Construction
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Intel has sought patent for Embedded Bridge with Protection Layer for Via Formation with Bump Pitch Scaling. This invention was developed by Tanaka Hiroki, May Robert Alan, Lee Ching-wei, Ndukum Tchefor, Turan Deniz, Zade Vishal Bhimrao, Pietambaram Srinivas Venkata Ramanuja, Duan Gang, Tharmarajah Sanjay,..