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Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- Suzhou Heguang Zhongyuan New Mat Co Ltd has submitted a patent application for Low-refractive-index Glue Containing Hollow Silicon Dioxide and Preparation Method of Low-refractive-index Glue. Zhu Zhaoyue and Xie Zhihui developed the invention.
The patent application number is CN202610590042 20260430. The ..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- Suzhou Dongcha New Mat Co Ltd has sought patent for High-residue Low-climbing Photocuring Organic Silicon Release Agent Composition as Well as Preparation Method and Application Thereof. This invention was developed by Liu Hanwen, Liu Kun, Sun Lulu, Shi Huanhuan and Ji Xianglei.
The patent application num..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- Marine Chemical Research Institute Co Ltd has submitted a patent application for Organic Silicon Modified Polyurethane Anti-cavitation Anti-fouling Paint as Well as Preparation Method and Application Thereof. Wu Lianfeng, Hu Chengying, Zhang Kai, Cong Weiwei, Wang Xiaojun, Lyu Zhao, Liu Shuhui, Sun Yiming an..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has released Anhui Yuanxin Microelectronic Co Ltd patent application for Wastewater Precipitation Equipment and Process for Manufacturing Integrated Circuit Chip. This invention was developed by Yuan Xiaoming and Gao Yucui.
The patent application number is CN202..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- Shaanxi Zhousong Environmental Protection Tech Co Ltd has submitted a patent application for Dosing System and Control Treatment System for Zero Discharge of Polycrystalline Silicon Wastewater. This invention was developed by Cao Liang, Li Guohong, Wang Lei and Jin Xiaochun.
The patent application number ..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Tel Mfg and Engineering of America Inc has been granted a patent for Multi-wafer Handling System. This invention was developed by Vaillant Jeremy John and Gwinn Matthew Charles.
The patent application number is US202418442926 20240215. The patent publication number is US12745602 (B2). International Pat..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has released Shanghai Advanced Silicon Tech Co Ltd patent application for Method for Reducing Crystal Primary Defects After Growth of Silicon Single Crystal for Integrated Circuit. This invention was developed by Liang Yongli, Wang Ximing, Zhang Junbao and Chen Men..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has published Ma Zeng patent application for Polycrystalline Silicon Reduction Furnace and Method for Adjusting Gas Flow Field in Polycrystalline Silicon Reduction Furnace.
The patent application number is CN202411963832 20241227. The patent publication number ..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has received Jiangsu Tianke Heda Semiconductor and Beijing Tankeblue Semiconductor patent application for Silicon Carbide Single Crystal Growth Device, Silicon Carbide Single Crystal Growth Furnace, and Silicon Carbide Single Crystal Growth Method. Guo Yu, Peng Ton..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- Wuhan Xinchuangyuan Semiconductor Co Ltd has sought patent for Automatic Copper Powder Adding System for Carrier Plate Electroplating Process and Early Warning Method of Automatic Copper Powder Adding System. This invention was developed by Xie-liu Danfeng, Su Hang, Zhang Xiaojun and Sun Hongchao.
The pat..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has released Lishi Electrode Tech Hangzhou Co Ltd patent application for Method for Reducing Consumption of Organic Additive in Pulse Electroplating Process. This invention was developed by Xue Junwei, Zhang Kaifeng and Zhao Qite.
The patent application number i..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- Shanghai Baigao Maidao Tech Co Ltd has filed a patent application for High-thermal-conductivity Organic Silicon Pouring Sealant and Preparation Method Thereof. This invention was developed by Feng Jingtao.
The patent application number is CN202610774160 20260601. The patent publication number is CN1223028..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has published Kunshan Sumei New Material Tech Co Ltd patent application for Acrylate Chip Mounting Adhesive with High Thermal Conductivity and Low Stress. The invention was developed by Zhang Hongxia, Li Junxian and Xu Cun.
The patent application number is CN202..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- Nameite New Material Tech Chongqing Co Ltd has filed a patent application for High-reflection-radiation Cooling Type Silicon Dioxide Aerogel Composite Coating as Well as Preparation Method and Application Thereof. This invention was developed by Yu Yuxi, Yu Hongge and Huang Liuying.
The patent application..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has released New Material Tech Co Ltd patent application for High-filling Rpet Substrate Composite Material, Preparation Method Thereof and Composite Floor. This invention was developed by She Jiajun.
