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Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- ENF Technology and Samsung Electronics have submitted a patent application for Silicon Oxide Film Etchant Composition, Etching Method Using Same, and Method for Manufacturing Semiconductor Device. This invention was developed by Lee Myung-ho, Song Myung Geun, Kim Ji-won, Kim Hag-soo, Zheng Fansheng, Kim Sang-..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- Jiangsu Sanmu Chemical Co Ltd and Jiangsu Sanmu Group Corp have filed a patent application for High-temperature-resistant and Ultraviolet-proof Polyester Modified Silicon Resin for High-end Coil Steel and Preparation Method of High-temperature-resistant and Ultraviolet-proof Polyester Modified Silicon Resin. ..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- South China University of Technology, Huayun Tongda Technology Group and Yuexiu China Transp Infrastructure Investment Co Ltd have applied Chinese patent for Substrate Joint Filling Material for Cement Pavement White-to-black Overlay, Preparation Method and Application. Zeng Liwen, Zhang Xin, Guo Yanling, Che..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- Guangdong Aiko Solar Energy Technology Co Ltd, Zhejiang Aiko Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Zhuhai Fushan Aixu Solar Energy Technology and Tianjin Aiko Solar Energy Technology have applied Chinese patent for Silicon Rod Slicing Method and Silicon Rod Slicing Equipment. Zhang ..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has received Infineon Tech Americas Corp patent application for Semiconductor Package and Method of Fabrication. Xiong Shunhe and Maloney Grant developed the invention.
The patent application number is US202519399428 20251124. The patent publication number is US202601651..
Semiconductor
| Sun 14 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has received Shenji Semiconductor Tech Xuzhou Co Ltd patent application for Semiconductor Growth Equipment Provided with Rotating Assembly. Chen Liang, Wang Shuai and Hong Xu developed the invention.
The patent application number is CN202610105950 20260127. The p..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- LG Management Development Inst Co Ltd has sought patent for Method, Apparatus, and System for Predicting Continuous Sequence. This invention was developed by Park Sung Woo and Lee Jae Hoon.
The patent application number is US202519409644 20251204. The patent publication number is US20260162017 (A1). Int..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Uni Chem Specialty Mat Pte Ltd has sought patent for Organic Light Emitting Device and Method for Forming the Same. This invention was developed by Hsieh Hui-shan, Lin Wei-fan and Liu Ling-jun.
The patent application number is US202519383746 20251109. The patent publication number is US20260164931 (A1)...
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- Clark Nicholas has filed a patent application for Memory-resident Execution of Persistent Executable Objects in Distributed Computing Systems.
The patent application number is US202619538221 20260212. The patent publication number is US20260161466 (A1). International Patent Classification code is G06F9..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- Hefei Kaimeng Tech Co Ltd has filed a patent application for Memory Management Method and Memory Controller. This invention was developed by Guan Dongsheng, Wu Tsung-lin, Zhu Qiao, Zhang Yu and Wang Zhi.
The patent application number is US202519386187 20251111. The patent publication number is US2026016..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Denka Co Limited has filed a patent application for Heat Dissipation Sheet. This invention was developed by Ohshima Kazuhiro, Wada Kosuke and Fukao Kenji.
The patent application number is US202218706662 20221109. The patent publication number is US20260160502 (A1). International Patent Classification co..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- Suzhou Dexin Chip Tech Co Ltd has filed a patent application for MEMS Device and Preparation Method Thereof. This invention was developed by Jiang Zhengyong.
The patent application number is CN202511604447 20251104. The patent publication number is CN121609293 (A). International Patent Classification codes..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has released Ragonesse Regina patent application for Method and System for Continuous Production of Pita Chips.
The patent application number is US202418975191 20241210. The patent publication number is US20260157406 (A1). International Patent Classification codes are A..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has released Arteris Inc patent application for Ensuring Arbitration Fairness in a Network-on-chip. This invention was developed by Charif Amir, Li Xinyu, Cizaire Stéphane and Van Ruymbeke Xavier.
The patent application number is US202519390673 20251117. The patent publ..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has published Saltzman Jonah E patent application for Integrated Deposit Return Management System.
