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Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Jiangxi Hengyi New Electronic Mat Co Ltd has submitted a patent application for Glass Fiber Substrate Forming Machine. This invention was developed by Zhang Jixiao, Zhai Guitao and Yi Maoqing.
The patent application number is CN202510781947 20250612. The patent publication number is CN120326538 (A). Intern..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Hangzhou Zhongwei Photoelectricity Co Ltd, Zhejiang Jingsheng Mechanical & Electrical and Zhejiang Jinray Electronic Mat Co Ltd patent application for Automatic Feeding and Discharging Equipment for Wafer Polishing and Grinding. Xie Longhui, Zhang Zunha..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Hangzhou Zhongxin Wafer Semiconductor Co Ltd has submitted a patent application for Polishing Pad Structure for Silicon Wafer Grinding and Control Method Thereof. Xu Jiangwei developed the invention.
The patent application number is CN202510290369 20250312. The patent publication number is CN120326521 (A)...
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Jiangsu Tuoyang Material Tech Co Ltd patent application for Ultra-high-purity Stainless Steel Material for Semiconductor Industry and Processing Technology of Ultra-high-purity Stainless Steel Material. The invention was developed by Yang Shibiao and C..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Xi'an Sino-Euro Materials Technologies has submitted a patent application for Hot Isostatic Pressing Forming Method for Preparing Substrate for Additive Manufacturing by Mixing SS-prep and EIGA Ti6Al4V ELI Spherical Powder. This invention was developed by Li Xin, Wang Chen, Guo Shaoshuai, Liu Yi, Kang Lu, Ma ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 --Hangzhou Zhongwei Photoelectricity Co Ltd, Zhejiang Qiushi Semiconductor Equipment and Zhejiang Jingsheng Mechanical & Electrical have submitted a patent application for Wafer Cleaning Machine. This invention was developed by Zhang Hangjun, Zhang Jiangshui, Wang Kai, Jin Shaobo, Liu Mingxiao and Zhao Wenjie.
..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Shanghai Welnew Micro-Electronics has submitted a patent application for Three-stage Washing System After Semiconductor Electroplating and Use Method. This invention was developed by Lu Jianping and Xiao Guangyuan.
The patent application number is CN202510759564 20250609. The patent publication number is CN1..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Jiangsu Shangda Semiconductor Co Ltd has submitted a patent application for Sputtering Pretreatment Device for Cof Packaging Base Material. This invention was developed by Wang Jian, Lu Wen, Sun Bin, Gu Lin, Qi Shengli, Han Shaohua, Sun Fei, Liu Minghan, Yang Jie, Ye Bin, Kim Jung-won, Ye Xinzhi, Huang Chunsh..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Shanghai Hanshu Image Tech Co Ltd patent application for High-speed Wafer Separator. This invention was developed by Zhang Weihai and Qian Lei.
The patent application number is CN202510508013 20250422. The patent publication number is CN120325558 (A)..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Shenzhen Yuanke Photoelectric Co Ltd has applied Chinese patent for Automobile Lamp Led Chip Packaging Equipment and Technology. Meng Jun, Huang Zucai, Li Jing, Lin Daiying and Zhong Shilin developed it.
The patent application number is CN202510505746 20250422. The patent publication number is CN120325470 ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Beijing Jingyeyuan New Mat Co Ltd has sought patent for Preparation Method of Metal Toughened Silicon Carbide-silicon Nitride Stemming Material. This invention was developed by Zuo Liangzhu, Zhao Ming and Tian Shixiu.
The patent application number is CN202510625884 20250515. The patent publication number i..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Taian Senxin Ind and Trade Co Ltd has sought patent for High-sealing Rotary Wood Chip Blanking Device and Using Method. This invention was developed by Zhang Peixing.
The patent application number is CN202310533732 20230512. The patent publication number is CN120328200 (A). International Patent Classificat..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Shenzhen Yougen Technology has sought patent for High-efficiency Chip Conveying and Omnibearing Detection Method. This invention was developed by Lo Guo-qiang, Wang Yong and Xiao Zhiang.
