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Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- Kk Toshiba and Toshiba Electronic Devices & Storage have filed a patent application for Semiconductor Device. This invention was developed by Nishiguchi Toshifumi.
The patent application number is US202418636162 20240415. The patent publication number is US2025393294 (A1). International Patent Classifica..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- Kk Toshiba and Toshiba Electronic Devices & Storage have applied United States patent for Semiconductor Device. Kono Hiroshi developed it.
The patent application number is US202519311055 20250827. The patent publication number is US2025393293 (A1). International Patent Classification codes are H10D62/10,..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- Panmnesia Inc has applied United States patent for Computing Device for Accessing Memory Expander Using CXL Interconnect and Operating Method Thereof. Gouk Dong Hyun, Ryu Eo Jin, Lee Sang Won and Kim Dong Pyung developed it.
The patent application number is US202418925147 20241024. The patent publication..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Jiangsu Changshi Jiye Electric Tech Co Ltd has filed a patent application for Automatic Welding Equipment Capable of Purifying Smoke and Used for Integrated Circuit Chip Processing. This invention was developed by Li Yongjian, Li Jiangping and Wang Tingting.
The patent application number is CN202510328008 2..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has published Jcet Man Co Ltd patent application for Package Structure and Package Method. The invention was developed by Liu Lihong, Gu Jiongjiong, Lei Dayong and Wang Nan.
The patent application number is US202519219581 20250527. The patent publication number is US20253..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- Jcet Group Co Ltd has applied United States patent for Package Structure and Package Method. Zhang Yuesheng, Sun Zhengyang and Yu Kaiyuan developed it.
The patent application number is US202519246628 20250623. The patent publication number is US2025391746 (A1). Cooperative Patent Classification codes are..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- Ims Nanofabrication GmbH and JEOL have applied United States patent for Lithography System. Kobayashi Noriyuki, Takizawa Yoshiaki, Okano Hideto and Platzgummer Elmar developed it.
The patent application number is US202519246950 20250624. The patent publication number is US2025391634 (A1). International P..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has published Gdm Holding LLC patent application for In-place Sorting. The invention was developed by Gale Trevor, Borchers Albert, Bodik Rastislav and Martins Danilo Carvalho.
The patent application number is US202418749344 20240620. The patent publication number is US20..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has published Shanghai Kairuien Semiconductor Tech Co Ltd patent application for Novel Base Material Back Grinding Protection Device and Using Method Thereof. The invention was developed by Jin Yong, Kim Young-sik, Kim Young-hoon and Quan Rilong.
The patent applic..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Shanghai Fulehua Semiconductor Tech Co Ltd has submitted a patent application for Laser Windowing Method for Small Round Hole in Thick Copper Foil of Amb Substrate. This invention was developed by Tong Hui, Yang Qiangjun and Dai Hongxing.
The patent application number is CN202510149258 20250211. The patent ..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Yancheng Stard Minli Valves Co Ltd has sought patent for Valve Machining Milling Equipment with Chip Controlling and Cooling Functions. This invention was developed by Zeng Xuelong, Yang Gengjun and Yu Haitao.
The patent application number is CN202510565214 20250430. The patent publication number is CN12015..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has released Suteng Innovation Technology patent application for Window Mirror Assembly, LiDAR, Automatic Driving Device and Assembly Process. This invention was developed by Cui Enkang, Zhang Teng, Wang Huan, Yang Dongyu and Liu Guoguang.
The patent application number is..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Shanghai Integrated Circuit Equipment Materials Industry Innovation Center has applied Chinese patent for Photomask Particle Cleaning Method and Device. Zhang Jiancheng, Ko Dong-won and Xu Long developed it.
The patent application number is CN202311733912 20231215. The patent publication number is CN1201554..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- Ebara has submitted a patent application for Processing Apparatus. This invention was developed by Sato Yuichi, Ota Kohei and Takada Nobuyuki.
The patent application number is US202519247774 20250624. The patent publication number is US2025387870 (A1). International Patent Classification code is B24B37/1..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Taizhou Huatuo Electronic Tech Co Ltd has sought patent for Drying Mechanism of Chip Plastic Package Curing Device. This invention was developed by Wang Long, Wang Tianhua and Zhang Biao.
