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Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Ningbo Fotile Kitchen Ware has applied Chinese patent for Bluetooth Chip Integrated with Saw Signal Acquisition and Communication Equipment. Hu Guogen, Hong Kun and Tian Meng developed it.
The patent application number is CN202610512090 20260417. The patent publication number is CN122394597 (A). Internationa..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Spreadtrum Communications (Shanghai) has filed a patent application for Voltage Configuration Method and Device, Communication Equipment, Chip and Chip Module. This invention was developed by Liu Baihua.
The patent application number is CN202610466524 20260409. The patent publication number is CN122394589 (A..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Semiconductor Manufacturing International (Shanghai) has submitted a patent application for Clock Signal Generation Circuit and System on Chip. This invention was developed by Xie Feng, Lei Wei and Sun Xingqu.
The patent application number is CN20251060818 20250114. The patent publication number is CN1223945..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has released Suzhou Hantianxia Electronics patent application for High-integration Low-loss Hybrid Fbar Chip Based on Glass Through Hole Technology. This invention was developed by Li Keyan, Lai Zhiguo and Yang Qinghua.
The patent application number is CN2026105077..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Realtek Semiconductor Corporation has submitted a patent application for Oscillator and Operating Method Thereof. This invention was developed by Wang Zhixian.
The patent application number is CN20251045496 20250113. The patent publication number is CN122394501 (A). International Patent Classification codes ..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Silergy Semiconductor Technology (Hangzhou) has submitted a patent application for Current Detection Method of Three-phase Permanent Magnet Motor and Driving Module. This invention was developed by Zhong Zhenfeng, Jia Kunlei and Cao Junpeng.
The patent application number is CN202610390990 20260327. The paten..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has published Zhuhai Nanxin Semiconductor Technology patent application for Load Current Sampling Circuit, Buck Converter and Power Supply Chip. The invention was developed by Lang Tianchen, Geng Xiang and Kuang Jianjun.
The patent application number is CN202610258..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Guangzhou Power Supply Bureau of Guangdong Power Grid has filed a patent application for Driving Device and Method of Semiconductor Device and Current Balance Control System. This invention was developed by Xiong Jun, Pan Wei, Ma Zhiyuan, Wang Rui, Wang Yong, Liu Chang, Zhou Kai, Luo Linhuan, Cui Xiaofei, Xu ..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Air Inlet Device and Semiconductor Process Equipment. Wang Yan developed the invention.
The patent application number is CN20251052882 20250113. The patent publication number is CN122393184 (A). International Patent Classificatio..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has received Guizhou Normal University patent application for Method for Calculating Doping Characteristic of N-type AgBiS2 Material Under Narrow Chemical Potential Window. Wang Gang, Gao Changsong, Xu Ziqiang, Shi Luping, Wang Degui, Liu Mingqiang, Bi Jinshun, Xiao..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Samsung Electronics has submitted a patent application for Semiconductor Memory Package Including Semiconductor Memory Chip Having Internal Circuit and Buffer Circuit, and Storage Device Including the Same. This invention was developed by Song Kiwhan, Choi Youngha, Lee Hyunee, Song Seunghwan, Song Seongjin..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing patent application for Packaged Memory Device and Method. This invention was developed by Tsai Chung-hao, Wang Yih, Yu Chen-hua, Wang Chuei-tang and Chen Wei-ting.
The patent application number is US202619724183 20260629. The..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing has applied United States patent for Photonic Semiconductor Device and Method of Manufacture. Hsia Hsing-kuo and Yu Chen-hua developed it.
The patent application number is US202619716999 20260623. The patent publication number is US20260334314 (A1). International Patent ..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Micron Technology has submitted a patent application for Methods of Forming a Portion of a Memory Including a Memory Array Structure. This invention was developed by Surthi Shyam.
The patent application number is US202619692207 20260529. The patent publication number is US20260334312 (A1). International P..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- LG Display has submitted a patent application for Display Device Including Light Emitting Diode. Ryu Ho-jin developed the invention.