The patent application number is US202519412984 20251209. The patent publication number is US20260162079 (A1). International Patent Classification codes are G06K7/14, G06..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has released Reed Semiconductor Corp patent application for System and Method for Maintaining Constant Switching Frequency in a Constant On-time Controller. This invention was developed by Shah Umang Bhadreshkumar and Sahu Biranchinath.
The patent application number is U..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has released Skytech Inc patent application for Deposition Equipment with Shield Cooling Device. This invention was developed by Liu Kuo-ju, Liu Chi-hsiang, Yi Ching-liang, Cheng Chi-hung, Cheng Yao-syuan and Wang Chun-fu.
The patent application number is US202418982806 ..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has released Zhang Chong, Komljenovic Tin and Tran Minh patent application for Comb Source with Improved Control.
The patent application number is US202418970061 20241205. The patent publication number is US20260161042 (A1). International Patent Classification code is G..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has released Lambda Micro Co Ltd and Samsung Electronics patent application for Heat Treatment Apparatus for Heating Wafers. This invention was developed by Park Kitae, An Hyoju, Baek Seungmin and Kim Dongyul.
The patent application number is US202519384623 20251110. The..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has released Suzhou Dexin Chip Tech Co Ltd patent application for MEMS Device and Manufacturing Method Thereof. This invention was developed by Jiang Zhengyong.
The patent application number is CN202511604406 20251104. The patent publication number is CN121609292..
Semiconductor
| Sun 14 Jun 2026
Beijing, June 15 -- Beijing Jingge Lingyu Semiconductor Co Ltd has submitted a patent application for Device and Method for Dynamically Adjusting Axial Temperature Gradient in Crystal Growth Process. This invention was developed by Zhang Zesheng, Zhang Guangyu and Wang Guobin.
The patent application number is CN202610131078 2..
Semiconductor
| Sun 14 Jun 2026
Beijing, June 15 -- Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd has submitted a patent application for Crystal Pulling Method for Improving In-plane Vf Value Uniformity of 111 Crystal Orientation Device. This invention was developed by Cao Qigang, Zhang Youhai, Liu Jie, Liu Yanpeng, Yang Kai, Rui Yang and Wang Liguang.
..
Semiconductor
| Sun 14 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has released Jiangsu Tianke Heda Semiconductor and Beijing Tankeblue Semiconductor patent application for Silicon Carbide Single Crystal and Preparation Method Thereof. This invention was developed by Peng Tonghua, Yang Jian, Meng Lingqiang, Lou Yanfang, Liu Kun, Li..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- Trapani Possignolo Rafael, Swarup Anurakti, Queiros Alves Ricardo Daniel, Groen Ankur and Zajo Joju Joseph have submitted a patent application for Method and Apparatus for Unified Memory Speculation Prediction.
The patent application number is US202418972638 20241206. The patent publication number is ..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- Electronics and Telecommunications Research Inst has submitted a patent application for Memory Control Method and Apparatus for Achieving Petaflops Performance of Artificial Neural Network Accelerator. This invention was developed by Cho Yong-cheol, Kim Ju-yeob, Han Jin-ho, Choi Jae-woong, Kim Jin-kyu and ..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- Alipay Hangzhou Digital Service Tech Co Ltd has submitted a patent application for Memory Management Method and Apparatus for Inference System. This invention was developed by Ding Zhiqiang, Du Jun and Yang Tongkai.
The patent application number is US202519405429 20251202. The patent publication number ..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- Suzhou Jiwei Photoelectric Co Ltd has filed a patent application for Sensing Chip and Detection Method Thereof. This invention was developed by Shen Chenyan and Cao Limin.
