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Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Zhejiang Qingxin Technology has submitted a patent application for Multifunctional Braid Retesting Mechanism. Cai Qingxin, Qiu Shaohui and Yang Jie developed the invention.
The patent application number is CN202510535933 20250427. The patent publication number is CN120246380 (A). International Patent Class..
Semiconductor
| Sat 17 Jan 2026
Helsinki, Jan. 17 -- National Board of Patents and Registration of Finland has published Corehw Semiconductor Oy patent application for Circularly Polarized Antennas. The invention was developed by Karilainen Antti.
The patent application number is FI20200006255 20201204. The patent publication number is FI20206255 (A1). Inte..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Sichuan Hongke Innovation Tech Co Ltd has applied Chinese patent for Support Plate Glass Used in Semiconductor Packaging Field and Preparation Method Thereof. Zhao Hongmei, Dong Junwei, Li Guanghua, Zhang Jun, Zhou Hongbin, Xu Guoliang and He Huachao developed it.
The patent application number is CN2025103..
Semiconductor
| Sat 17 Jan 2026
Madrid, Jan. 17 -- Univ Cadiz has submitted a patent application for Composite Material for Use in Stereolithography and Obtaining Procedure. Romero Ocaña Ismael and Molina Rubio Sergio Ignacio developed the invention.
The patent application number is ES20200031289 20201223. The patent publication number is ES2915589 (A1). I..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Dalian University of Technology has submitted a patent application for Blue-light-emitting Material Based on Phenanthroimidazole Derivative and Preparation Method and Application of Blue-light-emitting Material. This invention was developed by Long Saran, Jiang Yongchao, Du Jianjun, Peng Xiaojun and Fan Jiang..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Sichuan University has submitted a patent application for Organic-inorganic Hybrid Light-emitting Halide Material as Well as Preparation Method and Application Thereof. This invention was developed by Zou Guohong and Han Xiangyu.
The patent application number is CN202510737740 20250604. The patent publicat..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Laplace (Guangzhou) Semiconductor Technology has been awarded a patent for Gas Mixing and Distributing Mechanism, Gas Inlet Device and Deposition Preparation Equipment. This invention was developed by Long Zhanyong, Han Xueling, Li Hong, Liu Dingcai, Liang Zhancheng and Liu Qun.
The patent application numb..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Laplace (Guangzhou) Semiconductor Technology has been granted a patent for Spray Head Structure and Deposition Preparation Device. This invention was developed by Long Zhanyong, Han Xueling, Li Hong, Liu Dingcai, Liang Zhancheng and Liu Qun.
The patent application number is CN202422621842U 20241029. The pa..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Shenzhen Promotion of Environmental Prot Equipment Co Ltd has filed a patent application for Filtering Device for Improving Water Quality by Using Water-soluble Silicon. This invention was developed by Jeong Jin.
The patent application number is CN202510492737 20250418. The patent publication number is CN1..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Jurong Xingchen New Mat Co Ltd has applied Chinese patent for Polycrystalline Silicon Reduction Method and Equipment. Sun Lichun developed it.
The patent application number is CN202510410239 20250402. The patent publication number is CN120247033 (A). International Patent Classification code is C01B33/035. ..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has received Xinjiang Hesheng Silicon Industry New Mat Co Ltd patent application for Fine Crushing and Surface Modification Integrated Method for High-purity Silicon Powder. Qu Longxue, Luo Yedong, Cheng Yufeng, Liu Shaolong and Zhang Zhandong developed the inventio..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has released Zhejiang Jingyue Semiconductor Co Ltd patent application for Synthesis Method of P-type Silicon Carbide Powder. This invention was developed by Gao Bing.
The patent application number is CN202510740268 20250605. The patent publication number is CN120..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Ningxia Xing Chen New Mat Co Ltd has submitted a patent application for Preparation Method of Silicon Carbide Ultrafine Powder. This invention was developed by Fan Tao and Pu Changchun.
