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Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- State Intellectual Property Office of China has awarded a patent to Beijing Xintron Office Equipment Co Ltd for Consumable Chip. Li Jianfeng, Lin Yuanzhi and Li Desheng developed the invention. The patent application number is CN202520210320U 20250211. The patent publication number is CN223665010 (U). Int..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Wuxi Xinyuanwei Tech Co Ltd has been awarded a patent for Integrated Circuit Chip Burning Seat Convenient to Take Out. This invention was developed by Qing Xiaozheng. The patent application number is CN202423191786U 20241224. The patent publication number is CN223664992 (U). International Patent Classific..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Chinese Patent for Integrated Chip and Electronic Device has been issued to Beishan Integrated Circuit Shenzhen Co Ltd. This invention was developed by Zeng Jinghong. The patent application number is CN20252077527U 20250113. The patent publication number is CN223664959 (U). International Patent Classifica..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Sichuan Jiuzhou Electronic Technology has been awarded a patent for Current Expanding Circuit for LDO (low Dropout Regulator) Chip. This invention was developed by Peng Hongsong, Fang Hao, You Yuanhui, Huang Qian, Xue Yao and Li Hongbin. The patent application number is CN20252004725U 20250102. The patent p..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Beijing NAURA Microelectronics Equipment has secured a patent on Heat Exchange System and Semiconductor Process Equipment. Li Xuejun developed the invention. The patent application number is CN202520236470U 20250214. The patent publication number is CN223663820 (U). International Patent Classification codes..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- State Intellectual Property Office of China has awarded a patent to Shanghai Jita Semiconductor for Vertical Furnace Control System and Machine for Preparing Semiconductor Structure. Sheng Jianjun developed the invention. The patent application number is CN20252017127U 20250103. The patent publication numbe..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Longling Shunkang Silicon Smelting Co Ltd has received a patent for Water-cooling Flue for Industrial Silicon Heating Furnace. This invention was developed by Zhou Chaoyu and Yang Deming. The patent application number is CN20252022364U 20250106. The patent publication number is CN223663772 (U). Internatio..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- State Intellectual Property Office of China has awarded a patent to Xi'an Haige Electric Technology for Power Tube Overcurrent Protection Circuit Based on Voltage Monitoring Reset Chip. Zhao Mingming, Yu Zhu and Wang Zhiwen developed the invention. The patent application number is CN20242354080U 20241211. T..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Yunnan Detong Tech Co Ltd has obtained a patent for integrated 2*4 channel wavelength division demultiplexing germanium-silicon photodiode receiving array chip. This invention was developed by Xiao Xiao, Shan Li and Yang Faxi. The patent application number is CN202423233139U 20241226. The patent publicati..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Anhui Chenda Semiconductor Co Ltd has secured a patent on Composite Surge Suppressor with Planar Packaging Structure. Ma Yijun and Ma Yimian developed the invention. The patent application number is CN202422955522U 20241202. The patent publication number is CN223666038 (U). International Patent Classifica..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- State Intellectual Property Office of China has awarded a patent to Beijing GL Microelectronics Tech Co Ltd for Protection Circuit, Digital Input Receiver Circuit, and Digital Input Receiver Chip. Wang Zhan, Ma Chunyu and Yang Jing developed the invention. The patent application number is CN202423107347U ..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Anhui Yutu Tech Co Ltd has been awarded a patent for Cholesterol Liquid Crystal Panel and Color Film Substrate Thereof. This invention was developed by Wang Lizhong. The patent application number is CN202423315298U 20241231. The patent publication number is CN223664875 (U). International Patent Classifica..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Suzhou Kaixin Semiconductor Tech Co Ltd has received a patent for Furnace Door Opening and Closing Moving Device of High-temperature Purification Furnace. This invention was developed by He Pengbo and Li Yalin. The patent application number is CN202422651007U 20241031. The patent publication number is CN2..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Jiangsu Xianjin Quancheng Tech Co Ltd has secured a patent on Semiconductor Device Heat Treatment Equipment. Zhu Wanglong and Li Lei developed the invention. The patent application number is CN202422653836U 20241031. The patent publication number is CN223663733 (U). International Patent Classification cod..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Shenzhen Shanzhiben Ind Development Co Ltd has been granted a patent for Moisture-proof and Moisture-proof Chip Capacitor. This invention was developed by Lin Hanshan and Lin Miaoyan. The patent application number is CN202520225779U 20250212. The patent publication number is CN223665309 (U). International..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Anhui Taige Electronics Co Ltd has received a patent for Transformer Silicon Steel Sheet Lamination Tool. This invention was developed by Cao Guoqing, Zhang Yang, Weng Liang and Pan Jingbang. The patent application number is CN202520283802U 20250221. The patent publication number is CN223665298 (U). Inter..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Nanjing Jinghong Electronics Co Ltd has received a patent for Filter Inductance Chip Inductor. This invention was developed by Jin Haifan. The patent application number is CN202520274000U 20250220. The patent publication number is CN223665282 (U). International Patent Classification codes are H01F27/02 an..