The patent application number is CN202510648617 20250520. The patent publication number is CN120160391 (A). Internationa..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has published Song Young Jin patent application for Optical Filter, Sensor System Comprising Same, and Method for Manufacturing Halogenated Amorphous Silicon Thin Film for Optical Filter. The invention was developed by Song Young Jin and Hwangbo Chang Kwon.
The patent app..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Zhejiang Indesai Semiconductor Mat Co Ltd has submitted a patent application for Preparation Method of Silicon Nitride Powder. This invention was developed by Pan Jiawei, Hu Zunlan, Zhou Ping, Wang Long, Yang Yang and Zhao Xiaolan.
The patent application number is CN202510440749 20250409. The patent publica..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- East China Inst Optoelectronic Integrated Device has applied Chinese patent for Preparation Method of Piezoresistive High-temperature Pressure Sensor Based on TSV (through Silicon Via) of Silicon Column. Zhao Juan, Guo Qunying, Chen Binggen, Wang Wenjing, Cao Weida, Song Youyu and Zhang Hongkun developed it.
..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Meiqing Nawei Suzhou Chip Mfg Co Ltd has sought patent for Packaging Structure of Piezoelectric Printing Chip and Packaging Method Thereof. This invention was developed by Wu Xuanye and Zhang Hua.
The patent application number is CN202510326217 20250319. The patent publication number is CN120157080 (A). Int..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- Yoshikuni Masato, Tomita Daisuke and Mitsumi Electric have sought patent for Transmission Driver Integrated Circuit, Device Including the Same, and Bus System. This invention was developed by Yoshikuni Masato and Tomita Daisuke.
The patent application number is US202519247370 20250624. The patent publica..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has released Quanzhou Kuntaixin Microelectronic Tech Co Ltd patent application for Sensing Chip with Multiplexing Pin and Pin Multiplexing Method. This invention was developed by Qian Zhenhuang, Qian Zhentao and Zhang Kaixin.
The patent application number is CN202..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- The Spot Laboratory has submitted a patent application for Method for Grafting Modification on Surface of Substrate. This invention was developed by Niu Saisai.
The patent application number is CN202311722128 20231214. The patent publication number is CN120157353 (A). International Patent Classification cod..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Hefei Jinlonghao Tech Co Ltd has submitted a patent application for Method for Shielding Assembly Area of Glass Substrate Plated with Af Film and Application. Wu Jianyong, Wei Zhongkai and Li Kuanlu developed the invention.
The patent application number is CN202510267402 20250307. The patent publication num..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- Silicon Mitus Inc and Hangzhou Silicon Magic Semiconductor Tech Co Ltd China have sought patent for Apparatus and Method for Detecting Foreign Substance. This invention was developed by Hong Chang Ki, Park Chang Sub and Ko Young Seok.
The patent application number is US202117909692 20210303. The patent p..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has released Zhejiang Jingyuan New Mat Co Ltd patent application for Organic Silicon Feed Opening Negative Pressure Device for Aviation Lining Processing. This invention was developed by Zhang Chunhui, Chen Shilong, Wang Xiangdi, Tu Jungang, Wang Jinhua, Wang Songtao..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Omnisun Information Mat Co Ltd has submitted a patent application for Automatic Substrate Storage Device. This invention was developed by Song Xiaoguang, Ding Feng and Jin Hao.
The patent application number is CN202510425179 20250407. The patent publication number is CN120156848 (A). International Patent Cl..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Henan Paimo Machinery Equipment Co Ltd has submitted a patent application for Wood Chip Bin Capable of Preventing Stacking During Discharging. This invention was developed by Liu Jianlong, Li Yuan, Peng Xiaoxiao, Guo Wei and Li Zheng.
The patent application number is CN202510591143 20250508. The patent publ..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has published Samsung Electronics Co Ltd and Chungbuk National University Industry Academic Cooperation Foundation patent application for Variable Resistance Memory Device. The invention was developed by Lee Hyun Seok and Choi Min.
The patent application number is US20241..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- Earth Top International Enterprises Ltd has filed a patent application for Battery Management Integrated Circuit and System, Battery Pack Using the Battery Management Integrated Circuit, Computer Program Product and Related Method. This invention was developed by Yu Tsai-chung and Lee Nan-huei.
