Semiconductor
| Sat 28 Mar 2026
Beijing, March 28 -- Beijing Smartchip Microelectronics Technology has submitted a patent application for Three-dimensional Hall Element and Preparation Method Thereof, Electronic Device, Chip and Electronic Equipment. Jiang Shuai, Sun Hengchao, Du Jun, Li Tenghao, Fang Dongming, Zang Zhicheng, Li Peixiao, Liu Ziwei, Wang Manron..