The patent application number is US202619639117 20260403. The patent publication number is US20260333972 (A1). International Patent Classification codes are H10H29/39 and H1..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has received Realtek Semiconductor Corporation patent application for Circuit Design Method and Electronic Device for Executing Circuit Design Method. Peng Yanlin and Yi Huai'en developed the invention.
The patent application number is CN20251050645 20250113. The p..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Peng Cheng Laboratory has submitted a patent application for Cross-layer Evaluation Method, Device and Equipment for Self-heating Effect of Chip and Storage Medium. This invention was developed by Xie Biwei, Li Yifan, Li Xingquan, Long Zehao, Liu Junfeng, Zhao Jie and Long Shuaiying.
The patent application n..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has published Muxi Integrated Circuit (Shanghai) patent application for Hybrid Protocol Chip Bus Delay Adjustment Method, Electronic Equipment and Medium. The invention was developed by Wang Ding and Guo Xiaoxin.
The patent application number is CN202610535224 2026..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Institute of Microelectronics, CAS has submitted a patent application for Modeling Method and Device of Chip Packaging Structure, Storage Medium and Computer Equipment. This invention was developed by Ma Rui, Lei Bo, Li Jun, Su Meiying, Wang Qidong, Zhou Yunyan, Yang Chenglin and Zhao Jingyi.
The patent appl..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Wuhan Tianma Microelectronics has submitted a patent application for Array Substrate and Display Panel. This invention was developed by Wang Xianchi, Ke Qiyong, Zhao Xu and Liu Rusheng.
The patent application number is US202619707505 20260615. The patent publication number is US20260333874 (A1). Internati..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Sharp Display Technology has sought patent for Wiring Substrate and Display Device. This invention was developed by Nakagawa Hidetoshi.
The patent application number is US202619558743 20260306. The patent publication number is US20260333873 (A1). International Patent Classification codes are G02F1/1368, H..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Intel has sought patent for Wall That Includes a Gas Between Metal Gates of a Semiconductor Device. This invention was developed by Zhu Baofu, Liu Shengsi, Ghani Tahir, Yemenicioglu Sukru, Guler Leonard P and Sun Hongqian.
The patent application number is US202619685461 20260522. The patent publication nu..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Texas Instruments Incorporated has submitted a patent application for Integrated Boot Diode with High Forward Bias Capability. This invention was developed by Lee Dong Seup, Kim Sunglyong and Lee Kyoung Min.
The patent application number is US202619725116 20260630. The patent publication number is US20260..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Profile Control of a Gap Fill Structure. This invention was developed by Wen Ming-chang, Wu Wan-yao and Chang Chang-yun.
The patent application number is US202619725098 20260630. The patent publication number is US20260333839 (A1). ..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing patent application for Dipole Doping for Cfets with Reduced Loading. This invention was developed by Lee Hsin-yuan, Wang Hsin-chih, Yang Chih-kai, Huang Yi-fan, Shen Yu-tien and Shieh Ming-feng.
The patent application number ..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- High Frequency (Beijing) Technology has submitted a patent application for Multi-scale Dynamic Simulation Deduction System for Semiconductor Water System. Zhang Jiahui and Xie Hai developed the invention.
The patent application number is CN202610479052 20260413. The patent publication number is CN122389699 (..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Methods of Forming Source/drain Regions and Overlying Dielectric Layers in CFETs. This invention was developed by Shih Che Chi, Lin Zhi-chang, Chen Szu-hua, Chiang Yu-hsien, Liao Szuya, Su Man-nung and Yang Ku-feng.
The patent app..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Source/drain Epitaxial Profiles and Methods of Forming. This invention was developed by Yu Ming-hua, Chang Ching and Kuo Chien-i.
The patent application number is US202519184503 20250421. The patent publication number is US2026033..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device and Method of Manufacturing Semiconductor Device. This invention was developed by Dansako Daichi.
