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Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- World Intellectual Property Organization has published ASML Netherlands patent application for Method and Apparatus for Bonding Substrates. The invention was developed by Buijs Robin, De Poortere Etienne, Pellemans Henricus, Venugopalan Syam, Scaccabarozzi Luigi, Dillen Hermanus, Van Kampen Maarten, Ramos Andr�..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- World Intellectual Property Organization has published Applied Materials patent application for Magnetically Enhanced Resistive and Dielectric Barrier Discharge. The invention was developed by Sarode Vishwanath Yogananda and Poulose John. The patent application number is WO2025US49000 20251001. The patent publ..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- World Intellectual Property Organization has published Applied Materials patent application for Resonator Probe for Plasma Diagnostics. The invention was developed by Peterson David, Chan Kelvin, Bhuiyan Shariful, Xiao Yuhua, Putti Rajesh and Wani Shubham. The patent application number is WO2025US47508 2025092..

Semiconductor

  |  Thu 21 May 2026

Geneva, May 21 -- World Intellectual Property Organization has published Xpeedic patent application for Method for Quickly Solving Plane Segmentation of Via in Multi-layer Integrated Circuit Board. The invention was developed by Jiang Liguo, Dai Wenliang, Gao Lixing, Du Yunzhu and Guo Liang. The patent application number is WO2..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has published BOE Technology Group patent application for Pixel Circuit, Display Substrate and Display Device. The invention was developed by Zhang Hao, Liu Hao, Lu Jiangnan and Liu Libin. The patent application number is CN20248000649 20240329. The patent publicati..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has published Nihon Micronics patent application for Probe for Electrical Connection Device. The invention was developed by Takeya Toshinaga and Kishi Yasutaka. The patent application number is CN20248038784 20240529. The patent publication number is CN121368721 (A)..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has published The 10th Research Institute of China Electronics Technology Group patent application for Monitoring Method for Infrared Detector Chip. The invention was developed by Li Haiyan, Wang Jing, Wang Yuhang, Liu Ming, Xing Weirong and Shi Jingxia. The patent ..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has published Beijing Institute of Mechanical Equipment patent application for Four-channel Digital Micro-fluidic Chip for Library Construction. The invention was developed by Hou Hongqu, Zang Jinliang, Xu Nuo, Yang Mingzhu, Wang Junming, Zhang Huai, Wang Zhongjing a..

Semiconductor

  |  Thu 21 May 2026

Geneva, May 21 -- World Intellectual Property Organization has published The University of Sydney patent application for Systems and Methods for Laser Annealing Semiconductor Junctions. The invention was developed by Yi Jianpeng, Leung Tik Lun, Bing Jueming, Mahmud Arafat, Zheng Jianghui, Wang Guoliang, Liao Chwenhaw, Bailey Chr..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has published Shenzhen Yougen Technology patent application for Automatic Semiconductor Device Detection Sorting Machine and Method. The invention was developed by Lo Guo-qiang. The patent application number is CN202511946589 20251223. The patent publication number ..

