Semiconductor
| Wed 15 Jul 2026
Alexandria, July 16 -- Intel has been granted a patent for Integrated Circuit Package with Multi-layered Metallization Lines. Nad Suddhasattwa, Duong Benjamin, Wang Hsin-wei, Ecton Jeremy, Marin Brandon, Aleksov Aleksandar, May Robert A, Grujicic Darko, Darmawikarta Kristof and Arana Leonel developed the invention.
The patent..