The patent application number is US202619532071 20260206. The patent publication number is US20260333821 (A1). International Pat..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has received Tokyo Electron patent application for Methods for Fabricating Contact Structures. Yonezawa Ryota, Ishizaka Tadahiro, Suzuki Hidenao and Yu Kai-hung developed the invention.
The patent application number is US202519184215 20250421. The patent publication number..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Infineon Technologies, Austria has sought patent for Group III Nitride Semiconductor Device. This invention was developed by Knuuttila Lauri Olavi and Cubarovs Mihails.
The patent application number is US202619645978 20260413. The patent publication number is US20260333809 (A1). International Patent Cla..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has released Micron Technology patent application for Electronic Devices Comprising a Source Implant Region, and Related Electronic Systems and Methods. This invention was developed by Scarbrough Alyssa N and Howder Collin.
The patent application number is US202619715656 2..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- DENSO has filed a patent application for Field Effect Transistor and Method of Manufacturing the Same. This invention was developed by Takaya Hidefumi.
The patent application number is US202619720534 20260625. The patent publication number is US20260333786 (A1). International Patent Classification codes..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Microchip Technology has submitted a patent application for Jfet Having a Lateral Channel. Pandey Shesh Mani developed the invention.
The patent application number is US202619644859 20260410. The patent publication number is US20260333781 (A1). International Patent Classification codes are H10D30/01, H10D..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Infineon Technologies, Austria has submitted a patent application for Trench Junction Field Effect Transistor Including a Mesa Region. Weber Hans, Treu Michael Franz, Riegler Andreas and Aichriedler Leo developed the invention.
The patent application number is US202419486624 20240521. The patent publica..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has released Hyundai Mobis patent application for Power Semiconductor Device. This invention was developed by Kim Tae Yang, Woo Hyuk, Kim Sin A, Ha Jeong Mok, Kim Tae Yeop, Lee Ju Hwan and Kang Min Gi.
The patent application number is US202619722499 20260626. The patent pu..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Samsung Electronics has sought patent for Nonvolatile Memory Device Including Sub-planes. This invention was developed by Park Jeunghwan, Kim Youngjae, Byeon Youngseok, Kang Kyungmin, Wi Jonguk, Shin Dongha, Lee Myunghun, Kim Jongryul, Kim Junhyoung, Nam Hanmin and Rho Changhyun.
The patent application nu..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Micron Technology has submitted a patent application for Memory Array and Method Used in Forming a Memory Array Comprising Strings of Memory Cells. Scarbrough Alyssa N, Hopkins John D, Greenlee Jordan D and Lomeli Nancy M developed the invention.
The patent application number is US202619725166 20260630. T..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has published SK Hynix patent application for Three-dimensional Semiconductor Device and Method of Manufacturing the Three-dimensional Semiconductor Device. The invention was developed by Ahn Jung Ryul and Lee Seung Min.
The patent application number is US202619724579 2026..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Micron Technology has applied United States patent for Microelectronic Devices, and Related Methods and Memory Devices. Lengade Swapnil A, Li Haoyu, Zheng Pengyuan, Klein Rita J and Mcteer Everett A developed it.
The patent application number is US202619632791 20260330. The patent publication number is US..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has published Micron Technology patent application for Vertical Non-volatile Memory with Low Resistance Source Contact. The invention was developed by Clampitt Darwin A, Mckinsey Wesley O and Hopkins John.
The patent application number is US202619558322 20260305. The paten..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has released Beijing Xiaomi Mobile Software patent application for Method and Device for Determining Link, and Storage Medium and Chip. This invention was developed by Yang Xing.
The patent application number is US202218993277 20220713. The patent publication number is US2..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Beijing Xiaomi Mobile Software has filed a patent application for Communication Method and Apparatus, and Device, Storage Medium and Chip. This invention was developed by Wu Jinhua.
The patent application number is US202219122829 20221021. The patent publication number is US20260333271 (A1). International..
Semiconductor
| Thu 29 Oct 2026
Alexandria, Oct. 29 -- Realtek Semiconductor Corporation has filed a patent application for Signal Processing System, Monitoring Apparatus and Signal Processing Method. This invention was developed by Cyu Syu-min, Lee Wen-yung and Chou Hsin-hong.
