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Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Samsung Electronics has been awarded a patent for Memory Array Programming Method Using Bitlines and Memory Device for Performing the Same. This invention was developed by Choi Byeonghoon, Oh Myeonghee, Jung Hyuntaek and Choi Hanbyul. The patent application number is US202418753659 20240625. The patent pu..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Macronix has secured a patent on Extraction Method of Physically Unclonable Function and Memory Device. Tsai Wen-jer and Chou You-liang developed the invention. The patent application number is US202418926243 20241024. The patent publication number is US12770692 (B2). International Patent Classification c..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- U.S. Patent and Trademark Office has awarded a patent to Winbond Electronics for Method of Erasing Memory Cells of Flash Memory Device and an Flash Memory Device Using the Same. Huang Koying developed the invention. The patent application number is US202418401730 20240102. The patent publication number is..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- SCREEN Holdings has been granted a patent for Substrate Processing Device and Maintenance Method for Substrate Processing Device. Moriya Chiaki developed the invention. The patent application number is US202418890727 20240919. The patent publication number is US12766574 (B2). International Patent Classifi..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- United States Patent for Managing Program Operations in Memory Devices has been issued to Yangtze Memory Technologies. This invention was developed by Liu Hongtao, Wang Tingze, Huang Ying, Xu Pengyu and Zhao Xiangnan. The patent application number is US202418932991 20241031. The patent publication numbe..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Ebara has received a patent for Abrasion Detection Device, Abrasion Detection Method, Substrate Cleaning Device, and Substrate Cleaning Method. This invention was developed by Miyagawa Saki. The patent application number is US202418830568 20240910. The patent publication number is US12766573 (B2). Interna..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- SK Hynix has been awarded a patent for Memory Device Performing Program Operation and Method of Operating the Same. This invention was developed by Shin Hyun Seob and Kwak Dong Hun. The patent application number is US202318331689 20230608. The patent publication number is US12770688 (B2). International Pa..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- KIOXIA has been awarded a patent for Semiconductor Memory Device. This invention was developed by Li Xu. The patent application number is US202418964133 20241129. The patent publication number is US12770687 (B2). International Patent Classification codes are G11C16/04, G11C16/08, G11C16/10, G11C16/16, G11..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Zeno Semiconductor has obtained a patent for content addressable memory device having electrically floating body transistor. This invention was developed by Louie Benjamin S, Widjaja Yuniarto and Han Jin-woo. The patent application number is US202418791456 20240801. The patent publication number is US1277..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- SCREEN Holdings has received a patent for Substrate Processing Apparatus and Substrate Processing Method. This invention was developed by Maegawa Tadashi. The patent application number is US202218686823 20220824. The patent publication number is US12766566 (B2). International Patent Classification codes a..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- NVIDIA has secured a patent on Backside Metal Track Capacitance for Write Assist. Erbagci Cagri and Gupta Lalit developed the invention. The patent application number is US202418768938 20240710. The patent publication number is US12770681 (B2). International Patent Classification codes are G11C11/412, G11..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- SCREEN Holdings has obtained a patent for substrate processing method. This invention was developed by Maegawa Tadashi, Nakagawa Nozomu, Mitsuyoshi Ichiro and Ozaki Hidehiko. The patent application number is US202519047752 20250207. The patent publication number is US12766564 (B2). International Patent Cl..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- SK Hynix has obtained a patent for semiconductor memory apparatus and an operating method of the semiconductor memory apparatus. This invention was developed by Lee Jeong Jun, Kim Dong Kyu, Em Ho Seok, Won Hyung Sik and Cheon Jun Ho. The patent application number is US202418812600 20240822. The patent pub..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- U.S. Patent and Trademark Office has awarded a patent to SK Hynix for Nonvolatile Memory Device Including Multiple Page Buffers and Operating Method Thereof. Chai Soo Yeol developed the invention. The patent application number is US202418626349 20240404. The patent publication number is US12770662 (B2). I..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Canon has been granted a patent for Semiconductor Device and Apparatus. Iwao Koichi developed the invention. The patent application number is US202418979797 20241213. The patent publication number is US12770708 (B2). International Patent Classification code is G11C29/44. Cooperative Patent Classificatio..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- U.S. Patent and Trademark Office has awarded a patent to Canon for Semiconductor Device and Inkjet Printing Element Substrate. Negishi Toshio developed the invention. The patent application number is US202418673427 20240524. The patent publication number is US12770701 (B2). International Patent Classifica..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- SK Hynix has been granted a patent for Memory Device Performing Program Operation and Method of Operating the Same. Lee Hee Youl developed the invention. The patent application number is US202418417552 20240119. The patent publication number is US12770698 (B2). International Patent Classification codes ar..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- KIOXIA has obtained a patent for semiconductor memory device and method for controlling semiconductor memory device. This invention was developed by Schlykow Viktoria Diana and Tanaka Reika. The patent application number is US202418638788 20240418. The patent publication number is US12770695 (B2). Interna..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- U.S. Patent and Trademark Office has awarded a patent to Ferroelectric Memory for Cell Operation Circuit and Memory Device. Villa Corrado, Palludo Alessandro and Paone Luigi developed the invention. The patent application number is US202418985930 20241218. The patent publication number is US12770668 (B2)...

