Metal & Mining
| Mon 15 Jun 2026
Alexandria, June 15 -- Intel has applied United States patent for Through Glass Via Local Stress Reduction. Marin Brandon Christian, Chen Haobo, Nie Bai, Liu Xiao, Pietambaram Srinivas Venkata Ramanuja, Shan Bohan, Vehonsky Jacob, Tanaka Hiroki, Mcelhinny Kyle and May Robert A developed it.
The patent application number is US20..