Semiconductor

  |  Wed 20 May 2026

Alexandria, May 20 -- Taiwan Semiconductor Mfg and Tsmc Arizona Corp have filed a patent application for Semiconductor Package and Method of Manufacturing the Same. This invention was developed by Tang Xuewen, Ying Ji-feng, Chuang Wen-hsien, Wu Jyun-lin and Liu Hao-chun. The patent application number is US202418946989 2024111..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Univ Industry Cooperation Group Kyung Hee Univ and Research & Business Found Sungkyunkwan University have filed a patent application for Stretchable Semiconductor Film with Biocompatibility and Bio-implantable Electronic Device Using the Same. This invention was developed by Oh Jin Young, Bhang Suk Ho, Hyun..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- Fraunhofer Ges Zur Forderungder Angewandten Forschung EV and Robert Bosch have filed a patent application for MEMS with Adjusted Semiconductor Behavior. This invention was developed by Ranga Sergiu and Poser Robert. The patent application number is CN202510992192 20250718. The patent publication number is C..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- World Intellectual Property Organization has released ASML Netherlands patent application for System and Method. This invention was developed by Smeets Benjamin and Huang Yang-shan. The patent application number is WO2025EP77515 20250925. The patent publication number is WO2026098842 (A1). International Patent..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has released Memjet Technology patent application for Print Chip Configured for High Speed Printing. This invention was developed by Hogan Julie, Palitzer Ronen, Sheehan John, Brown Brian, Forbes Katriona and Lehane Pat. The patent application number is CN2025115518..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- World Intellectual Property Organization has released Tokyo Electron patent application for Plasma Processing Device and Etching Method. This invention was developed by Saito Yuto, Naoi Mamoru, Chiba Yuki, Kubo Sho and Nagaiwa Toshifumi. The patent application number is WO2025JP37434 20251024. The patent publi..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- World Intellectual Property Organization has released Sharp patent application for Terminal Device, Method, and Integrated Circuit. This invention was developed by Miyake Taichi, Tsuboi Hidekazu, Yamada Shohei, Kawano Takuma and Nomura Takaki. The patent application number is WO2025JP38930 20251106. The patent..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- World Intellectual Property Organization has released Canon patent application for Cell Chip Production Method and Cell Analysis Method. This invention was developed by Yamauchi Sachiko, Orihara Tatsuaki, Morita Yuki, Kuwabara Nobuyuki, Itoh Yoshinori, Shiratori Tsutomu and Hirose Futoshi. The patent applicati..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 --IBM and Tokyo Electron have applied United States patent for Etching a Phase Change Material. Buzi Luxherta, Bruce Robert L and Koty Devi developed it. The patent application number is US202418940569 20241107. The patent publication number is US20260136843 (A1). International Patent Classification codes a..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Beijing Boe Technology Dev Co Ltd and BOE Technology Group have applied United States patent for Array Substrate and Method for Manufacturing Same, and Display Panel. Wang Lizhong, Ning Ce, Guo Hui, Yang Kun, Zhang Jinchao and Zhou Tianmin developed it. The patent application number is US202318706139 202..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- Huazhong University of Science and Technology and Hubei Guanggu Laboratory have applied Chinese patent for Laminated Solar Cell Performance Prediction and Band Gap Parameter Optimization Method and System. Chen Chao, Chen Aoyue, Tang Jiang and Hao Bokai developed it. The patent application number is CN20251..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has released Infineon Technologies, Austria patent application for Semiconductor Package Having Die Assembly with Electrically Insulating Thickness Matching Layer. This invention was developed by Althaus Armin. The patent application number is CN202510942948 2025070..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has released LG Innotek patent application for Antenna Substrate and Front End Module Including Same. This invention was developed by Yang Canyu, Kim Soo-chul and Ha Ji-hoon. The patent application number is CN20248039883 20240612. The patent publication number is C..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has released Beijing University patent application for Micro-fluidic Chip and Application Thereof. This invention was developed by Yang Gen and Lu Chunyang. The patent application number is CN202511424198 20220923. The patent publication number is CN121372537 (A). I..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has released Southwest China Research Institute Electronic Equipment patent application for Processing Device and Method for Vector Laser Invisible Cutting of Gaas Chip. This invention was developed by Sun Xiaomao, Lu Xi, Zhang Jian, Liao Chengju, Xu Rongqing, Xiang ..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has received Zhejiang University patent application for Preparation Method of Elastic Modulus Programmable Flexible Substrate. Xu Kaichen, Jin Ziguan, Xu Chongyi and Yang Huayong developed the invention. The patent application number is CN202511392765 20250926. The ..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has received Samsung Display patent application for Substrate Processing Apparatus. Heo Sung-min developed the invention. The patent application number is CN202510718457 20250530. The patent publication number is CN121368359 (A). International Patent Classification ..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has received Guangdong Juhua Printing Display Technology patent application for Light-emitting Device and Preparation Method Thereof, Display Substrate and Display Device. Xie Shizhao and Chen Yawen developed the invention. The patent application number is CN2024119..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has received BOE Huacan Optoelectronics (Zhejiang) patent application for Blue-green Double-wave Light Emitting Diode and Preparation Method Thereof. Zhang Yi, Xu Zhibo and Jiang Han developed the invention. The patent application number is CN202511227922 20250829. ..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- World Intellectual Property Organization has received ASML Netherlands patent application for Bonding Apparatus. Dolk Victor developed the invention. The patent application number is WO2025EP78898 20251008. The patent publication number is WO2026098870 (A1). International Patent Classification codes are H10P72..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- World Intellectual Property Organization has received Kyocera patent application for Circuit Board for Bypass Diode, Bypass Diode Device, and Solar Cell Module. Kazama Takeshi, Shibata Masamitsu, Nakajima Yoshiki, Murakami Kensaku, Kanemaru Yutaka and Iino Yuji developed the invention. The patent application n..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- World Intellectual Property Organization has received Sony Semiconductor Solutions Corporation patent application for Light Detection Device and Semiconductor Device. Yamashita Hirofumi, Fujisaki Yutaro, Fujii Nobutoshi, Saito Suguru, Furuse Shunsuke and Hirano Tomoki developed the invention. The patent applic..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- State Intellectual Property Office of China has received Yanbian University patent application for Multi-pin Chip Welding Anti-warping Pressing Device. Li Weican and Wang Dechao developed the invention. The patent application number is CN202511671854 20251114. The patent publication number is CN121373634 (A)...

