Semiconductor
| Tue 19 Nov 2024
Beijing, Nov. 20 -- Jinshang Semiconductor Xinyang has been awarded a patent for arc gold wire ball bonding adjusting device. This invention was developed by Zhu Deping, Wang Zhibang, Du Cheng, Zhang Jinlong, Gong Ke, Wang Peng, Gao Jian and Xu Yulin.
The patent application number is CN202321851632U 20230713. The patent publi..