Chemicals
| Thu 13 Nov 2025
Alexandria, Nov. 14 -- United States Patent for Moisture Seal Coating of Hybrid Bonded Stacked Die Package Assembly has been issued to Intel. This invention was developed by Mallik Debendra, Kabir Mohammad Enamul, Deshpande Nitin, Karhade Omkar, Sarkar Arnab, Agraharam Sairam, Pelto Christopher, Kim Gwang-soo and Mahajan Ravindr..