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Jiequn Electronic Tech Huaian Co Ltd has been awarded a patent for Production Line of Thick-film Surface-mounted Chip Resistor. This invention was developed by Wang Ping and Zhu Ting. The patent application number is CN20242365945U 20241212. The patent publication number is CN223665256 (U). International ..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Boxincheng (Chongqing) Semiconductor Technology has been granted a patent for Resistor Chip and Electronic Device. This invention was developed by Pu Xianyong and Wang Tianxing. The patent application number is CN202422942815U 20241129. The patent publication number is CN223665253 (U). International Patent ..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- State Intellectual Property Office of China has awarded a patent to Soochow University for Voice Processing Circuit Based on CI1103 Voice Chip. Wu Di, Huang Kun and He Bo developed the invention. The patent application number is CN202422225404U 20240911. The patent publication number is CN223665183 (U). I..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Sichuan Tech & Business College has been granted a patent for Food-borne Microorganism Detection Device Based on Fluorescence Characteristics of Semiconductor Nanoparticles. Zhang Chongjun, Tang Xianhua, Zhao Silei, Li Huadong, Si Yuan, Zhao Yixin, Xiang Ziwen and Wang Yuhao developed the invention. The p..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Jiangsu Fulate Semiconductor Equipment Co Ltd has been granted a patent for Circulation Cell Built-in Cabinet Used in Cooperation with Near-infrared Concentration Online Analysis. Tao Chuan'an, Zhong Lihua, Zhou Chun, Li Xin and Zhang Yuheng developed the invention. The patent application number is CN2025..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Chongqing Yingneng Weisen Intelligent Tech Co Ltd has received a patent for Multi-light Compensation Device for Chip Dispensing Detection. This invention was developed by Lin Zhongtian, Fu Wenwu and Jiang Muhua. The patent application number is CN20242383077U 20241213. The patent publication number is CN2..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Shanghai Baian Sensing Tech Co Ltd and Shanghai Baian Semiconductor Co Ltd have secured a patent on Displacement Meter Lifting Measurer with Adjustable Height. Zhang Jinfeng and Guo Liangjie developed the invention. The patent application number is CN202520162028U 20250124. The patent publication number i..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- State Intellectual Property Office of China has awarded a patent to Taiwan Semiconductor Manufacturing for Semiconductor Structure. Xu Tinghong, Huang Zhenhua, Hong Caihao, Xie Zhengxian and Xu Lihan developed the invention. The patent application number is CN202422996844U 20241205. The patent publication n..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Chinese Patent for Distributed Insulation System Packaging Module has been issued to Nanjing Borui Semiconductor Co Ltd. This invention was developed by Wu Hong. The patent application number is CN202520272156U 20250220. The patent publication number is CN223665458 (U). International Patent Classification..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Siliconware Precision Industries has secured a patent on Substrate Structure. Xie Zhiyi, Wang Ruikun, Zhang Fangwei, Fan Zhiwen and Jian Xiufang developed the invention. The patent application number is CN202422552700U 20241022. The patent publication number is CN223665457 (U). International Patent Classifi..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Puolop Electronics Co Ltd for MOSFET Packaging Structure and Power Semiconductor Device. Fang Shaoming, Chen Yong, Zhang Chuanfa and Zeng Wei developed the invention. The patent application number is CN202423249289U 20241227. The..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Suzhou Yimaixi Semiconductor Tech Co Ltd has obtained a patent for fc packaging structure. This invention was developed by Huang Gao, Son Woo-sung and Huan Xun. The patent application number is CN202422939286U 20241129. The patent publication number is CN223665451 (U). International Patent Classification ..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Guangdong Siga Semiconductor Tech Co Ltd has received a patent for SD Card Storage Chip Packaging Structure. This invention was developed by Chen Xianming. The patent application number is CN202423270242U 20241230. The patent publication number is CN223665449 (U). International Patent Classification codes..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Taiwan Semiconductor Manufacturing has secured a patent on Semiconductor Package. Qiu Zhaowei, Xie Jinghua, Lin Xiuren, Pei Haoran, Zheng Jiashen and Kwak Hyun-jung developed the invention. The patent application number is CN202422996831U 20241205. The patent publication number is CN223665446 (U). Internati..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Hefei Yisen Electronic Tech Co Ltd has secured a patent on Substrate for Semiconductor Installation. Zheng Shiming, Xiao Lifang, Guan Yongqiang, Chen Xiezong, Ye Jiagan, Chen Donglin and Wu Juping developed the invention. The patent application number is CN202422948279U 20241202. The patent publication nu..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Shanghai Kingshine Electronic Tech Co Ltd has obtained a patent for packaging type integrated circuit. This invention was developed by Yang Jingjing. The patent application number is CN202423202825U 20241225. The patent publication number is CN223665444 (U). International Patent Classification codes are H..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- State Intellectual Property Office of China has awarded a patent to Yise Semiconductor Tech Jiangsu Co Ltd for Substrate Clamping and Carrying Device. Wu Gaoyang and Xu Qingzhang developed the invention. The patent application number is CN202423241059U 20241226. The patent publication number is CN22366544..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- State Intellectual Property Office of China has awarded a patent to Yise Semiconductor Tech Jiangsu Co Ltd for Compact Substrate Lifting Module. Wu Gaoyang and Xu Qingzhang developed the invention. The patent application number is CN202423234807U 20241226. The patent publication number is CN223665441 (U)...

