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Samsung Electronics

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(39)

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(35)

(32)

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(25)

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(25)

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(24)

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(21)

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(19)

SCREEN Holdings

(16)

(15)

Texas Instruments Incorpo

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(14)

(13)

Nanya Technology

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(11)

(11)

Hoya Lens Thailand

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(9)

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(9)

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Semiconductor Manufacturi

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(7)

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(7)

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(6)

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(6)

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(6)

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(6)

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(6)

Wuhan China Star Optoelec

(6)

Zhejiang University

(6)

Beijing ESWIN Computing T

(5)

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(5)

ChangXin Technology Group

(5)

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(5)

(5)

GlobalFoundries

(5)

Institute of Semiconducto

(5)

(5)

(5)

(5)

Semiconductor Components

(5)

Shanghai Huali Integrated

(5)

Southeast University; CSM

(5)

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(5)

Toshiba; Toshiba Electron

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(4)

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(4)

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(4)

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(4)

Beijing Smartchip Microel

(4)

Chongqing University

(4)

Eugene Technology

(4)

Hefei Nexchip Integrated

(4)

(4)

(4)

(4)

NuFlare Technology

(4)

(4)

Silergy Semiconductor Tec

(4)

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The Spot Laboratory

(4)

(3)

ASM International Holding

(3)

Advanced Semiconductor En

(3)

(3)

Changchun Changguang Fine

(3)

(3)

(3)

Forehope Semiconductor Ni

(3)

(3)

Guilin University of Elec

(3)

Guojing Hechuang Qingdao

(3)

Hebei Dingci Electronic T

(3)

Hisense Home Appliances G

(3)

Huahong Semiconductor, Wu

(3)

Huazhong University of Sc

(3)

IRICO Hefei LCD Glass

(3)

Jiangsu Shenzhou Semicond

(3)

KK Nihon Micronics

(3)

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(3)

(3)

Microsoft Technology Lice

(3)

(3)

NAMICS Corporation

(3)

(3)

Nanjing University

(3)

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(3)

Nihon Micronics

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(3)

Peoples Life Insurance Co

(3)

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(3)

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(3)

(3)

(3)

Samsung Display

(3)

Seoul Semiconductor

(3)

(3)

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(3)

Shinko Electric Industrie

(3)

(3)

Soochow University

(3)

Spreadtrum Semiconductor

(3)

(3)

Tsinghua University

(3)

Wuhan China Star Optoelec

(3)

Wushi Microelectronics Su

(3)

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(3)

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(3)

(3)

Yongjiang Laboratory

(3)

Youl Chon Chemical Co Ltd

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(2)

Advanced Semiconductor Pt

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Applied Materials Israel

(2)

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(2)

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(2)

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(2)

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(2)

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(2)

(2)

Changchun Institute of Op

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(2)

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(2)

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(2)

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(2)

Dabo Tech Shanghai Co Ltd

(2)

Daikin Youke Co Ltd

(2)

(2)

(2)

East China University of

(2)

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(2)

GalaxyCore Shanghai

(2)

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(2)

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(2)

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Hefei Ingenic Technology

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(2)

Inno Saike (Suzhou) Semic

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Innovation Academy For Mi

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Institute of Microelectro

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(2)

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(2)

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(2)

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(2)

Jinan University

(2)

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(2)

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(2)

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(2)

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(2)

Micronics Japan Co Ltd

(2)

Murata Manufacturing

(2)

NGK Spark Plugs

(2)

(2)

Nanjing University of Pos

(2)

Nantong Yourui Semiconduc

(2)

National Tsing Hua Univer

(2)

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(2)

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(2)

(2)

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(2)

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(2)

No 707 Institute China St

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(2)

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Origin Quantum Computing

(2)

Panasonic Holdings

(2)

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Peking University

(2)

Qingdao Lianzhi Optical C

(2)

(2)

(2)

(2)

Renesas Electronics

(2)

Rockwell Collins

(2)

Rongyao Terminal

(2)

Ruishi Chuangxin Shenzhen

(2)

SJ Semiconductor, Jiangyi

(2)

SK Hynix Nand Product Sol

(2)

STMicroelectronics Intern

(2)

Sandisk Tech Llc [us]; Sa

(2)

Sanechips Technology

(2)

(2)

Semiconductor Mfg Int Bei

(2)

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(2)

Shanghai Huali Integrated

(2)

Shanghai Institute of Mic

(2)

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(2)

Shanghai Shenming Aosi Se

(2)

Shanghai Weishi Semicondu

(2)

Shanghai Xinwei Semicondu

(2)

(2)

Shenzhen Ruiwowei Semicon

(2)

Shenzhen South China Micr

(2)

Shenzhen State Microchip

(2)

Shenzhen University

(2)

Shinetsu Chemical

(2)

Sichuan Honasoft Tech Co

(2)

Silicon Storage Technolog

(2)

Southern Power Grid New E

(2)

Sun Yat-sen University

(2)

Suzhou Lingwei Electronic

(2)

Suzhou Xixing Semiconduct

(2)

TCL China Star Optoelectr

(2)

TRUMPF Lasersystems for S

(2)

Taiwan Semiconductor Mfg

(2)

Taiwan Semiconductor Mfg

(2)

Toppan Holdings

(2)

Toray Industries

(2)

Unilumin Group; Guangdong

(2)

(2)

Winbond Electronics

(2)

(2)

Wondersolar Co Ltd

(2)

Wuhan Bright Diode Lasers

(2)

Wuhan Shantuo Microelectr

(2)

Wuhan Xinxin Semiconducto

(2)

Wuxi Sfr Semiconductors I

(2)

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(2)

Xinmai Semiconductor Tech

(2)

Yield Engineering Systems

(2)

Zhejiang Aoshou Material

(2)

Zhengzhou University

(2)

Zhiju Semiconductor Nanto

(2)

Zhongke Shenzhen Wireless

(2)

Zing Semiconductor

(2)

Zing Semiconductor; Taiyu

(2)

ams-OSRAM International

(2)

1qb Information Tech Inc

(1)

3peak Incorporated

(1)

ACM Research, Shanghai; S

(1)

Abov Semiconductor Co Ltd

(1)

Accelink Technologies

(1)

Accelink Technologies; Wu

(1)

Acm Res Shanghai Inc [cn]

(1)

Actions Technology

(1)

Adeia Semiconductor Techn

(1)

Advanced Micro Devices

(1)

(1)

(1)

Ailibi Semiconductor Equi

(1)

Alliance For Sustainable

(1)

Amkor Technology Singapor

(1)

Ams Sensors Belgium Bv

(1)

Angell Technology

(1)

Anhui Baiqiang Tech Co Lt

(1)

Anhui Dongxun Sealing Tec

(1)

Anhui Haoou Electronic Te

(1)

Anhui Hui Ning Elec Instr

(1)

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(1)

Anhui Sanan Optoelectroni

(1)

Anhui University

(1)

Anli Tech Suzhou Co Ltd

(1)

Applied Materials; Nation

(1)

(1)

Asml Netherlands B V [nl]

(1)

Avago Technologies Genera

(1)

BOE Crystal Core Technolo

(1)

BOE Technology Group; Cho

(1)

Baoji Top Titanium Ind Co

(1)

Beijing Aurasky Electroni

(1)

Beijing Baige Feichi Tech

(1)

Beijing Bige Bosi Informa

(1)

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(1)

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(1)

Beijing Boe Sensor Tech C

(1)

Beijing Chaoxian Memory R

(1)

