Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Applied Materials has filed a patent application for Polishing Articles for Hybrid Bonding Applications. This invention was developed by Jiang Liu, Lianto Prayudi, Rath Santosh Kumar, Bao Nina, Danish Muhammad Adli, Khanna Aniruddh, Gan Pin Gian, Ang Mohammad Faizal Bin Aermie, Yamamura Mayu, Ganapathiappan Si..