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Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Dynex Semiconductor Ltd and Zhuzhou CRRC Times Semiconductor have been granted a patent for Semiconductor Device. This invention was developed by Simpson Robin Adam and Wang Yangang.
The patent application number is US202118010570 20210719. The patent publication number is US12550782 (B2). Cooperative P..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- Wu Yuhui has sought patent for Semiconductor Precision Part Processing Jig.
The patent application number is CN202510821227 20250619. The patent publication number is CN120533499 (A). International Patent Classification codes are B23Q11/00, B23Q3/00 and B23Q7/00. Cooperative Patent Classification codes a..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- The Chinese Univ Of Hongkong Shenzhen has been granted a patent for Chip Embedded Composite for Electron Beam Lithography, Preparation Method and Application Thereof. Zhang Zhaoyu, Huang Yaoran, Liu Gexing and Li Haochuan developed the invention.
The patent application number is US202218002573 20220118...
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- United States Patent for Semiconductor Device Comprising a Heat Dissipation Plate Including a Thick Portion and a Thin Portion has been issued to Mitsubishi Electric. This invention was developed by Tsunoda Tetsujiro.
The patent application number is US202018040931 20201021. The patent publication numbe..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Sharp has been awarded a patent for Method for Producing Light-emitting Element, and Light-emitting Element. This invention was developed by Adachi Takahiro and Sakuma Jun.
The patent application number is US202018037476 20201203. The patent publication number is US12550600 (B2). International Patent Cl..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- State Intellectual Property Office of China has published Chen Long patent application for Chip Surface Cleaning Device. The invention was developed by Chen Long.
The patent application number is CN202510855552 20250625. The patent publication number is CN120532789 (A). International Patent Classification ..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Yangtze Memory Technologies has been awarded a patent for Memory Devices and Operating Methods Thereof, and Memory Systems. This invention was developed by Dong Zhipeng, Zhou Xufeng and Li Jianjie.
The patent application number is US202418631424 20240410. The patent publication number is US12548627 (B2)..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- United States Patent for Semiconductor Structure and Manufacturing Method Therefor, and Memory has been issued to ChangXin Memory Technologies. This invention was developed by Zhang Shuhao and Li Ning.
The patent application number is US202318451077 20230816. The patent publication number is US12548618 ..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- U.S. Patent and Trademark Office has awarded a patent to Samsung Electronics Co Ltd and Nanyang Technological University for Receiver, Operation Method Thereof, and Memory Device. Kim Jueon, Kim Taehyoung, Yoon Donghyun, Kwak Myoungbo, Park Jaewoo, Choi Youngdon and Choi Junghwan developed the invention.
..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- United States Patent for Semiconductor Storage Device Comprising a Replica Bit Line Circuit has been issued to Socionext. This invention was developed by Moriwaki Shinichi.
The patent application number is US202418594877 20240304. The patent publication number is US12548603 (B2). International Patent Cl..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Hitachi has applied Chinese patent for Semiconductor Device and Manufacturing Method Thereof. Matsushima Hiroyuki and Shimizu Yuka developed it.
The patent application number is CN20238090863 20231130. The patent publication number is CN120530493 (A). International Patent Classification codes are H01L23/48..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Mycros Tech Inc has submitted a patent application for Heat Exchanger for High Performance Chipset. This invention was developed by Mathe Drew M, Mcgowan Jesse D, Sullivan Joseph T and Valenzuela Javier A.
The patent application number is CN20248007839 20240123. The patent publication number is CN120530490..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- State Intellectual Property Office of China has received Opnovex Corp patent application for Variable Composition Ternary Compound Semiconductor Alloys, Structures and Devices. Krams Michael R developed the invention.
The patent application number is CN20238089478 20231229. The patent publication number is..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- United States Patent for Display Substrate and Display Device has been issued to Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group. This invention was developed by Chen Jiaxing, Zhang Yi, Shang Tinghua, Xu Qian, Liu Biao, Niu Zuoji, Huang Yan, Chu Yuge and Long Yixuan.
The patent applicat..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Aichuangda Identity Smart Card Co Ltd has filed a patent application for Method of Forming Integrated Circuit (IC) Card with Visual Display. This invention was developed by Wu Xiaoxing and Deng Lan.