The patent application number is CN202510693879 20250527. The patent publication number is CN120247027 (A). International..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Dongguan Yuncai Printing Supplies Co Ltd has been granted a patent for Ink Box with Detachable Chip. Wu Xixi, Wu Mingyuan, Ou Tiantian and Li Jinzuo developed the invention.
The patent application number is CN202422454335U 20241011. The patent publication number is CN223327180 (U). International Patent Cla..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Western Metal Mat Co Ltd has submitted a patent application for Porous Silicon Carbon Negative Electrode Material and Preparation Method and Application Thereof. This invention was developed by Zhou Shijie, Hu Linlin, Luo Xuan, Tian Meng, Wang Luhan and Tian Yi.
The patent application number is CN202510403..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Chinese Patent for Plastic Electroplating Product Surface Transfer Printing Treatment Device has been issued to Lihong Ind Jiangmen Co Ltd. This invention was developed by Huang Zhiye, Liang Xixin and Tan Ronggen.
The patent application number is CN20242339986U 20241210. The patent publication number is CN..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Yunnan Yongchang Silicon Ind Co Ltd has sought patent for Automatic Reducing Agent Unloading Method and System for Industrial Silicon Production in Combination with Machine Vision. This invention was developed by Wen Jianhua, Lu Guohong, Choi Kwang Hwi, Zhang Zhongyi, Dong Shumeng, Zhang Shukang, Gao Guangfu,..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Shaanxi Polytechnic Institute and Shaanxi Huaxing Electronic Group Co Ltd have submitted a patent application for Multifunctional Crystal Electroplating Electrolysis Instrument. This invention was developed by Zhu Zhanke, Cheng Hai'ou, Li Zhe, Fang Gang and Quan Lin.
The patent application number is CN2025..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Tianjin Zhonghuan Advanced & Material Technology and Zhonghuan Advanced Semiconductor Technology have been granted a patent for Discharging System for Circulation Warehousing of Silicon Wafer Boxes. Bu Zhaoning, Du Zhipeng, Zhang Jiuwu, Wang Shuai and Tan Yonglin developed the invention.
The patent applica..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Inner Mongolia Daqo New Energy and Inner Mongolia Daqo New Energy Res Institute Co Ltd have submitted a patent application for Electronic-grade Polycrystalline Silicon Reduction Furnace Capable of Feeding Air in Surrounding Manner. Koyu, Huo Chaofei and Zhao Xing developed the invention.
The patent applica..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Changyuan Gongchuang Electric Power Security Technology and Changyuan Tech Group Ltd have sought patent for RFID Chip Automatic Assembling Equipment and Assembling Method. This invention was developed by Zeng Junbin, Wei Lue, Cao An, Zhou Qingxiang, Ma Bo, Xie Biao, Dai Bingfeng, Yang Shangkai and Wang Jiaxua..
Semiconductor
| Sat 17 Jan 2026
London, Jan. 17 -- BOE Technology Group Co Ltd and Chengdu BOE Optoelectronics Technology hav submitted a patent application for Display Substrate and Driving Method Therefor, and Display Device. This invention was developed by Wenhui Gao, Yunsheng Xiao, Tiaomei Zhang and Zhiliang Jiang.
The patent application number is GB202..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Xi'an ESWIN Material Technology and Xi'an Xinxin Material Tech Co Ltd have submitted a patent application for Processing Method for Cleaning Carrier and Wafer. This invention was developed by Zhang Shuxing, Xia Xinchao and Zuo Bin.
The patent application number is CN202510212270 20250225. The patent public..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- China Three Gorges University and Hubei Three Gorges Laboratory have applied Chinese patent for Preparation Method of Supported Cracking Catalyst and Organic Silicon High-boiling Residue Catalytic Cracking Process Thereof. Yang Yizhi, Ji-lin Tianyi, Chen Tianyang and Yang Chen developed it.
The patent appl..