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- Yangtze Memory Technologies has filed a patent application for Managing Capacitors in Semiconductor Devices. This invention was developed by Feng Jinlong. The patent application number is CN20248001366 20240515. The patent publication number is CN121368931 (A). International Patent Classification codes are G1..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- ASML Netherlands has filed a patent application for Gain Balance Calibration for Motion Control Systems. This invention was developed by Simons Wilhelmus Franciscus Johannes and Jain Rishabh M. The patent application number is CN20248035052 20240508. The patent publication number is CN121368745 (A). Internati..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- Fudan University has filed a patent application for Self-curling On-chip Magnetic Domain Memory Device and Preparation Method Thereof. This invention was developed by Cui Jizhai, Chen Li, Chi Yuhang and Liu Shengbao. The patent application number is CN202511535394 20251024. The patent publication number is CN..

Semiconductor

  |  Thu 21 May 2026

Beijing, May 21 -- Jiangyin Weihua Precision Technology has filed a patent application for Integrated Liquid Drop Micro-fluidic Chip Based on 3D Printing and Liquid Drop Preparation Method. This invention was developed by Hao Nanjing, Guo Jiahao, Ma Li, Luo Zijuan and Yao Yilong. The patent application number is CN202511529112 ..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 21 -- The 10th Research Institute of China Electronics Technology Group has filed a patent application for Cutting Method of Compound Semiconductor Material. This invention was developed by Zhao Bingyao, Liu Jianggao, She Weilin, Li Xuan, He Zhen and Li Zhenxing. The patent application number is CN202511264103 2025..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 21 -- Tongwei Solar, Chengdu has filed a patent application for Screen Printing Plate and Manufacturing Method Thereof, Back Contact Solar Cell and Back Contact Photovoltaic Module. This invention was developed by Chen Xianzhi, Meng Xiajie and Li Zhonglan. The patent application number is CN202511172384 20250820. T..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- NAMICS Corporation has filed a patent application for Curable Resin Composition, Adhesive, Sealing Material, Cured Product, Semiconductor Device, and Electronic Component. This invention was developed by Ikarashi Hirotatsu, Mitsunushi Koki, Negishi Yuta and Iwashita Honoka. The patent application number is WO2..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- Hamamatsu Photonics has filed a patent application for Laser Processing Method, Laser Processing Device, and Method for Producing Semiconductor Device. This invention was developed by Korematsu Katsuhiro and Mitsuyama Yasuhiro. The patent application number is WO2025JP32938 20250918. The patent publication num..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- Socionext has filed a patent application for Phase Synchronization Circuit and Semiconductor Integrated Circuit. This invention was developed by Yamashita Shinichi, Kaga Yuta and Kimura Daisuke. The patent application number is WO2024JP40010 20241111. The patent publication number is WO2026100070 (A1). Interna..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- Asahi Kasei KK has filed a patent application for Underfill Material, Cured Product, Semiconductor Package, and Method for Manufacturing Same. This invention was developed by Otonari Masatoshi, Okamoto Ryosuke, Matsunaga Takahide and Ono Yuji. The patent application number is WO2025JP38425 20251031. The patent..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- Tokyo Electron has filed a patent application for Inference Model Creation Device, Inference Model Creation Method, and Storage Medium. This invention was developed by Tsuruda Toyohisa, Kobayashi Ruiki and Hosaka Masato. The patent application number is WO2025JP37879 20251028. The patent publication number is ..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- Panasonic Intellectual Property Management has filed a patent application for Solder Flux, Solder Paste, and Method for Manufacturing Electronic Component Mounting Substrate. This invention was developed by Yoshioka Yuki, Sakai Tadahiko and Maeda Tadashi. The patent application number is WO2025JP36957 20251021..