The paten..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has published Hefei Vigon Mat Tech Co Ltd patent application for Roll-to-roll Cvd (chemical Vapor Deposition) Production Equipment and Process. The invention was developed by Lyu Peng, Zhang Zihan, Nie Biao, Wang Yunlong and Wu Yiliang.
The patent application numb..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Zhaoteng Tech Wuxi Co Ltd has filed a patent application for Cvd (chemical Vapor Deposition) Wafer Coating Equipment. This invention was developed by Sun Dezhao, Liu Chao, Pan Xiaobo and Huang Dong.
The patent application number is CN202510418163 20250403. The patent publication number is CN120158724 (A). I..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has released Jiangsu Zhixinda Tech Co Ltd patent application for Substrate Evaporation System. This invention was developed by Li Shangjun.
The patent application number is CN202311672839 20231207. The patent publication number is CN120158714 (A). International Pa..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has published Chalco Application Research Institute and Chalco Ruimin patent application for Annealing Method of Aluminum Wafer for Mechanical Hard Disk. The invention was developed by Li Qing, Huang Dongnan, Gao Chong, Zhang Zilong, Wu Yongfu, Wu Jianxin, Huang Ruiy..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Univ Qiannan Normal Nationalities has submitted a patent application for Diluted Magnetic Semiconductor with Cr-doped Cds Nano-structure and Preparation Method of Diluted Magnetic Semiconductor. This invention was developed by Ren Yinshuan.
The patent application number is CN202510228160 20250228. The paten..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- Nichia has submitted a patent application for Lens and Light Emitting Device. This invention was developed by Kishimoto Tomohisa, Okahisa Tsuyoshi and Fujii Toshiyuki.
The patent application number is US202519305815 20250821. The patent publication number is US2025389923 (A1). International Patent Classi..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has released Zhejiang Sanshiji New Material Tech Co Ltd patent application for Hollow Silicon Dioxide Particles as Well as Preparation Method and Application Thereof. This invention was developed by Guo Yingchun, Sun Shouquan, Li Wen and Yanagihara Takeshi.
The pa..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has published East China University of Science and Technology and Xinjiang Geensi Energy Technology patent application for Preparation Method of Polycrystalline Silicon. The invention was developed by Zong Yuan, Zhao Ling, Tong Gui, Jiang Guangjing, Yang Zuodong and ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Linshu Jiakun Energy Mat Co Ltd has sought patent for Silicon Carbide Micro-powder Surface Modification Method and Application of Silicon Carbide Micro-powder Surface Modification Method in Thermal Insulation Board. This invention was developed by Yuan Hongfeng, Wang Jingling, Yuan Ruihan, Xing Qiangqiang and ..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- Corindus has submitted a patent application for Dynamic Device Manipulation. Canale Cameron, Sokhanvar Saeed and Clark Andrew developed the invention.
The patent application number is US202418749886 20240621. The patent publication number is US2025387169 (A1). International Patent Classification codes ar..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has released Univ Kiel Christian Albrechts patent application for Wafer Holder for Electrically Contacting Brittle Semiconductor Wafers and Use. This invention was developed by Barr John, Carstensen Jurgen and Adelung Rainer.
The patent application number is CN202..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- SK Hynix Memory Solutions Inc has applied Chinese patent for Systems, Methods, and Media for Reducing Impact of Driver Parameter Writes on Solid State Drive Performance. Gangadhar Sudhir V, Pelster David J, Govindarajan Bindu, Rajagopal Arun, Goletz Marco Andreas Stefan and Vakchar Youssef developed it.
The..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- Chengdu Analog Circuit Tech Inc has sought patent for Programming Method for Non-volatile Memory. This invention was developed by Wang Tengfeng and Hong Dong.
The patent application number is US202519209966 20250516. The patent publication number is US2025391475 (A1). International Patent Classification ..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has published Postech Academy Ind Foundation patent application for Method for Preparing Low-loss Hydrogenated Amorphous Silicon That is Transparent in Visible Light, Method for Preparing Low-loss Hydrogenated Amorphous Silicon Nitride That is Transparent in Visible Light, a..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Xinxi Holdings Co Ltd has submitted a patent application for Atomic Layer Deposition Method and Atomic Layer Deposition Apparatus. Sato Eiji and Sakamoto Hitoshi developed the invention.