Semiconductor
| Sat 17 Jan 2026
Paris, Jan. 17 -- Linxens has submitted a patent application for Chip Card and Method for Fabricating a Chip Card. This invention was developed by Yeap Yean Wei and Mathieu Christophe.
The patent application number is FR20170051760 20170303. The patent publication number is FR3063555 (A1). International Patent Classification ..
Semiconductor
| Sat 17 Jan 2026
Paris, Jan. 17 -- Commissariat Energie Atomique has sought patent for Microdevice Comprising an Element Protected Against Hf Etching and Formed from a Material Comprising a Semiconductor and a Metal. This invention was developed by Louwers Stephanus.
The patent application number is FR20170058848 20170925. The patent publicat..
Semiconductor
| Sat 17 Jan 2026
Paris, Jan. 17 -- Alstom Transp Tech has filed a patent application for Method for Driving an Insulated Gate Component and Corresponding Driving Circuit. This invention was developed by Andrianoelison Florent.
The patent application number is FR20180072228 20181203. The patent publication number is FR3089369 (A1). Internation..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has released Beijing Xunshi Tech Co Ltd, Beijing Xunshi Biological Tech Co Ltd; Zhejiang Xunshi Biological Tech Co Ltd and Zhejiang Xunshi Gene Tech Co Ltd patent application for Isothermal Amplification-crispr Detection System as Well as Micro-fluidic Chip and Kit ..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has released Elabscience Biotechnology Co Ltd and Elabscience Wuhan Biotechnology Co Ltd patent application for Lipid-type Substrate GPX Activity Detection Kit, Detection Method and Application. This invention was developed by Hu Qinqin, Yang Fei and Ou Xiongyu.
..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- HD Biosciences Co Ltd has applied Chinese patent for CRBN Neo-substrate Expression Plasmid, Cell Line and Application of CRBN Neo-substrate Expression Plasmid in Protac and/or Molecular Gel Screening. Si Hongfei, Wei Jiatong, Mou Shirong, Huang Limei, Chen Jiali and Sun Lingbing developed it.
The patent ap..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Nantong Huakai New Material Tech Co Ltd has received a patent for Release Paper Silicon Coating Machine. This invention was developed by Wu Heng, Yang Jiafeng and Wen Zuojin.
The patent application number is CN202422585299U 20241025. The patent publication number is CN223329622 (U). International Patent Cl..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has sought patent for Nested Protection Device and Method in Crystal Ingot Cutting Process. This invention was developed by Cao Dekun, Yao Zhiyong, Jiang Chengchen, Chen Haibing and Kong Haikuan.
The patent application number is CN202510604862 20250512. T..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Zhongke Shenzhen Wireless Semiconductor Co Ltd has submitted a patent application for Robot Joint Power Chip and Driving Method Thereof. This invention was developed by Ma Shengheng, Li Keju, Gao Fang and Wu Yizhen.
The patent application number is CN202510537050 20250427. The patent publication number is ..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- A Zenith Home Furnishings Co Ltd has submitted a patent application for Preparation Method of Organic Silicon Modified Super-hydrophobic Wood. This invention was developed by Feng Yazong, Jiang Haibo, Gao Linghui and Zhao Gang.
The patent application number is CN202510407646 20250402. The patent publicatio..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has released Shenzhen Kaima Times Tech Co Ltd patent application for Chip Feeding and Discharging Device and Chip Testing Machine. This invention was developed by Shen Bingyuan and Lin Yonghua.
The patent application number is CN202510726423 20250603. The patent ..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Dalian University of Technology has submitted a patent application for Substrate Film Forming Method Combining Ultrasonic Oscillation and Blade Coating. Yan Ying, Lee Woo-taek, Zhou Ping, Fang Zikeng and Wan Jiaqi developed the invention.
The patent application number is CN202510257016 20250305. The patent p..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Gucheng Huilong Metallurgical Access Co Ltd has submitted a patent application for Full-automatic Ceramic Chip Gluing Device. This invention was developed by Zhang Ling, Diao Yuxia and Jang Seong-cheol.