Semiconductor

  |  Wed 20 May 2026

Geneva, May 21 -- Applied Materials has filed a patent application for Word Line Contact for 3D Memory. This invention was developed by Kang Chang Seok, Kitajima Tomohiko and Makala Raghuveer Satya. The patent application number is WO2025US53703 20251103. The patent publication number is WO2026101814 (A1). International Patent ..

Semiconductor

  |  Thu 21 May 2026

Geneva, May 21 -- Micron Technology has filed a patent application for Multiple Epoxy Compounds for Memory System Manufacturing. This invention was developed by Lowry Kimball D and Bitz Bradley. The patent application number is WO2025US54421 20251106. The patent publication number is WO2026102159 (A1). International Patent Clas..

Semiconductor

  |  Thu 21 May 2026

Mexico City, May 21 -- PPG Industries, Ohio has filed a patent application for Compositions, Systems, and Methods for Treating a Substrate. This invention was developed by Bezer Silvia, Kumar Kuldeep, Brown-tseng Elizabeth Stephenie, Harris Rachel Dory, Allen Kristi Maree, Notte Anthony J and Mcmillen Mark William. The patent a..

Semiconductor

  |  Thu 21 May 2026

Geneva, May 21 -- Ningbo CRRC Times Transducer Technology has filed a patent application for Compound Hall Integrated Chip and Preparation Method Therefor. This invention was developed by Zheng Huaxiong, Shi Yanan, Meng Qingming, Guan Ke, Hou Xiaowei, Zhang Po and Li Juping. The patent application number is WO2025CN113454 20250..

Semiconductor

  |  Thu 21 May 2026

Luxembourg, May 21 -- Lishui University has been granted a patent for Rapid Stirring Device for Organic Light Emitting Diode Material Preparation. This invention was developed by Ye Hua. The patent application number is LU20250600340 20250224. The patent publication number is LU600340 (B1). International Patent Classification c..

Semiconductor

  |  Tue 19 May 2026

Beijing, May 20 -- Shenzhen Ingenic Time Semiconductor Co Ltd has applied Chinese patent for Overvoltage Protection Circuit. Su Yonghao developed it. The patent application number is CN202410957868 20240717. The patent publication number is CN121367169 (A). International Patent Classification code is H02H3/20. The abstrac..

Semiconductor

  |  Tue 19 May 2026

Beijing, May 20 -- Muxi Tech Chengdu Co Ltd has submitted a patent application for Chip Reset Circuit. Liu Kaifeng developed the invention. The patent application number is CN202511526131 20251024. The patent publication number is CN121367487 (A). International Patent Classification codes are G06F1/24 and H03K17/22. State..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- State Intellectual Property Office of China has released Yuanqixin Shandong Semiconductor Tech Co Ltd patent application for Network-on-chip System Based on Cache Consistency. This invention was developed by Li Jiahao, Yan Jianing and Gong Youwei. The patent application number is CN202511565261 20251030. Th..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Yangtze Memory Technologies has applied United States patent for Program Operations in Memory Devices. Zhou Xufeng, Han Jinchi and Dong Zhipeng developed it. The patent application number is US202519015036 20250109. The patent publication number is US20260134922 (A1). International Patent Classification ..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- Haiguang Yunxin Integrated Circuit Design Shanghai Co Ltd has filed a patent application for Excitation Vector Acquisition Method, Simulation Test Method, Device, Equipment and Medium. This invention was developed by Chen Mo, Yang Ping and Ma Guorong. The patent application number is CN202511770786 20251127..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- State Intellectual Property Office of China has released Shenzhen Qipule Chip Tech Co Ltd patent application for Chip Design Tool, Method, Equipment and Computer Medium. This invention was developed by Huang Hai and Chen Xiaopeng. The patent application number is CN202410965184 20240718. The patent publicat..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- Beijing Zhengdao Quantum Tech Co Ltd has filed a patent application for Chip Quantum Random Number Generation Device and Method. This invention was developed by Zhang Lingsong, Shen Qidong and Gao Xiaobin. The patent application number is CN202511923020 20251219. The patent publication number is CN121364849..