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Beijing ESWIN Computing T

(1)

Beijing Eswin Computing T

(1)

Beijing Honeycomb Century

(1)

Beijing Horizon Informati

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Beijing Huading Ruixin Te

(1)

Beijing Huakun Zhenyu Int

(1)

Beijing Ic East Semicondu

(1)

Beijing Institute of Comp

(1)

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(1)

Beijing Intellectual Prop

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Beijing Jingge Lingyu Sem

(1)

Beijing Jixieji Tech Co L

(1)

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(1)

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(1)

Beijing North Shitong Tec

(1)

Beijing Qingyun Tech Co L

(1)

Beijing Semiconductor Spe

(1)

Beijing Tesidi Semiconduc

(1)

Beijing University of Che

(1)

Beijing University of Pos

(1)

Beijing University of Tec

(1)

Beijing University; Hefei

(1)

Beijing University; Shang

(1)

Beijing Xiaomi Mobile Sof

(1)

Beijing Xiaomi Mobile Sof

(1)

Beijing Xulun Tech Co Ltd

(1)

Beijing Yuanfengcheng Tec

(1)

Beijing Ziguang Qingteng

(1)

(1)

Caihong Display Devices

(1)

Caihong Group; Shaanxi Ca

(1)

(1)

CanSemi Technology

(1)

Cangzhou Hospital Of Inte

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Carbon Chip Microelectron

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(1)

Central South University

(1)

Cgn Isotope Tech Mianyang

(1)

ChangXin Memory Technolog

(1)

Changchun Normal Universi

(1)

Changchun University of S

(1)

Changchun Zhiran Photoele

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Changfei Advanced Semicon

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Changjiang Integrated Cir

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Changsha Baosteel Steel P

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Changshu CSI Advanced Sol

(1)

Chengdu Chenwei Xunchi Te

(1)

Chengdu Huarui Shuxin Tec

(1)

Chengdu Lingtong Semicond

(1)

Chengdu Luwei Photoelectr

(1)

Chengdu University of Tec

(1)

Chengdu University; Jingy

(1)

Chengdu Yisiwei Computing

(1)

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China Electronics Technol

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China Jiliang University

(1)

China Jiliang University;

(1)

China Resources Microelec

(1)

China Three Gorges; Three

(1)

Chinese PLA Army Speciali

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ChipSemi Semiconductor, N

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Chipone Technology, Beiji

(1)

Chizhou Jucheng Electroni

(1)

Chn Energy Ledong Power G

(1)

Chonghui Semiconductor Ji

(1)

Chongqing Jinxin Maisi Se

(1)

Chongqing Phoenix Tech Co

(1)

Chongqing Sanxia Paints C

(1)

Chongqing Southwest Integ

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Chongqing Xinlian Microel

(1)

Chuangyuan Xinke Shanghai

(1)

Chugoku Marine Paints

(1)

Chuzhou Jietai New Energy

(1)

Chuzhou University; Anhui

(1)

Chuzhou Yinxing New Mat C

(1)

Circuit Tech Machinery Eq

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Cirrus Logic Int Semicond

(1)

(1)

Citizen Electronics; Citi

(1)

City University of Hong K

(1)

(1)

Commissariat Energie Atom

(1)

Continental Automotive Sy

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Cosmax China Inc

(1)

(1)

Crosschip Microsystems In

(1)

(1)

Cyge Electronic Tech Huna

(1)

Cypress Semiconductor Cor

(1)

(1)

Dainippon Ink & Chemicals

(1)

Dalian University of Tech

(1)

(1)

Delo Ind Klebstoffe Gmbh

(1)

Diodes Incorporated

(1)

Diodes Taiwan Inc

(1)

Dongguan Jinyu Semiconduc

(1)

Dongguan Shunluo Hongzhi

(1)

Dongguan Tlc Electronic T

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(1)

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(1)

Double Crane Beijing Biot

(1)

(1)

Dual Strategies Llc

(1)

E Song Emc Co Ltd

(1)

EV Group E Thallner

(1)

East China University of

(1)

Effect Photonics B V

(1)

Electric Power Research I

(1)

(1)

Episil Tech Inc

(1)

Etron Technology; Invent

(1)

Everspin Technologies

(1)

Fasford Technology

(1)

Flowserve Man Co

(1)

Foshan Jinyansheng New Ma

(1)

Foshan Yalanshi Tech Co L

(1)

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(1)

(1)

Fudan University

(1)

Fuhai Equipment Tech Shen

(1)

(1)

Fujian Gaoling Electronic

(1)

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Fujian Zhenjing New Mater

(1)

(1)

(1)

Furukawa Electric; Furuka

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Fuzhou University

(1)

GCL System Integration Te

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GOWIN Semiconductor

(1)

Galaxy Semiconductor Co L

(1)

Gallium International Ltd

(1)

Ganzhou Yihao New Mat Co

(1)

Giga Force Electronics Co

(1)

(1)

GlobalFoundries Singapore

(1)

(1)

Gowin Semiconductor Corp

(1)

(1)

Guangdong Jiangxinchuang

(1)

Guangdong Midea Refrigera

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Guangdong Mingyang Film T

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Guangdong Poloma New Mate

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Guangdong Yunguo Supply C

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Guangxi Technological Col

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Guangzhou Ankai Microelec

(1)

Guangzhou Institute of Ge

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Guangzhou Qikuan Informat

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Guilin Leiguang Tech Co L

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Guilin University of Elec

(1)

Guohong Shenzhen Optoelec

(1)

(1)

Haiguang Information Tech

(1)

Haiguang Integrated Circu

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Hamamatsu Photonics

(1)

Hana Micron Inc

(1)

Hangzhou Bosi Xinyu Tech

(1)

Hangzhou Chaoran Diamond

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Hangzhou Hesheng Tech Co

(1)

Hangzhou Huayi New Mat Co

(1)

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Hangzhou Keneng New Energ

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Hangzhou Leading Thermal

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Hangzhou Luntek Tech Co L

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Hangzhou Xiahesheng Biome

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(1)

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(1)

HannStar Display

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Hanshow Technology

(1)

Hanwha Chemical Co Ltd

(1)

Harbin Institute of Techn

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Harbin Institute of Techn

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Harbin University of Scie

(1)

Hebei Ruisite Precision T

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Hefei Jiufu Semiconductor

(1)

Hefei Junlian Automotive

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Hefei Simple T&m Tech Co

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Hefei University of Techn

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Hefei Zhongju Hecheng Pho

(1)

Hejian Tech Suzhou Co Ltd

(1)

Henan Academy Of Sciences

(1)

Henan Hongchang Electroni

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Heraeus Electronics Gmbh

(1)

Hexu Zhengzhou Biotechnol

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(1)

Hill Fox Co Ltd

(1)

(1)

Hitech Semiconductor Wuxi

(1)

Holtek Semiconductor Chin

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Hongyang Display (Xianyan

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Hongyang Semiconductor Co

(1)

(1)

Hoseo University Academic

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(1)

Hoya Optical Laboratory U

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(1)

Huawei Digital Power Tech

(1)

Huawei Tech Co Ltd [cn];

(1)

Huawei Tech Co Ltd [cn];

(1)

Huawei Technologies; Peki

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Huayi Microelectronics Co

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Huizhou Bester Chemical C

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Hunan Jushi Tech Co Ltd

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Hunan Railway Professiona

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ICleague Technology

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Intel Corp [us]; Guo Yeju

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Ipgoal Microelectronics S

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(1)

(1)

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U.S. Patent and Trademark Office Releases Metapwr Electronics Co Ltd Patent Application for High-integrated Substrate Manufacturing Method Therefor, and Power Module

Semiconductor

| Wed 25 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has released Metapwr Electronics Co Ltd patent application for High-integrated Substrate Manufacturing Method Therefor, and Power Module. This invention was developed by Hong Shouyu, Liu Hongxiu, Chen Qingdong and Zhang Mingzhun. The patent application number is US20251..