The patent application number is CN202510678345 20250526. The patent publication number is CN120243361 (..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Tianjin Micro Nano Chip Tech Co Ltd has applied Chinese patent for Microfluidic Chip. Wang Zhanhui, Wang Shuxiang and Wang Hongyi developed it.
The patent application number is CN202510662419 20250521. The patent publication number is CN120243162 (A). International Patent Classification code is B01L3/00. C..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Chongqing University has submitted a patent application for Droplet Microfluidic In-situ Test Chip and Method for Research on Microbial Mineralization Crystallization Kinetics. Zhang Jinxuan, Xiao Yang, Cui Hao, He Xiang, Wang Jianxin and Liu Hanlong developed the invention.
The patent application number is ..
Semiconductor
| Sat 17 Jan 2026
Paris, Jan. 17 -- Berger Produits has sought patent for Cartridge with Ceramic Substrate for an Improved Device for the Controlled Diffusion of an Odor, in Particular for an Olfactory Diffuser, and Associated Diffusion Device. This invention was developed by Ozouf Laurent, Gerard Corinne, Rolland Guillaume, Cellier Matthieu and ..
Semiconductor
| Sat 17 Jan 2026
Jerusalem, Jan. 17 -- Asml Netherlands BV has sought patent for Method of Measuring.
The patent application number is IL20190269561 20190923. The patent publication number is IL269561 (A). Cooperative Patent Classification codes are G01B11/02 (IL, KR, US), G03F7/70566 (IL, KR, US), G03F7/70575 (IL, KR, US), G03F7/70583 (IL, K..
Semiconductor
| Sat 17 Jan 2026
Jerusalem, Jan. 17 -- Asml Netherlands BV has sought patent for Lithographic Apparatus and Cooling Method.
The patent application number is IL20190269518 20190922. The patent publication number is IL269518 (A). Cooperative Patent Classification codes are B01D8/00 (EP, KR), F04B15/08 (EP, KR), F04B37/08 (KR), G03F7/70891 (EP, ..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Suzhou Youjing Semiconductor Tech Co Ltd has sought patent for Growth Device of Silicon Carbide Single Crystal and In-situ Annealing Method. This invention was developed by Zhao Wenchao, Chen Jianming, Yuan Changlu, Liu Xianhua and Wu Hao.
The patent application number is CN202510756885 20250609. The paten..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has received Qinghai Jinko Energy Co Ltd patent application for Preparation Method of Monocrystalline Silicon and Silicon Wafer. Cai Hui, Ou Ziyang, Ma Jianqiang, Chen Zhancang, Xiang Peng and Wei Jianxing developed the invention.
The patent application number is..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has published Zhongkejia Shenzhen Semiconductor Tech Co Ltd and Institute of Semiconductors, Chinese Academy of Sciences patent application for Preparation Method of Gallium Nitride Single Crystal Wafer. The invention was developed by Yang Shaoyan, Li Chengming, Yan..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Zhongke Huizhu Guangzhou Semiconductor Co Ltd has filed a patent application for Epitaxial Method for Improving Surface Micro-pit Defect of Silicon Carbide Epitaxial Wafer and Semiconductor Device. This invention was developed by Hu Lingfeng, Yang Junwei, Guo Songbo and Song Huaping.
The patent application..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has received Zhongkejia Shenzhen Semiconductor Tech Co Ltd and Institute of Semiconductors, Chinese Academy of Sciences patent application for Substrate Tray for Preparing Gallium Nitride Single Crystal Thick Film Material. Yang Shaoyan, Yang Rui, Li Chengming, Chen..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has received Nanjing Advanced Semiconductor Tech Nast Co Ltd patent application for Control Method for Automatic Welding of Silicon Single Crystals and Adjustment of Temperature Returning Temperature. Xu Yesheng, Qin Yingsu and Mu Tong developed the invention.
Th..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Shiji Chenxing Tech Nantong Co Ltd has submitted a patent application for Monocrystalline Silicon Growth Furnace and Control Method Thereof. This invention was developed by Huang Taoming and Wu Jianye.