Semiconductor

  |  Sun 25 Oct 2026

Beijing, Oct. 24 -- Henan Kangtai Micro Powder Co Ltd has been granted a patent for Synthesizer for High-performance Silicon Carbide Nano Powder. Cui Feng developed the invention. The patent application number is CN202520333660U 20250228. The patent publication number is CN223887993 (U). International Patent Classification co..

Semiconductor

  |  Sun 25 Oct 2026

Beijing, Oct. 24 -- Jiujiang Dongqing Fireproof Tech Co Ltd has obtained a patent for stirring and mixing device for silicon carbide production and processing. This invention was developed by Chen Chen and Chen Jie. The patent application number is CN202520312449U 20250226. The patent publication number is CN223887836 (U). In..

Semiconductor

  |  Sun 25 Oct 2026

Beijing, Oct. 24 -- State Intellectual Property Office of China has awarded a patent to Huaian Kaiyue Tech Development Co Ltd for Mixing Device for Producing Organic Silicon Surface Treating Agent. Li Haoyang, Zhang Feng, Ni Lingli, Zhen Leilei and Li Guijun developed the invention. The patent application number is CN20252046..

Semiconductor

  |  Sun 25 Oct 2026

Beijing, Oct. 24 -- Shanghai Zhuanghong Machinery Co Ltd has been granted a patent for Quick-release Roller of Semiconductor Wafer Mixing Equipment. This invention was developed by Liu Shanshan. The patent application number is CN202520292277U 20250224. The patent publication number is CN223887805 (U). International Patent Cl..

Semiconductor

  |  Sun 25 Oct 2026

Beijing, Oct. 24 -- Jilian Nantong Electronic Tech Co Ltd has been granted a patent for Adsorption Type Tail Gas Treatment Equipment for Semiconductor. This invention was developed by Ben Jin. The patent application number is CN202423224096U 20241226. The patent publication number is CN223887666 (U). International Patent Clas..

Semiconductor

  |  Sun 25 Oct 2026

Beijing, Oct. 24 -- Qinghai Huaxin Silicon Ind Co Ltd has been awarded a patent for Cooling Water Recycling Water-saving Device for Industrial Silicon Smelting Furnace. This invention was developed by Li Caiying, Zhao Shengyu, An Zongquan and Yan Gaoding. The patent application number is CN202520393360U 20250307. The patent p..