The patent application number is CN20248007262 20240321. The patent publication number is CN120530397 (A). I..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Zhongshan Xincheng Semiconductor Co Ltd has submitted a patent application for Processing Method of High-heat-dissipation Substrate and Packaging Structure of High-heat-dissipation Substrate. This invention was developed by Xu Qiang, Gu Xin and Huang Xiaodong.
The patent application number is CN20251059471..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- State Intellectual Property Office of China has released Xinai Tech Nanjing Co Ltd patent application for Improved Manufacturing Method of Composite Cored Substrate with Embedded Circuit. This invention was developed by Chao Yu-ang, Yin Jia, Lin Songkun and Chen Minyao.
The patent application number is CN2..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- State Intellectual Property Office of China has published Wuhan Xinxin Semiconductor patent application for Semiconductor Device and Manufacturing Method Thereof. The invention was developed by Xu Ruizhang, Zhu Kui, Chang Bingyan, Feng Yuanhao, Zhu Xinyue, Pan Dong, Liu Nian and Wang Qiong.
The patent appl..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- Wuxi Delixin Semiconductor Tech Co Ltd has filed a patent application for Packaging Equipment and Packaging Method of Fast Recovery Diode. This invention was developed by Huang Changmin, Zhang Zhiqi, Gu Yuesheng and Huang Guorong.
The patent application number is CN202510682530 20250523. The patent publica..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- Yangtze Memory Technologies has sought patent for Memory Device, Memory System, Memory Controller and Operating Method. This invention was developed by Tang Xingwei and Ye Guangchang.
The patent application number is CN202410190026 20240220. The patent publication number is CN120526824 (A). International P..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- Institute of Semiconductors, Chinese Academy of Sciences has applied Chinese patent for Speech Enhancement Method and Device Based on Lightweight Speech Enhancement Model. Tan Kaijun, Mao Wenyu, Li Jixing, Bian Yi and Lu Huaxiang developed it.
The patent application number is CN202410190165 20240220. The p..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- United States Patent for Display Apparatus has been issued to Samsung Display. This invention was developed by Jeong Jaewoo, Lee Juhyun, So Byungsoo and Kang Taewook.
The patent application number is US202217958518 20221003. The patent publication number is US12550544 (B2). International Patent Classifi..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Enkris Semiconductor Wuxi Ltd has received a patent for LED Structure with Stress Releasing Layers Comprising Periodic Structures. This invention was developed by Liu Weihua, Sun Xiaobo and Cheng Kai.
The patent application number is US202318304292 20230420. The patent publication number is US12550484 (..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Toshiba and Toshiba Electronic Devices & Storage have been granted a patent for Semiconductor Device. Itokazu Hiroko, Matsudai Tomoko, Iwakaji Yoko, Kawamura Keiko and Fuse Kaori developed the invention.
The patent application number is US202217901668 20220901. The patent publication number is US1255041..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- United States Patent for Semiconductor Structure and Method for Fabricating Same has been issued to ChangXin Memory Technologies. This invention was developed by Liu Yang.
The patent application number is US202318151458 20230108. The patent publication number is US12550415 (B2). International Patent Cla..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- U.S. Patent and Trademark Office has awarded a patent to Toshiba and Toshiba Electronic Devices & Storage for Semiconductor Device. Yasuzumi Takenori and Hung Hung developed the invention.
The patent application number is US202318180657 20230308. The patent publication number is US12550405 (B2). Interna..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Suzhou Ruijiewei Tech Group Co Ltd has filed a patent application for Chip Anti-damage Packaging Equipment. This invention was developed by Fang Jia'en, Zhang Zilong, Li Ming, Shi Chaoyang, Guan Junyan and Wang Longping.
The patent application number is CN20251147162 20250729. The patent publication number..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Shenzhen Liangxuan Tech Co Ltd has filed a patent application for Packaging Method and Packaging Structure of Superconducting Quantum Chip. This invention was developed by Hu Jinyao and Meng Tiejun.
The patent application number is CN202510856055 20250624. The patent publication number is CN120529822 (A). ..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Jinko Solar; Jinko Energy Haining has submitted a patent application for Perovskite Solar Cell and Preparation Method Thereof, Laminated Solar Cell and Photovoltaic Module. This invention was developed by Yu Yong, Yan Xunlei, Zhang Xinyu, Xu Menglei, Yang Jie, Xu Ying and Zou Qin.