The patent application number is CN202510575184 20250506. The patent publication number is CN120250138 (A..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Shandong Zhuoyue Seiko Group Co Ltd has submitted a patent application for Aluminum Profile Electroplating Control Method, Equipment and System. Liu Hailong, Li Zhiyong, Yin Shuguang, Zhu Pengcheng, Ren Xianwei and Zhao Xi developed the invention.
The patent application number is CN202510732650 20250604. T..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has received Guangde Jinheng Plating Ind Co Ltd patent application for Casting Surface Anti-corrosion Electroplating Processing Device. Ye Shuping, Ye Xin, Zhou Weiping and Yin Yong developed the invention.
The patent application number is CN202510583739 20250507..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Dongguan Baidut Metal Plating Ind Co Ltd has applied Chinese patent for Efficient Electroplating Equipment with Automatic Hardware Feeding and Discharging Assembly. Deng Feng, Quan Junxiong, Luo Zhongyuan and Liu Yangwu developed it.
The patent application number is CN202510387987 20250331. The patent publ..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has published University of Electronic Science and Technology of China and Lianshui Suhang Tech Co Ltd patent application for Plating Solution for Thick Copper Electroplating of Ceramic Substrate and Use Method of Plating Solution. The invention was developed by Che..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has received Jiangsu Aisen Semiconductor Mat Co Ltd and Aisen Semiconductor Mat Nantong Co Ltd patent application for High-stability Electroplating Solution Based on Ultrapure Cobaltous Sulfate as Well as Preparation Method and Application of High-stability Electrop..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Huzhou University has filed a patent application for Ni-based Composite Electroplating Solution for In-situ Generation of CeO2 Based on Cerium Nitrate as Well as Preparation Method and Application of Ni-based Composite Electroplating Solution. This invention was developed by Hao Lifeng and Lee Kang-won.
Th..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has received Dalai Nur Coal Industry and Harbin Institute of Technology patent application for Preparation Method of High-density Silicon Carbide Coating. Wang Zhijiang, Zhang Yuheng, Jing Qinghe, Sun Yuanshuai and Zhang Baocai developed the invention.
The patent..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Tuojing Chuangyi Shenyang Semiconductor Equipment has submitted a patent application for Heater Structure, Semiconductor Equipment and Heater Levelness Adjusting Method. This invention was developed by Wang Qiancheng, Meng Liang, Zhang Chuangchuang, Kan Jinzhuo, Dong Li, Liang Binbin and Zhang Yuansong.
The ..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has published North Integrated Circuit Tech Innovation Center and Institute of Microelectronics, CAS patent application for Bubbling Source Bottle for Atomic Layer Deposition and Thin Film Deposition Equipment. The invention was developed by Ming Shuaiqiang, Wang Zh..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Anhui Polytechnic University has applied Chinese patent for Rapid Loading and Unloading Clamp for Semiconductor Coating. Qiu Shubing, Wang Xiangling, Chen Zhen and Li Daofeng developed it.
The patent application number is CN202510286244 20250312. The patent publication number is CN120249916 (A). Internationa..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has published Zhejiang University patent application for Discontinuous Metal Film with Tunneling Effect, Tunneling Electrode Chip and Preparation Method Thereof. The invention was developed by Tang Longhua, Geng Wenhui, Tian Ye and Ihlon.
The patent application num..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has published Tianjin Pengtong Tech Co Ltd patent application for Substrate Magnetron Sputtering Coating Production Equipment. The invention was developed by Liu Haidong and Yang Yu.
The patent application number is CN202510736222 20250604. The patent publication..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Dongyang First Magnetics Co Ltd has filed a patent application for YIG Material for Substrate Surface Sputtering and Preparation Method Thereof. This invention was developed by Zhang Fangyuan, Li Lingfeng, Shi Longan, Wu Cui, Shen Tuhang, Tong Lei, Li Junling, Yang Hangfu, Zhao Rongzhi and Ruan Jiachang.