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Xuzhou Juli New Material Tech Co Ltd has received a patent for Anti-falling Bionic Friction-increasing Pad for Wafer Transfer. This invention was developed by Ji Keju, Wu Jianming, Deng Kai, Wang Xipeng and Ji Yuanming. The patent application number is CN202423272584U 20241230. The patent publication numb..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Scientech has been granted a patent for Diaphragm Type Substrate Processing Apparatus. Xie Mingu and Liu Maolin developed the invention. The patent application number is CN202423250301U 20241227. The patent publication number is CN223665435 (U). International Patent Classification code is H01L21/683. The ..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Dongguan Aomeite Technology has been awarded a patent for Feeding Mechanism of High-density Integrated Circuit Lead Frame. This invention was developed by Su Qian, Meng Min, Lin Yuxian and Zhang Shuangcheng. The patent application number is CN202422985523U 20241204. The patent publication number is CN223665..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Beijing NAURA Microelectronics Equipment has been granted a patent for Manipulator, Transmission Device, Transmission Chamber and Semiconductor Process Equipment. This invention was developed by Ma Liang, Wang Bingyuan, Fang Jiayu and Ding Chaopeng. The patent application number is CN202422611831U 20241029...

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Shenglan Semiconductor Changzhou Co Ltd has been granted a patent for High-efficiency Cooling Device for PZT Film Wafer. Ma Youcao and Dong Chao developed the invention. The patent application number is CN202520268603U 20250220. The patent publication number is CN223665424 (U). International Patent Classi..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Jiangsu Tianxin Micro Semiconductor Equipment has been awarded a patent for Gas Supply Assembly and Semiconductor Etching Equipment. This invention was developed by Wu Chunlong. The patent application number is CN202422992167U 20241204. The patent publication number is CN223665416 (U). International Patent ..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Beijing NAURA Microelectronics Equipment has received a patent for Coaxial Adjusting Device and Semiconductor Process Equipment. This invention was developed by Xu Kehao, Guo Shixuan, Guo Chun, Guo Ziyu, Zhang Hui and Ma Enze. The patent application number is CN202422868270U 20241122. The patent publication..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- State Intellectual Property Office of China has awarded a patent to SJ Semiconductor for Multi-nozzle Ball Mounting Device for Large-size Warped Substrate. Zhang Yunbo, Zhao Zhiqiang, Tang Xiuchi and Yang Chen developed the invention. The patent application number is CN20242333645U 20241209. The patent publ..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Hefei Zhenguan Electronic Technology has been awarded a patent for Cable Fastening Tool and Chip Packaging Assembly. This invention was developed by Li Yan. The patent application number is CN202422902427U 20241127. The patent publication number is CN223664643 (U). International Patent Classification codes ..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Beijing Haohai Yunxin Tech Co Ltd has been granted a patent for Multi-station Chip Surface Detection Device. This invention was developed by Qin Yiwei. The patent application number is CN202423218000U 20241226. The patent publication number is CN223664535 (U). International Patent Classification codes are..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Shenzhen Xinshe Tech Co Ltd has obtained a patent for multifunctional chip detection device. This invention was developed by Li Shifeng. The patent application number is CN202423200603U 20241225. The patent publication number is CN223664523 (U). International Patent Classification codes are G01N21/01, G01..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Shanxi Datong Ecological Env Monitoring Center has received a patent for Volatile Organic Compound Collecting Device for Environmental Monitoring. This invention was developed by Zhao Fang. The patent application number is CN202422876376U 20241125. The patent publication number is CN223664353 (U). Interna..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- State Intellectual Property Office of China has awarded a patent to Kangnaiwei Suzhou Semiconductor Tech Co Ltd for Oxygen Concentration Sampling Device for Vacuum Furnace and Vacuum Furnace Comprising Same. Du Haodong and Luo Yongqiang developed the invention. The patent application number is CN202520221..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Hangzhou Nanhe New Energy Tech Co Ltd has been granted a patent for Silicon Wafer Drying Box. Huang Chengbin and Wu Chunyong developed the invention. The patent application number is CN202423154789U 20241220. The patent publication number is CN223663628 (U). International Patent Classification codes are F..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Jiangsu Duishang Semiconductor Tech Co Ltd has been granted a patent for Cooling Device for Preparing Silicon Carbide. Fan Guofeng, Men Zhenlong, Zhang Hao and Zhang Lele developed the invention. The patent application number is CN20252093432U 20250115. The patent publication number is CN223663589 (U). In..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Balong Applied Materials Tech Hainan Co Ltd has been granted a patent for Inspection and Detection Device for Thermal Insulation Material. Zhang Shengguo, Yue Jianshe, Li Zhen, Zhang Shengxian, Ji Kaisi and Wu Xingchen developed the invention. The patent application number is CN202423128666U 20241218. The..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Commissariat A L'Energie Atomique Et Aux Energies Alternatives has been granted a patent for Fabricating of a Quantum Device with Autoalignment of the Gates on Their Respective Active Zone Region. Bertrand Benoît and Niebojewski Heimanu developed the invention. The patent application number is US20221..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- U.S. Patent and Trademark Office has awarded a patent to Applied Materials for Methods for Forming Gate Structures. Pranatharthiharan Balasubramanian and Breil Nicolas Louis developed the invention. The patent application number is US202318371113 20230921. The patent publication number is US12740104 (B..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- The Trustees of The University of Pennsylvania has been granted a patent for Post CMOS Compatible Ferroelectric Field Effect Transistor with Aiscn Dielectric and 2D Material Channel. This invention was developed by Jariwala Deep, Kim Kwan-ho, Olsson IIRoy H, Liu Xiwen and Stach Eric Andrew. The patent ..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- United States Patent for Transistors with Mitigated Free Body Effect has been issued to Micron Technology. This invention was developed by Karda Kamal M, Kanago Anthony J, Liu Haitao, Lee Si-woo and Sugiura Soichi. The patent application number is US202318237206 20230823. The patent publication number ..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Applied Materials has secured a patent on Metal Cap for Contact Resistance Reduction. Lee Joung Joo, Hou Wenting, Gelatos Avgerinos V, Lei Jianxin, Wu Liqi, Hung Raymond Hoiman, Mebarki Bencherki, Kuratomi Takashi, Ha Tae Hong and Tang Xianmin developed the invention. The patent application number is U..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- DB HiTek has been granted a patent for Power Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Ko Han Seok, Son Ung Bi, Kim Dae Il and Jung Ji Houn. The patent application number is US202318312227 20230504. The patent publication number is US12740087 (B2). Internation..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- United Microelectronics Corporation has been granted a patent for Manufacturing Method of Semiconductor Device. Lin Da-jun, Chiu Chung-yi, Tsai Fu-yu and Tsai Bin-siang developed the invention. The patent application number is US202217838258 20220612. The patent publication number is US12740082 (B2). Int..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Innoscience Suzhou Technology Holding Co Ltd has received a patent for Nitride-based Semiconductor Device and Method for Manufacturing the Same. This invention was developed by Hao Ronghui, Zhang Jinhan and Wong King Yuen. The patent application number is US202117609417 20210928. The patent publication..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- U.S. Patent and Trademark Office has awarded a patent to Diodes Inc for Power Diode Device and Method of Manufacturing the Same. Chang Chao Yi, Tseng Ching Chiu and Lo Tzu Yuan developed the invention. The patent application number is US202318205288 20230602. The patent publication number is US12740078..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Micron Technology has been granted a patent for Stacked Memory Device with Improved Per-die Power Delivery. Ayyapureddi Sujeet developed the invention. The patent application number is US202418939265 20241106. The patent publication number is US12740075 (B2). International Patent Classification codes a..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Seoul National University R&DB Foundation has been granted a patent for Memory Device and Manufacturing Method Thereof. Shin Joong Chan and Hwang Cheol Seong developed the invention. The patent application number is US202318575994 20231018. The patent publication number is US12740073 (B2). Internationa..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- United States Patent for Semiconductor Memory Device has been issued to Samsung Electronics. This invention was developed by Kim Song Yi. The patent application number is US202418665005 20240515. The patent publication number is US12740070 (B2). International Patent Classification codes are H10B63/00, H1..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Semiconductor Energy Laboratory has obtained a patent for semiconductor device. This invention was developed by Kunitake Hitoshi, Jinbo Yasuhiro, Matsuzaki Takanori, Hodo Ryota and Onuki Tatsuya. The patent application number is US202218691160 20220907. The patent publication number is US12740067 (B2)...