The patent application number is CN202510569269 20250501. The patent publication number is CN120328127 (A). International ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Jieke Dima Intelligent Equipment Nantong Co Ltd has applied Chinese patent for Centralized Chip Removal Machine for Machine Tool. Li Zhiliang, Nguyen Thi Miaotsui, Li Zhizhen and Cheng Shi developed it.
The patent application number is CN202510749581 20250606. The patent publication number is CN120326425 (..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Aidit Qinhuangdao Digital Dental System Co Ltd has submitted a patent application for Cutting Chip Removal Device and Cutting Machine. This invention was developed by Liu Chen, Hou Dawei and Li Yongjun.
The patent application number is CN202510699411 20250528. The patent publication number is CN120326423 (..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Suzhou Baochen Intelligent Equipment Co Ltd has sought patent for Machine Tool Chip Removal and Cleaning Device for Numerical Control Machine Tool. This invention was developed by Sui Haitao, Sui Haipeng and Zhong Weiye.
The patent application number is CN202510642839 20250519. The patent publication numbe..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Suzhou Hongdian Semiconductor Tech Co Ltd has filed a patent application for Laser Cutting Device for Manufacturing Semiconductor Processing Equipment Shell. This invention was developed by Li Xiwen, Wang Kang and Pang Fei.
The patent application number is CN202510688256 20250527. The patent publication nu..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Jiangsu H Fast Electronics Co Ltd has filed a patent application for Continuous Laser Precision Cutting Equipment for Ceramic Substrate. This invention was developed by Zhu Liming, Liu Jianguo and Liu Tongfa.
The patent application number is CN202510655266 20250521. The patent publication number is CN12032..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Shanghai Jiao Tong University has applied Chinese patent for RB-SiC Polished Surface Pressure Stress Strengthening Device and Implementation Method Thereof. Zhang Xifang, Lou Yuchen, Qie Zixuan and Yao Zhenqiang developed it.
The patent application number is CN202510605298 20250512. The patent publication ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Hangzhou Yinhu Laser Technology has applied Chinese patent for Laser Processing Method of Ceramic Substrate. Jiang Shibin and Jiang Lijia developed it.
The patent application number is CN202510814320 20250618. The patent publication number is CN120326128 (A). International Patent Classification codes are B23..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Hebei Zhitong Hydrogen Clean Tech Co Ltd patent application for Combined Machining Method and System for High-precision Multi-channel Main Shaft of Semiconductor CMP Equipment. Han Xiaoguang, Zeng Fanyong, Mei Lizheng, Jin Pan and Wang Limin developed t..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Tiannuo Photoelectric Mat Co Ltd has submitted a patent application for Preparation Method of Easily Dispersed Coated Silicon Nitride Powder. Zhu Yanyan, Li Huayang, Zhang Zheng, Hu Xiaojing, Zheng Jie, Chen Shibing and Li Deshan developed the invention.
The patent application number is CN202510340728 2025..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Junci Electronic Mat Hebei Co Ltd patent application for High-strength Aluminum Nitride Ceramic Substrate and Preparation Method Thereof. The invention was developed by Liu Qingfeng, Liu Jiale, Liu Fupeng, Liu Weihua, Zhang Fengyun, Liu Weimin and Du P..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Ningxia Beici New Material Tech Co Ltd patent application for Preparation Method of Low-oxygen Ultrahigh-thermal-conductivity Aluminum Nitride Substrate. The invention was developed by Xu Xuelei, Shi Liang, Wang Mingqing, Huang Jinxia, Yang Ying, Ma Ji..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Jiangsu Guanlan New Material Tech Co Ltd has submitted a patent application for Rare Earth Doped Silicon Carbide Particle Trap and Preparation Method and Application Thereof. Liu Dengdeng, Sun Min, Peng Hong, Zang Zhicheng, Ma Minglong, Qingshan Yao, Dong Huakai, Jiang Zihao and Chu Xiutang developed the inve..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Wuxi Huaci New Mat Co Ltd patent application for Modified Silicon Carbide Special Ceramic Material and Preparation Method Thereof. Zhu Wei developed the invention.
The patent application number is CN202510384356 20250328. The patent publication numbe..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Li Wenyan has submitted a patent application for Inorganic Silicon Composite Heat Preservation and Sound Insulation Material and Preparation Method Thereof. This invention was developed by Wu Dahua, Li Wenyan, Li Wentao and Li Wenbo.