Semiconductor

  |  Sun 25 Oct 2026

Beijing, Oct. 24 -- Shandong Hongda Electroplating Ind Park Co Ltd has been granted a patent for Solid-liquid Separation Device for Electroplating Sewage Treatment. Zhao You, Zhang Guangbiao, Zhang Ximin, Yu Jingfeng and Liu Yuye developed the invention. The patent application number is CN202520370032U 20250305. The patent pu..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- State Intellectual Property Office of China has received Guangdong Sygole Intelligent Tech Co Ltd patent application for Electrofluid Ejection Chip and Forming Method Thereof. Zeng Ming, Ji Junwang, Lin Yincheng, Zhu Xiaohui and Cui Haipeng developed the invention. The patent application number is CN202610..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Semiconductor Components Industries has secured a patent on Simplified Thermal Model for Electronic Fuse. De Cock Bart developed the invention. The patent application number is US202418974237 20241209. The patent publication number is US12771113 (B2). International Patent Classification codes are H02H1/00..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Furukawa Electric has received a patent for Semiconductor Device. This invention was developed by Wakaba Masaki and Maruyama Kazuomi. The patent application number is US202217814112 20220721. The patent publication number is US12771094 (B2). International Patent Classification codes are H01S5/024, H01S5..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Nichia has been awarded a patent for Plurality of Light-emitting Devices, and Light-emitting Module. This invention was developed by Enomoto Kiyoshi and Okahisa Eiichiro. The patent application number is US202318356092 20230720. The patent publication number is US12771092 (B2). International Patent Clas..

Semiconductor

  |  Sun 25 Oct 2026

Beijing, Oct. 24 -- Uhoyan Technology Suzhou has been awarded a patent for Developing Machine Gluing Mechanism for Circuit Board Processing. This invention was developed by Zhou Xiubin and An Liyu. The patent application number is CN20252044093U 20250109. The patent publication number is CN223888331 (U). International Patent Cl..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- QuantumCTek has been granted a patent for Filter Plate Assembly and Narrow-band Filter. Du Xianchang, Chen Pixiao, Wang Bin, Dong Jun, Xiao Daozhong, Tang Shibiao and Wang Hang developed the invention. The patent application number is CN202520598723U 20250328. The patent publication number is CN223883800 (..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Taiwan Semiconductor Manufacturing has been awarded a patent for Integrated Die. This invention was developed by Liu Weigang, Lu Haoyan, Tang Chengzhe and Xu Yingjie. The patent application number is CN202520405231U 20250310. The patent publication number is CN223883797 (U). International Patent Classificati..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- State Intellectual Property Office of China has awarded a patent to State Power Investment Heli Chuangxin Wuxi Tech Co Ltd for Novel Beam Current Testing Device for Wafer Proton Irradiation Production Line. Jiang Hejia, Bao Guozhu, Wang Mengtao, Wang Xiaoyu and Gui Zhengya developed the invention. The pate..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Focuslight Technologies has been granted a patent for Laser Emitting Device and Laser Radar. This invention was developed by Zhang Hongwei and Zhang Hao. The patent application number is CN202520194283U 20250207. The patent publication number is CN223883758 (U). International Patent Classification codes ar..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- State Intellectual Property Office of China has awarded a patent to Shanghai Dongyuan Integrated Circuit for Field Effect Transistor Chip Test Fixture with Appearance Damage Prevention Structure. Fu Yaofang and Wang Ping developed the invention. The patent application number is CN20252049657U 20250109. The p..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Beijing Sinodynetest Science & Tech Co Ltd has been granted a patent for Positioning Mechanism of Objective Table for Chip Testing. This invention was developed by Zhao Yongfeng and Yang Liangchun. The patent application number is CN20252026623U 20250107. The patent publication number is CN223883614 (U). I..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Tokyo Electron has been granted a patent for Processing System. Tokairin Kento developed the invention. The patent application number is US202418624410 20240402. The patent publication number is US12766739 (B2). International Patent Classification codes are B25J11/00, B25J13/08, B25J15/00, B25J15/06 and B..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- SUMCO Corporation has been granted a patent for Substrate Transfer System. This invention was developed by Maruyama Kento and Takushima Takayoshi. The patent application number is US202519008939 20250103. The patent publication number is US12766726 (B2). International Patent Classification codes are B25J1..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Tokyo Electron has been awarded a patent for Temperature Control System and Plasma Processing System. This invention was developed by Chiba Kazuhiro and Sakai Hayato. The patent application number is US202519058027 20250220. The patent publication number is US12770845 (B2). International Patent Classifica..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Tokyo Electron has secured a patent on Plasma Control Method, Plasma Processing Apparatus and Plasma Processing System. Matsumoto Yohei developed the invention. The patent application number is US202418917083 20241016. The patent publication number is US12770826 (B2). International Patent Classification c..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Tokyo Electron has been granted a patent for Plasma Processing Apparatus. Hirayama Masaki and Taniike Yasuaki developed the invention. The patent application number is US202218553337 20220325. The patent publication number is US12770825 (B2). International Patent Classification code is H01J37/32. Cooperat..