The patent application number is CN202610534581 20260422. The..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has received Jiangxi Wofu Chemical Tech Co Ltd and Zhejiang Wole Tech Co Ltd patent application for Multi-stage Back-mixing Dissociation Regeneration Device and Method for Fluorine-containing Sludge in Generic Semiconductor Industry. Yu Yanwen, Lu Huifeng, Lu Jing,..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has released Jiangxi Hankefan Semiconductor Tech Co Ltd patent application for Hot Filament CVD (Chemical Vapor Deposition) Photovoltaic Cell Edge Passivation Equipment and Cavity Thereof. This invention was developed by Huang Haibin and Liu Cuicui.
The patent a..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has received Institute of Semiconductors Henan Academy of Sciences patent application for Method for Preparing Wafer-level Tungsten Diselenide Film on Sio2/si Substrate. Jiang Jingjing, Li Jingtao, Wang Pu, Guan Zhiqiang, Yan Bin and Zhai Baoxing developed the inve..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has received Qingdao Institute Bioenergy & Bioprocess Technology Cas patent application for Bacterial Strain for Producing Lysine by Using Synthesis Gas Fermentation Product as Substrate and Application of Bacterial Strain. Li Fuli, Wang Haoming, Su Hang, Zhou Houm..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- Shenzhen Institute of Advanced Electronic Materials has submitted a patent application for Epoxy Resin Composition, Cured Resin and Packaging Chip. Fu Kexin, Yu Lijie, Zhu Pengli, Xie Jianming, Wan Yanjun, Hou Bin, Sun Rong and Liao Siyuan developed the invention.
The patent application number is CN202610..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has released Institute of New Material and Industry Technology Wenzhou University and Wenzhou University patent application for Ultraviolet Irradiation Silicon Dioxide Aerogel Modified Chlorinated Butyl Rubber. This invention was developed by Peng Xuqiang, Li Jun, ..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has received Shanghai Zhuide New Material Tech Co Ltd patent application for Flexible Substrate Material and Preparation Method and Application Thereof. Yang Zijiang, Wang Yuhui, Zhang Anbing, Cong Xinlong, Wang Yubin, Wu Wei, Kang Ning and Lyu Zhiwen developed the..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has published Ganjiang Traditional Chinese Medicine Innovation Center patent application for Traditional Chinese Medicine Polysaccharide Chip Based on Fluorescence Derivatization and Preparation Method Thereof. The invention was developed by Zheng Yi, Cheng Yiming,..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- Beijing Green Guardee Tech Co Ltd has filed a patent application for Acid-containing Organic Compound, Application Thereof and Perovskite Solar Cell. This invention was developed by Wu Weina, Lyu Yao and Xue Beiyu.
The patent application number is CN202411983260 20241231. The patent publication number is ..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has released Beijing Green Guardee Tech Co Ltd patent application for Organic Compound Containing Pyrene Ring Structure, Application of Organic Compound and Perovskite Solar Cell. This invention was developed by Lyu Yao and Feng Meijuan.
The patent application n..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- Shenzhen Hengdeye Tech Co Ltd has secured a patent on Laptop Semiconductor Refrigeration Radiator with Lifting Touch Control Function. Gao Shifeng developed the invention.
The patent application number is CN202520230935U 20250213. The patent publication number is CN223728195 (U). International Patent Clas..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- Wuxi Xinyuanwei Tech Co Ltd has been granted a patent for Integrated Circuit Chip Burning Device with Voltage Monitoring Mechanism. Sun Yanyan developed the invention.
The patent application number is CN202423191777U 20241224. The patent publication number is CN223727898 (U). International Patent Classifi..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has awarded a patent to Hefei Huaben Electronic Tech Co Ltd for Clamp for Testing Chip Resistor. Hua Lili and Feng Hao developed the invention.
The patent application number is CN202423271128U 20241230. The patent publication number is CN223727880 (U). Internati..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- Wuxi Xinyuanwei Tech Co Ltd has secured a patent on Integrated Circuit Chip Burning Test Jig Adaptable to Different Sizes. Sun Yanyan developed the invention.