Semiconductor

  |  Wed 20 May 2026

Alexandria, May 20 -- Adeia Semiconductor Bonding Technologies Inc has applied United States patent for Heterogeneous Annealing Method and Device. Enquist Paul M and Fountain Jr Gaius Gillman developed it. The patent application number is US202519349749 20251003. The patent publication number is US20260137000 (A1). Internatio..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- State Intellectual Property Office of China has received Jilin University and Shenyang Academy of Instrumentation Science patent application for Pressure Sensor Chip and Preparation Method Thereof. Ren Xiangyang, Gao Bingrong, Zhang Zhiguo, Liu Hongwei, Li Yongqing, Chen Qidai, Li Xianbin, Chen Nianke, He Fang..

Semiconductor

  |  Wed 20 May 2026

Alexandria, May 20 -- Tiawan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Device and Methods of Formation. Lin Tzu-ging developed the invention. The patent application number is US202418947412 20241114. The patent publication number is US20260136908 (A1). Cooperative Patent Classific..

Semiconductor

  |  Wed 20 May 2026

Alexandria, May 20 -- Sumsung Electronics Co Ltd has submitted a patent application for Wafer Cleaning Apparatus. Kang Jihye, Park Sangsick and Lee Hyoungjoo developed the invention. The patent application number is US202519211959 20250519. The patent publication number is US20260136890 (A1). Cooperative Patent Classification..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Suzhou Luumii Ltd has submitted a patent application for Surface Mount Device for Colorful Chips and Colorful Chips Surface Mount Method. Lin Yu-kai and Kang Chen-fang developed the invention. The patent application number is US202418948450 20241114. The patent publication number is US20260136873 (A1). C..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Pan Yang and Inspiring Atoms Pte Ltd have submitted a patent application for System and Method for Accelerated Process Chamber Pressure Modulation. Pan Yang developed the invention. The patent application number is US202418946920 20241114. The patent publication number is US20260136869 (A1). Internationa..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Hgc Wuhan Tech Co Ltd and HGC Zhangjiagang Semiconductor have submitted a patent application for Light Emitting Element and Manufacturing Method Therefor. This invention was developed by Sun Leimeng, Xu Xiaoli and Liu Fang. The patent application number is US202318704595 20230119. The patent publication ..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Purdue Research Foundation has submitted a patent application for On-chip Multi Chamber Light Induced and Monitoring Kit. This invention was developed by Izadian Afshin. The patent application number is US202519373591 20251029. The patent publication number is US20260131328 (A1). International Patent Cla..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- Zhejiang Evergreen Information Tech Co Ltd, Qingdao Kaixing Electronic Tech Co Ltd and Zhejiang Weilan Chip Tech Co Ltd have submitted a patent application for Data-adaptive Equipment Production Process Defect Identification Method and System. This invention was developed by Luo Zhicong, Zhang Haiqiang and Zha..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- Brightek Jiangsu Optoelectronic Co Ltd has filed a patent application for Light Emitting Module and Light Equalizing Assembly. This invention was developed by Li Qingliang and Zheng Songying. The patent application number is CN202511333108 20250917. The patent publication number is CN121363729 (A). Internat..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- State Intellectual Property Office of China has received Heguang Photomask Tech Anhui Co Ltd patent application for Defect Repairing Method of Photomask. Xu Xuefeng, Li Yong and Zhuo Qilin developed the invention. The patent application number is CN202511948234 20251223. The patent publication number is CN1..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Proasia Semiconductor Corp has applied United States patent for Silicon Carbide Metal-oxide-semiconductor Field-effect Transistor and Manufacturing Method Thereof. Wang Pei-jen and Huang Pin-yen developed it. The patent application number is US202519307666 20250822. The patent publication number is US202..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- U.S. Patent and Trademark Office has published Lin Fangfang patent application for Rotatable Light-emitting Ornament. The patent application number is US202619443456 20260108. The patent publication number is US20260132910 (A1). International Patent Classification codes are F21V14/06, F21V17/06 and F21V..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Quarkstar LLC has applied United States patent for Light-emitting Devices Providing Asymmetrical Propagation of Light. Haitz Roland H, Smith George E, Gardner Robert C and Lerman Louis developed it. The patent application number is US202519242645 20250618. The patent publication number is US20260132896 (..