Semiconductor

  |  Sun 25 Oct 2026

Beijing, Oct. 24 -- Zhongxin Taihe Yiyuan Electronic Mat Co Ltd has been awarded a patent for Die Bond Glue Dispensing Device for Chip Bonding. This invention was developed by Wang Cheng, Niu Mingjian and Yang Donghui. The patent application number is CN202520101791U 20250116. The patent publication number is CN223888383 (U)...

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Zhejiang Ruifeng Electronic Tech Co Ltd has been granted a patent for Tool for Testing Chip. Wang Lansong and Xiang Xinmin developed the invention. The patent application number is CN202520241023U 20250214. The patent publication number is CN223883709 (U). International Patent Classification codes are G01R..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Shanghai Aiwei Integrated Circuit Tech Co Ltd has obtained a patent for connecting device, semiconductor testing machine case, testing host and semiconductor testing machine. This invention was developed by Fan Hongbin, Yan Kaifeng and Jia Liuwei. The patent application number is CN202520108682U 20250116. ..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Suzhou Zhande Automation Equipment has obtained a patent for insulation and voltage resistance testing mechanism for PCB (Printed circuit board) substrate. This invention was developed by Di Jianke and Yang Chenguang. The patent application number is CN202520190537U 20250207. The patent publication number ..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Suzhou Shuangcai Biotechnology Co Ltd has obtained a patent for micro-fluidic chip loading detection device. This invention was developed by Wu Xudong and Shuai Yu. The patent application number is CN202423102866U 20241216. The patent publication number is CN223883462 (U). International Patent Classificati..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- State Intellectual Property Office of China has published Kunshan Korbe Prec Equipment Co Ltd patent application for Liquid Alloy Pressurizing and Leveling Device for Silicon Wafer Through Hole Filling. The invention was developed by Wang Wansheng. The patent application number is CN202610874124 20260617. ..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- U.S. Patent and Trademark Office has awarded a patent to Siemens for Circuit Breaker and Method. Tannhäuser Marvin developed the invention. The patent application number is US202218696498 20220916. The patent publication number is US12770805 (B2). International Patent Classification code is H01H9/54. C..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Taiwan Semiconductor Manufacturing has obtained a patent for polish apparatus and methods for use. This invention was developed by Jangjian Peng-chung and Yen Chia-hsiang. The patent application number is US202318318075 20230516. The patent publication number is US12766664 (B2). International Patent Class..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- ChangXin Memory Technologies has secured a patent on Method and Apparatus for Analog Simulation of Circuit Model, Computer Device, and Storage Medium. Li Yu and Zhao Beiyou developed the invention. The patent application number is US202217847190 20220623. The patent publication number is US12769918 (B2)..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Realtek Semiconductor Corporation has obtained a patent for margin calibration method and margin calibration system for static timing analysis. This invention was developed by Yu Mei-li, Lo Yu-lan and Chen Ying-chieh. The patent application number is US202318150767 20230105. The patent publication number ..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- Samsung Electronics has been awarded a patent for Method of Semiconductor Process Simulation. This invention was developed by Kotakemori Hisashi, Yi Shinwook, Lee Yuntae and Tsuji Yukihide. The patent application number is US202318534184 20231208. The patent publication number is US12769905 (B2). Internat..