The patent application number is CN202423226735U 20241226. The patent publication number is CN223727875 (U). International Patent Classification co..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- Weijidian Tech Suzhou Co Ltd has sought patent for Piezoelectric MEMS Fan and Stress Optimization Design Method, Preparation Method and Chip Thereof. This invention was developed by Liu Guiwu, Liu Junlin, Xia Songmin, Qiao Guanjun and Hou Haigang.
The patent application number is CN202610402783 20260330. ..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has released Sichuan Weiwodun Petroleum Technology and Chengdu Branch of Sichuan Weiwodun Petroleum Tech Co Ltd patent application for Upy Supramolecular Graft Modified Nano Liquid Silicon Anti-gas-channeling Agent as Well as Preparation Method and Application Ther..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- Ningxia Hejia Semiconductor Co Ltd has submitted a patent application for Barium Carbonate Coating Crucible and Polycrystalline Silicon Cast Ingot Preparation Method. Huang Wei, Zhou Ke, Guo Baolei, Jiang Hai, Wang Mengqian and Wu Jianke developed the invention.
The patent application number is CN20261065..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- Shaanxi Zhenan Zhuopu Electronics Co Ltd has applied Chinese patent for High-thermal-conductivity Low-expansion Modified Electronic Ceramic Substrate and Preparation Method Thereof. Chen Jinxiu and Hu Jianping developed it.
The patent application number is CN202610451965 20260408. The patent publication n..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has awarded a patent to Jiangsu Lianshixin Semiconductor Co Ltd for Photoetching Alignment Device for Manufacturing Integrated Circuit Chip. Xie Xuetao, Liu Jianfu and Chang Mingzhou developed the invention.
The patent application number is CN202423268803U 20241..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- U.S. Patent and Trademark Office has awarded a patent to Southern Univ Of Science And Technology, Univ Of Hong Kong Versitech Limited, Univ Southern Sci & Tech and VersiTech for Opto Chip-based Viscometer. Luo Yumeng, Li Kwai Hei and Chu Zhiqin developed the invention.
The patent application number is ..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- U.S. Patent and Trademark Office has awarded a patent to The Regents of the University of Michigan for Light-based Tactile Sensing with Directional Sensitivity. Sui Jingyang, Ku Pei-cheng and Chung Kunook developed the invention.
The patent application number is US202418673076 20240523. The patent publ..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- U.S. Patent and Trademark Office has awarded a patent to ST Microelectronics International NV for Digital Temperature Sensor, Corresponding Device and Method. Bruno Giuseppe and Ippolito Calogero Marco developed the invention.
The patent application number is US202418659275 20240509. The patent publica..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has received Changchun Institute of Optics Fine Mechanics and Physics Chinese Academy of Sciences and Jilin Changguang Jixin Tech Co Ltd patent application for Preparation Method of Extreme Ultraviolet Reflection Film. Lei Yuxin, Liang Lei, Chen Yongyi, Wang Yubing..
Semiconductor
| Thu 01 Oct 2026
Beijing, Sept. 30 -- Shengjisheng Korea Semiconductor Tech Co Ltd has applied Chinese patent for Thin Film Deposition Apparatus. Li Zhe, Cha Dong-il and Yoo Jin-ho developed it.
The patent application number is CN202511251295 20250903. The patent publication number is CN122303844 (A). International Patent Classification codes..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- Xinkai Semiconductor Equipment Xuzhou Co Ltd has received a patent for Temperature Measuring Structure for Semiconductor Equipment. This invention was developed by Zhong Youkai and Zu Heyuan.
The patent application number is CN202520317431U 20250226. The patent publication number is CN223727285 (U). Inter..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- Inner Mongolia Shenhong New Material Tech Co Ltd has received a patent for Novel Silicon Carbide Heating Equipment. This invention was developed by Di Baorong.
The patent application number is CN202522508245U 20251126. The patent publication number is CN223726915 (U). International Patent Classification c..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has awarded a patent to Hunan Renlong New Mat Co Ltd for Round Hole Cushion Block Type Silicon Carbide Stand Column Supporting Frame. Zhong Qilong and Zhong Hangyu developed the invention.
The patent application number is CN20252081529U 20250114. The patent publ..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- Chinese Patent for Device for Improving Siliconizing of Reactive Sintering Silicon Carbide has been issued to Hunan Taitan Future Tech Co Ltd. This invention was developed by Zhang Yueheng, Wang Ziwei, Zeng Yulin and Sun Wei.