The patent application number is CN202510547781 20250428. The patent publ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Trina Solar has submitted a patent application for Anti-PID Self-cleaning Nano Coating Glass, Preparation Method Thereof and Solar Cell. Xiao Jiangbo, Zhang Haobin, Zhang Shu and Chen Yifeng developed the invention.
The patent application number is CN202510507804 20250422. The patent publication number is ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Liaoning Tuobang Hongji Semiconductor Mat Co Ltd patent application for Process Method for Manufacturing Quartz Filter Assembly for Semiconductor. The invention was developed by Zhang Jian, Zhao Shujun, Xing Hongchao, Li Jingshuang, Wu Jingli, Wang Zha..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Shenzhen Kaiweida Electronic Co Ltd patent application for Wastewater Treatment Equipment and Method for Chip Production Line. Wu Jianwei developed the invention.
The patent application number is CN202510672053 20250523. The patent publication number..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Tongling Hengxin Guitan New Material Tech Co Ltd has applied Chinese patent for Preparation Method of Modified Nano Silicon Powder for Silicon-carbon Negative Electrode. Zhang Jin, Fang Dawei, Zhang Hongyan and Xu Zhenghe developed it.
The patent application number is CN202510456481 20250411. The patent pu..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Zhejiang Jingyue Semiconductor Co Ltd has submitted a patent application for Method and Device for Synthesizing Low-nitrogen-content High-purity Silicon Carbide Powder. This invention was developed by Gao Bing and Li Lujie.
The patent application number is CN202510828181 20250620. The patent publication nu..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Hangzhou Beihang Univ International Innovation Institute Beihang Univ International Innovation Insti has sought patent for LB Assembly Method of TE Nanowires on Different Substrate Surfaces. This invention was developed by Niu Tianchao, Zheng Qiao, Hua Chenqiang and Zhou Miao.
The patent application number..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Anhui Anyi Intelligent Equipment Co Ltd patent application for Ceramic Engraving and Milling Machine with Chip Cleaning Function. This invention was developed by Xia Gang, Zhong Zhiming and Zong Chaomei.
The patent application number is CN20251054729..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has submitted a patent application for Silicon Carbide Wire Cutting Equipment. Zhang Lei, Zhou Zhengfei and Jiang Chengchen developed the invention.
The patent application number is CN202510691278 20250527. The patent publication number is CN120326810 (A)..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has applied Chinese patent for Broken Line Detection and Roller Surface State Monitoring System Based on Sic Crystal Bar Cutting Process. Yao Zhiyong, Jiang Chengchen and Chen Haibing developed it.
The patent application number is CN202510657756 20250521...
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- NVIDIA has sought patent for Neural Network for Controlling Autonomous Machines. This invention was developed by Dalal Manish, Mandlekar Arvind Uday, Garrett Charles R, Handa Aniket and Fox Daniel.
The patent application number is CN20251078924 20250117. The patent publication number is CN120326591 (A). Inte..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Institute Of Advanced Technology Univ Of Science and Technology Of China has submitted a patent application for Semiconductor Detection Method and Device Based on Multi-scale Lightweight Network. Shu Min developed the invention.
The patent application number is CN202510212436 20250225. The patent publicati..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Suzhou Exceltech Electronics patent application for Abnormality Detection Method Based on Adaptive Memory Bank Updating and Multi-scale Comparison Aggregation. This invention was developed by Yang Junyang, Cao Qiuyang and Zhu Xiaobin.
The patent appl..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Hangzhou Dianzi University patent application for SLAM Parameter Adaptive Method and System Based on Deep Reinforcement Learning. This invention was developed by Dai Weichen, Su Wenhan, Ming Yuhang and Kong Wanzeng.
The patent application number is C..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Jiangsu Xingzhou Microelectronics Co Ltd has submitted a patent application for Chip Control Method and Device and Chip. Qu Junwu developed the invention.
The patent application number is CN202510445602 20250410. The patent publication number is CN120337311 (A). International Patent Classification codes ar..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 28 -- Rongyao Terminal has submitted a patent application for Face Recognition Method, Electronic Equipment, Chip System and Storage Medium. Yang Xiaoming developed the invention.