Semiconductor

  |  Sun 25 Oct 2026

Beijing, Oct. 24 -- Ensoo Taizhou Chemicals Co Ltd has been awarded a patent for Filter Press for Preparing Chemical Nickel for Electroplating. This invention was developed by He Lixin and Xu Fangqing. The patent application number is CN202423253384U 20241228. The patent publication number is CN223888010 (U). International Pa..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Guangdong Ada Semiconductor Equipment Co Ltd has submitted a patent application for Method and System for Stabilizing Wire Arcs of IC Chip and Memory Chip of Wire Bonding Machine. This invention was developed by Li Haiyuan, He Yunbo, Ji Haizhong and Wu Yuxuan. The patent application number is CN20261074623..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- NVIDIA has been awarded a patent for Logic Cell Placement Mechanisms for Improved Clock On-chip Variation. This invention was developed by Brown David Lyndell, Welty Erik and Rajaram Anand Kumar. The patent application number is US202318178375 20230303. The patent publication number is US12769924 (B2). In..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- United States Patent for Modeling Mandrel Tolerance in a Design of a Semiconductor Device has been issued to Synopsys. This invention was developed by Paasschens Jeroen Clemens Jozef, Movsisyan Gohar, Woon-fat Amanda, Barwin John E and Vaz Oliveira Marco Miguel. The patent application number is US20231812..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Hongzhan Kechuang Shenzhen Tech Co Ltd has submitted a patent application for Cutting and Separating Structure for Packaging Tf Card Chip. This invention was developed by Xie Hu and Xu Yi. The patent application number is CN202610527546 20260421. The patent publication number is CN122378281 (A). Internatio..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- NVIDIA has been awarded a patent for Neural Networks to Indicate Data Dependencies. This invention was developed by Law Marc Teva and Lucas James Robert. The patent application number is US202318098015 20230117. The patent publication number is US12769790 (B2). International Patent Classification codes ar..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Xiamen Xingke Electronic has submitted a patent application for Flexible Integrated Circuit Board Processing Equipment and Process. Luo Chunlin, Luo Chunquan, Zhang Kedong and Xia Hanqiao developed the invention. The patent application number is CN202610870836 20260616. The patent publication number is CN122..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Zhejiang Shicheng Household Co Ltd has submitted a patent application for Wood Board Cutting Device Capable of Effectively Solving Board Edge Pasting Problem. Ma Bin, Li Xiang and Li Guogang developed the invention. The patent application number is CN202610800098 20260604. The patent publication number is ..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Saier Tech Rudong Co Ltd has applied Chinese patent for Directional Porous Structure Regulated Silicon Carbide Wafer Low-damage Thinning Grinding Wheel and Preparation Method Thereof. Ran Longguang, Wu Qiang and Wang Yubo developed it. The patent application number is CN202610639299 20260511. The patent pu..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- U.S. Patent and Trademark Office has awarded a patent to NVIDIA for Epipolar Constraint-based Cross-camera Calibration Validation. Miao Hsin, Wu Yue, Pan Gang, Lupashin Sergei, Park Minwoo, Sen Ayon, Lipashin Sergei and Tevs Art developed the invention. The patent application number is US202418609302 2024..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- KIOXIA has secured a patent on Semiconductor Image Processing Apparatus and Semiconductor Image Processing Method. Fujiwara Takeshi, Ohashi Takuji, Ng Youyang, Lin Yuchieh, Yamane Osamu and Iijima Shuhei developed the invention. The patent application number is US202418589658 20240228. The patent publicat..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- NVIDIA has received a patent for Training One or More Neural Networks Using Synthetic Data. This invention was developed by Catanzaro Bryan, Tao Andrew, Pottorff Robert and Liu Shiqiu. The patent application number is US202017080503 20201026. The patent publication number is US12770209 (B2). International..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- NVIDIA has secured a patent on Combinational Logic-based Serializer. De Keulenaer Timothy and Pierco Ramses developed the invention. The patent application number is US202318485827 20231012. The patent publication number is US12769695 (B2). International Patent Classification codes are G06F1/04 and G06F13..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- U.S. Patent and Trademark Office has awarded a patent to Samsung Electronics for Memory Device and System for Performing Address Translation. Ostapenko Maksim, Oh Deok Jae and Shin Youngsam developed the invention. The patent application number is US202418969835 20241205. The patent publication number i..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- U.S. Patent and Trademark Office has awarded a patent to KIOXIA for Memory Device and Memory System. Nakasone Osamu developed the invention. The patent application number is US202418981086 20241213. The patent publication number is US12769650 (B2). International Patent Classification codes are G06F12/02..

