Packaging & Containers
| Fri 29 May 2026
Beijing, May 29 -- State Intellectual Property Office of China has received Intel patent application for Three-ball Two-stage Interconnection Packaging Framework. Ayalasomayajula Madhusudhan, Wu Jie, Carlson Andrew W, Magnavita Margarita, Wang Zewei, Lu Xiao, Robinson Glen, Moody Barbara, Rahimi Farid, Schaller Charles W, Chowdh..