U.S. Patent and Trademark Office Releases Kawasaki Heavy Ind Ltd and Kawasaki Robotics USA Inc Patent Application for Substrate Transfer Apparatus

Semiconductor

| Wed 25 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has released Kawasaki Heavy Ind Ltd and Kawasaki Robotics USA Inc patent application for Substrate Transfer Apparatus. This invention was developed by Tan Haruhiko, Wahl Weston, Liu Justin, Bharwani Avish Ashok and Kurata Iori. The patent application number is US2024188..

State Intellectual Property Office of China Releases Shenzhen Boluosi Tech Co Ltd Patent Application for Stacking Packaging Method and System for Ai-dsp Mixed Audio Processing Chip

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Shenzhen Boluosi Tech Co Ltd patent application for Stacking Packaging Method and System for Ai-dsp Mixed Audio Processing Chip. This invention was developed by Wei Xiangcheng and Hu Chengyuan. The patent application number is CN202511105401 2025080..

State Intellectual Property Office of China Releases Suzhou Xintai Semiconductor Tech Co Ltd Patent Application for Directional Cleaning Method for Semiconductor Chip

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Suzhou Xintai Semiconductor Tech Co Ltd patent application for Directional Cleaning Method for Semiconductor Chip. This invention was developed by Wu Mingfang. The patent application number is CN202410548798 20240506. The patent publication number i..

State Intellectual Property Office of China Releases Suzhou Xintai Semiconductor Tech Co Ltd Patent Application for Method for Cleaning Gaps of Semiconductor Chips

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Suzhou Xintai Semiconductor Tech Co Ltd patent application for Method for Cleaning Gaps of Semiconductor Chips. This invention was developed by Wu Mingfang. The patent application number is CN202410548781 20240506. The patent publication number is C..

State Intellectual Property Office of China Releases Nantong Tengyi Precision Tech Co Ltd Patent Application for Microscopic Etching Model Development Method for Wafer Wet Etching

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Nantong Tengyi Precision Tech Co Ltd patent application for Microscopic Etching Model Development Method for Wafer Wet Etching. This invention was developed by Miao Zhigao and Cheng Xiao. The patent application number is CN202511446960 20251011. The..

State Intellectual Property Office of China Receives Zing Semiconductor and Taiyuan Jinke Silicon Material Tech Co Ltd Patent Application for Substrate Transfer Device and Transfer..

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Zing Semiconductor and Taiyuan Jinke Silicon Material Tech Co Ltd patent application for Substrate Transfer Device and Transfer Method. Jiang Junnan, Zhu Yuanfang, Qiu Yaowu, Wang Wei and Yang Yabin developed the invention. The patent application nu..

State Intellectual Property Office of China Receives Zhengzhou Xinghang Tech Co Ltd Patent Application for Method and Structure for Flip Chip Mounting by Using Fow Adhesive Film

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Zhengzhou Xinghang Tech Co Ltd patent application for Method and Structure for Flip Chip Mounting by Using Fow Adhesive Film. Zhao Jialei, Hong Won-gon and Fu Yu developed the invention. The patent application number is CN20251171246 20250731. The p..

State Intellectual Property Office of China Receives Nantong Youtuo New Energy Tech Co Ltd Patent Application for Silicon Wafer Surface High-uniformity Texturing Method Based on Mu..

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Nantong Youtuo New Energy Tech Co Ltd patent application for Silicon Wafer Surface High-uniformity Texturing Method Based on Multi-parameter Coupling Regulation and Control. Xu Jianjun, Zhou Tongyi, Xu Rui and Jin Lili developed the invention. The p..

State Intellectual Property Office of China Publishes Suzhou Xintai Semiconductor Tech Co Ltd Patent Application for Semiconductor Chip Cleaning Method

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Suzhou Xintai Semiconductor Tech Co Ltd patent application for Semiconductor Chip Cleaning Method. The invention was developed by Wu Mingfang. The patent application number is CN202410548821 20240506. The patent publication number is CN120914084 (A..

State Intellectual Property Office of China Publishes Jiangsu Riyu Photovoltaic New Mat Co Ltd Patent Application for Conductive Silver Paste for N-type Solar Cell and Preparation ..

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Jiangsu Riyu Photovoltaic New Mat Co Ltd patent application for Conductive Silver Paste for N-type Solar Cell and Preparation Method and Application Thereof. The invention was developed by Guo Peng, Zheng Jing and Fan Qiuyang. The patent applicatio..

State Intellectual Property Office of China Receives Shanghai Shenming Aosi Semiconductor Tech Co Ltd Patent Application for 1T1PFC Cis-ferroelectric Memory Cell and Memory Array

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Shanghai Shenming Aosi Semiconductor Tech Co Ltd patent application for 1T1PFC Cis-ferroelectric Memory Cell and Memory Array. Zhu Zhilong developed the invention. The patent application number is CN20251165893 20250731. The patent publication numbe..

State Intellectual Property Office of China Publishes Shenzhen Yitoa Intelligent Control Co Ltd Patent Application for Ddic Chip Driving Time Sequence Control Method Supporting Var..

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Shenzhen Yitoa Intelligent Control Co Ltd patent application for Ddic Chip Driving Time Sequence Control Method Supporting Variable Refresh Rate. The invention was developed by Hu Qingzhou. The patent application number is CN202510786261 20250612. ..

Dongguan Yilian Information System Co Ltd Seeks Patent for Ultrathin Chip Suction Method and Device

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Dongguan Yilian Information System Co Ltd has sought patent for Ultrathin Chip Suction Method and Device. This invention was developed by Yang Jibao and Qu Haifeng. The patent application number is CN202511200159 20250826. The patent publication number is CN120914155 (A). International Patent Classificati..

Wushi Microelectronics Suzhou Co Ltd Seeks Patent for High-precision Wafer Bonding Device

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Wushi Microelectronics Suzhou Co Ltd has sought patent for High-precision Wafer Bonding Device. This invention was developed by Wan Shiyuan, Ding Shaochun, Shen Da and Xue Yaling. The patent application number is CN202510944227 20250709. The patent publication number is CN120914133 (A). International Pate..

Wushi Microelectronics Suzhou Co Ltd Seeks Patent for Wafer De-bonding Processing Module and Wafer De-bonding Device

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Wushi Microelectronics Suzhou Co Ltd has sought patent for Wafer De-bonding Processing Module and Wafer De-bonding Device. This invention was developed by Wan Shiyuan, Ding Shaochun, Shen Da and Xue Yaling. The patent application number is CN202510944226 20250709. The patent publication number is CN120914..

Wushi Microelectronics Suzhou Co Ltd Seeks Patent for Cold and Hot Integrated Wafer Processing Device

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Wushi Microelectronics Suzhou Co Ltd has sought patent for Cold and Hot Integrated Wafer Processing Device. This invention was developed by Wan Shiyuan, Qian Biao, Shen Da and Xue Yaling. The patent application number is CN202510885116 20250630. The patent publication number is CN120914131 (A). Internatio..

