Information Technology
| Wed 02 Apr 2025
Taipei, April 2 -- IBM has been granted a patent for multi-layer topological interconnect with proximal doping layer. This invention was developed by Chen Ching-tzu, Lavoie Christian, Cohen Guy M, Bajpai Utkarsh, Lanzillo Nicholas Anthony, Todorov Teodor Krassimirov, Gunawan Oki, Marchack Nathan P and Kerns Peter.
The patent ..