The patent application number is CN20238076962 20230828. The patent publication number is CN120153123 (A). International ..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has received Evonik Roehm GmbH and Deutsches Krebsforsch patent application for Multi-species Chip for Detecting Dna-methylation. Nagarajan Suresh, Roy Sashwati, Bohl Franz, Whelan Robert, Huang Lingzhi, Huang Jieying, S Tian, Frank David, Leco Francesco, Venkatesh G..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Aikesa Tech Chengdu Co Ltd has sought patent for Multi-modular Redundancy Backup Method and System for SSD (solid State Disk) Internal Data. This invention was developed by Song Peigen and Liu Xingjun.
The patent application number is CN202510129753 20250205. The patent publication number is CN120162194 (A)..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- Zero Asic Corp has submitted a patent application for Integrated Circuit Die Stitching Using Jumper Die. This invention was developed by Olofsson Andreas and Keser Lizabeth.
The patent application number is US202418753356 20240625. The patent publication number is US2025391775 (A1).
An abstract relea..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Shenzhen Langbowan Advanced Mat Co Ltd has sought patent for Carbon Fiber Negative Electrode Substrate and Preparation Method and Application Thereof. This invention was developed by Kang Hongwei and Liu Xiaolin.
The patent application number is CN202510348616 20250324. The patent publication number is CN12..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- Schaeffler Tech AG & Co KG and Vitesco Technologies have submitted a patent application for Half-bridge Module with Insulated Contact Areas Between Two Transistor Strip Sections. This invention was developed by Kuschel Alexander.
The patent application number is US202318868053 20230523. The patent public..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has received Jcet Man Co Ltd patent application for Package Structure and Manufacturing Method Thereof. Gu Xiao, Liu Lihong and Gu Jiongjiong developed the invention.
The patent application number is US202519246713 20250624. The patent publication number is US2025391753 (..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- Jcet Group Co Ltd has submitted a patent application for Package Structure and Package Method. This invention was developed by Yu Kaiyuan, Zhou Hao and Yin Jiaming.
The patent application number is US202519220721 20250528. The patent publication number is US2025391745 (A1). Cooperative Patent Classificat..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has published LYSTEEL and Hunan Liangang Electromagnetic Mat Co Ltd patent application for Stress Relief Annealing Control Method for Oriented Silicon Steel. The invention was developed by Xu Guang, Liang Liang, Zhu Yechao, Tian Fei, Liu Xuhui, Zhang Liqin, Cai Miao,..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has published Silith Tech Shanghai Co Ltd patent application for Time Domain Coherence Tomography System and Method Based on Photonic Integrated Chip. The invention was developed by Zhou Guangzhu, Zheng Zhexuan, Zhu Rui, Zhang Senlin and Chen Yuxuan.
The patent applicatio..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has received Evonik Operations GmbH and Deutsches Krebsforschungszentrum Stiftung Des Oeffentlichen Rechts patent application for Multi-species Chip to Detect Dna-methylation. Nagarajan Sanjanaa, Roy Suki, Böhl Florian, Whelan Rose, Huang Lingzhi, Wong Kit Yeng, Chan Sarah,..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Zhejiang Persian Cat Stationery Co Ltd has submitted a patent application for Full-automatic Pencil Sharpener, Pencil Sharpening Method and Chip. Zhou Xiaoguang developed the invention.
The patent application number is CN202510304998 20250314. The patent publication number is CN120156206 (A). International ..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has received Minebea Power Semiconductor Inc patent application for Semiconductor Device. Kato Yutaka developed the invention.
The patent application number is CN20238076825 20231025. The patent publication number is CN120153771 (A). International Patent Classific..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Guangdong Huaxin Zhiyuan Tech Co Ltd has submitted a patent application for Chip Sampling Method, Chip and Battery System. This invention was developed by Yang Jiachang.
The patent application number is CN20251084117 20250120. The patent publication number is CN120162559 (A). International Patent Classifica..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Beijing Xinchi Semiconductor Tech Co Ltd has submitted a patent application for Soc-based Camera Data Preview Method and Device, Medium and Chip. Yan Yong developed the invention.