Nanjing Zhengteng Electronic Tech Co Ltd Applies for Patent on Transformer Silicon Steel Sheet Lamination Tool

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Nanjing Zhengteng Electronic Tech Co Ltd has applied Chinese patent for Transformer Silicon Steel Sheet Lamination Tool. Xie Hui developed it. The patent application number is CN202511367028 20250924. The patent publication number is CN120914020 (A). International Patent Classification codes are H01F27/24..

Shenzhen Haoyun Tech Co Ltd Applies for Patent on Led Display Screen Based on Integrated Chip and Control System

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Shenzhen Haoyun Tech Co Ltd has applied Chinese patent for Led Display Screen Based on Integrated Chip and Control System. Li Xiaojun, Peng Xiangke, Liang Qiuhong, Yu Caiqiong and Cai Lei developed it. The patent application number is CN202511281342 20250909. The patent publication number is CN120913498 (..

Xiamen Anjieli Meiwei Tech Co Ltd Files Chinese Patent Application for Manufacturing Method of Tgv Seed Layer and Packaging Substrate, and Packaging Substrate

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Xiamen Anjieli Meiwei Tech Co Ltd has filed a patent application for Manufacturing Method of Tgv Seed Layer and Packaging Substrate, and Packaging Substrate. This invention was developed by Lai Feng, Yan Guoqiu, Kamimiya Shohei, Tian Hongzhou and Hu Rui. The patent application number is CN202511117696 202..

Wuhan Xinchuangyuan Semiconductor Co Ltd Files Chinese Patent Application for Fcbga Packaging Substrate and Processing Method Thereof

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Wuhan Xinchuangyuan Semiconductor Co Ltd has filed a patent application for Fcbga Packaging Substrate and Processing Method Thereof. This invention was developed by Zhang Kai, Ming Xing, Cai Tongqing and Wang Tao. The patent application number is CN202510927602 20250707. The patent publication number is C..

Zhejiang Xinwei Taike Semiconductor Co Ltd Files Chinese Patent Application for Method and System for Manufacturing Semiconductor Device

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Zhejiang Xinwei Taike Semiconductor Co Ltd has filed a patent application for Method and System for Manufacturing Semiconductor Device. This invention was developed by Yi Lan, Wang Chong, Hu Zhijie, Liu Tong, Zhang Dehua, Liang Jinxue and Chen Lunxing. The patent application number is CN202511444971 20251..

Nami Scient Instrument Equipment Hangzhou Co Ltd Files Chinese Patent Application for Small Sample Chip Surface Defect Detection Method Based on Convolutional Neural Network

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Nami Scient Instrument Equipment Hangzhou Co Ltd has filed a patent application for Small Sample Chip Surface Defect Detection Method Based on Convolutional Neural Network. This invention was developed by Liu Zhiping and Hong Jianli. The patent application number is CN202410550912 20240506. The patent pub..

Kulicke & Soffa Ind Inc Submits Patent Application for Systems for Bonding a Semiconductor Element to a Substrate Using Reducing Gas and Related Methods

Semiconductor

| Wed 25 Mar 2026

Alexandria, March 25 -- Kulicke & Soffa Ind Inc has submitted a patent application for Systems for Bonding a Semiconductor Element to a Substrate Using Reducing Gas and Related Methods. Muthyala Dhiraj, Grant Timothy Paul, Palumbo Thomas J and Tarabulski Matthew developed the invention. The patent application number is US2025..

Infineon Technologies Americas Corp Submits United States Patent Application for Bandwidth for Wirebond Integrated Circuit Package

Semiconductor

| Wed 25 Mar 2026

Alexandria, March 25 -- Infineon Technologies Americas Corp has submitted a patent application for Bandwidth for Wirebond Integrated Circuit Package. This invention was developed by Huang Shaowu and Wu Dance. The patent application number is US202519330576 20250916. The patent publication number is US20260082959 (A1). Coopera..

Qidong Xishi Intelligent Tech Co Ltd Submits Patent Application for Etching Device for Instrument Chip Processing

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Qidong Xishi Intelligent Tech Co Ltd has submitted a patent application for Etching Device for Instrument Chip Processing. Zhang Yu, Zhao Xu and Wei Jingfan developed the invention. The patent application number is CN202511437433 20251009. The patent publication number is CN120914148 (A). International Pa..

Yangzhou Ruimai Tech Co Ltd Submits Chinese Patent Application for Integrated Circuit Film Expanding Device and Integrated Circuit Film Expanding Method

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Yangzhou Ruimai Tech Co Ltd has submitted a patent application for Integrated Circuit Film Expanding Device and Integrated Circuit Film Expanding Method. This invention was developed by Yue Junwen. The patent application number is CN202511100274 20250807. The patent publication number is CN120914142 (A). ..

Huatian Tech Jiangsu Co Ltd Submits Chinese Patent Application for Flattening Device and Method for Warped Wafer

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Huatian Tech Jiangsu Co Ltd has submitted a patent application for Flattening Device and Method for Warped Wafer. This invention was developed by Tang Ziming, Hou Gangliang, Chen Xiaolong and Ma Shuying. The patent application number is CN20251139330 20250728. The patent publication number is CN120914138 ..

Shenzhen Ruiwowei Semiconductor Tech Co Ltd Submits Chinese Patent Application for Semiconductor Chip Packaging Method and Chip Packaging Piece

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Shenzhen Ruiwowei Semiconductor Tech Co Ltd has submitted a patent application for Semiconductor Chip Packaging Method and Chip Packaging Piece. This invention was developed by Shen Guang, Qi Shan and He Yide. The patent application number is CN20251130157 20250724. The patent publication number is CN1209..

Xiamen Anjieli Meiwei Tech Co Ltd Submits Chinese Patent Application for Manufacturing Method of Redistribution Layer of Package Substrate and Package Substrate

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Xiamen Anjieli Meiwei Tech Co Ltd has submitted a patent application for Manufacturing Method of Redistribution Layer of Package Substrate and Package Substrate. This invention was developed by Xie Teng, Yan Guoqiu, Kamimiya Shohei, Tian Hongzhou and Hu Rui. The patent application number is CN202511117699..

Jiangsu Punuowei Electronic Co Ltd Submits Patent Application for Copper Pillar Bump Processing Method Applied to High-density Interconnection and Chip Packaging Structure

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Jiangsu Punuowei Electronic Co Ltd has submitted a patent application for Copper Pillar Bump Processing Method Applied to High-density Interconnection and Chip Packaging Structure. Xiao Juanbo, Zong Xinru, Yang Fei, Zou Yin, Zhao Xiaoqiang and Ma Hongwei developed the invention. The patent application num..

Jingxincheng Beijing Tech Co Ltd; Hefei Nexchip Integrated Circuit Submits Patent Application for Method for Preventing Semiconductor Device from Electrochemical Corrosion and Semi..

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Jingxincheng Beijing Tech Co Ltd; Hefei Nexchip Integrated Circuit has submitted a patent application for Method for Preventing Semiconductor Device from Electrochemical Corrosion and Semiconductor Device. Hao Xiaoqiang, Tao Lei, Zhou Yufen and Li Xiao developed the invention. The patent application numbe..

Suzhou Xintai Semiconductor Tech Co Ltd Submits Patent Application for Method for Obliquely Cleaning Semiconductor Chip

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Suzhou Xintai Semiconductor Tech Co Ltd has submitted a patent application for Method for Obliquely Cleaning Semiconductor Chip. Wu Mingfang developed the invention. The patent application number is CN202410548805 20240506. The patent publication number is CN120914083 (A). International Patent Classificat..