The patent application number is CN20252051925U 20250109. The patent publication..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Semiconductor Structure Including Lines of Different Height. This invention was developed by Chen Hsin-ping, Chu Wei-chen, Chou Chuan-pu and Wu Chia-tien.
The patent application number is US202318366096 20230807. The patent publica..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Taiwan Semiconductor Manufacturing Co Ltd has been awarded a patent for Protection of Sti Features. This invention was developed by Syue Sen-hong, Chui Chi On and Teng Yun Chen.
The patent application number is US202418426939 20240130. The patent publication number is US12745614 (B2). International Pat..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Applied Materials Inc has received a patent for Implant Hard Mask for Substrates. This invention was developed by Wang Feng Shou, Zheng Yi, Fang Jun, Megalini Ludovico and Oh Jang Seok.
The patent application number is US202318398564 20231228. The patent publication number is US12745610 (B2). Internati..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- U.S. Patent and Trademark Office has awarded a patent to Applied Materials Inc for Endpoint Detection in Low Open Area and/or High Aspect Ratio Etch Applications. Wang Zefang, Koseki Shinichi, Walker Quentin and Lian Lei developed the invention.
The patent application number is US202418779953 20240722...
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Micron Technology Inc has received a patent for Memory Device Structure and Forming Method Including Reticle Adjustment. This invention was developed by Hu Yi.
The patent application number is US202117404649 20210817. The patent publication number is US12745606 (B2). International Patent Classification..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Taiwan Semiconductor Manufacturing Co Ltd has secured a patent on Pick-and-place Tool with Warpage-correction Mechanism. Chang Jen-yuan developed the invention.
The patent application number is US202318171315 20230217. The patent publication number is US12745603 (B2). International Patent Classificatio..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Seimconductor Manufacturing Co Limited for Wafer Storage Device with Particle-attraction Object. Kuo Yuan-cheng, Hsiao Kai-hung, Jen Chi-chung, Huang Chih-hsiung and Hsu Pei-huang developed the invention.
The patent application number is U..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Taiwan Semiconductor Manufacturing Co Ltd has obtained a patent for retaining ring for chemical-mechanical polishing. This invention was developed by Liu Chi-jen, Chang Tang-kuei, Lin Jeng-chi, Chen Kei-wei, Huang Hui-chi, Shen Chi-hsiang and Hou Te-chien.
The patent application number is US20231833495..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Tower Semiconductor Ltd has been granted a patent for Detection of a Position of a Wafer Within a Transfer Robot Vacuum Chamber. This invention was developed by Superfine Slava, Trabelsi Dany and Malachy Yaniv.
The patent application number is US202217821175 20220821. The patent publication number is U..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- United States Patent for Methods and Systems for Controlling Underfill Bleed-out in Semiconductor Packaging has been issued to SK Hynix Nand Product Solutions Corp. This invention was developed by Khalaf Bilal.
The patent application number is US202318123612 20230320. The patent publication number is U..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- United States Patent for Method of Cleaning Silicon Wafer, Method of Manufacturing Silicon Wafer, and Silicon Wafer has been issued to Shin Etsu Handotai Co Ltd and Shin-Etsu Handotai KK. This invention was developed by Abe Tatsuo and Fujii Kota.
The patent application number is US202218278071 20220221..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- International Business Machines has secured a patent on Self-aligned Litho-etch-litho-etch Mandrel Cut Process for Advanced Finfet Interconnect. Yang Xiaoming and Clevenger Lawrence A developed the invention.
The patent application number is US202318190085 20230325. The patent publication number is US1..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Applied Materials Inc has been granted a patent for Ion Implantation for Increased Adhesion with Resist Material. This invention was developed by Huang Zhiyu, Hwang Ho-yung David, Prasad Rajesh, Liao Lei, Wang Fenglin, Liu Lequn, Lang Chi-i, Ling Yichuan, Lin Yung-chen and Kanzawa Hideyuki.
The patent ..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Taiwan Semiconductor Manufacturing Co Ltd has secured a patent on Semiconductor Device, Memory Cell and Method of Forming the Same. Lin Bo-jiun, Lee Tung-ying, Lin Yu-chao and Yu Shao-ming developed the invention.