The patent application number is CN20241045810 20240110. The patent publication number is CN120337270 (A). International Patent Classif..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Hongrun Semiconductor (Suzhou) has applied Chinese patent for Surface Mounting Detection System in Semiconductor Packaging. Li Fanxing, Zhang Chunxia and Wang Chaoqun developed it.
The patent application number is CN202510424035 20250407. The patent publication number is CN120339701 (A). International Patent..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- NVIDIA has filed a patent application for Pixel Generation Techniques. This invention was developed by Barnes Lee, Luyens Jan Pieter, Pinzone Benjamin F and Sastri Cunigal Kalpesh N.
The patent application number is CN20251079081 20250117. The patent publication number is CN120339033 (A). International Paten..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- NVIDIA has filed a patent application for Synthetic Human Motion Generation Using Neural Networks for Scene Awareness. This invention was developed by Yi Hongwei, Rempe Dirk, Peng Xuebin and Fiedler Stefan.
The patent application number is CN20251071684 20250116. The patent publication number is CN120340108 ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Guangzhou National Laboratory has submitted a patent application for Multi-omics Experiment Device, Experiment Equipment and Experiment Method. This invention was developed by Cao Xiaobao, Wang Zhong, Yang Yunpeng, Zhan Aiwen, Jin Jian and Peng Guangdun.
The patent application number is CN202510748469 2025..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Beijing Xuanjie Technology has submitted a patent application for Image Edge Detection Method and Device, Electronic Equipment, Chip and Medium. This invention was developed by Wu Xin.
The patent application number is CN202510399570 20250331. The patent publication number is CN120339312 (A). International Pa..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Soochow University has applied Chinese patent for Transient Photovoltage Test System and Method with Spatial Resolution. Sun Baoquan, Xiang Zhizhang, Wang Yusheng and Song Tao developed it.
The patent application number is CN202510642002 20250519. The patent publication number is CN120334594 (A). Internati..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Zhisensor Tech Inc patent application for Z-axis MEMS Closed-loop Accelerometer Assembly and Accelerometer. This invention was developed by Fan Hongbin, Wang Yan, Zhang Gengcheng, Zhou Rui, Zhang Hengji and Luo Peng.
The patent application number is ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Yantai Zhigong Biomedical Tech has filed a patent application for Multi-channel Sample Parallel Detection Device of Liquid Phase Chip Instrument. This invention was developed by Che Tuanjie, Yan Libo, Shen Qingyu, Li Yana, Mi Jia, Lin Chunhua, Li Wenjun, Kan Ying, Lyu Xiaofei and Yang Tong.
The patent applic..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Yueyang Changling Equipment Res Institute Co Ltd has filed a patent application for Silica Powder Filter Stick Regeneration Compound and Technology for Polycrystalline Silicon Production Enterprise. This invention was developed by Yang Cixiong, Lu Hao, Chen An, Li Jiong and Yang Hao.
The patent application..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Tibet Autonomous Region Acad Of Forest Sciences patent application for Seedling Raising Substrate for Juniperus Chinensis and Preparation Method of Seedling Raising Substrate. This invention was developed by Li Bingzhang, Gesang Quzhen, Min Xiaohang, Wa..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Zhuhai Tanyun Jingxin Intelligent Tech Co Ltd has applied Chinese patent for Polypeptide Chip Sample Automatic Detection Processing Equipment and Detection Method. Wang Jun, Zhang Liying, Wang Quan, Liao Xitai and Li Yingrui developed it.
The patent application number is CN20241039821 20240110. The patent ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published NVIDIA patent application for Machine Learning Model for Generative Human Motion Simulation. The invention was developed by Peng Xuebin, Yuan Ye, Lempe David W, Iqbal Umar, Litani Orna, Wang Tingwu, Tessler Christine, Kautz Jan, Fiedler Stefan and Butt..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Center has filed a patent application for Optical Neural Network, Implementation Method Thereof and Optical Neural Network Chip. This invention was developed by Bi Yu, Li Tuo and Wang Changhong.
The patent application number is CN2025104..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Semiconductor Energy Laboratory patent application for Light Emitting Device and Method for Manufacturing Light Emitting Device. Seo Hiromi, Sasaki Toshiki and Ohsawa Nobuharu developed the invention.