The patent application number is CN202510227339 20250227. The patent publication number is CN120162018 (A). International Patent..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has released Shenzhen Huashang Data Tech Co Ltd patent application for Low-power-consumption Scheduling Method and System for RK Main Control Chip. This invention was developed by Zhong Yinglong, Ao Jinyang and Chen Xukun.
The patent application number is CN202510..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has received Infovision Optoelectronics Kunshan Co Ltd patent application for Manufacturing Method for Array Substrate, and Array Substrate. Chung Te-chen, Chang Yuan-hao and Tao Yuan developed the invention.
The patent application number is US202318881313 20230511. The p..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- STMicroelectronics International NV has submitted a patent application for Electronic Device Based on Sic Having Improved Electrical Performances and Manufacturing Method. This invention was developed by Rascuna' Simone, Puglisi Valeria and Bellocchi Gabriele.
The patent application number is US202519232..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has published Japan Display Inc and Idemitsu Kosan patent application for Oxide Semiconductor, Laminated Structure, Thin Film Transistor, and Electronic Device. The invention was developed by Watakabe Hajime, Tsubuku Masashi, Sasaki Toshinari, Tamaru Takaya, Mochizuki Marina..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Taiwan Semiconductor Co Ltd has filed a patent application for Biosensing Device. This invention was developed by Chen Junge.
The patent application number is CN202410164047 20240205. The patent publication number is CN120161554 (A). International Patent Classification codes are A61B5/145, A61B5/1455, G01D2..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Wenzhou Duofu Aviation Ind Group Co Ltd has submitted a patent application for Aircraft Remote Detection Method and System Based on Semiconductor Laser Radar. This invention was developed by Deng Baihai.
The patent application number is CN202510266117 20250307. The patent publication number is CN120161472 (..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- Commissariat a Ienergie Atomique Et Aux Energies Alternatives has submitted a patent application for Chips Direct Bonding Method. This invention was developed by Montmeat Pierre, Fournel Franck and Vacon Mélanie.
The patent application number is US202519241847 20250618. The patent publication number is ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has published Wanhua Chemical Group Electronic Mat Co Ltd patent application for Method for Detecting Crystal Pulling Growth Stripes of Semiconductor Monocrystalline Silicon Through CZ Method. The invention was developed by Wang Hongwu, Liu Yiliang, Li Bo, Wang Sha a..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- Isac Res Inc has submitted a patent application for Apparatus for Processing Substrate. This invention was developed by Park Hyung Sang, Jeong Seong Jun, Kim Ji Hye and Choi Min Ho.
The patent application number is US202519208031 20250514. The patent publication number is US2025391643 (A1). International..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Hebei Ruisite Precision Tech Co Ltd has submitted a patent application for Control Method of Electroplating Production Line with Optimized PLC (programmable Logic Controller) Program. This invention was developed by Fan Zhongjie, Zhang Jiaqiang, Fu Lijian, Fan Xitao and Xia Jilun.
The patent application num..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has released Suzhou Kaiwei Intelligent Tech Co Ltd patent application for Environment-friendly PCB Electroplating Equipment. This invention was developed by Zhou Zhizhen, Hou Yinghua and Ge Tongshu.
The patent application number is CN202510540569 20250427. The pat..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Weifang Forward Welding Mat Co Ltd has sought patent for Welding Wire Electroplating Treatment Device. This invention was developed by Zhang Hongfeng, Li Zhenjian and Xu Xichao.
The patent application number is CN202510534167 20250427. The patent publication number is CN120158800 (A). International Patent C..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Jiangsu Xianghuan Tech Co Ltd has filed a patent application for Horizontal Electroplating Method of Solar Cell Silicon Wafer. This invention was developed by Ji Jingjia, Qin Yusen, He Ruiyong, Zhou Guohua and Lu Yibo.
The patent application number is CN202510511245 20250423. The patent publication number i..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has received The Spot Laboratory patent application for Method for Divergent Graft Modification on Surface of Substrate. Niu Saisai developed the invention.
The patent application number is CN202311722130 20231214. The patent publication number is CN120158498 (A)...