The patent application nu..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Jiangxi Dinghua Xintai Tech Co Ltd has submitted a patent application for Packaging Method and Packaging Structure of Miniaturized Semiconductor Device. This invention was developed by He Zhongliang, Zhao Biao, Liu Qingdong, Rao Zhenggang and Wang Zhiguo.
The patent application number is CN202510659909 202..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Taiwan Semiconductor Co Ltd has submitted a patent application for Semiconductor Element. Zheng Yuling and Hsieh Boren developed the invention.
The patent application number is CN202410425067 20240410. The patent publication number is CN120529712 (A). International Patent Classification codes are H10H20/81..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Shenzhen Xunguang Technology has applied Chinese patent for Manufacturing Method of Light-emitting Device and Light-emitting Device Thereof. Yang Daoqun, Huang Wei, Cao Yuxing and Li Xiangyang developed it.
The patent application number is CN202411550878 20241101. The patent publication number is CN1205297..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- United States Patent for Array Substrate and Manufacturing Method Thereof, and Touch Display Device has been issued to Beijing BOE Display Tech Co Ltd and BOE Technology Group. This invention was developed by Su Qiujie, Zhao Chongyang, Liao Yanping, Sun Zhihua and Lee Seungmin.
The patent application nu..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- State Intellectual Property Office of China has released Elite Semiconductor Memory Tech Inc patent application for Audio Signal Processing Circuit with Stroke Estimation Compensation, Method and Storage Medium. This invention was developed by Qiu Xinyuan, Lin Congfu and Yu Wenlong.
The patent application ..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Southeast Univ and CSMC Technologies Fab2 have obtained a patent for igzo thin-film transistor and method for manufacturing same. This invention was developed by Wu Wangran, Yang Guangan, Lin Feng, Sun Guipeng, Wang Yaohui, Sun Weifeng and Shi Longxing.
The patent application number is US202017767333 20..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Semiconductor Mfg International Beijing Corporation and Semiconductor Manufacturing International Shanghai has been awarded a patent for Semiconductor Structure and Method for Forming Same. This invention was developed by Wang Ye.
The patent application number is US202318219227 20230707. The patent publ..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- U.S. Patent and Trademark Office has awarded a patent to Toshiba and Toshiba Electronic Devices & Storage for Semiconductor Device. Hatada Hiroki developed the invention.
The patent application number is US202318234344 20230815. The patent publication number is US12550349 (B2). International Patent Clas..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- KIOXIA has been awarded a patent for Semiconductor Device. This invention was developed by Shiokawa Taro, Maeda Takeru, Noda Kotaro and Fujii Shosuke.
The patent application number is US202318179620 20230307. The patent publication number is US12550314 (B2). International Patent Classification code is H..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Geke Semiconductor Shanghai Co Ltd has applied Chinese patent for Formation Method of Semiconductor Device. Huang Meng and Tao Yang developed it.
The patent application number is CN202410186064 20240219. The patent publication number is CN120529668 (A). International Patent Classification code is H10F39/18..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Ningbo Jinshengxin Image Tech Co Ltd has sought patent for Improved Chip Packaging Body and Chip Packaging Method. This invention was developed by Gou Pengfei and Long Xiangli.
The patent application number is CN202510908254 20250702. The patent publication number is CN120529663 (A). International Patent C..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Hangzhou Fuxin Semiconductor has applied Chinese patent for Semiconductor Structure and Preparation Method Thereof. Sun Yanan, Cui Weigang and Shi Liang developed it.
The patent application number is CN20251110491 20250722. The patent publication number is CN120529632 (A). International Patent Classificati..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Xinmai Semiconductor Tech Hangzhou Co Ltd has applied Chinese patent for Semiconductor Device Cell and Semiconductor Device. Wang Baozhu developed it.
The patent application number is CN202510644841 20250519. The patent publication number is CN120529617 (A). International Patent Classification codes are H1..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- State Intellectual Property Office of China has published Shenzhen Changjing Microelectronics Co Ltd patent application for Asymmetric Semiconductor Discharge Tube Chip and Manufacturing Method Thereof. The invention was developed by Zhou Xiongbiao, Liu Zonghe, Wu Peidong, Guo Jiaqiu, Zhou Zimin, Yu Qiang, Li..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- U.S. Patent and Trademark Office has awarded a patent to Onnivation LLC for Virtual Memory Paging System and Translation Lookaside Buffer with Pagelets. Yadavalli Sitaram developed the invention.