The patent application number is US202418583864 20240222. The patent publication number i..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- U.S. Patent and Trademark Office has awarded a patent to Government of The Us Secretary of Commerce, Regents of The University of Minnesota, Theiss Res Inc and University of Minnesota for Scalable Spintronic Devices Formed on Silicon Wafers. Shoup Jenae E, Lyu Deyuan, Wang Jian-ping and Gopman Daniel B de..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- International Business Machines has received a patent for Mram Device with Hexagonal Shaped Electrodes. This invention was developed by Van Der Straten Oscar, Rodriguez Gabriel and Yang Chih-chao.
The patent application number is US202318317989 20230516. The patent publication number is US12745570 (B2)..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Taiwan Semiconductor Manufacturing Co Ltd has received a patent for Magnetic Tunnel Junction Stack and Method for Manufacturing the Same. This invention was developed by Lu Po-sheng, Wu Zhiqiang, Xu Nuo and Xiao Zhi-ren.
The patent application number is US202217734535 20220502. The patent publication n..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- LG Chemical Ltd has obtained a patent for organic light emitting device. This invention was developed by Kim Hoon Jun, Choi Ji Young, Kim Joo Ho, Ha Jae Seung and Lee Woochul.
The patent application number is US202118018928 20210831. The patent publication number is US12745561 (B2). International Paten..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- United States Patent for Light Emitting Chip and Manufacturing Method for the Same, and Light Emitting Device has been issued to BOE Technology Group Co Ltd. This invention was developed by Zhou Tingting, Zhang Fangzhen, Niu Jing, Wang Wei, Niu Yanan, Wang Xinxing and Sun Shuang.
The patent application..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Hon Hai Prec Ind Co Ltd and National Yang Ming Chiao Tung University have received a patent for Light-emitting Device and Method of Manufacturing Thereof. This invention was developed by Huang Yao-wei, Chen Shih-chen, Hong Yu-heng, Tsai Wei-cheng and Kuo Hao-chung.
The patent application number is US20..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- United States Patent for Optical Part, Light-emitting Device with Quantum Dots, and Manufacturing Method Thereof has been issued to Qdlux Inc. This invention was developed by Yi Ching-liang, Huang Chen-yang and Chang Jung-hua.
The patent application number is US202318367300 20230912. The patent publica..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing Co Ltd for Pixel with Dual-pd Layout. Yaung Dun-nian, Hsiao Chia-chi, Chung Chi-hsien, Wang Tzu-jui and Wang Chen-jong developed the invention.
The patent application number is US202318324415 20230526. The paten..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- United States Patent for Deep Trench Isolation Structure for High Resolution CIS Pixel has been issued to Taiwan Semiconductor Manufacturing Co Ltd. This invention was developed by Lu Jiech-fun, Tsao Tsun-kai, Hsu Hung-wen, Kuo Wen-chang, You Bing Cheng and Shih Chih Cheng.
The patent application numbe..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- United States Patent for Electrostatic Discharge (ESD) Protection Circuit Including an Avalanche Semiconductor Controlled Rectifier (SCR) with Parallel Connected Static Trigger Control Circuit (TCC) has been issued to ST Microelectronics International NV. This invention was developed by Di Biccari Leonard..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Infineon Tech AG has secured a patent on ESD Protection Device. Eckinger Markus, Magrini Filippo, Nguyen Chi Dong, Cretu Gabriel-dumitru and Russ Christian Cornelius developed the invention.
The patent application number is US202318191596 20230328. The patent publication number is US12745463 (B2). Inte..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Ali Corp has secured a patent on Electrostatic Discharge Protection Device. Chuang Sheng-jun developed the invention.
The patent application number is US202318511983 20231116. The patent publication number is US12745462 (B2). International Patent Classification codes are H10D8/00 and H10D89/60. Coopera..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- United States Patent for Display Substrate and Preparation Method Therefor, and Display Apparatus has been issued to BOE Technology Group Co Ltd. This invention was developed by Xuan Minghua, Xiao Li, Cui Xiaorong, Zhao Jiao, Zhang Chenyang, Guo Yuzhen, Qu Yan and Zheng Haoliang.
The patent application..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Wuhan China Star Optoelectronics Technology Co Ltd has been granted a patent for Array Substrate and Display Panel. Luo Chengzhi developed the invention.