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Zhejiang Eno Environmental Prot Group Co Ltd has sought patent for Novel Etching Solution Formula in Semiconductor Material Etching Process. This invention was developed by Li Haonan, Fan Shuanggang, Gong Daigao, Chen Weijie and Zhong Jieqiong.
The patent application number is CN202510317612 20250318. The p..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has released Shenzhen Samcien Semiconductor Mat Co Ltd patent application for Organic Silicon Capable of Being De-bonded by Laser as Well as Preparation Method and Application of Organic Silicon. This invention was developed by Wu Yu, Huang Mingqi, Ye Zhenwen and Che..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Pangbeijie Powder Coating Shanghai Co Ltd has applied Chinese patent for Powder Coating Composition, Coated Substrate, Component and Method of Treating Substrate. Wang Kai, Miao Chunbo, Wu Cuiping and Song Liming developed it.
The patent application number is CN202311738200 20231215. The patent publication ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Shanghai Kairuien Semiconductor Tech Co Ltd has sought patent for Thermosetting Liquid Phase Composition Capable of Being Used as Back Grinding Protective Layer of Semiconductor Substrate and Application of Thermosetting Liquid Phase Composition. This invention was developed by Jin Yong, Kim Young-sik, Kim You..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Shanghai Shinchem Chemicals Co Ltd has submitted a patent application for Water-based Silicon Coating Additive and Preparation Method Thereof. This invention was developed by Yang Po and Cao Huabin.
The patent application number is CN202311729493 20231215. The patent publication number is CN120158135 (A). I..
Semiconductor
| Wed 07 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has received Synvivo Inc patent application for Multi-organ Microfluidic Chip. Fewell Gwendolyn Diedre, Ramsey Deborah Michele and Rosano Jenna Marie developed the invention.
The patent application number is US202519304374 20250819. The patent publication number is US2025..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Zhejiang Fulede Quartz Tech Co Ltd has submitted a patent application for Preparation Method of Quartz Ring on Semiconductor Etching Equipment. This invention was developed by Wang Jun, Zheng Mingshan, Yang Jun, Liang Mengying and Huang Peihong.
The patent application number is CN202510544905 20250428. The ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has sought patent for Silicon Carbide Wafer Multi-wire Cutting Degumming and Taking Method. This invention was developed by Yao Zhiyong, Zhong Jie and Chen Bo.
The patent application number is CN202510530981 20250425. The patent publication number is CN120..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- Petroleo Brasileiro SA Petrobras and Centro Brasileiro De Pesquisas Fisicas Cbfp have sought patent for Horseshoe-type Josephson Junction Device and Method of Manufacturing the Device. This invention was developed by Martins Eldues Oliveira, Oliveira Junior Ivan Dos Santos, Sinnecker Joäo Paulo and Rebello..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has received Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group patent application for Display Substrate and Display Device. Huang Yao, Cheng Yudiao, Huang Weiyun, Long Yue and Qiu Yuanyou developed the invention.
The patent application number is US202519317..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has received Beijing BOE Optoelectronics Tech Co Ltd and BOE Technology Group patent application for Display Substrate and Display Apparatus. Xian Jianbo, Xu Jingbo, Wang Jingquan, Qiao Yong and Wu Xinyin developed the invention.
The patent application number is US2024188..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has received Chengdu BOE Optoelectronics Tech Co Ltd [cn]; BOE Tech Group Co Ltd [cn]; Beijing BOE Technology Development patent application for Display Substrate and Display Device. Li Haoyu, Shi Ling, Fang Fei, Ma Hongbo and Huangfu Lujiang developed the invention.
The ..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Shengjisheng Semiconductor Tech Beijing Co Ltd has submitted a patent application for Method for Improving Overlay Precision by Optimizing Wafer Edge Voltage. He Jianyu, Cao Zhenghao, Wang Wenyi, Chu Chun and Zhang Jian developed the invention.
The patent application number is CN202510640489 20250519. The p..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has published Chongqing Duoliu Ind Co Ltd patent application for Method and System for Manufacturing Multilayer Ceramic Substrate. The invention was developed by Zhang Weilong and Hwang In-kwon.