The patent application number is CN202511758830 20251127. The patent publication number is CN121610361 (A). International Patent Classi..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has released Guangzhou Baiyun Tech Co Ltd and Guangdong Baiyun Tech Co Ltd patent application for Addition Type Organic Silicon Pouring Sealant with Low Viscosity and High Fluidity and Preparation Method Thereof. This invention was developed by Liu Jun, Liu Xuqi, Xi..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has published Jiangsu Shanshui Semiconductor Mat Co Ltd patent application for Wafer Polishing Solution Containing Graphene Nanosheets and Preparation Process of Wafer Polishing Solution. The invention was developed by Wang Chenwei, Li Shiquan, Lei Shuangshuang, Li ..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- Anst Tech Shenzhen Co Ltd has submitted a patent application for Chemical Mechanical Polishing Composition for Polishing Monocrystalline Silicon Substrate and Polishing Method. Xie Linfeng, Yu Jianchao, Hong Danyan, Jia Renhe, Yang Fan and Luo Xin developed the invention.
The patent application number is C..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has released Anst Tech Shenzhen Co Ltd patent application for Chemical Mechanical Polishing Composition for Polishing Silicon Oxide Substrate and Polishing Method Thereof. This invention was developed by Tan Che, Yang Yiwen, Zhu Siyuan, Jia Renhe and Koo Ja Ho.
T..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- Anst Tech Shenzhen Co Ltd has submitted a patent application for Chemical Mechanical Polishing Composition for Polishing Silicon Carbide Substrate and Polishing Method Thereof. This invention was developed by Tan Che, Zhu Siyuan, Yang Jiyuan and Jia Renhe.
The patent application number is CN202510869143 20..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- Anst Tech Shenzhen Co Ltd has filed a patent application for Chemical Mechanical Polishing Composition for Polishing Silicon Oxide Substrate and Polishing Method Thereof. This invention was developed by Yang Yiwen, Zhu Siyuan, Yeribona Nagendra Prasad, Jia Renhe and Koo Ja Ho.
The patent application number..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- Anst Tech Shenzhen Co Ltd has applied Chinese patent for Chemical Mechanical Polishing Composition for Polishing Silicon Carbide Substrate and Polishing Method Thereof. Yang Yiwen, Peng Luxi, Hong Danyan, Jia Renhe and Koo Ja Ho developed it.
The patent application number is CN202411982942 20241231. The pa..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has released Goode Eis Suzhou Corp Ltd patent application for Two-component Solvent-free Organic Silicon Resin Insulating Paint as Well as Preparation Method, Use Method and Application Thereof. This invention was developed by Jin Zhenghao, Luo Xiaofeng and Niu Yong..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- Wuxi Dongfeng Zhanrui Tech Co Ltd has sought patent for Wafer Carrying Friction Pad and Surface Treatment Method. This invention was developed by Yin Rundong and Fang Min.
The patent application number is CN202511534923 20251027. The patent publication number is CN121610077 (A). International Patent Classi..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- Guangxi Normal University for Nationalities has filed a patent application for Near-infrared Light-emitting Ru (II) Complex as Well as Preparation Method and Application Thereof. This invention was developed by Dai Yongcheng, Zhang Wuni, Wang Yusheng, Yang Wei and Wei Yamei.
The patent application number i..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has received Shandong Jingyi New Mat Co Ltd patent application for Boron Nitride Nanotube Compounded Boron Nitride Ceramic Substrate and Preparation Method Thereof. Cui Zhiwei, Hou Guangsheng, Li Wei, Li Pan and Huang Xiaohong developed the invention.
The patent ..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has published Henan Xinyu New Material Tech Co Ltd patent application for High-transparency Aluminum Oxide Ceramic Plate for Semiconductor Packaging and Preparation Method of High-transparency Aluminum Oxide Ceramic Plate. The invention was developed by Gao Jialin, ..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has published Haian Zhongke Intelligent Manufacturing and Information Perception Application Res and Development C patent application for Solar Distilled Water Follow-up Control System Based on Single Chip Microcomputer. The invention was developed by Li Yihan and L..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has received Hangzhou Haiqian Semiconductor Co Ltd patent application for Hoisting Tool Suitable for Silicon Carbide Wafer and Silicon Carbide Epitaxial Wafer. Zhang Xiaohong developed the invention.
The patent application number is CN202511123475 20250812. The p..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- Dingzhou Tech Co Ltd has applied Chinese patent for Support Device and Substrate Container. Chen Yanfang developed it.