The patent application number is US202117618580 20211029. The patent publication number is US12745459 (B2). International Patent Classification codes..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Murata Mfg Co Ltd has secured a patent on Support Substrate for Passive Electronic Component, Passive Electronic Component, Semiconductor Device, Matching Circuit, and Filter Circuit. Ito Korekiyo and Harada Masatomi developed the invention.
The patent application number is US202318497020 20231030. The..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Enkris Semiconductor Wuxi Ltd has obtained a patent for composite substrate, manufacturing method thereof and semiconductor device. This invention was developed by Cheng Kai.
The patent application number is US202318355656 20230720. The patent publication number is US12745456 (B2). International Patent..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- United States Patent for Integrated Circuit Driver Device, Layout, and Method has been issued to Taiwan Semiconductor Manufacturing Co Ltd. This invention was developed by Chung Shu-wei, Chang Chia-jung, Chen Chia-hui and Yen Kuei-feng.
The patent application number is US202318317481 20230515. The pate..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Innoscience Suzhou Tech Co Ltd and Innoscience Suzhou Technology Holding Co Ltd have secured a patent on Semiconductor Device and Method for Manufacturing the Same. Shi Yu and Zhao Qiyue developed the invention.
The patent application number is US202117623264 20211110. The patent publication number is ..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Infineon Tech AG has obtained a patent for method for forming a drift region of a superjunction device. This invention was developed by Peters Dethard and Hell Michael.
The patent application number is US202217846638 20220622. The patent publication number is US12745432 (B2). International Patent Class..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing Co Ltd for Semiconductor Structure and Method for Manufacturing the Same. Liang Chun-sheng, Chang Huang-chao, Lin Ta-chun and Liaw Jhon-jhy developed the invention.
The patent application number is US20231817287..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- U.S. Patent and Trademark Office has awarded a patent to TSMC Nanjing Company Ltd and Taiwan Semiconductor Manufacturing Co Ltd for Semiconductor Device and Manufacturing Method Thereof. Lin Han-yu, Shen Tzer-min, Yang Cheng-tzu, Putikam Raghunath, Lin Tze-chung, Lam Kai-tak, Lee Tzu-li, Lin Li-te, Lee Fa..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- U.S. Patent and Trademark Office has awarded a patent to Toshiba Electronic Devices & Storage Corp and Toshiba for Semiconductor Device. Matsudai Tomoko, Iwakaji Yoko and Gejo Ryohei developed the invention.
The patent application number is US202318242844 20230906. The patent publication number is US1..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- United States Patent for Resistor Structure Including Charge Control Layer has been issued to Texas Instr Incorporated. This invention was developed by Lee Dong Seup, Dey Sagnik and Varghese Dhanoop.
The patent application number is US202217737515 20220505. The patent publication number is US12745407 (..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Realtek Semiconductor Corp has obtained a patent for integrated transformer. This invention was developed by Yen Hsiao-tsung and Chan Ka-un.
The patent application number is US202318530272 20231206. The patent publication number is US12745406 (B2). International Patent Classification codes are H01F27/2..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Micron Technology Inc has secured a patent on Memory Device Including Tiers of Fefet Memory Cells and Vertical Control Gates. Ramaswamy Durai Vishak Nirmal, Karda Kamal M and Nirmal Ramaswamy Durai Vishak developed the invention.
The patent application number is US202318520002 20231127. The patent publ..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Semiconductor Energy Laboratory Co Ltd has received a patent for Memory Device and Manufacturing Method Thereof. This invention was developed by Murakawa Tsutomu, Kunitake Hitoshi and Sawai Hiromi.
The patent application number is US202017776388 20201109. The patent publication number is US12745391 (B2..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- United States Patent for Semiconductor Memory Devices and Methods of Manufacturing Thereof has been issued to Taiwan Semiconductor Manufacturing Co Ltd. This invention was developed by Huang Chia-en and Lin Meng-han.
The patent application number is US202519246932 20250624. The patent publication numbe..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Magnolia White Corp and Japan Display has obtained a patent for stretchable device. This invention was developed by Hishinuma Masatomo and Sano Takumi.
The patent application number is US202418825321 20240905. The patent publication number is US12745346 (B2). International Patent Classification code is..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- United States Patent for Circuit and Method for Driving a Micro-electro-mechanical Resonator of a Gyroscope with a Reduced Excitation of Spurious Harmonics has been issued to Stmicroelectronics SRL. This invention was developed by Gattere Gabriele and Garbarino Marco.