T..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Xinte Energy Co Ltd has sought patent for Polycrystalline Silicon Reduction Furnace Composite Coating, Preparation Method Thereof and Polycrystalline Silicon Reduction Furnace. This invention was developed by Hu Hui, Hu Lei, Wang Wen, Zhou Kehu, Liu Dandan, Liu Hao, Zhao Yalan and Teokoori Mukundas.
The pa..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Qingdao University of Science and Technology has filed a patent application for Application and Recovery Method of pH-sensitive Cellulase Based on Substrate Binding Domain Modification. This invention was developed by Li Lu, Zhang Huihui and Su Zhongliang.
The patent application number is CN202510400736 20..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Lihong Ind Jiangmen Co Ltd has been granted a patent for Anti-blocking Plastic Electroplating Liquid Medicine Recovery Device. This invention was developed by Huang Zhiye, Liang Xixin and Chen Shengxing.
The patent application number is CN202422746604U 20241112. The patent publication number is CN223329420..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Wenzhou Zhanxin New Mat Co Ltd has been granted a patent for Automatic Liquid Adding Device for Electroplating Tank. This invention was developed by Oh Kwang-je, Zhang Xianjin, Xu Shunhui and Zhu Shifan.
The patent application number is CN202422729568U 20241110. The patent publication number is CN223329419..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Chinese Patent for Conveying Device for Hardware Electroplating Machining has been issued to Huizhou Xinying Hardware Products Co Ltd. This invention was developed by Ye Jin and Ruan Qingxia.
The patent application number is CN202422805412U 20241118. The patent publication number is CN223329414 (U). Intern..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Sichuan Reach Jiayuan Machinery Co Ltd has been awarded a patent for Clamping Tool for Gear Surface Electroplating. This invention was developed by Su Hongping, Liu Yong and Li Xin.
The patent application number is CN202422633628U 20241030. The patent publication number is CN223329413 (U). International Pa..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Shandong Botong Microelectronics Co Ltd has obtained a patent for pressing plate type double-sided electroplating device for integrated circuit lead frame. This invention was developed by Li Yatao, Zong Qiming and Zhu Yapeng.
The patent application number is CN202422821404U 20241119. The patent publication..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Jian Shengyi Electronics Co Ltd has obtained a patent for floating frame assembly and vertical electroplating equipment. This invention was developed by Guo Kaiwei, Yasuda and Gong Ping.
The patent application number is CN202422661605U 20241101. The patent publication number is CN223329409 (U). Internation..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has published Wuhan Sanxuan Tech Co Ltd patent application for Solvent-free Printing State Film Sealing Adhesive, Preparation Method Thereof and Chip Packaging Method. The invention was developed by Wu De, Cao Dongping, Liao Shuhang and Wang Yanling.
The patent a..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has released Shenzhen Junchengxin Semiconductor Mat Co Ltd patent application for High-speed Polishing Solution for Polishing Silicon Carbide Wafer and Preparation Method of High-speed Polishing Solution. This invention was developed by Chen Xinghui, Yang Hongxing a..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has released Changzhou Institute of Technology patent application for Preparation Method of Photocuring Release Agent Suitable for Flexible Substrate. This invention was developed by Tan Xiyun, Xue Xiaoqiang, Zhou Yitian, Ma Zihao, Shi Gengyao, Wan Dongwu, Wang Ruox..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Qihe Tech Jilin Co Ltd has applied Chinese patent for Heat Insulation Strip Material Prepared by Compounding Biomass-based Silicon Carbon Material and HDPE/PET and Preparation Method of Heat Insulation Strip Material. Wu Changzhen, Li Yongqi, Pei Dianliang, Li Hongkun, Wang Liang, Gao Jianzhong, Wang Lidong, ..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has received Suzhou Aikelong Mat Co Ltd patent application for Preparation Method and Application of Polyimide Dielectric Film. Peng Weifeng developed the invention.