The patent application number is US202318692192 20230605. The patent publication number is US12547549 (B2). ..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- State Intellectual Property Office of China has released Shenzhen Hi Test Semiconductor Equip Co Ltd patent application for Bulk Material Supply Equipment of Chip Mounter. This invention was developed by Liu Jun, Ye Min, Song Yongchao, Yu Qin, Huang Xinqing, Xiong Xiong and Dai Junhao.
The patent applicati..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- United States Patent for Memory System and Method of Controlling Nonvolatile Memory has been issued to KIOXIA. This invention was developed by Kanno Shinichi.
The patent application number is US202418795962 20240806. The patent publication number is US12547538 (B2). International Patent Classification c..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Xinsiyuan Microelectronics Co Ltd has sought patent for ECDSA Digital Signature and Signature Verification System and Method Suitable for Security Chip. This invention was developed by Zhang Yikang, Wu Nengju, Yin Hao, Zhang Hui, Ye Fei, Zhang Xinyu, Zou Siyuan and Gao Tingting.
The patent application numb..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Shenzhen Raysees AI Tech Co Ltd has been granted a patent for VCSEL Array with Non-isolated Emitters. Kang Dongseok, He Yongxiang, Lanka Siva Kumar and Wang Yang developed the invention.
The patent application number is US202017766315 20200224. The patent publication number is US12548979 (B2). Internati..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- State Intellectual Property Office of China has released Shindengen Electric Manufacturing patent application for Semiconductor Device. This invention was developed by Hashimoto Masaki and Suemoto Ryuji.
The patent application number is CN20238086174 20230118. The patent publication number is CN120530730 (..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Lmpg Inc has received a patent for Narrow Aperture Luminaires and Light Guides Therefor. This invention was developed by Santoro Scott and Wong Kenton Keng Ting.
The patent application number is US202418433408 20240206. The patent publication number is US12546930 (B2). International Patent Classificatio..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- Chuanzhou Semiconductor Tech Shanghai Co Ltd has sought patent for Strong-robustness Encoder System Based on Inductive Encoder Chip. This invention was developed by Chen Zhelin, Li Menglong and Zhang Yirong.
The patent application number is CN202510907159 20250702. The patent publication number is CN120528..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- United States Patent for Closed Loop Cooling Water Corrosion Inhibition Employing Polymaleates and Non-borate Buffers has been issued to Ecolab USA. This invention was developed by Chen Bingzhi, Weberski Jr Michael Patrick and Yin Zhangzhang.
The patent application number is US202117308719 20210505. The..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Powers Innovation LLC has received a patent for System, Method and Apparatus for Switchable Sound-making Device. This invention was developed by Powers Philip and Heidmous Mathew.
The patent application number is US202117502641 20211015. The patent publication number is US12545350 (B2). International Pa..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Cirrus Logic Int Semiconductor Ltd and Cirrus Logic Inc have obtained a patent for circuitry for and methods of gain control. This invention was developed by Howlett Andrew J, Chandler-page Michael, Singleton David P and Zwyssig Erich P.
The patent application number is US202217982864 20221108. The pate..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- United States Patent for Positioning System, a Lithographic Apparatus, a Driving Force Attenuation Method, and a Device Manufacturing Method has been issued to ASML Netherlands BV and Carl Zeiss SMT. This invention was developed by Kimman Maarten Hartger, Butler Hans, Bernardus Vermeulen Johannes Petrus M..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Sichuan Heweisaide Electronic Tech Co Ltd has sought patent for Driving Circuit for Inhibiting Silicon Carbide MOSFET Bridge Arm Crosstalk. This invention was developed by Bi Chuang.
The patent application number is CN202510467974 20250415. The patent publication number is CN120528414 (A). International Pa..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- State Intellectual Property Office of China has published Suzhou Sicui New Energy Photoelectric Tech Research Institute Co Ltd, Suzhou Xinzhi Testing Tech Co Ltd and Soochow University patent application for Perovskite Solar Cell Nonlinear Aging Acceleration Test System and Method. The invention was developed..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- State Intellectual Property Office of China has published Taizhou Zhong Lai Photoelectric Technology and Shanxi Zhonglai Solar Energy Battery Tech Co Ltd patent application for Non-contact Testing Method and Sorting Method for Open-circuit Voltage of Solar Cell. The invention was developed by Zhang Geng, Guo ..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- Shanghai Eswin Computing Tech Co Ltd and Beijing ESWIN Computing Technology have sought patent for Voltage Conversion Circuit, Chip and Electronic Equipment. This invention was developed by Lyu Changming.
