510709233 20250529. The patent publ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Sony Semiconductor Solutions Corporation patent application for Transmission System, Transmission Device, and Transmission Method. The invention was developed by Hiraoka Tetsuya and Kumagai Koki.
The patent application number is CN20248008320 202401..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Toshiba; Toshiba Electronic Devices & Storage has submitted a patent application for Method for Manufacturing Semiconductor Device. This invention was developed by Ohashi Kenichi.
The patent application number is CN20248008599 20240401. The patent publication number is CN120569805 (A). International Patent..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published Nexwafe GmbH patent application for Method and System for Stripping Semiconductor Layer, and Semi-finished Product. The invention was developed by Heilig Michael L, Hohner Michael, Vescovi Giuseppe and Vandanapu Krishna Vinod Kumar.
The patent appli..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has received BOE Technology Group and Hefei Xinsheng Optoelectronic Technology Co Ltd patent application for Display Substrate and Display Device. Gu Xiaofang, Ma Xiaoye, Wang Yongcan, Zhang Ran, Xie Yongxian, Du Ruifang, Ding Zhiwei, Xu Xiaowei, Liu Ling, Zhang Xin..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Cymer Inc has submitted a patent application for Method for Maintaining Light Source Module in Semiconductor Lithography. Wells Neil G and Stevens Christopher John developed the invention.
The patent application number is CN20248008666 20240111. The patent publication number is CN120569738 (A). Internation..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Ningxia Wuju Silicon Powder Co Ltd has submitted a patent application for Method for Preparing Trichlorosilane by Granulating Industrial Silicon Undersize Powder. This invention was developed by Yu Lifang, Chen Baoping and Zhang Jun.
The patent application number is CN202510904795 20250701. The patent publ..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Yunnan Yongchang Silicon Ind Co Ltd has applied Chinese patent for Intelligent Refining Method and System for Industrial Silicon. Wen Jianhua, Yang Guiming, Wang Zhengyong, Lu Guohong, Zhang Zhongyi, Ren Jinghui, Dong Shumeng, Li Xue, Zhang Shukang, Gao Guangfu, Liao Changhu, Yang Rongming, Shen Xinglyu, Shen..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- SK Hynix Memory Solutions Inc has filed a patent application for Method and System for Dynamically Submitting Data Structures. This invention was developed by Dziadowicz Mark.
The patent application number is CN20238089313 20231201. The patent publication number is CN120569704 (A). International Patent Cla..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has received BOE Technology Group and Beijing BOE Technology Development patent application for Display Substrate and Display Device. Liu Wenqu, Liu Tengfei and Zhang Feng developed the invention.
The patent application number is CN20238012668 20231229. The paten..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- State Intellectual Property Office of China has published BOE Technology Group, Chongqing BOE Optoelectronics Co Ltd and Beijing BOE Technology Development patent application for Array Substrate and Preparation Method Thereof. The invention was developed by Ning Zhiyong, Qi Chengjun, Chen Wei, Wu Xu, Huang Zh..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Panasonic Intellectual Property Management has applied Chinese patent for Near-infrared Light-emitting Device, Spectroscopic Device, and Spectroscopic Method. Shigitani Ryosuke, Abe Takeshi, Nitta Mitsuru, Iwata Koki, Fujiwara Chigusa and Oshio Shozo developed it.
The patent application number is CN2023809..
Semiconductor
| Wed 18 Feb 2026
Beijing, Feb. 18 -- Changzhou Saipu Ruisheng Tech Co Ltd has submitted a patent application for High-precision Silicon Carbide Porous Ceramic Membrane and Preparation Method Thereof. Li Feng, Jiang Qiwen, Ge Yunjie and Zhou Di developed the invention.
The patent application number is CN20251117180 20250723. The patent publica..
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