Semiconductor

  |  Sun 25 Oct 2026

Beijing, Oct. 24 -- Chinese Patent for Intelligent Fire Extinguishing Device for Semiconductor Production Workshop has been issued to Zhongke Tongde Microelectronics Tech Datong Co Ltd. This invention was developed by Wang Jian and Zhang Wei. The patent application number is CN202520209648U 20250210. The patent publication nu..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Zhejiang Jibao Intelligent Equipment has submitted a patent application for Intelligent Control System and Method for Chip Removal Based on Machining Center. This invention was developed by Dong Linqiang, Xu Jiapeng and Meng Fancheng. The patent application number is CN202610664918 20260514. The patent publi..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Hangzhou Zhixin Semiconductor Co Ltd has submitted a patent application for Semiconductor Wafer Pedestal Roughness Detection Tool and Detection Method. This invention was developed by Ye Dingyun and Ni Xiaofeng. The patent application number is CN202511887846 20251215. The patent publication number is CN12..

Semiconductor

  |  Sat 24 Oct 2026

Alexandria, Oct. 24 -- Intel has been awarded a patent for Photonic Integrated Circuit Packages Including Substrates with Glass Cores. This invention was developed by Li Xiaoqian. The patent application number is US202218058996 20221128. The patent publication number is US12769052 (B2). International Patent Classification codes..

Semiconductor

  |  Sat 24 Oct 2026

Alexandria, Oct. 24 -- Sony Semiconductor Solutions Corporation has secured a patent on Communication Apparatus, Communication System, and Key Opening/closing Controlling Method. Nakano Hiroaki developed the invention. The patent application number is US202118016741 20210622. The patent publication number is US12768981 (B2). ..

Semiconductor

  |  Sat 24 Oct 2026

Alexandria, Oct. 24 -- U.S. Patent and Trademark Office has awarded a patent to Realtek Semiconductor Corporation for Circuit and Method for Handling Wireless Sensing. Chang Chung-yao and Lin Chuan-hu developed the invention. The patent application number is US202418908818 20241008. The patent publication number is US12768941 (..

Semiconductor

  |  Sat 24 Oct 2026

Alexandria, Oct. 24 -- U.S. Patent and Trademark Office has awarded a patent to Calterah Semiconductor Technology, Shanghai for Signal Processing Method and Device, Radar, Medium, Program Product and Terminal. Chen Yi, Zhu Tongyu, Cheng Yige, Zhang Lei, Wang Xiao, Yu Zengyu, Dai Lanfeng and Ma Yi developed the invention. The ..

Semiconductor

  |  Sat 24 Oct 2026

Alexandria, Oct. 24 -- Tokyo Electron has been awarded a patent for Testing Apparatus and Testing Method. This invention was developed by Nakayama Hiroyuki. The patent application number is US202418950883 20241118. The patent publication number is US12768799 (B2). International Patent Classification codes are G01M11/02, G01N21/..