The patent application number is CN20238083119 2023..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- DRS Network & Imaging Systems Inc has submitted a patent application for Method and System for Manufacturing Infrared Transparent Window Wafer with Integrated Anti-reflection Grating Structure. This invention was developed by Schmert Thomas.
The patent application number is CN20238082755 20231205. The pate..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Yangtze Memory Technologies has applied Chinese patent for Fabricating Fill Structure in Three-dimensional Semiconductor Device. Song Jiyue, Xu Zongke, Zhang Qiangwei, Xu Wei and Wu Jiajia developed it.
The patent application number is CN20238011842 20231016. The patent publication number is CN120323108 (A)...
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Hitachi Energy patent application for Operating Method, Semiconductor Module and Manufacturing Method. Wurth Stefan, Drofenik Ulrich, Park Ki-beom and Basthun Ulf developed the invention.
The patent application number is CN202280102414 20221206. The ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- NEO Semiconductor has submitted a patent application for 3D Memory Cell and Array Architecture and Process. This invention was developed by Hsu Fu-chang.
The patent application number is CN20238073455 20230502. The patent publication number is CN120323104 (A). International Patent Classification codes are ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- SanDisk Technologies has submitted a patent application for Stepless Three-dimensional Memory Device with Layer Contact Via Structure Over Support Pillar Structure and Method of Forming Same. This invention was developed by Yu Jixin, Matsuno Koichi, Chu Joao Matthew, Clamann Michael D and Alsmeier Johann.
Th..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- SanDisk Technologies has submitted a patent application for Three-dimensional Memory Device with Cylindrical Trench Bridge Structure and Method of Forming Same. This invention was developed by Matsuno Koichi, Kubo Tomohiro and Alsmeier Johann.
The patent application number is CN20248005331 20240524. The pate..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- SanDisk Technologies has filed a patent application for Three-dimensional Memory Devices Including Horizontal Semiconductor Channels and Methods of Forming Same. This invention was developed by Iwai Takasaki, Yada Shinsuke, Nakamura Tadashi and Ogawa Hiroyuki.
The patent application number is CN20248005252 2..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Micron Technology has submitted a patent application for Memory Device with Hierarchy of 2-transistor Memory Cells. Karda Kamal M, Ramaswamy Durai Vishak Nirmal, Liu Haitao and Sarpatwari Karthik developed the invention.
The patent application number is CN20238082529 20231128. The patent publication number i..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received LG Innotek patent application for Circuit Board and Semiconductor Package Including Same. Im Sehoon, Myung Se-ho and Yun Nam-kyu developed the invention.
The patent application number is CN20238083530 20231019. The patent publication number is CN120323..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received IHI Corporation patent application for Power Semiconductor Module and Power Conversion Device. Notake Yukiteru developed the invention.
The patent application number is CN20248005297 20240226. The patent publication number is CN120322952 (A). Internati..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Cymer Inc has applied Chinese patent for Catheter System, Radiation Source, Lithographic Apparatus and Methods Thereof. Steiger Thomas Detlef developed it.
The patent application number is CN20238083698 20231106. The patent publication number is CN120322923 (A). International Patent Classification codes ar..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Siemens patent application for Semiconductor Assembly Having at Least One Semiconductor Element. Neugebauer Stephan, Raab Oliver, Laduge Christian, Stegmeier Stefan, Wagner Klaus Florian and Michael Witten developed the invention.
The patent applicatio..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Applied Materials has sought patent for Electrochemical Reduction of Surface Metal Oxides. This invention was developed by Shin Yun-ah, Mebach Benachek, Li Zhengzhou, Tang Xianmin, Chua Thai Cheng and Christian W Valencia.
The patent application number is CN20238084399 20231127. The patent publication number..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Fujifilm has filed a patent application for Method for Manufacturing Laminate, Method for Manufacturing Semiconductor Member, Photosensitive Resin Composition, Laminate, Semiconductor Member, and Resin Composition. This invention was developed by Yamakawa Yuta.
The patent application number is CN20238083978 ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Netherlands Organisation for Applied Scientific Research patent application for Method and Apparatus for Depositing Components on a Substrate. This invention was developed by Hendriks Rob Jacob and Cordewey Robin Bernardus Johannes.