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Shanghai Huali Microelect Corp has secured a patent on Non-volatile Memory. Tang Maoyuan, Tan Jiahui and Zhou Meng developed the invention. The patent application number is US202418631225 20240410. The patent publication number is US12740065 (B2). International Patent Classification codes are H10B43/27..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Samsung Electronics has been granted a patent for Semiconductor Memory Device. Yang Woo Sung, Sung Suk Kang, Lim Joon-sung, Kim Ji Young and Hwang Sung-min developed the invention. The patent application number is US202418595737 20240305. The patent publication number is US12740063 (B2). International Pa..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Samsung Electronics has been awarded a patent for Nonvolatile Memory Device and Electronic System Including the Same. This invention was developed by Gwon Taemok, Ko Seungbeom, Yoo Byungik, Lee Seungmin, Son Changjin, Yeo Chadong and Lee Seulji. The patent application number is US202418581174 20240219. T..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Samsung Electronics has been granted a patent for Semiconductor Memory Device. Yoon Chan-sic and Lee Kiseok developed the invention. The patent application number is US202217957242 20220930. The patent publication number is US12740048 (B2). International Patent Classification codes are H10B12/00, H10D64/..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Nanya Technology Corp has secured a patent on Memory Device and Method of Forming the Same. Chen Wei Yu developed the invention. The patent application number is US202418648349 20240427. The patent publication number is US12740047 (B2). International Patent Classification code is H10B12/00. Cooperative..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Nanya Tech has been awarded a patent for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Lin Yu-ying. The patent application number is US202318493791 20231024. The patent publication number is US12740046 (B2). International Patent Classification code is H10B12/00...