Semiconductor

  |  Tue 19 May 2026

Beijing, May 20 -- GigaDevice Semiconductor has applied Chinese patent for Operation Method of Memory and Memory. Li Qi and Guo Xinrui developed it. The patent application number is CN202410961978 20240717. The patent publication number is CN121366613 (A). International Patent Classification codes are G11C16/04, G11C16/12, G1..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Electronics and Telecommunications Research Inst has submitted a patent application for Gate-all-around Field Effect Transistor Structure. This invention was developed by Park Jeong Woo, Suh Dongwoo, Kim Sang Hoon, Lee Wangjoo and Lee Seong Hyun. The patent application number is US202519379240 20251104. ..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Wavepia Co Ltd has submitted a patent application for Semiconductor Device. This invention was developed by Lee Sang Hun. The patent application number is US202619443379 20260108. The patent publication number is US20260136650 (A1). International Patent Classification codes are H10D1/47, H10D62/85, H10D8..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- U.S. Patent and Trademark Office has received Tainan Semiconductor Mfg Co Ltd patent application for Forming Cfets Through Low-temperature Re-growth. Shih Che Chi, Liu Cheng-wei, Ho Wei-de, Tsai Ji-yin, Yang Ku-feng, Jeng Pei-ren and Liao Szuya developed the invention. The patent application number is US..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- U.S. Patent and Trademark Office has received GlobalFoudries US Inc patent application for Isolation Stack for a Bipolar Transistor and Related Methods. Deangelis Jacob M, Raghunathan Uppili S, Shank Steven M, Mctaggart Sarah A, Lydon-nuhfer Megan Elizabeth and Luce Cameron developed the invention. The p..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Toshiba KK and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device. This invention was developed by Tanaka Katsuhisa and Kono Hiroshi. The patent application number is US202519371507 20251028. The patent publication number is US20260136590 (A1). International..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Kyocera Corp and Leland Stanford Junior University have sought patent for Trenched Transistor with Grooved Gate. This invention was developed by Kasai Hayao, Wen Xinyi and Chowdhury Srabanti. The patent application number is US202418989435 20241220. The patent publication number is US20260136579 (A1). In..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Toshiba KK and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device. This invention was developed by Sakano Tatsunori and Gejo Ryohei. The patent application number is US202519254185 20250630. The patent publication number is US20260136573 (A1). International ..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Livingcare Co Ltd has filed a patent application for Semiconductor Package Test Device Using Peltier Element. This invention was developed by Kwon Tage Ryul and Park Junhyun. The patent application number is US202319488752 20231213. The patent publication number is US20260133244 (A1). International Paten..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Reed Semiconductor Corp has filed a patent application for Current Sense Compensation Apparatus and Method. This invention was developed by Sahu Biranchinath, Mangina Naga Venkata Prasadu, Singla Rajeev and Mazumdar Sushmit. The patent application number is US202418947890 20241114. The patent publication..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- KIOXIA has submitted a patent application for Memory System. Katougi Hiroshi developed the invention. The patent application number is US202519315179 20250829. The patent publication number is US20260133718 (A1). International Patent Classification code is G06F3/06. Cooperative Patent Classification code..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- KIOXIA has submitted a patent application for Memory System. This invention was developed by Kamizono Akinori and Noda Kazutoshi. The patent application number is US202519071872 20250306. The patent publication number is US20260133696 (A1). International Patent Classification code is G06F3/06. Cooperativ..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Workday has applied United States patent for Memory Efficient Multi-versioned Concurrency for a Hypercube Memory Cache Using Anchor Object Pointers. Vemuri Srinivas and Lee Darren developed it. The patent application number is US202619445143 20260109. The patent publication number is US20260133953 (A1). ..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Macronix has submitted a patent application for Memory System and Operation Method of In-memory Computing. This invention was developed by Lin Bo-rong and Hu Han-wen. The patent application number is US202519096837 20250401. The patent publication number is US20260133904 (A1). International Patent Classi..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- State Intellectual Property Office of China has published Guochuang Advanced Semiconductor Mat Wuxi Co Ltd and Glass New Mat Innovation Center Anhui Co Ltd patent application for Glass Shearing Temperature Control Device. The invention was developed by Peng Shou, Bai Longtao, Zhang Li, Zheng Jijie, Chen Shuyon..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- Shirun Semiconductor Mat Jiangsu Co Ltd has sought patent for Waste Liquid Collecting Device for Semiconductor Organic Alkali Purification Equipment. This invention was developed by Wang Jie, Wang Jinjin, Zhang Lei, Wang Qiang, Zhang Yong and Yuan Xiaobin. The patent application number is CN202511936234 202..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- Jiangxi Zhaochi Integration Tech Co Ltd and Jiangxi MTC Semiconductor have sought patent for Multimodal Data Defect Identification Method and Device Based on Chip Preparation Process. This invention was developed by Xie Zhiwen, Zhang Han, Chen Mingsheng, Wen Guosheng, Jin Conglong and Ao Yingquan. The paten..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- Taiwan Semiconductor Manufacturing and Taijidian China Co Ltd have submitted a patent application for Integrated Circuit Device Design Method and System. Zhang Yamin developed the invention. The patent application number is CN202511436961 20191015. The patent publication number is CN121365641 (A). Internati..