The patent applic..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Kokusai Electric has filed a patent application for Transport System, Main Carriage, Sub-carriage, and Method for Maintaining Semiconductor Manufacturing Apparatus. This invention was developed by Ito Tsuyoshi and Takada Nobuhito.
The patent application number is CN20238084504 20230202. The patent publicatio..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- SCREEN Holdings has applied Chinese patent for Substrate Processing Method. Nishimura Yuta, Nishimori Daichi and Hinode Daiki developed it.
The patent application number is CN20238084521 20231110. The patent publication number is CN120322851 (A). International Patent Classification code is H01L21/304. Coop..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- RNR Labs Inc has submitted a patent application for Laser Heat Treatment Method of Substrate Structural Body Based on Scanning Mode and Electronic Device Preparation Method Applying Laser Heat Treatment Method. This invention was developed by Ryu Jeong-do, Kang Sung-ho, Cho Joo-hyun and Ryu Sung-hoon.
The ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- RNR Labs Inc has applied Chinese patent for Laser Heat Treatment Method of Substrate Structural Body and Preparation Method of Electronic Device Using Laser Heat Treatment Method. Ryu Jeong-do and Kang Sung-ho developed it.
The patent application number is CN20238083715 20231023. The patent publication num..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Soitec Silicon On Insulator patent application for Method for Producing Two Substrates, Each Comprising at Least Two Pieces of So-called Dummy Donor Substrates, on Carrier Substrate. This invention was developed by Mori Olivier, Darras Francis Xavier, L..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Lam Research patent application for Processing Tool with Hyperspectral Camera for Metrology-based Analysis. Sawlani Kapil, Martin Patkin John Ellsworth, Franzen Paul, Christensen Michael and Porter David developed the invention.
The patent application ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Lam Research has submitted a patent application for Semiconductor Processing Chamber with Metal or Metalloid Fluoride Process Exposure Coating. This invention was developed by Kirschey Robin, Eric A Pape, Wetzel David Joseph and Xu Lin.
The patent application number is CN20238083919 20231129. The patent publ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Applied Materials patent application for Systems and Methods for Implementing Micro-pulse Schemes Using Dual Independent Pulsers. The invention was developed by Azad Ahmed Noam Mohamed Waleed, Ramaswamy Kartik, Guo Yue, Bright Nicholas J and Yang Yang...
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received ASML Netherlands patent application for Electrooptical Stack, Module, Evaluation Device, Method for Producing an Electrooptical Stack. De Langen Johannes, Ruman Brian A, Mdeletosov Dmytro and Del Tin L developed the invention.
The patent application nu..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Qualcomm has filed a patent application for Apparatus with Inductor in Substrate and Method for Manufacturing Inductor. This invention was developed by Liu Ke, Qiu Ruiyi and Kim Jonghae.
The patent application number is CN20238084345 20231201. The patent publication number is CN120322836 (A). International P..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released SanDisk Technologies patent application for Non-volatile Memory with Sequential Reads. This invention was developed by Yuan Jiahui and Dutta Deepanshu.
The patent application number is CN20248005320 20240524. The patent publication number is CN12032282..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- SK Hynix Memory Solutions Inc has submitted a patent application for Systems, Methods, and Media for Prioritizing Read Access to Storage Device. This invention was developed by De Vries Jan and Vemula Naveen.
The patent application number is CN20238083809 20231025. The patent publication number is CN120322..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received TOPPAN Holdings patent application for Black Matrix Substrate and Display Device. Kawada Hiroaki and Ishikawa Shinya developed the invention.
The patent application number is CN20238080800 20231204. The patent publication number is CN120322815 (A). I..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Univ Wuxi Taihu has sought patent for Non-contact Working Parameter Measurement Method for IGBT (insulated Gate Bipolar Translator) Chip. This invention was developed by Yin Rong, Yang Xinbiao, Jiang Ningning and Gao Wenzhe.