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- U.S. Patent and Trademark Office has awarded a patent to Unisantis Electronics Singapore for Memory Device Including Semiconductor Element. Sakui Koji and Harada Nozomu developed the invention. The patent application number is US202418922784 20241022. The patent publication number is US12740044 (B2). I..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Seoul National University R&DB Foundation has received a patent for Capacitorless 3D Stacked DRAM Device and Manufacturing Method Thereof. This invention was developed by Jang Seo Young, Lee Han Chul and Hwang Cheol Seong. The patent application number is US202318570810 20231017. The patent publication..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- United States Patent for Memory Device, Method of Manufacturing Memory Device, and Electronic Apparatus Including Memory Device has been issued to Institute of Microelectronics Cas and Institute of Microelectronics, Chinese Academy of Sciences. This invention was developed by Zhu Huilong. The patent ap..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing for Memory Device and Method for Manufacturing the Same. Chang Jui-wen, Chang Feng-ming and Wang Ping-wei developed the invention. The patent application number is US202217743645 20220513. The patent publication..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- United States Patent for Semiconductor Integrated Circuit Device has been issued to Socionext. This invention was developed by Hirose Masanobu. The patent application number is US202318506989 20231110. The patent publication number is US12740036 (B2). International Patent Classification codes are G11C11/..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Unimicron Technology has obtained a patent for embedded inductor structure and manufacturing method thereof. This invention was developed by Tsai Chen-an. The patent application number is US202318136358 20230419. The patent publication number is US12739976 (B2). International Patent Classification code..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Unimicron Technology has been granted a patent for Collapse-free Circuit Structure with Low Capacitance Effect. Yang Kai-ming, Ko Cheng-ta, Lin Pu-ju and Peng Chia-yu developed the invention. The patent application number is US202418662236 20240513. The patent publication number is US12739969 (B2). Int..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Murata Manufacturing has received a patent for Multilayer Dielectric Substrate and Method for Manufacturing Multilayer Dielectric Substrate. This invention was developed by Fujii Norikazu. The patent application number is US202318167908 20230213. The patent publication number is US12739968 (B2). Intern..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Langfang Kangjie Ventilation Mat Co Ltd has been granted a patent for Integrated Floating Bead Silicon Crystal Air Pipe. Sun Jie developed the invention. The patent application number is CN202520237087U 20250214. The patent publication number is CN223662806 (U). International Patent Classification codes a..