The patent application number is U..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- United States Patent for Height Measurement Sensor has been issued to ASML Netherlands BV. This invention was developed by Martinsson Thomas Per Krister and Popinciuc Mihaita.
The patent application number is US202318838148 20230201. The patent publication number is US12742636 (B2). International Paten..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- Jiangsu Xwins Intelligent Tech Co Ltd has been granted a patent for Angular Velocity Sensing Device Based on Piezoresistance-avalanche Effect and MEMS Gyroscope. This invention was developed by Han Yingzhou, Peng Tianfang, Qiao Yuyang and Xia Yang.
The patent application number is CN202422427825U 20241009..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- Quanzhou Yunjian Measurement and Control and Perception Technology Innovation Research Institute and Quanzhou Yunjian Measurement And Control Information Tech Co Ltd has secured a patent on Anti-overload Triaxial MEMS (Micro Electro Mechanical System) Gyroscope. Chen Lei, Wang Shiqiang, Dai Zhihua and Wang H..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- Guangdong Tianxing Measurement Tech Co Ltd has been awarded a patent for Camera Chip Flatness Detection Mechanism and Detection Equipment Thereof. This invention was developed by Hong Jinlong and Qiu Zenghua.
The patent application number is CN202520411883U 20250311. The patent publication number is CN223..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has awarded a patent to Suzhou Gaiqi Intelligent Tech Co Ltd for Cooling Device for Semiconductor Part Processing. Li Lin developed the invention.
The patent application number is CN202520236381U 20250214. The patent publication number is CN223726729 (U). Intern..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- State Intellectual Property Office of China has awarded a patent to Suzhou Gaiqi Intelligent Tech Co Ltd for Circulating Air Cooling Box for Semiconductor Cooling. Li Lin developed the invention.
The patent application number is CN202520124904U 20250120. The patent publication number is CN223726726 (U). I..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- Shenzhen Eastway Integration Co Ltd has obtained a patent for safety protection type semiconductor light-emitting diode. This invention was developed by Wang Xiaowen and Huang Xianqiang.
The patent application number is CN202520462339U 20250316. The patent publication number is CN223726286 (U). Internatio..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Toshiba Electronic Devices & Storage Corp and KK Toshiba have received a patent for Semiconductor Device. This invention was developed by Tonedachi Tatsuo and Liu Jia.
The patent application number is US202418599238 20240308. The patent publication number is US12745682 (B2). International Patent Classi..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Taiwan Semiconductor Manufacturing Co Ltd has secured a patent on Semiconductor Structure with Integrated Passive Device Having Opposed Solder Bumps. Yu Ho Che, Chen Yu-hao, Lee Jyh Chwen Frank, Chang Fong-yuan, Lin Ching-yi and Lu Yii-chian developed the invention.
The patent application number is US2..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Shindengen Electric Manufacturing has obtained a patent for semiconductor device. This invention was developed by Kyutoku Atsushi and Umeda Soichiro.
The patent application number is US202217857242 20220705. The patent publication number is US12745653 (B2). International Patent Classification codes are..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Phoenix Pioneer Tech Co Ltd has secured a patent on Semiconductor Package Carrier Board Structure and Manufacturing Method Thereof. Chou Pao-hung and Chang Ming-yeh developed the invention.
The patent application number is US202318450167 20230815. The patent publication number is US12745651 (B2). Inter..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing Co Ltd for Semiconductor Devices with Dummy Fill Structures Between a Through Silicon Via and an Active Device and Methods of Forming the Same. Yang Chih Hsin, Chen Dian-hau, Wang Mao-nan and Wang Liang-wei develop..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- ST Microelectronics Grenoble 2 has obtained a patent for integrated circuit package. This invention was developed by Cuzzocrea Julien and Boutaleb Younes.
The patent application number is US202217884980 20220810. The patent publication number is US12745631 (B2). International Patent Classification code..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- Taiwan Semiconductor Manufacturing Co Ltd has been awarded a patent for Embedding a Metal-insulator-metal Capacitor in a Passivation Layer. This invention was developed by Liu Tzu-ting, Huang Chen-chiu, Wu Ying-ju, Chen Dian-hau and Shen Hsiang-ku.
The patent application number is US202318483695 202310..
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