The patent application number is CN202411300073 20240918. The patent publication number is CN121608973 (A). International Patent Classification codes are B65D25/02, B65D25/10, B65D85/48 an..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has received Shenzhen Huigao Material Tech Co Ltd patent application for Bagging Equipment for Semiconductor Wafer Box. Zhang Shengheng, Cao Taotao, Deng Wei and Deng Xuhui developed the invention.
The patent application number is CN202511879615 20251212. The pat..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Pan Yang and Inspiring Atoms Pte Ltd have applied United States patent for System and Method for Precisely Controlling Zonal Temperatures of Electrostatic Chucks. Pan Yang developed it.
The patent application number is US202418972861 20241207. The patent publication number is US20260165083 (A1).
The..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Inergy Tech Inc has applied United States patent for Chip Package Structure. Wen Nan-wei and Lin Li-zheng developed it.
The patent application number is US202519260287 20250704. The patent publication number is US20260165153 (A1).
The abstract of the patent published by the U.S. Patent and Trademark..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Alchip Tech Limited has applied United States patent for Integrated Circuit (IC) Structure and Floorplan Thereof. Ho Kai-ting and Lin Wen-hsi developed it.
The patent application number is US202519377087 20251103. The patent publication number is US20260165208 (A1).
The abstract of the patent publis..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Alchip Tech Limited has applied United States patent for Integrated Circuit (IC) Structure and Floorplan Thereof. Ho Kai-ting, Lin Wen-hsi and Shaizaf Erez developed it.
The patent application number is US202519377099 20251103. The patent publication number is US20260165214 (A1). International Patent Cl..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Silicon Magic Semiconductor Tech Hangzhou Co Ltd has submitted a patent application for Semiconductor Device with Transistor Cell Units. Wang Baozhu and Wang Jiakun developed the invention.
The patent application number is US202519284704 20250730. The patent publication number is US20260164705 (A1). Int..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Silicon Magic Semiconductor Tech Hangzhou Co Ltd has submitted a patent application for Semiconductor Device with Unit Transistor Cells. This invention was developed by Wang Baozhu and Wang Jiakun.
The patent application number is US202519361047 20251017. The patent publication number is US20260164706 (..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Champ Asia Semiconductor Corp has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Chung Jui-lun and Ye Tzuen-yang.
The patent application number is US202519213453 20250520. The patent publication number is US20260164747 (A1). I..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Massachusetts Inst Of Technology has submitted a patent application for Transistor Structure and Methods of Forming the Same. This invention was developed by Niroula John Prakash, Palacios Tomás A, Micale Gillian, Shih Pao-chuan and Xie Qingyun.
The patent application number is US202418971944 20241206...
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- Realtek Semiconductor Corporation has submitted a patent application for Communication Apparatus and Method Having Frequency Tracking Mechanism. This invention was developed by Wang Feng-xiang.
The patent application number is US202519367114 20251023. The patent publication number is US20260163772 (A1). I..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has released NVIDIA patent application for Using Signal-to-noise Ratio to Select a Neural Network. This invention was developed by Roe Michael and Janeiro Horta De Morais Joao Alberto.
The patent application number is US202418975439 20241210. The patent publication number ..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- Mediatek has submitted a patent application for Power Management System, Method for Transmitting Data in a Power Management System, and Integrated Circuit. This invention was developed by Chien Hung-sheng and Guo Hui.
The patent application number is US202418971302 20241206. The patent publication number ..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- NVIDIA has filed a patent application for Facilitating Efficient Management of Live Meetings. This invention was developed by Kumar Prasun, Sharma Priyanshu, Mishra Shivi, Kulkarni Amey, Pandey Mayank and Rao Harshraj.
The patent application number is US202418974376 20241209. The patent publication number..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- The Trustees of the University of Pennsylvania has sought patent for Advanced Placenta on a Chip. This invention was developed by Younesi Mousa, Huh Dongeun and Fattahi Pouria.
The patent application number is US202519347379 20251001. The patent publication number is US20260159794 (A1). International Pate..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has published Samsung Electronics patent application for Chip and Method for Chip Authentication. The invention was developed by Wang Peng.