Semiconductor

  |  Wed 20 May 2026

Alexandria, May 20 -- Tsmc China Co Limited and Taiwan Semiconductor have submitted a patent application for Wafer Processing Tool and Method for Processing Wafer. This invention was developed by Ma Lin, Luo Yong Hong, Lin Chun, Chen Lei, Zhang Tong and Tan Jian Xin. The patent application number is US202418972301 20241206. T..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Chengdu Boe Optoelect Tech Co and BOE Technology Group have submitted a patent application for Display Substrate and Manufacturing Method Thereof, and Display Device. Hui Yan, Shi Quan, Li Jun, Li Haibo, Zhou Rui, Li Po, Tao Huan, Chen Yingbing, Zhang Nan, Liu Xiaonan, Zhang Lei and Lu Yankai developed the ..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Yunnan Invensight Optoelectronics Technology Co Ltd and BOE Technology Group have submitted a patent application for Display Substrate and Electronic Apparatus. Yang Zongshun, Yu Hongtao, Huang Kuanta, Dong Yongfa and Li Shipeng developed the invention. The patent application number is US202519434242 202..

Semiconductor

  |  Tue 19 May 2026

Beijing, May 20 -- Huahong Semiconductor, Wuxi and Huahong Semiconductor Mfg Wuxi Co Ltd have submitted a patent application for Method for Cleaning Semiconductor Process Chamber. Sun Chenming, Zhang Cheng, Guo Hailiang, Zhao Zhi, Yao Daozhou, Wang Jian, Ding Jia and Wang Yuxin developed the invention. The patent application ..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- Wuxi Photon Chip United Research Center and Photon Core Valley Tech Wuxi Co Ltd have submitted a patent application for Gas Sensor Array and Gas Sensor Chip. This invention was developed by Li Zhiqiang, Xian Jiyao, Ouyang Chunfang, Kim Hyun-min and Wei Zhimeng. The patent application number is CN20231182713..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- Xi'an Jiaotong University and Hefei Hualing have sought patent for Heat Conduction Type Semiconductor Defrosting System of Air Cooling Refrigerator Evaporator and Control Method of Heat Conduction Type Semiconductor Defrosting System. This invention was developed by Zhang Huawei, Hu Haihong, Wang Hongjuan, Tan..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- State Grid Hunan Electric Power Co Ltd Electric Power Science Res Inst, State Grid Hunan Electric Power Co Ltd and State Grid Corporation of China have submitted a patent application for Modified Silicon Dioxide Flame-retardant Composite Material as Well as Preparation Method and Application Thereof in Electr..

Semiconductor

  |  Wed 20 May 2026

Beijing, May 20 -- Suzhou Advanced Research Institute Univ Of Science And Technology Of China and University of Science and Technology of China have sought patent for Micro-fluidic Rectification Chip Based on Magnetic Response Flexible Array, Preparation Method and Application. This invention was developed by Li Chuxin, Zhou Wen..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Quintessent Inc has sought patent for Systems and Methods for Distributing Optical Signals Using a Photonic Integrated Circuit. This invention was developed by Koch Brian, Liu Alan and Sparacin Daniel Knight. The patent application number is US202619442821 20260107. The patent publication number is US202..

Semiconductor

  |  Tue 19 May 2026

Alexandria, May 20 -- Changchun Inst Of Optics Fine Mechanics And Physics Chinese Academy Of Sciences has filed a patent application for Self-optimizing Beam Combining Apparatus and Method for Semiconductor Laser Beam Quality. This invention was developed by Zhu Hongbo, Zhang Chenhui, Lin Xingchen, Zhang Yawei, Xue Xulan, Zhang ..

Semiconductor

  |  Tue 19 May 2026

Beijing, May 20 -- Macronix has submitted a patent application for Input Buffer. Lee Dong Woo and Yang Shangji developed the invention. The patent application number is CN20241176610 20240807. The patent publication number is CN121367468 (A). International Patent Classification codes are H03F3/60 and H03K19/0175. Cooperative ..
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