Wuxi Mengxi Intelligent System Co Ltd Submits Chinese Patent Application for Radio Frequency MEMS Switch and Preparation Method Thereof

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Wuxi Mengxi Intelligent System Co Ltd has submitted a patent application for Radio Frequency MEMS Switch and Preparation Method Thereof. This invention was developed by Liu Zewen and Wei Jiangtao. The patent application number is CN202510818953 20250618. The patent publication number is CN120914061 (A). I..

Shanghai Silang Tech Co Ltd Submits Chinese Patent Application for Execution Method and Device of Molecular Dynamics Constraint Algorithm, Chip and Medium

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Shanghai Silang Tech Co Ltd has submitted a patent application for Execution Method and Device of Molecular Dynamics Constraint Algorithm, Chip and Medium. This invention was developed by Yang Yuhang, Li Huan and Zhang Bingyao. The patent application number is CN20251159182 20250730. The patent publicatio..

Carbon Chip Microelectronics Tech Shenzhen Co Ltd Submits Chinese Patent Application for SOC Chip, Bridging Integrated Chip and DRAM

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Carbon Chip Microelectronics Tech Shenzhen Co Ltd has submitted a patent application for SOC Chip, Bridging Integrated Chip and DRAM. This invention was developed by Su Xiaofeng and Lu Jiang. The patent application number is CN20251124988 20250723. The patent publication number is CN120913623 (A). Interna..

U.S. Patent and Trademark Office Releases Intel Patent Application for Apparatus and Method for Prefetching from a Second Level Translation Lookaside Buffer (TLB) to a First Level ..

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has released Intel patent application for Apparatus and Method for Prefetching from a Second Level Translation Lookaside Buffer (TLB) to a First Level TLB. This invention was developed by Pugsley Seth H. The patent application number is US202418890548 20240919. The pate..

KIOXIA Files United States Patent Application for Semiconductor Storage Device and Method of Manufacturing the Same

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- KIOXIA has filed a patent application for Semiconductor Storage Device and Method of Manufacturing the Same. This invention was developed by Tsuji Masaki and Yamada Kenta. The patent application number is US202519070132 20250304. The patent publication number is US20260080910 (A1). International Patent..

KIOXIA Submits United States Patent Application for Semiconductor Device and Method of Manufacturing the Same

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- KIOXIA has submitted a patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Ohashi Takashi. The patent application number is US202519071888 20250306. The patent publication number is US20260080911 (A1). International Patent Classification cod..

KIOXIA Files United States Patent Application for Semiconductor Storage Device

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- KIOXIA has filed a patent application for Semiconductor Storage Device. This invention was developed by Deguchi Masashi. The patent application number is US202519076744 20250311. The patent publication number is US20260080918 (A1). International Patent Classification codes are G11C16/04, G11C5/06, H10B..

CXMT Files United States Patent Application for Control Circuit and Memory

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- CXMT has filed a patent application for Control Circuit and Memory. This invention was developed by Shao Yanian, Eom Yoonjoo and Song Jiajin. The patent application number is US202519395391 20251120. The patent publication number is US20260080932 (A1). International Patent Classification codes are G11C..

U.S. Patent and Trademark Office Receives KIOXIA Patent Application for Storage Device

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has received KIOXIA patent application for Storage Device. Nakayama Masahiko developed the invention. The patent application number is US202519076932 20250311. The patent publication number is US20260080924 (A1). International Patent Classification code is G11C11/16. Co..

KIOXIA Submits United States Patent Application for Memory Device

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- KIOXIA has submitted a patent application for Memory Device. This invention was developed by Nakata Yuki and Matsuo Kouji. The patent application number is US202519057236 20250219. The patent publication number is US20260080940 (A1). International Patent Classification codes are G11C16/04, G11C5/06, H1..

Xilinx Submits United States Patent Application for Robust Single Event Upset (SEU) Tolerant High-performance Flip-flop

Semiconductor

| Wed 25 Mar 2026

Alexandria, March 25 -- Xilinx has submitted a patent application for Robust Single Event Upset (SEU) Tolerant High-performance Flip-flop. This invention was developed by Alam Tabrez, Rahul Kumar, Yachareni Santosh and Ahmad Ishtiaque. The patent application number is US202418889154 20240918. The patent publication number is ..

State Intellectual Property Office of China Releases Beijing University and Shanghai Jiao Tong University Patent Application for Preparation Method of Stacked Transistor, Stacked T..

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Beijing University and Shanghai Jiao Tong University patent application for Preparation Method of Stacked Transistor, Stacked Transistor and Semiconductor Device. This invention was developed by Wu Heng, Sun Fangcheng, Wang Yimeng, Wang Runsheng, Li Mi..

Hangzhou Xiahesheng Biomedical Tech Co Ltd Submits Chinese Patent Application for Production System and Production Process of Silicon Carbide Ceramic Precursor

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Hangzhou Xiahesheng Biomedical Tech Co Ltd has submitted a patent application for Production System and Production Process of Silicon Carbide Ceramic Precursor. This invention was developed by Yu Lujun. The patent application number is CN202511111260 20250808. The patent publication number is CN120919936 ..

Dual Strategies LLC Seeks Patent for Fluid Dosing Substrate Dispenser

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- Dual Strategies LLC has sought patent for Fluid Dosing Substrate Dispenser. This invention was developed by Wetzer Michael. The patent application number is US202519401503 20251126. The patent publication number is US20260076517 (A1). International Patent Classification codes are A47K10/32 and A47K10/3..

U.S. Patent and Trademark Office Publishes Mitsubishi Electric Patent Application for Semiconductor Apparatus

Semiconductor

| Wed 25 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has published Mitsubishi Electric patent application for Semiconductor Apparatus. The invention was developed by Hisaka Takayuki. The patent application number is US202219108684 20221227. The patent publication number is US20260082989 (A1). Cooperative Patent Classifica..

The Spot Laboratory Submits Chinese Patent Application for Micro-fluidic Chip Based on Photocuring Liquid Drops and Escherichia Coli Detection Method

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- The Spot Laboratory has submitted a patent application for Micro-fluidic Chip Based on Photocuring Liquid Drops and Escherichia Coli Detection Method. This invention was developed by Liu Bo, Su Danfeng, Feng Shilun and Wang Kun. The patent application number is CN20251192371 20250805. The patent publicati..

Chizhou Jucheng Electronic Tech Co Ltd Seeks Patent for Dispensing Device with Rapid Curing Function for Semiconductor Packaging

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Chizhou Jucheng Electronic Tech Co Ltd has sought patent for Dispensing Device with Rapid Curing Function for Semiconductor Packaging. This invention was developed by Zhang Yongping, Zhang Chengjun and Zhang Jinyu. The patent application number is CN202511256478 20250904. The patent publication number is ..

Shenzhen Xintongkang Tech Co Ltd Submits Chinese Patent Application for Glue Sealing Device and Method for Semiconductor Diode

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Shenzhen Xintongkang Tech Co Ltd has submitted a patent application for Glue Sealing Device and Method for Semiconductor Diode. This invention was developed by Tan Chao. The patent application number is CN202511295660 20250911. The patent publication number is CN120920290 (A). International Patent Classif..

Wuxi Ruihongxing Semiconductor Equipment Co Ltd Seeks Patent for Metal Oxide Semiconductor (mos) Tube Sorting Device

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Wuxi Ruihongxing Semiconductor Equipment Co Ltd has sought patent for Metal Oxide Semiconductor (mos) Tube Sorting Device. This invention was developed by Li Dongya. The patent application number is CN202511392903 20250927. The patent publication number is CN120920396 (A). International Patent Classificat..