The patent application number is US202619640745 20260407. The patent publication n..
Semiconductor
| Thu 29 Oct 2026
Beijing, Oct. 29 -- Xiaomi Automobile Technology has submitted a patent application for Commuting Portrait Generation Method and Device, Electronic Equipment, Chip and Storage Medium. Feng Yuchuan developed the invention.
The patent application number is CN202610475824 20260410. The patent publication number is CN122388608 (A)...
Semiconductor
| Thu 29 Oct 2026
Alexandria, Oct. 29 -- NVIDIA has filed a patent application for Switch Policies and Apis for Changing States in Communication Interface Links. This invention was developed by Tyson Eric and Narrishetti Naveen Kumar.
The patent application number is US202519186378 20250422. The patent publication number is US20260332540 (A1). I..
Semiconductor
| Thu 29 Oct 2026
Alexandria, Oct. 29 -- NVIDIA has applied United States patent for Switch Policies and Apis for Changing States in Communication Interface Links. Tyson Eric and Narrishetti Naveen Kumar developed it.
The patent application number is US202519186391 20250422. The patent publication number is US20260332532 (A1). International Pate..
Semiconductor
| Thu 29 Oct 2026
Alexandria, Oct. 29 -- NVIDIA has submitted a patent application for Lane Staggering in Multi-lane Communication Interface Links. This invention was developed by Dutt Hitendra Krishna, Huang Robert and Glaser Steve.
The patent application number is US202519186419 20250422. The patent publication number is US20260332527 (A1). In..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Institute of Applied Electronics, China Academy of Engineering Physics has sought patent for Narrow-linewidth Optical Fiber Coupling Semiconductor Laser with Spectrum Capable of Being Continuously Tuned. This invention was developed by Jiang Quanwei, Yang Xingbang, Tan Hao, Takamatsu Makoto, Zhang Lanping, Li..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Guangxi Juxin Technology has filed a patent application for Multi-wavelength Laser Chip and White Laser Light Source. This invention was developed by Meng Linghai, Liu Lei, Fu Jianbo, Hu Xiaodong, Du Mingyu, Zong Hua, Qin Xianzhuang, Luo Zhengbiao and Jiang Shengxiang.
The patent application number is CN2026..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has received Accelink Technologies patent application for High-saturation-power Narrow-linewidth Tunable Laser Chip and Manufacturing Method Thereof. He Weiqi, Zhang Xuzhi and Zhao Jianyi developed the invention.
The patent application number is CN20251054017 20250..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has published Accelink Technologies patent application for Semiconductor Chip and Manufacturing Method Thereof. The invention was developed by Liu Yang, He Weiqi, Zhang Xuzhi, Zhang Song and Zhao Jianyi.
The patent application number is CN20251052779 20250114. The ..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Shenzhen Xinkailai Industry Machine has submitted a patent application for Connection Kit, Semiconductor Chamber and Semiconductor Device. Jiang Yuanhang and Yin Shiliu developed the invention.
The patent application number is CN202610243200 20260228. The patent publication number is CN122393644 (A). Interna..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has received Chengdu Titan Testing Technology patent application for Test Data Processing System, Algorithm Pattern Generator, Storage Chip Automatic Test Equipment, Link Protection Code Generation Method, Test Data Processing Method and Computer Program Product. Ch..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Samsung Electronics has submitted a patent application for Nonvolatile Memory Device, Method of Operating Same, and Memory Device. This invention was developed by Song Seung-hwan, Lee Hyun-yi, Kim Wan-dong, Jung Young-seok, Song Chengzhen and Choi Young-ha.
The patent application number is CN202511766070 202..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Gexin USA Integrated Circuit Technology has submitted a patent application for Magnetic Screen Structure for Chip. Naik Vivek Bharat, Thalapatra Ajay and Pravotto Christopher C developed the invention.
The patent application number is CN202511864994 20251211. The patent publication number is CN122392588 (A)...