The patent application number is CN202510514671 20250423. The patent publication n..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Beijing Sunwise Space Technology patent application for Screening System and Method of Hybrid Integrated Circuit. Xu Xiaofang, Zhao Qian, Liu Baolin, Zheng Shiqi, Gu Zucheng, Zhang Yichun, Yuan Jiafei, Shi Liang, Tang Qing, Jiang Shang, Liu Qun and Zhan..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Kunshan Maiye Electronic Tech Co Ltd has sought patent for Semiconductor Chip Test Seat and Test Method Thereof. This invention was developed by Zou Anxing.
The patent application number is CN202510586714 20250508. The patent publication number is CN120334716 (A). International Patent Classification code i..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Tbstest Tech Co Ltd patent application for Signal Transmission Method Based on Chip Test. Zhang Loulou, Li Hongfei, Zhang Yue, Yang Aimin and Hua Lei developed the invention.
The patent application number is CN202510552918 20250429. The patent public..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Suzhou Geju Electronic Tech Co Ltd has applied Chinese patent for Probe Pin Test Equipment of Integrated Circuit Test Socket. Zhao Chengbing developed it.
The patent application number is CN202510479735 20250417. The patent publication number is CN120334712 (A). International Patent Classification codes ar..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Geke Microelectronics Zhejiang Co Ltd has submitted a patent application for Test Method and Test Fixture for Image Sensor Chip Package. This invention was developed by Lu Qun, Huang Zhiping and Zhang Wei.
The patent application number is CN20241069293 20240117. The patent publication number is CN120334704..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Hefei Zhice Electronic Co Ltd patent application for Device for Measuring Thermal Resistance of Semiconductor Device. The invention was developed by Yang Liangliang and Li Fangkui.
The patent application number is CN202510811486 20250618. The patent..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Northwest Electronic Equipment Tech Research Institute Second Research Institute Of China Electronic patent application for Vehicle Gauge Grade Silicon Carbide Device Power Cycle Test Method. The invention was developed by Liu Wenqing, Zhang Huo, Deng ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Shanghai DGT Environmental Protection Tech Co Ltd has submitted a patent application for Wood Chip Type Termite Monitoring Equipment with Termite Capturing Mechanism. This invention was developed by Chen Zhifeng.
The patent application number is CN202510621587 20250515. The patent publication number is CN1..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has released Univ Hengyang Normal patent application for Passive Electrostatic Collection Method Radon Measurement System Based on CMOS Image Sensor. This invention was developed by Tan Yanliang, Xie Ruomei, Fan Zhongkai and Yuan Hongzhi.
The patent application n..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Applied Materials Israel has submitted a patent application for Non-destructive Estimation of Structural Properties of Sample Via X-ray Modeling Based on Ground Truth Measurements. This invention was developed by Giermonski David, Haddad Uma, Smish David and Eilon Mehmet.
The patent application number is CN2..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has published Huayouyi Tech Co Ltd patent application for Multi-ray Machine Detection Module of Semiconductor Equipment. The invention was developed by Zhu Junlong and Zheng Jinghong.
The patent application number is CN20241062854 20240116. The patent publication..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- South China Normal University has applied Chinese patent for Analog Integrated Circuit Wiring Method and System, Electronic Equipment and Storage Medium. Wang Deming, Jiang Songyan and Zhang Yong developed it.
The patent application number is CN202510250329 20250304. The patent publication number is CN120337..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Coligen China Corp has filed a patent application for Ultrasonic Radar Semiconductor Chip Pin Design Method. This invention was developed by Huang Chengbiao, Lan Xingliang, Lin Zhenkui, Huang Zhiping, Liu Shaoxian, Fu Jie, Liao Wanqiang, Chen Jiaxin, Lin Zhiqi, Peng Bin, He Deren and Jiang Zhiqiang.
The pa..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- State Intellectual Property Office of China has received Heilongjiang University patent application for Single Event Upset Resistant Self-recovery In-memory Computing Unit Design Method Based on SRAM (static Random Access Memory). Li Hongchen, Zhao Xiaofeng and Cao Bei developed the invention.
The patent a..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 28 -- Zhengqi Co Ltd has submitted a patent application for Miniature Composite I/o Computer Chip Module Based on OSM-l Standard. This invention was developed by Zhang Yuzheng and Zhang Yuqi.
The patent application number is CN20241062997 20240116. The patent publication number is CN120337842 (A). International ..
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