The patent application number is CN202510484878 20250417. The patent ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has published Dongguan Yingxin Semiconductor Mat Co Ltd patent application for Polishing Pad for Polishing Silicon Substrate and Production Process Thereof. The invention was developed by Lei Longjin.
The patent application number is CN202510235605 20250228. The p..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Shandong Grins Semiconductor Mat Co Ltd has submitted a patent application for Silicon Wafer Polishing Solution Recovery Buffer Device. Zhang Rongbin, Yu Xingrui, Cheng Huaizhang, Meng Deqiang, Wang Yan, Li Chenyang and Chen Xin developed the invention.
The patent application number is CN202510453038 202504..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Ningbo Shanghang Electric Power Tech Co Ltd has submitted a patent application for Wafer Thinning Auxiliary Machine for Power Electronic Device Chip Production. This invention was developed by Li Huanling, Xu Genliang and Shen Jianfang.
The patent application number is CN202510639870 20250519. The patent pu..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Meere Company has filed a patent application for Substrate Corner Processing Device and Substrate Corner Processing Method. This invention was developed by Han Jung-yeol, Lee Ki-heon and Lee Hyung-keun.
The patent application number is CN202411825026 20241212. The patent publication number is CN120155860 (A..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- Ningbo Jinkai Machine Shares Co Ltd has filed a patent application for Milling and Grinding Combined Machining Device for Silicon Carbide Material. This invention was developed by Xiao Shuangmin, Wang Kai and Sun Chao.
The patent application number is CN202510647255 20250520. The patent publication number i..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 8 -- State Intellectual Property Office of China has released Foshan Hushun Electronic Tech Co Ltd patent application for Polishing Equipment for Semiconductor Surface. This invention was developed by Shen Mei, Zhang Qiuping and Wang Qiang.
The patent application number is CN202510470221 20250415. The patent pub..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has received Cupp Computing As patent application for System and Method for Implementing Content and Network Security Inside a Chip. Touboul Shlomo developed the invention.
The patent application number is US202519011878 20250107. The patent publication number is US202539..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Shanghai Ju Yue Electronics Co Ltd has filed a patent application for Reagent for Dyeing Semiconductor Microstructure, Dyeing Method and Application. This invention was developed by Shang Yue and Wang Shupei.
The patent application number is CN202510305776 20250314. The patent publication number is CN120160..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- Univ Of Hyogo has submitted a patent application for Manipulation System and Fluid Chip. Ukita Yoshiaki and Abe Takaaki developed the invention.
The patent application number is US202318860250 20230414. The patent publication number is US2025387790 (A1). International Patent Classification code is B01L3/..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- U.S. Patent and Trademark Office has released Micronics Inc patent application for Filter Assembly for a Filter Press. This invention was developed by Morley Terry Allen and Livingston Noah Riley.
The patent application number is US202519248957 20250625. The patent publication number is US2025387735 (A1)..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Jiangsu Meike Solar Tech Co Ltd has submitted a patent application for Cooling Liquid Collecting and Separating Device for Silicon Product Cutting. This invention was developed by Chen Ming, Zhang Ming, Wu Jiqing, Liu Fujie, Ji Mengxia, Xu Hui and Yang Jun.
The patent application number is CN202510331977 20..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- Jiangyin Sijie Electronics Co Ltd has filed a patent application for Automatic Test System and Method for Power Driving Chip Based on Digital Test Equipment. This invention was developed by Yu Zhangyong, Chen Jinchun and Huang Wenlong.
The patent application number is CN202510342567 20250321. The patent pub..
Semiconductor
| Thu 08 Jan 2026
Beijing, Jan. 8 -- CS Microelectronics Co Ltd has sought patent for Coupling Control Method and Device for Functional Area and Light Source of Chip to be Tested. This invention was developed by Taira Toshihiro, Liu Qi and Feng Changju.
The patent application number is CN202510209741 20250225. The patent publication number is ..
Semiconductor
| Thu 08 Jan 2026
Alexandria, Jan. 8 -- Weihai Hualing Opto Electronics Co Ltd has filed a patent application for Contact Image Sensor. This invention was developed by Jiang Li, Han Xiaowei, Lin Yonghui and Dai Pengfei.
The patent application number is US202318879697 20230627. The patent publication number is US2025392808 (A1). International P..
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