Semiconductor
| Thu 08 Oct 2026
Beijing, Oct. 7 -- Institute of Microelectronics, CAS has applied Chinese patent for Device and Method for Measuring Bonding Strength of Multi-layer D2w Hybrid Bonding Chip. Ding Fei, Yang Haibo, Zhang Yu, Cao Liqiang, Liu Yang, Yang Yudong, Kang Qiushi, Wang Qidong, Li Xuze, Kim In-hee and Peng Cheng developed it.
The patent a..