The patent application number is US202519009293 20250103. The patent publication number is US20260163744 (A1). International Patent C..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has published UIF University Industry Foundation, Yonsei University patent application for Transmitter and Receiver Adopting Correlated Signaling for Compensating for Inter-channel Mismatch and Integrated Circuit Including the Same. The invention was developed by Park Kwans..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has published Samsung Electronics patent application for Method of Simulating and Verifying Full-chip Layout. The invention was developed by Jeon Joohyun, Yeom Kyungmi, Kim Sungjin, Schmidt Alexander, Yoo Geunsang, Nishizawa Yutaka, Lee Seungmin, Ahn Chihak and Payet Anthon..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Integrated Circuit Structure. Lu Lee-chung, Zhuang Hui-zhong, Tien Li-chun, Chen Shun Li and Chiang Ting-wei developed it.
The patent application number is US202519179876 20250415. The patent publication number is US202601618..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has received OPENEDGES Technology patent application for Method for Transmitting and Receiving Data Between Chiplets Having Different AXI Parameters and Semiconductor Package Thereof. Kim Hyungyu and Lee Jaekwang developed the invention.
The patent application number is ..
Semiconductor
| Sun 14 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has received Renesas Design Austria patent application for Scan Mode for an Asynchron Counter. Pieber Michael developed the invention.
The patent application number is US202418969697 20241205. The patent publication number is US20260161873 (A1). International Patent Clas..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has received Jiangsu University of Science and Technology and China Machinery General Institute Group Ningbo Intelligent Machine Tool Research Inst Co Ltd patent application for Modularized 3D Printing Substrate Heating and Cooling Integrated Device and Using Method..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- Fujian Zhongwei Semiconductor Materials has submitted a patent application for Preparation Process of High-purity Zinc Powder. This invention was developed by Chen Huiling and Wang Zhongbing.
The patent application number is CN202610147038 20260202. The patent publication number is CN121607639 (A). Interna..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- State Intellectual Property Office of China has received Anhui Institute Of Information Technology patent application for E-shaped Silicon Steel Sheet Stamping Die. Zhan Shuhui and Shiba Tomoaki developed the invention.
The patent application number is CN202511799448 20251202. The patent publication number..
Semiconductor
| Mon 15 Jun 2026
Beijing, June 15 -- Suzhou Huicong Electromechanical Co Ltd has applied Chinese patent for Efficient Cleaning Device for Semiconductor Parts. Wang Zhongcheng, Han Shouhao and Liu Weizhen developed it.
The patent application number is CN202511658058 20251113. The patent publication number is CN121607368 (A). International Pate..
Semiconductor
| Sat 13 Jun 2026
Taipei, June 13 -- Lite On Microelectronic Wuxi Co Ltd and Shanghai Seefull Electronic Co Ltd have submitted a patent application for Plastic Packaging Mold and Plastic Packaging Method, Pressing Device and Device for Semiconductor Device. This invention was developed by Cheng Gen-bao, Xu Ai-ping and He Liu-hong.
The patent a..
Semiconductor
| Sat 13 Jun 2026
Taipei, June 13 -- Hwatsing Technology Co Ltd and Hwatsing Beijing Technology Co Ltd have submitted a patent application for Wafer Processing System, Wafer Processing Device, and Wafer Thinning Equipment. Chen Chao, Fu Yong-xu, Jin Kai-qiang and Zhao De-wen developed the invention.
The patent application number is TW202401170..
Semiconductor
| Sat 13 Jun 2026
Taipei, June 13 -- Japan Display Inc and Idemitsu Kosan have submitted a patent application for Oxide Semiconductor Film, Thin-film Transistor, and Electronic Device. This invention was developed by Watakabe Hajime, Tsubuku Masashi, Sasaki Toshinari, Tamaru Takaya, Mochizuki Marina, Onodera Ryo, Watabe Masahiro, Kawashima Emi, T..