State Intellectual Property Office of China Releases Ganzhou Yihao New Mat Co Ltd Patent Application for Aluminum Substrate Discharging Robot with Cleaning Function

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Ganzhou Yihao New Mat Co Ltd patent application for Aluminum Substrate Discharging Robot with Cleaning Function. This invention was developed by Ding Haibing, Liu Xuanji, Wang Haiyang and Wang Tiecheng. The patent application number is CN20251147668..

Jiangsu Chuangying Solar Energy Tech Co Ltd Submits Chinese Patent Application for Photovoltaic Crystalline Silicon Cell Laser Lift-off Equipment and Application Method

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Jiangsu Chuangying Solar Energy Tech Co Ltd has submitted a patent application for Photovoltaic Crystalline Silicon Cell Laser Lift-off Equipment and Application Method. This invention was developed by Long Junyao, Huang Zhirong, Li Tao and Han Di. The patent application number is CN202511223845 20250829...

State Intellectual Property Office of China Releases Jiangsu Chuangyi Prec Forging Co Ltd Patent Application for Cold Forging Die for Red Copper IGBT (insulated Gate Bipolar Transl..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Jiangsu Chuangyi Prec Forging Co Ltd patent application for Cold Forging Die for Red Copper IGBT (insulated Gate Bipolar Translator) Radiating Substrate. This invention was developed by Chen Xuefeng, Chen Fei, Zhu Jun, Nie Xiangyi and Zhang Chaozhong. ..

State Intellectual Property Office of China Releases Shenzhen Rongda Circuit Co Ltd Patent Application for Process Manufacturing Method of Aluminum Substrate

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Shenzhen Rongda Circuit Co Ltd patent application for Process Manufacturing Method of Aluminum Substrate. This invention was developed by Lai Yuebin and Huang Zhangjian. The patent application number is CN20251192547 20250805. The patent publication..

Flowserve Man Co Seeks Patent for Method and Device for Removing Reactive Particles from a Vacuum Environment, and Process Plant for Producing Monocrystalline Silicon Ingots

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- Flowserve Man Co has sought patent for Method and Device for Removing Reactive Particles from a Vacuum Environment, and Process Plant for Producing Monocrystalline Silicon Ingots. This invention was developed by Hencke Rayk, Lähn Stefan, Drechsel Julian, Meggers Nils and Schreiner Jochen. The patent a..

Enpulse Co Ltd Submits United States Patent Application for Polishing Pad, Preparation Method Thereof and Preparation Method of Semiconductor Device Using the Same

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- Enpulse Co Ltd has submitted a patent application for Polishing Pad, Preparation Method Thereof and Preparation Method of Semiconductor Device Using the Same. This invention was developed by Shin Yujin, Kim Kyunghwan, Yoon Jongwook and Seo Jangwon. The patent application number is US202519277426 202507..

State Intellectual Property Office of China Publishes Changchun Zhiran Photoelectric Tech Co Ltd Patent Application for Femtosecond Laser Trepanning Method and Device for Silicon N..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Changchun Zhiran Photoelectric Tech Co Ltd patent application for Femtosecond Laser Trepanning Method and Device for Silicon Nitride Ceramic. The invention was developed by Wang Fuguo, Zhang Benlei, Xiao Jingsong and Yang Hang. The patent applicati..

Sinochip Semiconductor Tech Co Ltd Submits Patent Application for Vcsel Chip Cleaning Device and Cleaning Process

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Sinochip Semiconductor Tech Co Ltd has submitted a patent application for Vcsel Chip Cleaning Device and Cleaning Process. Liang Gaoming, Lee Wang-rim, Chen Yun, Yu Juan, Tian Zhengru, Tang Xiujuan, Yao Shun and Han Hao developed the invention. The patent application number is CN202511449764 20251011. The..

Siwei Semiconductor Haining Co Ltd Submits Patent Application for Intelligent Chip Repairing Device and Method

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Siwei Semiconductor Haining Co Ltd has submitted a patent application for Intelligent Chip Repairing Device and Method. Liao Jianfu and Yin Jie developed the invention. The patent application number is CN202511361800 20250923. The patent publication number is CN120921008 (A). International Patent Classifi..

Hangzhou Zhixin Semiconductor Co Ltd Applies for Patent on Maintenance Method of Semiconductor Heater

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Hangzhou Zhixin Semiconductor Co Ltd has applied Chinese patent for Maintenance Method of Semiconductor Heater. Liu Zhiyang and Ye Dingyun developed it. The patent application number is CN202510899545 20250701. The patent publication number is CN120921006 (A). International Patent Classification code is B..

State Intellectual Property Office of China Releases Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd Patent Application for Multi-wire Cutting Method for Improving Cutting Morp..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Multi-wire Cutting Method for Improving Cutting Morphology of Small-size Silicon Wafer. This invention was developed by Liu Xiaoping, Cao Qigang, Zhang Youhai, Wang Zhongbao, Wa..

Venclose Inc Seeks Patent for Ablation Systems with Reduced Energy Loss

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- Venclose Inc has sought patent for Ablation Systems with Reduced Energy Loss. This invention was developed by Przygoda Darius and Behzadian Negin. The patent application number is US202418887444 20240917. The patent publication number is US20260076729 (A1). International Patent Classification codes are..

Zhejiang Xinding Plastic Co Ltd Submits Chinese Patent Application for Intelligent Tray Chip Embedded Type Injection Molding Device

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Zhejiang Xinding Plastic Co Ltd has submitted a patent application for Intelligent Tray Chip Embedded Type Injection Molding Device. This invention was developed by Ai Shangqi, Seo Eun-young, Jin Xiaoxin, Lai Jingting, Zhou Weiwen, Yang Chao, Ruan Chenlu, Zeng Yiying and Zeng Jianshu. The patent applicati..

State Intellectual Property Office of China Publishes Du Boyi Patent Application for Multipoint Material Injection Packaging Mold of Transistor Semiconductor

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Du Boyi patent application for Multipoint Material Injection Packaging Mold of Transistor Semiconductor. The invention was developed by Du Boyi, Wang Yanmeng and Zhou Yue. The patent application number is CN202510826445 20250619. The patent publica..

U.S. Patent and Trademark Office Publishes Taijia Corp Patent Application for Quantum-dot Light Conversion Film, Preparation Method and Application Thereof and Anti-ultraviolet Blu..

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has published Taijia Corp patent application for Quantum-dot Light Conversion Film, Preparation Method and Application Thereof and Anti-ultraviolet Blue-free Yellow Light for Chip Process. The invention was developed by Qiu Tianyi. The patent application number is US202..

State Intellectual Property Office of China Releases Inner Mongolia Xinggu Tech Co Ltd Patent Application for Crystal Silicon Plate Film Laminating Machine

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Inner Mongolia Xinggu Tech Co Ltd patent application for Crystal Silicon Plate Film Laminating Machine. This invention was developed by Wan Denghua and Liu Yuechen. The patent application number is CN202511453198 20251013. The patent publication num..

State Intellectual Property Office of China Publishes Chuzhou Yinxing New Mat Co Ltd Patent Application for Preparation Method of Nano Silicon Dioxide Modified Polyurethane Thermal..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Chuzhou Yinxing New Mat Co Ltd patent application for Preparation Method of Nano Silicon Dioxide Modified Polyurethane Thermal Insulation Material. The invention was developed by Lin Xun. The patent application number is CN202511102456 20250807. Th..

