Electronics
| Wed 06 May 2026
Beijing, May 7 -- Beijing Aerospace Wanyuan Science & Tech Co Ltd has submitted a patent application for Protective Device for Reflow Soldering Device of Printed Board Assembly. This invention was developed by Liu Fang, Wang Zhuoru, Li Dan, Li Yunzhe, Pi Xiuguo, Zhang Yun, Yang Hua, Dong Junlei, Feng Kaiqi, Hou Weiyi, Han Feifei..