The patent application number is CN202510899487 20250630. The patent publication number is CN120528244..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- SanDisk Tech LLC and SanDisk Technology have been granted a patent for Bonded Assembly Containing Bonding Pads with Metal Oxide Barriers and Methods for Forming the Same. Ishikawa Kensuke, Amano Fumitaka, Totani Shingo and Chen Linghan developed the invention.
The patent application number is US20221793..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Canon KK and Canon Kabishiki Kaisha have received a patent for Substrate and Method of Manufacturing Substrate. This invention was developed by Toshishige Mitsunori and Fukumoto Yoshiyuki.
The patent application number is US202217857332 20220705. The patent publication number is US12550746 (B2). Coopera..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Yunnan Invensight Optoelectronics Tech Co Ltd and BOE Technology Group have obtained a patent for display substrate and electronic apparatus having concave points within gap between pixel regions. This invention was developed by Yang Zongshun, Yu Hongtao, Huang Kuanta, Dong Yongfa and Li Shipeng.
The pa..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Hefei BOE Display Tech Co Ltd and BOE Technology Group have been granted a patent for Array Substrate and Display Device. This invention was developed by Liu Quanzhou, Qian Haijiao, Chen Liang and Liu Zexu.
The patent application number is US202218276646 20220714. The patent publication number is US1255..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Toshiba and Toshiba Electronic Devices & Storage have secured a patent on Semiconductor Device and Semiconductor Circuit. Iwakaji Yoko, Matsudai Tomoko and Gejo Ryohei developed the invention.
The patent application number is US202217903823 20220906. The patent publication number is US12550347 (B2). Int..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Taiwan Semiconductor Mfg Company Ltd and National Taiwan University have been granted a patent for Metal Halide Resistive Memory Device and Method for Forming the Same. This invention was developed by Li Chia-shuo, Wu Yu-tien, Chen Bo-you, Ni I-chih and Wu Chih-i.
The patent application number is US2022..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Cypress Semiconductor Corp and Infineon Tech Americas Corp have been awarded a patent for Slicers and Temperature Offset Cancelation Circuits for Decision Feedback Equalizers. This invention was developed by Bodnaruk Nicholas, Jung Soon-gil, Miller Gary, Sunkara Sai Goutham and Sanders Anthony.
The pate..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Huawei Tech Co Ltd and Huawei Technolgoies Co Ltd have been granted a patent for Codeword Synchronization Method, Communication Device, Chip, and Chip System. Ren Hao, He Xiang and Wang Xinyuan developed the invention.
The patent application number is US202418787001 20240729. The patent publication numb..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Samsung Electronics Co Ltd and Fairchild Korea Semiconductor Ltd have been granted a patent for Method and Apparatus for Charging a Battery. This invention was developed by Jung Ku-chul, Maier Erik Wilson, Freitas Oscar, Lee Kisun, Yun Chul-eun and Lee Kwang-sub.
The patent application number is US20211..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Display Substrate and Display Device. This invention was developed by Zhang Shunhang, Han Jiahui, Zhou Tianmin, Liang Pengxia, Xuan Minghua, Zhang Zhenyu, Liu Dongni, Zhang Zhen, Lim Yun-sik, Li Peirou and Yu L..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Cypress Semiconductor Corp and Infineon Tech Americas Corp have been awarded a patent for Battery Management System, Method of Battery Management and Wireless Communication Device for Battery Management Systems. This invention was developed by Zhodzishsky Victor, Kim Haram, Mysore Manamohan D, Park Joon Ha..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Chip Structure, Manufacturing Method Thereof and Display Substrate. This invention was developed by Han Tianyang, Li Wei, Wang Mingxing and Xu Jian.
The patent application number is CN20238012404 20231219. T..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Raytheon Tech Corporation and RTX have secured a patent on In-situ Solid Chemical Vapor Deposition Precursor Delivery. Nable Jun, She Ying and Sudre Olivier H developed the invention.
The patent application number is US202217888757 20220816. The patent publication number is US12545997 (B2). Internationa..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- Chengdu Xinhuo Integrated Circuit Ind Base Co Ltd and Chengdu Jinghui Zhuochuang Semiconductor Co Ltd have submitted a patent application for Surge Protection Circuit Based on Silicon Cavity Wall Structure and Manufacturing Method Thereof. Wu Wenqi, Li Chunhan and Zhang Xin developed the invention.