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- State Intellectual Property Office of China has received SK Hynix patent application for Memory Device Generating Per-pin Reference Voltage. Choi Eun-ji, Ok Sung-hwa, Hong Jae-hyung, Seo Bum-kyu and Zhang Junrui developed the invention.
The patent application number is CN202510995234 20250718. The patent pub..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Chipone Technology, Beijing has applied Chinese patent for Chroma Correction Method and Device of Display Screen, Display Device and Chip. Nario developed it.
The patent application number is CN202610416903 20260331. The patent publication number is CN122392426 (A). International Patent Classification code i..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Taiyuan University of Technology has sought patent for Vcsel Chip Defect Detection Model, Method and Device Based on Small Sample. This invention was developed by Guo Shuai, Hu Yanhan, Zhang Minfu, Zhang Chuandong, Liu Zhongkai and Sun Ziqiang.
The patent application number is CN202610837845 20260611. The pa..
Semiconductor
| Fri 30 Oct 2026
Beijing, Oct. 29 -- Wuhan Guochuangke Photoelectric Equipment has applied Chinese patent for Ink Droplet Tying Belt Length Processing Method Related to Substrate Ink-jet Printing and Ink-jet Printer. Tang Jun, Ma Weifei, Gao Junwei, Tang Wei and Peng Gan developed it.
The patent application number is CN202610630909 20260509. Th..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Sandisk Technology has sought patent for Bonded Assemblies with Large Through-silicon Vias and Methods for Forming the Same. This invention was developed by Nishida Akio, Li Yan and Yoon In-soo.
The patent application number is US202619725998 20260630. The patent publication number is US20260334334 (A1). ..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Texas Instruments Incorporated has applied United States patent for Stacked Semicondcutor Package. Awasthi Shambhavi, Gojagoji Sachin Ishwar and Hegde Hegde Ashish developed it.
The patent application number is US202519314582 20250829. The patent publication number is US20260334308 (A1). International Pat..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Heterogeneous Integrated Electro-optical Apparatus. This invention was developed by Chern Chan-hong.
The patent application number is US202519182204 20250417. The patent publication number is US20260334303 (A1). International Patent..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Sumitomo Electric Device Innovations has submitted a patent application for Semiconductor Device and Method of Manufacturing Semiconductor Device. This invention was developed by Kitawada Takashi.
The patent application number is US202619644004 20260410. The patent publication number is US20260334300 (A1)..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has published Siemens patent application for Method for Producing an Arrangement Having a Housing Part for Receiving a Semiconductor Element and Having a Base Plate. The invention was developed by Hüttner Rainer and Werner Ronny.
The patent application number is US2023191..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has published Microchip Technology patent application for Power Semiconductor Device Package with Buffer Material. The invention was developed by Estrada Fernando and Pandey Shesh.
The patent application number is US202519247617 20250624. The patent publication number is U..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has received Absolics patent application for Packaging Substrate and Semiconductor Package Comprising the Same. Lee Si Hun developed the invention.
The patent application number is US202619651765 20260419. The patent publication number is US20260334269 (A1). International ..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Huawei Technologies has sought patent for Circuit Board, Communication Device, and Chip. This invention was developed by Tian Qingshan, Gao Feng, Cai Li and Cheng Liujun.
The patent application number is US202619683263 20260520. The patent publication number is US20260334266 (A1). International Patent Cla..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Semiconductor Components Industries has submitted a patent application for Semiconductor Device Package with Integral Multi-layer Leads and Method of Manufacturing. Zschieschang Olaf and Sharma Ankit Bhushan developed the invention.
The patent application number is US202619648719 20260415. The patent publ..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Micron Technology has applied United States patent for Electronic Device Features for Evaluation of Singulation Positioning. Leow See Hiong, Chong Chin Hui, Tan Kelvin Aik Boo, Ye Seng Kim and Ng Hong Wan developed it.