Semiconductor

  |  Sat 24 Oct 2026

Alexandria, Oct. 24 -- Taiwan-Asia Semiconductor has secured a patent on Optical Sensing Device and Method for Manufacturing the Same. Dai Shu-wen and Tsai Fu-yung developed the invention. The patent application number is US202418765797 20240708. The patent publication number is US12768782 (B2). International Patent Classific..

Semiconductor

  |  Sat 24 Oct 2026

Alexandria, Oct. 24 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan-Asia Semiconductor for Infrared Light Sensing Device. Chang Yen-hsiang, Lin Tzu-hui and Chen Sheng-wei developed the invention. The patent application number is US202318532673 20231207. The patent publication number is US12768717 (B2). Inte..

Semiconductor

  |  Sat 24 Oct 2026

Alexandria, Oct. 24 -- United States Patent for Substrate Processing Apparatus and Method of Processing a Substrate Using the Same has been issued to Samsung Electronics. This invention was developed by Park Ji Hwan, Lee Kuntack and Park Sangjine. The patent application number is US202318095125 20230110. The patent publication ..

Semiconductor

  |  Sun 25 Oct 2026

Alexandria, Oct. 24 -- IUCF-HYU Industry University Cooperation Foundation Hanyang University , Research & Business Foundation Sungkyunkwan University, IUCF-HYU and Research & Business Found Sungkyunkwan University have received a patent for 3D Neuromorphic System and Operating Method Thereof. This invention was developed by Se..

Semiconductor

  |  Sun 25 Oct 2026

Beijing, Oct. 24 -- Dongguan Muyou Hardware Electromechanical Co Ltd has been granted a patent for Rapid Inclined Hole Clamping Puncher Facilitating Chip Removal. This invention was developed by Zhou Jun. The patent application number is CN202423186665U 20241224. The patent publication number is CN223890165 (U). International..

Semiconductor

  |  Sun 25 Oct 2026

Beijing, Oct. 24 -- State Intellectual Property Office of China has awarded a patent to Laplace Wuxi Semiconductor Technology for Sucker Assembly, Manipulator and Processing Equipment. Dong Xuedi, Li Bo, Zhu Henan and Kong Qi developed the invention. The patent application number is CN202520560019U 20250327. The patent public..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Guangzhou Zengxin Technology has secured a patent on Semiconductor Structure. Luo Jinlu developed the invention. The patent application number is CN202520436337U 20250312. The patent publication number is CN223885640 (U). International Patent Classification codes are H10W72/00 and H10W74/10. The abstra..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- State Intellectual Property Office of China has awarded a patent to STMicroelectronics International for Electronic Component. Fallood Lionel developed the invention. The patent application number is CN202422863772U 20241122. The patent publication number is CN223885635 (U). International Patent Classificati..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Taiwan Semiconductor Manufacturing has obtained a patent for integrated circuit. This invention was developed by Isa Tatsuyasu, Bao Xinyu and Yamamowazeri. The patent application number is CN202423237082U 20241226. The patent publication number is CN223885629 (U). International Patent Classification codes ar..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Chinese Patent for High-efficiency Heat Dissipation Chip Packaging Structure has been issued to Shanghai Benxin Semiconductor Tech Co Ltd. This invention was developed by An Hao and Li Meihua. The patent application number is CN202520456525U 20250317. The patent publication number is CN223885627 (U). Inter..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Hangzhou Luntek Tech Co Ltd has been awarded a patent for Test Equipment for Vehicle Gauge Level AI Chip. This invention was developed by Xu Zhenglei, Liu Endian and Sun Tiantian. The patent application number is CN202520374846U 20250305. The patent publication number is CN223885626 (U). International Pate..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- State Intellectual Property Office of China has awarded a patent to Nanjing Milimite Electronic Tech Co Ltd for Fixing Piece for Chip Packaging. Qian Cheng developed the invention. The patent application number is CN202520455019U 20250317. The patent publication number is CN223885621 (U). International Pat..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Shenzhen Pengai Semiconductor Co Ltd has obtained a patent for plastic package chip detection device. This invention was developed by Chen Huanming and Liu Moudi. The patent application number is CN202520486270U 20250319. The patent publication number is CN223885615 (U). International Patent Classification..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Chinese Patent for Cleaning Equipment of Semiconductor Manufacturing Equipment has been issued to Yunie Shanghai Semiconductor Technology. This invention was developed by Yu Jianbo and Lu Lang. The patent application number is CN20252089025U 20250114. The patent publication number is CN223885610 (U). Interna..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- State Intellectual Property Office of China has awarded a patent to Jingan Optoelectronics Co Ltd for Substrate, Semiconductor Device and Polishing Disk. Zeng Baixiang, Yang Shengyu, Zhang Jiahao, Xie Binhui and Hong Jiayue developed the invention. The patent application number is CN202422995898U 20241205...