The pat..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- Jiangxi Yaochi Tech Co Ltd and MTC Semiconductor have submitted a patent application for Chip Sorting Method and Chip Sorting System. This invention was developed by Zhu Bingbing, Guo Lei, Dong Guoqing, Wen Guosheng and Jin Conglong.
The patent application number is CN202510687097 20250527. The patent publ..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- Anhui University and China Electronics Technology No. 38 Research Institute have submitted a patent application for Radio Frequency MEMS Magnetoelectric Antenna Chip Analysis Method Based on Electromagnetic-force-micro Magnetic Coupling. This invention was developed by Chen Shitao, Li Yaqi, Huang Lin, Yin Qiu..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group have been granted a patent for Display Substrate and Manufacturing Method Therefor, and Display Apparatus. This invention was developed by Qing Haigang, Xiao Yunsheng and Gu Quanyong.
The patent application number is US202418814604 2024082..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Furukawa Electric and UACJ have applied Chinese patent for Substrate for Magnetic Disk. Hatakeyama Hideyuki and Takiguchi Koichiro developed it.
The patent application number is CN20248009835 20240126. The patent publication number is CN120530456 (A). International Patent Classification codes are G11B5/73,..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- BOE Technology Group, Beijing BOE Sensing Tech Co Ltd and Beijing BOE Technology Development have submitted a patent application for Pressure Sensing Chip and Pressure Sensor. This invention was developed by Li Yue, Wang Lihui, Wei Qiuxu, Guo Weilong, Zhang Taonan, Chang Wenbo, Sun Jie, He Nana, Liu Hanqing ..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Ningde Contemporary Future Energy Shanghai Research Institute and Ningde Contemporary Amperex Technology have sought patent for Perovskite Solar Cell and Preparation Method Thereof, Electric Equipment and Power Generation Equipment. This invention was developed by Chen Chen, Liu Shuo, Meng Ke, Wu Xueyun, Chen..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Zhuhai Power Supply Bureau Guangdong Power Grid Co Ltd and North China Electric Power University have sought patent for Large-current Silicon Carbide Power Module. This invention was developed by Cheng Xu, Zhao Bin, Chen Yong, Luo Qian, Chen Jianfu, Zhao Zhibin, Gao Zhihua, Li Xuebao, He Jianzong, Sun Peng, L..
Semiconductor
| Fri 13 Feb 2026
Beijing, Feb. 14 -- Fudan University and Jiashan Fudan Res Institute have applied Chinese patent for Ferroelectric Domain Wall Memory Array Structure with Gate Tube and Preparation Method Thereof. Jiang Jun and Liu Zixiong developed it.
The patent application number is CN202510623631 20250515. The patent publication number is..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 --Beijing BOE Display Tech Co Ltd and BOE Technology Group have obtained a patent for array substrate and display device. This invention was developed by Wang Xiao, Yin Xiaofeng, Chen Weitao, Yan Yan and Ma Yu.
The patent application number is US202418932441 20241030. The patent publication number is US125..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Taiwan Semiconductor Mfg Co Ltd and Taiwan Semiconductor Manufacturing Company have received a patent for Method of Forming Photoresist Pattern. This invention was developed by Su Yu-chung, Ko Tsung-han and Chang Ching-yu.
The patent application number is US202017098238 20201113. The patent publication..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Showa Denko Mat Co Ltd and Resonac have obtained a patent for photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element. This invention was developed by Aoki Yu, Hamano Yoshimi, Suzuki Teruaki and Hashimoto Masahiro.
The patent applicatio..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Beijing Eswin Computing Tech Co Ltd and Guangzhou Transa Semi Information Tech Co Ltd have secured a patent on GRPC-based Chip Test Method, Grpc-based Chip Test Apparatus, and Storage Medium. Xie Zeliang, Peng Yufeng, Shi Zuhua, Yuan Ligang and Ma Huichuang developed the invention.
The patent applicatio..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- State Intellectual Property Office of China has released Shenzhen Zhongzhixiang Tech Co Ltd patent application for Welding Device for Power Supply Chip Processing. This invention was developed by Wei Xiang, Zhou Cang, Mo Liang and An Jixing.