The patent application number is US202619576813 20260324. The patent publication number..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Samsung Electronics has submitted a patent application for Semiconductor Package Including an Interposer Substrate. This invention was developed by Ryu Seung-kwan, Park Jihong, Park Yukyung and Kim Hyeonjae.
The patent application number is US202619439646 20260105. The patent publication number is US20260..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- LG Innotek has filed a patent application for Circuit Board and Semiconductor Package Comprising Same. This invention was developed by Kong Eun Young, Kim Sung Min and Hwang See Yoon.
The patent application number is US202319104738 20230823. The patent publication number is US20260334255 (A1). Internation..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Siliconware Precision Industries has submitted a patent application for Electronic Package and Substrate Thereof. This invention was developed by Chen Yu-chen and Chen Szu-hsien.
The patent application number is US202619635615 20260331. The patent publication number is US20260334254 (A1). International Pa..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Semiconductor Components Industries has filed a patent application for Power Module Package Having Power Tab. This invention was developed by Kim Taekyun, Baek Jonghwan, Shin Hangil and Kim Jihwan.
The patent application number is US202519184839 20250421. The patent publication number is US20260334247 (A1..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing has filed a patent application for Doped Well and Alignment Mark for Semiconductor Devices. This invention was developed by Chen Liang-yin, Wang Bau-ming and Chen Chien-hao.
The patent application number is US202619728953 20260702. The patent publication number is US2026..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- SK Hynix has filed a patent application for Semiconductor Device. This invention was developed by Chang Heon Yong, Kim Chi Soung and Baek Jong Won.
The patent application number is US202519315660 20250901. The patent publication number is US20260334239 (A1). International Patent Classification codes are H..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- SK Hynix has submitted a patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Chang Heon Yong.
The patent application number is US202519303008 20250818. The patent publication number is US20260334233 (A1). International Patent Classification cod..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- SK Hynix has sought patent for Semiconductor Device. This invention was developed by Chang Heon Yong.
The patent application number is US202519310931 20250827. The patent publication number is US20260334232 (A1). International Patent Classification codes are H10W42/00 and H10W46/00. Cooperative Patent Cla..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Sandisk Technology has submitted a patent application for Semiconductor Device Package with Heat Spreader. This invention was developed by Nagarajan Raghavan, Zheng Chaolun, Sanyal Apratim and S Hariharapandian.
The patent application number is US202519185770 20250422. The patent publication number is US2..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has released ROHM patent application for Semiconductor Device, Inverter Device, Method for Manufacturing Inverter Device, and Vehicle. This invention was developed by Ishihara Takayuki.
The patent application number is US202619694354 20260601. The patent publication numb..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing has sought patent for Semiconductor Package and Method for Forming the Same. This invention was developed by Yu Chen-hua, Hsieh Cheng-chieh, Ku Shih-chang, Lien Yu-jen and Wang Li.
The patent application number is US202619728428 20260702. The patent publication number is..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Samsung Electronics has submitted a patent application for Integrated Circuit and Method of Designing the Integrated Circuit. This invention was developed by Kim Wook and Kang Sunggu.
The patent application number is US202619574679 20260323. The patent publication number is US20260334214 (A1). Internation..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Samsung Electronics has submitted a patent application for Semiconductor Chip Including Through Via. This invention was developed by Jung Jaemok, Park Chanwook, Park Jongho, Ha Taeoh and Yang Hyun.
The patent application number is US202619648781 20260415. The patent publication number is US20260334212 (A1..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Infineon Technologies has submitted a patent application for Semiconductor Device Compising a Gate Interconnection Line. Peters Dethard, Siemieniec Thomas Ralf and Korzenietz Andreas developed the invention.
The patent application number is US202619648431 20260415. The patent publication number is US20260..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Intel has submitted a patent application for Dual-sided Terminal Device with Split Signal and Power Routing. Reif Stefan, Prasad Vishnu, Proschwitz Jan, Seidemann Georg and Waidhas Bernd developed the invention.
The patent application number is US202619725953 20260630. The patent publication number is U..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Interconnect Structure with Dielectric Cap Layer and Etch Stop Layer Stack. This invention was developed by Wang Jen Hung and Wang Chao-chun.