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- State Intellectual Property Office of China has awarded a patent to Cgn Jingshi Photoelectric Tech Tianjin Co Ltd for Packaging Structure of Photoelectric Detection Chip. Wang Fei, Liu Yuxiao, Su Gang, Yu Kaixin and Liu Wanning developed the invention. The patent application number is CN202520181313U 20250..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Suzhou Fu Jia Lin Automation Tech Co Ltd has been granted a patent for Full-automatic Surface Mounting Equipment for Gallium Arsenide Battery. Zhang Zonghong, Liu Tingliang and Wang Dunzhou developed the invention. The patent application number is CN202520506297U 20250321. The patent publication number is ..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Taiwan Semiconductor Manufacturing has been granted a patent for Light Detection Element, Heterojunction Element, and Semiconductor Element. Chen Xianglin, Wang Zirui, Huang Shimin, Wang Quanzhong and Zhu Yixin developed the invention. The patent application number is CN20252014992U 20250103. The patent publ..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Chongqing Yuntong Technology has been granted a patent for Terminal Structure and Power Semiconductor Device. This invention was developed by Liao Guangchao and Wei Qiuyuan. The patent application number is CN202520329382U 20250227. The patent publication number is CN223885553 (U). International Patent Class..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- State Intellectual Property Office of China has awarded a patent to Jingan Optoelectronics Co Ltd for Substrate and Semiconductor Device. Zeng Baixiang, Luo Jiancheng, Yang Shengyu, Zhang Jiahao, Xie Binhui, Huang Rikui, Hong Jiayue and Fu Guiqing developed the invention. The patent application number is C..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- State Intellectual Property Office of China has awarded a patent to Beijing Huairou Laboratory for Cell Structure and Device Layout of Schottky Diode. He Yawei, Xu Kaixuan, Li Xinyu, Lu Yaqi, Dong Shaohua, Xie Jianfang, Jin Rui, Niu Xiping, Sang Ling and Li Zheyang developed the invention. The patent appli..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Chinese Patent for Semiconductor Structure has been issued to Taiwan Semiconductor Manufacturing. This invention was developed by Xie Zhihong, Yu Diansheng, Pan Guohua, Zhong Jiahe and Lin Zhiyong. The patent application number is CN202423184097U 20241223. The patent publication number is CN223885546 (U). In..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Flextronics Manufacturing (Zhuhai) has received a patent for Feida Material Belt Dismounting Device for Asm Chip Mounter on SMT Production Line. This invention was developed by Tang Changjie, Ni Xiangyang, Zheng Wei and Zhao Jiangjiang. The patent application number is CN202520425613U 20250311. The patent pu..

Semiconductor

  |  Sat 24 Oct 2026

Beijing, Oct. 24 -- Guangdong China Techwin Prec Machinery Co Ltd has secured a patent on Anti-displacement Chip Mounter of SMT Chip Mounter. Nie Xuhui and Yang Lianghui developed the invention. The patent application number is CN202520333088U 20250227. The patent publication number is CN223885540 (U). International Patent Cl..
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