Metal & Mining
| Sat 04 Apr 2026
Beijing, April 4 -- Zhuhai Taiwei Electronic Co Ltd has sought patent for Chip Metal Layer Filling Method and Device, Storage Medium and Computer Equipment. This invention was developed by Wu Zhenhai, Tang Pan, Wu Yajie, Liu Wen, Wei Yanqing, Chen Fengyi, Chen Yanglin, Zhang Aoyuan, Zhou Zichao and Ma Yusen.
The patent applic..