The patent application number is CN202510761992 20250609. The pat..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Jcet Advanced Packaging Co Ltd has been granted a patent for Chip Packaging Structure and Chip Packaging Method. This invention was developed by Xu Hong, Chen Dong, Xu Xia, Jin Dou and Chen Jinhui.
The patent application number is US202217893154 20220822. The patent publication number is US12550776 (B2)..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- U.S. Patent and Trademark Office has awarded a patent to Innolux for Semiconductor Device. Lin Te-hsun, Liao Wen-hsiang, Shih Ming-hsien, Chen Yung-feng and Wang Cheng-chi developed the invention.
The patent application number is US202218083561 20221218. The patent publication number is US12550760 (B2)...
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- Samsung Electronics has been awarded a patent for Semiconductor Package. This invention was developed by Lee Changbo, Oh Joonseok, Kim Youngmin, Shin Jihye and Lee Hyundong.
The patent application number is US202218053806 20221109. The patent publication number is US12550759 (B2). International Patent C..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- ChangXin Memory Technologies has received a patent for Semiconductor Device and Fabrication Method Thereof. This invention was developed by Xue Dong.
The patent application number is US202318327063 20230601. The patent publication number is US12550750 (B2). Cooperative Patent Classification codes are G0..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- U.S. Patent and Trademark Office has awarded a patent to Hangzhou HFC Semiconductor Corp for Semiconductor Chip Having a Crack-stop Ring Structure. Wu Zhuojie developed the invention.
The patent application number is US202318381163 20231017. The patent publication number is US12550735 (B2). Internationa..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- Hans Semiconductor Equipment Technology has submitted a patent application for Laser Modification Processing Mechanism, Method and Device, Processing Equipment and Storage Medium. This invention was developed by Chen Hong, Wang Zhuomin, Zeng Wei and Yin Jiangang.
The patent application number is CN20251068..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- U.S. Patent and Trademark Office has awarded a patent to International Business Machines for Subtractive Skip Via. Lanzillo Nicholas Anthony, Motoyama Koichi and Clevenger Lawrence A developed the invention.
The patent application number is US202218057380 20221121. The patent publication number is US125..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- Hans Semiconductor Equipment Technology has submitted a patent application for Laser Processing Method, Device and Equipment and Readable Storage Medium. This invention was developed by Liu Zhifa, Yao Jinkun, Liao Binbin, Li Bairu, Li Zhihui, Ma Qingping, Zhang Yao, He Yun and Yin Jiangang.
The patent appl..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- SEMES has received a patent for Support Unit, Line Storage Unit, and Transport System Including the Support Unit. This invention was developed by Kim Do Hyun.
The patent application number is US202318166794 20230209. The patent publication number is US12550670 (B2). Cooperative Patent Classification cod..
Semiconductor
| Sat 14 Feb 2026
Beijing, Feb. 14 -- Yancheng Dikaer Intelligent Machinery Co Ltd has submitted a patent application for Packaging and Welding Device Suitable for Semiconductor Materials. This invention was developed by Yue Dezhu.
The patent application number is CN202510657577 20250521. The patent publication number is CN120533246 (A). Inter..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- International Business Machines has secured a patent on Resistive Memory with Resistance Spreading Layer. Solomon Paul Michael, Ando Takashi, Rozen John and Cartier Eduard Albert developed the invention.
The patent application number is US202217931686 20220913. The patent publication number is US1255063..
Semiconductor
| Sat 14 Feb 2026
Alexandria, Feb. 14 -- U.S. Patent and Trademark Office has awarded a patent to LG Innotek for Thermoelectric Element. Choi Man Hue, Oh Sue Kyung and Lee Jong Min developed the invention.
The patent application number is US202418624621 20240402. The patent publication number is US12550613 (B2). International Patent Classifica..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Sony Semiconductor Solutions Corporation has been granted a patent for Signal Processing Device, Signal Processing System, Signal Processing Method, and Program. Higashibara Kiyoshi developed the invention.
The patent application number is US202218683047 20220603. The patent publication number is US1254..
Semiconductor
| Fri 13 Feb 2026
Alexandria, Feb. 14 -- Samsung Electronics has received a patent for Device and Method with Increasing Resolution of Frame in G-buffer Domain. This invention was developed by Hong Seokpyo, Kang Nahyup, Kim Hanjun, Moon Jaeyoung, Yu Hyeonseung, Lee Juyoung, Jung Hwiryong and Ha Inwoo.
The patent application number is US2023183..
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