Semiconductor

  |  Thu 24 Sep 2026

Beijing, Sept. 23 -- Hefei Yisen Electronic Tech Co Ltd has been granted a patent for Pipeline for Preparing Semiconductor Chip. This invention was developed by Zheng Shiming, Xiao Lifang, Guan Yongqiang, Chen Xiezong, Ye Jiagan, Chen Donglin and Wu Juping. The patent application number is CN202422826791U 20241120. The patent..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- U.S. Patent and Trademark Office has awarded a patent to International Business Machines for Power Rail Lead for Semiconductor Structures. Xie Ruilong, Yang Chih-chao, Li Tao and Sung Min Gyu developed the invention. The patent application number is US202318396901 20231227. The patent publication numbe..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- International Business Machines has received a patent for Interconnect Levels with Multiple Line Types. This invention was developed by Xie Ruilong, Lanzillo Nicholas Anthony, Vega Reinaldo, Anderson Brent A, Chu Albert M and Clevenger Lawrence A. The patent application number is US202318334414 2023061..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- United States Patent for Contact Structure, Semiconductor Device with the Same, and Method for Fabricating the Same has been issued to Nanya Tech. This invention was developed by Chuang Ying-cheng. The patent application number is US202418635313 20240415. The patent publication number is US12740391 (B2..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- U.S. Patent and Trademark Office has awarded a patent to Qualcomm for Stacked Integrated Circuit Devices with Face-to-face Connections Between Logic and Memory Dies. Sun Yangyang, Li Yue and Zhao Lily developed the invention. The patent application number is US202418428092 20240131. The patent publicat..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Taiwan Semiconductor Manufacturing has been granted a patent for Semiconductor Device and Method for Fabricating the Same. This invention was developed by Li Jian-sing, Zhuang Hui-zhong and Dash Satyabrata. The patent application number is US202318152385 20230110. The patent publication number is US127..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Taiwan Semiconductor Manufacturing has been granted a patent for Package and Fabrication Method Thereof. This invention was developed by Shih Ying-ching, Wu Chih-wei and Chiou Wen-chih. The patent application number is US202217886461 20220812. The patent publication number is US12740385 (B2). Internati..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Taiwan Semiconductor Manufacturing has received a patent for Semiconductor Device Including a Metal Oxide Interface Layer and Methods for Forming the Same. This invention was developed by Chiu Wei-gang, Shih Yu-chuan, Lu Chun-chieh, Huang Yen-chieh, Huang Huai-ying and Lin Yu-ming. The patent applicati..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Applied Materials has been granted a patent for Methods and Systems for a Spectral Library at a Manufacturing System. Ummethala Upendra V, Li Thomas, Zhu Zhaozhao, Tsai Hsinyi and Kutney Michael developed the invention. The patent application number is US202318485009 20231011. The patent publication nu..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- ASML Netherlands has been granted a patent for Source Material Delivery System, EUV Radiation System, Lithographic Apparatus, and Methods Thereof. This invention was developed by Kinney Charles Edward, Rollinger Bob, Lukens Joshua Mark and Beyhaghi Pooriya. The patent application number is US2020177826..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- United States Patent for Electrothermal Film Structure, Electrothermal Film Heating Device and Method for Manufacturing Electrothermal Film has been issued to Micron Optoelectronics Co Ltd. This invention was developed by Su Wei, Zhang Guoliang, Hu Shourong and Su Yu. The patent application number is U..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Sharp has been granted a patent for Terminal Apparatus, Method, and Integrated Circuit. This invention was developed by Kawano Takuma, Yamada Shohei, Miyake Taichi, Tsuboi Hidekazu and Inoue Kyosuke. The patent application number is US202318106919 20230207. The patent publication number is US12739919 (B2..