The patent application number is US202619725852 20260630. The patent publication number is..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Tokyo Electron has submitted a patent application for Methods for Making Semiconductor Devices Having an Oxide Liner for Metal Interconnect. This invention was developed by Rogers Jack and Lemley Corey.
The patent application number is US202519184228 20250421. The patent publication number is US2026033418..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Kokusai Electric has submitted a patent application for Substrate Processing Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording Medium. This invention was developed by Horii Sadayoshi, Karasawa Koichi, Ueda Tatsushi and Kakuda..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Ebara has filed a patent application for Method for Controlling Operation of Substrate Processing Apparatus, and Substrate Processing Apparatus. This invention was developed by Hamano Makoto, Sato Tensei and Koizumi Ryuya.
The patent application number is US202619552940 20260227. The patent publication nu..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- EV Group E Thallner has submitted a patent application for Vacuum Substrate Holder with Optimised Vacuum Seal. This invention was developed by Wimplinger Markus.
The patent application number is US202219105894 20220902. The patent publication number is US20260334161 (A1). International Patent Classificati..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Commissariat a Ienergie Atomique Et Aux Energies Alternatives has filed a patent application for Method of Preparing a Structured Substrate for Direct Bonding. This invention was developed by Fournel Franck and Montmeat Pierre.
The patent application number is US202619468511 20260203. The patent publicati..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has received Applied Materials patent application for Feature Creation in Substrate Supports. Lei Wei-sheng, Sommers Joseph Frederick, Beaudry Christopher Laurent, Behnke Joseph Frederick, Chadha Arvinder Manmohansingh and Joshi Gagandeep Singh developed the invention.
The..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has released ASM patent application for Substrate Processing Apparatus. This invention was developed by Lee Juill, Kim Daeyoun, Jeong Yongjin and Chae Heebum.
The patent application number is US202619636110 20260401. The patent publication number is US20260334151 (A1). Int..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- SHINKAWA Electric has submitted a patent application for Manufacturing Apparatus and Manufacturing Method of Semiconductor Device. This invention was developed by Eguchi Yuji and Seyama Kohei.
The patent application number is US202619529005 20260203. The patent publication number is US20260334150 (A1). ..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Shin-Etsu Polymer has submitted a patent application for Substrate Container. Ogawa Osamu and Tominaga Kiminori developed the invention.
The patent application number is US202319117394 20230328. The patent publication number is US20260334147 (A1). International Patent Classification codes are F16K24/00 ..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Miraial has submitted a patent application for Substrate Storage Container. This invention was developed by Kubota Kouji.
The patent application number is US202319491148 20230609. The patent publication number is US20260334146 (A1). International Patent Classification code is H10P72/10. Cooperative Patent..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- Applied Materials has filed a patent application for Apparatus and Techniques for Generator Control Using an Input/output (IO) Hub. This invention was developed by Chen Jian J, Choi Byung Dae, Puttanna Naveen Channarayapatna and Garner Stephen C.
The patent application number is US202519309365 20250825...
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- SCREEN Holdings has submitted a patent application for Substrate Processing Apparatus. This invention was developed by Kajino Itsuki, Hishitani Daisuke, Nemoto Shuhei, Nishimura Tomomitsu, Shoji Kazuhiro and Sato Yusuke.
The patent application number is US202319106761 20230724. The patent publication numb..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has published Samsung Electronics patent application for Substrate Cleaning Apparatus and Substrate Treatment System Including the Same. The invention was developed by Park Sang Jine and Park Ji Hwan.
The patent application number is US202619565447 20260312. The patent pub..
Semiconductor
| Fri 30 Oct 2026
Alexandria, Oct. 29 -- U.S. Patent and Trademark Office has received Tokyo Electron patent application for Substrate Processing Method, Substrate Processing Apparatus, and Recording Medium. Mizuguchi Shoki and Sakurai Hiroki developed the invention.
The patent application number is US202619529149 20260204. The patent publicatio..
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