State Intellectual Property Office of China Publishes Dongguan Tlc Electronic Tech Co Ltd Patent Application for Hole Transport Material, Preparation Method Thereof and Perovskite ..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Dongguan Tlc Electronic Tech Co Ltd patent application for Hole Transport Material, Preparation Method Thereof and Perovskite Solar Cell. The invention was developed by Xu Jiaju, Luo Yuewei, Chen Jinbiao, Chen Junmin, Fang Liyu and Lin Mengping. Th..

Seakr Eng LLC Submits United States Patent Application for Scalable Partitioning of Functions Within Application Specific Integrated Circuit or Microelectronics Device

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- Seakr Eng LLC has submitted a patent application for Scalable Partitioning of Functions Within Application Specific Integrated Circuit or Microelectronics Device. This invention was developed by Lowry Anthony. The patent application number is US202418885177 20240913. The patent publication number is US..

Hebei Dingci Electronic Tech Co Ltd Files Chinese Patent Application for High-hardness Aluminum Oxide Multilayer Ceramic Substrate

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Hebei Dingci Electronic Tech Co Ltd has filed a patent application for High-hardness Aluminum Oxide Multilayer Ceramic Substrate. This invention was developed by Gao Shan, Jin Huajiang, Li Jie, Liang Pengjie, Li Lei, Zhang Chenxu and Zhang Xueli. The patent application number is CN202511460976 20251014. T..

State Intellectual Property Office of China Publishes Shandong Huamei New Material Tech Co Ltd Patent Application for Silicon Carbide Ceramic Slurry for 3D Printing and Ceramic Boa..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Shandong Huamei New Material Tech Co Ltd patent application for Silicon Carbide Ceramic Slurry for 3D Printing and Ceramic Boat Prepared from Silicon Carbide Ceramic Slurry. The invention was developed by Wang Dong, Li Weiqiang, Bi Jianqiang, Yin Dong..

State Intellectual Property Office of China Publishes Zhejiang Jinchen Glass Co Ltd Patent Application for Manufacturing Method of Glass Substrate for Refrigerator Glass Door

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Zhejiang Jinchen Glass Co Ltd patent application for Manufacturing Method of Glass Substrate for Refrigerator Glass Door. The invention was developed by Jin Yongtang. The patent application number is CN202510729712 20250603. The patent publication ..

State Intellectual Property Office of China Receives Jiangsu Zhuoyuan Semiconductor Co Ltd Patent Application for Preparation Process of Silicon Carbide Powder for Growing Silicon ..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Jiangsu Zhuoyuan Semiconductor Co Ltd patent application for Preparation Process of Silicon Carbide Powder for Growing Silicon Carbide Crystals. Zhang Xinfeng, Wu Zhiliang and Huang Jie developed the invention. The patent application number is CN202..

State Intellectual Property Office of China Releases Tanyan Tech Service Wuxi Co Ltd Patent Application for Preparation Method of Pitch-based Porous Carbon for High-performance Sil..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Tanyan Tech Service Wuxi Co Ltd patent application for Preparation Method of Pitch-based Porous Carbon for High-performance Silicon Carbon. This invention was developed by Zheng Junhua. The patent application number is CN202511101113 20250807. The p..

Mixx Tech Inc Files United States Patent Application for System and Method for an Extended Buried Oxide Layer for Silicon Photonic Integrated Circuits

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- Mixx Tech Inc has filed a patent application for System and Method for an Extended Buried Oxide Layer for Silicon Photonic Integrated Circuits. This invention was developed by Schaevitz Rebecca Kayla and Raghuraman Vivek. The patent application number is US202519333147 20250918. The patent publication ..

Silith Tech Suzhou Co Ltd Submits United States Patent Application for Integrated Optical Chip and Application Method Thereof, and Integrated Optical System

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- Silith Tech Suzhou Co Ltd has submitted a patent application for Integrated Optical Chip and Application Method Thereof, and Integrated Optical System. This invention was developed by Zhang Xingyu and Zhang Ke. The patent application number is US202218994068 20221028. The patent publication number is U..

U.S. Patent and Trademark Office Releases Inventec Pudong Tech Corp and Inventec Patent Application for Monitoring Structure Without Chip

Semiconductor

| Tue 24 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has released Inventec Pudong Tech Corp and Inventec patent application for Monitoring Structure Without Chip. This invention was developed by Cheng Wei-chen, Shih Yi-cheng, Wu Yu, Lin Hsin-hung and Tai Yu Shu. The patent application number is US202519239361 20250616. Th..

State Intellectual Property Office of China Publishes Shenzhen Aerospace Dongfanghong Satellite Co Ltd Patent Application for Spacecraft Based on Spherical Solar Cell Array as Shel..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has published Shenzhen Aerospace Dongfanghong Satellite Co Ltd patent application for Spacecraft Based on Spherical Solar Cell Array as Shell and Thermal Control Design Method Thereof. The invention was developed by Sun Risi, Wang Cuilin, Yoon Mu-hyun, Gong Jinlai,..

Laser Mfg Institute Henan Academy Of Sciences Applies for Patent on Blood Vessel Chip System Fused with 3D Printing and Operation Method

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Laser Mfg Institute Henan Academy Of Sciences has applied Chinese patent for Blood Vessel Chip System Fused with 3D Printing and Operation Method. Gao Chuang, Zheng Yayun, Jiang Haoqing, Li Hao, Li Wei, Chen Jialiang and Xu Hongxing developed it. The patent application number is CN202511152951 20250818. T..

Shanghai Infectious Disease And Biological Safety Res Institute Seeks Patent for Microfluidic Real-time Quantitative PCR Chip System

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Shanghai Infectious Disease And Biological Safety Res Institute has sought patent for Microfluidic Real-time Quantitative PCR Chip System. This invention was developed by Mao Hongju, Li Yan, Cheng Xunjia and Wu Fan. The patent application number is CN20251170396 20250731. The patent publication number is ..

State Intellectual Property Office of China Receives Qingzhi Biotechnology Xuzhou Co Ltd Patent Application for Magnetic Sorting Chip for Cell Sorting and Preparation Method Thereo..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Qingzhi Biotechnology Xuzhou Co Ltd patent application for Magnetic Sorting Chip for Cell Sorting and Preparation Method Thereof. Jiang Zhenwei and Du Chuan developed the invention. The patent application number is CN202511101760 20250807. The paten..

Shenzhen Anpin Silicone Mat Co Ltd Seeks Patent for Organic Silicon Immersed Cooling Liquid for Data Center and Application Method of Organic Silicon Immersed Cooling Liquid

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Shenzhen Anpin Silicone Mat Co Ltd has sought patent for Organic Silicon Immersed Cooling Liquid for Data Center and Application Method of Organic Silicon Immersed Cooling Liquid. This invention was developed by Wu Nan, Tong Zhuoran, Ding Xiaowei and Ding Xiaobin. The patent application number is CN202511..

Wynca Tinyo Silicon Co Ltd Seeks Patent for Two-component Liquid Silicone Rubber for Organic Silicon Leather Bonding Layer as Well as Preparation Method and Application of Two-comp..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Wynca Tinyo Silicon Co Ltd has sought patent for Two-component Liquid Silicone Rubber for Organic Silicon Leather Bonding Layer as Well as Preparation Method and Application of Two-component Liquid Silicone Rubber. This invention was developed by Lu Boji, Li Zhiyuan, Wang Xiaopan, He Dong, Wu Jiawei and Zhou..