Semiconductor

  |  Wed 23 Sep 2026

Beijing, Sept. 23 -- Shenzhen Shengruixin Tech Co Ltd has been granted a patent for Ultrasonic Cleaning Device for Quartz Polishing Wafer. Xiong Dewen, Shi Qing, Wu Chu and Hu Lin developed the invention. The patent application number is CN202423126037U 20241218. The patent publication number is CN223669808 (U). International..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- U.S. Patent and Trademark Office has awarded a patent to Macronix for Semiconductor Integrated Circuit, Semiconductor Device and Method for Aligning Semiconductor Integrated Circuits. Yang Chin-cheng developed the invention. The patent application number is US202318346910 20230705. The patent publication..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Nanya Technology Corp has been granted a patent for Memory Device Package Having Scribe Line and Method for Manufacturing the Same. This invention was developed by Yang Wu-der. The patent application number is US202218056549 20221117. The patent publication number is US12740432 (B2). International Pate..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Evatec has obtained a patent for substrate support unit, and apparatus and method for depositing a layer using the same. This invention was developed by Hagmann Florian, Mark Andreas and Mündle Klaus. The patent application number is US202017754560 20200908. The patent publication number is US12740377 (..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- United States Patent for Lift Pin Actuators for Semiconductor Processing Systems and Related Methods has been issued to ASM IP Holding BV and ASM. This invention was developed by Huang Shujin, Tran Loc, Su Junwei, Lin Xing, Demos Alexandros and Evans Bradley Wayne. The patent application number is US20..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Taiwan Semiconductor Manufacturing has secured a patent on Semiconductor Processing Tool and Method of Operation. Liu Yan-chun, More Shahaji B, Lin Yii-chi, Lai Ching-lun, Chang Shih-chieh, Ma Chih-yu and Liu Sheng-jang developed the invention. The patent application number is US202418783485 20240725. ..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Applied Materials has been granted a patent for Cold Plate for Trapping Etching and Deposition Byproducts. Biloiu Costel, Ryan Kevin T, Rockwell Tyler and Chamberlain Nicholas Scott developed the invention. The patent application number is US202318510336 20231115. The patent publication number is US127..

Semiconductor

  |  Wed 23 Sep 2026

Beijing, Sept. 23 -- State Intellectual Property Office of China has awarded a patent to Zhangjiagang Xuanhede Aluminum Products Co Ltd for Ultrasonic Cleaning Machine for Cleaning Aluminum Wafer. Zhao Minggao developed the invention. The patent application number is CN202422789326U 20241115. The patent publication number is ..

Semiconductor

  |  Thu 24 Sep 2026

Alexandria, Sept. 23 -- Absolics has received a patent for Via Connection Structure Comprising Multiple Vias and Substrate Comprising the Same. This invention was developed by Kim Jincheol and Kim Sungjin. The patent application number is US202218010254 20220909. The patent publication number is US12740443 (B2). International P..
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