The patent application number is CN202510344736 20250324. The patent publication number is CN1202..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Guangdong Zhonghui Photoelectric Co Ltd has been awarded a patent for Touch Screen Coating Substrate Conveying and Taking Device. This invention was developed by Li Ya.
The patent application number is CN202422823062U 20241119. The patent publication number is CN223328572 (U). International Patent Classifi..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Guizhou Anxin Electronics Co Ltd has been awarded a patent for Led Chip Packaging Anti-shake Swing Arm Motion Control Assembly and Die Bonder. This invention was developed by Hong Shihuai, Zhao Guobing and Yang Yong.
The patent application number is CN202422736960U 20241111. The patent publication number i..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Zhejiang Uivoled Photoelectric Tech Co Ltd has submitted a patent application for Boron-nitrogen Compound, OLED (organic Light Emitting Diode) with Compound and Organic Light Emitting Device. Zhang Lei, Liu Yunqi, Zhang Huaxing, Kong Xiangzhen, Wu Kongwu, Ye Xubing and Zhao Xiaoyu developed the invention.
..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Fuyang Sineva New Material Tech Co Ltd has filed a patent application for Heterocyclic Compound for OLED and Application Thereof. This invention was developed by Guo Jintao, Wang Zhanqi, Li Zhiqiang, Hong Haozhi, Lu Jinbo and Huang Changgang.
The patent application number is CN202510379257 20250328. The pa..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Shandong Junyu Electronic Tech Co Ltd has been awarded a patent for Packaging Equipment for Semiconductor Lead Frame Processing. This invention was developed by Yu Xiaochuan, Chen Jicai, Song Jinlong and Zhang Shiguo.
The patent application number is CN202422665870U 20241101. The patent publication number ..
Semiconductor
| Fri 16 Jan 2026
Beijing, Jan. 17 -- Hebei Dingci Electronic Tech Co Ltd has applied Chinese patent for Heat-resistant Multilayer Ceramic Substrate and Preparation Method Thereof. Jin Huajiang, Wang Hong, Gao Shan, Wang Jin, Guo Zining and Zhao Muyang developed it.
The patent application number is CN202510712551 20250530. The patent publicati..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has published Sichuan Mingtai Microelectronic Tech Co Ltd patent application for Chip Packaging Machine and Chip Packaging Method. The invention was developed by Yang Yidong, Li Shehong, Dong Yong and Wang Yanhui.
The patent application number is CN202510744206 2..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Shanghai Institute of Satellite Equipment has sought patent for Axial Restraining Device for Folded State of Winding Type Flexible Solar Wing Substrate. This invention was developed by Chen Li, Cheng Tao, Li Yaoyao, Cao Hongtao, Wang Xiao and Zhang Chengxiang.
The patent application number is CN202510433583 ..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Anhui Huaxin Micro Nano Integrated Circuit Co Ltd has submitted a patent application for Ink Inlet Cavity Structure of MEMS (micro-electromechanical System) Thermal Bubble Type Ink-jet Printing Head and Preparation Method of Ink Inlet Cavity Structure. This invention was developed by Sui Huan, Pu Yi, Zhen Zhe..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has received Wuhan DR Laser Technology patent application for Filling Method of Transfer Printing Substrate Slurry. Liu Rui, Lu Hao, Nie Guoliang, Xu Tao, Zhu Jun and Liu Hejia developed the invention.
The patent application number is CN202311808462 20231226. The p..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has released Shenzhen Fullchance Rubber Plastic Electronic Co Ltd patent application for Glue-free Butt Joint Method for Pi Electric Heating Sheet and Silicon Carbide. This invention was developed by Zhu Zhilin.
The patent application number is CN202510706700 202..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Nantong Bairun Precision Tech Co Ltd has submitted a patent application for Injection Head Structure of Semiconductor Packaging Mold. This invention was developed by Du Xin and Sun Sujian.