Hangzhou Huayi New Mat Co Ltd Submits Patent Application for Light-cured Organic Silicon Release Agent as Well as Process Method and Application Thereof

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Hangzhou Huayi New Mat Co Ltd has submitted a patent application for Light-cured Organic Silicon Release Agent as Well as Process Method and Application Thereof. Zhou Haifeng, He Yuechi and Xu Bin developed the invention. The patent application number is CN202511469683 20251015. The patent publication num..

State Intellectual Property Office of China Releases Wuxi Yuanding Environmental Protection Tech Co Ltd Patent Application for Ionic Liquid Modified Super-hydrophobic Silicon Dioxi..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Wuxi Yuanding Environmental Protection Tech Co Ltd patent application for Ionic Liquid Modified Super-hydrophobic Silicon Dioxide Additive for Epoxy Resin Anticorrosive Paint as Well as Preparation Method and Application of Ionic Liquid Modified Super-..

Gu Xuelian Submits Chinese Patent Application for Lanthanum Gallium Silicon Thin Film Material Substrate and Preparation Method Thereof

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Gu Xuelian has submitted a patent application for Lanthanum Gallium Silicon Thin Film Material Substrate and Preparation Method Thereof. This invention was developed by Gu Xuelian and Cai Lingyun. The patent application number is CN202410561087 20240508. The patent publication number is CN120924032 (A). I..

Qingdao Besland Semiconductor Tech Co Ltd Files Chinese Patent Application for Antistatic Material for Wafer Loader and Preparation Method Thereof

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Qingdao Besland Semiconductor Tech Co Ltd has filed a patent application for Antistatic Material for Wafer Loader and Preparation Method Thereof. This invention was developed by Hara Keiryu, Jian Dunliang and Chen Na. The patent application number is CN202511219698 20250828. The patent publication number ..

State Intellectual Property Office of China Receives Zhuhai Aokeda Tech Research Institute, Kailuan Group and Kailuan New Mat Co Ltd Patent Application for X-ray Protection Materia..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Zhuhai Aokeda Tech Research Institute, Kailuan Group and Kailuan New Mat Co Ltd patent application for X-ray Protection Material Based on Semiconductor Material as Well as Preparation Method and Application of X-ray Protection Material. Li Liang, Liu B..

State Intellectual Property Office of China Receives Qingdao Besland Semiconductor Tech Co Ltd Patent Application for Corrosion-resistant Composition for Wafer Clamping Piece and P..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Qingdao Besland Semiconductor Tech Co Ltd patent application for Corrosion-resistant Composition for Wafer Clamping Piece and Preparation Method of Corrosion-resistant Composition. Jian Dunliang, Hara Keiryu and Jia Lingyan developed the invention. ..

State Intellectual Property Office of China Releases Quzhou Zhongtong Chemical Co Ltd Patent Application for Coated Spherical Silicon Dioxide Flame Retardant and Preparation Method..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Quzhou Zhongtong Chemical Co Ltd patent application for Coated Spherical Silicon Dioxide Flame Retardant and Preparation Method Thereof. This invention was developed by Tian Yonghong, Xu Lisi, Xu Yisheng and Lan Jian. The patent application number i..

Yellow River Delta Jingbo Res Institute Of Chemical Industry Co Ltd Submits Chinese Patent Application for Preparation Method and Application of Titanium-containing Organic Silicon..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Yellow River Delta Jingbo Res Institute Of Chemical Industry Co Ltd has submitted a patent application for Preparation Method and Application of Titanium-containing Organic Silicon Resin. This invention was developed by Huang Rui, Zhang Jingjing, Zhuang Rui, Chen Dianlong, Wang Dongzhe, Wang Yuanrong, Li Rui..

Chongqing Sanxia Paints Co Ltd Submits Chinese Patent Application for Tung Oil Modified Organic Silicon Biological Resin, Degradable Camouflage Coating and Preparation Method of De..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- Chongqing Sanxia Paints Co Ltd has submitted a patent application for Tung Oil Modified Organic Silicon Biological Resin, Degradable Camouflage Coating and Preparation Method of Degradable Camouflage Coating. This invention was developed by Xiang Quan, Zhou Rui, He Yang and You Kexin. The patent applicati..

State Intellectual Property Office of China Receives Shandong Lingxiao New Mat Co Ltd Patent Application for Preparation Method of Amphiphilic Silane Modified Block Type Organic Si..

Semiconductor

| Tue 24 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Shandong Lingxiao New Mat Co Ltd patent application for Preparation Method of Amphiphilic Silane Modified Block Type Organic Silicon Ether. Li Kuankuan, Wang Linfei, Li Conghao, Fang Fang, Jiang Xiaojun and Ding Guiqing developed the invention. The ..

State Intellectual Property Office of China Receives Zhangjiagang Yangzijiang Cold Rolled Sheet Co Ltd, Jiangsu Shagang Group and Jiangsu Shagang Institute Research Iron & Steel Pa..

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has received Zhangjiagang Yangzijiang Cold Rolled Sheet Co Ltd, Jiangsu Shagang Group and Jiangsu Shagang Institute Research Iron & Steel patent application for Method for Improving Iron and Steel Loss Full-length Uniformity of Middle and Low Grade Silicon Steel. M..

State Intellectual Property Office of China Releases Anhui Dongxun Sealing Tech Co Ltd Patent Application for Silicon Carbide Substrate and Substrate Preparation Method

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- State Intellectual Property Office of China has released Anhui Dongxun Sealing Tech Co Ltd patent application for Silicon Carbide Substrate and Substrate Preparation Method. This invention was developed by Xu Chengming, Hu Erying, Zhai Suzhen, Li Qiuying, Zhang Peili, Li Yong, Kong Pei, Luo Kehai and Ma Zhen..

U.S. Patent and Trademark Office Receives Toshiba KK and Toshiba Electronic Devices & Storage Patent Application for Control Circuit, Drive Circuit, and Semiconductor Circuit

Semiconductor

| Wed 25 Mar 2026

Alexandria, March 25 -- U.S. Patent and Trademark Office has received Toshiba KK and Toshiba Electronic Devices & Storage patent application for Control Circuit, Drive Circuit, and Semiconductor Circuit. Sagawa Michio, Shimokawa Manami and Niikura Yuichiro developed the invention. The patent application number is US2025192093..

MK Chem Tech Co Ltd Applies for Patent on Palladium Plating Composition, Method for Manufacturing Substrate for Semiconductor Package Using Same, and Substrate for Semiconductor Pa..

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- MK Chem Tech Co Ltd has applied Chinese patent for Palladium Plating Composition, Method for Manufacturing Substrate for Semiconductor Package Using Same, and Substrate for Semiconductor Package Manufactured by Method. Han Deok-gon, Sung Tae-hyun and Lee Tae-ho developed it. The patent application number ..

Jiangsu Huanneng Silicon Carbon Ceram Co Ltd Applies for Patent on CVD (chemical Vapor Deposition) Silicon Carbide Heater Processing System and Process Thereof

Semiconductor

| Wed 25 Mar 2026

Beijing, March 25 -- Jiangsu Huanneng Silicon Carbon Ceram Co Ltd has applied Chinese patent for CVD (chemical Vapor Deposition) Silicon Carbide Heater Processing System and Process Thereof. Ye Minghua developed it. The patent application number is CN20251193951 20250806. The patent publication number is CN120924946 (A). Inte..

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