Semiconductor
| Sat 13 Jun 2026
Taipei, June 13 -- Shinetsu Chemical Co and Kochi Prefectural Public Univ Corporation have submitted a patent application for Laminate, Semiconductor Device Using the Same, and Method for Manufacturing Laminate. Yasuoka Tatsuya, Hashigami Hiroshi, Kawaharamura Toshiyuki, Watabe Takenori, Sakatsume Takahiro, Liu Li, Susami Hiromu..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- NVIDIA has filed a patent application for Application Programming Interface to Cause Measurement of Processor Activity. This invention was developed by Oza Rucha, Guo Huizhen, Stolle Brent, Wightman Douglas, Narayanaswamy Sreedhar, Van De Groenendaal Joannes and Patel Pratikkumar Dilipkumar.
The patent ap..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has received The Florida International University Board Of Trustees and Applied Materials patent application for Highly-effective Ultrathin Sputter Able and Tamper-resistant Shields with Metal-refractory Alloy Stacks. Pulugurtha Markondeyaraj, Pial Mohammad Mohtasim Hamid, ..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has received Winbond Electronics patent application for Reference Current Generating Circuit and Semiconductor Device and Control Method Thereof. Ma Ying-ting developed the invention.
The patent application number is US202519404492 20251201. The patent publication number i..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has received JCET STATS ChipPAC, Korea patent application for Method and Apparatus for Reducing Warpage in Semiconductor Element, and Method for Forming Semiconductor Package. Yun Yeojun, Lee Heesoo and Lee Minsung developed the invention.
The patent application number is ..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has released Samsung Electronics patent application for Semiconductor Package and Method for Manufacturing the Same. This invention was developed by Jeong Sanghyeon.
The patent application number is US202519238976 20250616. The patent publication number is US20260165139 ..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Micron Technology has submitted a patent application for Substrate Having Integrated Stress Relief Structure. Christianson David R, Lowry Kimball Davis, Bitz Bradley Russell and Chaves Joao Elmiro developed the invention.
The patent application number is US202519179126 20250415. The patent publication num..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Taiwan Semiconductor Manufacturing Co Limited has submitted a patent application for Ring Structure for Interconnect Structures and Methods of Forming the Same. Hsieh Ping-yin, Shih Ying-ching and Wu Chih-wei developed the invention.
The patent application number is US202418969666 20241205. The patent p..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing patent application for Semiconductor Package and Method Forming the Same. The invention was developed by Lii Mirng-ji, Yan Kathy Wei, Wu Hung-chi, Hsu Chien Hao and Chang Kuo-chin.
The patent application number is US20241896..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has released Samsung Electronics patent application for Semiconductor Device and Method of Fabricating the Same. This invention was developed by Chung Hyunsoo.
The patent application number is US202519256789 20250701. The patent publication number is US20260165132 (A1). ..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Semiconductor Components Industries has submitted a patent application for Heat Disspation Device Having Dual-coupled Fin. Jeon Hyungil, Baek Jonghwan, Ma Sangyun, Paul Roveendra and Ryu Jinseok developed the invention.
The patent application number is US202519402554 20251126. The patent publication numbe..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Semiconductor Components Industries has applied United States patent for Immersion Cooling of Embedded Electronic Components. Im Seungwon developed it.
The patent application number is US202418976184 20241210. The patent publication number is US20260165129 (A1). Cooperative Patent Classification codes are..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has published Samsung Electronics patent application for Semiconductor Package and Method for Manufacturing the Same. The invention was developed by Park Dongwoon.
The patent application number is US202519182079 20250417. The patent publication number is US20260165125 (A..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Samsung Electronics has submitted a patent application for Semiconductor Package and Method of Manufacturing the Same. Park Kitae, Baek Seungmin, Lee Gunhyuck and Song Yong Jae developed the invention.
The patent application number is US202519369481 20251027. The patent publication number is US202601651..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Realtek Semiconductor Corporation has submitted a patent application for High Thermal Conductive and Electromagnetic Interference Shielding Electronic Package Structure and Method for Manufacturing the Same. This invention was developed by Su Chih-yen.
The patent application number is US202519272235 20250..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has published International Business Machines patent application for Stacked Fets with Thermoelectric Cooling. The invention was developed by Xie Ruilong, Chen Qianwen, Kim Wukang, Li Tao and Rubin Joshua Mark.
The patent application number is US202418971718 20241206. Th..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has published Renesas Electronics patent application for Semiconductor Device. The invention was developed by Suzumura Naohito and Tsuchiya Hideaki.