The patent application number is CN202510551630 20250429. The patent publication number is CN120245322 (A). Internatio..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Fujian Xinrui New Material Tech Co Ltd has submitted a patent application for Organic Silicon Supercritical Foaming Device and Foaming Method. Liu Xuedong, Pan Hanyu, Wang Chongda and Wang Guilong developed the invention.
The patent application number is CN202510741331 20250605. The patent publication numb..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has released Jiaxing Tianze Environmental Protection Tech Co Ltd patent application for Three-axis Truss Robot for Electroplating and Control System. This invention was developed by Wang Dongyi.
The patent application number is CN202510486721 20250418. The patent..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Nanjing Fukexun New Mat Co Ltd has submitted a patent application for Diamond Trimmer Based on CVD (chemical Vapor Deposition) Process. This invention was developed by Zhan Jun.
The patent application number is CN202510491270 20250418. The patent publication number is CN120244835 (A). International Patent ..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has received Beijing Tesidi Semiconductor Equipment patent application for Capsule Film, Polishing Pressure Head, Equipment and Method for Polishing Square Substrate. Tan Zhiliang, Liu Yongfeng, Kou Minghu and Sun Zhanshuai developed the invention.
The patent appli..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has published Beijing Tesidi Semiconductor Equipment patent application for Capsule Film, Polishing Pressure Head, Equipment and Method for Polishing Square Substrate. The invention was developed by Tan Zhiliang, Liu Yongfeng, Kou Minghu and Sun Zhanshuai.
The pate..
Semiconductor
| Sat 17 Jan 2026
London, Jan. 17 -- NVIDIA has submitted a patent application for Heat Recovery for Datacenter Cooling Systems. This invention was developed by Ali Heydari.
The patent application number is GB20210013635 20210924. The patent publication number is GB2600248 (A). International Patent Classification codes are F25B15/06 and H05K7/..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Jiangsu Aideke Photon Tech Co Ltd has submitted a patent application for Welding Device for Semiconductor Laser Shell Production. This invention was developed by Zhan Zhongyi.
The patent application number is CN202510701241 20250528. The patent publication number is CN120244382 (A). International Patent Cl..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Guangdong Chuanyuan Prec Mould Co Ltd has submitted a patent application for Working Method of Chip Inductor Compression Molding Equipment. He Bangcheng, He Kaoxian, Si Jun, Liu Debao and Su Ruiheng developed the invention.
The patent application number is CN202510568559 20250430. The patent publication nu..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has released Zhongrun New Energy, Chuzhou and Zhongrun New Energy, Xuzhou patent application for Quartz Boat Cleaning Assembly for Solar Cell Production. This invention was developed by Ding Kaishun.
The patent application number is CN202510375753 20250327. The p..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Shenzhen ZLC Intelligent Equipment Co Ltd has submitted a patent application for Dry Ice Cleaning Machine for Semiconductor Materials. This invention was developed by Lu Lichang, Miao Yinghua, Deng Bijing, Li Wanyang, Chen Haojie and Deng Wuquan.
The patent application number is CN202510429910 20250408. Th..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Shenzhen Hongkang Electronics Co Ltd has submitted a patent application for Full-automatic Horizontal Cleaning Equipment for Semiconductor Device. This invention was developed by Zhao Mingsheng.
The patent application number is CN202510651489 20250520. The patent publication number is CN120243544 (A). Inte..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- Suzhou Shihua Engineering Science & Tech Co Ltd has filed a patent application for Chemical Reaction Kettle for Processing Electroplating Additive for Integrated Circuit. This invention was developed by Pan Chunxiao.
The patent application number is CN202510296090 20250313. The patent publication number is..
Semiconductor
| Sat 17 Jan 2026
Beijing, Jan. 17 -- State Intellectual Property Office of China has published Suzhou Research Institute of Southeast University patent application for Gold and Silver Heterogeneous Noble Metal Nano Forest Electrode Based on Three-dimensional Porous Sponge Substrate as Well as Preparation Method and Application of Gold and Silver..
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