The patent application number is US202519371022 20251028. The patent publication number is US20260165117 (A1).
The abs..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- GlobalFoundries has sought patent for Electrical Fuse Having Fuse Link Along Sidewall(s) of Inactive Gate Structure. This invention was developed by Gebreselasie Ephrem, Mccallum-cook Ian A and Cucci Brett T.
The patent application number is US202418968344 20241204. The patent publication number is US2026..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Infineon Technologies has filed a patent application for Semiconductor Die and Method of Manufacturing the Same. This invention was developed by Peters Dethard, Söllradl Thomas, Ganner Thomas, Hilsenbeck Jochen, Ross Philipp, Schraml Konrad and Wassermann Tobias.
The patent application number is US202519..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has received International Business Machines patent application for Interconnect Structure with Airgap and Etch Stop Layer. Lanzillo Nicholas Anthony, Park Chanro, Mignot Yann and Motoyama Koichi developed the invention.
The patent application number is US202418969411 20..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- KIOXIA has sought patent for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Ikeno Daisuke and Ikeda Mitsuo.
The patent application number is US202519287005 20250731. The patent publication number is US20260165113 (A1). International Patent Classification codes..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has received Infineon Technologies, Austria patent application for Semiconductor Device Metallization Contact Structure and Method. Goller Klaus, Vorwerk Manuel, Pandya Bhargav and Augustin Markus developed the invention.
The patent application number is US202519414880 202..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Micron Technology has filed a patent application for Multi-layer Pad Structure for a Semiconductor Device. This invention was developed by Borsari Silvia, Benson Russell A, Nair Vinay, Lee Che-chi, Sahu Protyush and Sugiura Soichi.
The patent application number is US202519183261 20250418. The patent publi..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Conductive Structure Interconnects. Liang Shuen-shin, Yang Shin-yi, Chang Po-chin, Cheng Yuting, Liao Chun-hung, Chien Harry, Lin Pinyen, Chen Tzu Pei, Chu Chia-hung, Huang Hung-yi, Chang Chia-hao and Wang Sung-li developed it.
..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Win Semiconductors has sought patent for Semiconductor Structure and Method for Forming the Same. This invention was developed by Hua Chang-hwang, Yang Chia-jun and Liang Yao-ren.
The patent application number is US202418975639 20241210. The patent publication number is US20260165107 (A1). International..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has received Samsung Electronics patent application for Semiconductor Chip and Semiconductor Stack Structure Including the Same. Lee Wonil, Kim Jihoon, Kim Yiyoung and Kang Raeyoung developed the invention.
The patent application number is US202519409080 20251204. The pate..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Selectively Enlarging a Via Through a Directional Ion Beam Process. Huang Po-hsiang, Wu Cai-ling, Lin Wan-yi, Chen Yu-hsiang, Chien Wei-ting and Hsueh Hsiu-wen developed the invention.
The patent application number is US202..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has published Tokyo Electron patent application for Method for Self-aligned Via Formation in a Semiconductor Device. The invention was developed by Aizawa Hirokazu and Trickett Ying.
The patent application number is US202418929144 20241028. The patent publication number is..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has received Applied Materials patent application for Plasma Treatment Processes for Microelectronic Device Manufacture. Kashefi Kevin, Ju Zheng, Zhou Ruinan, Cen Jiajie and Yang Hsienlung developed the invention.
The patent application number is US202418969948 20241205. T..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufactring Co Ltd and Taiwan Semiconductor Manufacturing patent application for Isolation Structure for Metal Interconnect. This invention was developed by Chuang Cheng-chi, Huang Lin-yu, Lin Yu-ming, Wang Chih-hao, Yu Li-zhen and Chang C..
Semiconductor
| Mon 15 Jun 2026
Alexandria, June 15 -- Infineon Technologies has submitted a patent application for Semiconductor Die and Method of Manufacturing the Same. This invention was developed by Peters Dethard, Söllradl Thomas, Ganner Thomas, Korzenietz Andreas, Hilsenbeck Jochen, Ross Philipp, Schraml Konrad, Wassermann Tobias and Salmen Paul.
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